Datasheet ADG736 Datasheet (ANALOG DEVICES)

CMOS Low Voltage

www.BDTIC.com/ADI

FEATURES

1.8 V to 5.5 V single supply
Automotive temperature range: −40°C to

2.5 Ω (typical) on resistance
L

ow on resistance flatness

−3 dB bandwid
Rail-to-rail operation
10-lead MSOP package
Fast switching times

t

: 16 ns

ON

t

: 8 ns

OFF

Typical power consumption (<0.01 μW)
TTL-/CMOS-compatible

APPLICATIONS

USB 1.1 signal switching circuits
Cell phones
PDAs
Battery-powered systems
Communications systems
Sample-and-hold systems
Audio signal routing
Audio and video switching
Mechanical reed relay replacement

h > 200 MHz

t

+125°C

2.5 Ω Dual SPDT Switch
ADG736

FUNCTIONAL BLOCK DIAGRAM

ADG736

2

S1A

9

S1B

1

IN1

4

S2A

7

S2B

5

IN2

SWITCHES SHOWN

FOR A LOG IC 1 INPUT

Figure 1.

10

D1

6

D2

00046-001

GENERAL DESCRIPTION

The ADG736 is a monolithic device comprising two independ­ently selectable CMOS single pole, double throw (SPDT) switches.
These switches are designed using a submicron process that
provides low power dissipation yet gives high switching speed,
low on resistance, low leakage currents, and wide input signal
bandwidth.

The on resistance profile is very flat over the full analog signal

ge. This ensures excellent linearity and low distortion when

ran
switching audio signals. Fast switching speed also makes the
part suitable for video signal switching.

The ADG736 operates from a single 1.8 V to 5.5 V supply,
mak

ing it ideally suited to portable and battery-powered

instruments.

Each switch conducts equally well in both directions when on, and
ea

ch has an input signal range that extends to the power supplies.

The ADG736 exhibits break-before-make switching action.

The ADG736 is available in a 10-lead MSOP package.

Rev. C

Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.

PRODUCT HIGHLIGHTS

1. 1.8 V to 5.5 V Single-Supply Operation. The ADG736

offers high performance, including low on resistance and
fast switching times. It is fully specified and guaranteed
with 3 V and 5 V supply rails.

2. Ver y L o w R

At a supply voltage of 1.8 V, R
temperature range.

3. Low On Resistance Flatness.

4. −3 dB B

5. Low Power Dissipation. CMOS construction ensures low

p

ower dissipation.

6. Fast t

7. Break-Before-Make Switching Action.

8. 10-L

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: [phone] www.analog.com
Fax: [phone] ©2003–2007 Analog Devices, Inc. All rights reserved.

ead MSOP Package.

(4.5 Ω Maximum at 5 V, 8 Ω Maximum at 3 V).

ON

is typically 35 Ω over the

ON

ndwidth > 200 MHz.

a

.

ON/tOFF

ADG736

www.BDTIC.com/ADI

TABLE OF CONTENTS

Features .............................................................................................. 1

Applications....................................................................................... 1

General Description......................................................................... 1

Functional Block Diagram .............................................................. 1

Product Highlights ........................................................................... 1

Revision History ............................................................................... 2

Specifications..................................................................................... 3

Absolute Maximum Ratings............................................................ 5

ESD Caution.................................................................................. 5

REVISION HISTORY

12/07—Rev. B to Rev. C

Updated Temperature Range (Throughout)................................. 1

anges to Features Section............................................................ 1

Ch

Changes to Figure 4 and Figure 5................................................... 7

Changes to Ordering Guide.......................................................... 12

1/07—Rev. A to Rev. B

Updated Format..................................................................Universal

h

anges to Leakage Currents ......................................................... 3

C

Changes to Leakage Currents ......................................................... 4

Changes to Ordering Guide.......................................................... 12

Updated Outline Dimensions....................................................... 12

11/03—Rev. 0 to Rev. A

Renumbered Figures and TPCs........................................Universal

Ch

ange to Title.................................................................................. 1

Changes to Applications .................................................................. 1

Changes to Absolute Maximum Ratings....................................... 4

Changes to Ordering Guide............................................................ 4

Changes to Test Circuit 3................................................................. 7

Changes to Outline Dimensions..................................................... 8

Pin Configuration and Function Descriptions..............................6

Typical Perf or m an c e Charac t e r istics ..............................................7

Test Cir c ui t s ........................................................................................9

Te r mi n ol o g y .................................................................................... 10

Applications Information.............................................................. 11

Outline Dimensions ....................................................................... 12

Ordering Guide .......................................................................... 12

Rev. C | Page 2 of 12

ADG736

www.BDTIC.com/ADI

SPECIFICATIONS

VDD = 5 V ± 10%, GND = 0 V. All specifications −40°C to +125°C, unless otherwise noted.

Table 1.

B Version

−40°C to

Parameter

25°C

+85°C

ANALOG SWITCH

Analog Signal Range 0 V to V
On Resistance (RON) 2.5

4 4.5 7 Ω max

On Resistance Match Between Channels (∆RON) 0.1 Ω typ VS = 0 V to VDD, IDS = −10 mA

0.4 0.4 Ω max

On Resistance Flatness (R

) 0.5

FLAT (ON)

1.2 1.5 Ω max

LEAKAGE CURRENTS

Source Off Leakage IS (Off) ±0.01

Channel On Leakage ID, IS (On) ±0.01

DIGITAL INPUTS

Input High Voltage, V
Input Low Voltage, V
Input Current, I

INL

2.4 2.4 V min

INH

0.8 0.8 V max

INL

or I

0.005

INH

± 0.1 ± 0.1 μA max

DYNAMIC CHARACTERISTICS1

tON 12

t

5

OFF

Break-Before-Make Time Delay, tD 7

Off Isolation –62

–82

Channel-to-Channel Crosstalk –62

–82

Bandwidth (–3 dB) 200

16 16 ns max VS = 3 V; see Figure 13

8 8 ns max VS = 3 V; see Figure 13

1 1 ns min VS1 = VS2 = 3 V; see Figure 14

CS (Off) 9 pF typ
CD, CS (On) 32 pF typ

POWER REQUIREMENTS

IDD 0.001 μA typ Digital inputs = 0 V or 5 V

1.0 1.0 μA max

1

Guaranteed by design; not subject to production test.

−40°C to
+125°C

Unit Test Conditions/Comments

V

DD

Ω typ

= 0 V to VDD, IDS = −10 mA;

V

S

see Figure 10

Ω typ VS = 0 V to VDD, IDS = −10 mA

1 nA typ

VDD = 5.5 V

= 4.5 V/1 V, VD = 1 V/4.5 V;

V

S

see Figure 11

5 nA typ VS = VD = 1 V or 4.5 V; see Figure 12

μA typ VIN = V

INL

or V

INH

ns typ RL = 300 Ω, CL = 35 pF

ns typ RL = 300 Ω, CL = 35 pF

ns typ RL = 300 Ω, CL = 35 pF

dB typ RL = 50 Ω, CL = 5 pF, f = 10 MHz
dB typ

= 50 Ω, CL = 5 pF, f = 1 MHz;

R

L

see Figure 15

dB typ RL = 50 Ω, CL = 5 pF, f = 10 MHz

dB typ

= 50 Ω, CL = 5 pF, f = 1 MHz;

R

L

see Figure 16

MHz typ RL = 50 Ω, CL = 5 pF; see Figure 17

VDD = 5.5 V

Rev. C | Page 3 of 12

ADG736

www.BDTIC.com/ADI

VDD = 3 V ± 10%, GND = 0 V. All specifications −40°C to +125°C, unless otherwise noted.

Table 2.

B Version

−40°C to

Parameter

25°C

+85°C

ANALOG SWITCH

Analog Signal Range
On Resistance (RON) 5 5.5 Ω typ

On Resistance Match Between Channels (∆RON) 0.1

On Resistance Flatness (R

LEAKAGE CURRENTS

FLAT (ON)

)

0.4 0.4 Ω max

Source Off Leakage IS (Off) ±0.01

Channel On Leakage ID, IS (On) ±0.01

8 12 Ω max See Figure 10

2.5 2.5 Ω typ VS = 0 V to VDD, IDS = −10 mA

DIGITAL INPUTS

Input High Voltage, V
Input Low Voltage, V
Input Current, I

INL

2.0 2.4 V min

INH

0.4 0.8 V max

INL

or I

0.005

INH

±0.1 ± 0.1 μA max

DYNAMIC CHARACTERISTICS1

t

ON

t

6

OFF

Break-Before-Make Time Delay, tD 7

Off Isolation

Channel-to-Channel Crosstalk

Bandwidth (−3 dB) 200

14

−62

−82

−62

−82

20 20 ns max VS = 2 V; see Figure 13

10 10 ns max VS = 2 V; see Figure 13

1 1 ns min VS1 = VS2 = 2 V; see Figure 14

CS (Off) 9 pF typ
CD, CS (On) 32 pF typ

POWER REQUIREMENTS

IDD 0.001 μA typ Digital inputs = 0 V or 3 V

1.0 1.0 μA max

1

Guaranteed by design; not subject to production test.

−40°C to
+125°C

0 V to V

Unit Test Conditions/Comments

V

DD

= 0 V to VDD, IDS = −10 mA;

V

S

see Figure 10

Ω typ VS = 0 V to VDD, IDS = −10 mA

VDD = 3.3 V

1 nA typ

= 3 V/1 V, VD = 1 V/3 V;

V

S

see Figure 11

5 nA typ VS = VD = 1 V or 3 V; see Figure 12

μA typ VIN = V

INL

or V

INH

ns typ RL = 300 Ω, CL = 35 pF

ns typ RL = 300 Ω, CL = 35 pF

ns typ RL = 300 Ω, CL = 35 pF

dB typ RL = 50 Ω, CL = 5 pF, f = 10 MHz

dB typ

= 50 Ω, CL = 5 pF, f = 1 MHz;

R

L

see Figure 15

dB typ RL = 50 Ω, CL = 5 pF, f = 10 MHz

dB typ

= 50 Ω, CL = 5 pF, f = 1 MHz;

R

L

see Figure 16

MHz typ RL = 50 Ω, CL = 5 pF; see Figure 17

VDD = 3.3 V

Rev. C | Page 4 of 12

ADG736

www.BDTIC.com/ADI

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 3.

Parameter Rating

VDD to GND

Analog, Digital Inputs

Continuous Current, S or D 30 mA
Peak Current, S or D

Operating Temperature Range

Automotive
Storage Temperature Range

Junction Temperature 150°C
MSOP Package, Power Dissipation 315 mW

θJA Thermal Impedance 205°C/W
Lead Temperature (Soldering,

10 sec)
IR Reflow (Peak Temperature,

<20 sec)
Lead-Free Reflow Soldering

Peak Temperature 260(+0/−5)°C

Time at Peak Temperature 10 sec to 40 sec
ESD 2 kV

1

Overvoltages at IN, S, or D are clamped by internal diodes. Current should be

limited to the maximum ratings given.

1

−0.3 V to +6 V

−0.3 V to VDD + 0.3 V or 30 mA,

whichever occurs first

100 mA (Pulsed at 1 ms, 10%

ycle maximum)

duty c

−40°C to +125°C

−65°C to +150°C

300°C

235°C

Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.

ESD CAUTION

Rev. C | Page 5 of 12

ADG736

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PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

1

IN1

S1A

2

ADG736

3

GND

S2A

TOP VIEW

(Not to Scale)

4

5

IN2

Figure 2. Pin Configuration

Table 4. Pin Function Descriptions

Pin No. Mnemonic Description

1 IN1 Logic Control Input.
2 S1A Source Terminal. May be an input or output.
3 GND Ground (0 V) Reference.
4 S2A Source Terminal. May be an input or output.
5 IN2 Logic Control Input.
6 D2 Drain Terminal. May be an input or output.
7 S2B Source Terminal. May be an input or output.
8 V

DD

Most Positive Power Supply Potential.
9 S1B Source Terminal. May be an input or output.
10 D1 Drain Terminal. May be an input or output.

D1

10

9

S1B

8

V

DD

7

S2B

6

D2

00046-002

Table 5. Truth Table

Logic Switch A Switch B

0 Off On
1 On Off

Rev. C | Page 6 of 12

ADG736

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TYPICAL PERFORMANCE CHARACTERISTICS

6.0

5.5

5.0

4.5

4.0

3.5

(Ω)

3.0

ON

R

2.5

2.0

1.5

1.0

0.5

0

0 0.51.01.52.02.53.03.54.04.55.0

VD OR VS (DRAIN OR SOURCE VOLTAGE) (V)

VDD = 2.7V

V

DD

Figure 3. On Resistance as a Function of V

6.0

5.5

5.0

4.5

4.0

3.5

(Ω)

3.0

ON

R

2.5

2.0

1.5

1.0

0.5

0

0 0.5 1.0 1.5 2.0 2. 5 3. 0

+125°C

+85°C

+25°C

–40°C

VD OR VS (DRAIN OR SOURCE VOLTAGE) (V)

Figure 4. On Resistance as a Function of V

= 3 V

V

DD

TA = 25°C

= 3.0V

V

= 4.5V

DD

= 5.0V

V

DD

or VS Single Supplies

D

VDD = 3V

or VS for Different Temperatures

D

6.0

5.5

5.0

4.5

4.0

3.5

(Ω)

3.0

ON

R

2.5

2.0

1.5

1.0

00046-003

0.5

0

0 0.51.01.52.02.53.03.54.04.55.0

VD OR VS (DRAIN OR SOURCE VOLTAGE) (V)

Figure 5. On Resistance as a Function of V

10m

VDD = 5V
T

= 25°C

A

1m

100μ

10μ

(A)

1μ

SUPPLY

I

100n

10n

00046-004

1n

100 10M1M100k10k1k

+125°C

+25°C

–40°C

= 5 V

V

DD

FREQUENCY (Hz)

+85°C

or VS for Different Temperatures

D

VDD = 5V

00046-005

00046-006

Figure 6. Supply Current vs. Input Switching Frequency

Rev. C | Page 7 of 12

ADG736

www.BDTIC.com/ADI

0

VDD = 5V
T

A

–2

–4

ON RESPONSE (dB)

–8

10k 100M1M 10M100k

–30

VDD = 5V, 3V

–40

T

A

–50

–60

–70

–80

–90

OFF ISOLATION (dB)

–100

–110

–120

–130

10k 100M1M 10M100k

= 25°C

FREQUENCY (Hz)

Figure 7. Bandwidth

= 25°C

FREQUENCY (Hz)

Figure 8. Off Isolation vs. Frequency

00046-007

00046-008

–30

VDD = 5V, 3V

–40

T

= 25°C

A

–50

–60

–70

–80

–90

CROSSTALK (dB)

–100

–110

–120

–130

10k 100M1M 10M100k

FREQUENCY (Hz)

00046-009

Figure 9. Crosstalk vs. Frequency

Rev. C | Page 8 of 12

ADG736

V

V

V

V

V

www.BDTIC.com/ADI

TEST CIRCUITS

I

DS

SD

S

RON = V1/I

Figure 10. On Resistance

V1

DS

V

00046-011

V

DD

0.1μF

V

DD

S

V

S

IN

GND

V

DD

0.1μF

V

DD

SA

V

S

SB

IN

D

GND

IS (OFF)

SD

A

V

D

V

IN

V

OUT

V

IN

0V

V

S

V

OUT

0V

50% 50%

D

S

R

L

300Ω

Figure 11. O

R

L

300Ω

Figure 13. S

C

L

35pF

V

OUT

C

L

35pF

witching Times

V

OUT

ff Leakage

Figure 14. Break-Before-Make Time Delay, t

00046-012

50% 50%

90% 90%

t

ON

50% 50%

t

D

D

NC

t

D

0.1μF

SD

Figure 12. On Leakage

t

OFF

00046-014

90%

00046-015

V

DD

ID (ON)

A

V

D

00046-013

DD

0.1μF

V

DD

SA

SB

IN

V

V

IN

S

D

GND

R
50Ω

V

OUT

L

00046-016

S

NC

CHANNEL-TO-CHANNEL CROSSTALK = 20 × LOG |V

Figure 15. Off Isolation

V

IN

S

V

DD

0.1μF

V

DD

SD

IN

GND

R
50Ω

L

V

IN1

Figure 16. Channel-to-Channel Crosstalk

V

OUT

00046-018

V

DD

SD

SD

GND

50Ω

V

IN2

V

OUT

R

L

50Ω

|

S/VOUT

00046-017

Figure 17. Bandwidth

Rev. C | Page 9 of 12

ADG736

www.BDTIC.com/ADI

TERMINOLOGY

t

R

ON

Ohmic resistance between Terminal D and Terminal S.

ΔR

ON

On resistance match between any two channels; that is, RON
maximum − R

R

FLAT (ON)

minimum.

ON

Flatness is defined as the difference between the maximum and
minimum value of on resistance as measured over the specified
analog signal range.

(Off)

I

S

Source leakage current with the switch off.

I

, IS (On)

D

Channel leakage current with the switch on.

V

(VS)

D

Analog voltage on Terminal D and Terminal S.

C

(Off)

S

Off switch source capacitance.

C

, CS (On)

D

On switch capacitance.

t

ON

Delay between applying the digital control input and the output
switching on. See Figure 13.

OFF

Delay between applying the digital control input and the output
switching off. See Figure 13.

t

D

Off time or on time measured between the 90% points of both
switches, when switching from one address state to another. See
Figure 14.

Crosstalk

A measure of unwanted signal that is coupled from one channel
to

another as a result of parasitic capacitance.

Off Isolation

A measure of unwanted signal coupling through an off switch.

Bandwidth

The frequency at which the output is attenuated by −3 dB.

On Response

The frequency response of the on switch.

On Loss

The voltage drop across the on switch, seen on the on response

. frequency plot (see Figure 7) as how many decibels (dB) the

vs
sign

al is away from 0 dB at very low frequencies.

Rev. C | Page 10 of 12

ADG736

www.BDTIC.com/ADI

APPLICATIONS INFORMATION

V

DD

V+

S1A

S1B

ADG736

D

A = 2

250Ω

75Ω

250Ω

V

OUT

R

L

75Ω

00046-010

75Ω

CH

1

CH

2

75Ω

IN1

Figure 18. Using the ADG736 to Select Between Two Video Signals

Rev. C | Page 11 of 12

ADG736

www.BDTIC.com/ADI

OUTLINE DIMENSIONS

3.10

3.00

2.90

6

10

3.10

3.00

2.90

1

PIN 1

0.50 BSC

0.95

0.85

0.75

0.15

0.05

0.33

0.17

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-187-BA

Figure 19. 10-Lead Mini Small Outline Package [MSOP]

5.15

4.90

4.65

5

1.10 MAX

SEATING
PLANE

(RM

-10)

0.23

0.08

8°
0°

Dimensions shown in millimeters

0.80

0.60

0.40

ORDERING GUIDE

Model Temperature Range Package Description Package Option Branding

ADG736BRM

ADG736BRM-REEL

ADG736BRM-REEL7

ADG736BRMZ

ADG736BRMZ-REEL

1

1

ADG736BRMZ-REEL7

1

Z = RoHS Compliant Part, # denotes RoHS compliant part may be top or bottom marked.

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

1

−40°C to +125°C

10-Lead Mini Small Outline Package (MSOP) RM-10 SAB

10-Lead Mini Small Outline Package (MSOP) RM-10 SAB

10-Lead Mini Small Outline Package (MSOP) RM-10 SAB

10-Lead Mini Small Outline Package (MSOP) RM-10 SAB#

10-Lead Mini Small Outline Package (MSOP) RM-10 SAB#

10-Lead Mini Small Outline Package (MSOP) RM-10 SAB#

©2003–2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D00046-0-12/07(C)

T

Rev. C | Page 12 of 12

TTT