Wideband, 40 dB Isolation at 1 GHz, CMOS
www.BDTIC.com/ADI
FEATURES
Wideband switch: −3 dB @ 4.5 GHz
ADG901—absorptive switch
ADG902—reflective switch
High off isolation: 40 dB @ 1 GHz
Low insertion loss: 0.8 dB @1 GHz
Single 1.65 V to 2.75 V power supply
CMOS/LVTTL control logic
8-lead MSOP and tiny 3 mm × 3 mm LFCSP packages
Low power consumption (<1 μA)
APPLICATIONS
Wireless communications
General purpose RF switching
Dual-band applications
High speed filter selection
Digital transceiver front end switch
IF switching
Tuner modules
Antenna diversity switching list
GENERAL DESCRIPTION
The ADG901/ADG902 are wideband switches that use a CMOS
process to provide high isolation and low insertion loss to
1 GHz. The ADG901 is an absorptive (matched) switch with
50 Ω terminated shunt legs, while the ADG902 is a reflective
switch. These devices are designed such that the isolation is
high over the dc to 1 GHz frequency range. They have on-board
CMOS control logic, thus eliminating the need for external
controlling circuitry. The control inputs are both CMOS and
0
TA = 25°C
–10
–20
–30
–40
–50
–60
ISOLATION (dB)
–70
–80
–90
–100
10k 100k 100M1M 10M 1G
VDD = 2.5V
FREQUENCY (Hz)
Figure 2. Off Isolat
VDD = 1.8V
ion vs. Frequency
10G
03336-002
1.65 V to 2.75 V, SPST Switches
ADG901/ADG902
FUNCTIONAL BLOCK DIAGRAM
ADG901
RF2RF1
50Ω50Ω
CTRL
ADG902
RF2RF1
CTRL
03336-001
Figure 1.
LVTTL compatible. The low power consumption of these
CMOS de
vices makes them ideally suited to wireless
applications and general-purpose high frequency switching.
PRODUCT HIGHLIGHTS
1. −40 dB Off Isolation @ 1 GHz
2. 0.8 dB I
3. T
nsertion Loss @ 1 GHz
iny 8-Lead MSOP/LFCSP Packages
–0.4
–0.6
–0.8
–1.0
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2
INSERTION LOSS (dB)
–2.4
–2.6
–2.8
VDD = 2.5V
–3.0
= 25°C
T
A
–3.0
10k 100k 100M1M 10M 1G
Figure 3. Insertion Loss vs. Frequency
FREQUENCY (Hz)
10G
03336-003
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 www.analog.com
Fax: 781.461.3113 © 2005 Analog Devices, Inc. All rights reserved.
ADG901/ADG902
www.BDTIC.com/ADI
TABLE OF CONTENTS
Features .............................................................................................. 1
Pin Configuration and Function Descriptions..............................5
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Product Highlights........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
ESD Caution.................................................................................. 4
REVISION HISTORY
10/05—Rev. A to Rev. B
Changes to Figure 1..........................................................................1
Changes to Table 1............................................................................3
Changes to Ordering Guide..........................................................12
10/04—Rev. 0 to Rev. A.
Changes to Features ......................................................................... 1
C
hanges to Product Highlights ...................................................... 1
Changes to Specifications................................................................ 2
Changes to Ordering Guide............................................................ 3
Change to ADG9xx Evaluation Board Section............................. 9
Changes to Ordering Guide.......................................................... 10
Typical Perf or m ance C har a c ter i st i c s ..............................................6
Te r mi n ol o g y .......................................................................................8
Test Ci rc u its ........................................................................................9
Applications..................................................................................... 10
Absorptive vs. Reflective Switches........................................... 10
ADG90x Evaluation Board ........................................................... 11
Outline Dimensions ....................................................................... 12
Ordering Guide............................................................................... 13
8/03—Revision 0: Initial Version
Rev. B | Page 2 of 16
ADG901/ADG902
www.BDTIC.com/ADI
SPECIFICATIONS
VDD = 1.65 V to 2.75 V, GND = 0 V, input power = 0 dBm, all specifications T
MIN
to T
, unless otherwise specified.
MAX
Table 1.
B Version
Parameter Symbol Conditions Min Typ
AC ELECTRICAL CHARACTERISTICS
Operating Frequency
−3 dB Frequency
Input Power
4
3
4
DC 2.5 GHz
4.5 GHz
0 V dc bias 7 dBm
0.5 V dc bias 16 dBm
Insertion Loss S21, S12 DC to 100 MHz; VDD = 2.5 V ± 10% 0.4 0.7 dB
500 MHz; VDD = 2.5 V ± 10% 0.5 0.8 dB
1000 MHz; VDD = 2.5 V ± 10% 0.8 1.25 dB
Isolation—RF1 to RF2 S21, S12 100 MHz 60 61 dB
CP Package 500 MHz 43 45 dB
1000 MHz 34 40 dB
Isolation—RF1 to RF2 S21, S12 100 MHz 51 60 dB
RM Package 500 MHz 37.5 47 dB
1000 MHz 31 37 dB
Return Loss (On Channel)4 S11, S22 DC to 100 MHz 20 28 dB
500 MHz 23 29 dB
1000 MHz 25 28 dB
Return Loss (Off Channel)4 S11, S22 DC to 100 MHz 18 23 dB
500 MHz 17 21 dB
1000 MHz 15 19 dB
On Switching Time
Off Switching Time
Rise Time
Fall Time
4
4
1 dB Compression
4
4
4
tON 50% CTRL to 90% RF 3.6 6 ns
t
50% CTRL to 10% RF 5.8 9.5 ns
OFF
t
10% to 90% RF 3.1 5.5 ns
RISE
t
90% to 10% RF 6.0 8.5 ns
FAL L
P
B 1000 MHz 17 dBm
−1 dB
Third-Order Intermodulation Intercept IP3 900 MHz/901 MHz, 4 dBm 28.5 36 dBm
Video Feedthrough
5
2.5 mV p-p
DC ELECTRICAL CHARACTERISTICS
Input High Voltage V
V
Input Low Voltage V
V
VDD = 2.25 V to 2.75 V 1.7 V
INH
VDD = 1.65 V to 1.95 V 0.65 VDD V
INH
VDD = 2.25 V to 2.75 V 0.7 V
INL
VDD = 1.65 V to 1.95 V
INL
Input Leakage Current II 0 ≤ VIN ≤ 2.75 V ±0.1 ±1 μA
CAPACITANCE
4
RF1/RF2, RF Port On Capacitance CRF on f = 1 MHz 1.2 pF
CTRL Input Capacitance C
f = 1 MHz 2.1 pF
CTRL
POWER REQUIREMENTS
VDD 1.65 2.75 V
Quiescent Power Supply Current IDD Digital inputs = 0 V or VDD 0.1 1 μA
1
Temperature range for B version: −40°C to +85°C.
2
Typical values are at VDD = 2.5 V and 25°C, unless otherwise specified.
3
Point at which insertion loss degrades by 1 dB.
4
Guaranteed by design, not subject to production test.
5
The dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 Ω test setup, measured with 1 ns
rise time pulses and 500 MHz bandwidth.
1
2
Max Unit
0.35
V
V
DD
Rev. B | Page 3 of 16
ADG901/ADG902
www.BDTIC.com/ADI
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise specified.
Table 2.
Parameter Rating
V
to GND −0.5 V to +4 V
DD
Inputs to GND
Continuous Current 30 mA
Input Power 18 dBm
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Junction Temperature
MSOP Package
θ
Thermal Impedance
JA
LFCSP Package
θ
Thermal Impedance (2-Layer
JA
board)
θ
Thermal Impedance (4-Layer
JA
board)
Lead Temperature, Soldering (10 sec)
IR Reflow, Peak Temperature (<20 sec)
ESD 1 kV
1
RF1/RF2 off port inputs to ground: −0.5 V to VDD – 0.5 V
−0.5 V to V
1
V
−40°C to +85°C
−65°C to +150°C
150°C
206°C/W
84°C/W
48°C/W
300°C
235°C
DD
+ 0.3
Stresses above those listed under Absolute Maximum Ratings
y cause permanent damage to the device. This is a stress
ma
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. B | Page 4 of 16
ADG901/ADG902
www.BDTIC.com/ADI
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
V
DD
ADG901/
2
CTRL
GND
8-Lead
3 mm × 3 mm LFCSP (CP-8 – Exposed pad tied to substrate, GND
Figure 4. 8-Lead MSOP (RM-8) and
RF1
ADG902
3
TOP VIEW
(Not to Scale)
4
8
RF2
7
GND
6
GND
5
GND
03336-004
Table 3. Pin Function Descriptions
Pin No. Mnemonic Description
1 V
DD
Power Supply Input. These parts can be operated from 1.65 V to 2.75 V; VDD should be decoupled to GND.
2 CTRL CMOS or LVTTL Logic Level. CTRL input should not exceed V
0 → RF1 Isolated from RF2.
1 → RF1 to RF2.
3, 5, 6, 7 GND Ground Reference Point for All Circuitry on the Part.
4 RF1 RF1 Port.
8 RF2 RF2 Port.
Table 4. Truth Table
CTRL Signal Path
0 RF1 isolated from RF2
1 RF1 to RF2
DD.
Rev. B | Page 5 of 16
ADG901/ADG902
www.BDTIC.com/ADI
TYPICAL PERFORMANCE CHARACTERISTICS
–0.4
–0.6
–0.8
VDD = 2.5V
–1.0
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2
INSERTION LOSS (dB)
–2.4
–2.6
–2.8
TA = 25°C
–3.0
10k 100k 100M1M 10M 1G
FREQUENCY (Hz)
Figure 5. Insertion Loss vs. Frequency over Supplies (S12 and S21)
VDD = 2.25V
VDD = 2.75V
10G
03336-005
–0.4
–0.6
–0.8
+25°C
–1.0
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2
INSERTION LOSS (dB)
–2.4
–2.6
–2.8
VDD = 2.5V
–3.0
10k 100k 100M1M 10M 1G
+85°C
FREQUENCY (Hz)
–40°C
10G
Figure 8. Insertion Loss vs. Frequency over Temperature (S12 and S21)
03336-008
–0.40
–0.45
–0.50
VDD = 2.5V
–0.55
–0.60
–0.65
–0.70
–0.75
–0.80
INSERTION LOSS (dB)
–0.85
–0.90
–0.95
TA = 25°C
–1.00
10k 100k 100M1M 10M 1G
VDD = 2.25V
VDD = 2.75V
10G
FREQUENCY (Hz)
Figure 6. Insertion Loss vs. Frequency over Supplies (S12 and S21)
(Z
oomed Figure 5 Plot)
–0.4
–0.6
–0.8
VDD = 1.8V
–1.0
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2
INSERTION LOSS (dB)
–2.4
–2.6
–2.8
TA = 25°C
–3.0
10k 100k 100M1M 10M 1G
VDD = 1.95V
VDD = 1.65V
10G
FREQUENCY (Hz)
Figure 7. Insertion Loss vs. Frequency over Supplies (S12 and S21)
03336-006
03336-007
0
TA = 25°C
–5
–10
–15
–20
–25
–30
–35
–40
–45
–50
–55
–60
ISOLATION (dB)
–65
–70
–75
–80
–85
–90
–95
–100
10k 100k 100M1M 10M 1G
Figure 9. OFF Isolation vs. Frequency
0
VDD = 2.5V
–5
–10
–15
–20
–25
–30
–35
–40
–45
–50
–55
ISOLATION (dB)
–60
–65
–70
–75
–80
–85
–90
10k 100k 100M1M 10M 1G
VDD = 2.5V
VDD = 1.8V
10G
FREQUENCY (Hz)
over Supplies (S12 and S21)
+85°C
+25°C
–40°C
10G
FREQUENCY (Hz)
Figure 10. Off Isolation vs. Frequency over Temperature (S12 and S21)
03336-009
03336-010
Rev. B | Page 6 of 16
ADG901/ADG902
www.BDTIC.com/ADI
0
TA = 25°C
V
= 2.5V
DD
–5
–10
–15
–20
RETURN LOSS (dB)
–25
–30
–35
10k 100k 100M1M 10M 1G
OFF SWITCH
ON SWITCH
FREQUENCY (Hz)
Figure 11. Return Loss vs. Frequency (S11)
CH1
CH2
CH1 = CTRL = 1V/DIV
CH2 = RFx = 100mV/DIV
Figure 12. Switch Timing
t
t
FALL
RISE
= 2.8ns
= 5.1ns
10G
03336-011
03336-012
40
35
30
25
20
(dBm)
3
IP
15
10
5
0
250 350 450 550 650 750 850
20
18
16
14
12
(dBm)
10
–1dB
8
P
6
4
2
0
0 250 500 750 1000 1250 1500
FREQUENCY (MHz)
Figure 14. IP
FREQUENCY (MHz)
Figure 15. P
vs. Frequency
3
vs. Frequency
−1dB
VDD = 2.5V
T
= 25°C
A
VDD = 2.5V
T
= 25°C
A
03336-014
03336-015
1
CTRL
RFx
2
CH2 pk-pk
2.016mV
CH1 500mV CH2 1mV 10.0ns
03336-013
Figure 13. Video Feedthrough
Rev. B | Page 7 of 16
ADG901/ADG902
www.BDTIC.com/ADI
TERMINOLOGY
VDD
Most positive power supply potential.
I
DD
Positive supply current.
GND
Ground (0 V) reference.
CTRL
Logic control input.
V
INL
Maximum input voltage for Logic 0.
V
INH
Minimum input voltage for Logic 1.
I
L (I
IN
Input current of the digital input.
C
Digital input capacitance.
t
ON
Delay between applying the digital control input and the output
swi
t
OFF
Delay between applying the digital control input and the output
swi
t
RISE
Rise time. Time for the RF signal to rise from 10% to 90% of the
on
)
INH
IN
tching on.
tching off.
level.
t
FAL L
Fall time. Time for the RF signal to fall from 90% to 10% of the
level.
on
Off Isolation
The attenuation between input and output ports of the switch
hen the switch control voltage is in the off condition.
w
Insertion Loss
The attenuation between input and output ports of the switch
w
hen the switch control voltage is in the on condition.
P
−1 dB
1 dB compression point. The RF input power level at which the
swi
tch insertion loss increases by 1 dB over its low level value. It
is a measure of how much power the on switch can handle
before the insertion loss increases by 1 dB.
IP
3
Third-order intermodulation intercept. This is a measure of the
ower in false tones that occur when closely spaced tones are
p
passed through a switch, whereby the nonlinearity of the switch
causes these false tones to be generated.
Return Loss
The amount of reflected power relative to the incident power at
port. Large return loss indicates good matching. By measuring
a
return loss the VSWR can be calculated from conversion charts.
voltage standing wave ratio (VSWR) indicates the degree of
matching present at a switch RF port.
Video Feedthrough
The spurious signals present at the RF ports of the switch when
th
e control voltage is switched from high to low or low to high
without an RF signal present.
Rev. B | Page 8 of 16
ADG901/ADG902
V
V
www.BDTIC.com/ADI
TEST CIRCUITS
Similar setups for ADG902.
V
V
S
S
RF1
CTRL
CTRL
RF1
CTRL
CTRL
0.1μF
CTRL
0.1μF
CTRL
0.1μF
ADG901
50
Ω
0.1μF
ADG901
50
Ω
V
DD
V
DD
V
RF2RF1
GND
OUT
R
L
50
Ω
Figure 16. Switching Timing: t
V
DD
V
DD
V
RF1
RF2
GND
OUT
R
L
50
Ω
Figure 17. Switch Timing: t
V
DD
V
DD
RF2
50
Ω
GND
OFF ISOLATION = 20 LOG
Figure 18. Off Isolation
V
DD
V
DD
RF2
50
Ω
GND
INSERTION LOSS = 20 LOG
Figure 19. Insertion Loss
V
V
V
CTRL
V
OUT
CTRL
OUT
50% 50%
t
ON
, t
ON
OFF
50%
10%
t
RISE
, t
RISE
FALL
V
OUT
V
S
V
OUT
V
90%
90%
R
L
50
Ω
50
NETWORK
ANALYZER
R
L
50
Ω
50
Ω
NETWORK
ANALYZER
S
ADG901
OSCILLOSCOPE
10%
t
OFF
03336-016
V
RF1
CTRL
CTRL
Figure 20. Video Feedthrough
V
DD
0.1μF
ADG901
50
Ω
GND
V
DD
90%
V
OUT
t
FALL
50%
10%
SPECTRUM
03336-017
ANALYZER
V
RF1
CTRL
CTRL
Figure 21. IP
V
0.1μF
GND
DD
V
DD
Ω
V
S
ADG901
SPECTRUM
03336-018
V
OUT
ANALYZER
V
RF1
50Ω
CTRL
CTRL
Figure 22. P
V
S
03336-019
Rev. B | Page 9 of 16
50Ω
50
0.1μF
Ω
50Ω
–1 dB
3
GND
RF2
V
V
RF2
DD
DD
50Ω
COMBINER
RF
SOURCE
RF2
NC
RF
SOURCE
RF
SOURCE
03336-020
V
S
03336-021
03336-022
ADG901/ADG902
www.BDTIC.com/ADI
APPLICATIONS
The ADG901/ADG902 are ideal solutions for low power, high
frequency applications. The low insertion loss, high isolation
between ports, low distortion, and low current consumption of
these parts make them excellent solutions for many high
frequency switching applications.
Applications include switching between high frequency filters,
K generators, and FSK generators.
AS
ABSORPTIVE vs. REFLECTIVE SWITCHES
The ADG901 is an absorptive (matched) switch with
50 Ω terminated shunt legs and the ADG902 is a reflective
switch with 0 Ω terminated shunts to ground. The ADG901
absorptive switch has a good VSWR on each port, regardless of
the switch mode. An absorptive switch should be used when
there is a need for a good VSWR that is looking into the port
but not passing the through signal to the common port. The
ADG901 is therefore ideal for applications that require
minimum reflections back to the RF source. It also ensures that
the maximum power is transferred to the load.
The ADG902 reflective switch is suitable for applications where
h off port VSWR does not matter and the switch has some
hig
other desired performance feature. It can be used in many
applications, including high speed filter selection. In most cases,
an absorptive switch can be used instead of a reflective switch,
but not vice versa.
Rev. B | Page 10 of 16
ADG901/ADG902
www.BDTIC.com/ADI
ADG90x EVALUATION BOARD
The ADG90x evaluation board allows designers to evaluate the
high performance wideband switches with a minimum of effort.
To prove that these devices meet user requirements, the user
requires only a power supply and a network analyzer along with
the evaluation board. An application note is available with the
evaluation board and provides complete information on
operating the evaluation board.
The RF1 port (see Figure 23) is connected through a
0 Ω transmission line to the top left SMA Connector J1. RF2 is
5
connected through a 50 Ω transmission line to the top SMA
Connector J2. J3 is connected to GND. A through transmission
line connects J4 and J5 and this transmission line is used to
estimate the loss of the PCB over the environmental conditions
being evaluated.
The board is constructed of a 4-layer, FR4 material with
electric constant of 4.3 and an overall thickness of
a di
0.062 inches. Two ground layers with grounded planes
provide ground for the RF transmission lines. The transmission lines were designed using a coplanar waveguide
with ground plane model using a trace width of 0.052 inches,
clearance to ground plane of 0.030 inches, dielectric thickness
of 0.029 inches, and a metal thickness of 0.014 inches.
Figure 23. ADG90x Evaluation Board Top View
03336-023
Rev. B | Page 11 of 16
ADG901/ADG902
R
www.BDTIC.com/ADI
OUTLINE DIMENSIONS
3.20
3.00
2.80
PIN 1
0.95
0.85
0.75
0.15
0.00
COPLANARITY
8
1
0.65 BSC
0.38
0.22
0.10
3.20
3.00
2.80
5
4
SEATING
PLANE
5.15
4.90
4.65
1.10 MAX
0.23
0.08
8°
0°
0.80
0.60
0.40
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 24. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
ensions shown in millimeters
Dim
0.50
0.40
0.30
4
1
1.60
1.45
1.30
1.50
REF
PIN 1
INDICATO
1.89
1.74
1.59
INDICATOR
0.90 MAX
0.85 NOM
SEATING
PLANE
PIN 1
12° MAX
3.00
BSC SQ
TOP
VIEW
0.30
0.23
0.18
0.70 MAX
0.65 TYP
2.75
BSC SQ
0.20 REF
0.05 MAX
0.01 NOM
0.50
BSC
0.60 MAX
8
5
Figure 25. 8-Lead Lead Frame Chip Scale Package [LFCSP]
× 3 mm Body
3 mm
(CP-8-2)
Dimensions shown in millimeters
Rev. B | Page 12 of 16
ADG901/ADG902
www.BDTIC.com/ADI
ORDERING GUIDE
Model Temperature Range Package Description Package Option Branding
ADG901BRM −40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 W6B
ADG901BRM-500RL7 −40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 W6B
ADG901BRM-REEL7 −40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 W6B
ADG901BRMZ1 −40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 S1T
ADG901BRMZ-REEL71 −40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 S1T
ADG901BCP-500RL7 −40°C to +85°C 8-Lead Lead Frame Chip Scale Package [LFCSP] CP-8-2 W6B
ADG901BCP-REEL7 −40°C to +85°C 8-Lead Lead Frame Chip Scale Package [LFCSP] CP-8-2 W6B
ADG901BCPZ-REEL7 −40°C to +85°C 8-Lead Lead Frame Chip Scale Package [LFCSP] CP-8-2 S1T
ADG902BRM −40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 W7B
ADG902BRM-500RL7 −40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 W7B
ADG902BRM-REEL7 −40°C to +85°C 8-Lead Lead Frame Chip Scale Package [LFCSP] RM-8 W7B
ADG902BRMZ1 −40°C to +85°C 8-Lead Mini Small Outline Package [MSOP] RM-8 S1V
ADG902BCP-500RL7 −40°C to +85°C 8-Lead Lead Frame Chip Scale Package [LFCSP] CP-8-2 W7B
ADG902BCP-REEL7 −40°C to +85°C 8-Lead Lead Frame Chip Scale Package [LFCSP] CP-8-2 W7B
ADG902BCP-REEL7 −40°C to +85°C 8-Lead Lead Frame Chip Scale Package [LFCSP] CP-8-2 S1V
EVAL-ADG901EB Evaluation Board
EVAL-ADG902EB Evaluation Board
1
Z = Pb-free part.
Rev. B | Page 13 of 16
ADG901/ADG902 Preliminary Technical Data
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NOTES
Rev. B | Page 14 of 16
ADG901/ADG902
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NOTES
Rev. B | Page 15 of 16
ADG901/ADG902 Preliminary Technical Data
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NOTES
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D03336–0–10/05(B)
Rev. B | Page 16 of 16
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