Fully specified rail to rail at V
Input common-mode voltage from −0.2 V to V
Low glitch LVDS-compatible output stage
1.6 ns propagation delay
37 mW at 2.5 V
Shutdown pin
Single-pin control for programmable hysteresis and latch
Power supply rejection > 60 dB
−40°C to +125°C operation
APPLICATIONS
High speed instrumentation
Clock and data signal restoration
Logic level shifting or translation
Pulse spectroscopy
High speed line receivers
Threshold detection
Peak and zero-crossing detectors
High speed trigger circuitry
Pulse-width modulators
Current-/voltage-controlled oscillators
Automatic test equipment (ATE)
= 2.5 V to 5.5 V
CCI
+ 0.2 V
CCI
Single-Supply LVDS Comparators
ADCMP604/ADCMP605
FUNCTIONAL BLOCK DIAGRAM
CCO
(ADCMP605 ONLY)
LVDS
DN
INPUT
(ADCMP605
Q OUTPUT
Q OUTPUT
ONLY)
NONINVERTING
P
V
INVERTING
N
INPUT
INPUT
V
CCI
ADCMP604/
ADCMP605
Figure 1.
LE/HYS INPUT
S
05916-001
GENERAL DESCRIPTION
The ADCMP604/ADCMP605 are very fast comparators
fabricated on the Analog Devices, Inc. proprietary XFCB2
process. These comparators are exceptionally versatile and easy
to use. Features include an input range from V
0.2 V, low noise, LVDS-compatible output drivers, and
TTL/CMOS latch inputs with adjustable hysteresis and/or shutdown inputs.
The devices offer 1.5 ns propagation delays with 1 ps rms
random jitter (RJ). Overdrive and slew rate dispersion are
typically less than 50 ps.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
− 0.5 V to V
EE
CCI
+
A flexible power supply scheme allows the devices to operate
with a single 2.5 V positive supply and a −0.5 V to +2.7 V input
signal range up to a 5.5 V positive supply with a −0.5 V to +5.7 V
input signal range. Split input/output supplies, with no sequencing
restrictions on the ADCMP605, support a wide input signal
range with greatly reduced power consumption.
The LVDS-compatible output stage is designed to drive any
standard LVDS input. The comparator input stage offers robust
protection against large input overdrive, and the outputs do not
phase reverse when the valid input signal range is exceeded. High
speed latch and programmable hysteresis features are also provided
in a unique single-pin control option.
The ADCMP604 is available in a 6-lead SC70 package, and the
ADCMP605 is available in a 12-lead LFCSP.
Voltage Range VP, V
Common-Mode Range V
Differential Voltage V
Offset Voltage V
Bias Current IP, I
Offset Current −2.0 +2.0 μA
Capacitance CP, C
Resistance, Differential Mode −0.1 V to V
Resistance, Common Mode −0.5 V to V
Active Gain A
Common-Mode Rejection Ratio CMRR
V
Hysteresis R
LATCH ENABLE PIN CHARACTERISTICS (ADCMP605 ONLY )
V
V
I
IH
I
IL
HYSTERESIS MODE AND TIMING (ADCMP605 ONLY)
Hysteresis Mode Bias Voltage Current sink −1 μA 1.145 1.25 1.40 V
Minimum Resistor Value Hysteresis = 120 mV 30 110 kΩ
Hysteresis Current Hysteresis = 120 mV −25 −8 μA
Latch Setup Time t
Latch Hold Time t
Latch-to-Output Delay t
Latch Minimum Pulse Width t
SHUTDOWN PIN CHARACTERISTICS (ADCMP605 ONLY)
V
V
I
IH
I
IL
Sleep Time t
Wake-Up Time t
DC OUTPUT CHARACTERISTICS V
V
Differential Output Voltage Level V
ΔV
Common-Mode Voltage V
Peak-to-Peak Common-Mode Output V
= 2.5 V, TA = −40°C to +125°C, typical at TA = 25 °C, unless otherwise noted.
CCO
V
N
OS
N
N
V
IH
IL
Hysteresis is shut off 2.0 V
Latch mode guaranteed −0.2 +0.4 +0.8 V
V
V
S
H
, t
PLOH
PLOLVOD
PL
IH
IL
Comparator is operating 2.0 V
Shutdown guaranteed −0.2 +0.4 +0.6 V
V
V
V
Propagation Delay Skew—Rising to Falling Transition t
Propagation Delay Skew—Q to QB V
Overdrive Dispersion 10 mV < VOD < 125 mV 1.6 ns
Common-Mode Dispersion VCM = −0.2 V to V
Input Bandwidth 500 MHz
Minimum Pulse Width PW
POWER SUPPLY
Input Supply Voltage Range V
Output Supply Voltage Range V
Positive Supply Differential (ADCMP605) V
V
Positive Supply Current (ADCMP604) I
Input Section Supply Current (ADCMP605) I
Output Section Supply Current (ADCMP605) I
Power Dissipation P
V
Power Supply Rejection Ratio PSRR V
Shutdown Mode I
Shutdown Mode I
1
VIN = 100 mV square input at 50 MHz, VOD = 50 mV, VCM = 1.25 V, V
1
V
CCI
CCO
F
PD
PINSKEW
MIN
CCI
CCO
− V
CCI
− V
CCI
VCCI/V CCO
VCCI
VCCO
D
V
= V
CCI
CCO
10% to 90% 600 ps
V
= V
CCI
= 50 mV
V
OD
= V
CCI
V
= V
CCI
= V
CCI
V
= V
CCI
PW
OUT
= 2.5 V to 5.0 V,
CCO
= 2.5 V, VOD = 10 mV 3.0 ns
CCO
= 2.5 V to 5.0 V 70 ps
CCO
= 2.5 V to 5.0 V 70 ps
CCO
+ 0.2 V 250 ps
CCI
= 2.5 V to 5.0 V,
CCO
= 90% of PW
IN
1.6 ns
1.3 ns
2.5 5.5 V
2.5 5.0 V
Operating −3 +3 V
CCO
Nonoperating −5.0 +5.0 V
CCO
V
= V
CCI
V
CCI
V
CCO
V
CCI
CCI
CCI
CCI
CCI
= 2.5 V, unless otherwise noted.
= 2.5 V to 5.0 V 15 21 mA
CCO
= 2.5 V to 5.5 V 1.6 3.0 mA
= 2.5 V to 5.0 V 15 23 mA
= V
= 2.5 V 37 55 mW
CCO
= V
= 5.0 V 95 120 mW
CCO
= V
= 2.5 V to 5.0 V −50 dB
CCO
= V
= 2.5 V to 5.0 V 0.92 1.1 mA
CCO
= V
= 2.5 V to 5.0 V −30 +30 μA
CCO
Rev. A | Page 4 of 16
ADCMP604/ADCMP605
TIMING INFORMATION
Figure 2 illustrates the ADCMP604/ADCMP605 latch timing relationships. Tabl e 2 provides definitions of the terms shown in Figure 2.
1.1V
LATCH ENABLE
t
S
V
DIFFERENT IAL
INPUT VOLTAGE
Q OUTPUT
Q OUTPUT
IN
V
OD
t
PDL
t
PDH
Figure 2. System Timing Diagram
Table 2. Timing Descriptions
Symbol Timing Description
t
PDH
Input-to-Output High Delay
Propagation delay measured from the time the input signal crosses the reference (± the
input offset voltage) to the 50% point of an output low-to-high transition.
t
PDL
Input-to-Output Low Delay
Propagation delay measured from the time the input signal crosses the reference (± the
input offset voltage) to the 50% point of an output high-to-low transition.
t
PLOH
Latch Enable-to-Output High Delay
Propagation delay measured from the 50% point of the latch enable signal low-to-high
transition to the 50% point of an output low-to-high transition.
t
PLOL
Latch Enable-to-Output Low Delay
Propagation delay measured from the 50% point of the latch enable signal low-to-high
transition to the 50% point of an output high-to-low transition.
t
H
Minimum Hold Time
Minimum time after the negative transition of the latch enable signal that the input
signal must remain unchanged to be acquired and held at the outputs.
t
PL
t
S
Minimum Latch Enable Pulse Width Minimum time that the latch enable signal must be high to acquire an input signal change.
Minimum Setup Time
Minimum time before the negative transition of the latch enable signal occurs that an
input signal change must be present to be acquired and held at the outputs.
t
R
Output Rise Time
Amount of time required to transition from a low to a high output as measured at the
20% and 80% points.
t
F
Output Fall Time
Amount of time required to transition from a high to a low output as measured at the
20% and 80% points.
V
OD
Voltage Overdrive Difference between the input voltages, VA and VB. B
t
PL
t
H
± V
V
N
OS
t
PLOH
50%
t
F
50%
t
PLOL
t
R
05916-025
Rev. A | Page 5 of 16
ADCMP604/ADCMP605
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
Supply Voltages
Input Supply Voltage (V
Output Supply Voltage (V
Positive Supply Differential (V
to GND) −0.5 V to +6.0 V
CCI
to GND) −0.5 V to +6.0 V
CCO
− V
CCI
) −6.0 V to +6.0 V
CCO
Input Voltages
Input Voltage −0.5 V to V
Differential Input Voltage ±(V
CCI
CCI
+ 0.5 V)
+ 0.5 V
Maximum Input/Output Current ±50 mA
Shutdown Control Pin
Applied Voltage (SDN to GND) −0.5 V to V
+ 0.5 V
CCO
Maximum Input/Output Current ±50 mA
Latch/Hysteresis Control Pin
Applied Voltage (HYS to GND) −0.5 V to V
+ 0.5 V
CCO
Maximum Input/Output Current ±50 mA
Output Current ±50 mA
Temperature
Operating Temperature Range, Ambient −40°C to +125°C
Operating Temperature, Junction 150°C
Storage Temperature Range −65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5. ADCMP604 Pin Function Descriptions (6-Lead SC70)
Pin No. Mnemonic Description
1 Q
2 V
3 V
4 V
5 V
6
EE
P
N
CCI/VCCO
QInverting Output. Q is at logic low if the analog voltage at the noninverting input, VP, is greater than the analog
Noninverting Output. Q is at logic high if the analog voltage at the noninverting input, V
analog voltage at the inverting input, V
N
Negative Supply Voltage.
Noninverting Analog Input.
Inverting Analog Input.
Input Section Supply/Output Section Supply. V
voltage at the inverting input, VN.
V
1
CCO
CCI
V
EE
ADCMP605
2
3
TOP VIEW
(Not to Scale)
V
.
12 Q
11 VEE10 Q
PIN 1
INDICATOR
6
5
4
CCI
Q
V
CCI/VCCO
V
N
and V
9 V
8 LE/HYS
7 S
05916-002
are shared pin.
CCO
EE
DN
, is greater than the
P
4
5
6
P
N
EE
V
V
V
05916-003
Figure 4. ADCMP605 Pin Configuration
Table 6. ADCMP605 Pin Function Descriptions (12-Lead LFCSP_VQ)
Pin No. Mnemonic Description
1 V
2 V
3, 5, 9, 11 V
4 V
6 V
7 S
CCO
CCI
EE
P
N
DN
Output Section Supply.
Input Section Supply.
Negative Supply Voltages.
Noninverting Analog Input.
Inverting Analog Input.
Shutdown. Drive this pin low to shut down the device.
8 LE/HYS Latch/Hysteresis Control. Bias with resistor or current for hysteresis; drive low to latch.
10
QInverting Output. Q is at Logic low if the analog voltage at the noninverting input, VP, is greater than
the analog voltage at the inverting input, VN, if the comparator is in compare mode.
12 Q
Heat Sink Paddle V
EE
Noninverting Output. Q is at Logic high if the analog voltage at the noninverting input, V
than the analog voltage at the inverting input, V
, if the comparator is in compare mode.
N
The metallic back surface of the package is electrically connected to VEE. It can be left floating
because Pin 3, Pin 5, Pin 9, and Pin 11 provide adequate electrical connection. It can also be
soldered to the application board if improved thermal and/or mechanical stability is desired.
, is greater
P
Rev. A | Page 7 of 16
ADCMP604/ADCMP605
TYPICAL PERFORMANCE CHARACTERISTICS
V
= V
CCI
= 2.5 V, TA = 25°C, unless otherwise noted.
CCO
800
1.60
600
400
200
0
–200
CURRENT (µA)
–400
–600
–800
–1012345 6 7
LE/HYS PIN (V)
VCC = 5.5VVCC = 2.5V
Figure 5. LE/HYS Pin Current vs. Voltage
200
150
100
VCC = 5.5VVCC = 2.5V
50
0
CURRENT (µA)
–50
–100
–150
–101234567
Figure 6. S
SDN PIN (V)
Pin Current vs. Voltage
DN
10
8
6
4
2
0
(µA)
B
I
–2
–4
–6
–8
–10
–1.0 –0.50.00.51.01.52.02.53.03.5
AT VCC = 2.5V
V
CM
+125°C
+25°C
–40°C
Figure 7. Input Bias Current vs. Input Common-Mode Voltage
Figure 13. Propagation Delay vs. Input Common-Mode Voltage
925.0mV1.000ns/DI V
05916-004
Figure 15. 50 MHz Output Voltage Waveform at V
CCO
= 2.5 V
05916-014
1.543V
1.043V1.000n s/DIV
05916-005
Figure 16. 50 MHz Output Voltage Waveform at V
Q
Q
05916-015
= 5.5 V
CCO
Rev. A | Page 9 of 16
ADCMP604/ADCMP605
APPLICATION INFORMATION
POWER/GROUND LAYOUT AND BYPASSING
The ADCMP604/ADCMP605 comparators are very high speed
devices. Despite the low noise output stage, it is essential to use
proper high speed design techniques to achieve the specified
performance. Because comparators are uncompensated amplifiers,
feedback in any phase relationship is likely to cause oscillations
or undesired hysteresis. The use of low impedance supply
planes is of critical importance particularly the output supply
plane (V
planes are recommended as part of a multilayer board.
Providing the lowest inductance return path for switching
currents ensures the best possible performance in the target
application.
It is also important to adequately bypass the input and output
supplies. Multiple high quality 0.01 μF bypass capacitors should
be placed as close as possible to each of the V
pins and should be connected to the GND plane with redundant
vias. At least one of these should be placed to provide a physically
short return path for output currents flowing back from ground
to the V
should be carefully selected for minimum inductance and ESR.
Parasitic layout inductance should also be strictly controlled to
maximize the effectiveness of the bypass at high frequencies.
If the package allows, and the input and output supplies have
been connected separately (V
of these supplies separately to the GND plane. Do not connect a
bypass capacitor between these supplies. It is recommended that
the GND plane separate the V
circuit board layout is designed to minimize coupling between
the two supplies to take advantage of the additional bypass
capacitance from each respective supply to the ground plane.
This enhances the performance when split input/output supplies
are used. If the input and output supplies are connected together
for single-supply operation (V
two supplies is unavoidable; however, careful board placement
can help keep output return currents away from the inputs.
) and the ground plane (GND). Individual supply
CCO
and V
CCI
pin and the V
CCI
pin. High frequency bypass capacitors
CCO
≠ V
CCI
CCI
CCI
), be sure to bypass each
CCO
and V
= V
planes when the
CCO
), coupling between the
CCO
CCO
supply
LVDS-COMPATIBLE OUTPUT STAGE
Specified propagation delay dispersion performance is only
achieved by keeping parasitic capacitive loads at or below the
specified minimums. The outputs of the ADCMP604 and
ADCMP605 are designed to directly drive any standard LVDScompatible input.
USING/DISABLING THE LATCH FEATURE
The latch input is designed for maximum versatility. It can
safely be left floating or it can be driven low by any standard
TTL/CMOS device as a high speed latch. In addition, the pin
can be operated as a hysteresis control pin with a bias voltage of
1.25 V nominal and an input resistance of approximately
70 kΩ. This allows the comparator hysteresis to be easily
controlled by either a resistor or an inexpensive CMOS DAC.
Driving this pin high or floating the pin disables all hysteresis.
Hysteresis control and latch mode can be used together if an
open drain, an open collector, or a three-state driver is connected in
parallel to the hysteresis control resistor or current source.
Due to the programmable hysteresis feature, the logic threshold
of the latch pin is approximately 1.1 V, regardless of V
CCO
.
OPTIMIZING PERFORMANCE
As with any high speed comparator, proper design and layout
techniques are essential for obtaining the specified performance.
Stray capacitance, inductance, inductive power and ground
impedances, or other layout issues can severely limit performance
and often cause oscillation. Large discontinuities along input
and output transmission lines can also limit the specified pulsewidth dispersion performance. The source impedance should
be minimized as much as is practicable. High source impedance,
in combination with the parasitic input capacitance of the
comparator, causes an undesirable degradation in bandwidth at
the input, thus degrading the overall response. Thermal noise
from large resistances can easily cause extra jitter with slowly
slewing input signals. Higher impedances encourage undesired
coupling.
Rev. A | Page 10 of 16
ADCMP604/ADCMP605
COMPARATOR PROPAGATION DELAY
DISPERSION
The ADCMP604/ADCMP605 comparators are designed to
reduce propagation delay dispersion over a wide input overdrive
range of 5 mV to V
variation in propagation delay that results from a change in the
degree of overdrive or slew rate (how far or how fast the input
signal is driven past the switching threshold).
Propagation delay dispersion is a specification that becomes
important in high speed, time-critical applications, such as data
communications, automatic test and measurement, and instrumentation. It is also important in event-driven applications, such
as pulse spectroscopy, nuclear instrumentation, and medical
imaging. Dispersion is defined as the variation in propagation
delay as the input overdrive conditions are changed (see
and
Figure 18).
The ADCMP604/ADCMP605 dispersion is typically <1.6 ns as
the overdrive varies from 10 mV to 125 mV. This specification
applies to both positive and negative signals because each of
the ADCMP604 and ADCMP605 has substantially equal delays
for positive-going and negative-going inputs and very low
output skews.
− 1 V. Propagation delay dispersion is the
CCI
Figure 17
500mV OVERDRIVE
COMPARATOR HYSTERESIS
The addition of hysteresis to a comparator is often desirable in a
noisy environment, or when the differential input amplitudes
are relatively small or slow moving. The transfer function for a
comparator with hysteresis is shown in
voltage approaches the threshold (0 V, in this example) from
below the threshold region in a positive direction, the comparator
switches from low to high when the input crosses +V
new switching threshold becomes −V
in the high state until the threshold, −V
below the threshold region in a negative direction. In this manner,
noise or feedback output signals centered on 0 V input cannot
cause the comparator to switch states unless it exceeds the region
bounded by ±V
H
/2.
OUTPUT
V
V
OL
Figure 19. As the input
/2. The comparator remains
H
/2, is crossed from
H
OH
/2. The
H
INPUT VOLTAGE
10mV OVERDRIVE
± V
V
N
–V
2
Figure 19. Comparator Hysteresis Transfer Function
OS
The customary technique for introducing hysteresis into a
0V
H
INPUT
+V
H
2
05916-018
comparator uses positive feedback from the output back to
the input. One limitation of this approach is that the amount
DISPERSION
Q/Q OUTPUT
Figure 17. Propagation Delay—Overdrive Dispersion
05916-016
INPUT VOLTAGE
10V/ns
1V/ns
V
± V
N
OS
of hysteresis varies with the output logic levels, resulting in
hysteresis that is not symmetric about the threshold. The
external feedback network can also introduce significant
parasitics that reduce high speed performance and induce
oscillation in some cases.
The ADCMP605 comparator offers a programmable hysteresis
feature that significantly improves accuracy and stability.
Connecting an external pull-down resistor or a current source
from the LE/HYS pin to GND varies the amount of hysteresis
in a predictable and stable manner. Leaving the LE/HYS
pin disconnected or driving it high removes hysteresis. The
DISPERSIO N
Q/Q OUTPUT
Figure 18. Propagation Delay—Slew Rate Dispersion
05916-017
maximum hysteresis that can be applied using this pin is
approximately 160 mV.
hysteresis applied as a function of external resistor value.
Figure 20 illustrates the amount of
Figure 11
illustrates hysteresis as a function of current.
Rev. A | Page 11 of 16
ADCMP604/ADCMP605
The hysteresis control pin appears as a 1.25 V bias voltage
seen through a series resistance of 70 kΩ ± 20% throughout the
hysteresis control range. The advantages of applying hysteresis
in this manner are improved accuracy, improved stability, reduced
component count, and maximum versatility. An external bypass
capacitor is not recommended on the HYS pin because it would
likely degrade the jitter performance of the device and impair the
latch function. As described in the
Feature
section, hysteresis control need not compromise the
Using/Disabling the Latch
latch function.
250
200
150
100
HYSTERESIS (mV)
50
0
50100150200250300350400450500
VCC = 2.5V
VCC = 5.5V
HYSTERESIS RESISTOR (kΩ)
Figure 20. Hysteresis vs. R
Control Resistor
HYS
05916-026
CROSSOVER BIAS POINTS
Rail-to-rail inputs of this type, in both op amps and comparators,
have a dual front-end design. Certain devices are active near
the V
rail and others are active near the VEE rail. At some pre-
CCI
determined point in the common-mode range, a crossover
occurs. At this point, normally V
/2, the direction of the bias
CCI
current reverses and there are changes in measured offset
voltages and currents.
MINIMUM INPUT SLEW RATE REQUIREMENT
With the rated load capacitance and normal good PCB design
practice, as discussed in the
these comparators should be stable at any input slew rate with
no hysteresis. Broadband noise from the input stage is observed
in place of the violent chattering seen with most other high
speed comparators. With additional capacitive loading or poor
bypassing, oscillation is observed. This oscillation is due to the
high gain bandwidth of the comparator in combination with
feedback parasitics in the package and PCB. In many applications,
chattering is not harmful.
Optimizing Performance section,
Rev. A | Page 12 of 16
ADCMP604/ADCMP605
V
V
V
V
V
V
V
V
TYPICAL APPLICATION CIRCUITS
2.5V TO 5
0.1µF
2.5
INPUT
DIGITAL
INPUT
2kΩ
2kΩ
ADCMP604
0.1µF
Figure 21. Self-Biased, 50% Slicer
2.5V TO 3. 3
100ΩLVDSLVDS
ADCMP604
Figure 22. LVDS to Repeater
2.5V TO 5
ADCMP605
74VHC
1G07
150kΩ
LE/HYS
CMOS
OUTPUT
LVDS
ADCMP604
INPUT
05916-019
1.25V
±50m
INPUT
1.25V
REF
10kΩ
10kΩ
PWM
OUTPUT
ADCMP601
10kΩ
05916-020
82pF
LE/HYS
100kΩ
05916-023
Figure 25. Oscillator and Pulse-Width Modulator
2.5V TO 5
ADCMP605
DIGITAL
INPUT
74AHC
1G07
LE/HYS
CONTROL
VOLTAGE
0V TO 2.5V
150kΩ
Figure 23. Hysteresis Adjustment with Latch
2.5
10kΩ
82pF
ADCMP605
LE/HYS
CONTROL
VOLTAGE
0V TO 2.5
150kΩ
10kΩ
150kΩ
LVDS
OUTPUT
05916-021
05916-022
HYSTERESIS
CURRENT
10kΩ
Figure 26. Hysteresis Adjustment with Latch
05916-024
Figure 24. Voltage-Controlled Oscillator
Rev. A | Page 13 of 16
ADCMP604/ADCMP605
OUTLINE DIMENSIONS
2.20
2.00
1.80
2.40
1.35
1.25
1.15
PIN 1
1.30 BSC
1.00
0.90
0.70
0.10 MAX
0.10 COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-203-AB
Figure 27. 6-Lead Thin Shrink Small Outline Transistor Package (SC70)
3.00
BSC SQ
PIN 1
INDICATOR
1.00
0.85
0.80
SEATING
PLANE
12° MAX
TOP
VIEW
0.80 MAX
0.65 TYP
0.30
0.23
0.18
*
COMPLIANT TO JEDEC STANDARDS MO-220-VEED-1
EXCEPT FO R EXPOSED PAD DI MENSION.
Figure 28. 12-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
4 5 6
2.10
3 2 1
1.80
0.65 BSC
0.40
0.10
0.22
0.08
0.30
0.15
1.10
0.80
SEATING
PLANE
(KS-6)
Dimensions shown in millimeters
0.60 MAX
10
9
8
7
6
0.50
BSC
COPLANARITY
0.08
2.75
BSC SQ
0.20 REF
0.45
EXPOSED PAD
(BOTTOM VIEW )
0.05 MAX
0.02 NOM
3 mm × 3 mm Body, Very Thin Quad
(CP-12-1)
Dimensions shown in millimeters
0.46
0.36
0.26
0.75
0.55
0.35
11
12
1
2
3
5
4
PIN 1
INDICATOR
*
1.45
1.30 SQ
1.15
0.25 MIN
ORDERING GUIDE
Package
Model Temperature Range Package Description
ADCMP604BKSZ-R2
1
−40°C to +125°C 6-Lead Thin Shrink Small Outline Transistor Package (SC70) KS-6 G0Q
ADCMP604BKSZ-REEL71−40°C to +125°C 6-Lead Thin Shrink Small Outline Transistor Package (SC70) KS-6 G0Q
ADCMP604BKSZ-RL
ADCMP605BCPZ-WP
ADCMP605BCPZ-R2
ADCMP605BCPZ-R7
EVAL-ADCMP605BCPZ
1
Z = RoHS Compliant Part.
1
1
1
−40°C to +125°C 6-Lead Thin Shrink Small Outline Transistor Package (SC70) KS-6 G0Q
1
−40°C to +125°C 12-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-12-1 G0K
−40°C to +125°C 12-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-12-1 G0K
−40°C to +125°C 12-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-12-1 G0K