Analog Devices ADG426BRS, ADG426BN, ADG426, ADG406, ADG407BP Datasheet

...
a
ADG407
ENA0 A1 A2
S1A
S8A
DA
S8B
DB
S1B
1 OF 8
DECODER
ENA0 A1 A2 A3 RS
ADG426
S1
S16
D
WR
DECODER/
LATCHES
ADG406
ENA0 A1 A2 A3
S1
S16
D
1 OF 16
DECODER
LC2MOS 8-/16-Channel
High Performance Analog Multiplexers
ADG406/ADG407/ADG426
FEATURES 44 V Supply Maximum Ratings VSS to VDD Analog Signal Range Low On Resistance (80 max) Low Power Fast Switching
< 160 ns
t
ON
t
< 150 ns
OFF
Break Before Make Switching Action Plug-In Upgrade for
DG506A/ADG506A, DG507A/ADG507A, DG526/ADG526A
ADG406/ADG407 are Plug-In Replacements for
DG406/DG407
APPLICATIONS Audio and Video Routing Automatic Test Equipment Data Acquisition Systems Battery Powered Systems Sample Hold Systems Communication Systems Avionics
GENERAL DESCRIPTION
The ADG406, ADG407 and ADG426 are monolithic CMOS analog multiplexers. The ADG406 and ADG426 switch one of sixteen inputs to a common output as determined by the 4-bit binary address lines A0, A1, A2 and A3. The ADG426 has on­chip address and control latches that facilitate microprocessor interfacing. The ADG407 switches one of eight differential inputs to a common differential output as determined by the 3­bit binary address lines A0, A1 and A2. An EN input on all devices is used to enable or disable the device. When disabled, all channels are switched OFF.
The ADG406/ADG407/ADG426 are designed on an enhanced
2
LC
MOS process that provides low power dissipation yet gives high switching speed and low on resistance. These features make the parts suitable for high speed data acquisition systems and audio signal switching. Low power dissipation makes the parts suitable for battery powered systems. Each channel conducts equally well in both directions when ON and has an input signal range which extends to the supplies. In the OFF condition, signal levels up to the supplies are blocked. All channels exhibit break before make switching action preventing momentary shorting when switching channels. Inherent in the design is low charge injection for minimum transients when switching the digital inputs.
FUNCTIONAL BLOCK DIAGRAMS
PRODUCT HIGHLIGHTS
1. Extended Signal Range The ADG406/ADG407/ADG426 are fabricated on an enhanced LC
2
MOS process giving an increased signal range
which extends to the supply rails
2. Low Power Dissipation
3. Low R
ON
4. Single/Dual Supply Operation
5. Single Supply Operation For applications where the analog signal is unipolar, the ADG406/ADG407/ADG426 can be operated from a single rail power supply. The parts are fully specified with a single +12 V power supply and will remain functional with single supplies as low as +5 V.
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One Technology Way, P.O. Box 9106, Norwood. MA 02062-9106, U.S.A. Tel: 617/329-4700 Fax: 617/326-8703
1
ADG406/ADG407/ADG426–SPECIFICATIONS
(V
= +15 V ± 10%, V
DUAL SUPPLY
DD
B Version T Version
Parameter +25°C +85°C +25°C +125°C Units Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range VSS to V R
ON
R
Match 4 4 typ VD = 0 V, IS = –1 mA
ON
50 50 typ VD = ±10 V, IS = –1 mA 80 125 80 125 max VDD = +13.5 V, VSS = –13.5 V
LEAKAGE CURRENTS VDD = +16.5 V, VSS = –16.5 V
Source OFF Leakage IS (OFF) ± 0.5 ±20 ±0.5 ±50 nA max VD = ±10 V, VS = 710 V, Test Circuit 2 Drain OFF Leakage ID (OFF) VD = ±10 V, VS = 710 V; ADG406, ADG426 ±1 ±20 ±1 ±200 nA max Test Circuit 3 ADG407 ±1 ±20 ±1 ±100 nA max Channel ON Leakage ID, IS (ON) VS = VD = ±10 V;
ADG406, ADG426 ± 1 ± 20 ±1 ±200 nA max Test Circuit 4 ADG407 ±1 ±20 ±1 ±100 nA max
DIGITAL INPUTS
Input High Voltage, V Input Low Voltage, V Input Current
I
or I
INL
CIN, Digital Input Capacitance 8 8 pF typ f = 1 MHz
INH
DYNAMIC CHARACTERISTICS
t
TRANSITION
Break Before Make Delay, t
t
(EN, WR) 120 175 120 175 ns typ RL = 300 , CL = 35 pF;
ON
t
(EN, RS) 110 130 110 130 ns typ RL = 300 , CL = 35 pF;
OFF
INL
INH
OPEN
2
120 120 ns typ RL = 300 , CL = 35 pF; 150 250 150 250 ns max V1 = ±10 V, V2 = 710 V;
10 10 10 10 ns min RL = 300 , CL = 35 pF;
160 225 160 225 ns max VS = +5 V, Test Circuit 7
150 180 150 180 ns max VS = +5 V, Test Circuit 7
ADG426 Only
tW, Write Pulse Width 100 100 ns min tS, Address, Enable Setup Time 100 100 ns min tH, Address, Enable Hold Time 10 10 ns min tRS, Reset Pulse Width 100 100 ns min VS = +5 V
Charge Injection 8 8 pC typ VS = 0 V, RS = 0 , CL = 1 nF;
OFF Isolation –75 –75 dB typ RL = 1 k, f = 100 kHz;
Channel-to-Channel Crosstalk 85 85 dB typ RL = 1 k, f = 100 kHz, Test Circuit 12 CS (OFF) 5 5 pF typ f = 1 MHz CD (OFF) f = 1 MHz
ADG406, ADG426 50 50 pF typ ADG407 25 25 pF typ
CD, CS (ON) f = 1 MHz
ADG406, ADG426 60 60 pF typ ADG407 40 40 pF typ
= –15 V ± 10%, GND = 0 V, unless otherwise noted)
SS
–40°C to –55°C to
DD
VSS to VDDV
2.4 2.4 V min
0.8 0.8 V max ±1 ±1 µA max VIN = 0 or V
Test Circuit 5
VS = +5 V, Test Circuit 6
Test Circuit 10
VEN = 0 V, Test Circuit 11
DD
POWER REQUIREMENTS VDD = +16.5 V, VSS = –16.5 V
I
DD
I
SS
I
DD
I
SS
N
OTES
1
Temperature ranges are as follows: B Versions: –40°C to +85°C; T Versions: –55°C to +125°C.
2
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
100 100 µA typ VIN = 0 V, VEN = 2.4 V 200 500 200 500 µA max
11µA typ VIN = 0 V, VEN = 0 V 55µA max 11µA typ 55µA max
11µA typ 55µA max
–2–
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SINGLE SUPPLY
(V
= +12 V ± 10%, V
DD
= 0 V, GND = 0 V, unless otherwise noted)
SS
ADG406/ADG407/ADG426
B Version T Version
–40°C to –55°C to
Parameter +25°C +85°C +25°C +125°C Units Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 to V R
ON
90 90 typ VD = +3 V, +8.5 V, IS = –1 mA; 125 200 125 200 Ω max VDD = +10.8 V
DD
0 to V
DD
V
LEAKAGE CURRENTS VDD = +13.2 V
Source OFF Leakage IS (OFF) ±0.5 ±20 ±0.5 ±50 nA max VD = 8 V/0.1 V, VS = 0.1 V/8 V;
Test Circuit 2
Drain OFF Leakage ID (OFF) VD = 8 V/0.1 V, VS = 0.1 V/8 V;
ADG406, ADG426 ± 1 ± 20 ±1 ±200 nA max Test Circuit 3 ADG407 ±1 ±20 ±1 ±100 nA max
Channel ON Leakage ID, IS (ON) VS = VD = 8 V/0.1 V, Test Circuit 4
ADG406, ADG426 ± 1 ± 20 ±1 ±200 nA max ADG407 ±1 ±20 ±1 ±100 nA max
DIGITAL INPUTS
Input High Voltage, V Input Low Voltage, V Input Current
I
or I
INL
CIN, Digital Input Capacitance 8 8 pF typ f = 1 MHz
INH
DYNAMIC CHARACTERISTICS
t
TRANSITION
INH
INL
2
180 180 ns typ RL = 300 , CL = 35 pF; 220 350 220 350 ns max V1 = 8 V/0 V, V2 = 0 V/8 V;
2.4 2.4 V min
0.8 0.8 V max ±1 ±1 µA max VIN = 0 or V
DD
Test Circuit 5
Break Before Make Delay, t
t
(EN, WR) 180 180 ns typ RL = 300 , CL = 35 pF;
ON
t
(EN, RS) 135 135 ns typ RL = 300 , CL = 35 pF;
OFF
OPEN
10 10 ns typ RL = 300 , CL = 35 pF;
VS = +5 V, Test Circuit 6
240 350 240 350 ns max VS = +5 V, Test Circuit 7
180 220 180 220 ns max VS = +5 V, Test Circuit 7
ADG426 Only
tW, Write Pulse Width 100 100 ns min tS, Address, Enable Setup Time 100 100 ns min tH, Address, Enable Hold Time 10 10 ns min tRS, Reset Pulse Width 100 100 ns min VS = +5 V
Charge Injection 5 5 pC typ VS = 6 V, RS = 0 , CL = 1 nF;
Test Circuit 10
OFF Isolation –75 –75 dB typ RL = 1 k, f = 100 kHz;
Test Circuit 11
Channel-to-Channel Crosstalk 85 85 dB typ RL = 1 k, f = 100 kHz;
Test Circuit 12 CS (OFF) 8 8 pF typ f = 1 MHz CD (OFF) f = 1 MHz
ADG406, ADG426 80 80 pF typ ADG407 40 40 pF typ
CD, CS (ON) f = 1 MHz
ADG406, ADG426 100 100 pF typ ADG407 50 50 pF typ
POWER REQUIREMENTS VDD = +13.2 V
I
DD
I
DD
NOTES
1
Temperature ranges are as follows: B Versions: –40°C to +85°C; T Versions: –55°C to +125°C.
2
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
100 100 µA typ VIN = 0 V, VEN = 2.4 V 200 500 200 500 µA max
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11µA typ VIN = 0 V, VEN = 0 V 55µA max
–3–
ADG406/ADG407/ADG426
ABSOLUTE MAXIMUM RATINGS
(TA = +25°C unless otherwise noted)
1
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+44 V
V
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +25 V
DD
V
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –25 V
SS
Analog, Digital Inputs
2
. . . . . . . . . . . . . VSS – 2 V to VDD + 2 V
or 20 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 20 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 mA
(Pulsed at 1 ms, 10% Duty Cycle Max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40°C to +85°C
Extended (T Version) . . . . . . . . . . . . . . . . .–55°C to +125°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Plastic Package
θ
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75°C/W
JA
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260°C
PLCC Package
θ
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 80°C/W
JA
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
SSOP Package
θ
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 122°C/W
JA
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
ORDERING GUIDE
Model Temperature Range Package Option*
ADG406BN –40°C to +85°C N-28 ADG406BP –40°C to +85°C P-28A
ADG407BN –40°C to +85°C N-28 ADG407BP –40°C to +85°C P-28A
ADG426BN –40°C to +85°C N-28 ADG426BRS –40°C to +85°C RS-28
*N = Plastic DIP, P = Plastic Leaded Chip Carrier (PLCC), RS = Shrink Small
Outline Package (SSOP).
NOTES
1
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time.
2
Overvoltages at A, S, D, WR or RS will be clamped by internal diodes. Current should be limited to the maximum ratings given.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although these devices feature proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–4–
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