Analog Devices ADG509F, ADG528F, ADG508F Datasheet

4/8 Channel Fault-Protected
a
FEATURES Low On Resistance (300 typ) Fast Switching Times
250 ns max
t
ON
250 ns max
t
OFF
Low Power Dissipation (3.3 mW max) Fault and Overvoltage Protection (–40 V to +55 V) All Switches OFF with Power Supply OFF Analog Output of ON Channel Clamped Within Power
Supplies If an Overvoltage Occurs Latch-Up Proof Construction Break Before Make Construction TTL and CMOS Compatible Inputs
APPLICATIONS Existing Multiplexer Applications (Both Fault-Protected
and Nonfault-Protected) New Designs Requiring Multiplexer Functions
GENERAL DESCRIPTION
The ADG508F, ADG509F and ADG528F are CMOS analog multiplexers, the ADG508F and ADG528F comprising eight single channels and the ADG509F comprising four differential channels. These multiplexers provide fault protection. Using a series n-channel, p-channel, n-channel MOSFET structure, both device and signal source protection is provided in the event of an overvoltage or power loss. The multiplexer can withstand continuous overvoltage inputs from –40 V to +55 V. During fault conditions, the multiplexer input (or output) appears as an open circuit and only a few nanoamperes of leakage current will flow. This protects not only the multiplexer and the circuitry driven by the multiplexer, but also protects the sensors or signal sources that drive the multiplexer.
The ADG508F and ADG528F switch one of eight inputs to a common output as determined by the 3-bit binary address lines A0, A1 and A2. The ADG509F switches one of four differential inputs to a common differential output as determined by the 2­bit binary address lines A0 and A1. The ADG528F has on-chip address and control latches that facilitate microprocessor inter­facing. An EN input on each device is used to enable or disable the device. When disabled, all channels are switched OFF.
PRODUCT HIGHLIGHTS
1. Fault Protection. The ADG508F/ADG509F/ADG528F can withstand con­tinuous voltage inputs from –40 V to +55 V. When a fault occurs due to the power supplies being turned off, all the channels are turned off and only a leakage current of a few nanoamperes flows.
*Patent Pending.
Analog Multiplexers
ADG508F/ADG509F/ADG528F*
FUNCTIONAL BLOCK DIAGRAMS
ADG508F/ADG528F
S1
D
S8
ONLY
WR
RS
1 OF 8
DECODER
A0
A1 A2 EN
ADG528F
2. ON channel turns off while fault exists.
3. Low R
ON.
4. Fast Switching Times.
5. Break-Before-Make Switching. Switches are guaranteed break-before-make so that input signals are protected against momentary shorting.
6. Trench Isolation Eliminates Latch-up. A dielectric trench separates the p and n-channel MOSFETs thereby preventing latch-up.
ORDERING GUIDE
1
Model
Temperature Range Package Option
ADG508FBN –40°C to +85°C N-16 ADG508FBRN –40°C to +85°C R-16N ADG508FBRW –40°C to +85°C R-16W ADG508FTQ –55°C to +125°C Q-16
ADG509FBN –40°C to +85°C N-16 ADG509FBRN –40°C to +85°C R-16N ADG509FBRW –40°C to +85°C R-16W ADG509FTQ –55°C to +125°C Q-16
ADG528FBN –40°C to +85°C N-18 ADG528FBP –40°C to +85°C P-20A ADG528FTQ –55°C to +125°C Q-18
NOTES
1
To order MIL-STD-883, Class B processed parts, add /883B to T grade part numbers.
2
N = Plastic DIP; P = Plastic Leaded Chip Carrier (PLCC); Q = Cerdip; RN = 0.15" Small Outline IC (SOIC), RW = 0.3" Small Outline IC (SOIC).
S1A
S4A
S1B
S4B
ADG509F
1 OF 4
DECODER
A1
A0
EN
DA
DB
2
REV. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 1998
ADG508F/ADG509F/ADG528F–SPECIFICATIONS
1
Dual Supply
(V
= +15 V 10%, V
DD
= –15 V 10%, GND = 0 V, unless otherwise noted)
SS
B Version T Version
–40C to –55C to
Parameter +25ⴗC +85ⴗC +25ⴗC +125ⴗC Units Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range V
+ 3 VSS + 3 V min
SS
VDD – 1.5 VDD – 1.5 V max
R
ON
300 350 300 400 typ –10 V < V
400 450 max –10 V < V
Drift 0.6 0.6 %/°C typ V
R
ON
V
DD
V
DD
= 0 V, IS = 1 mA
S
< +10 V, IS = 1 mA;
S
= +15 V ± 10%, VSS = –15 V ± 10%
< +10 V, IS = 1 mA;
S
= +15 V ± 5%, VSS = –15 V ± 5%
RON Match 5 5 % max VS = 0 V, IS = 1 mA
LEAKAGE CURRENTS
Source OFF Leakage I
(OFF) ±0.02 ±0.02 nA typ VD = ±10 V, V
S
= ⫿10 V;
S
±1 ±50 ±1 ±50 nA max Test Circuit 2
Drain OFF Leakage I
(OFF) ±0.04 ±0.04 nA typ VD = ±10 V, V
D
= ⫿10 V;
S
ADG508F/ADG528F ±1 ±60 ±1 ±200 nA max Test Circuit 3 ADG509F ±1 ±30 ±1 ±100 nA max
Channel ON Leakage I
(ON) ±0.04 ±0.04 nA typ V
D
S
= V
S
= ±10 V;
D
, I
ADG508F/ADG528F ±1 ±60 ±1 ±200 nA max Test Circuit 4 ADG509F ±1 ±30 ±1 ±100 nA max
FAULT
Output Leakage Current ±0.02 ±0.02 nA typ V
= ±33 V, V
S
= 0 V, Test Circuit 3
D
(With Overvoltage) ±2 ±2 ±2 µA max
Input Leakage Current ±0.005 ±0.005 µA typ V
= ±25 V, V
S
= ⫿10 V, Test Circuit 5
D
(With Overvoltage) ±2 ±2 µA max
Input Leakage Current ±0.001 ±0.001 µA typ V
= ±25 V, V
S
= VEN = A0, A1, A2 = 0 V
D
(With Power Supplies OFF) ±2 ±2 µA max Test Circuit 6
DIGITAL INPUTS
Input High Voltage, V Input Low Voltage, V
INL
INH
2.4 2.4 V min
0.8 0.8 V max
Input Current
I
INL
or I
INH
±1 ±1 µA max V
= 0 or V
IN
DD
CIN, Digital Input Capacitance 5 5 pF typ
DYNAMIC CHARACTERISTICS
t
TRANSITION
t
OPEN
t
(EN, WR) 200 200 ns typ R
ON
(EN, RS) 200 200 ns typ R
t
OFF
2
200 200 ns typ R 300 400 300 400 ns max V 50 50 ns typ R 25 10 25 10 ns min V
250 400 250 400 ns max V
= 1 M, C
L
= ±10 V, V
S1
= 1 k, C
L
= +5 V; Test Circuit 8
S
= 1 k, C
L
= +5 V; Test Circuit 9
S
= 1 k, C
L
= 35 pF;
L
= ⫿10 V; Test Circuit 7
S8
= 35 pF;
L
= 35 pF;
L
= 35 pF;
L
250 400 250 400 ns max VS = +5 V; Test Circuit 9
, Settling Time
t
SETT
0.1% 1 1 µs typ R
0.01% 2.5 2.5 µs typ V
= 1 k, C
L
= +5 V
S
= 35 pF;
L
ADG528F Only
, Write Pulsewidth 100 120 100 200 ns min
t
W
tS, Address, Enable Setup Time 100 100 ns min
, Address, Enable Hold Time 10 10 ns min
t
H
, Reset Pulsewidth 100 100 ns min
t
RS
Charge Injection 4 4 pC typ VS =0V,R OFF Isolation 68 68 dB typ R
50 50 dB min V
= 1 k, C
L
= 7 V rms; Test Circuit 13
S
=0,C
S
L
= 1 nF; Test Circuit 12
L
= 15 pF, f = 100 kHz;
CS (OFF) 5 5 pF typ
(OFF)
C
D
ADG508F/ADG528F 50 50 pF typ ADG509F 25 25 pF typ
POWER REQUIREMENTS
I
DD
I
SS
NOTES
1
Temperature ranges are as follows: B Version: –40°C to +85°C; T Version: –55°C to +125°C.
2
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
0.1 0.2 0.1 0.2 mA max VIN = 0 V or 5 V
0.1 0.1 0.1 0.1 mA max
REV. C–2–
ADG508F/ADG509F/ADG528F
Table I. ADG508F Truth Table
A2 A1 A0 EN ON SWITCH
X X X 0 NONE 00011 00112 01013 01114 10015 10116 11017 11118
X = Don’t Care
Table III. ADG528F Truth Table
A2 A1 A0 EN WR RS SWITCH
X XXXg 1 Retains Previous Switch Condition X XXXX0 NONE (Address and Enable Latches Cleared) X X X 0 0 1 NONE 0 001011 0 011012 0 101013 0 111014 1 001015 1 011016 1 101017 1 111018
X = Don’t Care
Table II. ADG509F Truth Table
A1 A0 EN ON SWITCH PAIR
X X 0 NONE 0011 0112 1013 1114
X = Don’t Care
ON
TIMING DIAGRAMS (ADG528F)
3V
WR
A0, A1, A2
EN
50%
0V
3V
0V
t
W
2V
50%
t
S
t
0.8V
H
Figure 1.
Figure 1 shows the timing sequence for latching the switch address and enable inputs. The latches are level sensitive; there­fore, while WR is held low, the latches are transparent and the switches respond to the address and enable inputs. This input data is latched on the rising edge of WR.
3V
RS
SWITCH OUTPUT
0V
V
O
0V
50%
50%
t
RS
t
(RS)
OFF
0.8V
O
Figure 2.
Figure 2 shows the Reset Pulsewidth, tRS, and the Reset Turn­off Time, t
OFF
(RS).
Note: All digital input signals rise and fall times are measured from 10% to 90% of 3 V. t
= tF = 20 ns.
R
REV. C
–3–
ADG508F/ADG509F/ADG528F
WR
A0
RS
A1
S1 S2
S3
S5 S6
EN
V
SS
A2
S4 S7
D
S8
V
DD
GND
1 2
18 17
5 6 7
14 13 12
3 4
16 15
811 910
TOP VIEW
(Not to Scale)
ADG528F
EN
V
SS
S3
S1 S2
A0
WR
A1
NC
RS
1931220
4 5
8
6 7
12 1391110
18 17
14
16 15
TOP VIEW
(Not to Scale)
ADG528F
A2 GND
S6
V
DD
S5
S4
D
S7
S8
NC
NC = NO CONNECT
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS*
(T
= +25°C unless otherwise noted)
A
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+44 V
V
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +25 V
DD
V
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –25 V
SS
, VA Digital Input . . . . . . . – 0.3 V to VDD + 2 V or 20 mA,
V
EN
Whichever Occurs First
V
, Analog Input Overvoltage with Power ON . . . . . VSS – 25 V
S
V
, Analog Input Overvoltage with Power OFF
S
to V
+ 40 V
DD
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–40 V to +55 V
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 20 mA
Peak Current, S or D
(Pulsed at 1 ms, 10% Duty Cycle max) . . . . . . . . . . . 40 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40°C to +85°C
Extended (T Version) . . . . . . . . . . . . . . . . –55°C to +125°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Cerdip Package
, Thermal Impedance
θ
JA
16-Lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
18-Lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +300°C
Plastic Package
, Thermal Impedance
θ
JA
16-Lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117°C
18-Lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110°C
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260°C
SOIC Package
, Thermal Impedance
θ
JA
Narrow Body . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77°C/W
Wide Body . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
PLCC Package
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 90°C/W
θ
JA
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time.
ADG508F/ADG509F PIN CONFIGURATIONS
DIP/SOIC DIP/SOIC
1
A0
2
EN
3
V
SS
ADG508F
4
S1
TOP VIEW
5
S2
(Not to Scale)
6
S3
7
S4
DS8
89
16
A1
15
A2
14
GND
13
V
DD
12
S5
11
S6
10
S7
1
A0
2
EN
3
V
SS
ADG509F
S1A
4
TOP VIEW
5
S2A
(Not to Scale)
6
S3A
7
S4A
89
DA DB
16 15
14 13 12 11 10
ADG528F PIN CONFIGURATIONS
DIP PLCC
A1 GND V
DD
S1B S2B S3B S4B
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although these devices feature proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
–4–
REV. C
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