Operates from 1.65 V to 3.6 V supply rails
Unidirectional signal path
Up/down level translation
Ultracompact 6-lead SOT-66 and SOT-23 packages
Output short-circuit protection
LVTTL/CMOS-compatible inputs
APPLICATIONS
Level translation in:
PDAs
Handsets
MP3 players
GENERAL DESCRIPTION
The ADG32311 is a single-channel level translator designed on a
submicron process that is guaranteed to operate over the 1.65 V
to 3.6 V supply range. The device may be used in applications
requiring communication between digital devices operating
from multiple supply voltages. The logic levels on each side of
the device are set by the two supply voltages, V
for Y. The signal path is unidirectional, meaning data may
V
CC2
flow only from A to Y.
for A and
CC1
Translator in SOT-66 Package
ADG3231
FUNCTIONAL BLOCK DIAGRAM
V
CC1
PRODUCT HIGHLIGHTS
1. Up/down level translation.
2. Guaranteed to operate with any supply combination within
the 1.65 V to 3.6 V range.
3. Output short-circuit protection.
4. Available in ultracompact SOT-66 and SOT-23 packages.
GND
Figure 1.
V
CC2
Y
03298-001
The ADG3231 can operate with any combination of V
and V
allowing the part to perform either up (V
(V
supply voltages within the 1.65 V to 3.6 V range,
CC2
CC1
> V
CC1
) level translation. The output stage is protected
CC2
< V
CC2
CC1
) or down
against current overload, which may occur when the Y pin is
accidentally shorted to the V
or GND rails.
CC2
The ADG3231 is available in ultracompact packages, the
SOT-66 (1.65 mm × 1.66 mm × 0.57 mm) and the SOT-23
(2.8 mm × 2.9 mm × 1.3 mm), making the part ideal for
applications where space is critical.
1
Patent pending.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
= 1.65 V to 3.6 V, GND = 0 V. All specifications T
CC2
−40°C to +85°C.
Table 1.
Parameter Symbol Conditions Min Typ1 Max Unit
LOGIC INPUTS/OUTPUTS
Input High Voltage2 V
V
V
V
IH
V
IH
V
IH
Input Low Voltage2 V
V
V
V
IL
V
IL
V
IL
Output High Voltage VOH I
V
V
I
V
I
Output Low Voltage VOL I
V
V
I
V
I
SWITCHING CHARACTERISTICS2
Propagation Delay, tPD A to Y t
Propagation Delay, tPD A to Y t
Propagation Delay, tPD A to Y t
, t
3.3 V ± 0.3 V, CL = 30 pF, Figure 2 4 6.5 ns
PHL
PLH
, t
2.5 V ± 0.2 V, CL = 30 pF, Figure 2 4.5 6.5 ns
PHL
PLH
, t
1.8 V ± 0.15 V, CL = 30 pF, Figure 2 6.5 10.25 ns
PHL
PLH
Input Leakage Current II 0 ≤ VIN ≤ 3.6 V ±1 µA
Output Leakage Current IO 0 ≤ VIN ≤ 3.6 V ±1 µA
POWER REQUIREMENTS
Power Supply Voltages V
V
Quiescent Power Supply Current I
I
1.65 3.6 V
CC1
1.65 3.6 V
CC2
Digital inputs = 0 V or V
CC1
Digital inputs = 0 V or V
CC2
1
All typical values are at V
2
Guaranteed by design, not subject to production test.
= V
, TA = 25°C, unless otherwise stated.
CC1
CC2
INPUT
t
PLH
OUTPUT
to T
MIN
CC1
CC1
CC1
CC1
CC1
CC1
= –100 µA, V
OH
= −4 mA, V
OH
= −8 mA, V
OH
= 100 µA, V
OH
= 4 mA, V
OH
= 8 mA, V
OH
, unless otherwise noted. Temperature range for the B version is
MAX
= 3.0 V to 3.6 V 1.35 V
= 2.3 V to 2.7 V 1.35 V
= 1.65 V to 1.95 V 0.65 V
V
CC1
= 3.0 V to 3.6 V 0.8 V
= 2.3 V to 2.7 V 0.7 V
= 1.65 V to 1.95 V 0.35 V
= 3.0 V to 3.6 V 2.4 V
CC2
= 2.3 V to 2.7 V 2.0 V
CC2
= 1.65 V to 1.95 V V
CC2
= 2.3 V to 2.7 V 2.0 V
CC2
= 1.65 V to 1.95 V V
CC2
= 3.0 V to 3.6 V 2.4 V
CC2
= 3.0 V to 3.6 V 0.4 V
CC2
= 2.3 V to 2.7 V 0.4 V
CC2
= 1.65 V to 1.95 V 0.45 V
CC2
= 2.3 V to 2.7 V 0.4 V
CC2
= 1.65 V to 1.95 V 0.45 V
CC2
= 3.0 V to 3.6 V 0.4 V
CC2
2 µA
CC1
2 µA
CC2
V
CC1
50%
t
PHL
0V
V
50%
0V
CC2
03298-020
− 0.45 V
CC2
− 0.45 V
CC2
Figure 2. Timing Diagram
V
CC1
Rev. A | Page 3 of 12
ADG3231
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 2.
Parameter Rating
VCC to GND
Input Voltage for A
DC Output Current 25 mA
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Junction Temperature 150°C
6-Lead SOT-23
θJA Thermal Impedance 229°C/W
6-Lead SOT-66
θJA Thermal Impedance 191°C/W (4-layer board)
Lead Temperature, Soldering
(10 seconds)
IR Reflow, Peak Temperature
(<20 seconds)
−0.3 V to +4.6 V
−0.3 V to V
−40°C to +85°C
−65°C to +150°C
300°C
235°C
+ 0.3 V
CC1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability. Only one absolute maximum rating may be
applied at any one time
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Supply Voltage 1. Can be any supply voltage from 1.65 V to 3.6 V.
CC1
2 NC Not internally connected.
5 3 A Digital Input Referred to V
3, 4 4 GND Device Ground Pin.
2 5 Y Digital Output Referred to V
1 6 V
Supply Voltage 2. Can be any supply voltage from 1.65 V to 3.6 V.
CC2
CC1
CC2
V
CC2
GND
1
2
Y
3
INDICATOR
ADG3231
TOP VIEW
(Not to Scale)
6
V
CC1
5
A
GND
4
03298-003
PIN 1
Figure 4. SOT-66
.
.
Rev. A | Page 5 of 12
ADG3231
TYPICAL PERFORMANCE CHARACTERISTICS
5.0
TA = 25°C
4.5
4.0
3.5
3.0
(nA)
2.5
CC1
I
2.0
1.5
1.0
0.5
0
1.52.02.53.03.54.0
V
= 2.5V
CC2
V
= 1.8V
CC2
Figure 5. I
5.0
TA = 25°C
4.5
4.0
3.5
3.0
(nA)
2.5
CC2
I
2.0
1.5
1.0
0.5
0
1.52.02.53.03.54.0
V
= 3.3V
CC1
Figure 6. I
30
V
= 3.3V
CC2
25
20
(nA)
15
CC1
I
10
5
0
01020305040607080
Figure 7. I
TEMPERATURE (°C)
CC1
V
= 3.3V
CC2
V
(V)
CC1
vs. V
CC1
CC1
V
= 2.5V
CC1
V
(V)
CC2
vs. V
CC2
CC2
V
= 3.3V
CC1
= 2.5V
V
CC1
V
= 1.8V
CC1
vs. Temperature
03298-004
V
= 1.8V
CC1
03298-005
03298-006
30
V
= 3.3V
CC1
25
V
CC2
V
CC2
= 1.8V
= 3.3V
CC2
= 2.5V
20
15
(nA)
CC2
I
10
5
0
–5
01020305040607080
Figure 8. I
V
TEMPERATURE (°C)
vs. Temperature
CC2
80
T
= 25°C
A
25
20
15
(µA)
10
CC1
I
5
5
0
–5
10k100k1M10M100M
Figure 9. I
V
= V
CC1
= V
V
CC1
FREQUENCY (Hz)
CC1
= 1.8V
CC2
vs. Frequency
CC2
= 3.3V
2000
T
= 25°C
A
1800
1600
1400
1200
(µA)
1000
CC2
I
800
600
400
200
0
10k100k1M10M100M
V
Figure 10. I
= V
CC2
= V
CC1
CC2
vs. Frequency
CC2
= 3.3V
= 1.8V
CC1
V
FREQUENCY (Hz)
03298-007
03298-008
03298-009
Rev. A | Page 6 of 12
ADG3231
10
8
6
t
EN
TIME (ns)
4
2
TA = 25°C
= V
V
CC1
0
1.52.02.53.03.54.0
CC2
t
DIS
SUPPLY (V)
Figure 11. Enable, Disable Time vs. Supply
6
8
6
4
TIME (ns)
2
2
V
0
–40–20020406080
CC1
= V
CC2
t
EN
t
DIS
= 3.3V
TEMPERATURE (°C)
Figure 12. Enable, Disable Time vs. Temperature
16
V
= 3.3V
CC1
= 1.8V
V
CC2
14
= 25°C
T
A
DATA RATE 10Mbps
12
03298-010
03298-011
10
V
= 1.8V
CC1
9
V
= 3.3V
CC2
= 25°C
T
A
DATA RATE 10Mbps
8
7
t
LOW-TO-HIGH TRANSITION
6
5
4
RISE/FALL TIME (ns)
3
2
1
0
LH,
t
HIGH-TO-LOW TRANSITION
HL,
2232426252728292102
CAPACITIVE LOAD (pF)
Figure 14. Rise/Fall Time vs.
Capacitive Load(1.8 V to 3.3 V Level Translation)
8
V
= 3.3V
CC1
= 3.3V
V
CC2
7
= 25°C
T
A
DATA RATE 10Mbps
6
t
LOW-TO-HIGH TRANSITION
PLH,
5
4
3
2
PROPAGATION DELAY (ns)
1
0
2232426252728292102
t
HIGH-TO-LOW TRANSITION
PHL,
CAPACITIVE LOAD (pF)
Figure 15. Propagation Delay vs. Capacitive Load
8.0
6.0
03298-013
03298-014
10
t
LOW-TO-HIGH TRANSITION
8
6
RISE/FALL TIME (ns)
4
2
0
2232426252728292102
LH,
t
HIGH-TO-LOW TRANSITION
HL,
CAPACITIVE LOAD (pF)
Figure 13. Rise/Fall Time vs.
Capacitive Load (3.3 V to 1.8 V Level Translation)
03298-012
Rev. A | Page 7 of 12
t
A–Y
4.0
2.0
PROPAGATION DELAY (ns)
T
= 25°C
A
= V
V
CC1
0
1.52.02.53.03.54.0
CC2
PHL,
t
A–Y
PLHL,
SUPPLY VOLTAGE (V)
Figure 16. Propagation Delay vs. Supply Voltage
03298-015
ADG3231
4.0
3.0
2.0
1.0
PROPAGATION DELAY (ns)
V
CC1
0
–40–20020406080
Figure 17. Propagation Delay vs. Temperature
= V
t
PHL,
CC2
A–Y
= 3.3V
TEMPERATURE (°C)
t
PLH,
A–Y
03298-016
3.5
3.0
2.5
2.0
1.5
OUTPUT VOLTAGE (V)
1.0
0.5
0
VCC = 3.3V
VCC = 2.5V
VCC = 1.8V
VCC = 1.8V
SINK
05101520
CURRENT (mA)
T
V
SOURCE
VCC = 2.5V
= 25°C
A
= V
CC
= V
CC1
CC2
VCC = 3.3V
03298-019
Figure 20. Output Voltage vs. Sink and Source Current
TA = 25°C
DATA RATE = 10MHz
3
2
Figure 18. Input/Output V
3
2
3.3V
A
1.8V
Y
03298-017
= 3.3 V, V
CC1
= 1.8 V
CC2
A
1.8V
Y
3.3V
1
Figure 19. Input/Output V
TA = 25°C
DATA RATE = 10MHz
= 1.8 V, V
CC1
= 3.3 V
CC2
03298-018
Rev. A | Page 8 of 12
ADG3231
THEORY OF OPERATION
The ADG3231 is a single-channel level translator designed on a
submicron process that is guaranteed to operate over the 1.65 V
to 3.6 V supply range. The device may be used in applications
requiring communication between digital devices operating
from multiple supply voltages. The logic levels on each side of
the device are set by the two supply voltages, V
V
for Y. The signal path is unidirectional, meaning data may
CC2
for A and
CC1
flow only from A to Y.
The ADG3231 can operate with any combination of V
and V
allowing the part to perform either up (V
(V
supply voltages within the 1.65 V to 3.6 V range,
CC2
CC1
> V
CC1
) level translation.
CC2
< V
CC2
CC1
) or down
V
CC1
V
CC1
The output stage is protected against current overload that may
occur when the Y pin is accidentally shorted to the V
GND rails by limiting the current delivered into the load; for
example, ~1.7 mA with V
= 3.6 V.
CC2
The short-circuit protection circuitry works by limiting
the output current when the output voltage exceeds
(A = 0 logic) or is less than VOH (A = 1 logic) threshold
V
OL
values specified for the V
supply voltage used.
CC2
Figure 21 shows the typical application for the ADG3231 where
the device performs level translation from V
levels to V
-compatible levels to allow proper communication
CC2
-compatible
CC1
between the two digital devices, DEVICE 1 and DEVICE 2.
V
CC2
V
CC2
CC2
or
SIGNAL INPUT
DEVICE 1
Figure 21. Typical Application of the ADG3231 Level Translator
A
ADG3231
GND
Y
DEVICE 2
SIGNAL OUTPUT
03298-021
Rev. A | Page 9 of 12
ADG3231
OUTLINE DIMENSIONS
2.90 BSC
1.90
BSC
0.50
0.30
45
2.80 BSC
2
0.95 BSC
1.45 MAX
SEATING
PLANE
0.22
0.08
1.60 BSC
PIN 1
INDICATOR
1.30
1.15
0.90
0.15MAX
6
13
COMPLIANT TO JEDEC STANDARDS MO-178AB
Figure 22. 6-Lead Small Outline Transistor Package [SOT-23]
(RJ-6)
Dimensions shown in millimeters
10°
1.30
1.20
1.10
128MAX
0.18
0.60
4°
0.45
0°
0.30
0.17
0.13
1.70
1.66
1.50
6
5
TOP VIEW
PIN 1
13
2
0.34 MAX
0.27 NOM
0.26
0.19
1.70
1.65
1.50
0.60
0.57
0.53
0.11
0.10 NOM
0.05 MIN
4
SEATING
PLANE
BOTTOM
0.25 MAX
0.17 MIN
0.20 MIN
VIEW
Figure 23. 6-Lead Small Outline Transistor Package [SOT-66]
(RY-6-1)
Dimensions shown in millimeters
0.50
BSC
0.30
0.23
0.10
ORDERING GUIDE
Model Temperature Range Package Description Branding Package Option