Output frequency range: 2400 MHz to 2725 MHz
Divide-by-2 output
3.0 V to 3.6 V power supply
1.8 V logic compatibility
Integer-N synthesizer
Programmable dual-modulus prescaler 16/17, 32/33
Programmable output power level
3-wire serial interface
Analog and digital lock detect
Hardware and software power-down mode
The ADF4360-0 is a fully integrated integer-N synthesizer and
voltage controlled oscillator (VCO). The ADF4360-0 is designed
for a center frequency of 2600 MHz. In addition, a divide-by-2
option is available, whereby the user gets an RF output of between 1200 MHz and 1360 MHz.
Control of all the on-chip registers is through a simple 3-wire
interface. The device operates with a power supply ranging from
3.0 V to 3.6 V and can be powered down when not in use.
CE
PHASE
R
SET
MULTIPLEXER
CHARGE
PUMP
MUTE
MUXOUT
CP
V
VCO
V
TUNE
C
C
C
N
DD
LOCK
DETECT
COMPARATOR
INTEGER
REGISTER
13-BIT B
COUNTER
PRESCALER
P/P+1
N = (BP + A)
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
LOAD
LOAD
5-BIT A
COUNTER
AGNDDGNDCPGND
MULTIPLEXER
Figure 1.
RF
A
OUT
RF
OUT
04644-0-001
B
DIVSEL = 1
DIVSEL = 2
VCO
CORE
OUTPUT
STAGE
÷2
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
REFIN Input Sensitivity 0.7/AV
0 to AVDD V max CMOS compatible.
REFIN Input Capacitance 5.0 pF max
REFIN Input Current ±100 µA max
PHASE DETECTOR
Phase Detector Frequency2 8 MHz max
CHARGE PUMP
ICP Sink/Source3 With R
High Value 2.5 mA typ
Low Value 0.312 mA typ
R
Range 2.7/10 kΩ
SET
ICP Three-State Leakage Current 0.2 nA typ
Sink and Source Current Matching 2 % typ 1.25 V ≤ VCP ≤ 2.5 V.
ICP vs. VCP 1.5 % typ 1.25 V ≤ VCP ≤ 2.5 V.
ICP vs. Temperature 2 % typ VCP = 2.0 V.
LOGIC INPUTS
V
, Input High Voltage 1.5 V min
INH
V
, Input Low Voltage 0.6 V max
INL
I
, Input Current ±1 µA max
INH/IINL
CIN, Input Capacitance 3.0 pF max
LOGIC OUTPUTS
VOH, Output High Voltage DVDD – 0.4 V min CMOS output chosen.
IOH, Output High Current 500 µA max
VOL, Output Low Voltage 0.4 V max IOL = 500 µA.
POWER SUPPLIES
AVDD 3.0/3.6 V min/V max
DVDD AV
V
AV
VCO
4
AI
DD
4
DI
DD
, 5
4
I
VCO
4
I
RFOUT
Low Power Sleep Mode4 7 µA typ
RF OUTPUT CHARACTERISTICS5
VCO Output Frequency 2400/2725 MHz min/max I
VCO Sensitivity 56 MHz/V typ
Lock Time
Frequency Pushing (Open Loop) 1 MHz/V typ
Frequency Pulling (Open Loop) 15 kHz typ Into 2.00 VSWR load.
Harmonic Content (Second) −30 dBc typ
Harmonic Content (Third) −39 dBc typ
Output Power
Output Power Variation ±3 dB typ For tuned loads, see Output Matching section.
VCO Tuning Range 1.25/2.50 V min/max
VCO Tuning Port Leakage Current 0.2 nA typ
VCO
6
5, 7
1
= 3.3 V ± 10%; AGND = DGND = 0 V; TA = T
DD
DD
DD
10 mA typ
2.5 mA typ
19.0 mA typ I
3.5 to 11.0 mA typ RF output stage is programmable.
250 µs typ To within 10 Hz of final frequency.
−13/−6.5 dBm typ Programmable in 3 dB steps. See Table 7.
MIN
to T
, unless otherwise noted.
MAX
For f < 10 MHz, use dc-coupled
CMOS compatible square wave, slew rate > 21 V/µs.
V p-p min/max AC-coupled.
= 4.7 kΩ.
SET
= 10 mA.
CORE
= 15 mA.
CORE
Rev. 0 | Page 3 of 20
ADF4360-0
Parameter B Version Unit Conditions/Comments
NOISE CHARACTERISTICS5
VCO Phase Noise Performance
−133 dBc/Hz typ @ 1 MHz offset from carrier.
−140 dBc/Hz typ @ 3 MHz offset from carrier.
−145 dBc/Hz typ @ 10 MHz offset from carrier.
Synthesizer Phase Noise Floor
RMS Integrated Phase Error12 1.4 Degrees typ 100 Hz to 100 kHz.
Spurious Signals due to PFD Frequency
Level of Unlocked Signal with MTLD Enabled −45 dBm typ
1
Operating temperature range is: –40°C to +85°C.
2
Guaranteed by design. Sample tested to ensure compliance.
3
ICP is internally modified to maintain constant loop gain over the frequency range.
4
TA = 25°C; AVDD = DVDD = V
5
These characteristics are guaranteed for VCO core power = 10 mA.
6
Jumping from 2.4 GHz to 2.725 GHz. PFD frequency = 200 kHz; loop bandwidth = 10 kHz.
7
Using 50 Ω resistors to V
8
The noise of the VCO is measured in open-loop conditions.
9
The synthesizer phase noise floor is estimated by measuring the in-band phase noise at the output of the VCO and subtracting 20 log N (where N is the N divider value).
10
The phase noise is measured with the EVAL-ADF4360-xEB1 Evaluation Board and the HP8562E Spectrum Analyzer. The spectrum analyzer provides the REFIN for the
synthesizer; offset frequency = 1 kHz.
11
f
= 10 MHz; f
REFIN
12
f
= 10 MHz; f
REFIN
13
The spurious signals are measured with the EVAL-ADF4360-xEB1 Evaluation Board and the HP8562E Spectrum Analyzer. The spectrum analyzer provides the REFIN for
the synthesizer; f
VCO
, into a 50 Ω load. For tuned loads, see Output Matching.
VCO
= 200 kHz; N = 2600; Loop B/W = 10 kHz.
PFD
= 1 MHz; N = 2600; Loop B/W = 25 kHz.
PFD
= 10 MHz @ 0 dBm.
REFOUT
8
9
= 3.3 V; P = 32.
11, 13
−111 dBc/Hz typ @ 100 kHz offset from carrier.
−172 dBc/Hz typ @ 25 kHz PFD frequency.
−80 dBc/Hz typ @ 1 kHz offset from carrier.
−75 dBc typ
Rev. 0 | Page 4 of 20
ADF4360-0
TIMING CHARACTERISTICS
AVDD = DVDD = V
Table 2.
Parameter Limit at T
t1 20 ns min LE Setup Time
t2 10 ns min DATA to CLOCK Setup Time
t3 10 ns min DATA to CLOCK Hold Time
t4 25 ns min CLOCK High Duration
t5 25 ns min CLOCK Low Duration
t6 10 ns min CLOCK to LE Setup Time
t7 20 ns min LE Pulse Width
= 3.3 V ± 10%; AGND = DGND = 0 V; 1.8 V and 3 V logic levels used; TA = T
VCO
to T
MIN
CLOCK
(B Version) Unit Test Conditions/Comments
MAX
t
t
4
5
MIN
to T
, unless other wise noted.
MAX
DATA
t
2
DB23 (MSB)DB22DB2
LE
t
1
LE
t
3
DB1
(CONTROL BIT C2)
DB0 (LSB)
(CONTROL BIT C1)
t
6
t
7
04414-0-002
Figure 2. Timing Diagram
Rev. 0 | Page 5 of 20
ADF4360-0
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter Rating
AVDD to GND
AVDD to DVDD −0.3 V to +0.3 V
V
to GND −0.3 V to +3.9 V
VCO
V
to AVDD −0.3 V to +0.3 V
VCO
Digital I/O Voltage to GND −0.3 V to VDD + 0.3 V
Analog I/O Voltage to GND −0.3 V to VDD + 0.3 V
REFIN to GND −0.3 V to VDD + 0.3 V
Operating Temperature Range −40°C to + 85°C
Storage Temperature Range −65°C to +150°C
Maximum Junction Temperature 150°C
CSP θJA Thermal Impedance
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
This device is a high performance RF integrated circuit with an
ESD rating of <1 kV and it is ESD sensitive. Proper precautions
should be taken for handling and assembly.
TRANSISTOR COUNT
12543 (CMOS) and 700 (Bipolar)
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. 0 | Page 6 of 20
ADF4360-0
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
DD
21
PIN 1
IDENTIFIER
ADF4360-0
TOP VIEW
(Not to Scale)
AGND8AGND9AGND10AGND
MUXOUT20LE
11
19
DATA
18
CLK
17
16
REF
IN
15
DGND
14
C
N
13
R
SET
12
C
C
04644-0-002
CPGND
AV
AGND
RF
OUT
RF
OUT
V
VCO
CP24CE23AGND22DV
1
2
DD
3
4
A
B
5
6
7
TUNE
V
Figure 3. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Function
1 CPGND Charge Pump Ground. This is the ground return path for the charge pump.
2 AVDD
Analog Power Supply. This ranges from 3.0 V to 3.6 V. Decoupling capacitors to the analog ground plane
should be placed as close as possible to this pin. AV
must have the same value as DVDD.
DD
3, 8 to 11, 22 AGND Analog Ground. This is the ground return path of the prescaler and VCO.
4 RF
OUT
A
VCO Output. The output level is programmable from −6.5 dBm to −13 dBm. See the Output Matching section
for a description of the various output stages.
5 RF
OUT
B
VCO Complementary Output. The output level is programmable from −6.5 dBm to −13 dBm. See the Output
Matching section for a description of the various output stages.
6 V
7 V
VCO
TUNE
Power Supply for the VCO. This ranges from 3.0 V to 3.6 V. Decoupling capacitors to the analog ground plane
should be placed as close as possible to this pin. V
must have the same value as AVDD.
VCO
Control Input to the VCO. This voltage determines the output frequency and is derived from filtering the CP
output voltage.
12 CC Internal Compensation Node. This pin must be decoupled to ground with a 10 nF capacitor.
13 R
14 C
SET
N
Connecting a resistor between this pin and CP
synthesizer. The nominal voltage potential at the R
I
Where R
CPmax
SET
75.11
=
R
SET
= 4.7 kΩ, I
CPmax
= 2.5 mA.
Internal Compensation Node. This pin must be decoupled to V
sets the maximum charge pump output current for the
GND
pin is 0.6 V. The relationship between ICP and R
SET
with a 10 µF capacitor.
VCO
15 DGND Digital Ground.
16 REFIN
Reference Input. This is a CMOS input with a nominal threshold of V
/2 and a dc equivalent input resistance of
DD
100 kΩ. See Figure 10. This input can be driven from a TTL or CMOS crystal oscillator or it can be ac-coupled.
17 CLK
Serial Clock Input. This serial clock is used to clock in the serial data to the registers. The data is latched into the
24-bit shift register on the CLK rising edge. This input is a high impedance CMOS input.
18 DATA
Serial Data Input. The serial data is loaded MSB first with the two LSBs being the control bits. This input is a
high impedance CMOS input.
19 LE
Load Enable, CMOS Input. When LE goes high, the data stored in the shift registers is loaded into one of the
four latches, and the relevant latch is selected using the control bits.
20 MUXOUT
This multiplexer output allows either the lock detect, the scaled RF, or the scaled reference frequency to be
accessed externally.
21 DVDD
23 CE
Digital Power Supply. This ranges from 3.0 V to 3.6 V. Decoupling capacitors to the digital ground plane should
be placed as close as possible to this pin. DV
must have the same value as AVDD.
DD
Chip Enable. A logic low on this pin powers down the device and puts the charge pump into three-state mode.
Taking the pin high powers up the device depending on the status of the power-down bits.
24 CP
Charge Pump Output. When enabled, this provides ± I
internal VCO.
to the external loop filter, which in turn, drives the
The reference input stage is shown in Figure 10. SW1 and SW2
are normally closed switches. SW3 is normally open. When
power-down is initiated, SW3 is closed, and SW1 and SW2 are
opened. This ensures that there is no loading of the REF
IN
pin
on power-down.
POWER-DOWN
CONTROL
100kΩ
NC
REF
SW1
SW2
SW3
NO
IN
NC
BUFFER
TO R COUNTER
04414-0-010
Figure 10. Reference Input Stage
PRESCALER (P/P + 1)
The dual-modulus prescaler (P/P + 1), along with the A and B
counters, enables the large division ratio,
N, to be realized (N =
BP + A). The dual-modulus prescaler, operating at CML levels,
takes the clock from the VCO and divides it down to a manageable frequency for the CMOS A and B counters. The prescaler is
programmable. It can be set in software to 8/9, 16/17, or 32/33
and is based on a synchronous 4/5 core. There is a minimum
divide ratio possible for fully contiguous output frequencies;
this minimum is determined by P, the prescaler value, and is
given by (
2
P
− P).
A AND B COUNTERS
The A and B CMOS counters combine with the dual-modulus
prescaler to allow a wide range division ratio in the PLL feedback counter. The counters are specified to work when the prescaler output is 300 MHz or less. Thus, with a VCO frequency of
2.5 GHz, a prescaler value of 16/17 is valid, but a value of 8/9 is
not valid.
Pulse Swallow Function
The A and B counters, in conjunction with the dual-modulus
prescaler, make it possible to generate output frequencies that
are spaced only by the reference frequency divided by
VCO frequency equation is
RfABPf
VCO
()
REFIN
/×]+×[=
where:
R. The
FROM VCO
R COUNTER
The 14-bit R counter allows the input reference frequency to
be divided down to produce the reference clock to the phase
frequency detector (PFD). Division ratios from 1 to 16,383 are
allowed.
PFD AND CHARGE PUMP
The PFD takes inputs from the R counter and N counter (N =
BP + A) and produces an output proportional to the phase and
frequency difference between them. Figure 12 is a simplified
schematic. The PFD includes a programmable delay element
that controls the width of the antibacklash pulse. This pulse
ensures that there is no dead zone in the PFD transfer function
and minimizes phase noise and reference spurs. Two bits in the
R counter latch, ABP2 and ABP1, control the width of the pulse
(see Table 9).
HI
R DIVIDER
HI
N DIVIDER
N = BP + A
PRESCALER
P/P+1
MODULUS
CONTROL
N DIVIDER
Figure 11. A and B Counters
UP
Q1D1
U1
CLR1
PROGRAMMABLE
DELAY
ABP1ABP2
CLR2
DOWN
Q2D2
U2
13-BIT B
COUNTER
LOAD
LOAD
5-BIT A
COUNTER
U3
V
P
CPGND
TO PFD
04414-0-011
CHARGE
PUMP
CP
f
is the output frequency of the VCO.
VCO
R DIVIDER
P is the preset modulus of the dual-modulus prescaler (8/9,
N DIVIDER
P OUTPU
Figure 12. PFD Simplified Schematic and Timing (In Lock)
04414-0-012
16/17, and so on).
B is the preset divide ratio of the binary 13-bit counter (3 to 8191).
A is the preset divide ratio of the binary 5-bit swallow counter (0 to 31).
f
is the external reference frequency oscillator.
REFIN
Rev. 0 | Page 9 of 20
ADF4360-0
MUXOUT AND LOCK DETECT
The output multiplexer on the ADF4360 family allows the user
to access various internal points on the chip. The state of
MUXOUT is controlled by M3, M2, and M1 in the function
latch. The full truth table is shown in Table 7. Figure 13 shows
the MUXOUT section in block diagram form.
Lock Detect
MUXOUT can be programmed for two types of lock detect:
digital and analog. Digital lock detect is active high. When LDP
in the R counter latch is set to 0, digital lock detect is set high
when the phase error on three consecutive phase detector cycles
is less than 15 ns.
With LDP set to 1, five consecutive cycles of less than 15 ns
phase error are required to set the lock detect. It stays set high
until a phase error of greater than 25 ns is detected on any subsequent PD cycle.
The N-channel open-drain analog lock detect should be operated with an external pull-up resistor of 10 kΩ nominal. When a
lock has been detected, this output is high with narrow lowgoing pulses.
DV
DD
ANALOG LOCK DETECT
DIGITAL LOCK DETECT
R COUNTER OUTPUT
N COUNTER OUTPUT
SDOUT
Figure 13. MUXOUT Circuit
CONTROLMUX
INPUT SHIFT REGISTER
The ADF4360 family’s digital section includes a 24-bit input
shift register, a 14-bit R counter, and an 18-bit N counter,
comprised of a 5-bit A counter and a 13-bit B counter. Data is
clocked into the 24-bit shift register on each rising edge of CLK.
The data is clocked in MSB first. Data is transferred from the
shift register to one of four latches on the rising edge of LE. The
destination latch is determined by the state of the two control
bits (C2, C1) in the shift register. These are the two LSBs, DB1
and DB0, as shown in Figure 2.
The truth table for these bits is shown in Table 5. Table 6 shows
a summary of how the latches are programmed. Note that the
test modes latch is used for factory testing and should not be
programmed by the user.
MUXOUT
DGND
04414-0-013
Table 5. C2 and C1 Truth Table
Control Bits
C2 C1
0 0 Control Latch
0 1 R Counter
1 0 N Counter (A and B)
1 1 Test Modes Latch
VCO
The VCO core in the ADF4360 family uses eight overlapping
bands, as shown in Figure 14, to allow a wide frequency range to
be covered without a large VCO sensitivity (K
poor phase noise and spurious performance.
The correct band is chosen automatically by the band select
logic at power-up or whenever the N counter latch is updated. It
is important that the correct write sequence be followed at
power-up. This sequence is
1.
R counter latch Control latch
2.
3.
N counter latch
During band s elect, which takes five PFD cycles, the VCO V
is disconnected from the output of the loop filter and connected
to an internal reference voltage.
2.5
2.3
2.1
1.9
1.7
1.5
1.3
VOLTAGE (V)
1.1
0.9
0.7
0.5
22002400260028003000
Figure 14. Frequency vs. V
FREQUENCY (MHz)
TUNE
The R counter output is used as the clock for the band select logic
and should not exceed 1 MHz. A programmable divider is provided
at the R counter input to allow division by 1, 2, 4, or 8 and is controlled by Bits BSC1 and BSC2 in the R counter latch. Where the
required PFD frequency exceeds 1 MHz, the divide ratio should be
set to allow enough time for correct band selection.
After band select, normal PLL action resumes. The nominal
value of K
is 56 MHz/V or 28 MHz/V, if divide-by-2 operation
V
has been selected (by programming DIV2 (DB22) high in the N
counter latch). The ADF4360 family contains linearization circuitry to minimize any variation of the product of I
) and resultant
V
, ADF4360-0
and KV.
CP
TUNE
04644-0-004
Rev. 0 | Page 10 of 20
ADF4360-0
The operating current in the VCO core is programmable in four
steps: 5 mA, 10 mA, 15 mA, and 20 mA. This is controlled by
Bits PC1 and PC2 in the control latch.
OUTPUT STAGE
The RF
nected to the collectors of an NPN differential pair driven by
buffered outputs of the VCO, as shown in Figure 15. To allow
the user to optimize the power dissipation versus the output
power requirements, the tail current of the differential pair is
programmable via Bits PL1 and PL2 in the control latch. Four
current levels may be set: +3.5 mA, +5 mA, +7.5 mA, and
+11 mA. These levels give output power levels of −13 dBm,
−11 dBm, −8.5 dBm, and −6.5 dBm, respectively, using a 50 Ω
resistor to V
both outputs can be combined in a 1 + 1:1 transformer or a 180°
microstrip coupler (see the Output Matching section).
A and RF
OUT
and ac coupling into a 50 Ω load. Alternatively,
DD
B pins of the ADF4360 family are con-
OUT
If the outputs are used individually, the optimum output stage
consists of a shunt inductor to V
DD
.
Another feature of the ADF4360 family is that the supply current
to the RF output stage is shut down until the part achieves lock as
measured by the digital lock detect circuitry. This is enabled by the
Mute-Till-Lock Detect (MTLD) bit in the control latch.
RF
VCO
BUFFER/
DIVIDE BY 2
Figure 15. Output Stage ADF4360-0
ARF
OUT
OUT
B
04414-0-015
Rev. 0 | Page 11 of 20
ADF4360-0
LATCH STRUCTURE
Table 6 shows the three on-chip latches for the ADF4360 family. The two LSBs decide which latch is programmed.
With (C2, C1) = (0, 0), the control latch is programmed. Table 7
shows the input data format for programming the control latch.
Prescaler Value
In the ADF4360 family, P2 and P1 in the control latch set the
prescaler values.
Power-Down
DB21 (PD2) and DB20 (PD1) provide programmable powerdown modes.
In the programmed asynchronous power-down, the device
powers down immediately after latching a 1 into Bit PD1, with
the condition that PD2 has been loaded with a 0. In the programmed synchronous power-down, the device power-down is
gated by the charge pump to prevent unwanted frequency
jumps. Once the power-down is enabled by writing a 1 into
Bit PD1 (on the condition that a 1 has also been loaded to PD2),
the device goes into power-down on the second rising edge of
the R counter output, after LE goes high. When the CE pin is
low, the device is immediately disabled regardless of the state of
PD1 or PD2.
When a power-down is activated (either synchronous or
asynchronous mode), the following events occur:
• All active dc current paths are removed.
• The R, N, and timeout counters are forced to their load
state conditions.
• The charge pump is forced into three-state mode.
• The digital lock detect circuitry is reset.
• The RF outputs are debiased to a high impedance state.
• The reference input buffer circuitry is disabled.
• The input register remains active and capable of loading and
latching data.
Charge Pump Currents
CPI3, CPI2, and CPI1 in the ADF4360 family determine
Current Setting 1.
CPI6, CPI5, and CPI4 determine Current Setting 2. See the
truth table in Table 7.
Output Power Level
Bits PL1 and PL2 set the output power level of the VCO. See the
truth table in Table 7.
Mute-Till-Lock Detect
DB11 of the control latch in the ADF4360 family is the Mute-TillLock Detect bit. This function, when enabled, ensures that the RF
outputs are not switched on until the PLL is locked.
CP Gain
DB10 of the control latch in the ADF4360 family is the Charge
Pump Gain bit. When it is programmed to a 1, Current Setting 2
is used. When it is programmed to a 0, Current Setting 1 is used.
Charge Pump Three-State
This bit puts the charge pump into three-state mode when
programmed to a 1. It should be set to 0 for normal operation.
Phase Detector Polarity
The PDP bit in the ADF4360 family sets the phase detector
polarity. The positive setting enabled by programming a 1 is
used when using the on-chip VCO with a passive loop filter or
with an active non-inverting filter. It can also be set to 0. This is
required, if an active inverting loop filter is used.
MUXOUT Control
The on-chip multiplexer is controlled by M3, M2, and M1. See
the truth table in Table 7.
Counter Reset
DB4 is the counter reset bit for the ADF4360 family. When this
is 1, the R counter and the A, B counters are reset. For normal
operation, this bit should be 0.
Core Power Level
PC1 and PC2 set the power level in the VCO core. The recommended setting is 10 mA. See the truth table in Table 7.
Rev. 0 | Page 16 of 20
ADF4360-0
N COUNTER LATCH
With (C2, C1) = (1, 0), the N counter latch is programmed.
Table 8 shows the input data format for programming the
N counter latch.
A Counter Latch
A5 to A1 program the 5-bit A counter. The divide range is 0
(00000) to 31 (11111).
Reserved Bits
DB7 is a spare bit and has been designated as Reserved. It
should be programmed to 0.
B Counter Latch
B13 to B1 program the B counter. The divide range is 3
(00.....0011) to 8191 (11....111).
Overall Divide Range
The overall divide range is defined by ((P × B) + A), where P is
the prescaler value.
CP Gain
DB21 of the N counter latch in the ADF4360 family is the
charge pump gain bit. When this is programmed to 1, Current
Setting 2 is used. When programmed to 0, Current Setting 1 is used.
This bit can also be programmed through DB10 of the control
latch. The bit always reflects the latest value written to it, whether
this is through the control latch or the N counter latch.
Divide-by-2
DB22 is the divide-by-2 bit. When set to 1, the output divide-by-2
function is chosen. When it is set to 0, normal operation occurs.
Divide-by-2 Select
DB23 is the divide-by-2 select bit. When programmed to 1, the
divide-by-2 output is selected as the prescaler input. When set
to 0, the fundamental is used as the prescaler input. For example, using the output divide-by-2 feature and a PFD frequency
of 200 kHz, the user needs a value of N = 13,000 to generate
1,500 MHz. With the divide-by-2 select bit high, the user may
keep N = 6,500.
R COUNTER LATCH
With (C2, C1) = (0, 1), the R counter latch is programmed.
Table 9 shows the input data format for programming the
R counter latch.
R Counter
R1 to R14 set the counter divide ratio. The divide range is 1
(00......001) to 16383 (111......111).
Antibacklash Pulse Width
DB16 and DB17 set the antibacklash pulse width.
Lock Detect Precision
DB18 is the lock detect precision bit. This bit sets the number of
reference cycles with less than 15 ns phase error for entering the
locked state. With LDP at 1, five cycles are taken; with LDP at 0,
three cycles are taken.
Test Mode Bit
DB19 is the test mode bit (TMB) and should be set to 0. With
TMB = 0, the contents of the test mode latch are ignored and
normal operation occurs as determined by the contents of the
control latch, R counter latch, and N counter latch. Note that
test modes are for factory testing only and should not be programmed by the user.
Band Select Clock
These bits set a divider for the band select logic clock input. The
output of the R counter is by default the value used to clock the
band select logic, but, if this value is too high (>1 MHz), a
divider can be switched on to divide the R counter output to a
smaller value (see Table 9).
Reserved Bits
DB23 to DB22 are spare bits that have been designated as
Reserved. They should be programmed to 0.
Rev. 0 | Page 17 of 20
ADF4360-0
APPLICATIONS
FIXED FREQUENCY LO
Figure 16 shows the ADF4360-0 used as a fixed frequency LO at 2.6
GHz. The low-pass filter was designed using ADIsimPLL for a
channel spacing of 8 MHz and an open-loop bandwidth of 40 kHz.
The maximum PFD frequency of the ADF4360-0 is 8 MHz. Since
using a larger PFD frequency allows users to use a smaller N, the
in-band phase noise is reduced to as low as possible, –100 dBc/Hz.
The 40 kHz bandwidth is chosen to be just greater than the point at
which the open-loop phase noise of the VCO is –100 dBc/Hz, thus
giving the best possible integrated noise. The typical rms phase
noise (100 Hz to 100 kHz) of the LO in this configuration is 0.35°.
The reference frequency is from a 16 MHz TCXO from Fox; thus,
an R value of 2 is programmed. Taking into account the high PFD
frequency and its effect on the band select logic, the band select
clock divider is enabled. In this case, a value of 8 is chosen. A very
simple pull-up resistor and dc blocking capacitor complete the RF
output stage.
V
VCO
6
DVDDAVDDCE MUXOUT
V
VCO
14
C
N
1nF1nF
16
REF
IN
51Ω
17
CLK
18
DATA
19
LE
12
C
13
R
CPGNDAGNDDGND
1
ADF4360-0
C
SET
3 8 9 10 11 22 15
FOX
801BE-160
16MHz
SPI COMPATIBLE SERIAL BUS
1nF
10µF
4.7kΩ
Figure 16. Fixed Frequency LO
POWER-UP
After power-up, the part needs three writes for normal operation. The correct sequence is to the R counter latch, followed by
the control latch, and N counter latch.
INTERFACING
The ADF4360 family has a simple SPI® compatible serial interface for writing to the device. CLK, DATA, and LE control the
data transfer. When LE goes high, the 24 bits that have been
clocked into the appropriate register on each rising edge of CLK
are transferred to the appropriate latch. See Figure 2 for the
timing diagram and Table 5 for the latch truth table.
The maximum allowable serial clock rate is 20 MHz. This
means that the maximum update rate possible is 833 kHz or
one update every 1.2 µs. This is more than adequate for systems
that have typical lock times in hundreds of microseconds.
LOCK
V
DETECT
VDD
2023221
V
7
TUNE
24
CP
A
4
RF
OUT
5
B
RF
OUT
3kΩ
8.2nF
560pF270pF
1.5kΩ
V
VCO
51Ω
51Ω
100pF
100pF
ADuC812 Interface
Figure 17 shows the interface between the ADF4360 family and
the ADuC812 MicroConverter®. Since the ADuC812 is based on
an 8051 core, this interface can be used with any 8051 based
microcontroller. The MicroConverter is set up for SPI master
mode with CPHA = 0. To initiate the operation, the I/O port
driving LE is brought low. Each latch of the ADF4360 family
needs a 24-bit word, which is accomplished by writing three 8bit bytes from the MicroConverter to the device. When the third
byte has been written, the LE input should be brought high to
complete the transfer.
SCLOCK
MOSI
ADuC812
I/O PORTS
Figure 17. ADuC812 to ADF4360-x Interface
SCLK
SDATA
LE
ADF4360-x
CE
MUXOUT
(LOCK DETECT)
04437-0-014
I/O port lines on the ADuC812 are also used to control powerdown (CE input) and detect lock (MUXOUT configured as lock
detect and polled by the port input). When operating in the
described mode, the maximum SCLOCK rate of the ADuC812
is 4 MHz. This means that the maximum rate at which the output frequency can be changed is 166 kHz.
ADSP-2181 Interface
Figure 18 shows the interface between the ADF4360 family and
the ADSP-21xx digital signal processor. The ADF4360 family
needs a 24-bit serial word for each latch write. The easiest way
04644-0-003
to accomplish this using the ADSP-21xx family is to use the
autobuffered transmit mode of operation with alternate framing. This provides a means for transmitting an entire block of
serial data before an interrupt is generated.
SCLOCK
MOSI
TFS
ADSP-21xx
I/O PORTS
Figure 18. ADSP-21xx to ADF4360-x Interface
SCLK
SDATA
LE
ADF4360-x
CE
MUXOUT
(LOCK DETECT)
04437-0-015
Set up the word length for 8 bits and use three memory locations for each 24-bit word. To program each 24-bit latch, store
the 8-bit bytes, enable the autobuffered mode, and write to the
transmit register of the DSP. This last operation initiates the
autobuffer transfer.
Rev. 0 | Page 18 of 20
ADF4360-0
PCB DESIGN GUIDELINES FOR CHIP SCALE PACKAGE
The leads on the chip scale package (CP-24) are rectangular.
The printed circuit board pad for these should be 0.1 mm
longer than the package lead length and 0.05 mm wider than
the package lead width. The lead should be centered on the pad
to ensure that the solder joint size is maximized.
The bottom of the chip scale package has a central thermal pad.
The thermal pad on the printed circuit board should be at least
as large as this exposed pad. On the printed circuit board, there
should be a clearance of at least 0.25 mm between the thermal
pad and the inner edges of the pad pattern to ensure that shorting is avoided.
Thermal vias may be used on the printed circuit board thermal
pad to improve thermal performance of the package. If vias are
used, they should be incorporated in the thermal pad at 1.2 mm
pitch grid. The via diameter should be between 0.3 mm and
0.33 mm, and the via barrel should be plated with 1 ounce of
copper to plug the via.
Experiments have shown that the circuit shown in Figure 20
provides an excellent match to 50 Ω over the operating range of
the ADF4360-0. This gives approximately −4 dBm output power
across the frequency range of the ADF4360-0. Both singleended architectures can be examined using the EVALADF4360-0EB1 evaluation board.
V
VCO
47nH
3.9nH
RF
OUT
Figure 20. Differential ADF4360-0 Output Stage
1.5pF
50Ω
04414-0-021
If the user does not need the differential outputs available on
the ADF4360-0, the user may either terminate the unused output or combine both outputs using a balun. The circuit in
Figure 21 shows how best to combine the outputs.
V
VCO
The user should connect the printed circuit thermal pad to
AGND. This is internally connected to AGND.
OUTPUT MATCHING
There are a number of ways to match the output of the
ADF4360-0 for optimum operation; the most basic is to use a
50 Ω resistor to V
nected in series, as shown in Figure 19. Because the resistor is
not frequency dependent, this provides a good broadband
match. The output power in the circuit below typically gives
−6.5 dBm output power into a 50 Ω load.
A better solution is to use a shunt inductor (acting as an RF
choke) to V
VCO.
therefore, more output power. Additionally, a series inductor is
added after the dc bypass capacitor to provide a resonant LC
circuit. This tunes the oscillator output and provides approximately 10 dB additional rejection of the second harmonic. The
shunt inductor needs to be a relatively low value (<10 nH).
. A dc bypass capacitor of 100 pF is con-
VCO
V
VCO
51Ω
RF
OUT
Figure 19. Simple ADF4360-1 Output Stage
100pF
50Ω
04414-0-020
This gives a better match than a resistor and,
1nH
A
RF
OUT
RF
OUT
Figure 21. Balun for Combining ADF4360-0 RF Outputs
1nH
B
3.6nH
1.5pF
3.6nH
1.5pF
47nH
10pF
50Ω
04414-0-022
The circuit in Figure 21 is a lumped lattice type LC balun. It is
designed for a center frequency of 2.6 GHz and outputs −1 dBm
at this frequency. The series 1 nH inductor is used to tune out
any parasitic capacitance due to the board layout from each
input, and the remainder of the circuit is used to shift the
output of one RF input by +90° and the second by −90°, thus
combining the two. The action of the 3.6 nH inductor and the
1.5 pF capacitor accomplishes this. The 12 nH is used to provide
an RF choke to feed the supply voltage, and the 10 pF capacitor
provides the necessary dc block. To ensure good RF performance, the circuits in Figure 19 and Figure 21 are implemented
with Coilcraft 0402/0603 inductors and AVX 0402 thin-film
capacitors.
Alternatively, instead of the LC balun shown in Figure 21, both
outputs may be combined using a 180° rat-race coupler.
Rev. 0 | Page 19 of 20
ADF4360-0
OUTLINE DIMENSIONS
0.08
0.60 MAX
19
18
BOTTOM
13
12
VIEW
24
7
1
6
2.50 REF
PIN 1
INDICATOR
2.25
2.10 SQ
1.95
0.25 MIN
PIN 1
INDICATOR
1.00
0.85
0.80
SEATING
PLANE
12° MAX
4.00
BSC SQ
TOP
VIEW
0.80 MAX
0.65TYP
COMPLIANT TOJEDEC STANDARDSMO-220-VGGD-2
0.30
0.23
0.18
3.75
BSC SQ
0.20 REF
0.60 MAX
0.05 MAX
0.02 NOM
0.50
BSC
0.50
0.40
0.30
COPLANARITY
Figure 22. 24-Lead Lead Frame Chip Scale Package [LFCSP]
(CP-24-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Frequency Range Package Option
ADF4360-0BCP −40°C to +85°C 2400 MHz to 2725 MHz CP-24-1
ADF4360-0BCPRL −40°C to +85°C 2400 MHz to 2725 MHz CP-24-1
ADF4360-0BCPRL7 −40°C to +85°C 2400 MHz to 2725 MHz CP-24-1
EVAL-ADF4360-0EB1 Evaluation Board
Purchase of licensed I2C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I2C Patent
Rights to use these components in an I
2
C system, provided that the system conforms to the I2C Standard Specification as defined by Philips.