Analog Devices ADG408 9 b Datasheet

LC2MOS 4-/8-Channel
ADG408
1-OF-8
DECODER
S1
S8
D
A0 A1 A2 EN
ADG409
1-OF-4
DECODER
S1A
S4B
DA
A0 A1 EN
DB
S4A
S1B
a
FEATURES 44 V Supply Maximum Ratings
to VDD Analog Signal Range
SS
Low On Resistance (100 ⍀ max) Low Power (I Fast Switching Break-Before-Make Switching Action Plug-in Replacement for DG408/DG409
APPLICATIONS Audio and Video Routing Automatic Test Equipment Data Acquisition Systems Battery-Powered Systems Sample-and-Hold Systems Communication Systems

GENERAL DESCRIPTION

SUPPLY
< 75 ␮A)
High Performance Analog Multiplexers
The ADG408 and ADG409 are monolithic CMOS analog multiplexers comprising eight single channels and four differen­tial channels, respectively. The ADG408 switches one of eight inputs to a common output as determined by the 3-bit binary address lines A0, A1, and A2. The ADG409 switches one of four differential inputs to a common differential output as determined by the 2-bit binary address lines A0 and A1. An EN input on both devices is used to enable or disable the device. When disabled, all channels are switched OFF.
2
The ADG408/ADG409 are designed on an enhanced LC
MOS process that provides low power dissipation yet gives high switching speed and low on resistance. Each channel conducts equally well in both directions when ON and has an input signal range that extends to the supplies. In the OFF condition, signal levels up to the supplies are blocked. All channels exhibit break­before-make switching action, preventing momentary shorting when switching channels. Inherent in the design is low charge injection for minimum transients when switching the digital inputs.
The ADG408/ADG409 are improved replacements for the DG408/DG409 analog multiplexers.
ADG408/ADG409

FUNCTIONAL BLOCK DIAGRAMS

PRODUCT HIGHLIGHTS

1. Extended Signal Range. The ADG408/ADG409 are fabricated on an enhanced
2
MOS process, giving an increased signal range that
LC extends to the supply rails.
2. Low Power Dissipation.
3 Low R
4. Single-Supply Operation. For applications where the analog signal is unipolar, the ADG408/ADG409 can be operated from a single rail power supply. The parts are fully specified with a single 12 V power supply and will remain functional with single supplies as low as 5 V.
ON
.
REV. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective companies.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 © 2003 Analog Devices, Inc. All rights reserved.
ADG408/ADG409–SPECIFICATIONS
1

DUAL SUPPLY

Parameter +25ⴗC +85ⴗC +25ⴗC +125ⴗC Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range V R
ON
DR
ON
LEAKAGE CURRENTS
Source OFF Leakage I
Drain OFF Leakage I
ADG408 ± 1 ± 100 ±1 ± 100 nA max Test Circuit 3 ADG409 ± 1 ± 50 ±1 ± 50 nA max
Channel ON Leakage I
ADG408 ± 1 ± 100 ±1 ± 100 nA max Test Circuit 4 ADG409 ± 1 ± 50 ±1 ± 50 nA max
DIGITAL INPUTS
Input High Voltage, V Input Low Voltage, V Input Current
I
or I
INL
CIN, Digital Input Capacitance 8 8 pF typ f = 1 MHz
DYNAMIC CHARACTERISTICS
t
TRANSITION
t
OPEN
t
(EN) 85 125 85 125 ns typ RL = 300 W, CL = 35 pF;
ON
t
OFF
Charge Injection 20 20 pC typ V
OFF Isolation –75 –75 dB typ R
Channel-to-Channel Crosstalk 85 85 dB typ R
C
(OFF) 11 11 pF typ f = 1 MHz
S
C
(OFF) f = 1 MHz
D
ADG408 40 40 pF typ ADG409 20 20 pF typ
C
, CS (ON) f = 1 MHz
D
ADG408 54 54 pF typ ADG409 34 34 pF typ
POWER REQUIREMENTS
I
DD
I
SS
I
DD
NOTES
1
Temperature ranges are as follows: B Version: –40C to +85C; T Version: –55C to +125C.
2
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
INH
(EN) 65 65 ns typ RL = 300 W, CL = 35 pF;
(VDD = +15 V, VSS = –15 V, GND = 0 V, unless otherwise noted.)
B Version T Version
–40C to –55C to
SS
to V
DD
VSS to VDDV
40 40 W typ VD = ± 10 V, IS = –10 mA 100 125 100 125 W max 15 15 W max VD = +10 V, –10 V
(OFF) ± 0.5 ± 50 ± 0.5 ± 50 nA max VD = ± 10 V, VS = 10 V;
S
Test Circuit 2
(OFF) VD = ± 10 V; VS = 10 V;
D
, IS (ON) VS = VD = ± 10 V;
D
INH
INL
2
2.4 2.4 V min
0.8 0.8 V max
± 10 ±10 mA max VIN = 0 or V
DD
120 120 ns typ RL = 300 W, CL = 35 pF; 250 250 ns max V
= ± 10 V, VS8 = 10 V;
S1
Test Circuit 5
10 10 10 10 ns min RL = 300 W, CL = 35 pF;
V
= 5 V; Test Circuit 6
S
150 225 150 225 ns max V
150 150 ns max V
= 5 V; Test Circuit 7
S
= 5 V; Test Circuit 7
S
= 0 V, RS = 0 W, CL = 10 nF;
S
Test Circuit 8
= 1 kW, f = 100 kHz;
L
V
= 0 V; Test Circuit 9
EN
= 1 kW, f = 100 kHz;
L
Test Circuit 10
11mA typ VIN = 0 V, VEN = 0 V 55mA max 11mA typ
55mA max 100 100 mA typ VIN = 0 V, VEN = 2.4 V 200 500 200 500 mA max
–2–
REV. B
ADG408/ADG409
1

SINGLE SUPPLY

Parameter +25ⴗC +85ⴗC +25ⴗC +125ⴗC Unit Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range 0 to V R
ON
LEAKAGE CURRENTS
Source OFF Leakage I
Drain OFF Leakage I
ADG408 ± 1 ± 100 ±1 ± 100 nA max Test Circuit 3 ADG409 ± 1 ± 50 ± 1 ± 50 nA max
Channel ON Leakage I
ADG408 ± 1 ± 100 ±1 ± 100 nA max Test Circuit 4 ADG409 ± 1 ± 50 ± 1 ± 50 nA max
DIGITAL INPUTS
Input High Voltage, V Input Low Voltage, V Input Current
I
or I
INL
CIN, Digital Input Capacitance 8 8 pF typ f = 1 MHz
DYNAMIC CHARACTERISTICS
t
TRANSITION
t
OPEN
t
(EN) 140 140 ns typ RL = 300 W, CL = 35 pF;
ON
t
OFF
Charge Injection 5 5 pC typ V
OFF Isolation –75 –75 dB typ R
Channel-to-Channel Crosstalk 85 85 dB typ R
C
(OFF) 11 11 pF typ f = 1 MHz
S
C
(OFF) f = 1 MHz
D
ADG408 40 40 pF typ ADG409 20 20 pF typ
C
, CS (ON) f = 1 MHz
D
ADG408 54 54 pF typ ADG409 34 34 pF typ
POWER REQUIREMENTS
I
DD
I
DD
NOTES
1
Temperature ranges are as follows: B Version: –40C to +85C; T Version: –55C to +125C.
2
Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
INH
(EN) 60 60 ns typ RL = 300 W, CL = 35 pF;
(VDD = 12 V, VSS = 0 V, GND = 0 V, unless otherwise noted.)
B Version T Version
–40C to –55C to
DD
0 to V
DD
V
90 90 W typ VD = 3 V, 10 V, IS = –1 mA
(OFF) ± 0.5 ± 50 ± 0.5 ± 50 nA max VD = 8 V/0 V, VS = 0 V/8 V;
S
Test Circuit 2
(OFF) VD = 8 V/0 V, VS = 0 V/8 V;
D
, IS (ON) VS = VD = 8 V/0 V;
D
INH
INL
2
2.4 2.4 V min
0.8 0.8 V max
± 10 ±10 mA max VIN = 0 or V
DD
130 130 ns typ RL = 300 W, CL = 35 pF;
V
= 8 V/0 V, VS8 = 0 V/8 V;
S1
Test Circuit 5
10 10 ns typ RL = 300 W, CL = 35 pF;
V
= 5 V; Test Circuit 6
S
V
= 5 V; Test Circuit 7
S
V
= 5 V; Test Circuit 7
S
= 0 V, RS = 0 W, CL = 10 nF;
S
Test Circuit 8
= 1 kW, f = 100 kHz;
L
V
= 0 V; Test Circuit 9
EN
= 1 kW, f = 100 kHz;
L
Test Circuit 10
11mA typ VIN = 0 V, VEN = 0 V
55mA max 100 100 mA typ VIN = 0 V, VEN = 2.4 V 200 500 200 500 mA max
REV. B
–3–
ADG408/ADG409

ABSOLUTE MAXIMUM RATINGS

(TA = 25C, unless otherwise noted.)
1
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 V
to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +25 V
V
DD
V
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –25 V
SS
Analog, Digital Inputs
2
. . . VSS – 2 V to VDD + 2 V or 20 mA,
Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 20 mA
Peak Current, S or D
(Pulsed at 1 ms, 10% Duty Cycle max) . . . . . . . . . . . 40 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40C to +85∞C
Extended (T Version) . . . . . . . . . . . . . . . –55C to +125∞C
Storage Temperature Range . . . . . . . . . . . –65C to +150∞C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150∞C
CERDIP Package, Power Dissipation . . . . . . . . . . . . 900 mW
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 76∞C/W
q
JA
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . 300∞C
PDIP Package, Power Dissipation . . . . . . . . . . . . . . . 470 mW
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 117∞C/W
q
JA
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . 260∞C
TSSOP Package, Power Dissipation . . . . . . . . . . . . . 450 mW
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 155∞C/W
q
JA
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 50∞C/W
q
JC
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 600 mW
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 77∞C/W
q
JA
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215∞C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . 220∞C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause per­manent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the opera­tional sections of this specification is not implied. Exposure to absolute maxi­mum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time.
2
Overvoltages at A, EN, S, or D will be clamped by internal diodes. Current should be limited to the maximum ratings given.

ORDERING GUIDE

1
Model
Temperature Range Package Option
ADG408BN –40C to +85∞C N-16 ADG408BR –40C to +85∞C R-16A ADG408BRU –40C to +85∞C RU-16 ADG408TQ –55C to +125∞C Q-16
ADG409BN –40C to +85∞C N-16 ADG409BR –40C to +85∞C R-16A ADG409BRU –40C to +85∞C RU-16 ADG409TQ –55C to +125∞C Q-16
NOTES
1
To order MIL-STD-883, Class B processed parts, add /883B to T grade part numbers.
2
N = PDIP; Q = CERDIP; R = 0.15" Small Outline IC (SOIC); RU = Thin Shrink Small Outline Package (TSSOP).
2
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG408/ADG409 feature proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
–4–
REV. B
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