Analog Devices ADG3304 Datasheet

Low Voltage, 1.15 V to 5.5 V, 4-Channel

FEATURES

Bidirectional level translation Operates from 1.15 V to 5.5 V Low quiescent current < 1 µA No direction pin

APPLICATIONS

SPI®, MICROWIRE™ level translation Low voltage ASIC level translation Smart card readers Cell phones and cell phone cradles Portable communication devices Telecommunications equipment Network switches and routers Storage systems (SAN/NAS) Computing/server applications GPS Portable POS systems Low cost serial interfaces

GENERAL DESCRIPTION

The ADG3304 is a bidirectional logic level translator that con­tains four bidirectional channels. It can be used in multivoltage digital system applications such as data transfer between a low voltage DSP/controller and a higher voltage device using SPI and MICROWIRE interfaces. The internal architecture allows the device to perform bidirectional logic level translation without an additional signal to set the direction in which the translation takes place.
The voltage applied to V the device, while V operation, V
CCY
must always be less than V
CCA
patible logic signals applied to the A side of the device appear as
-compatible levels on the Y side. Similarly, V
V
CCY
logic levels applied to the Y side of the device appear as V compatible logic levels on the A side.
sets the logic levels on the A side of
CCA
sets the levels on the Y side. For proper
CCY
. The V
-com-
CCA
-compatible
CCY
CCA
-
Bidirectional Logic Level Translator
ADG3304

FUNCTIONAL BLOCK DIAGRAM

V
CCA
A1
A2
A3
A4
EN
The enable pin (EN) provides three-state operation on both the A-side and the Y-side pins. When the EN pin is pulled low, the terminals on both sides of the device are in the high impedance state. The EN pin is referred to the V driven high for normal operation.
The ADG3304 is available in compact 14-lead TSSOP and 12-bump WLCSP packages. It is guaranteed to operate over the 1.15 V to 5.5 V supply voltage range and the extended
−40°C to +85°C temperature range.
PRODUCT HIGHLIGHTS
1. Bidirectional level translation.
2. Fully guaranteed over the 1.15 V to 5.5 V supply range.
3. No direction pin.
GND
Figure 1.
V
CCY
Y1
Y2
Y3
Y4
supply voltage and
CCA
04860-001
Rev. 0
4. 14-lead TSSOP and 12-bump WLCSP packages.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 Fax: 781.326.8703 © 2005 Analog Devices, Inc. All rights reserved.
www.analog.com
ADG3304
TABLE OF CONTENTS
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 6
ESD Caution.................................................................................. 6
Pin Configurations and Function Descriptions ........................... 7
Typical Performance Characteristics ............................................. 8
Test C ir c ui t s .....................................................................................12
Te r mi n ol o g y .................................................................................... 15
Theory of Operation ...................................................................... 16
Level Translator Architecture ................................................... 16
REVISION HISTORY
1/05—Revision 0: Initial Version
Input Driving Requirements..................................................... 16
Output Load Requirements ...................................................... 16
Enable Operation ....................................................................... 16
Power Supplies ............................................................................ 16
Data Rate ..................................................................................... 17
Applications..................................................................................... 18
Layout Guidelines....................................................................... 18
Outline Dimensions ....................................................................... 19
Ordering Guide .......................................................................... 19
Rev. 0 | Page 2 of 20
ADG3304
CCA
≤ V
V
CCA
3
3
3
3
3
CCY
1
= 1.15 V to V
3
, V
= 5 V ± 0.5 V
CCY
, V
= 3.3 V ± 0.3 V
CCY
CCY
, GND = 0 V. All specifications T
CCY
V
IHA
IHA
V
ILA
OHA
OLA
C
A
LA, HiZ
V
IHY
ILY
OHY
OLY
CY
LY, HiZ
V
IHEN
IHEN
V
ILEN
LEN
C
EN
t
EN
V
= 1.15 V V
CCA
V
= 1.2 V to 5.5 V V
CCA
0.4 V
VY = V
VY = 0 V, IOL = 20 µA, Figure 28 0.4 V
f = 1 MHz, EN = 0, Figure 33 9 pF VA = 0 V/V
V
0.4 V VA = V VA = 0 V, IOL = 20 µA, Figure 29 0.4 V f = 1 MHz, EN = 0, Figure 34 6 pF VY = 0 V/V
V
= 1.15 V V
CCA
V
= 1.2 V to 5.5 V V
CCA
0.4 V VEN = 0 V/V
3 pF RS = RT = 50 Ω, VA = 0 V/V
V
= 0 V/V
Y
R
P, A-Y
R, A-Y
F, A-Y
MAX, A-Y
SKEW, A-Y
PPSKEW, A-Y
R
P, Y-A
R, Y-A
F, Y-A
MAX, Y-A
SKEW, Y-A
PPSKEW, Y-A
R
P, A-Y
R, A-Y
F, A-Y
MAX, A-Y
SKEW, A-Y
PPSKEW, A-Y
= RT = 50 Ω, CL = 50 pF, Figure 36
S
6 10 ns 2 3.5 ns 2 3.5 ns 50 Mbps 2 4 ns 3 ns
= RT = 50 Ω, CL = 15 pF, Figure 37
S
4 7 ns 1 3 ns
3 7 ns 50 Mbps 2 3.5 ns 2 ns
= RT = 50 Ω, CL = 50 pF, Figure 36
S
8 11 ns 2 5 ns 2 5 ns 50 Mbps 2 4 ns 4 ns
to T
MIN
, IOH = 20 µA, Figure 28 V
CCY
, EN = 0, Figure 30 ±1 µA
CCA
, IOH = 20 µA, Figure 29 V
CCA
, EN = 0, Figure 31 ±1 µA
CCY
, VA = 0 V, Figure 32 ±1
CCA
(YA), Figure 35
CCY
, unless otherwise noted.
MAX
(AY),
CCA
1 1.8 µs
− 0.3 V
CCA
− 0.4
CCA
− 0.4 V
CCA
− 0.4 V
CCY
− 0.4 V
CCY
− 0.3 V
CCA
− 0.4 V
CCA
µA

SPECIFICATIONS

V
= 1.65 V to 5.5 V, V
CCY
Table 1.
Parameter Symbol Conditions Min Typ2Max Unit
LOGIC INPUTS/OUTPUTS
A Side
Input High Voltage V Input Low Voltage Output High Voltage V Output Low Voltage V Capacitance Leakage Current I
Y Side
Input Low Voltage Input High Voltage3 V Output High Voltage V Output Low Voltage V Capacitance Leakage Current I
Enable (EN)
Input High Voltage V Input Low Voltage Leakage Current I
Capacitance Enable Time
SWITCHING CHARACTERISTICS
3.3 V ± 0.3 V ≤ V AY Level Translation
Propagation Delay t Rise Time t Fall Time t Maximum Data Rate D Channel-to-Channel Skew t Part-to-Part Skew t
YA Level Translation
Propagation Delay t Rise Time t
Fall Time t Maximum Data Rate D Channel-to-Channel Skew t Part-to-Part Skew t
1.8 V ± 0.15 V ≤ V AY Translation
Propagation Delay t Rise Time t Fall Time t Maximum Data Rate D Channel-to-Channel Skew t Part-to-Part Skew t
3
3
3
3
CCA
Rev. 0 | Page 3 of 20
ADG3304
Parameter Symbol Conditions Min Typ2Max Unit
YA Translation
Propagation Delay t Rise Time t Fall Time t Maximum Data Rate D Channel-to-Channel Skew t Part-to-Part Skew t
1.15 V to 1.3 V ≤ V
CCA
V
, V
= 3.3 V ± 0.3 V
CCY
CCY
AY Translation
Propagation Delay t Rise Time t Fall Time t Maximum Data Rate D Channel-to-Channel Skew t Part-to-Part Skew t
YA Translation
Propagation Delay t Rise Time t Fall Time t Maximum Data Rate D Channel-to-Channel Skew t Part-to-Part Skew t
1.15 V to 1.3 V ≤ V
CCA
V
, V
= 1.8 V ± 0.3 V
CCY
CCY
AY Translation
Propagation Delay t Rise Time t Fall Time t Maximum Data Rate D Channel-to-Channel Skew t Part-to-Part Skew t
YA Translation
Propagation Delay t Rise Time t Fall Time t Maximum Data Rate D Channel-to-Channel Skew t Part-to-Part Skew t
2.5 V ± 0.2 V ≤ V
CCA
V
CCY
, V
CCY
= 3.3 V ± 0.3 V
AY Translation
Propagation Delay t Rise Time t Fall Time t Maximum Data Rate D Channel-to-Channel Skew t Part-to-Part Skew t
YA Translation
Propagation Delay t Rise Time t Fall Time t Maximum Data Rate D Channel-to-Channel Skew t Part-to-Part Skew t
R
P, Y-A
R, Y-A
F, Y-A
MAX, Y-A
SKEW, Y-A
PPSKEW, Y-A
R
P, A-Y
R, A-Y
F, A-Y
MAX, A-Y
SKEW, A-Y
PPSKEW, A-Y
R
P, Y-A
R, Y-A
F, Y-A
MAX, Y-A
SKEW, Y-A
PPSKEW, Y-A
R
P, A-Y
R, A-Y
F, A-Y
MAX, A-Y
SKEW, A-Y
PPSKEW, A-Y
R
P, Y-A
R, Y-A
F, Y-A
MAX, Y-A
SKEW, Y-A
PPSKEW, Y-A
R
P, A-Y
R, A-Y
F, A-Y
MAX, A-Y
SKEW, A-Y
PPSKEW, A-Y
R
P, Y-A
R, Y-A
F, Y-A
MAX, Y-A
SKEW, Y-A
PPSKEW, Y-A
= RT = 50 Ω, CL = 15 pF, Figure 37
S
5 8 ns 2 3.5 ns 2 3.5 ns 50 Mbps 2 3 ns 3 ns
= RT = 50 Ω, CL = 50 pF, Figure 36
S
9 18 ns 3 5 ns 2 5 ns 40 Mbps 2 5 ns 10 ns
= RT = 50 Ω, CL = 15 pF, Figure 37
S
5 9 ns 2 4 ns 2 4 ns 40 Mbps 2 4 ns 4 ns
= RT = 50 Ω, CL = 50 pF, Figure 36
S
12 25 ns 7 12 ns 3 5 ns 25 Mbps 2 5 ns 15 ns
= RT = 50 Ω, CL = 15 pF, Figure 37
S
14 35 ns 5 16 ns
2.5 6.5 ns 25 Mbps 3 6.5 ns
23.5 ns
= RT = 50 Ω, CL = 50 pF, Figure 36
S
7 10 ns
2.5 4 ns 2 5 ns 60 Mbps
1.5 2 ns 4 ns
= RT = 50 Ω, CL = 15 pF, Figure 37
S
5 8 ns 1 4 ns 3 5 ns 60 Mbps 2 3 ns 3 ns
Rev. 0 | Page 4 of 20
ADG3304
Parameter Symbol Conditions Min Typ2Max Unit
POWER REQUIREMENTS
Power Supply Voltages V
V Quiescent Power Supply Current I
I
Three-State Mode Power Supply Current I I
1
Temperature range is as follows: B version: −40°C to +85°C.
2
All typical values are at TA = 25°C, unless otherwise noted.
3
Guaranteed by design; not subject to production test.
CCA
CCY
CCA
CCY
HiZA
HiZY
V
V
CCA
CCY
1.65 5.5 V VA = 0 V/V
= V
V
CCA
VA = 0 V/V V
= V
CCA
V
= V
CCA
V
= V
CCA
, VY = 0 V/V
CCA
= 5.5 V, EN = 1
CCY
, VY = 0 V/V
CCA
= 5.5 V, EN = 1
CCY
= 5.5 V, EN = 0 0.1 1 µA
CCY
= 5.5 V, EN = 0 0.1 1 µA
CCY
CCY
CCY
,
,
1.15 5.5 V
0.17 1 µA
0.27 1 µA
Rev. 0 | Page 5 of 20
ADG3304

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.
Table 2.
Parameter Rating
V
to GND −0.3 V to +7 V
CCA
V
to GND V
CCY
Digital Inputs (A) −0.3 V to (V Digital Inputs (Y) −0.3 V to (V EN to GND −0.3 V to +7 V Operating Temperature Range
Industrial (B Version) −40°C to +85°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C θJA Thermal Impedance (4-Layer Board)
14-Lead TSSOP 89.21°C/W
12-Bump WLCSP 1200C/W Lead Temperature, Soldering (10 sec) 300°C IR Reflow, Peak Temperature (< 20 sec) 260°C
to +7 V
CCA
+ 0.3 V)
CCA
+ 0.3 V)
CCY
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. 0 | Page 6 of 20
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