ANALOG DEVICES ADF 4350 BCPZ Datasheet

Wideband Synthesizer with Integrated VCO
ADF4350
Trademarks and registered trademarks are the property of their respective owners.
MUXOUT
CP
OUT
LD
SW
V
COM
TEMP
REF
IN
CLK
DATA
LE
AV
DD
SDV
DD
DV
DD
V
P
AGND
CE
DGND CP
GND
SD
GND
A
GNDVCO
R
SETVVCO
V
TUNE
V
REF
RF
OUT
A+
RF
OUT
A–
RF
OUT
B+
RF
OUT
B–
VCO
CORE
PHASE
COMPARATOR
FL
O
SWITCH
CHARGE
PUMP
OUTPUT
STAGE
OUTPUT
STAGE
PDB
RF
MULTIPLEXER
MULTIPLEXER
10-BIT R
COUNTER÷2DIVIDER
×2
DOUBLER
FUNCTION
LATCH
DATA REGISTER
INTEGER
REG
N COUNTER
FRACTION
REG
THIRD-ORDER
FRACTIONAL
INTERPOLATOR
MODULUS
REG
MULTIPLEXER
LOCK
DETECT
÷1/2/4/8/16
ADF4350
07325-001
Data Sheet

FEATURES

Output frequency range: 137.5 MHz to 4400 MHz Fractional-N synthesizer and integer-N synthesizer Low phase noise VCO Programmable divide-by-1/-2/-4/-8/-16 output Typical rms jitter: <0.4 ps rms Power supply: 3.0 V to 3.6 V Logic compatibility: 1.8 V Programmable dual-modulus prescaler of 4/5 or 8/9 Programmable output power level RF output mute function 3-wire serial interface Analog and digital lock detect Switched bandwidth fast-lock mode Cycle slip reduction

APPLICATIONS

Wireless infrastructure (W-CDMA, TD-SCDMA, WiMAX,
GSM, PCS, DCS, DECT) Test equipment Wireless LANs, CATV equipment Clock generation

FUNCTIONAL BLOCK DIAGRAM

GENERAL DESCRIPTION

The ADF4350 allows implementation of fractional-N or integer-N phase-locked loop (PLL) frequency synthesizers if used with an external loop filter and external reference frequency.
The ADF4350 has an integrated voltage controlled oscillator (VCO) with a fundamental output frequency ranging from 2200 MHz to 4400 MHz. In addition, divide-by-1/2/4/8 or 16 circuits allow the user to generate RF output frequencies as low as 137.5 MHz. For applications that require isolation, the RF output stage can be muted. The mute function is both pin- and software-controllable. An auxiliary RF output is also available, which can be powered down if not in use.
Control of all the on-chip registers is through a simple 3-wire interface. The device operates with a power supply ranging from 3.0 V to 3.6 V and can be powered down when not in use.
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Figure 1.
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ADF4350 Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Timing Characteristics ................................................................ 5
Absolute Maximum Ratings ............................................................ 6
Transistor Count ........................................................................... 6
ESD Caution .................................................................................. 6
Pin Configuration and Function Descriptions ............................. 7
Typical Performance Characteristics ............................................. 9
Circuit Description ......................................................................... 11
Reference Input Section ............................................................. 11
RF N Divider ............................................................................... 11
INT, FRAC, MOD, and R Counter Relationship .................... 11
INT N MODE ............................................................................. 11
R Counter .................................................................................... 11
Phase Frequency Detector (PFD) and Charge Pump ............ 11
MUXOUT and LOCK Detect ................................................... 12
Input Shift Registers ................................................................... 12
Program Modes .......................................................................... 12
VCO.............................................................................................. 12
Output Stage ................................................................................ 13
Register Maps .................................................................................. 14
Register 0 ..................................................................................... 18

REVISION HISTORY

5/16—Rev. A to Rev. B
Changes to Figure 3 .......................................................................... 7
Changes to the ADuC7019 to ADuC7029 Family Interface
Section, Figure 35, and Figure 35 Caption .................................. 26
Updated Outline Dimensions ....................................................... 30
Changes to Ordering Guide .......................................................... 30
Rev. B | Page 2 of 34
Register 1 ..................................................................................... 18
Register 2 ..................................................................................... 18
Register 3 ..................................................................................... 20
Register 4 ..................................................................................... 20
Register 5 ..................................................................................... 20
Initialization Sequence .............................................................. 21
RF Synthesizer—A Worked Example ...................................... 21
Modulus ....................................................................................... 21
Reference Doubler and Reference Divider ............................. 21
12-Bit Programmable Modulus ................................................ 21
Cycle Slip Reduction for Faster Lock Times ........................... 22
Spurious Optimization and Fast lock ...................................... 22
Fast-Lock Timer and Register Sequences ............................... 22
Fast Lock—An Example ............................................................ 22
Fast Lock—Loop Filter Topology ............................................. 23
Spur Mechanisms ....................................................................... 23
Spur Consistency and Fractional Spur Optimization ........... 24
Phase Resync ............................................................................... 24
Applications Information .............................................................. 25
Direct Conversion Modulator .................................................. 25
Interfacing ................................................................................... 26
PCB Design Guidelines for a Chip Scale Package ................. 26
Output Matching ........................................................................ 27
Outline Dimensions ....................................................................... 31
Ordering Guide .......................................................................... 31
4/11—Rev. 0 to Rev. A
Changes to Typical rms Jitter in Features Section ......................... 1
Changes to Specifications ................................................................. 3
Changes Output Stage Section ...................................................... 13
Changes to Figure 29 ...................................................................... 17
Changes to Fast Lock—An Example Section ............................. 22
Changes to Direct Conversion Modulator Section and
Figure 34 ......................................................................................... 25
Changes to ADuC70xx Interface Section and ADSP-BF527
Interface Section ............................................................................. 26
Changes to Output Matching Section and Table 7 .................... 27
Added Table 8 ................................................................................. 28
Changes to Ordering Guide .......................................................... 29
11/08—Revision 0: Initial Version
Data Sheet ADF4350
CHARGE PUMP
Input High Voltage, V
1.5
V
POWER SUPPLIES
70
80
mA
Maximum VCO Output Frequency
4400
MHz
Harmonic Content (Third)
−13 dBc
Fundamental VCO output

SPECIFICATIONS

AVDD = DVDD = V temperature range is −40°C to +85°C.
Table 1.
Parameter
REFIN CHARACTERISTICS
Input Frequency 10 250 MHz For f < 10 MHz ensure slew rate > 21 V/µs Input Sensitivity 0.7 AVDD V p-p Biased at AVDD/21 Input Capacitance 10 pF Input Current ±60 µA
PHASE DETECTOR
Phase Detector Frequency2 32 MHz
= SDVDD = VP = 3.3 V ± 10%; AGND = DGND = 0 V; TA = T
VCO
B Version
to T
MIN
, unless otherwise noted. Operating
MAX
Unit Test Conditions/Comments Min Typ Max
ICP Sink/Source3 With R
= 5.1 kΩ
SET
High Value 5 mA Low Value 0.312 mA R
Range 2.7 10 kΩ
SET
Sink and Source Current Matching 2 % 0.5 V ≤ VCP ≤ 2.5 V ICP vs. VCP 1.5 % 0.5 V ≤ VCP ≤ 2.5 V ICP vs. Temperature 2 % VCP = 2.0 V
LOGIC INPUTS
INH
Input Low Voltage, V Input Current, I
0.6 V
INL
±1 µA
INH/IINL
Input Capacitance, CIN 3.0 pF
LOGIC OUTPUTS
Output High Voltage, VOH DVDD − 0.4 V CMOS output chosen Output High Current, IOH 500 µA Output Low Voltage, VOL 0.4 V IOL = 500 µA
AVDD 3.0 3.6 V DVDD, V DIDD + AI
, SD
VCO
, VP AVDD These voltages must equal AVDD
VDD
4
21 27 mA
DD
Output Dividers 6 to 24 mA Each output divide-by-2 consumes 6 mA
4
I
VCO
I
RFOUT
4
21 26 mA RF output stage is programmable
Low Power Sleep Mode 7 1000 µA
RF OUTPUT CHARACTERISTICS
Minimum VCO Output Frequency 2200 MHz Fundamental VCO mode Minimum VCO Output Frequency
Using Dividers VCO Sensitivity 33 MHz/V Frequency Pushing (Open-Loop) 1 MHz/V Frequency Pulling (Open-Loop) 90 kHz Into 2.00 VSWR load Harmonic Content (Second) −19 dBc Fundamental VCO output
Harmonic Content (Second) −20 dBc Divided VCO output Harmonic Content (Third) −10 dBc Divided VCO output Minimum RF Output Power 5 −4 dBm Programmable in 3 dB steps Maximum RF Output Power5 5 dBm Output Power Variation ±1 dB Minimum VCO Tuning Voltage 0.5 V Maximum VCO Tuning Voltage 2.5 V
137.5 MHz 2200 MHz fundamental output and divide by 16 selected
Rev. B | Page 3 of 34
ADF4350 Data Sheet
−86 dBc/Hz
10 kHz offset from 3.3 GHz carrier
−110
dBc/Hz
100 kHz offset from 4.4 GHz carrier
B Version
Parameter
NOISE CHARACTERISTICS
VCO Phase-Noise Performance6 −89 dBc/Hz 10 kHz offset from 2.2 GHz carrier
−114 dBc/Hz 100 kHz offset from 2.2 GHz carrier
−134 dBc/Hz 1 MHz offset from 2.2 GHz carrier
−148 dBc/Hz 5 MHz offset from 2.2 GHz carrier
−111 dBc/Hz 100 kHz offset from 3.3 GHz carrier
−134 dBc/Hz 1 MHz offset from 3.3 GHz carrier
−145 dBc/Hz 5 MHz offset from 3.3 GHz carrier
−83 dBc/Hz 10 kHz offset from 4.4 GHz carrier
−132 dBc/Hz 1 MHz offset from 4.4 GHz carrier
−145 dBc/Hz 5 MHz offset from 4.4 GHz carrier Normalized Phase Noise Floor (PN Normalized 1/f Noise (PN
)8 −111 dBc/Hz 10 kHz offset; normalized to 1 GHz
1_f
)7 −220 dBc/Hz PLL Loop BW = 500 kHz
SYNTH
In-Band Phase Noise9 −97 dBc/Hz 3 kHz offset from 2113.5 MHz carrier Integrated RMS Jitter10 0.5 ps Spurious Signals Due to PFD Frequency −70 dBc Level of Signal With RF Mute Enabled −40 dBm
1
AC coupling ensures AVDD/2 bias.
2
Guaranteed by design. Sample tested to ensure compliance.
3
ICP is internally modified to maintain constant loop gain over the frequency range.
4
TA = 25°C; AVDD = DVDD = V
5
Using 50 Ω resistors to V
main output.
6
The noise of the VCO is measured in open-loop conditions.
7
The synthesizer phase noise floor is estimated by measuring the in-band phase noise at the output of the VCO and subtracting 20 log N (where N is the N divider
value) and 10 log F
8
The PLL phase noise is composed of 1/f (flicker) noise plus the normalized PLL noise floor. The formula for calculating the 1/f noise contribution at an RF frequency, fRF,
and at a frequency offset f is given by PN = P
9
f
= 100 MHz; f
REFIN
= 313 µA; low noise mode. The noise was measured with an EVAL-ADF4350EB1Z and the Agilent E5052A signal source analyzer.
I
CP
10
f
= 100 MHz; f
REFIN
PFD
PFD
PFD
= 3.3 V; prescaler = 8/9; f
VCO
, into a 50 Ω load. Power measured with auxiliary RF output disabled. The current consumption of the auxiliary output is the same as for the
VCO
. PN
= PN
SYNTH
= 25 MHz; offset frequency = 10 kHz; VCO frequency = 4227 MHz, output divide by two enabled. RF
− 10 log F
TOT
+ 10log(10 kHz/f) + 20log(fRF/1 GHz). Both the normalized phase noise floor and flicker noise are modeled in ADIsimPLL.
1_f
= 25 MHz; VCO frequency = 4400 MHz, RF
REFIN
− 20 log N.
PFD
= 100 MHz; f
OUT
= 25 MHz; fRF = 4.4 GHz.
PFD
= 4400 MHz; N = 176; loop BW = 40 kHz, ICP = 313 µA; low noise mode. The noise was measured with
an EVAL-ADF4350EB1Z and the Agilent E5052A signal source analyzer.
Unit Test Conditions/Comments Min Typ Max
= 2113.5 MHz; N = 169; loop BW = 40 kHz,
OUT
Rev. B | Page 4 of 34
Data Sheet ADF4350

TIMING CHARACTERISTICS

AVDD = DVDD = V otherwise noted.
Table 2.
Parameter Limit (B Version) Unit Test Conditions/Comments
t1 20 ns min LE setup time t2 10 ns min DATA to CLK setup time t3 10 ns min DATA to CLK hold time t4 25 ns min CLK high duration t5 25 ns min CLK low duration t6 10 ns min CLK to LE setup time t7 20 ns min LE pulse width
= SDVDD = VP = 3.3 V ± 10%; AGND = DGND = 0 V; 1.8 V and 3 V logic levels used; TA = T
VCO
CLK
t
4
t
5
MIN
to T
MAX
, unless
DATA
DB31 (MSB) DB30
LE
t
1
LE
t
2
t
3
DB2
(CONTROL BIT C3)
DB1
(CONTROL BIT C2)
DB0 (LSB)
(CONTROL BIT C1)
t
6
t
7
07325-002
Figure 2. Timing Diagram
Rev. B | Page 5 of 34
ADF4350 Data Sheet
REFIN to GND
−0.3 V to VDD + 0.3 V

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.
Table 3.
Parameter Rating
AVDD to GND1 −0.3 V to +3.9 V AVDD to DVDD −0.3 V to +0.3 V V
to GND −0.3 V to +3.9 V
VCO
V
to AVDD −0.3 V to +0.3 V
VCO
Digital Input/Output Voltage to GND −0.3 V to VDD + 0.3 V Analog Input/Output Voltage to GND −0.3 V to VDD + 0.3 V
Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.
This device is a high-performance RF integrated circuit with an ESD rating of <0.5 kV and is ESD sensitive. Proper precautions must be taken for handling and assembly.
Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +125°C Maximum Junction Temperature 150°C LFCSP θJA Thermal Impedance 27.3°C/W
(Paddle-Soldered)
Reflow Soldering
Peak Temperature 260°C Time at Peak Temperature 40 sec
1
GND = AGND = DGND = 0 V

TRANSISTOR COUNT

24202 (CMOS) and 918 (bipolar).

ESD CAUTION

Rev. B | Page 6 of 34
Data Sheet ADF4350
CLK
DATA
LE
CE
SW
V
P
CP
OUT
CP
GND
SDV
DD
REF
IN
DGND
DV
DD
SD
GND
MUXOUT
PDB
RF
LD
AGND
AV
DD
RF
OUT
A+
RF
OUT
B+
RF
OUT
B−
RF
OUT
A−
V
VCO
A
GNDVCO
V
REF
V
COM
R
SET
V
TUNE
A
GNDVCO
A
GNDVCO
TEM
P
V
VCO
07325-003
NOTES
1. THE LFCSP HAS AN EXPO S E D P ADDLE THAT MUST BE CONNECTED TO G ND.
24 23 22 21 20 19 18 17
1 2 3 4 5 6 7 8
9
10111213141516
32313029282726
25
ADF4350
TOP VIEW
(Not to S cale)

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1 CLK Serial Clock Input. Data is clocked into the 32-bit shift register on the CLK rising edge. This input is a high
2 DATA Serial Data Input. The serial data is loaded MSB first with the three LSBs as the control bits. This input is a high
3 LE Load Enable, CMOS Input. When LE goes high, the data stored in the shift register is loaded into the register
4 CE Chip Enable. A logic low on this pin powers down the device and puts the charge pump into three-state mode.
5 SW Fast-Lock Switch. A connection must be made from the loop filter to this pin when using the fast-lock mode. 6 VP Charge Pump Power Supply. This pin is to be equal to AVDD. Decoupling capacitors to the ground plane are to
7 CP
8 CP 9 AGND Analog Ground. This is a ground return pin for AVDD. 10 AVDD Analog Power Supply. This pin ranges from 3.0 V to 3.6 V. Decoupling capacitors to the analog ground plane are
11, 18, 21 A 12 RF 13 RF
14 RF
15 RF
16, 17 V
19 TEMP Temperature Compensation Output. Decoupling capacitors to the ground plane are to be placed as close as
20 V
Charge Pump Output. When enabled, this provides ±I
OUT
Charge Pump Ground. This is the ground return pin for CP
GND
VCO Analog Ground. These are the ground return pins for the VCO.
GNDVCO
A+ VCO Output. The output level is programmable. The VCO fundamental output or a divided down version is available.
OUT
A− Complementary VCO Output. The output level is programmable. The VCO fundamental output or a divided
OUT
B+ Auxilliary VCO Output. The output level is programmable. The VCO fundamental output or a divided down
OUT
B− Complementary Auxilliary VCO Output. The output level is programmable. The VCO fundamental output or a
OUT
Power Supply for the VCO. This ranges from 3.0 V to 3.6 V. Decoupling capacitors to the analog ground plane
VCO
Control Input to the VCO. This voltage determines the output frequency and is derived from filtering the CP
TUNE
Figure 3. Pin Configuration
impedance CMOS input.
impedance CMOS input.
that is selected by the three LSBs.
A logic high on this pin powers up the device depending on the status of the power-down bits.
be placed as close as possible to this pin.
to the external loop filter. The output of the loop filter is
connected to V
to drive the internal VCO.
TUNE
to be placed as close as possible to this pin. AV
CP
.
OUT
must have the same value as DVDD.
DD
down version is available.
version is available.
divided down version is available.
must be placed as close as possible to these pins. V
must have the same value as AVDD.
VCO
possible to this pin.
output voltage.
Rev. B | Page 7 of 34
OUT
ADF4350 Data Sheet
SET
CP
R
25.5
I =
where:
29
REFIN
Reference Input. This is a CMOS input with a nominal threshold of VDD/2 and a dc equivalent input resistance of
Pin No. Mnemonic Description
22 R
23 V
24 V 25 LD Lock Detect Output Pin. This pin outputs a logic high to indicate PLL lock. A logic low output indicates loss of PLL lock. 26 PDBRF RF Power-Down. A logic low on this pin mutes the RF outputs. This function is also software controllable. 27 DGND Digital Ground. Ground return path for DVDD. 28 DVDD Digital Power Supply. This pin must be the same voltage as AVDD. Decoupling capacitors to the ground plane
30 MUXOUT Multiplexer Output. This multiplexer output allows either the lock detect, the scaled RF, or the scaled reference
31 SD 32 SDVDD Power Supply Pin for the Digital Σ-Δ Modulator. Must be the same voltage as AVDD. Decoupling capacitors to the
33 EP Exposed Pad.
Connecting a resistor between this pin and GND sets the charge pump output current. The nominal voltage
SET
bias at the R
pin is 0.55 V. The relationship between ICP and R
SET
SET
is
R
= 5.1 kΩ
SET
ICP = 5 mA
Internal Compensation Node Biased at Half the Tuning Range. Decoupling capacitors to the ground plane must
COM
be placed as close as possible to this pin.
Reference Voltage. Decoupling capacitors to the ground plane must be placed as close as possible to this pin.
REF
must be placed as close as possible to this pin.
100 kΩ. This input can be driven from a TTL or CMOS crystal oscillator, or it can be ac-coupled.
frequency to be accessed externally.
Digital Sigma-Delta (Σ-Δ) Modulator Ground. Ground return path for the Σ-Δ modulator.
GND
ground plane are to be placed as close as possible to this pin.
Rev. B | Page 8 of 34
Data Sheet ADF4350
–150 –160
–140
–120
–100
–80
–130
–110
–90
–70
–60
–50
–40
1k
10k 100k
1M
10M
100M
07325-028
FREQUENCY (Hz )
PHASE NOISE (dBc/Hz)
1k 10k 100k 1M 10M 100M
07325-029
FREQUENCY (Hz )
PHASE NOISE (dBc/Hz)
–150 –160
–140
–120
–100
–80
–130
–110
–90
–70
–60
–50
–40
–140
–120
–100
–80
–130
–160
–150
–110
–90
–70
–60
–50
–40
1k 10k 100k
1M 10M 100M
07325-030
FREQUENCY (Hz )
PHASE NOISE (dBc/Hz)
–170
–160
–150
–140
–130
–120
–110
–100
–90
–70
–80
1k
10k
100k 1M
10M 100M
07325-031
FREQUENCY (Hz )
PHASE NOISE (dBc/Hz)
FUND DIV2 DIV4 DIV8 DIV16
–170
–160
–150
–140
–130
–120
–110
–100
–90
–70
–80
PHASE NOISE (dBc/Hz)
FUND DIV2 DIV4 DIV8 DIV16
1k 10k 100k 1M 10M 100M
07325-032
FREQUENCY (Hz )
PHASE NOISE (dBc/Hz)
–170
–160
–150
–140
–130
–120
–110
–100
–90
–70
–80
FUND DIV2 DIV4 DIV8 DIV16
1k 10k 100k 1M 10M 100M
07325-033
FREQUENCY (Hz )
PHASE NOISE (dBc/Hz)

TYPICAL PERFORMANCE CHARACTERISTICS

Figure 4. Open-Loop VCO Phase Noise, 2.2 GHz
Figure 5. Open-Loop VCO Phase Noise, 3.3 GHz
Figure 7. Closed-Loop Phase Noise, Fundamental VCO and Dividers,
VCO = 2.2 GHz, PFD = 25 MHz, Loop Bandwidth = 40 kHz
Figure 8. Closed-Loop Phase Noise, Fundamental VCO and Dividers,
VCO = 3.3 GHz, PFD = 25 MHz, Loop Bandwidth = 40 kHz
Figure 6. Open-Loop VCO Phase Noise, 4.4 GHz
Figure 9. Closed-Loop Phase Noise, Fundamental VCO and Dividers,
VCO = 4.4 GHz, PFD = 25 MHz, Loop Bandwidth = 40 kHz
Rev. B | Page 9 of 34
ADF4350 Data Sheet
0
–20
–40
–60
–80
–100
–120
–140
–160
PHASE NOISE (dBc/Hz)
1k 10k
FREQUENCY (Hz)
100k 1M
07325-034
10M
0
–20
–40
–60
–80
–100
–120
–140
–160
PHASE NOISE (dBc/Hz)
1k 10k
FREQUENCY (Hz)
100k 1M
07325-035
10M
0
–20
–40
–60
–80
–100
–120
–140
–160
PHASE NOISE (dBc/Hz)
1k 10k
FREQUENCY (Hz)
100k 1M
07325-036
10M
0
–20
–40
–60
–80
–100
–120
–140
–160
PHASE NOISE (dBc/Hz)
1k 10k
FREQUENCY (Hz)
100k 1M
07325-037
10M
0
–20
–40
–60
–80
–100
–120
–140
–160
PHASE NOISE (dBc/Hz)
1k 10k
FREQUENCY (Hz)
100k 1M
07325-038
10M
2
.95
2.
96
2.97
2.98
2.
99
3.
00
3.01
3.
02
FREQUE
NC
Y (GHz)
CSR OFF CSR ON
0 100 200
300
TIME (µs)
400 500 600
07325-039
Figure 10. Integer-N Phase Noise and Spur Performance. GSM900 Band,
RF
= 904 MHz, REFIN = 100 MHz, PFD = 800 kHz, Output Divide-by-4
OUT
Selected; Loop-Filter Bandwidth = 16 kHz, Channel Spacing = 200 kHz.
Figure 11. Fractional-N Spur Performance; Low Noise Mode. W-CDMA Band,
RF
= 2113.5 MHz, REFIN = 100 MHz, PFD = 25 MHz, Output Divide-by-2
OUT
Selected; Loop Filter Bandwidth = 40 kHz, Channel Spacing = 200 kHz.
Figure 13. Fractional-N Spur Performance. Low Noise Mode, RF
2.591 GHz, REF
= 105 MHz, PFD = 17.5 MHz, Output Divide-by-1 Selected;
IN
OUT
=
Loop Filter Bandwidth = 20 kHz, Channel Spacing = 100 kHz.
Figure 14. Fractional-N Spur Performance. Low Spur Mode RF
2.591 GHz, REF
= 105 MHz, PFD = 17.5 MHz, Output Divide-by-1 Selected.
IN
OUT
=
Loop Filter Bandwidth = 20 kHz, Channel Spacing = 100 kHz (Note That
Fractional Spurs Are Removed and Only the Integer Boundary Spur Remains
in Low Spur Mode).
Figure 12. Fractional-N Spur Performance. Low Spur Mode, W-CDMA Band
RF
= 2113.5 MHz, REFIN = 100 MHz, PFD = 25 MHz, Output Divide-by-2
OUT
Selected; Loop Filter Bandwidth = 40 kHz, Channel Spacing = 200 kHz
Figure 15. Lock Time for 100 MHz Jump from 3070 MHz to 2970 MHz with
Rev. B | Page 10 of 34
CSR On and Of f, PFD = 25 MHz, I
= 313 µA, L oop Filter Bandwidth = 20 kHz
CP
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