Datasheet ADA4304-2 Datasheet (ANALOG DEVICES)

1:2 Single-Ended, Low Cost,
V5V

FEATURES

Ideal for CATV and terrestrial applications Excellent frequency response
1.6 GHz, −3 dB bandwidth
1 dB flatness to 1.0 GHz Low noise figure: 4.0 dB Low distortion
Composite second order (CSO): −62 dBc
Composite triple beat (CTB): −72 dBc
1 dB compression point of 8.25 dBm
2.8 dB of gain per output channel 25 dB output-to-output isolation, 50 MHz to 1000 MHz 75 Ω input and outputs Integrated output resistors Small package size: 16-lead, 3 mm × 3 mm LFCSP

APPLICATIONS

Set-top boxes Residential gateways CATV distribution systems Splitter modules Digital cable ready (DCR) TVs
Active RF Splitter
ADA4304-2

FUNCTIONAL BLOCK DIAGRAM

5
0.1µF0.1µF
1µH
VCC
VIN
0.01µF
IL
ADA4304-2
GND
Figure 1.
VOUT1
0.01µF
VOUT2
0.01µF
06539-001

GENERAL DESCRIPTION

The ADA4304-2 is a 75 Ω active splitter for use in applications where a lossless signal split is required. Typical applications include multituner digital set-top boxes, cable splitter modules, multituner/digital cable ready (DCR) televisions, and home gateways where traditional solutions require discrete passive splitter modules with separate fixed gain amplifiers.
The ADA4304-2 is fabricated using Analog Devices, Inc. proprietary silicon-germanium (SiGe), complementary bipolar process, enabling it to achieve very low levels of distortion with a noise figure of 4 dB. The part provides a low cost alternative that simplifies designs and improves system performance by integrating a signal splitter element and a gain block into a single IC. The ADA4304-2 is available in a 16-lead LFCSP and operates in the extended industrial temperature range of −40°C to +85°C.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
4
3
2
1
0
–1
–2
–3
GAIN (dB)
–4
–5
–6
–7
–8
10050 1000 4000
Figure 2. Gain (S
TA = +85°C
T
= +25°C
A
FREQUENCY (MHz)
, S31) vs. Frequency
21
TA = –40°C
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2007 Analog Devices, Inc. All rights reserved.
06539-011
ADA4304-2

TABLE OF CONTENTS

Features.............................................................................................. 1
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5

REVISION HISTORY

5/07—Revision 0: Initial Version
Typical Performance Characteristics..............................................6
Test Circuits........................................................................................8
Applications........................................................................................9
Circuit Description .......................................................................9
Evaluation Boards .........................................................................9
RF Layout Considerations............................................................9
Power Supply..................................................................................9
Outline Dimensions....................................................................... 11
Ordering Guide .......................................................................... 11
Rev. 0 | Page 2 of 12
ADA4304-2

SPECIFICATIONS

VCC = 5 V, 75 Ω system, TA = 25°C, unless otherwise noted.
Table 1.
Parameter Conditions Min Typ Max Unit
DYNAMIC PERFORMANCE
Bandwidth (−3 dB) 1600 MHz
Specified Frequency Range 54 865 MHz
Gain (S21, S31) f = 100 MHz; see Figure 17 and Figure 18 2.8 dB
1 dB Gain Flatness 1000 MHz NOISE/DISTORTION PERFORMANCE
Noise Figure1 @ 54 MHz 4.0 dB
@ 550 MHz 4.5 dB
@ 865 MHz 4.6 dB
Output IP3 f1 = 97.25 MHz, f2 = 103.25 MHz 26 dBm
Output IP2 f1 = 97.25 MHz, f2 = 103.25 MHz 44.5 dBm
Composite Triple Beat (CTB) 135 channels, 15 dBmV/channel, f = 865 MHz −72 dBc
Composite Second Order (CSO) 135 channels, 15 dBmV/channel, f = 865 MHz −62 dBc
Cross Modulation (CXM)
INPUT CHARACTERISTICS See Figure 17, Figure 18, and Figure 19
Input Return Loss (S11) @ 54 MHz −15 −11 dB
@ 550 MHz −35.5 −22 dB
@ 865 MHz −13.3 −8 dB
Output-to-Input Isolation (S12, S13) Either output, 54 MHz to 865 MHz
@ 54 MHz −32 −30 dB
@ 550 MHz −32 −29 dB
@ 865 MHz −33 −31 dB OUTPUT CHARACTERISTICS See Figure 17, Figure 18, and Figure 19
Output Return Loss (S22, S33) Either output, 54 MHz to 865 MHz
@ 54 MHz −26.7 −21 dB
@ 550 MHz −22 −15 dB
@ 865 MHz −20 −12 dB
Output-to-Output Isolation (S23, S32) Either output, 54 MHz to 865 MHz dB
@ 54 MHz −26.7 dB
@ 550 MHz −25.1 dB
@ 865 MHz −25 dB
1 dB Compression (P POWER SUPPLY
Nominal Supply Voltage 4.75 5.0 5.25 V
Quiescent Supply Current 88 105 mA
1
Characterized with 50 Ω noise figure analyzer.
) Output referred, f = 100 MHz 8.25 dBm
1dB
135 channels, 15 dBmV/channel, 100% modulation @ 15.75 kHz, f = 865 MHz
−69 dBc
Rev. 0 | Page 3 of 12
ADA4304-2

ABSOLUTE MAXIMUM RATINGS

Table 2.
Parameter Rating
Supply Voltage 5.5 V Power Dissipation See Figure 3 Storage Temperature Range −65°C to +125°C Operating Temperature Range −40°C to +85°C Lead Temperature (Soldering, 10 sec) 300°C Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

THERMAL RESISTANCE

θJA is specified for the device (including exposed pad) soldered to a high thermal conductivity 2s2p circuit board, as described in EIA/JESD 51-7.
Table 3. Thermal Resistance
Package Type θJA Unit
16-Lead LFCSP (Exposed Pad) 98 °C/W

Maximum Power Dissipation

The maximum safe power dissipation in the ADA4304-2 package is limited by the associated rise in junction temperature (T which is the glass transition temperature, the plastic changes its properties. Even temporarily exceeding this temperature limit can change the stresses that the package exerts on the die, permanently shifting the parametric performance of the ADA4304-2. Exceeding a junction temperature of 150°C for an extended period can result in changes in the silicon devices, potentially causing failure.
) on the die. At approximately 150°C,
J
The power dissipated in the package (P the quiescent power dissipation; the supply voltage (V the quiescent current (I
). In Tab le 1 , the maximum power
S
dissipation of the ADA4304-2 can be calculated as
P
= 5.25 V × 105 mA = 551 mW
D (MAX)
Airflow increases heat dissipation, effectively reducing θ In addition, more metal directly in contact with the package leads/exposed pad from metal traces, through-holes, ground, and power planes reduces the θ
JA
Figure 3 shows the maximum safe power dissipation in the package vs. the ambient temperature for the 16-lead LFCSP (98°C/W) on a JEDEC standard 4-layer board.
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
MAXIMUM POWER DISSIPATION (W)
0.2
0
10 20 30 40 50 60 70 80 90
0 100
AMBIENT TEMPERATURE (°C)
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION

) is essentially equal to
D
.
) times
S
.
JA
06539-004
Rev. 0 | Page 4 of 12
ADA4304-2

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

NC
IL
VCC
VCC
13
14
16
15
PIN 1 INDICATOR
1VCC
ADA4304-2
2VCC
TOP VIEW
3GND
(Not to Scale)
4VIN
5
6
ND
GND
NC = NO CONNECT
G
Figure 4. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1, 2, 15, 16 VCC Supply Pin 3, 5 to 7, 9, 11 GND Ground 4 VIN Input 8, 13 NC No Connection 10 VOUT2 Output 2 12 VOUT1 Output 1 14 IL Bias Pin
12 VOUT1
11 GN D
10 VOUT2
9GND
8
7
NC
GND
06539-002
Rev. 0 | Page 5 of 12
ADA4304-2

TYPICAL PERFORMANCE CHARACTERISTICS

VCC = 5 V, 75 Ω system, TA = 25°C, unless otherwise noted.
54
–56
–58
CSO (dBc)
–60
–62
–64
–66
–68
–70
–72
–74
T
= +85°C
A
TA= –40°C
10050 1000
FREQUENCY (MHz )
Figure 5. Composite Second Order (CSO) vs. Frequency
60
63
66
69
CTB (dBc)
72
75
78
81
84
87
90
TA = +85°C
T
= –40°C
A
10050 1000
FREQUENCY (MHz )
TA= +25°C
Figure 6. Composite Triple Beat (CTB) vs. Frequency
60
63
66
69
72
75
CXM (dBc)
78
81
84
87
90
TA = +85°C
T
= –40°C
A
10050 1000
FREQUENCY (MHz )
TA= +25°C
Figure 7. Cross Modulation (CXM) vs. Frequency
TA= +25°C
06539-005
06539-007
06539-006
NOISE FI GURE (dB)
OUTPUT IP2 (dBm)
OUTPUT I P3 (dBm)
10
50 SYSTEM
8
6
4
2
0
60
55
50
45
40
35
30
25
20
40
35
30
25
20
15
10
5
0
TA = +85°C
10050 1000
FREQUENCY (MHz)
TA = +25°C
TA = –40°C
Figure 8. Noise Figure vs. Frequency
10050 1000
FREQUENCY (M Hz)
Figure 9. Output IP2 vs. Frequency
10050 1000
FREQUENCY (MHz)
Figure 10. Output IP3 vs. Frequency
06539-008
6539-009
6539-010
Rev. 0 | Page 6 of 12
ADA4304-2
4
3
2
1
0
–1
–2
–3
GAIN (dB)
–4
–5
–6
–7
–8
10050 1000 4000
TA = +85°C
Figure 11. Gain (S
30
–31
–32
–33
–34
–35
–36
ISOLATION (dB)
–37
–38
–39
–40
10050 1000 4000
Figure 12. Output-to-Input Isolation (S
0
–5
–10
–15
–20
–25
ISOLATION (dB)
–30
–35
–40
–45
10050 1000 4000
`Figure 13. Output-to-Output Isolation (S
T
= +25°C
A
FREQUENCY (MHz)
, S31) vs. Frequency
21
FREQUENCY (MHz )
FREQUENCY (M Hz)
TA = –40°C
, S13) vs. Frequency
12
, S32) vs. Frequency
23
06539-011
6539-012
06539-013
0
–5
–10
–15
–20
–25
–30
INPUT RETURN LOSS (dB)
–35
–40
10050 1000
FREQUENCY (M Hz)
Figure 14. Input Return Loss (S
) vs. Frequency
11
0
–5
–10
–15
–20
–25
–30
OUTPUT RET URN LOSS (d B)
–35
–40
Figure 15. Output Return Loss (S
10050 1000
FREQUENCY (M Hz)
, S33) vs. Frequency
22
95
90
85
80
75
QUIESCENT SUPPLY CURRENT ( mA)
70
–60 –50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90 100
TEMPERATURE ( °C)
Figure 16. Quiescent Supply Current vs. Temperature
6539-014
06539-015
06539-016
Rev. 0 | Page 7 of 12
ADA4304-2

TEST CIRCUITS

RF NETWORK ANAL YZER
75 S-PARAMETER
TEST SET
VOUT1
PORT 2
VIN
4
PORT 1
Figure 17. Test Circuit for S
RF NETWORK ANAL YZER
12
DUT
10
VOUT2
PORT 3
, S12, S21, S22 Measurements
11
75
06539-017
75 S-PARAMETER
TEST SET
VOUT1
PORT 2
VIN
PORT 1
DUT
4
Figure 18. Test Circuit for S
12
10
VOUT2
PORT 3
, S31, S33 Measurements
13
75
06539-018
RF NETWORK ANAL YZER
75 S-PARAMETER
TEST SET
VOUT1
PORT 2
VIN
4
PORT 1
75
Figure 19. Test Circuit for S
12
DUT
10
23
VOUT2
PORT 3
, S32 Measurements
06539-019
Rev. 0 | Page 8 of 12
ADA4304-2
V

APPLICATIONS

The ADA4304-2 active splitter is primarily intended for use in the downstream path of television set-top boxes (STBs) that contain multiple tuners. It is typically located directly after the diplexer in a bidirectional CATV customer premise unit. The ADA4304-2 provides a single-ended input and two single­ended outputs that allow the delivery of the RF signal to two different signal paths. These paths can include, but are not limited to, a main picture tuner, the picture-in-picture (PIP) tuner, an out-of-band (OOB) tuner, a digital video recorder (DVR), and a cable modem (CM).
The ADA4304-2 exhibits composite second order (CSO) and composite triple beat (CTB) products that are −62 dBc and
−72 dBc, respectively. The use of the SiGe bipolar process also allows the ADA4304-2 to achieve a noise figure (NF) of 4 dB.

CIRCUIT DESCRIPTION

The ADA4304-2 consists of a low noise buffer amplifier followed by a resistive power divider. This arrangement provides 2.8 dB of gain relative to the RF signal present at the input of the device. The input and each output must be properly matched to a 75 Ω environment for distortion and noise performance to match the data sheet specifications. AC coupling capacitors of 0.01 μF are recommended for the input and outputs.
A 1 μH RF choke (Coilcraft chip inductor 0805LS-102X) is required to correctly bias internal nodes of the ADA4304-2. It should be connected between the 5 V supply and the IL pin (Pin 14). The choke should be placed as close as possible to the ADA4304-2 to minimize parasitic capacitance on the IL pin, which is critical for achieving the specified bandwidth and flatness.
GND
CC

EVALUATION BOARDS

The ADA4304-2 evaluation board allows designers to assess the performance of the parts in their particular application. The board includes 75 Ω coaxial connectors and 75 Ω controlled­impedance signal traces that carry the input and output signals. Power (5 V) is applied to the red VCC loop connector, and ground is connected to the black GND loop connector.
Figure 20 is a schematic of the ADA4304-2 evaluation board. On the ADA4304-2 evaluation board, connectors VO1 and VO4 are not populated.

RF LAYOUT CONSIDERATIONS

Appropriate impedance matching techniques are mandatory when designing circuit boards for the ADA4304-2. Improper characteristic impedances on traces can cause reflections that can lead to poor linearity. The characteristic impedance of the signal trace to the input and from each output should be 75 Ω. Any ground metal on the top surface near signal lines should be stitched with vias to the internal ground plane, as shown in Figure 21.

POWER SUPPLY

The 5 V supply should be applied to each of the VCC pins and RF choke via a low impedance power bus. The power bus should be decoupled to ground using a 10 μF tantalum capacitor and a
0.1 μF ceramic chip capacitor located close to the ADA4304-2. In addition, the VCC pins should be decoupled to ground with a
0.1 μF ceramic chip capacitor located as close to each of the pins as possible.
NC
GND
GND
12
11
10
9
C1
0.1µF
C3
0.01μF
C4
0.01μF
VO2
VO3
06539-003
0.1µF
VIN
NC = NO CONNECT
C2
0.01μF
+
C5
10µF
C8
1
VCC
2
VCC
ADA4304-2
3
GND
4
VIN
5
Figure 20. Evaluation Board Schematic
L1
1.0μH
15
14IL13
VCC16VCC
VOUT1
VOUT2
GND6GND7GND8NC
Rev. 0 | Page 9 of 12
ADA4304-2
Figure 21. ADA4304-2 Evaluation Board
06539-020
Figure 22. Evaluation Board Component Layout
06539-021
Rev. 0 | Page 10 of 12
ADA4304-2
R

OUTLINE DIMENSIONS

0.50
0.40
PIN 1
INDICATO
1.00
0.85
0.80
SEATING
PLANE
12° MAX
3.00
BSC SQ
TOP
VIEW
0.30
0.23
0.18
COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2
2.75
BSC SQ
0.80 MAX
0.65 TYP
0.20 REF
0.05 MAX
0.02 NOM
0.45
0.50
BSC
1.50 REF
0.60 MAX
13
12
(BOTTOM VIEW)
9
8
Figure 23. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
3 mm × 3 mm Body, Very Thin Quad
(CP-16-1)
Dimensions shown in millimeters
EXPOSED
PA D
0.30
16
1
4
5
PIN 1 INDICATOR
1.25
1.10 SQ
0.95
0.25 MIN

ORDERING GUIDE

Model Temperature Range Package Description Package Option Ordering Quantity Branding
ADA4304-2ACPZ-RL ADA4304-2ACPZ-R7 ADA4304-2ACPZ-R2
1
Z = RoHS Compliant Part.
1
−40°C to +85°C 16-Lead LFCSP_VQ CP-16-1 5,000 H0Z
1
−40°C to +85°C 16-Lead LFCSP_VQ CP-16-1 1,500 H0Z
1
−40°C to +85°C 16-Lead LFCSP_VQ CP-16-1 250 H0Z
Rev. 0 | Page 11 of 12
ADA4304-2
NOTES
©2007 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06539-0-5/07(0)
Rev. 0 | Page 12 of 12
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