Datasheet AD9974 Datasheet (ANALOG DEVICES)

Dual-Channel, 14-Bit, CCD Signal

Processor with Precision Timing Core

FEATURES

1.8 V analog and digital core supply voltage Correlated double sampler (CDS) with

−3 dB, 0 dB, +3 dB, and +6 dB gain 6 dB to 42 dB, 10-bit variable gain amplifier (VGA) 14-bit, 65 MHz analog-to-digital converter (ADC) Black level clamp with variable level control Complete on-chip timing generator Precision Timing core with 240 ps resolution @ 65 MHz On-chip 3 V horizontal and RG drivers 100-lead, 9 mm × 9 mm, 0.8 mm pitch, CSP_BGA package Internal low dropout (LDO) regulator circuitry

APPLICATIONS

Professional HDTV camcorders Professional/high end digital cameras Broadcast cameras Industrial high speed cameras

AD9974

GENERAL DESCRIPTION

The AD9974 is a highly integrated, dual-channel, chargecoupled device (CCD) signal processor for high speed digital video camera applications. Each channel is specified at pixel rates of up to 65 MHz. The AD9974 consists of a complete analog front end (AFE) with analog-to-digital conversion, combined with a programmable timing driver. The Precision Timi ng™ core allows adjustment of high speed clocks with approximately 240 ps resolution at 65 MHz operation.

Each AFE includes black level clamping, CDS, VGA, and a 65 MSPS, 14-bit ADC. The timing driver provides the high speed CCD clock drivers for the RG_A, RG_B, H1_A to H4_A, and H1_B to H4_B outputs. A 3-wire serial interface is used to program each channel of the AD9974.

Available in a space-saving, 9 mm × 9 mm, CSP_BGA package, the AD9974 is specified over an operating temperature range of

−25°C to +85°C.

AD9974

CCDINP_A

CCDINM_A

CCDINP_B

CCDINM_B

1.8V OUTP UT LDO A

1.8V OUTP UT LDO B

RG_A RG_B

H1_A TO H4_

H1_B TO H4_B

CDS

HORIZONTAL

FUNCTIONAL BLOCK DIAGRAM

REFT_AREFB_

–3, 0, +3, +6dB

DRIVERS

VREF_A

VGA

INTERNAL CL OCKS

PRECISION

TIMING

CORE

SYNC

GENERATOR

HD_A VD_A HD_B VD_B

REFT_B REFB_B

6dB TO 42d B

Figure 1.

VREF_B

SL_A

CLAMP

INTERNAL

REGISTERS

SDATA_A

ADC

SL_B

SDATA_B

DOUT_A

DOUT_B

CLI_A CLI_B

SCK_A SCK_B

5955-001

Rev. A

Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.

AD9974

Features .............................................................................................. 1

Applications ....................................................................................... 1 

General Description ......................................................................... 1

Functional Block Diagram .............................................................. 1

Revision History ............................................................................... 2

Specifications ..................................................................................... 3

Channel-to-Channel Specifications ........................................... 3

Timing Specifications .................................................................. 4

Digital Specifications ................................................................... 5

Analog Specifications ................................................................... 6

Absolute Maximum Ratings ............................................................ 8

Thermal Characteristics .............................................................. 8

ESD Caution .................................................................................. 8

Pin Configuration and Function Descriptions ............................. 9

Typical Performance Characteristics ........................................... 11

Equivalent Input/Output Circuits ................................................ 12

Terminolog y .................................................................................... 13

Theory of Operation ...................................................................... 14

Programmable Timing Generation .............................................. 15

Precision Timing High Speed Timing Core ............................. 15

Horizontal Clamping and Blanking ......................................... 18

Complete Field—Combining H-Patterns ............................... 25

Mode Registers ........................................................................... 26

Horizontal Timing Sequence Example .................................... 28

Analog Front End Description and Operation ...................... 29

Applications Information .............................................................. 33

Recommended Power-Up Sequence ....................................... 33

Standby Mode Operation .......................................................... 36

CLI Frequency Change .............................................................. 36

Circuit Configuration ................................................................ 37

Grounding and Decoupling Recommendations .................... 37

3-Wire Serial Interface Timing ..................................................... 39

Layout of Internal Registers ...................................................... 40

Updating of Register Values ...................................................... 41

Complete Register Listing ............................................................. 42

Outline Dimensions ....................................................................... 50

Ordering Guide .......................................................................... 50

REVISION HISTORY

10/09—Revision A: Initial Version

Changes to Table 1 ............................................................................ 3

Changes to Table 3 ............................................................................ 4

Changes to Pin Function Descriptions Table ............................... 9

Changes to Figure 11 ...................................................................... 12

Changes to Individual HBLK Pattern Section ............................ 20

Changes to Table 14 ........................................................................ 25

Added Example Register Setting for Power-Up Section ........... 34

Added Additional Restrictions Section ....................................... 35

Changes to Table 2 .......................................................................... 36

Changes to 3 V System Compatibility Section ........................... 37

Changes to Grounding and Decoupling

Recommendations Section ............................................................ 37

Changes to Table 30 ........................................................................ 48

Changes to Table 31 ........................................................................ 49

Changes to Ordering Guide .......................................................... 50

Rev. A | Page 2 of 52

AD9974

SPECIFICATIONS

X = A = B, unless otherwise noted.

Table 1.

Parameter Min Typ Max Unit

TEMPERATURE RANGE

Operating −25 +85 °C Storage −65 +150 °C

POWER SUPPLY VOLTAGE

AVDD_X (AFE, Timing Core) 1.6 1.8 2.0 V RGVDD_X (RG_X Driver) 2.7 3.3 3.6 V HVDD_X (H1_X to H4_X Drivers) 2.7 3.3 3.6 V DVDD_X (All Other Digital) 1.6 1.8 2.0 V DRVDD_X (Parallel Data Output Drivers) 1.6 3.0 3.6 V IOVDD_X (I/O Supply Without the Use of LDO) 1.6 1.8 3.6 V

POWER SUPPLY CURRENTS—65 MHz OPERATION

AVDD_X (1.8 V) 55 mA RGVDD_X (3.3 V, 20 pF RG Load) 5 mA HVDD_X1 (3.3 V, 200 pF Total Load on H1 to H4) 40 mA DVDD_X (1.8 V) 15 mA DRVDD_X (3.0 V) 3 mA IOVDD_X (1.8 V) 2 mA

POWER SUPPLY CURRENTS—STANDBY MODE OPERATION

Reference Standby 10 mA Total Shutdown 0.5 mA

LDO

IOVDD_X (I/O Supply When Using LDO) 3.0 V Output Voltage 1.85 V Output Current 60 100 mA

CLOCK RATE (CLI) 8 65 MHz

The total power dissipated by the HVDD (or RGVDD) supply can be approximated as follows: Total HVDD Power = [C

Reducing the capacitive load and/or reducing the HVDD supply reduces the power dissipation. C

LDO should be used to supply only AVDD and DVDD.

is the total capacitance seen by all H-outputs.

LOAD

× HVDD × Pixel Frequency] × HVDD.

LOAD

CHANNEL-TO-CHANNEL SPECIFICATIONS

X = A = B, T

Table 2.

Parameter Min Typ Max Unit Test Conditions/Comments

LINEARITY MISMATCH CROSSTALK ERROR CDS = 0 dB

Channel A to Channel B −82 dB Full-scale step applied to Channel A while measuring response on Channel B Channel B to Channel A −82 dB Full-scale step applied to Channel B while measuring response on Channel A

See the section for further measurement explanation. Terminology

MIN

to T

, AVDD_X = DVDD_X = 1.8 V, f

MAX

<0.5 % Absolute value above 1⁄16 of maximum output code

= 65 MHz, typical timing specifications, unless otherwise noted.

CLI

Rev. A | Page 3 of 52

AD9974

TIMING SPECIFICATIONS

X = A = B, CL = 20 pF, AVDD_X = DVDD_X = 1.8 V, f

Table 3.

Parameter Min Typ Max Unit Comments

MASTER CLOCK (CLI) See Figure 17

CLI Clock Period (t CLI High/Low Pulse Width (t

) 15.38 ns

CONV

) 6.9 7.7 8.9 ns

ADC

Delay from CLI Rising Edge to Internal Pixel Position 0 (t

AFE

SHP Rising Edge to SHD Rising Edge (tS1) 6.9 7.7 8.5 ns See Figure 21 AFE Pipeline Delay 16 Cycles See Figure 22 CLPOB Pulse Width (Programmable) (t

)

2 20 Pixels

COB

HD Pulse Width t VD Pulse Width 1 HD period ns

SERIAL INTERFACE See Figure 52

Maximum SCK Frequency (f

) 40 MHz

SCLK

SL to SCK Setup Time (tLS) 10 ns SCK to SL Hold Time (tLH) 10 ns SDATA Valid to SCK Rising Edge Setup (tDS) 10 ns SCK Rising Edge to SDATA Valid Hold (tDH) 10 ns

H-COUNTER RESET SPECIFICATIONS See Figure 49

HD Pulse Width t VD Pulse Width 1 HD period ns VD Falling Edge to HD Falling Edge(t HD Falling Edge to CLI Rising Edge(t

) 0 VD period − t

VDHD

) 3 t

HDCLI

CLI Rising Edge to SHPLOC (Internal Sample Edge) (t

TIMING CORE SETTING RESTRICTIONS

Inhibited Region for SHP Edge Location (t Inhibited Region for SHP or SHD with Respect to H-Clocks

(See Figure 21)

RETIME = 0, MASK = 0 (t RETIME = 0, MASK = 1 (t RETIME = 1, MASK = 0 (t RETIME = 1, MASK = 1 (t

3, 4, 5, 6

) H × NEGLOC − 15 H × NEGLOC − 0 Edge location

SHDINH

) H × POSLOC − 15 H × POSLOC − 0 Edge location

SHDINH

) H × NEGLOC − 15 H × NEGLOC − 0 Edge location

SHPINH

) H × POSLOC − 15 H × POSLOC − 0 Edge location

SHPINH

) (See Figure 21)250 64/0 Edge location

SHPINH

Inhibited Region for DOUTPHASE Edge Location (t

(See Figure 21)

Minimum CLPOB pulse width is for functional operation only. Wider typical pulses are recommended to achieve good clamp performance.

Only applies to slave mode operation. The inhibited area for SHP is needed to meet the timing requirements for t

When 0x34[2:0] HxBLKRETIME bits are enabled, the inhibit region for SHD location changes to inhibit region for SHP location.

When sequence register 0x09[23:21] HBLK masking registers are set to 0, the H-edge reference becomes H × NEGLOC.

The H-clock signals that have SHP/SHD inhibit regions depend on the HCLK mode: Mode 1 = H1, Mode 2 = H1, H2, and Mode 3 = H1, H3.

These specifications apply when H1POL, H2POL, RGPOL, and HLPOL are all set to 1 (default setting).

= 65 MHz, unless otherwise noted.

CLI

) 5 ns

CLIDLY

CONV

) 3 t

CLISHP

DOUTINH

)

SHDLOC + 0 SHDLOC + 15 Edge location

CONV

− 2 ns

CONV

− 2 ns

CONV

for proper H-counter reset operation.

CLISHP

Rev. A | Page 4 of 52

AD9974

DIGITAL SPECIFICATIONS

X = A = B, IOVDD_X = 1.6 V to 3.6 V, RGVDD_X = HVDD_X = 2.7 V to 3.6 V, CL = 20 pF, T

Table 4.

Parameter Min Typ Max Unit Test Conditions/Comments

LOGIC INPUTS

High Level Input Voltage (VIH) IOVDD − 0.6 V Low Level Input Voltage (VIL) 0.6 V High Level Input Current (IIH) 10 μA Low Level Input Current (IIL) 10 μA Input Capacitance (CIN) 10 pF

LOGIC OUTPUTS

High Level Output Voltage (VOH) IOVDD − 0.5 V IOH = 2 mA Low Level Output Voltage (VOL) 0.5 V IOL = 2 mA

CLI INPUT (CLI_BIAS = 0)

High Level Input Voltage (V Low Level Input Voltage (V

) IOVDD/2 + 0.5 V

IHCLI

) IOVDD/2 − 0.5 V

ILCLI

H-DRIVER OUTPUTS

High Level Output Voltage at Maximum Current (VOH) HVDD − 0.5 V Low Level Output Voltage at Maximum Current 0.5 V Maximum Output Current (Programmable) (VOL) 30 mA Maximum Load Capacitance 100 pF

MIN

to T

, unless otherwise noted.

MAX

Rev. A | Page 5 of 52

AD9974

ANALOG SPECIFICATIONS

X = A = B, AVDD_X = 1.8 V, f

Table 5.

Parameter Min Typ Max Unit Test Conditions/Comments

CDS1

Allowable CCD Reset Transient 0.5 0.8 V CDS Gain Accuracy

−3 dB CDS Gain −3.3 −2.8 −2.3 0 dB CDS Gain (Default) −0.7 −0.2 +0.3 3 dB CDS Gain 2.3 2.8 3.3 6 dB CDS Gain 4.9 5.4 5.9

Maximum Input Voltage VGA gain = 5.6 dB (Code 15, default value)

−3 dB CDS Gain 1.4 V p-p 0 dB CDS Gain (Default) 1.0 V p-p 3 dB CDS Gain 0.7 V p-p 6 dB CDS Gain 0.5 V p-p

Allowable OB Pixel Amplitude

0 dB CDS Gain (Default) −100 +200 mV 6 dB CDS Gain −50 +100 mV

VARIABLE GAIN AMPLIFIER (VGA_X)

Gain Control Resolution 1024 Steps Gain Monotonicity Guaranteed Low Gain Setting (VGA Code 15, Default) 6 dB Maximum Gain Setting (VGA Code 1023) 42 dB

BLACK LEVEL CLAMP

Clamp Level Resolution 1024 Steps Minimum Clamp Level (Code 0) 0 LSB Measured at ADC output Maximum Clamp Level (Code 1023) 1023 LSB Measured at ADC output

ADC (CHN_A and CHN_B)

Resolution 14 Bits Differential Nonlinearity (DNL) −1.0 ±0.5 +1.2 LSB No Missing Codes Guaranteed Integral Nonlinearity (INL) 5 15 LSB Full-Scale Input Voltage 2.0 V

VOLTAGE REFERENCE

Reference Top Voltage (REFT_X) 1.4 V Reference Bottom Voltage (REFB_X) 0.4 V

SYSTEM PERFORMANCE Specifications include entire signal chain

VGA Gain Accuracy 0 dB CDS gain (default)

Low Gain (Code 15) 5.1 5.6 6.1 dB Gain = (0.0359 × code) + 5.1 dB

Maximum Gain (Code 1023) 41.3 41.8 42.3 dB Peak Nonlinearity, 500 mV Input Signal 0.1 0.4 % 12 dB total gain applied Total Output Noise 2 LSB rms AC-grounded input, 6 dB gain applied Power Supply Rejection (PSR) 48 dB Measured with step change on supply

Input signal characteristics are defined as shown in . Figure 2

= 65 MHz, typical timing specifications, T

CLI

MIN

to T

, unless otherwise noted.

MAX

Rev. A | Page 6 of 52

AD9974

800mV MAXIMUM

500mV TYP

RESET TRANSIENT

200mV MAX

OPTICAL BLACK PIXEL

MAXIMUM INPUT LIMIT = LESSER OF 2.2V OR (AVDD + 0.3V )

+1.8V TYP (AVDD)

+1.3V TYP (AVDD – 0.5V) DC RESTORE VO LTAGE

1V MAXIMUM INPUT SIGNAL RANGE (0dB CDS GAIN)

0V (AVSS)

MINIMUM INPUT LIMIT (AVSS – 0.3V)

05957-002

Figure 2. Input Signal Characteristics

Rev. A | Page 7 of 52

AD9974

ABSOLUTE MAXIMUM RATINGS

Ratings apply to both Channel A and Channel B, unless otherwise noted.

Table 6.

Parameter Rating

AVDD to AVSS −0.3 V to +2.2 V DVDD to DVSS −0.3 V to +2.2 V DRVDD to DRVSS −0.3 V to +3.9 V IOVDD to DVSS −0.3 V to +3.9 V HVDD to HVSS −0.3 V to +3.9 V RGVDD to RGVSS −0.3 V to +3.9 V Any VSS −0.3 V to +0.3 V RG Output to RGVSS −0.3 V to RGVDD + 0.3 V H1 to H4, HL Output to HVSS −0.3 V to HVDD + 0.3 V SCK, SL, SDI to DVSS −0.3 V to IOVDD + 0.3 V REFT, REFB, CCDINM, CCDINP to AVSS −0.2 V to AVDD + 0.2 V Junction Temperature 150°C Lead Temperature (10 sec) 350°C

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

THERMAL CHARACTERISTICS

θJA is measured using a 4-layer PCB with the exposed paddle soldered to the board.

Table 7. Thermal Resistance

Package Type θJA Unit

100-Lead, 9 mm × 9 mm, CSP_BGA 38.3 °C/W

ESD CAUTION

Rev. A | Page 8 of 52

AD9974

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

AD9974

TOP VIEW

A1 CORNER

INDEX AREA

A B C D E F G H

Figure 3. Pin Configuration

(Not to S cale)

2345678910

05955-003

Table 8. Pin Function Descriptions

Ball Location Mnemonic Type

Description

B2 SL_A DI 3-Wire Serial Load for Channel A.

C2 SDATA_A DI 3-Wire Serial Data for Channel A.

D2 SCK_A DI 3-Wire Serial Clock for Channel A.

C1 REFT_A AO Reference with Top Decoupling for Channel A. Decouple with 0.1 μF to AVSS_A.

D1 REFB_A AO Reference with Bottom Decoupling for Channel A. Decouple with 0.1 μF to AVSS_A.

A1 CCDINM_A AI Analog Input for Channel A Image Sensor Signal.

F4 H1_A DO CCD Horizontal Clock 1 for Channel A.

F3 H2_A DO CCD Horizontal Clock 2 for Channel A.

D4 H3_A DO CCD Horizontal Clock 3 for Channel A.

D3 H4_A DO CCD Horizontal Clock 4 for Channel A.

B4 RG_A DO CCD Reset Gate Clock for Channel A.

J2 DRVSS_A P Digital Driver Ground for Channel A.

K3 DRVDD_A P Digital Driver Supply for Channel A: 1.8 V or 3.0 V.

E3 HVSS_A P H1_A to H4_A Driver Ground for Channel A.

E4 HVDD_A P H1_A to H4_A Driver Supply for Channel A: 3.0 V.

C3 RGVSS_A P RG_A Driver Ground for Channel A.

C4 RGVDD_A P RG_A Driver Supply for Channel A: 3.0 V.

B3 IOVDD_A P

Digital I/O Supply: 1.8 V or 3.0 V (HD, VD, SL, SCK, SDATA) and LDO Input (3.0 V Only)

When LDO Is Used. A4 CLI_A DI Master Clock Input for Channel A. B1 AVSS_A P Analog Ground for Channel A. A2 CCDINP_A AI Analog Input for Channel A Image Sensor Signal. F2 DVSS_A P Digital Ground for Channel A. F1 DVDD_A P Digital Supply for Channel A: 1.8 V. E2 VD_A DI Vertical Sync Pulse for Channel A. E1 HD_A DI Horizontal Sync Pulse for Channel A. B8 SL_B DI 3-Wire Serial Load for Channel B. C8 SDATA_B DI 3-Wire Serial Data for Channel B. A5 LDO_OUT_A P 1.8 V LDO Output from Channel A. A6 CCDINM_B AI Analog Input for Channel B Image Sensor Signal. D8 SCK_B DI 3-Wire Serial Clock for Channel B. C7 REFT_B AO Reference with Top Decoupling for Channel B. Decouple with 0.1 μF to AVSS_B. D7 REFB_B AO Reference with Bottom Decoupling for Channel B. Decouple with 0.1 μF to AVSS_B. A7 CCDINP_B AI Analog Input for Channel B Image Sensor Signal. F10 H1_B DO CCD Horizontal Clock 1 for Channel B. F9 H2_B DO CCD Horizontal Clock 2 for Channel B.

Rev. A | Page 9 of 52

AD9974

Ball Location Mnemonic Type

Description

D10 H3_B DO CCD Horizontal Clock 3 for Channel B. D9 H4_B DO CCD Horizontal Clock 4 for Channel B. B10 RG_B DO CCD Reset Gate Clock for Channel B. J8 DRVSS_B P Digital Driver Ground for Channel B. K9 DRVDD_B P Digital Driver Supply for Channel B: 1.8 V or 3.0 V. E9 HVSS_B P H1_B to H4_B Driver Ground for Channel B. E10 HVDD_B P H1_B to H4_B Driver Supply for Channel B: 3.0 V. C9 RGVSS_B P RG_B Driver Ground for Channel B. C10 RGVDD_B P RG_B Driver Supply for Channel B: 3.0 V. B9 IOVDD_B P

Digital I/O Supply: 1.8 V or 3.0 V (HD, VD, SL, SCK, SDATA) and LDO Input (3.0 V Only)

When LDO Is Used. A10 LDO_OUT_B P 1.8 V LDO Output from Channel B. B7 AVSS_B P Analog Ground for Channel B. A8 AVDD_B P Analog Supply for Channel B: 1.8 V. F8 DVSS_B P Digital Ground for Channel B. F7 DVDD_B P Digital Supply for Channel B: 1.8 V. E8 VD_B DI Vertical Sync Pulse for Channel B. E7 HD_B DI Horizontal Sync Pulse for Channel B. A3 AVDD_A P Analog Supply for Channel A: 1.8 V. G1 D0_A DO Data Outputs Channel A. H1 D1_A DO Data Outputs Channel A. J1 D2_A DO Data Outputs Channel A. K1 D3_A DO Data Outputs Channel A. G2 D4_A DO Data Outputs Channel A. H2 D5_A DO Data Outputs Channel A. K2 D6_A DO Data Outputs Channel A. G3 D7_A DO Data Outputs Channel A. H3 D8_A DO Data Outputs Channel A. J3 D9_A DO Data Outputs Channel A. K4 D10_A DO Data Outputs Channel A. J4 D11_A DO Data Outputs Channel A. H4 D12_A DO Data Outputs Channel A. G4 D13_A DO Data Outputs Channel A. B5, C5, D5, E5, F5, G5, H5,

GND P Ground Connection. J5, K5, B6, C6, D6, E6, F6, G6, H6, J6, K6

A9 CLI_B DI Master Clock Input for Channel B. G7 D0_B DO Data Outputs Channel B. H7 D1_B DO Data Outputs Channel B. J7 D2_B DO Data Outputs Channel B. K7 D3_B DO Data Outputs Channel B. G8 D4_B DO Data Outputs Channel B. H8 D5_B DO Data Outputs Channel B. K8 D6_B DO Data Outputs Channel B. G9 D7_B DO Data Outputs Channel B. H9 D8_B DO Data Outputs Channel B. J9 D9_B DO Data Outputs Channel B. K10 D10_B DO Data Outputs Channel B. J10 D11_B DO Data Outputs Channel B. H10 D12_B DO Data Outputs Channel B. G10 D13_B DO Data Outputs Channel B.

AI = analog input, AO = analog output, DI = digital input, DO = digital output, P = power.

Rev. A | Page 10 of 52

AD9974

TYPICAL PERFORMANCE CHARACTERISTICS

250

200

150

100

POWER (mW)

20 25 30 35 40 45 50 55 60 65

TOTAL POWER

3.3V SUPPLIES

1.8V SUPPLIES

SAMPLE RATE (MHz)

Figure 4. Power vs. Sample Rate

05955-005

LSB

–2

–4

–6

–8

2k 4k 6k 8k 10k 12k 14k 16k

ADC OUTPUT CODE

05955-008

Figure 7. Integral Nonlinearity

180

160

140

120

100

RMS OUTPUT NOISE (LSB)

0 5 10 15 20 25 30 35 40 45

VGA GAIN (dB)

Figure 5. RMS Output Noise vs. VGA Gain

1.0

0.8

0.6

0.4

0.2

LSB

–0.2

–0.4

–0.6

–0.8 –1.0

2k 4k 6k 8k 10k 12k 14k 16k

ADC OUTPUT CODE

Figure 6. Differential Nonlinearity

1.0

0.8

0.6

0.4

0.2

–0.2

INL MISMATCH (%)

–0.4

–0.6

–0.8

–1.0

3k 5k 7k 9k 11k 13k 15k

05955-006

ADC OUTPUT CODE

05955-009

Figure 8. Linearity Mismatch vs. ADC Output Code

05955-007

Rev. A | Page 11 of 52

AD9974

EQUIVALENT INPUT/OUTPUT CIRCUITS

AVSS AVSS

Figure 9. CCDIN Input

IOVDD

330Ω

IOVDD

CLI

05955-010

330Ω

AVSS

100kΩ

05955-011

Figure 11. CLI Input, Register 0x15[0] = 1 Enables the Bias Circuit

HVDD OR RGVDD

DATA

ENABLE

OUTPUT

DVSS

Figure 10. Digital Inputs

05955-012

HVSS OR RGVSS

5955-013

Figure 12. H1 to H4 and RG Outputs

Rev. A | Page 12 of 52

AD9974

TERMINOLOGY

Differential Nonlinearity (DNL)

An ideal ADC exhibits code transitions that are exactly 1 LSB apart. DNL is the deviation from this ideal value. Therefore, every code must have a finite width. No missing codes guaranteed to 14-bit resolution indicates that all 16,384 codes, each for its respective input, must be present over all operating conditions.

Peak Nonlinearity

Peak nonlinearity, a full signal chain specification, refers to the peak deviation of the output of the AD9974 from a true straight line. The point used as zero scale occurs 0.5 LSB before the first code transition. Positive full scale is defined as a level 1 LSB and 0.5 LSB beyond the last code transition. The deviation is measured from the middle of each particular output code to the true straight line. The error is then expressed as a percentage of the 2 V ADC full-scale signal. The input signal is always appropriately gained up to fill the ADC full-scale range.

Tot a l O ut p ut Noi se

The rms output noise is measured using histogram techniques. The standard deviation of the ADC output codes is calculated in LSB and represents the rms noise level of the total signal chain at the specified gain setting. The output noise can be converted to an equivalent voltage using the relationship

1 LSB = (ADC Full Scale/2

where n is the bit resolution of the ADC. For the AD9974, 1 LSB is approximately 122.0 μV.

Linearity Mismatch

The linearity mismatch is calculated by taking the difference in INL of the two channels at Input X, and then expressing the difference as a percentage of the output code at X. The values given in Tab le 2 are obtained over the range of 1⁄16 and maximum of the output code. The general trend is for the linearity mismatch to decrease as the output approaches the maximum code, as shown in Figure 8.

Codes)

MAX

OUTPUT CODE (LSB)

OUTPUT (X)

MAX/16

INL A(X)

INL B(X)

XFS

INPUT VOLTAGE

Figure 13. Linearity Mismatch Definition

CHANNEL B

IDEAL

CHANNEL A

Power Supply Rejection (PSR)

The PSR is measured with a step change applied to the supply pins. The PSR specification is calculated from the change in the data outputs for a given step change in the supply voltage.

Crosstalk

The crosstalk is measured while applying a full-scale step to one channel and measuring the interference on the opposite channel.

)(

LSBceInterferen

⎛ ⎜

×=

Crosstalk

log20)dB(

⎜ ⎝

384,16

⎞ ⎟

⎟ ⎠

5955-004

MismatchLinearity

(%)

−

XBINLXAINL

)()(

XCodeOutput

)(

Rev. A | Page 13 of 52

AD9974

THEORY OF OPERATION

V DRIVER

H1_A TO H4_A, RG_A H1_B TO H4_B, RG_B

CCDINP_A CCDINM_A

CCD

CCDINP_B CCDINM_B

V1 > Vx, VSG 1 > VS Gx, SUBCK

AD9974

INTEGRATED

AFE + TD

SERIAL

INTERFACE

DOUT_A DOUT_B

HD_A, VD_A, HD_B, VD_B

CLI_A, CLI _B

DIGITAL IMAGE

PROCESSING

ASIC

05955-014

Figure 14. Typical Application

Figure 14 shows the typical system block diagram for the AD9974. The charge-coupled device (CCD) output is processed by the analog front-end (AFE) circuitry of the AD9974, consisting of a CDS, VGA, black level clamp, and ADC. The digitized pixel information is sent to the digital image processor chip, which performs the postprocessing and compression. To operate the CCD, all CCD timing parameters are programmed into the AD9974 from the system ASIC through the 3-wire serial interface. From the system master clock, CLI_X, which is provided by the image processor or external crystal, the AD9974 generates the horizontal clocks of the CCD and all internal AFE clocks.

MAX VD LENG TH IS 8192 LINES

All AD9974 clocks are synchronized with VD and HD inputs. All of the AD9974 horizontal pulses (CLPOB, PBLK, and HBLK) are programmed and generated internally.

The H-drivers for H1 to H4 and RG are included in the AD9974, allowing these clocks to be directly connected to the CCD. An H-driver voltage of 3 V is supported in the AD9974.

Figure 15 and Figure 16 show the maximum horizontal and vertical counter dimensions for the AD9974. All internal horizontal and vertical clocking is controlled by these counters, which specify line and pixel locations. Maximum HD length is 8191 pixels per line, and maximum VD length is 8191 lines per field.

MAXIMUM COUNTE R DIM ENS I O NS

13-BIT HORIZONTAL = 8192 PIXELS MAX

13-BIT VERTICAL = 8192 L INES MAX

5955-015

Figure 15. Vertical and Horizontal Counters

CLI

MAX HD LENGTH IS 8192 PIXELS

Figure 16. Maximum VD/HD Dimensions

Rev. A | Page 14 of 52

05955-016

AD9974

PROGRAMMABLE TIMING GENERATION

PRECISION TIMING HIGH SPEED TIMING CORE

The AD9974 generates flexible high speed timing signals using the Precision Timing core. This core, composed of the Reset Gate RG, Horizontal Driver H1 to Horizontal Driver H4, and SHP/SHD sample clocks, is the foundation for generating the timing for both the CCD and the AFE. A unique architecture makes it routine for the system designer to optimize image quality by providing precise control over the horizontal CCD readout and the AFE correlated double sampling.

Timing Resolution

The Precision Timing core uses a master clock input (CLI_X) as a reference. This clock input should be the same as the CCD pixel clock frequency. Figure 17 illustrates how the internal timing core divides the master clock period into 64 steps or edge positions; therefore, the edge resolution of the Precision Timing core is (t

/64). For more information on using the CLI input, refer to

CLI

the Applications Information section.

POSITION

P[0] P[64] = P[0]P[16] P[32] P[48]

Using a 65 MHz CLI frequency, the edge resolution of the Precision Timing core is approximately 240 ps. If a 1× system clock is not available, it is possible to use a 2× reference clock by programming the CLIDIVIDE register (Address 0x0D). The AD9974 then internally divides the CLI frequency by 2.

High Speed Clock Programmability

Figure 18 shows when the high speed clocks, RG, H1 to H4, SHP, and SHD, are generated. The RG pulse has programmable rising and falling edges and can be inverted using the polarity control. The H1 and H2 horizontal clocks have separate programmable rising and falling edges, as well as separate polarity control. The AD9974 provides additional HCLK-mode programmability, as described in Ta bl e 9 .

The edge location registers are each six bits wide, allowing the selection of all 64 edge locations. Figure 21 shows the default timing locations for all of the high speed clock signals.

CLI

CLIDLY

1 PIXEL

PERIOD

NOTES

1. THE PIXEL CLOCK PERIOD IS DIVIDED INTO 64 POSITIONS, PROVIDING FINE EDGE RESOLUTION FOR HIGH SPEED CLOCKS.

2. THERE IS A F I XED DELAY FROM THE CLI INPUT TO THE INTERNAL PIXEL PERIOD POSITION (

CLIDLY

5955-017

Figure 17. High Speed Clock Resolution from CLI Master Clock Input

CCD

IGNAL

H1, H3

H2, H4

PROGRAMMABLE CLOCK POSI T IONS:

SHP SAMPLE LOCATION.

SHD SAMPLE LO CAT I O N.

RG RISING EDGE.

RG FALLING EDGE.

H1 RISING EDGE.

H1 FALLING EDGE.

Figure 18. High Speed Clock Programmable Locations (HCLK Mode 1)

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Rev. A | Page 15 of 52

AD9974

H1, H3

H2, H4

H1 TO H4 P R OGRAMM A B LE LO CATI ONS:

H1 RISING EDGE.

H1 FALLING EDGE.

H2 RISING EDGE.

H2 FALLING EDGE.

5955-019

Figure 19. HCLK Mode 2 Operation

H1 TO H4 PROGRAMMABLE LOCATIONS:

H1 RISIN G EDGE .

H1 FALLING EDGE.

H3 RISIN G EDGE .

H3 FALLING EDGE.

05955-020

Figure 20. HCLK Mode 3 Operation

P[0]

P[32]P[16] P[48]POSITION

P[64] = P[0]

CLI

RGr[0] RGf[16]

H1r[0] H1f[32]

CCD

SIGNAL

SHPLOC[32]

SHP

SHDLOC[0]

SHD

DOUTPHASEP

NOTES

1. ALL SIGNAL EDGES ARE FULLY PROGRAMMABLE TO ANY OF THE 64 POSITIONS WITHIN ONE PIXEL PERIOD. TYPICAL P OSITI ONS FOR EACH SIGNAL ARE SHO WN. HCLK MODE 1 IS SHOWN.

2. CERTAIN POSITIONS SHOULD BE AVOIDED FO R EACH SIGNAL, S HOWN ABOVE AS INHIBIT REGIONS.

3. IF A SETTING I N THE INHIBIT REGION IS USED, AN UNSTABLE PIXEL S HIFT CAN OCCUR IN THE HBLK LOCATION OR AF E P IPELINE.

DOUTINH

DATAPHASEP[32]

SHPINH

SHDINH

05955-021

Figure 21. High Speed Timing Default Locations

Rev. A | Page 16 of 52

AD9974

Table 9. HCLK Modes, Selected by HCLKMODE Register (Address 0x23[7:5])

HCLK Mode Register Value Description

Mode 1 001 H1 edges are programmable, with H3 = H1 and H2 = H4 = inverse of H1. Mode 2 010

Mode 3 100

Invalid Selection 000, 011, 101, 110, 111 Invalid register settings.

Table 10. H1, H2, RGCONTROL, DRVCONTROL, and SAMPCONTROL Register Parameters

Parameter Length (Bits) Range Description

Polarity 1 High/low

Positive Edge 6 0 to 63 edge location Positive edge location for H1/H3 and RG. Negative Edge 6 0 to 63 edge location Negative edge location for H1/H3 and RG. Sample Location 6 0 to 63 sample location Sampling location for SHP and SHD. Drive Control 3 0 to 7 current steps Drive current for H1 to H4 and RG outputs, 0 to 7 steps of 4.3 mA each.

CLI

CLIDLY

CCDIN

NN+2N+1

N+3

N+4

H1 edges are programmable, with H3 = H1. H2 edges are programmable, with H4 = H2.

H1 edges are programmable, with H2 = inverse of H1. H3 edges are programmable, with H4 = inverse of H3.

Polarity control for H1/H3 and RG.

0 = no inversion. 1 = inversion.

N+13N+12N+11N+10N+9N+8N+7N+6N+5

N+14

N+16 N+17N+15

SHD

(INTERNAL)

ADC OUT

(INTERNAL)

DOUTPHASE

CLK

DOUT

NOTES

1. EXAMPLE SHOWN FOR SHDLO C = 0.

2. HIGHER VALUES OF SHD AND/ OR DOUTPHASE W ILL SHIFT DOUT TRANSITIO N TO THE RIGHT, WITH RESPECT TO CLI LOCATIO N.

SAMPLE PIXEL N

DOUTINH

N–14 N–4N–5N–6N–7N–8N–9N–10N–11N–12N–13 N–3 N–2 N–1 N N+1N–15N–16N–17

PIPELINE LATENCY = 16 CYCLES

N–14 N–4N–5N–6N–7N–8N–9N–10N–11N–12N–13 N–3 N–2 N–1 N N+1N–15N–16N–17

Figure 22. Pipeline Delay of AFE Data Outputs

H-Driver and RG Outputs Digital Data Outputs

In addition to the programmable timing positions, the AD9974 features on-chip output drivers for the RG and H1 to H4 outputs. These drivers are powerful enough to drive the CCD inputs directly. The H-driver and RG-driver current can be adjusted for optimum rise/fall time into a particular load by using the drive strength control registers (Address 0x35). Use the register to adjust the drive strength in 4.3 mA increments. The minimum setting of 0 is equal to off or three-state, and the maximum setting of 7 is equal to 30.1 mA.

For maximum system flexibility, the AD9974 uses the DOUTPHASE registers (Address 0x37[11:0]) to select the location for the start of each new pixel data value. Any edge location from 0 to 63 can be programmed. These registers determine the start location of the data output and the DCLK rising edge with respect to the master clock input, CLI_X.

The pipeline delay through the AD9974 is shown in Figure 22. After the CCD input is sampled by SHD, there is a 16-cycle delay until the data is available.

5955-022

Rev. A | Page 17 of 52

AD9974

HORIZONTAL CLAMPING AND BLANKING

The horizontal clamping and blanking pulses of the AD9974 are fully programmable to suit a variety of applications. Individual control is provided for CLPOB, PBLK, and HBLK during the different regions of each field. This allows the dark pixel clamping and blanking patterns to be changed at each stage of the readout to accommodate different image transfer timing and high speed line shifts.

Individual CLPOB and PBLK Patterns

The AFE horizontal timing consists of CLPOB and PBLK, as shown in Figure 23. These two signals are programmed independently using the registers in Tab le 1 1 . The start polarity for the CLPOB or PBLK signal is CLPOB_POL (PBLK_POL), and the first and second toggle positions of the pulse are CLPOB_TOG1 (PBLK_TOG1) and CLPOB_TOG2 (PBLK_TOG2). Both signals are active low and need to be programmed accordingly.

Two separate patterns for CLPOB and PBLK can be programmed for each H-pattern, CLPOB0, CLPOB1, PBLK0, and PBLK1. The CLPOB_PAT and PBLK_PAT field registers select which of the two patterns is used in each field.

Figure 34 shows how the sequence change positions divide the readout field into different regions. By assigning a different H-pattern to each region, the CLPOB and PBLK signals can change with each change in the vertical timing.

CLPOB and PBLK Masking Area

Additionally, the AD9974 allows the CLPOB and PBLK signals to be disabled during certain lines in the field without changing any of the existing pattern settings. There are three sets of start and end registers for both CLPOB and PBLK that allow the creation of up to three masking areas for each signal.

For example, to use the CLPOB masking, program the CLPOBMASKSTART and CLPOBMASKEND registers to specify the starting and ending lines in the field where the CLPOB patterns are to be ignored. Figure 24 illustrates this feature.

The masking registers are not specific to a certain H-pattern; they are always active for any existing field of timing. To disable the CLPOB and PBLK masking feature, set these registers to the maximum value of 0x1FFF.

Note that to disable CLPOB and PBLK masking during power-up, it is recommended that CLPOBMASKSTART (PBLKMASKSTART) be set to 8191 and CLPOBMASKEND (PBLKMASKEND) be set to 0. This prevents any accidental masking caused by different register update events.

CLPOB

PBLK

PROGRAMMABLE SETTI NGS :

START POLARITY (CLAM P AND BLANK REGION ARE ACTIVE LO W).

FIRST TOGGLE POSITION.

SECOND TOGGLE POSITION.

ACTIVE

Figure 23. Clamp and Preblank Pulse Placement

ACTIVE

05955-023

LPOB

NO CLPOB SI GNAL

FOR LINE S 6 TO 8

0 1 2 597 598

CLPOBMASKSTART1 = 6 CL P OBMASKEND1 = 8

Figure 24. CLPOB Masking Example

CLPOBMASKSTART2 = CLPOBMASKEND2 = 600

NO CLPOB SI GNAL

FOR LINE 600

05957-024

Rev. A | Page 18 of 52

AD9974

Table 11. CLPOB and PBLK Pattern Registers

Parameter Length (Bits) Range Description

CLPOB0_TOG1 13 0 to 8191 pixel location First CLPOB0 toggle position within the line for each V-sequence. CLPOB0_TOG2 13 0 to 8191 pixel location Second CLPOB0 toggle position within the line for each V-sequence. CLPOB1_TOG1 13 0 to 8191 pixel location First CLPOB1 toggle position within the line for each V-sequence. CLPOB1_TOG2 13 0 to 8191 pixel location Second CLPOB1 toggle position within the line for each V-sequence. CLPOB_POL 9 High/low Starting polarity of CLPOB for each V-sequence [8:0] (in field registers). CLPOB_PAT 9 0 to 9 settings CLPOB pattern selection for each V-sequence [8:0] (in field registers). CLPOBMASKSTART 13 0 to 8191 pixel location CLPOB mask start position: three values available (in field registers). CLPOBMASKEND 13 0 to 8191 pixel location CLPOB mask end position: three values available (in field registers). PBLK0_TOG1 13 0 to 8191 pixel location First PBLK0 toggle position within the line for each V-sequence. PBLK0_TOG2 13 0 to 8191 pixel location Second PBLK0 toggle position within the line for each V-sequence. PBLK1_TOG1 13 0 to 8191 pixel location First PBLK1 toggle position within the line for each V-sequence. PBLK1_TOG2 13 0 to 8191 pixel location Second toggle position within the line for each V-sequence. PBLK_POL 9 High/low Starting polarity of PBLK for each V-sequence [8:0] (in field registers). PBLK_PAT 9 0 to 9 settings PBLK pattern selection for each V-sequence [8:0] (in field registers). PBLKMASKSTART 13 0 to 8191 pixel location PBLK mask start position: three values available (in field registers). PBLKMASKEND 13 0 to 8191 pixel location PBLK mask end position: three values available (in field registers).

HBLKTOGE1 HBLKTOGE2

HBLK

BLANK BLANK

BASIC HBLK PULSE IS GENERATED USING HBLKTOGE1 AND HBLKTOGE2 REGISTERS ( HBLKALT = 0).

Figure 25. Typical Horizontal Blanking Pulse Placement (HBLKMODE = 0)

05955-025

HBLK

H1/H3

THE POLARITY OF H1/H3 DURING BLANKI NG IS PROG RAM M ABLE (H2/H4 POLARITY IS SEPARATELY PROGRAMMABLE)

H1/H3

H2/H4

Figure 26. HBLK Masking Control

05955-026

Rev. A | Page 19 of 52

AD9974

Individual HBLK Patterns

The HBLK programmable timing shown in Figure 25 is similar to CLPOB and PBLK; however, there is no start polarity control. Only the toggle positions designate the start and the stop positions of the blanking period. Additionally, as shown in Figure 26, there is a polarity control, HBLKMASK, for H1/H3 and H2/H4 that designates the polarity of the horizontal clock signals during the blanking period. Setting HBLKMASK_H1 low sets H1 = H3 = low and HBLKMASK_H2 high sets H2 = H4 = high during the blanking. As with the CLPOB and PBLK signals, HBLK registers are available in each H-pattern group, allowing unique blanking signals to be used with different vertical timing sequences.

The AD9974 supports three modes of HBLK operation. HBLK Mode 0 supports basic operation and provides some support for special HBLK patterns. HBLK Mode 1 supports pixel mixing HBLK operation. HBLK Mode 2 supports advanced HBLK operation. The following sections describe each mode. Register parameters are detailed in Tab l e 1 2 .

HBLKTOGE2

HBLKTOGE1

HBLKTOGE3

HBLKTOGE4

HBLK Mode 0 Operation

There are six toggle positions available for HBLK. Normally, only two of the toggle positions are used to generate the standard HBLK interval. However, the additional toggle positions can be used to generate special HBLK patterns, as shown in Figure 27. The pattern in this example uses all six toggle positions to generate two extra groups of pulses during the HBLK interval. By changing the toggle positions, different patterns are created.

Separate toggle positions are available for even and odd lines. If alternation is not needed, load the same values into the registers for even (HBLKTOGE) and odd (HBLKTOGO) lines.

HBLKTOGE6

HBLKTOGE5

HBLK

H1/H3

H2/H4

SPECIAL H-BL ANK P ATTERN IS CREATED USING MUL TIPLE HBLK TOGGLE POSITIONS (HBL KALT = 0).

Figure 27. Generating Special HBLK Patterns

05955-027

Table 12. HBLK Pattern Registers

HBLK_MODE 2 0 to 2 HBLK modes Enables different HBLK toggle position operations.

0 = normal mode. Six toggle positions available for even and odd lines. If even/odd alternation is not needed, set toggles for even/odd the same.

1 = pixel mixing mode. In addition to six toggle positions, the HBLKSTART, HBLKEND, HBLKLEN, and HBLKREP registers can be used to generate HBLK patterns. If even/odd alternation is not needed, set toggles for even/odd the same.

2 = advanced HBLK mode. Divides HBLK interval into six different repeat

areas. Uses HBLKSTARTA/B/C and RA*H*REPA/B/C registers. 3 = test mode only. Do not access. HBLKSTART 13 0 to 8191 pixel location Start location for HBLK in HBLK Mode 1 and HBLK Mode 2. HBLKEND 13 0 to 8191 pixel location End location for HBLK in HBLK Mode 1 and HBLK Mode 2. HBLKLEN 13 0 to 8191 pixels HBLK length in HBLK Mode 1 and HBLK Mode 2. HBLKREP 13 0 to 8191 repetitions Number of HBLK repetitions in HBLK Mode 1 and HBLK Mode 2. HBLKMASK_H1 1 High/low Masking polarity for H1 and H3 during HBLK. HBLKMASK_H2 1 High/low Masking polarity for H2 and H4 during HBLK.

Rev. A | Page 20 of 52

AD9974

HBLKTOGO1 13 0 to 8191 pixel location First HBLK toggle position for odd lines in HBLK Mode 0 and HBLK Mode 1. HBLKTOGO2 13 0 to 8191 pixel location Second HBLK toggle position for odd lines in HBLK Mode 0 and HBLK Mode 1. HBLKTOGO3 13 0 to 8191 pixel location Third HBLK toggle position for odd lines in HBLK Mode 0 and HBLK Mode 1. HBLKTOGO4 13 0 to 8191 pixel location Fourth HBLK toggle position for odd lines in HBLK Mode 0 and HBLK Mode 1. HBLKTOGO5 13 0 to 8191 pixel location Fifth HBLK toggle position for odd lines in HBLK Mode 0 and HBLK Mode 1. HBLKTOGO6 13 0 to 8191 pixel location Sixth HBLK toggle position for odd lines in HBLK Mode 0 and HBLK Mode 1. HBLKTOGE1 13 0 to 8191 pixel location First HBLK toggle position for even lines in HBLK Mode 0 and HBLK Mode 1. HBLKTOGE2 13 0 to 8191 pixel location Second HBLK toggle position for even lines in HBLK Mode 0 and HBLK Mode 1. HBLKTOGE3 13 0 to 8191 pixel location Third HBLK toggle position for even lines in HBLK Mode 0 and HBLK Mode 1. HBLKTOGE4 13 0 to 8191 pixel location Fourth HBLK toggle position for even lines in HBLK Mode 0 and HBLK Mode 1. HBLKTOGE5 13 0 to 8191 pixel location Fifth HBLK toggle position for even lines in HBLK Mode 0 and HBLK Mode 1. HBLKTOGE6 13 0 to 8191 pixel location Sixth HBLK toggle position for even lines in HBLK Mode 0 and HBLK Mode 1. RA0H1REPA/B/C 12

[3:0] RA0H1REPA. Number of H1 pulses following HBLKSTARTA. [7:4] RA0H1REPB. Number of H1 pulses following HBLKSTARTB. [11:8] RA0H1REPC. Number of H1 pulses following HBLKSTARTC. RA1H1REPA/B/C 12 0 to 15 HCLK pulses HBLK Repeat Area 1. Number of H1 repetitions for HBLKSTARTA/B/C. RA2H1REPA/B/C 12 0 to 15 HCLK pulses HBLK Repeat Area 2. Number of H1 repetitions for HBLKSTARTA/B/C. RA3H1REPA/B/C 12 0 to 15 HCLK pulses HBLK Repeat Area 3. Number of H1 repetitions for HBLKSTARTA/B/C. RA4H1REPA/B/C 12 0 to 15 HCLK pulses HBLK Repeat Area 4. Number of H1 repetitions for HBLKSTARTA/B/C. RA5H1REPA/B/C 12 0 to 15 HCLK pulses HBLK Repeat Area 5. Number of H1 repetitions for HBLKSTARTA/B/C. RA0H2REPA/B/C 12

[3:0] RA0H2REPA. Number of H2 pulses following HBLKSTARTA. [7:4] RA0H2REPB. Number of H2 pulses following HBLKSTARTB. [11:8] RA0H2REPC. Number of H2 pulses following HBLKSTARTC. RA1H2REPA/B/C 12 0 to 15 HCLK pulses HBLK Repeat Area 1. Number of H2 repetitions for HBLKSTARTA/B/C. RA2H2REPA/B/C 12 0 to 15 HCLK pulses HBLK Repeat Area 2. Number of H2 repetitions for HBLKSTARTA/B/C. RA3H2REPA/B/C 12 0 to 15 HCLK pulses HBLK Repeat Area 3. Number of H2 repetitions for HBLKSTARTA/B/C. RA4H2REPA/B/C 12 0 to 15 HCLK pulses HBLK Repeat Area 4. Number of H2 repetitions for HBLKSTARTA/B/C. RA5H2REPA/B/C 12 0 to 15 HCLK pulses HBLK Repeat Area 5. Number of H2 repetitions for HBLKSTARTA/B/C. HBLKSTARTA 13 0 to 8191 pixel location HBLK Repeat Area Start Position A for HBLK Mode 2. HBLKSTARTB 13 0 to 8191 pixel location HBLK Repeat Area Start Position B for HBLK Mode 2. HBLKSTARTC 13 0 to 8191 pixel location HBLK Repeat Area Start Position C for HBLK Mode 2. HBLKALT_PAT1 3 0 to 5 even repeat area

HBLKALT_PAT2 3 0 to 5 even repeat area HBLK Mode 2, Odd Field Repeat Area 1 pattern. HBLKALT_PAT3 3 0 to 5 even repeat area HBLK Mode 2, Odd Field Repeat Area 2 pattern. HBLKALT_PAT4 3 0 to 5 even repeat area HBLK Mode 2, Odd Field Repeat Area 3 pattern. HBLKALT_PAT5 3 0 to 5 even repeat area HBLK Mode 2, Odd Field Repeat Area 4 pattern. HBLKALT_PAT6 3 0 to 5 even repeat area HBLK Mode 2, Odd Field Repeat Area 5 pattern.

0 to 15 HCLK pulses for each A, B, and C

HBLK Repeat Area 0. Number of H1 repetitions for HBLKSTARTA/B/C in HBLK Mode 2 for even lines; odd lines are defined using HBLKALT_PAT.

HBLK Repeat Area 0. Number of H2 repetitions for HBLKSTARTA/B/C in HBLK Mode 2 for even lines; odd lines are defined using HBLKALT_PAT.

HBLK Mode 2, Odd Field Repeat Area 0 pattern, selected from even field. Repeat areas previously defined.

Rev. A | Page 21 of 52

AD9974

HBLK Mode 1 Operation

Enable multiple repeats of the HBLK signal by setting HBLK_MODE to 1. In this mode, the HBLK pattern can be generated using a different set of registers: HBLKSTART, HBLKEND, HBLKLEN, and HBLKREP, along with the six toggle positions (see Figure 28).

Separate toggle positions are available for even and odd lines. If alternation is not needed, load the same values into the registers for even (HBLKTOGE) and odd (HBLKTOGO) lines.

Generating HBLK Line Alternation

HBLK Mode 0 and HBLK Mode 1 provide the ability to alternate different HBLK toggle positions on even and odd lines. Separate toggle positions are available for even and odd lines. If even/odd line alternation is not required, load the same values into the registers for even (HBLKTOGE) and odd (HBLKTOGO) lines.

Table 13. HCLK Width Register

HCLK_WIDTH 4 Controls H1 to H4 width during HBLK as a fraction of pixel rate. 0 = same frequency as pixel rate. 1 = 1/2 pixel frequency, that is, doubles the HCLK pulse width. 2 = 1/4 pixel frequency. 3 = 1/6 pixel frequency. 4 = 1/8 pixel frequency. 5 = 1/10 pixel frequency. … 15 = 1/30 pixel frequency.

HBLKSTART HBLKTOGE1

HBLKTOGE2

HBL

TOGE4

Increasing H-Clock Width During HBLK

HBLK Mode 0 and HBLK Mode 1 allow the H1 to H4 pulse width to be increased during the HBLK interval. As shown in Figure 29, the H-clock frequency can be reduced by a factor of 1/2, 1/4, 1/6, 1/8, 1/10, 1/12, and so on, up to 1/30. To enable this feature, the HCLK_WIDTH register (Address 0x34[7:4]) is set to a value between 1 and 15. When this register is set to 0, the wide HCLK feature is disabled. The reduced frequency occurs only for H1 to H4 pulses that are located within the HBLK area.

The HCLK_WIDTH register is generally used in conjunction with special HBLK patterns to generate vertical and horizontal mixing in the CCD.

Note that the wide HCLK feature is available only in HBLK Mode 0 and HBLK Mode 1, not in HBLK Mode 2.

HBLKENDHBLKTOGE3

HBLK

HBLKLEN

HBLKREP = 3

H1/H3

H2/H4

HBLKREP NUMBER 1 HBLKREP NUMBER 2 HBLKREP NUMBER 3

H-BLANK REPE ATING PATTERN IS CREATED USING HBLKLEN AND HBLKRE P RE GISTERS.

Figure 28. HBLK Repeating Pattern Using HBLKMODE = 1

05955-028

HBLK

H1/H3

H2/H4

1/F

PIX

H-CLOCK FREQUENCY CAN BE REDUCED DURING HBLK BY 1/2 (AS SHO WN), 1/4, 1/6, 1/8, 1/10, 1/12, AND SO ON, UP TO 1/30 USI NG HBLKWI DTH REGISTER.

Figure 29. Generating Wide H-Clock Pulses During HBLK Interval

2 × (1/F

)

PIX

Rev. A | Page 22 of 52

5955-029

AD9974

HBLK Mode 2 Operation

HBLK Mode 2 allows more advanced HBLK pattern operation. If unevenly spaced HCLK pulses in multiple areas are needed, HBLK Mode 2 can be used. Using a separate set of registers, HBLK Mode 2 can divide the HBLK region into up to six repeat areas (see Tab l e 1 2 ). As shown in Figure 31, each repeat area shares a common group of toggle positions, HBLKSTARTA, HBLKSTARTB, and HBLKSTARTC. However, the number of toggles following each start position can be unique in each repeat area by using the RAH1REP and RAH2REP registers. As shown in Figure 30, setting the RAH1REPA/RAH1REPB/ RAH1REPC or RAH2REPA/RAH2REPB/RAH2REPC registers to 0 masks HCLK groups from appearing in a particular repeat area. Figure 31 shows only two repeat areas being used, although six are available. It is possible to program a separate number of repeat area repetitions for H1 and H2, but generally the same value is used for both H1 and H2.

CREAT E UP TO 3 GROUPS OFTOGGLES A, B, C COMMON IN ALL REPEAT AREAS

MASK A, B, C PULSES IN ANY REPEAT

AREA BY SETTING RA*H*REP* = 0

Figure 31 shows the following example:

RA0H1REPA/RA0H1REPB/RA0H1REPC = RA0H2REPA/RA0H2REPB/RA0H2REPC = RA1H1REPA/RA1H1REPB/RA1H1REPC = RA1H2REPA/RA1H2REPB/RA1H2REPC = 2.

Furthermore, HBLK Mode 2 allows a different HBLK pattern on even and odd lines. The HBLKSTARTA, HBLKSTARTB, and HBLKSTARTC registers, as well as the RAH1REPA/RAH1REPB/ RAH1REPC and RAH2REPA/RAH2REPB/RAH2REPC registers, define operation for the even lines. For separate control of the odd lines, the HBLKALT_PAT registers specify up to six repeat areas on the odd lines by reordering the repeat areas used for the even lines. New patterns are not available, but the order of the previously defined repeat areas on the even lines can be changed for the odd lines to accommodate advanced CCD operation.

CHANGE NUMBER OF A, B, C PULSE S IN AN Y REPEAT AREA USING RA*H*REP* REGI STERS

HBLK

HBLKSTART

REPEATAREA 0

REPEATAREA 1 REPEAT AREA 2 REPEAT AREA 3 REPEAT AREA 4 REPEAT AREA 5

HBLKEND

5955-030

Figure 30. HBLK Mode 2 Operation

HBLKLEN

HBLKSTARTA

HBLKSTARTB

RA0H1REPA

HBLKSTART

RA0H2REPA

RA0H1REPB RA0H1REPC

RA0H2REPB RA0H2REPC

REPEAT AREA 0

HBLKSTARTC

HBLKREP = 2

TO CREATE 2 REPEAT AREAS

ALL RA*H*RE PA, B, C RE GISTERS = 2, TO CRE ATE 2 HCL K P ULSES

RA1H1REPA

RA1H2REPA

RA1H1REPB RA1H1REPC

RA1H2REPB RA1H2REPC

REPEATAREA 1

HBLKEND

05955-031

Figure 31. HBLK Mode 2 Registers

Rev. A | Page 23 of 52

AD9974

HBLK, PBLK, and CLPOB Toggle Positions

The AD9974 uses an internal horizontal pixel counter to position the HBLK, PBLK, and CLPOB toggle positions. The horizontal counter does not reset to 0 until 12 CLI periods after the falling edge of HD. This 12-cycle pipeline delay must be considered when determining the register toggle positions. For example, if CLPOB_TOG1 is 100 and the pipeline delay is not considered, the final toggle position is applied at 112. To obtain the correct toggle positions, the toggle position registers must be set to the desired toggle position minus 12.

PIXEL NO.

For example, if the desired toggle position is 100, CLPOB_TOG should be set to 88 (that is, 100 − 12). Figure 49 shows the 12-cycle pipeline delay referenced to the falling edge of HD.

Caution

Toggle positions cannot be programmed during the 12-cycle delay from the HD falling edge until the H-counter has reset. See Figure 33 for an example of this restriction.

112103100600

(PIXEL COUNTER )

CLPOB

H-COUNTER

DESIRED TOGGLE

1. HBLKTOG1 60 (60 – 12) = 48

2. HBLKTOG2 100 ( 100 – 12) = 88

3. CLPOB_TOG1 103 (103 – 12) = 91

4. CLPOB_TOG2 112 (112 – 12) = 100

POSITION

ACTUAL REGISTER VALUE

Figure 32. Example of Register Setting to Obtain Desired Toggle Positions

NO TOGGLE POSITIONSALLOWED IN THISAREA

XXXX

NOTES

1. TOGGLE POSITIONS CANNOT BE PROGRAMMED W ITHIN 12 PI XELS OF P IXEL 0 LOCATION.

N-1 N 0 1 2N-2N-3N-4N-5N-6N-7N-8N-9N-10N-11N-12

Figure 33. Restriction for Toggle Position Placement

H-COUNTER

RESET

05955-032

05955-033

Rev. A | Page 24 of 52

AD9974

COMPLETE FIELD—COMBINING H-PATTERNS

After the H-patterns are created, they combine to create different readout fields. A field consists of up to nine different regions determined by the SCP registers. Within each region, a different H-pattern group can be selected up to a maximum of 32 groups. Registers to control the H-patterns are located in the field registers. Tabl e 31 describes the field registers.

SCP 0

REGION 0

SCP 1 SCP 2

REGION 1 REGION 2 REGION 3 REGI ON 4 REGION 8

H-Pattern Selection

The H-patterns are stored in the HPAT memory, as described in Tabl e 20 . The user decides how many H-pattern groups are required, up to a maximum of 32, and then uses the HPAT_SEL registers to select which H-pattern group is output in each region of the field. Figure 34 shows how to use the HPAT_SEL and SCP registers. The SCP registers create the line boundaries for each region.

H-PATTERNS

HPAT_SEL0 HPAT_SEL1

FIELD SETTINGS:

1. SEQUENCE CHANG E POSIT IONS (SCP0-8) DE FINE EACH OF THE NINE AVAILABLE REGIONS IN THE FIE LD.

2. HPAT_SEL SELECTS THE DESIRED H-PATTERN FOR EACH REGIO N.

HPAT_SEL2

HPAT_SEL3

HPAT_SEL4

HPAT_SEL8

05955-034

Figure 34. Complete Field Divided into Regions

Table 14. Field Registers

SCPx 13 0 to 8191 line number Sequence change position for each region. Selects an individual line. HPAT_SELx 5 0 to 31 H-patterns Selected H-pattern for each region of the field. CLPOB_POL 9 High/low CLPOB start polarity settings for each region of the field. CLPOB_PAT 9 0 to 9 patterns CLPOB pattern selector for each region of the field. CLPOBMASKSTARTx,

13 Number of lines CLPOB mask positions for up to three masking configurations.

CLPOBMASKENDx PBLK_POL 9 High/low PBLK start polarity settings for each region of the field. PBLK_PAT 9 0 to 9 patterns PBLK pattern selector for each region of the field. PBLKMASKSTARTx,

13 Number of lines PBLK mask positions for up to three masking configurations.

PBLKMASKENDx,

Rev. A | Page 25 of 52

AD9974

MODE REGISTERS

The mode registers contain registers to select the final field timing of the AD9974. Typically, all of the field and H-pattern group information is programmed into the AD9974 at startup. During operation, the mode registers allow the user to select any combination of field timing to meet the current requirements of the system. The advantage of using the mode registers in conjunction with preprogrammed timing is that they greatly reduce the system programming requirements during camera operation. Only a few register writes are required when the camera operating mode is changed, rather than having to write in all of the vertical timing information with each camera mode change.

Table 15. Mode Registers

HPATNUM 5 0 to 31 H-pattern groups Total number of H-pattern groups, starting at Address 0x800. FIELDNUM 3 0 to 7 fields Total number of applied fields. Set to 1 for single-field operation. FIELD_SEL1 5 0 to 31 field groups Selected first field. FIELD_SEL2 5 0 to 31 field groups Selected second field. FIELD_SEL3 5 0 to 31 field groups Selected third field. FIELD_SEL4 5 0 to 31 field groups Selected fourth field. FIELD_SEL5 5 0 to 31 field groups Selected fifth field. FIELD_SEL6 5 0 to 31 field groups Selected sixth field. FIELD_SEL7 5 0 to 31 field groups Selected seventh field.

A basic still camera application can require five fields of horizontal timing: one for draft mode operation, one for autofocusing, and three for still image readout. With the AD9974, all of the register timing information for the five fields is loaded at startup. Then, during camera operation, the mode registers select which field timing to activate, depending on how the camera is being used.

The AD9974 supports up to seven field sequences selected from up to 31 preprogrammed field groups using the FIELD_SEL registers. When FIELDNUM is greater than 1, the AD9974 starts with Field 1 and increments to each Field n at the start of each VD.

Figure 35 provides examples of mode configuration settings. This example assumes to have four field groups, Field Group 0 to Field Group 3, stored in memory.

Rev. A | Page 26 of 52

AD9974

H-PATTERN MEMORY

FIELD 0

FIELD 1

FIELD 2

FIELD 3

EXAMPLE 1: TOTAL FIELDS = 3, F IRST FI E LD = FIELD 0, SECOND F IELD = FI E LD 1, THIRD F IELD = FIELD 2

FIELD_SEL1 = 0 FIELD_SEL2 = 1 FIELD_SEL3 = 2

FIELD 0

FIELD 1 FIELD 2

EXAMPLE 2: TOTAL FIELDS = 1, FIRST FIELD = FIELD 3

FIELD_SEL1 = 3

FIELD 3

EXAMPLE 3: TOTAL FIELDS = 4, FIRST FIELD = FIELD 5, SECOND FIELD = FIELD 1, THIRD FI ELD = FIE LD 4, FOURTH FIELD = FIELD 2

FIELD_SEL1 = 5 FIELD_SEL2 = 1 FIELD_SEL3 = 4 FIELD_SEL4 = 2

FIELD 5

FIELD 1 FIELD 4

FIELD 2

05955-035

Figure 35. Example of Mode Configurations

Rev. A | Page 27 of 52

AD9974

HORIZONTAL TIMING SEQUENCE EXAMPLE

Figure 36 shows an example of a CCD layout. The horizontal register contains 28 dummy pixels that occur on each line clocked from the CCD. In the vertical direction, there are 10 optical black (OB) lines at the front of the readout and two at the back of the readout. The horizontal direction has four OB pixels in the front and 48 in the back.

Figure 37 shows the basic sequence layout to use during the effective pixel readout. The 48 OB pixels at the end of each line are used for the CLPOB signals. PBLK is optional and is often used to blank the digital outputs during the HBLK time. HBLK is used during the vertical shift interval.

Because PBLK is used to isolate the CDS input (see the Analog Front End Description and Operation section), do not use the PBLK signal during CLPOB operation. The change in the offset behavior that occurs during PBLK impacts the accuracy of the CLPOB circuitry.

The HBLK, CLPOB, and PBLK parameters are programmed in the V-sequence registers. More elaborate clamping schemes, such as adding a separate sequence to clamp all the shielded OB lines, can be used. This requires configuring a separate V-sequence for clocking out the OB lines.

The CLPOBMASK registers are also useful for disabling the CLPOB on a few lines without affecting the setup of the clamping sequences. It is important to use CLPOB only during valid OB pixels. During other portions on the frame timing, such as vertical blanking or SG line timing, the CCD does not output valid OB pixels. Any CLPOB pulse that occurs during this time causes errors in clamping operation and, therefore, changes in the black level of the image.

2 VERTICAL OB LINES

4 OB PIXELS

EFFECTIVE IMAGE AREA

HORIZONTAL CCD REGISTE R

48 OB PIXELS

10 VERTICAL OB LINES

CCD OUTPUT

OPTICAL BLACK

VERTICAL SHIFT VERT. SHIFT

SHP

SHD

H1/H3

H2/H4

HBLK

PBLK

CLPOB

NOTES

1. PBLK ACTIVE (LOW) S HOULD NOT BE US E D DURING CLPOB ACTIVE (L OW).

DUMMY EFFECTIVE PIXELS

Figure 37. Horizontal Sequence Example

28 DUMMY PIXELS

Figure 36. Example CCD Configuration

OPTICAL BLACK

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5955-037

Rev. A | Page 28 of 52

AD9974

ANALOG FRONT END DESCRIPTION AND OPERATION

0.1µF 0.1µF REFTREFB

DC RESTORE

0.4V 1.4V

AD9974

SHP

PBLK (WHEN DCBYP = 1)

SHP

SHD

CDS

–3dB, 0dB, +3dB, +6dB

CDS GAIN

SHP

GENERATION

DOUT

SHD

PHASE

PRECISION

TIMING

Figure 38. Channel A and Channel B Analog Front End Functional Block Diagram

6dB ~ 42dB

VGA

VGA GAIN

CLPOB PBLK

GENERATION

TIMING

0.1µF CCDIN

CLI

1.2V

PBLK

S1 IS NORMALLY CLOS ED.

S2 IS NORMAL LY OPEN.

The AD9974 signal processing chain is shown in Figure 38. Each processing step is essential for achieving a high quality image from the raw CCD pixel data.

DC Restore

To reduce the large dc offset of the CCD output signal, a dc restore circuit is used with an external 0.1 μF series coupling capacitor. This restores the dc level of the CCD signal to approximately 1.2 V, making it compatible with the 1.8 V core supply voltage of the AD9974. The dc restore switch is active during the SHP sample pulse time.

The dc restore circuit can be disabled when the optional PBLK signal is used to isolate large-signal swings from the CCD input (see the Analog Preblanking section). Bit 6 of Address 0x00 controls whether the dc restore is active during the PBLK interval.

Analog Preblanking

During certain CCD blanking or substrate clocking intervals, the CCD input signal to the AD9974 may increase in amplitude beyond the recommended input range. The PBLK signal can be used to isolate the CDS input from large-signal swings. As shown in Figure 38, when PBLK is active (low), the CDS input is isolated from the CCDIN pin (S1 open) and is internally shorted to ground (S2 closed).

Rev. A | Page 29 of 52

V-H

DOUT PHASE

OUTPUT

DATA

LATCH

PBLK

CLPOB

BLANK TO ZERO OR CLAMP LEVEL

DAC

INTERNAL

REF

14-BIT

ADC

OPTICAL BLACK

CLAMP

DIGITAL

FILTER

2V FULL SCALE

CLAMP LEVEL

During the PBLK active time, the ADC outputs can be programmed to output all 0s or the programmed clamp level.

Note that because the CDS input is shorted during PBLK, the CLPOB pulse should not be used during the same active time as the PBLK pulse.

Correlated Double Sampler (CDS)

The CDS circuit samples each CCD pixel twice to extract the video information and to reject low frequency noise. The timing shown in Figure 21 illustrates how the two internally generated CDS clocks, SHP and SHD, are used to sample the reference level and data level of the CCD signal, respectively. The placement of the SHP and SHD sampling edges is determined by the setting of the SHPLOC and SHDLOC register located at Address 0x36. Placement of these two clock signals is critical for achieving the best performance from the CCD. The CDS gain is variable in four steps by using the AFE Register Address 0x04: −3 dB, 0 dB (default), +3 dB, and +6 dB. Improved noise performance results from using the +3 dB and +6 dB settings, but the input range is reduced (see Tabl e 5).

DOUT

5955-038

AD9974

Input Configurations

The CDS circuit samples each CCD pixel twice to extract the video information and reject low frequency noise (see Figure 39). There are three possible configurations for the CDS: inverting CDS mode, noninverting CDS mode, and SHA mode. The CDSMODE register (Address 0x00[9:8]) selects which configuration is used.

SHP

CCDINP

CCDINM

SHA1

SHA2

SHD

DIFF AMP

CDS_OUT

05955-039

Figure 39. CDS Block Diagram (Conceptual)

Inverting CDS Mode

For this configuration, the signal from the CCD is applied to the positive input of the (CCDINP) CDS system with the minus side (CCDINM) grounded (see Figure 40). The CDSMODE register setting for this configuration is 0x00. Traditional CCD applications use this configuration with the reset level established below the AVDD supply level by the AD9974 dc restore circuit, at approximately 1.5 V. The maximum saturation level is 1.0 V below the reset level, as shown in Figure 41 and Ta b le 16 . A maximum saturation voltage of 1.4 V is also possible when using the minimum CDS gain setting.

AD9974

CCDINP

IMAGE

SENSOR

CCDINM

SHA/ CDS

(N) SIGNAL SAMPL

SIGNAL LEVEL

)

(N + 1) RESET SAMPLE

5955-041

RESET LEVEL

)

RST

(N) RESET SAMPLE

Figure 41. Traditional Inverting CDS Signal

Table 16. Inverting Voltage Levels

Signal Level Symbol Min (mV) Typ (mV) Max (mV)

Saturation VFS 1000 1400 Reset V

VDD − 500 VDD − 300 VDD

RST

Supply Voltage VDD 1600 1800 2000

Noninverting Input

If the noninverting input is desired, the reset (or black) level signal is established at a voltage above ground potential. Saturation (or white) level is approximately 1 V. Samples are taken at each signal level. See Figure 42 and Ta ble 1 7.

SIGNAL LEVEL

)

(N) SIGNAL SAMPLE

(N + 1) RESET SAMPLE

05955-042

RESET LEVEL

)

RST

GND

(N) RESET SAMPLE

Figure 42. Noninverting CDS Signal

NOTES

1. COUPLING CAPACITOR IS NOT REQ UIRED FOR CERT AIN BLACK LEVEL RE FERENCE VOL TAGES.

Figure 40. Single Input CDS Configuration

5955-040

Rev. A | Page 30 of 52

Table 17. Noninverting Voltage Levels

Signal Level Symbol Min (mV) Typ (mV) Max (mV)

Saturation VFS 1000 1400 Reset V

0 250 500

RST

AD9974

SHA Mode—Differential Input Configuration

This configuration uses a differential input sample/hold amplifier (SHA) (see Figure 43).

AD9974

CCDINP

IMAGE

SENSOR

CCDINM

Figure 43. SHA Mode—Differential Input Configuration

SHA/

CDS

05955-043

Referring to Figure 46 and Tab l e 1 9 , the CCDINM signal is a constant dc voltage set at a level above ground potential. The sensor signal is applied to the other input, and samples are taken at the signal minimum and at a point of signal maximum. The resulting differential signal is the difference between the signal and the reference voltage.

(N + 1) SIGNAL SAMPLE

(N) SIGNAL SAMPLE

In this configuration, a signal is applied to the CCDINP input and, simultaneously, an inverse signal is applied to the CCDINM input. Sampling occurs on both signals at the same time. This creates the differential output for amplification and the ADC (see Figure 44 and Ta b le 1 8 ).

(N + 1) SIGNAL SAMPLE

(N) SIGNAL SAMPLE

INPUT_POS

BLACK SIGNAL LEVEL (V

MINIMUM SIGNAL LEVEL (V

GND

BLK

)

PEAK SIGNAL LEVEL (V

)

MIN

)

INPUT_NEG

Figure 44. SHA Mode—Differential Input Signal

Table 18. SHA Mode—Differential Voltage Levels

Signal Level Symbol Min (mV) Typ (mV) Max (mV)

Black V

BLK

Saturation VFS 1000 VDD − 300 1400 Minimum V

0 1800

MIN

INPUT_POS

INPUT_NEG

5955-046

BLACK SIGNAL LEVEL (V

MINIMUM SIGNAL LEVEL (V

GND

BLK

PEAK SIGNAL LEVEL (V

)

MIN

)

Figure 46. SHA Mode—Single–Ended Input Signal (DC-Coupled)

Table 19. SHA Mode—Single-Ended Input Voltages

Signal Level Symbol Min (mV) Typ (mV) Max (mV)

Black V

BLK

Saturation VFS 1000 1400 Minimum V

MIN

CDS Timing Control

The timing shown in Figure 21 illustrates how the two internally generated CDS clocks, SHP and SHD, are used to sample the reference level and data level of the CCD signal, respectively. The placement of the SHP and SHD sampling edges is determined by

05955-044

the setting of the SHPLOC and SHDLOC register located at Address 0x36. Placement of these two clock signals is critical in achieving the best performance from the CCD.

SHA Timing Control

When SHA mode is selected, only the SHPLOC setting is used to sample the input signal, but the SHDLOC signal should still be programmed to an edge setting of SHPLOC + 32.

SHA Mode—DC-Coupled, Single–Ended Input

The SHA mode can also be used in a single-ended fashion, with the signal from the image sensor applied to the CDS/SHA using a single input, CCDINP. This is similar to the differential configuration, except in this case, the CCDINM line is held at a constant dc voltage, establishing a reference level that matches the image sensor reference voltage (see Figure 45).

AD9974

CCDINP

IMAGE

SENSOR

CCDINM

NOTES

1. DC VOLT AGE ABOVE GROUND MAYBE USED TO MATCH THE SENSOR REFERENCE L E V E L.

Figure 45. SHA Mode—Single–Ended Input Configuration, DC-Coupled

SHA/

CDS

05955-045

Rev. A | Page 31 of 52

AD9974

G A

Variable Gain Amplifier

The VGA stage provides a gain range of approximately 6 dB to 42 dB, programmable with 10-bit resolution through the serial digital interface. A gain of 6 dB is needed to match a 1 V input signal with the ADC full-scale range of 2 V. When compared to 1 V full-scale systems, the equivalent gain range is 0 dB to 36 dB.

The VGA gain curve follows a linear-in-dB characteristic. The exact VGA gain is calculated for any gain register value by

Gain (dB) = (0.0359 × Code) + 5.1 dB

where Code is the range of 0 to 1023.

GAIN (dB) V

0 127 255 383 511 639 767 895 1023

VGA GAIN REGISTER CODE

Figure 47. VGA Gain Curve

05955-047

ADC

The AD9974 uses a high performance ADC architecture optimized for high speed and low power. Differential nonlinearity (DNL) performance is typically better than 0.5 LSB. The ADC uses a 2 V input range. See Figure 5, Figure 6, and Figure 7 for typical noise performance and linearity plots for the AD9974.

Optical Black Clamp

The optical black clamp loop is used to remove residual offsets in the signal chain and track low frequency variations in the CCD black level. During the optical black (shielded) pixel interval on each line, the ADC output is compared with a fixed black level reference, selected by the user in the clamp level register. The value can be programmed between 0 LSB and 1023 LSB in 1023 steps.

The resulting error signal is filtered to reduce noise, and the correction value is applied to the ADC input through a DAC. Normally, the optical black clamp loop is turned on once per horizontal line, but this loop can be updated more slowly to suit a particular application. If external digital clamping is used during postprocessing, the AD9974 optical black clamping can be disabled using Bit 3 in AFE Register Address 0x00. When the loop is disabled, the clamp level register can still be used to provide fixed offset adjustment.

Note that if the CLPOB loop is disabled, higher VGA gain settings reduce the dynamic range because the uncorrected offset in the signal path is gained up.

The CLPOB pulse should be aligned with the optical black pixels of the CCD. It is recommended that the CLPOB pulse duration be at least 20 pixels wide. Shorter pulse widths can be used, but the ability of the loop to track low frequency variations in the black level is reduced. See the Horizontal Clamping and Blanking section for more timing information.

Digital Data Outputs

The AD9974 digital output data is latched using the DOUTPHASE register value, as shown in Figure 38. Output data timing is shown in Figure 22. The switching of the data outputs can couple noise back into the analog signal path. To minimize any switching noise while using default SHPLOC and SHDLOC, it is recommended that the DOUTPHASEP register be set to a value between 36 and 47. Other settings can produce good results, but experimentation is necessary.

Rev. A | Page 32 of 52

AD9974

APPLICATIONS INFORMATION

The Precision Timing core must be reset by writing 1 to the

RECOMMENDED POWER-UP SEQUENCE

When the AD9974 is powered up, the following sequence is recommended (see Figure 48 for each step).

Turn on the power supplies for the AD9974 and apply CLI

clock. There is no required sequence for turning on each supply.

Although the AD9974 contains an on-chip power-on reset,

2. a software reset of the internal registers is recommended. Write 1 to the SW_RST register (Address 0x10) to reset all the internal registers to their default values. This bit is selfclearing and automatically resets to 0.

Write to the desired registers to configure high speed timing

and horizontal timing. Note that all TESTMODE registers must be written as described in the Complete Register Listing section.

To place the part into normal power operation, write 0 to the

STANDBY and REFBUF_PWRDN registers (Address 0x00).

AD9974 SUPPLIE S

POWER

SUPPLIES

5. TGCORE_RST register (Address 0x14). This starts the internal timing core operation.

Write 1 to the OUT_CONTROL register (Address 0x11).

The next VD/HD falling edge allows register updates to occur, including OUT_CONTROL, which enables all clock outputs.

Additional Restrictions

When operating, note the following restrictions:

• The HD falling edge should be located in the same CLI

clock cycle as the VD falling edge or after the VD falling edge. The HD falling edge should not be located between one and five cycles prior to the VD falling edge.

• If possible, perform all start-up serial writes with VD and

HD disabled. This prevents unknown behavior caused by partial updating of registers before all information is loaded.

The internal horizontal counter is reset 12 CLI cycles after the falling edge of HD. See Figure 49 for details on how the internal counter is reset.

CLI

(INPUT)

SERIAL

WRITES

(INPUT)

H-CLOCKS

23 5 6

HI-Z BY DEFAULT

H2, H4

H1, H3, RG

Figure 48. Recommended Power-Up Sequence

1ST FIELD

CLOCKS ACTIVE WHEN OUTCONTROL REGIST E R I S UP DATED AT VD/HD EDGE

05955-048

Rev. A | Page 33 of 52

AD9974

Example Register Settings for Power-Up

The following settings can be used for basic operation. A single CLPOB pulse is used with only H-pattern and one field. Additional HPATS and FIELDS can be added, as needed, along with different CLPOB toggle positions.

010 0000001 //software reset 028 0000001 //total number of H-Pattern groups = 1 800 0064000 //HPAT0 HBLKTOGO1, TOGO2 settings 801 3ffffff //unused HBLK odd toggles set to zero or max value 802 3ffffff //unused HBLK odd toggles set to zero or max value 803 0064000 //HPAT0 HBLKTOGE1, TOGE2 settings 804 3ffffff //unused HBLK Even toggles set to zero or max value 805 3ffffff //unused HBLK Even toggles set to zero or max value 806 0000000 //HBLK StartA, B are not used 807 0000000 //HBLK StartC is not used 808 0000000 //HBLK alternation patterns are not used 809 0000000 //HBLKLEN, HBLKREP not used, HBLK masking pol = 0 80a 0000000 //HBLKSTART, end not used 80b 0000000 //test, set to zero 80c 00dc05a //CLPOB pat 0 toggles 80d 3ffffff //CLPOB pat 1 toggles not used, set to max 80e 3ffffff //PBLK pat 0 toggles not used, set to max 80f 3ffffff //PBLK pat 1 toggles not used, set to max 810 1000000 //FIELD0 SCP0, SCP1 811 1000800 //SCP2, SCP3 set same as SCP1 812 1000800 //SCP4, SCP5 set same as SCP1 813 1000800 //SCP6, SCP7 set same as SCP1 814 0000800 //SCP8 set same as SCP1 815 0000000 //select HPAT0 for all regions 816 0000000 //select HPAT0 for all regions 817 0000000 //test, set to zero 818 0000001 //CLPOB start polarity = HIGH 819 1000800 //CLPOB masking set to highest SCP value (no mask) 81a 1000800 //CLPOB masking set to highest SCP value (no mask) 81b 1000800 //CLPOB masking set to highest SCP value (no mask) 81c 0000001 //PBLK start polarity = HIGH 81d 1000800 //PBLK masking set to highest SCP value (no mask) 81e 0000000 //PBLK masking set to highest SCP value (no mask) 81f 0000000 //PBLK masking set to highest SCP value (no mask) 02a 0000001 //total number of fields = 1 02b 0000000 //field select = FIELD0 02c 0000000 //field select = FIELD0 000 0000008 //AFE settings 014 0000001 //reset TGCORE 011 0000001 //enable outputs

Rev. A | Page 34 of 52

AD9974

VDHD

3ns MIN

CLI

CLIDLY

SHD

INTERNAL

3ns MIN

INTERNAL

H-COUNTER

(PIXEL CO UNTER)

NOTES

1. EXTERNAL HD F ALLING E DGE IS LAT CHE D BY CLI RISI NG EDGE, T HE N LATCHED AGAIN BY S HD INTERNAL FALLING EDG E.

2. INTERNAL H-COUNTER IS ALWAYS RESE T 11.5 CLOCK CYCLES AFTER THE INTERNAL HD FALLING EDGE.

3. DEPENDING ON THE VALUE OF SHDLOC, H-COUNTER RES ET CAN OCCUR 12 OR 13 CLI CLOCK EDGE S AFTER THE EX TERNAL HD FALLING EDGE .

4. SHPLOC = 0 IS SHOWN I N THE ABOVE EX AM P LE. IN TH IS CASE, THE H- COUNTER RESET OCCURS 12 CLI RISING EDGES AFTER HD FALLING E DGE.

5. HD FALLING EDGE SHOULD OCCUR COI NCIDENT WIT H VD FALLI NG EDGE (WITHIN SAME CL I CYCLE) O R AF TER VD FALLING EDGE . HD FALLI NG EDGE SHOUL D NOT OCCUR WITHIN 1 AND 5 CLI CYCL ES IMMEDIATELY BEFORE VD FALL ING EDGE.

XXXXXXXXXXXXXX012

11.5 CYCLES

Figure 49. Horizontal Counter Pipeline Delay

NO TOGGLE POSITIONS ALLOWED IN THIS AREA

H-COUNTER

(PIXEL COUNTER)

X X X X X X N–11 N–10 N–9 N–8 N–7 N–6 N–5 N–4 N–3 N–2 N–1 0 1 2N

NOTES

1. TOGGLE POSITIONS CANNOT BE PROGRAM M E D WITHIN 12 PIXELS OF PIXE L 0 LOCAT ION.

Figure 50. No-Toggle Positions

Additional Restrictions

When operating, note the following restrictions:

• The HD falling edge should be located in the same CLI clock cycle as the VD falling edge or later than the VD falling edge. The HD falling edge should not be located within 1 cycle prior to the VD falling edge.

H-COUNTER RESET

05955-049

H-COUNTER

RESET

• If possible, perform all start-up serial writes with VD and HD disabled. This prevents unknown behavior caused by partial updating of registers before all information is loaded.

The internal horizontal counter is reset 12 CLI cycles after the falling edge of HD. See Figure 49 for details on how the internal counter is reset.

5955-050

Rev. A | Page 35 of 52

AD9974

STANDBY MODE OPERATION

The AD9974 contains two standby modes to optimize the overall power dissipation in a particular application. Bit 1 and Bit 0 of Address 0x00 control the power-down state of the device.

STANDBY[1:0] = 00 = normal operation (full power) STANDBY[1:0] = 01 = reference standby mode STANDBY[1:0] = 10 or 11 = total shutdown mode

(lowest power)

Tabl e 20 summarizes the operation of each power-down mode. The OUT_CONTROL register takes priority over the reference standby mode in determining the digital output states, but total shutdown mode takes priority over OUT_CONTROL. Total shutdown mode has the lowest power consumption.

When returning from total shutdown mode to normal operation, the timing core must be reset at least 100 μs after the STANDBY register is written to.

There is an additional register to disable the internal voltage reference buffer (Address 0x00[2]) independently. By default the buffer is disabled, but it must be enabled for normal operation.

CLI FREQUENCY CHANGE

If the input clock, CLI, is interrupted or changes to a different frequency, the timing core must be reset for proper operation. After the CLI clock has settled to the new frequency, or the previous frequency has resumed, write 0 and then 1 to the TGCORE_RST register (Address 0x14). This guarantees proper timing core operation.

Table 20. Standby Mode Operation

I/O Block Total Shutdown (Default)

1, 2

OUT_CONTROL = Low

Reference Standby

AFE Off No change Only REFT, REFB on Timing Core Off No change On H1 High-Z Low Low (4.3 mA) H2 High-Z High High (4.3 mA) H3 High-Z Low Low (4.3 mA) H4 High-Z High High (4.3 mA) HL High-Z Low Low (4.3 mA) RG High-Z Low Low (4.3 mA) DOUT Low3 Low Low

To exit total shutdown, write 00 to STANDBY (Address 0x00, Bits[1:0]), then reset the timing core after 100 μs to guarantee proper settling.

Total shutdown mode takes priority over OUT_CONTROL for determining the output polarities.

The status of the DOUT pins is unknown at power-up. Low status is guaranteed in total shutdown mode after the power-up sequence is completed.

Rev. A | Page 36 of 52

AD9974

CIRCUIT CONFIGURATION

The AD9974 recommended circuit configuration is shown in Figure 51. Achieving good image quality from the AD9974 requires careful attention to PCB layout. All signals should be routed to maintain low noise performance. The CCD_A and CCD_B output signals should be directly routed to Pin A1 and Pin A7, respectively, through a 0.1 μF capacitor. The master clock, CLI_X, should be carefully routed to Pin A3 and Pin A9 to minimize interference with the CCDIN_X, REFT_X, and REFB_X signals.

The digital outputs and clock inputs should be connected to the digital ASIC away from the analog and CCD clock signals. Placing series resistors close to the digital output pins may help reduce digital code transition noise. If the digital outputs must drive a load larger than 20 pF, buffering is recommended to minimize additional noise. If the digital ASIC can accept gray code, the outputs of the AD9974 can be selected to output data in gray code format using Register 0x01[2]. Compared with binary coding, gray coding helps reduce potential digital transition noise.

The H1_X to H4_X and RG_X traces should have low inductance to avoid excessive distortion of the signals. Heavier traces are recommended because of the large transient current demand on H1_X to H4_X from the capacitive load of the CCD. If possible, physically locating the AD9974 closer to the CCD reduces the inductance on these lines. As always, the routing path should be as direct as possible from the AD9974 to the CCD.

The CLI_X and CCDIN_X PCB traces should be carefully matched in length and impedance to achieve optimal channel-to-channel matching performance.

3 V System Compatibility

The AD9974 typical circuit connections for a 3 V system are shown in Figure 51. This application uses an external 3.3 V supply connected to the IOVDD input of the AD0074, which also serves as the LDO input. The LDO generates a 1.8 V output for the AD9974 core supply voltages, AVDD and DVDD. The LDOOUT pin can then be connected directly to the AVDD and DVDD pins. In this configuration, the LDOEN pin is tied high to enable the LDO.

Alternatively, a separate 1.8 V regulated supply voltage may be used to power the AVDD and DVDD pins. In this case, the LDOOUT pin needs to be left floating, and the LDOEN pin needs to be grounded. A typical circuit configuration for a 1.8 V system is shown in Figure 51.

GROUNDING AND DECOUPLING RECOMMENDATIONS

As shown in Figure 51, a single ground plane is recommended for the AD9974. This ground plane needs to be as continuous as possible, particularly around the P-type, AI-type, and A-type pins to ensure that all analog decoupling capacitors provide the lowest possible impedance path between the power and bypass pins and their respective ground pins. All high frequency decoupling capacitors need to be located as close as possible to the package pins.

All the supply pins must be decoupled to ground with good quality, high frequency chip capacitors. There also needs to be a 4.7 μF or larger bypass capacitor for each main supply, that is, AVDD, RGVDD, HVDD, and DRVDD, although this is not necessary for each individual pin. In most applications, it is easier to share the supply for RGVDD and HVDD, which can be done as long as the individual supply pins are separately bypassed. A separate 3 V supply can be used for DRVDD, but this supply pin still needs to be decoupled to the same ground plane as the rest of the chip. A separate ground for DRVSS is not recommended.

The reference bypass pins (REFT, REFB) must be decoupled to ground as close as possible to their respective pins. The bridge capacitor between REFT and REFB is recommended for pixel rates greater than 40 MHz. The analog input capacitor (CCDINM, CCDINP) also needs to be located close to the pin.

The GND connections should be tied to the lowest impedance ground plane on the PCB. Performance does not degrade if several of these GND connections are left unconnected for routing purposes.

Rev. A | Page 37 of 52

AD9974

COMMON MASTER

CLOCK INPUT

SERIAL INTERFACE FOR CHN A

H1A–H4A

DRIVER

SUPPLY

1.8V ANALOG SUPPLY

3V IOVDD SUPPL

1.8V LDO OUTP UT A

RG_A DRIVER SUPPLY

CCD SIGNAL_A PLUS

1.8V ANALOG SUPPLY

0.1µF

HD COMMON INP UT VD COMMON INPUT

4.7µF 0.1µF H1A–H4A

OUTPUTS

0.1µF

RG_A OUTPUT

CLI_A

REFB_A

0.1µF REFT_A

SL_A

SDATA_A

SCK_A

HD_A

VD_A HVDD_A HVSS_A

H1A H2A H3A

H4A DVDD_A DVSS_A

D0_A (LSB)

D1_A D2_A D3_A D4_A D5_A D6_A D7_A D8_A

4.7µF

0.1µF

AVSS_A

AVDD_A

A4 D1

C1 B2 C2 D2 E1 E2 E4 E3 F4 F3 D4 D3 F1 F2 G1 H1 J1 K1 G2 H2 K2 G3 H3

0.1µF

RGVSS_A

RGVDD_A

CCDINM_A

CCDINP_A

0.1µF

GNDC5GNDD5GND

GNDE6GND

GNDC6GNDB6GND

IOVDD_A

RG_A

LDO_OUT_A

AD9974

NOT DRAWN TO SCALE

0.1µF

IOVDD_B

0.1µF

LDO_OUT_B

RG_B

RGVDD_B

RGVSS_B

CCDINM_B

CCDINP_B

AVDD_B

C10

A10

B10

G10

H10

J10

B7 A9 D7

C7 B8 C8 D8 E7 E8

E10

F10

D10

D9 F7 F8

H7 J7 K7

H8 K8

K10

3V IOVDD SUPPLY

1.8V LDO OUTPUT B

RG_B OUTPUT RG_B DRIVER SUPPLY

CCD SIGNAL_B PLUS

0.1µF

AVSS_B CLI_B REFB_B

REFT_B

SL_B SDATA_B SCK_B HD_B VD_B HVDD_B HVSS_B H1B H2B H3B H4B DVDD_B DVSS_B D0_B (LSB) D1_B D2_B D3_B D4_B D5_B D6_B D7_B

0.1µF

HD COMMON INPUT

VD COMMON INPUT

0.1µF 4

H1B–H4B OUTPUTS

1.8V ANALOG SUPPLY

COMMON MAST E CLOCK INPUT

1.8V ANALOG SUPPLY

0.1µF

SERIAL INTERFACE FOR CHN B

H1B–H4B DRIVER SUPPLY

CHN A DATA

OUTPUTS

D9_A

D10_AJ4D11_AH4D12_A

GNDG5GNDH5GNDJ5GNDK5GNDK6GNDJ6GNDH6GNDG6GNDF6GND

DRVSS_A

DRVDD_A

D13_A (MSB)

0.1µF

4.7µF

DRIVER

DRVSS_B

DRVDD_B

0.1µF

DRIVER

D9_BH9D8_B

D12_B

D11_B

D10_B

D13_B (MSB)

CHN B DATA OUTPUTS

Figure 51. Recommended Circuit Configuration

Rev. A | Page 38 of 52

AD9974

3-WIRE SERIAL INTERFACE TIMING

All of the internal registers of the AD9974 are accessed through a 3-wire serial interface. Each register consists of a 12-bit address and a 28-bit data-word. Both the 12-bit address and 28-bit dataword are written starting with the LSB. To write to each register, a 40-bit operation is required, as shown in Figure 52. Although many registers are fewer than 28 bits wide, all 28 bits must be written for each register. For example, if the register is only 20 bits wide, the upper eight bits are don’t cares and must be filled with 0s during the serial write operation. If fewer than 28 data bits are written, the register is not updated with new data.

12-BI

DDRESS

Figure 53 shows a more efficient way to write to the registers, using the AD9974 address auto-increment capability. Using this method, the lowest desired address is written first, followed by multiple 28-bit data-words. Each new 28-bit data-word is automatically written to the next highest register address. By eliminating the need to write each 12-bit address, faster register loading is achieved. Continuous write operations can be used, starting with any register location.

28-BIT DAT

A4 A5A2 A3SDATA A0A1 A6 A8A9A10A11D0D1 D2 D3 D25 D26 D27

SCK

1234

NOTES

1. SDATA BIT S ARE LATCHED ON SCK RIS ING EDGES. SCK CAN IDLE HIGH OR LOW BETWEEN WRITE OP E RATIONS.

2. ALL 40 BITS MUST BE WRITTEN: 12 BITS FOR ADDRESS AND 28 BITS F OR DATA.

3. IF THE REGISTER LENGTH IS <28 BITS, THEN ZEROS MUST BE USED TO COMPLETE THE 28-BIT DATA LENGTH.

4. NEW DATA VALUES ARE UPDATED IN THE SPECIFIED REGISTER LOCATION AT DIFFERENT TIMES, DEPENDING ON THE PARTICULAR REG ISTER WRI TTEN TO. SEE THE UPDATING OF NE W REGIST E R V AL UES SECTION FOR MORE INFORMATION.

5 406 7 8 9 10111213141516 3839

05955-052

Figure 52. Serial Write Operation

DATA FOR STARTING REGISTER ADDRESS

SDATA A0A1A2 A10A11D0D1 D26D27

SCK

1 402 3 4 11121314 39

NOTES

1. MULTI PLE SEQUENTIAL REGISTERS CAN BE L OADED CONTINUOUSLY.

2. THE FI RST (LOWEST ADDRESS) RE GISTER ADDRES S IS WRIT TEN, FOLLOWE D BY M ULTIPLE 28-BIT DATA- WORDS.

3. THE ADDRESS AUTOMATICALLY INCREME NTS WIT H E ACH 28- BIT DATA-WORD (ALL 28 BI TS MUST BE WRITTEN) .

4. SL IS HELD LOW UNT IL THE L AS T DESIRED REG ISTER HAS BEEN LOADED.

Figure 53. Continuous Serial Write Operation

DATA FOR NEXT

D0 D1 D26 D27

4241 6867

D2D1

706971

5955-053

Rev. A | Page 39 of 52

AD9974

LAYOUT OF INTERNAL REGISTERS

The AD9974 address space is divided into two register areas, as shown in Figure 54. In the first area, Address 0x00 to Address 0x72 contain the registers for the AFE, miscellaneous functions, VD/HD parameters, I/O control, mode control, timing core, and update control functions. The second area of the address space, beginning at Address 0x800, consists of the registers for the H-pattern groups and fields. This is a configurable set of register spaces; the user can decide how many H-patterns and fields are used in a particular design. The AD9974 supports the use of up to 32 H-patterns.

Register 0x28 specifies the total number of H-pattern groups. The starting address for the H-pattern groups is always 0x800. The starting address for the field registers is determined by the number of H-pattern groups. Each H-pattern group and field occupies 16 register addresses.

FIXED REG ISTER ARE

ADDR 0x000

AFE REGISTERS

The starting address for the field registers is based on the number of H-pattern groups and is equal to 0x800 plus the number of H-pattern groups times 16.

It is important to note that the H-pattern and field registers must always occupy a continuous block of addresses.

Figure 55 shows an example when three H-pattern groups and two fields are used. The starting address for the H-pattern groups is always 0x800. Because HPATNUM is 3, the H-pattern groups occupy 48 address locations (that is, 16 registers × 3 H-pattern groups). The starting address of the field registers for this example is 0x830 (that is, 0x800 + 48 (decimal)). Note that the decimal value must be converted to a hex number before adding it to 0x800.

The AD9974 address space contains many unused addresses. Any undefined addresses between Address 0x00 and Address 0x7FF should not be written to; otherwise, the AD9974 may operate incorrectly. Continuous register writes should be performed carefully so that undefined registers are not written to.

CONFIGURABL E RE G I STER ARE

HPAT START 0x800

MISCELL ANEOUS FUNCTIO N REGISTERS

DDR 0x7FF

VD/HD REGISTERS

I/O REGISTERS

MODE CONTRO L REG I S T ERS

TIMING CORE REGISTERS

FIELD START

TEST REGISTERS

UPDATE CONTRO L REGIST E RS

INVALID—DO NOT ACCESS

NOTES

1. THE H-PAT TERN AND FIEL D REGISTERS MUST ALWAYS OCCUPY A CONTINUOUS BLOCK O F ADDRESSES.

MAX 0xFFF

H-PATTERN GROUPS

FIELDS

05955-054

Figure 54. Layout of AD9974 Registers

DDR 0x800

3 H-PATTERN G ROUPS

(16 × 3 = 48 REGISTERS)

DDR 0x830

2 FIELDS

(16 × 2 = 32 REGISTERS)

DDR 0x850

MAX 0xFFF

UNUSED MEMORY

05955-055

Figure 55. Example Register Configuration

Rev. A | Page 40 of 52

AD9974

UPDATING OF REGISTER VALUES

The internal registers of the AD9974 are updated at different times, depending on the particular register.

Table 21 summarizes the three types of register updates. The tables in the Complete Register Listing section also contain a column with update type to identify when each register is updated.

• SCK Updated—Some of the registers are updated immediately

as the 28th data bit (D27) is written. These registers are used for functions that do not require gating with the next VD boundary, such as power-up and reset functions.

Table 21. Register Update Types

Update Type Description

SCK Updated Register is immediately updated when the 28th data bit (D27) is clocked in. VD Updated

SCP Updated Register is updated at the next SCP when the register is used.

Register is updated at the VD falling edge. VD-updated registers can be delayed further by using the UPDATE register at Address 0x17. Field registers are not affected by the UPDATE register.

• VD Updated—Many of the registers are updated at the

next VD falling edge. By updating these values at the next VD edge, the current field is not corrupted, and the new register values are applied to the next field. The VD update can be further delayed past the VD falling edge by using UPDATE Register Address 0x17. This delays the VD-updated register updates to any HD line in the field. Note that the field registers are not affected by the UPDATE register.

• SCP Updated—All of the H-pattern group registers are

updated at the next SCP when they are used.

Rev. A | Page 41 of 52

AD9974

COMPLETE REGISTER LISTING

All addresses and default values are expressed in hexadecimal. When an address contains less than 28 data bits, all remaining bits must be written as 0s. All TESTMODE registers must be set to the specified values.

Table 22. AFE Registers

Data Bit

Address

0x00 [1:0] 3 SCK STANDBY

[2] 1 REFBUF_PWRDN

[3] 1 CLAMPENABLE

[5:4] 0 TESTMODE Test Operation Only. Set to 0. [6] 0 PBLK_LVL

[7] 0 DCBYP

[9:8] 0 CDSMODE

[16:10] 0 TESTMODE Test Operation Only. Set to 0. [27:17] Unused Set unused bits to 0. 0x01 [1:0] 0 SCK TESTMODE Test Operation Only. Set to 0. [2] 0 GRAYENCODE

[3] 0 TESTMODE Test Operation Only. Set to 0. [4] 1 TESTMODE Test Operation Only. Set to 0. [27:5] Unused Set unused bits to 0. 0x02 [0] 0 SCK TESTMODE Test Operation Only. Set to 0. [27:1] Unused Set unused bits to 0. 0x03 [23:0] FFFFFF SCK TESTMODE Test Operation Only. Set to FFFFFF. [27:24] Unused Set unused bits to 0. 0x04 [1:0] 1 VD CDSGAIN

[27:2] Unused Set unused bits to 0. 0x05 [9:0] F VD VGAGAIN VGA Gain. 6 dB to 42 dB (0.035 dB per step). [27:10] Unused Set unused bits to 0. 0x06 [9:0] 1EC VD CLAMPLEVEL Optical Black Clamp Level. 0 LSB to 1023 LSB (1 LSB per step). [27:10] Unused Set unused registers to 0. 0x07 [27:0] 0 TESTMODE Test Operation Only. Set to 0 if this register is accessed. 0x08 [27:0] 0 TESTMODE Test Operation Only. Set to 0 if this register is accessed. 0x09 [27:0] 0 TESTMODE Test Operation Only. Set to 0 if this register is accessed. 0x0A [27:0] 0 TESTMODE Test Operation Only. Set to 0 if this register is accessed. 0x0B [27:0] 0 TESTMODE Test Operation Only. Set to 0 if this register is accessed.

Content

Default Value

Update Name Description

Standby Modes.

0 = normal operation. 1= band gap reference in standby. 2, 3 = total power-down.

Reference Buffer for REFT and REFB Power Control.

0 = REFT/REFB internally driven. 1 = REFT/REFB not driven.

Clamp Enable Control.

0 = disable black clamp. 1 = enable black clamp.

PBLK Level Control.

0 = blank to 0. 1 = blank to clamp level.

DC Restore Circuit Control.

0 = enable dc restore circuit during PBLK. 1 = bypass dc restore circuit during PBLK.

CDS Operation.

0 = normal (inverting) CDS mode. 1 = sample and hold (SHA) mode. 2 = positive CDS mode. 3 = invalid, do not use.

Gray Coding ADC Outputs.

0 = disable. 1 = enable.

CDS Gain Setting.

0 = −3 dB. 1 = 0 dB (default). 2 = +3 dB. 3 = +6 dB.

Rev. A | Page 42 of 52

AD9974

Data Bit

Address

0x0C [27:0] 0 VD TESTMODE Test Operation Only. Set to 0 if this register is accessed. 0x0D [0] 0 VD CLIDIVIDE

[3:1] 0 TESTMODE Test Operation Only. Set to 0. [27:4] Unused Set unused bits to 0. 0x0E [27:0] SCK Unused Set unused register to 0 if accessed. 0x0F [27:0] SCK Unused Set unused register to 0 if accessed.

Content

Table 23. Miscellaneous Registers

Data Bit

Address

0x10 [0] 0 SCK SW_RST

[27:1] Unused Set unused bits to 0. 0x11 [0] 0 VD OUT_CONTROL

[27:1] Unused Set unused bits to 0. 0x12 [1:0] 0 SCK TESTMODE Test Operation Only. Set to 0. [27:2] Unused Set unused bits to 0. 0x13 [0] 0 SCK TESTMODE Test Operation Only. Set to 0. [27:1] Unused Set unused bits to 0. 0x14 [0] 0 SCK TGCORE_RST

[27:1] Unused Set unused bits to 0. 0x15 [0] 0 SCK CLI_BIAS

[27:1] Unused Set unused bits to 0. 0x16 [0] 0 SCK TESTMODE Test Operation Only. Set to 0. [27:1] Unused Set unused bits to 0. 0x17 [12:0] 0 SCK UPDATE

[13] 0 PREVENTUP

[27:14] Unused Set unused bits to 0. 0x18 [27:0] 0 TESTMODE Test Operation Only. Set to 0 if this register is accessed. 0x19 [27:0] 0 TESTMODE Test Operation Only. Set to 0 if this register is accessed. 0x1A to

0x1F

Content

[27:0] Unused Set unused bits to 0.

Default Value Update Name Description

CLI Divide.

1 = divide CLI input frequency by 2.

Default Value

Update Name Description

Software Reset. Bit self-clears to 0 when a reset occurs.

1 = reset Address 0x00 to Address 0xFF to default values.

Output Control.

0 = make all outputs dc inactive. 1 = enable outputs at next VD edge.

Timing Core Reset Bar.

0 = hold in reset. 1 = resume operation.

Enable bias for CLI input (see Figure 11).

0 = disable bias (CLI input is dc-coupled). 1 = enable bias (CLI input is ac-coupled).

Serial Interface Update Line. Sets the line (HD) within the field to update the VD-updated registers. Disabled when PREVENTUP = 1.

Prevents normal update of VD-updated registers.

0 = normal update at VD. 1 = prevent update of VD-updated registers.

Table 24. VD/HD Registers

Data Bit

Address

0x20 [0] 0 SCK TESTMODE Test Operation Only. Set to 0. [27:1] Unused Set unused bits to 0. 0x21 [0] 0 SCK VDHDPOL

[2:1] 0 TESTMODE Test Operation Only. Set to 0. [27:3] Unused Set unused bits to 0. 0x22 [27:0] 0 TESTMODE Test Operation Only. Set to 0 if this register is accessed.

Content

Default Value Update Name Description

VD/HD Active Polarity.

0 = active low. 1 = active high.

Rev. A | Page 43 of 52

AD9974

Table 25. I/O Control Registers

Data Bit

Address

0x23 [0] 0 SCK TESTMODE Test Operation Only. Set to 0. [1] 0 TESTMODE Test Operation Only. Set to 0. [2] 0 IO_NVR

[3] 0 DATA_NVR DRVDD Voltage Range. [4] 0 TESTMODE Test Operation Only. Set to 0. [7:5] 1 HCLKMODE Selects HCLK output configuration (see Table 9). [27:8] Unused Set unused bits to 0. 0x24 [27:0] 0 TESTMODE Test Operation Only. Set to 0 if this register is accessed. 0x25 [27:0] 0 TESTMODE Test Operation Only. Set to 0 if this register is accessed. 0x26 [27:0] 0 TESTMODE Test Operation Only. Set to 0 if this register is accessed. 0x27 [27:0] 0 TESTMODE Test Operation Only. Set to 0 if this register is accessed.

Content

Table 26. Mode Registers

Data Bit

Address

0x28 [4:0] 0 VD HPATNUM Total Number of H-Pattern Groups. [27:5] Unused Set unused bits to 0. 0x29 [27:0] Unused Set unused register to 0 if accessed. 0x2A [2:0] 0 VD FIELDNUM Total Number of Fields. Set to 1 for single-field operation. [27:3] Unused Set unused bits to 0. 0x2B [4:0] 0 VD FIELD_SEL1 Selected First Field. [9:5] 0 VD FIELD_SEL2 Selected Second Field. [14:10] 0 FIELD_SEL3 Selected Third Field. [19:15] 0 FIELD_SEL4 Selected Fourth Field. [24:20] 0 FIELD_SEL5 Selected Fifth Field. [27:25] Unused Set unused bits to 0. 0x2C [4:0] 0 VD FIELD_SEL6 Selected Sixth Field. [9:5] 0 FIELD_SEL7 Selected Seventh Field. [27:10] Unused Set unused bits to 0. 0x2D [27:0] SCK Unused Set unused register to 0 if this register is accessed. 0x2E [27:0] SCK Unused Set unused register to 0 if this register is accessed. 0x2F [27:0] SCK Unused Set unused register to 0 if this register is accessed.

Content

Default Value Update Name Description

IOVDD Voltage Range for VD, HD, SCK, SDATA, and SL.

0 = 1.8 V.

1 = 3.3 V. The I/Os are 3 V tolerant, so there is no problem having higher than 1.8 V inputs at start-up, but this register should be set to 1

at initialization if using higher than 1.8 V supplies.

Default Value Update Name Description

Rev. A | Page 44 of 52

AD9974

Table 27. Timing Core Registers

Data Bit

Address

0x30 [5:0] 0 SCK H1POSLOC H1 Rising Edge Location. [7:6] Unused Set unused bits to 0. [13:8] 20 H1NEGLOC H1 Falling Edge Location. [15:14] 0 TESTMODE Test Operation Only. Set to 0. [16] 1 H1POL

[27:17] Unused Set unused bits to 0. 0x31 [5:0] 0 SCK H2POSLOC H2 Rising Edge Location. [7:6] Unused Set unused bits to 0. [13:8] 20 H2NEGLOC H2 Falling Edge Location. [15:14] 0 TESTMODE Test Operation Only. Set to 0. [16] 1 H2POL

[27:17] Unused Set unused bits to 0. 0x32 [5:0] 0 SCK TESTMODE Test Operation Only. Set to 0. [7:6] Unused Set unused bits to 0. [13:8] 20 TESTMODE Test Operation Only. Set to 20. [15:14] 0 TESTMODE Test Operation Only. Set to 0. [16] 1 TESTMODE Test Operation Only. Set to 1. [27:17] Unused Set unused bits to 0. 0x33 [5:0] 0 SCK RGPOSLOC RG Rising Edge Location. [7:6] Unused Set unused bits to 0. [13:8] 10 RGNEGLOC RG Falling Edge Location. [15:14] 0 TESTMODE Test Operation Only. Set to 0. [16] 1 RGPOL

[27:17] Unused Set unused bits to 0. 0x34 [0] 0 SCK H1BLKRETIME

[1] 0 H2BLKRETIME Retime H2 HBLK to Internal Clock. [2] 0 TESTMODE Test Operation Only. Set to 0 [3] 0 TESTMODE Test Operation Only. Set to 0 [7:4] 0 HCLK_WIDTH

[27:8] Unused Set unused bits to 0. 0x35 [2:0] 1 SCK H1DRV

[3] Unused Set unused bits to 0. [6:4] 1 H2DRV H2 Drive Strength. [7] Unused Set unused bits to 0.

Content

Default Value Update Name Description

H1 Polarity Control.

0 = inverse of Figure 21. 1 = no inversion.

H2 Polarity Control.

0 = inverse of Figure 21. 1 = no inversion.

RG Polarity Control.

0 = inverse of Figure 21. 1 = no inversion.

Retime H1 HBLK to Internal Clock.

0 = no retime. 1 = enable retime.

Recommended setting is enable retime. Enabling retime adds one cycle delay to programmed HBLK positions.

Enables wide H-clocks during HBLK interval.

0 = disable (see Table 13).

H1 Drive Strength.

0 = off. 1 = 4.3 mA. 2 = 8.6 mA. 3 = 12.9 mA. 4 = 17.2 mA. 5 = 21.5 mA. 6 = 25.8 mA. 7 = 30.1 mA.

Rev. A | Page 45 of 52

AD9974

Data Bit

Address

[10:8] 1 H3DRV H3 Drive Strength. [11] Unused Set unused bits to 0. [14:12] 1 H4DRV H4 Drive Strength. [15] Unused Set unused bits to 0. [18:16] TESTMODE Test Operation Only. Set to 0. [19] Unused Set unused bits to 0. [22:20] 1 RGDRV RG Drive Strength. [27:23] 0 Unused Set unused bits to 0. 0x36 [5:0] 0 SCK SHDLOC SHD Sampling Edge Location. [11:6] 20 SHPLOC SHP Sampling Edge Location. [17:12] 10 SHPWIDTH SHP Width. Controls input dc restore switch active time. [27:18] Unused Set unused bits to 0. 0x37 [5:0] 0 SCK DOUTPHASEP DOUT Positive Edge Phase Control. [11:6] 20 DOUTPHASEN

[12] 0 DCLKMODE 0 = DCLK tracks DOUT phase.

[14:13] 2 CLKDATA_SEL Data Output Clock Selection.

[15] 0 INV_DCLK 0 = no invert.

[27:16] Unused Set unused bits to 0. 0x38 [27:0] Unused Set unused register to 0 if this register is accessed. 0x39 [27:0] Unused Set unused register to 0 if this register is accessed. 0x3A [27:0] Unused Set unused register to 0 if this register is accessed. 0x3B [27:0] Unused Set unused register to 0 if this register is accessed. 0x3C [27:0] Unused Set unused register to 0 if this register is accessed. 0x3D [27:0] Unused Set unused register to 0 if this register is accessed.

Content

Default Value Update Name Description

DOUT Negative Edge Phase Control. Set DOUTPHASEN = DOUTPHASEP + 0x20.

1 = DCLK is CLI post-Schmitt trigger and post-divider when CLIDIVIDE = 1.

0 = no delay. 1 = ~4 ns. 2 = ~8 ns. 3 = ~12 ns.

1 = invert DCLK to output.

Table 28. Test Registers—Do Not Access

Data Bit

Address

0x3E [18:0] 4B020 SCK TESTMODE Test Operation Only. Set to 4B020. [27:19] Unused Set unused bits to 0. 0x3F [27:0] SCK Unused Set unused register to 0 if these registers are accessed. 0x40 [3:0] F SCK TESTMODE Test Operation Only. Set to F if accessed. [9:4] 0 TESTMODE Test Operation Only. Set to 0. [27:10] Unused Set unused bits to 0. 0x41 to

0x4F 0x50 to

0x5F

Content

[27:0] SCK Unused Set unused register to 0 if these registers are accessed.

Default Value

Update Name Description

Rev. A | Page 46 of 52

AD9974

Table 29. Update Control Registers

Data Bit

Address

0x60 [15:0] 1803 SCK AFE_UPDT_SCK

[27:16] Unused Set unused register = 0 if accessed. 0x61 [15:0] E7FC SCK AFE_UPDT_VD

[27:16] Unused Set unused register to 0 if accessed. 0x62 [15:0] F8FD SCK MISC_UPDT_SCK

[27:16] Unused Set unused register to 0 if accessed. 0x63 [15:0] 0702 SCK MISC_UPDT_VD

[27:16] Unused Set unused register to 0 if accessed. 0x64 [15:0] FFF9 SCK VDHD_UPDT_SCK Enable SCK update of VDHD Registers, Address 0x20 to Address 0x22. [27:16] Unused Set unused register to 0 if accessed. 0x65 [15:0] 0006 SCK VDHD_UPDT_VD Enable VD update of VDHD registers, Address 0x20 to Address 0x22. [27:16] Unused Set unused register to 0 if accessed. 0x66 [15:0] FFFF SCK TGCORE_UPDT_SCK

[27:16] Unused Set unused register to 0 if accessed. 0x67 [15:0] 0000 SCK TGCORE_UPDT_VD

[27:16] Unused Set unused register to 0 if accessed. 0x68 to

0x72

Content

[27:0] SCK Unused Set unused register to 0 if accessed.

Default Value Update Name Description

Enable SCK update of AFE registers. Each bit corresponds to one address location.

AFE_UPDT_SCK[0] = 1, update Address 0x00 on SL rising edge. AFE_UPDT_SCK[1] = 1, update Address 0x01 on SL rising edge. … AFE_UPDT_SCK[15] = 1, update Address 0x0F on SL rising edge.

Enable VD update of AFE registers. Each bit corresponds to one address location.

AFE_UPDT_VD[0] = 1, update Address 0x00 on VD rising edge. AFE_UPDT_VD[1] = 1, update Address 0x01 on VD rising edge. … AFE_UPDT_VD[15] = 1, update Address 0x0F on VD rising edge.

Enable SCK update of miscellaneous registers. Address 0x10 to Address 0x1F.

Enable VD update of miscellaneous registers, Address 0x10 to Address 0x1F.

Enable SCK update of timing core registers, Address 0x30 to Address 0x37.

Enable VD update of timing core registers, Address 0x30 to Address 0x37.

Table 30. HPAT Registers (HPAT Registers Always Start at Address 0x800)

Data Bit

Address

0x00 [12:0] X SCP HBLKTOGO1 First HBLK Toggle Position for Odd Lines, or RA0H1REPA/B/C. [25:13] X HBLKTOGO2 Second HBLK Toggle Position for Odd Lines, or RA1H1REPA/B/C. [27:26] X Unused Set unused bits to 0. 0x01 [12:0] X SCP HBLKTOGO3 Third HBLK Toggle Position for Odd Lines, or RA2H1REPA/B/C. [25:13] X HBLKTOGO4 Fourth HBLK Toggle Position for Odd Lines, or RA3H1REPA/B/C. [27:26] X Unused Set unused bits to 0. 0x02 [12:0] X SCP HBLKTOGO5 Fifth HBLK Toggle Position for Odd Lines, or RA4H1REPA/B/C. [25:13] X HBLKTOGO6 Sixth HBLK Toggle Position for Odd Lines, or RA5H1REPA/B/C. [27:26] X Unused Set unused bits to 0. 0x03 [12:0] X SCP HBLKTOGE1 First HBLK Toggle Position for Even Lines, or RA0H2REPA/B/C. [25:13] X HBLKTOGE2 Second HBLK Toggle Position for Even Lines, or RA1H2REPA/B/C. [27:26] X Unused Set unused bits to 0. 0x04 [12:0] X SCP HBLKTOGE3 Third HBLK Toggle Position for Even Lines, or RA2H2REPA/B/C. [25:13] X HBLKTOGE4 Fourth HBLK Toggle Position for Even Lines, or RA3H2REPA/B/C. [27:26] X Unused Set unused bits to 0.

Content

Default Value Update Name Description

Rev. A | Page 47 of 52

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Data Bit

Address

0x05 [12:0] X SCP HBLKTOGE5 Fifth HBLK Toggle Position for Even Lines, or RA4H2REPA/B/C. [25:13] X HBLKTOGE6 Sixth HBLK Toggle Position for Even Lines, or RA5H2REPA/B/C. [27:26] X Unused Set unused bits to 0. 0x06 [12:0] X SCP HBLKSTARTA HBLK Repeat Area Start Position A. Used during HBLK Mode 2. [25:13] X HBLKSTARTB HBLK Repeat Area Start Position B. Used during HBLK Mode 2. [27:26] X Unused Set unused bits to 0. 0x07 [12:0] X SCP HBLKSTARTC HBLK Repeat Area Start Position C. Used during HBLK Mode 2. [27:13] X Unused Set unused bits to 0. 0x08 [2:0] X SCP HBLKALT_PAT1 HBLK Pattern 1 Order. Used during pixel mixing mode. [5:3] X HBLKALT_PAT2 HBLK Pattern 2 Order. Used during pixel mixing mode. [8:6] X HBLKALT_PAT3 HBLK Pattern 3 Order. Used during pixel mixing mode. [11:9] X HBLKALT_PAT4 HBLK Pattern 4 Order. Used during pixel mixing mode. [14:12] X HBLKALT_PAT5 HBLK Pattern 5 Order. Used during pixel mixing mode. [17:15] X HBLKALT_PAT6 HBLK Pattern 6 Order. Used during pixel mixing mode. [19:18] X HBLK_MODE HBLK Mode Selection.

[20] X TESTMODE Test Operation Only. Set to 0. [27:21] X Unused Set unused bits to 0. 0x09 [12:0] X SCP HBLKLEN HBLK Length in HBLK Alteration Modes. [20:13] X HBLKREP Number of HBLK Repetitions in HBLK Alternation Modes. [21] X HBLKMASK_H1 Masking Polarity for H1/H3 During HBLK. [22] X HBLKMASK_H2 Masking Polarity for H2/H4 During HBLK. [27:23] X Unused Set unused bits to 0. 0xA [12:0] X SCP HBLKSTART HBLK Start Position Used in Pixel Mixing Modes. [25:13] X HBLKEND HBLK End Position Used in Pixel Mixing Modes. [27:26] X Unused Set unused bits to 0. 0xB [27:0] X SCP TESTMODE Test Operation Only. Set to 0. 0xC [12:0] X SCP CLPOB0_TOG1 CLPOB0 Toggle Position 1. [25:13] X CLPOB0_TOG2 CLPOB0 Toggle Position 2. [27:26] X Unused Set unused bits to 0. 0xD [12:0] X SCP CLPOB1_TOG1 CLPOB1 Toggle Position 1. [25:13] X CLPOB1_TOG2 CLPOB1 Toggle Position 2. [27:26] X Unused Set unused bits to 0. 0xE [12:0] X SCP PBLK0_TOG1 PBLK0 Toggle Position 1. [25:13] X PBLK0_TOG2 PBLK0 Toggle Position 2. [27:26] X Unused Set unused bits to 0. 0xF [12:0] X SCP PBLK1_TOG1 PBLK1 Toggle Position 1. [25:13] X PBLK1_TOG2 PBLK1 Toggle Position 2. [27:26] X Unused Set unused bits to 0.

Content

Default Value Update Name Description

0 = normal HBLK. 1 = pixel mixing mode. 2 = special pixel mixing mode. 3 = not used.

Table 31. Field Registers

Data Bit

Address

0x00 [12:0] X VD SCP0 Sequence Change Position 0. [25:13] X SCP1 Sequence Change Position 1. [27:26] X Unused Set unused bits to 0. 0x01 [12:0] X VD SCP2 Sequence Change Position 2. [25:13] X SCP3 Sequence Change Position 3. [27:26] X Unused Set unused bits to 0.

Content

Default Value Update Name Description

Rev. A | Page 48 of 52

AD9974

Data Bit

Address

0x02 [12:0] X VD SCP4 Sequence Change Position 4. [25:13] X SCP5 Sequence Change Position 5. [27:26] X Unused Set unused bits to 0. 0x03 [12:0] X VD SCP6 Sequence Change Position 6. [25:13] X SCP7 Sequence Change Position 7. [27:26] X Unused Set unused bits to 0. 0x04 [12:0] X VD SCP8 Sequence Change Position 8. [27:13] Unused Set unused bits to 0. 0x05 [4:0] X VD HPAT_SEL0 Selected H-Pattern for First Region in Field. [9:5] X HPAT_SEL1 Selected H-Pattern for Second Region in Field. [14:10] X HPAT_SEL2 Selected H-Pattern for Third Region in Field. [19:15] X HPAT_SEL3 Selected H-Pattern for Fourth Region in Field. [24:20] X HPAT_SEL4 Selected H-pattern for fifth region in field. [27:25] X Unused Set unused bits to 0. 0x06 [4:0] X VD HPAT_SEL5 Selected H-Pattern for Sixth Region in Field. [9:5] X HPAT_SEL6 Selected H-Pattern for Seventh Region in Field. [14:10] X HPAT_SEL7 Selected H-Pattern for Eighth Region in Field. [19:15] X HPAT_SEL8 Selected H-Pattern for Ninth Region in Field. [27:20] X Unused Set unused bits to 0. 0x07 [27:0] X VD Unused Set unused bits to 0. 0x08 [8:0] X VD CLPOB_POL CLPOB Start Polarity Settings. [17:9] X CLPOB_PAT CLPOB Pattern Selector.

[27:18] X Unused Set unused bits to 0. 0x09 [12:0] X VD CLPOBMASKSTART1 CLPOB Mask 1 Start Position. [25:13] X CLOBMASKEND1 CLPOB Mask 1 End Position. [27:26] Unused Set unused bits to 0. 0xA [12:0] X VD CLPOBMASKSTART2 CLPOB Mask 2 Start Position. [25:13] X CLOBMASKEND2 CLPOB Mask 2 End Position. [27:26] X Unused Set unused bits to 0. 0xB [12:0] X VD CLPOBMASKSTART3 CLPOB Mask 3 Start Position. [25:13] X CLOBMASKEND3 CLPOB Mask 3 End Position. [27:26] X Unused Set unused bits to 0. 0xC [8:0] X VD PBLK_POL PBLK Start Polarity Settings for Sequence 0 to Sequence 8. [17:9] X PBLK_PAT PBLK Pattern Selector.

[27:18] X Unused Set unused bits to 0 0xD [12:0] X VD PBLKMASKSTART1 PBLK Mask Region 1 Start Position. [25:13] X PBLKMASKEND1 PBLK Mask Region 1 End Position. [27:26] X Unused Set unused bits to 0. 0xE [12:0] X VD PBLKMASKSTART2 PBLK Mask Region 2 Start Position. [25:13] X PBLKMASKEND2 PBLK Mask Region 2 End Position. [27:26] X Unused Set unused bits to 0. 0xF [12:0] X VD PBLKMASKSTART3 PBLK Mask Region 3 Start Position. [25:13] X PBLKMASKEND3 PBLK Mask Region 3 End Position. [27:26] X Unused Set unused bits to 0.

Content

Default Value Update Name Description

0 = CLPOB0_TOG registers are used. 1 = CLPOB1_TOG registers are used.

0 = PBLK0_TOG registers are used. 1 = PBLK1_TOG registers are used.

Rev. A | Page 49 of 52

AD9974

OUTLINE DIMENSIONS

INDEX AREA

0.80 BSC

DETAIL A

1 CORNER

SEATING PLANE

A B C D E F

G H J

0.65 MIN

COPLANARITY

0.12

1.40 MAX

9.10

9.00 SQ

8.90

BALL A1 PAD CORNER

TOP VIEW

DETAIL A

7.20

BSC SQ

0.25 MIN

10 9 8 7 6 5 4 3 2 1

0.55

0.50

0.45

BALL DIAMET ER

COMPLIANT TO JEDEC S T ANDARDS M O-205-AB.

012006-0

Figure 56. 100-Lead Chip Scale Package Ball Grid Array [CSP_BGA]

(BC-100-1)

Dimensions shown in millimeters

ORDERING GUIDE

Model Temperature Range Package Description Package Option

AD9974BBCZ1 −25°C to +85°C 100-Lead Chip Scale Package Ball Grid Array [CSP_BGA] BC-100-1 AD9974BBCZRL

Z = RoHS Compliant Part.

−25°C to +85°C 100-Lead Chip Scale Package Ball Grid Array [CSP_BGA] BC-100-1

Rev. A | Page 50 of 52

AD9974

NOTES

Rev. A | Page 51 of 52

AD9974

NOTES

Rev. A | Page 52 of 52

Datasheet AD9974 Datasheet (ANALOG DEVICES)

Specifications and Main Features

Frequently Asked Questions

User Manual

FEATURES

APPLICATIONS

GENERAL DESCRIPTION

FUNCTIONAL BLOCK DIAGRAM

TABLE OF CONTENTS

REVISION HISTORY

SPECIFICATIONS

CHANNEL-TO-CHANNEL SPECIFICATIONS

TIMING SPECIFICATIONS

DIGITAL SPECIFICATIONS

ANALOG SPECIFICATIONS

ABSOLUTE MAXIMUM RATINGS

THERMAL CHARACTERISTICS

ESD CAUTION

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

TYPICAL PERFORMANCE CHARACTERISTICS

EQUIVALENT INPUT/OUTPUT CIRCUITS

TERMINOLOGY

THEORY OF OPERATION

PROGRAMMABLE TIMING GENERATION

PRECISION TIMING HIGH SPEED TIMING CORE

Timing Resolution

High Speed Clock Programmability

H-Driver and RG Outputs Digital Data Outputs

HORIZONTAL CLAMPING AND BLANKING

Individual CLPOB and PBLK Patterns

CLPOB and PBLK Masking Area

Individual HBLK Patterns

HBLK Mode 0 Operation

HBLK Mode 1 Operation

Generating HBLK Line Alternation

Increasing H-Clock Width During HBLK

HBLK Mode 2 Operation

HBLK, PBLK, and CLPOB Toggle Positions

Caution

COMPLETE FIELD—COMBINING H-PATTERNS

H-Pattern Selection

MODE REGISTERS

HORIZONTAL TIMING SEQUENCE EXAMPLE

ANALOG FRONT END DESCRIPTION AND OPERATION

DC RESTORE

Analog Preblanking

Correlated Double Sampler (CDS)

Input Configurations

Inverting CDS Mode

Noninverting Input

SHA Mode—Differential Input Configuration

CDS Timing Control

SHA Mode—DC-Coupled, Single–Ended Input

Optical Black Clamp

Digital Data Outputs

APPLICATIONS INFORMATION

RECOMMENDED POWER-UP SEQUENCE

Additional Restrictions

Example Register Settings for Power-Up

Additional Restrictions

STANDBY MODE OPERATION

CLI FREQUENCY CHANGE

CIRCUIT CONFIGURATION

3 V System Compatibility

GROUNDING AND DECOUPLING RECOMMENDATIONS

3-WIRE SERIAL INTERFACE TIMING

LAYOUT OF INTERNAL REGISTERS

UPDATING OF REGISTER VALUES

COMPLETE REGISTER LISTING

OUTLINE DIMENSIONS

ORDERING GUIDE