−2 V to +3 V input range with +5 V/−5 V supplies
On-chip terminations at both input pins
Resistor-programmable hysteresis
Differential latch control
Power supply rejection > 70 dB
APPLICATIONS
Automatic test equipment (ATE)
High speed instrumentation
Pulse spectroscopy
Medical imaging and diagnostics
High speed line receivers
Threshold detection
Peak and zero-crossing detectors
High speed trigger circuitry
Clock and data signal restoration
Voltage Comparators
ADCMP580/ADCMP581/ADCMP582
FUNCTIONAL BLOCK DIAGRAM
CCI
V
TERMINATION
TP
NONINVERTI NG
P
V
N
VTN TERMINATION
INVERTING
INPUT
INPUT
ADCMP580/
ADCMP581/
ADCMP582
V
EE
Figure 1.
CML/ECL/
PECL
LE INPUT
LE INPUTHYS
V
CCO
Q OUTPUT
Q OUTPUT
V
EE
04672-001
GENERAL DESCRIPTION
The ADCMP580/ADCMP581/ADCMP582 are ultrafast voltage
comparators fabricated on the Analog Devices, Inc. proprietary
XFCB3 Silicon Germanium (SiGe) bipolar process. The
ADCMP580 features CML output drivers, the ADCMP581
features reduced swing ECL (negative ECL) output drivers, and
the ADCMP582 features reduced swing PECL (positive ECL)
output drivers.
All three comparators offer 180 ps propagation delay and 100 ps
um pulse width for 10 Gbps operation with 200 fs random
minim
jitter (RJ). Overdrive and slew rate dispersion are typically less
than 15 ps.
The ±5 V power supplies enable a wide −2 V to +3 V input
ra
nge with logic levels referenced to the CML/NECL/PECL
outputs. The inputs have 50 Ω on-chip termination resistors
with the optional capability to be left open (on an individual
pin basis) for applications requiring high impedance input.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
The CML output stage is designed to directly drive 400 mV into
50
Ω transmission lines terminated to ground. The NECL output
stages are designed to directly drive 400 mV into 50 Ω terminated
to −2 V. The PECL output stages are designed to directly drive
400 mV into 50 Ω terminated to V
− 2 V. High speed latch
CCO
and programmable hysteresis are also provided. The differential
latch input controls are also 50 Ω terminated to an independent
V
pin to interface to either CML or ECL or to PECL logic.
TT
The ADCMP580/ADCMP581/ADCMP582 are available in a
16-lead LFCS
Input Voltage Range VP, V
Input Differential Range −2.0 +2.0 V
Input Offset Voltage V
Offset Voltage Temperature Coefficient ΔVOS/d
Input Bias Current IP, I
Input Bias Current Temperature Coefficient ΔIB/d
Input Offset Current +2 ±5.0 μA
Input Resistance 47 to 53 Ω
Input Resistance, Differential Mode Open termination 50 kΩ
Input Resistance, Common Mode Open termination 500 kΩ
Active Gain A
Common-Mode Rejection Ratio CMRR VCM = −2.0 V to +3.0 V 60 dB
Hysteresis R
LATCH ENABLE CHARACTERISTICS
Latch Enable Input Impedance Z
Latch-to-Output Delay t
Latch Minimum Pulse Width t
ADCMP580 (CML)
Latch Enable Input Range −0.8 0 V
Latch Enable Input Differential 0.2 0.4 0.5 V
Latch Setup Time t
Latch Hold Time t
ADCMP581 (NECL)
Latch Enable Input Range −1.8 +0.8 V
Latch Enable Input Differential 0.2 0.4 0.5 V
Latch Setup Time t
Latch Hold Time t
ADCMP582 (PECL)
Latch Enable Input Range V
Latch Enable Input Differential 0.2 0.4 0.5 V
Latch Setup Time t
Latch Hold Time t
DC OUTPUT CHARACTERISTICS
ADCMP580 (CML)
Output Impedance Z
Output Voltage High Level V
Output Voltage Low Level V
Output Voltage Differential 50 Ω to GND 340 395 450 mV
ADCMP581 (NECL)
Output Voltage High Level V
Output Voltage High Level V
Output Voltage High Level V
Output Voltage Low Level V
Output Voltage Low Level V
Output Voltage Low Level V
Output Voltage Differential 50 Ω to −2.0 V 340 395 450 mV
= 3.3 V; TA = 25°C, unless otherwise noted.
CCO
−2.0 +3.0 V
N
OS
N
V
IN
PLOH
PL
S
H
S
H
S
H
OUT
OH
OL
OH
OH
OH
OL
OL
OL
−10.0 ±4 +10.0 mV
10 μV/°C
T
Open termination 15 30.0 μA
50 nA/°C
T
48 dB
= ∞ 1 mV
HYS
Each pin, VTT at ac ground 47 to 53 Ω
, t
PLOLVOD
= 200 mV 175 ps
VOD = 200 mV 100 ps
VOD = 200 mV 95 ps
VOD = 200 mV −90 ps
VOD = 200 mV 70 ps
VOD = 200 mV −65 ps
VOD = 200 mV 30 ps
VOD = 200 mV −25 ps
50 Ω
50 Ω to GND −0.10 0 +0.03 V
50 Ω to GND −0.50 −0.40 −0.35 V
50 Ω to −2 V, TA = 125°C −0.99 −0.87 −0.75 V
50 Ω to −2 V, TA = 25°C −1.06 −0.94 −0.82 V
50 Ω to −2 V, TA = −55°C −1.11 −0.99 −0.87 V
50 Ω to −2 V, TA = 125°C −1.43 −1.26 −1.13 V
50 Ω to −2 V, TA = 25°C −1.50 −1.33 −1.20 V
50 Ω to −2 V, TA = −55°C −1.55 −1.38 −1.25 V
− 1.8 V
CCO
− 0.8 V
CCO
Rev. A | Page 3 of 16
ADCMP580/ADCMP581/ADCMP582
www.BDTIC.com/ADI
Parameter Symbol Condition Min Typ Max Unit
ADCMP582 (PECL) V
Output Voltage High Level V
Output Voltage High Level V
Output Voltage High Level V
Output Voltage Low Level V
Output Voltage Low Level V
Output Voltage Low Level V
OH
OH
OH
OL
OL
OL
Output Voltage Differential 50 Ω to V
AC PERFORMANCE
Propagation Delay t
Propagation Delay Temperature Coefficient ΔtPD/d
Propagation Delay Skew—Rising
Toggle Rate >50% output swing 12.5 Gbps
Deterministic Jitter DJ
Deterministic Jitter DJ
RMS Random Jitter RJ VOD = 200 mV, 5 V/ns, 1.25 GHz 0.2 ps
Minimum Pulse Width PW
Minimum Pulse Width PW
Rise/Fall Time tR, t
MIN
MIN
F
POWER SUPPLY
Positive Supply Voltage V
Negative Supply Voltage V
CCI
EE
ADCMP580 (CML)
Positive Supply Current I
Negative Supply Current I
Power Dissipation P
VCCI
VEE
D
ADCMP581 (NECL)
Positive Supply Current I
Negative Supply Current I
Power Dissipation P
VCCI
VEE
D
ADCMP582 (PECL)
Logic Supply Voltage V
Input Supply Current I
Output Supply Current I
Negative Supply Current I
Power Dissipation P
Power Supply Rejection (V
) PSR
CCI
Power Supply Rejection (VEE) PSR
Power Supply Rejection (V
1
Equivalent input bandwidth assumes a simple first-order input response and is calculated with the following formula: BWEQ = 0.22/(tr
transition time of a quasi-Gaussian input edge applied to the comparator input and tr
) PSR
CCO
CCO
VCCI
VCCO
VEE
D
VCCI
VEE
VCCO
= 3.3 V
CCO
50 Ω to V
50 Ω to V
50 Ω to V
50 Ω to V
50 Ω to V
50 Ω to V
− 2 V, TA = 125°C V
CCO
− 2 V, TA = 25°C V
CCO
− 2 V, TA = −55°C V
CCO
− 2 V, TA = 125°C V
CCO
− 2 V, TA = 25°C V
CCO
− 2 V, TA = −55°C V
CCO
− 2.0 V 340 395 450 mV
CCO
− 0.99 V
CCO
− 1.06 V
CCO
− 1.11 V
CCO
− 1.43 V
CCO
− 1.50 V
CCO
− 1.55 V
CCO
− 0.87 V
CCO
− 0.94 V
CCO
− 0.99 V
CCO
− 1.26 V
CCO
− 1.33 V
CCO
− 1.35 V
CCO
− 0.75 V
CCO
− 0.82 V
CCO
− 0.87 V
CCO
− 1.13 V
CCO
− 1.20 V
CCO
− 1.25 V
CCO
VOD = 500 mV 180 ps
0.25 ps/°C
= 500 mV, 5 V/ns 10 ps
OD
0.0 V to 400 mV input,
= tF = 25 ps, 20/80
t
R
= 500 mV, 5 V/ns,
V
OD
31
− 1 NRZ, 5 Gbps
PRBS
= 200 mV, 5 V/ns,
V
OD
31
− 1 NRZ, 10 Gbps
PRBS
8 GHz
15 ps
25 ps
ΔtPD < 5 ps 100 ps
ΔtPD < 10 ps 80 ps
20/80 37 ps
+4.5 +5.0 +5.5 V
−5.5 −5.0 −4.5 V
V
= 5.0 V, 50 Ω to GND 6 8 mA
CCI
VEE = −5.0 V, 50 Ω to GND −50 −40 −34 mA
50 Ω to GND 230 260 mW
V
= 5.0 V, 50 Ω to −2 V 6 8 mA
CCI
VEE = −5.0 V, 50 Ω to −2 V −35 −25 −19 mA
50 Ω to −2 V 155 200 mW
+2.5 +3.3 +5.0 V
V
= 5.0 V, 50 Ω to V
CCI
V
= 5.0 V, 50 Ω to V
CCO
VEE = −5.0 V, 50 Ω to V
50 Ω to V
V
= 5.0 V + 5% −75 dB
CCI
− 2 V 310 350 mW
CCO
− 2 V 6 8 mA
CCO
− 2 V 44 55 mA
CCO
− 2 V −35 −25 −19 mA
CCO
VEE = −5.0 V + 5% −60 dB
V
= 3.3 V + 5% (ADCMP582) −75 dB
CCO
2
2
– tr
is the effective transition time digitized by the comparator.
COMP
COMP
), where trIN is the 20/80
IN
Rev. A | Page 4 of 16
ADCMP580/ADCMP581/ADCMP582
www.BDTIC.com/ADI
TIMING INFORMATION
Figure 2 shows the ADCMP580/ADCMP581/ADCMP582 compare and latch timing relationships. Table 2 provides the definitions of the
terms shown in Figure 2.
LATCH ENABLE
50%
LATCH ENABLE
t
S
t
H
V
DIFFERENTIAL
INPUT VOLTAGE
Q OUTPUT
Q OUTPUT
N
V
OD
t
PDL
t
PDH
Figure 2. Comparator Timing Diagram
Table 2. Timing Descriptions
Symbol Timing Description
t
PDH
Input-to-Output High Delay
Propagation delay measured from the time the i
(± the input offset voltage) to the 50% point of an output low-to-high transition.
t
PDL
Input-to-Output Low Delay
Propagation delay measured from the time the i
(± the input offset voltage) to the 50% point of an output high-to-low transition.
t
PLOH
Latch Enable-to-Output High Delay
Propagation delay measured from the 50% point of the latch enable signal low-to-high
transition to the
t
t
PLOL
H
Latch Enable-to-Output Low Delay
Minimum Hold Time
Propagation delay measured from the 50% point of the latch enable signal low-to-high
ansition to the 50% point of an output high-to-low transition.
tr
Minimum time after the negative transition of the la
signal must remain unchanged to be acquired and held at the outputs.
t
PL
t
S
Minimum Latch Enable Pulse Width Minimum time that the latch enable signal must be high to acquire an input signal change.
Minimum Setup Time
Minimum time before the negative transition of
signal change must be present to be acquired and held at the outputs.
t
R
Output Rise Time
Amount of time required to transition from a
20% and 80% points.
t
F
Output Fall Time
Amount of time required to transition from a high to a low output as measured at the
20% and 80% p
V
N
V
OD
Normal Input Voltage Difference between the input voltages VP and VN for output true.
Voltage Overdrive Difference between the input voltages VP and VN for output false.
t
PL
V
± V
N
t
PLOH
50%
t
F
50%
t
PLOL
t
R
nput signal crosses the reference
nput signal crosses the reference
50% point of an output low-to-high transition.
tch enable signal that the input
the latch enable signal that an input
low to a high output as measured at the
oints.
OS
04672-028
Rev. A | Page 5 of 16
ADCMP580/ADCMP581/ADCMP582
www.BDTIC.com/ADI
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
SUPPLY VOLTAGES
Positive Supply Voltage (V
Negative Supply Voltage (VEE to GND) –6.0 V to +0.5 V
Logic Supply Voltage (V
INPUT VOLTAGES
Input Voltage −3.0 V to +4.0 V
Differential Input Voltage −2 V to +2 V
Input Voltage, Latch Enable −2.5 V to +5.5 V
HYSTERESIS CONTROL PIN
Applied Voltage (HYS to VEE) −5.5 V to +0.5 V
Maximum Input/Output Current 1 mA
OUTPUT CURRENT
ADCMP580 (CML) −25 mA
ADCMP581 (NECL) −40 mA
ADCMP582 (PECL) −40 mA
TEMPERATURE
Operating Temperature Range, Ambient −40°C to +125°C
Operating Temperature, Junction 125°C
Storage Temperature Range −65°C to +150°C
to GND) −0.5 V to +6.0 V
CCI
to GND) −0.5 V to +6.0 V
CCO
Stresses above those listed under Absolute Maximum Ratings
ma
y cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CONSIDERATIONS
The ADCMP580/ADCMP581/ADCMP582 16-lead LFCSP
option has a θ
70°C/W in still air.
(junction-to-ambient thermal resistance) of
JA
ESD CAUTION
Rev. A | Page 6 of 16
ADCMP580/ADCMP581/ADCMP582
www.BDTIC.com/ADI
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
I
CC
EE
GND
HYS
V
V
14
13
15
16
PIN 1
TP
P
N
TN
1V
2V
ADCMP580
3V
4V
(Not to Scale)
INDICATOR
TOP VIEW
5
6
I
LE
CC
12 GND
11 Q
10
Q
9GND
8
7
E
TT
L
V
4672-003
Figure 3. ADCMP580 Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1 V
2 V
3 V
4 V
5, 16 V
6
TP
P
N
TN
CCI
LE
Termination Resistor Return Pin for VP Input.
Noninverting Analog Input.
Inverting Analog Input.
Termination Resistor Return Pin for VN Input.
Positive Supply Voltage.
Latch Enable Input Pin, Inverting Side. In compare mode (LE = low), the output tracks changes at the input of
the comparator. In latch mode (LE
placed into latch mode. LE must be driven in complement with LE.
7 LE
Latch Enable Input Pin, Noninverting Side. In compare mode (LE =
input of the comparator. In latch mode (LE = low), the output reflects the input state just prior to the
comparator being placed into latch mode. LE must be driven in complement with LE
8 V
TT
Termination Return Pin for the LE/LE Input Pins.
For the ADCMP580 (CML output stage), this pin should be c
For the ADCMP581 (ECL output stage), this pin should be c
For the ADCMP582 (PECL output stage), this pin should be connected to the V
9, 12 GND/V
CCO
Digital Ground Pin/Positive Logic Power Supply Terminal.
For the ADCMP580/ADCMP581, this pin should be connected to the GND pin.
For the ADCMP582, this pin should be connected to the positive logic power V
10
Q
Inverting Output. Q is logic low if the analog voltage at the noninverting input, VP, is greater than the analog
voltage at the inverting input, V
(Pin 6 to Pin 7) for more information.
11 Q
Noninverting Output. Q is logic high if the analog v
analog voltage at the inverting input, V
descriptions (Pin 6 to Pin 7) for more information.
13 V
EE
14 HYS
Negative Power Supply.
Hysteresis Control. Leave this pin disconnected for zero hysteresis. Connect this pin to the V
suitably sized resistor to add the desired amount of hysteresis. Refer to Figure 9 for proper sizing of the HYS
h
ysteresis control resistor.
15 GND Analog Ground.
Heat Sink
Paddle
N/C
The metallic back surface of the package is not electrically connected to any part of the circuit. It can be left
floa
ting for optimal electrical isolation between the package handle and the substrate of the die. It can also
be soldered to the application board if improved thermal and/or mechanical stability is desired. Exposed metal
at package corners is connected to the heat sink paddle.
TP
P
N
TN
Figure 4. ADCMP581 Pin Configuration
I
CC
1V
2V
ADCMP581
3V
4V
(Not to Scale)
GND
V
15
16
PIN 1
INDICATOR
TOP VIEW
5
6
I
LE
CC
EE
HYS
V
14
13
12 GND
11 Q
10
Q
9GND
8
7
E
TT
L
V
4672-004
TP
P
N
TN
1V
2V
ADCMP582
3V
4V
(Not to Scale)
CCI
GND
V
15
16
PIN 1
INDIC ATO R
TOP VIEW
5
6
LE
CCI
EE
HYS
V
14
13
12 V
CCO
11 Q
Q
10
9V
CCO
8
7
TT
LE
V
Figure 5. ADCMP582 Pin Configuration
= high), the output reflects the input state just prior to the comparator being
high), the output tracks changes at the
.
onnected to the GND ground.
onnected to the –2 V termination potential.
– 2 V termination potential.
CCO
supply.
CCO
, provided that the comparator is in compare mode. See the LE/LE descriptions
N
oltage at the noninverting input, V
, provided that the comparator is in compare mode. See the LE/LE
N
, is greater than the
P
supply with a
EE
4672-005
Rev. A | Page 7 of 16
ADCMP580/ADCMP581/ADCMP582
–
www.BDTIC.com/ADI
TYPICAL PERFORMANCE CHARACTERISTICS
V
= 5.0 V, VEE = −5.0 V, V
CCI
12
= 3.3 V, TA = 25°C, unless otherwise noted.
CCO
80
10
8
6
4
BIAS CURRENT (µA)
2
0
–4
Figure 6. Bias Current vs. Co
0.8
–0.9
–1.0
–1.1
–1.2
OUTPUT (V)
–1.3
VOH vs. TEMPE RATURE
OUTPUT (NECL)
VOL vs. TEMPE RATURE
OUTPUT (NECL)
VIN COMMON-MO DE BIAS SWEEP
–202
COMMON-MODE (V)
mmon-Mode Voltage
70
60
50
40
30
HYSTERESIS (mV)
20
10
0
4
04672-006
110k
101001k
CONTROL RESISTO R (Ω)
R
HYS
Figure 9. Hysteresis vs. R
Control Resistor
HYS
04672-009
2.5
2.4
VOH vs. TEMPERATURE
2.3
2.2
OUTPUT (V)
2.1
OUTPUT (PECL)
–1.4
–1.5
–55
–54595
Figure 7. ADCMP581 Output V
80
70
60
50
40
30
HYSTERESIS (mV)
20
10
0
0
100200300400500
Figure 8. Hysteresis vs. −IHYST
TEMPERATURE (°C)
oltage vs. Temperature
–IHYST (µ A)
145
600
2.0
1.9
–55
04672-007
–54595
VOL vs. TEMPE RATURE
OUTPUT (PECL)
TEMPERATURE (°C)
145
04672-010
Figure 10. ADCMP582 Output Voltage vs. Temperature
8
7
6
5
4
OFFSET (mV)
3
2
1
0
04672-008
+125°C COMMON-MODE OFFSET SWEEP
+25°C COMMO N-MODE OF FSET SW EEP
–55°C COMMO N-MODE OF FSET SWEEP
–2
Figure 11. A Typical V
02
COMMON-MODE (V)
vs. Common-Mode Voltage
OS
4
04672-011
Rev. A | Page 8 of 16
ADCMP580/ADCMP581/ADCMP582
www.BDTIC.com/ADI
5
4
3
2
1
0
–1
–2
LOT2 CHAR1 RISE
–3
PROPAGATION DELAY ERROR (ps)
LOT2 CHAR1 FALL
LOT3 CHAR1 RISE
–4
LOT3 CHAR1 FALL
–5
–23
–1012
(V)
V
CM
04672-012
45
43
41
39
37
(ps)
35
F
t
/
R
t
33
31
29
27
25
–55
–35–15525456585105
TEMPERATURE (°C)
Q
RISE
Q
RISE
Q
FALL
Q
FALL
125
04672-015
Figure 12. ADCMP580 Propagation Delay Error vs. Common-Mode Voltage
M1
M1
04672-013
Figure 13. ADCMP580 Eye Diagram at 7.5 Gbps
18
16
14
12
10
8
DISPERSIO N (ps)
6
4
2
OD DISPERSION RISE
0
0
50100150200
OVERDRIVE (mV)
OD DISPERSI ON FALL
250
Figure 14. Dispersion vs. Overdrive
Figure 15. ADCMP581 t
vs. Temperature
R/tF
500mV
M1
M1
500mV
20ps/DIV
04672-016
Figure 16. ADCMP582 Eye Diagram at 2.5 Gbps
04672-014
Rev. A | Page 9 of 16
ADCMP580/ADCMP581/ADCMP582
V
V
V
V
V
V
VPV
www.BDTIC.com/ADI
TYPICAL APPLICATION CIRCUITS
GND
V
TP
V
V
IN
P
V
ADCMP580
N
V
TN
LATCH
INPUTS
Figure 17. Zero-Crossing Detector with CML Outputs
TP
V
V
P
N
P
V
ADCMP581
N
V
TN
LATCH
INPUTS
Figure 18. LVDS to a 50 Ω Back-Terminated (RS) ECL Receiver
50Ω50Ω
Q
Q
4672-017
P
N
ADCMP580
1kΩ
V
EE
Figure 21. Disabling the Lat
CML
50Ω
50Ω
ch Feature on the ADCMP580
04672-021
Q
Q
50Ω50Ω
V
TT
4672-018
V
P
N
ADCMP581
= –2V
V
TT
750Ω
V
EE
Figure 22. Disabling the Lat
RSECL
50Ω50Ω
V
TT
ch Feature on the ADCMP581
04672-022
50Ω
CCO
RSPECL
50Ω
– 2V
04672-023
ADCMP580
HYS
0Ω TO 5kΩ
V
EE
Figure 19. Adding Hysteresis
V
IN
TH
+
ADCMP580
–
LATCH
INPUTS
50Ω50Ω
Using the HYS Control
GND
N
04672-019
Figure 23. Disabling the Latch Fe
ADCMP582
750Ω
V
CCO
VTT = V
ature on the ADCMP582
50Ω50Ω
Q
Q
04672-020
Figure 20. Comparator with −2 to +3 V Input Range
Rev. A | Page 10 of 16
ADCMP580/ADCMP581/ADCMP582
www.BDTIC.com/ADI
APPLICATION INFORMATION
POWER/GROUND LAYOUT AND BYPASSING
The ADCMP58x family of comparators is designed for very
high speed applications. Consequently, high speed design
techniques must be used to achieve the specified performance.
It is critically important to use low impedance supply planes,
particularly for the negative supply (V
plane (V
), and the ground plane (GND). Individual supply
CCO
planes are recommended as part of a multilayer board. Providing the lowest inductance return path for the switching currents
ensures the best possible performance in the target application.
It is also important to adequately bypass the input and output
su
pplies. A 1 µF electrolytic bypass capacitor should be placed
within several inches of each power supply pin to ground. In
addition, multiple high quality 0.1 µF bypass capacitors should
be placed as close as possible to each of the V
supply pins and should be connected to the GND plane with
redundant vias. High frequency bypass capacitors should be
carefully selected for minimum inductance and ESR. Parasitic
layout inductance should be strictly avoided to maximize the
effectiveness of the bypass at high frequencies.
ADCMP58x FAMILY OF OUTPUT STAGES
Specified propagation delay dispersion performance is achieved
by using proper transmission line terminations. The outputs of
the ADCMP580 family comparators are designed to directly
drive 400 mV into 50 Ω cable or microstrip/stripline transmission lines terminated with 50 Ω referenced to the proper return.
The CML output stage for the ADCMP580 is shown in the
simplified schematic diagram in
ck-terminated with 50 Ω for best transmission line matching.
ba
The outputs of the ADCMP581/ADCMP582 are illustrated in
Figure 25; they should be terminated to −2 V for ECL outputs of
AD
CMP581 and V
As an alternative, Thevenin equivalent termination networks
can also be used. If these high speed signals must be routed
more than a centimeter, either microstrip or stripline techniques
are required to ensure proper transition times and to prevent
excessive output ringing and pulse width-dependent propagation
delay dispersion.
− 2 V for PECL outputs of ADCMP582.
CCO
), the output supply
EE
and V
EE, VCCI,
Figure 24. Each output is
CCO
GND
50Ω50Ω
Q
Q
16mA
V
EE
Figure 24. Simplified Schematic Diagram of the ADCMP580 CML Output Stage
GND/V
CCO
V
EE
Figure 25. Simplified Schematic Diagram of the
A
DCMP581/ADCMP582 ECL/PECL Output Stage
04672-024
Q
Q
04672-025
USING/DISABLING THE LATCH FEATURE
The latch inputs (LE/LE) are active low for latch mode and are
internally terminated with 50 Ω resistors to the V
using the ADCMP580, V
When using the ADCMP581, V
When using the ADCMP582, V
to V
− 2 V, preferably with its own low inductance plane.
CCO
should be connected to ground.
TT
should be connected to −2 V.
TT
should be connected externally
TT
When using the ADCMP580, the latch function can be disabled
connecting the
by
LE
pin to VEE with an external pull-down
resistor and by leaving the LE pin to ground. To prevent excessive
power dissipation, the resistor should be 1 kΩ for the ADCMP580.
When using the ADCMP581 comparators, the latch can be
disabled by connecting the
LE
pin to VEE with an external 750 Ω
resistor and leaving the LE pin connected to −2 V. The idea is to
create an approximate 0.5 V offset using the internal resistor as
half of the voltage divider. The V
pin should be connected as
TT
recommended.
pin. When
TT
Rev. A | Page 11 of 16
ADCMP580/ADCMP581/ADCMP582
www.BDTIC.com/ADI
OPTIMIZING HIGH SPEED PERFORMANCE
As with any high speed comparator, proper design and layout
techniques are essential to obtaining the specified performance.
Stray capacitance, inductance, inductive power, and ground
impedances or other layout issues can severely limit performance
and can cause oscillation. Discontinuities along input and output
transmission lines can also severely limit the specified pulse
width dispersion performance.
For applications in a 50 Ω environment, input and output
ma
tching have a significant impact on data-dependent (or
deterministic) jitter (DJ) and pulse width dispersion
performance. The ADCMP58x family of comparators provides
internal 50 Ω termination resistors for both V
The return side for each termination is pinned out separately
with the V
is desired at one or both of the V
and VTN pins, respectively. If a 50 Ω termination
TP
inputs, the VTP and VTN
P/VN
pins can be connected (or disconnected) to (from) the desired
termination potential as appropriate. The termination potential
should be carefully bypassed using ceramic capacitors as discussed previously to prevent undesired aberrations on the input
signal due to parasitic inductance in the termination return
path. If a 50 Ω termination is not desired, either one or both
of the V
termination pins can be left disconnected. In this
TP/VTN
case, the open pins should be left floating with no external pull
downs or bypassing capacitors.
For applications that require high speed operation but do not
ave on-chip 50 Ω termination resistors, some reflections
h
should be expected, because the comparator inputs can no
longer provide matched impedance to the input trace leading
up to the device. It then becomes important to back-match the
drive source impedance to the input transmission path leading
to the input to minimize multiple reflections. For applications
in which the comparator is less than 1 cm from the driving
signal source, the source impedance should be minimized. High
source impedance in combination with parasitic input capacitance of the comparator could cause undesirable degradation
in bandwidth at the input, thus degrading the overall response.
It is therefore recommended that the drive source impedance
should be no more than 50 Ω for best high speed performance.
and VN inputs.
P
COMPARATOR PROPAGATION DELAY DISPERSION
The ADCMP58x family of comparators has been specifically
designed to reduce propagation delay dispersion over a wide
input overdrive range of 5 mV to 500 mV. Propagation delay
dispersion is a change in propagation delays that results
from a change in the degree of overdrive or slew rate (how far
or fast the input signal exceeds the switching threshold). The
overall result is a higher degree of timing accuracy.
Propagation delay dispersion is a specification that becomes
im
portant in critical timing applications, such as data communications, automatic test and measurement, instrumentation,
and event-driven applications, such as pulse spectroscopy,
nuclear instrumentation, and medical imaging. Dispersion
is defined as the variation in the overall propagation delay as
the input overdrive conditions are changed (see
Figure 27). For the ADCMP58x family of comparators, dispersio
n is typically <25 ps, because the overdrive varies from 5 mV
to 500 mV, and the input slew rate varies from 1 V/ns to 10 V/ns.
This specification applies for both positive and negative signals
because the ADCMP58x family of comparators has almost
equal delays for positive- and negative-going inputs.
500mV OVERDRIVE
INPUT VOLTAGE
5mV OVERDRIVE
Q/Q OUTPUT
Figure 26. Propagation Delay—Overdrive Dispersion
INPUT VOLTAGE
1V/ns
10V/ns
Figure 26 and
V
± V
N
DISPERSIO N
± V
V
N
OS
04672-026
OS
Rev. A | Page 12 of 16
DISPERSION
Q/Q OUTPUT
Figure 27. Propagation Delay—Slew Rate Dispersion
4672-027
ADCMP580/ADCMP581/ADCMP582
V
–V
www.BDTIC.com/ADI
COMPARATOR HYSTERESIS
Adding hysteresis to a comparator is often desirable in a noisy
environment or when the differential inputs are very small or
slow moving. The transfer function for a comparator with
hysteresis is shown in
e threshold from the negative direction, the comparator
th
switches from a low to a high when the input crosses +V
The new switching threshold becomes −V
remains in the high state until the threshold −V
from the positive direction. In this manner, noise centered on
0 V input does not cause the comparator to switch states unless
it exceeds the region bounded by ±V
The customary technique for introducing hysteresis into a
c
omparator uses positive feedback from the output back to
the input. A limitation of this approach is that the amount
of hysteresis varies with the output logic levels, resulting in
hysteresis that is not symmetric about the threshold. The
external feedback network can also introduce significant
parasitics that reduce high speed performance and can even
reduce overall stability in some cases.
0
Figure 28. Comparator Hysteresis Transfer Function
The ADCMP58x family of comparators offers a programmable
hysteresis feature that can significantly improve the accuracy
and stability of the desired hysteresis. By connecting an external
pull-down resistor from the HYS pin to V
of hysteresis can be applied. Leaving the HYS pin disconnected
disables the feature, and hysteresis is then less than 1 mV, as
specified. The maximum range of hysteresis that can be applied
by using this method is approximately ±70 mV.
Figure 29 illustrates the amount of applied hysteresis as a
unction of the external resistor value. The advantage of
f
applying hysteresis in this manner is improved accuracy,
stability, and reduced component count. An external bypass
capacitor is not required on the HYS pin, and it would likely
degrade the jitter performance of the device.
Figure 28. If the input voltage approaches
/2. The comparator
H
/2 is crossed
H
/2.
H
+
H
2
0V
OUTPUT
H
2
INPUT
1
4672-028
, a variable amount
EE
H
/2.
The hysteresis pin can also be driven by a current source.
t is biased approximately 400 mV above V
I
and has an
EE
internal series resistance of approximately 600 Ω.
80
70
60
50
40
30
20
COMPARATOR HYSTERESIS (mV)
10
0
110k
Figure 29. Comparator Hysteresis vs. R
101001k
R
CONTROL RESISTO R (Ω)
HYS
Control Resistor
HYS
04672-029
MINIMUM INPUT SLEW RATE REQUIREMENT
As with many high speed comparators, a minimum slew rate
requirement must be met to ensure that the device does not
oscillate as the input signal crosses the threshold. This oscillation is due in part to the high input bandwidth of the comparator
and the feedback parasitics inherent in the package. A
minimum slew rate of 50 V/µs should ensure clean output
transitions from the ADCMP58x family of comparators.
The slew rate may be too slow for other reasons. The extremely
h
igh bandwidth of these devices means that broadband noise
can be a significant factor when input slew rates are low. There
is 120 V of thermal noise generated over the bandwidth of the
comparator by the two 50 terminations at room temperature.
With a slew rate of only 50 V/s, the inputs are inside this noise
band for over 2 ps, rendering the comparator’s jitter performance of
200 fs irrelevant. Raising the slew rate of the input signal and/or
reducing the bandwidth over which that resistance is seen at the
input can greatly reduce jitter. Devices are not characterized this
way but simply bypassing a reference input close to the package
can reduce jitter 30% in low slew rate applications.
Rev. A | Page 13 of 16
ADCMP580/ADCMP581/ADCMP582
R
R
www.BDTIC.com/ADI
OUTLINE DIMENSIONS
0.50
0.40
PIN 1
INDICATO
0.90
0.85
0.80
SEATING
PLANE
12° MAX
3.00
BSC SQ
TOP
VIEW
0.30
0.23
0.18
*
COMPLIANT
EXCEPT FOR EXPOSED PAD DIMENSION.
2.75
BSC SQ
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
0.20 REF
TO
JEDEC STANDARDS MO-220-VEED-2
0.45
0.50
BSC
1.50 REF
0.60 MAX
13
12
(BOTTOM VIEW)
9
8
Figure 30. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
3
mm × 3 mm Body, Very Thin Quad
(CP-16-3)
Dimensions shown in millimeters
EXPOSED
PAD
0.30
16
1
4
5
N
P
I
D
N
I
*
1.65
1.50 SQ
1.35
0.25 MIN
1
O
C
I
A
T
ORDERING GUIDE
Model Temperature Range Package Description Package Option Branding
ADCMP580BCP-WP −40°C to +125°C 16-Lead LFCSP_VQ CP-16-3 G07
ADCMP580BCP–R2 −40°C to +125°C 16-Lead LFCSP_VQ CP-16-3 G07
ADCMP580BCP–RL7 −40°C to +125°C 16-Lead LFCSP_VQ CP-16-3 G07
ADCMP580BCPZ-WP
ADCMP580BCPZ–R2
ADCMP580BCPZ–RL7
ADCMP581BCP-WP −40°C to +125°C 16-Lead LFCSP_VQ CP-16-3 G09
ADCMP581BCP–R2 −40°C to +125°C 16-Lead LFCSP_VQ CP-16-3 G09
ADCMP581BCP–RL7 −40°C to +125°C 16-Lead LFCSP_VQ CP-16-3 G09
ADCMP581BCPZ-WP
ADCMP581BCPZ–R2
ADCMP581BCPZ–RL7
ADCMP582BCP-WP −40°C to +125°C 16-Lead LFCSP_VQ CP-16-3 G0B
ADCMP582BCP-R2 −40°C to +125°C 16-Lead LFCSP_VQ CP-16-3 G0B
ADCMP582BCP-RL7 −40°C to +125°C 16-Lead LFCSP_VQ CP-16-3 G0B
ADCMP582BCPZ-WP
ADCMP582BCPZ-R2
ADCMP582BCPZ-RL7
EVAL-ADCMP580BCPZ
EVAL-ADCMP581BCPZ
EVAL-ADCMP582BCPZ