ANALOG DEVICES ADG901, ADG902 Service Manual

Wideband, 40 dB Isolation at 1 GHz, CMOS

www.BDTIC.com/ADI

FEATURES

Wideband switch: −3 dB @ 4.5 GHz
ADG901—absorptive switch
ADG902—reflective switch
High off isolation: 40 dB @ 1 GHz
Low insertion loss: 0.8 dB @1 GHz
Single 1.65 V to 2.75 V power supply
CMOS/LVTTL control logic
8-lead MSOP and tiny 3 mm × 3 mm LFCSP packages
Low power consumption (<1 μA)

APPLICATIONS

Wireless communications
General purpose RF switching
Dual-band applications
High speed filter selection
Digital transceiver front end switch
IF switching
Tuner modules
Antenna diversity switching list

GENERAL DESCRIPTION

The ADG901/ADG902 are wideband switches that use a CMOS
process to provide high isolation and low insertion loss to
1 GHz. The ADG901 is an absorptive (matched) switch with
50 Ω terminated shunt legs, while the ADG902 is a reflective
switch. These devices are designed such that the isolation is
high over the dc to 1 GHz frequency range. They have on-board
CMOS control logic, thus eliminating the need for external
controlling circuitry. The control inputs are both CMOS and

0

TA = 25°C

–10

–20

–30

–40

–50

–60

ISOLATION (dB)

–70

–80

–90

–100

10k 100k 100M1M 10M 1G

VDD = 2.5V

FREQUENCY (Hz)

Figure 2. Off Isolat

VDD = 1.8V

ion vs. Frequency

10G

03336-002

1.65 V to 2.75 V, SPST Switches
ADG901/ADG902

FUNCTIONAL BLOCK DIAGRAM

ADG901

RF2RF1

50Ω50Ω

CTRL

ADG902

RF2RF1

CTRL

03336-001

Figure 1.

LVTTL compatible. The low power consumption of these
CMOS de

vices makes them ideally suited to wireless

applications and general-purpose high frequency switching.

PRODUCT HIGHLIGHTS

1. −40 dB Off Isolation @ 1 GHz

2. 0.8 dB I

3. T

nsertion Loss @ 1 GHz

iny 8-Lead MSOP/LFCSP Packages

–0.4
–0.6
–0.8
–1.0
–1.2
–1.4
–1.6
–1.8
–2.0
–2.2

INSERTION LOSS (dB)

–2.4
–2.6
–2.8

VDD = 2.5V

–3.0

= 25°C

T

A

–3.0

10k 100k 100M1M 10M 1G

Figure 3. Insertion Loss vs. Frequency

FREQUENCY (Hz)

10G

03336-003

Rev. B

Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: [phone] www.analog.com
Fax: [phone] © 2005 Analog Devices, Inc. All rights reserved.

ADG901/ADG902

www.BDTIC.com/ADI

TABLE OF CONTENTS

Features .............................................................................................. 1

Pin Configuration and Function Descriptions..............................5

Applications....................................................................................... 1

Functional Block Diagram .............................................................. 1

General Description......................................................................... 1

Product Highlights........................................................................... 1

Revision History ............................................................................... 2

Specifications..................................................................................... 3

Absolute Maximum Ratings............................................................ 4

ESD Caution.................................................................................. 4

REVISION HISTORY

10/05—Rev. A to Rev. B

Changes to Figure 1..........................................................................1

Changes to Table 1............................................................................3

Changes to Ordering Guide..........................................................12

10/04—Rev. 0 to Rev. A.

Changes to Features ......................................................................... 1

C

hanges to Product Highlights ...................................................... 1

Changes to Specifications................................................................ 2

Changes to Ordering Guide............................................................ 3

Change to ADG9xx Evaluation Board Section............................. 9

Changes to Ordering Guide.......................................................... 10

Typical Perf or m ance C har a c ter i st i c s ..............................................6

Te r mi n ol o g y .......................................................................................8

Test Ci rc u its ........................................................................................9

Applications..................................................................................... 10

Absorptive vs. Reflective Switches........................................... 10

ADG90x Evaluation Board ........................................................... 11

Outline Dimensions ....................................................................... 12

Ordering Guide............................................................................... 13

8/03—Revision 0: Initial Version

Rev. B | Page 2 of 16

ADG901/ADG902

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SPECIFICATIONS

VDD = 1.65 V to 2.75 V, GND = 0 V, input power = 0 dBm, all specifications T

MIN

to T

, unless otherwise specified.

MAX

Table 1.

B Version
Parameter Symbol Conditions Min Typ

AC ELECTRICAL CHARACTERISTICS

Operating Frequency

−3 dB Frequency
Input Power

4

3

4

DC 2.5 GHz

4.5 GHz
0 V dc bias 7 dBm

0.5 V dc bias 16 dBm
Insertion Loss S21, S12 DC to 100 MHz; VDD = 2.5 V ± 10% 0.4 0.7 dB
500 MHz; VDD = 2.5 V ± 10% 0.5 0.8 dB
1000 MHz; VDD = 2.5 V ± 10% 0.8 1.25 dB
Isolation—RF1 to RF2 S21, S12 100 MHz 60 61 dB

CP Package 500 MHz 43 45 dB
1000 MHz 34 40 dB
Isolation—RF1 to RF2 S21, S12 100 MHz 51 60 dB

RM Package 500 MHz 37.5 47 dB
1000 MHz 31 37 dB
Return Loss (On Channel)4 S11, S22 DC to 100 MHz 20 28 dB
500 MHz 23 29 dB
1000 MHz 25 28 dB
Return Loss (Off Channel)4 S11, S22 DC to 100 MHz 18 23 dB
500 MHz 17 21 dB
1000 MHz 15 19 dB
On Switching Time
Off Switching Time
Rise Time
Fall Time

4

4

1 dB Compression

4

4

4

tON 50% CTRL to 90% RF 3.6 6 ns
t

50% CTRL to 10% RF 5.8 9.5 ns

OFF

t

10% to 90% RF 3.1 5.5 ns

RISE

t

90% to 10% RF 6.0 8.5 ns

FAL L

P

B 1000 MHz 17 dBm

−1 dB

Third-Order Intermodulation Intercept IP3 900 MHz/901 MHz, 4 dBm 28.5 36 dBm
Video Feedthrough

5

2.5 mV p-p

DC ELECTRICAL CHARACTERISTICS

Input High Voltage V
V
Input Low Voltage V
V

VDD = 2.25 V to 2.75 V 1.7 V

INH

VDD = 1.65 V to 1.95 V 0.65 VDD V

INH

VDD = 2.25 V to 2.75 V 0.7 V

INL

VDD = 1.65 V to 1.95 V

INL

Input Leakage Current II 0 ≤ VIN ≤ 2.75 V ±0.1 ±1 μA

CAPACITANCE

4

RF1/RF2, RF Port On Capacitance CRF on f = 1 MHz 1.2 pF
CTRL Input Capacitance C

f = 1 MHz 2.1 pF

CTRL

POWER REQUIREMENTS

VDD 1.65 2.75 V
Quiescent Power Supply Current IDD Digital inputs = 0 V or VDD 0.1 1 μA

1

Temperature range for B version: −40°C to +85°C.

2

Typical values are at VDD = 2.5 V and 25°C, unless otherwise specified.

3

Point at which insertion loss degrades by 1 dB.

4

Guaranteed by design, not subject to production test.

5

The dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 Ω test setup, measured with 1 ns

rise time pulses and 500 MHz bandwidth.

1

2

Max Unit

0.35
V

V

DD

Rev. B | Page 3 of 16

ADG901/ADG902

www.BDTIC.com/ADI

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise specified.

Table 2.

Parameter Rating

V

to GND −0.5 V to +4 V

DD

Inputs to GND

Continuous Current 30 mA
Input Power 18 dBm
Operating Temperature Range

Industrial (B Version)

Storage Temperature Range

Junction Temperature

MSOP Package
θ

Thermal Impedance

JA

LFCSP Package

θ

Thermal Impedance (2-Layer

JA

board)
θ

Thermal Impedance (4-Layer

JA

board)

Lead Temperature, Soldering (10 sec)

IR Reflow, Peak Temperature (<20 sec)

ESD 1 kV

1

RF1/RF2 off port inputs to ground: −0.5 V to VDD – 0.5 V

−0.5 V to V

1

V

−40°C to +85°C

−65°C to +150°C
150°C

206°C/W

84°C/W

48°C/W

300°C
235°C

DD

+ 0.3

Stresses above those listed under Absolute Maximum Ratings

y cause permanent damage to the device. This is a stress

ma
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.

Rev. B | Page 4 of 16

ADG901/ADG902

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PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

1

V

DD

ADG901/

2

CTRL

GND

8-Lead

3 mm × 3 mm LFCSP (CP-8 – Exposed pad tied to substrate, GND

Figure 4. 8-Lead MSOP (RM-8) and

RF1

ADG902

3

TOP VIEW

(Not to Scale)

4

8

RF2

7

GND

6

GND

5

GND

03336-004

Table 3. Pin Function Descriptions

Pin No. Mnemonic Description

1 V

DD

Power Supply Input. These parts can be operated from 1.65 V to 2.75 V; VDD should be decoupled to GND.

2 CTRL CMOS or LVTTL Logic Level. CTRL input should not exceed V

0 → RF1 Isolated from RF2.

1 → RF1 to RF2.
3, 5, 6, 7 GND Ground Reference Point for All Circuitry on the Part.
4 RF1 RF1 Port.
8 RF2 RF2 Port.

Table 4. Truth Table

CTRL Signal Path

0 RF1 isolated from RF2
1 RF1 to RF2

DD.

Rev. B | Page 5 of 16