ANALOG DEVICES ADG3231 Service Manual

查询ADG3231供应商查询ADG3231供应商
Low Voltage, Single-Channel
Level Translator
FEATURES Operates from 1.65 V to 3.6 V Supply Rails Unidirectional Signal Path, Bidirectional Level Translation Tiny 6-Lead SOT-23 Package Short Circuit Protection LV T TL/CMOS Compatible Inputs
APPLICATIONS Level Translation Low Voltage ASIC Translation Serial Interface Translation
GENERAL DESCRIPTION
The ADG3231 is a level translator designed on a submicron process that operates from supplies as low as 1.65 V. The device is guaranteed for operation over the supply range 1.65 V to 3.6 V. It operates from two supply voltages, allowing bidirectional level translation, i.e., it translates low voltages to higher voltages and vice versa. The signal path is unidirectional, meaning data may fl ow only from A1 to Y1.
This type of device may be used in applications requiring commu­nication between devices operating from different supply levels.
The level translator is packaged in one of the smallest footprints available for its pin count. The 6-lead SOT-23 package requires only a maximum of 5.28 mm 5.28 mm board space.
ADG3231
FUNCTIONAL BLOCK DIAGRAM
V
CC1
A1
PRODUCT HIGHLIGHTS
1. Bidirectional level translation matches any voltage level from
1.65 V to 3.6 V.
2. The device offers high performance and is fully guaranteed across the supply range.
3. Short circuit protection.
4. Tiny SOT-23 package.
GND
V
CC2
Y1
*
*Patent Pending
REV. 0
Information furnished by Analog Devices is be lieved to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or oth­erwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective companies.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 © 2003 Analog Devices, Inc. All rights reserved.
(V
= V
ADG3231–SPECIFICATIONS
CC1
1
oth er wise noted.)
= 1.65 V to 3.6 V, GND = 0 V. All specifi cations T
CC2
MIN
to T
, un less
MAX
Parameter Symbol Conditions Min Typ2 Max Unit
LOGIC INPUTS/OUTPUTS Input High Voltage4 VIH V V V Input Low Voltage
4
VIL V V V Output High Voltage V V V I V I Output Low Voltage V V V I V I
SWITCHING CHARACTERISTICS Propagation Delay, tPD A1 to Y1 t Propagation Delay, t Propagation Delay, t
PD
PD
Input Leakage Current I Output Leakage Current I
3
4, 5
A1 to Y1 t A1 to Y1 t
= 3.0 V to 3.6 V 1.35 V
V
IH
V
IH
V
IL
V
IL
IOH = –100 µA, V
OH
IOH = +100 µA, V
OL
, t
PHL
, t
PHL
, t
PHL
0 VIN 3.6 V ±1 µA
I
O
CC1
= 2.3 V to 2.7 V 1.35 V
CC1
= 1.65 V to 1.95 V 0.65 VCC V
CC1
= 3.0 V to 3.6 V 0.8 V
CC1
= 2.3 V to 2.7 V 0.7 V
CC1
= 1.65 V to 1.95 V 0.35 VCC V
CC1
= –4 mA, V
OH
= –8 mA, V
OH
= +4 mA, V
OH
= +8 mA, V
OH
3.3 V ± 0.3 V, CL = 30 pF, VT = VCC/2 4 6.5 ns
PLH
2.5 V ± 0.2 V, CL = 30 pF, VT = VCC/2 4.5 6.5 ns
PLH
1.8 V ± 0.15 V, CL = 30 pF, VT = VCC/2 6.5 10.25 ns
PLH
= 3.0 V to 3.6 V 2.4 V
CC2
= 2.3 V to 2.7 V 2.0 V
CC2
= 1.65 V to 1.95 V VCC – 0.45 V
CC2
= 2.3 V to 2.7 V 2.0 V
CC2
= 1.65 V to 1.95 V VCC – 0.45 V
CC2
= 3.0 V to 3.6 V 2.4 V
CC2
= 3.0 V to 3.6 V 0.4 V
CC2
= 2.3 V to 2.7 V 0.4 V
CC2
= 1.65 V to 1.95 V 0.45 V
CC2
= 2.3 V to 2.7 V 0.4 V
CC2
= 1.65 V to 1.95 V 0.45 V
CC2
= 3.0 V to 3.6 V 0.4 V
CC2
0 VIN 3.6 V ±1 µA
POWER REQUIREMENTS Power Supply Voltages V V Quiescent Power Supply Current I I
NOTES
1
Temperature range is as follows: B Version: –40°C to +85°C.
2
All typical values are at V
3
VIL and VIH levels are specifi ed with respect to V
4
Guaranteed by design, not subject to production test.
5
See Test Circuit and Waveforms.
Specifi cations subject to change without notice.
CC1
= V
, TA = 25°C, unless otherwise stated.
CC2
CC1
1.65 3.6 V
CC1
1.65 3.6 V
CC2
Digital Inputs = 0 V or VCC 2 µA
CC1
Digital Inputs = 0 V or VCC 2 µA
CC2
; VOH and VOL levels are with respect to V
CC2
.
–2–
REV. 0
ADG3231
ABSOLUTE MAXIMUM RATINGS*
(TA = 25°C, unless otherwise noted.)
VCC to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +4.6 V
A1 Input Voltage . . . . . . . . . . . . . . . . . . . –0.3 V to V
CC1
+0.3 V
DC Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . .150°C
6-Lead SOT-23,
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 229°C/W
q
JA
Lead Temperature, Soldering (10 seconds) . . . . . . . . . . . 300°C
IR Refl ow, Peak Temperature (<20 seconds) . . . . . . . . . . 235°C
*Stresses above those listed under Absolute Maximum Ratings may cause permanent
damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time.
ORDERING GUIDE
Model Temperature Range Package Description Branding Package Option
ADG3231BRJ-REEL –40°C to +85°C SOT-23 W2B RJ-6 ADG3231BRJ-REEL7 –40°C to +85°C SOT-23 W2B RJ-6
PIN CONFIGURATION
V
V
CC1
NC
A1
1
ADG3231
2
(No t to Scale)
3
6
CC2
Y1
5
GND
4
PIN FUNCTION DESCRIPTIONS
Pin Mnemonic Description
1 V
CC1
Supply Voltage 1, can be any supply voltage from 1.65 V to 3.6 V. 2 NC Not Internally Connected. 3 A1
Digital Input Referred to V
CC1
. 4 GND Device Ground Pin. 5 Y1 6 V
CC2
Digital Output Referred to V Supply Voltage 2, can be any supply voltage from 1.65 V to 3.6 V.
CC2
.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily ac cu mu late on the human body and test equipment and can discharge without detection. Although the ADG3231 features proprietary ESD pro tec tion circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD pre cau tions are rec om mend ed to avoid per for mance deg ra da tion or loss of functionality.
REV. 0
–3–
Loading...
+ 5 hidden pages