ANALOG DEVICES ADF4150HV Service Manual

High Voltage, Fractional-N/
V

FEATURES

Fractional-N synthesizer and integer-N synthesizer High voltage charge pump: V
Tuning range: 1.0 V to 29 V (or ±1 V from V RF bandwidth to 3.0 GHz Programmable divide-by-1/-2/-4/-8/-16 outputs Synthesizer power supply: 3.0 V to 3.6 V Programmable dual-modulus prescaler of 4/5 or 8/9 Programmable output power level Programmable charge pump currents RF output mute function 3-wire serial interface Analog and digital lock detect

APPLICATIONS

Wireless infrastructure Microwave point-to-point/point-to-multipoint radios VSAT radios Test equipment Private land mobile radios
= 6 V to 30 V
P
SDV
DD
supply rails)
P

FUNCTIONAL BLOCK DIAGRAM

AV
DD
DV
Integer-N PLL Synthesizer
ADF4150HV

GENERAL DESCRIPTION

The ADF4150HV is a 3.0 GHz, fractional-N or integer-N frequency synthesizer with an integrated high voltage charge pump. The synthesizer can be used to drive external wideband VCOs directly, eliminating the need for operational amplifiers to achieve higher tuning voltages. This simplifies design and reduces cost while improving phase noise, in contrast to active filter topologies, which tend to degrade phase noise compared to passive filter topologies.
The VCO frequency can be divided by 1, 2, 4, 8, or 16 to allow the user to generate RF output frequencies as low as 31.25 MHz. For applications that require isolation, the RF output stage can be muted. The mute function is both pin- and software-controllable.
A simple 3-wire interface controls all on-chip registers. The charge pump operates from a power supply ranging from 6 V to 30 V, whereas the rest of the device operates from 3.0 V to 3.6 V. The ADF4150HV can be powered down when not in use.
DD
P
R
SET
REF
IN
CLK
DATA
LE
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
×2
DOUBLER
DATA REG ISTE R
N COUNTER
INTEGER
VALUE
10-BIT R
COUNTER
FRACTION
VALUE
THIRD-ORDER
FRACTIONAL
INTERPOL ATOR
÷2
DIVIDER
FUNCTION
LATCH
MODULUS
VALUE
LOCK
DETECT
PHASE
COMPARATOR
MULTIPLEXER
MULTIPLEXER
HIGH VOL TAGE
CHARGE
PUMP
CURRENT
SETTING
DIVIDE -BY-1/
-2/-4/-8/-16
BOOST
MODE
OUTPUT
STAGE
INPUT
RF
MUXOUT
LD
CP
RF
RF
PDB
RF
RF
ADF4150HV
GNDCE CP
GND
SD
GND
Figure 1.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2011 Analog Devices, Inc. All rights reserved.
OUT
OUT
OUT
IN
IN
+
RF
+
09058-001
ADF4150HV

TABLE OF CONTENTS

Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Timing Characteristics ................................................................ 5
Absolute Maximum Ratings ............................................................ 6
Transistor Count ........................................................................... 6
Thermal Resistance ...................................................................... 6
ESD Caution .................................................................................. 6
Pin Configuration and Function Descriptions ............................. 7
Typical Performance Characteristics ............................................. 9
Circuit Description ......................................................................... 11
Reference Input Section ............................................................. 11
RF N Divider ............................................................................... 11
Phase Frequency Detector (PFD) and High Voltage
Charge Pump .............................................................................. 11
MUXOUT and Lock Detect ...................................................... 12
Input Shift Registers ................................................................... 12
Program Modes .......................................................................... 12
Output Stage ................................................................................ 12
Register Maps .................................................................................. 13
Register 0 ..................................................................................... 17

REVISION HISTORY

8/11—Revision 0: Initial Version
Register 1 ..................................................................................... 17
Register 2 ..................................................................................... 17
Register 3 ..................................................................................... 19
Register 4 ..................................................................................... 19
Register 5 ..................................................................................... 19
Register Initialization Sequence ............................................... 19
RF Synthesizer—A Worked Example ...................................... 20
Reference Doubler and Reference Divider ............................. 20
12-Bit Programmable Modulus ................................................ 20
Spurious Optimization and Boost Mode ................................ 21
Spur Mechanisms ....................................................................... 21
Spur Consistency and Fractional Spur Optimization ........... 21
Phase Resync ............................................................................... 22
Applications Information .............................................................. 23
Ultrawideband PLL .................................................................... 23
Microwave PLL ........................................................................... 23
Generating the High Voltage Supply ....................................... 24
Interfacing to the ADuC702x and the ADSP-BF527 ............. 25
PCB Design Guidelines for a Chip Scale Package ................. 25
Output Matching ........................................................................ 26
Outline Dimensions ....................................................................... 27
Ordering Guide .......................................................................... 27
Rev. 0 | Page 2 of 28
ADF4150HV

SPECIFICATIONS

AVDD = DVDD = SDVDD = 3.3 V ± 10%; VP = 6.0 V to 30 V; GND = 0 V; TA = T range is −40°C to +85°C.
Table 1.
Parameter Min Typ Max Unit Test Conditions/Comments
REFIN CHARACTERISTICS
Input Frequency 10 300 MHz For f < 10 MHz, ensure slew rate > 21 V/μs
10 30 MHz
Input Sensitivity 0.7 AVDD V p-p Biased at AVDD/2; ac coupling ensures AVDD/2 bias
Input Capacitance 5.0 pF
Input Current ±60 μA
RF INPUT CHARACTERISTICS
RF Input Frequency (RFIN) 0.5 3.0 GHz −10 dBm ≤ RF input power ≤ +5 dBm
Prescaler Output Frequency 750 MHz
PHASE DETECTOR
Phase Detector Frequency 26 MHz Low noise mode
20 MHz Low spur mode
26 MHz Integer-N mode
HIGH VOLTAGE CHARGE PUMP
ICP Sink/Source
High Value 384 μA R Low Value 48 μA R R
Range 3.3 10
SET
High Value vs. R
196 μA R
SET
594 μA R Sink and Source Current Matching 6 % 1.0 V ≤ VCP ≤ (VP − 1.0 V); VP = 6 V to 30 V Absolute ICP Accuracy 3 % ICP vs. VCP 2.5 % 1.0 V VCP ≤ (VP − 1.0 V) ICP vs. Temperature 2.5 % VCP = VP/2 ICP Leakage 2.5 nA VCP = VP/2
LOGIC INPUTS
Input High Voltage, V Input Low Voltage, V Input Current, I
INH/IINL
2.0 V
INH
0.6 V
INL
±1 μA
Input Capacitance, CIN 15.0 pF
LOGIC OUTPUTS
Output High Voltage, VOH DVDD − 0.4 V CMOS output selected Output High Current, IOH 500 μA Output Low Voltage, VOL 0.4 V IOL = 500 μA
POWER SUPPLIES
AVDD 3.0 3.6 V DVDD, SDVDD AVDD V VP 6.0 30 V
IP 1 2.5 mA VP = 30 V DIDD + AI
1
50 60 mA
DD
Current per Output Divider 6 to 24 mA Each output divide-by-2 consumes 6 mA typ
2
I
RFOUT
20 32 mA RF output stage is programmable
Low Power Sleep Mode 1 μA
MIN
to T
, unless otherwise noted. Operating temperature
MAX
Reference doubler enabled (DB25 bit in Register 2 is set to 1)
For lower RF
frequencies, ensure slew
IN
rate > 400 V/μs
= 5.1 kΩ
SET
= 5.1 kΩ
SET
= 10 kΩ
SET
= 3.3 kΩ
SET
Set the V
supply at least 1 V above the
P
maximum desired tuning voltage
Rev. 0 | Page 3 of 28
ADF4150HV
Parameter Min Typ Max Unit Test Conditions/Comments
RF OUTPUT CHARACTERISTICS
Output Frequency Using RF Output
Dividers
Harmonic Content (Second) −19 dBc Fundamental VCO output
−20 dBc Divided VCO output Harmonic Content (Third) −13 dBc Fundamental VCO output
−10 dBc Divided VCO output Minimum RF Output Power Maximum RF Output Power
2
−4 dBm Programmable in 3 dB steps
2
5 dBm Programmable in 3 dB steps
Output Power Variation vs. Supply ±1 dB
Output Power Variation vs. Temperature ±1 dB From −40°C to +85°C Level of Signal with RF Mute Enabled −37 dBm PDBRF pin brought low; RF = 2 GHz
NOISE CHARACTERISTICS
Normalized In-Band Phase Noise
Floor (PN
SYNTH
3
)
−203 dBc/Hz Low spur mode Normalized 1/f Noise (PN
4
)
−113 dBc/Hz Low noise mode
1_f
−108 dBc/Hz Low spur mode RF Output Divider Noise Floor −155 dBc/Hz Measured at 10 MHz offset Spurious Signals Due to PFD Frequency −70 dBc At RF
−85 dBc At VCO output
1
TA = 25°C; AVDD = DVDD = 3.3 V; prescaler = 8/9; f
2
Using 50 Ω resistors to AVDD, into a 50 Ω load.
3
This figure can be used to calculate phase noise for any application. To calculate in-band phase noise performance as seen at the VCO output, use the following formula:
PN
= PN
SYNTH
4
The PLL phase noise is composed of flicker (1/f) noise plus the normalized PLL noise floor. The flicker noise is specified at a 10 kHz offset and normalized to 1 GHz. The
formula for calculating the 1/f noise contribution at an RF frequency (fRF) and at a frequency offset (f) is given by PN = PN the normalized phase noise floor and flicker noise are modeled in ADIsimPLL.
− 10 log(f
TOT
) − 20 log N.
PFD
31.25 MHz 500 MHz VCO input and divide-by-16 selected
Pull-up supply on Pin 18 and Pin 19 varied from 3.0 V to 3.6 V
−213 dBc/Hz Low noise mode
+/RF
− pins
OUT
+ 10 log(10 kHz/f) + 20 log(fRF/1 GHz). Both
1_f
= 100 MHz; f
REFIN
= 25 MHz; fRF = 1.75 GHz.
PFD
OUT
Rev. 0 | Page 4 of 28
ADF4150HV

TIMING CHARACTERISTICS

AVDD = DVDD = SDVDD = 3.3 V ± 10%; VP = 6.0 V to 30 V; GND = 0 V; TA = T range is −40°C to +85°C.
Table 2.
Parameter Limit Unit Description
t1 20 ns min LE setup time t2 10 ns min DATA to CLK setup time t3 10 ns min DATA to CLK hold time t4 25 ns min CLK high duration t5 25 ns min CLK low duration t6 10 ns min CLK to LE setup time t7 20 ns min LE pulse width

Timing Diagram

t
4
CLK
to T
MIN
t
5
, unless otherwise noted. Operating temperature
MAX
DATA
DB31 (MSB) DB30
LE
t
1
LE
t
2
t
3
DB2
(CONTROL BIT C3)
DB1
(CONTROL BIT C2)
DB0 (LSB)
(CONTROL BIT C1)
t
6
t
7
09058-002
Figure 2. Timing Diagram
Rev. 0 | Page 5 of 28
ADF4150HV

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.
Table 3.
Parameter Rating
AVDD to GND1 −0.3 V to +3.9 V AVDD to DVDD −0.3 V to +0.3 V VP to GND1 −0.3 V to +33 V Digital I/O Voltage to GND1 −0.3 V to AVDD + 0.3 V Analog I/O Voltage to GND1 −0.3 V to DVDD + 0.3 V REFIN to GND1 −0.3 V to AVDD + 0.3 V Operating Temperature Range −40°C to +85°C Storage Temperature Range −65°C to +125°C Maximum Junction Temperature 150°C Reflow Soldering
Peak Temperature 260°C Time at Peak Temperature 40 sec
1
GND = CP
GND
= SD
GND
= 0 V.
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

TRANSISTOR COUNT

The transistor count for the ADF4150HV is 23,380 (CMOS) and 809 (bipolar).

THERMAL RESISTANCE

Thermal impedance (θJA) is specified for a device with the exposed pad soldered to GND.
Table 4. Thermal Resistance
Package Type θJA Unit
32-Lead LFCSP (CP-32-11) 27.3 °C/W

ESD CAUTION

Rev. 0 | Page 6 of 28
ADF4150HV
A

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

SDVDDMUXOUTLDREF
+
DD
IN
IN
AV
RF
RF
IN
25
GND
24 GND 23
GND DV
22
PDB
21 20
AV
19
RF
18
RF
17 GND
DD
DD
OUT
OUT
RF
+
09058-003
GND
SET
GND
R
GND
SD
32313029282726
GND
1 2
CLK
DAT
3 4 5 6
P
7 8
ADF4150HV
TOP VIEW
(Not to Scale)
9
10111213141516
DD
OUT
GND
GND
AV
CP
CP
LE CE
V GND GND
NOTES
1. THE LFCSP HAS AN EXPO SED PAD THAT MUST BE CONNECTED TO GND.
Figure 3. Pin Configuration
Table 5. Pin Function Descriptions
Pin No. Mnemonic Description
1, 7, 8, 12, 16, 17,
GND Ground. All ground pins should be tied together.
23, 24, 30, 32
2 CLK
Serial Clock Input. Data is clocked into the 32-bit shift register on the CLK rising edge. This input is a high impedance CMOS input.
3 DATA
Serial Data Input. The serial data is loaded MSB first with the three LSBs as the control bits. This input is a high impedance CMOS input.
4 LE
Load Enable. When LE goes high, the data stored in the 32-bit shift register is loaded into the register that is selected by the three control bits. This input is a high impedance CMOS input.
5 CE
6 VP
Chip Enable. A logic low on this pin powers down the device and puts the charge pump into three-state mode. A logic high on this pin powers up the device.
High Voltage Charge Pump Power Supply. Place decoupling capacitors to the ground plane as close to this pin as possible. The decoupling capacitors should have the appropriate voltage rating (a value of 10 μF is recommended). Care should be taken to ensure that V
does not exceed the absolute maximum
P
ratings on power-up (see Table 3 ). A 10 Ω series resistor can help to significantly reduce voltage overshoot with minimal IR drop.
9 CP
10 CP 11, 13, 20 AVDD
OUT
High Voltage Charge Pump Output. When enabled, this output provides ±I filter. The output of the loop filter is connected to the voltage tuning port of the external VCO.
High Voltage Charge Pump Ground. All ground pins should be tied together.
GND
Analog Power Supply. This pin ranges from 3.0 V to 3.6 V. Place decoupling capacitors to the ground plane as close to this pin as possible. AV
must have the same value as DVDD.
DD
to the external passive loop
CP
14 RFIN+ Positive RF Input. The output of the VCO or external prescaler should be ac-coupled to this pin. 15 RFIN−
Complementary RF Input. If a single-ended input is required, this pin can be tied to ground via a 100 pF capacitor.
18 RF
OUT
Divided-Down Output of RF
−. This pin can be left unconnected if the divider functionality is not
IN
required.
19 RF
OUT
+
Divided-Down Output of RF
+. This pin can be left unconnected if the divider functionality is not
IN
required. 21 PDBRF RF Power-Down. A logic low on this pin mutes the RF outputs. This function is also software controllable. 22 DVDD
25 REFIN
Digital Power Supply. Place decoupling capacitors to the ground plane as close to this pin as possible.
must have the same value as AVDD.
DV
DD
Reference Input. This CMOS input has a nominal threshold of AV
/2 and a dc equivalent input resistance
DD
of 100 kΩ. This input can be driven from a crystal oscillator, TCXO, or other reference. 26 LD
Lock Detect Output. A logic high output on this pin indicates PLL lock. A logic low output indicates loss
of PLL lock.
Rev. 0 | Page 7 of 28
ADF4150HV
Pin No. Mnemonic Description
27 MUXOUT
28 SDVDD
29 SD 31 R
Digital Σ-Δ Modulator Ground. All ground pins should be tied together.
GND
SET
EP Exposed Pad Exposed Pad. The LFCSP has an exposed pad that must be connected to GND.
Multiplexer Output. The multiplexer output allows the lock detect, the N divider value, or the R counter value to be accessed externally.
Digital Σ-Δ Modulator Power Supply. Place decoupling capacitors to the ground plane as close to this pin as possible. SDVDD must have the same value as AVDD.
Connecting a resistor between this pin and GND sets the charge pump output current. Place the resistor as close to this pin as possible. The nominal voltage bias at the R I
and R
CP
is as follows:
SET
ICP = 1.96/R
SET
pin is 0.55 V. The relationship between
SET
where:
= 5.1 kΩ.
R
SET
I
= 384 μA.
CP
Rev. 0 | Page 8 of 28
ADF4150HV

TYPICAL PERFORMANCE CHARACTERISTICS

600 550 500 450 400 350 300 250 200 150 100
50
(µA)
0
CP
I
–50 –100 –150 –200 –250 –300 –350 –400 –450 –500
0 2 4 6 8 10121416182022242628
ICP = 400µ A SOURCE ICP = 350µ A SOURCE ICP = 300µ A SOURCE ICP = 250µ A SOURCE ICP = 200µ A SOURCE ICP = 150µ A SOURCE ICP = 100µ A SOURCE
ICP = 50µA SOURCE
ICP = 50µA SINK ICP = 100µA SINK ICP = 150µA SINK ICP = 200µA SINK ICP = 250µA SINK ICP = 300µA SINK ICP = 350µA SINK ICP = 400µA SINK
VCP (V)
Figure 4. Charge Pump Output Characteristics, VP = 28 V,
Varied from 50 μA to 400 μA, R
I
CP
= 5.1 kΩ
SET
09058-004
16
14
12
10
8
6
4
2
0
–2
MISMATCH (%)
–4
CP
I
–6
–8
–10
–12
–14
–16
0 2 4 6 8 10121416182022242628
VP = 6V MISMATCH (%) VP = 9V MISMATCH (%) VP = 12V MISMATCH (%) VP = 15V MISMATCH (%) VP = 18V MISMATCH (%) VP = 21V MISMATCH (%) VP = 24V MISMATCH (%) VP = 28V MISMATCH (%)
VCP (V)
Figure 7. Charge Pump Output Mismatch vs. VP, ICP = 200 μA
09058-007
80 –85 –90 –95
–100 –105 –110 –115 –120 –125 –130 –135 –140
PHASE NOISE (d Bc/Hz)
–145 –150 –155 –160 –165 –170
100 1k 10k 100k 1M 10M 100M
FREQUENCY (Hz)
ADF4150HV RMS NOISE = 0.28°
ADF4156 RMS NOISE = 0.36°
Figure 5. Active Filter Phase Noise, ADF4150HV vs. ADF4156;
Active Filter Implemented Using OP27 Op Amp; PFD = 20 MHz, Loop
Bandwidth = 10 kHz, I
2.0
1.9
1.8
1.7
1.6
1.5
1.4
FREQUENCY (GHz)
1.3
1.2
1.1
1.0 0 50 100 150 200 250 300
= 300 μA, Carrier Frequency = 1.7 GHz, VP = 28 V
CP
BOOST MODE ON
BOOST MODE O FF
TIME (µs)
Figure 6. PLL Lock Time with Boost Mode On and Off;
Locking over Octave Range Jump (1 GHz to 2 GHz) for PFD = 20 MHz,
Loop Bandwidth = 100 kHz, I
= 300 μA, VP = 28 V, VDD = 3.3 V, REFIN = 100 MHz
CP
40
–50
BEAT NOTE
–60
–70
–80
–90
–100
SPUR LEVEL (dBc)
–110
–120
–130
1500 15251520151515101505
09058-005
SPUR
200kHz 400kHz
FREQUE NCY (MHz)
600kHz 800kHz
BEAT NOTE
SPUR
09058-008
Figure 8. Fractional Spur Levels vs. Frequency, Low Spur Mode;
Measured at VCO Output, PFD = 25 MHz, MOD = 125
40
–50
–60
–70
–80
–90
–100
SPUR LEVEL (dBc)
–110
–120
–130
09058-006
1500 15251520151515101505
200kHz 400kHz
FREQUENCY (MHz)
600kHz 800kHz
09058-009
Figure 9. Fractional Spur Levels vs. Frequency, Low Noise Mode;
Measured at VCO Output, PFD = 25 MHz, MOD = 125
Rev. 0 | Page 9 of 28
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