Analog Devices ADG787 Datasheet

2.5 Ω CMOS Low Power
A
A

FEATURES

USB 1.1 signal switching compliant
−3 dB bandwidth 150 MHz Tiny 10-lead LFCSP, WLCSP, MSOP packages Single-supply 1.8 V to 5.5 V operation Low on resistance
2.5 Ω typ
3.35 max at 85°C
Typical power consumption: <0.1 µW

APPLICATIONS

USB 1.1 signal switching circuits Cellular phones PDAs MP3 players Battery-powered systems Headphone switching Audio and video signal routing Communications systems
Dual 2:1 Mux/Demux USB 1.1 Switch
ADG787

FUNCTIONAL BLOCK DIAGRAM

S1
S1B
S2
S2B
ADG787
IN1
IN2
SWITCHES SHOWN
FOR A LOGIC 0 INPUT
Figure 1.
D1
D2
05250-001

GENERAL DESCRIPTION

The ADG787 is a low voltage, CMOS device that contains two independently selectable, single-pole, double-throw (SPDT) switches. It is designed as a general analog/digital switch and can also be used for routing USB 1.1 signals.
This device offers low on resistance of typically 2.5 Ω, making the part an attractive solution for applications that require low distortion through the switch.
The ADG787 comes in a tiny 3 × 4 bump, 1.50 mm × 2.00 mm WLCSP, a tiny 10-lead LFCSP, and a 10-lead MSOP. These packages make the ADG787 the ideal solution for space­constrained applications.
Each switch conducts equally well in both directions when on and has an input signal range that extends to the supplies. The ADG787 exhibits break-before-make switching action.
MASK: FS (12Mbps)
1
= 25°C
05250-032
Figure 2. Eye Pattern; 12 Mbps, V
V
= 4.2 V, PRBS 31
DD
20.0ns/DIV = 3V p-p
IN
T
A
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
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www.analog.com
ADG787

TABLE OF CONTENTS

Specifications..................................................................................... 3
Te r m in o l o g y .......................................................................................7
Absolute Maximum Ratings............................................................ 5
Truth Tab l e .................................................................................... 5
ESD Caution.................................................................................. 5
Pin Configurations and Function Descriptions ........................... 6
REVISION HISTORY
1/05—Revision 0: Initial Version
Typical Perfor m a n c e Charac t e r ist i c s ..............................................8
Tes t Ci rc ui ts ..................................................................................... 12
Outline Dimensions....................................................................... 14
Ordering Guide .......................................................................... 15
Rev. 0 | Page 2 of 16
ADG787

SPECIFICATIONS

VDD = 4.2 V to 5.5 V, GND = 0 V, unless otherwise noted.
Table 1.
Parameter +25°C −40°C to +85°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 to V On Resistance (RON) 2.5 typ VDD = 4.2 V, VS = 0 V to VDD, IS = 10 mA
2.9 3.35 Ω max See Figure 28 On Resistance Match Between Channels (∆RON) 0.02 Ω typ VDD = 4.2 V, VS = 3.5 V, IS = 10 mA
0.1 max
On Resistance Flatness (R
) 0.65 typ VDD = 4.2 V, VS = 0 V to V
FLAT (ON)
0.8 0.95 max IS = 10 mA LEAKAGE CURRENTS VDD = 5.5 V
Source Off Leakage IS(OFF) ±0.05 nA typ VS = 1 V/4.5 V, VD = 4.5 V/1 V; see Figure 29 Channel On Leakage ID, IS(ON) ±0.05 nA typ VS = VD = 1 V or 4.5 V; see Figure 30
DIGITAL INPUTS
Input High Voltage, V Input Low Voltage, V
INH
INL
Input Current
I
or I
INL
INH
±0.1 µA max CIN, Digital Input Capacitance 2.5 pF typ
DYNAMIC CHARACTERISTICS
t
ON
2
19 22 ns max VS = 3 V; See Figure 31 t
3 ns typ RL = 50 Ω, CL = 35 pF
OFF
5 6 ns max VS = 3 V; See Figure 31 Propagation Delay Skew, t
SKEW
0.15 ns max Break-Before-Make Time Delay (t
) 10 ns typ RL = 50 Ω, CL = 35 pF
BBM
5 ns min VS1 = VS2 = 3 V; See Figure 32 Charge Injection 14 pC typ VD = 1 V, RS = 0 Ω, CL = 1 nF; See Figure 33 Off Isolation −63 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; See Figure 34 Channel-to-Channel Crosstalk −110 dB typ
−63 dB typ
Total Harmonic Distortion (THD + N) 0.03 % RL = 32 Ω, f = 20 Hz to 20 kHz, VS = 2 V p-p Insertion Loss −0.2 dB typ RL = 50 Ω, CL = 5 pF; see Figure 35
−3 dB Bandwidth 145 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 35 CS (OFF) 16 pF typ CD, CS (ON) 40 pF typ
POWER REQUIREMENTS VDD = 5.5 V
I
DD
1 µA max
1
Temperature range for B version: −40°C to +85°C.
2
Guaranteed by design, not subject to production test.
1
DD
V
DD
2.0 V min
0.8 V max
0.005 µA typ VIN = V
INL
or V
INH
13 ns typ RL = 50 Ω, CL = 35 pF
0.06 ns typ CL = 50 pF; VS = 3 V
S1A to S2A/S1B to S2B; R
= 50 Ω, CL = 5 pF,
L
f = 1 MHz; see Figure 37 S1A to S1B/S2A to S2B; R
= 50 Ω, CL = 5 pF,
L
f = 1 MHz; see Figure 36
0.005 µA typ Digital inputs = 0 V or 5.5 V
Rev. 0 | Page 3 of 16
ADG787
VDD = 2.7 V to 3.6 V, GND = 0 V, unless otherwise noted.
Table 2.
Parameter +25°C −40°C to +85°C Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range V On Resistance (RON) 4 typ VDD = 2.7 V, VS = 0 V to VDD
5.2 5.5 max IS = 10 mA; see Figure 28 On Resistance Match Between Channels (∆RON) 0.07 typ VDD = 2.7 V, VS = 1.5 V
0.3 0.35 max IS = 10 mA On Resistance Flatness (R
) 1.6 typ VDD = 2.7 V, VS = 0 V to V
FLAT (ON)
2.2 2.5 max IS = 10 mA LEAKAGE CURRENTS VDD = 3.6 V
Source Off Leakage IS(OFF) ±0.01 nA typ VS = 0.6 V/3.3 V, VD = 3.3 V/0.6 V; see Figure 29 Channel On Leakage ID, IS(ON) ±0.01 nA typ VS = VD = 0.6 V or 3.3 V; see Figure 30
DIGITAL INPUTS
Input High Voltage, V Input Low Voltage, V
INH
INL
Input Current
I
or I
INL
INH
±0.1 µA max CIN, Digital Input Capacitance 2 pF typ
DYNAMIC CHARACTERISTICS
t
ON
2
30 35 ns max VS = 1.5 V; see Figure 31 t
4 ns typ RL = 50 Ω, CL = 35 pF
OFF
6 7 ns max VS = 1.5 V; see Figure 31 Propagation Delay Skew, t
SKEW
0.12 ns max Break-Before-Make Time Delay (t
) 15 ns typ RL = 50 Ω, CL = 35 pF
BBM
5 ns min VS1 = VS2 = 1.5 V; see Figure 32 Charge Injection 10 pC typ VD = 1.25 V, RS = 0 Ω, CL = 1 nF; see Figure 33 Off Isolation −63 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 34 Channel-to-Channel Crosstalk −110 dB typ
−63 dB typ
Total Harmonic Distortion (THD + N) 0.07 % RL = 32 Ω, f = 20 Hz to 20 kHz, VS = 1.5 V p-p Insertion Loss −0.24 dB typ RL = 50 Ω, CL = 5 pF; see Figure 35
−3 dB Bandwidth 145 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 35 CS (OFF) 16 pF typ CD, CS (ON) 40 pF typ
POWER REQUIREMENTS VDD = 3.6 V
I
DD
1 µA max
1
Temperature range for B version: −40°C to +85°C.
2
Guaranteed by design, not subject to production test.
1
DD
1.3 V min
0.8 V max
0.005 µA typ VIN = V
INL
or V
INH
18 ns typ RL = 50 Ω, CL = 35 pF
0.04 ns typ CL = 50 pF; VS = 1.5 V
S1A to S2A/S1B to S2B; R
= 50 Ω, CL = 5 pF,
L
f = 1 MHz; see Figure 37 S1A to S1B/S2A to S2B; R
= 50 Ω, CL = 5 pF,
L
f = 1 MHz; see Figure 35
0.005 µA typ Digital Inputs = 0 V or 3.6 V
Rev. 0 | Page 4 of 16
ADG787

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.
Table 3.
Parameter Rating
VDD to GND −0.3 V to +6 V Analog Inputs Digital Inputs1
Peak Current, S or D
5 V Operation 300 mA
3.3 V Operation
Continuous Current, S or D
5 V Operation 100 mA
3.3 V Operation 80 mA
Operating Temperature Range
Industrial (B Version) −40°C to +85°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C WLCSP Package (4-Layer Board)
θJA Thermal Impedance 120°C/W LFCSP Package (4-Layer Board)
θJA Thermal Impedance 61°C/W MSOP Package (4-Layer Board)
θJA Thermal Impedance 142°C/W
θJC Thermal Impedance 43.7°C/W Lead-Free Temperature Soldering
IR Reflow, Peak Temperature 260°C ± 5°C
1
−0.3 V to VDD + 0.3 V
−0.3 V to +6 V or 10 mA, whichever occurs first
200 mA (pulsed at 1 ms, 10% duty cycle max)
1
Overvoltages at IN, S, or D are clamped by internal diodes. Current should be
limited to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time.

TRUTH TABLE

Table 4.
Logic (IN1/IN2) Switch 1A/2A Switch 1B/2B
0 Off On 1 On Off

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. 0 | Page 5 of 16
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