Analog Devices ADG467BR, ADG467BN, ADG466BRS, ADG466BRM, ADG466BN Datasheet

REV. A
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a
ADG466/ADG467
Triple and Octal
Channel Protectors
FUNCTIONAL BLOCK DIAGRAMS
ADG466
ADG467
V
D1
V
D2
V
D3
V
S1
V
S2
V
S3
V
D1
V
D2
V
D3
V
D8
V
S1
V
S2
V
S3
V
S8
VDDV
SS
VDDV
SS
V
IN
V
DD
V
DD
V
IN
V
OUT
OUTPUT CLAMPED @ V
DD
– 1.5V
V
OUT
GENERAL DESCRIPTION
The ADG466 and ADG467 are triple and octal channel pro­tectors, respectively. The channel protector is placed in series with the signal path. The channel protector will protect sensitive components from voltage transience in the signal path whether the power supplies are present or not. Because the channel protection works whether the supplies are present or not, the channel protectors are ideal for use in applications where correct power sequencing can’t always be guaranteed (e.g., hot­insertion rack systems) to protect analog inputs. This is dis­cussed further, and some example circuits are given in the Applications section of this data sheet.
Each channel protector has an independent operation and con­sists of an n-channel MOSFET, a p-channel MOSFET and an n-channel MOSFET, connected in series. The channel protec­tor behaves just like a series resistor during normal operation, i.e., (V
SS
+ 2 V) < VIN < (V
DD
– 1.5 V). When a channel’s ana-
log input exceeds the power supplies (including V
DD
and VSS = 0 V), one of the MOSFETs will switch off, clamping the output to either V
SS
+ 2 V or VDD – 1.5 V. Circuitry and signal source protection is provided in the event of an overvoltage or power loss. The channel protectors can withstand overvoltage inputs from –40 V to +40 V. See the Circuit Information section of this data sheet.
The ADG466 and ADG467 can operate off both bipolar and unipolar supplies. The channels are normally on when power is connected and open circuit when power is disconnected. With
power supplies of ± 15 V, the on-resistance of the ADG466 and
FEATURES Fault and Overvoltage Protection up to 640 V
Signal Paths Open Circuit with Power Off Signal Path Resistance of R
ON
with Power On 44 V Supply Maximum Ratings Low On Resistance
ADG466/ADG467 60 V typ 1 nA Max Path Current Leakage @ +258C Low R
ON
Match (5 V max) Low Power Dissipation 0.8 mW typ Latch-Up Proof Construction
APPLICATIONS ATE Equipment Sensitive Measurement Equipment Hot-Insertion Rack Systems
ADG467 is 60 typ with a leakage current of ±1 nA max.
When power is disconnected, the input leakage current is ap-
proximately ±5 nA typ. The ADG466 is available in 8-lead DIP, SOIC and µSOIC
packages. The ADG467 is available in an 18-lead SOIC package and a 20-lead SSOP package.
PRODUCT HIGHLIGHTS
1. Fault Protection. The ADG466 and ADG467 can withstand continuous volt­age inputs from –40 V to +40 V. When a fault occurs due to the power supplies being turned off or due to an overvoltage being applied to the ADG466 and ADG467, the output is clamped. When power is turned off, current is limited to the microampere level.
2. Low Power Dissipation.
3. Low R
ON
.
ADG466/ADG467 60 typ.
4. Trench Isolation Latch-Up Proof Construction. A dielectric trench separates the p- and n-channel MOSFETs thereby preventing latch-up.
–2–
REV. A
ADG466/ADG467–SPECIFICATIONS
Dual Supply
1
ADG466 ADG467
Parameter +258CB
1
+258CB
1
Units Test Conditions/Comments
FAULT PROTECTED CHANNEL
Fault-Free Analog Signal Range
2
VSS + 1.2 VSS + 1.2 V min Output Open Circuit V
DD
– 0.8 VDD – 0.8 V max
R
ON
60 75 62 80 typ –10 V VS ≤ +10 V, I
S
= 1 mA
80 95 max
R
ON
34 6 max –5 V VS ≤ +5 V
R
ON
Match 4 6 5 6 max VS = ±10 V, I
S
= 1 mA
LEAKAGE CURRENTS
Channel Output Leakage, I
S(ON)
VS = V
D
= ±10 V
(without Fault Condition) ±0.1 ±1 ±0.04 ±0.2 nA typ
±1 ±5 ±1 ±5 nA max
Channel Input Leakage, I
D(ON)
V
S
= ±25 V
(with Fault Condition) ±0.2 ±0.4 ±0.2 ±0.4 nA typ V
D
= Open Circuit
±2 ±5 ±2 ±5 nA max
Channel Input Leakage, I
D(OFF)
VDD = 0 V, V
SS
= 0 V
(with Power Off and Fault) ±0.5 ±2 ±0.5 ±2 nA typ V
S
= ±35 V,
±1 ±5 ±2 ±10 nA max V
D
= Open Circuit
Channel Input Leakage, I
D(OFF)
VDD = 0 V, V
SS
= 0 V
(with Power Off and Output S/C) ±0.005 ±0.1 ±0.006 ±0.16 µA typ V
S
= ±35 V, V
D
= 0 V
±0.015 ±0.5 ±0.015 ±0.5 µA max
POWER REQUIREMENTS
I
DD
±0.05 ±0.05 µA typ ±0.5 ±8 ±0.5 ±8 µA max
I
SS
±0.05 ±0.05 µA typ ±0.5 ±8 ±0.5 ±8 µA max
V
DD/VSS
0 0 0 0 V min
±20 ±20 ±20 ±20 V max
NOTES
1
Temperature range is as follows: B Version: – 40°C to +85°C.
2
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
(VDD = +15 V, VSS = –15 V, GND = 0 V, unless otherwise noted)
ADG466/ADG467
–3–
REV. A
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= +25°C unless otherwise noted)
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +44 V
V
S
, VD, Analog Input Overvoltage with Power ON
2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . VSS – 20 V to VDD + 20 V
V
S
, VD, Analog Input Overvoltage with Power OFF
2
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–35 V to +35 V
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 20 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 mA
(Pulsed at 1 ms, 10% Duty Cycle Max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +125°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Plastic DIP Package
θ
JA
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 125°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260°C
SOIC Package
θ
JA
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 160°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
µSOIC Package
θ
JA
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 160°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
SSOP Package
θ
JA
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 130°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating condi­tions for extended periods may affect device reliability. Only one absolute maxi­mum rating may be applied at any one time.
2
Overvoltages at S or D will be clamped by the channel protector, see Circuit
Information section of the data sheet.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG466/ADG467 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
PIN CONFIGURATIONS
8-Lead
DIP, SOIC 18-Lead and mSOIC SOIC
1 2 3 4
8 7 6 5
TOP VIEW
(Not to Scale)
ADG466
V
D1
V
S3
V
S2
V
S1
V
DD
V
D2
V
D3
V
SS
14 13 12 11
17 16 15
18
10
9
8
1 2 3 4
7
6
5
TOP VIEW
(Not to Scale)
ADG467
V
D1
V
S3
V
S2
V
S1
V
DD
V
D2
V
D3
V
D4
V
S6
V
S5
V
S4
V
D5
V
D6
V
D7
V
D8
V
SS
V
S8
V
S7
20-Lead
SSOP
V
D1
V
S3
V
S2
V
S1
V
DD
V
D2
V
D3
V
D4
V
S6
V
S5
V
S4
V
D5
V
D6
V
D7
V
D8
V
SS
V
S8
V
S7
14 13 12 11
17 16 15
20 19 18
10
9
8
1 2 3 4
7
6
5
TOP VIEW
(Not to Scale)
ADG467
NC = NO CONNECT
NC
NC
ORDERING GUIDE
Model Temperature Range Package Description Package Options
ADG466BN –40°C to +85°C 8-Lead Plastic DIP N-8 ADG466BR –40°C to +85°C 8-Lead Small Outline Package SO-8 ADG466BRM –40°C to +85°C 8-Lead Micro Small Outline Package RM-8
ADG467BR –40°C to +85°C 18-Lead Small Outline Package R-18 ADG467BRS –40°C to +85°C 20-Lead Shrink Small Outline Package RS-20
WARNING!
ESD SENSITIVE DEVICE
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