Unity-gain stable
Ultralow noise: 1 nV/√Hz, 2.6 pA/√Hz
Ultralow distortion −117 dBc at 1 MHz
High speed
−3 dB bandwidth: 600 MHz (G = +1)
Slew rate: 310 V/μs
Offset voltage: 230 μV maximum
Low input bias current: 100 nA
Wide supply voltage range: 5 V to 12 V
Supply current: 14.7 mA
High performance pinout
Disable mode
APPLICATIONS
Analog-to-digital drivers
Instrumentation
Filters
IF and baseband amplifiers
DAC buffers
Optical electronics
ADA4899-1
CONNECTION DIAGRAMS
ADA4899-1
DISABLE
FEEDBACK
1
2
3
–IN
4
+IN
NC = NO CONNECT
Figure 1. 8-Lead LFCSP_VD (CP-8-2)
ADA4899-1
–V
–IN
+IN
1
2
3
4
S
FEEDBACK
Figure 2. 8-Lead SOIC_N_EP (RD-8-1)
8
+V
7
V
6
NC
5
–V
8
DISABLE
7
+V
6
V
5
–V
OUT
OUT
S
S
S
S
05720-001
05720-002
GENERAL DESCRIPTION
The ADA4899-1 is an ultralow noise (1 nV/√Hz) and distortion
(<−117 dBc @1 MHz) unity-gain stable voltage feedback op
amp, the combination of which makes it ideal for 16-bit and
18-bit systems. The ADA4899-1 features a linear, low noise
input stage and internal compensation that achieves high slew
rates and low noise even at unity gain. The Analog Devices, Inc.
proprietary next-generation XFCB process and innovative
circuit design enable such high performance amplifiers.
The ADA4899-1 drives 100 Ω loads at breakthrough performance
l
evels with only 15 mA of supply current. With the wide supply
voltage range (4.5 V to 12 V), low offset voltage (230 μV maximum), wide bandwidth (600 MHz), and slew rate (310 V/μs),
the ADA4899-1 is designed to work in the most demanding
applications. The ADA4899-1 also features an input bias current
cancellation mode that reduces input bias current by a factor of 60.
The ADA4899-1 is available in a 3 mm × 3 mm LFCSP and an
-lead SOIC package. Both packages feature an exposed metal
8
paddle that improves heat transfer to the ground plane, which is
a significant improvement over traditional plastic packages. The
ADA4899-1 is rated to work over the extended industrial
temperature range, −40°C to +125°C.
40
G = +1
= ±5V
V
S
–50
= 1kΩ
R
L
= 2V p-p
V
OUT
–60
–70
–80
HD3
05720-071
1001010.1
HARMONIC DISTORTION (dBc)
–90
–100
–110
–120
–130
HD2
FREQUENCY (MHz )
Figure 3. Harmonic Distortion vs. Frequency
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
TA = 25°C, G = +1, RL = 1 kΩ to ground, unless otherwise noted.
Table 1.
Parameter Conditions Min Typ Max Unit
DYNAMIC PERFORMANCE
–3 dB Bandwidth V
V
Bandwidth for 0.1 dB Flatness G = +2, V
Slew Rate V
Settling Time to 0.1% V
NOISE/DISTORTION PERFORMANCE
Harmonic Distortion, HD2/HD3 (dBc) fC = 500 kHz, V
f
Input Voltage Noise f = 100 kHz 1.0 nV/√Hz
Input Current Noise
DC PERFORMANCE
Input Offset Voltage 35 230 μV
Input Offset Voltage Drift 5 μV/°C
Input Bias Current
Input Bias Current Drift 3 nA/°C
Input Bias Offset Current 0.05 0.7 μA
Open-Loop Gain 82 85 dB
INPUT CHARACTERISTICS
Input Resistance Differential mode 4 kΩ
Common mode 7.3 MΩ
Input Capacitance 4.4 pF
Input Common-Mode Voltage Range −3.7 to +3.7 V
Common-Mode Rejection Ratio 98 130 dB
DISABLE PIN
DISABLE Input Threshold Voltage
Turn-Off Time
Turn-On Time
Input Bias Current
OUTPUT CHARACTERISTICS
Output Overdrive Recovery Time (Rise/Fall) VIN = −2.5 V to +2.5 V, G = +2 30/50 ns
Output Voltage Swing RL = 1 kΩ −3.65 to +3.65 −3.7 to +3.7 V
R
Short-Circuit Current Sinking/sourcing 160/200 mA
Off Isolation
POWER SUPPLY
Operating Range 4.5 12 V
Quiescent Current 14.7 16.2 mA
Quiescent Current (Disabled)
Positive Power Supply Rejection Ratio +VS = 4 V to 6 V (input referred) 84 90 dB
Negative Power Supply Rejection Ratio −VS = −6 V to −4 V (input referred) 87 93 dB
= 25 mV p-p 600 MHz
OUT
= 2 V p-p 80 MHz
OUT
= 2 V p-p 35 MHz
OUT
= 5 V step 310 V/μs
OUT
= 2 V step 50 ns
OUT
= 2 V p-p −123/−123 dBc
OUT
= 10 MHz, V
C
f = 100 kHz, DISABLE
f = 100 kHz, DISABLE
DISABLE pin floating
DISABLE
pin = +V
= 2 V p-p −80/−86 dBc
OUT
pin floating
pin = +V
S
2.6 pA/√Hz
5.2 pA/√Hz
−6 −12 μA
S
−0.1 −1 μA
Output disabled <2.4 V
50% of DISABLE
VIN = 0.5 V
50% of DISABLE
voltage to 10% of V
voltage to 90% of V
100 ns
,
OUT
40 ns
,
OUT
VIN = 0.5 V
DISABLE
DISABLE
f = 1 MHz, DISABLE
DISABLE
= +VS (enabled)
= −VS (disabled)
= 100 Ω −3.13 to +3.15 −3.25 to +3.25 V
L
= −V
S
= −V
S
17 21 μA
−35 −44 μA
−48 dB
1.8 2.1 mA
Rev. B | Page 3 of 20
ADA4899-1
www.BDTIC.com/ADI
SPECIFICATIONS WITH +5 V SUPPLY
VS = 5 V @ TA = 25°C, G = +1, RL = 1 kΩ to midsupply, unless otherwise noted.
Table 2.
Parameter Conditions Min Typ Max Unit
DYNAMIC PERFORMANCE
–3 dB Bandwidth V
V
Bandwidth for 0.1 dB Flatness G = +2, V
Slew Rate V
Settling Time to 0.1% V
NOISE/DISTORTION PERFORMANCE
Harmonic Distortion, HD2/HD3 (dBc) fC = 500 kHz, V
f
Input Voltage Noise f = 100 kHz 1.0 nV/√Hz
Input Current Noise
DC PERFORMANCE
Input Offset Voltage 5 210 μV
Input Offset Voltage Drift 5 μV/°C
Input Bias Current
Input Bias Offset Current 0.05 μA
Input Bias Offset Current Drift 2.5 nA/°C
Open-Loop Gain 76 80 dB
INPUT CHARACTERISTICS
Input Resistance Differential mode 4 kΩ
Common mode 7.7 MΩ
Input Capacitance 4.4 pF
Input Common-Mode Voltage Range 1.3 to 3.7 V
Common-Mode Rejection Ratio 90 114 dB
DISABLE PIN
DISABLE Input Threshold Voltage
Turn-Off Time
Turn-On Time
Input Bias Current
OUTPUT CHARACTERISTICS
Overdrive Recovery Time (Rise/Fall) VIN = 0 V to 2.5 V, G = +2 50/70 ns
Output Voltage Swing RL = 1 kΩ 1.25 to 3.75 1.2 to 3.8 V
R
Short-Circuit Current Sinking/sourcing 60/80 mA
Off Isolation
POWER SUPPLY
Operating Range 4.5 12 V
Quiescent Current 14.3 16 mA
Quiescent Current (Disabled)
Positive Power Supply Rejection Ratio +VS = 4.5 V to 5.5 V, −VS = 0 V (input referred) 84 90 dB
Negative Power Supply Rejection Ratio +VS = 5 V, −VS = −0.5 V to +0.5 V (input referred) 86 90 dB
= 25 mV p-p 535 MHz
OUT
= 2 V p-p 60 MHz
OUT
= 2 V p-p 25 MHz
OUT
= 2 V step 185 V/μs
OUT
= 2 V step 50 ns
OUT
= 1 V p-p −100/−113 dBc
OUT
= 10 MHz, V
C
f = 100 kHz, DISABLE
f = 100 kHz, DISABLE
DISABLE
DISABLE
pin floating
pin = +V
= 1 V p-p −89/−100 dBc
OUT
pin floating
pin = +V
S
2.6 pA/√Hz
5.2 pA/√Hz
−6 −12 μA
S
−0.2 −1.5 μA
Output disabled <2.4 V
50% of DISABLE
voltage to 10% of V
OUT
,
100 ns
VIN = 0.5 V
50% of DISABLE
voltage to 90% of V
OUT
,
60 ns
VIN = 0.5 V
DISABLE
DISABLE
f = 1 MHz, DISABLE
DISABLE
= +VS (enabled)
= −VS (disabled)
= 100 Ω 1.4 to 3.6 1.35 to 3.65 V
L
= −V
S
= −V
S
16 18 μA
−33 −42 μA
−48 dB
1.5 1.7 mA
Rev. B | Page 4 of 20
ADA4899-1
(
www.BDTIC.com/ADI
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
Supply Voltage 12.6 V
Power Dissipation See Figure 4
Differential Input Voltage ±1.2 V
Differential Input Current ±10 mA
Storage Temperature Range –65°C to +150°C
Operating Temperature Range –40°C to +125°C
Lead Temperature (Soldering 10 sec) 300°C
Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the ADA4899-1
package is limited by the associated rise in junction temperature
(T
) on the die. The plastic encapsulating the die locally reaches
J
the junction temperature. At approximately 150°C, which is the
glass transition temperature, the plastic changes its properties.
Even temporarily exceeding this temperature limit may change
the stresses that the package exerts on the die, permanently
shifting the parametric performance of the ADA4899-1.
Exceeding a junction temperature of 150°C for an extended
period can result in changes in silicon devices, potentially
causing failure.
The still-air thermal properties of the package and PCB (θ
the ambient temperature (T
the package (P
) determine the junction temperature of the die.
D
), and the total power dissipated in
A
The junction temperature is calculated as
T
= TA + (PD × θJA)
J
The power dissipated in the package (P
) is the sum of the
D
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (V
quiescent current (I
midsupply, the total drive power is V
). Assuming the load (RL) is referenced to
S
/2 × I
S
dissipated in the package and some in the load (V
) times the
S
, some of which is
OUT
OUT
× I
OUT
),
JA
).
The difference between the total drive power and the load
ower is the drive power dissipated in the package.
p
P
= Quiescent Power + (Total Drive Power – Load Power)
D
⎛
()
D
⎜
IVP
SS
⎜
⎝
V
2
⎞
V
OUTS
⎟
×+×=
⎟
R
L
⎠
RMS output voltages should be considered. If R
V
–, as in single-supply operation, the total drive power is VS ×
S
. If the rms signal levels are indeterminate, consider the
addition, more metal directly in contact with the package leads
from metal traces, through holes, ground, and power planes
reduces the θ
. Soldering the exposed paddle to the ground
JA
plane significantly reduces the overall thermal resistance of the
package.
Figure 4 shows the maximum safe power dissipation in the
ackage vs. the ambient temperature for the exposed paddle
p
(EPAD) 8-lead SOIC (70°C/W) and 8-lead LFCSP (70°C/W)
packages on a JEDEC standard 4-layer board. θ
values are
JA
approximations.
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
MAXIMUM POWER DISSIPATION (W)
0.0
Figure 4. Maximum Power Dissipation vs. Ambient Temperature
LFCSP AND SOIC
120–40–200 20406080100
AMBIENT TEMPERATURE (°C)
ESD CAUTION
05720-003
Rev. B | Page 5 of 20
ADA4899-1
www.BDTIC.com/ADI
TYPICAL PERFORMANCE CHARACTERISTICS
3
0
VS = ±5V
R
= 1kΩ
L
V
= 25mV p-p
OUT
G = +1
G = –1
3
0
G = +1
R
= 100Ω
L
V
OUT
= 25mV p-p
–3
–6
–9
NORMALIZ ED CLOSED-L OOP GAI N (dB)
–12
G = +10
FREQUENCY (MHz)
Figure 5. Small Signal Frequency Response for Various Gains, R
G = +2
G = +5
= 1 kΩ
L
3
VS = ±5V
R
= 100Ω
L
V
= 25mV p-p
OUT
0
–3
–6
–9
NORMALIZ ED CLOSED- LOOP G AIN (dB)
–12
G = +10
FREQUENCY (MHz)
Figure 6. Small Signal Frequency Response for Various Gains, R
G = +2
G = +5
G = +1
G = –1
= 100 Ω
L
3
0
G = +1
V
= ±5V
S
R
= 1kΩ
–3
L
V
= 25mV p-p
OUT
–6
CLOSED-LOOP GAIN (dB)
–9
–12
FREQUENCY (MHz)
T = +125°C
T = –40°C
Figure 7. Small Signal Frequency Response for Various Temperatures
–3
–6
CLOSED-LOOP GAIN (dB)
–9
05720-004
1000110010
–12
FREQUENCY (MHz)
V
= +5V
S
VS = ±5V
05720-007
100010100
Figure 8. Small Signal Frequency Response for Various Supply Voltages
6
G = +1
R
= 1kΩ
L
V
= 25mV p-p
OUT
3
0
–3
–6
CLOSED-LOOP GAIN (dB)
–9
05720-005
1000110010
–12
CL = 15pF
R
= 10Ω
SNUB
C
= 2pF
L
FREQUENCY (MHz)
C
= 0pF
L
C
L
C
= 15pF
= 5pF
L
05720-032
100010010
Figure 9. Small Signal Frequency Response for Capacitive Loads
5.0
VS = ±5V
V
= 25mV p-p
OUT
4.5
G = +1
4.0
R
= 1kΩ
L
3.5
3.0
2.5
2.0
PEAKING (d B)
1.5
1.0
0.5
05720-006
100010100
0
G = +1
R
= 100Ω
L
G = +2
R
= 1kΩ
L
CAPACITIVE L OAD (pF)
G = +1
R
= 1kΩ
L
R
SNUB
= 10Ω
05720-031
454035302520151050
Figure 10. Small Signal Frequency Response Peaking vs.
citive Load for Various Gains
Capa
Rev. B | Page 6 of 20
ADA4899-1
www.BDTIC.com/ADI
0.1
0
CLOSED-LOOP GAIN (dB)
–0.1
–0.2
–0.3
–0.4
–0.5
G = +2
V
= ±5V
S
R
= 150Ω
L
V
= 100mV p-p
OUT
V
= 2V p-p
OUT
FREQUENCY (MHz )
Figure 11. 0.1 dB Flatness for Various Output Voltages
3
G = +1
R
= 1kΩ
L
V
= 2V p-p
OUT
0
VS = ±5V
–3
V
= +5V
S
–6
CLOSED-LOOP GAIN (dB)
–9
05720-010
100110
3
G = +1
V
= ±5V
S
R
= 100Ω
L
0
V
= 1V p-p
V
= 4V p-p
–3
–6
CLOSED-LOOP GAIN (dB)
–9
–12
OUT
V
OUT
= 7V p-p
FREQUENCY (MHz)
OUT
05720-009
1000110100
Figure 14. Large Signal Frequency Response for Various Output Voltages
100
80
60
40
20
OPEN-LOOP GAIN (dB)
0
VS = ±5V
R
= 100Ω
L
180
150
120
90
60
30
OPEN-LOOP PHASE (Degrees)
–12
FREQUENCY (MHz)
05720-011
100010100
Figure 12. Large Signal Frequency Response for Various Supply Voltages
10
1
VOLTAGE NOISE (nV/ Hz)
0.1
FREQUENCY (Hz)
05720-027
100M10M1M100k10k1k10010
Figure 13. Voltage Noise vs. Frequency
05720-030
–20
Figure 15. Open-Loop Gain
FREQUENCY (MHz)
/Phase vs. Frequency
0
10001001010.10.010.001
1k
100
10
CURRENT NOISE (pA/ Hz)
DISABLE = NC
1
DISABLE = 5V
FREQUENCY (Hz)
05720-028
100M10M1M100k10k1k10010
Figure 16. Input Current Noise vs. Frequency
Rev. B | Page 7 of 20
ADA4899-1
–
–
–
–
–
–
www.BDTIC.com/ADI
HARMONIC DISTORTION (dBc)
40
G = +1
= ±5V
V
S
–50
= 1kΩ
R
L
= 2V p-p
V
OUT
–60
–70
–80
–90
–100
–110
–120
–130
HD2
FREQUENCY (MHz )
Figure 17. Harmonic Distortion vs. Frequency
HD3
05720-021
1001010.1
HARMONIC DISTORTION (dBc)
40
G = +5
= 1kΩ
R
L
–50
= ±5V
V
S
= 2V p-p
V
OUT
–60
–70
–80
–90
–100
–110
–120
HD2
HD3
FREQUENCY (MHz)
Figure 20. Harmonic Distortion vs. Frequency
05720-024
1001010.1
40
G = +1
= 1kΩ
R
L
–50
f = 5MHz
–60
–70
HARMONIC DISTORTION (dBc)
–80
–90
–100
–110
–120
OUTPUT AMPLITUDE (V p -p)
HD2
HD3
Figure 18. Harmonic Distortion vs. Output Amplitude
40
G = +1
= 1kΩ
R
L
–50
= 5V
V
S
HARMONIC DISTORTION (dBc)
–60
–70
–80
–90
–100
–110
–120
V
= 2V p-p
OUT
V
FREQUENCY (MHz )
OUT
= 1V p-p
HD3
HD2
HD2
Figure 19. Harmonic Distortion vs. Frequency
HD3
40
G = +5
= ±5V
V
S
–50
= 100Ω
R
L
= 2V p-p
V
OUT
–60
–70
HD2
SOIC
–80
–V
ON PIN 5
S
–90
–100
HARMONIC DISTORTION (dBc)
–110
05720-022
87654321
–120
HD2
SOIC
–V
ON PIN 4
S
HD2
LFCSP
HD3
LFCSP
FREQUENCY (MHz )
HD3
SOIC
–V
ON PIN 4 OR PIN 5
S
05720-043
1001010.1
Figure 21. Harmonic Distortion vs. Frequency for
V
arious Pinouts and Packages
40
G = +1
= ±5V
V
S
–50
= 100Ω
R
L
= 2V p-p
V
OUT
–60
–70
–80
–90
–100
HARMONIC DISTORTION (dBc)
–110
05720-023
1001010.1
–120
HD2
LFCSP
HD2
SOIC
FREQUENCY (MHz )
HD3
LFCSP OR SOIC
05720-044
1001010.1
Figure 22. Harmonic Distortion vs. Frequency for Both Packages
Rev. B | Page 8 of 20
ADA4899-1
www.BDTIC.com/ADI
0.10
–0.02
–0.04
OUTPUT VOL TAGE (V)
–0.06
–0.08
–0.10
0.08
0.06
0.04
0.02
0
G = +1
= ±5V
V
S
= 1kΩ
R
L
CL = 15pF
C
L
TIME (ns)
Figure 23. Small Signal Transient Response for
V
arious Capacitive Loads (Rising Edge)
0.08
RL = 1kΩ
= ±5V
V
S
0.06
0.04
0.02
G = +2
G = +5
G = +10
0
C
= 0pF
= 5pF
L
C
R
L
SNUB
= 15pF
= 10Ω
05720-041
151050
0.10
G = +1
= ±5V
V
S
0.08
= 1kΩ
R
L
0.06
0.04
0.02
0
–0.02
–0.04
OUTPUT VOL TAGE (V)
–0.06
–0.08
–0.10
C
L
TIME (ns)
Figure 26. Small Signal Transient Response for
V
arious Capacitive Loads (Falling Edge)
1.5
1.0
0.5
0
RL = 1kΩ
= ±5V
V
S
G = +2
G = +10
G = +5
= 0pF
CL = 15pF
= 5pF
C
L
C
R
L
SNUB
= 15pF
= 10Ω
05720-042
151050
–0.02
OUTPUT VOL TAGE (V)
–0.04
–0.06
–0.08
TIME (ns)
Figure 24. Small Signal Transient Response for Various Gains
1.5
G = +1
= 100Ω
R
L
1.0
= ±5V
V
S
0.5
= +5V
V
S
0
–0.5
OUTPUT VOL TAGE (V)
–1.0
–1.5
TIME (ns)
Figure 25. Large Signal Transient Response for
rious Supply Voltages, R
Va
= 100 Ω
L
–0.5
OUTPUT VOL TAGE (V)
–1.0
05720-019
1009080706050403020100
–1.5
TIME (ns)
05720-013
1009080706050403020100
Figure 27. Large Signal Transient Response for Various Gains
1.5
G = +1
= 1kΩ
R
L
1.0
= ±5V
V
S
0.5
V
= +5V
0
–0.5
OUTPUT VOL TAGE (V)
–1.0
05720-017
1009080706050403020100
–1.5
S
TIME (ns)
05720-018
1009080706050403020100
Figure 28. Large Signal Transient Response for
rious Supply Voltages, R
Va
= 1 kΩ
L
Rev. B | Page 9 of 20
ADA4899-1
–
www.BDTIC.com/ADI
= ±5V
= 1kΩ
0.3
0.2
0.1
0
–0.1
OUTPUT SETTLING (%)
–0.2
05720-025
–0.3
1500255075100125
OUTPUT IMPEDANCE (Ω)
0.01
0.001
10
1
0.1
G = +1
= ±5V
V
S
DISABLE = NC
Figure 32. Output Imped
FREQUENCY (MHz)
ance vs. Frequency
05720-015
10001001010.10.010.001
0.3
0.2
0.1
100k
10k
G = +1
= ±5V
V
S
DISABLE = –5V
VOLTAGE (V)
1.5
1.0
0.5
–0.5
–1.0
–1.5
1.5
1.0
0.5
INPUT
0
OUTPUT
TIME (ns)
ERROR
G = +1
V
S
R
L
Figure 29. Settling Time, G = +1
INPUT
= ±5V
= 1kΩ
0
–0.1
OUTPUT SETTLING (%)
–0.2
05720-026
–0.3
1500255075100125
1k
OUTPUT IMPEDANCE (Ω)
100
10
Figure 33. Output Impedance v
FREQUENCY (MHz)
s. Frequency (Disabled)
05720-014
10001001010.1
20
G = +1
= 1kΩ
R
–30
L
= 1kΩ
R
F
–40
–50
–60
–70
–80
–90
–100
VS = +5V
–110
COMMON-MO DE REJECTIO N (dB)
–120
V
–130
05720-016
10001001010.1
–140
= ±5V
S
FREQUENCY (Hz)
05720-020
1G100M10M1M100k10k1k10010
0
VOLTAGE (V)
–0.5
–1.0
–1.5
OUTPUT
TIME (ns)
ERROR
G = +5
V
S
R
L
Figure 30. Settling Time, G = +5
100k
INPUT IMPEDANCE (Ω)
10k
1k
100
10
FREQUENCY (MHz)
G = +1
= ±5V
V
S
DISABLE = NC
Figure 31. Input Impedance vs. Frequency
Rev. B | Page 10 of 20
Figure 34. Common-Mode Rejection vs. Frequency
ADA4899-1
–
www.BDTIC.com/ADI
–10
–20
–30
–40
–50
–60
–70
SUPPLY REJE CTION (d B)
–80
–90
–100
22
–28
–34
0
VS = ±5V
DISABLE = –5V
–PSR
+PSR
FREQUENCY (MHz)
Figure 35. Power Supply Rejection
500
400
300
COUNT
200
100
05720-029
10001001010.10.010.001
0
VOLTAGE OF FSET (µV)
Figure 38. Input Offset Voltage Distribution (V
500
400
N: 4651
MEAN: –4.92µV
SD: 29.22µV
= 5V
V
S
= 5 V)
S
N: 4655
MEAN: –34.62µ V
SD: 28.94µV
= ±5V
V
S
05720-034
200–200 –150 –100–50050100150
ISOLAT ION (dB)
COUNT
–40
–46
–52
–58
–64
–70
700
600
500
400
300
200
100
Figure 36. Off Isolation vs. Fr
0
FREQUENCY (MHz)
equency
INPUT BIAS CURRENT (µA)
N: 4653
MEAN: –0.083µA
SD: 0.13µA
= ±5V
V
S
0.9–0.9–0.6–0. 300.30.6
05720-012
10000.1110100
05720-033
300
COUNT
200
100
0
VOLTAGE OFFSET (µV)
Figure 39. Input Offset Voltage Distribution (V
= ±5 V)
S
05720-035
200–200 –150 –100–50050100150
Figure 37. Input Bias Current Distribution
Rev. B | Page 11 of 20
ADA4899-1
V
V
V
V
T
V
V
V
www.BDTIC.com/ADI
TEST CIRCUITS
+
S
10µF
R
G
+
S
R
10µF
F
24.9Ω
IN
10µF
49.9Ω
0.1µF
–V
S
Figure 40. Typical Noninverting Load
+
S
10µF
AC
49.9Ω
0.1µF
–V
S
1kΩ10Ω
10Ω
Figure 41. Positive Power Supply Rejection
+
S
10µF
1kΩ
1kΩ
V
IN
53.6Ω
1kΩ
1kΩ
10µF
0.1µF
R
L
Configuration
V
R
L
0.1µF
0.1µF
V
OUT
OUT
0.1µF
R
IN
R
10µF
T
–V
05720-045
S
SNUB
0.1µF
V
OU
R
C
L
L
05720-040
Figure 43. Typical Capacitive Load Configuration
+
S
10µF
1kΩ10Ω
10Ω
05720-038
AC
0.1µF
V
OUT
R
L
49.9Ω
–V
S
05720-039
Figure 44. Negative Power Supply Rejection
V
OUT
R
L
–V
S
05720-036
Figure 42. Common-Mode Rejection
Rev. B | Page 12 of 20
ADA4899-1
www.BDTIC.com/ADI
THEORY OF OPERATION
The ADA4899-1 is a voltage feedback op amp that combines
unity-gain stability with a 1 nV/√Hz input noise. It employs a
highly linear input stage that can maintain greater than −80 dBc
(@ 2 V p-p) distortion out to 10 MHz while in a unity-gain
configuration. This rare combination of low gain stability,
input-referred noise, and extremely low distortion is the result
of Analog Devices proprietary op amp architecture and high
speed complementary bipolar processing technology.
The simplified ADA4899-1 topology, shown in Figure 45, is a
sin
gle gain stage with a unity-gain output buffer. It has over
80 dB of open-loop gain and maintains precision specifications
such as CMRR, PSRR, and offset to levels that are normally
associated with topologies having two or more gain stages.
R1R
Figure 45. ADA4899-1 Topology
A pair of internally connected diodes limits the differential
voltage between the noninverting input and the inverting input
of the ADA4899-1. Each set of diodes has two series diodes
connected in antiparallel, which limits the differential voltage
between the inputs to approximately ±1.2 V. All of the ADA4899-1
pins are ESD protected with voltage-limiting diodes connected
between both rails. The protection diodes can handle 10 mA.
Currents should be limited through these diodes to 10 mA or less
by using a series limiting resistor.
BUFFERgm
C
C
V
OUT
L
05720-060
PACKAGING INNOVATION
The ADA4899-1 is available in both a SOIC and an LFCSP, each
of which has a thermal pad that allows the device to run cooler,
thereby increasing reliability. To help avoid routing around the
pad when laying out the board, both packages have a dedicated
feedback pin on the opposite side of the package for ease in
connecting the feedback network to the inverting input. The
secondary output pin also isolates the interaction of any
capacitive load on the output and the self-inductance of the
package and bond wire from the feedback loop. When using the
dedicated feedback pin, inductance in the primary output helps to
isolate capacitive loads from the output impedance of the
amplifier.
Both the SOIC and LFCSP have modified pinouts to improve
avy load second harmonic distortion performance. The intent
he
of both is to isolate the negative supply pin from the noninverting
input. The LFCSP accomplishes this by rotating the standard
8-lead package pinout counterclockwise by one pin, which puts
the supply and output pins on the right side of the package and
the input pins on the left side of the package. The SOIC is
slightly different with the intent of both isolating the inputs
from the supply pins and giving the user the option of using the
ADA4899-1 in a standard SOIC board layout with little or no
modification. Taking the unused Pin 5 and making it a second
negative supply pin allows for both an input isolated layout and
a traditional layout to be supported.
DISABLE PIN
A three-state input pin is provided on the ADA4899-1 for a
high impedance disable and an optional input bias current
cancellation circuit. The high impedance output allows several
ADA4899-1s to drive the same ADC or output line time
interleaved. Pulling the
impedance state (see Tab le 7 for threshold levels). When the
DISABLE
normally. With the
positive supply, an optional input bias current cancellation
circuit is turned on, which lowers the input bias current to less
than 200 nA. In this mode, the user can drive the ADA4899-1
from a high dc source impedance and still maintain minimal
output-referred offset without having to use impedance
matching techniques. In addition, the ADA4899-1 can be
ac-coupled while setting the bias point on the input with a high
dc impedance network. The input bias current cancellation
circuit doubles the input-referred current noise, but this effect is
minimal as long as the wideband impedances are kept low (see
Figure 16).
pin is left floating (open), the ADA4899-1 operates
DISABLE
DISABLE
pin low activates the high
pin pulled within 0.7 V of the
Rev. B | Page 13 of 20
ADA4899-1
V
V
www.BDTIC.com/ADI
APPLICATIONS
UNITY-GAIN OPERATION
The ADA4899-1 schematic for unity-gain configuration is
nearly a textbook example (see Figure 46). The only exception is
he small 24.9 Ω series resistor at the noninverting input. The
t
series resistor is only required in unity-gain configurations;
higher gains negate the need for the resistor. In
s
een that the overall noise contribution of the amplifier and the
24.9 Ω resistor is equivalent to the noise of a single 87 Ω resistor.
Figure 47 shows the small signal frequency response for the
uni
ty-gain amplifier shown in Figure 46.
+
S
0.1µF
24.9Ω
IN
0.1µF
–V
S
Figure 46. Unity-Gain Schematic
Table 4, it can be
V
OUT
05720-037
3
G = +1
R
= 100Ω
L
0
–3
–6
CLOSED-LOOP GAIN (dB)
–9
–12
Figure 47. Small Signal Frequency Response for Various Output Voltages
200mV p-p
100mV p-p
FREQUE NCY (MHz)
50mV p-p
25mV p-p
05720-063
100001100101000
RECOMMENDED VALUES FOR VARIOUS GAINS
Table 4 provides a handy reference for determining various
gains and associated performance. For noise gains greater than
one, the Series Resistor R
are kept low to minimize their contribution to the overall noise
performance of the amplifier.
is not required. Resistors RF and RG
S
Table 4. Conditions: VS = ±5 V, TA = 25°C, RL = 1 kΩ
To analyze the noise performance of an amplifier circuit, first
identify the noise sources, then determine if the source has a
significant contribution to the overall noise performance of the
amplifier. To simplify the noise calculations, noise spectral
densities were used, rather than actual voltages to leave
bandwidth out of the expressions (noise spectral density, which
is generally expressed in nV/
1 Hz bandwidth).
The noise model shown in Figure 48 has six individual noise
ources: the Johnson noise of the three resistors, the op amp
s
voltage noise, and the current noise in each input of the
amplifier. Each noise source has its own contribution to the
noise at the output. Noise is generally specified referred to input
(RTI), but it is often simpler to calculate the noise referred to
the output (RTO) and then divide by the noise gain to obtain
the RTI noise.
V
N, R1
B
4kTR1
V
N, R3
A
4kTR3
RTI NOISE =
RTO NOISE = NG × RTI NOISE
I
R1
R3
I
Figure 48. Op Amp Noise Analysis Model
All resistors have a Johnson noise that is calculated by
)(4kBTR
where:
oltzmann’s Constant (1.38 × 10
k is B
B is the bandwidth in Hz.
T is the absolute temperature in Kelvin.
R is the resistance in ohms.
A simple relationship that is easy to remember is that a 50 Ω
sistor generates a Johnson noise of 1 nV
re
In applications where noise sensitivity is critical, care must be
t
aken not to introduce other significant noise sources to the
amplifier. Each resistor is a noise source. Attention to the
following areas is critical to maintain low noise performance:
design, layout, and component selection. A summary of noise
performance for the amplifier and associated resistors can be
Table 4.
seen in
√Hz, is equivalent to the noise in a
N, R2
R2
GAIN FROM
B TO OUTPUT
R2
R1 + R2
2
+ 4kTR2
J/K).
A TO OUTPUT
N–
V
N+
2
V
N
2
+
I
N+
4kTR2
N
+ 4kTR3 + 4kTR1
R1 × R2
2
R32 + I
N–
R1 + R2R1 + R2
–23
√Hz at 25°C.
GAIN FROM
NOISE GAIN =
NG = 1 +
R1
V
OUT
= –
R1
2
R1
=
R2
R2
2
5720-070
ADC DRIVER
The ultralow noise and distortion performance of the
ADA4899-1 makes it an excellent candidate for driving 16-bit
ADCs. The schematic for a single-ended input buffer using the
ADA4899-1 and the
in Figure 49. Table 5 shows the performance data of the
AD
A4899-1 and the AD7677.
NALO
+
INPUT
NALO
–
INPUT
Table 5. ADA4899-1, Single-Ended Driver for AD7677
16-Bit, 1 MSPS, f
Parameter Measurement (dB)
Second Harmonic Distortion −116.5
Third Harmonic Distortion −111.9
THD
SFDR
SNR +92.6
The ADA4899-1 configured as a single-ended-to-differential
driver for the AD7677 is shown in Figure 50. Tab le 6 shows the
Table 6. ADA4899-1, Single Ended-to-Differential Driver for
AD7677 16-Bit, 1 MSPS, f
Parameter Measurement (dB)
THD −92.7
SFDR +91.8
SNR +90.6
AD7677, a 1 MSPS, 16-bit ADC, is shown
+5V
25Ω
ADA4899-1
–5V
+5V
25Ω
ADA4899-1
–5V
15Ω
2.7nF
15Ω
2.7nF
Figure 49. Single-Ended Input ADC Driver
= 50 kHz
C
−108.6
+101.4
+5V
590Ω
590Ω
+2.5V
REF
ADA4899-1
–5V
590Ω
590Ω
590Ω15Ω
590Ω
+5V
–5V
= 500 kHz
C
15Ω
ADA4899-1
IN+
IN–
2.7nF
2.7nF
AD7677
IN+
IN–
AD7677
05720-062
05720-061
Rev. B | Page 15 of 20
ADA4899-1
0
V
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DISABLE PIN OPERATION
The ADA4899-1
DISABLE
enable, disable, and reduction of the input bias current. When
the
DISABLE
pin is brought to within 0.7 V of the positive
supply, the input bias current circuit is enabled, which reduces
the input bias current by a factor of 100. In this state, the input
current noise doubles from 2.6 pA/
outlines the
DISABLE
pin performs three functions:
√Hz to 5.2 pA/√Hz. Tabl e 7
pin operation.
An AD8137 differential amplifier is used as a level translator
that converts the TTL input to a complementary ±3 V output to
drive the
DISABLE
pins of the ADA4899-1s. The transient
response for the 2:1 mux is shown in Figure 52.
1
Table 7.
DISABLE
Pin Truth Table
Supply Voltage ±5 V +5 V
Disable −5 V to +2.4 V 0 V to 2.4 V
Enable Open Open
Low Input Bias Current 4.3 V to 5 V 4.3 V to 5 V
ADA4899-1 MUX
With a true output disable, the ADA4899-1 can be used in
multiplexer applications. The outputs of two ADA4899-1s are
wired together to form a 2:1 mux. Figure 51 shows the 2:1 mux
chematic.
s
+5
0.1µF
2
CH1 = 500mV/DIV
CH2 = 5V/DIV
200ns/DIV
Figure 52. ADA4899-1 2:1 Mux Transient Response
CIRCUIT CONSIDERATIONS
Careful and deliberate attention to detail when laying out the
ADA4899-1 board yields optimal performance. Power supply
bypassing, parasitic capacitance, and component selection all
contribute to the overall performance of the amplifier.
PCB Layout
1MHz
V TO 5V
1V p-p
15MHz
50Ω
ADA4899-1
0.1µF
2kΩ
+5V
0.1µF2.2µF
+
1kΩ50Ω
AD8137
–5V
DISABLE
V
OUT
R
50Ω
50Ω
T
Because the ADA4899-1 can operate up to 600 MHz, it is
essential that RF board layout techniques be employed. All
ground and power planes under the pins of the ADA4899-1
should be cleared of copper to prevent the formation of parasitic
capacitance between the input pins to ground and the output
pins to ground. A single mounting pad on a SOIC footprint can
add as much as 0.2 pF of capacitance to ground if the ground
plane is not cleared from under the mounting pads. The low
distortion pinout of the ADA4899-1 reduces the distance
between the output and the inverting input of the amplifier.
This helps minimize the parasitic inductance and capacitance
of the feedback path, which reduces ringing and second harmonic
distortion.
Power Supply Bypassing
Power supply bypassing for the ADA4899-1 has been optimized
for frequency response and distortion performance. Figure 40
hows the recommended values and location of the bypass
s
1.02kΩ
V
REF
= 2.50V
0.1µF2.2µF
+
–5V
2kΩ
DISABLE
+5V
0.1µF
ADA4899-1
capacitors. Power supply bypassing is critical for stability,
2V p-p
15MHz
Figure 51. ADA4899-1 2:1 Mux Schematic
–5V
0.1µF
05720-064
frequency response, distortion, and PSR performance. The
0.1 μF capacitors shown in
s
upply pins of the ADA4899-1 as possible. The electrolytic
capacitors should be directly adjacent to the 0.1 μF capacitors.
The capacitor between the two supplies helps improve PSR and
distortion performance. In some cases, additional paralleled
capacitors can help improve frequency and transient response.
05720-065
Figure 40 should be as close to the
Rev. B | Page 16 of 20
ADA4899-1
www.BDTIC.com/ADI
Grounding
Ground and power planes should be used where possible.
Ground and power planes reduce the resistance and inductance
of the power planes and ground returns. The returns for the
input, output terminations, bypass capacitors, and R
be kept as close to the ADA4899-1 as possible. The output load
ground and the bypass capacitor grounds should be returned to
the same point on the ground plane to minimize parasitic trace
inductance, ringing, and overshoot and to improve distortion
performance.
The ADA4899-1 packages feature an exposed paddle. For
optimum electrical and thermal performance, solder this
paddle to ground. For more information on high speed circuit
design, see
Boa
A Practical Guide to High-Speed Printed-Circuit-
rd Layout.
should all
G
Rev. B | Page 17 of 20
ADA4899-1
www.BDTIC.com/ADI
OUTLINE DIMENSIONS
5.00 (0.197)
4.00 (0.157)
3.90 (0.154)
3.80 (0.150)
4.90 (0.193)
4.80 (0.189)
85
TOP VIEW
6.20 (0.244)
6.00 (0.236)
41
5.80 (0.228)
2.29 (0.090)
2.29 (0.090)
1.27 (0.05)
BSC
1.75 (0.069)
1.35 (0.053)
0.10 (0.004)
MAX
COPLANARITY
0.10
CONTROLL ING DIMENSIONS ARE IN MILLI METER; INCH DI MENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ON LY AND ARE NOT APPROPRI ATE FOR USE IN DESIGN.
0.51 (0.020)
0.31 (0.012)
COMPLIANT TO JEDEC STANDARDS MS-012-A A
1.65 (0.065)
1.25 (0.049)
SEATING
PLANE
Figure 53. 8-Lead Standard Small Outline
BOTTOM VIEW
(PINS UP)
0.25 (0.0098)
0.17 (0.0067)
0.50 (0.020)
0.25 (0.010)
8°
0°
45°
1.27 (0.050)
0.40 (0.016)
Package with Exposed Pad [SOIC_N_EP]
060506-A
(RD-8-1)
Dimensions shown in millimeters and (inches)
INDICATOR
0.90 MAX
0.85 NOM
3.25
PIN 1
12° MAX
3.00 SQ
2.75
TOP
VIEW
0.70 MAX
0.65 TYP
2.95
2.75 SQ
2.55
0.05 MAX
0.01 NOM
0.20 REF
0.50
BSC
0.30
0.23
0.18
0.60 MAX
8
EXPOSED
(BOTTOM VIEW)
5
Figure 54. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
mm × 3 mm Body, Very Thin, Dual Lead
3
(CP-8-2)
Dimensions shown in millimeters
PA D
4
0.50
0.40
0.30
1
1.60
1.45
1.30
PIN 1
INDICATOR
1.89
1.74
1.59
022107-A
ORDERING GUIDE
Model Temperature Range Package Description Package Option Branding Ordering Quantity