ANALOG DEVICES ADG711 Service Manual

CMOS
IN1
IN2
IN3
IN4
S1
D1
S2
D2
S3
D3
S4
D4
ADG711
SWITCHES SHOWN FOR A LOGIC "1" INPUT
IN1
IN2
IN3
IN4
S1
D1
S2
D2
S3
D3
S4
D4
ADG712
IN1
IN2
IN3
IN4
S1
D1
S2
D2
S3
D3
S4
D4
ADG713
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a

FEATURES

1.8 V to 5.5 V Single Supply Low On Resistance (2.5 Typ) Low On Resistance Flatness –3 dB Bandwidth > 200 MHz Rail-to-Rail Operation 16-Lead TSSOP and SOIC Packages Fast Switching Times
16 ns
t
ON
t
10 ns
OFF
Typical Power Consumption (< 0.01 W) TTL/CMOS Compatible
APPLICATIONS USB 1.1 Signal Switching Circuits Cell Phones PDAs Battery-Powered Systems Communication Systems Sample Hold Systems Audio Signal Routing Video Switching Mechanical Reed Relay Replacement
Low Voltage 4 ⍀ Quad SPST Switches
ADG711/ADG712/ADG713

FUNCTIONAL BLOCK DIAGRAMS

GENERAL DESCRIPTION

The ADG711, ADG712, and ADG713 are monolithic CMOS devices containing four independently selectable switches. These switches are designed on an advanced submicron process that provides low power dissipation yet gives high switching speed, low on resistance, low leakage currents, and high bandwidth.
They are designed to operate from a single 1.8 V to 5.5 V supply, making them ideal for use in battery-powered instruments and with the new generation of DACs and ADCs from Analog Devices. Fast switching times and high bandwidth make the parts suitable for switching USB 1.1 data signals and video signals.
The ADG711, ADG712, and ADG713 contain four independent single-pole/single-throw (SPST) switches. The ADG711 and ADG712 differ only in that the digital control logic is inverted. The ADG711 switches are turned on with a logic low on the appropriate control input, while a logic high is required to turn on the switches of the ADG712. The ADG713 contains two switches whose digital control logic is similar to the ADG711, while the logic is inverted on the other two switches.
Each switch conducts equally well in both directions when ON. The ADG713 exhibits break-before-make switching action.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
The ADG711/ADG712/ADG713 are available in 16-lead TSSOP and 16-lead SOIC packages.

PRODUCT HIGHLIGHTS

1. 1.8 V to 5.5 V Single-Supply Operation. The ADG711, ADG712, and ADG713 offer high perfor­mance and are fully specified and guaranteed with 3 V and 5 V supply rails.
2. Very Low R supply voltage of 1.8 V, R
(4.5 W max at 5 V, 8 W max at 3 V). At
ON
is typically 35 W over the
ON
temperature range.
3. Low On Resistance Flatness.
4. –3 dB Bandwidth >200 MHz.
5. Low Power Dissipation. CMOS construction ensures low power dissipation.
6. Fast t
ON/tOFF.
7. Break-Before-Make Switching. This prevents channel shorting when the switches are con­figured as a multiplexer (ADG713 only).
8. 16-Lead TSSOP and 16-Lead SOIC Packages.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 © 2004 Analog Devices, Inc. All rights reserved.
(VDD = +5 V 10%, GND = 0 V. All specifications
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1
ADG711/ADG712/ADG713–SPECIFICATIONS
–40C to +85C unless otherwise noted.)
B Version
–40C to
Parameter +25C +85C Unit Test Conditions/Comments
ANALOG SWITCH Analog Signal Range 0 V to V
On Resistance (R
) 2.5 typ VS = 0 V to VDD, IS = –10 mA;
ON
DD
V
4 4.5 max Test Circuit 1
On Resistance Match Between 0.05 Ω typ V
Channels (∆R
On Resistance Flatness (R
) 0.3 max
ON
FLAT(ON)
) 0.5 typ VS = 0 V to VDD, IS = –10 mA
= 0 V to VDD, IS = –10 mA
S
1.0 Ω max
LEAKAGE CURRENTS V
Source OFF Leakage I
(OFF) ± 0.01 nA typ VS = 4.5 V/1 V, VD = 1 V/4.5 V;
S
= +5.5 V;
DD
± 0.1 ± 0.2 nA max Test Circuit 2
Drain OFF Leakage I
(OFF) ± 0.01 nA typ VS = 4.5 V/1 V, VD = 1 V/4.5 V;
D
± 0.1 ± 0.2 nA max Test Circuit 2
Channel ON Leakage I
, IS (ON) ± 0.01 nA typ VS = VD = 1 V, or 4.5 V;
D
± 0.1 ± 0.2 nA max Test Circuit 3
DIGITAL INPUTS
Input High Voltage, V Input Low Voltage, V
INL
INH
2.4 V min
0.8 V max
Input Current
I
INL
or I
INH
0.005 µA typ VIN = V
INL
or V
INH
± 0.1 µA max
DYNAMIC CHARACTERISTICS
t
ON
t
OFF
Break-Before-Make Time Delay, t
(ADG713 Only) 1 ns min V
Charge Injection 3 pC typ V
2
11 ns typ RL = 300 , CL = 35 pF,
16 ns max V
= 3 V; Test Circuit 4
S
6 ns typ RL = 300 , CL = 35 pF,
10 ns max V
D
6 ns typ RL = 300 , CL = 35 pF,
= 3 V; Test Circuit 4
S
= VS2 = 3 V; Test Circuit 5
S1
= 2 V; RS = 0 , CL = 1 nF;
S
Test Circuit 6
Off Isolation –58 dB typ R
–78 dB typ R
= 50 , CL = 5 pF, f = 10 MHz
L
= 50 , CL = 5 pF, f = 1 MHz;
L
Test Circuit 7
Channel-to-Channel Crosstalk –90 dB typ R
= 50 , CL = 5 pF, f = 10 MHz;
L
Test Circuit 8
Bandwidth –3 dB 200 MHz typ R
(OFF) 10 pF typ
C
S
C
(OFF) 10 pF typ
D
= 50 , CL = 5 pF; Test Circuit 9
L
CD, CS (ON) 22 pF typ
POWER REQUIREMENTS V
I
DD
0.001 µA typ Digital Inputs = 0 V or 5 V
= +5.5 V
DD
1.0 µA max
NOTES
1
Temperature range: B Version: –40°C to +85°C.
2
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
–2–
REV. A
ADG711/ADG712/ADG713
www.BDTIC.com/ADI
1
SPECIFICATIONS
Parameter +25C +85C Unit Test Conditions/Comments
ANALOG SWITCH Analog Signal Range 0 V to V
On Resistance (R
On Resistance Match Between 0.1 Ω typ V
Channels (∆R
On Resistance Flatness (R
LEAKAGE CURRENTS V
Source OFF Leakage I
Drain OFF Leakage I
Channel ON Leakage I
DIGITAL INPUTS
Input High Voltage, V Input Low Voltage, V Input Current
or I
I
INL
INH
DYNAMIC CHARACTERISTICS
t
ON
t
OFF
Break-Before-Make Time Delay, t
(ADG713 Only) 1 ns min V
Charge Injection 3 pC typ V
Off Isolation –58 dB typ R
Channel-to-Channel Crosstalk –90 dB typ R
Bandwidth –3 dB 200 MHz typ R
(OFF) 10 pF typ
C
S
(OFF) 10 pF typ
C
D
CD, CS (ON) 22 pF typ
POWER REQUIREMENTS V
I
DD
NOTES
1
Temperature range: B Version: –40°C to +85°C.
2
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
)55.5 Ω typ VS = 0 V to VDD, IS = –10 mA;
ON
) 0.3 max
ON
(OFF) ± 0.01 nA typ VS = 3 V/1 V, VD = 1 V/3 V;
S
(OFF) ± 0.01 nA typ VS = 3 V/1 V, VD = 1 V/3 V;
D
, IS (ON) ± 0.01 nA typ VS = VD = 1 V, or 3 V;
D
INH
INL
(VDD = +3 V 10%, GND = 0 V. All specifications –40C to +85C unless otherwise noted.)
B Version
–40C to
V
DD
8 max Test Circuit 1
= 0 V to VDD, IS = –10 mA
S
FLAT(ON)
) 2.5 typ VS = 0 V to VDD, IS = –10 mA
= +3.3 V;
DD
± 0.1 ± 0.2 nA max Test Circuit 2
± 0.1 ± 0.2 nA max Test Circuit 2
± 0.1 ± 0.2 nA max Test Circuit 3
2.0 V min
0.4 V max
0.005 µA typ VIN = V
INL
± 0.1 µA max
2
13 ns typ RL = 300 , CL = 35 pF,
20 ns max V
= 2 V; Test Circuit 4
S
7 ns typ RL = 300 , CL = 35 pF,
12 ns max V
D
7 ns typ RL = 300 , CL = 35 pF,
= 2 V; Test Circuit 4
S
= VS2 = 2 V; Test Circuit 5
S1
= 1.5 V; RS = 0 , CL = 1 nF;
S
Test Circuit 6
= 50 , CL = 5 pF, f = 10 MHz
L
–78 dB typ R
= 50 , CL = 5 pF, f = 1 MHz;
L
Test Circuit 7
= 50 , CL = 5 pF, f = 10 MHz;
L
Test Circuit 8
= 50 , CL = 5 pF; Test Circuit 9
L
= +3.3 V
DD
0.001 µA typ Digital Inputs = 0 V or 3 V
1.0 µA max
or V
INH
REV. A
–3–
ADG711/ADG712/ADG713
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ABSOLUTE MAXIMUM RATINGS

(TA = +25°C unless otherwise noted)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . .–0.3 V to +6 V
Analog, Digital Inputs
2
. . . . . . . . . . . –0.3 V to VDD +0.3 V or
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
TSSOP Package, Power Dissipation . . . . . . . . . . . . . 430 mW
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 150°C/W
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 27°C/W
θ
JC
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG711/ADG712/ADG713 feature proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
1
30 mA, Whichever Occurs First

ORDERING GUIDE

SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 520 mW
θ
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 125°C/W
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 42°C/W
θ
JC
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time.
2
Overvoltages at IN, S, or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
WARNING!
ESD SENSITIVE DEVICE
Model Temperature Range Package Description Package Option
ADG711BR –40°C to +85°C Standard Small Outline (SOIC) R-16 ADG711BR-REEL –40°C to +85°C Standard Small Outline (SOIC) R-16 ADG711BR-REEL7 –40°C to +85°C Standard Small Outline (SOIC) R-16 ADG711BRU –40°C to +85°CThin Shrink Small Outline (TSSOP) RU-16 ADG711BRU-REEL –40°C to +85°CThin Shrink Small Outline (TSSOP) RU-16 ADG711BRU-REEL7 –40°C to +85°CThin Shrink Small Outline (TSSOP) RU-16 ADG712BR –40°C to +85°C Standard Small Outline (SOIC) R-16 ADG712BR-REEL –40°C to +85°C Standard Small Outline (SOIC) R-16 ADG712BR-REEL7 –40°C to +85°C Standard Small Outline (SOIC) R-16 ADG712BRU –40°C to +85°CThin Shrink Small Outline (TSSOP) RU-16 ADG712BRU-REEL –40°C to +85°CThin Shrink Small Outline (TSSOP) RU-16 ADG712BRU-REEL7 –40°C to +85°CThin Shrink Small Outline (TSSOP) RU-16 ADG712BRUZ* –40°C to +85°CThin Shrink Small Outline (TSSOP) RU-16 ADG712BRUZ-REEL* –40°C to +85°CThin Shrink Small Outline (TSSOP) RU-16 ADG712BRUZ-REEL7* –40°C to +85°CThin Shrink Small Outline (TSSOP) RU-16 ADG713BR –40°C to +85°C Standard Small Outline (SOIC) R-16 ADG713BR-REEL –40°C to +85°C Standard Small Outline (SOIC) R-16 ADG713BR-REEL7 –40°C to +85°C Standard Small Outline (SOIC) R-16 ADG713BRU –40°C to +85°CThin Shrink Small Outline (TSSOP) RU-16 ADG713BRU-REEL –40°C to +85°CThin Shrink Small Outline (TSSOP) RU-16 ADG713BRU-REEL7 –40°C to +85°CThin Shrink Small Outline (TSSOP) RU-16
*Z = Pb-free part.
–4–
REV. A
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