0.2 Ω on resistance flatness
±3.3 V to ±8 V dual-supply operation
3.3 V to 16 V single-supply operation
No V
supply required
L
3 V logic-compatible inputs
Rail-to-rail operation
Continuous current per channel
LFCSP package: 280 mA
TSSOP package: 175 mA
16-lead TSSOP and 16-lead, 4 mm × 4 mm LFCSP
APPLICATIONS
Communication systems
Medical systems
Audio signal routing
Video signal routing
Automatic test equipment
Data acquisition systems
Battery-powered systems
Sample-and-hold systems
Relay replacements
GENERAL DESCRIPTION
The ADG1611/ADG1612/ADG1613 contain four independent
single-pole/single-throw (SPST) switches. The ADG1611 and
ADG1612 differ only in that the digital control logic is inverted.
The ADG1611 switches are turned on with Logic 0 on the
appropriate control input, while Logic 1 is required for the
ADG1612 switches. The ADG1613 has two switches with
digital control logic similar to that of the ADG1611; the logic is
inverted on the other two switches. Each switch conducts equally
well in both directions when on and has an input signal range that
extends to the supplies. In the off condition, signal levels up to
the supplies are blocked.
The ADG1613 exhibits break-before-make switching action for use
in multiplexer applications. Inherent in the design is the low charge
injection for minimum transients when switching the digital inputs.
The ultralow on resistance of these switches make them ideal
solutions for data acquisition and gain switching applications
where low on resistance and distortion is critical. The on resistance
profile is very flat over the full analog input range, ensuring
excellent linearity and low distortion when switching audio signals.
The CMOS construction ensures ultralow power dissipation, making
them ideally suited for portable and battery-powered instruments.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
VDD = +5 V ± 10%, VSS = −5 V ± 10%, GND = 0 V, unless otherwise noted.
Table 1.
−40°C to
Parameter 25°C
+85°C
ANALOG SWITCH
Analog Signal Range VDD to VSS V
On Resistance (RON) 1 Ω typ VS = ±4.5 V, IS = −10 mA; see Figure 24
1.2 1.4 1.6 Ω max VDD = ±4.5 V, VSS = ±4.5 V
On Resistance Match Between Channels (∆RON) 0.04 Ω typ VS = ±4.5 V, IS = −10 mA
0.08 0.09 0.1 Ω max
On Resistance Flatness (R
) 0.2 Ω typ VS = ±4.5 V, IS = −10 mA
FLAT(ON)
0.25 0.29 0.34 Ω max
LEAKAGE CURRENTS VDD = +5.5 V, VSS = −5.5 V
Source Off Leakage, IS (Off) ±0.1 nA typ
±0.3 ±1 ±6 nA max
Drain Off Leakage, ID (Off) ±0.1 nA typ
±0.3 ±1 ±6 nA max
Channel On Leakage, ID, IS (On) ±0.2 nA typ VS = VD = ±4.5 V; see Figure 26
±0.4 ±1.5 ±10 nA max
DIGITAL INPUTS
Input High Voltage, V
Input Low Voltage, V
Input Current, I
INL
2.0 V min
INH
0.8 V max
INL
or I
+0.005 ±0.1 μA typ VIN = V
INH
±0.1 μA max
Digital Input Capacitance, CIN 5 pF typ
DYNAMIC CHARACTERISTICS1
tON 165 ns typ RL = 300 Ω, CL = 35 pF
212 253 285 ns max VS = 2.5 V; see Figure 31
t
105 ns typ RL = 300 Ω, CL = 35 pF
OFF
137 150 159 ns max VS = 2.5 V; see Figure 31
Break-Before-Make Time Delay, tD (ADG1613 Only) 25 ns typ RL = 300 Ω, CL = 35 pF
20 ns min VS1 = VS2 = 2.5 V; see Figure 32
Charge Injection 140 pC typ VS = 0 V, RS = 0 Ω, CL = 1 nF; see Figure 33
Off Isolation 70 dB typ
Channel-to-Channel Crosstalk 110 dB typ
Total Harmonic Distortion + Noise (THD + N) 0.007 % typ
−3 dB Bandwidth 42 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 29
CS (Off) 63 pF typ VS = 0 V, f = 1 MHz
CD (Off) 63 pF typ VS = 0 V, f = 1 MHz
CD, CS (On) 154 pF typ VS = 0 V, f = 1 MHz
POWER REQUIREMENTS VDD = +5.5 V, VSS = −5.5 V
IDD 0.001 μA typ Digital inputs = 0 V or VDD
1.0 μA max
VDD/VSS ±3.3/±8 V min/max
1
Guaranteed by design, not subject to production test.
Analog Signal Range 0 V to VDD V
On Resistance (RON) 0.95 Ω typ VS = 0 V to 10 V, IS = −10 mA; see Figure 24
1.1 1.25 1.45 Ω max VDD = 10.8 V, VSS = 0 V
On Resistance Match Between Channels (∆RON) 0.03 Ω typ VS = 0 V to 10 V, IS = −10 mA
0.06 0.7 0.08 Ω max
On Resistance Flatness (R
) 0.2 Ω typ VS = 0 V to 10 V, IS = −10 mA
FLAT(ON)
0.23 0.27 0.32 Ω max
LEAKAGE CURRENTS VDD = 13.2 V, VSS = 0 V
Source Off Leakage, IS (Off) ±0.1 nA typ VS = 1 V/10 V, VS = 10 V/1 V, see Figure 25
±0.3 ±1 ±6 nA max
Drain Off Leakage, ID (Off) ±0.1 nA typ VS = 1 V/10 V, VS = 10 V/1 V see Figure 25
±0.3 ±1 ±6 nA max
Channel On Leakage, ID, IS (On) ±0.2 nA typ VS = VD = 1 V or 10 V; see Figure 26
±0.4 ±1.5 ±10 nA max
DIGITAL INPUTS
Input High Voltage, V
Input Low Voltage, V
Input Current, I
INL
2.0 V min
INH
0.8 V max
INL
or I
0.001 μA typ VIN = V
INH
±0.1 μA max
Digital Input Capacitance, CIN 5 pF typ
DYNAMIC CHARACTERISTICS1
tON 125 ns typ RL = 300 Ω, CL = 35 pF
156 190 215 ns max VS = 8 V; see Figure 31
t
75 ns typ RL = 300 Ω, CL = 35 pF
OFF
87 93 99 ns max VS = 8 V; see Figure 31
Break-Before-Make Time Delay, tD (ADG1613 Only) 35 ns typ RL = 300 Ω, CL = 35 pF
30 ns min VS1 = VS2 = 8 V; see Figure 32
Charge Injection 170 pC typ VS = 6 V, RS = 0 Ω, CL = 1 nF; see Figure 33
Off Isolation 70 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 27
Channel-to-Channel Crosstalk 110 dB typ RL = 50 Ω, CL = 5 pF, f = 1 MHz; see Figure 28
Total Harmonic Distortion + Noise 0.012 % typ
−3 dB Bandwidth 38 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 29
CS (Off) 60 pF typ VS = 6 V, f = 1 MHz
CD (Off) 60 pF typ VS = 6 V, f = 1 MHz
CD, CS (On) 154 pF typ VS = 6 V, f = 1 MHz
POWER REQUIREMENTS VDD = 12 V
IDD 0.001 μA typ Digital inputs = 0 V or VDD
1 μA max
IDD 320 μA typ Digital inputs = 5 V
480 μA max
VDD 3.3/16 V min/max
1
Guaranteed by design, not subject to production test.
Analog Signal Range 0 V to VDD V
On Resistance (RON) 1.7 Ω typ VS = 0 V to 4.5 V, IS = −10 mA; see Figure 24
2.15 2.4 2.7 Ω max VDD = 4.5 V, VSS = 0 V
On Resistance Match Between Channels (∆RON) 0.05 Ω typ VS = 0 V to 4.5 V, IS = −10 mA
0.09 0.12 0.15 Ω max
On Resistance Flatness (R
) 0.4 Ω typ VS = 0 V to 4.5 V, IS = −10 mA
FLAT(ON)
0.53 0.55 0.6 Ω max
LEAKAGE CURRENTS VDD = 5.5 V, VSS = 0 V
Source Off Leakage, IS (Off) ±0.05 nA typ VS = 1 V/4.5 V, VD = 4.5 V/1 V; see Figure 25
±0.3 ±1 ±6 nA max
Drain Off Leakage, ID (Off) ±0.05 nA typ VS = 1 V/4.5 V, VD = 4.5 V/1 V; see Figure 25
±0.3 ±1 ±6 nA max
Channel On Leakage, ID, IS (On) ±0.15 nA typ VS = VD = 1 V or 4.5 V; see Figure 26
±0.4 ±1.5 ±10 nA max
DIGITAL INPUTS
Input High Voltage, V
Input Low Voltage, V
Input Current, I
INL
2.0 V min
INH
0.8 V max
INL
or I
0.001 μA typ VIN = V
INH
±0.1 μA max
Digital Input Capacitance, CIN 5 pF typ
DYNAMIC CHARACTERISTICS1
tON 215 ns typ RL = 300 Ω, CL = 35 pF
279 334 376 ns max VS = 2.5 V; see Figure 31
t
115 ns typ RL = 300 Ω, CL = 35 pF
OFF
150 169 180 ns max VS = 2.5 V; see Figure 31
Break-Before-Make Time Delay, tD (ADG1613 Only) 35 ns typ RL = 300 Ω, CL = 35 pF
25 ns min VS1 = VS2 = 2.5 V; see Figure 32
Charge Injection 80 pC typ VS = 0 V, RS = 0 Ω, CL = 1 nF; see Figure 33
Off Isolation 70 dB typ
Channel-to-Channel Crosstalk 110 dB typ
Total Harmonic Distortion + Noise 0.093 % typ
−3 dB Bandwidth 42 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 29
CS (Off) 72 pF typ VS = 2.5 V, f = 1 MHz
CD (Off) 72 pF typ VS = 2.5 V, f = 1 MHz
CD, CS (On) 160 pF typ VS = 2.5 V, f = 1 MHz
POWER REQUIREMENTS VDD = 5.5 V
IDD 0.001 μA typ Digital inputs = 0 V or VDD
1 μA max
VDD 3.3/16 V min/max
1
Guaranteed by design, not subject to production test.
Analog Signal Range 0 V to VDD V
On Resistance (RON) 3.2 3.4 3.6 Ω typ
On Resistance Match Between Channels (∆RON) 0.06 0.07 0.08 Ω typ VS = 0 V to VDD, IS = −10 mA
On Resistance Flatness (R
) 1.2 1.3 1.4 Ω typ VS = 0 V to VDD, IS = −10 mA
FLAT(ON)
LEAKAGE CURRENTS VDD = 3.6 V, VSS = 0 V
Source Off Leakage, IS (Off) ±0.02 nA typ VS = 0.6 V/3 V, VD = 3 V/0.6 V; see Figure 25
±0.3 ±1 ±6 nA max
Drain Off Leakage, ID (Off) ±0.02 nA typ VS = 0.6 V/3 V, VD = 3 V/0.6 V; see Figure 25
±0.3 ±1 ±6 nA max
Channel On Leakage, ID, IS (On) ±0.1 nA typ VS = VD = 0.6 V or 3 V; see Figure 26
±0.4 ±1.5 ±10 nA max
DIGITAL INPUTS
Input High Voltage, V
Input Low Voltage, V
Input Current, I
INL
2.0 V min
INH
0.8 V max
INL
or I
0.001 μA typ VIN = V
INH
±0.1 μA max
Digital Input Capacitance, CIN 3 pF typ
DYNAMIC CHARACTERISTICS1
tON 350 ns typ RL = 300 Ω, CL = 35 pF
493 556 603 ns max VS = 1.5 V; see Figure 31
t
190 ns typ RL = 300 Ω, CL = 35 pF
OFF
263 286 300 ns max VS = 1.5 V; see Figure 31
Break-Before-Make Time Delay, tD (ADG1613 Only) 25 ns typ RL = 300 Ω, CL = 35 pF
18 ns min VS1 = VS2 = 1.5 V; see Figure 32
Charge Injection 50 pC typ VS = 1.5 V, RS = 0 Ω, CL = 1 nF; see Figure 33
Off Isolation 70 dB typ
Channel-to-Channel Crosstalk 110 dB typ
Total Harmonic Distortion + Noise 0.18 % typ
−3 dB Bandwidth 52 MHz typ RL = 50 Ω, CL = 5 pF; see Figure 29
CS (Off) 76 pF typ VS = 1.5 V, f = 1 MHz
CD (Off) 76 pF typ VS = 1.5 V, f = 1 MHz
CD, CS (On) 160 pF typ VS = 1.5 V, f = 1 MHz
POWER REQUIREMENTS VDD = 3.6 V
IDD 0.001 μA typ Digital inputs = 0 V or VDD
1.0 1.0 μA max
VDD 3.3/16 V min/max
1
Guaranteed by design, not subject to production test.
−40°C to
+125°C Unit Test Conditions/Comments
= 0 V to VDD, IS = −10 mA, VDD = 3.3 V,
V
S
= 0 V; see Figure 24
V
SS
or VDD
GND
= 50 Ω, CL = 5 pF, f = 100 kHz;
R
L
see Figure 27
= 50 Ω, CL = 5 pF, f = 100 kHz;
R
L
see Figure 28
= 110 Ω, f = 20 Hz to 20 kHz,
R
L
= 2 V p-p; see Figure 30
V
S
Rev. A | Page 6 of 16
ADG1611/ADG1612/ADG1613
CONTINUOUS CURRENT PER CHANNEL, S OR D
Table 5.
Parameter
CONTINUOUS CURRENT, S OR D
VDD = +5 V, VSS = −5 V
TSSOP (θJA = 150.4°C/W) 175 119 70 mA maximum
LFCSP (θJA = 48.7°C/W) 280 175 95 mA maximum
VDD = 12 V, VSS = 0 V
TSSOP (θJA = 150.4°C/W) 206 135 84 mA maximum
LFCSP (θJA = 48.7°C/W) 336 203 108 mA maximum
VDD = 5 V, VSS = 0 V
TSSOP (θJA = 150.4°C/W) 140 91 63 mA maximum
LFCSP (θJA = 48.7°C/W) 220 140 84 mA maximum
VDD = 3.3 V, VSS = 0 V
TSSOP (θJA = 150.4°C/W) 140 98 70 mA maximum
LFCSP (θJA = 48.7°C/W) 228 150 91 mA maximum
25°C 85°C 125°C
Unit
Rev. A | Page 7 of 16
ADG1611/ADG1612/ADG1613
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 6.
Parameter Rating
VDD to VSS 18 V
VDD to GND −0.3 V to +18 V
VSS to GND +0.3 V to −18 V
Analog Inputs1
Digital Inputs1
Peak Current, S or D
Continuous Current, S or D2 Data + 15%
Operating Temperature Range
Industrial (Y Version) −40°C to +125°C
Storage Temperature Range −65°C to +150°C
Junction Temperature 150°C
16-Lead TSSOP, θJA Thermal
Impedance (2-Layer Board)
16-Lead LFCSP, θJA Thermal
Impedance (4-Layer Board)
Reflow Soldering Peak
Temperature, Pb free
1
Overvoltages at IN, S, or D are clamped by internal diodes. Current should be
limited to the maximum ratings given.
2
See Table 5.
− 0.3 V to VDD + 0.3 V or
V
SS
30 mA, whichever occurs first
GND − 0.3 V to V
30 mA, whichever occurs first
630 mA (pulsed at 1 ms,
10% duty-cycle maximum)
150.4°C/W
48.7°C/W
260°C
+ 0.3 V or
DD
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. A | Page 8 of 16
ADG1611/ADG1612/ADG1613
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
IN1
D1
IN2
D2
14
13
15
1S1
2V
3GND
4S4
16
PIN 1
INDICATOR
ADG1611/
ADG1612/
ADG1613
TOP VIEW
(Not to Scale)
7
5
6
D4
IN4
IN3
12 S2
11 V
DD
10 NC
9S3
8
D3
.
SS
07981-003
1
IN1
2
D1
3
S1
ADG1611/
ADG1612/
4
V
SS
ADG1613
5
S4
D4
TOP VIEW
(Not to Scale)
6
7
8
GND
IN4
NC = NO CONNECT
Figure 4. 16-Lead TSSOP Pin Configuration
16
IN2
15
D2
14
S2
13
V
DD
12
NC
11
S3
10
D3
9
IN3
07981-002
SS
NOTES
1. NC = NO CONNECT .
2. EXPOSED P AD TIED TO SUBSTRATE, V
Figure 5. 16-Lead LFCSP Pin Configuration
Table 7. Pin Function Descriptions
Pin No.
16-Lead TSSOP 16-Lead LFCSP
Mnemonic Description
1 15 IN1 Logic Control Input.
2 16 D1 Drain Terminal. This pin can be an input or output.
3 1 S1 Source Terminal. This pin can be an input or output.
4 2 VSS Most Negative Power Supply Potential.
5 3 GND Ground (0 V) Reference.
6 4 S4 Source Terminal. This pin can be an input or output.
7 5 D4 Drain Terminal. This pin can be an input or output.
8 6 IN4 Logic Control Input.
9 7 IN3 Logic Control Input.
10 8 D3 Drain Terminal. This pin can be an input or output.
11 9 S3 Source Terminal. This pin can be an input or output.
12 10 NC No Connection.
13 11 VDD Most Positive Power Supply Potential.
14 12 S2 Source Terminal. This pin can be an input or output.
15 13 D2 Drain Terminal. This pin can be an input or output.
16 14 IN2 Logic Control Input.
N/A 17 (EPAD) EP (EPAD) Exposed Pad. Tied to substrate, VSS.
Table 8. ADG1611/ADG1612 Truth Table
ADG1611 INx ADG1612 INx Switch Condition
0 1 On
1 0 Off
Table 9. ADG1613 Truth Table
Logic (INx) Switch 1, Switch 4 Switch 2, Switch 3
0 Off On
1 On Off
Rev. A | Page 9 of 16
ADG1611/ADG1612/ADG1613
TYPICAL PERFORMANCE CHARACTERISTICS
1.4
TA = 25°C
= +3.3V
V
DD
V
= –3.3V
1.2
1.0
0.8
ON RESISTANCE ()
0.6
SS
= +5V
V
DD
V
= –5V
SS
VDD = +8V
V
= –8V
SS
1.4
1.2
1.0
0.8
ON RESISTANCE ()
0.6
TA = +125°C
T
= +85°C
A
T
= +25°C
A
T
= –40°C
A
VDD = 12V
V
= 0V
SS
0.4
–8–6–4–202468
OR VD VOLTAGE (V)
V
S
Figure 6. On Resistance as a Function of VD (VS) for Dual Supply
3.5
TA = 25°C
3.0
2.5
2.0
1.5
ON RESISTANCE ()
1.0
0.5
0246810121416
Figure 7. On Resistance as a Function of V
VDD = 3.3V
V
= 0V
SS
VDD = 5V
V
= 0V
SS
V
OR VD VOLTAGE (V)
S
V
= 12V
DD
V
= 0V
SS
D
VDD = 16V
V
(VS) for Single Supply
= 0V
SS
1.4
1.2
0.4
024681012
07981-013
Figure 9. On Resistance as a Function of V
VS OR VD VOLTAGE (V)
(VS) for Different Temperatures,
D
07981-010
12 V Single Supply
2.5
TA = +125°C
= +125°C
T
A
T
T
= +85°C
= +85°C
A
A
T
T
= +25°C
= +25°C
A
A
T
T
= –40°C
= –40°C
A
A
2.0
1.5
ON RESISTANCE ()
1.0
00.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.55.0
07981-014
VS OR VD VOLTAGE (V)
VDD = 5V
V
= 0V
SS
07981-012
Figure 10. On Resistance as a Function of VD (VS) for Different Temperatures,
5 V Single Supply
4.0
VDD = 3.3V
V
= 0V
SS
3.5
1.0
0.8
ON RESISTANCE ()
0.6
VDD = +5V
V
= –5V
SS
0.4
–6–4–20246
V
OR VD VOLTAGE (V)
S
Figure 8. On Resistance as a Function of V
(VS) for Different Temperatures,
D
T
TA = +125°C
= +125°C
A
T
T
= +85°C
= +85°C
A
A
T
T
= +25°C
= +25°C
A
A
T
T
= –40°C
= –40°C
A
A
±5 V Dual Supply
07981-011
Figure 11. On Resistance as a Function of VD (VS) for Different Temperatures,
Rev. A | Page 10 of 16
3.0
T
= +125°C
2.5
ON RESISTANCE ()
2.0
1.5
00.51. 01. 52. 02. 53. 03. 5
A
T
= +85°C
A
T
= +25°C
A
TA = –40°C
VS OR VD VOLTAGE (V)
3.3 V Single Supply
07981-006
ADG1611/ADG1612/ADG1613
(
20
15
10
5
0
–5
LEAKAGE CURRENT (n A)
–10
–15
0 20406080100120
TEMPERATURE (°C)
ID, IS (ON) +, +
ID (OFF) –, +
IS (OFF) +, –
ID, IS (ON) –, –
IS (OFF) –, +
ID (OFF) +, –
07981-03
Figure 12. Leakage Currents as a Function of Temperature, ±5 V Dual Supply
25
20
15
10
5
0
–5
LEAKAGE CURRENT (n A)
–10
–15
–20
0 20406080100120
TEMPERATURE (°C)
ID, IS (ON) +, +
ID (OFF) –, +
IS (OFF) +, –
ID, IS (ON) –, –
IS (OFF) –, +
(OFF) +, –
I
D
7981-031
Figure 13. Leakage Currents as a Function of Temperature,
12 V Single Supply
20
15
ID, IS (OFF) +, +
10
ID, IS (OFF) –, –
5
LEAKAGE CURRENT (n A)
0
–5
0 20406080100120
TEMPERATURE (°C)
ID (OFF) –, +
IS (OFF) +, –
IS (OFF) –, +
ID (OFF) +, –
07981-019
Figure 14. Leakage Currents as a Function of Temperature,
5 V Single Supply
18
16
14
12
10
8
6
4
2
LEAKAGE CURRENT (n A)
0
–2
–4
020406080100120
TEMPERATURE (°C)
ID, IS (OFF) +, +
ID, IS (OFF) –, –
ID (OFF) –, +
IS (OFF) +, –
IS (OFF) –, +
(OFF) +, –
I
D
Figure 15. Leakage Currents as a Function of Temperature,
3.3 V Single Supply
600
500
400
300
µA)
200
DD
I
100
0
–100
024681012
IDD = +12V
I
= 0V
SS
I
= +5V
DD
I
= –5V
SS
IDD = +3.3V
I
= 0V
SS
Figure 16. I
I
= +5V
DD
I
= 0V
SS
LOGIC (V)
vs. Logic Level
DD
IDD PER CHANNEL
T
= 25°C
A
300
VDD = +5V
V
= –5V
SS
= 0V
VS (V)
SS
VDD = +5V
V
= 0V
SS
V
V
DD
SS
= +12V
= 0V
250
200
150
100
CHARGE INJECTI ON (pC)
50
VDD = +3.3V
0
–6–4–202468101214
V
Figure 17. Charge Injection vs. Source Voltage (V
07981-030
07981-005
07981-009
)
S
Rev. A | Page 11 of 216
ADG1611/ADG1612/ADG1613
–
A
500
450
400
350
300
250
TIME (ns)
200
150
100
50
t
(+5V)
OFF
t
(±5V)
OFF
t
(+5V)
ON
t
(+12V)
0
–60 –40 –20020406080 100 120 140
OFF
Figure 18. t
TEMPERATURE (°C)
Times vs. Temperature
ON/tOFF
t
OFF
t
ON
(+3.3V)
(+3.3V)
t
(±5V)
OFF
t
(+12V)
ON
1-018
0798
0
–1
–2
–3
–4
INSERTION LOSS (dB)
–5
–6
100k1M10M100M1G10k1k
FREQUENCY (Hz)
TA = 25°C
= +5V
V
DD
= –5V
V
SS
07981-004
Figure 21. On Response vs. Frequency
TION (dB)
OFF ISOL
CROSSTALK (dB)
–100
–120
–140
–10
–15
–20
–25
–30
–35
–40
–45
–50
–55
–60
–65
–70
–75
–80
–85
–20
–40
–60
–80
5
TA = 25°C
V
V
0
TA = 25°C
V
V
= +5V
DD
= –5V
SS
100k1M10M100M1G10k1k
FREQUENCY ( Hz)
Figure 19. Off Isolation vs. Frequency
= +5V
DD
= –5V
SS
100k1M10M100M1G10k1k
FREQUENCY ( Hz)
Figure 20. Crosstalk vs. Frequency
0
TA = 25°C
= +5V
V
DD
= –5V
V
SS
–20
–40
–60
ACPSRR (dB)
–80
–100
007
07981-
–120
FREQUENCY (Hz)
NO DECOUPLI NG
CAPACITORS
DECOUPLING
CAPACITORS
100k1M10M10k1k
07981-008
Figure 22. ACPSRR vs. Frequency
0.20
0.18
RL = 110
0.16
T
= 25°C
A
0.14
0.12
0.10
0.08
THD + N (%)
0.06
0.04
0.02
07981-017
VDD = +12V
= 5V p-p
V
S
0
0
VDD = +3.3V
= 2V
V
S
VDD = +5V
= 3.5V
V
S
15k20k10k5k25k
FREQUENCY ( Hz)
VDD = +5V
V
= –5V
SS
= 5V p-p
V
S
1-016
0798
Figure 23. THD + N vs. Frequency
Rev. A | Page 12 of 16
ADG1611/ADG1612/ADG1613
V
V
V
V
V
V
TEST CIRCUITS
DD
SS
0.1µF
V
SS
Sx
Dx
Figure 27. Off Isolation
L
50
OFF ISOLATION = 20 log
DD
0.1µF
V
DD
S1
S2
NETWO RK
ANALYZER
50
V
OUT
R
L
50
SS
0.1µF
V
SS
Dx
V
S
V
OUT
V
S
07981-026
R
L
50
SxDx
V
S
RON = V1/I
Figure 24. On Resistance
0.1µF
V
DD
I
S
V1
S
07981-020
INx
V
IN
GND
NETWORK
ANALYZER
V
OUT
R
50
IS (OFF)ID (OFF)
V
S
SxDx
AA
Figure 25. Off Leakage
SxDx
NC
NC = NO CONNECT
Figure 26. On Leakage
ID (ON)
A
V
D
S
V
D
7981-021
CHANNEL-TO-CHANNEL CROSSTAL K = 20 log
Figure 28. Channel-to-Channel Crosstalk
DD
SS
0.1µF
V
DD
INx
V
IN
07981-022
GND
0.1µF
V
SS
Sx
Dx
INSERTIO N LOSS = 20 log
Figure 29. Bandwidth
GND
V
OUT
V
S
NETWORK
ANALYZER
50
R
L
50
V
WITH SWITCH
OUT
WITHOUT SWITCH
V
OUT
07981-027
V
S
V
OUT
7981-028
V
Rev. A | Page 13 of 16
ADG1611/ADG1612/ADG1613
V
V
V
V
V
V
V
0.1µF
INx
IN
V
DD
SS
0.1µF
R
L
110
AUDIO PRECISI ON
R
S
V
S
V p-p
V
OUT
07981-029
V
V
DD
SS
Sx
Dx
GND
Figure 30. THD + Noise
V
DD
SS
0.1µF
V
DD
Sx
S
INx
GND
0.1µF
ADG1612
V
V
V
OUT
IN
IN
ADG1611
V
SS
V
C
L
35pF
OUT
Dx
R
L
300
50%50%
50%50%
90%90%
t
ON
t
OFF
07981-023
Figure 31. Switching Times
V
DD
0.1µF
SS
0.1µF
V
IN
0V
50%50%
V
V
DD
IN1,
IN2
S1D1
S2D2
ADG1613
V
S1
V
S2
GND
SS
R
L
R
L
300
C
L
35pF
V
OUT2
300
C
L
35pF
V
OUT1
V
V
OUT1
OUT2
0V
90%
0V
90%
t
D
t
90%
D
90%
07981-024
Figure 32. Break-Before-Make Time Delay
DD
SS
V
V
DD
SS
C
1nF
V
OUT
L
R
S
V
S
INx
Sx
Dx
GND
V
IN
V
IN
V
OUT
ADG1612
ADG1611
Q
INJ
ON
= CL × V
OUT
V
OFF
OUT
07981-025
Figure 33. Charge Injection
Rev. A | Page 14 of 16
ADG1611/ADG1612/ADG1613
TERMINOLOGY
IDD
The positive supply current.
I
SS
The negative supply current.
V
(VS)
D
The analog voltage on Terminal D and Terminal S.
R
ON
The ohmic resistance between Terminal D and Terminal S.
R
FLAT(ON)
Flatness that is defined as the difference between the maximum
and minimum value of on resistance measured over the specified
analog signal range.
I
(Off)
S
The source leakage current with the switch off.
I
(Off)
D
The drain leakage current with the switch off.
I
, IS (On)
D
The channel leakage current with the switch on.
V
INL
The maximum input voltage for Logic 0.
V
INH
The minimum input voltage for Logic 1.
I
(I
)
INL
INH
The input current of the digital input.
C
(Off)
S
The off switch source capacitance, which is measured with
reference to ground.
C
(Off)
D
The off switch drain capacitance, which is measured with
reference to ground.
C
, CS (On)
D
The on switch capacitance, which is measured with reference to
ground.
C
IN
The digital input capacitance.
t
ON
The delay between applying the digital control input and the
output switching on. See Figure 31.
t
OFF
The delay between applying the digital control input and the
output switching off. See Figure 31.
Charge Injection
A measure of the glitch impulse transferred from the digital
input to the analog output during switching. See Figure 33.
Off Isolation
A measure of unwanted signal coupling through an off switch.
See Figure 27.
Crosstalk
A measure of unwanted signal that is coupled through from one
channel to another as a result of parasitic capacitance. See
Figure 28.
Bandwidth
The frequency at which the output is attenuated by 3 dB. See
Figure 29.
On Response
The frequency response of the on switch.
Insertion Loss
The loss due to the on resistance of the switch.
Total Harmonic Distortion + Noise (THD + N)
The ratio of the harmonic amplitude plus noise of the signal to
the fundamental. See Figure 30.
AC Power Supply Rejection Ratio (ACPSRR)
The ratio of the amplitude of signal on the output to the amplitude
of the modulation. This is a measure of the ability of the part to
avoid coupling noise and spurious signals that appear on the supply
voltage pin to the output of the switch. The dc voltage on the device
is modulated by a sine wave of 0.62 V p-p.
Rev. A | Page 15 of 16
ADG1611/ADG1612/ADG1613
C
OUTLINE DIMENSIONS
5.10
5.00
4.90
16
4.50
4.40
4.30
PIN 1
0.15
0.05
0.65
BSC
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 34. 16-Lead Thin Shrink Small Outline Package [TSSOP]
4.00
BSC SQ
PIN 1
ATO R
INDI
TOP VIEW
12° MAX
1.00
0.85
0.80
SEATING
PLANE
0.30
0.23
0.18
COMPLIANTTOJEDEC STANDARDS MO-220-VGGC.
Figure 35. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad (CP-16-13)
ORDERING GUIDE
Model Temperature Range Package Description Package Option
ADG1611BRUZ1 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1611BRUZ-REEL1 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1611BRUZ-REEL71 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1611BCPZ-REEL1 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-13
ADG1611BCPZ-REEL71 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-13
ADG1612BRUZ1 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1612BRUZ-REEL1 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1612BRUZ-REEL71 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1612BCPZ- REEL1 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-13
ADG1612BCPZ-REEL71 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-13
ADG1613BRUZ1 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1613BRUZ-REEL1 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1613BRUZ-REEL71 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1613BCPZ-REEL1 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-13
ADG1613BCPZ-REEL71 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-16-13