2.3 V to 3.6 V power supply
Programmable output power:
−16 dBm to +13 dBm in 0.3 dBm steps
Receiver sensitivity:
−117.5 dBm at 1 kbps, FSK
−110.5 dBm at 9.6 kbps, FSK
−106.5 dBm at 9.6 kbps, ASK
Low power consumption:
19 mA in receive mode
22 mA in transmit mode (10 dBm output)
FSK/ASK Transceiver IC
ADF7020
On-chip VCO and fractional-N PLL
On-chip 7-bit ADC and temperature sensor
±1 ppm RF output frequency accuracy possible from
low cost 100 ppm crystal
Digital RSSI
Leakage current <1 µA in power-down mode
48-lead ultrasmall MLF package (chip scale)
APPLICATIONS
Low cost wireless data transfer
Remote control/security systems
Wireless metering
Keyless entry
Home automation
Process and building control
Wireless voice
FUNCTIONAL BLOCK DIAGRAM
MUXOUTADCINRSETVREG(1:4)
RFINB
P
R
LNA
RFIN
OUT
BIASLDO(1:4)
LNA
GAIN
DIVIDERS/
MUXING
ASK/OOK
MOD CONTROL
GAUSSIAN FILTER
IF FILTER
FSK MOD
CONTROL
VCO
VCOIN CPOUT
OFFSET
CORRECTION
RSSI
OFFSET
CORRECTION
GAUSSIAN
FILTER
CP
MODULATOR
N/N+1DIV P
PFD
TEMP
SENSOR
MUX
Σ-∆
DIV R
7-BIT ADC
Figure 1.
TEST MUX
DEMODULATOR
CONTROL
CONTROL
RING
OSC
OSC
FSK/ASK
AGC
AFC
CLK
DIV
SYNCHRONIZER
CONTROL
OUT
CLK
DATA
Tx/Rx
SERIAL
PORT
CE
RxCLK
Tx/Rx DATA
CLKOUT
INT/LOCK
SLE
SDATA IN
SDATA OUT
SCLK
01975-PrG-001
Rev. PrH
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
The ADF7020 is a low power, highly integrated FSK/GFSK/
ASK/OOK/GASK transceiver designed for operation in the
license-free ISM bands at 433 MHz, 868 MHz, and 915 MHz. It
is suitable for circuit applications that meet either the European
ETSI-300-220 or the North American FCC (Part 15) regulatory
standards. A complete transceiver can be built using a small
number of external discrete components, making the ADF7020
very suitable for price-sensitive and area-sensitive applications.
The transmit section contains a VCO and low noise
fractional-N PLL with output resolution of <1 ppm. The VCO
operates at twice the fundamental frequency to reduce spurious
emissions and frequency pulling problems.
The transmitter output power is programmable in 0.3 dB steps
from −16 dBm to +13 dBm. The transceiver RF frequency,
channel spacing, and modulation are programmable using a
simple 3-wire interface. The device operates with a power
supply range of 2.3 V to 3.6 V and can be powered down when
not in use.
A low IF architecture is used in the receiver (200 kHz),
minimizing power consumption and the external component
count and avoiding interference problems at low frequencies.
The ADF7020 supports a wide variety of programmable
features including Rx linearity, sensitivity, and IF bandwidth,
allowing the user to trade off receiver sensitivity and selectivity
against current consumption, depending on the application. The
receiver also features a patent-pending automatic frequency
control (AFC) loop, allowing the PLL to track out the frequency
error in the incoming signal.
An on-chip ADC provides readback of an integrated temperature sensor, an external analog input, the battery voltage, or the
RSSI signal, which provides savings on an ADC in some
applications. The temperature sensor is accurate to ±5°C over
the full operating temperature range of −40°C to +85°C.
Rev. PrH | Page 3 of 40
ADF7020 Preliminary Technical Data
SPECIFICATIONS
VDD = 2.3 V to 3.6 V, GND = 0 V, TA = T
Typical specifications are at V
= 3 V, TA = 25°C.
DD
All measurements are performed using the test circuit in Figure TBD using PN9 data sequence, unless otherwise noted.
Table 1.
Parameter Min Typ Max Unit Test Conditions
RF CHARACTERISTICS
Frequency Ranges 862 928 MHz
Frequency Ranges (Divide-by-2 Mode) 433 464 MHz
Phase Frequency Detector Frequency RF/256 20 MHz
TRANSMISSION PARAMETERS
Chip Enabled to Regulator Ready TBD µs C
Crystal Oscillator Startup time 1 ms With 19.2 MHz XTAL
Tx to Rx Turnaround Time
LOGIC INPUTS
V
Input High Voltage 0.7 × V DD V
INH,
V
, Input Low Voltage 0.2 × V
INL
I
Input Current ±1 µA
INH/IINL,
350 µs +
(5 × T
)
BIT
V
DD
CIN, Input Capacitance 10 pF
Control Clock Input 50 MHz
LOGIC OUTPUTS
VOH,Output High Voltage
DV
DD
V I
−
0.4
VOL, Output Low Voltage 0.4 V IOL = 500 µA
CLK
Rise/Fall 5 ns
OUT
CLK
Load 10 pF
OUT
TEMPERATURE RANGE—TA −40 +85 °C
POWER SUPPLIES
Voltage Supply
AV
DV
DD
DD
2.3 3.6 V
AV
DD
AV
DD
Transmit Current Consumption
−20 dBm TBD mA
−10 dBm 12 mA VCO_BIAS_SETTING = 3
0 dBm 15 mA
10 dBm 22 mA
Receive Current Consumption
Low Current Mode 19 TBD mA
High Sensitivity Mode 21 TBD mA
Power-Down Mode
Low Power Sleep Mode
0.1 1 µA
1
Higher data rates are achievable depending on local regulations.
2
For definition of frequency deviation, see the R section. egister 2—Transmit Modulation Register (FSK Mode)
3
For definition of GFSK frequency deviation, see the R section. egister 2—Transmit Modulation Register (GFSK/GOOK Mode)
4
Measured as maximum unmodulated power. Output power varies with both supply and temperature.
5
For matching details, see the LN section. A/PA Matching
6
See Table 5 for description of different receiver modes.
7
See Table 5 for description of different receiver modes.
8
Follow the matching and layout guidelines to achieve the relevant FCC/ETSI specifications.
9
See the section. Image Rejection Calibration
Measured for a 10 MHz frequency step to
within 5 ppm accuracy,
PFD = 20 MHz, LBW = TBD
See the Reference Input Section
= 100 nF
REG
Time to synchronized data, includes AGC
settling
= 500 µA
OH
FRF = 915 MHz, V
= 3.0 V, PA is matched
DD
in to 50 Ω
Rev. PrH | Page 6 of 40
Preliminary Technical Data ADF7020
A
TIMING CHARACTERISTICS
VDD = 3 V ± 10%; VGND = 0 V, TA = 25°C, unless otherwise noted.
Guaranteed by design, but not production tested.
Table 2.
Parameter Limit at T
t
1
<10 ns SDATA to SCLK Setup Time
t2 <10 ns SDATA to SCLK Hold Time
t3 <25 ns SCLK High Duration
t4 <25 ns SCLK Low Duration
t5 <10 ns SCLK to SLE Setup Time
t6 <20 ns SLE Pulse Width
t
7
t
8
t
9
t
10
<TBD ns SLE to SCLK Setup Time, Readback
<TBD ns SCLK to SREAD Data Valid, Readback
<TBD ns SREAD Hold Time after SCLK, Readback
<TBD ns SCLK to SLE Disable Time, Readback
MIN
to T
MAX
Unit Test Conditions/Comments
SCLK
SDAT
SLE
t
1
DB31 (MSB)DB30DB2
t
1
SCLK
SDATA
REG7 DB0
(CONTROL BIT C1)
SLE
t
3
t
2
t
2
t
3
t
4
DB1
(CONTROL BIT C2)
Figure 2. Serial Interface Timing Diagram
DB0 (LSB)
(CONTROL BIT C1)
t
5
t
6
01975-PrG-002
t
10
SREAD
t
XRV16RV15RV2RV1
t
8
9
Figure 3. Readback Timing Diagram
01975-PrG-003
Rev. PrH | Page 7 of 40
ADF7020 Preliminary Technical Data
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter Rating
VDD to GND
Analog I/O Voltage to GND −0.3 V to AVDD + 0.3 V
Digital I/O Voltage to GND −0.3 V to DVDD + 0.3 V
Operating Temperature Range
Industrial (B Version) −40°C to +85°C
Storage Temperature Range −65°C to +125°C
Maximum Junction Temperature 125°C
MLF θJA Thermal Impedance
Lead Temperature Soldering
Vapor Phase (60 s) 235°C
Infrared (15 s) 240°C
1
−0.3 V to +5 V
TBD°C/W
1
GND = CPGND = RFGND = DGND = AGND = 0 V.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
This device is a high-performance RF integrated circuit with an
ESD rating of <2 kV and it is ESD sensitive. Proper precautions
should be taken for handling and assembly.
Rev. PrH | Page 8 of 40
Preliminary Technical Data ADF7020
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
CVCO
GND1
GND
VCO GND
GND
VDD
CPOUT
VREG3
VDD3
OSC1
OSC2
MUXOUT
VCOIN
VREG1
VDD1
RFOUT
RFGND
RFIN
RFINB
R
LNA
VDD4
RSET
VREG4
GND4
4847464544434241403938
PIN 1
1
INDICATOR
2
3
4
5
6
7
8
9
10
11
12
ADF7020
TOP VIEW
(Not to Scale)
37
36
CLKOUT
35
DATA CLK
34
DATA I/O
INT/LOCK
33
VDD2
32
VREG2
31
ADCIN
30
GND2
29
SCLK
28
SREAD
27
SDATA
26
SLE
25
1314151617181920212223
MIX_I
MIX_I
MIX_Q
GND4
FILT_I
FILT_I
MIX_Q
FILT_Q
GND4
FILT_Q
24
CE
TEST_A
01975-PrG-004
Figure 4. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Function
1 VCOIN
The tuning voltage on this pin determines the output frequency of the voltage controlled oscillator (VCO).
The higher the tuning voltage, the higher the output frequency.
2 VREG1
Regulator Voltage for PA Block. A 100 nF capacitor should be placed between this pin and ground for
regulator stability and noise rejection.
3 VDD1
Voltage Supply for PA Block. Decoupling capacitors (X7R or Tantalum) of 0.1 µF and 0.01 µF should be placed
as close as possible to this pin.
4 RFOUT
The modulated signal is available at this pin. Output power levels are from −20 dBm to +13 dBm. The output
should be impedance matched to the desired load using suitable components. See the Transmitter section.
5 RFGND Ground for Output Stage of Transmitter.
6 RFIN
LNA Input for Receiver Section. Input matching is required between the antenna and the differential LNA
input to ensure maximum power transfer. See the LNA/PA Matching section.
7 RFINB Complementary LNA Input. See the LNA/PA Matching section.
8 R
External bias resistor for LNA. Optimum resistor is 1.1 kΩ with 5% tolerance.
LNA
9 VDD4 Voltage supply for LNA/MIXER block. This pin should be decoupled to ground with a 0.01 µF capacitor.
10 RSET External Resistor to Set Charge Pump Current and Some Internal Bias Currents. Use 3.6 kΩ with 5% tolerance.
11 VREG4
Regulator Voltage for LNA/MIXER block. A 100 nF capacitor should be placed between this pin and GND for
regulator stability and noise rejection.
12 GND4 Ground for LNA/MIXER block.
13–18 MIX/FILT
Signal Chain Test Pins. These pins are high impedance under normal conditions and should be left
Signal Chain Test Pins. These pins are high impedance under normal conditions and should be left
unconnected.
24 CE
Chip Enable. Bringing CE low puts the ADF7020 into complete power-down. Register values are lost when CE
is low, and the part must be reprogrammed once CE is brought high.
25 SLE
Load Enable, CMOS Input. When LE goes high, the data stored in the shift registers is loaded into one of the
four latches. A latch is selected using the control bits.
26 SDATA
Serial Data Input. The serial data is loaded MSB first with the two LSBs as the control bits. This pin is a high
impedance CMOS input.
27 SREAD
Serial Data Output. This pin is used to feed readback data from the ADF7020 to the microcontroller. The SCLK
input is used to clock each readback bit (AFC, ADC readback) from the SREAD pin.
28 SCLK
Serial Clock Input. This serial clock is used to clock in the serial data to the registers. The data is latched into
the 24-bit shift register on the CLK rising edge. This pin is a digital CMOS input.
Rev. PrH | Page 9 of 40
ADF7020 Preliminary Technical Data
Pin No. Mnemonic Function
29 GND2 Ground for Digital Section.
30 ADCIN
31 VREG2
32 VDD2
33 INT/LOCK
34 DATA I/O Transmit Data Input/Received Data Output. This is a digital pin and normal CMOS levels apply.
35 DATA CLK
36 CLKOUT
37 MUXOUT
38 OSC2
39 OSC1 The reference crystal should be connected between this pin and OSC2.
40 VDD3
41 VREG3
42 CPOUT
43 VDD Voltage Supply for VCO Tank Circuit. This pin should be decoupled to ground with a 0.01 µF capacitor.
44–47 GND Grounds for VCO Block.
48 CVCO A 22 nF capacitor should be placed between this pin and VREG1 to reduce VCO noise.
Analog-to-Digital Converter Input. The internal 7-bit ADC can be accessed through this pin. Full scale is 0 to
1.9 V. Readback is made using the SREAD pin.
Regulator Voltage for Digital Block. A 100 nF capacitor should be placed between this pin and ground for
regulator stability and noise rejection.
Voltage Supply for Digital Block. A decoupling capacitor (X7R or Tantalum) of 0.01 µF should be placed as
close as possible to this pin.
Bidirectional Pin. In output mode (INTerrupt mode), the ADF7020 asserts the INT/ LOCK pin when it has found
a match for the preamble sequence.
In input mode (lock mode), the microcontroller can be used to lock the demodulator threshold when a valid
preamble has been detected. Once the threshold is locked, NRZ data can be reliably received. In this mode, a
demod lock can be asserted with minimum delay.
In receive mode, the pin outputs the synchronized data clock. The positive clock edge is matched to the
center of the received data.
In GFSK transmit mode, the pin outputs an accurate clock to latch the data from the microcontroller into the
transmit section at the exact required data rate. See the Gaussian Frequency Shift Keying (GFSK) section.
A Divided-Down Version of the Crystal Reference with Output Driver. The digital clock output can be used to
drive several other CMOS inputs such as a microcontroller clock. The output has a 50:50 mark-space ratio.
This pin provides the Lock_Detect signal, which is used to determine if the PLL is locked to the correct
frequency. Other signals include Regulator_Ready, which is an indicator of the status of the serial interface
regulator.
The reference crystal should be connected between this pin and OSC1. A TCXO reference can be used by
driving this pin with CMOS levels and disabling the crystal oscillator.
Voltage Supply for the Charge Pump and PLL Dividers. This pin should be decoupled to ground with a
0.01 µF capacitor.
Regulator Voltage for Charge Pump and PLL Dividers. A 100 nF capacitor should be placed between this pin
and ground for regulator stability and noise rejection.
Charge Pump Output. This output generates current pulses that are integrated in the loop filter. The
integrated current changes the control voltage on the input to the VCO.
Rev. PrH | Page 10 of 40
Preliminary Technical Data ADF7020
A
T
FREQUENCY SYNTHESIZER
REFERENCE INPUT SECTION
The on-board crystal oscillator circuitry (Figure 5) can use an
inexpensive quartz crystal as the PLL reference. The oscillator
circuit is enabled by setting R1_DB12 high. It is enabled by
default on power-up and is disabled by bringing CE low. Errors
in the crystal can be corrected using the automatic frequency
control (see the AFC Section) feature or by adjusting the
fractional-N value (see the N Counter section). A single-ended
reference (TCXO, CXO) can also be used. The CMOS levels
should be applied to OSC2 with R1_DB12 set low.
R Counter
The 3-bit R counter divides the reference input frequency by an
integer from 1 to 7. The divided-down signal is presented as the
reference clock to the phase frequency detector (PFD). The
divide ratio is set in Register 1. Maximizing the PFD frequency
reduces the N value. This reduces the noise multiplied at a rate
of 20 log(N) to the output, as well as reducing occurrences of
spurious components. The R Register defaults to R = 1 on
power-up:
PFD [Hz] = XTAL/R
MUXOUT and Lock Detect
OSC1
Figure 5. Oscillator Circuit on the ADF7020
OSC2
CP1CP2
01975-PrG-005
Two parallel resonant capacitors are required for oscillation at
the correct frequency; their values are dependent on the crystal
specification. They should be chosen so that the series value of
capacitance added to the PCB track capacitance adds up to the
load capacitance of the crystal, usually 20 pF. Track capacitance
values vary from 2 pF to 5 pF, depending on board layout.
Where possible, choose capacitors that have a very low
temperature coefficient to ensure stable frequency operation
over all conditions.
CLKOUT Divider and Buffer
The CLKOUT circuit takes the reference clock signal from the
oscillator section, shown in Figure 5, and supplies a divideddown 50:50 mark-space signal to the CLKOUT pin. An even
divide from 2 to 30 is available. This divide number is set in
R1_DB(8:11). On power-up, the CLKOUT defaults to
divide-by-8.
DV
DD
CLK
OUT
ENABLE BIT
OSC1
DIVIDER
1 TO 15
÷2
Figure 6. CLK
OUT
Stage
CLK
OUT
01975-PrG-006
To disable CLKOUT, set the divide number to 0. The output
buffer can drive up to a 20 pF load with a 10% rise time at
4.8 MHz. Faster edges can result in some spurious feedthrough
to the output. A small series resistor (50 Ω) can be used to slow
the clock edges to reduce these spurs at F
CLK
.
The MUXOUT pin allows the user to access various digital
points in the ADF7020. The state of MUXOUT is controlled by
Bits R0_DB(29:31).
Regulator Ready
REGULATOR READY is the default setting on MUXOUT after
the transceiver has been powered up. The power-up time of the
regulator is typically 50 µs. Because the serial interface is
powered from the regulator, the regulator must be at its nominal
voltage before the ADF7020 can be programmed. The status of
the regulator can be monitored at MUXOUT. When the
REGULATOR READY signal on MUXOUT is high,
programming of the ADF7020 can begin.
DV
DD
REGULATOR READY
DIGITAL LOCK DETECT
NALOG LOCK DETEC
R COUNTER OUTPUT
N COUNTER OUTPUT
PLL TEST MODES
Σ-∆ TEST MODES
MUXCONTROL
Figure 7. MUXOUT Circuit
DGND
MUXOUT
01975-PrG-007
Digital Lock Detect
Digital lock detect is active high. The lock detect circuit is
located at the PFD. When the phase error on five consecutive
cycles is less than 15 ns, lock detect is set high. Lock detect
remains high until 25 ns phase error is detected at the PFD.
Because no external components are needed for digital lock
detect, it is more widely used than analog lock detect.
Rev. PrH | Page 11 of 40
ADF7020 Preliminary Technical Data
Analog Lock Detect
This N-channel open-drain lock detect should be operated with
an external pull-up resistor of 10 kΩ nominal. When a lock has
been detected, this output is high with narrow low-going pulses.
Voltage Regulators
The ADF7020 contains four regulators to supply stable voltages
to the part. The nominal regulator voltage is 2.3 V. Each
regulator should have a 100 nF capacitor connected between
VREG and GND. When CE is high, the regulators and other
associated circuitry are powered on, drawing a total supply
current of 2 mA. Bringing the chip-enable pin low disables the
regulators, reduces the supply current to less than 1 µA, and
erases all values held in the registers. The serial interface
operates off a regulator supply; therefore, to write to the part,
the user must have CE high and the regulator voltage must be
stabilized. Regulator status (VREG4) can be monitored using
the regulator ready signal from MUXOUT.
Loop Filter
For GFSK, it is recommended that an LBW of 2.0 to 2.5 times
the data rate be used to ensure that sufficient samples are taken
of the input data while filtering system noise. The free design
tool ADIsimPLL can be used to design loop filters for the
ADF7020.
N Counter
The feedback divider in the ADF7020 PLL consists of an 8-bit
integer counter and a 14-bit Σ-∆ fractional-N divider. The
integer counter is the standard pulse-swallow type common in
PLLs. This sets the minimum integer divide value to 31. The
fractional divide value gives very fine resolution at the output,
where the output frequency of the PLL is calculated as
F
REFERENCE IN
OUT
=
4R
XTAL
R
CHARGE
PFD/
PUMP
× (Integer-N +
-NFractional
)
14
2
VCO
The loop filter integrates the current pulses from the charge
pump to form a voltage that tunes the output of the VCO to the
desired frequency. It also attenuates spurious levels generated by
the PLL. A typical loop filter design is shown in Figure 8.
CHARGE
PUMP OUT
Figure 8. Typical Loop Filter Configuration
VCO
01975-PrG-008
In FSK, the loop should be designed so that the loop bandwidth
(LBW) is approximately five times the data rate. Widening the
LBW excessively reduces the time spent jumping between
frequencies, but can cause insufficient spurious attenuation.
For ASK systems, a wider LBW is recommended. The sudden
large transition between two power levels might result in VCO
pulling and can cause a wider output spectrum than is desired.
By widening the LBW to more than 10 times the data rate, the
amount of VCO pulling is reduced, because the loop settles
quickly back to the correct frequency. The wider LBW might
restrict the output power and data rate of ASK-based systems
compared with FSK-based systems.
Narrow-loop bandwidths can result in the loop taking long
periods of time to attain lock. Careful design of the loop filter is
critical to obtaining accurate FSK/GFSK modulation.
4N
THIRD-ORDER
Σ-∆ MODULATOR
INTEGER-NFRACTIONAL-N
Figure 9. Fractional-N PLL
01975-PrG-009
The combination of the integer-N (maximum = 255) and the
fractional-N (maximum = 16383/16384) give a maximum N
divider of 255 + 1. Therefore, the minimum usable PFD is
PDF
[Hz] = Maximum Required Output Frequency/(255 + 1)
MIN
For example, when operating in the European 868 MHz to
870 MHz band, PFD
equals 3.4 MHz.
MIN
Voltage Controlled Oscillator (VCO)
To minimize spurious emissions, the on-chip VCO operates
from 1732 MHz to 1856 MHz. The VCO signal is then divided
by 2 to give the required frequency for the transmitter and the
required LO frequency for the receiver.
The VCO should be recentered, depending on the required
frequency of operation, by programming the VCO adjust bits
R1_DB(20:21).
The VCO is enabled as part of the PLL by the PLL-enable bit,
R0_DB28.
A further frequency divide-by-2 is included to allow operation
in the lower 433 MHz and 460 MHz bands. To enable operation
in the these bands, R1_DB13 should be set to 1. The VCO needs
an external 22 nF between the VCO and the regulator to reduce
internal noise.
Rev. PrH | Page 12 of 40
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