SNR = 60.6 dBc (61.6 dBFS) to 70 MHz at 150 MSPS
SFDR = 81 dBc to 70 MHz at 150 MSPS
Low power: 825 mW at 150 MSPS
1.8 V analog supply operation
1.8 V to 3.3 V CMOS output supply or 1.8 V LVDS supply
Integer 1 to 8 input clock divider
Intermediate frequency (IF) sampling frequenci
Internal analog-to-digital converter (ADC) voltage reference
Integrated ADC sample-and-hold inputs
Flexible analog input: 1 V p-p to 2 V p-p range
Differential analog inputs with 650 MHz bandwidth
ADC clock duty cycle stabilizer
95 dB channel isolation/crosstalk
Serial port control
User-configurable built-in self-test (BIST) capability
Energy-saving power-down modes
Integrated receive features
Fast detect/threshold bits
Composite signal monitor
APPLICATIONS
Point-to-point radio receivers (GPSK, QAM)
Diversity radio systems
es up to 450 MHz
FUNCTIONAL BLOCK DIAGRAM
FD[0:3]A
AD9600
I/Q demodulation systems
Smart antenna systems
Digital predistortion
General-purpose software radios
Broadband data applications
Data acquisition
Nondestructive testing
features a separate digital output driver supply to
accommodate 1.8 V to 3.3 V logic families.
6. A st
andard serial port interface supports various product
features and functions, such as data formatting (offset
binary, twos complement, or gray coding), enabling the
clock DCS, power-down mode, and voltage reference mode.
7. Th
e AD9600 is pin compatible with the AD9627-11, AD9627,
AD9640, allowing a simple migration from 10 bits to
and
11 b
its, 12 bits, or 14 bits.
SCLK/
SDIO/
DFS
DCS
erates from a single 1.8 V supply and
DRVDDDVDDAVDDCSB
FD BITS/THRESHOLD
AD9600
VIN + A
VIN – A
VREF
SENSE
CML
VIN – B
VIN + B
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
SHAADC
–+
REFERENCE
SELECT
SHA
MULTICHIP
SYNC
NOTES
1. PIN NAMES ARE F OR THE CMOS PIN CONFIGURATION O NLY;
SEE FIGURE 7 FOR LVDS PIN NAMES.
The AD9600 is a dual, 10-bit, 105 MSPS/125 MSPS/150 MSPS
ADC. It is designed to support communications applications
where low cost, small size, and versatility are desired.
The dual ADC core features a multistage, differential pipelined
rchitecture with integrated output error correction logic. Each
a
ADC features wide bandwidth, differential sample-and-hold
analog input amplifiers supporting a variety of user-selectable
input ranges. An integrated voltage reference eases design
considerations. A duty cycle stabilizer is provided to compensate for variations in the ADC clock duty cycle, allowing the
converters to maintain excellent performance.
The AD9600 has several functions that simplify the automated
ga
in control (AGC) function in a communications receiver. For
example, the fast detect feature allows fast overrange detection
by outputting four bits of input level information with very
short latency.
In addition, the programmable threshold detector allows monit
oring the amplitude of the incoming signal with short latency,
using the four fast detect bits of the ADC. If the input signal level
exceeds the programmable threshold, the fine upper threshold
indicator goes high. Because this threshold is set from the four
MSBs, the user can quickly adjust the system gain to avoid an
overrange condition.
Another AGC-related function of the AD9600 is the signal
onitor. This block allows the user to monitor the composite
m
magnitude of the incoming signal, which aids in setting the gain
to optimize the dynamic range of the overall system.
The ADC output data can be routed directly to the two external
10-b
it output ports. These outputs can be set from 1.8 V to 3.3 V
CMOS or 1.8 V LVDS. In addition, flexible power-down options
allow significant power savings.
Rev. 0 | Page 3 of 72
AD9600
www.BDTIC.com/ADI
SPECIFICATIONS
DC SPECIFICATIONS
AVDD = 1.8 V, DVDD = 1.8 V, DRVDD = 3.3 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.0 V internal reference, DCS
enabled, fast detect output pins disabled, signal monitor disabled, unless otherwise noted.
Table 1.
AD9600BCPZ-105 AD9600BCPZ-125 AD9600BCPZ-150
Parameter Temp
RESOLUTION Full 10 10 10 Bits
ACCURACY
No Missing Codes Full Guaranteed Guaranteed Guaranteed
Offset Error Full ±0.3 ±0.7 ±0.3 ±0.7 ±0.3 ±0.7 % FSR
Gain Error Full −3.6 −2.2 −1.0 −4.0 −2.5 −1.3 −4.3 −3.0 −1.6 % FSR
Differential Nonlinearity (DNL)
Offset Error Full ±0.3 ±0.7 ±0.3 ±0.7 ±0.2 ±0.7 % FSR
Gain Error Full ±0.2 ±0.8 ±0.3 ±0.8 ±0.2 ±0.8 % FSR
TEMPERATURE DRIFT
Offset Error Full ±15 ±15 ±15 ppm/°C
Gain Error Full ±95 ±95 ±95 ppm/°C
INTERNAL VOLTAGE REFERENCE
Output Voltage Error (1 V Mode) Full ±5 ±16 ±5 ±16 ±5 ±16 mV
Load Regulation @ 1.0 mA Full 7 7 7 mV
INPUT-REFERRED NOISE
VREF = 1.0 V 25°C 0.1 0.1 0.1 LSB rms
ANALOG INPUT
Input Span, VREF = 1.0 V Full
Input Capacitance
2
Full
VREF INPUT RESISTANCE Full 6 6 6 kΩ
POWER SUPPLIES
Supply Voltage
AVDD, DVDD Full 1.7 1.8 1.9 1.7 1.8 1.9 1.7 1.8 1.9 V
DRVDD (CMOS Mode) Full 1.7 3.3 3.6 1.7 3.3 3.6 1.7 3.3 3.6 V
Supply Current
1, 3
I
AVDD
4
1, 3,
I
DVDD
I
(3.3 V CMOS) Full
DRVDD
I
(1.8 V CMOS) Full
DRVDD
I
(1.8 V LVDS)
DRVDD
Full
Full
POWER CONSUMPTION
DC Input Full
Sine Wave Input
1
DRVDD = 1.8 V Full
DRVDD = 3.3 V Full
Standby Power
4
Full
Power-Down Power Full
1
Measured with a low input frequency, full-scale sine wave, with approximately 5 pF loading on each output bit.
2
Input capacitance refers to the effective capacitance between one differential input pin and AGND. Refer to Figure 8 for the equivalent analog input structure.
3
The maximum limit applies to the combination of I
4
Standby power is measured with a dc input and the CLK+ and CLK− pins inactive (set to AVDD or AGND).
Min Typ Max Min Typ Max Min Typ Max Unit
and I
DVDD
currents.
AVDD
2
8
310 365 385 455 419 495 mA
34 365 42 455 50 495 mA
35
15
42
600 650 750 800 825 890 mW
645
740
68
2.5 6 2.5 6 2.5 6 mW
Rev. 0 | Page 4 of 72
2 2 V p-p
8 8 pF
36 42 mA
18 22 mA
44 46 mA
813 892 mW
900 990 mW
77 77 mW
AD9600
www.BDTIC.com/ADI
AC SPECIFICATIONS
AVDD = 1.8 V, DVDD = 1.8 V, DRVDD = 3.3 V, maximum sample rate, VIN = −1.0 dBFS differential input, 1.0 V internal reference, DCS
enabled, fast detect output pins disabled, signal monitor disabled, unless otherwise noted.
Table 2.
Parameter
SIGNAL-TO-NOISE RATIO (SNR)
fIN = 2.3 MHz 25°C 60.7 60.6 60.6 dB
fIN = 70 MHz 25°C 60.6 60.6 60.6 dB
Full 60.3 60.3
fIN = 140 MHz 25°C 60.6 60.6 60.5 dB
fIN = 220 MHz 25°C
SIGNAL-TO-NOISE AND DISTORTION (SINAD)
fIN = 2.3 MHz 25°C 60.6
fIN = 70 MHz 25°C 60.5
Full 60.2
fIN = 140 MHz 25°C 60.5
fIN = 220 MHz 25°C 60.4 60.4 60.3 dB
EFFECTIVE NUMBER OF BITS (ENOB)
fIN = 2.3 MHz 25°C
fIN = 70 MHz 25°C
fIN = 140 MHz 25°C
fIN = 220 MHz 25°C
WORST SECOND OR THIRD HARMONIC
fIN = 2.3 MHz 25°C
fIN = 70 MHz 25°C
Full
fIN = 140 MHz 25°C
fIN = 220 MHz 25°C
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
fIN = 2.3 MHz 25°C
fIN = 70 MHz 25°C
Full 72.0
fIN = 140 MHz 25°C
fIN = 220 MHz 25°C
WORST OTHER HARMONIC OR SPUR
fIN = 2.3 MHz 25°C
fIN = 70 MHz 25°C
Full
fIN = 140 MHz 25°C
fIN = 220 MHz 25°C
TWO-TONE SFDR
fIN = 29.1 MHz, 32.1 MHz (−7 dBFS ) 25°C
fIN = 169.1 MHz, 172.1 MHz (−7 dBFS ) 25°C
CROSSTALK
ANALOG INPUT BANDWIDTH 25°C
1
See AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions.
2
Crosstalk is measured at 100 MHz with −1 dBFS on one channel and no input on the alternate channel.
Logic Compliance CMOS/LVDS/LVPECL
Internal Common-Mode Bias Full 1.2 V
Differential Input Voltage Full 0.2 6 V p-p
Input Voltage Range Full GND − 0.3 AVDD + 1.6 V
Input Common-Mode Range Full 1.1 AVDD V
High Level Input Voltage Full 1.2 3.6 V
Low Level Input Voltage Full 0 0.8 V
High Level Input Current Full −10 +10 μA
Low Level Input Current Full −10 +10 μA
Input Capacitance Full 4 pF
Input Resistance Full 8 10 12 kΩ
SYNC INPUT
Logic Compliance CMOS
Internal Bias Full 1.2 V
Input Voltage Range Full GND − 0.3 AVDD + 1.6 V
High Level Input Voltage Full 1.2 3.6 V
Low Level Input Voltage Full 0 0.8 V
High Level Input Current Full −10 +10 μA
Low Level Input Current Full −10 +10 μA
Input Capacitance Full 4 pF
Input Resistance Full 8 10 12 kΩ
LOGIC INPUT (CSB)1
High Level Input Voltage Full 1.22 3.6 V
Low Level Input Voltage Full 0 0.6 V
High Level Input Current Full −10 +10 μA
Low Level Input Current Full 40 132 μA
Input Resistance Full 26 kΩ
Input Capacitance Full 2 pF
LOGIC INPUT (SCLK/DFS)2
High Level Input Voltage Full 1.22 3.6 V
Low Level Input Voltage Full 0 0.6 V
High Level Input Current (VIN = 3.3 V) Full −92 −135 μA
Low Level Input Current Full −10 +10 μA
Input Resistance Full 26 kΩ
Input Capacitance Full 2 pF
LOGIC INPUTS/OUTPUTS (SDIO/DCS, SMI SDFS)
High Level Input Voltage Full 1.22 3.6 V
Low Level Input Voltage Full 0 0.6 V
High Level Input Current Full −10 +10 μA
Low Level Input Current Full 38 128 μA
Input Resistance Full 26 kΩ
Input Capacitance Full 5 pF
1
Rev. 0 | Page 6 of 72
AD9600
www.BDTIC.com/ADI
Parameter Temperature Min Typ Max Unit
LOGIC INPUTS/OUTPUTS (SMI SDO/OEB, SMI SCLK/PDWN)
High Level Input Voltage Full 1.22 3.6 V
Low Level Input Voltage Full 0 0.6 V
High Level Input Current (VIN = 3.3 V) Full −90 −134 μA
Low Level Input Current Full −10 +10 μA
Input Resistance Full 26 kΩ
Input Capacitance Full 5 pF
DIGITAL OUTPUTS
CMOS Mode—DRVDD = 3.3 V
High Level Output Voltage (IOH = 50 μA) Full 3.29 V
High Level Output Voltage (IOH = 0.5 mA) Full 3.25 V
Low Level Output Voltage (IOL = 1.6 mA) Full 0.2 V
Low Level Output Voltage (IOL = 50 μA) Full 0.05 V
CMOS Mode—DRVDD = 1.8 V
High Level Output Voltage (IOH = 50 μA) Full 1.79 V
High Level Output Voltage (IOH = 0.5 mA) Full 1.75 V
Low Level Output Voltage (IOL = 1.6 mA) Full 0.2 V
Low Level Output Voltage (IOL = 50 μA) Full 0.05 V
LVDS Mode—DRVDD = 1.8 V
Differential Output Voltage (VOD), ANSI Mode Full 250 350 450 mV
Output Offset Voltage (VOS), ANSI Mode Full 1.15 1.25 1.35 V
Differential Output Voltage (VOD), Reduced Swing Mode Full 150 200 280 mV
Output Offset Voltage (VOS), Reduced Swing Mode Full 1.15 1.25 1.35 V
Input Clock Rate Full 625 625 625 MHz
Conversion Rate
DCS Enabled Full 20 105 20 125 20 150 MSPS
DCS Disabled Full 10 105 10 125 10 150 MSPS
CLK Period (t
CLK Pulse Width High
Divide-by-1 Mode,
DCS Enabled
Divide-by-1 Mode,
DCS Disabled
Divide-by-2 Mode,
DCS Enabled
Divide-by-3 Through Divide-
by-8 Modes, DCS Enabled
DATA OUTPUT PARAMETERS
CMOS Mode—DRVDD = 3.3 V
Data Propagation Delay (tPD)1Full 2.2 4.5 6.4 2.2 4.5 6.4 2.2 4.5 6.4 ns
DCO Propagation Delay (t
Setup Time (tS) Full 5.25 4.5 3.83 ns
Hold Time (tH) Full 4.25 3.5 2.83 ns
CMOS Mode—DRVDD = 1.8 V
Data Propagation Delay (tPD)1
DCO Propagation Delay (t
Setup Time (tS) Full 5.25 4.5 3.83 ns
Hold Time (tH) Full 4.25 3.5 2.83 ns
LVDS Mode—DRVDD = 1.8 V Full
Data Propagation Delay (tPD)1
DCO Propagation Delay (t
CMOS Mode Pipeline Delay
(Latency)
LVDS Mode Pipeline Delay
(Latency) Channel A/Channel B
Aperture Delay (tA) Full 1.0 1.0 1.0 ns
Aperture Uncertainty (Jitter, tJ) Full 0.1 0.1 0.1 ps rms
Wake-Up Time
OUT-OF-RANGE RECOVERY TIME Full 2 3 3 Cycles
1
Output propagation delay is measured from the CLK+ and CLK− pins 50% transition to the output data pins 50% transition, with 5 pF load.
2
Wake-up time is dependent on the value of the decoupling capacitors.
) Full 9.5 8 6.66 ns
CLK
Full 2.85 4.75 6.65 2.4 4 5.6 2.0 3.33 4.66 ns
Full 4.28 4.75 5.23 3.6 4 4.4 3.0 3.33 3.66 ns
Full 1.6 1.6 1.6 ns
Full 0.8 0.8 0.8 ns
) Full 3.8 5.0 6.8 3.8 5.0 6.8 3.8 5.0 6.8 ns
DCO
Full 2.4 5.2 6.9 2.4 5.2 6.9 2.4 5.2 6.9 ns
) Full 4.0 5.6 7.3 4.0 5.6 7.3 4.0 5.6 7.3 ns
DCO
2.0 4.8 6.3 2.0 4.8 6.3 2.0 4.8 6.3 ns
) Full 5.2 7.3 9.0 5.2 7.3 9.0 5.2 7.3 9.0 ns
DCO
Full 12 12 12 Cycles
Full 12/12.5 12/12.5 12/12.5 Cycles
2
Full 350 350 350 μs
Min Typ Max Min Typ Max Min Typ Max Unit
Rev. 0 | Page 8 of 72
AD9600
A
www.BDTIC.com/ADI
TIMING CHARACTERISTICS
Table 5.
Parameter Conditions Min Typ Max Unit
SYNC TIMING REQUIREMENTS
t
SSYNC
t
HSYNC
SPI TIMING REQUIREMENTS
t
DS
t
DH
t
CLK
t
S
t
H
t
HIGH
t
LOW
t
EN_SDIO
t
DIS_SDIO
SPORT TIMING REQUIREMENTS
t
CSSCLK
t
SSCLKSDO
t
SSCLKSDFS
Setup time between SYNC and the rising edge of CLK+ 0.24 ns
Hold time between SYNC and the rising edge of CLK+ 0.40 ns
Setup time between the data and the rising edge of SCLK 2 ns
Hold time between the data and the rising edge of SCLK 2 ns
Period of the SCLK 40 ns
Setup time between CSB and SCLK 2 ns
Hold time between CSB and SCLK 2 ns
SCLK pulse width high 10 ns
SCLK pulse width low 10 ns
Time required for the SDIO pin to switch from an input to an output
10 ns
relative to the SCLK falling edge
Time required for the SDIO pin to switch from an output to an input
10 ns
relative to the SCLK rising edge
Delay from the rising edge of CLK+ to the rising edge of SMI SCLK 3.2 4.5 6.2 ns
Delay from the rising edge of SMI SCLK to SMI SDO −0.4 0 0.4 ns
Delay from the rising edge of SMI SCLK to SMI SDFS −0.4 0 0.4 ns
TIMING DIAGRAMS
CH A/CH B DAT
CH A/CH B FAST
CLK+
CLK–
DETECT
DCOA/DCOB
N+2
N+ 1
N
t
A
t
CLK
t
PD
N – 12N – 11N – 9N – 8N – 7N – 6N – 5N – 4
N – 13
N – 1N + 2N + 3N + 4N + 5N + 6N – 3N – 2
t
S
t
H
N+ 3
N – 10
N
t
N + 1
DCO
N+ 4
N+ 5
N+ 6
t
CLK
N+ 7
Figure 2. CMOS Output Mode Data and Fast Detect Output Timing
N+ 8
06909-012
Rev. 0 | Page 9 of 72
AD9600
S
www.BDTIC.com/ADI
N
t
A
CLK+
CLK–
CH A/CH B DATA
CH A/CH B FAS T
DETECT
DCO+
DCO–
t
PD
ABABABABABABABABAAB
N – 12N – 11N – 9N – 8N – 7N – 6N – 5N – 4
N – 13
ABABABABABABABABAAB
N – 6N – 5N – 3N – 2N – 1NN + 1N + 2N – 7
Figure 3. LVDS Mode Data and Fast Detect Output T
N+ 1
t
CLK
N+2
N+ 3
N – 10
N – 4
N+ 4
t
DCO
N+ 5
t
CLK
N+ 6
N+ 7
iming (Fast Detect Mode Select Bits = 000)
N+ 8
06909-089
CLK+
CLK+
CLK–
MI SCLK/PDWN
SMI SDFS
t
SSYNC
SYNC
Figure 4. SYNC Input Timing Requirements
t
CSSCLK
t
SSCLKSDFS
Figure 5. Signal Monitor SPORT Outpu
t
HSYNC
t
SSCLKSDO
DATADATASMI SDO/OEB
t Timing (Divide-by-2 Mode)
06909-072
06909-082
Rev. 0 | Page 10 of 72
AD9600
www.BDTIC.com/ADI
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter Rating
ELECTRICAL
AVDD, DVDD to AGND −0.3 V to +2.0 V
DRVDD to DRGND −0.3 V to +3.9 V
AGND to DRGND −0.3 V to +0.3 V
AVDD to DRVDD −3.9 V to +2.0 V
VIN + A/VIN + B, VIN − A/VIN − B to
−0.3 V to AVDD + 0.2 V
AGND
CLK+, CLK− to AGND −0.3 V to +3.9 V
SYNC to AGND −0.3 V to +3.9 V
VREF to AGND −0.3 V to AVDD + 0.2 V
SENSE to AGND −0.3 V to AVDD + 0.2 V
CML to AGND −0.3 V to AVDD + 0.2 V
RBIAS to AGND −0.3 V to AVDD + 0.2 V
CSB to AGND −0.3 V to +3.9 V
SCLK/DFS to DRGND −0.3 V to +3.9 V
SDIO/DCS to DRGND −0.3 V to DRVDD + 0.3 V
SMI SDO/OEB −0.3 V to DRVDD + 0.3 V
SMI SCLK/PDWN −0.3 V to DRVDD + 0.3 V
SMI SDFS −0.3 V to DRVDD + 0.3 V
Output Data Pins to DRGND
Fast Detect Output Pins to DRGND
Data Clock Output Pins to DRGND
1
−0.3 V to DRVDD + 0.3 V
2
−0.3 V to DRVDD + 0.3 V
3
−0.3 V to DRVDD + 0.3 V
ENVIRONMENTAL
Operating Temperature Range
−40°C to +85°C
(Ambient)
Maximum Junction Temperature
150°C
Under Bias
Storage Temperature Range
−65°C to +150°C
(Ambient)
1
The output data pins are D0A/D0B to D9A/D9B for the CMOS configuration
and D0+/D0− to D9+/D9− for the LVDS configuration.
2 The fast detect output pins are FD0A/FD0B to FD3A/FD3B for the CMOS
configuration and FD0+/FD0− to FD3+/FD3−.
3
The data clock output pins are DCOA and DCOB for the CMOS configuration
and DCO+ and DCO− for the LVDS configuration.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the
customer board increases the reliability of the solder joints,
maximizing the thermal capability of the package.
Table 7. Thermal Resistance
Airflow
locity
Package Type
64 Lead, 9 mm × 9 mm
LFCSP (CP-64-3)
Ve
(m/s)
0 18.8 0.6 6.0 °C/W
1.0 16.5 °C/W
1, 2
1, 3
θ
θ
JA
JC
1, 4
θ
Unit
JB
2.0 15.8 °C/W
1
Per JEDEC 51-7 standard and JEDEC 25-5 2S2P test board.
2
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3
Per MIL-Std 883, Method 1012.1.
4
Per JEDEC JESD51-8 (still air).
Typical θJA and θJC are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θ
JA
. In
addition, metal (such as metal traces through holes, ground,
and power planes) that is in direct contact with the package
leads reduces the θ
Table 8. Parallel CMOS Mode Pin Function Descriptions
Pin No. Mnemonic Type Description
ADC Power Supplies
20, 64 DRGND Ground Digital Output Ground.
1, 21 DRVDD Supply Digital Output Driver Supply (1.8 V to 3.3 V).
24, 57 DVDD Supply Digital Power Supply (1.8 V Nominal).
36, 45, 46 AVDD Supply Analog Power Supply (1.8 V Nominal).
0 AGND Ground Analog Ground. Pin 0 is the exposed thermal pad on the bottom of the package.
ADC Inputs
37 VIN + A Input Differential Analog Input Pin (+) for Channel A.
38 VIN − A Input Differential Analog Input Pin (−) for Channel A.
44 VIN + B Input Differential Analog Input Pin (+) for Channel B.
43 VIN − B Input Differential Analog Input Pin (−) for Channel B.
39 VREF I/O Voltage Reference Input/Output.
40 SENSE Input Voltage Reference Mode Select (see Tab le 11 for details).
42 RBIAS Input External Reference Bias Resistor.
41 CML Output Common-Mode Level Bias Output for Analog Inputs.
49 CLK+ Input
ADC Master Clock True. The ADC clock can be driven using a single-ended
CMOS (see Figure 60 and Figure 61 for the recommended connection).
50 CLK− Input
ADC Master Clock Complement. The ADC clock can be driven using a single-
nded CMOS (see Figure 60 and Figure 61 for the recommended connection).
e
ADC Fast Detect Outputs
29 FD0A Output Channel A Fast Detect Indicator (see Tab le 14 for details).
30 FD1A Output Channel A Fast Detect Indicator (see Tab le 14 for details).
31 FD2A Output Channel A Fast Detect Indicator (see Tab le 14 for details).
32 FD3A Output Channel A Fast Detect Indicator (see Tab le 14 for details).
53 FD0B Output Channel B Fast Detect Indicator (see Tab le 14 for details).
54 FD1B Output Channel B Fast Detect Indicator (see Tab le 14 for details).
55 FD2B Output Channel B Fast Detect Indicator (see Tab le 14 for details).
56 FD3B Output Channel B Fast Detect Indicator (see Tab le 14 for details).
Rev. 0 | Page 12 of 72
AD9600
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Pin No. Mnemonic Type Description
Digital Inputs
52 SYNC Input Digital Synchronization Pin (Slave Mode Only).
Digital Outputs
16 to 19, 22, 23,
25 to 28
62, 63, 2 to 9 D0B to D9B Output Channel B CMOS Output Data.
11 DCOA Output Channel A Data Clock Output.
10 DCOB Output Channel B Data Clock Output.
SPI Control
48 SCLK/DFS Input SPI Serial Clock/Data Format Select Pin in External Pin Mode.
47 SDIO/DCS I/O SPI Serial Data Input and Output/Duty Cycle Stabilizer in External Pin Mode.
51 CSB Input SPI Chip Select (Active Low).
Signal Monitor Port
33 SMI SDO/OEB I/O
35 SMI SDFS Output Signal Monitor Serial Data Frame Sync.
34 SMI SCLK/PDWN I/O Signal Monitor Serial Clock Output/Power-Down Input in External Pin Mode.
Do Not Connect
12 to 15, 58 to 61 DNC N/A Do Not Connect.
D0A to D9A Output Channel A CMOS Output Data.
Signal Monitor Serial Data Output/Output Enable I
External Pin Mode.
nput (Active Low) in
Rev. 0 | Page 13 of 72
AD9600
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DRGND
DNC
DNC
FD3+
FD3–
FD2+
FD2–
DVDD
FD1+
FD1–
FD0+
FD0–
SYNC
CSB
CLK–
CLK+
49
48
SCLK/DFS
47
SDIO/DCS
46
AVDD
45
AVDD
44
VIN + B
43
VIN – B
42
RBIAS
41
CML
40
SENSE
39
VREF
38
VIN – A
37
VIN + A
36
AVDD
35
SMI SDFS
34
SMI SCLK/PDWN
33
SMI SDO/OEB
DRVDD
DNC
DNC
DNC
DNC
DNC
DNC
(LSB) D0–
D0+
DCO–
DCO+
D1–
D1+
D2–
D2+
D3–
646362616059585756555453525150
PIN 1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
INDICATO R
EXPOSED PADDLE, PIN 0
(BOTTOM OF PACKAGE)
AD9600
PARALLEL LVDS
TOP VIEW
(Not to Scale)
DNC = DO NOT CONNECT
Figure 7. Interleaved Parallel LVDS M
171819202122232425262728293031
D5–
D6–
D7–
D4–
D3+
D5+
D4+
DRGND
DRVDD
DVDD
D8–
D6+
D7+
D8+
ode Pin Configuration (Top View)
32
D9–
(MSB) D9+
06909-003
Table 9. Interleaved Parallel LVDS Mode Pin Function Descriptions
Pin No. Mnemonic Type Description
ADC Power Supplies
20, 64 DRGND Ground Digital Output Ground.
1, 21 DRVDD Supply Digital Output Driver Supply (1.8 V to 3.3 V).
24, 57 DVDD Supply Digital Power Supply (1.8 V Nominal).
36, 45, 46 AVDD Supply Analog Power Supply (1.8 V Nominal).
0 AGND Ground Analog Ground. Pin 0 is the exposed thermal pad on the bottom of the package.
ADC Inputs
37 VIN + A Input Differential Analog Input Pin (+) for Channel A.
38 VIN − A Input Differential Analog Input Pin (−) for Channel A.
44 VIN + B Input Differential Analog Input Pin (+) for Channel B.
43 VIN − B Input Differential Analog Input Pin (−) for Channel B.
39 VREF I/O Voltage Reference Input/Output.
40 SENSE Input Voltage Reference Mode Select (see Table 11 for details).
42 RBIAS Input External Reference Bias Resistor.
41 CML Output Common-Mode Level Bias Output for Analog Inputs.
49 CLK+ Input
ADC Master Clock True. The ADC clock can be driven using a single-ended CMOS
(see Figure 60 and Figure 61 for the recommended connection).
50 CLK− Input
ADC Master Clock Complement. The ADC clock can be driven using a single-ended
CMOS (see Figure 60 and Figure 61 for the recommended connection).
ADC Fast Detect Outputs
54 FD0+ Output Channel A/Channel B LVDS Fast Detect Indicator 0 True (see Table 1 4 for full details).
53 FD0− Output
Channel A/Channel B LVDS Fast Detect Indicator 0 Complement (see Tabl e 14
or details).
f
56 FD1+ Output Channel A/Channel B LVDS Fast Detect Indicator 1 True (see Table 1 4 for details).
55 FD1− Output
Channel A/Channel B LVDS Fast Detect Indicator 1 Complement (see Table 14
or details).
f
59 FD2+ Output Channel A/Channel B LVDS Fast Detect Indicator 2 True (see Table 1 4 for details).
58 FD2− Output
Channel A/Channel B LVDS Fast Detect Indicator 2 Complement (see Table 14
or details).
f
61 FD3+ Output Channel A/Channel B LVDS Fast Detect Indicator 3 True (see Table 1 4 for details).
60 FD3− Output
Channel A/Channel B LVDS Fast Detect Indicator 3 Complement (see Tabl e 14
or details).
f
Rev. 0 | Page 14 of 72
AD9600
www.BDTIC.com/ADI
Pin No. Mnemonic Type Description
Digital Inputs
52 SYNC Input Digital Synchronization Pin (Slave Mode Only).
Digital Outputs
9 D0+ Output Channel A/Channel B LVDS Output Data 0 True.
8 D0− Output Channel A/Channel B LVDS Output Data 0 Complement.
13 D1+ Output Channel A/Channel B LVDS Output Data 1 True.
12 D1− Output Channel A/Channel B LVDS Output Data 1 Complement.
15 D2+ Output Channel A/Channel B LVDS Output Data 2 True.
14 D2− Output Channel A/Channel B LVDS Output Data 2 Complement.
17 D3+ Output Channel A/Channel B LVDS Output Data 3 True.
16 D3− Output Channel A/Channel B LVDS Output Data 3 Complement.
19 D4+ Output Channel A/Channel B LVDS Output Data 4 True.
18 D4− Output Channel A/Channel B LVDS Output Data 4 Complement.
23 D5+ Output Channel A/Channel B LVDS Output Data 5 True.
22 D5− Output Channel A/Channel B LVDS Output Data 5 Complement.
26 D6+ Output Channel A/Channel B LVDS Output Data 6 True.
25 D6− Output Channel A/Channel B LVDS Output Data 6 Complement.
28 D7+ Output Channel A/Channel B LVDS Output Data 7 True.
27 D7− Output Channel A/Channel B LVDS Output Data 7 Complement.
30 D8+ Output Channel A/Channel B LVDS Output Data 8 True.
29 D8− Output Channel A/Channel B LVDS Output Data 8 Complement.
32 D9+ Output Channel A/Channel B LVDS Output Data 9 True.
31 D9− Output Channel A/Channel B LVDS Output Data 9 Complement.
11 DCO+ Output Channel A/Channel B LVDS Data Clock Output True.
10 DCO− Output Channel A/Channel B LVDS Data Clock Output Complement.
SPI Control
48 SCLK/DFS Input SPI Serial Clock/Data Format Select Pin in External Pin Mode.
47 SDIO/DCS I/O SPI Serial Data Input and Output/Duty Cycle Stabilizer in External Pin Mode.
51 CSB Input SPI Chip Select (Active Low).
Signal Monitor Port
33 SMI SDO/OEB I/O
35 SMI SDFS Output Signal Monitor Serial Data Frame Sync.
34 SMI SCLK/PDWN I/O Signal Monitor Serial Clock Output/Power-Down Input in External Pin Mode.
Do Not Connect
2 to 7, 62, 63 DNC N/A Do Not Connect.
Signal Monitor Serial Data Output/Output Enable I
External Pin Mode.
nput (Active Low) in
Rev. 0 | Page 15 of 72
AD9600
V
C
A
V
www.BDTIC.com/ADI
EQUIVALENT CIRCUITS
26kΩ
1kΩ
1kΩ
06909-008
LK+
IN
Figure 8. Analog Input Circuit
AVDD
1.2V
10kΩ10kΩ
SCLK/DFS
06909-004
Figure 12. Equivalent SCLK/DFS Input Circuit
SENSE
CLK–
Figure 9. Equivalent Clock Input Circu
DRVDD
DRGND
Figure 10. Digital Output
DRVDD
DRVDD
26kΩ
SDIO/DCS
1kΩ
6909-005
it
6909-081
Figure 13. Equivalent SENSE Circuit
VDD
26kΩ
CSB
1kΩ
06909-009
06909-010
Figure 14. Equivalent CSB Input Circuit
AVDD
REF
06909-007
Figure 11. Equivalent SDIO/DCS Input Circuit
Rev. 0 | Page 16 of 72
6kΩ
Figure 15. Equivalent VREF Circuit
06909-011
AD9600
www.BDTIC.com/ADI
TYPICAL PERFORMANCE CHARACTERISTICS
AVDD = 1.8 V, DVDD = 1.8 V, DRVDD = 3.3 V, sample rate = 150 MSPS, DCS enabled, 1 V internal reference, 2 V p-p differential input,
VIN = −1.0 dBFS, 64k sample, and T
Figure 36. AD9600-150 Two-Tone SFDR/IMD3 vs. Input Frequency (f
= 29.1 MHz, f
f
IN1
= 32.1 MHz, fS = 150 MSPS
IN2
) with
IN
–120
07605040302010
06909-135
FREQUENCY (MHz)
0
06909-138
Figure 38. AD9600-150 Noise Power Ratio (NPR)
100
90
80
70
SNR/SFDR (dBc)
06909-136
SNR—SIDE A
60
50
0255075100125150
Figure 39. AD9600-150 Single-Tone SNR/SFDR vs. Clock Frequency (f
f
SFDR—SIDE B
SFDR—SIDE A
SNR—SIDE B
ENCODE (MSPS)
= 2.3 MHz
IN1
) with
S
06909-035
Rev. 0 | Page 20 of 72
AD9600
www.BDTIC.com/ADI
12
10
8
0.10 LSB rms
100
95
SFDR DCS ON
90
85
6
4
NUMBER OF HIT S (1M)
2
0
OUTPUT CODE
Figure 40. AD9600 Grounded Input Histogram
0.10
0.05
0
INL ERROR (LSB)
–0.05
–0.10
01282563845126407688961024
Figure 41. AD9600 INL with f
OUTPUT CODE
= 10.3 MHz
IN1
80
75
SNR/SFDR (d Bc)
SNR DCS ON
70
65
N + 3N + 2N + 1NN – 1N – 2N – 3
06909-140
60
20806040
Figure 43. AD9600-150 SNR/SFDR vs. Duty Cycle with f
95
90
85
80
75
70
SNR/SFDR (d Bc)
65
60
55
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1. 1 1.2 1.3
06909-036
INPUT COMMON-MODE VOLTAGE (V)
Figure 44. AD9600-150 SNR/SFDR vs. Input
f
IN1
SFDR DCS OFF
SNR DCS OFF
DUTY CYCLE (%)
SFDR
SNR
Common-Mode Voltage (V
= 30 MHz
= 10.3 MHz
IN1
CM
06909-143
06909-144
) with
0.100
0.075
0.050
0.025
0
–0.025
DNL ERROR (LSB)
–0.050
–0.075
–0.100
01282563845126407688961024
Figure 42. AD9600 DNL with f
OUTPUT CO DE
= 10.3 MHz
IN1
06909-037
Rev. 0 | Page 21 of 72
AD9600
www.BDTIC.com/ADI
THEORY OF OPERATION
The AD9600 dual ADC design can be used for diversity
reception of signals, where the ADCs are operating identically
on the same carrier but from two separate antennae. The ADCs
can also be operated with independent analog inputs. The user
can sample any f
/2 frequency segment from dc to 200 MHz
S
using appropriate low-pass or band-pass filtering at the ADC
inputs with little loss in ADC performance. Although operation
of up to 450 MHz analog input is permitted, ADC distortion
increases at frequencies toward the higher end of this range.
In nondiversity applications, the AD9600 can be used as a
eband receiver where one ADC is used for I input data and
bas
the other used for Q input data.
Synchronization capability is provided to allow synchronized
g among multiple channels or multiple devices.
timin
Programming and control of the AD9600 is accomplished using
a 3-b
it SPI-compatible serial interface.
ADC ARCHITECTURE
The AD9600 architecture consists of a dual front-end sampleand-hold amplifier (SHA) followed by a pipelined switchedcapacitor ADC. The quantized outputs from each stage are
combined into a final 10-bit result in the digital correction
logic. The pipelined architecture permits the first stage to
operate on a new input sample while the remaining stages
operate on preceding samples. Sampling occurs on the rising
edge of the clock.
Each stage of the pipeline excluding the last consists of a low
esolution flash ADC connected to a switched-capacitor digital-
r
to-analog converter (DAC) and an interstage residue amplifier
(a multiplying digital-to-analog converter (MDAC)). The residue
amplifier magnifies the difference between the reconstructed
DAC output and the flash input for the next stage in the
pipeline. One bit of redundancy is used in each stage to
facilitate digital correction of flash errors. The last stage simply
consists of a flash ADC.
The input stage of each channel contains a differential SHA that
ca
n be ac- or dc-coupled in differential or single-ended modes.
The output-staging block aligns the data, corrects errors, and
passes the data to the output buffers. The output buffers are
powered from a separate supply, allowing adjustment of the
output voltage swing. During power-down, the output buffers
go into a high impedance state.
ANALOG INPUT CONSIDERATIONS
The analog input to the AD9600 is a differential switchedcapacitor SHA that has been designed for optimum
performance while processing a differential input signal.
The clock signal alternatively switches the SHA between sample
ode and hold mode (see Figure 45). When the SHA is
m
swi
tched into sample mode, the signal source must be capable
of charging the sample capacitors and settling within one-half
Rev. 0 | Page 22 of 72
of a clock cycle. A small resistor in series with each input can
help reduce the peak transient current required from the output
stage of the driving source. A shunt capacitor can be placed
across the inputs to provide dynamic charging currents. This
passive network creates a low-pass filter at the ADC’s input;
therefore, the precise values are dependent on the application.
In undersampling (IF sampling) applications, any shunt capacitors
ould be reduced. In combination with the driving source
sh
impedance, the shunt capacitors limit the input bandwidth. See
the
AN-742 Application Note, F
requency Domain Response of
Switched-Capacitor ADCs; the AN-827 Application Note, A
esonant Approach to Interfacing Amplifiers to Switched-Capacitor
R
ADCs; and the Analog Dialogue article “Tr an s fo r me r- C o up le d
F
ront-End for Wideband A/D Converters” (Volume 39, April
2005
) for more information. In general, the precise values are
dependent on the application.
S
C
H
C
H
S
06909-013
VIN+
C
PIN, PAR
VIN–
C
PIN, PAR
Figure 45. Switched-Capac
S
S
C
S
H
C
S
itor SHA Input
For best dynamic performance, the source impedances driving
VIN+ and VIN− should be matched.
An internal differential reference buffer creates positive and nega
tive reference voltages that define the input span of the ADC core.
The span of the ADC core is set by the buffer to 2 × VREF.
Input Common Mode
The analog inputs of the AD9600 are not internally dc-biased.
Therefore, in ac-coupled applications, the user must provide this
bias externally. Setting the device so that V
= 0.55 × AVDD is
CM
recommended for optimum performance, but the device can
function over a wider range with reasonable performance (see
Figure 44). An on-board common-mode voltage reference is
cluded in the design and is available from the CML pin.
in
Optimum performance is achieved when the common-mode
voltage of the analog input is set by the CML pin voltage (typically
0.55 × AVDD). The CML pin must be decoupled to ground by a
0.1 F capacitor as described in the
Applications section.
Differential Input Configurations
Optimum performance is achieved while driving the AD9600
in a differential input configuration. For baseband applications,
the AD8138, ADA4937-2, and ADA4938-2 differential drivers
p
rovide excellent performance and a flexible interface to the
ADC. The output common-mode voltage of the AD8138 is
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