Datasheet ADE7518 Datasheet (ANALOG DEVICES)

Single-Phase Energy Measurement IC with

GENERAL FEATURES

Wide supply voltage operation: 2.4 V to 3.7 V Internal bipolar switch between regulated and battery inputs Ultralow power operation with power saving modes

Full operation: 4 mA to 1.6 mA (PLL clock dependent) Battery mode: 3.2 mA to 400 μA (PLL clock dependent) Sleep mode

Real-time clock (RTC) mode: 1.5 μA

RTC and LCD mode: 27 μA Reference: 1.2 V ± 0.1% (10 ppm/°C drift) 64-lead RoHS package option

Low profile quad flat package (LQFP)

Operating temperature range: −40°C to +85°C

ENERGY MEASUREMENT FEATURES

Proprietary analog-to-digital converters (ADCs) and digital

signal processing (DSP) provide high accuracy active (WATT), reactive (VAR), and apparent energy (VA) measurement Less than 0.1% error on active energy over a dynamic

range of 1000 to 1 @ 25°C

Less than 0.5% error on reactive energy over a dynamic

range of 1000 to 1 @ 25°C

Less than 0.5% error on root mean square (rms)

measurements over a dynamic range of 500 to 1 for

current (I

Supports IEC 62053-21, IEC 62053-22, IEC 62053-23,

EN 50470-3 Class A, Class B, and Class C, and ANSI C12-16 Differential input with programmable gain amplifiers (PGAs)

supports shunts and current transformers

High frequency outputs proportional to I

or apparent power (AP)

) and 100 to 1 for voltage (V

rms

) @ 25°C

rms

, active, reactive,

rms

8052 MCU, RTC, and LCD Driver

ADE7518

MICROPROCESSOR FEATURES

8052-based core

Single-cycle 4 MIPS 8052 core 8052-compatible instruction set

32.768 kHz external crystal with on-chip PLL Two external interrupt sources External reset pin

Low power battery mode

Wake-up from I/O, alarm, and universal asynchronous

receiver/transmitter (UART)

LCD driver operation

Real-time clock

Counter for seconds, minutes, and hours Automatic battery switchover for RTC backup Operation down to 2.4 V Ultralow battery supply current: 1.5 μA Selectable output frequency: 1 Hz to 16.384 kHz Embedded digital crystal frequency compensation for

calibration and temperature variation: 2 ppm resolution

Integrated LCD driver

108-segment driver 2×, 3×, or 4× multiplexing LCD voltages generated with external resistors

On-chip peripherals

UART, SPI or I Power supply management with user-selectable levels Memory: 16 kB flash memory, 512 bytes RAM Development tools

Single-pin emulation

IDE-based assembly and C-source debugging

C, and watchdog timer

Rev. 0

Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.

ADE7518

General Features ............................................................................... 1

Energy Measurement Features ........................................................ 1

Microprocessor Features .................................................................. 1

Revision History ............................................................................... 3

General Description ......................................................................... 4

Functional Block Diagram .............................................................. 4

Specifications ..................................................................................... 5

Energy Metering ........................................................................... 5

Analog Peripherals ....................................................................... 6

Digital Interface ............................................................................ 7

Timing Specifications .................................................................. 9

Absolute Maximum Ratings .......................................................... 14

Thermal Resistance .................................................................... 14

ESD Caution ................................................................................ 14

Pin Configuration and Function Descriptions ........................... 15

Typical Performance Characteristics ........................................... 17

Terminology .................................................................................... 20

SFR Mapping ................................................................................... 21

Power Management ........................................................................ 22

Power Management Register Details ....................................... 22

Power Supply Architecture ........................................................ 25

Battery Switchover ...................................................................... 25

Power Supply Management (PSM) Interrupt ......................... 26

Using the Power Supply Features ............................................. 28

Operating Modes ............................................................................ 30

PSM0 (Normal Mode) ............................................................... 30

PSM1 (Battery Mode) ................................................................ 30

PSM2 (Sleep Mode) .................................................................... 30

3.3 V Peripherals and Wake-Up Events ................................... 31

Transitioning Between Operating Modes ............................... 32

Using the Power Management Features .................................. 32

Energy Measurement ..................................................................... 33

Access to Energy Measurement SFRs ...................................... 33

Access to Internal Energy Measurement Registers ................ 33

Energy Measurement Registers ................................................ 35

Energy Measurement Internal Registers Details .................... 36

Interrupt Status/Enable SFRs .................................................... 38

Analog Inputs .............................................................................. 40

Analog-to-Digital Conversion .................................................. 41

Power Quality Measurements ................................................... 44

Phase Compensation ................................................................. 46

RMS Calculation ........................................................................ 46

Active Power Calculation .......................................................... 48

Active Energy Calculation ........................................................ 50

Reactive Power Calculation ...................................................... 53

Reactive Energy Calculation ..................................................... 54

Apparent Power Calculation ..................................................... 58

Apparent Energy Calculation ................................................... 59

Ampere-Hour Accumulation ................................................... 60

Energy-to-Frequency Conversion............................................ 61

Energy Register Scaling ............................................................. 62

Energy Measurement Interrupts .............................................. 62

8052 MCU CORE Architecture .................................................... 63

MCU Registers ............................................................................ 63

Basic 8052 Registers ................................................................... 65

Standard 8052 SFRs .................................................................... 66

Memory Overview ..................................................................... 66

Addressing Modes ...................................................................... 67

Instruction Set ............................................................................ 69

Read-Modify-Write Instructions ............................................. 71

Instructions That Affect Flags .................................................. 71

Dual Data Pointers ......................................................................... 73

Interrupt System ............................................................................. 74

Standard 8052 Interrupt Architecture ..................................... 74

Interrupt Architecture ............................................................... 74

Interrupt Registers...................................................................... 74

Interrupt Priority ........................................................................ 75

Interrupt Flags ............................................................................ 76

Interrupt Vectors ........................................................................ 78

Interrupt Latency ........................................................................ 78

Context Saving ............................................................................ 78

Watchdog Timer ............................................................................. 79

LCD Driver ...................................................................................... 81

LCD Registers ............................................................................. 81

LCD Setup ................................................................................... 84

LCD Timing and Waveforms .................................................... 84

Blink Mode .................................................................................. 85

Display Element Control ........................................................... 85

LCD External Circuitry ............................................................. 86

LCD Function in PSM2 ............................................................. 86

Rev. 0 | Page 2 of 128

ADE7518

Flash Memory .................................................................................. 87

Overview ...................................................................................... 87

Flash Memory Organization ...................................................... 88

Using the Flash Memory ............................................................ 88

Protecting the Flash Memory .................................................... 91

In-Circuit Programming ............................................................ 92

Timers ............................................................................................... 93

Timer Registers ............................................................................ 93

Timer 0 and Timer 1 ................................................................... 95

Timer 2 ......................................................................................... 96

PLL .................................................................................................... 98

PLL Registers ............................................................................... 98

Real-Time Clock ........................................................................... 100

RTC Registers ........................................................................... 100

Read and Write Operations .................................................... 103

RTC Modes ............................................................................... 103

RTC Interrupts ......................................................................... 103

RTC Calibration ....................................................................... 104

UART Serial Interface .................................................................. 105

UART Registers ........................................................................ 105

UART Operation Modes ......................................................... 108

UART Baud Rate Generation ................................................. 109

UART Additional Features ...................................................... 111

Serial Peripheral Interface (SPI) .................................................. 112

SPI Registers .............................................................................. 112

SPI Pins ....................................................................................... 115

SPI Master Operating Modes .................................................. 116

SPI Interrupt and Status Flags ................................................. 117

I2C-Compatible Interface ............................................................. 118

Serial Clock Generation ........................................................... 118

Slave Addresses .......................................................................... 118

I2C Registers ............................................................................... 118

Read and Write Operations ..................................................... 119

I2C Receive and Transmit FIFOs ............................................. 120

I/O Ports ......................................................................................... 121

Parallel I/O ................................................................................. 121

I/O Registers .............................................................................. 122

Port 0 ........................................................................................... 125

Port 1 ........................................................................................... 125

Port 2 ........................................................................................... 125

Determining the Version of the ADE7518 ................................ 126

Outline Dimensions ...................................................................... 127

Ordering Guide ......................................................................... 127

REVISION HISTORY

1/09—Revision 0: Initial Version

Rev. 0 | Page 3 of 128

ADE7518

)

GENERAL DESCRIPTION

The ADE75181 integrates the Analog Devices, Inc., energy (ADE) metering IC analog front end and fixed function DSP solution with an enhanced 8052 MCU core, an RTC, an LCD driver, and all the peripherals to make an electronic energy meter with an LCD display in a single part.

The ADE measurement core includes active, reactive, and apparent energy calculations, as well as voltage and current rms measurements. This information is ready to use for energy billing by using built-in energy scalars. Many power line supervisory features, such as SAG, peak, and zero crossing, are included in the energy measurement DSP to simplify energy meter design.

The microprocessor functionality includes a single-cycle 8052 core, a real-time clock with a power supply backup pin, a UART, and an

SPI or I

C® interface. The ready-to-use information from the ADE core reduces the program memory size requirement, making it easy to integrate complicated design into 16 kB of flash memory.

The ADE7518 also includes a 108-segment LCD driver. This driver generates waveforms capable of driving LCDs up to 3.3 V.

DGND

GND

BAT

FUNCTIONAL BLOCK DIAGRAM

K L C

SPI/I2C

SERIAL

USER RAM

256 BYTES

USER XRAM

256 BYTES

LDO

D T N

O S

I M

T A D S

I S O M

LDO

T0T

T2T

3 × 16-BIT COUNTER

TIMERS

POR

A T N

X E 2

SINGLE

CYCLE

T E S E R

8052 MCU

T U O

/ N

F E R

1.20V REF

PGA1

–

PGA2

–

ADC

POWER SUPPLY

CONTROL AND

MONIT ORING

N I

C D

F C

43 42 39 38 7 6 45 11 43 42 41 40 39 38 37 36 5 6 7 8 9 1038 39 40 41

INTERFACE

ENERGY

MEASUREMENT

DSP

PROGRAM MEMORY

16kB FLASH

D D

T U O

W S

) 1 T

/ L R T C B

( 0

. 0 P

1-PIN

EMULATOR

) L A C C T

)

P F

(

DOWNLOADER

DEBUGGER

UART

TIMER

N E D S

A T A

) 0

)

C S

(

WATCHDOG

TIMER

UART

SERIAL

PORT

D x T

) 1 T

/ S S

( 7

. 0 P

D x

) 4 2 P F

)

(

ADE7518

LCD

LEVELS

108-SEGMENT

LCD DRIVER

RTC

) 3 2

)

/ 2

(

PLL

OSC

4647 48 45

1 L A T X

)

(

P2.0 (FP18)

P2.1 (FP17)

P2.2 (FP16)

P2.3 (SDEN)

LCDVP1

LCDVP2

LCDVA

LCDVB

LCDVC

COM0

. .

...

COM3

FP0

. .

...

FP15

FP16

FP17

FP18

FP19

FP20

FP21

FP22

FP23

FP24

FP25

FP26

T X

07327-001

Figure 1.

Patents pending.

Rev. 0 | Page 4 of 128

ADE7518

SPECIFICATIONS

VDD = 3.3 V ± 5%, AGND = DGND = 0 V, on-chip reference XTAL = 32.768 kHz, T

ENERGY METERING

Table 1.

Parameter Min Typ Max Unit Test Conditions/Comments

MEASUREMENT ACCURACY1

Phase Error Between Channels

PF = 0.8 Capacitive ±0.05 Degrees 37° phase lead PF = 0.5 Inductive ±0.05 Degrees 60° phase lag

Active Energy Measurement Error2 0.1 % of reading Over a dynamic range of 1000 to 1 @ 25°C

AC Power Supply Rejection2 V

Output Frequency Variation 0.01 % IP = VP = ±100 mV rms

DC Power Supply Rejection2 V

Output Frequency Variation 0.01 % Active Energy Measurement Bandwidth1 8 kHz Reactive Energy Measurement Error2 0.5 % of reading Over a dynamic range of 1000 to 1 @ 25°C V

Measurement Error2 0.5 % of reading Over a dynamic range of 100 to 1 @ 25°C

rms

Measurement Bandwidth1 3.9 kHz

rms

Measurement Error2 0.5 % of reading Over a dynamic range of 500 to 1 @ 25°C

rms

Measurement Bandwidth1 3.9 kHz

rms

ANALOG INPUTS

Maximum Signal Levels ±400 mV peak VP − VN differential input

±400 mV peak IP − IN differential input Input Impedance (DC) 770 kΩ ADC Offset Error2 ±10 mV PGA1 = PGA2 = 1

±1 mV PGA1 = 16

Gain Error2

Current Channel −3 + 3 % IP = 0.4 V dc or IP = 0.4 dc

Voltage Channel −3 + 3 % Voltage channel = 0.4 V dc Gain Error Match ±0.2 %

CF1 AND CF2 PULSE OUTPUT

Maximum Output Frequency 13.5 kHz

Duty Cycle 50 % If CF1 or CF2 frequency, >5.55 Hz Active High Pulse Width 90 ms If CF1 or CF2 frequency, <5.55 Hz

These specifications are not production tested but are guaranteed by design and/or characterization data on production release.

See the Terminology section for definition.

MIN

to T

= −40°C to +85°C, unless otherwise noted.

MAX

= 3.3 V + 100 mV rms/120 Hz

= 3.3 V ± 117 mV dc

− VN = 400 mV peak, IP − IN = 250 mV,

PGA1 = 2 sine wave

Rev. 0 | Page 5 of 128

ADE7518

ANALOG PERIPHERALS

Table 2.

Parameter Min Typ Max Unit Test Conditions/Comments

POWER-ON RESET (POR)

VDD POR

Detection Threshold 2.5 2.95 V POR Active Timeout Period 33 ms

POR

SWOUT

Detection Threshold 1.8 2.2 V POR Active Timeout Period 20 ms

POR

INTD

Detection Threshold 2.03 2.22 V POR Active Timeout Period 16 ms

POR

INTA

Detection Threshold 2.05 2.15 V POR Active Timeout Period 120 ms

BATTERY SWITCHOVER

Voltage Operating Range (V VDD to V

Switching

BAT

Switching Threshold (VDD) 2.5 2.95 V Switching Delay 10 ns When VDD to V 30 ms When VDD to V

to VDD Switching

BAT

Switching Threshold (VDD) 2.5 2.95 V Switching Delay 30 ms Based on VDD > 2.75 V

To V

SWOUT

Leakage Current 10 nA V

BAT

LCD, RESISTOR LADDER ACTIVE

Leakage Current ±20 nA 1/2 and 1/3 bias modes, no load V1 Segment Line Voltage LCDVA − 0.1 LCDVA V Current on segment line = −2 μA V2 Segment Line Voltage LCDVB − 0.1 LCDVB V Current on segment line = −2 μA V3 Segment Line Voltage LCDVC − 0.1 LCDVC V Current on segment line = −2 μA

ON-CHIP REFERENCE

Reference Error ±0.9 mV TA = 25°C Power Supply Rejection 80 dB Temperature Coefficient 10 50 ppm/°C

) 2.4 3.7 V

SWOUT

= 0 V, V

BAT

switch activated by VDD

BAT

switch activated by V

BAT

= 3.43 V, TA = 25°C

SWOUT

DCIN

Rev. 0 | Page 6 of 128

ADE7518

DIGITAL INTERFACE

Table 3.

Parameter Min Typ Max Unit Test Conditions/Comments

LOGIC INPUTS

All Inputs Except XTAL1, XTAL2, BCTRL,

, INT1, RESET

INT0

Input High Voltage, V

Input Low Voltage, V

2.0 V

INH

0.4 V

INL

BCTRL, INT0, INT1, RESET

Input High Voltage, V

Input Low Voltage, V

1.3 V

INH

0.4 V

INL

Input Currents

RESET

Port 0, Port 1, Port 2 ±100 nA Internal pull-up disabled, input = 0 V or V

−3.75 −8.5 μA Internal pull-up enabled, input = 0 V, V Input Capacitance 10 pF All digital inputs

FLASH MEMORY

Endurance1 10,000 Cycles Data Retention2 20 Years TJ = 85°C

CRYSTAL OSCILLATOR

Crystal Equivalent Series Resistance 30 50 kΩ Crystal Frequency 32 32.768 33.5 kHz XTAL1 Input Capacitance 12 pF XTAL2 Output Capacitance 12 pF

MCU CLOCK RATE (f

) 4.096 MHz Crystal = 32.768 kHz and CD[2:0] = 0b000

CORE

32 kHz Crystal = 32.768 kHz and CD[2:0] = 0b111 LOGIC OUTPUTS

Output High Voltage, VOH 2.4 V VDD = 3.3 V ± 5%

80 μA

SOURCE

Output Low Voltage, V

2 mA

SINK

0.4 V VDD = 3.3 V ± 5%

START-UP TIME4

PSM0 Power-On Time 448 ms VDD at 2.75 V to PSM0 code execution From Power Saving Mode 1 (PSM1)

PSM1 → PSM0

From Power Saving Mode 2 (PSM2)

PSM2 → PSM1 PSM2 → PSM0

POWER SUPPLY INPUTS

VDD 3.13 3.3 3.46 V V

2.4 3.3 3.7 V

BAT

INTERNAL POWER SUPPLY SWITCH (V

to V

BAT

VDD to V V

←→ VDD Switching Open Time

BAT

On Resistance 22 Ω V

SWOUT

On Resistance 10.2 Ω VDD = 3.13 V

SWOUT

BCTRL State Change and Switch Delay 18 μs V

Output Current Drive 1 6 mA

SWOUT

POWER SUPPLY OUTPUTS

2.25 2.75 V

INTA

2.3 2.70 V

INTD

Power Supply Rejection 60 dB

INTA

Power Supply Rejection 50 dB

INTD

100 nA

RESET = V

130 ms V

ms Wake-up event to PSM1 code execution

186 ms V

at 2.75 V to PSM0 code execution

)

= 2.4 V

BAT

40 ns

SWOUT

= 3.3 V

SWOUT

= 3.3 V

Rev. 0 | Page 7 of 128

ADE7518

Parameter Min Typ Max Unit Test Conditions/Comments

POWER SUPPLY CURRENTS

Current in Normal Mode (PSM0) 4 5.3 mA f

2.1 mA f

1.6 mA f

3.2 4.25 mA

3 3.9 mA

Current in PSM1 3.2 5.05 mA f 880 μA f Current in PSM2 38 μA LCD active at 3.3 V + RTC (real-time clock)

1.5 μA RTC only, TA = 25°C, V

POWER SUPPLY CURRENTS

Current in Normal Mode (PSM0) 4 5.3 mA f

Endurance is qualified as per JEDEC Standard 22 Method A117 and measured at −40°C, +25°C, +85°C, and +125°C.

Retention lifetime equivalent at junction temperature (TJ) = 85°C as per JEDEC Standard 22 Method A117. Retention lifetime derates with junction temperature.

Test performed with all the I/Os set to a low output level.

Delay between power supply valid and execution of first instruction by 8052 core.

= 4.096 MHz, LCD and meter active

CORE

= 1.024 MHz, LCD and meter active

CORE

= 32.768 kHz, LCD and meter active

CORE

= 4.096 MHz, meter DSP active, metering ADC

CORE

powered down

= 4.096 MHz, metering ADC and DSP powered

CORE

down

= 4.096 MHz, LCD active, V

CORE

= 1.024 MHz, LCD active

CORE

= 3.3 V

BAT

= 4.096 MHz, LCD and meter active

CORE

= 3.7 V

BAT

Rev. 0 | Page 8 of 128

ADE7518

–

TIMING SPECIFICATIONS

AC inputs during testing were driven at V and 0.45 V for Logic 0. Timing measurements were made at V minimum for Logic 1 and V

maximum for Logic 0, as shown in

Figure 2.

0.5

SWOUT

0.45V

Table 4. Clock Input (External Clock Driven XTAL1) Parameters

32.768 kHz External Crystal

Parameter Description Min Typ Max Unit

tCK XTAL1 period 30.52 μs t

XTAL1 width low 6.26 μs

CKL

XTAL1 width high 6.26 μs

CKH

XTAL1 rise time 9 ns

CKR

XTAL1 fall time 9 ns

CKF

1/t

Core clock frequency1 0.032768 1.024 4.096 MHz

CORE

The ADE7518 internal PLL locks onto a multiple (512 times) of the 32.768 kHz external crystal frequency to provide a stable 4.096 MHz internal clock for the system.

The core can operate at this frequency or at a binary submultiple defined by the CD[2:0] bits, selected via the POWCON SFR (see Table 24).

− 0.5 V for Logic 1

SWOUT

0.2V

+ 0.9V

SWOUT

TEST POINTS

– 0.1V

SWOUT

Figure 2. Timing Waveform Characteristics

For timing purposes, a port pin is no longer floating when a 100 mV change from load voltage occurs. A port pin begins to float when a 100 mV change from the loaded V occurs, as shown in Figure 2.

Fo r Ta bl e 4 t o Tabl e 9 , C

3.6 V, and all specifications T

– 0.1V

LOAD

+ 0.1V

LOAD

TIMING

REFERENCE

POINTS

= 80 pF for all outputs, VDD = 2.7 V to

LOAD

to T

MIN

, unless otherwise noted.

MAX

– 0.1V

LOAD

– 0.1V

LOAD

OH/VOL

07327-002

level

Table 5. I2C-Compatible Interface Timing Parameters (400 kHz)

Parameter Description Typ Uni t

Bus-free time between stop condition and start condition 1.3 μs

BUF

tL SCLK low pulse width 1.36 μs tH SCLK high pulse width 1.14 μs t

Start condition hold time 251.35 μs

SHD

Data setup time 740 ns

DSU

Data hold time 400 ns

DHD

Setup time for repeated start 12.5 ns

RSU

Stop condition setup time 400 ns

PSU

tR Rise time of both SCLK and SDATA 200 ns tF Fall time of both SCLK and SDATA 300 ns

Pulse width of spike suppressed 50 ns

SUP

Input filtering on both the SCLK and SDATA inputs suppresses noise spikes of less than 50 ns.

SDATA (I/O)

SCLK (I)

BUF

MSB

DSU

PSU

STOP

CONDITI ON

START

CONDITI ON

SHD

DHD

2TO 7

Figure 3. I

C-Compatible Interface Timing

SUP

LSB ACK MSB

DSU

89 1

SUP

DHD

RSU

S(R)

REPEATED

START

7327-003

Rev. 0 | Page 9 of 128

ADE7518

Table 6. SPI Master Mode Timing (SPICPHA = 1) Parameters

Parameter Description Min Typ Max Unit

tSL SCLK low pulse width 2 tSH SCLK high pulse width 2 t

Data output valid after SCLK edge 3 × t

DAV

Data input setup time before SCLK edge 0 ns

DSU

Data input hold time after SCLK edge t

DHD

tDF Data output fall time 19 ns tDR Data output rise time 19 ns tSR SCLK rise time 19 ns tSF SCLK fall time 19 ns

depends on the clock divider or CD[2:0] bits of the POWCON SFR (see Table 24); t

CORE

SCLK

(SPICPOL = 0)

SCLK

(SPICPOL = 1)

MOSI

DAV

MSB

SPIR

× t

SPIR

× t

CORE

= 2CD/4.096 MHz.

CORE

BITS [6:1]

CORE

LSB

MISO

DSU

MSB IN

BITS [6:1]

DHD

LSB IN

07327-004

Figure 4. SPI Master Mode Timing (SPICPHA = 1)

Rev. 0 | Page 10 of 128

ADE7518

Table 7. SPI Master Mode Timing (SPICPHA = 0) Parameters

Parameter Description Min Typ Max Unit

tSL SCLK low pulse width 2 tSH SCLK high pulse width 2 t

Data output valid after SCLK edge 3 × t

DAV

Data output setup before SCLK edge 75 ns

DOSU

Data input setup time before SCLK edge 0 ns

DSU

Data input hold time after SCLK edge t

DHD

tDF Data output fall time 19 ns tDR Data output rise time 19 ns tSR SCLK rise time 19 ns tSF SCLK fall time 19 ns

depends on the clock divider or CD[2:0] bits of the POWCON SFR (see Table 24); t

CORE

SCLK

(SPICPOL = 0)

SCLK

(SPICPOL = 1)

MOSI

DOSU

MSB

DAV

BITS [6:1]

SPIR

× t

SPIR

× t

CORE

= 2CD/4.096 MHz.

CORE

(SPIR + 1) × t

CORE

(SPIR + 1) × t

CORE

LSB

CORE

MISO

DSU

MSB IN

BITS [6:1]

DHD

LSB IN

7327-005

Figure 5. SPI Master Mode Timing (SPICPHA = 0)

Rev. 0 | Page 11 of 128

ADE7518

Table 8. SPI Slave Mode Timing (SPICPHA = 1) Parameters

Parameter Description Min Typ Max Unit

tSS

to SCLK edge

SS tSL SCLK low pulse width 6 × t tSH SCLK high pulse width 6 × t t

Data output valid after SCLK edge 25 ns

DAV

Data input setup time before SCLK edge 0 ns

DSU

Data input hold time after SCLK edge 2 × t

DHD

tDF Data output fall time 19 ns tDR Data output rise time 19 ns tSR SCLK rise time 19 ns tSF SCLK fall time 19 ns t

SFS

depends on the clock divider or CD[2:0] bits of the POWCON SFR (see Table 24); t

CORE

high after SCLK edge

CORE

SCLK

(SPICPOL = 0)

SCLK

(SPICPOL = 1)

145 ns

CORE

+ 0.5 μs

CORE

0 ns

= 2CD/4.096 MHz.

SFS

DAV

MISO

MOSI BITS [6:1]

DSU

MSB IN

MSB

DHD

BITS [6:1]

LSB

LSB IN

07327-006

Figure 6. SPI Slave Mode Timing (SPICPHA = 1)

Rev. 0 | Page 12 of 128

ADE7518

Table 9. SPI Slave Mode Timing (SPICPHA = 0) Parameters

Parameter Description Min Typ Max Unit

tSS

to SCLK edge

SS tSL SCLK low pulse width 6 × t tSH SCLK high pulse width 6 × t t

Data output valid after SCLK edge 25 ns

DAV

Data input setup time before SCLK edge 0 ns

DSU

Data input hold time after SCLK edge 2 × t

DHD

tDF Data output fall time 19 ns tDR Data output rise time 19 ns tSR SCLK rise time 19 ns tSF SCLK fall time 19 ns t

DOSS

SFS

depends on the clock divider or CD[2:0] bits of the POWCON SFR (see Table 24); t

CORE

Data output valid after SS

high after SCLK edge

edge

= 2CD/4.096 MHz.

CORE

145 ns

CORE

+ 0.5 μs

CORE

0 ns 0 ns

SFS

SCLK

(SPICPOL = 0)

SCLK

(SPICPOL = 1)

MISO

MOSI

DOSS

DSU

MSB IN

MSB

DHD

DAV

BITS [6:1]

LSB IN

LSB

07327-007

Figure 7. SPI Slave Mode Timing (SPICPHA = 0)

Rev. 0 | Page 13 of 128

ADE7518

ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted.

Table 10.

Parameter Rating

VDD to DGND −0.3 V to +3.7 V V

to DGND −0.3 V to +3.7 V

BAT

to DGND −0.3 V to V

DCIN

Input LCD Voltage to AGND, LCDVA,

LCDVB, LCDVC

Analog Input Voltage to AGND, VP, VN, IP,

and I

−0.3 V to V

−2 V to +2 V

Digital Input Voltage to DGND −0.3 V to V Digital Output Voltage to DGND −0.3 V to V

SWOUT

+ 0.3 V + 0.3 V

+ 0.3 V

+ 0.3 V Operating Temperature Range (Industrial) −40°C to +85°C Storage Temperature Range −65°C to +150°C 64-Lead LQFP, Power Dissipation 1 W Lead Temperature

Soldering 300°C Time 30 sec

When used with external resistor divider.

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages.

Table 11. Thermal Resistance

Package Type θJA θ

Unit

64-Lead LQFP 60 20.5 °C/W

ESD CAUTION

Rev. 0 | Page 14 of 128

ADE7518

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

INTA

BAT

ADE7518

TOP VIEW

(Not to Scale)

IN/OU

REF

FP26

AGND53I

RESET

FP927FP828FP729FP630FP531FP432FP3

FP11

FP10

51EA50

INT0

XTAL1

XTAL2

BCTRL/INT1/P0.0

SDEN/P2.3

P0.2/CF1/RTCCAL

P0.3/CF2

P0.4/MOSI/SDATA

P0.5/MISO

P0.6/SCLK/T0

P0.7/SS/T1

P1.0/RxD

P1.1/TxD

FP0

FP1

FP2

07327-008

COM3/F P27

COM2/F P28

COM1

COM0

P1.2/FP25

P1.3/T2EX/FP24

P1.4/T2/ FP23

P1.5/FP22

P1.6/FP21

P1.7/FP20

P0.1/FP19

P2.0/FP18

P2.1/FP17

P2.2/FP16

LCDVC

LCDVP2

DCIN

INTD

SWOUT

LCDVP1

FP1521FP1422FP1323FP12

DGND62V

PIN 1

LCDVA

LCDVB

Figure 8. Pin Configuration

Table 12. Pin Function Descriptions

Pin No. Mnemonic Description

1 COM3/FP27 Common Output 3 or LCD Segment Output 27. COM3 is used for LCD backplane. 2 COM2/FP28 Common Output 2 or LCD Segment Output 28. COM2 is used for LCD backplane. 3 COM1 Common Output 1. COM1 is used for LCD backplane. 4 COM0 Common Output 0. COM0 is used for LCD backplane. 5 P1.2/FP25 General-Purpose Digital I/O Port 1.2 or LCD Segment Output 25. 6 P1.3/T2EX/FP24 General-Purpose Digital I/O Port 1.3, Timer 2 Control Input, or LCD Segment Output 24. 7 P1.4/T2/FP23 General-Purpose Digital I/O Port 1.4, Timer 2 Input, or LCD Segment Output 23. 8 P1.5/FP22 General-Purpose Digital I/O Port 1.5 or LCD Segment Output 22. 9 P1.6/FP21 General-Purpose Digital I/O Port 1.6 or LCD Segment Output 21. 10 P1.7/FP20 General-Purpose Digital I/O Port 1.7 or LCD Segment Output 20. 11 P0.1/FP19 General-Purpose Digital I/O Port 0.1 or LCD Segment Output 19. 12 P2.0/FP18 General-Purpose Digital I/O Port 2.0 or LCD Segment Output 18. 13 P2.1/FP17 General-Purpose Digital I/O Port 2.1 or LCD Segment Output 17. 14 P2.2/FP16 General-Purpose Digital I/O Port 2.2 or LCD Segment Output 16. 15 LCDVC

This pin is internally connected to V

. A resistor should be connected between LCDVC and LCDVB to

generate the top two voltages for the LCD waveforms (see the LCD Driver section). 16 LCDVP2 This pin is internally connected to LCDVP1 (see the LCD Driver section). 17 LCDVB

This pin is an input voltage for the LCD driver. A resistor should be connected between LCDVB and LCDVC to

generate an intermediate voltage for the LCD driver. In 1/3 bias LCD mode, another resistor must be

connected between LCDVB and LCDVA to generate another intermediate voltage. In 1/2 bias LCD mode,

LCDVB and LCDVA are internally connected (see the LCD Driver section). 18 LCDVA

This pin is an input voltage for the LCD driver. A resistor should be connected between LCDVA and LCDVP1

to generate an intermediate voltage for the LCD driver. In 1/3 bias LCD mode, another resistor must be

connected between LCDVB and LCDVA to generate another intermediate voltage. In 1/2 bias LCD mode,

LCDVB and LCDVA are internally connected (see the LCD Driver section). 19 LCDVP1

This pin is an input voltage for the LCD driver. A resistor should be connected between LCDVA and LCDVP1

to generate an intermediate voltage for the LCD driver. Another resistor must be connected between

LCDVP1 and DGND to generate another intermediate voltage (see the LCD Driver section). 35 to 20 FP0 to F15 LCD Segment Output 0 to LCD Segment Output 15. 36 P1.1/TxD General-Purpose Digital I/O Port 1.1 or Transmitter Data Output (Asynchronous).

Rev. 0 | Page 15 of 128

ADE7518

Pin No. Mnemonic Description

37 P1.0/RxD General-Purpose Digital I/O Port 1.0 or Receiver Data Input (Asynchronous). 38

P0.7/SS

/T1 39 P0.6/SCLK/T0 General-Purpose Digital I/O Port 0.6, Clock Output for I2C or SPI Port, or Timer 0 Input. 40 P0.5/MISO General-Purpose Digital I/O Port 0.5 or Data Input for SPI Port. 41 P0.4/MOSI/SDATA General-Purpose Digital I/O Port 0.4, Data Output for SPI Port, or I2C-Compatible Data Line. 42 P0.3/CF2

43 P0.2/CF1/RTCCAL

/P2.3 Serial Download Mode Enable or Digital Output Port P2.3. This pin is used to enable serial download mode

SDEN

BCTRL/INT1

/P0.0 Digital Input for Battery Control, External Interrupt Input 1, or General-Purpose Digital I/O Port 0.0. This logic

46 XTAL2

47 XTAL1

INT0

49, 50 VP, VN

This pin is used as an input for emulation. When held high, this input enables the device to fetch code from

52, 53 IP, IN

54 AGND This pin provides the ground reference for the analog circuitry. 55 FP26 LCD Segment Output 26. 56 57 REF

58 V

59 V

RESET

IN/OUT

BAT

INTA

60 VDD

61 V

62 V

SWOUT

INTD

63 DGND This pin provides the ground reference for the digital circuitry. 64 V

DCIN

General-Purpose Digital I/O Port 0.7, Slave Select When SPI is in Slave Mode, or Timer 1 Input.

General-Purpose Digital I/O Port 0.3 or Calibration Frequency Logic Output 2. The CF2 logic output gives instantaneous active, reactive, I

, or apparent power information.

rms

General-Purpose Digital I/O Port 0.2, Calibration Frequency Logic Output 1, or RTC Calibration Frequency Logic Output. The CF1 logic output gives instantaneous active, reactive, I

, or apparent power information.

rms

The RTCCAL logic output gives access to the calibrated RTC output.

through a resistor when pulled low on power-up or reset. On reset, this pin momentarily becomes an input and the status of the pin is sampled. If there is no pull-down resistor in place, the pin momentarily goes high and then user code is executed. If the pin is pulled down on reset, the embedded serial download/debug kernel executes, and this pin remains low during the internal program execution. After reset, this pin can be used as a digital output port pin (P2.3).

or V

input connects V

BAT

to V

open, the connection between V

internally when set to logic high or logic low, respectively. When left

SWOUT

and V

or between V

SWOUT

BAT

and V

is selected internally.

SWOUT

A crystal can be connected across this pin and XTAL1 (see the XTAL1 pin description) to provide a clock source for the ADE7518. The XTAL2 pin can drive one CMOS load when an external clock is supplied at XTAL1 or by the gate oscillator circuit. An internal 6 pF capacitor is connected to this pin.

An external clock can be provided at this logic input. Alternatively, a parallel resonant AT crystal can be connected across XTAL1 and XTAL2 to provide a clock source for the ADE7518. The clock frequency for specified operation is 32.768 kHz. An internal 6 pF capacitor is connected to this pin.

External Interrupt Input 0. Analog Inputs for Voltage Channel. These inputs are fully differential voltage inputs with a maximum

differential level of ±400 mV for specified operation. This channel also has an internal PGA.

internal program memory locations. The ADE7518 does not support external code memory. This pin should not be left floating.

Analog Inputs for Current Channel. These inputs are fully differential voltage inputs with a maximum differential level of ±400 mV for specified operation. This channel also has an internal PGA.

Reset Input, Active Low. This pin provides access to the on-chip voltage reference. The on-chip reference has a nominal value of

1.2 V ± 0.1% and a typical temperature coefficient of 50 ppm/°C maximum. This pin should be decoupled with a 1 μF capacitor in parallel with a ceramic 100 nF capacitor.

Power Supply Input from the Battery with a 2.4 V to 2.7 V Range. This pin is connected internally to V

when

the battery is selected as the power supply for the ADE7518. This pin provides access to the on-chip 2.5 V analog LDO. No external active circuitry should be connected to

this pin. This pin should be decoupled with a 10 μF capacitor in parallel with a ceramic 100 nF capacitor.

3.3 V Power Supply Input from the Regulator. This pin is connected internally to V

when the regulator is

selected as the power supply for the ADE7518. This pin should be decoupled with a 10 μF capacitor in parallel with a ceramic 100 nF capacitor.

3.3 V Power Supply Output. This pin provides the supply voltage for the LDOs and internal circuitry of the ADE7518. This pin should be decoupled with a 10 μF capacitor in parallel with a ceramic 100 nF capacitor.

This pin provides access to the on-chip 2.5 V digital LDO. No external active circuitry should be connected to this pin. This pin should be decoupled with a 10 μF capacitor in parallel with a ceramic 100 nF capacitor.

Analog Input for DC Voltage Monitoring. The maximum input voltage on this pin is V

with respect to

SWOUT

AGND. This pin is used to monitor the preregulated dc voltage.

Rev. 0 | Page 16 of 128

ADE7518

TYPICAL PERFORMANCE CHARACTERISTICS

2.0

GAIN = 1 INTERNAL REFERENCE

1.5

MID CLASS C

2.0 GAIN = 1 INTERNAL REFERENCE

1.5

1.0

0.5 +25°C; PF = 1

–0.5

ERROR (% of Reading)

–1.0

–1.5

–2.0

0.1 1 10 100

CURRENT CHANNEL (% of Full S cale)

+85°C; PF = 1

–40°C; PF = 1

MID CLASS C

Figure 9. Active Energy Error as a Percentage of Reading (Gain = 1) over

Temperature with Internal Reference

1.5

GAIN = 1 INTERNAL REFERENCE

1.0

0.5

–0.5

ERROR (% of Read ing)

–1.0

–1.5

+25°C; PF = 1 +85°C; PF = 1 –40°C; PF = 1

+25°C; PF = 0.5 +85°C; PF = 0.5 –40°C; PF = 0.5

0.1 1 10 100

CURRENT CHANNEL (% of Full S cale)

MID CLASS C

Figure 10. Active Energy Error as a Percentage of Reading (Gain = 1) over

Power Factor with Internal Reference

2.0

GAIN = 1 INTERNAL REFERENCE

1.5

1.0

0.5

–0.5

ERROR (% of Reading)

–1.0

–1.5

–2.0

0.1 1 10 100

07327-009

+85°C; PF = 0.866 +25°C; PF = 0.866 –40°C; PF = 0 .866

+85°C; PF = 0 +25°C; PF = 0 –40°C; PF = 0

CURRENT CHANNEL (% of Full Scale)

07327-012

Figure 12. Reactive Energy Error as a Percentage of Reading (Gain = 1) over

Power Factor with Internal Reference

2.0

GAIN = 1 INTERNAL REFERENCE

1.5

1.0

0.5 +25°C; PF = 1

–0.5

ERROR (% o f Readi ng)

–1.0

–1.5

–2.0

0.1 1 10 100

07327-010

+85°C; PF = 1

–40°C; PF = 1

CURRENT CHANNEL (% of Full S cale)

MID CLASS C

07327-013

Figure 13. Current RMS Error as a Percentage of Reading (Gain = 1) over

Temperature with Internal Reference

2.0

GAIN = 1 INTERNAL REFERENCE

1.5

MID CLASS C

1.0

0.5

–0.5

ERROR (% of Read ing)

–1.0

–1.5

–2.0

0.1 1 10 100

+85°C; PF = 0 +25°C; PF = 0 –40°C; PF = 0

CURRENT CHANNEL (% of Full Scale)

07327-011

Figure 11. Reactive Energy Error as a Percentage of Reading (Gain = 1) over

Temperature with Internal Reference

Rev. 0 | Page 17 of 128

1.0

0.5

–0.5

ERROR (% of Reading)

–1.0

–1.5

–2.0

+25°C; PF = 1 +25°C; PF = 0.5

–40°C; PF = 1 –40°C; PF = 0.5

0.1 1 10 100

CURRENT CHANNEL (% of Full S cale)

+85°C; PF = 1 +85°C; PF = 0.5

MID CLASS C

Figure 14. Current RMS Error as a Percentage of Reading (Gain = 1) over

Power Factor with Internal Reference

07327-014

ADE7518

0.5 GAIN = 1 INTERNAL REFERENCE

0.4

0.3

0.2

0.1

–0.1

–0.2

ERROR (% of Reading)

–0.3

–0.4

–0.5

0.1 1 10 100

; 3.3V

rms

; 3.43V

rms

; 3.13V

rms

CURRENT CHANNEL (% of Full S cale)

; 3.3V

rms

; 3.43V

rms

; 3.13V

rms

07327-015

Figure 15. Voltage and Current RMS Error as a Percentage of Reading (Gain = 1)

over Power Supply with Internal Reference

1.0 GAIN = 1

INTERNAL REFERENCE

0.8

0.6

0.4

0.2

PF = 0.5

–0.2

–0.4

ERROR (% o f Readi ng)

–0.6

–0.8

–1.0

40 45 50 55 60 65 70

PF = 1

MID CLASS B

LINE FREQ UENCY (Hz)

07327-016

Figure 16. Active Energy Error as a Percentage of Reading (Gain = 1) over

Frequency with Internal Reference

0.5 GAIN = 1 INTERNAL REFERENCE

0.4

0.3

0.2

VAR; 3.3V

0.1

–0.1

–0.2

ERROR (% o f Readi ng)

–0.3

–0.4

–0.5

0.1 1 10 100

VAR; 3.43V

WATT; 3. 3V

VAR; 3.13V

WATT; 3. 13V

CURRENT CHANNEL (% of Full Scale)

WATT; 3. 43V

07327-017

Figure 17. Active and Reactive Energy Error as a Percentage of Reading (Gain = 1)

over Power Supply with Internal Reference

1.5 GAIN = 8 INTERNAL REFERENCE

1.0

0.5

PF = 1

–0.5

ERROR (% o f Readi ng)

–1.0

–1.5

0.1 1 10 100

PF = –0.5

PF = +0.5

CURRENT CHANNEL (% of Full Scale)

MID CLASS C

7327-018

Figure 18. Active Energy Error as a Percentage of Reading (Gain = 8) over

Power Factor with Internal Reference

1.0

GAIN = 8 INTERNAL REFERENCE

0.8

0.6

0.4

PF = 1

0.2

–0.2

–0.4

ERROR (% of Reading)

–0.6

–0.8

–1.0

PF = +0.5

PF = –0.5

0.1 1 10 100

CURRENT CHANNEL (% of Full Scale)

07327-019

Figure 19. Reactive Energy Error as a Percentage of Reading (Gain = 8) over

Power Factor with Internal Reference

1.5 GAIN = 8 INTERNAL REFERENCE

1.0

0.5

PF = 1

–0.5

ERROR (% of Read ing)

–1.0

–1.5

0.1 1 10 100

PF = +0.5

PF = –0.5

CURRENT CHANNEL (% of Full S cale)

MID CLASS C

7327-020

Figure 20. Current RMS Error as a Percentage of Reading (Gain = 8) over

Power Factor with Internal Reference

Rev. 0 | Page 18 of 128

ADE7518

2.0

GAIN = 16 INTERNAL REFERENCE

1.5

1.0

0.5 +25°C; PF = 1

–0.5

ERROR (% of Reading)

–1.0

–1.5

–2.0

–40°C; PF = 1

+85°C; PF = 1

0.1 1 10 100

CURRENT CHANNEL (% of Full S cale)

MID CLASS C

Figure 21. Active Energy Error as a Percentage of Reading (Gain = 16) over

Temperature with Internal Reference

2.0

GAIN = 16 INTERNAL REFERENCE

1.5

1.0

0.5

–0.5

ERROR (% of Read ing)

–1.0

+85°C; PF = 0.5 +25°C; PF = 1 +25°C; PF = 0.5

+85°C; PF = 1 –40°C; PF = 1 –40°C; PF = 0.5

MID CLASS C

1.0 GAIN = 16 INTERNAL REFERENCE

0.8

0.6

0.4

0.2

–0.2

–0.4

ERROR (% of Read ing)

–0.6

–0.8

–1.0

0.1 1 10 100

07327-021

CURRENT CHANNEL (% of Full Scale)

–40°C; PF = 0 +85°C; PF = 0 +85°C; PF = 0.866 –40°C; PF = 0.866

+25°C; PF = 0.866 +25°C; PF = 0

7327-024

Figure 24. Reactive Energy Error as a Percentage of Reading (Gain = 16) over

Power Factor with Internal Reference

2.0

GAIN = 16 INTERNAL REFERENCE

1.5

1.0

0.5 –40°C; PF = 1

–0.5

+85°C; PF = 1

ERROR (% of Reading)

–1.0

+25°C; PF = 1

MID CLASS C

–1.5

–2.0

0.1 1 10 100

CURRENT CHANNEL (% of Full S cale)

MID CLASS C

07327-022

Figure 22. Active Energy Error as a Percentage of Reading (Gain = 16) over

Power Factor with Internal Reference

1.0 GAIN = 16 INTERNAL REFERENCE

0.8

0.6

0.4

0.2

–0.2

–0.4

ERROR (% of Reading)

–0.6

–0.8

–1.0

0.1 1 10 100

+85°C; PF = 0

–40°C; PF = 0

+25°C; PF = 0

CURRENT CHANNEL (% of Full Scale)

07327-023

Figure 23. Reactive Energy Error as a Percentage of Reading (Gain = 16) over

Temperature with Internal Reference

–1.5

–2.0

0.1 1 10 100

CURRENT CHANNEL (% of Full Scale)

MID CLASS C

Figure 25. Current RMS Error as a Percentage of Reading (Gain = 16) over

Temperature with Internal Reference

2.0

GAIN = 16 INTERNAL REFERENCE

1.5

1.0

0.5

–0.5

ERROR (% of Read ing)

–1.0

–1.5

–2.0

0.1 1 10 100

–40°C; PF = 1 +25°C; PF = 1 –40°C; PF = 0. 5

+85°C; PF = 0.5 +25°C; PF = 0.5 +85°C; PF = 1

CURRENT CHANNEL (% of Full Scale)

MID CLASS C

Figure 26. Current RMS Error as a Percentage of Reading (Gain = 16) over

Power Factor with Internal Reference

07327-025

07327-026

Rev. 0 | Page 19 of 128

ADE7518

TERMINOLOGY

Measurement Error

The error associated with the energy measurement made by the ADE7518 is defined by the following formula:

Percentage Error =

⎛ ⎜ ⎜ ⎝

Phase Error Between Channels

The digital integrator and the high-pass filter (HPF) in the current channel have a nonideal phase response. To offset this phase response and equalize the phase response between channels, two phase correction networks are placed in the current channel: one for the digital integrator and the other for the HPF. The phase correction networks correct the phase response of the corresponding component and ensure a phase match between current channel and voltage channel to within ±0.1° over a range of 45 Hz to 65 Hz with the digital integrator off. With the digital integrator on, the phase is corrected to within ±0.4° over a range of 45 Hz to 65 Hz.

Power Supply Rejection (PSR)

PSR quantifies the ADE7518 measurement error as a percentage of reading when the power supplies are varied. For the ac PSR measurement, a reading at nominal supplies (3.3 V) is taken. A second reading is obtained with the same input signal levels when an ac (100 mV rms/120 Hz) signal is introduced onto the supplies. Any error introduced by this ac signal is expressed as a percentage of reading (see the Measurement Error definition).

−

EnergyTrue

⎞

EnergyTrueRegisterEnergy

⎟ ⎟ ⎠

%100×

For the dc PSR measurement, a reading at nominal supplies (3.3 V) is taken. A second reading is obtained with the same input signal levels when the supplies are varied ±5%. Any error introduced is again expressed as a percentage of the reading.

ADC Offset Error

ADC offset error is the dc offset associated with the analog inputs to the ADCs. It means that, with the analog inputs connected to AGND, the ADCs still see a dc analog input signal. The magnitude of the offset depends on the gain and input range selection (see the Typical Performance Characteristics section). However, when HPF1 is switched on, the offset is removed from the current channel, and the power calculation is not affected by this offset. The offsets can be removed by performing an offset calibration (see the Analog Inputs section).

Gain Error

Gain error is the difference between the measured ADC output code (minus the offset) and the ideal output code (see the Current Channel ADC section and the Voltage Channel ADC section). It is measured for each of the gain settings on the current channel (1, 2, 4, 8, and 16). The difference is expressed as a percentage of the ideal code.

Rev. 0 | Page 20 of 128

ADE7518

SFR MAPPING

Table 13.

Mnemonic Address Details

INTPR 0xFF Table 15 SCRATCH4 0xFE Table 23 SCRATCH3 0xFD Table 22 SCRATCH2 0xFC Table 21 SCRATCH1 0xFB Table 20 IPSMF 0xF8 Table 16 TEMPCAL 0xF7 Table 116 RTCCOMP 0xF6 Table 115 BATPR 0xF5 Table 17 PERIPH 0xF4 Table 18 B 0xF0 Table 45 LCDSEGE2 0xED Table 77 IPSME 0xEC Table 19 SPISTAT 0xEA Table 131 SPI2CSTAT 0xEA Table 135 SPIMOD2 0xE9 Table 130 I2CADR 0xE9 Table 134 SPIMOD1 0xE8 Table 129 I2CMOD 0xE8 Table 133 WAV2H 0xE7 Table 29 WAV2M 0xE6 Table 29 WAV2L 0xE5 Table 29 WAV1H 0xE4 Table 29 WAV1M 0xE3 Table 29 WAV1L 0xE2 Table 29 ACC 0xE0 Table 45 MIRQSTH 0xDE Table 39 MIRQSTM 0xDD MIRQSTL 0xDC Table 37 MIRQENH 0xDB Table 42 MIRQENM 0xDA Table 41 MIRQENL 0xD9 Table 40 IRMSH 0xD6 Table 29 IRMSM 0xD5 Table 29 IRMSL 0xD4 Table 29 VRMSH 0xD3 Table 29 VRMSM 0xD2 Table 29 VRMSL 0xD1 Table 29 PSW 0xD0 Table 46 TH2 0xCD Table 99 TL2 0xCC Table 100 RCAP2H 0xCB Table 101 RCAP2L 0xCA Table 102 T2CON 0xC8 Table 94 EADRH 0xC7 Table 89 EADRL 0xC6 Table 88 POWCON 0xC5 Table 24 KYREG 0xC1 Table 105 WDCON 0xC0 Table 65 PROTR 0xBF Table 87

Table

Mnemonic Address Details

PROTB1 0xBE Table 86 PROTB0 0xBD Table 85 EDATA 0xBC Table 84 PROTKY 0xBB Table 83 FLSHKY 0xBA Table 82 ECON 0xB9 Table 81 IP 0xB8 Table 59 PINMAP2 0xB4 Table 140 PINMAP1 0xB3 Table 139 PINMAP0 0xB2 Table 138 LCDCONY 0xB1 Table 70 CFG 0xAF Table 52 LCDDAT 0xAE Table 76 LCDPTR 0xAC Table 75 IEIP2 0xA9 Table 60 IE 0xA8 Table 58 DPCON 0xA7 Table 56 INTVAL 0xA6 Table 114 HOUR 0xA5 Table 113 MIN 0xA4 Table 112 SEC 0xA3 Table 111 HTHSEC 0xA2 Table 110 TIMECON 0xA1 Table 109 P2 0xA0 Table 143 EPCFG 0x9F Table 137 SBAUDT 0x9E Table 123 SBAUDF 0x9D Table 124 LCDCONX 0x9C Table 69 SPI2CRx 0x9B Table 128 SPI2CTx 0x9A Table 127 SBUF 0x99 Table 122 SCON 0x98 Table 121 LCDSEGE 0x97 Table 74 LCDCLK 0x96 Table 71 LCDCON 0x95 Table 68 MDATH 0x94 Table 29 MDATM 0x93 Table 29 MDATL 0x92 Table 29 MADDPT 0x91 Table 29 P1 0x90 Table 142 TH1 0x8D Table 97 TH0 0x8C Table 95 TL1 0x8B Table 98 TL0 0x8A Table 96 TMOD 0x89 Table 92 TCON 0x88 Table 93 PCON 0x87 Table 47 DPH 0x83 Table 49 DPL 0x82 Table 48 SP 0x81 Table 51 P0 0x80 Table 141

Rev. 0 | Page 21 of 128

ADE7518

POWER MANAGEMENT

The ADE7518 has elaborate power management circuitry that manages the regular power supply to battery switchover and power supply failures. The power management functionalities can be accessed directly through the 8052 SFRs (see Table 14).

Table 14. Power Management SFRs

SFR Address R/W Mnemonic Description

0xEC R/W IPSME Power Management Interrupt Enable. See Table 19. 0xF5 R/W BATPR Battery Switchover Configuration. See Table 17. 0xF8 R/W IPSMF Power Management Interrupt Flag. See Table 16. 0xFF R/W INTPR Interrupt Pins Configuration. See Table 15. 0xF4 R/W PERIPH Peripheral Configuration SFR. See Table 18. 0xC5 R/W POWCON Power Control. See Table 24. 0xFB R/W SCRATCH1 Scratch Pad 1. See Table 20. 0xFC R/W SCRATCH2 Scratch Pad 2. See Table 21. 0xFD R/W SCRATCH3 Scratch Pad 3. See Table 22. 0xFE R/W SCRATCH4 Scratch Pad 4. See Table 23.

POWER MANAGEMENT REGISTER DETAILS

Table 15. Interrupt Pins Configuration SFR (INTPR, 0xFF)

Bit Mnemonic Default Description

7 RTCCAL 0

6 to 5 FSEL[1:0] 00 Sets the RTC calibration output frequency and calibration window.

4 Reserved N/A 3 to 1 INT1PRG[2:0] 000

0 INT0PRG 0

Controls the RTC calibration output. When this bit is set, the RTC calibration frequency selected by FSEL[1:0] is output on the P0.2/CF1/RTCCAL pin.

FSEL[1:0] Result (Calibration Window, Frequency)

00 30.5 sec, 1 Hz 01 30.5 sec, 512 Hz 10 0.244 sec, 500 Hz 11 0.244 sec, 16.384 kHz

Controls the function of INT1

INT1PRG[2:0] Result

x00 GPIO enabled x01 BCTRL enabled 01x

11x

Controls the function of INT0

INT0PRG Result 0 1

INT1 INT1

INT0 INT0

input disabled input enabled

Writing to the Interrupt Pins Configuration SFR (INTPR, 0xFF)

To protect the RTC from runaway code, a key must be written to the Key SFR (KYREG, 0xC1) to obtain write access to INTPR. KYREG (see Table 105) should be set to 0xEA to unlock this SFR and then reset to zero after a timekeeping register is written to. The RTC registers can be written using the following 8052 assembly code:

MOV KYREG, #0EAh MOV INTPR, #080h

Rev. 0 | Page 22 of 128

ADE7518

Table 16. Power Management Interrupt Flag SFR (IPSMF, 0xF8)

Bit Address Mnemonic Default Description

7 0xFF FPSR 0

Power Supply Restored Interrupt Flag. Set when the V This occurs when the source of V

changes from V

SWOUT

6 0xFE FPSM 0 PSM Interrupt Flag. Set when an enabled PSM interrupt condition occurs. 5 0xFD FSAG 0 Voltage SAG Interrupt Flag. Set when an ADE energy measurement SAG condition occurs. 4 0xFC Reserved 0 This bit must be kept cleared for proper operation. 3 0xFB Reserved 0 This bit must be kept cleared for proper operation. 2 0xFA Reserved 0 This bit must be kept cleared for proper operation. 1 0xF9 FBSO 0 Battery Switchover Interrupt Flag. Set when V 0 0xF8 FVDCIN 0 V

Monitor Interrupt Flag. Set when V

DCIN

SWOUT

falls below 1.2 V.

DCIN

Table 17. Battery Switchover Configuration SFR (BATPR, 0xF5)

Bit Mnemonic Default Description

7 to 2 Reserved 0 These bits must be kept to 0 for proper operation. 1 to 0 BATPRG[1:0] 00 Control Bits for Battery Switchover.

BATPRG[1:0] Result

00 Battery switchover enabled on low VDD 01 Battery switchover enabled on low VDD and low V 1x Battery switchover disabled

Table 18. Peripheral Configuration SFR (PERIPH, 0xF4)

Bit Mnemonic Default Description

7 RXFLAG 0 If set, indicates that an Rx edge event triggered wake-up from PSM2. 6 VSWSOURCE 1 Indicates the power supply that is internally connected to V 5 VDD_OK 1 If set, indicates that the VDD power supply is ready for operation. 4 PLL_FLT 0

If set, indicates that a PLL fault occurred where the PLL lost lock. Set the PLL_FTL_ACK bit (see Table 107) in the Start ADC Measurement SFR (ADCGO, 0xD8) to acknowledge the fault and clear

the PLL_FLT bit. 3 Reserved 0 This bit should be kept to 0. 2 Reserved 0 This bit should be kept to 0. 1 to 0 RXPROG[1:0] 00 Controls the function of the P1.0/RxD pin.

RXPROG[1:0] Result

00 GPIO

01 RxD with wake-up disabled

11 RxD with wake-up enabled

power supply has been restored.

to VDD.

BAT

switches from VDD to V

DCIN

SWOUT

(0 V

SWOUT

= V

BAT

, 1 V

BAT.

SWOUT

= VDD).

Table 19. Power Management Interrupt Enable SFR (IPSME, 0xEC)

Bit Mnemonic Default Description

7 EPSR 0 Enables a PSM interrupt when the power supply restored flag (FPSR) is set. 6 Reserved 0 Reserved. 5 ESAG 0 Enables a PSM interrupt when the voltage SAG flag (FSAG) is set. 4 to 2 Reserved 0 These bits must be kept cleared for proper operation. 1 EBSO 0 Enables a PSM interrupt when the battery switchover flag (FBSO) is set. 0 EVDCIN 0 Enables a PSM interrupt when the V

monitor flag (FVDCIN) is set.

DCIN

Table 20. Scratch Pad 1 SFR (SCRATCH1, 0xFB)

Bit Mnemonic Default Description

7 to 0 SCRATCH1 0 Value can be written/read in this register. This value is maintained in all the power saving modes.

Rev. 0 | Page 23 of 128

ADE7518

Table 21. Scratch Pad 2 SFR (SCRATCH2, 0xFC)

Bit Mnemonic Default Description

7 to 0 SCRATCH2 0 Value can be written/read in this register. This value is maintained in all the power saving modes.

Table 22. Scratch Pad 3 SFR (SCRATCH3, 0xFD)

Bit Mnemonic Default Description

7 to 0 SCRATCH3 0 Value can be written/read in this register. This value is maintained in all the power saving modes.

Table 23. Scratch Pad 4 SFR (SCRATCH4, 0xFE)

Bit Mnemonic Default Description

7 to 0 SCRATCH4 0 Value can be written/read in this register. This value is maintained in all the power saving modes.

Clearing the Scratch Pad Registers (SCRATCH1, 0xFB to SCRATCH4, 0xFE)

Note that these scratch pad registers are only cleared when the part loses VDD and V PLL reset and, therefore, need to be set correctly in these situations.

Table 24. Power Control SFR (POWCON, 0xC5)

Bit Mnemonic Default Description

7 Reserved 1 Reserved. 6 METER_OFF 0

Set this bit to turn off the modulators and energy metering DSP circuitry to reduce power if

metering functions are not needed in PSM0. 5 Reserved 0 This bit should be kept at 0 for proper operation. 4 COREOFF 0 Set this bit to shut down the core and enter PSM2 if in PSM1 operating mode. 3 Reserved 0 Reserved. 2 to 0 CD[2:0] 010 Controls the core clock frequency, f

CD[2:0] Result (f

in MHz)

CORE

000 4.096

001 2.048

010 1.024

011 0.512

100 0.256

101 0.128

110 0.064

111 0.032

. They are not cleared by software, watchdog, or

BAT

. f

CORE

= 4.096 MHz/2CD.

CORE

Writing to the Power Control SFR (POWCON, 0xC5)

Writing data to the POWCON SFR involves writing 0xA7 into the Key SFR (KYREG, 0xC1), which is described in Table 105, followed by a write to the POWCON SFR. For example,

MOV KYREG,#0A7h ;Write KYREG to 0xA7 to get write access to the POWCON SFR MOV POWCON,#10h ;Shutdown the core

Rev. 0 | Page 24 of 128

ADE7518

POWER SUPPLY ARCHITECTURE

The ADE7518 has two power supply inputs, VDD and V requires only a single 3.3 V power supply at V

for full operation.

A battery backup, or secondary power supply, with a maximum of 3.7 V, can be connected to the V ADE7518 connects V

or V

BAT

power for the ADE7518 circuitry. The V the voltage at the internal power supply (V

input. Internally, the

BAT

to V

, which is used to derive

SWOUT

output pin reflects

) and has a

SWOUT

maximum output current of 6 mA. This pin can also be used to power a limited number of peripheral components. The 2.5 V analog supply (V (V

) are derived by on-chip linear regulators from V

INTD

) and the 2.5 V supply for the core logic

INTA

Figure 27 shows the power supply architecture of ADE7518.

The ADE7518 provides automatic battery switchover between V

and V

based on the voltage level detected at VDD or V

BAT

Additionally, the BCTRL input can be used to trigger a battery switchover. The conditions for switching V

and back to VDD are described in the Battery Switchover

BAT

section. V

is an input pin that can be connected to a 0 V to

DCIN

from VDD to

SWOUT

3.3 V dc signal. This input is intended for power supply supervisory purposes and does not provide power to the ADE7518 circuitry (see the Battery Switchover section).

BCTRL

DCINVDDVBAT

POWER SUPPLY

MANAGEMENT

SCRATCHPAD LCD RTC

Figure 27. Power Supply Architecture

SWOUT

INTD

LDO

3.3V

INTA

SWOUT

MCU

ADE

SPI/I2C

UART

2.5V

BAT

, and

DCIN

BATTERY SWITCHOVER

The ADE7518 monitors VDD, V

to V

, V

, or BCTRL pin. Battery switchover is

DCIN

switchover from V status of the V enabled by default. Setting Bit 1 in the Battery Switchover Configuration SFR (BATPR, 0xF5) disables battery switchover so that

is always connected to V

is indicated by Bit 6 in the Peripheral Configuration SFR

SWOUT

(PERIPH, 0xF4), which is described in Table 18. Bit 6 is set when V connected to V

is connected to VDD and cleared when V

SWOUT

BAT

, and V

BAT

can be configured based on the

BAT

(see Table 17). The source of

SWOUT

. Automatic battery

DCIN

SWOUT

07327-027

The battery switchover functionality provided by the ADE7518

to V

allows a seamless transition from V

. An automatic

BAT

battery switchover option ensures a stable power supply to the ADE7518, as long as the external battery voltage is above 2.75 V. It allows continuous code execution even while the internal

to V

power supply is switching from V

the energy metering ADCs are not available when V used for V

SWOUT

and back. Note that

BAT

is being

BAT

Power supply management (PSM) interrupts can be enabled to indicate when battery switchover occurs and when the V

power supply is restored (see the Power Supply Management (PSM) Interrupt section).

to V

BAT

The following three events switch the internal power supply (V

SWOUT

• V

from V

) from VDD to V

< 1.2 V. When V

DCIN

to V

BAT

falls below 1.2 V, V

DCIN

. This event is enabled when the

BAT

SWOUT

switches

BATPRG[1:0] bits in the Battery Switchover Configuration SFR (BATPR, 0xF5) = 0b01. Setting these bits disables switchover based on V

is disabled by default.

DCIN

• V

< 2.75 V. When VDD falls below 2.75 V, V

to V

from V

. This event is enabled when BATPRG[1:0] in

BAT

. Battery switchover on low

DCIN

SWOUT

switches

the BATPR SRF are cleared.

• Falling edge on BCTRL. When the battery control pin,

BCTRL, goes low, V

switches from VDD to V

SWOUT

external switchover signal can trigger a switchover to V

BAT

. This

BAT

at any time. Setting the bits INT1PRG[2:0] to 0bx01 in the Interrupt Pins Configuration SFR (INTPR, 0xFF) enables the battery control pin (see Table 15).

Switching from V

To s wit c h V

SWOUT

to VDD

BAT

from V

to VDD, all of the following events

BAT

that are enabled to force battery switchover must be false:

• V

• BCTRL enabled. V

< 1.2 V and VDD < 2.75 V enabled. If the low V

DCIN

condition is enabled, V remains above 1.2 V and V

< 2.75 V enabled. V

remains above 2.75 V.

SWOUT

switches to VDD after V

SWOUT

remains above 2.75 V.

switches back to VDD after

SWOUT

switches back to VDD after BCTRL

DCIN

is high, and the first or second bullet point is satisfied.

Rev. 0 | Page 25 of 128

ADE7518

POWER SUPPLY MANAGEMENT (PSM) INTERRUPT

The power supply management (PSM) interrupt alerts the 8052 core of power supply events. The PSM interrupt is disabled by default. Setting the EPSM bit in the Interrupt Enable and Priority 2 SFR (IEIP2, 0xA9) enables the PSM interrupt (see Table 60).

EPSR FPSR

ESAG

FSAG

The Power Management Interrupt Enable SFR (IPSME, 0xEC) controls the events that result in a PSM interrupt (see Table 19). Figure 28 is a diagram illustrating how the PSM interrupt vector is shared among the PSM interrupt sources. The PSM interrupt flags are latched and must be cleared by writing to the IPSMF flag register (see Table 16).

EBSO

FBSO

EVDCIN FVDCIN

IPSME ADDR. 0xEC

IPSMF ADDR. 0xF8

IEIP2 ADDR. 0xA9

FPSM

EPSM

EPSR RESERVED ESAG RESERVED EBSO EVDCIN

FPSR F PSM FSAG RESERVED FBSO FVDCIN

RESERVED PTI RESE RVED PSI EADE ETI EPSM ESI

NOT INVOLVED IN PSM INTERRUPT SIGNAL CHAIN

TRUE?

RESERVED RESERVED

PENDING PSM

INTERRUPT

07327-028

Figure 28. PSM Interrupt Sources

Rev. 0 | Page 26 of 128

ADE7518

Battery Switchover and Power Supply Restored PSM Interrupt

The ADE7518 can be configured to generate a PSM interrupt when the source of V

changes from VDD to V

SWOUT

, indicating

BAT

battery switchover. Setting the EBSO bit in the Power Management Interrupt Enable SFR (IPSME, 0xEC) enables this event to generate a PSM interrupt (see Table 19).

The ADE7518 can also be configured to generate an interrupt when the source of V that the V

power supply has been restored. Setting the EPSR bit

changes from V

SWOUT

to VDD, indicating

BAT

in the Power Management Interrupt Enable SFR (IPSME, 0xEC) enables this event to generate a PSM interrupt.

The flags in the IPSMF SFR for these interrupts, FBSO and FPSR, are set regardless of whether the respective enable bits have been set. The battery switchover and power supply restore event flags, FBSO and FPSR, are latched. These events must be cleared by writing 0 to these bits. Bit 6 in the Peripheral Configuration SFR (PERIPH, 0xF4), VSWSOURCE, tracks the source of V

. The bit is set when V

SWOUT

and cleared when V

is connected to V

SWOUT

is connected to VDD

SWOUT

BAT

Monitor PSM Interrupt

DCIN

The V

voltage is monitored by a comparator. The FVDCIN

DCIN

bit in the Power Management Interrupt Flag SFR (IPSMF, 0xF8) is set when the V

input level is lower than 1.2 V. Setting the

DCIN

EVDCIN bit in the IPSME SFR enables this event to generate a PSM interrupt. This event, which is associated with the SAG monitoring, can be used to detect a power supply (V

) being

compromised and to trigger further actions prior to deciding a

to V

switch of V

BAT

SAG Monitor PSM Interrupt

The ADE7518 energy measurement DSP monitors the ac voltage input at the V

and VN input pins. The SAGLVL register is used

to set the threshold for a line voltage SAG event. The FSAG bit in the Power Management Interrupt Flag SFR (IPSMF, 0xF8) is set if the line voltage stays below the level set in the SAGLVL register for the number of line cycles set in the SAGCYC register. See the Line Voltage SAG Detection section for more information. Setting the ESAG bit in the Power Management Interrupt Enable SFR (IPSME, 0xEC) enables this event to generate a PSM interrupt.

Rev. 0 | Page 27 of 128

ADE7518

USING THE POWER SUPPLY FEATURES

In an energy meter application, the 3.3 V power supply (VDD) is typically generated from the ac line voltage and regulated to

3.3 V by a voltage regulator IC. The preregulated dc voltage, typically 5 V to 12 V, can be connected to V tor divider. A 3.6 V battery can be connected to V shows how the ADE7518 power supply inputs are set up in this application.

Figure 30 shows the sequence of events that occurs if the main power supply generated by the PSU starts to fail in the power meter application shown in Figure 29. The SAG detection can provide the earliest warning of a potential problem on V

(240V, 220V, 110V TYPICAL)

AC INPUT

through a resis-

DCIN

. Figure 29

BAT

BCTRL

When a SAG event occurs, user code can be configured to back up data and prepare for battery switchover if desired. The relative spacing of these interrupts depends on the design of the power supply.

Figure 31 shows the sequence of events that occurs if the main power supply starts to fail in the power meter application shown in Figure 29, with battery switchover on low V

or low VDD

DCIN

enabled.

Finally, the transition between V

and V

and the different

BAT

power supply modes (see the Operating Modes section) are represented in Figure 32 and Figure 33.

SAG

DETECT ION

5V TO 12V DC

PSU

3.3V

REGULATOR

SWOUT

DCIN

BAT

VOLTAG E

SUPERVISORY

VOLTAG E

SUPERVISORY

POWER SUPPLY

MANAGEMENT

IPSMF SFR

(ADDR. 0xF8)

07327-029

Figure 29. Power Supply Management for Energy Meter Application

–

SAG LEVEL TRIP POINT

SAGCYC = 1

DCIN

1.2V

2.75V

SAG EVENT

(FSAG = 1)

Figure 30. Power Supply Management Interrupts and Battery Switchover with Only V

EVENT

DCIN

(FVDCIN = 1)

IF SWITCHOVER ON LOW VDD IS ENABLED,

AUTOMATIC BAT TERY SWI TCHOVER

CONNECTED TO V

SWOUT

BSO EVENT

(FBSO = 1)

Enabled for Battery Switchover

BAT

7327-030

Rev. 0 | Page 28 of 128

ADE7518

VP–

Table 25. Power Supply Event Timing Operating Modes

Parameter Time Description

t1 10 ns min Time between when V t2 10 ns min Time between when VDD falls below 2.75 V and when battery switchover occurs. t3 30 ms typ

Time between when V battery switchover.

t4 130 ms typ

Time between when power supply restore conditions are met (V BATPR[1:0] = 0b01 or V

SAG LEVEL TRIP POINT SAGCYC = 1

DCIN

1.2V

2.75V

falls below 1.2 V and when FVDCIN is raised.

DCIN

falls below 1.2 V and when battery switchover occurs if V

DCIN

above 1.2 V and VDD above 2.75 V if

above 2.75 V if BATPR[1:0] = 0b00) and when V

DCIN

SWOUT

is enabled to cause

DCIN

switches to VDD.

SAG EVENT

(FSAG = 1)

Figure 31. Power Supply Management Interrupts and Battery Switchover with V

EVENT

DCIN

(FVDCIN = 1)

or V

IF SWI TCHOVER ON L OW V

ENABLED, AUTO MATIC BATTERY

SWITCHOVER V

Enabled for Battery Switchover

DCIN

CONNECT ED TO V

SWOUT

BSO EVENT

(FBSO = 1)

DCIN

BAT

07327-031

VP − V

SAG LEVEL TRIP POINT

EVENT

DCIN

1.2V

2.75V

BATTERY SWITCH

ENABLED ON

LOW V

DCIN

SAG EVENT

BAT

PSM0 PSM0

DCIN

30ms MIN

DCIN

130ms MIN

PSM1 OR PSM2

EVENT

BATTERY SWITCH

ENABLED ON

LOW V

PSM0 PSM0

PSM1 OR PSM2

07327-032

Figure 32. Power Supply Management Transitions Between Modes

Rev. 0 | Page 29 of 128

ADE7518

OPERATING MODES

PSM0 (NORMAL MODE)

In PSM0, normal operating mode, V All of the analog circuitry and digital circuitry powered by

and V

INTD

default clock frequency, f

are enabled by default. In normal mode, the

INTA

, established during a power-on

CORE

reset or software reset, is 1.024 MHz.

is connected to VDD.

SWOUT

PSM1 (BATTERY MODE)

In PSM1, battery mode, V operating mode, the 8052 core and all of the digital circuitry are enabled by default. The analog circuitry for the ADE energy metering DSP powered by V automatically restarts, and the switch to the V occurs when the V

supply is above 2.75 V and the PWRDN

bit in the MODE1 register (0x0B) is cleared (see Table 31). The default f

for PSM1, established during a power-on reset or

CORE

software reset, is 1.024 MHz.

is connected to V

SWOUT

is disabled. This analog circuitry

INTA

BAT

power supply

. In this

PSM2 (SLEEP MODE)

PSM2 is a low power consumption sleep mode for use in battery operation. In this mode, V

2.5 V digital and analog circuitry powered through V are disabled, including the MCU core, resulting in the following:

• The RAM in the MCU is no longer valid.

• The program counter for the 8052, also held in volatile

memory, becomes invalid when the 2.5 V supply is shut down. Therefore, the program does not resume from where it left off but always starts from the power-on reset vector when the ADE7518 exits PSM2.

The 3.3 V peripherals (RTC, and LCD) are active in PSM2. They can be enabled or disabled to reduce power consumption and are configured for PSM2 operation when the MCU core is active (see Table 27 for more information about the individual peripherals and their PSM2 configuration). The ADE7518 remains in PSM2 until an event occurs to wake them up.

In PSM2, the ADE7518 provides four scratch pad RAM SFRs that are maintained during this mode. These SFRs can be used to save data from PSM0 or PSM1 when entering PSM2 (see Table 20 to Table 23).

In PSM2, the ADE7518 maintains some SFRs (see Table 26). The SFRs that are not listed in this table should be restored when the part enters PSM0 or PSM1 from PSM2.

is connected to V

SWOUT

. All of the

BAT

and V

INTA

INTD

Table 26. SFRs Maintained in PSM2

I/O Configuration Power Supply Management RTC Peripherals LCD Peripherals

Interrupt Pins Configuration SFR (INTPR, 0xFF), see Table 15

Peripheral Configuration SFR (PERIPH, 0xF4), see Table 18

Battery Switchover Configuration SFR (BATPR, 0xF5), see Table 17

RTC Nominal Compensation SFR (RTCCOMP, 0xF6), see Table 115

RTC Temperature Compensation SFR (TEMPCAL, 0xF7),

LCD Segment Enable 2 SFR (LCDSEGE2, 0xED), see Table 77

LCD Configuration Y SFR (LCDCONY, 0xB1), see Table 70

see Table 116

Port 0 Weak Pull-Up Enable SFR (PINMAP0, 0xB2), see Table 138

Port 1 Weak Pull-Up Enable SFR (PINMAP1, 0xB3), see Table 139

RTC Configuration SFR (TIMECON, 0xA1), see Table 109

Hundredths of a Second Counter SFR

LCD Configuration X SFR (LCDCONX, 0x9C), see Table 69

LCD Configuration SFR (LCDCON, 0x95), see Table 68

(HTHSEC, 0xA2), see Table 110

Port 2 Weak Pull-Up Enable SFR (PINMAP2, 0xB4), see Table 140

Scratch Pad 1 SFR (SCRATCH1, 0xFB), see Table 20

Scratch Pad 2 SFR (SCRATCH2, 0xFC), see Table 21

Scratch Pad 3 SFR (SCRATCH3, 0xFD), see Table 22

Scratch Pad 4 SFR

Seconds Counter SFR (SEC, 0xA3), see Table 111

Minutes Counter SFR (MIN, 0xA4), see Table 112

Hours Counter SFR (HOUR, 0xA5), see Table 113

Alarm Interval SFR (INTVAL, 0xA6), see Table 114

LCD Clock SFR (LCDCLK, 0x96), see Table 71

LCD Segment Enable SFR (LCDSEGE, 0x97), see Table 74

LCD Pointer SFR (LCDPTR, 0xAC), see Table 75

LCD Data SFR (LCDDAT, 0xAE), see Table 76

(SCRATCH4, 0xFE), see Table 23

Rev. 0 | Page 30 of 128

ADE7518

3.3 V PERIPHERALS AND WAKE-UP EVENTS

Some of the 3.3 V peripherals are capable of waking the ADE7518 from PSM2. The events that can cause the ADE7518 to wake up from PSM2 are listed in the Wake-Up Event column in Table 27.

Table 27. 3.3 V Peripherals and Wake-Up Events

3.3 V Peripheral

Power Supply

Management

RTC Midnight Nonmaskable Midnight IRTC

I/O Ports1

Rx Edge

External Reset RESET Nonmaskable

LCD

Scratch Pad The four SCRATCHx registers remain intact in PSM2.

All I/O pins are treated as inputs. The weak pull-up on each I/O pin can be disabled individually in the Port 0 Weak Pull-Up Enable SFR (PINMAP0, 0xB2), Port 1 Weak

Pull-Up Enable SFR (PINMAP1, 0xB3), and Port 2 Weak Pull-Up Enable SFR (PINMAP2, 0xB4) to decrease current consumption. The interrupts can be enabled/disabled.

Wake-Up Event

Wake-Up Enable Bits Flag

Interrupt Vector Comments

PSR Nonmaskable PSR IPSM

Alarm Maskable Alarm IRTC

INT0

INT1PRG[2:0] =

INT1

INT0PRG = 1 IE0

IE1

11x

RXPROG[1:0] = 11

PERIPH[7] (RXFLAG)

The interrupt flag associated with these events must be cleared prior to executing instructions that put the ADE7518 in PSM2 mode after wake-up.

The ADE7518 wakes up if the power supply is restored (if

switches to be connected to VDD). The VSWSOURCE

SWOUT

flag, Bit 6 of the Peripheral Configuration SFR (PERIPH, 0xF4), is set to indicate that V

is connected to VDD.

SWOUT

The ADE7518 wakes up at midnight every day to update its calendars. The RTC interrupt needs to be serviced and acknowledged prior to entering PSM2 mode.

An alarm can be set to wake the ADE7518 after the desired amount of time. The RTC alarm is enabled by setting the ALARM bit in the RTC Configuration SFR (TIMECON, 0xA1). The RTC interrupt needs to be serviced and acknowledged prior to entering PSM2 mode.

The edge of the interrupt is selected by Bit IT0 in the TCON register. The IE0 flag bit in the TCON register is not affected. The Interrupt 0 interrupt needs to be serviced and acknowledged prior to entering PSM2 mode.

The edge of the interrupt is selected by Bit IT1 in the TCON register. The IE1 flag bit in the TCON register is not affected. The Interrupt 1 interrupt needs to be serviced and acknowledged prior to entering PSM2 mode.

An Rx edge event occurs if a rising or falling edge is detected on the Rx line. The UART RxD flag needs to be cleared prior to entering PSM2 mode.

If the RESET

pin is brought low while the ADE7518 is in

PSM2, the ADE7518 wakes up to PSM1. The LCD can be enabled/disabled in PSM2. The LCD data

memory remains intact.

Rev. 0 | Page 31 of 128

ADE7518

TRANSITIONING BETWEEN OPERATING MODES

The operating mode of the ADE7518 is determined by the power supply connected to V supply, such as when V

switches to VDD, alter the operating mode. This section

SWOUT

describes events that change the operating mode.

Automatic Battery Switchover (PSM0 to PSM1)

If any of the enabled battery switchover events occur (see the Battery Switchover section), V over results in a transition from the PSM0 to PSM1 operating mode. When battery switchover occurs, the analog circuitry used in the ADE energy measurement DSP is disabled. To reduce power consumption, the user code can initiate a transition to PSM2.

Entering Sleep Mode (PSM1 to PSM2)

To reduce power consumption when V V

, user code can initiate sleep mode, PSM2, by setting Bit 4

BAT

in the Power Control SFR (POWCON, 0xC5) to shut down the MCU core. Events capable of waking the MCU can be enabled (see the 3.3 V Peripherals and Wake-Up Events section).

Servicing Wake-Up Events (PSM2 to PSM1)

The ADE7518 may need to wake up from PSM2 to service wake-up events (see the 3.3 V Peripherals and Wake-Up Events section). PSM1 code execution begins at the power-on reset vector. After servicing the wake-up event, the ADE7518 can be returned to PSM2 by setting Bit 4 in the Power Control SFR (POWCON, 0xC5) to shut down the MCU core.

Automatic Switch to VDD (PSM2 to PSM0)

If the conditions to switch V the Battery Switchover section), the operating mode switches to PSM0. When this switch occurs, the MCU core and the analog circuitry used in the ADE energy measurement DSP automatically restart. PSM0 code execution begins at the power-on reset vector.

. Therefore, changes in the power

SWOUT

switches from VDD to V

SWOUT

switches to V

SWOUT

from V

BAT

is connected to

SWOUT

to VDD occur (see

BAT

or when

BAT

. This switch-

POWER SUPPLY

RESTORED

Automatic Switch to VDD (PSM1 to PSM0)

If the conditions to switch V

SWOUT

from V

to VDD occur (see

BAT

the Battery Switchover section), the operating mode switches to PSM0. When this switch occurs, the analog circuitry used in the ADE energy measurement DSP automatically restarts. Note that normal code execution continues. A software reset can be performed to start PSM0 code execution at the power-on reset vector.

USING THE POWER MANAGEMENT FEATURES

Because program flow is different for each operating mode, the status of V bit in the Peripheral Configuration SFR (PERIPH, 0xF4) indicates what V

SWOUT

to control program flow on wake-up. Because code execution always starts at the power-on reset vector, Bit 6 of the PERIPH SRF can be tested to determine which power supply is being used and to branch to normal code execution or to wake up event code execution. Power supply events can also occur when the MCU core is active. To be aware of the events that change what V

SWOUT

• Enable the battery switchover interrupt (EBSO)

if V

• Enable the power supply restored interrupt (EPSR)

if V

An early warning that battery switchover is about to occur is provided by SAG detection and possibly low V (see the Battery Switchover section).

For a user-controlled battery switchover, enable automatic battery switchover on low V event to generate the PSM interrupt. When a low V occurs, start data backup. Upon completion of the data backup, enable battery switchover on low V occurs 30 ms later.

must be known at all times. The VSWSOURCE

SWOUT

is connected to (see Table 18). This bit can be used

is connected to, use the following guidelines:

= VDD at power-up.

SWOUT

= V

SWOUT

at power-up.

BAT

detection

DCIN

only. Then, enable the low V

DCIN

. Battery switchover

DCIN

event

PSM0

NORMAL MODE

CONNECTED TO V

SWOUT

POWER SUPPLY

AUTOMATIC BATTERY

SWITCHOVER

RESTORED

PSM2

SLEEP MODE

CONNECT ED TO V

SWOUT

Figure 33. Transitioning Between Operating Modes

Rev. 0 | Page 32 of 128

WAKE -UP

EVENT

BAT

PSM1

BATTERY MODE

CONNECTED TO V

SWOUT

BAT

USER CODE DIRECTS MCU

TO SHUT DOWN CO RE AFTER

SERVICING WAKE-UP EV ENT

07327-033

ADE7518

ENERGY MEASUREMENT

The ADE7518 offers a fixed function, energy measurement, digital processing core that provides all the information needed to measure energy in single-phase energy meters. The part provides two ways to access the energy measurements: direct access through SFRs for time sensitive information and indirect access through address and data SFR registers for the majority

, V

of energy measurements. The I

, interrupts, and waveform

rms

registers are readily available through SFRs, as shown in Table 29. Other energy measurement information is mapped to a page of memory that is accessed indirectly through the MADDPT, MDATL, MDATM, and MDATH SFRs. The address and data registers act as pointers to the energy measurement internal registers.

ACCESS TO ENERGY MEASUREMENT SFRs

Access to the energy measurement SFRs is achieved by reading or writing to the SFR addresses detailed in Table 29. The internal data for the MIRQx SFRs are latched byte by byte into the SFR when the SFR is read.

The WAV1x, WAV2x, VRMSx, and IRMSx registers are all 3-byte SFRs. The 24-bit data is latched into these SFRs when the high byte is read. Reading the low or medium byte before the high byte results in reading the data from the previous latched sample.

Sample code to read the VRMSx register is as follows:

MOV R1, VRMSH ;latches data in VRMSH, VRMSM, and VRMSL SFRs

MOV R2, VRMSM MOV R3, VRMSL

ACCESS TO INTERNAL ENERGY MEASUREMENT REGISTERS

Access to the internal energy measurement registers is achieved by writing to the Energy Measurement Pointer Address SFR (MADDPT, 0x91). This SFR selects the energy measurement register to be accessed and determines if a read or a write is performed (see Table 28).

Table 28. Energy Measurement Pointer Address SFR (MADDPT, 0x91)

Bit Description

7 1 = write, 0 = read 6 to 0 Energy measurement internal register address

Writing to the Internal Energy Measurement Registers

When Bit 7 of the Energy Measurement Pointer Address SFR (MADDPT, 0x91) is set, the contents of the MDATx SFRs (MDATL, MDATM, and MDATH) are transferred to the internal energy measurement register designated by the address in the

MADDPT SFR. If the internal register is 1 byte long, only the MDATL SFR content is copied to the internal register, and the MDATM SFR and MDATH SFR contents are ignored.

The energy measurement core functions with an internal clock of 4.096 MHz  5, or 819.2 kHz. Because the 8052 core functions

with another clock, 4.096 MHz  2

, synchronization between the two clock environments when CD = 0 or 1 is an issue. When data is written to the internal energy measurement registers, a small wait period needs to be implemented before another read or write to these registers can take place.

Sample code to write 0x0155 to the 2-byte SAGLVL register located at 0x14 in the energy measurement memory space is as follows:

MOV MDATM,#01h MOV MDATL,#55h MOV MADDPT,#SAGLVL_W (Address 0x94) MOV A,#05h DJNZ ACC,$

;Next write or read to energy measurement SFR can be done after this.

Reading the Internal Energy Measurement Registers

When Bit 7 of Energy Measurement Pointer Address SFR (MADDPT, 0x91) is cleared, the content of the internal energy measurement register designated by the address in MADDPT is transferred to the MDATx SFRs. If the internal register is 1 byte long, only the MDATL SFR content is updated with a new value, whereas the MDATM SFR and MDATH SFR contents are reset to 0x00.

The energy measurement core functions with an internal clock of 4.096 MHz  5, or 819.2 kHz. Because the 8052 core functions

with another clock, 4.096 MHz  2

, synchronization between the two clock environments when CD = 0 or 1 is an issue. When data is read from the internal energy measurement registers, a small wait period needs to be implemented before the MDATx SFRs are transferred to another SFR.

Sample code to read the peak voltage in the 2-byte VPKLVL register located at 0x16 into the data pointer is as follows:

MOV MADDPT,#VPKLVL_R (Address 0x16) MOV A,#05h DJNZ ACC,$ MOV DPH,MDATM MOV DPL,MDATL

Rev. 0 | Page 33 of 128

ADE7518

Table 29. Energy Measurement SFRs

Address R/W Mnemonic Description

0x91 R/W MADDPT Energy Measurement Pointer Address. 0x92 R/W MDATL Energy Measurement Pointer Data Lowest Significant Byte. 0x93 R/W MDATM Energy Measurement Pointer Data Middle Byte. 0x94 R/W MDATH Energy Measurement Pointer Data Most Significant Byte. 0xD1 R VRMSL V 0xD2 R VRMSM V 0xD3 R VRMSH V 0xD4 R IRMSL I 0xD5 R IRMSM I 0xD6 R IRMSH I 0xD9 R/W MIRQENL Energy Measurement Interrupt Enable Lowest Significant Byte. 0xDA R/W MIRQENM Energy Measurement Interrupt Enable Middle Byte. 0xDB R/W MIRQENH Energy Measurement Interrupt Enable Most Significant Byte. 0xDC R/W MIRQSTL Energy Measurement Interrupt Status Lowest Significant Byte. 0xDD R/W MIRQSTM Energy Measurement Interrupt Status Middle Byte. 0xDE R/W MIRQSTH Energy Measurement Interrupt Status Most Significant Byte. 0xE2 R WAV1L Selection 1 Sample Lowest Significant Byte. 0xE3 R WAV1M Selection 1 Sample Middle Byte. 0xE4 R WAV1H Selection 1 Sample Most Significant Byte. 0xE5 R WAV2L Selection 2 Sample Lowest Significant Byte. 0xE6 R WAV2M Selection 2 Sample Middle Byte. 0xE7 R WAV2H Selection 2 Sample Most Significant Byte.

×1, ×2, ×4, ×8, ×16

{GAIN[2:0]}

PGA1

PGA2

ADC

HPF

PHCAL[7:0]

HPF

Measurement Lowest Significant Byte.

rms

Measurement Middle Byte.

rms

Measurement Most Significant Byte.

rms

Measurement Lowest Significant Byte.

rms

Measurement Middle Byte.

rms

Measurement Most Significant Byte.

rms

MULTIPLIER

IRMSOS[11:0]

VRMSOS[11:0]

LPF

LPF2

WGAIN[11:0]

WATTOS[15:0]

LPF2

VAROS[15:0]

VARGAIN[11:0]

VAGAIN[11:0]

VADIV[7:0]

Figure 34. Energy Metering Block Diagram

VARDIV[7:0]

METERIN G SFRs

CF1NUM[15:0]

DFC

CF1DEN[15:0]

CF2NUM[15:0]

DFC

WDIV[7:0]

CF2DEN[15:0]

CF1

CF2

07327-034

Rev. 0 | Page 34 of 128

ADE7518

ENERGY MEASUREMENT REGISTERS

Table 30. Energy Measurement Register List

Address MADDPT[6:0] Mnemonic R/W

0x01 WATTHR R 24 S 0 Reads Wh accumulator without reset. 0x02 RWATTHR R 24 S 0 Reads Wh accumulator with reset. 0x03 LWATTHR R 24 S 0 Reads Wh accumulator synchronous to line cycle. 0x04 VARHR R 24 S 0 Reads VARh accumulator without reset. 0x05 RVARHR R 24 S 0 Reads VARh accumulator with reset. 0x06 LVARHR R 24 S 0 Reads VARh accumulator synchronous to line cycle. 0x07 VAHR R 24 S 0

0x08 RVAHR R 24 S 0

0x09 LVAHR R 24 S 0

0x0A PER_FREQ R 16 U 0

0x0B MODE1 R/W 8 U 0x06 Sets basic configuration of energy measurement (see Table 31). 0x0C MODE2 R/W 8 U 0x40 Sets basic configuration of energy measurement (see Table 32). 0x0D WAVMODE R/W 8 U 0

0x0E NLMODE R/W 8 U 0 Sets energy level of no load thresholds (see Table 34). 0x0F ACCMODE R/W 8 U 0

0x10 PHCAL R/W 8 S 0x40 Sets phase calibration register (see the Phase Compensation section). 0x11 ZXTOUT R/W 12 U 0x0FFF

0x12 LINCYC R/W 16 U 0xFFFF

0x13 SAGCYC R/W 8 U 0xFF

0x14 SAGLVL R/W 16 U 0

0x15 IPKLVL R/W 16 U 0xFFFF

0x16 VPKLVL R/W 16 U 0xFFFF

0x17 IPEAK R 24 U 0 Reads current peak level without reset (see the Peak Detection section). 0x18 RSTIPEAK R 24 U 0 Reads current peak level with reset (see the Peak Detection section). 0x19 VPEAK R 24 U 0 Reads voltage peak level without reset (see the Peak Detection section). 0x1A RSTVPEAK R 24 U 0 Reads voltage peak level with reset (see the Peak Detection section). 0x1B GAIN R/W 8 U 0 Sets PGA gain of analog inputs (see Table 36). 0x1C Reserved R/W 12 S 0 Reserved. 0x1D WGAIN R/W 12 S 0 Sets WATT gain register. 0x1E VARGAIN R/W 12 S 0 Sets VAR gain register. 0x1F VAGAIN R/W 12 S 0 Sets VA gain register. 0x20 WATTOS R/W 16 S 0 Sets WATT offset register. 0x21 VAROS R/W 16 S 0 Sets VAR offset register. 0x22 IRMSOS R/W 12 S 0 Sets current rms offset register. 0x23 VRMSOS R/W 12 S 0 Sets voltage rms offset register. 0x24 WDIV R/W 8 U 0 Sets WATT energy scaling register. 0x25 VARDIV R/W 8 U 0 Sets VAR energy scaling register. 0x26 VADIV R/W 8 U 0 Sets VA energy scaling register. 0x27 CF1NUM R/W 16 U 0 Sets CF1 numerator register. 0x28 CF1DEN R/W 16 U 0x003F Sets CF1 denominator register.

Length (Bits)

Signed/ Unsigned Default Description

Reads VAh accumulator without reset. If the VARMSCFCON bit in MODE2 register (0x0C) is set, this register accumulates I

Reads VAh accumulator with reset. If the VARMSCFCON bit in MODE2 register (0x0C) is set, this register accumulates I

Reads VAh accumulator synchronous to line cycle. If the VARMSCFCON bit in MODE2 register (0x0C) is set, this register accumulates I

Reads line period or frequency register depending on MODE2 register.

Sets configuration of Waveform Sample 1 and Waveform Sample 2 (see Table 33).

Sets configuration of WATT, VAR accumulation, and various tamper alarms (see Table 35).

Sets timeout for zero-crossing timeout detection (see the ZeroCrossing Timeout section).

Sets number of half-line cycles for LWATTHR, LVARHR, and LVAHR accumulators.

Sets number of half-line cycles for SAG detection (see the Line Voltage SAG Detection section).

Sets detection level for SAG detection (see the Line Voltage SAG Detection section).

Sets peak detection level for current peak detection (see the Peak Detection section).

Sets peak detection level for voltage peak detection (see the Peak Detection section).

Rev. 0 | Page 35 of 128

rms

ADE7518

Address MADDPT[6:0] Mnemonic R/W

0x29 CF2NUM R/W 16 U 0 Sets CF2 numerator register. 0x2A CF2DEN R/W 16 U 0x003F Sets CF2 denominator register. 0x3B Reserved 0 This register must be kept at its default value for proper operation. 0x3C Reserved 0x0300 This register must be kept at its default value for proper operation. 0x3D Reserved 0 This register must be kept at its default value for proper operation. 0x3E Reserved 0 This register must be kept at its default value for proper operation. 0x3F Reserved 0 This register must be kept at its default value for proper operation.

ENERGY MEASUREMENT INTERNAL REGISTERS DETAILS

Table 31. MODE1 Register (0x0B)

Bit Mnemonic Default Description

7 SWRST 0 Setting this bit resets all of the energy measurement registers to their default values. 6 DISZXLPF 0 Setting this bit disables the zero-crossing low-pass filter. 5 Reserved 0 This bit must be kept at its default value for proper operation. 4 SWAPBITS 0 Setting this bit swaps CH1 ADC and CH2 ADC. 3 PWRDN 0 Setting this bit powers down voltage and current ADCs. 2 DISCF2 1 Setting this bit disables Frequency Output CF2. 1 DISCF1 1 Setting this bit disables Frequency Output CF1. 0 DISHPF 0 Setting this bit disables the HPFs in voltage and current channels.

Length (Bits)

Signed/ Unsigned Default Description

Table 32. MODE2 Register (0x0C)

Bit Mnemonic Default Description

7 to 6 CF2SEL[1:0] 01 Configuration Bits for CF2 Output.

CF2SEL[1:0] Result

00 CF2 frequency is proportional to active power. 01 CF2 frequency is proportional to reactive power. 1x CF2 frequency is proportional to apparent power or I

rms

5 to 4 CF1SEL[1:0] 00 Configuration Bits for CF1 Output.

CF1SEL[1:0] Result

00 CF1 frequency is proportional to active power. 01 CF1 frequency is proportional to reactive power. 1x CF1 frequency is proportional to apparent power or I 3 VARMSCFCON 0

Configuration Bits for Apparent Power or I

for CF1, CF2 Outputs, and VA Accumulation

rms

Registers (VAHR, RVAHR, and LVAHR). Note that CF1 cannot be proportional to VA if CF2 is proportional to I

VARMSCFCON Result

and vice versa.

rms

0 If CF1SEL[1:0] = 1x, CF1 is proportional to VA. If CF2SEL[1:0] = 1x, CF2 is proportional to VA. 1 If CF1SEL[1:0] = 1x, CF1 is proportional to I If CF2SEL[1:0] = 1x, CF2 is proportional to I

rms

. 2 ZXRMS 0 Logic 1 enables update of rms values synchronously to Voltage ZX. 1 FREQSEL Configuration Bits to Select Period or Frequency Measurement for PER_FREQ Register (0x0A).

FREQSEL Result

0 PER_FREQ register holds a period measurement. 1 PER_FREQ register holds a frequency measurement. 0 WAVEN 0 When this bit is set, the waveform sampling mode is enabled.

Rev. 0 | Page 36 of 128

ADE7518

Table 33. WAVMODE Register (0x0D)

Bit Mnemonic Default Description

7 to 5 WAV2SEL[2:0] 000 Waveform 2 Selection for Samples Mode.

000 Current 001 Voltage 010 Active power multiplier output 011 Reactive power multiplier output 100 VA multiplier output 101 I Others Reserved 4 to 2 WAV1SEL[2:0] 000 Waveform 1 Selection for Samples Mode.

000 Current 001 Voltage 010 Active power multiplier output 011 Reactive power multiplier output 100 VA multiplier output 101 I Others Reserved 1 to 0 DTRT[1:0] 00 Waveform Samples Output Data Rate.

00 25.6 kSPS (clock/32) 01 12.8 kSPS (clock/64) 10 6.4 kSPS (clock/128) 11 3.2 kSPS (clock/256)

WAV2SEL[2:0] Source

LPF output

rms

WAV1SEL[2:0] Source

LPF output (low 24-bit)

rms

DTRT[1:0] Update Rate (Clock = f

/5 = 819.2 kHz)

CORE

Table 34. NLMODE Register (0x0E)

Bit Mnemonic Default Description

7 DISVARCMP 0 Setting this bit disables fundamental VAR gain compensation over line frequency. 6 IRMSNOLOAD 0

Logic 1 enables I

no load threshold detection. The level is defined by the setting of the

rms

VANOLOAD bits.

5 to 4 VANOLOAD[1:0] 00 Apparent Power No Load Threshold.

VANOLOAD[1:0] Result

00 No load detection disabled 01 No load detection enabled with threshold = 0.030% of full scale 10 No load detection enabled with threshold = 0.015% of full scale 11 No load detection enabled with threshold = 0.0075% of full scale 3 to 2 VARNOLOAD[1:0] 00 Reactive Power No Load Threshold.

VARNOLOAD[1:0] Result

00 No load detection disabled 01 No load detection enabled with threshold = 0.015% of full scale 10 No load detection enabled with threshold = 0.0075% of full scale 11 No load detection enabled with threshold = 0.0037% of full scale 1 to 0 APNOLOAD[1:0] 00 Active Power No Load Threshold.

APNOLOAD[1:0] Result

Rev. 0 | Page 37 of 128

ADE7518

Table 35. ACCMODE Register (0x0F)

Bit Mnemonic Default Description

7 to 6 Reserved 0 These bits should be left at their default value for proper operation. 5 VARSIGN 0

4 APSIGN 0

3 ABSVARM 0 Logic 1 enables absolute value accumulation of reactive power in energy register and pulse output. 2 SAVARM 0

1 POAM 0

0 ABSAM 0

Table 36. GAIN Register (0x1B)

Bit Mnemonic Default Description

7 to 5 PGA2[2:0] 000 These bits define the voltage channel input gain.

000 Gain = 1 001 Gain = 2 010 Gain = 4 011 Gain = 8 100 Gain = 16 4 Reserved 0 Reserved. 3 CFSIGN_OPT 0 This bit defines where the CF change of sign detection (APSIGN or VARSIGN) is implemented.

0 Filtered power signal 1 On a per CF pulse basis 2 to 0 PGA1[2:0] 000 These bits define the current channel input gain.

000 Gain = 1 001 Gain = 2 010 Gain = 4 011 Gain = 8 100 Gain = 16

Configuration bit to select the event that triggers a reactive power sign interrupt. If set to 0, VARSIGN interrupt occurs when reactive power changes from positive to negative. If this bit is set to 1, VARSIGN interrupt occurs when reactive power changes from negative to positive.

Configuration bit to select event that triggers an active power sign interrupt. If set to 0, APSIGN interrupt occurs when active power changes from positive to negative. If this bit is set to 1, APSIGN interrupt occurs when active power changes from negative to positive.

Logic 1 enables reactive power accumulation depending on the sign of the active power. If active power is positive, VAR is accumulated as it is. If active power is negative, the sign of the VAR is reversed for the accumulation. This accumulation mode affects both the VAR registers (VARHR, RVARHR, LVARHR) and the pulse output when connected to VAR.

Logic 1 enables positive-only accumulation of active power in the WATTHR energy register and pulse output.

Logic 1 enables absolute value accumulation of active power in the WATTHR energy register and pulse output.

PGA2[2:0] Result

CFSIGN_OPT Result

PGA1[2:0] Result

INTERRUPT STATUS/ENABLE SFRS

Table 37. Interrupt Status 1 SFR (MIRQSTL, 0xDC)

Bit Interrupt Flag Description

7 ADEIRQFLAG

6 Reserved Reserved. 5 Reserved Reserved. 4 VARSIGN Logic 1 indicates that the reactive power sign has changed according to the configuration of the ACCMODE register. 3 APSIGN Logic 1 indicates that the active power sign has changed according to the configuration of the ACCMODE register. 2 VANOLOAD

1 RNOLOAD Logic 1 indicates that an interrupt has been caused by a reactive power no load detection. 0 APNOLOAD Logic 1 indicates that an interrupt has been caused by an active power no load detection.

This bit is set if any of the ADE status flags that are enabled to generate an ADE interrupt are set. This bit is automatically cleared when all of the enabled ADE status flags are cleared.

Logic 1 indicates that an interrupt has been caused by an apparent power no load detection. This interrupt is also used to reflect the part entering the I

Rev. 0 | Page 38 of 128

no load mode.

rms

ADE7518

Table 38. Interrupt Status 2 SFR (MIRQSTM, 0xDD)

Bit Interrupt Flag Description

7 CF2

6 CF1

5 VAEOF Logic 1 indicates that the VAHR register has overflowed. 4 REOF Logic 1 indicates that the VARHR register has overflowed. 3 AEOF Logic 1 indicates that the WATTHR register has overflowed. 2 VAEHF Logic 1 indicates that the VAHR register is half full. 1 REHF Logic 1 indicates that the VARHR register is half full. 0 AEHF Logic 1 indicates that the WATTHR register is half full.

Table 39. Interrupt Status 3 SFR (MIRQSTH, 0xDE)

Bit Interrupt Flag Description

7 RESET Indicates the end of a reset (for both software and hardware reset). 6 Reserved Reserved. 5 WFSM Logic 1 indicates that new data is present in the waveform registers (Address 0xE2 to Address 0xE7). 4 PKI Logic 1 indicates that the current channel has exceeded the IPKLVL value 3 PKV Logic 1 indicates that the voltage channel has exceeded the VPKLVL value. 2 CYCEND Logic 1 indicates the end of the energy accumulation over an integer number of half-line cycles. 1 ZXTO Logic 1 indicates that no zero crossing on the line voltage happened for the last ZXTOUT half-line cycles. 0 ZX Logic 1 indicates detection of a zero crossing in the voltage channel.

Logic 1 indicates that a pulse on CF2 has been issued. The flag is set even if the CF2 pulse output is not enabled by clearing Bit 2 of the MODE1 register.

Logic 1 indicates that a pulse on CF1 has been issued. The flag is set even if the CF1 pulse output is not enabled by clearing Bit 1 of the MODE1 register.

Table 40. Interrupt Enable 1 SFR (MIRQENL, 0xD9)

Bit Interrupt Enable Bit Description

7 to 5 Reserved Reserved. 4 VARSIGN When this bit is set, the VARSIGN flag set creates a pending ADE interrupt to the 8052 core. 3 APSIGN When this bit is set, the APSIGN flag set creates a pending ADE interrupt to the 8052 core. 2 VANOLOAD When this bit is set, the VANOLOAD flag set creates a pending ADE interrupt to the 8052 core. 1 RNOLOAD When this bit is set, the RNOLOAD flag set creates a pending ADE interrupt to the 8052 core. 0 APNOLOAD When this bit is set, the APNOLOAD flag set creates a pending ADE interrupt to the 8052 core.

Table 41. Interrupt Enable 2 SFR (MIRQENM, 0xDA)

Bit Interrupt Enable Bit Description

7 CF2 When this bit is set, a CF2 pulse creates a pending ADE interrupt to the 8052 core. 6 CF1 When this bit is set, a CF1 pulse creates a pending ADE interrupt to the 8052 core. 5 VAEOF When this bit is set, the VAEOF flag set creates a pending ADE interrupt to the 8052 core. 4 REOF When this bit is set, the REOF flag set creates a pending ADE interrupt to the 8052 core. 3 AEOF When this bit is set, the AEOF flag set creates a pending ADE interrupt to the 8052 core. 2 VAEHF When this bit is set, the VAEHF flag set creates a pending ADE interrupt to the 8052 core. 1 REHF When this bit is set, the REHF flag set creates a pending ADE interrupt to the 8052 core. 0 AEHF When this bit is set, the AEHF flag set creates a pending ADE interrupt to the 8052 core.

Table 42. Interrupt Enable 3 SFR (MIRQENH, 0xDB)

Bit Interrupt Enable Bit Description

7 to 6 Reserved Reserved. 5 WFSM When this bit is set, the WFSM flag set creates a pending ADE interrupt to the 8052 core. 4 PKI When this bit is set, the PKI flag set creates a pending ADE interrupt to the 8052 core. 3 PKV When this bit is set, the PKV flag set creates a pending ADE interrupt to the 8052 core. 2 CYCEND When this bit is set, the CYCEND flag set creates a pending ADE interrupt to the 8052 core. 1 ZXTO When this bit is set, the ZXTO flag set creates a pending ADE interrupt to the 8052 core. 0 ZX When this bit is set, the ZX flag set creates a pending ADE interrupt to the 8052 core.

Rev. 0 | Page 39 of 128

ADE7518

ANALOG INPUTS

The ADE7518 has two fully differential voltage input channels. The maximum differential input voltage for input pairs V and I

is ±0.4 V.

P/IN

Each analog input channel has a programmable gain amplifier (PGA) with possible gain selections of 1, 2, 4, 8, and 16. The gain selections are made by writing to the GAIN register (see Table 36 and Figure 36). Bit 0 to Bit 2 select the gain for the PGA in the current channel, and Bit 5 to Bit 7 select the gain for the PGA in the voltage channel. Figure 35 shows how a gain selection for the current channel is made using the gain register.

P/VN

GAIN[7:0]

76543210

00000000

GAIN (K) SELECTION

K × V

Figure 35. PGA in Current Channel

CURRENT AND VOLTAGE CHANNELS PGA CONTROL

PGA2 GAIN SELECT 000 = ×1 001 = ×2 010 = ×4 011 = ×8 100 = ×16

*REGISTER CO NTENTS SHO W POWER-ON DEFAULTS.

GAIN REGISTER*

76543210

00000000

PGA1 GAIN SELECT 000 = ×1 001 = ×2 010 = ×4 011 = ×8 100 = ×16

CFSIGN_O PT

RESERVED

ADDR: 0x1B

Figure 36. Analog Gain Register

07327-035

07327-036

Rev. 0 | Page 40 of 128

ADE7518

ANALOG-TO-DIGITAL CONVERSION

Each ADE7518 has two Σ- analog-to-digital converters (ADCs). The outputs of these ADCs are mapped directly to waveform sampling SFRs (Address 0xE2 to Address 0xE7) and are used for energy measurement internal digital signal processing. In PSM1 (battery mode) and PSM2 (sleep mode), the ADCs are powered down to minimize power consumption.

For simplicity, the block diagram in Figure 38 shows a first-

Σ-∆ ADC. The converter is made up of the Σ-∆ modulator

order and the digital low-pass filter.

Σ-∆ modulator converts the input signal into a continuous serial

A stream of 1s and 0s at a rate determined by the sampling clock. In the ADE7518, the sampling clock is equal to 4.096 MHz/5. The 1-bit DAC in the feedback loop is driven by the serial data stream. The DAC output is subtracted from the input signal. If the loop gain is high enough, the average value of the DAC output (and, therefore, the bit stream) can approach that of the input signal level.

For any given input value in a single sampling interval, the data from the 1-bit ADC is virtually meaningless. A meaningful result is obtained only when a large number of samples is averaged. This averaging is carried into the second part of the ADC, the digital low-pass filter. By averaging a large number of bits from the modulator, the low-pass filter can produce 24-bit data-words that are proportional to the input signal level.

noise (noise due to sampling) over a wider bandwidth. With the noise spread more thinly over a wider bandwidth, the quantization noise in the band of interest is lowered (see Figure 37).

However, oversampling alone is not efficient enough to improve the signal-to-noise ratio (SNR) in the band of interest. For example, an oversampling ratio of four is required to increase the SNR by only 6 dB (1 bit). To keep the oversampling ratio at a reasonable level, it is possible to shape the quantization noise so that the majority of the noise lies at the higher frequencies. In the

Σ-∆

modulator, the noise is shaped by the integrator, which has a high-pass-type response for the quantization noise. The result is that most of the noise is at the higher frequencies, where it can be removed by the digital low-pass filter. This noise shaping is shown in Figure 37.

ANTIALIAS

IGNAL

NOISE

FILTER (RC)

DIGITAL

FILTER

409.60 819.22

FREQUENCY (kHz)

HIGH RESOLUTION

OUTPUT FROM DIGITAL

LPF

SHAPED

NOISE

SAMPLING

FREQUENCY

Σ-∆ converter uses two techniques to achieve high resolution

The from what is essentially a 1-bit conversion technique. The first is oversampling. Oversampling means that the signal is sampled at a rate (frequency) that is many times higher than the bandwidth of interest. For example, the sampling rate in the ADE7518 is

4.096 MHz/5, or 819.2 kHz, and the band of interest is 40 Hz to 2 kHz. Oversampling has the effect of spreading the quantization

ANALOG

LOW-PASS FILTER

INTEGRATOR

–

Figure 38. First-Order

REF

MCLK/5

... 10100101 . ..

1-BIT DAC

LATCHED

COMPARATOR

-∆ ADC

409.60 819.22

FREQUENCY (kHz)

Figure 37. Noise Reduction Due to Oversampling and

Noise Shaping in the Analog Modulator

DIGITAL

LOW-PASS

FILTER

07327-038

07327-037

Rev. 0 | Page 41 of 128

ADE7518

Antialiasing Filter

Figure 38 also shows an analog low-pass filter (RC) on the input to the modulator. This filter is present to prevent aliasing, an artifact of all sampled systems. Aliasing means that frequency components in the input signal to the ADC, which are higher than half the sampling rate of the ADC, appear in the sampled signal at a frequency below half the sampling rate. Figure 39 illustrates the effect. Frequency components (the black arrows) above half the sampling frequency (also known as the Nyquist frequency, that is, 409.6 kHz) are imaged or folded back down below 409.6 kHz. This happens with all ADCs regardless of the architecture. In the example shown in Figure 39, only frequencies near the sampling frequency (819.2 kHz) move into the band of interest for metering (40 Hz to 2 kHz). This allows the use of a very simple low-pass filter (LPF) to attenuate high frequency (near 819.2 kHz) noise and prevents distortion in the band of interest.

For conventional current sensors, a simple RC filter (single-pole LPF) with a corner frequency of 10 kHz produces an attenuation of approximately 40 dB at 819.2 kHz (see Figure 39). The 20 dB per decade attenuation is usually sufficient to eliminate the effects of aliasing for conventional current sensors. However, for a di/dt sensor such as a Rogowski coil, the sensor has a 20 dB per decade gain. This neutralizes the −20 dB per decade attenuation produced by one simple LPF. Therefore, when using a di/dt sensor, care should be taken to offset the 20 dB per decade gain. One simple approach is to cascade two RC filters to produce the

−40 dB per decade attenuation needed.

×1, ×2, ×4 ×8, ×16 {GAIN[2:0]}

PGA1

REFERENCE

ADC

HPF

LIASING EFFECTS

IMAGE

FREQUENCIES

409.60 819.22

FREQUENCY (kHz)

SAMPLING

FREQUENCY

07327-039

Figure 39. ADC and Signal Processing in Current Channel Outline Dimensions

ADC Transfer Function

Both ADCs in the ADE7518 are designed to produce the same output code for the same input signal level. With a full-scale signal on the input of 0.4 V and an internal reference of 1.2 V, the ADC output code is nominally 2,147,483, or 0x20C49B. The maximum code from the ADC is ±4,194,304; this is equivalent to an input signal level of ±0.794 V. However, for specified performance, it is recommended that the full-scale input signal level of 0.4 V not be exceeded.

Current Channel ADC

Figure 40 shows the ADC and signal processing chain for the current channel. In waveform sampling mode, the ADC outputs a signed, twos complement, 24-bit data-word at a maximum of

25.6 kSPS (4.096 MHz/160).

With the specified full-scale analog input signal of 0.4 V and PGA1 = 1, the ADC produces an output code that is approximately between 0x20C49B (+2,147,483d) and 0xDF3B65 (−2,147,483d). For inputs of 0.25 V, 0.125 V, 82.6 mV, and 31.3 mV with PGA1 = 2, 4, 8, and 16, respectively, the ADC produces an output code that is approximately between 0x28F5C2 (+2,684,354d) and 0xD70A3E (–2,684,354d).

CURRENT RMS (I CALCULATIO N

WAVEFORM SAMPLE REGISTER

ACTIVE AND REACTI VE POWER CALCULATION

rms

)

0.25V, 0.125V,

62.5mV, 31.3mV

ANALOG INPUT RANGE

0x28F5C2

0x000000

0xD70A3E

CURRENT CHANNEL WAVEFORM DATA RANGE

07327-040

Figure 40. ADC and Signal Processing in Current Channel with PGA1 = 1, 2, 4, 8, or 16

Rev. 0 | Page 42 of 128

ADE7518

Voltage Channel ADC

Figure 41 shows the ADC and signal processing chain for the voltage channel. In waveform sampling mode, the ADC outputs a signed, twos complement, 24-bit data-word at a maximum of 25.6 kSPS (MCLK/160). The ADC produces an output code that is approximately between 0x28F5 (+10,485d) and 0xD70B (−10,485d).

Channel Sampling

The waveform samples of the current ADC and voltage ADC can also be routed to the waveform registers to be read by the MCU core. The active, reactive, apparent power, and energy calculation remain uninterrupted during waveform sampling.

0.5V, 0.25V ,

0.125V, 62.5mV,

31.3mV

ANALOG INPUT RANGE

×1, ×2, ×4, ×8, ×16

{GAIN[7:5]}

PGA2

REFERENCE

ADC

0x28F5

0x0000

0xD70B

POWE R CALCULA TION

HPF

VOLTAGE CHANNEL WAVEFORM DATA RANGE

CTIVEAND REACTIVE

When in waveform sampling mode, one of four output sample rates can be chosen by using the DTRT[1:0] bits of the WAVMODE register (see Table 33

). The output sample rate can be 25.6 kSPS,

12.8 kSPS, 6.4 kSPS, or 3.2 kSPS. If the WFSM enable bit is set in the Interrupt Enable 3 SFR (MIRQENH, 0xDB), the 8052 core has a pending ADE interrupt. The sampled signals selected in the WAVMODE register are latched into the Waveform SFRs when the waveform high byte (WAV1H or WAV2H) is read.

The ADE interrupt stays active until the WFSM status bit is cleared (see the Energy Measurement Interrupts section).

VOLTAGE RMS (V CALCULATIO N

WAVEFORM SAMPLE REGISTER

VOLTAGE PEAK DETECT

LPF1

= 63.7Hz

–3dB

MODE1[6]

)

rms

ZX DETECTION

ZX SIGNAL DATA RANGE FOR 60Hz SIGNAL

0x1DD0

0x0000

0xE230

ZX SIGNAL DATA RANGE FOR 50Hz SIGNAL

0x2037

0x0000

0xDFC9

07327-041

Figure 41. ADC and Signal Processing in Voltage Channel

Rev. 0 | Page 43 of 128

ADE7518

POWER QUALITY MEASUREMENTS

Zero-Crossing Detection

Each ADE7518 has a zero-crossing detection circuit on the voltage channel. This zero crossing is used to produce a zerocrossing internal signal (ZX) and is used in calibration mode.

The zero-crossing is generated by default from the output of LPF1. This filter has a low cutoff frequency and is intended for 50 Hz and 60 Hz systems. If needed, this filter can be disabled to allow a higher frequency signal to be detected or to limit the group delay of the detection. If the voltage input fundamental frequency is below 60 Hz and a time delay in ZX detection is acceptable, it is recommended to enable LPF1. Enabling LPF1 limits the variability in the ZX detection by eliminating the high frequency components. Figure 42 shows how the zero-crossing signal is generated.

×1, ×2, ×4, ×8, ×16

{GAIN[ 7:5]}

PGA2

1.0

0.73

Figure 42. Zero-Crossing Detection on the Voltage Channel

The zero-crossing signal ZX is generated from the output of LPF1 (bypassed or not). LPF1 has a single pole at 63.7 Hz (at MCLK = 4.096 MHz). As a result, there is a phase lag between the analog input signal V2 and the output of LPF1. The phase lag response of LPF1 results in a time delay of approximately 2 ms (@ 60 Hz) between the zero crossing on the analog inputs of the voltage channel and ZX detection.

The zero-crossing detection also drives the ZX flag in the Interrupt Status 3 SFR (MIRQSTH, 0xDE). If the ZX bit in the Interrupt Enable 3 SFR (MIRQENH, 0xDB) is set, the 8052 core has a pending ADE interrupt. The ADE interrupt stays active until the ZX status bit is cleared (see the Energy Measurement Interrupts section).

Zero-Crossing Timeout

The zero-crossing detection also has an associated timeout register, ZXTOUT. This unsigned, 12-bit register is decremented (1 LSB) every 160/MCLK seconds. The register is reset to its user-programmed full-scale value every time a zero crossing is detected on the voltage channel. The default power-on value in this register is 0xFFF. If the internal register decrements to 0 before a zero crossing is detected in the Interrupt Status 3 SFR

REFERENCE

ADC 2

43.24° @ 60Hz

LPF1

HPF

LPF1

= 63.7Hz

–3dB

MODE1[6]

ZERO

CROSSING

Rev. 0 | Page 44 of 128

07327-042

(MIRQSTH, 0xDE) and the ZXTO bit in the Interrupt Enable 3 SFR (MIRQENH, 0xDB) is set, the 8052 core has a pending ADE interrupt.

The ADE interrupt stays active until the ZXTO status bit is cleared (see the Energy Measurement Interrupts section). The ZXTOUT register (Address 0x11) can be written to or read from the 8052 by the user (see the energy measurement register list in Table 30). The resolution of the register is 160/MCLK seconds per LSB. Thus, the maximum delay for an interrupt is 0.16 sec

(1/MCLK × 2

) when MCLK = 4.096 MHz.

Figure 43 shows the mechanism of the zero-crossing timeout detection when the line voltage stays at a fixed dc level for more than MCLK/160 × ZXTOUT seconds.

12-BIT INT ERNAL

ZXTOUT

VOLTAGE

CHANNEL

ZXTO FLAG

BIT

Figure 43. Zero-Crossing Timeout Detection

07327-043

Period or Frequency Measurements

The ADE7518 provides the period or frequency measurement of the line. The period or frequency measurement is selected by clearing or setting the FREQSEL bit in the MODE2 register (0x0C). The period/frequency register, PER_FREQ register (0x0A), is an unsigned 16-bit register that is updated every period. If LPF1 is enabled, a settling time of 1.8 seconds is associated with this filter before the measurement is stable.

When the period measurement is selected, the measurement has a

2.44 µs/LSB (4.096 MHz/10) resolution, which represents 0.014% when the line frequency is 60 Hz. When the line frequency is 60 Hz, the value of the period register is approximately 0d6827. The length of the register enables the measurement of line frequencies as low as 12.5 Hz. The period register is stable at ±1 LSB when the line is established and the measurement does not change.

When the frequency measurement is selected, the measurement has a 0.0625 Hz/LSB resolution when MCLK = 4.096 MHz, which represents 0.104% when the line frequency is 60 Hz. When the line frequency is 60 Hz, the value of the frequency register is 0d960. The frequency register is stable at ±4 LSB when the line is established and the measurement does not change.

ADE7518

Line Voltage SAG Detection

In addition to detection of the loss of the line voltage signal (zero crossing), the ADE7518 can also be programmed to detect when the absolute value of the line voltage drops below a certain peak value for a number of line cycles. This condition is illustrated in Figure 44.

FULL SCALE

SAGLVL [15:0]

SAGCYC[7:0] = 0x04

SAG FLAG

VOLTAGE CHANNEL

3 LINE CYCLES

Figure 44. SAG Detection

SAG RESET LOW WHEN VOLTAGE CHANNEL EXCEEDS SAGLVL[15:0] AND SAG FLAG RE SET

Figure 44 shows the line voltage falling below a threshold that is set in the SAG level register (SAGLVL[15:0]) for three line cycles. The quantities 0 and 1 are not valid for the SAGCYC register, and the contents represent one more than the desired number of full line cycles. For example, when the SAG cycle (SAGCYC[7:0]) contains 0x04, FSAG in the Power Management Interrupt Flag SFR (IPSMF, 0xF8) is set at the end of the third line cycle after the line voltage falls below the threshold. If the SAG enable bit (ESAG) in the Power Management Interrupt Enable SFR (IPSME, 0xEC) is set, the 8052 core has a pending power supply management interrupt. The PSM interrupt stays active until the ESAG bit is cleared (see the Power Supply Management (PSM) Interrupt section).

In Figure 44, the SAG flag (FSAG) is set on the fifth line cycle after the signal on the voltage channel first drops below the threshold level.

SAG Level Set

The 2-byte contents of the SAG level register (SAGLVL, 0x14) are compared to the absolute value of the output from LPF1.

Therefore, when LPF1 is enabled, writing 0x2038 to the SAG level register puts the SAG detection level at full scale (see Figure 44). Writing 0x00 or 0x01 puts the SAG detection level at 0. The SAG level register is compared to the input of the ZX detection, and detection is made when the contents of the SAG level register are greater.

Peak Detection

The ADE7518 can also be programmed to detect when the absolute value of the voltage or current channel exceeds a specified peak value. Figure 45 illustrates the behavior of the peak detection for the voltage channel. Both voltage and current channels are monitored at the same time.

VPKLVL[15:0]

PKV RESET LOW WHEN MIRQSTH SF R

PKV INTERRUPT

RESET BIT PKV

IN MIRQ STH S F

FLAG

Figure 45. Peak Level Detection

IS READ

07327-045

Figure 45 shows a line voltage exceeding a threshold that is set in the voltage peak register (VPKLVL[15:0]). The voltage peak event

07327-044

is recorded by setting the PKV flag in the Interrupt Status 3 SFR (MIRQSTH, 0xDE). If the PKV enable bit is set in the Interrupt Enable 3 SFR (MIRQENH, 0xDB), the 8052 core has a pending ADE interrupt. Similarly, the current peak event is recorded by setting the PKI flag in Interrupt Status 3 SFR (MIRQSTH, 0xDE). The ADE interrupt stays active until the PKV or PKI status bit is cleared (see the Energy Measurement Interrupts section).

Peak L evel Set

The contents of the VPKLVL and IPKLVL registers are compared to the absolute value of the voltage and the 2 MSBs of the current channel, respectively. Thus, for example, the nominal maximum code from the current channel ADC with a full-scale signal is 0x28F5C2 (see the Current Channel ADC section). Therefore, writing 0x28F5 to the IPKLVL register puts the peak detection level of the current channel at full scale and sets the current peak detection to its least sensitive value. Writing 0x00 puts the current channel detection level at 0. The detection is done by comparing the contents of the IPKLVL register to the incoming current channel sample. The PKI flag indicates that the peak level is exceeded. If the PKI or PKV bit is set in the Interrupt Enable 3 SFR (MIRQENH, 0xDB), the 8052 core has a pending ADE interrupt.

Peak Level Record

Each ADE7518 records the maximum absolute value reached by the voltage and current channels in two different registers, IPEAK and VPEAK, respectively. Each register is a 24-bit unsigned register that is updated each time the absolute value of the waveform sample from the corresponding channel is above the value stored in the VPEAK or IPEAK register. The contents of the VPEAK register correspond to the maximum absolute value observed on the voltage channel input. The contents of IPEAK and VPEAK represent the maximum absolute value observed on the current and voltage input, respectively. Reading the RSTVPEAK and RSTIPEAK registers clears their respective contents after the read operation.

Rev. 0 | Page 45 of 128

ADE7518

PHASE COMPENSATION

The ADE7518 must work with transducers that can have inherent phase errors. For example, a phase error of 0.1° to 0.3° is not uncommon for a current transformer (CT). These phase errors can vary from part to part, and they must be corrected to perform accurate power calculations. The errors associated with phase mismatch are particularly noticeable at low power factors. The ADE7518 provides a means of digitally calibrating these small phase errors. The part allows a small time delay or time advance to be introduced into the signal processing chain to compensate for small phase errors. Because the compensation is in time, this technique should only be used for small phase errors in the range of 0.1° to 0.5°. Correcting large phase errors using a time shift technique can introduce significant phase errors at higher harmonics.

The phase calibration register (PHCAL[7:0]) is a twos complement, signed, single-byte register that has values ranging from 0x82 (−126d) to 0x68 (+104d).

The PHCAL register is centered at 0x40, meaning that writing 0x40 to the register results in 0 delay. By changing this register, the time delay in the voltage channel signal path can change from −231.93 µs to +48.83 µs (MCLK = 4.096 MHz). One LSB is equivalent to a 1.22 µs (4.096 MHz/5) time delay or advance. A line frequency of 60 Hz gives a phase resolution of 0.026° at the fundamental (that is, 360° × 1.22 µs × 60 Hz).

Figure 46 illustrates how the phase compensation is used to remove a 0.1° phase lead in the current channel due to the external transducer. To cancel the lead (0.1°) in the current channel, a phase lead must also be introduced into the voltage channel. The resolution of the phase adjustment allows the introduction of a phase lead in increments of 0.026°. The phase lead is achieved by introducing a time advance into the voltage channel. A time advance of 4.88 µs is made by writing −4 (0x3C) to the time delay block, thus reducing the amount of time delay by 4.88 µs, or equivalently, a phase lead of approximately 0.1° at a line frequency of 60 Hz (0x3C represents −4 because the register is centered with 0 at 0x40).

PGA1

PGA2

ADC 1

0.1°

–231.93µs TO +48.83µs

ADC 2

HPF

LPF2

DELAY BLOCK

1.22µs/L SB

PHCAL[7:0]

CHANNEL 2 DELAY REDUCED BY 4.48µs (0.1°LEAD AT 60Hz) 0x0B IN PHCAL[7:0]

110100

RMS CALCULATION

The root mean square (rms) value of a continuous signal V(t) is defined as

rms

×=

For time sampling signals, rms calculation involves squaring the signal, taking the average, and obtaining the square root. The ADE7518 implements this method by serially squaring the input, averaging them, and then taking the square root of the average. The averaging part of this signal processing is done by implementing a low-pass filter (LPF3 in Figure 47, Figure 48, and Figure 50). This LPF has a −3 dB cutoff frequency of 2 Hz when MCLK =

4.096 MHz.

()

where V is the rms voltage.

When this signal goes through LPF3, the cos(2ωt) term is attenuated and only the dc term V Figure 47).

V(t ) = √2 × V sin(ωt)

INPUT

The I

signal can be read from the waveform register by setting

rms

the WAVMODE register (0x0D) and setting the WFSM bit in the Interrupt Enable 3 SFR (MIRQENH, 0xDB). Like the current and voltage channels waveform sampling modes, the waveform data is available at a sample rate of 25.6 kSPS, 12.8 kSPS, 6.4 kSPS, or 3.2 kSPS.

It is important to note that when the current input is larger than 40% of full scale, the I represent the true processed rms value. The rms value processed with this level of input is larger than the 24-bit read by the waveform register, making the value read truncated on the high end.

dttV

)(

∫

(1)

)sin(2 tVtV ω×= (2)

222

()

tVVtV ω−= 2cos)(

(3)

goes through (shown as V2 in

rms

V2(t) = V2 – V2 cos (2ωt)

LPF3

(t) = V

Figure 47. RMS Signal Processing

waveform sample register does not

rms

07327-047

60Hz

Figure 46. Phase Calibration

07327-046

Rev. 0 | Page 46 of 128

ADE7518

Current Channel RMS Calculation

Each ADE7518 simultaneously calculates the rms values for the current and voltage channels in different registers. Figure 48 shows the detail of the signal processing chain for the rms calculation on the current channel. The current channel rms value is processed from the samples used in the current channel waveform sampling mode and is stored in an unsigned 24-bit register (I

rms

). One LSB of the current channel rms register is equivalent to one LSB of a current channel waveform sample.

The update rate of the current channel rms measurement is

4.096 MHz/5. To minimize noise in the reading of the register, the I

rms

zero crossing of the voltage input. This configuration is done by setting the ZXRMS bit in the MODE2 register (0x0C).

With the different specified full-scale analog input signal PGA1 values, the ADC produces an output code that is approximately ±0d2,147,483 (PGA1 = 1) or ±0d2,684,354 (PGA1 = 2, 4, 8, or 16). See the Current Channel ADC section. Similarly, the equivalent rms value of a full-scale ac signal is 0d1,518,499 (0x172BA3) when PGA = 1 and 0d1,898,124 (0x1CF68C) when PGA1 = 2,

HPF

HPF1

4, 8, or 16. The current rms measurement provided in the ADE7518 is accurate to within 0.5% for signal inputs between full scale and full scale/500. The conversion from the register value to amps must be done externally in the microprocessor using an amps/LSB constant.

Current Channel RMS Offset Compensation

The ADE7518 incorporates a current channel rms offset compensation register (IRMSOS). This is a 12-bit signed register that can be used to remove offset in the current channel rms calculation. An offset can exist in the rms calculation due to input noises that are integrated into the dc component of V

One LSB of the current channel rms offset is equivalent to 16,384 LSBs of the square of the current channel rms register. Assuming that the maximum value from the current channel rms calculation is 0d1,898,124 with full-scale ac inputs, then 1 LSB of the current channel rms offset represents 0.23% of measurement error at −60 dB down from full scale.

where I

sgn 2

LPF3

rmsrms

is the rms measurement without offset correction.

rms0

IRMSOS[ 11:0]

26225

2172

0x00

×+= IRMSOSII

(t)

rms

(4)

768,32

[23:0]

(t).

CURRENT CHANNEL WAVEFORM DATA RANGE

0x28F5C2

0x000000

0xD70A3E

7327-048

Figure 48. Current Channel RMS Signal Processing with PGA1 = 1, 2, 4, 8, or 16

Rev. 0 | Page 47 of 128

ADE7518

ω−=

Voltage Channel RMS Calculation

Figure 50 shows details of the signal processing chain for the rms calculation on the voltage channel. The voltage channel rms value is processed from the samples used in the voltage channel waveform sampling mode and is stored in the unsigned 24-bit V

rms

The update rate of the voltage channel rms measurement is MCLK/5. To minimize noise in the reading of the register, the V

rms

zero crossing of the voltage input. This configuration is done by setting the ZXRMS bit in the MODE2 register (0x0C).

With the specified full-scale ac analog input signal of 0.4 V, the output from the LPF1 in Figure 50 swings between 0x28F5 and 0xD70B at 60 Hz (see the Voltage Channel ADC section). The equivalent rms value of this full-scale ac signal is approximately 0d1,898,124 (0x1CF68C) in the V

rms

measurement provided in the ADE7518 is accurate to within ±0.5% for signal input between full scale and full scale/20. The conversion from the register value to volts must be done externally in the microprocessor using a V/LSB constant.

Voltage Channel RMS Offset Compensation

The ADE7518 incorporates a voltage channel rms offset compensation register (VRMSOS). This is a 12-bit signed register that can be used to remove offset in the voltage channel rms calculation. An offset can exist in the rms calculation due to input noises and dc offset in the input samples. One LSB of the voltage channel rms offset is equivalent to 64 LSBs of the rms register. Assuming that the maximum value from the voltage channel rms calculation is 0d1,898,124 with full-scale ac inputs, then 1 LSB of the voltage channel rms offset represents 3.37% of measurement error at −60 dB down from full scale.

= V

rms

where V

+ 64 × VRMSOS (5)

rms0

is the rms measurement without offset correction.

rms0

ACTIVE POWER CALCULATION

Active power is defined as the rate of energy flow from source to load. It is the product of the voltage and current waveforms. The resulting waveform is called the instantaneous power signal and is equal to the rate of energy flow at every instant of time. The unit of power is watt or joules/second. Equation 8 gives an expression for the instantaneous power signal in an ac system.

()

)sin(2 tVtv ω×= (6)

where:

v is the rms voltage. i is the rms current.

)()()( titvtp

)2cos()( tVIVItp

(8)

The average power over an integral number of line cycles (n) is given by the expression in Equation 9.

)(

∫

(9)

VIdttp

where:

T is the line cycle period. P is referred to as the active or real power.

Note that the active power is equal to the dc component of the instantaneous power signal p(t) in Equation 9, that is, VI. This is the relationship used to calculate active power in the ADE7518. The instantaneous power signal p(t) is generated by multiplying the current and voltage signals. The dc component of the instantaneous power signal is then extracted by LPF2 (low-pass filter) to obtain the active power information. This process is illustrated in Figure 49.

0x19999A

0xCCCCD

0x00000

INSTANTANEO US POWER SIG NAL

CURRENT i(t) = √2 × i × sin(ωt)

VOLTAG E v(t) = √2 × v × sin(ωt)

Figure 49. Active Power Calculation

p(t) = v × i – v × i × cos(2ωt)

ACTIVE REAL POWER SIGNAL = v × i

Because LPF2 does not have an ideal brick wall frequency response (see Figure 51), the active power signal has some ripple due to the instantaneous power signal. This ripple is sinusoidal and has a frequency equal to twice the line frequency. Because of its sinusoidal nature, the ripple is removed when the active power signal is integrated to calculate energy (see the Active Energy Calculation section).

07327-050

()

)sin(2 tIti ω×= (7)

OLTAGE SIGNAL (V(t))

VRMSOS[11: 0]

216sgn 2

272

0x28F5C2

VRMSx[23:0]

0x00

OLTAGE CHANNEL

0x28F5

0x0

0xD70B

LPF1

Figure 50. Voltage Channel RMS Signal Processing

Rev. 0 | Page 48 of 128

LPF3

07327-049

ADE7518

–4

–8

–12

–16

ATTENUATION (dB)

–20

–24

31030100

FREQUENCY (Hz)

Figure 51. Frequency Response of LPF2

07327-051

Active Power Gain Calibration

Figure 52 shows the signal processing chain for the active power calculation in the ADE7518. As explained previously, the active power is calculated by filtering the output of the multiplier with a low-pass filter. Note that when reading the waveform samples from the output of LPF2, the gain of the active energy can be adjusted by using the multiplier and watt gain register (WGAIN[11:0]). The gain is adjusted by writing a twos complement 12-bit word to the watt gain register. Equation 10 shows how the gain adjustment is related to the contents of the watt gain register.

⎛ ⎜

⎜ ⎝

PowerActiveWGAINOutput

⎧

⎨ ⎩

WGAIN

+×=

⎞

⎫

⎟

(10)

⎬

⎟

⎭

⎠

For example, when 0x7FF is written to the watt gain register, the power output is scaled up by 50% (0x7FF = 2047d, 2047/2

= 0.5). Similarly, 0x800 = −2048d (signed, twos complement) and power output is scaled by –50%. Each LSB scales the power output by 0.0244%. The minimum output range is given when the watt gain register contents are equal to 0x800 and the maximum range is given by writing 0x7FF to the watt gain register. This watt gain register can be used to calibrate the active power (or energy) calculation in the ADE7518.

Active Power Offset Calibration

The ADE7518 also incorporates an active power offset register (WATTOS[15:0]). It is a signed, twos complement, 16-bit register that can be used to remove offsets in the active power calculation (see Figure 49). An offset can exist in the power calculation due to crosstalk between channels on the PCB or in the IC itself. The offset calibration allows the contents of the active power register to be maintained at 0 when no power is being consumed.

The 256 LSBs (WATTOS = 0x0100) written to the active power offset register are equivalent to 1 LSB in the waveform sample register. Assuming the average value, output from LPF2 is 0xCCCCD (838,861d) when inputs on the voltage and current channels are both at full scale. At −60 dB below full scale on the current channel (1/1000 of the current channel full-scale input), the average word value output from LPF2 is 838.861

(838,861/1000). One LSB in the LPF2 output has a measurement error of 1/838.861 × 100% = 0.119% of the average value. The active power offset register has a resolution equal to 1/256 LSB of the waveform register. Therefore, the power offset correction resolution is 0.000464%/LSB (0.119%/256) at −60 dB.

Active Power Sign Detection

The ADE7518 detects a change of sign in the active power. The APSIGN flag in the Interrupt Status 1 SFR (MIRQSTL, 0xDC) records when a change of sign has occurred according to Bit APSIGN in the ACCMODE register (0x0F). If the APSIGN flag is set in the Interrupt Enable 1 SFR (MIRQENL, 0xD9), the 8052 core has a pending ADE interrupt. The ADE interrupt stays active until the APSIGN status bit is cleared (see the Energy Measurement Interrupts section).

When APSIGN in the ACCMODE register (0x0F) is cleared (default), the APSIGN flag in the Interrupt Status 1 SFR (MIRQSTL, 0xDC) is set when a transition from positive to negative active power has occurred.

If APSIGN in the ACCMODE register (0x0F) is set, the APSIGN flag in the MIRQSTL SFR is set when a transition from negative to positive active power occurs.

Active Power No Load Detection

The ADE7518 includes a no load threshold feature on the active energy that eliminates any creep effects in the meter. The part accomplishes this by not accumulating energy if the multiplier output is below the no load threshold. When the active power is below the no load threshold, the APNOLOAD flag in the Interrupt Status 1 SFR (MIRQSTL, 0xDC) is set. If the APNOLOAD bit is set in the Interrupt Enable 1 SFR (MIRQENL, 0xD9), the 8052 core has a pending ADE interrupt. The ADE interrupt stays active until the APNOLOAD status bit is cleared (see the Energy Measurement Interrupts section).

The no load threshold level is selectable by setting the APNOLOAD bits in the NLMODE register (0x0E). Setting these bits to 0b00 disables the no load detection, and setting them to 0b01, 0b10, or 0b11 sets the no load detection threshold to 0.015%, 0.0075%, or 0.0037%, respectively, of the multiplier’s full-scale output frequency. The IEC 62053-21 specification states that the meter must start up with a load equal to or less than 0.4% I

, which translates to 0.0167% of the full-scale

output frequency of the multiplier.

Rev. 0 | Page 49 of 128

ADE7518

ACTIVE ENERGY CALCULATION

As stated in the Active Power Calculation section, power is defined as the rate of energy flow. This relationship can be expressed mathematically in Equation 11.

P =

where:

P is power. E is energy.

Conversely, energy is given as the integral of power.

The ADE7518 achieves the integration of the active power signal by continuously accumulating the active power signal in an internal, nonreadable, 49-bit energy register. The active energy register (WATTHR[23:0]) represents the upper 24 bits of this internal register. This discrete time accumulation or summation is equivalent to integration in continuous time. Equation 13 expresses the relationship.

where:

n is the discrete time sample number. T is the sample period.

The discrete time sample period (T) for the accumulation register in the ADE7518 is 1.22 µs (5/MCLK). In addition to calculating the energy, this integration removes any sinusoidal components that may be in the active power signal. Figure 52

(11)

= dttPE )(

(12)

∫

CURRENT CHANNEL

OLTAGE HANNEL

∞

⎧ ⎨

∑

=→1

⎩

⎫

(13)

)(lim)(

TnTpdttpE

×==

⎬ ⎭

FOR WAVEFORM SAMPLING

WATTO S[1 5:0 ]

sgn

252–62–72

LPF2

ACTIVE POWER

MCLK

SIGNAL

–8

WAVEFORM

VALUES

WGAIN[11:0]

shows this discrete time integration or accumulation. The active power signal in the waveform register is continuously added to the internal active energy register.

The active energy accumulation depends on the setting of the POAM and ABSAM bits in the ACCMODE register (0x0F). When both bits are cleared, the addition is signed and, therefore, negative energy is subtracted from the active energy contents. When both bits are set, the ADE7518 is set to be in the more restrictive mode, the positive-only accumulation mode.

When POAM in the ACCMODE register (0x0F) is set, only positive power contributes to the active energy accumulation. When ABSAM in the ACCMODE register (0x0F) is set, the absolute active power is used for the active energy accumulation (see the Watt-Absolute Accumulation Mode section).

The output of the multiplier is divided by the value in the WDIV register. If the value in the WDIV register is equal to 0, the internal active energy register is divided by 1. WDIV is an 8-bit unsigned register. After dividing by WDIV, the active energy is accumulated in a 49-bit internal energy accumulation register. The upper 24 bits of this register are accessible through a read to the active energy register (WATTHR[23:0]). A read to the RWATTHR register returns the content of the WATTHR register, and the upper 24 bits of the internal register are cleared. As shown in Figure 52, the active power signal is accumulated in an internal 49-bit signed register. The active power signal can be read from the waveform register by setting the WAVMODE register (0x0D) and setting the WFSM bit in the Interrupt Enable 3 SFR (MIRQENH, 0xDB). Like the current and voltage channels waveform sampling modes, the waveform data is available at a sample rate of 25.6 kSPS, 12.8 kSPS, 6.4 kSPS, or 3.2 kSPS.

UPPER 24 BITS ARE ACCESSIBLE THROUGH WATTHR[23:0] REGIST ER

WDIV[7:0]

48 0

TO DIGITAL-TO-FREQUENCY CONVERTER

WATTHR[23:0]

23 0

OUTPUTS FROM THE LPF2 ARE ACCUMULATED (INT EGRATED) I N THE INTERNAL ACTIVE ENERG Y REGIST ER

OUTPUT LPF2

TIME (nT)

Figure 52. Active Energy Calculation

7327-052

Rev. 0 | Page 50 of 128

ADE7518

Figure 53 shows this energy accumulation for full-scale signals (sinusoidal) on the analog inputs. The three displayed curves illustrate the minimum period of time it takes the energy register to roll over when the active power gain register contents are 0x7FF, 0x000, and 0x800. The watt gain register is used to carry out power calibration in the ADE7518. As shown, the fastest integration time occurs when the watt gain register is set to maximum full scale, that is, 0x7FF.

WATTHR[23:0]

0x7F,FFF

0x3F,FFF

0x00,0000

0x40,0000

6.823.41 10.2

13.7

WGAIN = 0x7FF WGAIN = 0x000 WGAIN = 0x800

TIME (Minutes)

When WDIV is set to a value other than 0, the integration time varies, as shown in Equation 15.

Time = Time

× WDIV (15)

WDIV = 0

Active Energy Accumulation Modes

Watt -Si g ne d Ac cum ula tio n Mo d e

The ADE7518 active energy default accumulation mode is a watt-signed accumulation based on the active power information.

Watt Positive-Only Accumulation Mode

The ADE7518 is placed in watt positive-only accumulation mode by setting the POAM bit in the ACCMODE register (0x0F). In this mode, the energy accumulation is only done for positive power, ignoring any occurrence of negative power above or below the no load threshold (see Figure 54). The CF pulse also reflects this accumulation method when in this mode. The default setting for this mode is off. Detection of the transitions in the direction of power flow and detection of no load threshold are active in this mode.

0x80,0000

Figure 53. Energy Register Rollover Time for Full-Scale Power

(Minimum and Maximum Power Gain)

Note that the energy register contents roll over to full-scale negative (0x800000) and continue to increase in value when the power or energy flow is positive (see Figure 53). Conversely, if the power is negative, the energy register underflows to fullscale positive (0x7FFFFF) and continues to decrease in value.

By using the interrupt enable register, the ADE7518 can be configured to issue an ADE interrupt to the 8052 core when the active energy register is half full (positive or negative) or when an overflow or underflow occurs.

Integration Time Under Steady Load: Active Energy

As mentioned previously, the discrete time sample period (T) for the accumulation register is 1.22 µs (5/MCLK). With fullscale sinusoidal signals on the analog inputs and the WGAIN register set to 0x000, the average word value from each LPF2 is 0xCCCCD (see Figure 49). The maximum positive value

that can be stored in the internal 49-bit register is 2

(or 0xFFFF,FFFF,FFFF) before it overflows. The integration time under these conditions when WDIV = 0 is calculated in the following equation:

Time =

FFFFFFFF,,xFFFF0

xCCCCD0

==×

min82.6sec6.409s22.1

(14)

7327-053

ACTIVE ENERGY

NO LOAD

THRESHOLD

ACTIVE POWER

NO LOAD

THRESHOLD

APSIGN FL AG

INTERRUPT ST ATUS REGIS TERS

Figure 54. Energy Accumulation in Positive-Only Accumulation Mode

NEG

POSPOS

7327-054

Watt-Absolute Accumulation Mode

The ADE7518 is placed in watt-absolute accumulation mode by setting the ABSAM bit in the ACCMODE register (0x0F). In this mode, the energy accumulation is done using the absolute active power, ignoring any occurrence of power below the no load threshold (see Figure 55). The CF pulse also reflects this accumulation method when in this mode. The default setting for this mode is off. Detection of the transitions in the direction of power flow and detection of a no load threshold are active in this mode.

Rev. 0 | Page 51 of 128

ADE7518

Line Cycle Active Energy Accumulation Mode

In line cycle active energy accumulation mode, the energy accumulation of the ADE7518 can be synchronized to the voltage channel zero crossing so that active energy can be accumulated over an integer number of half-line cycles. The

CTIVE ENERGY

NO LOAD

THRESHOLD

ACTIVE POWER

NO LOAD

THRESHOLD

APSIGN FL AG

APNOLOAD APNOL OAD

INTERRUPT ST ATUS REGIS TERS

NEG

POSPOS

07327-055

Figure 55. Energy Accumulation in Watt-Absolute Accumulation Mode

Active Energy Pulse Output

All of the ADE7518 circuitry has a pulse output whose frequency is proportional to active power (see the Active Power Calculation section). This pulse frequency output uses the calibrated signal from the WGAIN register output, and its behavior is consistent with the setting of the active energy accumulation mode in the ACCMODE register (0x0F). The pulse output is active low and should be preferably connected to an LED, as shown in Figure 66.

DIGITAL -TO-FREQUENCY

CONVERTER

advantage of summing the active energy over an integer number of line cycles is that the sinusoidal component in the active energy is reduced to 0. This eliminates any ripple in the energy calculation. Energy is calculated more accurately and more quickly because the integration period can be shortened. By using this mode, the energy calibration can be greatly simplified, and the time required to calibrate the meter can be significantly reduced.

In line cycle active energy accumulation mode, the ADE7518 accumulates the active power signal in the LWATTHR register for an integral number of line cycles, as shown in Figure 56. The number of half-line cycles is specified in the LINCYC register.

The ADE7518 can accumulate active power for up to 65,535 half-line cycles. Because the active power is integrated on an integer number of line cycles, the CYCEND flag in the Interrupt Status 3 SFR (MIRQSTH, 0xDE) is set at the end of an active energy accumulation line cycle. If the CYCEND enable bit in the Interrupt Enable 3 SFR (MIRQENH, 0xDB) is set, the 8052 core has a pending ADE interrupt. The ADE interrupt stays active until the CYCEND status bit is cleared (see the Energy Measurement Interrupts section). Another calibration cycle starts as soon as the CYCEND flag is set. If the LWATTHR register is not read before a new CYCEND flag is set, the LWATTHR register is overwritten by a new value.

OUTPUT

FROM

LPF2

FROM VOLTAGE

CHANNEL

ADC

LPF1

WGAIN[11:0]

ZERO-CROSS ING

DETECT ION

48 0

23 0

LWATTHR[ 23:0]

WDIV[7:0]WATTOS [15:0]

CALIBRATION

CONTROL

LINCYC[15:0]

Figure 56. Line Cycle Active Energy Accumulation

Rev. 0 | Page 52 of 128

ACTIVE ENERGY IS ACCUMULATED IN THE INTERNAL REGISTER, AND THE LWATTHR REGISTER IS UPDATED AT THE END OF THE LINCYC HALF-L INE CY CLES

07327-056

ADE7518

When a new half-line cycle is written in the LINCYC register, the LWATTHR register is reset, and a new accumulation starts at the next zero crossing. The number of half-line cycles is then counted until LINCYC is reached. This implementation provides a valid measurement at the first CYCEND interrupt after writing to the LINCYC register (see Figure 57). The line active energy accumulation uses the same signal path as the active energy accumulation. The LSB size of these two registers is equivalent.

′

where: θ is the phase difference between the voltage and current channel.

⎛

sin2)(

⎜ ⎝

v is the rms voltage. i is the rms current.

LWATTHR REGISTER

q(t) = v(t) × i’(t) (21)

q(t) = VI sin (θ) + VI sin

CYCEND IRQ

LINCYC

VALUE

Figure 57. Energy Accumulation When LINCYC Changes

From the information in Equation 8 and Equation 9,

()

⎧ ⎪ ⎪

dtVItE

−=

⎨ ⎪

⎪ ⎩

⎛ ⎜

⎝

⎫ ⎪

nTnT

⎪

()

dtft

2cos

⎬

∫∫

⎪

⎞ ⎟

⎪

9.8

⎠

⎭

(16)

where:

n is an integer. T is the line cycle period.

Because the sinusoidal component is integrated over an integer number of line cycles, its value is always 0. Therefore,

∫

00+=

VIdtE (17)

07327-057

The average reactive power over an integer number of lines (n) is given in Equation 22.

∫

where:

T is the line cycle period. q is referred to as the reactive power.

Note that the reactive power is equal to the dc component of the instantaneous reactive power signal q(t) in Equation 21.

The instantaneous reactive power signal q(t) is generated by multiplying the voltage and current channels. In this case, the phase of the current channel is shifted by 90°. The dc component of the instantaneous reactive power signal is then extracted by a low-pass filter to obtain the reactive power information (see Figure 58).

In addition, the phase-shifting filter has a nonunity magnitude response. Because the phase-shifted filter has a large attenuation at high frequency, the reactive power is primarily for calculation at line frequency. The effect of harmonics is largely ignored in

E(t) = VInT (18)

Note that in this mode, the 16-bit LINCYC register can hold a maximum value of 65,535. In other words, the line energy accumulation mode can be used to accumulate active energy for a maximum duration of over 65,535 half-line cycles. At a 60 Hz line frequency, this translates to a total duration of 65,535/120 Hz = 546 sec.

REACTIVE POWER CALCULATION

Reactive power is defined as the product of the voltage and current waveforms when one of these signals is phase-shifted by 90°. The resulting waveform is called the instantaneous reactive power signal. Equation 21 gives an expression for the instantaneous reactive power signal in an ac system when the phase of the current channel is shifted by 90°.

the reactive power calculation. Note that, because of the magnitude characteristic of the phase shifting filter, the weight of the reactive power is slightly different from that of the active power calculation (see the Energy Register Scaling section).

The frequency response of the LPF in the reactive signal path is identical to the one used for LPF2 in the average active power calculation. Because LPF2 does not have an ideal brick wall frequency response (see Figure 51), the reactive power signal has some ripple due to the instantaneous reactive power signal. This ripple is sinusoidal and has a frequency equal to twice the line frequency. Because the ripple is sinusoidal in nature, it is removed when the reactive power signal is integrated to calculate energy.

The reactive power signal can be read from the waveform register by setting the WAVMODE register (0x0D) and the WFSM bit in the Interrupt Enable 3 SFR (MIRQENH, 0xDB). Like the current and voltage channels waveform sampling modes, the waveform data is available at a sample rate of 25.6 kSPS, 12.8 kSPS, 6.4 kSPS, or 3.2 kSPS.

)sin(2)( θtVtv +ω= (19)

)sin(2)( tIti ω=

⎞

tIti (20)

⎟

⎠

)2( θ+ωt

θ==

VIdttq

)sin()(

(22)

Rev. 0 | Page 53 of 128

ADE7518

Reactive Power Gain Calibration

Figure 58 shows the signal processing chain for the ADE7518 reactive power calculation. As explained in the Reactive Power Calculation section, the reactive power is calculated by applying a low-pass filter to the instantaneous reactive power signal. Note that, when reading the waveform samples from the output of LPF2, the gain of the reactive energy can be adjusted by using the multiplier and by writing a twos complement, 12-bit word to the VAR gain register (VARGAIN[11:0]). Equation 23 shows how the gain adjustment is related to the contents of the watt gain register.

Output VARGAIN =

⎛ ⎜

PowerReactive

⎝

The resolution of the VARGAIN register is the same as the WGAIN register (see the Active Power Gain Calibration section). VARGAIN can be used to calibrate the reactive power (or energy) calculation in the ADE7518.

VARGAIN

⎧

+×

⎨ ⎩

⎞

⎫

(23)

⎟

⎬

⎭

⎠

Reactive Power Offset Calibration

The ADE7518 also incorporates a reactive power offset register (VAROS[15:0]). This is a signed, twos complement, 16-bit register that can be used to remove offsets in the reactive power calculation (see Figure 58). An offset may exist in the reactive power calculation due to crosstalk between channels on the PCB or in the IC itself. The offset calibration allows the contents of the reactive power register to be maintained at 0 when no power is being consumed.

The 256 LSBs (VAROS = 0x100) written to the reactive power offset register are equivalent to 1 LSB in the WAVMODE register.

Sign of Reactive Power Calculation

Note that the average reactive power is a signed calculation. The phase-shift filter has −90° phase shift when the integrator is enabled, and +90° phase shift when the integrator is disabled. Table 43 summarizes how the relationship of the phase difference between the voltage and the current affects the sign of the resulting VAR ca lc u la t ion .

Table 43. Sign of Reactive Power Calculation

Angle Integrator Sign

Between 0° to +90° Between –90° to 0° Between 0° to +90° Between –90° to 0°

Off Positive Off Negative On Positive On Negative

Reactive Power Sign Detection

The ADE7518 detects a change of sign in the reactive power. The VARSIGN flag in the Interrupt Status 1 SFR (MIRQSTL, 0xDC) records when a change of sign has occurred according to the VARSIGN bit in the ACCMODE register (0x0F). If the VARSIGN bit is set in the Interrupt Enable 1 SFR (MIRQENL, 0xD9), the 8052 core has a pending ADE interrupt. The ADE

interrupt stays active until the VARSIGN status bit is cleared (see the Energy Measurement Interrupts section).

When VARSIGN in the ACCMODE register (0x0F) is cleared (default), the VARSIGN flag in the Interrupt Status 1 SFR (MIRQSTL, 0xDC) is set when a transition from positive to negative reactive power occurs.

If VARSIGN in the ACCMODE register (0x0F) is set, the VARSIGN flag in the Interrupt Status 1 SFR (MIRQSTL, 0xDC) is set when a transition from negative to positive reactive power occurs.

Reactive Power No Load Detection

The ADE7518 includes a no load threshold feature on the reactive energy that eliminates any creep effects in the meter. The ADE7518 accomplishes this by not accumulating reactive energy when the multiplier output is below the no load threshold. When the reactive power is below the no load threshold, the RNOLOAD flag in the Interrupt Status 1 SFR (MIRQSTL, 0xDC) is set. If the RNOLOAD bit is set in the Interrupt Enable 1 SFR (MIRQENL, 0xD9), the 8052 core has a pending ADE interrupt. The ADE interrupt stays active until the RNOLOAD status bit is cleared (see the Energy Measurement Interrupts section).

The no load threshold level is selectable by setting the VARNOLOAD bits in the NLMODE register (0x0E). Setting these bits to 0b00 disables the no load detection, and setting them to 0b01, 0b10, or 0b11 sets the no load detection threshold to 0.015%, 0.0075%, and 0.0037% of the full-scale output frequency of the multiplier, respectively.

REACTIVE ENERGY CALCULATION

As for reactive energy, the ADE7518 achieves the integration of the reactive power signal by continuously accumulating the reactive power signal in an internal, nonreadable, 49-bit energy register. The reactive energy register (VARHR[23:0]) represents the upper 24 bits of this internal register.

The discrete time sample period (T) for the accumulation register in the ADE7518 is 1.22 µs (5/MCLK). As well as calculating the energy, this integration removes any sinusoidal components that may be in the active power signal. Figure 58 shows this discrete time integration or accumulation. The reactive power signal in the waveform register is continuously added to the internal reactive energy register.

The reactive energy accumulation depends on the setting of the SAVARM and ABSVARM bits in the ACCMODE register (0x0F). When both bits are cleared, the addition is signed and, therefore, negative energy is subtracted from the reactive energy contents. When both bits are set, the ADE7518 is set to be in the more restrictive mode, the absolute accumulation mode.

Rev. 0 | Page 54 of 128

ADE7518

When SAVARM in the ACCMODE register (0x0F) is set, the reactive power is accumulated depending on the sign of the active power. When active power is positive, the reactive power is added as it is to the reactive energy register. When active power is negative, the reactive power is subtracted from the reactive energy accumulator (see the VAR Antitamper Accumulation Mode section).

When ABSVARM in the ACCMODE register (0x0F) is set, the absolute reactive power is used for the reactive energy accumulation (see the VAR Absolute Accumulation Mode section).

The output of the multiplier is divided by VARDIV. If the value in the VARDIV register is equal to 0, the internal reactive energy register is divided by 1. VARDIV is an 8-bit, unsigned register. After dividing by VARDIV, the reactive energy is accumulated in a 49-bit internal energy accumulation register. The upper 24 bits of this register are accessible through a read to the reactive energy register (VARHR[23:0]). A read to the RVARHR register returns the content of the VARHR register, and the upper 24 bits of the internal register are cleared.

VAROS[15:0]

sgn 252–62–72

LPF2

REACTIVE PO WER

SIGNAL

MCLK

WAVEFORM

VALUES

CURRENT CHANNEL

VOLTAGE CHANNEL

HPF

PHCAL[7:0]

90° PHASE

SHIFTING FILTER

FOR WAVEFORM

SAMPLING

–8

As shown in Figure 58, the reactive power signal is accumulated in an internal 49-bit signed register. The reactive power signal can be read from the waveform register by setting the WAVMODE register (0x0D) and setting the WFSM bit in the Interrupt Enable 3 SFR (MIRQENH, 0xDB). Like the current and voltage channel waveform sampling modes, the waveform data is available at a sample rate of 25.6 kSPS, 12.8 kSPS, 6.4 kSPS, or 3.2 kSPS.

Figure 53 shows this energy accumulation for full-scale signals (sinusoidal) on the analog inputs. These curves also apply for the reactive energy accumulation.

Note that the energy register contents roll over to full-scale negative (0x800000) and continue to increase in value when the power or energy flow is positive. Conversely, if the power is negative, the reactive energy register underflows to full-scale positive (0x7FFFFF) and continues to decrease in value.

By using the interrupt enable register, the ADE7518 can be configured to issue an ADE interrupt to the 8052 core when the reactive energy register is half full (positive or negative) or when an overflow or underflow occurs.

UPPER 24 BITS ARE ACCESSIBLE THROUGH VARHR[23:0] REGISTER

]

OUTPUTS FROM THE LPF2 ARE ACCUMULATED (INT EGRATED) I N THE INTERNAL REACTIVE ENERGY REGISTER

VARDIV[7:0]

VARGAIN[11:0]

DIGITAL-TO-FREQUENCY

CONVERTER

ARHR[23:0

23 0

48 0

OUTPUT LPF2

TIME (nT)

07327-058

Figure 58. Reactive Energy Calculation

Rev. 0 | Page 55 of 128

ADE7518

Integration Time Under Steady Load: Reactive Energy

As mentioned in the Active Energy Calculation section, the discrete time sample period (T) for the accumulation register is

1.22 µs (5/MCLK). With full-scale sinusoidal signals on the analog inputs and the VARGAIN and VARDIV registers set to 0x000, the integration time before the reactive energy register overflows is calculated in Equation 24.

Time =

0xCCCCD

FFFFFFFF,0xFFFF,

==μ×

min82.6sec6.409s22.1

(24)

When VARDIV is set to a value other than 0, the integration time varies, as shown in Equation 25.

WDIV×==0

VARDIVTimeTime

(25)

Reactive Energy Accumulation Modes

VAR - Si gn ed Ac cu mu la ti on Mo de

The ADE7518 reactive energy default accumulation mode is a signed accumulation based on the reactive power information.

VAR Antitamper Accumulation Mode

The ADE7518 is placed in VAR antitamper accumulation mode by setting the SAVARM bit in the ACCMODE register (0x0F). In this mode, the reactive power is accumulated depending on the sign of the active power. When active power is positive, the reactive power is added as it is to the reactive energy register. When active power is negative, the reactive power is subtracted from the reactive energy accumulator (see Figure 59). The CF pulse also reflects this accumulation method when in this mode. The default setting for this mode is off. Transitions in the direction of power flow and no load threshold are active in this mode.

REACTIVE ENERGY

NO LOAD

THRESHOLD

REACTIVE POWER

NO LOAD

THRESHOLD

NO LOAD

THRESHOLD

ACTIVE POWER

NO LOAD

THRESHOLD

APSIGN FLAG

POSPOS

INTERRUPT STAT US REGI STERS

Figure 59. Reactive Energy Accumulation in

Antitamper Accumulation Mode

NEG

7327-059

Rev. 0 | Page 56 of 128

ADE7518

VAR Absolute Accumulation Mode

The ADE7518 is placed in absolute accumulation mode by setting the ABSVARM bit in the ACCMODE register (0x0F). In absolute accumulation mode, the reactive energy accumulation is done by using the absolute reactive power and ignoring any occurrence of power below the no load threshold for the active energy (see Figure 60). The CF pulse also reflects this accumulation method when in absolute accumulation mode. The default setting for this mode is off. Transitions in the direction of power flow and no load threshold are active in this mode.

REACTIVE ENERG Y

NO LOAD

THRESHOLD

REACTIVE POWER

NO LOAD

THRESHOLD

Figure 60. Reactive Energy Accumulation in Absolute Accumulation Mode

7327-060

Reactive Energy Pulse Output

The ADE7518 provides all the circuitry with a pulse output whose frequency is proportional to reactive power (see the Energy-to-Frequency Conversion section). This pulse frequency output uses the calibrated signal after VARGAIN, and its behavior is consistent with the setting of the reactive energy accumulation mode in the ACCMODE register (0x0F). The pulse output is active low and should preferably be connected to an LED, as shown in Figure 66.

DIGITAL-TO-FREQUENCY

CONVERTER

Line Cycle Reactive Energy Accumulation Mode

In line cycle reactive energy accumulation mode, the energy accumulation of the ADE7518 can be synchronized to the voltage channel zero crossing so that reactive energy can be accumulated over an integer number of half-line cycles. The advantage of this mode is similar to that described in the Line Cycle Active Energy Accumulation Mode section.

In line cycle active energy accumulation mode, the ADE7518 accumulates the reactive power signal in the LVARHR register for an integral number of line cycles, as shown in Figure 61. The number of half-line cycles is specified in the LINCYC register. The ADE7518 can accumulate active power for up to 65,535 half-line cycles.

Because the reactive power is integrated on an integer number of line cycles, the CYCEND flag in the Interrupt Status 3 SFR (MIRQSTH, 0xDE) is set at the end of an active energy accumulation line cycle. If the CYCEND enable bit in the Interrupt Enable 3 SFR (MIRQENH, 0xDB) is set, the 8052 core has a pending ADE interrupt. The ADE interrupt stays active until the CYCEND status bit is cleared (see the Energy Measurement Interrupts section). Another calibration cycle starts as soon as the CYCEND flag is set. If the LVARHR register is not read before a new CYCEND flag is set, the LVARHR register is overwritten by a new value.

When a new half-line cycle is written in the LINCYC register, the LVARHR register is reset, and a new accumulation starts at the next zero crossing. The number of half-line cycles is then counted until LINCYC is reached. This implementation provides a valid measurement at the first CYCEND interrupt after writing to the LINCYC register. The line reactive energy accumulation uses the same signal path as the reactive energy accumulation. The LSB size of these two registers is equivalent.

VARGAIN[11:0]

48 0

OUTPUT

FROM

LPF2

FROM VOLTAGE

CHANNEL ADC

LPF1

VARDIV[7:0]VAROS[15:0]

ZERO-CRO SSING

DETECTION

Figure 61. Line Cycle Reactive Energy Accumulation Mode

CALIBRATION

CONTROL

LINCYC[15:0]

23 0

LVARHR[23:0]

REACTIVE ENERGY IS ACCUMULATED I N THE INTERNAL REGISTER, AND THE LWATT HR REGISTER IS UPDATED AT THE END OF THE LINCYC HALF-LINE CYCLES

07327-061

Rev. 0 | Page 57 of 128

ADE7518

APPARENT POWER CALCULATION

Apparent power is defined as the maximum power that can be delivered to a load. V current delivered to the load, respectively. Therefore, the apparent power (AP) = V phase angle between the current and the voltage.

Equation 29 gives an expression of the instantaneous power signal in an ac system with a phase shift.

() 2 sin( )

vt V t

()

Figure 62 illustrates the signal processing for the calculation of the apparent power in the ADE7518.

The apparent power signal can be read from the waveform register by setting the WAVMODE register (0x0D) and setting the WFSM bit in the Interrupt Enable 3 SFR (MIRQENH, 0xDB). Like the current and voltage channel waveform sampling modes, the waveform data is available at a sample rate of 25.6 kSPS, 12.8 kSPS,

6.4 kSPS, or 3.2 kSPS.

rms

and I

rms

× I

. This equation is independent from the

rms

are the effective voltage and

rms

(26)

)sin(2 θ+ω= tIti

(27)

)()()( titvtp ×= (28)

)2cos()cos( θ+ω−θ= tIVIVtp

rmsrmsrmsrms

rms

CURRENT RMS SIG NAL – i(t)

0x1CF68C

rms

VOLTAGE RMS SIGNAL – v(t)

0x1CF 68C

(29)

0x00

Figure 62. Apparent Power Signal Processing

The gain of the apparent energy can be adjusted by using the multiplier and by writing a twos complement, 12-bit word to the VAGAIN register (VAGAIN[11:0]). Equation 30 shows how the gain adjustment is related to the contents of the VAGAIN register.

Output VAGAIN =

⎛ ⎜

PowerApparent

⎝

⎧

+×

⎨ ⎩

VAGAIN

⎞

⎫

(30)

⎟

⎬ ⎭

⎠

For example, when 0x7FF is written to the VAGAIN register, the power output is scaled up by 50% (0x7FF = 2047d, 2047/2 Similarly, 0x800 = –2047d (signed twos complement) and power output is scaled by –50%. Each LSB represents 0.0244% of the power output. The apparent power is calculated with the current and voltage rms values obtained in the rms blocks of the ADE7518.

Apparent Power Offset Calibration

Each rms measurement includes an offset compensation register to calibrate and eliminate the dc component in the rms value (see the Current Channel RMS Calculation section and the Voltage Channel RMS Calculation section). The voltage and current channels rms values are then multiplied together in the apparent power signal processing. Because no additional offsets are created in the multiplication of the rms values, there is no specific offset compensation in the apparent power signal processing. The offset compensation of the apparent power measurement is done by calibrating each individual rms measurement.

ARMSCFCON

APPARENT POW ER SIGNAL (P)

0x1A36E2

VAGAIN

DIGITAL-TO-FREQUENCY

CONVERTER

07327-062

= 0.5).

Rev. 0 | Page 58 of 128

ADE7518

APPARENT ENERGY CALCULATION

The apparent energy is given as the integer of the apparent power.

= dttPowerApparentEnergyApparent )(

∫

The ADE7518 achieves the integration of the apparent power signal by continuously accumulating the apparent power signal in an internal 48-bit register. The apparent energy register (VAHR[23:0]) represents the upper 24 bits of this internal register. This discrete time accumulation or summation is equivalent to integration in continuous time. Equation 32 expresses the relationship.

∞

⎧ ⎨

∑

=→0

⎩

where:

n is the discrete time sample number. T is the sample period.

The discrete time sample period (T) for the accumulation register in the ADE7518 is 1.22 µs (5/MCLK).

Figure 63 shows this discrete time integration or accumulation. The apparent power signal is continuously added to the internal register. This addition is a signed addition even if the apparent energy theoretically remains positive.

The 49 bits of the internal register are divided by VADIV. If the value in the VADIV register is 0, the internal apparent energy register is divided by 1. VADIV is an 8-bit unsigned register. The upper 24 bits are then written in the 24-bit apparent energy register (VAHR[23:0]). The RVAHR register (24 bits long) is

(31)

⎫

(32)

)(lim

TnTPowerApparentEnergyApparent

×=

⎬ ⎭

23 0

provided to read the apparent energy. This register is reset to 0 after a read operation.

Note that the apparent energy register is unsigned. By setting the VAEHF and VAEOF bits in the Interrupt Enable 2 SFR (MIRQENM, 0xDA), the ADE7518 can be configured to issue an ADE interrupt to the 8052 core when the apparent energy register is half-full or when an overflow occurs. The half-full interrupt for the unsigned apparent energy register is based on 24 bits as opposed to 23 bits for the signed active energy register.

Integration Times Under Steady Load: Apparent Energy

As mentioned in the Apparent Energy Calculation section, the discrete time sample period (T) for the accumulation register is 1.22 µs (5/MCLK). With full-scale sinusoidal signals on the analog inputs and the VAGAIN register set to 0x000, the average word value from the apparent power stage is 0x1A36E2 (see the Apparent Power Calculation section). The maximum value that can be stored in the apparent energy register before it overflows

is 2

or 0xFF,FFFF. The average word value is added to the internal register, which can store 248 or 0xFFFF,FFFF,FFFF before it overflows. Therefore, the integration time under these conditions with VADIV = 0 is calculated as follows:

Time =

FFFFFFFF,0xFFFF,

0xD055

min33.3sec199s22.1

==μ×

When VADIV is set to a value other than 0, the integration time varies, as shown in Equation 34.

Time = Time

× VADIV (34)

WDIV = 0

AHR[23:0]

(33)

APPARENT POW ER

rms

VADIV

APPARENT POWER SIGNAL = P

TIME (nT)

Figure 63. Apparent Energy Calculation

48 0

APPARENT POWER OR I ACCUMULATED (INT EGRATED) IN THE APPARENT ENERGY REGISTER

rms

7327-063

Rev. 0 | Page 59 of 128

ADE7518

Apparent Energy Pulse Output

All ADE7518 circuitry has a pulse output whose frequency is proportional to apparent power (see the Energy-to-Frequency Conversion section). This pulse frequency output uses the calibrated signal after VAGAIN. This output can also be used to output a pulse whose frequency is proportional to I

rms

The pulse output is active low and should preferably be connected to an LED, as shown in Figure 66.

Line Apparent Energy Accumulation

The ADE7518 is designed with a special apparent energy accumulation mode that simplifies the calibration process. By using the on-chip zero-crossing detection, the ADE7518 accumulates the apparent power signal in the LVAHR register for an integral number of half cycles, as shown in Figure 64. Line apparent energy accumulation mode is always active.

The number of half-line cycles is specified in the LINCYC register, which is an unsigned 16-bit register. The ADE7518 can accumulate apparent power for up to 65,535 combined half cycles. Because the apparent power is integrated on the same integral number of line cycles as the line active register and reactive energy register, these values can easily be compared. The energies are calculated more accurately because of this precise timing control, and provide all the information needed for reactive power and power factor calculation.

At the end of an energy calibration cycle, the CYCEND flag in the Interrupt Status 3 SFR (MIRQSTH, 0xDE) is set. If the CYCEND enable bit in the Interrupt Enable 3 SFR (MIRQENH, 0xDB) is enabled, the 8052 core has a pending ADE interrupt.

As for LWATTHR, when a new half-line cycle is written in the LINCYC register, the LVAHR register is reset and a new accumulation starts at the next zero crossing. The number of half-line cycles is then counted until LINCYC is reached.

This implementation provides a valid measurement at the first CYCEND interrupt after writing to the LINCYC register. The line apparent energy accumulation uses the same signal path as the apparent energy accumulation. The LSB size of these two registers is equivalent.

Apparent Power No Load Detection

The ADE7518 includes a no load threshold feature on the apparent power that eliminates any creep effects in the meter. The ADE7518 accomplishes this by not accumulating energy if the multiplier output is below the no load threshold. When the apparent power is below the no load threshold, the VANOLOAD flag in the Interrupt Status 1 SFR (MIRQSTL, 0xDC) is set. If the VANOLOAD bit is set in the Interrupt Enable 1 SFR (MIRQENL, 0xD9), the 8052 core has a pending ADE interrupt. The ADE interrupt stays active until the APNOLOAD status bit is cleared (see the Energy Measurement Interrupts section).

The no load threshold level is selectable by setting the VANOLOAD bits in the NLMODE register (0x0E). Setting these bits to 0b00 disables the no load detection, and setting them to 0b01, 0b10, or 0b11 sets the no load detection threshold to 0.030%, 0.015%, and 0.0075% of the full-scale output frequency of the multiplier, respectively.

This no load threshold can also be applied to the I

rms

pulse output when selected. In this case, the level of no load threshold is the same as for the apparent energy.

AMPERE-HOUR ACCUMULATION

In a tampering situation where no voltage is available to the energy meter, the ADE7518 is capable of accumulating the ampere-hour instead of apparent power into VAHR, RVAHR, and LVAHR. When Bit 3 (VARMSCFCON) of the MODE2 register (0x0C) is set, VAHR, RVAHR, LVAHR, and the input for the digital-to-frequency converter accumulate I apparent power. All the signal processing and calibration registers available for apparent power and energy accumulation remain the same when ampere-hour accumulation is selected. However, the scaling difference between I power requires independent values for gain calibration in the VAG AI N, VAD IV, C Fx N UM , a nd C Fx D EN re gi s ter s.

instead of

rms

and apparent

rms

48 0

LVAHR REGIST ER IS UPDATED EVERY LINCYC ZERO CROSSI NG WIT H THE TOTAL APPARENT ENERGY DURING THAT DURATION

23 0

LVAHR[23:0]

07327-064

VOLTAGE CHANNEL

FROM

ADC

APPARENT POWER

LPF1

or I

rms

ZERO-CROSSING

DETECTIO N

Figure 64. Line Cycle Apparent Energy Accumulation

VADIV[7:0]

CALIBR

LINCYC[15:0]

ATI ON

CONTROL

Rev. 0 | Page 60 of 128

ADE7518

ENERGY-TO-FREQUENCY CONVERSION

The ADE7518 also provides two energy-to-frequency conversions for calibration purposes. After initial calibration at manufacturing, the manufacturer or end customer often verifies the energy meter calibration. One convenient way to do this is for the manufacturer to provide an output frequency that is proportional to the active power, reactive power, apparent power, or I

under steady load conditions. This output frequency

rms

can provide a simple, single-wire, optically isolated interface to external calibration equipment. Figure 65 illustrates the energyto-frequency conversion in the ADE7518.

MODE 2 REGI STER 0x0C

VARMSCFCON

rms

Two digital-to-frequency converters (DFC) are used to generate the pulsed outputs. When WDIV = 0 or 1, the DFC generates a pulse each time 1 LSB in the energy register is accumulated. An output pulse is generated when a CFxNUM/CFxDEN number of pulses are generated at the DFC output. Under steady load conditions, the output frequency is proportional to the active power, reactive power, apparent power, or I the CFxSEL bits in the MODE2 register (0x0C).

Both pulse outputs can be enabled or disabled by clearing or setting Bit DISCF1 and Bit DISCF2 in the MODE1 register (0x0B), respectively.

Both pulse outputs set separate flags in the Interrupt Status 2 SFR (MIRQSTM, 0xDD), CF1 and CF2. If the CF1 and CF2 enable bits in the Interrupt Enable 2 SFR (MIRQENM, 0xDA) are set, the 8052 core has a pending ADE interrupt. The ADE interrupt stays active until the CF1 or CF2 status bits are cleared (see the Energy Measurement Interrupts section).

CFxSEL[1:0]

CFxNUM

VAR

WATT

Figure 65. Energy-to-Frequency Conversion

DFC

CFxDEN

, depending on

rms

CFx PULSE OUTPUT

07327-065

Pulse Output Configuration

The two pulse output circuits have separate configuration bits in the MODE2 register (0x0C). Setting the CFxSEL bits to 0b00, 0b01, or 0b1x configures the DFC to create a pulse output proportional to active power, to reactive power, or to apparent power or I

The selection between I

, respectively.

rms

and apparent power is done by the

rms

VARMSCFCON bit in the MODE2 register (0x0C). With this selection, CF2 cannot be proportional to apparent power if CF1 is proportional to I power if CF2 is proportional to I

, and CF1 cannot be proportional to apparent

rms

Pulse Output Characteristic

The pulse output for both DFCs stays low for 90 ms if the pulse period is longer than 180 ms (5.56 Hz). If the pulse period is shorter than 180 ms, the duty cycle of the pulse output is 50%. The pulse output is active low and should preferably be connected to an LED, as shown in Figure 66.

7327-066

Figure 66. CF Pulse Output

The maximum output frequency with ac input signals at full scale and CFxNUM = 0x00 and CFxDEN = 0x00 is approximately 21.1 kHz.

The ADE7518 incorporates two registers per DFC, CFxNUM[15:0] and CFxDEN[15:0], to set the CFx frequency. These are unsigned 16-bit registers that can be used to adjust the CFx frequency to a wide range of values. These frequency scaling registers are 16-bit registers that can scale the output frequency by 1/2

with a step of 1/2

to 1

If 0 is written to any of these registers, 1 is applied to the register. The ratio CFxNUM/CFxDEN should be less than 1 to ensure proper operation. If the ratio of the CFxNUM/CFxDEN registers is greater than 1, the register values are adjusted to a ratio of 1. For example, if the output frequency is 1.562 kHz and the content of CFxDEN is 0 (0x000), the output frequency can be set to 6.1 Hz by writing 0xFF to the CFxDEN register.

Rev. 0 | Page 61 of 128

ADE7518

ENERGY REGISTER SCALING

The ADE7518 provides measurements of active, reactive, and apparent energies that use separate paths and filtering for calculation. The difference in data paths may result in small differences in LSB weight between active, reactive, and apparent energy registers. These measurements are internally compensated so that the scaling is nearly one to one. The relationship between these registers is shown in Table 44.

Table 44. Energy Registers Scaling

Line Frequency = 50 Hz Line Frequency = 60 Hz Integrator

VAR = 0.9952 × WATT VAR = 0.9949 × WATT Off VA = 0.9978 × WATT VA = 1.0015 × WATT Off VAR = 0.9997 × WATT VAR = 0.9999 × WATT On VA = 0.9977 × WATT VA = 1.0015 × WATT On

ENERGY MEASUREMENT INTERRUPTS

The energy measurement part of the ADE7518 has its own interrupt vector for the 8052 core, Vector Address 0x004B (see the Interrupt Vectors section). The bits set in the Interrupt Enable 1 SFR (MIRQENL, 0xD9), Interrupt Enable 2 SFR (MIRQENM, 0xDA), and Interrupt Enable 3 SFR (MIRQENH, 0xDB) enable the energy measurement interrupts that are allowed to interrupt the 8052 core. If an event is not enabled, it cannot create a system interrupt.

The ADE interrupt stays active until the status bit that has created the interrupt is cleared. The status bit is cleared when a zero is written to this register bit.

Rev. 0 | Page 62 of 128

ADE7518

8052 MCU CORE ARCHITECTURE

The ADE7518 has an 8052 MCU core and uses the 8051 instruction set. Some of the standard 8052 peripherals, such as the UART, have been enhanced. This section describes the standard 8052 core and its enhancements used in the ADE7518.

The special function register (SFR) space is mapped into the upper 128 bytes of internal data memory space and is accessed by direct addressing only. It provides an interface between the CPU and all on-chip peripherals. A block diagram showing the

256 BYTES GENERAL-

PURPOSE

RAM

STACK

BANKS

programming model of the ADE7518 via the SFR area is shown in Figure 67.

All registers except the program counter (PC), the instruction register (IR), and the four general-purpose register banks reside in the SFR area. The SFR registers include power control, configuration, and data registers that provide an interface between the CPU and all on-chip peripherals.

MCU REGISTERS

The registers used by the MCU are summarized in this section.

Table 45. 8052 SFRs

Address Mnemonic Bit Addressable Description

0xE0 ACC Yes Accumulator. 0xF0 B Yes Auxiliary Math. 0xD0 PSW Yes Program Status Word (see Table 46). 0x87 PCON No Program Control (see Table 47). 0x82 DPL No Data Pointer Low (see Table 48). 0x83 DPH No Data Pointer High (see Table 49). 0x83 and 0x82 DPTR No Data Pointer (see Table 50). 0x81 SP No Stack Pointer (see Table 51). 0xAF CFG No Configuration (see Table 52).

16kB ELECTRI CALLY

REPROGRAMMABLE

NONVOLATI LE

FLASH/EE

PROGRAM/DATA

MEMORY

8051-

COMPAT IBLE

CORE

256 BYTES XRAM

Figure 67. Block Diagram

128-BYTE

SPECIAL FUNCTION REGISTER

AREA

ENERGY

MEASUREMENT

POWER

MANAGEMENT

RTC

LCD DRIVER

BATTERY

ADC

OTHER ON-CHIP PERIPHERALS:

• SERIAL I/O

• WDT

• TIMERS

07327-067

Table 46. Program Status Word SFR (PSW, 0xD0)

Bit Address Mnemonic Description

7 0xD7 CY Carry Flag. Modified by ADD, ADDC, SUBB, MUL, and DIV instructions. 6 0xD6 AC Auxiliary Carry Flag. Modified by ADD and ADDC instructions. 5 0xD5 F0 General-Purpose Flag Available to the User. 4 to 3 0xD4, 0xD3 RS1, RS0 Register Bank Select Bits.

RS1 RS0 Result (Selected Bank)

0 0 0 0 1 1 1 0 2

1 1 3 2 0xD2 OV Overflow Flag. Modified by ADD, ADDC, SUBB, MUL, and DIV instructions. 1 0xD1 F1 General-Purpose Flag Available to the User. 0 0xD0 P

Parity Bit. The number of bits set in the accumulator added to the value of the parity bit is always an

even number.

Rev. 0 | Page 63 of 128

ADE7518

Table 47. Program Control SFR (PCON, 0x87)

Bit Default Description

7 0 SMOD Bit. Double baud rate control. 6 to 0 0 Reserved. Should be left cleared.

Table 48. Data Pointer Low SFR (DPL, 0x82)

Bit Default Description

7 to 0 0 Contain the low byte of the data pointer.

Table 49. Data Pointer High SFR (DPH, 0x83)

Bit Default Description

7 to 0 0 Contain the high byte of the data pointer.

Table 52. Configuration SFR (CFG, 0xAF)

Bit Mnemonic Description

7 Reserved This bit should be left set for proper operation. 6 EXTEN Enhanced UART Enable Bit.

EXTEN Result

0 Standard 8052 UART without enhanced error-checking features. 1 Enhanced UART with enhanced error checking (see the UART Additional Features section).

5 SCPS Synchronous Communication Selection Bit.

SCPS Result

0 1

4 MOD38EN 38 kHz Modulation Enable Bit.

MOD38EN Result

0 38 kHz modulation is disabled. 1

3 to 2 Reserved 1 to 0

XREN1, XREN0

XRENx Result

XREN1 OR XREN0 = 1 Enables MOVX instruction to use 256 bytes of extended RAM. XREN1 AND XREN0 = 0 Disables MOVX instruction.

C port is selected for control of the shared I2C/SPI pins (MOSI, MISO, SCLK, and SS) and SFRs.

I SPI port is selected for control of the shared I

38 kHz modulation is enabled on the pins selected by the MOD38[7:0] bits in the Extended Port Configuration SFR (EPCFG, 0x9F).

Table 50. Data Pointer SFR (DPTR, 0x82 and 0x83)

Bit Default Description

15 to 0 0

Contain the 2-byte address of the data pointer. DPTR is a combination of DPH and DPL SFRs.

Table 51. Stack Pointer SFR (SP, 0x81)

Bit Default Description

7 to 0 7

Contain the eight LSBs of the pointer for the stack.

C/SPI pins (MOSI, MISO, SCLK, and SS) and SFRs.

Rev. 0 | Page 64 of 128

ADE7518

BASIC 8052 REGISTERS

Program Counter (PC)

The program counter holds the 2-byte address of the next instruction to be fetched. The PC is initialized with 0x00 at reset and is incremented after each instruction is performed. Note that the amount added to the PC depends on the number of bytes in the instruction, so the increment can range from one byte to three bytes. The program counter is not directly accessible to the user but can be directly modified by CALL and JMP instructions that change which part of the program is active.

Instruction Register (IR)

The instruction register holds the operations code of the instruction being executed. The operations code is the binary code that results from assembling an instruction. This register is not directly accessible to the user.

Register Banks

There are four banks that each contains eight byte-wide registers for a total of 32 bytes of registers. These registers are convenient for temporary storage of mathematical operands. An instruction involving the accumulator and a register can be executed in one clock cycle, as opposed to two clock cycles, to perform an instruction involving the accumulator and a literal or a byte of general-purpose RAM. The register banks are located in the first 32 bytes of RAM.

The active register bank is selected by the RS0 and RS1 bits in the Program Status Word SFR (PSW, 0xD0).

Accumulator

The accumulator is a working register, storing the results of many arithmetic or logical operations. The accumulator is used in more than half of the 8052 instructions, where it is usually referred to as “A.” The program status register (PSW) constantly monitors the number of bits that are set in the accumulator to determine if it has even or odd parity. The accumulator is stored in the SFR space (see Table 45).

B Register

The B register is used by the multiply and divide instructions, MUL AB and DIV AB, to hold one of the operands. Because the B register is not used for many instructions, it can be used as a scratch pad register, such as those in the register banks. The B register is stored in the SFR space (see Table 45).

Program Status Word (PSW)

The PSW register reflects the status of arithmetic and logical operations through carry, auxiliary carry, and overflow flags. The parity flag reflects the parity of the accumulator contents, which can be helpful for communication protocols. The PSW bits are described in Table 46. The Program Status Word SFR (PSW, 0xD0) is bit addressable.

Data Pointer (DPTR)

The data pointer is made up of two 8-bit registers: DPH (high byte) and DPL (low byte). These provide memory addresses for internal code and data access. The DPTR can be manipulated as a 16-bit register (DPTR = DPH, DPL) or as two independent 8-bit registers (DPH, DPL). See Table 48 and Table 49.

The ADE7518 supports dual data pointers. See the Dual Data Pointers section. Note that the Dual Data Pointers section is the only section in the data sheet where the main and shadow data pointers are distinguished. Whenever the data pointer (DPTR) is mentioned elsewhere in the data sheet, active DPTR is implied.

Stack Pointer (SP)

The stack pointer keeps track of the current address at the top of the stack. To push a byte of data onto the stack, the stack pointer is incremented, and the data is moved to the new top of the stack. To pop a byte of data off the stack, the top byte of data is moved into the awaiting address, and the stack pointer is decremented. The stack is a last in, first out (LIFO) method of data storage because the most recent addition to the stack is the first to come off it.

The stack is utilized to store the program address when CALL and RET instructions are executed so that the program can return to this address when returning from the function call. The stack is also manipulated when vectoring for interrupts to keep track of the prior state of the PC.

The stack resides in the internal extended RAM, and the SP register holds the address of the stack in the extended RAM (XRAM). The advantage of this solution is that the stack is segregated to the internal XRAM. The use of the general-purpose RAM can be limited to data storage, and the use of the extended internal RAM can be limited to the stack pointer. This separation limits the chance of data RAM corruption when the stack pointer overflows in data RAM.

Data can still be stored in XRAM by using the MOVX command.

0xFF 0xFF

256 BYTES OF

RAM

(DATA)

0x00

Figure 68. Extended Stack Pointer Operation

0x00

256 BYTES OF

ON-CHIP XRAM

DATA + STACK

7327-068

To change the default starting address for the stack, move a value into the stack pointer (SP). For example, to enable the extended stack pointer and initialize it at the beginning of the XRAM space, use the following code:

MOV SP,#00H

Rev. 0 | Page 65 of 128

ADE7518

STANDARD 8052 SFRS

The standard 8052 special function registers include the ACC, B, PSW, DPTR, and SP SFRs described in the Basic 8052 Registers section. The standard 8052 SFRs also define the timers, the serial port interface, the interrupts, the I/O ports, and the power-down modes.

Timer SFRs

The 8052 contains three 16-bit timers: the identical Timer0 and Timer1, as well as a Timer2. These timers can also function as event counters. Timer2 has a capture feature where the value of the timer can be captured in two 8-bit registers upon the assertion of an external input signal (see Table 91 and the Timers section).

Serial Port SFRs

The full-duplex serial port peripheral requires two registers: one for setting up the baud rate and other communication parameters, and another for the transmit/receive buffer. The ADE7518 also has enhanced serial port functionality with a dedicated timer for baud rate generation with a fractional divisor and additional error detection. See Table 120 and the UART Serial Interface section.

Interrupt SFRs

There is a two-tiered interrupt system standard in the 8052 core. The priority level for each interrupt source is individually selectable as high or low. The ADE7518 enhances this interrupt system by creating, in essence, a third interrupt tier for the highest priority, the power supply management (PSM) interrupt (see the Interrupt System section).

I/O Port SFRs

The 8052 core supports four I/O ports, Port 0 through Port 3, where Port 0 and Port 2 are typically used to access external code and data spaces. The ADE7518, unlike standard 8052 products, provides internal nonvolatile flash memory so that an external code space is unnecessary. The on-chip LCD driver requires many pins, some of which are dedicated for LCD functionality, and others that can be configured as LCD or general-purpose inputs/outputs. Due to the limited number of I/O pins, the ADE7518 does not allow access to external code and data spaces.

The ADE7518 provides 20 pins that can be used for generalpurpose I/O. These pins are mapped to Port 0, Port 1, and Port 2. They are accessed through three bit-addressable 8052 SFRs, P0, P1, and P2. Another enhanced feature of the ADE7518 is that the weak pull-ups that are standard on 8052 Port 1, Port 2, and Port 3 can be disabled to make open-drain outputs, as is standard on Port 0. The weak pull-ups can be enabled on a pin-by-pin basis (see the I/O Ports section).

Program Control Register (PCON, 0x87)

The 8052 core defines two power-down modes: power-down and idle. The ADE7518 enhances the power control capability of the traditional 8052 MCU with additional power management functions. The Power Control SFR (POWCON, 0xC5) is used to define power control-specific functionality for the ADE7518. The Program Control SFR (PCON, 0x87) is not bit addressable (see the Power Management section).

The ADE7518 has many other peripherals not standard to the 8052 core, including

• ADE energy measurement DSP

• RTC

• LCD driver

• Battery switchover/power management

• SPI/I

C communication

• Flash memory controller

• Wat chd o g t ime r

MEMORY OVERVIEW

The ADE7518 contains the following memory blocks:

• 16 kB of on-chip Flash/EE program and data memory

• 256 bytes of general-purpose RAM

• 256 bytes of internal extended RAM (XRAM)

The 256 bytes of general-purpose RAM share the upper 128 bytes of its address space with special function registers. All of the memory spaces are shown in Figure 69. The addressing mode specifies which memory space to access.

General-Purpose RAM

General-purpose RAM resides in the 0x00 through 0xFF memory locations and contains the register banks.

0x7F

GENERAL-PURPO SE AREA

0x30

BANKS

SELECTED

VIA

BITS IN PSW

Figure 69. Lower 128 Bytes of Internal Data Memory

0x20

0x18

0x10

0x08

Address 0x80 through Address 0xFF of general-purpose RAM are shared with the special function registers. The mode of addressing determines which memory space is accessed, as shown in Figure 70.

0x2F

0x1F

0x17

0x0F

0x07

BIT-ADDRESSABL E (BIT ADDRESSES )

FOUR BANKS OF E IGHT REGISTERS R0 TO R7

RESET VALUE OF STACK POINT ER

7327-069

Rev. 0 | Page 66 of 128

ADE7518

0xFF

ACCESSIBLE BY

INDIRECT ADDRESSI NG

0x80 0x7F

ACCESSIBLE BY

DIRECT AND INDIRECT

0x00

ADDRESSING

GENERAL-PURPO SE RAM

SPECIAL FUNCT ION REGI STERS (SFRs)

ONLY

ACCESSIBLE BY

DIRECT ADDRESSI NG

ONLY

07327-070

Figure 70. General-Purpose RAM and SFR Memory Address Overlap

Both direct and indirect addressing can be used to access generalpurpose RAM from 0x00 through 0x7F. However, only indirect addressing can be used to access general-purpose RAM from 0x80 through 0xFF because this address space shares the same space with the special function registers (SFRs).

The 8052 core also has the means to access individual bits of certain addresses in the general-purpose RAM and special function memory spaces. The individual bits of general-purpose RAM Address 0x20 to RAM Address 0x2F can be accessed through Bit Address 0x00 through Bit Address 0x7F. The benefit of bit addressing is that the individual bits can be accessed quickly without the need for bit masking, which takes more code memory and execution time. The bit addresses for general-purpose RAM Address 0x20 through RAM Address 0x2F can be seen in Figure 71.

BYTE

DDRESS BIT ADDRESSES (HEXA)

0x2F

0x2E

0x2D

0x2C

0x2B

0x2A

0x29

0x28

0x27

0x26

0x25

0x24

0x23

0x22

0x21

0x20

07327-071

Figure 71. Bit Addressable Area of General-Purpose RAM

Bit addressing can be used for instructions that involve Boolean variable manipulation and program branching (see the Instruction Set section).

Special Function Registers

Special function registers are registers that affect the function of the 8052 core or its peripherals. These registers are located in RAM in Address 0x80 through Address 0xFF. They are only accessible through direct addressing, as shown in Figure 70.

The individual bits of some SFRs can be accessed for use in Boolean and program branching instructions. These SFRs are labeled as bit-addressable and the bit addresses are given in the SFR Mapping section.

Extended Internal RAM (XRAM)

The ADE7518 provides 256 bytes of extended on-chip RAM, which is located in Address 0x0000 through Address 0x00FF in the extended RAM space. No external RAM is supported. To select the extended RAM memory space, the extended indirect addressing modes are used. The internal XRAM is enabled in the Configuration SFR (CFG, 0xAF) by writing 01 to CFG[1:0].

0x00F

256 BYTES OF

EXTENDED INTE RNAL

RAM (XRAM)

0x0000

07327-072

Figure 72. Extended Internal RAM (XRAM) Space

Code Memory

Code and data memory are stored in the 16 kB flash memory space. No external code memory is supported. To access code memory, code indirect addressing is used.

ADDRESSING MODES

The 8052 core provides several addressing modes. The addressing mode determines how the core interprets the memory location or data value specified in assembly language code. There are six addressing modes, as shown in Table 53.

Table 53. 8052 Addressing Modes

Core Clock

Addressing Mode Example Bytes

Immediate MOV A, #A8h 2 2 MOV DPTR, #A8h 3 3 Direct MOV A, A8h 2 2 MOV A, IE 2 2 MOV A, R0 1 1 Indirect MOV A, @R0 1 2 Extended Direct MOVX A, @DPTR 1 4 Extended Indirect MOVX A, @R0 1 4 Code Indirect MOVC A, @A+DPTR 1 4 MOVC A, @A+PC 1 4 JMP @A+DPTR 1 3

Immediate Addressing

In immediate addressing, the expression entered after the number sign (#) is evaluated by the assembler and stored in the specified memory address. This number is referred to as a literal because it refers only to a value and not to a memory location.

Instructions using this addressing mode are slower than those between two registers because the literal must be stored and fetched from memory. The expression can be entered as a symbolic variable or an arithmetic expression; the value is computed by the assembler.

Cycles

Rev. 0 | Page 67 of 128

ADE7518

Direct Addressing

With direct addressing, the value at the source address is moved to the destination address. Direct addressing provides the fastest execution time of all the addressing modes when an instruction is performed between registers. Note that indirect or direct addressing modes can be used to access general-purpose RAM Address 0x00 through RAM Address 0x7F. An instruction with direct addressing that uses an address between 0x80 and 0xFF is referring to a special function memory location.

Indirect Addressing

With indirect addressing, the value pointed to by the register is moved to the destination address. For example, to move the contents of internal RAM Address 0x82 to the accumulator, use the following instructions:

MOV R0,#82h MOV A,@R0

These two instructions require a total of four clock cycles and three bytes of storage in the program memory.

Indirect addressing allows addresses to be computed, which is useful for indexing into data arrays stored in RAM.

Note that an instruction that refers to Address 0x00 through Address 0x7F is referring to internal RAM, and indirect or direct addressing modes can be used. An instruction with indirect addressing that uses an address between 0x80 and 0xFF is referring to internal RAM, not to an SFR.

Extended Direct Addressing

The DPTR register (see Table 50) is used to access internal extended RAM in extended indirect addressing mode. The ADE7518 has 256 bytes of XRAM, accessed through MOVX instructions. External memory spaces are not supported on this device.

In extended direct addressing mode, the DPTR register points to the address of the byte of extended RAM. The following code moves the contents of extended RAM Address 0x100 to the accumulator:

MOV DPTR,#100h MOVX A,@DPTR

These two instructions require a total of seven clock cycles and four bytes of storage in the program memory.

Extended Indirect Addressing

The internal extended RAM is accessed through a pointer to the address in indirect addressing mode. The ADE7518 has 256 bytes of internal extended RAM, accessed through MOVX instructions. External memory is not supported on the devices.

In extended indirect addressing mode, a register holds the address of the byte of extended RAM. The following code moves the contents of extended RAM Address 0x80 to the accumulator:

MOV R0,#80h MOVX A,@R0

These two instructions require six clock cycles and three bytes of storage.

Note that there are 256 bytes of extended RAM; therefore, both extended direct and extended indirect addressing can cover the whole address range. There is a storage and speed advantage to using extended indirect addressing because the additional byte of addressing available through the DPTR register that is not needed is not stored.

From the three examples demonstrating the access of internal RAM from 0x80 through 0xFF, and the access of extended internal RAM from 0x00 through 0xFF, it can be seen that it is most efficient to use the entire internal RAM accessible through indirect access before moving to extended RAM.

Code Indirect Addressing

The internal code memory can be accessed indirectly. This can be useful for implementing lookup tables and other arrays of constants that are stored in flash. For example, to move the data stored in flash memory at Address 0x8002 into the accumulator, use the following code:

MOV DPTR,#8002h CLR A MOVX A,@A+DPTR

The accumulator can be used as a variable index into the array of flash memory located at DPTR.

Rev. 0 | Page 68 of 128

ADE7518

INSTRUCTION SET

Table 54 documents the number of clock cycles required for each instruction. Most instructions are executed in one or two clock cycles, resulting in a 4-MIPS peak performance.

Table 54. Instruction Set

Mnemonic Description Bytes Cycles

Arithmetic

ADD A, Rn Add register to A 1 1 ADD A, @Ri Add indirect memory to A 1 2 ADD A, dir Add direct byte to A 2 2 ADD A, #data Add immediate to A 2 2 ADDC A, Rn 1 1 Add register to A with carry 1 1 ADDC A, @Ri Add indirect memory to A with carry 1 2 ADDC A, dir Add direct byte to A with carry 2 2 ADDC A, #data Add immediate to A with carry 2 2 SUBB A, Rn Subtract register from A with borrow 1 1 SUBB A, @Ri Subtract indirect memory from A with borrow 1 2 SUBB A, dir Subtract direct from A with borrow 2 2 SUBB A, #data Subtract immediate from A with borrow 2 2 INC A Increment A 1 1 INC Rn Increment register 1 1 INC @ Ri increment indirect memory 1 2 INC dir Increment direct byte 2 2 INC DPTR Increment data pointer 1 3 DEC A Decrement A 1 1 DEC Rn Decrement register 1 1 DEC @Ri Decrement indirect memory 1 2 DEC dir Decrement direct byte 2 2 MUL AB Multiply A by B 1 9 DIV AB Divide A by B 1 9 DA A Decimal Adjust A 1 2

Logic

ANL A, Rn AND register to A 1 1 ANL A, @Ri AND indirect memory to A 1 2 ANL A, dir AND direct byte to A 2 2 ANL A, #data AND immediate to A 2 2 ANL dir, A AND A to direct byte 2 2 ANL dir, #data AND immediate data to direct byte 3 3 ORL A, Rn OR register to A 1 1 ORL A, @Ri OR indirect memory to A 1 2 ORL A, dir OR direct byte to A 2 2 ORL A, #data OR immediate to A 2 2 ORL dir, A OR A to direct byte 2 2 ORL dir, #data OR immediate data to direct byte 3 3 XRL A, Rn Exclusive OR register to A 1 1 XRL A, @Ri Exclusive OR indirect memory to A 2 2 XRL A, #data Exclusive OR immediate to A 2 2 XRL dir, A Exclusive OR A to direct byte 2 2 XRL A, dir Exclusive OR indirect memory to A 2 2 XRL dir, #data Exclusive OR immediate data to direct 3 3 CLR A Clear A 1 1 CPL A Complement A 1 1 SWAP A Swap nibbles of A 1 1 RL A Rotate A left 1 1

Rev. 0 | Page 69 of 128

ADE7518

Mnemonic Description Bytes Cycles

RLC A Rotate A left through carry 1 1 RR A Rotate A right 1 1 RRC A Rotate A right through carry 1 1

Data Transfer

MOV A, Rn Move register to A 1 1 MOV A, @Ri Move indirect memory to A 1 2 MOV Rn, A Move A to register 1 1 MOV @Ri, A Move A to indirect memory 1 2 MOV A, dir Move direct byte to A 2 2 MOV A, #data Move immediate to A 2 2 MOV Rn, #data Move register to immediate 2 2 MOV dir, A Move A to direct byte 2 2 MOV Rn, dir Move register to direct byte 2 2 MOV dir, Rn Move direct to register 2 2 MOV @Ri, #data Move immediate to indirect memory 2 2 MOV dir, @Ri Move indirect to direct memory 2 2 MOV @Ri, dir Move direct to indirect memory 2 2 MOV dir, dir Move direct byte to direct byte 3 3 MOV dir, #data Move immediate to direct byte 3 3 MOV DPTR, #data Move immediate to data pointer 3 3 MOVC A, @A+DPTR Move code byte relative DPTR to A 1 4 MOVC A, @A+PC Move code byte relative PC to A 1 4 MOVX A, @Ri Move external (A8) data to A 1 4 MOVX A, @DPTR Move external (A16) data to A 1 4 MOVX @Ri, A Move A to external data (A8) 1 4 MOVX @DPTR, A Move A to external data (A16) 1 4 PUSH dir Push direct byte onto stack 2 2 POP dir Pop direct byte from stack 2 2 XCH A, Rn Exchange A and register 1 1 XCH A, @Ri Exchange A and indirect memory 1 2 XCHD A, @Ri Exchange A and indirect memory nibble 1 2 XCH A, dir Exchange A and direct byte 2 2

Boolean

CLR C Clear carry 1 1 CLR bit Clear direct bit 2 2 SETB C Set carry 1 1 SETB bit Set direct bit 2 2 CPL C Complement carry 1 1 CPL bit Complement direct bit 2 2 ANL C, bit AND direct bit and carry 2 2 ANL C, /bit AND direct bit inverse to carry 2 2 ORL C, bit OR direct bit and carry 2 2 ORL C, /bit OR Direct bit inverse to carry 2 2 MOV C, bit Move direct bit to carry 2 2 MOV bit, C Move carry to direct bit 2 2

Branching

JMP @A+DPTR Jump indirect relative to DPTR 1 3 RET Return from subroutine 1 4 RETI Return from interrupt 1 4 ACALL addr11 Absolute jump to subroutine 2 3 AJMP addr11 Absolute jump unconditional 2 3 SJMP rel Short jump (relative address) 2 3 JC rel Jump on carry equal to 1 2 3

Rev. 0 | Page 70 of 128

ADE7518

Mnemonic Description Bytes Cycles

JNC rel Jump on carry = 0 2 3 JZ rel Jump on accumulator = 0 2 3 JNZ rel Jump on accumulator ≠ 0 2 3 DJNZ Rn, rel Decrement register, JNZ relative 2 3 LJMP Long jump unconditional 3 4 LCALL addr16 Long jump to subroutine 3 4 JB bit, rel Jump on direct bit = 1 3 4 JNB bit, rel Jump on direct bit = 0 3 4 JBC bit, rel Jump on direct bit = 1 and clear 3 4 CJNE A, dir, rel Compare A, direct JNE relative 3 4 CJNE A, #data, rel Compare A, immediate JNE relative 3 4 CJNE Rn, #data, rel Compare register, immediate JNE relative 3 4 CJNE @Ri, #data, rel Compare indirect, immediate JNE relative 3 4 DJNZ dir, rel Decrement direct byte, JNZ relative 3 4

Miscellaneous

NOP No operation 1 1

READ-MODIFY-WRITE INSTRUCTIONS

Some 8052 instructions read the latch and others read the pin. The state of the pin is read for instructions that input a port bit. Instructions that read the latch rather than the pin are the ones that read a value, possibly change it, and rewrite it to the latch. Because these instructions involve modifying the port, it is assumed that the pin being modified is an output, so the output state of the pin is read from the latch. This prevents a possible misinterpretation of the voltage level of a pin. For example, if a port pin is used to drive the base of a transistor, a 1 is written to the bit to turn on the transistor. If the CPU reads the same port bit at the pin rather than the latch, it reads the base voltage of the transistor and interprets it as Logic 0. Reading the latch rather than the pin returns the correct value of 1.

The instructions that read the latch rather than the pin are called read-modify-write instructions and are listed in Table 55. When the destination operand is a port or a port bit, these instructions read the latch rather than the pin.

Table 55. Read-Modify-Write Instructions

Instruction Example Description

ANL ANL P0, A Logic AND. ORL ORL P1, A Logic OR. XRL XRL P2, A Logic XOR. JBC JBC P1.1, LABEL Jump if Bit = 1 and Clear Bit. CPL CPL P2.0 Complement Bit. INC INC P2 Increment. DEC DEC P2 Decrement. DJNZ DJNZ P0, LABEL Decrement and Jump if Not Zero. MOV PX.Y,C1 MOV P0.0, C Move Carry to Bit Y of Port X. CLR PX.Y1 CLR P0.0 Clear Bit Y of Port X. SETB PX.Y1 SETB P0.0 Set Bit Y of Port X.

These instructions read the port byte (all eight bits), modify the addressed

bit, and write the new byte back to the latch.

INSTRUCTIONS THAT AFFECT FLAGS

Many instructions explicitly modify the carry bit, such as the MOV C bit and CLR C instructions. Other instructions that affect status flags are listed in this section.

ADD A, Source

This instruction adds the source to the accumulator. No status flags are referenced by the instruction.

Affected Status Flags

C Set if there is a carry out of Bit 7. Cleared otherwise.

Used to indicate an overflow if the operands are unsigned.

OV Set if there is a carry out of Bit 6 or a carry out of

Bit 7, but not if both are set. Used to indicate an overflow for signed addition. This flag is set if two positive operands yield a negative result or if two negative operands yield a positive result.

AC Set if there is a carry out of Bit 3. Cleared otherwise.

ADDC A, Source

This instruction adds the source and the carry bit to the accumulator. The carry status flag is referenced by the instruction.

Affected Status Flags

C Set if there is a carry out of Bit 7. Cleared otherwise.

Used to indicate an overflow if the operands are unsigned.

OV Set if there is a carry out of Bit 6 or a carry out of Bit 7,

but not if both are set. Used to indicate an overflow for signed addition. This flag is set if two positive operands yield a negative result or if two negative operands yield a positive result.

AC Set if there is a carry out of Bit 3. Cleared otherwise.

Rev. 0 | Page 71 of 128

ADE7518

SUBB A, Source

This instruction subtracts the source byte and the carry (borrow) flag from the accumulator. It references the carry (borrow) status flag.

Affected Status Flags

C Set if there is a borrow needed for Bit 7. Cleared

otherwise. Used to indicate an overflow if the operands are unsigned.

of Bit 0 to Bit 3 exceeds nine, 0x06 is added to the accumulator to correct the lower four bits. If the carry bit is set when the instruction begins, or if 0x06 is added to the accumulator in the first step, 0x60 is added to the accumulator to correct the higher four bits.

The carry and AC status flags are referenced by this instruction.

Affected Status Flag

C Set if the result is greater than 0x99. Cleared otherwise.

OV Set if there is a borrow needed for Bit 6 or Bit 7, but

not for both. Used to indicate an overflow for signed subtraction. This flag is set if a negative number subtracted from a positive yields a negative result or if a positive number subtracted from a negative number yields a positive result.

AC Set if a borrow is needed for Bit 3. Cleared otherwise.

MUL AB

This instruction multiplies the accumulator by the B register. This operation is unsigned. The lower byte of the 16-bit product is stored in the accumulator and the higher byte is left in the B register. No status flags are referenced by the instruction.

Affected Status Flags

C Cleared.

OV Set if the result is greater than 255. Cleared otherwise.

DIV AB

This instruction divides the accumulator by the B register. This operation is unsigned. The integer part of the quotient is stored in the accumulator and the remainder goes into the B register. No status flags are referenced by the instruction.

Affected Status Flags

C Cleared.

OV Cleared unless the B register is equal to 0, in which

case the results of the division are undefined and the OV flag is set.

DA A

This instruction adjusts the accumulator to hold two 4-bit digits after the addition of two binary coded decimals (BCDs) with the ADD or ADDC instructions. If the AC bit is set or if the value

RRC A

This instruction rotates the accumulator to the right through the carry flag. The old LSB of the accumulator becomes the new carry flag, and the old carry flag is loaded into the new MSB of the accumulator.

The carry status flag is referenced by this instruction.

Affected Status Flag

C Equal to the state of ACC.0 before execution of the

instruction.

RLC A

This instruction rotates the accumulator to the left through the carry flag. The old MSB of the accumulator becomes the new carry flag, and the old carry flag is loaded into the new LSB of the accumulator.

The carry status flag is referenced by this instruction.

Affected Status Flag

C Equal to the state of ACC.7 before execution of the

instruction.

CJNE Destination, Source, Relative Jump

This instruction compares the source value to the destination value and branches to the location set by the relative jump if they are not equal. If the values are equal, program execution continues with the instruction after the CJNE instruction.

No status flags are referenced by this instruction.

Affected Status Flag

C Set if the source value is greater than the destination

value. Cleared otherwise.

Rev. 0 | Page 72 of 128

ADE7518

DUAL DATA POINTERS

The ADE7518 incorporates two data pointers. The second data pointer is a shadow data pointer and is selected via the Data Pointer Control SFR (DPCON, 0xA7). DPCON features automatic hardware postincrement and postdecrement, as well as an automatic data pointer toggle.

Note that this is the only section of the data sheet where the main and shadow data pointers are distinguished. Whenever the data pointer (DPTR) is mentioned elsewhere in the data sheet, active DPTR is implied.

In addition, only the MOVC/MOVX @DPTR instructions automatically postincrement and postdecrement the DPTR. Other MOVC/MOVX instructions, such as MOVC PC or MOVC @Ri, do not cause the DPTR to automatically postincrement and postdecrement.

To illustrate the operation of DPCON, the following code copies 256 bytes of code memory at Address 0xD000 into XRAM, starting from Address 0x0000:

MOV DPTR,#0 ;Main DPTR = 0 MOV DPCON,#55H ;Select shadow DPTR ;DPTR1 increment mode ;DPTR0 increment mode ;DPTR auto toggling ON MOV DPTR,#0D000H ;DPTR = D000H MOVELOOP: CLR A MOVC A,@A+DPTR ;Get data ;Post Inc DPTR ;Swap to Main DPTR(Data) MOVX @DPTR,A ;Put ACC in XRAM ;Increment main DPTR ;Swap Shadow DPTR(Code) MOV A, DPL JNZ MOVELOOP

Table 56. Data Pointer Control SFR (DPCON, 0xA7)

Bit Mnemonic Default Description

7 0 Not Implemented. Write don’t care. 6 DPT 0

5 to 4

3to 2

1 0 Not Implemented. Write don’t care. 0 DPSEL 0

DP1m1, DP1m0

0 0 8052 behavior. 0 1 DPTR is postincremented after a MOVX or MOVC instruction. 1 0 DPTR is postdecremented after a MOVX or MOVC instruction. 1 1

DP0m1, DP0m0

0 0 8052 behavior. 0 1 DPTR is postincremented after a MOVX or MOVC instruction. 1 0 DPTR is postdecremented after a MOVX or MOVC instruction. 1 1

Data Pointer Automatic Toggle Enable. Cleared by the user to disable autoswapping of the DPTR. Set in user software to enable automatic toggling of the DPTR after each MOVX or MOVC instruction.

Shadow Data Pointer Mode. These bits enable extra modes of the shadow data pointer operation, allowing more compact and more efficient code size and execution.

DP1m1 DP1m0 Result (Behavior of the Shadow Data Pointer)

DPTR LSB is toggled after a MOVX or MOVC instruction. This instruction can be useful for moving 8-bit blocks to/from 16-bit devices.

Main Data Pointer Mode. These bits enable extra modes of the main data pointer operation, allowing more compact and more efficient code size and execution.

DP0m1 DP0m0 Result (Behavior of the Main Data Pointer)

DPTR LSB is toggled after a MOVX or MOVC instruction. This instruction is useful for moving 8-bit blocks to/from 16-bit devices.

Data Pointer Select. Cleared by the user to select the main data pointer, meaning that the contents of this 16-bit register are placed into the DPL SFR and DPH SFR. Set by the user to select the shadow data pointer, meaning that the contents of a separate 16-bit register appear in the DPL SFR and DPH SFR.

Rev. 0 | Page 73 of 128

ADE7518

INTERRUPT SYSTEM

The unique power management architecture of the ADE7518 includes an operating mode (PSM2) where the 8052 MCU core is shut down. Events can be configured to wake the 8052 MCU core from the PSM2 operating mode. A distinction is drawn here between events that can trigger the wake-up of the 8052 MCU core and events that can trigger an interrupt when the MCU core is active. Events that can wake the core are referred to as wake-up events, whereas events that can interrupt the program flow when the MCU is active are called interrupts. See the 3.3 V Peripherals and Wake-Up Events section to learn more about events that can wake the 8052 core from PSM2.

The ADE7518 provides 12 interrupt sources with three priority levels. The power management interrupt is at the highest priority level. The other two priority levels are configurable through the Interrupt Priority SFR (IP, 0xB8) and the Interrupt Enable and Priority 2 SFR (IEIP2, 0xA9).

STANDARD 8052 INTERRUPT ARCHITECTURE

The 8052 standard interrupt architecture includes two tiers of interrupts, where some interrupts are assigned a high priority and others are assigned a low priority.

HIGH

LOW

Figure 73. Standard 8052 Interrupt Priority Levels

A Priority 1 interrupt can interrupt the service routine of a Priority 0 interrupt, and if two interrupts of different priorities

Table 57. Interrupt SFRs

SFR Address Default Bit Addressable Description

IE 0xA8 0x00 Yes Interrupt Enable (see Table 58). IP 0xB8 0x00 Yes Interrupt Priority (see Table 59). IEIP2 0xA9 0xA0 No Interrupt Enable and Priority 2 (see Table 60). WDCON 0xC0 0x10 Yes

PRIORITY 1

PRIORITY 0

07327-073

Watchdog Timer (see Table 65 and the Writing to the Watchdog Timer SFR (WDCON, 0xC0) section).

occur at the same time, the Priority 1 interrupt is serviced first. An interrupt cannot be interrupted by another interrupt of the same priority level. If two interrupts of the same priority level occur simultaneously, a polling sequence is observed (see the Interrupt Priority section).

INTERRUPT ARCHITECTURE

The ADE7518 possesses advanced power supply managment features. To ensure a fast response to time-critical power supply issues, such as a loss of line power, the power supply managment interrupt should be able to interrupt any interrupt service routine. To enable the user to have full use of the standard 8052 interrupt priority levels, an additional priority level is added for the power supply management (PSM) interrupt. The PSM interrupt is the only interrupt at this highest interrupt priority level.

HIGH

LOW

Figure 74. Interrupt Architecture

PSM

PRIORITY 1

PRIORITY 0

7327-074

See the Power Supply Management (PSM) Interrupt section for more information on the PSM interrupt.

INTERRUPT REGISTERS

The control and configuration of the interrupt system is carried out through four interrupt-related SFRs discussed in this section.

Table 58. Interrupt Enable SFR (IE, 0xA8)

Bit Address Mnemonic Description

7 0xAF EA Enables All Interrupt Sources. Set by the user. Cleared by the user to disable all interrupt sources. 6 0xAE Reserved This bit should be left cleared for proper operation. 5 0xAD ET2 Enables the Timer 2 Interrupt. Set by the user. 4 0xAC ES Enables the UART Serial Port Interrupt. Set by the user. 3 0xAB ET1 Enables the Timer 1 Interrupt. Set by the user. 2 0xAA EX1

Enables the External Interrupt 1 (INT1

). Set by the user. 1 0xA9 ET0 Enables the Timer 0 Interrupt. Set by the user. 0 0xA8 EX0

Enables External Interrupt 0 (INT0

). Set by the user.

Rev. 0 | Page 74 of 128

ADE7518

Table 59. Interrupt Priority SFR (IP, 0xB8)

Bit Address Mnemonic Description

7 0xBF PADE ADE Energy Measurement Interrupt Priority (1 = high, 0 = low). 6 0xBE Reserved This bit should be left cleared for proper operation. 5 0xBD PT2 Timer 2 Interrupt Priority (1 = high, 0 = low). 4 0xBC PS UART Serial Port Interrupt Priority (1 = high, 0 = low). 3 0xBB PT1 Timer 1 Interrupt Priority (1 = high, 0 = low). 2 0xBA PX1 1 0xB9 PT0 Timer 0 Interrupt Priority (1 = high, 0 = low). 0 0xB8 PX0

Table 60. Interrupt Enable and Priority 2 SFR (IEIP2, 0xA9)

Bit Mnemonic Description

7 Reserved Reserved. 6 PTI RTC Interrupt Priority (1 = high, 0 = low). 5 Reserved Reserved. 4 PSI SPI/I2C Interrupt Priority (1 = high, 0 = low). 3 EADE Enables the Energy Metering Interrupt (ADE). Set by the user. 2 ETI Enables the RTC Interval Timer Interrupt. Set by the user. 1 EPSM Enables the PSM Power Supply Management Interrupt. Set by the user. 0 ESI Enables the SPI/I2C Interrupt. Set by the user.

(External Interrupt 1) Priority (1 = high, 0 = low).

INT1

(External Interrupt 0) Priority (1 = high, 0 = low).

INT0

INTERRUPT PRIORITY

If two interrupts of the same priority level occur simultaneously, the polling sequence is observed (as shown in Table 61).

Table 61. Priority Within Interrupt Level

Source Priority Description

IPSM 0 (Highest) Power Supply Management Interrupt. IRTC 1 RTC Interval Timer Interrupt. IADE 2 ADE Energy Measurement Interrupt. WDT 3 Watchdog Timer Overflow Interrupt. IE0 4 External Interrupt 0. TF0 5 Timer/Counter 0 Interrupt. IE1 6 External Interrupt 1. TF1 7 Timer/Counter 1 Interrupt. ISPI/I2CI 8 SPI/I2C Interrupt. RI/TI 9 UART Serial Port Interrupt. TF2/EXF2 10 (Lowest) Timer/Counter 2 Interrupt.

Rev. 0 | Page 75 of 128

ADE7518

INTERRUPT FLAGS

The interrupt flags and status flags associated with the interrupt vectors are shown in Table 62 and Table 63. Most of the interrupts have flags associated with them.

Table 62. Interrupt Flags

Interrupt Source Flag Bit Name Description

IE0 TCON.1 IE0 External Interrupt 0. TF0 TCON.5 TF0 Timer 0. IE1 TCON.3 IE1 External Interrupt 1. TF1 TCON.7 TF1 Timer 1. RI + TI SCON.1 TI Transmit Interrupt.

SCON.0 RI Receive Interrupt.

TF2 + EXF2 T2CON.7 TF2 Timer 2 Overflow Flag.

T2CON.6 EXF2 Timer 2 External Flag. IPSM (Power Supply) IPSMF.6 FPSM PSM Interrupt Flag. IADE (Energy Measurement DSP) MIRQSTL.7 ADEIRQFLAG Read MIRQSTH, MIRQSTM, MIRQSTL.

Table 63. Status Flags

Interrupt Source Flag Bit Name Description

ISPI/I2CI SPI2CSTAT1 N/A SPI Interrupt Status Register.

SPI2CSTAT1 N/A I2C Interrupt Status Register.

IRTC (RTC Interval Timer) TIMECON.7 MIDNIGHT RTC Midnight Flag.

TIMECON.2 ALARM RTC Alarm Flag.

WDT (Watchdog Timer) WDCON.2 WDS Watchdog Timeout Flag.

There is no specific flag for ISPI/I2CI; however, all flags for SPI2CSTAT need to be read to assess the reason for the interrupt.

and

C/SPI status bits in the SPI Interrupt Status SFR

INT1

interrupts are only cleared if the external interrupt

INT0

INT1

is configured to interrupt on a low level,

C/SPI interrupt.

C/SPI

A functional block diagram of the interrupt system is shown in Figure 75. Note that the PSM interrupt is the only interrupt in the highest priority level.

If an external wake-up event occurs to wake the ADE7518 from PSM2, a pending external interrupt is generated. When the EX0 or EX1 bit in the Interrupt Enable SFR (IE, 0xA8) is set to enable external interrupts, the program counter is loaded with the IE0 or IE1 interrupt vector. The IE0 and IE1 interrupt flags in the TCON register are not affected by events that occur when the 8052 MCU core is shut down during PSM2. See the Power Supply Management (PSM) Interrupt section.

The RTC and I

C/SPI interrupts are latched such that pending interrupts cannot be cleared without entering their respective interrupt service routines. Clearing the RTC midnight flags and alarm flags does not clear a pending RTC interrupt. Similarly,

clearing the I (SPISTAT, 0xEA) does not cancel a pending I These interrupts remain pending until the RTC or I interrupt vectors are enabled. Their respective interrupt service routines are entered shortly thereafter.

Figure 75 shows how the interrupts are cleared when the interrupt service routines are entered. Some interrupts with multiple interrupt sources are not automatically cleared; specifically, the PSM, ADE, UART, and Timer 2 interrupt vectors. Note that the INT0

is configured to be triggered by a falling edge by setting IT0 in the Timer/Counter 0 and Timer/Counter 1 Control SFR (TCON, 0x88). If the interrupt service routine is re-entered until the respective pin goes high.

Rev. 0 | Page 76 of 128

ADE7518

PRIORITY LEVEL

LOW HIGH HIGHEST

PSM

IPSMF

IPSME

FPSM

(IPSMF.6)

IE/IEIP2 REGISTERS IP/IEIP2 REGISTERS

RTC

ADE

WATCHDOG

EXTERNAL

INTERRUPT 0

TIMER 0

EXTERNAL

INTERRUPT 1

MIDNIGHT ALARM

MIRQSTH MIRQSTM MIRQSTL

MIRQENH MIRQENM MIRQENL

WATCHDOG TIMEOUT

IT0

INT0

TF0

IT1

INT1

WDIR

IT0

IT1

IN/OUT LATCH

RESET

MIRQSTL.7

PSM2

IE0

PSM2

IE1

INTERRUPT POLLING SEQUENCE

TIMER 1

I2C/SPI

UART

TIMER 2

TF1

SPI INTERRUPT

I2C INTERRUPT

RI TI

TF2 EXF2

CFG.5

IN/OUT LATCH

RESET

INDIVIDUAL

INTERRUPT

ENABLE

GLOBAL

INTERRUPT

ENABLE (EA)

LEGEND

AUTOMATIC CLEAR SIGNAL

07327-075

Figure 75. Interrupt System Functional Block Diagram

Rev. 0 | Page 77 of 128

ADE7518

INTERRUPT VECTORS

When an interrupt occurs, the program counter is pushed onto the stack, and the corresponding interrupt vector address is loaded into the program counter. When the interrupt service routine is complete, the program counter is popped off the stack by a RETI instruction. This allows program execution to resume from where it was interrupted. The interrupt vector addresses are shown in Table 64.

Table 64. Interrupt Vector Addresses

Source Vector Address

IE0 0x0003 TF0 0x000B IE1 0x0013 TF1 0x001B RI + TI 0x0023 TF2 + EXF2 0x002B Reserved 0x0033 ISPI/I2CI 0x003B IPSM (Power Supply) 0x0043 IADE (Energy Measurement DSP) 0x004B IRTC (RTC Interval Timer) 0x0053 WDT (Watchdog Timer) 0x005B

INTERRUPT LATENCY

The 8052 architecture requires that at least one instruction executes between interrupts. To ensure this, the 8052 MCU core hardware prevents the program counter from jumping to an ISR immediately after completing an RETI instruction or an access of the IP and IE registers.

The shortest interrupt latency is 3.25 instruction cycles, 800 ns with a clock of 4.096 MHz. The longest interrupt latency for a high priority interrupt results when a pending interrupt is generated during a low priority interrupt RETI, followed by a multiply instruction. This results in a maximum interrupt latency of 16.25 instruction cycles, 4 µs with a clock of 4.096 MHz.

CONTEXT SAVING

When the 8052 vectors to an interrupt, only the program counter is saved on the stack. Therefore, the interrupt service routine must be written to ensure that registers used in the main program are restored to their preinterrupt state. Common registers that can be modified in the ISR are the accumulator register and the PSW register. Any general-purpose registers that are used as scratch pads in the ISR should also be restored before exiting the interrupt. The following example 8052 code shows how to restore some commonly used registers:

GeneralISR: ; save the current accumulator value PUSH ACC ; save the current status and register bank

selection

PUSH PSW

; service interrupt …

; restore the status and registe r bank selection

POP PSW

; restore the accumulator

POP ACC RETI

Rev. 0 | Page 78 of 128

ADE7518

WATCHDOG TIMER

The watchdog timer generates a device reset or interrupt within a reasonable amount of time if the ADE7518 enters an erroneous state, possibly due to a programming error or electrical noise. The watchdog is enabled by default with a timeout of two seconds and creates a system reset if not cleared within two seconds. The watchdog function can be disabled by clearing the watchdog enable bit (WDE) in the Watchdog Timer SFR (WDCON, 0xC0).

The watchdog circuit generates a system reset or interrupt (WDS) if the user program fails to set the WDE bit within a predetermined amount of time (set by PRE[3:0]). The watchdog timer is clocked from the 32.768 kHz external crystal connected between the XTAL1 and XTAL2 pins.

Table 65. Watchdog Timer SFR (WDCON, 0xC0)

Bit Address Mnemonic Default Description

7 to 4

0000 15.6 ms 0001 31.2 ms 0010 62.5 ms 0011 125 ms 0100 250 ms 0101 500 ms 0110 1 sec 0111 2 sec 1000 0 sec, automatic reset 1001 0 sec, serial download reset 1010 to 1111 Not a valid selection 3 0xC3 WDIR 0

2 0xC2 WDS 0

1 0xC1 WDE 1

0 0xC0 WDWR 0

0xC7 to 0xC4

PRE[3:0] 7

Watchdog Prescaler. In normal mode, the 16-bit watchdog timer is clocked by the input clock (32.768 kHz). The PREx bits set which of the upper bits of the counter are used as the watchdog output, as follows:

PRE

WATCHDOG

PRE[3:0] Result (Watchdog Timeout)

Watchdog Interrupt Response Bit. When cleared, the watchdog generates a system reset when the watchdog timeout period has expired. When set, the watchdog generates an interrupt when the watchdog timeout period has expired.

Watchdog Status Bit. This bit is set to indicate that a watchdog timeout has occurred. It is cleared by writing a 0 or by an external hardware reset. A watchdog reset does not clear WDS; therefore, it can be used to distinguish between a watchdog reset and a hardware reset from the RESET pin.

Watchdog Enable Bit. When set, this bit enables the watchdog and clears its counter. The watchdog counter is subsequently cleared again whenever WDE is set. If the watchdog is not cleared within its selected timeout period, it generates a system reset or watchdog interrupt, depending on the WDIR bit.

Watchdog Write Enable Bit. See the Writing to the Watchdog Timer SFR (WDCON, 0xC0) section.

The WDCON SFR can be written only by user software if the double write sequence described in the Writing to the Watchdog Timer SFR (WDCON, 0xC0) section is initiated on every write access to the WDCON SFR.

To prevent any code from inadvertently disabling the watchdog, a watchdog protection can be activated. This watchdog protection locks in the watchdog enable and event settings so that they cannot be changed by user code. The protection is activated by clearing a watchdog protection bit in the flash memory. The watchdog protection bit is the most significant bit at Address 0x3FFA of the flash memory. When this bit is cleared, the WDIR bit is forced to 0, and the WDE bit is forced to 1. Note that the sequence for configuring the flash protection bits must be followed to modify the watchdog protection bit at Address 0x3FFA (see the Protecting the Flash Memory section).

XTAL

×=

Rev. 0 | Page 79 of 128

ADE7518

Table 66. Watchdog and Flash Protection Byte in Flash (Flash Address = 0x3FFA)

Bit Mnemonic Default Description

7 WDPROT_PROTKY7 1 This bit holds the protection for the watchdog timer and the seventh bit of the flash protection key.

When this bit is cleared, the watchdog enable (WDE) and interrupt response bits (WDIR) cannot be changed by user code. The watchdog configuration is then fixed to WDIR = 0 and WDE = 1. The watchdog timeout in PRE[3:0] can still be modified by user code.

The value of this bit is also used to set the flash protection key. If this bit is cleared to protect the watchdog, then the default value for the flash protection key is 0x7F instead of 0xFF (see the Protecting the Flash Memory section for more information on how to clear this bit).

6 to 0 PROTKY[6:0] 0xFF

Writing to the Watchdog Timer SFR (WDCON, 0xC0)

Writing data to the WDCON SFR involves a double instruction sequence. The WDWR bit must be set and the following instruction must be a write instruction to the WDCON SFR.

Disable Watch dog CLR EA SETB WDWR CLR WDE SETB EA

This sequence is necessary to protect the WDCON SFR from code execution upsets that may unintentionally modify this SFR. Interrupts should be disabled during this operation due to the consecutive instruction cycles.

These bits hold the flash protection key. The content of this flash address is compared to the Flash Protection Key SFR (PROTKY, 0xBB) when the protection is being set or changed. If the two values match, the new protection is written to Flash Address 0x3FFF to Flash Address 0x3FFB. See the Protecting the Flash Memory section for more information on how to configure these bits.

Watchdog Timer Interrupt

If the watchdog timer is not cleared within the watchdog timeout period, a system reset occurs unless the watchdog timer interrupt is enabled. The watchdog timer interrupt enable bit (WDIR) is located in the Watchdog Timer SFR (WDCON, 0xC0). Enabling the WDIR bit allows the program to examine the stack or other variables that may have led the program to execute inappropriate code. The watchdog timer interrupt also allows the watchdog to be used as a long interval timer.

Note that WDIR is automatically configured as a high priority interrupt. This interrupt cannot be disabled by the EA bit in the IE register (see Table 58). Even if all of the other interrupts are disabled, the watchdog is kept active to watch over the program.

Rev. 0 | Page 80 of 128

ADE7518

LCD DRIVER

Using shared pins, the LCD module is capable of directly driving an LCD panel of 17 × 4 segments without compromising any ADE7518 functions. It is capable of driving LCDs with 2×, 3×, and 4× multiplexing. The LCD waveform voltages are generated through an external resistor ladder.

Each ADE7518 has an embedded LCD control circuit, driver, and power supply circuit. The LCD module is functional in all operating modes (see the Operating Modes section).

Table 67. LCD Driver SFRs

SFR Address Mnemonic R/W Description

0x95 LCDCON R/W LCD Configuration (see Table 68). 0x96 LCDCLK R/W LCD Clock (see Table 71). 0x97 LCDSEGE R/W LCD Segment Enable (see Table 74). 0x9C LCDCONX R/W LCD Configuration X (see Table 69). 0xAC LCDPTR R/W LCD Pointer (see Table 75). 0xAE LCDDAT R/W LCD Data (see Table 76). 0xB1 LCDCONY R/W LCD Configuration Y (see Table 70). 0xED LCDSEGE2 R/W LCD Segment Enable 2 (see Table 77).

LCD REGISTERS

There are six LCD control registers that configure the driver for the specific type of LCD in the end system and set up the user display preferences. The LCD Configuration SFR (LCDCON, 0x95), the LCD Configuration X SFR (LCDCONX, 0x9C), and the LCD Configuration Y SFR (LCDCONY, 0xB1) contain general LCD driver configuration information, including the LCD enable and reset, as well as the method of LCD voltage generation and multiplex level. The LCD Clock SFR (LCDCLK, 0x96) configures timing settings for LCD frame rate and blink rate. LCD pins are configured for LCD functionality in the LCD Segment Enable SFR (LCDSEGE, 0x97) and the LCD Segment Enable 2 SFR (LCDSEGE2, 0xED).

Table 68. LCD Configuration SFR (LCDCON, 0x95)

Bit Mnemonic Default Description

7 LCDEN 0 LCD Enable. If this bit is set, the LCD driver is enabled. 6 LCDRST 0 LCD Data Registers Reset. If this bit is set, the LCD data registers are reset to zero. 5 BLINKEN 0

4 LCDPSM2 0 Forces LCD off when in PSM2 (sleep mode).

3 CLKSEL 0 LCD Clock Selection.

2 BIAS 0 Bias Mode.

1 to 0 LMUX[1:0] 00 LCD Multiplex Level.

Blink Mode Enable Bit. If this bit is set, blink mode is enabled. The blink mode is configured by the BLKMOD[1:0] and BLKFREQ[1:0] bits in the LCD Clock SFR (LCDCLK, 0x96).

LCDPSM2 Result

0 The LCD is disabled or enabled in PSM2 by the LCDEN bit. 1 The LCD is disabled in PSM2 regardless of LCDEN setting.

CLKSEL Result

0 f 1 f

BIAS Result

0 1/2. In this mode, LCDVA is internally connected to LCDVB (see Figure 76). 1 1/3 (see Figure 77).

LMUX[1:0] Result

00 Reserved. 01 2× Multiplexing. FP27/COM3 is used as FP27. FP28/COM2 is used as FP28. 10 3× Mulitplexing. FP27/COM3 is used as FP27. FP28/COM2 is used as COM2. 11 4× Multiplexing. FP27/COM3 is used as COM3. FP28/COM2 is used as COM2.

LCDC LK

= 2048 Hz. = 128 Hz.

Rev. 0 | Page 81 of 128

ADE7518

Table 69. LCD Configuration X SFR (LCDCONX, 0x9C)

Bit Mnemonic Default Description

7 Reserved 0 Reserved. 6 EXTRES 0 External Resistor Ladder Selection Bit.

EXTRES Result

0 External resistor ladder is disabled. 1 External resistor ladder is enabled.

5 to 0 Reserved 0 These bits should be set to 0 for proper operation.

Table 70. LCD Configuration Y SFR (LCDCONY, 0xB1)

Bit Mnemonic Default Description

7 Reserved 0 This bit should be kept cleared for proper operation. 6 INV_LVL 0

5 to 2 Reserved 0 These bits should be kept cleared for proper operation. 1 UPDATEOVER 0

0 REFRESH 0

Table 71. LCD Clock SFR (LCDCLK, 0x96)

Bit Mnemonic Default Description

7 to 6 BLKMOD[1:0] 00 Blink Mode Clock Source Configuration Bits.

5 to 4 BLKFREQ[1:0] 00 Blink Rate Configuration Bits. These bits control the LCD blink rate if BLKMOD[1:0] = 11.

3 to 0 FD[3:0] 0 LCD Frame Rate Selection Bits. See Table 72 and Table 73.

Frame Inversion Mode Enable Bit. If this bit is set, frames are inverted every other frame. If this bit is cleared, frames are not inverted.

Update Finished Flag Bit. This bit is updated by the LCD driver. When set, this bit indicates that the LCD memory has been updated and a new frame has begun.

Refresh LCD Data Memory Bit. This bit should be set by the user. When this bit is set, the LCD driver does not use the data in the LCD data registers to update the display. The LCD data registers can be updated by the 8052. When this bit is cleared, the LCD driver uses the data in the LCD data registers to update the display at the next frame.

BLKMOD[1:0] Result

00 The blink rate is controlled by software. The display is off. 01 The blink rate is controlled by software. The display is on. 10 The blink rate is 2 Hz. 11 The blink rate is set by BLKFREQ[1:0].

BLKFREQ[1:0] Result (Blink Rate)

00 1 Hz 01 1/2 Hz 10 1/3 Hz 11 1/4 Hz

Rev. 0 | Page 82 of 128

ADE7518

Table 72. LCD Frame Rate Selection for f

2× Multiplexing 3× Multiplexing 4× Multiplexing FD3 FD2 FD1 FD0 f

(Hz) Frame Rate (Hz) f

LCD

0 0 0 1 256 1281 341.3 170.71 512 1281 0 0 1 0 170.7 85.3 341.3 113.81 341.3 85.3 0 0 1 1 128 64 256 85.3 256 64 0 1 0 0 102.4 51.2 204.8 68.3 204.8 51.2 0 1 0 1 85.3 42.7 170.7 56.9 170.7 42.7 0 1 1 0 73.1 36.6 146.3 48.8 146.3 36.6 0 1 1 1 64 32 128 42.7 128 32 1 0 0 0 56.9 28.5 113.8 37.9 113.8 28.5 1 0 0 1 51.2 25.6 102.4 34.1 102.4 25.6 1 0 1 0 46.5 23.25 93.1 31 93.1 23.25 1 0 1 1 42.7 21.35 85.3 28.4 85.3 21.35 1 1 0 0 39.4 19.7 78.8 26.3 78.8 19.7 1 1 0 1 36.6 18.3 73.1 24.4 73.1 18.3 1 1 1 0 34.1 17.05 68.3 22.8 68.3 17.05 1 1 1 1 32 16 64 21.3 64 16 0 0 0 0 16 8 32 10.7 32 8

Not within the range of typical LCD frame rates.

= 2048 Hz (LCDCON[3] = 0)

LCDCLK

(Hz) Frame Rate (Hz) f

LCD

(Hz) Frame Rate (Hz)

LCD

Table 73. LCD Frame Rate Selection for f

= 128 Hz (LCDCON[3] = 1)

LCDCLK

2× Multiplexing 3× Multiplexing 4× Multiplexing FD3 FD2 FD1 FD0 f

(Hz) Frame Rate (Hz) f

LCD

(Hz) Frame Rate (Hz) f

LCD

(Hz) Frame Rate (Hz)

LCD

0 0 0 1 32 161 32 10.7 32 8 0 0 1 0 21.3 10.6 32 10.7 32 8 0 0 1 1 16 8 32 10.7 32 8 0 1 0 0 16 8 32 10.7 32 8 0 1 0 1 16 8 32 10.7 32 8 0 1 1 0 16 8 32 10.7 32 8 0 1 1 1 16 8 32 10.7 32 8 1 0 0 0 16 8 32 10.7 32 8 1 0 0 1 16 8 32 10.7 32 8 1 0 1 0 16 8 32 10.7 32 8 1 0 1 1 16 8 32 10.7 32 8 1 1 0 0 16 8 32 10.7 32 8 1 1 0 1 16 8 32 10.7 32 8 1 1 1 0 16 8 32 10.7 32 8 1 1 1 1 128 64 128 42.7 128 32 0 0 0 0 64 32 64 21.3 64 16

Not within the range of typical LCD frame rates.

Table 74. LCD Segment Enable SFR (LCDSEGE, 0x97)

Bit Mnemonic Default Description

7 FP25EN 0 FP25 Function Select Bit. 0 = general-purpose I/O, 1 = LCD function. 6 FP24EN 0 FP24 Function Select Bit. 0 = general-purpose I/O, 1 = LCD function. 5 FP23EN 0 FP23 Function Select Bit. 0 = general-purpose I/O, 1 = LCD function. 4 FP22EN 0 FP22 Function Select Bit. 0 = general-purpose I/O, 1 = LCD function. 3 FP21EN 0 FP21 Function Select Bit. 0 = general-purpose I/O, 1 = LCD function. 2 FP20EN 0 FP20 Function Select Bit. 0 = general-purpose I/O, 1 = LCD function. 1 to 0 Reserved 0 These bits should be left at 0 for proper operation.

Rev. 0 | Page 83 of 128

ADE7518

Table 75. LCD Pointer SFR (LCDPTR, 0xAC)

Bit Mnemonic Default Description

6 Reserved 0 Reserved. 5 to 0 ADDRESS 0 LCD Memory Address (see Table 78).

Table 76. LCD Data SFR (LCDDAT, 0xAE)

Bit Mnemonic Default Description

7 to 0 LCDDATA 0 Data to be written into or read out of the LCD Memory SFRs.

Table 77. LCD Segment Enable 2 SFR (LCDSEGE2, 0xED)

Bit Mnemonic Default Description

7 to 4 Reserved 0 Reserved. 3 FP19EN 0 FP19 Function Select Bit. 0 = general-purpose I/O, 1 = LCD function. 2 FP18EN 0 FP18 Function Select Bit. 0 = general-purpose I/O, 1 = LCD function. 1 FP17EN 0 FP17 Function Select Bit. 0 = general-purpose I/O, 1 = LCD function. 0 FP16EN 0 FP16 Function Select Bit. 0 = general-purpose I/O, 1 = LCD function.

Read or Write LCD Bit. If this bit = 1, the data in LCDDAT is written to the address indicated by the LCDPTR[5:0] bits.

LCD SETUP

The LCD Configuration SFR (LCDCON, 0x95) configures the LCD module to drive the type of LCD in the user end system. The BIAS and LMUX[1:0] bits in this SFR should be set according to the LCD specifications.

The COM2/FP28 and COM3/FP27 pins default to LCD segment lines. Selecting the 3× multiplex level in the LCD Configuration SFR (LCDCON, 0x95) by setting LMUX[1:0] = 10 changes the FP28 pin functionality to COM2. The 4× multiplex level selection, LMUX[1:0] = 11, changes the FP28 pin functionality to COM2 and the FP27 pin functionality to COM3.

LCD segments FP0 to FP15 and FP26 are enabled by default. Additional pins are selected for LCD functionality in the LCD Segment Enable SFR (LCDSEGE, 0x97) and the LCD Segment Enable 2 SFR (LCDSEGE2, 0xED), where there are individual enable bits for the FP16 to FP25 segment pins. The LCD pins do not have to be enabled sequentially. For example, if the alternate function of FP23, the Timer 2 input, is required, any of the other shared pins, FP16 to FP25, can be enabled instead.

The Display Element Control section contains details about setting up the LCD data memory to turn individual LCD segments on and off. Setting the LCDRST bit in the LCD Configuration SFR (LCDCON, 0x95) resets the LCD data memory to its default (0). A power-on reset also clears the LCD data memory.

LCD TIMING AND WAVEFORMS

An LCD segment acts like a capacitor that is charged and discharged at a certain rate. This rate, the refresh rate, determines the visual characteristics of the LCD. A slow refresh rate results in the LCD blinking on and off between refreshes. A fast refresh rate presents a screen that appears to be continuously lit. In addition, a faster refresh rate consumes more power.

The frame rate, or refresh rate, for the LCD module is derived from the LCD clock, f or 128 Hz by the CLKSEL bit in the LCD Configuration SFR (LCDCON, 0x95). The minimum refresh rate needed for the LCD to appear solid (without blinking) is independent of the multiplex level.

The LCD waveform frequency, f the LCD switches the active common line. Thus, the LCD waveform frequency depends heavily on the multiplex level. The frame rate and LCD waveform frequency are set by the f

, the multiplex level, and the FD[3:0] frame rate selection

LCDCLK

bits in the LCD Clock SFR (LCDCLK, 0x96).

The LCD module provides 16 different frame rates for f = 2048 Hz, ranging from 8 Hz to 128 Hz for an LCD with 4× multiplexing. Fewer options are available with f ranging from 8 Hz to 32 Hz for a 4× multiplexed LCD. The 128 Hz clock is beneficial for battery operation because it consumes less power than the 2048 Hz clock. The frame rate is set by the FD[3:0] bits in the LCD Clock SFR (LCDCLK, 0x96); see Table 72 and Table 73.

The LCD waveform is inverted at twice the LCD waveform frequency, f

. This way, each frame has an average dc offset

LCD

of zero. ADC offset degrades the lifetime and performance of the LCD.

. The LCD clock is selected as 2048 Hz

LCDCLK

, is the frequency at which

LCD

LCDCLK

= 128 Hz,

Rev. 0 | Page 84 of 128

ADE7518

BLINK MODE

Blink mode is enabled by setting the BLINKEN bit in the LCD Configuration SFR (LCDCON, 0x95). This mode is used to alternate between the LCD on state and LCD off state so that the LCD screen appears to blink. There are two blinking modes: a software controlled blink mode and an automatic blink mode.

Software Controlled Blink Mode

The LCD blink rate can be controlled by user code with the BLKMOD[1:0] bits in the LCD Clock SFR (LCDCLK, 0x96) by toggling the bits to turn the display on and off at a rate determined by the MCU code.

Automatic Blink Mode

There are five blink rates available. These blink rates are selected by the BLKMOD[1:0] and BLKFREQ[1:0] bits in the LCD Clock SFR (LCDCLK, 0x96); see Table 71.

DISPLAY ELEMENT CONTROL

A bank of 15 bytes of data memory located in the LCD module controls the on or off state of each LCD segment. The LCD data memory is stored in Address 0 through Address 14 in the LCD module. Each byte configures the on and off states of two segment lines. The LSBs store the state of the even numbered segment lines, and the MSBs store the state of the odd numbered segment lines. For example, LCD Memory Address 0 refers to segment lines one and zero (see Table 78). Note that the LCD data memory is maintained in PSM2 operating mode.

The LCD data memory is accessed indirectly through the LCD Pointer SFR (LCDPTR, 0xAC) and LCD Data SFR (LCDDAT, 0xAE). Moving a value to the LCDPTR SFR selects the LCD data byte to be accessed and initiates a read or write operation (see Table 75).

Table 78. LCD Data Memory Accessed Indirectly Through LCD Pointer SFR (LCDPTR, 0xAC) and LCD Data SFR (LCDDAT, 0xAE)

LCD Pointer SFR (LCDPTR, 0xAC) LCD Pointer SFR (LCDDAT, 0xAE) LCD Memory Address COM3 COM2 COM1 COM0 COM3 COM2 COM1 COM0

0x0E FP28 FP28 FP28 FP28 0x0D FP27 FP27 FP27 FP27 FP26 FP26 FP26 FP26 0x0C FP25 FP25 FP25 FP25 FP24 FP24 FP24 FP24 0x0B FP23 FP23 FP23 FP23 FP22 FP22 FP22 FP22 0x0A FP21 FP21 FP21 FP21 FP20 FP20 FP20 FP20 0x09 FP19 FP19 FP19 FP19 FP18 FP18 FP18 FP18 0x08 FP17 FP17 FP17 FP17 FP16 FP16 FP16 FP16 0x07 FP15 FP15 FP15 FP15 FP14 FP14 FP14 FP14 0x06 FP13 FP13 FP13 FP13 FP12 FP12 FP12 FP12 0x05 FP11 FP11 FP11 FP11 FP10 FP10 FP10 FP10 0x04 FP9 FP9 FP9 FP9 FP8 FP8 FP8 FP8 0x03 FP7 FP7 FP7 FP7 FP6 FP6 FP6 FP6 0x02 FP5 FP5 FP5 FP5 FP4 FP4 FP4 FP4 0x01 FP3 FP3 FP3 FP3 FP2 FP2 FP2 FP2 0x00 FP1 FP1 FP1 FP1 FP0 FP0 FP0 FP0

COMx designates the common lines.

FPx designates the segment lines.

Rev. 0 | Page 85 of 128

Writing to LCD Data Registers

To update the LCD data memory, first set the LSB of the LCD Configuration Y SFR (LCDCONY, 0xB1) to freeze the data being displayed on the LCD while updating it. Then, move the data to the LCD Data SFR (LCDDAT, 0xAE) prior to accessing the LCD Pointer SFR (LCDPTR, 0xAC). When the MSB of the LCDPTR SFR is set, the content of the LCDDAT SFR is transferred to the internal LCD data memory designated by the address in the LCDPTR SFR. Clear the LSB of the LCD Configuration Y SFR (LCDCONY, 0xB1) when all of the data memory has been updated to allow the use of the new LCD setup for display.

To update the segments attached to the FP10 and FP11 pins, use the following sample 8052 code:

ORL LCDCONY,#01h ;start updating the data MOV LCDDAT,#FFh MOV LCDPTR,#80h OR 05h ANL LCDCONY,#0FEh ;update finished

Reading LCD Data Registers

When the MSB of the LCD Pointer SFR (LCDPTR, 0xAC) is cleared, the content of the LCD data memory address designated by LCDPTR is transferred to the LCD Data SFR (LCDDAT, 0xAE).

Sample 8052 code to read the contents of LCD Data Memory Address 0x07, which holds the on and off state of the segments attached to FP14 and FP15, is as follows:

MOV LCDPTR,#07h MOV R1, LCDDAT

1, 2

ADE7518

LCD EXTERNAL CIRCUITRY

The voltage generation selection is made by setting Bit EXTRES in the LCD Configuration X SFR (LCDCONX, 0x9C). This bit is cleared by default and needs to be set to enable an external resistor ladder.

External Resistor Ladder

To enable the external resistor ladder, set the EXTRES bit in the LCD Configuration X SFR (LCDCONX, 0x9C). When EXTRES = 1, the LCD waveform voltages are supplied by the external resistor ladder. Because the LCD voltages are not generated on chip, the LCD bias compensation implemented to maintain contrast over temperature and supply is not possible.

The external circuitry needed for the resistor ladder option is shown in Figure 77. The resistors required should be in the range of 10 kΩ to 100 kΩ and based on the current required by the LCD being used.

LCDVC

LCD WAVEFORM

CIRCUITRY

Figure 76. External Circuitry for External Resistor Ladder Option 1/2 Bias

LCDVB

LCDVA

LCDVP1

LCDVP2

Configuration

07327-076

LCDVC

LCD WAVEFORM

CIRCUITRY

Figure 77. External Circuitry for External Resistor Ladder Option1/3 Bias

LCDVB

LCDVA

LCDVP1

LCDVP2

Configuration

07327-077

LCD FUNCTION IN PSM2

The LCDPSM2 and LCDEN bits in the LCD Configuration SFR (LCDCON, 0x95) control LCD functionality in PSM2 operating mode (see Table 79).

Table 79. Bits Controlling LCD Functionality in PSM2 Mode

LCDPSM2 LCDEN Result

0 0 The display is off in PSM2. 0 1 The display is on in PSM2. 1 X The display is off in PSM2.

In addition, note that the LCD configuration and data memory is retained when the display is turned off.

Example LCD Setup

An example of how to set up the LCD peripheral for a specific LCD is described in this section with the following parameters:

• Type of LCD: 4× multiplexed with 1/3 bias, 96 segments

• Refresh rate: 64 Hz

A 96-segment LCD with 4× multiplexing requires 96/4 = 24 segment lines. Sixteen pins, FP0 to FP15, are automatically dedicated for use as LCD segments. Eight more pins must be chosen for the LCD function. Because the LCD has 4× multiplexing, all four common lines are used. As a result, COM2/FP28 and COM3/FP27 cannot be used as segment lines. Based on the alternate functions of the pins used for FP16 through FP25, FP16 to FP23 are chosen for the eight remaining segment lines. These pins are enabled for LCD functionality in the LCD Segment Enable SFR (LCDSEGE, 0x97) and LCD Segment Enable 2 SFR (LCDSEGE2, 0xED).

The LCD is set up with the following 8052 code:

; setup LCD pins to have LCD functionality MOV LCDSEG,#FP20EN+FP21EN+FP22EN+FP23EN MOV LCDSEGX,#FP16EN+FP17EN+FP18EN+FP19EN

; set up LCDCON for f

= 2048 Hz, 1/3

LCDCLK

bias and 4× multiplexing MOV LCDCON,#BIAS+LMUX1+LMUX0 ; set up LCDCONX for resistor ladder MOV LCDCONX,#40h ; set up refresh rate for 64 Hz with f

LCDCLK

2048 Hz MOV LCDCLK,#FD3+FD2+FD1+FD0 ; set up LCD data registers with data to be

displayed using ; LCDPTR and LCDDATA registers ; turn all segments on FP27 on and FP26 off ORL LCDCONY,#01h ; start data memory

refresh MOV LCDDAT,#F0H MOV LCDPTR, #80h OR 0DH ANL LCDCONY,#0FEh ; end of data memory

refresh ORL LCDCON,#LCDEN ; enable LCD

To set up the same 3.3 V LCD for use with an external resistor ladder,

; set up LCDCONX for external resistor ladder

MOV LCDCONX,#EXTRES

Rev. 0 | Page 86 of 128

ADE7518

FLASH MEMORY

OVERVIEW

Flash memory is a type of nonvolatile memory that is in-circuit programmable. The default state of a byte of flash memory is 0xFF (erased). When a byte of flash memory is programmed, the required bits change from 1 to 0. The flash memory must be erased to turn the 0s back to 1s. However, a byte of flash memor y cannot be erased individually. The entire segment, or page, of flash memory that contains the byte must be erased.

The ADE7518 provides 16 kB of flash program/information memory. This memory is segmented into 32 pages of 512 bytes each. Therefore, to reprogram one byte of flash memory, the other 511 bytes in that page must be erased. The flash memory can be erased by page or all at once in a mass erase. There is a command to verify that a flash write operation has completed successfully. The ADE7518 flash memory controller also offers configurable flash memory protection.

The 16 kB of flash memory are provided on-chip to facilitate code execution without any external discrete ROM device requirements. The program memory can be programmed incircuit, using the serial download or emulation options provided or using conventional third party memory programmers.

Flash/EE Memory Reliability

The flash memory arrays on the ADE7518 are fully qualified for two key Flash/EE memory characteristics: Flash/EE memory cycling endurance and Flash/EE memory data retention.

Endurance quantifies the ability of the Flash/EE memory to be cycled through many program, read, and erase cycles. In real terms, a single endurance cycle is composed of the following four independent, sequential events:

Initial page erase sequence.

Read/verify sequence.

Byte program sequence.

Second read/verify sequence.

In reliability qualification, every byte in both the program and data Flash/EE memory is cycled from 0x00 to 0xFF until a first fail is recorded, signifying the endurance limit of the on-chip Flash/EE memory.

As indicated in the Specifications section, the ADE7518 flash memory endurance qualification has been carried out in accordance with JEDEC Standard 22 Method A117 over the industrial temperature range of −40°C, +25°C, and +85°C. The results allow the specification of a minimum endurance figure over supply and temperature of 100,000 cycles, with a minimum endurance figure of 20,000 cycles of operation at 25°C.

Retention is the ability of the flash memory to retain its programmed data over time. Again, the parts have been qualified in accordance with the formal JEDEC Standard 22 Method A117 at a specific junction temperature (TJ = 55°C). As part of this qualification procedure, the flash memory is cycled to its specified endurance limit before data retention is characterized. This means that the flash memory is guaranteed to retain its data for its full specified retention lifetime every time the flash memory is reprogrammed. It should also be noted that retention lifetime, based on an activation energy of 0.6 eV, derates with T

, as shown

in Figure 78.

300

250

200

(Years)

150

100

RETENTIO N

40 60 70 90

50 80 110

Figure 78. Flash/EE Memory Data Retention

ANALOG DEVI CES

SPECIFICATION

100 YEARS MIN.

AT TJ = 55°C

JUNCTION TEMPERATURE (°C)

100

7327-078

Rev. 0 | Page 87 of 128

ADE7518

FLASH MEMORY ORGANIZATION

The 16 kB of flash memory provided by the ADE7518 are segmented into 32 pages of 512 bytes each. It is up to the user to decide which flash memory to allocate for data memory. It is recommended that each page be dedicated solely to program memory or to data memory. Doing so prevents the program counter from being loaded with data memory instead of an operations code from the program memory. It also prevents program memory used to update a byte of data memory from being erased.

0x3FFF

0x3E00

0x3DFF

0x3C00

0x3BFF

0x3A00 0x39FF

0x3800

0x37FF

0x3600

0x35FF

0x3400

0x33FF

0x3200

0x31FF

0x3000

0x2FFF

0x2E00

0x2DFF

0x2C00

0x2BFF

0x2A00 0x29FF

0x2800

0x27FF

0x2600

0x25FF

0x2400

0x23FF

0x2200

0x21FF

0x2000

PAGE 31

PAGE 30

PAGE 29

PAGE 28

PAGE 27

PAGE 26

PAGE 25

PAGE 24

PAGE 23

PAGE 22

PAGE 21

PAGE 20

PAGE 19

PAGE 18

PAGE 17

PAGE 16

CONTAINS PRO TECTION SETTING S.

READ PROTECT BIT 7

READ PROTECT BIT 6

READ PROTECT BIT 5

READ PROTECT BIT 4

Figure 79. Flash Memory Organization

The flash memory can be protected from read or write/erase (W/E) access. The protection is implemented in part of the last page of the flash memory, Page 31. Four of the bytes from this page are used to set up write/erase protection for each page. Another byte is used for configuring read protection of the flash memory. The read protection is selected for groups of four pages. Finally, one byte is used to store the key required for modifying the protection scheme. The last page of flash memory must be write/erase protected for any flash protection to be active.

0x1FF

0x1E00

0x1DFF

0x1C00 0x1BFF

0x1A00

0x19FF

0x1800

0x17FF

0x1600

0x15FF

0x1400

0x13FF

0x1200

0x11FF

0x1000

0x0FFF

0x0E00

0x0DFF

0x0C00 0x0BFF

0x0A00

0x09FF

0x0800

0x07FF

0x0600

0x05FF

0x0400

0x03FF

0x0200

0x01FF

0x0000

PAGE 15

PAGE 14

PAGE 13

PAGE 12

PAGE 11

PAGE 10

PAGE 9

PAGE 8

PAGE 7

PAGE 6

PAGE 5

PAGE 4

PAGE 3

PAGE 2

PAGE 1

PAGE 0

READ PROTECT BIT 3

READ PROTECT BIT 2

READ PROTECT BIT 1

READ PROTECT BIT 0

07327-079

The implication of write/erase protecting the last page is that the content of the 506 bytes in this page that are available to the user must not change.

Thus, if code protection is enabled, it is recommended to use this last page for program memory only (if the firmware does not need to be updated in the field). If the firmware must be protected and can be updated at a future date, the last page should be used only for constants utilized by the program code.

Therefore, Page 0 through Page 30 are for general program and data memory use. It is recommended that Page 31 be used for constants or code that do not need to be updated. Note that the last six bytes of Page 31 are reserved for protecting the flash memory.

USING THE FLASH MEMORY

The 16 kB of flash memory are configured as 32 pages, each of 512 bytes. As with the other ADE7518 peripherals, the interface to this memory space is via a group of registers mapped in the SFR space (see Table 80).

A data register, EDATA, holds the byte of data to be accessed. The byte of flash memory is addressed via the EADRH and EADRL registers. Finally, ECON is an 8-bit control register that can be written to with one of seven flash memory access commands to trigger various read, write, erase, and verify functions.

Table 80. The Flash SFRs

Bit

SFR Address Default

ECON 0xB9 0x00 No Flash Control FLSHKY 0xBA 0xFF No Flash Key PROTKY 0xBB 0xFF No

EDATA 0xBC 0x00 No Flash Data PROTB0 0xBD 0xFF No

PROTB1 0xBE 0xFF No

PROTR 0xBF 0xFF No

EADRL 0xC6 0x00 No

EADRH 0xC7 0x00 No

Figure 80 demonstrates the steps required for access to the flash memory.

Addressable Description

Flash Protection Key

Flash W/E Protection 0

Flash W/E Protection 1

Flash Read Protection

Flash Low Byte Address

Flash High Byte Address

COMMAND

ADDRESS ADDRESS

EADRH

EADRL

PROTECTION KEY

FLSHKY

DECODER

FLASH

FLSHKY = 0 × 3B?

Figure 80. Flash Memory Read/Write/Erase Protection Block Diagram

ECON

PROTECTION

DECODER

ACCESS

ALLOWED?

Rev. 0 | Page 88 of 128

TRUE: ACCESS ALLOWED ECON = 0

FALSE: ACCESS DENIED ECON = 1

7327-080

ADE7518

ECON—Flash/EE Memory Control SFR

Programming flash memory is done through the Flash Control SFR (ECON, 0xB9). This SFR allows the user to read, write, erase, or verify the 16 kB of flash memory. As a method of security, a key must be written to the FLSHKY register to initiate any user access to the flash memory. Upon completion of the flash memory operation, the FLSHKY register is reset so that it must be written to prior to another flash memory operation. Requiring the key to be set before an access to the flash memory decreases the likelihood of user code or data being overwritten by a program inappropriately modified during its execution.

Table 81. Flash Control SFR (ECON, 0xB9)

Bit Mnemonic Value Description

7 to 0 ECON 1

4 Read Byte. The byte in the flash memory addressed by EADRH/EADRL is read into EDATA. 5

8 Protect Code (see the Protecting the Flash Memory section).

Write Byte. The value in EDATA is written to the flash memory at the page address given by EADRH and EADRL. Note that the byte being addressed must be pre-erased.

Erase Page. A 512-byte page of flash memory address is erased. The page is selected by the address in EADRH/EADRL. Any address in the page can be written to EADRH/EADRL to select it for erasure.

Erase All. All 16 kB of the flash memory are erased. Note that this command is used during serial and parallel download modes but should not be executed by user code.

Erase Page and Write Byte. The page that holds the byte addressed by EADRH/EADRL is erased. Data in EDATA is then written to the byte of flash memory addressed by EADRH/EADRL.

The program counter (PC) is held on the instruction where the ECON register is written to until the flash memory controller is done performing the requested operation. Then, the PC increments to continue with the next instruction.

Any interrupt requests that occur while the flash controller is performing an operation are not handled until the flash operation is complete. All peripherals, such as timers and counters, continue to operate as configured throughout the flash memory access.

Table 82. Flash Key SFR (FLSHKY, 0xBA)

Bit Mnemonic Default Description

7 to 0 FLSHKY 0xFF

The content of this SFR is compared to the flash key, 0x3B. If the two values match, the next ECON operation is allowed (see the Protecting the Flash Memory section).

Table 83. Flash Protection Key SFR (PROTKY, 0xBB)

Bit Mnemonic Default Description

7 to 0 PROTKY 0xFF

The content of this SFR is compared to the flash memory location at Address 0x3FFA. If the two values match, the update of the write/erase and read protection setup is allowed (see the Protecting the Flash Memory section).

If the protection key in the flash is 0xFF, the PROTKY SFR value is not used for comparison. This SFR is also used to write the protection key in the flash. This is done by writing the desired value in PROTKY and by writing 0x08 in the ECON SFR. This operation can only be done once.

Table 84. Flash Data SFR (EDATA, 0xBC)

Bit Mnemonic Default Description

7 to 0 EDATA 0 Flash Pointer Data.

Table 85. Flash Write/Erase Protection 0 SFR (PROTB0, 0xBD)

Bit Mnemonic Default Description

7 to 0 PROTB0 0xFF

Page 7 Page 6 Page 5 Page 4 Page 3 Page 2 Page 1 Page 0

This SFR is used to write the write/erase protection bits for Page 0 to Page 7 of the flash memory (see the Protecting the Flash Memory section). Clearing the bits enables the protection.

PROTB0.7

PROTB0.6 PROTB0.5 PROTB0.4 PROTB0.3 PROTB0.2 PROTB0.1 PROTB0.0

Table 86. Flash Write/Erase Protection 1 SFR (PROTB1, 0xBE)

Bit Mnemonic Default Description

7 to 0 PROTB1 0xFF

Page 15 Page 14 Page 13 Page 12 Page 11 Page 10 Page 9 Page 8

This SFR is used to write the write/erase protection bits for Page 8 to Page15 of the flash memory (see the Protecting the Flash Memory section). Clearing the bits enables the protection.

PROTB1.7 PROTB1.6 PROTB1.5 PROTB1.4 PROTB1.3 PROTB1.2 PROTB1.1 PROTB1.0

Rev. 0 | Page 89 of 128

ADE7518

Table 87. Flash Read Protection SFR (PROTR, 0xBF)

Bit Mnemonic Default Description

7 to 0 PROTR 0xFF

Table 88. Flash Low Byte Address SFR (EADRL, 0xC6)

Bit Mnemonic Default Description

7 to 0 EADRL 0

Page 23 Page 22 Page 21 Page 20 Page 19 Page 18 Page 17 Page 16

Table 89. Flash High Byte Address SFR (EADRH, 0xC7)

Bit Mnemonic Default Description

7 to 0 EADRH 0

This SFR is used to write the read protection bits for Page 0 to Page 31 of the flash memory (see the Protecting the Flash Memory section). Clearing the bits enables the protection.

PROTR.7 PROTR.6 PROTR.5 PROTR.4 PROTR.3 PROTR.2 PROTR.1 PROTR.0

Page 28 to Page 31

Flash Pointer Low Byte Address. This SFR is also used to write the write/erase protection bits for Page 16 to Page 23 of the flash memory (see the Protecting the Flash Memory section). Clearing the bits enables the protection.

EADRL.7 EADRL.6 EADRL.5 EADRL.4 EADRL.3 EADRL.2 EADRL.1 EADRL.0

Flash Pointer High Byte Address. This SFR is also used to write the write/erase protection bits for Page 24 to Page 31 of the flash memory (see the Protecting the Flash Memory section). Clearing the bits enables the protection.

EADRH.7 EADRH.6 EADRH.5 EADRH.4 EADRH.3 EADRH.2 EADRH.1 EADRH.0

Page 31 Page 30 Page 29 Page 28 Page 27 Page 26 Page 25 Page 24

Page 24 to Page 27

Page 20 to Page 23

Page 16 to Page 19

Page 12 to Page 15

Page 8 to Page 11

Page 4 to Page 7

Page 0 to Page 3

Flash Functions

Sample 8052 code is provided in this section to demonstrate how to use the flash functions. For these examples, the byte of Flash Memory 0x3C00 is accessed.

Writ e By te

Write 0xF3 into Flash Memory Byte 0x3C00.

MOV EDATA,#F3h ; Data to be written MOV EADRH,#3Ch ; Set up byte address MOV EADRL,#00h MOV FLSHKY,#3Bh ; Write flash security

key. MOV ECON,#01h ; Write byte

Erase Page

Erase the page containing Flash Memory Byte 0x3C00.

MOV EADRh,#3Ch ; Select page through byte address

MOV EADRL,#00h MOV FLSHKY,#3Bh ; Write flash security

key MOV ECON,#02h ; Erase Page

Erase All

Erase all of the 16 kB flash memory.

MOV FLSHKY,#3Bh ; Write flash security key

MOV ECON,#03h ; Erase all

Read Byte

Read Flash Memory Byte 0x3C00.

MOV EADRH,#3Ch ; Set up byte address MOV EADRL,#00h MOV FLSHKY,#3Bh ; Write flash security

key MOV ECON,#04h ; Read byte

; Data is ready in EDATA

Erase Page and Write Byte

Erase the page containing Flash Memory Byte 0x3C00 and then write 0xF3 to that address. Note that the other 511 bytes in this page are erased.

MOV EDATA,#F3h ; Data to be written MOV EADRH,#3Ch ; Set up byte address MOV EADRL,#00h MOV FLSHKY,#3Bh ; Write flash security

key MOV ECON,#05h ; Erase page and then

write byte

Rev. 0 | Page 90 of 128

ADE7518

PROTECTING THE FLASH MEMORY

Two forms of protection are offered for this flash memory: read protection and write/erase protection. The read protection ensures that any pages that are read protected are not able to be read by the end user. The write protection ensures that the flash memory cannot be erased or written over. This protects the end system from tampering and can prevent the code from being overwritten in the event of an unexpected disruption of the normal execution of the program.

Write/erase protection is individually selectable for all 32 pages. Read protection is selected in groups of four pages (see Figure 79 for the groupings). The protection bits are stored in the last flash memory locations, Address 0x3FFA through Address 0x3FFF (see Figure 81); four bytes are reserved for write/erase protection, one byte is for read protection, and another byte sets the protection security key. The user must enable read and write/erase protection for the last page for the entire protection scheme to work.

Note that the read protection does not prevent MOVC commands from being executed within the code.

There is an additional layer of protection offered by a protection security key. The user can set up this security key so that the protection scheme cannot be changed without this key. Once the protection key has been configured, it cannot be modified.

Enabling Flash Protection by Code

The protection bytes in the flash memory can be programmed using the flash controller command and programming ECON to 0x08. In this case, the EADRH, EADRL, PROTB1, and PROTB0 bytes are used to store the data to be written to the 32 bits of write protection. Note that the EADRH and EADRL registers are not used as data pointers here but to store write protection data.

EADRH

EADRL

PROTB1

PROTB0

PROTR

PROTKY

0x3FFF

0x3FFE

0x3FFD

0x3FFC

0x3FFB

0x3FFA

0x3FF9

0x3E00

WP30WP29WP

WP23WP22WP21WP

WP15WP14WP13WP

WP7WP6WP5WP

31:28

27:24RP23:20RP19:16RP15:12RP11:8RP7:4RP3:0

WDOG

LOCK

Figure 81. Flash Protection in Page 31

WP27WP26WP25WP

WP19WP18WP17WP

WP11WP10WP9WP

WP3WP2WP1WP

PROTECTION KEY

07327-081

The sequence for writing the protection bits is as follows:

Set up the EADRH, EADRL, PROTB1, and PROTB0

registers with the write/erase protection bits. When erased, the protection bits default to 1 (like any other bit of flash memory). The default protection setting is for no protection. To enable protection, write a 0 to the bits corresponding to the pages that should be protected.

Set up the PROTR register with the read protection bits.

Note that every read protection bit protects four pages. To enable the read protection bit, write a 0 to the bits that should be read protected.

To enable the protection key, write to the PROTKY register.

If enabled, the protection key is required to modify the protection scheme. The protection key, Flash Memory Address 0x3FFA, defaults to 0xFF; if the PROTKY register is not written to, it remains 0xFF. If the protection key is written to, the PROTKY register must be written with this value every time the protection functionality is accessed. Note that once the protection key is configured, it cannot be modified. Also, note that the most significant bit of Address 0x3FFA is used to enable a lock mechanism for the watchdog settings (see the Watchdog Timer section for more information).

Run the protection command by writing 0x08 to the

ECON register.

Reset the chip to activate the new protection.

To enable read and write/erase protection for the last page only, use the following 8052 code. Writing the flash protection command to the ECON register initiates programming of the protection bits in the flash.

; enable read protection on the last four pages only

MOV PROTR,#07Fh

; set up a protection key of 0A3h. This command can be

; omitted to use the default protection key of 0xFF

MOV PROTKY,#0A3h

; write the flash key to the FLSHKY register to enable flash

; access. The flash access key is not configurable.

MOV FLSHKY,#3Bh

; write flash protection command to the ECON register

MOV ECON,#08h

Rev. 0 | Page 91 of 128

ADE7518

Enabling Flash Protection by Emulator Commands

Another way to set the flash protection bytes is to use some reserved emulator commands available only in download mode. These commands write directly to the SFRs and can be used to duplicate the operation mentioned in the Enabling Flash Protection by Code section. When these flash bytes are written, the part can exit emulation mode by a reset and the protections are effective. This method can be used in production and implemented after downloading the program. The commands used for this operation are an extension of the commands listed in Application Note uC004, Understanding the Serial Download Protocol, available at www.analog.com.

• Command with ASCII Code I or 0x49 writes the data into R0.

• Command with ASCII Code F or 0x46 writes R0 into the

SFR address defined in the data of this command.

By omitting the protocol defined in Application Note uC004, Understanding the Serial Download Protocol, the sequence to load protections is similar to the sequence presented in the Enabling Flash Protection by Code section, except that two emulator commands are necessary to replace one assembly command. For example, to write the protection value in EADRH, the two following commands need to be executed:

• Command I with data = value of Protection Byte 0x3FFF.

• Command F with data = 0xC7.

Following this protocol, the protection can be written to the flash using the same sequence as mentioned in the Enabling Flash Protection by Code section. When the part is reset, the protection is effective.

Notes on Flash Protection

The flash protection scheme is disabled by default so that none of the pages of the flash are protected from reading or writing/ erasing.

The last page must be read and write/erase protected for the protection scheme to work.

To activate the protection settings, the ADE7518 must be reset after configuring the protection.

After configuring protection on the last page and resetting the part, protections that have been enabled can only be removed by mass erasing the flash memory. The protection bits are read and erase protected by enabling read and write/erase protection on the last page, but the protection bits are never truly write protected.

Protection bits can be modified from 1 to 0, even after the last page has been protected. In this way, more protection can be added but none can be removed.

The protection scheme is intended to protect the end system. Protection should be disabled while developing and emulating code.

Flash Memory Timing

Typical program and erase times for the flash memory are shown in Table 90.

Table 90. Flash Memory Program and Erase Times

Bytes

Command

Write Byte 1 byte 30 μs Erase Page 512 bytes 20 ms Erase All 16 kB 200 ms Read Byte 1 byte 100 ns Erase Page and Write Byte 512 bytes 21 ms Verify Byte 1 byte 100 ns

Note that the core microcontroller operation is idled until the requested flash memory operation is complete. In practice, this means that even though the flash operation is typically initiated with a two-machine-cycle MOV instruction to write to the Flash Control SFR (ECON, 0xB9), the next instruction is not executed until the Flash/EE operation is complete. This means that the core cannot respond to interrupt requests until the Flash/EE operation is complete, although the core peripheral functions, such as counters and timers, continue to count as configured throughout this period.

Affected

Flash Memory Timing

IN-CIRCUIT PROGRAMMING

Serial Downloading

The ADE7518 facilitates code download via the standard UART serial port. The parts enter serial download mode after a reset or a power cycle if the 1 kΩ resistor. When in serial download mode, the hidden embedded download kernel executes. This allows the user to download code to the full 16 kB of flash memory while the device is in-circuit in its target application hardware.

Protection configured in the last page of the ADE7518 affects whether flash memory can be accessed in serial download mode. Read protected pages cannot be read. Write/erase protected pages cannot be written or erased.

SDEN

pin is pulled low through an external

Rev. 0 | Page 92 of 128

ADE7518

TIMERS

The ADE7518 has three 16-bit timer/counters: Timer/Counter 0, Timer/Counter 1, and Timer/Counter 2. The timer/counter hardware is included on chip to relieve the processor core of overhead inherent in implementing timer/counter functionality in software. Each timer/counter consists of two 8-bit registers: THx and TLx (x = 0, 1, or 2). All three timers can be configured to operate as timers or as event counters.

When functioning as a timer, the TLx register is incremented every machine cycle. Thus, users can think of it as counting machine cycles. Because a machine cycle on a single cycle core consists of one core clock period, the maximum count rate is the core clock frequency.

Table 91. Timer SFRs

SFR Address Bit Addressable Description

TCON 0x88 Yes Timer/Counter 0 and Timer/Counter 1 Control (see Table 93). TMOD 0x89 No Timer/Counter 0 and Timer/Counter 1 Mode (see Table 92). TL0 0x8A No Timer 0 Low Byte (see Table 96). TL1 0x8B No Timer 1 Low Byte (see Table 98). TH0 0x8C No Timer 0 High Byte (see Table 95). TH1 0x8D No Timer 1 High Byte (see Table 97). T2CON 0xC8 Yes Timer/Counter 2 Control (see Table 94). RCAP2L 0xCA No Timer 2 Reload/Capture Low Byte (see Table 102). RCAP2H 0xCB No Timer 2 Reload/Capture High Byte (see Table 101). TL2 0xCC No Timer 2 Low Byte (see Table 100). TH2 0xCD No Timer 2 High Byte (see Table 99).

When functioning as a counter, the TLx register is incremented by a 1-to-0 transition at its corresponding external input pin: T0, T1, or T2. When the samples show a high in one cycle and a low in the next cycle, the count is incremented. Because it takes two machine cycles (two core clock periods) to recognize a 1-to-0 transition, the maximum count rate is half the core clock frequency.

There are no restrictions on the duty cycle of the external input signal, but to ensure that a given level is sampled at least once before it changes, it must be held for a minimum of one full machine cycle. User configuration and control of all timer operating modes is achieved via the SFRs listed in Table 91.

TIMER REGISTERS

Table 92. Timer/Counter 0 and Timer/Counter 1 Mode SFR (TMOD, 0x89)

Bit Mnemonic Default Description

7 Gate1 0

5 to 4

3 Gate0 0

1 to 0

C/T1

T1/M1, T1/M0

C/T0

T0/M1, T0/M0

00 Timer 1 Mode Select Bits.

00 Timer 0 Mode Select Bits.

Timer 1 Gating Control. Set by software to enable Timer/Counter 1 only when the INT1 TR1 control is set. Cleared by software to enable Timer 1 whenever the TR1 control bit is set.

Timer 1 Timer or Counter Select Bit. Set by software to select counter operation (input from the T1 pin). Cleared by software to select the timer operation (input from the internal system clock).

T1/M[1:0] Result

00 TH1 operates as an 8-bit timer/counter. TL1 serves as a 5-bit prescaler. 01 16-Bit Timer/Counter. TH1 and TL1 are cascaded; there is no prescaler. 10 8-Bit Autoreload Timer/Counter. TH1 holds a value to reload into TL1 each time it overflows. 11 Timer/Counter 1 stopped. Timer 0 Gating Control. Set by software to enable Timer/Counter 0 only when the INT0

TR0 control bit is set. Cleared by software to enable Timer 0 whenever the TR0 control bit is set. Timer 0 Timer or Counter Select Bit. Set by software to the select counter operation (input from the T0 pin).

Cleared by software to the select timer operation (input from the internal system clock).

T0/M[1:0] Result

00 TH0 operates as an 8-bit timer/counter. TL0 serves as a 5-bit prescaler. 01 16-Bit Timer/Counter. TH0 and TL0 are cascaded; there is no prescaler. 10 8-Bit Autoreload Timer/Counter. TH0 holds a value to reload into TL0 each time it overflows. 11

TL0 is an 8-bit timer/counter controlled by the standard Timer 0 control bits. TH0 is an 8-bit timer only, controlled by Timer 1 control bits.

pin is high and the

Rev. 0 | Page 93 of 128

ADE7518

Table 93. Timer/Counter 0 and Timer/Counter 1 Control SFR (TCON, 0x88)

Bit Address Mnemonic Default Description

7 0x8F TF1 0

6 0x8E TR1 0

5 0x8D TF0 0

4 0x8C TR0 0

3 0x8B IE11 0

2 0x8A IT11 0

1 0x89 IE01 0

0 0x88 IT01 0

These bits are not used to control Timer/Counter 0 and Timer/Counter 1 but are instead used to control and monitor the external

Timer 1 Overflow Flag. Set by hardware on a Timer/Counter 1 overflow. Cleared by hardware when the program counter (PC) vectors to the interrupt service routine.

Timer 1 Run Control Bit. Set by the user to turn on Timer/Counter 1. Cleared by the user to turn off Timer/Counter 1.

Timer 0 Overflow Flag. Set by hardware on a Timer/Counter 0 overflow. Cleared by hardware when the PC vectors to the interrupt service routine.

Timer 0 Run Control Bit. Set by the user to turn on Timer/Counter 0. Cleared by the user to turn off Timer/Counter 0.

External Interrupt 1 (INT1 to the external interrupt pin, INT1

) Flag. Set by hardware by a falling edge or by a zero level applied

, depending on the state of Bit IT1. Cleared by hardware when the PC vectors to the interrupt service routine only if the interrupt was transition activated. If level activated, the external requesting source controls the request flag rather than the on-chip hardware.

External Interrupt 1 (IE1) Trigger Type. Set by software to specify edge sensitive detection, that is, 1-to-0 transition. Cleared by software to specify level sensitive detection, that is, zero level.

External Interrupt 0 (INT0 to the external interrupt pin, INT0

) Flag. Set by hardware by a falling edge or by a zero level being applied

, depending on the state of Bit IT0. Cleared by hardware when the PC vectors to the interrupt service routine only if the interrupt was transition activated. If level activated, the external requesting source controls the request flag rather than the on-chip hardware.

External Interrupt 0 (IE0) Trigger Type. Set by software to specify edge sensitive detection, that is, 1-to-0 transition. Cleared by software to specify level sensitive detection, that is, zero level.

INT0

INT1

and

interrupt pins.

Table 94. Timer/Counter 2 Control SFR (T2CON, 0xC8)

Bit Address Mnemonic Default Description

7 0xCF TF2 0

Timer 2 Overflow Flag. Set by hardware on a Timer 2 overflow. TF2 cannot be set when either RCLK = 1 or TCLK = 1. Cleared by user software.

6 0xCE EXF2 0

Timer 2 External Flag. Set by hardware when either a capture or reload is caused by a negative transition on T2EX pin and EXEN2 = 1. Cleared by user software.

5 0xCD RCLK 0

Receive Clock Enable Bit. Set by the user to enable the serial port to use Timer 2 overflow pulses for its receive clock in Serial Port Mode 1 and Serial Port Mode 3. Cleared by the user to enable Timer 1 overflow to be used for the receive clock.

4 0xCC TCLK 0

Transmit Clock Enable Bit. Set by the user to enable the serial port to use Timer 2 overflow pulses for its transmit clock in Serial Port Mode 1 and Serial Port Mode 3. Cleared by the user to enable Timer 1 overflow to be used for the transmit clock.

3 0xCB EXEN2 0

Timer 2 External Enable Flag. Set by the user to enable a capture or reload to occur as a result of a negative transition on T2EX if Timer 2 is not being used to clock the serial port. Cleared by the user for Timer 2 to ignore events at T2EX.

2 0xCA TR2 0 Timer 2 Start/Stop Control Bit. Set by the user to start Timer 2. Cleared by the user to stop Timer 2. 1 0xC9

C/T2

Timer 2 Timer or Counter Function Select Bit. Set by the user to select the counter function (input from external T2 pin). Cleared by the user to select the timer function (input from on-chip core clock).

0 0xC8 CAP2 0

Timer 2 Capture/Reload Select Bit. Set by the user to enable captures on negative transitions at T2EX if EXEN2 = 1. Cleared by the user to enable autoreloads with Timer 2 overflows or negative transitions at T2EX when EXEN2 = 1. When either RCLK = 1 or TCLK = 1, this bit is ignored and the timer is forced to autoreload on Timer 2 overflow.

Rev. 0 | Page 94 of 128

ADE7518

Table 95. Timer 0 High Byte SFR (TH0, 0x8C)

Bit Mnemonic Default Description

7 to 0 TH0 0 Timer 0 Data High Byte.

Table 96. Timer 0 Low Byte SFR (TL0, 0x8A)

Bit Mnemonic Default Description

7 to 0 TL0 0 Timer 0 Data Low Byte.

Table 97. Timer 1 High Byte SFR (TH1, 0x8D)

Bit Mnemonic Default Description

7 to 0 TH1 0 Timer 1 Data High Byte.

Mode 0 (13-Bit Timer/Counter)

Mode 0 configures an 8-bit timer/counter. Figure 82 shows Mode 0 operation. Note that the divide-by-12 prescaler is not present on the single cycle core.

CORE

P0.6/T0

TR0

C/T0 = 0

C/T0 = 1

(5 BITS)

CONTROL

TL0

TH0

(8 BITS)

TF0

INTERRUPT

Table 98. Timer 1 Low Byte SFR (TL1, 0x8B)

Bit Mnemonic Default Description

7 to 0 TL1 0 Timer 1 Data Low Byte.

Table 99. Timer 2 High Byte SFR (TH2, 0xCD)

Bit Mnemonic Default Description

7 to 0 TH2 0 Timer 2 Data High Byte.

Table 100. Timer 2 Low Byte SFR (TL2, 0xCC)

Bit Mnemonic Default Description

7 to 0 TL2 0 Timer 2 Data Low Byte.

Table 101. Timer 2 Reload/Capture High Byte SFR (RCAP2H, 0xCB)

Bit Mnemonic Default Description

7 to 0 TH2 0

Timer 2 Reload/ Capture High Byte.

Table 102. Timer 2 Reload/Capture Low Byte SFR (RCAP2L, 0xCA)

Bit Mnemonic Default Description

7 to 0 TL2 0

Timer 2 Reload/ Capture Low Byte.

TIMER 0 AND TIMER 1

Timer/Counter 0 and Timer/Counter 1 Data Registers

Each timer consists of two 8-bit registers. They are Timer 0 High Byte SFR (TH0, 0x8C), Timer 0 Low Byte SFR (TL0, 0x8A), Timer 1 High Byte SFR (TH1, 0x8D), and Timer 1 Low Byte SFR (TL1, 0x8B). These can be used as independent registers or combined into a single 16-bit register, depending on the timer mode configuration (see Table 95 to Table 98).

Timer/Counter 0 and Timer/Counter 1 Operating Modes

This section describes the operating modes for Timer/Counter 0 and Timer/Counter 1. Unless otherwise noted, these modes of operation are the same for both Timer 0 and Timer 1.

GATE

NT0

Figure 82. Timer/Counter 0, Mode 0

In this mode, the timer register is configured as a 13-bit register. As the count rolls over from all 1s to all 0s, it sets the timer overflow flag, TF0. TF0 can then be used to request an interrupt. The counted input is enabled to the timer when TR0 = 1 and either Gate0 = 0 or controlled by external input

INT0

= 1. Setting Gate0 = 1 allows the timer to be

INT0

to facilitate pulse width measurements. TR0 is a control bit in the Timer/Counter 0 and Timer/Counter 1 Control SFR (TCON, 0x88); the Gate0/Gate1 bits are in the Timer/Counter 0 and Timer/Counter 1 Mode SFR (TMOD, 0x89). The 13-bit register consists of all eight bits of Timer 0 High Byte SFR (TH0, 0x8C) and the lower five bits of Timer 0 Low Byte SFR (TL0, 0x8A). The upper three bits of the TL0 SFR are indeterminate and should be ignored. Setting the run flag (TR0) does not clear the registers.

Mode 1 (16-Bit Timer/Counter)

Mode 1 is the same as Mode 0 except that the Mode 1 timer register runs with all 16 bits. Mode 1 is shown in Figure 83.

CORE

P0.6/T0

GATE

INT

C/T0 = 0

C/T0 = 1

TR0

Figure 83. Timer/Counter 0, Mode 1

(8 BITS)

CONTROL

TL0

TH0

(8 BITS)

TF0

INTERRUPT

07327-082

07327-083

Rev. 0 | Page 95 of 128

ADE7518

Mode 2 (8-Bit Timer/Counter with Autoreload)

Mode 2 configures the timer register as an 8-bit counter (TL0) with automatic reload, as shown in Figure 84. Overflow from TL0 not only sets TF0 but also reloads TL0 with the contents of TH0, which is preset by software. The reload leaves TH0 unchanged.

CORE

P0.6/T0

GATE

INT0

C/T0 = 0

C/T0 = 1

CONTROL

TR0

Figure 84. Timer/Counter 0, Mode 2

TL0

(8 BITS)

RELOAD

TH0

(8 BITS)

TF0

INTERRUPT

Mode 3 (Two 8-Bit Timer/Counters)

Mode 3 has different effects on Timer 0 and Timer 1. Timer 1 in Mode 3 simply holds its count. The effect is the same as setting TR1 = 0. Timer 0 in Mode 3 establishes TL0 and TH0 as two separate counters. This configuration is shown in Figure 85. TL0 uses the Timer 0 control bits, C/ TR0, TF0 (see Table 93), and

, Gate0 (see Table 92),

INT0

. TH0 is locked into a timer function (counting machine cycles) and takes over the use of TR1 and TF1 from Timer 1. Therefore, TH0 controls the Timer 1 interrupt. Mode 3 is provided for applications requiring an extra 8-bit timer or counter.

When Timer 0 is in Mode 3, Timer 1 can be turned on and off by switching it out of and into its own Mode 3, or it can be used by the serial interface as a baud rate generator. In fact, Timer 1 can be used in any application not requiring an interrupt from Timer 1 itself.

CORE CLK/12

C/T0 = 0

C/T0 = 1

Figure 85. Timer/Counter 0, Mode 3

(8 BITS)

CONTROL

(8 BITS)

TL0

TH0

TF0

TF1

INTERRUPT

CORE

P0.6/T0

GATE

/12

TR1

TR0

0IN T

Rev. 0 | Page 96 of 128

07327-084

07327-085

TIMER 2

Timer/Counter 2 Data Registers

Timer/Counter 2 also has two pairs of 8-bit data registers associated with it: Timer 2 High Byte SFR (TH2, 0xCD), Timer 2 Low Byte SFR (TL2, 0xCC), Timer 2 Reload/Capture High Byte SFR (RCAP2H, 0xCB), and Timer 2 Reload/Capture Low Byte SFR (RCAP2L, 0xCA). These are used as both timer data registers and as timer capture/reload registers (see Table 99 to Table 102).

Timer/Counter 2 Operating Modes

The following sections describe the operating modes for Timer/Counter 2. The operating modes are selected by bits in the Timer/Counter 2 Control SFR (T2CON, 0xC8), as shown in Table 94 and Table 103.

Table 103. T2CON Operating Modes

RCLK or TCLK CAP2 TR2 Mode

0 0 1 16-bit autoreload 0 1 1 16-bit capture 1 X 1 Baud rate X X 0 Off

16-Bit Autoreload Mode

Autoreload mode has two options that are selected by Bit EXEN2 in Timer/Counter 2 Control SFR (T2CON, 0xC8). If EXEN2 = 0 when Timer 2 rolls over, it not only sets TF2 but also causes the Timer 2 registers to be reloaded with the 16-bit value in both the Timer 2 Reload/Capture High Byte SFR (RCAP2H, 0xCB) and Timer 2 Reload/Capture Low Byte SFR (RCAP2L, 0xCA) registers, which are preset by software. If EXEN2 = 1, Timer 2 performs the same events as when EXEN2 = 0 but adds a 1-to-0 transition at the external input T2EX, which triggers the 16-bit reload and sets EXF2. Autoreload mode is shown in Figure 86.

16-Bit Capture Mode

Capture mode has two options that are selected by Bit EXEN2 in Timer/Counter 2 Control SFR (T2CON, 0xC8). If EXEN2 = 0, Timer 2 is a 16-bit timer or counter that, upon overflowing, sets Bit TF2, the Timer 2 overflow bit, which can be used to generate an interrupt. If EXEN2 = 1, Timer 2 performs the same events as when EXEN2 = 0 but adds a l-to-0 transition on external input T2EX, which causes the current value in the Timer 2 registers, TL2 and TH2, to be captured into the RCAP2L and RCAP2H registers, respectively. In addition, the transition at T2EX causes Bit EXF2 in T2CON to be set, and EXF2, like TF2, can generate an interrupt. Capture mode is shown in Figure 87. The baud rate generator mode is selected by RCLK = 1 and/or TCLK = 1.

In either case, if Timer 2 is used to generate the baud rate, the TF2 interrupt flag does not occur. Therefore, Timer 2 interrupts do not occur and do not have to be disabled. In this mode, the EXF2 flag can, however, still cause interrupts that can be used as a third external interrupt. Baud rate generation is described as part of the UART serial port operation in the UART Serial Interface section.

ADE7518

P1.3/

T2EX

CORE

P1.4/T2

TRANSITION

DETECTOR

C/ T2 = 0

C/ T2 = 1

TR2

CONTROL

RELOAD

TL2

(8 BITS)

RCAP2L RCAP2H

TH2

(8 BITS)

TF2

EXF2

TIMER INTERRUPT

EXEN2

07327-086

Figure 86. Timer/Counter 2, 16-Bit Autoreload Mode

P1.3/

T2EX

CORE

P1.4/T2

TRANSITION

DETECTOR

C/ T2 = 0

C/ T2 = 1

EXEN2

TR2

CONTROL

CONTRO L

CAPTURE

TL2

(8 BITS)

RCAP2L RCAP2H

TH2

(8 BITS)

TF2

EXF2

TIMER INTERRUPT

07327-087

Figure 87. Timer/Counter 2, 16-Bit Capture Mode

Rev. 0 | Page 97 of 128

ADE7518

PLL

The ADE7518 is intended for use with a 32.768 kHz watch crystal. A PLL locks onto a multiple of this frequency to provide a stable

4.096 MHz clock for the system. The core can operate at this frequency or at binary submultiples of it to allow power savings when maximum core performance is not required. The default core clock is the PLL clock divided by 4, or 1.024 MHz. The ADE energy measurement clock is derived from the PLL clock and is maintained at 4.096 MHz/5 MHz, or 819.2 kHz, across all CD settings.

PLL REGISTERS

Table 104. Power Control SFR (POWCON, 0xC5)

Bit Mnemonic Default Description

7 Reserved 1 Reserved. 6 METER_OFF 0

5 Reserved 0 This bit should be kept at 0 for proper operation. 4 COREOFF 0 Set this bit to shut down the core if in PSM1 operating mode. 3 Reserved Reserved. 2 to 0 CD[2:0] 010 Controls the core clock frequency (f

Set this bit to turn off the modulators and energy metering DSP circuitry to reduce power if metering functions are not needed in PSM0.

CD[2:0] Result (f

000 4.096 001 2.048 010 1.024 011 0.512 100 0.256 101 0.128 110 0.064 111 0.032

The PLL is controlled by the CD[2:0] bits in the Power Control SFR (POWCON, 0xC5). To protect erroneous changes to the POWCON SRF, a key is required to modify the register. First, the Key SFR (KYREG, 0xC1) is written with the key, 0xA7, and then a new value is written to the POWCON SFR.

If the PLL loses lock, the MCU is reset and the PLL_FLT bit is set in the Peripheral Configuration SFR (PERIPH, 0xF4). Set the PLLACK bit in the Start ADC Measurement SFR (ADCGO, 0xD8) to acknowledge the PLL fault, clearing the PLL_FLT bit.

). f

CORE

= 4.096 MHz/2CD.

CORE

in MHz)

CORE

Writing to the Power Control SFR (POWCON, 0xC5)

Note that writing data to the POWCON SFR involves writing 0xA7 into the Key SFR (KYREG, 0xC1) followed by a write to the POWCON SFR.

Table 105. Key SFR (KYREG, 0xC1)

Bit Mnemonic Default Description

7 to 0 KYREG 0

Write 0xA7 to the KYREG SFR before writing to the POWCON SFR to unlock it. Write 0xEA to the KYREG SFR before writing to the INTPR, HTHSEC, SEC, MIN, or HOUR timekeeping registers to unlock it.

Rev. 0 | Page 98 of 128

ADE7518

Table 106. Peripheral Configuration SFR (PERIPH, 0xF4)

Bit Mnemonic Default Description

7 RXFLAG 0 If this bit is set, indicates that an Rx edge event triggered wake-up from PSM2. 6 VSWSOURCE 1

Indicates the power supply that is connected internally to V

. If this bit is cleared, V

SWOUT

= V

BAT

. 5 VDD_OK 1 If this bit is set, indicates that VDD power supply is acceptable for operation. 4 PLL_FLT 0 If this bit is set, indicates that PLL is not locked. 3 REF_BAT_EN 0 If this bit is set, the internal voltage reference is enabled in PSM2 mode. 2 Reserved 0 This bit should be kept to zero. 1 to 0 RXPROG[1:0] 00 Controls the function of the P1.0/RxD pin.

RXPROG[1:0] Result

00 GPIO 01 Rx with wake-up disabled 11 Rx with wake-up enabled

Table 107. Start ADC Measurement SFR (ADCGO, 0xD8)

Bit Address Mnemonic Default Description

7 0xDF PLL_FTL_ACK 0

Set this bit to clear the PLL fault bit, PLL_FLT in the PERIPH register. A PLL fault is generated if a reset was caused because the PLL lost lock.

6 to 0 0xDE to 0xD8 Reserved 0 Reserved.

. If this bit is set, V

SWOUT

Rev. 0 | Page 99 of 128

ADE7518

REAL-TIME CLOCK

The ADE7518 has an embedded real-time clock (RTC), as shown in Figure 88. The external 32.768 kHz crystal is used as the clock source for the RTC. Calibration is provided to compensate the nominal crystal frequency and for variations in the external crystal frequency over temperature. By default, the RTC is maintained active in all power saving modes. The RTC counters retain their values through watchdog resets and external resets. They are only reset during a power-on reset.

CALIBRATED

32.768kHz

32.768kHz CRYSTAL

RTCEN

RTCCOMP

CALIBRATION

TEMPCAL

RTC REGISTERS

Note that all the real-time clock SFRs are not bit addressable.

Table 108. Real-Time Clock SFR

SFR Address Description

TIMECON 0xA1 RTC Configuration (see Table 109). HTHSEC 0xA2

SEC 0xA3 Seconds Counter (see Table 111). MIN 0xA4 Minutes Counter (see Table 112). HOUR 0xA5 Hours Counter (see Table 113). INTVAL 0xA6 Alarm Interval (see Table 114). RTCCOMP 0xF6

TEMPCAL 0xF7

Hundredths of a Second Counter (see Table 110).

RTC Nominal Compensation (see Table 115).

RTC Temperature Compensation (see Table 116).

8-BIT

PRESCALER

HUNDREDTHS COUNTER

HTHSEC

SECONDS COUNTER

SEC

MINUTES COUNT ER

MIN

HOURS COUNTER

HOUR

8-BIT

INTERVAL CO UNTER

INTVAL SFR

Figure 88. RTC Implementation

ITS1 ITS0

INTERVAL

TIMEBASE

SELECTION

MUX

MIDNIGHT EVENT

EQUAL?

ALARM EVENT

ITEN

Protecting the RTC from Runaway Code

To protect the RTC from runaway code, a key must be written to the KYREG register to obtain write access to the Interrupt Pins Configuration SFR (INTPR, 0xFF), Hundredths of a Second Counter SFR (HTHSEC, 0xA2), Seconds Counter SFR (SEC, 0xA3), Minutes Counter SFR (MIN, 0xA4), and Hours Counter SFR (HOUR, 0xA5). KYREG should be set to 0xEA to unlock it and reset it to zero after a timekeeping register is written to. The RTC registers can be written using the following 8052 assembly code:

MOV KYREG,#0EAh MOV INTPR,#080h

07327-088

Rev. 0 | Page 100 of 128

Datasheet ADE7518 Datasheet (ANALOG DEVICES)

Specifications and Main Features

Frequently Asked Questions

User Manual

GENERAL FEATURES

ENERGY MEASUREMENT FEATURES

MICROPROCESSOR FEATURES

TABLE OF CONTENTS

REVISION HISTORY

GENERAL DESCRIPTION

FUNCTIONAL BLOCK DIAGRAM

SPECIFICATIONS

ENERGY METERING

ANALOG PERIPHERALS

DIGITAL INTERFACE

TIMING SPECIFICATIONS

ABSOLUTE MAXIMUM RATINGS

THERMAL RESISTANCE

ESD CAUTION

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

TYPICAL PERFORMANCE CHARACTERISTICS

TERMINOLOGY

SFR MAPPING

POWER MANAGEMENT

POWER MANAGEMENT REGISTER DETAILS

Writing to the Interrupt Pins Configuration SFR (INTPR, 0xFF)

Clearing the Scratch Pad Registers (SCRATCH1, 0xFB to SCRATCH4, 0xFE)

Writing to the Power Control SFR (POWCON, 0xC5)

POWER SUPPLY ARCHITECTURE

BATTERY SWITCHOVER

POWER SUPPLY MANAGEMENT (PSM) INTERRUPT

Battery Switchover and Power Supply Restored PSM Interrupt

SAG Monitor PSM Interrupt

USING THE POWER SUPPLY FEATURES

OPERATING MODES

PSM0 (NORMAL MODE)

PSM1 (BATTERY MODE)

PSM2 (SLEEP MODE)

3.3 V PERIPHERALS AND WAKE-UP EVENTS

TRANSITIONING BETWEEN OPERATING MODES

Automatic Battery Switchover (PSM0 to PSM1)

Entering Sleep Mode (PSM1 to PSM2)

Servicing Wake-Up Events (PSM2 to PSM1)

Automatic Switch to VDD (PSM2 to PSM0)

Automatic Switch to VDD (PSM1 to PSM0)

USING THE POWER MANAGEMENT FEATURES

ENERGY MEASUREMENT

ACCESS TO ENERGY MEASUREMENT SFRs

ACCESS TO INTERNAL ENERGY MEASUREMENT REGISTERS

Writing to the Internal Energy Measurement Registers

Reading the Internal Energy Measurement Registers

ENERGY MEASUREMENT REGISTERS

ENERGY MEASUREMENT INTERNAL REGISTERS DETAILS

INTERRUPT STATUS/ENABLE SFRS

ANALOG INPUTS

ANALOG-TO-DIGITAL CONVERSION

Antialiasing Filter

ADC Transfer Function

Current Channel ADC

Voltage Channel ADC

Channel Sampling

POWER QUALITY MEASUREMENTS

Zero-Crossing Detection

Zero-Crossing Timeout

Period or Frequency Measurements

Line Voltage SAG Detection

SAG Level Set

Peak Detection

Peak L evel Set

Peak Level Record

PHASE COMPENSATION

RMS CALCULATION

Current Channel RMS Calculation

Current Channel RMS Offset Compensation

Voltage Channel RMS Calculation

Voltage Channel RMS Offset Compensation

ACTIVE POWER CALCULATION

Active Power Gain Calibration

Active Power Offset Calibration

Active Power Sign Detection