ANALOG DEVICES AD9522-2 Service Manual

12 LVDS/24 CMOS Output Clock Generator

F

CP

FEATURES

Low phase noise, phase-locked loop (PLL)

with Integrated 2.2 GHz VCO

AD9522-2

FUNCTIONAL BLOCK DIAGRAM

L

On-chip VCO tunes from 2.02 GHz to 2.335 GHz

VCO

LVDS/ CMOS

STATUS

MONITOR

ZERO

DELAY

Supports external 3.3 V/5 V VCO/VCXO to 2.4 GHz 1 differential or 2 single-ended reference inputs Accepts CMOS, LVPECL, or LVDS references to 250 MHz Accepts 16.62 MHz to 33.3 MHz crystal for reference input Optional reference clock doubler Reference monitoring capability Auto and manual reference switchover/holdover modes,

with selectable revertive/nonrevertive switching Glitch-free switchover between references Automatic recovery from holdover Digital or analog lock detect, selectable Optional zero delay operation

Twelve 800 MHz LVDS outputs divided into 4 groups

Each group of 3 has a 1-to-32 divider with phase delay Additive broadband jitter as low as 242 fs rms

OPTIONAL

REFIN

CLK

REF1

REF2

SWITCHOVER

AND MONITOR

DIVIDER

AND MUXES

DIV/Φ

PLL

Channel-to-channel skew grouped outputs < 60 ps Each LVDS output can be configured as 2 CMOS outputs

(for f

≤ 250 MHz)

OUT

Automatic synchronization of all outputs on power-up Manual synchronization of outputs as needed SPI- and I²C-compatible serial control port 64-lead LFCSP Nonvolatile EEPROM stores configuration settings

APPLICATIONS

Low jitter, low phase noise clock distribution Clock generation and translation for SONET, 10Ge, 10G FC,

and other 10 Gbps protocols

Forward error correction (G.710) Clocking high speed ADCs, DACs, DDSs, DDCs, DUCs, MxFEs High performance wireless transceivers ATE and high performance instrumentation Broadband infrastructures

GENERAL DESCRIPTION

The AD9522-21 provides a multioutput clock distribution function with subpicosecond jitter performance, along with an

The AD9522 serial interface supports both SPI and IC® ports. An in-package EEPROM can be programmed through the serial interface and store user-defined register settings for power-up and chip reset.

The AD9522 features 12 LVDS outputs in four groups. Any of the 800 MHz LVDS outputs can be reconfigured as two 250 MHz CMOS outputs.

Each group of outputs has a divider that allows both the divide ratio (from 1 to 32) and the phase (coarse delay) to be set.

The AD9522 is available in a 64-lead LFCSP and can be operated from a single 3.3 V supply. The external VCO can have an operating voltage up to 5.5 V.

The AD9522 is specified for operation over the standard industrial range of −40°C to +85°C.

The AD9520-2 is an equivalent part to the AD9522-2 featuring LVPECL/CMOS drivers instead of LVDS/CMOS drivers.

SPI/I2C CONTROL

PORT AND

DIGITAL LOGIC

EEPROM

Figure 1.

AD9522

on-chip PLL and VCO. The on-chip VCO tunes from 2.02 GHz to 2.335 GHz. An external 3.3 V/5 V VCO/VCXO of up to 2.4 GHz can also be used.

1

The AD9522 is used throughout this data sheet to refer to all the members of the AD9522 family. However, when AD9522-2 is used, it is referring to that specific

member of the AD9522 family.

OUT0 OUT1 OUT2

OUT3 OUT4 OUT5

OUT6 OUT7 OUT8

OUT9 OUT10 OUT11

07221-001

Rev. 0

Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.

AD9522-2

REVISION HISTORY

11/08—Revision 0: Initial Version

Rev. 0 | Page 3 of 84

AD9522-2

SPECIFICATIONS

Typical (typ) is given for VS = 3.3 V ± 5%; VS ≤ VCP ≤ 5.25 V; TA = 25°C; RSET = 4.12 kΩ; CPRSET = 5.1 kΩ, unless otherwise noted. Minimum (min) and maximum (max) values are given over full VS and T

POWER SUPPLY REQUIREMENTS

Table 1.

Parameter Min Typ Max Unit Test Conditions/Comments

VS 3.135 3.3 3.465 V 3.3 V ± 5% VCP VS 5.25 V This is nominally 3.3 V to 5.0 V ± 5% RSET Pin Resistor 4.12 kΩ Sets internal biasing currents; connect to ground CPRSET Pin Resistor 5.1 kΩ

BYPASS Pin Capacitor 220 nF Bypass for internal LDO regulator; necessary for LDO stability; connect to ground

PLL CHARACTERISTICS

Table 2.

Parameter Min Typ Max Unit Test Conditions/Comments

VCO (ON-CHIP)

Frequency Range 2020 2335 MHz See Figure 13 VCO Gain (K Tunin g Volt age (VT) 0.5

Frequency Pushing (Open-Loop) 1 MHz/V Phase Noise @ 1 kHz Offset −61 dBc/Hz LVDS output; f Phase Noise @ 100 kHz Offset −117 dBc/Hz LVDS output; f Phase Noise @ 1 MHz Offset −135 dBc/Hz LVDS output; f

REFERENCE INPUTS

Differential Mode (REFIN, REFIN)

Input Frequency 0 250 MHz

Input Sensitivity 280 mV p-p Self-Bias Voltage, REFIN 1.35 1.60 1.75 V Self-bias voltage of REFIN1 Self-Bias Voltage, REFIN Input Resistance, REFIN 4.0 4.8 5.9 kΩ Self-biased1 Input Resistance, REFIN

Dual Single-Ended Mode (REF1, REF2) Two single-ended CMOS-compatible inputs

Input Frequency (AC-Coupled)

with DC Offset Off)

Input Frequency (AC-Coupled

with DC Offset On)

Input Frequency (DC-Coupled) 0 250 MHz Slew rate > 50 V/μs; CMOS levels Input Sensitivity (AC-Coupled

with DC Offset Off)

Input Sensitivity (AC-Coupled

with DC Offset On)

Input Logic High, DC Offset Off 2.0 V Input Logic Low, DC Offset Off 0.8 V Input Current −100 +100 μA Input Capacitance 2 pF

) 38 MHz/V See Figure 8

VCO

1.30 1.50 1.60 V

4.4 5.3 6.4 kΩ Self-biased

10 250 MHz Slew rate must be > 50 V/μs

250 MHz

0.55 3.28 V p-p VIH should not exceed VS

1.5 2.78 V p-p VIH should not exceed VS

(−40°C to +85°C) variation.

A

Sets internal CP current range, nominally 4.8 mA (CP_lsb = 600 μA); actual current can be calculated by CP_lsb = 3.06/CPRSET; connect to ground

VCP −

V VCP ≤ VS when using internal VCO

0.5

= 2175 MHz; f

VCO

= 2175 MHz; f

VCO

= 2175 MHz; f

VCO

= 725 MHz

OUT

= 725 MHz

OUT

= 725 MHz

OUT

Differential mode (can accommodate single-ended input by ac grounding undriven input)

Frequencies below about 1 MHz should be dc-coupled; be careful to match V

(self-bias voltage)

CM

Self-bias voltage of REFIN1

1

Slew rate must be > 50 V/μs, and input amplitude sensitivity specification must be met; see input sensitivity

Each pin, REFIN (REF1)/REFIN

(REF2)

Rev. 0 | Page 4 of 84

AD9522-2

Parameter Min Typ Max Unit Test Conditions/Comments

Crystal Oscillator

Crystal Resonator Frequency Range 16.62 33.33 MHz

Maximum Crystal Motional Resistance 30 Ω

PHASE/FREQUENCY DETECTOR (PFD)

PFD Input Frequency 100 MHz Antibacklash pulse width = 1.3 ns, 2.9 ns 45 MHz Antibacklash pulse width = 6.0 ns Reference Input Clock Doubler Frequency 0.004 50 MHz Antibacklash pulse width = 1.3 ns, 2.9 ns Antibacklash Pulse Width 1.3 ns 0x017[1:0] = 01b

2.9 ns 0x017[1:0] = 00b; 0x017[1:0] = 11b

6.0 ns 0x017[1:0] = 10b

CHARGE PUMP (CP)

ICP Sink/Source Programmable

High Value 4.8 mA

With CPRSET = 5.1 kΩ; higher I changing CPRSET

Low Value 0.6 mA

With CPRSET = 5.1 kΩ; lower I

changing CPRSET Absolute Accuracy 2.5 % Charge pump voltage set to VCP/2 CPRSET Range 2.7 10 kΩ

ICP High Impedance Mode Leakage 1 nA Sink-and-Source Current Matching 1 %

0.5 V < V

< VCP − 0.5 V; VCP is the voltage on the CP (charge

CP

pump) pin; VCP is the voltage on the VCP power supply pin

ICP vs. VCP 1.5 % 0.5 V < VCP < VCP − 0.5 V ICP vs. Temperature 2 % VCP = VCP/2 V

PRESCALER (PART OF N DIVIDER)

Prescaler Input Frequency

P = 1 FD 300 MHz P = 2 FD 600 MHz P = 3 FD 900 MHz P = 2 DM (2/3) 600 MHz P = 4 DM (4/5) 1000 MHz P = 8 DM (8/9) 2400 MHz P = 16 DM (16/17) 3000 MHz P = 32 DM (32/33) 3000 MHz

Prescaler Output Frequency 300 MHz

A, B counter input frequency (prescaler input frequency

divided by P)

PLL N DIVIDER DELAY Register 0x019[2:0]; see Table 52

000 Off 001 385 ps 010 504 ps 011 623 ps 100 743 ps 101 866 ps 110 989 ps 111 1112 ps

PLL R DIVIDER DELAY Register 0x019[5:3]; see Table 52

000 Off 001 365 ps 010 486 ps 011 608 ps 100 730 ps 101 852 ps 110 976 ps 111 1101 ps

is possible by

CP

is possible by

CP

Rev. 0 | Page 5 of 84

AD9522-2

Parameter Min Typ Max Unit Test Conditions/Comments

PHASE OFFSET IN ZERO DELAY

Phase Offset (REF-to-LVDS Clock Output

1890 2348 3026 ps When N delay and R delay are bypassed

REF refers to REFIN (REF1)/REFIN

Pins) in Internal Zero Delay Mode

Phase Offset (REF-to-LVDS Clock Output

900 1217 1695 ps When N delay = Setting 111 and R delay is bypassed

Pins) in Internal Zero Delay Mode

Phase Offset (REF-to-CLK Input Pins) in

318 677 1085 ps When N delay and R delay are bypassed

External Zero Delay Mode

Phase Offset (REF-to-CLK Input Pins) in

−329 +33 +360 ps When N delay = Setting 011 and R delay is bypassed

External Zero Delay Mode

NOISE CHARACTERISTICS

In-Band Phase Noise of the Charge Pump/

Phase Frequency Detector (In-Band Means Within the LBW of the PLL)

The PLL in-band phase noise floor is estimated by measuring the in-band phase noise at the output of the VCO and subtracting 20 log(N) (where N is the value

of the N divider) @ 500 kHz PFD Frequency −165 dBc/Hz @ 1 MHz PFD Frequency −162 dBc/Hz @ 10 MHz PFD Frequency −152 dBc/Hz @ 50 MHz PFD Frequency −144 dBc/Hz

PLL Figure of Merit (FOM) −222 dBc/Hz

Reference slew rate > 0.5 V/ns; FOM + 10 log(f

approximation of the PFD/CP in-band phase noise (in

the flat region) inside the PLL loop bandwidth; when

running closed-loop, the phase noise, as observed at

the VCO output, is increased by 20 log(N); PLL figure of

merit decreases with decreasing slew rate; see Figure 12

PLL DIGITAL LOCK DETECT WINDOW2

Signal available at the LD, STATUS, and REFMON pins

when selected by appropriate register settings; lock

detect window settings can be varied by changing the

CPRSET resistor

Lock Threshold (Coincidence of Edges)

Selected by 0x017[1:0] and 0x018[4] (this is the threshold

to go from unlock to lock) Low Range (ABP 1.3 ns, 2.9 ns) 3.5 ns 0x017[1:0] = 00b, 01b, 11b; 0x018[4] = 1b High Range (ABP 1.3 ns, 2.9 ns) 7.5 ns 0x017[1:0] = 00b, 01b, 11b; 0x018[4] = 0b High Range (ABP 6.0 ns) 3.5 ns 0x017[1:0] = 10b; 0x018[4] = 0b

Unlock Threshold (Hysteresis)2

Selected by 0x017[1:0] and 0x018[4] (this is the threshold

to go from lock to unlock) Low Range (ABP 1.3 ns, 2.9 ns) 7 ns 0x017[1:0] = 00b, 01b, 11b; 0x018[4] = 1b High Range (ABP 1.3 ns, 2.9 ns) 15 ns 0x017[1:0] = 00b, 01b, 11b; 0x018[4] = 0b High Range (ABP 6.0 ns) 11 ns 0x017[1:0] = 10b; 0x018[4] = 0b

1

The REFIN and

2

For reliable operation of the digital lock detect, the period of the PFD frequency must be greater than the unlock-after-lock time.

REFIN

self-bias points are offset slightly to avoid chatter on an open input condition.

(REF2)

PFD

) is an

Rev. 0 | Page 6 of 84

AD9522-2

CLOCK INPUTS

Table 3.

Parameter Min Typ Max Unit Test Conditions/Comments

CLOCK INPUTS (CLK, CLK)

Input Frequency 01 2.4 GHz High frequency distribution (VCO divider) 0

Input Sensitivity, Differential 150 mV p-p

Input Level, Differential 2 V p-p

Input Common-Mode Voltage, VCM 1.3 1.57 1.8 V Self-biased; enables ac coupling Input Common-Mode Range, V

CMR

Input Sensitivity, Single-Ended 150 mV p-p Input Resistance 3.9 4.7 5.7 kΩ Self-biased

Input Capacitance 2 pF

1

Below about 1 MHz, the input should be dc-coupled. Care should be taken to match VCM.

CLOCK OUTPUTS

Table 4.

Parameter Min Typ Max Unit Test Conditions/Comments

LVDS CLOCK OUTPUTS Termination = 100 Ω across differential pair

OUT0, OUT1, OUT2, OUT3, OUT4, OUT5,

OUT6, OUT7, OUT8, OUT9, OUT10, OUT11 Output Frequency, Maximum 800 MHz

Output Differential Voltage, VOD 247 360 454 mV

Delta VOD 25 mV

Output Offset Voltage, VOS 1.125 1.25 1.375 V (VOH + VOL)/2 across a differential pair Delta VOS 25 mV

Short-Circuit Current, ISA, ISB 14 24 mA Output shorted to GND

CMOS CLOCK OUTPUTS

OUT0A, OUT0B, OUT1A, OUT1B, OUT2A,

OUT2B, OUT3A, OUT3B, OUT4A, OUT4B, OUT5A, OUT5B, OUT6A, OUT6B, OUT7A, OUT7B, OUT8A, OUT8B, OUT9A, OUT9B, OUT10A, OUT10B, OUT11A, OUT11B

Output Frequency 250 MHz See Figure 22 Output Voltage High, VOH VS − 0.1 V @ 1 mA load Output Voltage Low, VOL 0.1 V @ 1 mA load Output Voltage High, VOH 2.7 V @ 10 mA load Output Voltage Low, VOL 0.5 V @ 10 mA load

Differential input

1

1.6 GHz

Distribution only (VCO divider bypassed); this is the frequency range supported by the channel divider

Measured at 2.4 GHz; jitter performance is improved with slew rates > 1 V/ns

Larger voltage swings can turn on the protection diodes and can degrade jitter performance

1.3 1.8 V With 200 mV p-p signal applied; dc-coupled CLK ac-coupled; CLK

Differential (OUT, OUT

ac-bypassed to RF ground

)

The AD9522 outputs toggle at higher frequencies, but the output amplitude may not meet the V specification

− VOL measurement across a differential pair

V

OH

at the default amplitude setting with output driver not toggling; see Figure 21 for variation over frequency

This is the absolute value of the difference between VOD when the normal output is high vs. when the complementary output is high

This is the absolute value of the difference between V

when the normal output is high vs.

OS

when the complementary output is high

Single-ended; termination = 10 pF

OD

Rev. 0 | Page 7 of 84

AD9522-2

K

TIMING CHARACTERISTICS

Table 5.

Parameter Min Typ Max Unit Test Conditions/Comments

LVDS OUTPUT RISE/FALL TIMES Termination = 100 Ω across differential pair

Output Rise Time, tRP 150 350 ps 20% to 80%, measured differentially Output Fall Time, tFP 150 350 ps 80% to 20%, measured differentially

PROPAGATION DELAY, t

For All Divide Values 1866 2313 2812 ps High frequency clock distribution configuration 1808 2245 2740 ps Clock distribution configuration Variation with Temperature 1 ps/°C

OUTPUT SKEW, LVDS OUTPUTS1 Termination = 100 Ω across differential pair

LVDS Outputs That Share the Same Divider 7 60 ps LVDS Outputs on Different Dividers 19 162 ps All LVDS Outputs Across Multiple Parts 432 ps

CMOS OUTPUT RISE/FALL TIMES Termination = open

Output Rise Time, tRC 625 835 ps 20% to 80%; C Output Fall Time, tFC 625 800 ps 80% to 20%; C

PROPAGATION DELAY, t

For All Divide Values 1913 2400 2950 ps Variation with Temperature 2 ps/°C

OUTPUT SKEW, CMOS OUTPUTS1

CMOS Outputs That Share the Same Divider 10 55 ps All CMOS Outputs on Different Dividers 27 230 ps All CMOS Outputs Across Multiple Parts 500 ps

OUTPUT SKEW, LVDS-TO-CMOS OUTPUT1 All settings identical; different logic type

Outputs That Share the Same Divider −31 +152 +495 ps LVDS to CMOS on the same part Outputs That Are on Different Dividers −193 +160 +495 ps LVDS to CMOS on the same part

1

The output skew is the difference between any two similar delay paths while operating at the same voltage and temperature.

Timing Diagrams

CL

, CLK-TO-LVDS OUTPUT

LVDS

= 10 pF

LOAD

= 10 pF

LOAD

, CLK-TO-CMOS OUTPUT Clock distribution configuration

CMOS

t

CLK

t

CMOS

Figure 2. CLK/

DIFFERENTIAL

80%

20%

LVDS

t

RP

CLK

to Clock Output Timing, DIV = 1

LVDS

t

FP

07221-060

07221-061

SINGL E-ENDE D

80%

CMOS

10pF LOAD

20%

t

RC

t

FC

Figure 4. CMOS Timing, Single-Ended, 10 pF Load

07221-063

Figure 3. LVDS Timing, Differential

Rev. 0 | Page 8 of 84

AD9522-2

CLOCK OUTPUT ADDITIVE PHASE NOISE (DISTRIBUTION ONLY; VCO DIVIDER NOT USED)

Table 6.

Parameter Min Typ Max Unit Test Conditions/Comments

CLK-TO-LVDS ADDITIVE PHASE NOISE Distribution section only; does not include PLL and VCO

CLK = 1.6 GHz, Output = 800 MHz Input slew rate > 1 V/ns Divider = 2

@ 10 Hz Offset −100 dBc/Hz @ 100 Hz Offset −110 dBc/Hz @ 1 kHz Offset −117 dBc/Hz @ 10 kHz Offset −126 dBc/Hz @ 100 kHz Offset −134 dBc/Hz @ 1 MHz Offset −137 dBc/Hz

@ 10 MHz Offset −147 dBc/Hz

@ 100 MHz Offset −148 dBc/Hz CLK = 1 GHz, Output = 200 MHz Input slew rate > 1 V/ns Divider = 5

@ 10 Hz Offset −111 dBc/Hz @ 100 Hz Offset −123 dBc/Hz @ 1 kHz Offset −132 dBc/Hz @ 10 kHz Offset −141 dBc/Hz @ 100 kHz Offset −146 dBc/Hz @ 1 MHz Offset −150 dBc/Hz

>10 MHz Offset −156 dBc/Hz

CLK-TO-CMOS ADDITIVE PHASE NOISE Distribution section only; does not include PLL and VCO

CLK = 1 GHz, Output = 500 MHz Input slew rate > 1 V/ns Divider = 2

@ 10 Hz Offset −102 dBc/Hz @ 100 Hz Offset −114 dBc/Hz @ 1 kHz Offset −122 dBc/Hz @ 10 kHz Offset −129 dBc/Hz @ 100 kHz Offset −135 dBc/Hz @ 1 MHz Offset −140 dBc/Hz

>10 MHz Offset −150 dBc/Hz CLK = 1 GHz, Output = 50 MHz Input slew rate > 1 V/ns Divider = 20

@ 10 Hz Offset −125 dBc/Hz

@ 100 Hz Offset −136 dBc/Hz

@ 1 kHz Offset −144 dBc/Hz

@ 10 kHz Offset −152 dBc/Hz

@ 100 kHz Offset −157 dBc/Hz

@ 1 MHz Offset −160 dBc/Hz

>10 MHz Offset −164 dBc/Hz

Rev. 0 | Page 9 of 84

AD9522-2

CLOCK OUTPUT ABSOLUTE PHASE NOISE (INTERNAL VCO USED)

Table 7.

Parameter Min Typ Max Unit Test Conditions/Comments

LVDS ABSOLUTE PHASE NOISE

VCO = 2335 MHz; Output = 778.3 MHz

@ 1 kHz Offset −59 dBc/Hz @ 10 kHz Offset −90 dBc/Hz @ 100 kHz Offset −115 dBc/Hz @ 1 MHz Offset −133 dBc/Hz @ 10 MHz Offset −147 dBc/Hz @ 40 MHz Offset −150 dBc/Hz

VCO = 2175 MHz; Output = 725 MHz

@ 1 kHz Offset −61 dBc/Hz @ 10 kHz Offset −92 dBc/Hz @ 100 kHz Offset −117 dBc/Hz @ 1 MHz Offset −135 dBc/Hz @ 10 MHz Offset −148 dBc/Hz @ 40 MHz Offset −150 dBc/Hz

VCO = 2020 MHz; Output = 673.3 MHz

@ 1 kHz Offset −63 dBc/Hz @ 10 kHz Offset −94 dBc/Hz @ 100 kHz Offset −119 dBc/Hz @ 1 MHz Offset −136 dBc/Hz @ 10 MHz Offset −149 dBc/Hz @ 40 MHz Offset −150 dBc/Hz

Internal VCO; VCO divider = 3; LVDS output and for loop bandwidths < 1 kHz

CLOCK OUTPUT ABSOLUTE TIME JITTER (CLOCK GENERATION USING INTERNAL VCO)

Table 8.

Parameter Min Typ Max Unit Test Conditions/Comments

LVDS OUTPUT ABSOLUTE TIME JITTER

VCO = 2212 MHz; LVDS = 245.76 MHz; PLL LBW = 55 kHz 171 fs rms Integration BW = 200 kHz to 10 MHz 342 fs rms Integration BW = 12 kHz to 20 MHz VCO = 2212 MHz; LVDS = 122.88 MHz; PLL LBW = 55 kHz 183 fs rms Integration BW = 200 kHz to 10 MHz 350 fs rms Integration BW = 12 kHz to 20 MHz VCO = 2212 MHz; LVDS = 61.44 MHz; PLL LBW = 55 kHz 210 fs rms Integration BW = 200 kHz to 10 MHz 407 fs rms Integration BW = 12 kHz to 20 MHz

Application example based on a typical setup where the reference source is clean, so a wider PLL loop bandwidth is used; reference = 15.36 MHz; R DIV = 1

CLOCK OUTPUT ABSOLUTE TIME JITTER (CLOCK CLEANUP USING INTERNAL VCO)

Table 9.

Parameter Min Typ Max Unit Test Conditions/Comments

LVDS OUTPUT ABSOLUTE TIME JITTER

VCO = 2177 MHz; LVDS = 155.52 MHz; PLL LBW = 1.8 kHz 625 fs rms Integration BW = 12 kHz to 20 MHz VCO = 2212 MHz; LVDS = 122.88 MHz; PLL LBW = 1.8 kHz 648 fs rms Integration BW = 12 kHz to 20 MHz

Application example based on a typical setup where the reference source is jittery, so a narrower PLL loop bandwidth is used; reference = 19.44 MHz; R DIV = 162

Rev. 0 | Page 10 of 84

AD9522-2

CLOCK OUTPUT ABSOLUTE TIME JITTER (CLOCK GENERATION USING EXTERNAL VCXO)

Table 10.

Parameter Min Typ Max Unit Test Conditions/Comments

LVDS OUTPUT ABSOLUTE TIME JITTER

LVDS = 245.76 MHz; PLL LBW = 125 Hz 87 fs rms Integration BW = 200 kHz to 5 MHz 108 fs rms Integration BW = 200 kHz to 10 MHz 146 fs rms Integration BW = 12 kHz to 20 MHz LVDS = 122.88 MHz; PLL LBW = 125 Hz 120 fs rms Integration BW = 200 kHz to 5 MHz 151 fs rms Integration BW = 200 kHz to 10 MHz 207 fs rms Integration BW = 12 kHz to 20 MHz LVDS = 61.44 MHz; PLL LBW = 125 Hz 157 fs rms Integration BW = 200 kHz to 5 MHz 210 fs rms Integration BW = 200 kHz to 10 MHz 295 fs rms Integration BW = 12 kHz to 20 MHz

CLOCK OUTPUT ADDITIVE TIME JITTER (VCO DIVIDER NOT USED)

Table 11.

Parameter Min Typ Max Unit Test Conditions/Comments

LVDS OUTPUT ADDITIVE TIME JITTER

CLK = 622.08 MHz 69 fs rms Integration bandwidth = 12 kHz to 20 MHz

Any LVDS Output = 622.08 MHz

Divide Ratio = 1 CLK = 622.08 MHz 116 fs rms Integration bandwidth = 12 kHz to 20 MHz

Any LVDS Output = 155.52 MHz

Divide Ratio = 4 CLK = 100 MHz 263 fs rms Calculated from SNR of ADC method

Any LVDS Output = 100 MHz Broadband jitter

Divide Ratio = 1 CLK = 500 MHz 242 fs rms Calculated from SNR of ADC method

Any LVDS Output = 100 MHz Broadband jitter

Divide Ratio = 5

CMOS OUTPUT ADDITIVE TIME JITTER

CLK = 200 MHz 289 fs rms Calculated from SNR of ADC method

Any CMOS Output Pair = 100 MHz Broadband jitter

Divide Ratio = 2

Application example based on a typical setup using an external 245.76 MHz VCXO (Toyocom TCO-2112); reference = 15.36 MHz; R DIV = 1

Distribution section only; does not include PLL and VCO; measured at rising edge of clock signal

Distribution section only; does not include PLL and VCO

Rev. 0 | Page 11 of 84

AD9522-2

CLOCK OUTPUT ADDITIVE TIME JITTER (VCO DIVIDER USED)

Table 12.

Parameter Min Typ Max Unit Test Conditions/Comments

LVDS OUTPUT ADDITIVE TIME JITTER

CLK = 500 MHz; VCO DIV = 5; LVDS = 100 MHz;

248 fs rms

Bypass Channel Divider; Duty-Cycle Correction = On

CMOS OUTPUT ADDITIVE TIME JITTER

CLK = 200 MHz; VCO DIV = 2; CMOS = 100 MHz;

290 fs rms

Bypass Channel Divider; Duty-Cycle Correction = Off

CLK = 200 MHz; VCO DIV = 1; CMOS = 100 MHz;

288 fs rms

Bypass Channel Divider; Duty-Cycle Correction = Off

SERIAL CONTROL PORT—SPI MODE

Table 13.

Parameter Min Typ Max Unit Test Conditions/Comments

CS (INPUT)

Input Logic 1 Voltage 2.0 V Input Logic 0 Voltage 0.8 V Input Logic 1 Current 3 μA Input Logic 0 Current −110 μA

Input Capacitance 2 pF

SCLK (INPUT) IN SPI MODE

Input Logic 1 Voltage 2.0 V Input Logic 0 Voltage 0.8 V Input Logic 1 Current 110 μA Input Logic 0 Current 1 μA Input Capacitance 2 pF

SDIO (WHEN AN INPUT IN BIDIRECTIONAL MODE)

Input Logic 1 Voltage 2.0 V Input Logic 0 Voltage 0.8 V Input Logic 1 Current 1 μA Input Logic 0 Current 1 μA Input Capacitance 2 pF

SDIO, SDO (OUTPUTS)

Output Logic 1 Voltage 2.7 V Output Logic 0 Voltage 0.4 V

TIMING

Clock Rate (SCLK, 1/t Pulse Width High, t Pulse Width Low, t

) 25 MHz

SCLK

16 ns

HIGH

16 ns

LOW

SDIO to SCLK Setup, tDS 4 ns SCLK to SDIO Hold, tDH 0 ns SCLK to Valid SDIO and SDO, tDV 11 ns CS to SCLK Setup and Hold, tS, tC

CS Minimum Pulse Width High, t

PWH

CS has an internal 30 kΩ pull-up resistor

The minus sign indicates that current is flowing out of the AD9522, which is due to the internal pull-up resistor

SCLK has an internal 30 kΩ pull-down resistor in SPI mode, but not in I

2 ns 3 ns

Distribution section only; does not include PLL and VCO; uses rising edge of clock signal

Calculated from SNR of ADC method (broadband jitter)

Distribution section only; does not include PLL and VCO; uses rising edge of clock signal

Calculated from SNR of ADC method (broadband jitter)

2

C mode

Rev. 0 | Page 12 of 84

AD9522-2

SERIAL CONTROL PORT—I²C MODE

Table 14.

Parameter Min Typ Max Unit Test Conditions/Comments

SDA, SCL (WHEN INPUTTING DATA)

Input Logic 1 Voltage 0.7 × VS V Input Logic 0 Voltage 0.3 × VS V Input Current with an Input Voltage Between

0.1 × VS and 0.9 × VS Hysteresis of Schmitt Trigger Inputs 0.015 × VS V Pulse Width of Spikes That Must Be Suppressed by

the Input Filter, t

SPIKE

SDA (WHEN OUTPUTTING DATA)

Output Logic 0 Voltage at 3 mA Sink Current 0.4 V Output Fall Time from VIH

MIN

to VIL

with a Bus

MAX

Capacitance from 10 pF to 400 pF

TIMING

Clock Rate (SCL, f Bus Free Time Between a Stop and Start Condition, t Setup Time for a Repeated Start Condition, t

) 400 kHz

I2C

IDLE

0.6 μs

SET; STR

Hold Time (Repeated) Start Condition (After This Period,

the First Clock Pulse Is Generated), t Setup Time for Stop Condition, t Low Period of the SCL Clock, t High Period of the SCL Clock, t SCL, SDA Rise Time, t SCL, SDA Fall Time, t Data Setup Time, t

Data Hold Time, t

RISE

FAL L

SET; DAT

HLD; DAT

LOW

HIGH

20 + 0.1 Cb 300 ns Cb = capacitance of one bus line in pF

120 ns

140 880 ns

SET; STP

1.3 μs

0.6 μs

HLD; STR

0.6 μs

Capacitive Load for Each Bus Line, Cb 400 pF

1

According to the original I2C specification, an I2C master must also provide a minimum hold time of 300 ns for the SDA signal to bridge the undefined region of the SCL

falling edge.

−10 +10 μA

50 ns

20 + 0.1 C

250 ns Cb = capacitance of one bus line in pF

b

Note that all I to VIH (0.7 × VS)

1.3 μs

0.6 μs

This is a minor deviation from the original I²C specification of 100 ns minimum

This is a minor deviation from the original I²C specification of 0 ns minimum

2

C timing values refer

(0.3 × VS) and VIL

MIN

1

MAX

levels

Rev. 0 | Page 13 of 84

AD9522-2

PD, SYNC, AND RESET PINS

Table 15.

Parameter Min Typ Max Unit Test Conditions/Comments

INPUT CHARACTERISTICS Each of these pins has an internal 30 kΩ pull-up resistor

Logic 1 Voltage 2.0 V Logic 0 Voltage 0.8 V Logic 1 Current 1 μA Logic 0 Current −110 μA

Capacitance 2 pF

RESET TIMING

Pulse Width Low 50 ns RESET Inactive to Start of Register Programming

SYNC TIMING

Pulse Width Low 1.3 ns High speed clock is CLK input signal

100 ns

SERIAL PORT SETUP PINS: SP1, SP0

Table 16.

Parameter Min Typ Max Unit Test Conditions/Comments

SP1, SP0 These pins do not have internal pull-up/pull-down resistors

Logic Level 0 0.25 × VS V VS is the voltage on the VS pin Logic Level ½ 0.4 × VS 0.65 × VS V

Logic Level 1 0.8 × VS V

User can float these pins to obtain Logic Level ½; if floating this pin, user should connect a capacitor to ground

The minus sign indicates that current is flowing out of the AD9522, which is due to the internal pull-up resistor

LD, STATUS, AND REFMON PINS

Table 17.

Parameter Min Typ Max Unit Test Conditions/Comments

OUTPUT CHARACTERISTICS

Output Voltage High, VOH 2.7 V Output Voltage Low, VOL 0.4 V

MAXIMUM TOGGLE RATE 100 MHz

ANALOG LOCK DETECT

Capacitance 3 pF

REF1, REF2, AND VCO FREQUENCY STATUS MONITOR

Normal Range 1.02 MHz

Extended Range 8 kHz

LD PIN COMPARATOR

Trip Point 1.6 V Hysteresis 260 mV

When selected as a digital output (CMOS); there are other modes in which these pins are not CMOS digital outputs; see Table 52, 0x017, 0x01A, and 0x01B

Applies when mux is set to any divider or counter output, or PFD up/down pulse; also applies in analog lock detect mode; usually debug mode only; note that spurs can couple to output when any of these pins are toggling

On-chip capacitance; used to calculate RC time constant for analog lock detect readback; use a pull-up resistor

Frequency above which the monitor indicates the presence of the reference

Rev. 0 | Page 14 of 84

AD9522-2

POWER DISSIPATION

Table 18.

Parameter Min Typ Max Unit Test Conditions/Comments

POWER DISSIPATION, CHIP

Power-On Default 0.88 1.0 W No clock; no programming; default register values PLL Locked; One LVDS Output Enabled 0.54 0.63 W

PLL Locked; One CMOS Output Enabled 0.55 0.66 W

Distribution Only Mode; VCO Divider On;

0.36 0.43 W

One LVDS Output Enabled

Distribution Only Mode; VCO Divider Off;

0.33 0.4 W

One LVDS Output Enabled

Maximum Power, Full Operation 1.1 1.3 W

PD Power-Down

PD Power-Down, Maximum Sleep

35 50 mW

27 43 mW

VCP Supply 8 2.3 mW PLL operating; typical closed-loop configuration

POWER DELTAS, INDIVIDUAL FUNCTIONS Power delta when a function is enabled/disabled

VCO Divider On/Off 33 43 mW VCO divider not used REFIN (Differential) Off 25 31 mW

REF1, REF2 (Single-Ended) On/Off 16 22 mW

VCO On/Off 60 95 mW Internal VCO disabled; CLK input selected PLL Dividers and Phase Detector On/Off 54 67 mW PLL off to PLL on, normal operation; no reference enabled LVDS Channel 118 146 mW No LVDS output on to one LVDS output on; channel divider set to 1 LVDS Driver 11 15 mW Second LVDS output turned on, same channel CMOS Channel 120 154 mW

CMOS Driver On/Off 16 30 mW Additional CMOS outputs within the same channel turned on Channel Divider Enabled 33 40 mW

Zero Delay Block On/Off 30 35 mW

Does not include power dissipated in external resistors; all LVDS outputs terminated with 100 Ω across differential pair; all CMOS outputs have 10 pF capacitive loading

= 25 MHz; f

f

REF

= 250 MHz; VCO = 2250 MHz; VCO divider = 3;

OUT

one LVDS output and output divider enabled; zero delay off; ICP = 4.8 mA

= 25 MHz; f

f

REF

= 62.5 MHz; VCO = 2250 MHz; VCO divider = 3;

OUT

one CMOS output and output divider enabled; zero delay off; ICP = 4.8 mA

f

= 2.4 GHz; f

CLK

= 200 MHz; VCO divider = 2; one LVDS output

OUT

and output divider enabled; zero delay off

= 2.4 GHz; f

f

CLK

= 200 MHz; VCO divider bypassed; one LVDS

OUT

output and output divider enabled; zero delay off PLL on; internal VCO = 2250 MHz; VCO divider = 3; all channel

dividers on; 12 LVDS outputs @ 125 MHz; zero delay on PD pin pulled low; does not include power dissipated in

termination resistors PD pin pulled low; PLL power-down, 0x010[1:0] = 01b; power-

down SYNC, 0x230[2] = 1b; power-down distribution reference, 0x230[1] = 1b

Delta between reference input off and differential reference input mode

Delta between reference inputs off and one single-ended reference enabled; double this number if both REF1 and REF2 are powered up

No CMOS output on to one CMOS output on; channel divider set to 1; f

= 62.5 MHz and 10 pF of capacitive loading

OUT

Delta between divider bypassed (divide-by-1) and divide-by-2 to divide-by-32

Rev. 0 | Page 15 of 84

AD9522-2

ABSOLUTE MAXIMUM RATINGS

Table 19.

With

Parameter or Pin

VS GND −0.3 V to +3.6 V VCP, CP GND −0.3 V to +5.8 V REFIN, REFIN RSET, LF, BYPASS GND −0.3 V to VS + 0.3 V CPRSET GND −0.3 V to VS + 0.3 V CLK, CLK CLK

SCLK/SCL, SDIO/SDA, SDO, CS OUT0, OUT0, OUT1, OUT1,

OUT2, OUT2 OUT4, OUT4 OUT6, OUT6, OUT7, OUT7, OUT8, OUT8, OUT9, OUT9, OUT10, OUT10, OUT11, OUT11

SYNC, RESET, PD REFMON, STATUS, LD GND −0.3 V to VS + 0.3 V SP0, SP1, EEPROM GND −0.3 V to VS + 0.3 V Junction Temperature1 150°C Storage Temperature Range −65°C to +150°C Lead Temperature (10 sec) 300°C

1

See Table 20 for θJA.

, OUT3, OUT3, , OUT5, OUT5,

Respect to Rating

GND −0.3 V to VS + 0.3 V

GND −0.3 V to VS + 0.3 V CLK GND −0.3 V to VS + 0.3 V GND −0.3 V to VS + 0.3 V

GND −0.3 V to VS + 0.3 V

−1.2 V to +1.2 V

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

THERMAL RESISTANCE

Thermal impedance measurements were taken on a JEDEC JESD51-5 2S2P test board in still air in accordance with JEDEC JESD51-2. See the Thermal Performance section for more details.

Table 20.

Package Type θJA Unit

64-Lead LFCSP (CP-64-4) 22 °C/W

ESD CAUTION

Rev. 0 | Page 16 of 84

AD9522-2

S

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

REFIN (REF 1)

REFIN (REF 2)

CPRSETVSVS

GND

RSETVSOUT0 (OUT0A)

OUT0 (OUT0B)VSOUT1 (OUT1A)

OUT1 (OUT1B)

OUT2 (OUT2A)

OUT2 (OUT2B)

646362616059585756555453525150

VS

49

32

VS

48

OUT3 (OUT3A)

47

OUT3 (OUT3B)

46

VS

45

OUT4 (OUT4A)

44

OUT4 (OUT4B)

43

OUT5 (OUT5A)

42

OUT5 (OUT5B)

41

VS

40

VS

39

OUT8 (OUT8B)

38

OUT8 (OUT8A)

37

OUT7 (OUT7B)

36

OUT7 (OUT7A)

35

VS

34

OUT6 (OUT6B)

33

OUT6 (OUT6A)

07221-003

VS

1

PIN 1

REFMON

LD

VCP

CP

STATUS

REF_SEL

SYNC

LF

BYPASS

10

VS

11

VS

12

CLK

13

CLK

14

CS

15 16

CLK/SCL

NOTES

1. EXPOSED DIE PAD MUST BE CO NNECTED TO GND.

INDICATO R

2 3 4 5 6 7 8 9

171819202122232425262728293031

SDIO/SDA

SDO

SP1

GND

AD9522

TOP VIEW

(Not to Scale)

PD

SP0

RESET

EEPROM

T9 (OUT9A)

OU

T9 (OUT9B)

OU

VS

OUT10A)

OUT10 (

OUT10B)

OUT10 (

OUT11A)

OUT11 (

OUT11B)

OUT11 (

Figure 5. Pin Configuration

Table 21. Pin Function Descriptions

Pin No.

1, 11, 12, 27,

Input/ Output

I Power VS 3.3 V Power Pins.

Pin Type Mnemonic Description

32, 35, 40, 41, 46, 49, 54, 57, 60, 61

2 O 3.3 V CMOS REFMON Reference Monitor (Output). This pin has multiple selectable outputs. 3 O 3.3 V CMOS LD 4 I Power VCP

Lock Detect (Output). This pin has multiple selectable outputs. Power Supply for Charge Pump (CP); VS < VCP < 5.0 V. VCP must still be connected

to 3.3 V if the PLL is not used.

5 O Loop filter CP

Charge Pump (Output). This pin connects to an external loop filter. This pin can

be left unconnected if the PLL is not used. 6 O 3.3 V CMOS STATUS 7 I 3.3 V CMOS REF_SEL

Programmable Status Output.

Reference Select. It selects REF1 (low) or REF2 (high). This pin has an internal

30 kΩ pull-down resistor. 8 I 3.3 V CMOS

SYNC

Manual Synchronizations and Manual Holdover. This pin initiates a manual

synchronization and is used for manual holdover. Active low. This pin has an

internal 30 kΩ pull-up resistor. 9 I Loop filter LF 10 O Loop filter BYPASS

Loop Filter (Input). It connects internally to the VCO control voltage node.

This pin is for bypassing the LDO to ground with a 220 nF capacitor.

This pin can be left unconnected if the PLL is not used. 13 I

Differential

CLK

Along with CLK

, this pin is the differential input for the clock distribution section.

clock input

14 I

Differential clock input

Along with CLK, this pin is the differential input for the clock distribution section. If a

CLK

single-ended input is connected to the CLK pin, connect a 0.1 μF bypass capacitor

from this pin to ground.

Rev. 0 | Page 17 of 84

AD9522-2

Input/

Pin No.

15 I 3.3 V CMOS

16 I 3.3 V CMOS SCLK/SCL

17 I/O 3.3 V CMOS SDIO/SDA Serial Control Port Bidirectional Serial Data In/Out. 18 O 3.3 V CMOS SDO Serial Control Port Unidirectional Serial Data Out. 19, 59 I GND GND Ground Pins. 20 I

21 I

22 I 3.3 V CMOS EEPROM

23 I 3.3 V CMOS 24 I 3.3 V CMOS 25 O

26 O

28 O

29 O

30 O

31 O

33 O

34 O

36 O

37 O

38 O

39 O

42 O

43 O

44 O

45 O

Output

Pin Type Mnemonic Description

Serial Control Port Chip Select; Active Low. This pin has an internal 30 kΩ

CS

pull-up resistor. Serial Control Port Clock Signal. This pin has an internal 30 kΩ pull-down resistor

in SPI mode but is high impedance in I²C mode.

Three-level logic

LVDS or CMOS

SP1

SP0

RESET PD OUT9 (OUT9A)

(OUT9B) Clock Output. This pin can be configured as one side of a differential LVDS output

OUT9

OUT10 (OUT10A)

(OUT10B) Clock Output. This pin can be configured as one side of a differential LVDS output

OUT10

OUT11 (OUT11A)

(OUT11B) Clock Output. This pin can be configured as one side of a differential LVDS output

OUT11

OUT6 (OUT6A)

(OUT6B) Clock Output. This pin can be configured as one side of a differential LVDS output

OUT6

OUT7 (OUT7A)

(OUT7B) Clock Output. This pin can be configured as one side of a differential LVDS output

OUT7

OUT8 (OUT8A)

(OUT8B) Clock Output. This pin can be configured as one side of a differential LVDS output

OUT8

(OUT5B) Clock Output. This pin can be configured as one side of a differential LVDS output

OUT5

OUT5 (OUT5A)

(OUT4B) Clock Output. This pin can be configured as one side of a differential LVDS output

OUT4

OUT4 (OUT4A)

Select SPI or I²C as the serial interface port and select the I²C slave address in I²C mode. Three-level logic. This pin is internally biased for the open logic level.

Setting this pin high selects the register values stored in the internal EEPROM to be loaded at reset and/or power-up. Setting this pin low causes the AD9522 to load the hard-coded default register values at power-up/reset. This pin has an internal 30 kΩ pull-down resistor.

Chip Reset, Active Low. This pin has an internal 30 kΩ pull-up resistor. Chip Power-Down, Active Low. This pin has an internal 30 kΩ pull-up resistor. Clock Output. This pin can be configured as one side of a differential LVDS output

or as a single-ended CMOS output.

or as a single-ended CMOS output. Clock Output. This pin can be configured as one side of a differential LVDS output

or as a single-ended CMOS output.

or as a single-ended CMOS output. Clock Output. This pin can be configured as one side of a differential LVDS output

or as a single-ended CMOS output.

or as a single-ended CMOS output. Clock Output. This pin can be configured as one side of a differential LVDS output

or as a single-ended CMOS output.

or as a single-ended CMOS output. Clock Output. This pin can be configured as one side of a differential LVDS output

or as a single-ended CMOS output.

or as a single-ended CMOS output. Clock Output. This pin can be configured as one side of a differential LVDS output

or as a single-ended CMOS output.

or as a single-ended CMOS output. Clock Output. This pin can be configured as one side of a differential LVDS output

or as a single-ended CMOS output.

or as a single-ended CMOS output. Clock Output. This pin can be configured as one side of a differential LVDS output

or as a single-ended CMOS output.

Rev. 0 | Page 18 of 84

AD9522-2

Input/

Pin No.

47 O

48 O

50 O

51 O

52 O

53 O

55 O

56 O

58 O

62 O

63 I

64 I

EPAD GND GND The exposed die pad must be connected to GND.

Output

Pin Type Mnemonic Description

LVDS or CMOS

Current set resistor

Reference input

(OUT3B) Clock Output. This pin can be configured as one side of a differential LVDS output

OUT3

or as a single-ended CMOS output.

OUT3 (OUT3A)

(OUT2B) Clock Output. This pin can be configured as one side of a differential LVDS output

OUT2

OUT2 (OUT2A)

(OUT1B) Clock Output. This pin can be configured as one side of a differential LVDS output

OUT1

OUT1 (OUT1A)

(OUT0B) Clock Output. This pin can be configured as one side of a differential LVDS output

OUT0

OUT0 (OUT0A)

RSET

CPRSET

(REF2) Along with REFIN, this is the differential input for the PLL reference. Alternatively,

REFIN

REFIN (REF1)

Clock Output. This pin can be configured as one side of a differential LVDS output

or as a single-ended CMOS output.

Clock Output. This pin can be configured as one side of a differential LVDS output

or as a single-ended CMOS output.

Clock Output. This pin can be configured as one side of a differential LVDS output

or as a single-ended CMOS output.

Clock Output. This pin can be configured as one side of a differential LVDS output

or as a single-ended CMOS output.

Clock Distribution Current Set Resistor. Connect a 4.12 kΩ resistor from this pin

to GND.

Charge Pump Current Set Resistor. Connect a 5.1 kΩ resistor from this pin to GND.

This resistor can be omitted if the PLL is not used.

this pin is a single-ended input for REF2.

Along with REFIN

this pin is a single-ended input for REF1.

, this is the differential input for the PLL reference. Alternatively,

Rev. 0 | Page 19 of 84

AD9522-2

–

TYPICAL PERFORMANCE CHARACTERISTICS

275

250

225

200

175

150

CURRENT (mA)

125

100

3 CHANNELS—6 LVDS

3 CHANNELS—3 LVDS

2 CHANNELS—2 LVDS

1 CHANNEL—1 LVDS

5

4

PUMP UPPUMP DOWN

3

2

CURRENT FROM CP P IN (mA)

1

75

0 200 400 600 800 1000

FREQUENCY (MHz )

07221-108

Figure 6. Total Current vs. Frequency, CLK-to-Output (PLL Off), Channel and VCO Divide r Bypa ssed, LVDS Outputs Terminated 100 Ω A cross Differential Pair

240

220

200

180

160

140

CURRENT (mA)

120

100

80

0 50 100 150 200 250

2 CHANNELS—8 CMOS

2 CHANNELS—2 CMOS

1 CHANNEL—2 CMOS

1 CHANNEL—1 CMOS

FREQUENCY (MHz)

07221-109

Figure 7. Total Current vs. Frequency, CLK-to-Output (PLL Off), Channel and

VCO Divider Bypassed, CMOS Outputs with 10 pF Load

48

46

44

42

40

(MHz/V)

38

VCO

K

36

34

32

30

2.00 2.05 2.10 2.15 2.20 2.25 2.30 2.35

VCO FREQUENCY ( GHz)

Figure 8. K

VCO

07221-010

vs. VCO Frequency

0

033.02.52.01.51.00.5

VOLTAGE ON CP PIN (V)

Figure 9. Charge Pump Characteristics @ VCP = 3.3 V

5

4

PUMP DOWN PUMP UP

3

2

CURRENT FROM CP P IN (mA)

1

0

054.03.0 4.53.52.52. 01.51.00.5

VOLTAGE ON CP PIN (V)

Figure 10. Charge Pump Characteristics @ VCP = 5.0 V

140

–145

–150

–155

(dBc/Hz)

–160

–165

PFD PHASE NOI SE REFERRED TO PFD INPUT

–170

0.1 1 10010

PFD FREQUENCY (MHz)

Figure 11. PFD Phase Noise Referred to PFD Input vs. PFD Frequency

.5

07221-111

.0

07221-112

07221-013

Rev. 0 | Page 20 of 84

AD9522-2

–

208

–210

–212

–214

–216

–218

–220

PLL FIGURE OF MERIT (dBc/ Hz)

–222

–224

DIFFERENTIAL INPUT

SINGLE- ENDED INPUT

0 0.4 0.8 1.20.2 0.6 1.0 1.4

INPUT SLEW RATE (V/ns)

Figure 12. PLL Figure of Merit (FOM) vs. Slew Rate at REFIN/

1.9

1.8

1.7

1.6

1.5

REFIN

07221-114

0

–10

–20

–30

–40

–50

–60

POWER (dBm)

–70

–80

–90

–100

122.38 122.58 122.78 122. 98 123. 18 123. 38

FREQUENCY (MHz )

Figure 15. Output Spectrum, LVDS; 122.88 MHz; PFD = 15.36 MHz;

LBW = 127 kHz; I

3.5

3.0 VS_DRV = 3.135V

2.5

VS_DRV = 2.35V

2.0

(V)

OH

V

1.5

= 3.0 mA; f

CP

= 2212 MHz

VCO

VS_DRV = 3.3V

VS_DRV = 2.5V

07221-117

1.4

VCO TUNING V OLTAGE (V)

1.3

1.2

2.0 2.42.32.22.1

FREQUENCY (GHz)

Figure 13. VCO Tuning Voltage vs. Frequency

0

–10

–20

–30

–40

–50

–60

POWER (dBm)

–70

–80

–90

–100

–110

100 145140135130125120115110105

FREQUENCY (MHz)

Figure 14. PFD/CP Spurs; 122.88 MHz; PFD = 15.36 MHz;

LBW = 127 kHz; I

= 3.0 mA; f

CP

= 2212 MHz

VCO

1.0

0.5

0

10k 1k 100

07221-115

Figure 16. CMOS Output VOH (Static) vs. R

RESISTIVE LOAD (Ω)

(to Ground)

LOAD

07221-118

0.4

0.3

0.2

0.1

0

–0.1

–0.2

DIFFERENTIAL OUTPUT (V)

–0.3

–0.4

011413121110987654321

07221-116

TIME (ns)

5

07221-014

Figure 17. LVDS Output (Differential) @ 100 MHz, Output Terminated 100 Ω Across Differential Pair

Rev. 0 | Page 21 of 84

AD9522-2

–

0.4

1600

0.3

0.2

0.1

0

–0.1

–0.2

DIFFERENTIAL SWING (V p-p)

–0.3

–0.4

032.52.01.51. 00.5

TIME (ns)

Figure 18. LVDS Differential Voltage Swing @ 800 MHz,

Output Terminated 100 Ω Across Differential Pair

3.2

2.8

2.4

2.0

1.6

AMPLITUDE ( V)

1.2

0.8

0.4

0

0860 1004020 7050 903010

TIME (ns)

0

Figure 19. CMOS Output with 10 pF Load @ 25 MHz

3.2

2.8

2.4

2.0

1.6

AMPLITUDE (V)

1.2

0.8

0.4

0

010987654321

2pF LOAD

TIME (ns)

10pF

LOAD

Figure 20. CMOS Output with 2 pF and 10 pF Load @ 250 MHz

1400

1200

1000

800

600

400

DIFFERENTIAL SWING (mV p-p)

200

.0

07221-015

0

0 1000600 800400200

7mA SETTING

DEFAULT 3.5mA SETTING

FREQUENCY (GHz)

Figure 21. LVDS Differential Voltage Swing vs. Frequency,

Output Terminated 100 Ω Across Differential Pair

4.0

3.5

3.0

2.5

2.0

1.5

AMPLITUDE (V)

1.0

0.5

0

07221-018

07

FREQUENCY (MHz )

Figure 22. CMOS Output Swing vs. Frequency and Capacitive Load

50

–60

–70

–80

–90

–100

–110

–120

PHASE NOISE (dBc/Hz)

–130

–140

–150

–160

07221-019

1k 100M1M 10M100k10k

FREQUENCY (Hz)

Figu re 23. Intern al VC O Phase Noise (Absolute), LVDS Output @ 673.3 MHz

07221-123

2pF

10pF

20pF

600500400300200100

00

07221-124

07221-023

Rev. 0 | Page 22 of 84

AD9522-2

–

50

–60

–70

–80

–90

–100

–110

–120

PHASE NOISE (dBc/Hz)

–130

–140

–150

–160

1k 100M1M 10M100k10k

FREQUENCY (Hz)

Figu re 24. Internal VCO Phas e Noise (Absolute), LVDS Output @ 725 MHz

50

–60

–70

–80

–90

–100

–110

–120

PHASE NOISE (dBc/Hz)

–130

–140

–150

–160

1k 100M1M 10M100k10k

FREQUENCY (Hz)

Figu re 25. Internal VCO Phas e Noise ( Absolute), LVDS Output @ 778.3 MHz

100

07221-024

07221-025

100

–110

–120

–130

–140

PHASE NOISE (dBc/Hz)

–150

–160

10 1k100 100M1M 10M100k10k

Figure 27. Additive (Residual) Phase Noise,

CLK-to-LVDS @ 200 MHz, Divide-by-5

100

–110

–120

–130

PHASE NOISE (dBc/Hz)

–140

–150

10 1k100 100M1M 10M100k10k

Figure 28. Additive (Residual) Phase Noise,

CLK-to-LVDS @ 800 MHz, Divide-by-1

110

FREQUENCY (Hz)

07221-129

07221-130

–110

–120

–130

–140

PHASE NOISE (dBc/Hz)

–150

–160

10 1k100 100M1M 10M100k10k

Figure 26. Additive (Residual) Phase Noise,

CLK-to-LVDS @ 245.76 MHz, Divide-by-1

FREQUENCY (Hz)

07221-128

–120

–130

–140

–150

PHASE NOISE (dBc/Hz)

–160

–170

10 1k100 100M1M 10M100k10k

Figure 29. Additive (Residual) Phase Noise,

CLK-to-CMOS @ 50 MHz, Divide-by-20

FREQUENCY (Hz)

07221-131

Rev. 0 | Page 23 of 84

AD9522-2

–

100

–110

–120

–90

–100

–110

80

INTEGRAT ED RMS JITTER (12kHz TO 20MHz): 146fs

–130

–140

PHASE NOISE (dBc/Hz)

–150

–160

10 1k100 100M1M 10M100k10k

FREQUENCY (Hz)

Figure 30. Additive (Residual) Phase Noise,

CLK-to-CMOS @ 250 MHz, Divide-by-4

100

–110

–120

–130

–140

PHASE NOISE (dBc/Hz)

–150

–160

1k 100M1M 10M100k10k

FREQUENCY (Hz)

Figure 31. Phase Noise (Absolute) Clock Generation; Internal VCO @

2212 MHz; PFD = 15.36 MHz; LBW = 40 kHz; LVDS Output = 122.88 MHz

80

INTEGRATED RMS JITTER (12kHz TO 20MHz): 625fs INTEGRATED RMS JITTER (20kHz TO 80MHz): 438fs (EXTRAPOLATED)

–90

–100

–120

–130

PHASE NOISE (dBc/Hz)

–140

–150

–160

1k 100M1M 10M100k10k

07221-132

FREQUENCY (Hz)

07221-135

Figure 33. Phase Noise (Absolute), External VCXO (Toyocom TCO-2112)

@ 245.76 MHz; PFD = 15.36 MHz; LBW = 250 Hz; LVDS Output = 245.76 MHz

R2

C2 62pF

BYPASS

CAPACITOR

FOR LDO

C1 240nF

R1 820Ω

390Ω

C12 220nF

C3 33pF

LFCP

BYPASS

07221-234

Figure 34. PLL Loop Filter Used for Clock Generation Plot (See Figure 31)

R2

3kΩ

C1

BYPASS

FOR LDO

4.7µF

R1

2.1kΩ

C12 220nF

C2

1.5nF

07221-033

CAPACITOR

C3

2.2nF

LFCP

BYPASS

07221-235

Figure 35. PLL Loop Filter Used for Clock Cleanup Plot (See Figure 32)

–110

–120

–130

PHASE NOISE (dBc/Hz)

–140

–150

–160

1k 100M1M 10M100k10k

FREQUENCY (Hz)

07221-034

Figure 32. Phase Noise (Absolute) Clock Cleanup; Internal VCO @ 2177 MHz;

PFD = 120 kHz; LBW = 1.92 kHz; LVDS Output = 155.52 MHz

Rev. 0 | Page 24 of 84

AD9522-2

TERMINOLOGY

Phase Jitter and Phase Noise

An ideal sine wave can be thought of as having a continuous and even progression of phase with time from 0° to 360° for each cycle. Actual signals, however, display a certain amount of variation from ideal phase progression over time. This phenomenon is called phase jitter. Although many causes can contribute to phase jitter, one major cause is random noise, which is characterized statistically as Gaussian (normal) in distribution.

This phase jitter leads to a spreading out of the energy of the sine wave in the frequency domain, producing a continuous power spectrum. This power spectrum is usually reported as a series of values whose units are dBc/Hz at a given offset in frequency from the sine wave (carrier). The value is a ratio (expressed in decibels) of the power contained within a 1 Hz bandwidth with respect to the power at the carrier frequency. For each measurement, the offset from the carrier frequency is also given.

It is meaningful to integrate the total power contained within some interval of offset frequencies (for example, 10 kHz to 10 MHz). This is called the integrated phase noise over that frequency offset interval and can be readily related to the time jitter due to the phase noise within that offset frequency interval.

Phase noise has a detrimental effect on the performance of ADCs, DACs, and RF mixers. It lowers the achievable dynamic range of the converters and mixers, although they are affected in somewhat different ways.

Time Jitter

Phase noise is a frequency domain phenomenon. In the time domain, the same effect is exhibited as time jitter. When observing a sine wave, the time of successive zero crossings varies. In a square wave, the time jitter is a displacement of the edges from their ideal (regular) times of occurrence. In both cases, the variations in timing from the ideal are the time jitter. Because these variations are random in nature, the time jitter is specified in seconds root mean square (rms) or 1 sigma of the Gaussian distribution.

Time jitter that occurs on a sampling clock for a DAC or an ADC decreases the signal-to-noise ratio (SNR) and dynamic range of the converter. A sampling clock with the lowest possible jitter provides the highest performance from a given converter.

Additive Phase Noise

Additive phase noise is the amount of phase noise that is attributable to the device or subsystem being measured. The phase noise of any external oscillators or clock sources is subtracted. This makes it possible to predict the degree to which the device impacts the total system phase noise when used in conjunction with the various oscillators and clock sources, each of which contributes its own phase noise to the total. In many cases, the phase noise of one element dominates the system phase noise. When there are multiple contributors to phase noise, the total is the square root of the sum of squares of the individual contributors.

Additive Time Jitter

Additive time jitter is the amount of time jitter that is attributable to the device or subsystem being measured. The time jitter of any external oscillators or clock sources is subtracted. This makes it possible to predict the degree to which the device impacts the total system time jitter when used in conjunction with the various oscillators and clock sources, each of which contributes its own time jitter to the total. In many cases, the time jitter of the external oscillators and clock sources dominates the system time jitter.

Rev. 0 | Page 25 of 84

AD9522-2

V

DETAILED BLOCK DIAGRAM

OPTIONAL

BYPASS

EEPROM

REFIN

CLK

PD

SYNC

RESET

REF1

REF2

REGULATOR (LDO)

LF

REF_SEL CPRSETVCP

REFERENCE

SWITCHOVER

STATUS

BUF

AMP

LOW DROPOUT

DIGITAL

LOGIC

EEPROM

S GND RSET

DISTRIBUTION

REFERENCE

CLOCK

DOUBLER

STATUS

P, P + 1

PRESCALER

N DIVIDER

ZERO DELAY BL OCK

DIVIDE BY 1,

2, 3, 4, 5, OR 6

01

A/B

COUNTERS

REFMON

R

DIVIDE R

PROGRAMMABLE

N DELAY

DIVIDE BY

1 TO 32

R DELAY

LOCK

DETECT

PHASE

FREQUENCY

DETECTOR

PLL

REFERENCE

CHARGE

PUMP

LD

HOLD

CP

STATUS

OUT0

OUT1

OUT2

SP1

SP0

SCLK/SCL

SDIO/SDA

SDO

CS

SERIAL

PORT

DECODE

INTERFACE

SPI

INTERFACE

AD9522

I2C

DIVIDE BY

1 TO 32

DIVIDE BY

1 TO 32

DIVIDE BY

1 TO 32

Figure 36.

OUT3

OUT4

OUT5

OUT6

OUT7

OUT8

OUT9

OUT10

OUT11

LVDS/CMOS OUTPUTS

07221-028

Rev. 0 | Page 26 of 84

ANALOG DEVICES AD9522-2 Service Manual

FEATURES

FUNCTIONAL BLOCK DIAGRAM

APPLICATIONS

GENERAL DESCRIPTION

TABLE OF CONTENTS

REVISION HISTORY

SPECIFICATIONS

POWER SUPPLY REQUIREMENTS

PLL CHARACTERISTICS

CLOCK INPUTS

CLOCK OUTPUTS

TIMING CHARACTERISTICS

Timing Diagrams

CLOCK OUTPUT ADDITIVE PHASE NOISE (DISTRIBUTION ONLY; VCO DIVIDER NOT USED)

CLOCK OUTPUT ABSOLUTE PHASE NOISE (INTERNAL VCO USED)

CLOCK OUTPUT ABSOLUTE TIME JITTER (CLOCK GENERATION USING INTERNAL VCO)

CLOCK OUTPUT ABSOLUTE TIME JITTER (CLOCK CLEANUP USING INTERNAL VCO)

CLOCK OUTPUT ABSOLUTE TIME JITTER (CLOCK GENERATION USING EXTERNAL VCXO)

CLOCK OUTPUT ADDITIVE TIME JITTER (VCO DIVIDER NOT USED)

CLOCK OUTPUT ADDITIVE TIME JITTER (VCO DIVIDER USED)

SERIAL CONTROL PORT—SPI MODE

SERIAL CONTROL PORT—I²C MODE

SERIAL PORT SETUP PINS: SP1, SP0

LD, STATUS, AND REFMON PINS

POWER DISSIPATION

ABSOLUTE MAXIMUM RATINGS

THERMAL RESISTANCE

ESD CAUTION

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

TYPICAL PERFORMANCE CHARACTERISTICS

TERMINOLOGY

DETAILED BLOCK DIAGRAM