Ideal for CATV and terrestrial applications
Excellent frequency response
1.6 GHz, −3 dB bandwidth
1 dB flatness to 1.0 GHz
Low noise figure: 4.0 dB
Low distortion
Composite second order (CSO): −62 dBc
Composite triple beat (CTB): −72 dBc
1 dB compression point of 8.25 dBm
2.8 dB of gain per output channel
25 dB output-to-output isolation, 50 MHz to 1000 MHz
75 Ω input and outputs
Integrated output resistors
Small package size: 16-lead, 3 mm × 3 mm LFCSP
APPLICATIONS
Set-top boxes
Residential gateways
CATV distribution systems
Splitter modules
Digital cable ready (DCR) TVs
Active RF Splitter
ADA4304-2
FUNCTIONAL BLOCK DIAGRAM
5
0.1µF0.1µF
1µH
VCC
VIN
0.01µF
IL
ADA4304-2
GND
Figure 1.
VOUT1
0.01µF
VOUT2
0.01µF
06539-001
GENERAL DESCRIPTION
The ADA4304-2 is a 75 Ω active splitter for use in applications
where a lossless signal split is required. Typical applications
include multituner digital set-top boxes, cable splitter modules,
multituner/digital cable ready (DCR) televisions, and home
gateways where traditional solutions require discrete passive
splitter modules with separate fixed gain amplifiers.
The ADA4304-2 is fabricated using Analog Devices, Inc.
proprietary silicon-germanium (SiGe), complementary bipolar
process, enabling it to achieve very low levels of distortion with
a noise figure of 4 dB. The part provides a low cost alternative
that simplifies designs and improves system performance by
integrating a signal splitter element and a gain block into a single
IC. The ADA4304-2 is available in a 16-lead LFCSP and operates in
the extended industrial temperature range of −40°C to +85°C.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Supply Voltage 5.5 V
Power Dissipation See Figure 3
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +85°C
Lead Temperature (Soldering, 10 sec) 300°C
Junction Temperature 150°C
Stresses above those listed under Absolute Maximum
Ratings may cause permanent damage to the device. This is
a stress rating only; functional operation of the device at
these or any other conditions above those indicated in the
operational section of this specification is not implied.
Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
THERMAL RESISTANCE
θJA is specified for the device (including exposed pad)
soldered to a high thermal conductivity 2s2p circuit board,
as described in EIA/JESD 51-7.
Table 3. Thermal Resistance
Package Type θJA Unit
16-Lead LFCSP (Exposed Pad) 98 °C/W
Maximum Power Dissipation
The maximum safe power dissipation in the ADA4304-2
package is limited by the associated rise in junction
temperature (T
which is the glass transition temperature, the plastic changes
its properties. Even temporarily exceeding this temperature
limit can change the stresses that the package exerts on the
die, permanently shifting the parametric performance of
the ADA4304-2. Exceeding a junction temperature of 150°C
for an extended period can result in changes in the silicon
devices, potentially causing failure.
) on the die. At approximately 150°C,
J
The power dissipated in the package (P
the quiescent power dissipation; the supply voltage (V
the quiescent current (I
). In Tab le 1 , the maximum power
S
dissipation of the ADA4304-2 can be calculated as
P
= 5.25 V × 105 mA = 551 mW
D (MAX)
Airflow increases heat dissipation, effectively reducing θ
In addition, more metal directly in contact with the package
leads/exposed pad from metal traces, through-holes, ground,
and power planes reduces the θ
JA
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 16-lead LFCSP
(98°C/W) on a JEDEC standard 4-layer board.
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
MAXIMUM POWER DISSIPATION (W)
0.2
0
102030405060708090
0100
AMBIENT TEMPERATURE (°C)
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
Figure 16. Quiescent Supply Current vs. Temperature
6539-014
06539-015
06539-016
Rev. 0 | Page 7 of 12
ADA4304-2
TEST CIRCUITS
RF NETWORK ANAL YZER
75Ω S-PARAMETER
TEST SET
VOUT1
PORT 2
VIN
4
PORT 1
Figure 17. Test Circuit for S
RF NETWORK ANAL YZER
12
DUT
10
VOUT2
PORT 3
, S12, S21, S22 Measurements
11
75Ω
06539-017
75Ω S-PARAMETER
TEST SET
VOUT1
PORT 2
VIN
PORT 1
DUT
4
Figure 18. Test Circuit for S
12
10
VOUT2
PORT 3
, S31, S33 Measurements
13
75Ω
06539-018
RF NETWORK ANAL YZER
75Ω S-PARAMETER
TEST SET
VOUT1
PORT 2
VIN
4
PORT 1
75Ω
Figure 19. Test Circuit for S
12
DUT
10
23
VOUT2
PORT 3
, S32 Measurements
06539-019
Rev. 0 | Page 8 of 12
ADA4304-2
V
APPLICATIONS
The ADA4304-2 active splitter is primarily intended for use in
the downstream path of television set-top boxes (STBs) that
contain multiple tuners. It is typically located directly after the
diplexer in a bidirectional CATV customer premise unit. The
ADA4304-2 provides a single-ended input and two singleended outputs that allow the delivery of the RF signal to two
different signal paths. These paths can include, but are not
limited to, a main picture tuner, the picture-in-picture (PIP)
tuner, an out-of-band (OOB) tuner, a digital video recorder
(DVR), and a cable modem (CM).
The ADA4304-2 exhibits composite second order (CSO) and
composite triple beat (CTB) products that are −62 dBc and
−72 dBc, respectively. The use of the SiGe bipolar process also
allows the ADA4304-2 to achieve a noise figure (NF) of 4 dB.
CIRCUIT DESCRIPTION
The ADA4304-2 consists of a low noise buffer amplifier followed
by a resistive power divider. This arrangement provides 2.8 dB
of gain relative to the RF signal present at the input of the device.
The input and each output must be properly matched to a 75 Ω
environment for distortion and noise performance to match the
data sheet specifications. AC coupling capacitors of 0.01 μF are
recommended for the input and outputs.
A 1 μH RF choke (Coilcraft chip inductor 0805LS-102X) is
required to correctly bias internal nodes of the ADA4304-2. It
should be connected between the 5 V supply and the IL pin
(Pin 14). The choke should be placed as close as possible to
the ADA4304-2 to minimize parasitic capacitance on the
IL pin, which is critical for achieving the specified bandwidth
and flatness.
GND
CC
EVALUATION BOARDS
The ADA4304-2 evaluation board allows designers to assess the
performance of the parts in their particular application. The
board includes 75 Ω coaxial connectors and 75 Ω controlledimpedance signal traces that carry the input and output signals.
Power (5 V) is applied to the red VCC loop connector, and
ground is connected to the black GND loop connector.
Figure 20 is
a schematic of the ADA4304-2 evaluation board. On the
ADA4304-2 evaluation board, connectors VO1 and VO4 are
not populated.
RF LAYOUT CONSIDERATIONS
Appropriate impedance matching techniques are mandatory
when designing circuit boards for the ADA4304-2. Improper
characteristic impedances on traces can cause reflections that
can lead to poor linearity. The characteristic impedance of the
signal trace to the input and from each output should be 75 Ω.
Any ground metal on the top surface near signal lines should be
stitched with vias to the internal ground plane, as shown in
Figure 21.
POWER SUPPLY
The 5 V supply should be applied to each of the VCC pins and
RF choke via a low impedance power bus. The power bus should
be decoupled to ground using a 10 μF tantalum capacitor and a
0.1 μF ceramic chip capacitor located close to the ADA4304-2. In
addition, the VCC pins should be decoupled to ground with a
0.1 μF ceramic chip capacitor located as close to each of the pins
as possible.
NC
GND
GND
12
11
10
9
C1
0.1µF
C3
0.01μF
C4
0.01μF
VO2
VO3
06539-003
0.1µF
VIN
NC = NO CONNECT
C2
0.01μF
+
C5
10µF
C8
1
VCC
2
VCC
ADA4304-2
3
GND
4
VIN
5
Figure 20. Evaluation Board Schematic
L1
1.0μH
15
14IL13
VCC16VCC
VOUT1
VOUT2
GND6GND7GND8NC
Rev. 0 | Page 9 of 12
ADA4304-2
Figure 21. ADA4304-2 Evaluation Board
06539-020
Figure 22. Evaluation Board Component Layout
06539-021
Rev. 0 | Page 10 of 12
ADA4304-2
R
OUTLINE DIMENSIONS
0.50
0.40
PIN 1
INDICATO
1.00
0.85
0.80
SEATING
PLANE
12° MAX
3.00
BSC SQ
TOP
VIEW
0.30
0.23
0.18
COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2
2.75
BSC SQ
0.80 MAX
0.65 TYP
0.20 REF
0.05 MAX
0.02 NOM
0.45
0.50
BSC
1.50 REF
0.60 MAX
13
12
(BOTTOM VIEW)
9
8
Figure 23. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
3 mm × 3 mm Body, Very Thin Quad
(CP-16-1)
Dimensions shown in millimeters
EXPOSED
PA D
0.30
16
1
4
5
PIN 1
INDICATOR
1.25
1.10 SQ
0.95
0.25 MIN
ORDERING GUIDE
Model Temperature Range Package Description Package Option Ordering Quantity Branding