ANALOG DEVICES ADG3242 Service Manual

2.5 V/3.3 V, 2-Bit Common Control
A
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FEATURES

225 ps propagation delay through the switch
4.5 Ω switch connection between ports Data rate 1.5 Gbps
2.5 V/3.3 V supply operation Selectable level shifting/translation Level translation
3.3 V to 2.5 V
3.3 V to 1.8 V
2.5 V to 1.8 V Small signal bandwidth 710 MHz 8-lead SOT-23 package

APPLICATIONS

3.3 V to 2.5 V voltage translation
3.3 V to 1.8 V voltage translation
2.5 V to 1.8 V voltage translation Bus switching Bus isolation Hot swap Hot plug Analog switch applications
Level Translator Bus Switch
ADG3242

FUNCTIONAL BLOCK DIAGRAM

0
A1
BE
Figure 1.
B0
B1
4309-001

GENERAL DESCRIPTION

The ADG3242 is a 2.5 V or 3.3 V, 2-bit, 2-port, common control digital switch. It is designed on a low voltage CMOS process, and provides low power dissipation, yet gives high switching speed and very low on resistance. This allows the inputs to be connected to the outputs without additional propagation delay or generating additional ground bounce noise.
These switches are enabled by means of a common bus enable
BE
) input signal. This digital switch allows a bidirectional signal
( to be switched when on. In the off condition, signal levels up to the supplies are blocked.
This device is ideal for applications requiring level translation.
hen operated from a 3.3 V supply, level translation from 3.3 V
W inputs to 2.5 V outputs is allowed. Similarly, if the device is oper­ated from a 2.5 V supply and 2.5 V inputs are applied, the device translates the outputs to 1.8 V. In addition, a level translating select pin (
SEL
) is included. When
SEL
is low, VCC is reduced
internally, allowing for level translation between 3.3 V inputs and 1.8 V outputs. This makes the device suitable for applications requiring level translation between different supplies, such as converter to DSP/microcontroller interfacing.

PRODUCT HIGHLIGHTS

1. 3.3 V or 2.5 V supply operation.
xtremely low propagation delay through switch.
2. E
3. 4.5 Ω swi
4. L
5. T
tches connect inputs to outputs.
evel/voltage translation.
iny SOT-23 package.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2006 Analog Devices, Inc. All rights reserved.
ADG3242
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TABLE OF CONTENTS

Features.............................................................................................. 1
Timing Measurement Information.............................................. 11
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
ESD Caution.................................................................................. 4
Pin Configurations and Function Descriptions ........................... 5
Typical Performance Characteristics ............................................. 6
Terminology .................................................................................... 10

REVISION HISTORY

9/06—Rev. 0 to Rev. A
Bus Switch Applications ................................................................ 12
Mixed Voltage Operation, Level Translation.......................... 12
3.3 V to 2.5 V Translation ......................................................... 12
2.5 V to 1.8 V Translation ......................................................... 12
3.3 V to 1.8 V Translation ......................................................... 12
Bus Isolation................................................................................ 13
Hot Plug and Hot Swap Isolation............................................. 13
Analog Switching ....................................................................... 13
High Impedance during Power-Up/Power-Down................. 13
Outline Dimensions....................................................................... 14
Ordering Guide............................................................................... 14
Updated Format..................................................................Universal
Added Table 4.................................................................................... 5
Changes to the Ordering Guide.................................................... 14
8/03—Revision 0: Initial Version
Rev. A | Page 2 of 16
ADG3242
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SPECIFICATIONS

VCC = 2.3 V to 3.6 V, GND = 0 V; all specifications T
MIN
to T
, unless otherwise noted.
MAX
Table 1.
B Version Parameter Symbol Conditions Min Typ2 Max Unit
DC ELECTRICAL CHARACTERISTICS
Input High Voltage V V Input Low Voltage V V
VCC = 2.7 V to 3.6 V 2.0 V
INH
= 2.3 V to 2.7 V 1.7 V
CC
VCC = 2.7 V to 3.6 V 0.8 V
INL
= 2.3 V to 2.7 V 0.7 V
CC
Input Leakage Current II ±0.01 ±1 μA Off State Leakage Current IOZ 0 ≤ A, B ≤ VCC ±0.01 ±1 μA On State Leakage Current 0 ≤ A, B ≤ VCC ±0.01 ±1 μA Maximum Pass Voltage VP
V V V
A/VB
A/VB
A/VB
SEL
= VCC = = VCC =
= 3.3 V, IO = −5 μA
SEL
= 2.5 V, IO = −5 μA
= VCC = 3.3 V,
SEL
= 0 V, IO = −5 μA
2.0 2.5 2.9 V
1.5 1.8 2.1 V
1.5 1.8 2.1 V
CAPACITANCE3
A Port Off Capacitance CA OFF f = 1 MHz 3.5 pF B Port Off Capacitance CB OFF f = 1 MHz 3.5 pF A, B Port On Capacitance CA, CB ON f = 1 MHz 7 pF Control Input Capacitance CIN f = 1 MHz 4 pF
SWITCHING CHARACTERISTICS3
Propagation Delay A to B or B to A, t
4
t
PD
PHL
, t
PLH
C
= 50 pF, VCC =
L
SEL
= 3 V
0.225 ns
Propagation Delay Matching5 5 ps
, t
Bus Enable Time BE to A or B6
t
PZH
PZL
, t
Bus Disable Time BE to A or B6
t
PHZ
PLZ
Maximum Data Rate Channel Jitter
V
= 3.0 V to 3.6 V;
CC
V
= 3.0 V to 3.6 V;
CC
V
= 2.3 V to 2.7 V;
CC
V
= 3.0 V to 3.6 V;
CC
V
= 3.0 V to 3.6 V;
CC
V
= 2.3 V to 2.7 V;
CC
SEL
V
=
= 3.3 V; VA/VB = 2 V
CC
SEL
V
=
= 3.3 V; VA/VB = 2 V
CC
SEL SEL SEL SEL SEL SEL
= VCC = 0 V = VCC = VCC = 0 V = VCC
1 3.2 4.6 ns 1 3 4 ns 1 3 4 ns 1 3 4 ns 1 2.5 3.8 ns 1 2.5 3.4 ns
1.5 Gbps 45 ps p-p
DIGITAL SWITCH
On Resistance RON
On Resistance Matching ∆RON
V V V V V V V V
= 3 V,
CC
= 3 V,
CC
= 2.3 V,
CC
= 2.3 V,
CC
= 3 V,
CC
= 3 V,
CC
= 3 V,
CC
= 3 V,
CC
SEL
= VCC, VA = 0 V, IBA = 8 mA
SEL
= VCC, VA = 1.7 V, IBA = 8 mA
SEL
= VCC, VA = 0 V, IBA = 8 mA
SEL
= VCC, VA = 1 V, IBA = 8 mA
SEL
= 0 V, VA = 0 V, IBA = 8 mA
SEL
= 0 V, VA = 1 V, IBA = 8 mA
SEL
= VCC, VA = 0 V, IA = 8 mA
SEL
= 0 V, VA = 0 V, IA = 8 mA
4.5 8 Ω 12 28 Ω 5 9 Ω 9 18 Ω 5 8 Ω 12 Ω
0.1 0.5 Ω
0.1 0.5 Ω
POWER REQUIREMENTS
VCC 2.3 3.6 V Quiescent Power Supply Current ICC
Increase in ICC per Input7 ∆ICC
1
Temperature range is as follows: B version: −40°C to +85°C.
2
Typical values are at 25°C, unless otherwise stated.
3
Guaranteed by design, not subject to production test.
4
The digital switch contributes no propagation delay other than the RC delay of the typical RON of the switch and the load capacitance when driven by an ideal voltage
source. Because the time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagation delay to the system. Propagation delay of the digital switch when used in a system is determined by the driving circuit on the driving side of the switch and its interaction with the load on the driven side.
5
Propagation delay matching between channels is calculated from the on resistance matching and load capacitance of 50 pF.
6
See Timing Measurement Information section.
7
This current applies to the Control Pin BE only. The A and B ports contribute no significant ac or dc currents as they transition.
Digital inputs = 0 V or V Digital inputs = 0 V or V V
= 3.6 V, BE = 3.0 V;
CC
SEL
;
CC
;
CC
= VCC
SEL
SEL
= VCC
= 0 V
0.01 1 μA
0.1 0.2 mA
0.15 8 μA
1
Rev. A | Page 3 of 16
ADG3242
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ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.
Table 2.
Parameter Rating
VCC to GND −0.5 V to +4.6 V Digital Inputs to GND −0.5 V to +4.6 V DC Input Voltage −0.5 V to +4.6 V DC Output Current 25 mA per channel Operating Temperature Range
Industrial (B Version) −40°C to +85°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C
θJA Thermal Impedance 206°C/W Lead Temperature, Soldering (10 sec) 300°C IR Reflow, Peak Temperature (<20 sec) 235°C
Stresses above those listed under Absolute Maximum Ratings ma
y cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Only one absolute maximum rating can be applied at any
time.
one

ESD CAUTION

Rev. A | Page 4 of 16
ADG3242
V
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PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

SEL
BE
CC
ADI DIE MARK
BE
1
A0
2
ADG3242
TOP VIEW
3
A1
(Not to Scale)
GND
4
Figure 2. Pin Configuration Figure 3. Die Pad Configuration (Die size: 550 μm × 820 μm)
8
V
CC
7
SEL
B0
6
B1
5
04309-002
B0
B1
Table 3. Pin Function Descriptions
Pin No. Mnemonic Description
1
BE
Bus Enable (Active Low).
2 A0 Port A0, Input or Output. 3 A1 Port A1, Input or Output. 4 GND Ground (0 V) Reference. 5 B1 Port B1, Input or Output. 6 B0 Port B0, Input or Output. 7
SEL
Level Translation Select.
8 VCC Positive Power Supply Voltage.
ADG3242
TOP VIEW
(Not to S cale)
A0
A1
GND
04309-100
Table 4. Die Pad Coordinates (Measured fro
m the Center of the Die)
Mnemonic X(μm) Y(μm)
BE
+93 +303
A0 +102 +150 A1 +168 −139 GND +126 −266 B1 −88 −247 B0 −168 +121 SEL
−111 +279
VCC −7 +303
Table 5. Truth Table
BE
1
Function
SEL
L L A0 = B0, A1 = B1, 3.3 V to 1.8 V Level Shifting. L H A0 = B0, A1 = B1, 3.3 V to 2.5 V/2.5 V to 1.8 V Level Shifting. H X Disconnect.
1
SEL
= 0 V only when VDD = 3.3 V ± 10%.
Rev. A | Page 5 of 16
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