Analog Devices AD9767 b Datasheet

a
“1”
LATCH
“1”
DAC
REFIO FSADJ1 FSADJ2 GAINCTRL
REFERENCE
BIAS
GENERATOR
I
OUTA1
I
OUTB1
SLEEP
I
OUTA2
I
OUTB2
DIGITAL
INTERFACE
AD9767
PORT1
PORT2
WRT1
WRT2
DVDD DCOM AVDD ACOM CLK1
CLK2
MODE
“2”
DAC
“2”
LATCH
14-Bit, 125 MSPS
Dual TxDAC+
®
D/A Converter
AD9767*
FEATURES 14-Bit Dual Transmit DAC 125 MSPS Update Rate Excellent SFDR and IMD: 82 dBc Excellent Gain and Offset Matching: 0.1% Fully Independent or Single Resistor Gain Control Dual Port or Interleaved Data On-Chip 1.2 V Reference Single 5 V or 3 V Supply Operation Power Dissipation: 380 mW @ 5 V Power-Down Mode: 50 mW @ 5 V 48-Lead LQFP
APPLICATIONS Communications Base Stations Digital Synthesis Quadrature Modulation
PRODUCT DESCRIPTION
The AD9767 is a dual port, high speed, two channel, 14-bit CMOS DAC. It integrates two high quality 14-bit TxDAC+ cores, a voltage reference and digital interface circuitry into a small 48-lead LQFP package. The AD9767 offers exceptional ac and dc performance while supporting update rates up to 125 MSPS.
The AD9767 has been optimized for processing I and Q data in communications applications. The digital interface consists of two double-buffered latches as well as control logic. Separate write inputs allow data to be written to the two DAC ports independent of one another. Separate clocks control the update rate of the DACs.
A mode control pin allows the AD9767 to interface to two sep­arate data ports, or to a single interleaved high speed data port. In interleaving mode the input data stream is demuxed into its original I and Q data and then latched. The I and Q data is then converted by the two DACs and updated at half the input data rate.
The GAINCTRL pin allows two modes for setting the full-scale current (I set independently using two external resistors, or I
) of the two DACs. I
OUTFS
for each DAC can be
OUTFS
OUTFS
for both
DACs can be set by using a single external resistor.**
The DACs utilize a segmented current source architecture com­bined with a proprietary switching technique to reduce glitch energy and to maximize dynamic accuracy. Each DAC provides
FUNCTIONAL BLOCK DIAGRAM
differential current output thus supporting single-ended or differential applications. Both DACs can be simultaneously updated and provide a nominal full-scale current of 20 mA. The full-scale currents between each DAC are matched to within
0.1%.
The AD9767 is manufactured on an advanced low cost CMOS process. It operates from a single supply of 3.0 V to 5.0 V and consumes 380 mW of power.
PRODUCT HIGHLIGHTS
1. The AD9767 is a member of a pin-compatible family of dual TxDACs providing 8-, 10-, 12- and 14-bit resolution.
2. Dual 14-Bit, 125 MSPS DACs: A pair of high performance DACs optimized for low distortion performance provide for flexible transmission of I and Q information.
3. Matching: Gain matching is typically 0.1% of full scale, and offset error is better than 0.02%.
4. Low Power: Complete CMOS Dual DAC function operates on 380 mW from a 3.0 V to 5.0 V single supply. The DAC full-scale current can be reduced for lower power operation, and a sleep mode is provided for low power idle periods.
5. On-Chip Voltage Reference: The AD9767 includes a 1.20 V temperature-compensated bandgap voltage reference.
6. Dual 14-Bit Inputs: The AD9767 features a flexible dual­port interface allowing dual or interleaved input data.
TxDAC+ is a registered trademark of Analog Devices, Inc.
**Patent pending.
**Please see GAINCTRL Mode section, for important date code information on
this feature.
REV. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 2000
AD9767–SPECIFICATIONS
(T
to T
DC SPECIFICATIONS
MIN
, AVDD = +5 V, DVDD = +5 V, I
MAX
Parameter Min Typ Max Units
RESOLUTION 14 Bits
DC ACCURACY
1
Integral Linearity Error (INL)
T
= +25°C –3.5 ± 1.5 +3.5 LSB
A
T
MIN
to T
MAX
–4.0 +4.0 LSB
Differential Nonlinearity (DNL)
= +25°C –2.5 ± 1.0 +2.5 LSB
T
A
T
MIN
to T
MAX
–3.0 +3.0 LSB
ANALOG OUTPUT
Offset Error –0.02 +0.02 % of FSR Gain Error (Without Internal Reference) –2 ±0.25 +2 % of FSR Gain Error (With Internal Reference) –5 ±1 +5 % of FSR Gain Match –1.6 0.1 +1.6 % of FSR
–0.14 +0.14 dB
2.0 20.0 mA
Full-Scale Output Current
2
Output Compliance Range –1.0 +1.25 V Output Resistance 100 k Output Capacitance 5 pF
REFERENCE OUTPUT
Reference Voltage 1.14 1.20 1.26 V Reference Output Current
3
REFERENCE INPUT
Input Compliance Range 0.1 1.25 V Reference Input Resistance 1 M Small Signal Bandwidth 0.5 MHz
TEMPERATURE COEFFICIENTS
Offset Drift 0 ppm of FSR/°C Gain Drift (Without Internal Reference) ±50 ppm of FSR/°C Gain Drift (With Internal Reference) ±100 ppm of FSR/°C Reference Voltage Drift ±50 ppm/°C
POWER SUPPLY
Supply Voltages
AVDD 3 5 5.5 V
DVDD 2.7 5 5.5 V Analog Supply Current (I Digital Supply Current (I Digital Supply Current (I Supply Current Sleep Mode (I Power Dissipation Power Dissipation Power Dissipation
4
(5 V, I
5
(5 V, I
6
(5 V, I
Power Supply Rejection Ratio
)7175mA
AVDD
4
)
DVDD
5
)
DVDD
OUTFS
OUTFS
OUTFS
)812mA
AVDD
= 20 mA) 380 410 mW = 20 mA) 420 450 mW = 20 mA) 450 mW
7
—AVDD –0.4 +0.4 % of FSR/V
Power Supply Rejection Ratio7—DVDD –0.025 +0.025 % of FSR/V
OPERATING RANGE –40 +85 °C
NOTES
1
Measured at I
2
Nominal full-scale current, I
3
An external buffer amplifier with input bias current <100 nA should be used to drive any external load.
4
Measured at f
5
Measured at f
6
Measured as unbuffered voltage output with I
7
±10% Power supply variation.
Specifications subject to change without notice.
, driving a virtual ground.
OUTA
= 25 MSPS and f
CLOCK
= 100 MSPS and f
CLOCK
, is 32 times the I
OUTFS
= 1.0 MHz.
OUT
= 1 MHz.
OUT
current.
REF
= 20 mA and 50 Ω R
OUTFS
LOAD
at I
OUTA
= 20 mA, unless otherwise noted.)
OUTFS
100 nA
57 mA
15 mA
and I
OUTB
, f
= 100 MSPS and f
CLOCK
= 40 MHz.
OUT
–2–
REV. B
AD9767
(T
to T
DYNAMIC SPECIFICATIONS
MIN
, AVDD = +5 V, DVDD = +5 V, I
MAX
Output, 50 Doubly Terminated, unless otherwise noted)
Parameter Min Typ Max Units
DYNAMIC PERFORMANCE
Maximum Output Update Rate (f Output Settling Time (t Output Propagation Delay (t
) (to 0.1%)
ST
)1ns
PD
Glitch Impulse 5 pV-s Output Rise Time (10% to 90%) Output Fall Time (90% to 10%) Output Noise (I Output Noise (I
= 20 mA) 50 pA/Hz
OUTFS
= 2 mA) 30 pA/Hz
OUTFS
) 125 MSPS
CLOCK
1
1
1
AC LINEARITY
Spurious-Free Dynamic Range to Nyquist
= 100 MSPS; f
f
CLOCK
= 1.00 MHz
OUT
0 dBFS Output 71 82 dBc –6 dBFS Output 77 dBc –12 dBFS Output 73 dBc –18 dBFS Output 70 dBc
= 65 MSPS; f
f
CLOCK
= 65 MSPS; f
f
CLOCK
f
= 65 MSPS; f
CLOCK
f
= 65 MSPS; f
CLOCK
= 65 MSPS; f
f
CLOCK
f
= 125 MSPS; f
CLOCK
f
= 125 MSPS; f
CLOCK
= 1.00 MHz 82 dBc
OUT
= 2.51 MHz 80 dBc
OUT
= 5.02 MHz 79 dBc
OUT
= 14.02 MHz 70 dBc
OUT
= 25 MHz 55 dBc
OUT
= 25 MHz 67 dBc
OUT
= 40 MHz 70 dBc
OUT
Spurious-Free Dynamic Range Within a Window
= 100 MSPS; f
f
CLOCK
f
= 50 MSPS; f
CLOCK
= 65 MSPS; f
f
CLOCK
f
= 125 MSPS; f
CLOCK
= 1.00 MHz; 2 MHz Span 82 91 dBc
OUT
= 5.02 MHz; 10 MHz Span 88 dBc
OUT
= 5.03 MHz; 10 MHz Span 88 dBc
OUT
= 5.04 MHz; 10 MHz Span 88 dBc
OUT
Total Harmonic Distortion
= 100 MSPS; f
f
CLOCK
f
= 50 MSPS; f
CLOCK
f
= 125 MSPS; f
CLOCK
= 125 MSPS; f
f
CLOCK
= 1.00 MHz –81 –71 dBc
OUT
= 2.00 MHz –79 dBc
OUT
= 4.00 MHz –83 dBc
OUT
= 10.00 MHz –80 dBc
OUT
Multitone Power Ratio (Eight Tones at 110 kHz Spacing)
f
= 65 MSPS; f
CLOCK
= 2.00 MHz to 2.99 MHz
OUT
0 dBFS Output 80 dBc –6 dBFS Output 79 dBc –12 dBFS Output 78 dBc –18 dBFS Output 76 dBc
Channel Isolation
= 125 MSPS; f
f
CLOCK
f
= 125 MSPS; f
CLOCK
NOTES
1
Measured single-ended into 50 load.
Specifications subject to change without notice.
= 10 MHz 85 dBc
OUT
= 40 MHz 77 dBc
OUT
= 20 mA, Differential Transformer Coupled
OUTFS
35 ns
2.5 ns
2.5 ns
REV. B –3–
AD9767–SPECIFICATIONS
WARNING!
ESD SENSITIVE DEVICE
(T
to T
DIGITAL SPECIFICATIONS
MIN
, AVDD = +5 V, DVDD = +5 V, I
MAX
Parameter Min Typ Max Units
DIGITAL INPUTS
Logic “1” Voltage @ DVDD = +5 V 3.5 5 V Logic “1” @ DVDD = 3 2.1 3 V Logic “0” Voltage @ DVDD = +5 V 0 1.3 V Logic “0” @ DVDD = 3 0 0.9 V Logic “1” Current –10 +10 µA Logic “0” Current –10 +10 µA Input Capacitance 5 pF Input Setup Time (t Input Hold Time (t Latch Pulsewidth (t
Specifications subject to change without notice.
) 2.0 ns
S
) 1.5 ns
H
, t
LPW
) 3.5 ns
CPW
ABSOLUTE MAXIMUM RATINGS*
With
Parameter Respect to Min Max Units
AVDD ACOM –0.3 +6.5 V DVDD DCOM –0.3 +6.5 V ACOM DCOM –0.3 +0.3 V AVDD DVDD –6.5 +6.5 V MODE, CLK1, CLK2, WRT1, WRT2 DCOM –0.3 DVDD + 0.3 V Digital Inputs DCOM –0.3 DVDD + 0.3 V I
OUTA1/IOUTA2
, I
OUTB1/IOUTB2
ACOM –1.0 AVDD + 0.3 V REFIO, FSADJ1, FSADJ2 ACOM –0.3 AVDD + 0.3 V GAINCTRL, SLEEP ACOM –0.3 AVDD + 0.3 V Junction Temperature +150 °C Storage Temperature –65 +150 °C Lead Temperature (10 sec) +300 °C
*Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum ratings for extended periods may affect device reliability.
= 20 mA, unless otherwise noted.)
OUTFS
ORDERING GUIDE
Temperature Package Package
Model Range Description Option*
(WRT2) (WRT1 / IQWRT)
DATA IN
AD9767AST –40°C to +85°C 48-Lead LQFP ST-48 AD9767-EB Evaluation Board
*ST = Thin Plastic Quad Flatpack.
(CLK2) (CLK1/ IQCLK)
THERMAL CHARACTERISTICS Thermal Resistance
48-Lead LQFP
θ
= 91°C/W
JA
Figure 1. Timing Diagram for Dual and Interleaved Modes
See Dynamic and Digital sections for timing specifications.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD9767 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
–4–
IOUTA
OR
IOUTB
t
S
t
H
t
LPW
t
CPW
t
PD
REV. B
PIN FUNCTION DESCRIPTIONS
Pin No. Name Description
1–14 PORT1 Data Bits DB13–P1 to DB0–P1. 15, 21 DCOM1, DCOM2 Digital Common. 16, 22 DVDD1, DVDD2 Digital Supply Voltage. 17 WRT1/IQWRT Input write signal for PORT 1 (IQWRT in interleaving mode). 18 CLK1/IQCLK Clock input for DAC1 (IQCLK in interleaving mode). 19 CLK2/IQRESET Clock input for DAC2 (IQRESET in interleaving mode). 20 WRT2/IQSEL Input write signal for PORT 2 (IQSEL in interleaving mode). 23–36 PORT2 Data Bits DB13–P2 to DB0–P2. 37 SLEEP Power-Down Control Input. 38 ACOM Analog Common. 39, 40 I
OUTA2
, I
OUTB2
“PORT 2” differential DAC current outputs. 41 FSADJ2 Full-scale current output adjust for DAC2. 42 GAINCTRL GAINCTRL Mode (0 = 2 resistor, 1 = 1 resistor.) 43 REFIO Reference Input/Output. 44 FSADJ1 Full-scale current output adjust for DAC1. 45, 46 I
OUTB1
, I
OUTA1
“PORT 1” differential DAC current outputs. 47 AVDD Analog Supply Voltage. 48 MODE Mode Select (1 = Dual Port, 0 = Interleaved).
AD9767
DB13-P1 (MSB)
DB12-P1
DB11-P1
DB10-P1
DB9-P1
DB8-P1
DB7-P1
DB6-P1
DB5-P1
DB4-P1
DB3-P1
DB2-P1
PIN CONFIGURATION
OUTA1IOUTB1
MODE
AVDD
I
FSADJ1
REFIO
GAINCTRL
AD9767
CLK1/IQCLK
WRT1/IQWRT
FSADJ2
WRT2/IQSEL
CLK2/IQRESET
48 47 46 45 44 39 38 3743 42 41 40
1
PIN 1
2
IDENTIFIER
3
4
5
6
7
8
9
10
11
12
13 14 15 16 17 18 19 20 21 22 23 24
DB1-P1
DB0-P1
DCOM1
TOP VIEW
(Not to Scale)
DVDD1
OUTB2IOUTA2
I
DVDD2
DCOM2
ACOM
SLEEP
DB13-P2
DB12-P2
36
35
34
33
32
31
30
29
28
27
26
25
DB0-P2
DB1-P2
DB2-P2
DB3-P2
DB4-P2
DB5-P2
DB6-P2
DB7-P2
DB8-P2
DB9-P2
DB10-P2
DB11-P2
REV. B
–5–
AD9767
DEFINITIONS OF SPECIFICATIONS Linearity Error (Also Called Integral Nonlinearity or INL)
Linearity error is defined as the maximum deviation of the actual analog output from the ideal output, determined by a straight line drawn from zero to full scale.
Differential Nonlinearity (or DNL)
DNL is the measure of the variation in analog value, normalized to full scale, associated with a 1 LSB change in digital input code.
Monotonicity
A D/A converter is monotonic if the output either increases or remains constant as the digital input increases.
Offset Error
The deviation of the output current from the ideal of zero is called offset error. For I inputs are all 0s. For I
, 0 mA output is expected when the
OUTA
, 0 mA output is expected when all
OUTB
inputs are set to 1s.
Gain Error
The difference between the actual and ideal output span. The actual span is determined by the output when all inputs are set to 1s minus the output when all inputs are set to 0s.
Output Compliance Range
The range of allowable voltage at the output of a current-output DAC. Operation beyond the maximum compliance limits may cause either output stage saturation or breakdown resulting in nonlinear performance.
Temperature Drift
Temperature drift is specified as the maximum change from the ambient (+25°C) value to the value at either T
MIN
or T
MAX
. For offset and gain drift, the drift is reported in ppm of full-scale range (FSR) per degree C. For reference drift, the drift is reported in ppm per degree C (ppm/°C).
Power Supply Rejection
The maximum change in the full-scale output as the supplies are varied from nominal to minimum and maximum specified voltages.
Settling Time
The time required for the output to reach and remain within a specified error band about its final value, measured from the start of the output transition.
Glitch Impulse
Asymmetrical switching times in a DAC give rise to undesired output transients that are quantified by a glitch impulse. It is specified as the net area of the glitch in pV-s.
Spurious-Free Dynamic Range
The difference, in dB, between the rms amplitude of the output signal and the peak spurious signal over the specified bandwidth.
Total Harmonic Distortion
THD is the ratio of the rms sum of the first six harmonic components to the rms value of the measured input signal. It is expressed as a percentage or in decibels (dB).
R
1
SET
2k
0.1␮F
R
SET
2k
DVDD
DCOM
*RETIMED CLOCK OUTPUT
FSADJ1
REFIO
FSADJ2
2
LECROY 9210
PULSE
GENERATOR
1.2V REF
GAINCTRL
WRT1/ IQWRT
50
AVDD
PMOS
CURRENT
SOURCE
ARRAY
PMOS
CURRENT
SOURCE
ARRAY
AD9767
5V
DB0 – DB13 DB0 – DB13
DIGITAL
DATA
TEKTRONIX
AWG-2021
w/OPTION 4
CLK1/IQCLK
CLK
DIVIDER
DAC 1
LATCH
DAC 2
LATCH
MULTIPLEXING LOGIC
CHANNEL 2 LATCHCHANNEL 1 LATCH
*AWG2021 CLOCK RETIMED SUCH THAT DIGITAL DATA TRANSITIONS ON FALLING EDGE OF 50% DUTY CYCLE CLOCK
CLK2/IQRESET
SEGMENTED
SWITCHES FOR
DAC1
SEGMENTED
SWITCHES FOR
DAC2
SWITCH
SWITCH
WRT2/ IQSEL
SLEEP
LSB
LSB
ACOM
I
OUTA1
I
OUTB1
I
OUTA2
I
OUTB2
MODE
DVDD
DCOM
5050
5V
MINI
CIRCUITS
T1-1T
TO HP3589A SPECTRUM/ NETWORK ANALYZER
Figure 2. Basic AC Characterization Test Setup for AD9767, Testing Port 1 in Dual Port Mode, Using Independent GAINCTRL Resistors on FSADJ1 and FSADJ2
–6–
REV. B
Typical Characterization Curves
(AVDD = +5 V, DVDD = +3.3 V, I otherwise noted.)
90
5MSPS
80
70
SFDR – dBc
60
25MSPS
65MSPS
= 20 mA, 50 Doubly Terminated Load, Differential Output, TA = +25C, SFDR up to Nyquist, unless
OUTFS
125MSPS
90
85
SFDR – dBc
80
–12dBFS
0dBFS
–6dBFS
90
85
80
75
SFDR – dBc
70
65
AD9767
0dBFS
12dBFS
6dBFS
50
110
Figure 3. SFDR vs. f
85
80
75
70
65
SFDR – dBc
60
55
50
05 25
Figure 6. SFDR vs. f
90
85
80
75
SFDR – dBc
70
65
60
–20 –15
f
– MHz
OUT
0dBFS
–6dBFS
10 15 20
f
OUT
910kHz/10MSPS
2.27MHz/25MSPS
5.91MHz/65MSPS
–10 –5
A
OUT
@ 0 dBFS
OUT
–12dBFS
– MHz
OUT
11.37MHz/125MSPS
– dBFS
30 35
@ 65 MSPS
Figure 9. Single-Tone SFDR vs. A @ f
OUT
= f
CLOCK
/11
100
0
OUT
75
0.00 2.500.50 1.00 1.50 2.00
Figure 4. SFDR vs. f
85
80
75
70
–12dBFS
65
SFDR – dBc
60
55
50
010 50
Figure 7. SFDR vs. f
90
85
2MHz/10MSPS
80
75
70
SFDR – dBc
65
60
55
50
–20 –15 –5
0dBFS
20 30 40
5MHz/25MSPS
f
– MHz
OUT
OUT
–6dBFS
f
– MHz
OUT
@ 125 MSPS
OUT
1MHz/5MSPS
13MHz/65MSPS
25MHz/125MSPS
–10
A
– dBFS
OUT
@ 5 MSPS
60 70
Figure 10. Single-Tone SFDR vs.
@ f
A
OUT
OUT
= f
CLOCK
/5
60
0
Figure 5. SFDR vs. f
90
85
80
75
70
SFDR – dBc
65
60
55
50
0
Figure 8. SFDR vs. f
4
212
f
OUT
I
= 5mA
OUTFS
I
OUTFS
5152535
10
f
OUT
6
– MHz
OUT
I
= 20mA
– MHz
8
@ 25 MSPS
= 10mA
OUTFS
20 30
and I
OUT
10
OUTFS
@ 65 MSPS and 0 dBFS
85
80
75
70
65
SFDR – dBc
60
55
50
0
–25 –15 –10 –5
Figure 11. Dual-Tone SFDR vs. A @ f
OUT
0.965/1.035MHz@7MSPS
3.38/3.63MHz@25MSPS
16.9/18.1MHz@125MSPS
6.75/7.25MHz@65MSPS
–20
A
– dBFS
OUT
= f
CLOCK
/7
0
OUT
REV. B
–7–
AD9767
75
I
= 20mA
OUTFS
70
I
= 10mA
65
SINAD – dBc
60
55
20 14040 60 80 100 120
Figure 12. SINAD vs. f @ f
= 5 MHz and 0 dBFS
OUT
85
80
75
70
65
SFDR – dBc
60
55
50
45
40 20 80
60
OUTFS
I
= 5mA
OUTFS
f
– MSPS
CLOCK
CLOCK
f
= 1MHz
OUT
f
= 10MHz
OUT
f
= 25MHz
OUT
f
= 40MHz
OUT
f
= 60MHz
OUT
TEMPERATURE – C
40200
and I
60
OUTFS
100
Figure 15. SFDR vs. Temperature @ 125 MSPS, 0 dBFS
2.5
2.0
1.5
1.0
0.5
INL – LSBs
0
0.5
1.0
1.5
4000 8000 12000 16000
0
CODE
Figure 13. Typical INL
0.05
GAIN ERROR
0.03 OFFSET ERROR
0.00
–0.03
OFFSET ERROR – % FS
0.05
40 200 20406080
TEMPERATURE – C
1.0
0.5
0.00
0.5
1.0
Figure 16. Reference Voltage Drift vs. Temperature
GAIN ERROR – % FS
0.4
0.2
0
0.2
0.4
0.6
DNL LSBs
0.8
1.0
1.2
1.4
0 200
400 600 800 1000
CODE
Figure 14. Typical DNL
10
0
10
20
30
40
dBm
50
60
70
80
90
0
10 30
20
FREQUENCY – MHz
Figure 17. Single-Tone SFDR @ f
= 125 MSPS
CLK
40
0
10
20
30
40
dBm
50
60
70
80
90
0
20
10 30
FREQUENCY – MHz
Figure 18. Dual-Tone SFDR @ f
= 125 MSPS
CLK
0
10
20
30
40
dBm
50
60
70
80
90
0
40
10 30
20
FREQUENCY – MHz
40
Figure 19. Four-Tone SFDR
= 125 MSPS
@ f
CLK
–8–
REV. B
AD9767
+1.2V
REF
AVDD
GAINCTRL
CURRENT
SOURCE
ARRAY
REFIO
FSADJ
2k
AD9767
REFERENCE
SECTION
I
REF
ACOM
AVDD
EXTERNAL
REFERENCE
I
REF
5V
CURRENT
CURRENT
AD9767
WRT1/ IQWRT
AVDD
PMOS
SOURCE
ARRAY
PMOS
SOURCE
ARRAY
MULTIPLEXING LOGIC
DB0 – DB13 DB0 – DB13
R
1
SET
2k
1
I
2
REF
0.1␮F
R
SET
2k
FSADJ1
REFIO
2
FSADJ2
1.2V REF
GAINCTRL
CLK1/IQCLK
CLK
DIVIDER
DAC 1
LATCH
DAC 2
LATCH
DIGITAL DATA INPUTS
Figure 20. Simplified Block Diagram
FUNCTIONAL DESCRIPTION
Figure 20 shows a simplified block diagram of the AD9767. The AD9767 consists of two DACs, each with its own indepen­dent digital control logic and full-scale output current control. Each DAC contains a PMOS current source array capable of providing up to 20 mA of full-scale current (I
OUTFS
). The array is divided into 31 equal currents that make up the five most significant bits (MSBs). The next four bits, or middle bits, consist of 15 equal current sources whose value is 1/16th of an MSB current source. The remaining LSB is a binary weighted fraction of the middle bit current sources. Implementing the middle and lower bits with current sources, instead of an R-2R ladder, enhances the dynamic performance for multitone or low amplitude signals and helps maintain the DAC’s high output impedance (i.e., >100 k).
All of these current sources are switched to one or the other of the two output nodes (i.e., I
OUTA
or I
) via PMOS differen-
OUTB
tial current switches. The switches are based on a new architec­ture that drastically improves distortion performance. This new switch architecture reduces various timing errors and provides matching complementary drive signals to the inputs of the dif­ferential current switches.
The analog and digital sections of the AD9767 have separate power supply inputs (i.e., AVDD and DVDD) that can operate independently over a 3 V to 5.5 V range. The digital section, which is capable of operating up to a 125 MSPS clock rate, consists of edge-triggered latches and segment decoding logic circuitry. The analog section includes the PMOS current sources, the associated differential switches, a 1.20 V bandgap voltage reference and two reference control amplifiers.
The full-scale output current of each DAC is regulated by sepa­rate reference control amplifiers and can be set from 2 mA to 20 mA via an external resistor, R
, connected to the Full
SET
Scale Adjust (FSADJ) pin. The external resistor, in combination with both the reference control amplifier and voltage reference
, sets the reference current I
V
REFIO
, which is replicated to the
REF
segmented current sources with the proper scaling factor. The full-scale current, I
REV. B
, is 32 × I
OUTFS
REF
.
–9–
CLK2/IQRESET
SWITCHES FOR
SEGMENTED
SWITCHES FOR
CHANNEL 2 LATCHCHANNEL 1 LATCH
SEGMENTED
DAC1
DAC2
SLEEP
LSB
SWITCH
LSB
SWITCH
WRT2/ IQSEL
ACOM
I
OUTA1
I
OUTB1
I
OUTA2
I
OUTB2
MODE
DVDD
DCOM
= V
A – V
V
DIFF
OUT
2A
V
OUT
V
2B
RL2B 50
RL2A 50
OUT
5V
B
OUT
1A
V
OUT
V
1B
RL1B 50
RL1A 50
OUT
REFERENCE OPERATION
The AD9767 contains an internal 1.20 V bandgap reference. This can easily be overridden by an external reference with no effect on performance. REFIO serves as either an input or out- put, depending on whether the internal or an external reference is used. To use the internal reference, simply decouple the REFIO pin to ACOM with a 0.1 µF capacitor. The internal reference voltage will be present at REFIO. If the voltage at REFIO is to be used elsewhere in the circuit, an external buffer amplifier with an input bias current of less than 100 nA should be used. An example of the use of the internal reference is shown in Figure 21.
OPTIONAL EXTERNAL
REFERENCE
BUFFER
ADDITIONAL
EXTERNAL
LOAD
0.1␮F
I
REF
2k
GAINCTRL
+1.2V
REF
REFIO
FSADJ
AD9767
REFERENCE
SECTION
AVDD
CURRENT
SOURCE
ARRAY
ACOM
Figure 21. Internal Reference Configuration
An external reference can be applied to REFIO as shown in Figure 22. The external reference may provide either a fixed reference voltage to enhance accuracy and drift performance or a varying reference voltage for gain control. Note that the 0.1 µF compensation capacitor is not required since the internal refer­ence is overridden, and the relatively high input impedance of REFIO minimizes any loading of the external reference.
Figure 22. External Reference Configuration
AD9767
GAINCTRL MODE
The AD9767 allows the gain of each channel to be indepen­dently set by connecting one R other R system cost, a single R
resistor to FSADJ2. To add flexibility and reduce
SET
resistor can be used to set the gain of
SET
resistor to FSADJ1 and an-
SET
both channels simultaneously.
When GAINCTRL is low (i.e., connected to AGND), the inde­pendent channel gain control mode using two resistors is enabled. In this mode, individual R
resistors should be connected to
SET
FSADJ1 and FSADJ2. When GAINCTRL is high (i.e., con­nected to AVDD), the master/slave channel gain control mode using one resistor is enabled. In this mode, a single R
resistor
SET
is connected to FSADJ1 and the resistor on FSADJ2 must be removed.
NOTE: Only parts with date code of 9930 or later have the Master/Slave GAINCTRL function. For parts with a date code before 9930, Pin 42 must be connected to AGND, and the part will operate in the two resistor, independent gain control mode.
REFERENCE CONTROL AMPLIFIER
Both of the DACs in the AD9767 contain a control amplifier that is used to regulate the full-scale output current, I
OUTFS
. The control amplifier is configured as a V-I converter as shown in Figure 21, so that its current output, I by the ratio of the V stated in Equation 4. I
and an external resistor, R
REFIO
is copied to the segmented current
REF
sources with the proper scale factor to set I
, is determined
REF
as stated in
OUTFS
SET
, as
Equation 3.
The control amplifier allows a wide (10:1) adjustment span of I
from 2 mA to 20 mA by setting I
OUTFS
and 625 µA. The wide adjustment range of I
between 62.5 µA
REF
OUTFS
provides several benefits. The first relates directly to the power dissipa­tion of the AD9767, which is proportional to I
OUTFS
(refer to the Power Dissipation section). The second relates to the 20 dB adjustment, which is useful for system gain control purposes.
The small signal bandwidth of the reference control amplifier is approximately 500 kHz and can be used for low frequency, small signal multiplying applications.
DAC TRANSFER FUNCTION
Both DACs in the AD9767 provide complementary current outputs, I current output, I = 16383) while I current. The current output appearing at I a function of both the input code and I
OUTA
and I
OUTFS
OUTB
. I
OUTB
will provide a near full-scale
OUTA
, when all bits are high (i.e., DAC CODE
, the complementary output, provides no
and I
OUTA
and can be
OUTFS
OUTB
is
expressed as:
I
= (DAC CODE /16384) × I
OUTA
I
= (16383 – DAC CODE)/16384) × I
OUTB
OUTFS
OUTFS
(1)
(2)
where DAC CODE = 0 to 16383 (i.e., Decimal Representation).
As previously mentioned, I current I V
REFIO
, which is nominally set by a reference voltage,
REF
and external resistor R
I
= 32 × I
OUTFS
REF
is a function of the reference
OUTFS
. It can be expressed as:
SET
(3)
where
I
REF
= V
REFIO /RSET
(4)
The two current outputs will typically drive a resistive load di­rectly or via a transformer. If dc coupling is required, I I
should be directly connected to matching resistive loads,
OUTB
, that are tied to analog common, ACOM. Note, R
R
LOAD
may represent the equivalent load resistance seen by I I
as would be the case in a doubly terminated 50 or
OUTB
OUTA
OUTA
LOAD
or
and
75 cable. The single-ended voltage output appearing at the
and I
I
OUTA
V
OUTA
V
OUTB
Note the full-scale value of V
nodes is simply:
OUTB
= I
= I
OUTA
OUTB
× R × R
LOAD
LOAD
OUTA
and V
should not exceed
OUTB
(5)
(6)
the specified output compliance range to maintain specified distortion and linearity performance.
V
= (I
DIFF
Substituting the values of I
OUTA
– I
OUTB
) × R
OUTA
LOAD
, I
OUTB
and I
REF
; V
DIFF
(7)
can be
expressed as:
V
= {(2 × DAC CODE – 16383)/16384} ×
DIFF
(32 × R
LOAD/RSET
) × V
REFIO
(8)
These last two equations highlight some of the advantages of operating the AD9767 differentially. First, the differential opera­tion will help cancel common-mode error sources associated with I
OUTA
and I
such as noise, distortion and dc offsets.
OUTB
Second, the differential code dependent current and subsequent voltage, V output (i.e., V
, is twice the value of the single-ended voltage
DIFF
OUTA
or V
), thus providing twice the signal
OUTB
power to the load.
Note, the gain drift temperature performance for a single-ended (V
OUTA
and V
) or differential output (V
OUTB
) of the AD9767
DIFF
can be enhanced by selecting temperature tracking resistors for R
LOAD
and R
due to their ratiometric relationship as shown in
SET
Equation 8.
ANALOG OUTPUTS
The complementary current outputs in each DAC, I I
, may be configured for single-ended or differential opera-
OUTB
tion. I single-ended voltage outputs, V tor, R
and I
OUTA
, as described in the DAC Transfer Function section
LOAD
can be converted into complementary
OUTB
OUTA
and V
, via a load resis-
OUTB
by Equations 5 through 8. The differential voltage, V existing between V
OUTA
and V
can also be converted to a
OUTB
OUTA
and
DIFF
,
single-ended voltage via a transformer or differential amplifier configuration. The ac performance of the AD9767 is optimum and specified using a differential transformer coupled output in which the voltage swing at I
OUTA
and I
If a single-ended unipolar output is desirable, I
is limited to ±0.5 V.
OUTB
OUTA
should be
selected.
The distortion and noise performance of the AD9767 can be enhanced when it is configured for differential operation. The common-mode error sources of both I
OUTA
and I
OUTB
can be significantly reduced by the common-mode rejection of a trans­former or differential amplifier. These common-mode error sources include even-order distortion products and noise. The enhancement in distortion performance becomes more signifi­cant as the frequency content of the reconstructed waveform increases. This is due to the first order cancellation of various dynamic common-mode distortion mechanisms, digital feed­through and noise.
–10–
REV. B
AD9767
Performing a differential-to-single-ended conversion via a trans­former also provides the ability to deliver twice the reconstructed signal power to the load (i.e., assuming no source termination). Since the output currents of I
OUTA
and I
are complemen-
OUTB
tary, they become additive when processed differentially. A properly selected transformer will allow the AD9767 to provide the required power and voltage levels to different loads.
The output impedance of I
OUTA
and I
is determined by the
OUTB
equivalent parallel combination of the PMOS switches associ­ated with the current sources and is typically 100 k in parallel with 5 pF. It is also slightly dependent on the output voltage
OUTA
and V
(i.e., V As a result, maintaining I
) due to the nature of a PMOS device.
OUTB
OUTA
and/or I
at a virtual ground
OUTB
via an I-V op amp configuration will result in the optimum dc linearity. Note the INL/DNL specifications for the AD9767 are measured with I
maintained at a virtual ground via an
OUTA
op amp.
I
OUTA
and I
also have a negative and positive voltage com-
OUTB
pliance range that must be adhered to in order to achieve opti­mum performance. The negative output compliance range of –1.0 V is set by the breakdown limits of the CMOS process. Operation beyond this maximum limit may result in a break­down of the output stage and affect the reliability of the AD9767.
The positive output compliance range is slightly dependent on the full-scale output current, I its nominal 1.25 V for an I I
= 2 mA. The optimum distortion performance for a
OUTFS
OUTFS
. It degrades slightly from
OUTFS
= 20 mA to 1.00 V for an
single-ended or differential output is achieved when the maxi­mum full-scale signal at I
OUTA
and I Applications requiring the AD9767’s output (i.e., V V
) to extend its output compliance range should size R
OUTB
does not exceed 0.5 V.
OUTB
OUTA
and/or
LOAD
accordingly. Operation beyond this compliance range will ad­versely affect the AD9767’s linearity performance and subse­quently degrade its distortion performance.
DIGITAL INPUTS
The AD9767’s digital inputs consist of two channels. For the dual port mode, each DAC has its own dedicated 14-bit data port, WRT line and CLK line. In the interleaved timing mode, the function of the digital control pins changes as described in the Interleaved Mode Timing section. The 14-bit parallel data inputs follow straight binary coding where DB13 is the Most Significant Bit (MSB) and DB0 is the Least Significant Bit (LSB). I bits are at Logic 1. I
produces a full-scale output current when all data
OUTA
produces a complementary output
OUTB
with the full-scale current split between the two outputs as a function of the input code.
The digital interface is implemented using an edge-triggered master slave latch. The DAC outputs are updated following either the rising edge, or every other rising edge of the clock, depending on whether dual or interleaved mode is being used. The DAC outputs are designed to support a clock rate as high as 125 MSPS. The clock can be operated at any duty cycle that meets the specified latch pulsewidth. The setup and hold times can also be varied within the clock cycle as long as the specified minimum times are met, although the location of these transi­tion edges may affect digital feedthrough and distortion perfor­mance. Best performance is typically achieved when the input data transitions on the falling edge of a 50% duty cycle clock.
DAC TIMING
The AD9767 can operate in two timing modes, dual and inter­leaved, which are described below. The block diagram in Figure 25 represents the latch architecture in the interleaved timing mode.
DUAL PORT MODE TIMING
For the following section, refer to Figure 2.
When the mode pin is at Logic 1, the AD9767 operates in dual port mode. The AD9767 functions as two distinct DACs. Each DAC has its own completely independent digital input and control lines.
The AD9767 features a double buffered data path. Data enters the device through the channel input latches. This data is then transferred to the DAC latch in each signal path. Once the data is loaded into the DAC latch, the analog output will settle to its new value.
For general consideration, the WRT lines control the channel input latches and the CLK lines control the DAC latches. Both sets of latches are updated on the rising edge of their respective control signals.
The rising edge of CLK should occur before or simultaneously with the rising edge of WRT. Should the rising edge of CLK occur after the rising edge of WRT, a 2 ns minimum delay should be maintained from the rising edge of WRT to the rising edge of CLK.
Timing specifications for dual port mode are given in Figures 23 and 24.
DATA IN
WRT1/WRT2
CLK1/CLK2
IOUTA
OR
IOUTB
t
S
t
H
t
LPW
t
CPW
t
PD
Figure 23. Dual Mode Timing
D1 D2 D3 D4 D5DATA IN
WRT1/WRT2
CLK1/CLK2
IOUTA
OR
IOUTB
xx
D1
D2
D3
D4
Figure 24. Dual Mode Timing
REV. B
–11–
AD9767
DVDD
DIGITAL
INPUT
INTERLEAVED MODE TIMING
For the following section, refer to Figure 25.
When the mode pin is at Logic 0, the AD9767 operates in inter­leaved mode. WRT1 now functions as IQWRT and CLK1 functions as IQCLK. WRT2 functions as IQSEL and CLK2 functions as IQRESET.
Data enters the device on the rising edge of IQWRT. The logic level of IQSEL will steer the data to either Channel Latch 1 (IQSEL = 1) or to Channel Latch 2 (IQSEL = 0).
When IQRESET is high, IQCLK is disabled. When IQRESET goes low, the following rising edge on IQCLK will update both DAC latches with the data present at their inputs. In the inter­leaved mode IQCLK is divided by 2 internally. Following this first rising edge, the DAC latches will only be updated on every other rising edge of IQCLK. In this way, IQRESET can be used to synchronize the routing of the data to the DACs.
As with the dual port mode, IQCLK should occur before or simultaneously with IQWRT.
INTERLEAVED
DATA IN, PORT 1
IQWRT
IQSEL
IQCLK
IQRESET
PORT 1
INPUT
LATCH
PORT 2
INPUT
LATCH
2
DAC1 LATCH
DAC2 LATCH
DAC1
DAC2
DEINTERLEAVED DATA OUT
Figure 25. Latch Structure Interleaved Mode
Timing specifications for interleaved mode are given in Figures 26 and 27.
t
DATA IN
IQSEL
t
*
IQWRT
IQCLK
IOUTA
OR
IOUTB
* Applies to falling edge of IQCLK/IQWRT and IQSEL only
H
S
t
H
t
LPW
t
PD
Figure 26. Interleaved Mode Timing
INTERLEAVED
DATA
IQSEL
xx
D1 D2 D3 D4 D5
The digital inputs are CMOS-compatible with logic thresholds, V
THRESHOLD
, set to approximately half the digital positive supply
(DVDD) or
V
THRESHOLD
= DVDD/2 (± 20%)
The internal digital circuitry of the AD9767 is capable of oper­ating over a digital supply range of 3 V to 5.5 V. As a result, the digital inputs can also accommodate TTL levels when DVDD is set to accommodate the maximum high level voltage of the TTL drivers V
(MAX). A DVDD of 3 V to 3.3 V will typically
OH
ensure proper compatibility with most TTL logic families. Fig­ure 28 shows the equivalent digital input circuit for the data and clock inputs. The sleep mode input is similar with the exception that it contains an active pull-down circuit, thus ensuring that the AD9767 remains enabled if this input is left disconnected.
Since the AD9767 is capable of being updated up to 125 MSPS, the quality of the clock and data input signals are important in achieving the optimum performance. Operating the AD9767 with reduced logic swings and a corresponding digital supply (DVDD) will result in the lowest data feedthrough and on-chip digital noise. The drivers of the digital data interface circuitry should be specified to meet the minimum setup and hold times of the AD9767 as well as its required min/max input logic level thresholds.
Digital signal paths should be kept short and run lengths matched to avoid propagation delay mismatch. The insertion of a low value resistor network (i.e., 20 to 100 ) between the AD9767 digital inputs and driver outputs may be helpful in reducing any overshooting and ringing at the digital inputs that contribute to digital feedthrough. For longer board traces and high data up­date rates, stripline techniques with proper impedance and termination resistors should be considered to maintain “clean” digital inputs.
The external clock driver circuitry should provide the AD9767 with a low jitter clock input meeting the min/max logic levels while providing fast edges. Fast clock edges will help minimize any jitter that will manifest itself as phase noise on a recon­structed waveform. Thus, the clock input should be driven by the fastest logic family suitable for the application.
Note that the clock input could also be driven via a sine wave, which is centered around the digital threshold (i.e., DVDD/2) and meets the min/max logic threshold. This will typically result in a slight degradation in the phase noise, which becomes more noticeable at higher sampling rates and output frequencies. Also, at higher sampling rates, the 20% tolerance of the digital logic threshold should be considered since it will affect the effec­tive clock duty cycle and, subsequently, cut into the required data setup and hold times.
IQWRT
IQCLK
IQRESET
DAC OUTPUT
PORT 1
DAC OUTPUT
PORT 2
xx
xx
D1
D2
Figure 27. Interleaved Mode Timing
D3
D4
–12–
Figure 28. Equivalent Digital Input
REV. B
AD9767
RATIO – f
OUT/fCLK
0
0.1
0
I
DVDD
– mA
5
10
15
20
25
30
35
0.2 0.3 0.4 0.5
125MSPS
100MSPS
65MSPS
25MSPS
5MSPS
RATIO – f
OUT/fCLK
0
0.1
0
I
DVDD
– mA
2
4
6
8
10
12
14
0.2 0.3 0.4 0.5
16
18
125MSPS
100MSPS
65MSPS
25MSPS
5MSPS
INPUT CLOCK AND DATA TIMING RELATIONSHIP
SNR in a DAC is dependent on the relationship between the position of the clock edges and the point in time at which the input data changes. The AD9767 is rising edge triggered, and so exhibits SNR sensitivity when the data transition is close to this edge. In general, the goal when applying the AD9767 is to make the data transition close to the falling clock edge. This becomes more important as the sample rate increases. Figure 29 shows the relationship of SNR to clock placement with different sample rates. Note that at the lower sample rates, much more tolerance is allowed in clock placement, while much more care must be taken at higher rates.
80
70
60
50
40
SNR – dBc
30
20
10
0
3 1
4 2
TIME OF DATA CHANGE RELATIVE TO
RISING CLOCK EDGE – ns
Figure 29. SNR vs. Clock Placement @ f
= 125 MSPS
f
CLK
0
1
23
= 20 MHz and
OUT
4
80
70
60
50
AVDD
I
40
30
20
10
0510
Figure 30. I
Conversely, I form, f
CLOCK
show I
DVDD
(f
OUT/fCLOCK
is dependent on both the digital input wave-
DVDD
, and digital supply DVDD. Figures 31 and 32
as a function of full-scale sine wave output ratios
) for various update rates with DVDD = 5 V and
DVDD = 3 V, respectively. Note how I
15 20 25
I
OUTFS
vs. I
AVDD
OUTFS
DVDD
is reduced by more
than a factor of 2 when DVDD is reduced from 5 V to 3 V.
SLEEP MODE OPERATION
The AD9767 has a power-down function that turns off the output current and reduces the supply current to less than 8.5 mA over the specified supply range of 3.0 V to 5.5 V and tempera­ture range. This mode can be activated by applying a Logic Level “1” to the SLEEP pin. The SLEEP pin logic threshold is equal to 0.5 × AVDD. This digital input also contains an active pull-down circuit that ensures the AD9767 remains enabled if
Figure 31. I
vs. Ratio @ DVDD = 5 V
DVDD
this input is left disconnected. The AD9767 takes less than 50 ns to power down and approximately 5 µs to power back up.
POWER DISSIPATION
The power dissipation, PD, of the AD9767 is dependent on several factors that include: (1) The power supply voltages (AVDD and DVDD), (2) the full-scale current output I (3) the update rate f
, (4) and the reconstructed digital
CLOCK
OUTFS
,
input waveform. The power dissipation is directly proportional to the analog supply current, I rent, I
DVDD
. I
is directly proportional to I
AVDD
in Figure 30 and is insensitive to f
REV. B
, and the digital supply cur-
AVDD
OUTFS
CLOCK
.
as shown
–13–
Figure 32. I
vs. Ratio @ DVDD = 3 V
DVDD
AD9767
APPLYING THE AD9767 Output Configurations
The following sections illustrate some typical output configura­tions for the AD9767. Unless otherwise noted, it is assumed that I
is set to a nominal 20 mA. For applications requir-
OUTFS
ing the optimum dynamic performance, a differential output configuration is suggested. A differential output configuration may consist of either an RF transformer or a differential op amp configuration. The transformer configuration provides the opti­mum high frequency performance and is recommended for any application allowing for ac coupling. The differential op amp configuration is suitable for applications requiring dc coupling, a bipolar output, signal gain and/or level-shifting, within the bandwidth of the chosen op amp.
A single-ended output is suitable for applications requiring a unipolar voltage output. A positive unipolar output voltage will result if I
OUTA
and/or I
sized load resistor, R
is connected to an appropriately-
OUTB
, referred to ACOM. This configuration
LOAD
may be more suitable for a single-supply system requiring a dc coupled, ground referred output voltage. Alternatively, an amplifier could be configured as an I-V converter, thus convert-
OUTA
or I
ing I figuration provides the best dc linearity since I is maintained at a virtual ground. Note that I slightly better performance than I
into a negative unipolar voltage. This con-
OUTB
OUTA
provides
OUTA
.
OUTB
or I
OUTB
DIFFERENTIAL COUPLING USING A TRANSFORMER
An RF transformer can be used to perform a differential-to­single-ended signal conversion as shown in Figure 33. A dif­ferentially coupled transformer output provides the optimum distortion performance for output signals whose spectral con­tent lies within the transformer’s passband. An RF transformer such as the Mini-Circuits T1-1T provides excellent rejection of common-mode distortion (i.e., even-order harmonics) and noise over a wide frequency range. It also provides electrical isolation and the ability to deliver twice the power to the load. Transformers with different impedance ratios may also be used for impedance matching purposes. Note that the transformer provides ac coupling only.
The center tap on the primary side of the transformer must be connected to ACOM to provide the necessary dc current path for both I ing at I
OUTA
OUTA
and I
and I
. The complementary voltages appear-
OUTB
OUTB
(i.e., V
OUTA
and V
) swing symmetri-
OUTB
cally around ACOM and should be maintained with the specified output compliance range of the AD9767. A differential resistor,
, may be inserted in applications where the output of the
R
DIFF
transformer is connected to the load, R reconstruction filter or cable. R
is determined by the trans-
DIFF
, via a passive
LOAD
former’s impedance ratio and provides the proper source termi­nation that results in a low VSWR. Note that approximately half the signal power will be dissipated across R
DIFF
.
DIFFERENTIAL COUPLING USING AN OP AMP
An op amp can also be used to perform a differential-to-single­ended conversion as shown in Figure 34. The AD9767 is con­figured with two equal load resistors, R differential voltage developed across I
OUTA
, of 25 . The
LOAD
and I
OUTB
is con­verted to a single-ended signal via the differential op amp con­figuration. An optional capacitor can be installed across I and I
, forming a real pole in a low-pass filter. The addition
OUTB
OUTA
of this capacitor also enhances the op amps distortion perfor­mance by preventing the DACs high slewing output from over­loading the op amp’s input.
The common-mode rejection of this configuration is typically determined by the resistor matching. In this circuit, the differ­ential op amp circuit using the AD8047 is configured to provide some additional signal gain. The op amp must operate from a dual supply since its output is approximately ±1.0 V. A high speed amplifier capable of preserving the differential perfor­mance of the AD9767, while meeting other system level objectives (i.e., cost, power), should be selected. The op amp’s differential gain, its gain setting resistor values, and full-scale output swing capabilities should all be considered when optimizing this circuit.
500
AD9767
I
OUTA
I
OUTB
C
OPT
225
225
2525
AD8047
500
Figure 34. DC Differential Coupling Using an Op Amp
The differential circuit shown in Figure 35 provides the neces­sary level-shifting required in a single supply system. In this case AVDD, which is the positive analog supply for both the AD9767 and the op amp, is also used to level-shift the differential output of the AD9767 to midsupply (i.e., AVDD/2). The AD8055 is a suitable op amp for this application.
500
AD9767
I
OUTA
I
OUTB
25
C
OPT
225
225
50025
AD8055
1k
AVDD
Figure 35. Single Supply DC Differential Coupled Circuit
AD9767
I
OUTA
I
OUTB
MINI-CIRCUITS
T1-1T
OPTIONAL R
DIFF
R
LOAD
Figure 33. Differential Output Using a Transformer
SINGLE-ENDED UNBUFFERED VOLTAGE OUTPUT
Figure 36 shows the AD9767 configured to provide a unipolar output range of approximately 0 V to +0.5 V for a doubly termi­nated 50 cable since the nominal full-scale current, I 20 mA flows through the equivalent R R
represents the equivalent load resistance seen by I
LOAD
. The unused output (I
I
OUTB
OUTA
or I
ACOM directly or via a matching R
of 25 . In this case,
LOAD
) can be connected to
OUTB
. Different values of
LOAD
OUTFS
–14–
, of
or
OUTA
REV. B
I
OUTFS
and R
can be selected as long as the positive compli-
LOAD
ance range is adhered to. One additional consideration in this mode is the integral nonlinearity (INL) as discussed in the Analog Output section of this data sheet. For optimum INL performance, the single-ended, buffered voltage output configu­ration is suggested.
AD9767
I
OUTA
I
OUTB
I
OUTFS
= 20mA
25
50
V
OUTA
= 0 TO +0.5V
50
Figure 36. 0 V to 0.5 V Unbuffered Voltage Output
AD9767
One factor that can measurably affect system performance is the ability of the DAC output to reject dc variations or ac noise superimposed on the analog or digital dc power distribution. This is referred to as the Power Supply Rejection Ratio. For dc variations of the power supply, the resulting performance of the DAC directly corresponds to a gain error associated with the DAC’s full-scale current, I common in applications where the power distribution is gener­ated by a switching power supply. Typically, switching power supply noise will occur over the spectrum from tens of kHz to several MHz. The PSRR vs. frequency of the AD9767 AVDD supply over this frequency range is shown in Figure 38.
90
. AC noise on the dc supplies is
OUTFS
SINGLE-ENDED, BUFFERED VOLTAGE OUTPUT CONFIGURATION
Figure 37 shows a buffered single-ended output configuration in which the op amp U1 performs an I-V conversion on the AD9767 output current. U1 maintains I
OUTA
(or I
OUTB
) at a virtual ground, thus minimizing the nonlinear output impedance effect on the DAC’s INL performance as discussed in the Analog Output section. Although this single-ended configura­tion typically provides the best dc linearity performance, its ac distortion performance at higher DAC update rates may be limited by U1’s slewing capabilities. U1 provides a negative unipolar output voltage and its full-scale output voltage is sim­ply the product of R
and I
FB
. The full-scale output should
OUTFS
be set within U1’s voltage output swing capabilities by scaling
and/or RFB. An improvement in ac distortion perfor-
I
OUTFS
mance may result with a reduced I
since the signal current
OUTFS
U1 will be required to sink will be subsequently reduced.
C
OPT
R
FB
200
I
= 10mA
AD9767
I
OUTA
I
OUTB
OUTFS
200
U1
V
= I
OUTFS
R
FB
OUT
Figure 37. Unipolar Buffered Voltage Output
POWER AND GROUNDING CONSIDERATIONS, POWER SUPPLY REJECTION
Many applications seek high speed and high performance under less than ideal operating conditions. In these application cir­cuits, the implementation and construction of the printed circuit board is as important as the circuit design. Proper RF tech­niques must be used for device selection, placement and rout­ing, as well as power supply bypassing and grounding to ensure optimum performance. Figures 43 to 50 illustrate the recom­mended printed circuit board ground, power and signal plane layouts which are implemented on the AD9767 evaluation board.
85
80
PSRR – dB
75
70
0.2
0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 FREQUENCY – MHz
Figure 38. Power Supply Rejection Ratio of AD9767
Note that the units in Figure 38 are given in units of (amps out/ volts in). Noise on the analog power supply has the effect of modulating the internal current sources, and therefore the out­put current. The voltage noise on AVDD, therefore, will be added in a nonlinear manner to the desired I
. PSRR is very
OUT
code-dependent thus producing mixing effects which can modu­late low frequency power supply noise to higher frequencies. Worst case PSRR for either one of the differential DAC outputs will occur when the full-scale current is directed towards that output. As a result, the PSRR measurement in Figure 38 repre­sents a worst case condition in which the digital inputs remain static and the full-scale output current of 20 mA is directed to the DAC output being measured.
An example serves to illustrate the effect of supply noise on the analog supply. Suppose a switching regulator with a switching frequency of 250 kHz produces 10 mV of noise and, for simplic­ity sake (i.e., ignore harmonics), all of this noise is concentrated at 250 kHz. To calculate how much of this undesired noise will appear as current noise superimposed on the DAC’s full-scale current, I Figure 38 at 250 kHz. To calculate the PSRR for a given R
, one must determine the PSRR in dB using
OUTFS
LOAD
,
such that the units of PSRR are converted from A/V to V/V, adjust the curve in Figure 38 by the scaling factor 20 × Log
). For instance, if R
(R
LOAD
is 50 , the PSRR is reduced
LOAD
by 34 dB (i.e., PSRR of the DAC at 250 kHz, which is 85 dB in Figure 38, becomes 51 dB V
OUT/VIN
).
REV. B
–15–
AD9767
Proper grounding and decoupling should be a primary objective in any high speed, high resolution system. The AD9767 features separate analog and digital supply and ground pins to optimize the management of analog and digital ground currents in a system. In general, AVDD, the analog supply, should be de­coupled to ACOM, the analog common, as close to the chip as physically possible. Similarly, DVDD, the digital supply, should be decoupled to DCOM as close to the chip as physically possible.
For those applications that require a single +5 V or +3 V supply for both the analog and digital supplies, a clean analog supply may be generated using the circuit shown in Figure 39. The circuit consists of a differential LC filter with separate power supply and return lines. Lower noise can be attained by using low ESR type electrolytic and tantalum capacitors.
TTL/CMOS
LOGIC
CIRCUITS
+5V
POWER SUPPLY
FERRITE
BEADS
ELECTROLYTIC
100F
CERAMIC
AVDD
10–22F 0.1␮F
ACOM
TANTALUM
Figure 39. Differential LC Filter for Single +5 V and +3 V Applications
20
30
40
50
60
70
dBm
80
90
100
110
120
0.685 0.705 0.725 0.745 0.765 0.785 0.805 0.825
0.665 FREQUENCY – MHz
Figure 40a. Notch in Missing Bin at 750 kHz Is Down >60 dB (Peak Amplitude = 0 dBm)
20
40
60
dBm
–80
APPLICATION VDSL Applications Using the AD9767
Very High Frequency Digital Subscriber Line (VDSL) technol­ogy is growing rapidly in applications requiring data transfer over relatively short distances. By using QAM modulation and transmitting the data in Discrete Multiple Tones (DMT), high data rates can be achieved.
As with other multitone applications, each VDSL tone is ca­pable of transmitting a given number of bits, depending on the signal-to-noise ratio (SNR) in a narrow band around that tone. For a typical VDSL application, the tones are evenly spaced over the range of several kHz to 10 MHz. At the high frequency end of this range, performance is generally limited by cable characteristics and environmental factors, such as external inter­ferers. Performance at the lower frequencies is much more de­pendent on the performance of the components in the signal chain. In addition to in-band noise, intermodulation from other tones can also potentially interfere with the data recovery for a given tone. The two graphs in Figure 40 represent a 500 tone missing bin test vector, with frequencies evenly spaced from 400 Hz to 10 MHz. This test is very commonly done to deter­mine if distortion will limit the number of bits which can be transmitted in a tone. The test vector has a series of missing tones around 750 kHz, which is represented in Figure 40a, and a series of missing tones around 5 MHz, which is represented in Figure 40b. In both cases, the spurious free dynamic range (SFDR) between the transmitted tones and the empty bins is greater than 60 dB.
100
120
4.85 4.90 4.95 5.00 5.05 5.10 5.15 FREQUENCY – MHz
Figure 40b. Notch in Missing Bin at 5 MHz Is Down >60 dB (Peak Amplitude = 0 dBm)
CDMA
Carrier Division Multiple Access, or CDMA, is an air transmit/ receive scheme where the signal in the transmit path is modu­lated with a pseudorandom digital code (sometimes referred to as the spreading code). The effect of this is to spread the trans­mitted signal across a wide spectrum. Similar to a DMT wave­form, a CDMA waveform containing multiple subscribers can be characterized as having a high peak to average ratio (i.e., crest factor), thus demanding highly linear components in the transmit signal path. The bandwidth of the spectrum is defined by the CDMA standard being used, and in operation is imple­mented by using a spreading code with particular characteristics.
Distortion in the transmit path can lead to power being trans­mitted out of the defined band. The ratio of power transmitted in-band to out-of-band is often referred to as Adjacent Channel Power (ACP). This is a regulatory issue due to the possibility of interference with other signals being transmitted by air. Regula­tory bodies define a spectral mask outside of the transmit band, and the ACP must fall under this mask. If distortion in the transmit path causes the ACP to be above the spectral mask, then filtering, or different component selection, is needed to meet the mask requirements.
–16–
REV. B
AD9767
Figure 41 shows the AD9767, when used with the AD8346, reconstructing a wideband CDMA signal at 2.4 GHz. The baseband signal is being sampled at 65 MSPS and has a chip rate of 8M chips.
30
40
50
60
==
70
80
dB
90
100
110
c11 cu1
120
130
CENTER 2.4GHz 3MHz SPAN 30MHz
c11
C0
FREQUENCY
cu1
C0
Figure 41. CDMA Signal, 8 M Chips Sampled at 65 MSPS, Recreated at 2.4 GHz Adjacent Channel Power > 60 dBm
DVDD AVDD
CLK1
FSADJ1
(Q DAC)
FSADJ2
AD9767
(I DAC)
INPUT
LATCHES
INPUT
LATCHES
REFIO SLEEP
0.1␮F
DAC
LATCHES
DAC
LATCHES
CLK2
U1
DAC
U2
DAC
ACOM
IOUTA
IOUTB
QOUTA
QOUTB
DCOM
50
50
500
500
50
500
50
R
CAL
220
R
SET1
2k
I DATA
INPUT
WRT1
WRT2
Q DATA
INPUT
R
SET2
1.9k
Figure 42 shows an example of the AD9767 used in a W-CDMA transmitter application using the AD6122 CDMA 3 V IF sub­system. The AD6122 has functions, such as external gain con­trol and low distortion characteristics, needed for the superior Adjacent Channel Power (ACP) requirements of W-CDMA.
3V
500
500
500 500
LOIPP LOIPN
500
GAIN
CONTROL
IIPP
IIPN
IIQP
IIQN
REFIN
VGAIN
2
CONTROL
FACTOR
PHASE
SPLITTER
GAIN
SCALE
AD6122
TEMPERATURE
COMPENSATION
MODOPP
MODOPN
V
CC
V
CC
REV. B
TXOPP
TXOPN
Figure 42. CDMA Transmit Application Using AD9767 and AD6122
–17–
AD9767
EVALUATION BOARD General Description
The AD9767-EB is an evaluation board for the AD9767 14-bit dual D/A converter. Careful attention to layout and circuit design, combined with a prototyping area, allow the user to easily and effectively evaluate the AD9767 in any application where high resolution, high speed conversion is required.
This board allows the user the flexibility to operate the AD9767 in various configurations. Possible output configurations include
POWER DECOUPLING AND INPUT CLOCKS
RED
DVDDIN
BAN-JACK
TP10
B1
B2
L1
BEAD
2
1
C9 10F 25V
BLK
TP37
DVDD
BLK
TP38
BLK
TP39
B3
AVDDIN
BAN-JACK
B4
transformer coupled, resistor terminated, and single and differ­ential outputs. The digital inputs can be used in dual port or interleaved mode, and are designed to be driven from various word generators, with the on-board option to add a resistor network for proper load termination. When operating the AD9767, best performance is obtained by running the Digital Supply (DVDD) at +3 V and the Analog Supply (AVDD) at +5 V.
RED TP11
L2
BEAD
1
2
C10 10F 25V
BLK TP40
AVDD
BLK
TP41
BLK
TP42
DVDD
2
1
C7
0.1␮F
1
C8
0.01␮F
2
WRT1IN
IQWRT
CLK1IN
IQCLK
CLK2IN
RESET
WRT2IN
IQSEL
RCOM
RCOM
BAN-JACK
S1
S2
S3
S4
SLEEP
R1 22
21
INP1
R1 22
21
INP23
WHT TP29
DGND;3,4,5
WHT TP30
DGND;3,4,5
WHT TP31
DGND;3,4,5
WHT TP32
DGND;3,4,5
WHT TP33
R2 22
3
INP2
R2 22
3
INP24
INP3
INP25
1
2
R3 22
4
R3 22
4
R13 50
1
R1 50
2
INP4
INP26
R4 22
5
R4 22
5
1
2
INP5
INP27
R2 50
R5 22
6
R5 22
6
TP43
DGND
BLK
DCLKIN1 DCLKIN2
1
JP16
JP5
AB
2
1
3
IC
JP4
A
B
2
1
3
IC
JP3
A
B
2
1
3
INP7
INP29
1
2
8
8
R4 50
R7 22
R7 22
IC
INP8
INP30
R8 22
9
R8 22
9
1
2
INP6
INP28
7
7
R3 50
R6 22
R6 22
BAN-JACK
JP9
2
A
B
RP16
R9 22
10
RP10
R9 22
10
TP44
AGND
BLK
3
DVDD
JP6
2
1
3
A
B
JP2
10
PRE
CLR
14
U2
Q
Q
DGND;8 DVDD;16
9
7
TSSOP112
11
J
13
CLK
12
K
JP1
DVDD
4
PRE
15
A
U1
CLR
2
JP7
Q
Q
DGND;8 DVDD;16
B
3
5
6
TSSOP112
3
J
1
CLK
2
KDVDD
1
/2 CLOCK DIVIDER
WRT1
CLK1
CLK2
WRT2
SLEEP
RP9
R2
RCOM
RCOM
INP9
INP31
21
21
R1 22
R1 22
INP10
INP32
22
3
R2 22
3
INP11
INP33
4
4
R3 22
R3 22
INP12
INP34
R4 22
5
R4 22
5
INP13
INP35
R5 22
6
R5 22
6
INP14
INP36
7
7
R6 22
R6 22
R7 22
8
R7 22
8
9
INCK1
9
INCK2
R8 22
R8 22
R9 22
10
RP15
R9 22
10
Figure 43. Power Decoupling and Clocks on AD9767 Evaluation Board
–18–
REV. B
2 P1
4 P1
6 P1
8 P1
10 P1
12 P1
14 P1
16 P1
18 P1
20 P1
22 P1
24 P1
26 P1
28 P1
30 P1
32 P1
34 P1
36 P1
38 P1
40 P1
2 P2
4 P2
6 P2
8 P2
10 P2
12 P2
14 P2
16 P2
18 P2
20 P2
22 P2
24 P2
26 P2
28 P2
30 P2
32 P2
34 P2
36 P2
38 P2
40 P2
P1 1
P1 3
P1 5
P1 7
P1 9
P1 11
P1 13
P1 15
P1 17
P1 19
P1 21
P1 23
P1 25
P1 27
P1 29
P1 31
P1 33
P1 35
P1 37
P1 39
P2 1
P2 3
P2 5
P2 7
P2 9
P2 11
P2 13
P2 15
P2 17
P2 19
P2 21
P2 23
P2 25
P2 27
P2 29
P2 31
P2 33
P2 35
P2 37
P2 39
INP1
INP2
INP3
INP4
INP5
INP6
INP7
INP8
INP9
INP10
INP11
INP12
INP13
INP14
INCK1
INP23
INP24
INP25
INP26
INP27
INP28
INP29
INP30
INP31
INP32
INP33
INP34
INP35
INP36
INCK2
RP5, 10
116
RP5, 10
314
RP5, 10
512
RP5, 10
710
RP6, 10
116
RP6, 10
314
RP6, 10
512
RP7, 10
116
RP7, 10
314
RP7, 10
512
RP7, 10
710
RP8, 10
116
RP8, 10
314
RP8, 10
512
RP3
RCOM
DVDD
RP5, 10
215
RP5, 10
4
RP5, 10
6
RP5, 10
8
RP6, 10
2
RP6, 10
4
RP6, 10
6
RP6, 10
89
RP4
RCOM
DVDD
RP7, 10
215
RP7, 10
4
RP7, 10
6
RP7, 10
8
RP8, 10
2
RP8, 10
4
RP8, 10
6
RP8, 10
89
R1 R9
22
1
13
11
9
15
13
11
R1 R9
22
1
13
11
9
15
13
11
DIGITAL INPUT SIGNAL CONDITIONING
RP1
R1 R9
RCOM
22
RP5, 10
710
1098765432
1098765432
SPARES
1
DVDD
RP2
RCOM
22
1
DVDD
RP8, 10
710
R1 R9
1098765432
1098765432
RP13
R1 R9
RCOM
33
1
RP14
R1 R9
RCOM
33
1
AD9767
RP11
R1 R9
RCOM
33
1098765432
1
RP12
R1 R9
RCOM
33
1098765432
1
1098765432
DUTP1
DUTP2
DUTP3
DUTP4
DUTP5
DUTP6
DUTP7
DUTP8
DUTP9
DUTP10
DUTP11
DUTP12
DUTP13
DUTP14
DCLKIN1
1098765432
DUTP23
DUTP24
DUTP25
DUTP26
DUTP27
DUTP28
DUTP29
DUTP30
DUTP31
DUTP32
DUTP33
DUTP34
DUTP35
DUTP36
DCLKIN2
REV. B
Figure 44. Digital Input Signal Conditioning
–19–
AD9767
DUTP1
DUTP2
DUTP3
DUTP4
DUTP5
DUTP6
DUTP7
DUTP8
DUTP9
DUTP10
DUTP11
DUTP12
DUTP13
DUTP14
WRT1
CLK1
CLK2
WRT2
DUTP23
DUTP24
1
C1 VAL
2
1
DB13P1MSB
2
DB12P1
3
DB11P1
4
DB10P1
5
DB9P1
6
DB8P1
7
DB7P1
8
DB6P1
9
DB5P1
10
DB4P1
11
DB3P1
12
DB2P1
13
DB1P1
14
DB0P1
15
DCOM1
16
DVDD1
17
WRT1
18
CLK1
19
CLK2
20
WRT2
21
DCOM2
22
DVDD2
23
DB13P2MSB
24
DB12P2
1
C2
0.01␮F
2
U2
1
C3
0.1␮F
2
DVDD
MODE
AVDD
IA1
IB1
FSADJ1
REFIO
GAINCTRL
FSADJ2
IB2
IA2
ACOM
SLEEP
DB0P2
DB1P2
DB2P2
DB3P2
DB4P2
DB5P2
DB6P2
DB7P2
DB8P2
DB9P2
DB10P2
DB11P2
DUT AND ANALOG OUTPUT SIGNAL CONDITIONING
DVDD
1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
AVDD
MODE
JP8
A
ACOM
JP15
2
1
3
A
B
2
3
B
10pF
SLEEP
10pF
DUTP36
C15
1
R5 50
2
2
C4
10pF
1
2
10pF
1
1
R7 50
2
1
R6 50
2
2
C5
1
2
C6
1
1
R8 50
2
DUTP35
DUTP34
DUTP33
DUTP32
DUTP31
DUTP30
DUTP29
DUTP28
DUTP27
DUTP26
DUTP25
1
1
C11
C12
1F
2
0.01␮F
2
1
2
C13
0.1␮F
AVDD
NC = 5
3
2
R11 VAL
16
TP45 WHT
WHT TP46
R12 VAL
R9
1.92k
12
C16
22nF
2
1
C17
22nF
2
1
R10
1.92k
12
NC = 5
3
2
16
BL1
1:1
T1
BL2
R15
256
12
R14
256
12
JP10
BL3
1:1
T2
BL4
4
4
TP35 WHT
TP34 WHT
REFIO
2
AGND;3,4,5
TP36 WHT
1
C14
0.1␮F
AGND;3,4,5
S6 OUT1
S11 OUT2
Figure 45. AD9767 and Output Signal Conditioning
–20–
REV. B
AD9767
Figure 46. Assembly, Top Side
REV. B
–21–
AD9767
Figure 47. Assembly, Bottom Side
–22–
REV. B
AD9767
REV. B
Figure 48. Layer 1, Top Side
–23–
AD9767
Figure 49. Layer 2, Ground Plane
–24–
REV. B
AD9767
REV. B
Figure 50. Layer 3, Power Plane
–25–
AD9767
Figure 51. Layer 4, Bottom Side
–26–
REV. B
(
)
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
48-Lead Thin Plastic Quad Flatpack
(ST-48)
0.063 (1.60)
0.030 (0.75)
0.018 (0.45)
MAX
0.354 (9.00) BSC SQ
48
1
AD9767
37
36
COPLANARITY
0.003 (0.08)
0.004 (0.09)
0.008 (0.2)
0 MIN
7 0
(PINS DOWN)
12
13
0.019 (0.5) BSC
0.006 (0.15)
0.002
0.05
TOP VIEW
0.011 (0.27)
0.006 (0.17)
SEATING PLANE
24
25
0.276 (7.00)
BSC
SQ
0.057 (1.45)
0.053 (1.35)
C3583a–0–2/00 (rev. B) 00620
REV. B
PRINTED IN U.S.A.
–27–
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