ANALOG DEVICES ADF4360-2 Service Manual

Integrated Synthesizer and VCO

FEATURES

Output frequency range: 1850 MHz to 2170 MHz
Divide-by-2 output

3.0 V to 3.6 V power supply

1.8 V logic compatibility
Integer-N synthesizer
Programmable dual-modulus prescaler 8/9, 16/17, 32/33
Programmable output power level
3-wire serial interface
Analog and digital lock detect
Hardware and software power-down mode

APPLICATIONS

Wireless handsets (DECT, GSM, PCS, DCS, WCDMA)
Test equipment
Wireless LANs
CATV equipment

FUNCTIONAL BLOCK DIAGRAM

AV

DD

ADF4360-2

REF

CLK

DATA

IN

LE

14-BIT R

COUNTER

24-BIT

DATA REGISTER

24-BIT

FUNCTION

LATCH

DV

DD

ADF4360-2

GENERAL DESCRIPTION

The ADF4360-2 is a fully integrated integer-N synthesizer
and voltage-controlled oscillator (VCO). The ADF4360-2 is
designed for a center frequency of 2000 MHz. In addition, a
divide-by-2 option is available, whereby the user gets an RF
output of between 925 MHz and 1085 MHz.

Control of all the on-chip registers is through a simple 3-wire
interface. The device operates with a power supply ranging
from 3.0 V to 3.6 V and can be powered down when not in use.

CE

R

SET

MUXOUT

CP

V

VCO

V

TUNE

C

C

C

N

LOCK

DETECT

PHASE

COMPARATOR

MULTIPLEXER

CHARGE

PUMP

MUTE

INTEGER

REGISTER

13-BIT B

COUNTER

PRESCALER

P/P+1

N = (BP + A)

LOAD
LOAD

5-BIT A

COUNTER

AGND DGND CPGND

Rev. B

Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.

RF

A

OUT

RF

OUT

04436-001

B

MULTIPLEXER

DIVSEL = 1

DIVSEL = 2

VCO

CORE

OUTPUT

STAGE

÷2

Figure 1.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: [phone] www.analog.com
Fax: [phone] ©2006 Analog Devices, Inc. All rights reserved.

ADF4360-2

TABLE OF CONTENTS

Features .............................................................................................. 1

MUXOUT and Lock Detect...................................................... 10

Applications....................................................................................... 1

General Description......................................................................... 1

Functional Block Diagram .............................................................. 1

Revision History ............................................................................... 2

Specifications..................................................................................... 3

Timing Characteristics..................................................................... 5

Absolute Maximum Ratings............................................................ 6

Transi s t o r Cou n t ........................................................................... 6

ESD Caution.................................................................................. 6

Pin Configuration and Function Descriptions............................. 7

Typical Performance Characteristics ............................................. 8

Circuit Description........................................................................... 9

Reference Input Section............................................................... 9

Prescaler (P/P + 1)........................................................................ 9

A and B Counters ......................................................................... 9

Input Shift Register .................................................................... 10

VCO ............................................................................................. 10

Output Stage................................................................................ 11

Latch Structure ........................................................................... 12

Power-Up..................................................................................... 16

Control Latch.............................................................................. 18

N Counter Latch......................................................................... 19

R Counter Latch ......................................................................... 19

Applications..................................................................................... 20

Direct Conversion Modulator .................................................. 20

Fixed Frequency LO................................................................... 21

Interfacing ................................................................................... 21

PCB Design Guidelines for Chip Scale Package........................... 22

Output Matching........................................................................ 22

Outline Dimensions ....................................................................... 23

R Counter ...................................................................................... 9

PFD and Charge Pump................................................................ 9

REVISION HISTORY

4/06—Rev. A to Rev. B

Updated Format..................................................................Universal

Changes to Features and General Description ............................. 1

Changes to Table 1............................................................................ 3

Changes to VCO Section............................................................... 11

Changes to Control Latch Section................................................ 18

Changes to Direct Conversion Modulator Section.................... 20

Changes to Ordering Guide.......................................................... 23

Ordering Guide .......................................................................... 23

12/04—Rev. 0 to Rev. A

Updated Format.................................................................. Universal

Changes to Specifications.................................................................3

Changes to Timing Characteristics.................................................5

Changes to Power-Up Section ...................................................... 16

Added Table 10 ............................................................................... 16

Added Figure 16 ............................................................................. 16

Changes to Ordering Guide.......................................................... 23

Updated Outline Dimensions....................................................... 23

1/04—Revision 0: Initial Version

Rev. B | Page 2 of 24

ADF4360-2

SPECIFICATIONS

AVDD = DVDD = V

Table 1.

Parameter B Version Unit Conditions/Comments

REFIN CHARACTERISTICS

REFIN Input Frequency 10/250 MHz min/max

REFIN Input Sensitivity 0.7/AV
0 to AVDD V max CMOS-compatible
REFIN Input Capacitance 5.0 pF max
REFIN Input Current ±100 μA max

PHASE DETECTOR

Phase Detector Frequency2 8 MHz max

CHARGE PUMP

ICP Sink/Source3 With R

High Value 2.5 mA typ
Low Value 0.312 mA typ
R

Range 2.7/10 kΩ

SET

ICP Three-State Leakage Current 0.2 nA typ
Sink and Source Current Matching 2 % typ 1.25 V ≤ VCP ≤ 2.5 V
ICP vs. VCP 1.5 % typ 1.25 V ≤ VCP ≤ 2.5 V
ICP vs. Temperature 2 % typ VCP = 2.0 V

LOGIC INPUTS

V

, Input High Voltage 1.5 V min

INH

V

, Input Low Voltage 0.6 V max

INL

I

, Input Current ±1 μA max

INH/IINL

CIN, Input Capacitance 3.0 pF max

LOGIC OUTPUTS

VOH, Output High Voltage DVDD − 0.4 V min CMOS output chosen
IOH, Output High Current 500 μA max
VOL, Output Low Voltage 0.4 V max IOL = 500 μA

POWER SUPPLIES

AVDD 3.0/3.6 V min/V max
DVDD AV
V

AV

VCO

4

AI

DD

4

DI

DD

4, 5

I

VCO

4, 5

I

VCO

4

I

RFOUT

Low Power Sleep Mode

VCO

1

= 3.3 V ± 10%; AGND = DGND = 0 V; TA = T

DD

DD

DD

10 mA typ

2.5 mA typ

24.0 mA typ I

29.0 mA typ I

3.5 to 11.0 mA typ RF output stage is programmable

4

7 μA typ

MIN

to T

, unless otherwise noted.

MAX

For f < 10 MHz, use a CMOS-compatible
square wave, slew rate > 21 V/μs

V p-p min/max AC-coupled

= 4.7 kΩ

SET

= 15 mA

CORE

= 20 mA

CORE

Rev. B | Page 3 of 24

ADF4360-2

Parameter B Version Unit Conditions/Comments

RF OUTPUT CHARACTERISTICS

VCO Output Frequency 1850/2170 MHz min/max I
I
VCO Sensitivity 57 MHz/V typ
Lock Time

6

Frequency Pushing (Open Loop) 6 MHz/V typ
Frequency Pulling (Open Loop) 15 kHz typ Into 2.00 VSWR load
Harmonic Content (Second) −19 dBc typ
Harmonic Content (Third) −37 dBc typ
Output Power

5, 7

Output Power Variation ±3 dB typ For tuned loads, see the Output Matching section
VCO Tuning Range 1.25/2.7 V min/max

NOISE CHARACTERISTICS

VCO Phase-Noise Performance

−133 dBc/Hz typ @ 1 MHz offset from carrier

−141 dBc/Hz typ @ 3 MHz offset from carrier

−147 dBc/Hz typ @ 10 MHz offset from carrier
Synthesizer Phase-Noise Floor9 −172 dBc/Hz typ @ 25 kHz PFD frequency

−163 dBc/Hz typ @ 200 kHz PFD frequency

−147 dBc/Hz typ @ 8 MHz PFD frequency
In-Band Phase Noise
RMS Integrated Phase Error12 0.64 Degrees typ 100 Hz to 100 kHz
Spurious Signals due to PFD Frequency
Level of Unlocked Signal with MTLD Enabled −42 dBm typ

1

Operating temperature range is −40°C to +85°C.

2

Guaranteed by design. Sample tested to ensure compliance.

3

ICP is internally modified to maintain constant loop gain over the frequency range.

4

TA = 25°C; AVDD = DVDD = V

5

For RF > 2 GHz, these characteristics are guaranteed only for VCO core power = 15 mA. For frequencies < 2 GHz, these characteristics are guaranteed only for VCO core

power = 20 mA.

6

Jumping from 2.0 GHz to 2.17 GHz. PFD frequency = 200 kHz; loop bandwidth = 10 kHz.

7

Using 50 Ω resistors to V

8

The noise of the VCO is measured in open-loop conditions.

9

The synthesizer phase-noise floor is estimated by measuring the in-band phase noise at the output of the VCO and subtracting 20 log N (where N is the N divider value).

10

The phase noise is measured with the EVAL-ADF4360-xEB1 Evaluation Board and the HP8562E spectrum analyzer. The spectrum analyzer provides the REFIN for the

synthesizer; offset frequency = 1 kHz.

11

f

= 10 MHz; f

REFIN

12

f

= 10 MHz; f

REFIN

13

The spurious signals are measured with the EVAL-ADF4360-xEB1 Evaluation Board and the HP8562E spectrum analyzer. The spectrum analyzer provides the REFIN for

the synthesizer; f

VCO

= 200 kHz; N = 10000; Loop B/W = 10 kHz.

PFD

= 1 MHz; N = 2000; Loop B/W = 25 kHz.

PFD

= 10 MHz @ 0 dBm.

REFOUT

5

400 μs typ To within 10 Hz of final frequency

−13/−6 dBm typ Programmable in 3 dB steps (see Tabl e 7)

5

8

10, 11

11, 13

= 3.3 V; P = 32.

VCO

into a 50 Ω load. For tuned loads, see the Output Matching section.

−110 dBc/Hz typ @ 100 kHz offset from carrier

−83 dBc/Hz typ @ 1 kHz offset from carrier

−70 dBc typ

= 20 mA, RF < 2 GHz

CORE

= 15 mA, RF > 2 GHz

CORE

Rev. B | Page 4 of 24

ADF4360-2

K

TIMING CHARACTERISTICS

AVDD = DVDD = V

Table 2.

Parameter Limit at T

t1 20 ns min LE Setup Time
t2 10 ns min DATA to CLOCK Setup Time
t3 10 ns min DATA to CLOCK Hold Time
t4 25 ns min CLOCK High Duration
t5 25 ns min CLOCK Low Duration
t6 10 ns min CLOCK to LE Setup Time
t7 20 ns min LE Pulse Width

1

See the Power-Up section for the recommended power-up procedure for this device.

= 3.3 V ± 10%; AGND = DGND = 0 V; 1.8 V and 3 V logic levels used; TA = T

VCO

to T

MIN

1

to T

MIN

(B Version) Unit Test Conditions/Comments

MAX

, unless otherwise noted.

MAX

CLOC

DATA

t

2

DB23 (MSB) DB22 DB2

LE

t

1

LE

t

t

4

3

t

5

DB1

(CONTROL BIT C2)

DB0 (LSB)

(CONTROL BIT C1)

t

6

t

7

04436-002

Figure 2. Timing Diagram

Rev. B | Page 5 of 24

ADF4360-2

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 3.

Parameter Rating

AVDD to GND
AVDD to DVDD −0.3 V to +0.3 V
V

to GND −0.3 V to +3.9 V

VCO

V

to AVDD −0.3 V to +0.3 V

VCO

Digital I/O Voltage to GND −0.3 V to VDD + 0.3 V
Analog I/O Voltage to GND −0.3 V to VDD + 0.3 V
REFIN to GND −0.3 V to VDD + 0.3 V
Operating Temperature

Maximum Junction Temperature 150°C

CSP θJA Thermal Impedance

Paddle Soldered 50°C/W
Paddle Not Soldered 88°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C

1

GND = AGND = DGND = 0 V.

1

−0.3 V to +3.9 V

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those included in the operational

sections of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

This device is a high performance RF integrated circuit with an

ESD rating of <1 kV; it is ESD sensitive. Proper precautions

should be taken for handling and assembly.

TRANSISTOR COUNT

12,543 (CMOS) and 700 (Bipolar).

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.

Rev. B | Page 6 of 24

ADF4360-2

T

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

DD

21

PIN 1
IDENTIFIER

ADF4360-2

TOP VIEW

(Not to Scale)

AGND8AGND9AGND10AGND

MUXOU

20LE19

11

18

DATA

CLK

17

REF

16

IN

DGND

15

C

14

N

R

13

SET

12

C

C

04436-003

CPGND

AV

AGND

RF

OUT

RF

OUT

V

VCO

CP24CE23AGND22DV

1

2

DD

3

A

4

B

5

6

7

TUNE

V

Figure 3. Pin Configuration

Table 4. Pin Function Descriptions

Pin No. Mnemonic Descriptions

1 CPGND Charge Pump Ground. This is the ground return path for the charge pump.
2 AVDD

Analog Power Supply. This ranges from 3.0 V to 3.6 V. Decoupling capacitors to the analog ground plane
should be placed as close as possible to this pin. AV

must have the same value as DVDD.

DD

3, 8 to 11, 22 AGND Analog Ground. This is the ground return path of the prescaler and VCO.
4 RF

OUT

A

VCO Output. The output level is programmable from −6 dBm to −13 dBm. See the

Output Matching section

for a description of the various output stages.

5 RF

OUT

B

VCO Complementary Output. The output level is programmable from −6 dBm to −13 dBm. See the
Output Matching section for a description of the various output stages.

6 V

7 V

VCO

TUNE

Power Supply for the VCO. This ranges from 3.0 V to 3.6 V. Decoupling capacitors to the analog ground plane
should be placed as close as possible to this pin. V

must have the same value as AVDD.

VCO

Control Input to the VCO. This voltage determines the output frequency and is derived from filtering the CP

output voltage.
12 CC Internal Compensation Node. This pin must be decoupled to ground with a 10 nF capacitor.
13 R

14 C

SET

N

Connecting a resistor between this pin and CP

synthesizer. The nominal voltage potential at the R

CPmax

where R

=

= 4.7 kΩ, I

SET

R

SET

= 2.5 mA.

CPmax

7511I.

Internal Compensation Node. This pin must be decoupled to V

sets the maximum charge pump output current for the

GND

pin is 0.6 V. The relationship between ICP and R

SET

with a 10 μF capacitor.

VCO

15 DGND Digital Ground.
16 REFIN

Reference Input. This is a CMOS input with a nominal threshold of V

100 kΩ. See
17 CLK

Serial Clock Input. This serial clock is used to clock in the serial data to the registers. The data is latched into

Figure 10. This input can be driven from a TTL or CMOS crystal oscillator, or it can be ac-coupled.

/2 and a dc equivalent input resistance of

DD

the 24-bit shift register on the CLK rising edge. This input is a high impedance CMOS input.
18 DATA

Serial Data Input. The serial data is loaded MSB first with the two LSBs being the control bits. This input is a

high impedance CMOS input.
19 LE

Load Enable, CMOS Input. When LE goes high, the data stored in the shift registers is loaded into one of the

four latches, and the relevant latch is selected using the control bits.
20 MUXOUT

This multiplexer output allows either the lock detect, the scaled RF, or the scaled reference frequency to be

accessed externally.
21 DVDD

23 CE

Digital Power Supply. This ranges from 3.0 V to 3.6 V. Decoupling capacitors to the digital ground plane

should be placed as close as possible to this pin. DV

must have the same value as AVDD.

DD

Chip Enable. A logic low on this pin powers down the device and puts the charge pump into three-state

mode. Taking the pin high powers up the device depending on the status of the power-down bits.
24 CP

Charge Pump Output. When enabled, this provides ± I

to the external loop filter, which in turn drives the

CP

internal VCO.

SET

is

Rev. B | Page 7 of 24

ADF4360-2

TYPICAL PERFORMANCE CHARACTERISTICS

0
–10

–20
–30
–40
–50

–60
–70
–80
–90

–100
–110
–120

OUTPUT POWER (dB)

–130
–140

–150
–160
–170

1k 10M1M100k10k

1

2

FREQUENCY OFFSET (Hz)

3

4

04436-004

Figure 4. Open-Loop VCO Phase Noise

–70

–75

–80

–85
–90

–95

–100

–105

–110
–115
–120

–125

OUTPUT POWER (dB)

–130
–135

–140

–145
–150

100 10M1M100k10k1k

FREQUENCY OFFSET (Hz)

04436-005

Figure 5. VCO Phase Noise, 2000 MHz, 200 kHz PFD, 10 kHz Loop Bandwidth

–70

–75

–80

–85
–90

–95

–100

–105

–110
–115
–120

–125

OUTPUT POWER (dB)

–130
–135

–140

–145
–150

100 10M1M100k10k1k

FREQUENCY OFFSET (Hz)

04436-006

Figure 6. VCO Phase Noise, 1000 MHz,

Divide-by-2 Enabled 200 kHz PFD, 10 kHz Loop Bandwidth

0

VDD = 3V, V

–10

I

= 2.5mA

CP

PFD FREQUENCY = 200kHz

–20

LOOP BANDWIDTH = 10kHz
RES. BANDWIDTH = 30Hz

–30

VIDEO BANDWIDTH = 30Hz
SWEEP = 1.9SECONDS
AVERAGES = 10

–40

–50

–60

–70

OUTPUT POWER (dB)

–80

–90

–2kHz –1kHz 2000MHz 1kHz 2kHz

VCO

= 3V

–84.0dBc/Hz

04436-007

Figure 7. Close-In Phase Noise at 2000 MHz (200 kHz Channel Spacing)

0

VDD = 3V, V

–10

I

= 2.5mA

CP

PFD FREQUENCY = 200kHz

–20

LOOP BANDWIDTH = 10kHz
RES. BANDWIDTH = 3kHz

–30

VIDEO BANDWIDTH = 3kHz
SWEEP = 140ms
AVERAGES = 100

–40

–50

–60

–70

OUTPUT POWER (dB)

–80

–90

–200kHz –100kHz 2000MHz 100kHz 200kHz

VCO

= 3V

–79.5dBc

04436-008

Figure 8. Reference Spurs at 2000 MHz

(200 kHz Channel Spacing, 10 kHz Loop Bandwidth)

0

VDD = 3V, V

–10

I

= 2.5mA

CP

PFD FREQUENCY = 1MHz

–20

LOOP BANDWIDTH = 25kHz
RES. BANDWIDTH = 30kHz

–30

VIDEO BANDWIDTH = 30kHz
SWEEP = 50ms
AVERAGES = 100

–40

–50

–60

–70

OUTPUT POWER (dB)

–80

–90

–1MHz –0.5MHz 2000MHz 0.5MHz 1MHz

VCO

= 3V

–83.8dBc/Hz

04436-009

Figure 9. Reference Spurs at 2000 MHz

(1 MHz Channel Spacing, 25 kHz Loop Bandwidth)

Rev. B | Page 8 of 24