ANALOG DEVICES ADA4960-1 Service Manual
5 GHz, Low Distortion
FEATURES
−3 dB bandwidth of 5 GHz (AV = 6 dB)
Single resistor programmable gain: 0 dB to 18 dB
Differential or single-ended input to differential output
Low harmonic distortion (HD2/HD3 @ A
−88/−69 dBc @ 250 MHz
−77/−66 dBc @ 500 MHz
−73/−72 dBc @ 1 GHz
IMD3 @ 1 GHz = −63 dBc
Slew rate
8700 V/µs (A
6600 V/s (A
= 6 dB, 2 V step)
V
= 18 dB, 2 V step)
V
Fast settling: 1 ns to 1%, 1.4 ns to 0.1%
Fast overdrive recovery: 6.7 ns to 1%, 9.3 ns to 0.5%
Single-supply operation: 5 V
0.1 dB gain flatness to 300 MHz
DC level translation
Available in 16-lead LFCSP
APPLICATIONS
Differential ADC drivers for giga-sample ADCs
GBPS line drivers with pre-emphasis
High speed data acquisition
Electronic surveillance countermeasures
Pulse capture and conditioning
Oscilloscopes
Satellite communications
Single-ended-to-differential converters
RF/IF gain blocks
GENERAL DESCRIPTION
The ADA4960-1 is a high performance, differential amplifier
optimized for RF and IF applications. It achieves better than 63 dB
IMD3 performance for frequencies up to and beyond 1 GHz,
making it an ideal driver for 8-bit to 10-bit giga-sample analogto-digital converters (ADCs).
The buffered inputs of the ADA4960-1 isolate the gain-setting
resistor (R
input resistance, easing matching and input drive requirements.
The ADA4960-1 has a nominal 150 differential output impedance.
The ADA4960-1 is optimized for wideband, low distortion
performance for frequencies up to and beyond 1 GHz. These
attributes, together with its adjustable gain capability, make this
device the amplifier of choice for general-purpose IF and broadband applications where low distortion, noise, and power are critical.
) from the signal inputs, maintaining a constant 10 k
G
= 6 dB)
V
ADC Driver/Line Driver
ADA4960-1
FUNCTIONAL BLOCK DIAGRAM
PD
VIP
IIP
R
G
IIN
VIN
1.2
1.0
0.8
0.6
80%
0.4
0.2
(V)
0
OUT
V
–0.2
–0.4
–0.6
–0.8
–1.0
–1.2
–0.2 0 0.2
Figure 2. Rise Time, V
For A
V
BIAS CELL
ADA4960-1
Figure 1.
= 6dB
A
V
AV = 12dB
AV (dB) SLEW RATE ( V/µs)
6
12
18 6600
20%
0.4 0.6 0.8 1.0
TIME
(ns)
= 2 V p-p, TA = 25°C,
= 6 dB, AV = 12 dB, and AV = 18 dB
OUT
The device is optimized for the best combination of slew rate,
bandwidth, and broadband distortion. These attributes allow it
to drive a wide variety of ADCs. It is ideally suited for driving
mixers, pin diode attenuators, SAW filters, and multi-element
discrete devices.
The user accessible gain adjust and bandwidth extension features
allow configuration of the ADA4960-1 for line driver and
channel equalization applications.
The quiescent current of the ADA4960-1 is typically 60 mA. When
disabled, it consumes less than 3 mA, offering excellent input-tooutput isolation.
Fabricated on an Analog Devices, Inc., high speed SiGe process,
the ADA4960-1 is available in a compact 3 mm × 3 mm, 16-lead
LFCSP. It operates over the temperature range of −40°C to +85°C.
VCC
VOCM
VOP
VON
GND
AV = 18dB
8700
7700
08458-001
08458-047
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 www.analog.com
Fax: 781.461.3113 ©2010 Analog Devices, Inc. All rights reserved.
ADA4960-1
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 6
Thermal Resistance ...................................................................... 6
Maximum Power Dissipation ..................................................... 6
ESD Caution .................................................................................. 6
Pin Configuration and Function Descriptions ............................. 7
Typical Performance Characteristics ............................................. 8
Test Circuits ................................................................................. 12
REVISION HISTORY
4/10—Revision 0: Initial Version
Circuit Description......................................................................... 13
Basic Structure ............................................................................ 13
Applications Information .............................................................. 14
Basic Connections ...................................................................... 14
Input and Output Interfacing ................................................... 14
Gain Adjust ................................................................................. 15
Bandwidth Extension ................................................................. 15
ADC Interfacing ......................................................................... 16
Line Driver Applications .......................................................... 16
Overdrive and Recovery ............................................................ 17
Layout, Grounding, and Bypassing .............................................. 18
Outline Dimensions ....................................................................... 19
Ordering Guide .......................................................................... 19
Rev. 0 | Page 2 of 20
ADA4960-1
SPECIFICATIONS
VCC = 5 V, VOCM = 2.5 V, RL = 100 Ω differential, AV = 6 dB, CL = 1 pF differential, f = 140 MHz, T = 25°C. Inputs and outputs are ac-coupled.
Table 1.
Parameter Conditions Min Typ Max Unit
DYNAMIC PERFORMANCE
−3 dB Bandwidth AV = 6 dB, V
A
A
Bandwidth for 0.1 dB Flatness V
= 12 dB, V
V
= 18 dB, V
V
≤ 1.0 V p-p 300 MHz
OUT
Gain Accuracy RG = 95.3 Ω 0.5 dB
Gain Supply Sensitivity VS ± 5% 0.2 dB/V
Gain Temperature Sensitivity −40°C to +85°C 2.5 mdB/°C
Slew Rate AV = 6 dB, V
A
A
A
A
A
= 12 dB, V
V
= 18 dB, V
V
= 6 dB, V
V
= 12 dB, V
V
= 18 dB, V
V
Settling Time 1 V step to 1% 1 ns
1 V step to 0.1% 1.4 ns
Overdrive Recovery Time VIN = 1 V to 0 V step, AV = 12 dB, V
V
= 1 V to 0 V step, AV = 12 dB, V
IN
Reverse Isolation (S12) f = ≤1 GHz 68 dB
INPUT/OUTPUT CHARACTERISTICS
Output Common Mode VS/2 V
VOCM Adjustment Range 1 2.75 V
Input Common-Mode Range 2.25 2.75 V
Maximum Output Voltage Swing 1 dB compressed 3.5 V p-p
Output Common-Mode Offset Referenced to VCC/2 −20 +10 mV
Output Common-Mode Drift −40°C to +85°C 0.05 mV/°C
Output Differential Offset Voltage −36 +22 mV
Common-Mode Rejection Ratio (CMRR) 60 dB
Output Differential Offset Drift −40°C to +85°C 0.05 mV/°C
Input Bias Current −40°C to +85°C −20 μA
Input Resistance (Differential) AV = all gains 10 kΩ
Input Capacitance (Differential) AV = all gains 0.4 pF
Input Resistance (Single-Ended) AV = all gains 5 kΩ
Input Capacitance (Single-Ended) AV = all gains 0.8 pF
Output Resistance (Differential) 150 Ω
Output Capacitance (Differential) 1.2 pF
POWER INTERFACE
Supply Voltage 4.75 5.0 5.25 V
ENB Threshold Low to high 2.2 V
High to low 1.3 V
ENB Input Bias Current ENB high 30 μA
ENBL low −180 μA
Quiescent Current ENB high 56 60 64 mA
ENBL low 2.9 mA
≤ 1.0 V p-p 5000 MHz
OUT
≤ 1.0 V p-p 2000 MHz
OUT
≤ 1.0 V p-p 1200 MHz
OUT
= 2 V step, 20% to 80% 8700 V/μs
OUT
= 2 V step, 20% to 80% 7700 V/μs
OUT
= 2 V step, 20% to 80% 6600 V/μs
OUT
= 1 V step, 20% to 80% 7200 V/μs
OUT
= 1 V step, 20% to 80% 4900 V/μs
OUT
= 1 V step, 20% to 80% 3700 V/μs
OUT
≤ 1% 6.7 ns
OUT
≤ 0.5% 9.3 ns
OUT
Rev. 0 | Page 3 of 20
ADA4960-1
Parameter Conditions Min Typ Max Unit
NOISE/HARMONIC PERFORMANCE
140 MHz
Second/Third Harmonic Distortion AV = 6 dB, V
A
A
= 12 dB, V
V
= 18 dB, V
V
OIP3/IMD3 AV = 6 dB, V
A
A
= 12 dB, V
V
= 18 dB, V
V
Noise Spectral Density (RTI) AV = 6 dB 5.4 nV/√Hz
A
A
= 12 dB 3.2 nV/√Hz
V
= 18 dB 2.1 nV/√Hz
V
1 dB Compression Point (RTO) AV = 6 dB 12.0 dBm
A
A
= 12 dB 12.0 dBm
V
= 18 dB 11.9 dBm
V
250 MHz
Second/Third Harmonic Distortion AV = 6 dB, V
A
A
= 12 dB, V
V
= 18 dB, V
V
OIP3/IMD3 AV = 6 dB, V
A
A
= 12 dB, V
V
= 18 dB, V
V
Noise Spectral Density (RTI) AV = 6 dB 5.4 nV/√Hz
A
A
= 12 dB 3.1 nV/√Hz
V
= 18 dB 2.0 nV/√Hz
V
1 dB Compression Point (RTO) AV = 6 dB 12.0 dBm
A
A
= 12 dB 11.9 dBm
V
= 18 dB 11.7 dBm
V
500 MHz
Second/Third Harmonic Distortion AV = 6 dB, V
A
A
= 12 dB, V
V
= 18 dB, V
V
OIP3/IMD3 AV = 6 dB, V
A
A
= 12 dB, V
V
= 18 dB, V
V
Noise Spectral Density (RTI) AV = 6 dB 5.2 nV/√Hz
A
A
= 12 dB 3.0 nV/√Hz
V
= 18 dB 1.9 nV/√Hz
V
1 dB Compression Point (RTO) AV = 6 dB 11.6 dBm
A
A
= 12 dB 11.4 dBm
V
= 18 dB 11.0 dBm
V
750 MHz
Second/Third Harmonic Distortion AV = 6 dB, V
A
A
= 12 dB, V
V
= 18 dB, V
V
OIP3/IMD3 AV = 6 dB, V
A
A
= 12 dB, V
V
= 18 dB, V
V
Noise Spectral Density (RTI) AV = 6 dB 5.0 nV/√Hz
A
A
= 12 dB 3.0 nV/√Hz
V
= 18 dB 1.8 nV/√Hz
V
1 dB Compression Point (RTO) AV = 6 dB 9.7 dBm
A
A
= 12 dB 9.5 dBm
V
= 18 dB 9.5 dBm
V
= 0.9 V p-p −91/−73 dBc
OUT
= 0.9 V p-p −86/−73 dBc
OUT
= 0.9 V p-p −82/−72 dBc
OUT
= 0.9 V p-p composite (2 MHz spacing) +33.2/−79 dBm/dBc
OUT
= 0.9 V p-p composite (2 MHz spacing) +33.4/−78 dBm/dBc
OUT
= 0.9 V p-p composite (2 MHz spacing) +33.3/−78 dBm/dBc
OUT
= 0.9 V p-p −88/−69 dBc
OUT
= 0.9 V p-p −81/−68 dBc
OUT
= 0.9 V p-p −77/−68 dBc
OUT
= 0.9 V p-p composite (2 MHz spacing) +32.5/−77 dBm/dBc
OUT
= 0.9 V p-p composite (2 MHz spacing) +32.6/−77 dBm/dBc
OUT
= 0.9 V p-p composite (2 MHz spacing) +32.1/−76 dBm/dBc
OUT
= 0.9 V p-p −77/−66 dBc
OUT
= 0.9 V p-p −71/−66 dBc
OUT
= 0.9 V p-p −68/−65 dBc
OUT
= 0.9 V p-p composite (2 MHz spacing) +30.2/−72 dBm/dBc
OUT
= 0.9 V p-p composite (2 MHz spacing) +29.9/−71 dBm/dBc
OUT
= 0.9 V p-p composite (2 MHz spacing) +29.1/−70 dBm/dBc
OUT
= 0.9 V p-p −70/−68 dBc
OUT
= 0.9 V p-p −67/−69 dBc
OUT
= 0.9 V p-p −64/−69 dBc
OUT
= 0.9 V p-p composite (2 MHz spacing) +28.3/−67 dBm/dBc
OUT
= 0.9 V p-p composite (2 MHz spacing) +27.7/−67 dBm/dBc
OUT
= 0.9 V p-p composite (2 MHz spacing) +26.9/−65 dBm/dBc
OUT
Rev. 0 | Page 4 of 20
ADA4960-1
Parameter Conditions Min Typ Max Unit
1000 MHz
Second/Third Harmonic Distortion AV = 6 dB, V
A
A
= 12 dB, V
V
= 18 dB, V
V
OIP3/IMD3 AV = 6 dB, V
A
A
= 12 dB, V
V
= 18 dB, V
V
Noise Spectral Density (RTI) AV = 6 dB 4.8 nV/√Hz
A
A
= 12 dB 2.7 nV/√Hz
V
= 18 dB 1.6 nV/√Hz
V
1 dB Compression Point (RTO) AV = 6 dB 8.0 dBm
A
A
= 12 dB 7.7 dBm
V
= 18 dB 7.6 dBm
V
= 0.9 V p-p −73/−72 dBc
OUT
= 0.9 V p-p −69/−78 dBc
OUT
= 0.9 V p-p −67/−85 dBc
OUT
= 0.9 V p-p composite (2 MHz spacing) +26.2/−63 dBm/dBc
OUT
= 0.9 V p-p composite (2 MHz spacing) +26.0/−63 dBm/dBc
OUT
= 0.9 V p-p composite (2 MHz spacing) +25.0/−61 dBm/dBc
OUT
Rev. 0 | Page 5 of 20
ADA4960-1
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Supply Voltage, VCC 5.25 V
VIP, VIN VCC + 0.5 V
Internal Power Dissipation See Figure 3
Maximum Junction Temperature 150°C
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The power dissipated in the package (P
quiescent power dissipation and the power dissipated in the
package due to the load drive. The quiescent power is the voltage
between the supply pins (V
The power dissipated due to the load drive depends upon the
particular application. The power due to load drive is calculated
by multiplying the load current by the associated voltage drop
across the device. RMS voltages and currents must be used in
these calculations.
Airflow increases heat dissipation, effectively reducing θ
addition, more metal directly in contact with the package leads/
exposed pad from metal traces, through holes, ground, and power
planes reduce θ
Figure 3 shows the maximum safe power dissipation of the
ADA4960-1 vs. the ambient temperature on a JEDEC standard
4-layer board.
2.5
θJA is specified for the device (including the exposed pad) soldered
to a high thermal conductivity, 4-layer circuit board, as described
2.0
in EIA/JESD 51-7.
) times the quiescent current (IS).
S
.
JA
) is the sum of the
D
JA
. In
Table 3. Thermal Resistance
Package Type θJA Unit
16-Lead LFCSP (Exposed Pad) 89.5 °C/W
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the ADA4960-1 package
is limited by the associated rise in junction temperature (T
the die. At approximately 150°C, which is the glass transition
temperature, the plastic changes its properties. Even temporarily
exceeding this temperature limit can change the stresses that the
package exerts on the die, permanently shifting the parametric
performance of the ADA4960-1. Exceeding a junction temperature
of 150°C for an extended period can result in changes in the
silicon devices, potentially causing failure.
) on
J
1.5
1.0
0.5
MAXIMUM POWER DISSIPATION
0
–40 –20 0 20 40 60 80 100
Figure 3. Maximum Power Dissipation vs. Ambient Temperature for 4-Layer Board
QUIESCENT POWER
AMBIENT TEMPERATURE (°C)
08458-002
ESD CAUTION
Rev. 0 | Page 6 of 20
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