ANALOG DEVICES ADG409 Service Manual

LC2MOS 4-/8-Channel

www.BDTIC.com/ADI

High Performance Analog Multiplexers

FEATURES

44 V supply maximum ratings

to VDD analog signal range

V

SS

Low on resistance (100 Ω maximum)
Low power (I
Fast switching
Break-before-make switching action
Plug-in replacement for DG408/DG409

APPLICATIONS

Audio and video routing
Automatic test equipment
Data acquisition systems
Battery-powered systems
Sample-and-hold systems
Communication systems

GENERAL DESCRIPTION

The ADG408/ADG409 are monolithic CMOS analog multiplexers
comprising eight single channels and four differential channels,
respectively. The ADG408 switches one of eight inputs to a
common output as determined by the 3-bit binary address lines
A0, A1, and A2. The ADG409 switches one of four differential
inputs to a common differential output, as determined by the
2-bit binary address lines A0 and A1. An EN input on both devices
is used to enable or disable the device. When the device is disabled,
all channels are switched off.

The ADG408/ADG409 are designed on an enhanced LC
process that provides low power dissipation yet gives high
switching speed and low on resistance. Each channel conducts
equally well in both directions when on and has an input signal
range that extends to the supplies. In the off condition, signal
levels up to the supplies are blocked. All channels exhibit break­before-make switching action, preventing momentary shorting
when switching channels. Inherent in the design is low
charge injection for minimum transients when switching the
digital inputs.

SUPPLY

< 75 μA)

2

MOS

ADG408/ADG409

FUNCTIONAL BLOCK DIAGRAMS

ADG408

S1

S8

1-OF-8

DECODER

S1A

S4A

D

S1B

S4B

Figure 1.

PRODUCT HIGHLIGHTS

1. Extended Signal Range. The ADG408/ADG409 are

fabricated on an enhanced LC
increased signal range that extends to the supply rails.

w Power Dissipation.

2. Lo

3. Lo

4. S

analog signal is unipolar, the ADG408/ADG409 can be
operated from a single rail power supply. The parts are
fully specified with a single 12 V power supply and remain
functional with single supplies as low as 5 V.

.

w R

ON

ingle-Supply Operation. For applications where the

ADG409

1-OF-4

DECODER

A0 A1 E NA0 A1 A2 EN

2

MOS process, giving an

DA

DB

00027-001

The ADG408/ADG409 are improved replacements for the
D

G408/DG409 analog multiplexers.

Rev. C

Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: [phone] www.analog.com
Fax: [phone] ©2006 Analog Devices, Inc. All rights reserved.

ADG408/ADG409

www.BDTIC.com/ADI

TABLE OF CONTENTS

Features.............................................................................................. 1

Absolute Maximum Ratings ............................................................6

Applications....................................................................................... 1

Functional Block Diagrams............................................................. 1

General Description ......................................................................... 1

Product Highlights ........................................................................... 1

Revision History ............................................................................... 2

Specifications..................................................................................... 3

Dual Supply................................................................................... 3

Single Supply................................................................................. 4

REVISION HISTORY

10/06—Rev. B to Rev. C

Updated Format..................................................................Universal

Changes to Table 3............................................................................ 6

Inserted Table 4 and Table 5............................................................ 7

Updated Outline Dimensions....................................................... 14

Changes to Ordering Guide.......................................................... 15

ESD Caution...................................................................................6

Pin Configurations and Function Descriptions............................7

Typical Performance Characteristics..............................................8

Test Circuits..................................................................................... 11

Terminology.................................................................................... 13

Outline Dimensions....................................................................... 14

Ordering Guide .......................................................................... 16

3/03—Rev. A to Rev. B

C

hanges to Ordering Guide.............................................................4

Updated Outline Dimensions....................................................... 11

2/01—Revision 0: Initial Version

Rev. C | Page 2 of 16

ADG408/ADG409

www.BDTIC.com/ADI

SPECIFICATIONS

DUAL SUPPLY

VDD = 15 V, VSS = −15 V, GND = 0 V, unless otherwise noted.

Table 1.

B Version T Version

−40ºC to

Parameter +25ºC

ANALOG SWITCH

Analog Signal Range VSS to VDD VSS to VDD V
RON 40 40 Ω typ
100 125 100 125 Ω max
∆RON 15 15 Ω max

LEAKAGE CURRENTS

Source Off Leakage IS (OFF) ±0.5 ±50 ±0.5 ±50 nA max VD = ±10 V, VS = 10 V; see mFigure 19
Drain Off Leakage ID (OFF) VD = ±10 V; VS = 10 V; see m Figure 20

ADG408 ±1 ±100 ±1 ±100 nA max
ADG409 ±1 ±50 ±1 ±50 nA max

Channel On Leakage ID, IS (ON) VS = VD = ±10 V; see Figure 21

ADG408 ±1 ±100 ±1 ±100 nA max
ADG409 ±1 ±50 ±1 ±50 nA max

DIGITAL INPUTS

Input High Voltage, V
Input Low Voltage, V
Input Current

I

or I

±10 ±10 μA max VIN = 0 or VDD

INL

INH

CIN, Digital Input Capacitance 8 8 pF typ f = 1 MHz

DYNAMIC CHARACTERISTICS

t
250 250 ns max VS1 = ±10 V, VS8 = 10 V; see m Figure 22
t
V
tON (EN) 85 125 85 125 ns typ RL = 300 Ω CL = 35 pF;
150 225 150 225 ns max VS = 5 V; see Figure 24
t
150 150 ns max VS = 5 V; see Figure 24
Charge Injection 20 20 pC typ VS = 0 V, RS = 0 Ω, CL = 10 nF; see Figure 25
OFF Isolation
V
Channel-to-Channel Crosstalk 85 85 dB typ RL = 1 kΩ, f = 100 kHz; see Figure 27
CS (OFF) 11 11 pF typ f = 1 MHz
CD (OFF) f = 1 MHz

CD, CS (ON) f = 1 MHz

120 120 ns typ RL = 300 Ω, CL = 35 pF;

TRANSITION

10 10 10 10 ns min RL = 300 Ω, CL = 35 pF;

OPEN

(EN) 65 65 ns typ RL = 300 Ω, CL = 35 pF;

OFF

ADG408 40 40 pF typ
ADG409 20 20 pF typ

ADG408 54 54 pF typ
ADG409 34 34 pF typ

2.4 2.4 V min

INH

0.8 0.8 V max

INL

1

−75

+85ºC +25ºC

−75

−55ºC to
+125ºC Unit Test Conditions/Comments

V

= ±10 V, IS = −10 mA

D

V

= +10 V, −10 V

D

= 5 V; see Figure 23

S

dB typ RL = 1 kΩ, f = 100 kHz;

= 0 V; see Figure 26

EN

Rev. C | Page 3 of 16

ADG408/ADG409

www.BDTIC.com/ADI

B Version T Version

−40ºC to

Parameter +25ºC

+85ºC

+25ºC

POWER REQUIREMENTS

IDD 1 1 μA typ VIN = 0 V, VEN = 0 V
5 5 μA max
ISS 1 1 μA typ
5 5 μA max
IDD 100 100 μA typ VIN = 0 V, VEN = 2.4 V

200 500 200 500 μA max

1

Guaranteed by design, not subject to production test.

SINGLE SUPPLY

VDD = 12 V, VSS = 0 V, GND = 0 V, unless otherwise noted.

Table 2.

B Version T Version

−40ºC to

Parameter +25ºC

ANALOG SWITCH

Analog Signal Range 0 to VDD 0 to VDD V
RON 90 90 Ω typ VD = 3 V, 10 V, IS = –1 mA

LEAKAGE CURRENTS

Source Off Leakage IS (OFF) ±0.5 ±50 ±0.5 ±50 nA max VD = 8 V/0 V, VS = 0 V/8 V; see Figure 19
Drain Off Leakage ID (OFF) VD = 8 V/0 V, VS = 0 V/8 V; see Figure 20

ADG408 ±1 ±100 ±1 ±100 nA max
ADG409 ±1 ±50 ±1 ±50 nA max

Channel On Leakage ID, IS (ON) VS = VD = 8 V/0 V; see Figure 21

ADG408 ±1 ±100 ±1 ±100 nA max
ADG409 ±1 ±50 ±1 ±50 nA max

DIGITAL INPUTS

Input High Voltage, V
Input Low Voltage, V

2.4 2.4 V min

INH

0.8 0.8 V max

INL

Input Current

I

or I

±10 ±10 μA max VIN = 0 or VDD

INL

INH

C

Digital Input Capacitance 8 8 pF typ f = 1 MHz

IN,

DYNAMIC CHARACTERISTICS

t

130 130 ns typ RL = 300 Ω, CL = 35 pF;

TRANSITION

1

V
t

OPEN

10 10 ns typ

V
tON (EN) 140 140 ns typ RL = 300 Ω CL = 35 pF;
V
t

(EN) 60 60 ns typ RL = 300 Ω, CL = 35 pF;

OFF

V

Charge Injection 5 5 pC typ VS = 0 V, RS = 0Ω, CL = 10 nF; see Figure 25
Off Isolation –75 –75 dB typ RL = 1 kΩ f = 100 kHz;
V

+85ºC +25°C

−55ºC to
+125ºC

Unit Test Conditions/Comments

−55ºC to
+125ºC Unit Test Conditions/Comments

= 8 V/0 V, VS8 = 0 V/8 V; see Figure 22

S1

RL = 300 Ω, CL = 35 pF;

= 5 V; see Figure 23

S

= 5 V; see Figure 24

S

= 5 V; see Figure 24

S

= 0 V; see Figure 26

EN

Rev. C | Page 4 of 16

ADG408/ADG409

www.BDTIC.com/ADI

B Version T Version

−40ºC to

Parameter +25ºC

Channel-to-Channel Crosstalk 85 85 dB typ RL = 1 kΩ, f = 100 kHz; see Figure 27
CS (OFF) 11 11 pF typ f = 1 MHz
CD (OFF) f = 1 MHz

ADG408 40 40 pF typ
ADG409 20 20 pF typ

CD, CS (ON) f = 1 MHz

ADG408 54 54 pF typ
ADG409 34 34 pF typ

POWER REQUIREMENTS

IDD 1 1 μA typ VIN = 0 V, VEN = 0 V
5 5 μA max
IDD 100 100 μA typ VIN = 0 V, VEN = 2.4 V

200 500 200 500 μA max

1

Guaranteed by design, not subject to production test.

+85ºC

+25°C

−55ºC to
+125ºC

Unit Test Conditions/Comments

Rev. C | Page 5 of 16

ADG408/ADG409

www.BDTIC.com/ADI

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 3.

Parameter Rating

VDD to VSS 44 V
VDD to GND −0.3 V to +32 V
V

to GND +0.3 V to −32 V

SS

Analog, Digital Inputs

Continuous Current, S or D 20 mA
Peak Current, S or D

(Pulsed at 1 ms, 10% Duty Cycle
Maximum)

Operating Temperature Range

Industrial (B Version) −40° C to +85°C
Extended (T Version) −55° C to +125°C

Storage Temperature Range −65° C to +150°C
Junction Temperature 150°C
CERDIP Package, Power Dissipation 900 mW

θJA, Thermal Impedance 76°C/W

Lead Temperature, Soldering

(10 sec)
PDIP Package, Power Dissipation 470 mW

θ

Thermal Impedance 117°C/W

JA,

Lead Temperature, Soldering

(10 sec)
TSSOP Package, Power Dissipation 450 mW

θJA, Thermal Impedance 155°C/W

θJC, Thermal Impedance 50°C/W
SOIC Package, Power Dissipation 600 mW

θJA, Thermal Impedance 77°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C

− 2 V to VDD + 2 V or 20 mA,

V

SS

whichever occurs first

40 mA

300°C

260°C

Stresses above those listed under Absolute Maximum Ratings
ma

y cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.

ESD CAUTION

Rev. C | Page 6 of 16

ADG408/ADG409

V

www.BDTIC.com/ADI

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

A0

A0

EN

SS

S1

S2

S3

S4

D

1

2

3

ADG408

4

TOP VIEW

(Not to Scale)

5

6

7

8

16

A1

A2

15

GND

14

13

V

DD

S5

12

S6

11

10

S7

S8

9

00027-002

Figure 2. ADG408 Pin Configuration

Table 4. ADG408 Pin Function Descriptions

Pin
No.

Mnemonic Description

1 A0 Logic Control Input.
2 EN

Active High Digital Input. When low, the

evice is disabled and all switches are off.

d
When high, Ax logic inputs determine on
switches.

3 VSS

Most Negative Power Supply Potential in

Supplies. In single-supply applications,

Dual
it can be connected to ground.

4 S1

Source Terminal 1. Can be an input or
an output.

5 S2

Source Terminal 2. Can be an input or
an output.

6 S3

Source Terminal 3. Can be an input or
an output.

7 S4

Source Terminal 4. Can be an input or
an output.

8 D

Drain Terminal. Can be an input or an
output.

9 S8

Source Terminal 8. Can be an input or
an output.

10 S7

Source Terminal 7. Can be an input or
an output.

11 S6

Source Terminal 6. Can be an input or
an output.

12 S5

Source Terminal 5. Can be an input or

an output.
13 VDD Most Positive Power Supply Potential.
14 GND Ground (0 V) Reference.
15 A2 Logic Control Input.
16 A1 Logic Control Input.

Table 6. ADG408 Truth Table

A2 A1 A0 EN ON SWITCH

X X X 0 NONE
0 0 0 1 1
0 0 1 1 2
0 1 0 1 3
0 1 1 1 4
1 0 0 1 5
1 0 1 1 6
1 1 0 1 7
1 1 1 1 8

1

EN

2

3

V

ADG409

SS

DA

TOP VIEW

4

(Not to Scale)

5

6

7

8

S1A

S2A

S3A

S4A

Figure 3. ADG409 Pin Configuration

Table 5. ADG409 Pin Function Descriptions

Pin
No.

Mnemonic Description

1 A0 Logic Control Input.
2 EN

Active High Digital Input. When low, the

evice is disabled and all switches are off.

d
When high, Ax logic inputs determine on
switches.

3 VSS

Most Negative Power Supply Potential in

Supplies. In single-supply applications,

Dual
it can be connected to ground.

4 S1A

Source Terminal 1A. Can be an input or
an output.

5 S2A

Source Terminal 2A. Can be an input or
an output.

6 S3A

Source Terminal 3A. Can be an input or
an output.

7 S4A

Source Terminal 4A. Can be an input or
an output.

8 DA

Drain Terminal A. Can be an input or an
output.

9 DB

Drain Terminal B. Can be an input or an
output.

10 S4B

Source Terminal 4B. Can be an input or
an output.

11 S3B

Source Terminal 3B. Can be an input or
an output.

12 S2B

Source Terminal 2B. Can be an input or
an output.

13 S1B

Source Terminal 1B. Can be an input or

an output.
14 VDD Most Positive Power Supply Potential.
15 GND Ground (0 V) Reference.
16 A1 Logic Control Input.

Table 7. ADG409 Truth Table

ON SWITCH
A1 A0 EN PAIR

X X 0 NONE
0 0 1 1
0 1 1 2
1 0 1 3
1 1 1 4

A1

16

GND

15

14

V

DD

13

S1B

S2B

12

S3B

11

S4B

10

DB

9

00027-003

Rev. C | Page 7 of 16

ADG408/ADG409

www.BDTIC.com/ADI

TYPICAL PERFORMANCE CHARACTERISTICS

120

TA=25°C

100

80

(Ω)

VDD=+10V

= –10V

V

ON

SS

R

60

40

20

–15 –10 –5 0 5 10 15

VD[VS](V)

VDD=+5V

=–5V

V

SS

VDD= +12V
V

SS

VDD= +15V

=–15V

V

SS

= –12V

Figure 4. RON as a Function of VD (VS): Dual-Supply Voltage

00027-004

180

160

140

120

(Ω)

ON

R

100

80

60

40

0369121

VDD=5V

=0V

V

SS

VDD=10V
V

SS

VD[VS](V)

=0V

TA=25°C

VDD=12V

=0V

V

SS

VDD=15V

=0V

V

SS

Figure 7. RON as a Function of VD (VS): Single-Supply Voltage

5

00027-007

100

VDD=+15V

= –15V

V

SS

90

80

70

(Ω)

ON

R

60

50

40

30

–15 –10 –5 0 5 10 15

Figure 5. R

0.2

0.1

0

LEAKAGE CURRENT (n A)

–0.1

125°C

85°C

25°C

](V)

V

D[VS

as a Function of VD (VS) for Different Temperatures

ON

TA= 25°C
V

=+15V

DD

V

= –15V

SS

IS(OFF)

ID(OFF)

I

(ON)

D

130

VDD=12V

=0V

V

SS

120

110

100

(Ω)

ON

R

90

80

70

60

024681012

00027-005

Figure 8. R

0.04

0.02

0

–0.02

LEAKAGE CURRENT (n A)

–0.04

125°C

85°C

25°C

VD[VS](V)

as a Function of VD (VS) for Different Temperature

ON

TA= 25°C

=12V

V

DD

=0V

V

SS

(ON)

I

D

(OFF)

I

D

(OFF)

I

S

00027-008

–0.2

–15 –10 –5 0 5 10 15

V

D[VS

](V)

00027-006

Figure 6. Leakage Currents as a Function of VD (VS)

Rev. C | Page 8 of 16

–0.06

024681012

Figure 9. Leakage Currents as a Function of V

VD[VS](V)

D

(VS)

0027-009

ADG408/ADG409

www.BDTIC.com/ADI

120

100

80

TIME (ns)

60

40

20

400

300

200

TIME (ns)

100

t

TRANSITION

t

(EN)

ON

t

(EN)

OFF

13579111315

Figure 10. Switching Time vs. V

t

TRANSITI ON

t

(EN)

ON

t

(EN)

OFF

(V)

V

IN

IN

VDD= +15V
V

= –15V

SS

(Bipolar Supply)

V

IN

=5V

00027-010

140

VDD=12V

=0V

V

SS

120

100

TIME (ns)

80

60

40

135791113

VIN(V)

t

TRANSITI ON

t

(EN)

ON

t

(EN)

OFF

Figure 13. Switching Time vs. VIN (Single Supply)

TIME (ns)

300

200

100

t

OFF

t

TRANSITI ON

t

(EN)

ON

(EN)

=5V

V

IN

00027-013

0

57911131

V

SUPPLY

(V)

Figure 11. Switching Time vs. Single Supply

10k

VDD= +15V
V

= –15V

SS

1k

(µA)

DD

I

EN = 2.4V

EN = 0V

100

10 100 1k 10k 100k 1M 10M

FREQUENCY (Hz)

Figure 12. Positive Supply Current vs. Switching Frequency

5

00027-011

0027-012

0

±5 ±15±7

±9 ±11 ±13

V

SUPPLY

(V)

Figure 14. Switching Time vs. Bipolar Supply

10k

VDD= +15V

=–15V

V

SS

1k

100

(µA)

SS

I

10

0

–10

10 100 1k 10k 100k 1M 10M

EN = 2.4V

EN = 0V

FREQUENCY (Hz)

Figure 15. Negative Supply Current vs. Switching Frequency

00027-014

00027-015

Rev. C | Page 9 of 16

ADG408/ADG409

www.BDTIC.com/ADI

110

100

90

OFF ISOLATION (dB)

80

VDD= +15V

= –15V

V

SS

CROSSTALK (d B)

110

100

VDD=+15V

= –15V

V

SS

90

80

70

70

1k 10k 100k 1M

FREQUENCY (Hz)

00027-016

Figure 16. Off Isolation vs. Frequency

60

1k 100k 1M

10k

FREQUENCY ( Hz)

0027-017

Figure 17. Cross talk vs. Frequency

Rev. C | Page 10 of 16

ADG408/ADG409

V

V

VSSV

VDDV

VDDV

VDDV

www.BDTIC.com/ADI

TEST CIRCUITS

I

DS

V1

SD

S

RON=V1/I

DS

00027-018

S

Figure 18. On Resistance

V

V

DD

SS

V

V

DD

GND

SS

D

0.8V

EN

00027-019

V

S

IS(OFF)

S1

A

V

S

S2

S8

V

D

Figure 19. IS (OFF)

3V

ADDRESS
DRIVE (V

0V

t

TRANSITION

OUTPUT

)

IN

50% 50%

90%

t

r

t

f

< 20ns
< 20ns

t

TRANSITION

90%

A0

V

IN

50Ω

2.4V EN

A1

A2

S1

S2

S8

S1

S8

V

DDVSS

ADG408

GND

DD

V

V

SS

DD

EN

GND

Figure 20. ID (OFF)

SS

V

V

DD

SS

EN

GND

Figure 21. ID (ON)

SS

S1

S2–S7

S8

1

OUTPUT

D

D

0.8V

D

2.4V

V

V

300Ω

ID(OFF)

A

V

D

00027-020

ID(ON)

A

V

D

00027-021

S1

S8

35pF

Figure 22. Switching Time of Multiplexer, t

3V

ADDRESS
DRIVE (V

)

IN

0V

OUTPUT

80% 80%

t

OPEN

Figure 23. Break-Before-Make Delay, t

Rev. C | Page 11 of 16

1

SIMILAR CONNECTION F OR ADG409.

TRANSlTlON

SS

V

DDVSS

A0

V

IN

50Ω

A1

A2

ADG408

2.4V EN

1

SIMILAR CONNECTION F OR ADG409.

OPEN

GND

S2–S7

1

S1

S8

D

V

OUTPUT

300Ω

S

35pF

00027-022

00027-023

ADG408/ADG409

VDDV

O

R

VINV

VDDV

VSVSSV

VSSV

www.BDTIC.com/ADI

SS

3V

ENABLE
D

IVE (VIN)

0V

UTPUT

50% 50%

t

0.9V

OFF

(EN)

O

V

IN

50Ω

1

SIMILAR CONNECTION F OR ADG409.

(EN), t

OFF

(EN)

ON

t

(EN)

ON

0.9V

O

Figure 24. Enable Delay, t

V

A0

A1

A2

EN

DDVSS

ADG408

GND

S2–S8

1

S1

D

OUTPUT

300Ω

V

S

35pF

00027-024

SS

V

DDVSS

A0

A1

A2

GND

1

DS

C

L

10nF

V

OUT

ADG408

EN

V

IN

OUT

3V

R

S

V

S

Q

INJ=CL

× ΔV

OUT

ΔV

OUT

1

SIMILAR CONNECTI ON FOR ADG409.

00027-025

Figure 25. Charge Injection

DD

V

V

A0

A1

A2

S1

S8

0V

EN

OFF ISOLATION = 20 log V

DD

ADG408

GND

SS

Figure 26. Off Isolation

D

OUT/VIN

1kΩ

V

OUT

V

S

00027-026

Figure 27. Channel-to-Channel Crosstalk

DD

V

V

A0

A1

A2

S1

S2

S8

CROSSTALK = 20 log V

DD

ADG408

GND

SS

EN

D

OUT/VIN

2.4V

V

OUT

1kΩ1kΩ

0027-027

Rev. C | Page 12 of 16

ADG408/ADG409

www.BDTIC.com/ADI

TERMINOLOGY

RON
Ohmic resistance between D and S.

ΔR

ON

Difference between the RON of any two channels.

(OFF)

I

S

Source leakage current when the switch is off.

I

(OFF)

D

Drain leakage current when the switch is off.

I

, IS (ON)

D

Channel leakage current when the switch is on.

(VS)

V

D

Analog voltage on Terminal D and Terminal S.

C

(OFF)

S

Channel input capacitance for off condition.

C

(OFF)

D

Channel output capacitance for off condition.

, CS (ON)

C

D

On switch capacitance.

C

IN

Digital input capacitance.

(EN)

t

ON

Delay time between the 50% and 90% points of the digital input
and switch on condition.

(EN)

t

OFF

Delay time between the 50% and 90% points of the digital input
and switch off condition.

t

TRANSITION

Delay time between the 50% and 90% points of the digital
inputs and the switch on condition when switching from one
address state to another.

t

OPEN

Off time measured between the 80% point of both switches
when switching from one address state to another.

V

INL

Maximum input voltage for Logic 0.

V

INH

Minimum input voltage for Logic 1.

(I

INL

INH

)

I

Input current of the digital input.

Crosstalk

A

measure of unwanted signal that is coupled through from one

channel to another as a result of parasitic capacitance.

Off Isolation

ure of unwanted signal coupling through an off channel.

A meas

Charge Injection

A m

easure of the glitch impulse transferred from the digital

input to the analog output during switching.

I

DD

Positive supply current.

I

SS

Negative supply current.

Rev. C | Page 13 of 16

ADG408/ADG409

0

www.BDTIC.com/ADI

OUTLINE DIMENSIONS

0.800 (20.32)

0.790 (20.07)

0.780 (19.81)

0.210

(5.33)

0.150 (3.81)

0.130 (3.30)

0.115 (2.92)

0.022 (0.56)

0.018 (0.46)

0.014 (0.36)

16

1

PIN 1

0.100 (2.54)
BSC

MAX

0.070 (1.78)

0.060 (1.52)

0.045 (1.14)

CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
CORNER LEADS MAY BE CONFIGURED AS WHOLE OR HALF LEADS.

COMPLIANT TO JEDEC STANDARDS MS-001-AB

Figure 28. 16-Lead Plastic Dual In-Line Package [PDIP]

Dimensions shown in inches and (millimeters)

9

8

0.280 (7.11)

0.250 (6.35)

0.240 (6.10)

0.015
(0.38)
MIN

SEATING
PLANE

0.005 (0.13)
MIN

Nar

row Body

(N-16)

0.060 (1.52)
MAX

0.015 (0.38)
GAUGE

PLANE

0.325 (8.26)

0.310 (7.87)

0.300 (7.62)

0.430 (10.92)
MAX

0.195 (4.95)

0.130 (3.30)

0.115 (2.92)

0.014 (0.36)

0.010 (0.25)

0.008 (0.20)

0.005 (0.13) MIN

16

1

PIN 1

0.100 (2.54) BSC

0.840 (21.34) MAX

.200 (5.08)

MAX

0.200 (5.08)

0.125 (3.18)

0.023 (0.58)

0.014 (0.36)

CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

Figure 29. 16-Lead Ceramic Dual In-Line Package [CERDIP]

Dim

0.098 (2.49) MAX

9

0.310 (7.87)

0.220 (5.59)

8

0.060 (1.52)

0.015 (0.38)

0.150
(3.81)
MIN

0.070 (1.78)

0.030 (0.76)

SEATING
PLANE

15°

0°

(Q-16)

ensions shown in inches and (millimeters)

0.320 (8.13)

0.290 (7.37)

0.015 (0.38)

0.008 (0.20)

Rev. C | Page 14 of 16

ADG408/ADG409

www.BDTIC.com/ADI

4.00 (0.1575)

3.80 (0.1496)

0.25 (0.0098)

0.10 (0.0039)

COPLANARITY

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

10.00 (0.3937)

9.80 (0.3858)

16

1

1.27 (0.0500)
BSC

0.51 (0.0201)

0.10

0.31 (0.0122)

COMPLIANT TO JEDEC STANDARDS MS-012-AC

9

6.20 (0.2441)

5.80 (0.2283)

8

1.75 (0.0689)

1.35 (0.0531)

SEATING
PLANE

0.25 (0.0098)

0.17 (0.0067)

0.50 (0.0197)

0.25 (0.0098)

8°
0°

1.27 (0.0500)

0.40 (0.0157)

× 45°

Figure 30. 16-Lead Standard Small Outline Package [SOIC_N]

Na

rrow Body

(R-16)

Dimensions shown in millimeters and (inches)

5.10

5.00

4.90

0.15

0.05

16

4.50

4.40

4.30

PIN 1

0.65

BSC

COPLANARITY

0.10

COMPLIANT TO JEDEC STANDARDS MO-153-AB

Figure 31. 16-Lead Thin Shrink S

9

6.40

BSC

81

1.20
MAX

0.30

0.19

SEATING
PLANE

0.20

0.09

mall Outline Package [TSSOP]

(RU-16)

Dimensions shown in millimeters

8°
0°

0.75

0.60

0.45

Rev. C | Page 15 of 16

ADG408/ADG409

www.BDTIC.com/ADI

ORDERING GUIDE

Model Temperature Range Package Description Package Option

ADG408BN
ADG408BNZ

1

ADG408BR
ADG408BR-REEL
ADG408BR-REEL7
ADG408BRU
ADG408BRU-REEL
ADG408BRU-REEL7
ADG408BRUZ

1

ADG408BRUZ-REEL
ADG408BRUZ-REEL7
ADG408BRZ
ADG408BRZ-REEL

1

1

ADG408BRZ-REEL7
ADG408TQ
ADG408BCHIPS
ADG409BN
ADG409BNZ

1

ADG409BR
ADG409BR-REEL
ADG409BR-REEL7
ADG409BRU
ADG409BRU-REEL
ADG409BRU-REEL7
ADG409BRUZ

1

ADG409BRUZ-REEL
ADG409BRUZ-REEL7
ADG409BRZ
ADG409BRZ-REEL

1

1

ADG409BRZ-REEL7
ADG409TQ

1

Z = Pb-free part.

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

1

1

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

1

−40°C to +85°C

−55°C to +125°C

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

1

1

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

−40°C to +85°C

1

−40°C to +85°C

−55°C to +125°C

16-Lead Plastic Dual In-Line Package [PDIP]
16-Lead Plastic Dual In-Line Package [PDIP]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Ceramic Dual In-Line Package [CERDIP]
DIE
16-Lead Plastic Dual In-Line Package [PDIP]
16-Lead Plastic Dual In-Line Package [PDIP]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Narrow Body Small Outline Package [SOIC_N]
16-Lead Ceramic Dual In-Line Package [CERDIP]

N-16
N-16
R-16
R-16
R-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
R-16
R-16
R-16
Q-16

N-16
N-16
R-16
R-16
R-16
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
R-16
R-16
R-16
Q-16

©2006 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
C00027-0-10/06(C)

Rev. C | Page 16 of 16