ANALOG DEVICES AD9517-2 Service Manual

12-Output Clock Generator with
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FEATURES

Low phase noise, phase-locked loop
On-chip VCO tunes from 2.05 GHz to 2.33 GHz External VCO/VCXO to 2.4 GHz optional 1 differential or 2 single-ended reference inputs Reference monitoring capability Auto and manual reference switchover/holdover modes Autorecover from holdover Accepts references to 250 MHz Programmable delays in path to PFD Digital or analog lock detect, selectable
2 pairs of 1.6 GHz LVPECL outputs
Each pair shares 1 to 32 dividers with coarse phase delay Additive output jitter 225 f Channel-to-channel skew paired outputs <10 ps
2 pairs of 800 MHz LVDS clock outputs
Each pair shares two cascaded 1 to 32 dividers with coarse
phase del
ay Additive output jitter 275 f Fine delay adjust (ΔT) on each LVDS output
Eight 250 MHz CMOS outputs (two per LVDS output) Automatic synchronization of all outputs on power-up Manual synchronization of outputs as needed Serial control port 48-lead LFCSP

APPLICATIONS

Low jitter, low phase noise clock distribution Clocking high speed ADCs, DACs, DDSs, DDCs, DUCs, MxFEs High performance wireless transceivers High performance instrumentation Broadband infrastructure AT E

GENERAL DESCRIPTION

The AD9517-21 provides a multi-output clock distribution function with subpicosecond jitter performance, along with an on-chip PLL and VCO. The on-chip VCO tunes from 2.05 GHz to 2.33 GHz. Optionally, an external VCO/VCXO of up to
2.4 GHz can be used.
The AD9517-2 emphasizes low jitter and phase noise to max
imize data converter performance, and it can benefit other
applications with demanding phase noise and jitter requirements.
rms
S
rms
S
Integrated 2.2 GHz VCO
AD9517-2

FUNCTIONAL BLOCK DIAGRAM

PLL
ΔT
ΔT
ΔT
ΔT
LF
STATUS
MONITOR
VCO
LVPECL
LVPECL
LVDS/CMOS
LVDS/CMOS
AD9517-2
CP
REF1
REFIN
REF2
SWITCHOVER
AND MONITOR
CLK
DIV/Φ DIV/Φ
DIV/Φ DIV/Φ
SERIAL CONT ROL PORT
DIVIDER
AND MUXs
DIV/Φ
DIV/Φ
AND
DIGITAL LOGIC
Figure 1.
The AD9517-2 features four LVPECL outputs (in two pairs); four LVDS outputs (in two pairs); and eight CMOS outputs (two per LVDS output). The LVPECL outputs operate to 1.6 GHz, the LVDS outputs operate to 800 MHz, and the CMOS outputs operate to 250 MHz.
Each pair of outputs has dividers that allow both the divide
atio and coarse delay (or phase) to be set. The range of division
r for the LVPECL outputs is 1 to 32. The LVDS/CMOS outputs allow a range of divisions up to a maximum of 1024.
The AD9517-2 is available in a 48-lead LFCSP and can be op
erated from a single 3.3 V supply. An external VCO, which requires an extended voltage range, can be accommodated by connecting the charge pump supply (VCP) to 5.5 V. A separate LVPECL power supply can be from 2.375 V to 3.6 V.
The AD9517-2 is specified for operation over the standard
ustrial range of −40°C to +85°C.
ind
1
AD9517 is used throughout to refer to all the members of the AD9517
family. However, when AD9517-2 is used, it is referring to that specific member of the AD9517 family.
OUT0 OUT1 OUT2 OUT3 OUT4 OUT5 OUT6 OUT7
06426-001
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2007 Analog Devices, Inc. All rights reserved.
AD9517-2
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TABLE OF CONTENTS

Features .............................................................................................. 1
Applications....................................................................................... 1
General Description......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 3
Specifications..................................................................................... 4
Power Supply Requirements ....................................................... 4
PLL Characteristics ...................................................................... 4
Clock Inputs.................................................................................. 6
Clock Outputs............................................................................... 6
Timing Characteristics ................................................................ 7
Clock Output Additive Phase Noise (Distribution Only; VCO
Divider Not Used) ........................................................................ 8
Clock Output Absolute Phase Noise (Internal VCO Used).... 9
Clock Output Absolute Time Jitter (Clock Generation Using
Internal VCO) ............................................................................. 10
Clock Output Absolute Time Jitter (Clock Cleanup Using
Internal VCO) ............................................................................. 10
Clock Output Absolute Time Jitter (Clock Generation Using
External VCXO) ......................................................................... 10
Clock Output Additive Time Jitter (VCO Divider Not Used)
....................................................................................................... 11
Clock Output Additive Time Jitter (VCO Divider Used)..... 11
Delay Block Additive Time Jitter.............................................. 12
Serial Control Port .....................................................................12
,
, and
SYNC
PD
LD, STATUS, REFMON Pins.................................................... 13
Power Dissipation....................................................................... 14
Timing Diagrams............................................................................ 15
Absolute Maximum Ratings.......................................................... 16
Thermal Resistance .................................................................... 16
ESD Caution................................................................................ 16
Pin Configuration and Function Descriptions........................... 17
Typical Performance Characteristics ........................................... 19
Te r mi n ol o g y .................................................................................... 25
Detailed Block Diagram ................................................................ 26
Theory of Operation ...................................................................... 27
Operational Configurations...................................................... 27
High Frequency Clock Distribution—CLK or External
VCO >1600 MHz ...................................................................27
Internal VCO and Clock Distribution.................................29
Pins ..................................................... 13
RESET
Clock Distribution or External VCO <1600 MHz ............ 31
Phase-Locked Loop (PLL) .................................................... 33
Configuration of the PLL ...................................................... 33
Phase Frequency Detector (PFD) ........................................ 33
Charge Pump (CP)................................................................. 34
On-Chip VCO ........................................................................ 34
PLL External Loop Filter....................................................... 34
PLL Reference Inputs............................................................. 34
Reference Switchover............................................................. 35
Reference Divider R............................................................... 35
VCXO/VCO Feedback Divider N: P, A, B, R ..................... 35
Digital Lock Detect (DLD) ....................................................... 37
Analog Lock Detect (ALD)................................................... 37
Current Source Digital Lock Detect (DLD) ....................... 37
External VCXO/VCO Clock Input (CLK/
Holdover .................................................................................. 38
Manual Holdover Mode ........................................................ 38
Automatic/Internal Holdover Mode.................................... 38
Frequency Status Monitors................................................... 39
VCO Calibration .................................................................... 40
Clock Distribution ..................................................................... 41
Internal VCO or External CLK as Clock Source ............... 41
CLK or VCO Direct to LVPECL Outputs........................... 41
Clock Frequency Division..................................................... 42
VCO Divider ........................................................................... 42
Channel Dividers—LVPECL Outputs................................. 42
Channel Dividers—LVDS/CMOS Outputs........................ 44
Synchronizing the Outputs—SYNC Function ................... 47
Clock Outputs......................................................................... 49
LVPECL Outputs: OUT0 to OUT3 ..................................... 49
LVDS/CMOS Outputs: OUT4 to OUT7............................. 50
Reset Modes ................................................................................ 50
Power-On Reset—Start-Up Conditions When VS Is
Applied .................................................................................... 50
Asynchronous Reset via the
Soft Reset via 0x00<5> .......................................................... 50
Power-Down Modes .................................................................. 50
Chip Power-Down via
PLL Power-Down................................................................... 51
Distribution Power-Down .................................................... 51
RESET
PD
.................................................... 50
CLK
)................ 37
Pin ............................. 50
Rev. 0 | Page 2 of 80
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Individual Clock Output Power-Down................................51
Individual Circuit Block Power-Down ................................51
Serial Control Port ..........................................................................52
Serial Control Port Pin Descriptions........................................52
General Operation of Serial Control Port ...............................52
Communication Cycle—Instruction Plus Data..................52
Wr it e .........................................................................................52
Read ..........................................................................................53
The Instruction Word (16 Bits).................................................53
MSB/LSB First Transfers............................................................53

REVISION HISTORY

7/07—Revision 0: Initial Version
Register Map Overview ..................................................................56
Register Map Descriptions.............................................................60
Application Notes............................................................................78
Using the AD9517 Outputs for ADC Clock Applications ....78
LVPECL Clock D i s t ribut io n ......................................................78
LVDS Clock Distribution...........................................................78
CMOS Clock Distribution.........................................................79
Outline Dimensions........................................................................80
Ordering Guide...........................................................................80
Rev. 0 | Page 3 of 80
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SPECIFICATIONS

Typical (typ) is given for VS = V unless otherwise noted. Minimum (min) and maximum (max) values are given over full V

POWER SUPPLY REQUIREMENTS

Table 1.
Parameter Min Typ Max Unit Test Conditions/Comments
V
S
V
S_LVPECL
V
CP
3.135 3.3 3.465 V This is 3.3 V ± 5%
2.375 V V
S
RSET Pin Resistor 4.12 Sets internal biasing currents; connect to ground CPRSET Pin Resistor 5.1
BYPASS Pin Capacitor 220 nF Bypass for internal LDO regulator; necessary for LDO stability; connect to ground

PLL CHARACTERISTICS

Table 2.
Parameter Min Typ Max Unit Test Conditions/Comments
VCO (ON-CHIP)
Frequency Range 2050 2335 MHz See Figure 15 VCO Gain (K Tunin g Volt age (VT) 0.5 VCP − 0.5 V
Frequency Pushing (Open-Loop) 1 MHz/V Phase Noise @ 100 kHz Offset −107 dBc/Hz f = 2175 MHz Phase Noise @ 1 MHz Offset −124 dBc/Hz f = 2175 MHz
REFERENCE INPUTS
Differential Mode (REFIN, REFIN)
Input Frequency 0 250 MHz
Input Sensitivity 250 mV p-p
Self-Bias Voltage, REFIN 1.35 1.60 1.75 V Self-bias voltage of REFIN Self-Bias Voltage, REFIN Input Resistance, REFIN 4.0 4.8 5.9 Self-biased Input Resistance, REFIN
Dual Single-Ended Mode (REF1, REF2) Two single-ended CMOS-compatible inputs
Input Frequency (AC-Coupled) 20 250 MHz Slew rate > 50 V/μs Input Frequency (DC-Coupled) 0 250 MHz Slew rate > 50 V/μs; CMOS levels Input Sensitivity (AC-Coupled) 0.8 V p-p Should not exceed VS p-p Input Logic High 2.0 V Input Logic Low 0.8 V Input Current −100 +100 μA
Input Capacitance 2 pF
) 50 MHz/V See Figure 10
VCO
= 3.3 V ± 5%; VS ≤ VCP ≤ 5.25 V; TA = 25°C; RSET = 4.12 kΩ; CPRSET = 5.1 kΩ,
S_LVPECL
and TA (−40°C to +85°C) variation.
S
V This is nominally 2.5 V to 3.3 V ± 5%
S
5.25 V This is nominally 3.3 V to 5.0 V ± 5%
Sets internal CP current range, nominally 4.8 mA (CP_lsb = 600 μA);
tual current can be calculated by: CP_lsb = 3.06/CPRSET; connect to ground
ac
≤ VS when using internal VCO; outside of this
V
CP
range, the CP spurs may increase due to CP up/ down mismatch
Differential mode (can accommodate single­ended input by ac grounding undriven input)
Frequencies below about 1 MHz should be
coupled; be careful to match V
dc­PLL figure of merit increases with increasing
te; see Figure 14
slew ra
1.30 1.50 1.60 V
4.4 5.3 6.4 kΩ Self-biased
Self-bias voltage of REFIN
1
1
Each pin, REFIN/REFIN
CM
1
1
(REF1/REF2)
(self-bias voltage)
Rev. 0 | Page 4 of 80
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Parameter Min Typ Max Unit Test Conditions/Comments
PHASE/FREQUENCY DETECTOR (PFD)
PFD Input Frequency 100 MHz Antibacklash pulse width = 1.3 ns, 2.9 ns 45 MHz Antibacklash pulse width = 6.0 ns Antibacklash Pulse Width 1.3 ns 0x17<1:0> = 01b
2.9 ns 0x17<1:0> = 00b; 0x17<1:0> = 11b
6.0 ns 0x17<1:0> = 10b
CHARGE PUMP (CP)
ICP Sink/Source Programmable
High Value 4.8 mA With CPRSET = 5.1 kΩ
Low Value 0.60 mA
Absolute Accuracy 2.5 % CPV = VCP/2 V
CPRSET Range 2.7/10 ICP High Impedance Mode Leakage 1 nA Sink-and-Source Current Matching 2 % 0.5 < CPV < VCP − 0.5 V ICP vs. V
CP
ICP vs. Temperature 2 % CPV = VCP /2 V
PRESCALER (PART OF N DIVIDER)
Prescaler Input Frequency
P = 1 FD 300 MHz
P = 2 FD 600 MHz
P = 3 FD 900 MHz
P = 2 DM (2/3) 600 MHz
P = 4 DM (4/5) 1000 MHz
P = 8 DM (8/9) 2400 MHz
P = 16 DM (16/17) 3000 MHz
P = 32 DM (32/33) 3000 MHz Prescaler Output Frequency 300 MHz
PLL DIVIDER DELAYS Register 0x19: R<5:3>, N<2:0>; see Tab le 53
000 Off 001 330 ps 010 440 ps 011 550 ps 100 660 ps 101 770 ps 110 880 ps 111 990 ps
NOISE CHARACTERISTICS
In-Band Phase Noise of the Charge Pump/Phase Frequency Detector (In-Band Means Within the LBW of the PLL)
@ 500 kHz PFD Frequency −165 dBc/Hz
@ 1 MHz PFD Frequency −162 dBc/Hz
@ 10 MHz PFD Frequency −151 dBc/Hz
@ 50 MHz PFD Frequency −143 dBc/Hz PLL Figure of Merit (FOM) −220 dBc/Hz
1.5 % 0.5 < CPV < VCP − 0.5 V
A, B counter input frequency (prescaler
equency divided by P)
input fr
The PLL in-band phase noise floor is estimated by measuring the in-band phase noise at the output of the VCO and subtracting 20 log(N) (where N is the value of the N divider)
Reference slew rate > 0.25 V/ns. FOM + 10 log(f is an approximation of the PFD/CP in-band phase noise (in the flat region) inside the PLL loop bandwidth; when running closed loop, the phase noise, as observed at the VCO output, is increased by 20 log(N)
PFD
)
Rev. 0 | Page 5 of 80
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Parameter Min Typ Max Unit Test Conditions/Comments
PLL DIGITAL LOCK DETECT WINDOW
Required to Lock (Coincidence of Edges) Selected by 0x17<1:0> and 0x18<4>
Low Range (ABP 1.3 ns, 2.9 ns) 3.5 ns 0x17<1:0> = 00b, 01b,11b; 0x18<4> = 1b High Range (ABP 1.3 ns, 2.9 ns) 7.5 ns 0x17<1:0> = 00b, 01b, 11b; 0x18<4> = 0b High Range (ABP 6 ns) 3.5 ns 0x17<1:0> = 10b; 0x18<4> = 0b
To Unlock After Lock (Hysteresis)
Low Range (ABP 1.3 ns, 2.9 ns) 7 ns 0x17<1:0> = 00b, 01b, 11b; 0x18<4> = 1b High Range (ABP 1.3 ns, 2.9 ns) 15 ns 0x17<1:0> = 00b, 01b, 11b; 0x18<4> = 0b High Range (ABP 6 ns) 11 ns 0x17<1:0> = 10b; 0x18<4> = 0b
1
REFIN and
2
For reliable operation of the digital lock detect, the period of the PFD frequency must be greater than the unlock-after-lock time.
REFIN
self-bias points are offset slightly to avoid chatter on an open input condition.

CLOCK INPUTS

Table 3.
Parameter Min Typ Max Unit Test Conditions/Comments
CLOCK INPUTS (CLK, CLK)
Input Frequency 0 0 Input Sensitivity, Differential 150 mV p-p
Input Level, Differential 2 V p-p
Input Common-Mode Voltage, V Input Common-Mode Range, V Input Sensitivity, Single-Ended 150 mV p-p
Input Resistance 3.9 4.7 5.7 Self-biased Input Capacitance 2 pF
1
Below about 1 MHz, the input should be dc-coupled. Care should be taken to match VCM.
CMR
2
2
Signal available at LD, STATUS, and REFMON pins when se
lected by appropriate register settings
Differential input
1
2.4 GHz High frequency distribution (VCO divider)
1
1.6 GHz Distribution only (VCO divider bypassed) Measured at 2.4 GHz; jitter performance is improved
w rates > 1 V/ns
with sle Larger voltage swings may turn on the protection
diodes and can degr
CM
1.3 1.57 1.8 V Self-biased; enables ac coupling
ade jitter performance
1.3 1.8 V With 200 mV p-p signal applied; dc-coupled CLK ac-coupled; CLK
ac-bypassed to RF ground

CLOCK OUTPUTS

Table 4.
Parameter Min Typ Max Unit Test Conditions/Comments
LVPECL CLOCK OUTPUTS Termination = 50 Ω to VS − 2 V
OUT0, OUT1, OUT2, OUT3
Differential (OUT, Output Frequency, Maximum 2950 MHz Using direct to output; see Figure 25 Output High Voltage (VOH) VS − 1.12 VS − 0.98 VS − 0.84 V Output Low Voltage (VOL) VS − 2.03 VS − 1.77 VS − 1.49 V Output Differential Voltage (VOD) 550 790 980 mV
LVDS CLOCK OUTPUTS Differential termination 100 Ω @ 3.5 mA
OUT4, OUT5, OUT6, OUT7
Differential (OUT, Output Frequency 800 MHz See Figure 26 Differential Output Voltage (VOD) 247 360 454 mV Delta V
OD
25 mV Output Offset Voltage (VOS) 1.125 1.24 1.375 V Delta V
OS
25 mV Short-Circuit Current (ISA, ISB) 14 24 mA Output shorted to GND
Rev. 0 | Page 6 of 80
OUT
OUT
)
)
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Parameter Min Typ Max Unit Test Conditions/Comments
CMOS CLOCK OUTPUTS
OUT4A, OUT4B, OUT5A, OUT5B, OUT6A, OUT6B, OUT7A, OUT7B
Output Frequency 250 MHz See Figure 27 Output Voltage High (VOH) VS − 0.1 V @ 1 mA load Output Voltage Low (VOL) 0.1 V @ 1 mA load

TIMING CHARACTERISTICS

Table 5.
Parameter Min Typ Max Unit Test Conditions/Comments
LVPECL Termination = 50 Ω to VS − 2 V; level = 810 mV
Output Rise Time, t Output Fall Time, t
PROPAGATION DELAY, t
High Frequency Clock Distribution Configuration 835 995 1180 ps See Figure 42 Clock Distribution Configuration 773 933 1090 ps See Figure 44 Variation with Temperature 0.8 ps/°C
OUTPUT SKEW, LVPECL OUTPUTS
LVPECL Outputs That Share the Same Divider 5 15 ps LVPECL Outputs on Different Dividers 13 40 ps All LVPECL Outputs Across Multiple Parts 220 ps
LVDS Termination = 100 Ω differential; 3.5 mA
Output Rise Time, t Output Fall Time, t
PROPAGATION DELAY, t
For All Divide Values 1.4 1.8 2.1 ns Variation with Temperature 1.25 ps/°C
OUTPUT SKEW, LVDS OUTPUTS
LVDS Outputs That Share the Same Divider 6 62 ps LVDS Outputs on Different Dividers 25 150 ps All LVDS Outputs Across Multiple Parts 430 ps
CMOS Termination = open
Output Rise Time, t Output Fall Time, t
PROPAGATION DELAY, t
For All Divide Values 1.6 2.1 2.6 ns Variation with Temperature 2.6 ps/°C
OUTPUT SKEW, CMOS OUTPUTS
CMOS Outputs That Share the Same Divider 4 66 ps All CMOS Outputs on Different Dividers 28 180 ps All CMOS Outputs Across Multiple Parts 675 ps
DELAY ADJUST
Shortest Delay Range
Zero Scale 50 315 680 ps 0xA2 (0xA5) (0xA8) (0xAB) <5:0> 000000b Full Scale 540 880 1180 ps 0xA2 (0xA5) (0xA8) (0xAB) <5:0> 101111b
Longest Delay Range
Zero Scale 200 570 950 ps 0xA2 (0xA5) (0xA8) (0xAB) <5:0> 000000b
Quarter Scale 1.72 2.31 2.89 ns 0xA2 (0xA5) (0xA8) (0xAB) <5:0> 001100b
Full Scale 5.7 8.0 10.1 ns 0xA2 (0xA5) (0xA8) (0xAB) <5:0> 101111b
RP
FP
, CLK-TO-LVPECL OUTPUT
PECL
1
RL
FL
, CLK-TO-LVDS OUTPUT Delay off on all outputs
LVDS
1
RC
FC
, CLK-TO-CMOS OUTPUT Fine delay off
CMOS
1
3
4
4
Single-ended; termination = 10 pF
70 180 ps 20% to 80%, measured differentially 70 180 ps 80% to 20%, measured differentially
170 350 ps 20% to 80%, measured differentially 160 350 ps 20% to 80%, measured differentially
2
2
Delay off on all outputs
495 1000 ps 20% to 80%, C 475 985 ps 80% to 20%, C
LOAD
LOAD
= 10 pF = 10 pF
Fine delay off
LVDS and CMOS 0xA1 (0xA4) (0xA7) (0xAA) <5:0> 101111b
0xA1 (0xA4) (0xA7) (0xAA) <5:0> 000000b
Rev. 0 | Page 7 of 80
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Parameter Min Typ Max Unit Test Conditions/Comments
Delay Variation with Temperature
Short Delay Range
Zero Scale 0.23 ps/°C Full Scale −0.02 ps/°C
Long Delay Range
Zero Scale 0.3 ps/°C Full Scale 0.24 ps/°C
1
This is the difference between any two similar delay paths while operating at the same voltage and temperature.
2
Corresponding CMOS drivers set to A for noninverting, and B for inverting.
3
The maximum delay that can be used is a little less than one-half the period of the clock. A longer delay disables the output.
4
Incremental delay; does not include propagation delay.
5
All delays between zero scale and full scale can be estimated by linear interpolation.

CLOCK OUTPUT ADDITIVE PHASE NOISE (DISTRIBUTION ONLY; VCO DIVIDER NOT USED)

Table 6.
Parameter Min Typ Max Unit Test Conditions/Comments
CLK-TO-LVPECL ADDITIVE PHASE NOISE
CLK = 1 GHz, OUTPUT = 1 GHz Input slew rate > 1 V/ns Divider = 1
@ 10 Hz Offset −109 dBc/Hz @ 100 Hz Offset −118 dBc/Hz @ 1 kHz Offset −130 dBc/Hz @ 10 kHz Offset −139 dBc/Hz @ 100 kHz Offset −144 dBc/Hz @ 1 MHz Offset −146 dBc/Hz
@ 10 MHz Offset −147 dBc/Hz
@ 100 MHz Offset −149 dBc/Hz CLK = 1 GHz, OUTPUT = 200 MHz Input slew rate > 1 V/ns Divider = 5
@ 10 Hz Offset −120 dBc/Hz @ 100 Hz Offset −126 dBc/Hz @ 1 kHz Offset −139 dBc/Hz @ 10 kHz Offset −150 dBc/Hz @ 100 kHz Offset −155 dBc/Hz @ 1 MHz Offset −157 dBc/Hz
>10 MHz Offset −157 dBc/Hz
CLK-TO-LVDS ADDITIVE PHASE NOISE
CLK = 1.6 GHz, OUTPUT = 800 MHz Input slew rate > 1 V/ns Divider = 2
@ 10 Hz Offset −103 dBc/Hz @ 100 Hz Offset −110 dBc/Hz @ 1 kHz Offset −120 dBc/Hz @ 10 kHz Offset −127 dBc/Hz @ 100 kHz Offset −133 dBc/Hz @ 1 MHz Offset −138 dBc/Hz @ 10 MHz Offset −147 dBc/Hz @ 100 MHz Offset −149 dBc/Hz
5
5
Distribution section only; does not include PLL and
VCO
Distribution section only; does not include PLL and
VCO
Rev. 0 | Page 8 of 80
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Parameter Min Typ Max Unit Test Conditions/Comments
CLK = 1.6 GHz, OUTPUT = 400 MHz Input slew rate > 1 V/ns Divider = 4
@ 10 Hz Offset −114 dBc/Hz @ 100 Hz Offset −122 dBc/Hz @ 1 kHz Offset −132 dBc/Hz @ 10 kHz Offset −140 dBc/Hz @ 100 kHz Offset −146 dBc/Hz @ 1 MHz Offset −150 dBc/Hz >10 MHz Offset −155 dBc/Hz
CLK-TO-CMOS ADDITIVE PHASE NOISE
CLK = 1 GHz, OUTPUT = 250 MHz Input slew rate > 1 V/ns Divider = 4
@ 10 Hz Offset −110 dBc/Hz @ 100 Hz Offset −120 dBc/Hz @ 1 kHz Offset −127 dBc/Hz @ 10 kHz Offset −136 dBc/Hz @ 100 kHz Offset −144 dBc/Hz @ 1 MHz Offset −147 dBc/Hz
>10 MHz Offset −154 dBc/Hz CLK = 1 GHz, OUTPUT = 50 MHz Input slew rate > 1 V/ns Divider = 20
@ 10 Hz Offset −124 dBc/Hz
@ 100 Hz Offset −134 dBc/Hz
@ 1 kHz Offset −142 dBc/Hz
@ 10 kHz Offset −151 dBc/Hz
@ 100 kHz Offset −157 dBc/Hz
@ 1 MHz Offset −160 dBc/Hz
>10 MHz Offset −163 dBc/Hz
Distribution section only; does not include PLL and
VCO

CLOCK OUTPUT ABSOLUTE PHASE NOISE (INTERNAL VCO USED)

Table 7.
Parameter Min Typ Max Unit Test Conditions/Comments
LVPECL ABSOLUTE PHASE NOISE Internal VCO; direct to LVPECL output
VCO = 2.335 GHz; OUTPUT = 2.335 GHz
@ 1 kHz Offset −46 dBc/Hz
@ 10 kHz Offset −78 dBc/Hz
@ 100 kHz Offset −105 dBc/Hz
@ 1 MHz Offset −124 dBc/Hz
@ 10 MHz Offset −141 dBc/Hz
@ 40 MHz Offset −146 dBc/Hz VCO = 2.175 GHz; OUTPUT = 2.175 GHz
@ 1 kHz Offset −51 dBc/Hz
@ 10 kHz Offset −80 dBc/Hz
@ 100 kHz Offset −107 dBc/Hz
@ 1 MHz Offset −124 dBc/Hz
@ 10 MHz Offset −142 dBc/Hz
@ 40 MHz Offset −146 dBc/Hz
Rev. 0 | Page 9 of 80
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Parameter Min Typ Max Unit Test Conditions/Comments
VCO = 2.05 GHz; OUTPUT = 2.05 GHz
@ 1 kHz Offset −53 dBc/Hz @ 10 kHz Offset −82 dBc/Hz @ 100 kHz Offset −108 dBc/Hz @ 1 MHz Offset −127 dBc/Hz @ 10 MHz Offset −142 dBc/Hz @ 40 MHz Offset −147 dBc/Hz

CLOCK OUTPUT ABSOLUTE TIME JITTER (CLOCK GENERATION USING INTERNAL VCO)

Table 8.
Parameter Min Typ Max Unit Test Conditions/Comments
LVPECL OUTPUT ABSOLUTE TIME JITTER
VCO = 2.21 GHz; LVPECL = 245.76 MHz; PLL LBW = 138 kHz 146 fS rms Integration BW = 200 kHz to 10 MHz 329 fS rms Integration BW = 12 kHz to 20 MHz VCO = 2.21 GHz; LVPECL = 122.88 MHz; PLL LBW = 138 kHz 151 fS rms Integration BW = 200 kHz to 10 MHz 329 fS rms Integration BW = 12 kHz to 20 MHz VCO = 2.21 GHz; LVPECL = 61.44 MHz; PLL LBW = 138 kHz 203 fS rms Integration BW = 200 kHz to 10 MHz 376 fS rms Integration BW = 12 kHz to 20 MHz
Application example based on a typical setup wher clean, so a wider PLL loop bandwidth is used; reference = 15.36 MHz; R = 1
e the reference source is

CLOCK OUTPUT ABSOLUTE TIME JITTER (CLOCK CLEANUP USING INTERNAL VCO)

Table 9.
Parameter Min Typ Max Unit Test Conditions/Comments
LVPECL OUTPUT ABSOLUTE TIME JITTER
VCO = 2.18 GHz; LVPECL = 155.52 MHz; PLL LBW = 125 Hz 515 fS rms Integration BW = 12 kHz to 20 MHz VCO = 2.21 GHz; LVPECL = 122.88 MHz; PLL LBW = 125 Hz 570 fS rms Integration BW = 12 kHz to 20 MHz
Application example based on a typical setup wher jittery, so a narrower PLL loop bandwidth is used; reference = 10.0 MHz; R = 20
e the reference source is

CLOCK OUTPUT ABSOLUTE TIME JITTER (CLOCK GENERATION USING EXTERNAL VCXO)

Table 10.
Parameter Min Typ Max Unit Test Conditions/Comments
LVPECL OUTPUT ABSOLUTE TIME JITTER
LVPECL = 245.76 MHz; PLL LBW = 125 Hz 54 fS rms Integration BW = 200 kHz to 5 MHz 77 fS rms Integration BW = 200 kHz to 10 MHz 109 fS rms Integration BW = 12 kHz to 20 MHz LVPECL = 122.88 MHz; PLL LBW = 125 Hz 79 fS rms Integration BW = 200 kHz to 5 MHz 114 fS rms Integration BW = 200 kHz to 10 MHz 163 fS rms Integration BW = 12 kHz to 20 MHz LVPECL = 61.44 MHz; PLL LBW = 125 Hz 124 fS rms Integration BW = 200 kHz to 5 MHz 176 fS rms Integration BW = 200 kHz to 10 MHz 259 fS rms Integration BW = 12 kHz to 20 MHz
Application example based on a typical setup using an
ternal 245.76 MHz VCXO (Toyocom TCO-2112);
ex reference = 15.36 MHz; R = 1
Rev. 0 | Page 10 of 80
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CLOCK OUTPUT ADDITIVE TIME JITTER (VCO DIVIDER NOT USED)

Table 11.
Parameter Min Typ Max Unit Test Conditions/Comments
LVPECL OUTPUT ADDITIVE TIME JITTER
CLK = 622.08 MHz; LVPECL = 622.08 MHz; Divider = 1 40 fS rms BW = 12 kHz to 20 MHz CLK = 622.08 MHz; LVPECL = 155.52 MHz; Divider = 4 80 fS rms BW = 12 kHz to 20 MHz CLK = 1.6 GHz; LVPECL = 100 MHz; Divider = 16 215 fS rms
CLK = 500 MHz; LVPECL = 100 MHz; Divider = 5 245 fS rms
LVDS OUTPUT ADDITIVE TIME JITTER
CLK = 1.6 GHz; LVDS = 800 MHz; Divider = 2; VCO Divider Not Used 85 fS rms BW = 12 kHz to 20 MHz CLK = 1 GHz; LVDS = 200 MHz; Divider = 5 113 fS rms BW = 12 kHz to 20 MHz CLK = 1.6 GHz; LVDS = 100 MHz; Divider = 16 280 fS rms
CMOS OUTPUT ADDITIVE TIME JITTER
CLK = 1.6 GHz; CMOS = 100 MHz; Divider = 16 365 fS rms
Distribution section only; does not include PLL and clock signal
Calculated from SNR of ADC method;
C not used for even divides
DC Calculated from SNR of ADC method;
C on
DC Distribution section only; does not
include PLL and clock signal
Calculated from SNR of ADC method;
C not used for even divides
DC Distribution section only; does not
include PLL and clock signal
Calculated from SNR of ADC method;
C not used for even divides
DC
VCO; rising edge of
VCO; rising edge of
VCO; rising edge of

CLOCK OUTPUT ADDITIVE TIME JITTER (VCO DIVIDER USED)

Table 12.
Parameter Min Typ Max Unit Test Conditions/Comments
LVPECL OUTPUT ADDITIVE TIME JITTER
CLK = 2.4 GHz; VCO DIV = 2; LVPECL = 100 MHz; Divider = 12; Duty-Cycle Correction = Off
LVDS OUTPUT ADDITIVE TIME JITTER
CLK = 2.4 GHz; VCO DIV = 2; LVDS = 100 MHz; Divider = 12; Duty-Cycle Correction = Off
CMOS OUTPUT ADDITIVE TIME JITTER
CLK = 2.4 GHz; VCO DIV = 2; CMOS = 100 MHz; Divider = 12; Duty-Cycle Correction = Off
210 f
285 f
350 f
Distribution section only; does not include PLL and VCO;
ising edge of clock signal
uses r
rms Calculated from SNR of ADC method
S
Distribution section only; does not include PLL and VCO;
ising edge of clock signal
uses r
rms Calculated from SNR of ADC method
S
Distribution section only; does not include PLL and VCO;
ising edge of clock signal
uses r
rms Calculated from SNR of ADC method
S
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DELAY BLOCK ADDITIVE TIME JITTER

Table 13.
Parameter Min Typ Max Unit Test Conditions/Comments
DELAY BLOCK ADDITIVE TIME JITTER
100 MHz Output
Delay (1600 μA, 1C) Fine Adj. 000000 0.54 ps rms Delay (1600 μA, 1C) Fine Adj. 101111 0.60 ps rms Delay (800 μA, 1C) Fine Adj. 000000 0.65 ps rms Delay (800 μA, 1C) Fine Adj. 101111 0.85 ps rms Delay (800 μA, 4C) Fine Adj. 000000 0.79 ps rms Delay (800 μA, 4C) Fine Adj. 101111 1.2 ps rms Delay (400 μA, 4C) Fine Adj. 000000 1.2 ps rms Delay (400 μA, 4C) Fine Adj. 101111 2.0 ps rms Delay (200 μA, 1C) Fine Adj. 000000 1.3 ps rms Delay (200 μA, 1C) Fine Adj. 101111 2.5 ps rms Delay (200 μA, 4C) Fine Adj. 000000 1.9 ps rms Delay (200 μA, 4C) Fine Adj. 101111 3.8 ps rms
1
This value is incremental. That is, it is in addition to the jitter of the LVDS or CMOS output without the delay. To estimate the total jitter, the LVDS or CMOS output jitter
should be added to this value using the root sum of the squares (RSS) method.
1
Incremental additive jitter

SERIAL CONTROL PORT

Table 14.
Parameter Min Typ Max Unit Test Conditions/Comments
CS (INPUT)
Input Logic 1 Voltage 2.0 V Input Logic 0 Voltage 0.8 V Input Logic 1 Current 3 μA Input Logic 0 Current 110 μA Input Capacitance 2 pF
SCLK (INPUT) SCLK has an internal 30 kΩ pull-down resistor
Input Logic 1 Voltage 2.0 V Input Logic 0 Voltage 0.8 V Input Logic 1 Current 110 μA Input Logic 0 Current 1 μA Input Capacitance 2 pF
SDIO (WHEN INPUT)
Input Logic 1 Voltage 2.0 V Input Logic 0 Voltage 0.8 V Input Logic 1 Current 10 nA Input Logic 0 Current 20 nA Input Capacitance 2 pF
SDIO, SDO (OUTPUTS)
Output Logic 1 Voltage 2.7 V Output Logic 0 Voltage 0.4 V
CS has an internal 30 kΩ pull-up resistor
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Parameter Min Typ Max Unit Test Conditions/Comments
TIMING
Clock Rate (SCLK, 1/t Pulse Width High, t Pulse Width Low, t SDIO to SCLK Setup, t SCLK to SDIO Hold, t SCLK to Valid SDIO and SDO, t CS to SCLK Setup and Hold, tS, t CS Minimum Pulse Width High, t
PD
,
SYNC
, AND
Table 15.
Parameter Min Typ Max Unit Test Conditions/Comments
INPUT CHARACTERISTICS These pins each have a 30 kΩ internal pull-up resistor
Logic 1 Voltage 2.0 V Logic 0 Voltage 0.8 V Logic 1 Current 110 μA Logic 0 Current 1 μA Capacitance 2 pF
RESET TIMING
Pulse Width Low 50 ns
SYNC TIMING
Pulse Width Low 1.5 High speed clock cycles High speed clock is CLK input signal

LD, STATUS, REFMON PINS

) 25 MHz
SCLK
HI
LO
DS
DH
RESET
DV
H
PWH
PINS
16 ns 16 ns 2 ns
1.1 ns 8 ns 2 ns 3 ns
Table 16.
Parameter Min Typ Max Unit Test Conditions/Comments
OUTPUT CHARACTERISTICS
Output Voltage High (VOH) 2.7 V Output Voltage Low (VOL) 0.4 V
MAXIMUM TOGGLE RATE 100 MHz
ANALOG LOCK DETECT
Capacitance 3 pF
REF1, REF2, AND VCO FREQUENCY STATUS MONITOR
Normal Range 1.02 MHz
Extended Range 8 kHz
LD PIN COMPARATOR
Trip Point 1.6 V Hysteresis 260 mV
When selected as a digital output (CMOS); there are other modes in outputs; see Tab le 53, 0x17, 0x1A, and 0x1B
Applies when mux is set to an or PFD up/down pulse; also applies in analog lock detect mode; usually debug mode only; beware that spurs may couple to output when any of these pins are toggling
On-chip capacitance; used to calculate RC time constant
or analog lock detect readback; use a pull-up resistor
f
Frequency above which the monitor indicates the
esence of the reference
pr Frequency above which the monitor indicates the
esence of the reference
pr
which these pins are not CMOS digital
y divider or counter output,
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POWER DISSIPATION

Table 17.
Parameter Min Typ Max Unit Test Conditions/Comments
POWER DISSIPATION, CHIP
Power-On Default 1.0 1.2 W
Full Operation; CMOS Outputs at 195 MHz 1.4 2.0 W
Full Operation; LVDS Outputs at 195 MHz 1.4 2.1 W
PD
Power-Down
PD
Power-Down, Maximum Sleep
VCP Supply 1.5 mW PLL operating; typical closed-loop configuration
POWER DELTAS, INDIVIDUAL FUNCTIONS Power delta when a function is enabled/disabled
VCO Divider 30 mW VCO divider not used REFIN (Differential) 20 mW All references off to differential reference enabled REF1, REF2 (Single-Ended) 4 mW
VCO 70 mW CLK input selected to VCO selected PLL 75 mW PLL off to PLL on, normal operation; no reference enabled Channel Divider 30 mW Divider bypassed to divide-by-2 to divide-by-32 LVPECL Channel (Divider Plus Output Driver) 160 mW No LVPECL output on to one LVPECL output on LVPECL Driver 90 mW Second LVPECL output turned on, same channel LVDS Channel (Divider Plus Output Driver) 120 mW No LVDS output on to one LVDS output on LVDS Driver 50 mW Second LVDS output turned on, same channel CMOS Channel (Divider Plus Output Driver) 100 mW Static; no CMOS output on to one CMOS output on CMOS Driver (Second in Pair) 0 mW Static; second CMOS output, same pair, turned on CMOS Driver (First in Second Pair) 30 mW Static; first output, second pair, turned on Fine Delay Block 50 mW
75 185 mW
31 mW
No clock; no programming; defa does not include power dissipated in external resistors
PLL on; internal VCO = 2335 MHz; VCO divider = 2;
annel dividers on; six LVPECL outputs @ 584 MHz;
all ch eight CMOS outputs (10 pF load) @ 195 MHz; all fine delay on, maximum current; does not include power dissipated in external resistors
PLL on; internal VCO = 2335 MHz, VCO divider = 2; all channel dividers on; six L four LVDS outputs @ 195 MHz; all fine delay on, maximum current; does not include power dissipated in external resistors
PD
pin pulled low; does not include power dissipated
in terminations PD
pin pulled low; PLL power-down 0x10<1:0> = 01b; SYNC power-down 0x230<2> = 1b; REF for distribution power-down 0x230<1> = 1b
All references off to REF1 or REF2 enabled; differential
ference not enabled
re
Delay block off to delay block enabled; maximum
ent setting
curr
ult register values;
VPECL outputs @ 584 MHz;
Rev. 0 | Page 14 of 80
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TIMING DIAGRAMS

t
CLK
CL
DIFFERENTIAL
80%
20%
t
LVDS
t
PECL
LVDS
t
CMOS
Figure 2. CLK/
DIFFERENTIAL
80%
20%
Figure 3. LVPECL Timing, Differential
CLK
to Clock Output Timing, DIV = 1
LVPECL
t
RP
t
RL
06426-060
Figure 4. LVDS Timing, Differential
SINGL E-ENDE D
80%
CMOS
10pF LOAD
20%
t
FP
06426-061
t
RC
Figure 5. CMOS Timing, Single-End
t
FL
t
FC
ed, 10 pF Load
06426-062
06426-063
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ABSOLUTE MAXIMUM RATINGS

Table 18.
With
Parameter or Pin
VS, VS_LVPECL GND −0.3 V to +3.6 V VCP GND −0.3 V to +5.8 V REFIN, REFIN REFIN RSET GND −0.3 V to VS + 0.3 V CPRSET GND −0.3 V to VS + 0.3 V CLK, CLK CLK
SCLK, SDIO, SDO, CS OUT0, OUT0, OUT1, OUT1,
OUT2, OUT2 OUT4, OUT4, OUT5, OUT5, OUT6, OUT6, OUT7, OUT7
SYNC REFMON, STATUS, LD GND −0.3 V to VS + 0.3 V Junction Temperature Storage Temperature Range −65°C to +150°C Lead Temperature (10 sec) 300°C
1
See Table 19 for θJA.
, OUT3, OUT3,
1
Respec
t To Rating
GND −0.3 V to VS + 0.3 V REFIN
GND −0.3 V to VS + 0.3 V CLK GND −0.3 V to VS + 0.3 V GND −0.3 V to VS + 0.3 V
GND −0.3 V to V
150°C
−3.3 V to +3.3 V
−1.2 V to +1.2 V
+ 0.3 V
S
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

THERMAL RESISTANCE

Table 19.
Package Type
48-Lead LFCSP 28.5 °C/W
1
Thermal impedance measurements were taken on a 4-layer board in still air
in accordance with EIA/JESD51-7.
1
θ
JA
Unit

ESD CAUTION

Rev. 0 | Page 16 of 80
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PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

REFIN (REF 1)
REFIN (REF 2)
CPRSETVSRSETVSOUT0
4847464544434241403938
OUT0
VS_LVPECL
OUT1
OUT1
VS
37
REFMON
LD
VCP
CP
STATUS
REF_SEL
SYNC
BYPASS
VS
CLK
CLK
1
PIN 1
2
INDICAT OR
3
4
5
6
7
8
LF
9
10
11
12
AD9517-2
TOP VIEW
(Not to Scale)
13141516171819
CS
SCLK
PD
SDO
SDIO
RESET
2021222324
OUT2
OUT2
S_LVPECL
OUT3
36
S
V
35
OUT4 (OUT4A)
34
OUT4 (OUT4B)
33
OUT5 (OUT5A)
32
OUT5 (OUT5B)
31
VS
30
VS
29
OUT7 (OUT7B)
28
OUT7 (OUT7A)
27
OUT6 (OUT6B)
26
OUT6 (OUT6A)
25
S
V
VS
OUT3
06426-003
Figure 6. Pin Configuration
Table 20. Pin Function Descriptions
Pin No. Mnemonic Description
1 REFMON Reference Monitor (Output). This pin has multiple selectable outputs; see Tabl e 53 0x1B. 2 LD Lock Detect (Output). This pin has multiple selectable outputs; see Table 5 3 0x1A. 3 VCP 4 CP 5 STATUS 6 REF_SEL 7
SYNC
Power Supply for Charge Pump (CP); VS < VCP < 5.0 V. Charge Pump (Output). Connects to external loop filter. Status (Output). This pin has multiple selectable outputs; see Table 53 0x17. Reference Select. Selects REF1 (low) or REF2 (high). This pin has an internal 30 kΩ pull-down resistor. Manual Synchronizations and Manual Holdover. This pin initiates a manual synchronization and is
also used for manual holdover. Active low. This pin has an internal 30 kΩ pull-up resistor. 8 LF 9 BYPASS 10, 24, 25, 30, 31,
VS
Loop Filter (Input). Connects to VCO control voltage node internally.
This pin is for bypassing the LDO to ground with a capacitor.
3.3 V Power Pins.
36, 37, 43, 45 11 CLK
12
CLK 13 SCLK 14
CS
Along with CLK Along with CLK, this is the differential input for the clock distribution section. Serial Control Port Data Clock Signal. Serial Control Port Chip Select; Active Low. This pin has an internal 30 kΩ pull-up resistor.
, this is the differential input for the clock distribution section.
15 SDO Serial Control Port Unidirectional Serial Data Out. 16 SDIO 17
18
RESET
PD 21, 40 VS_LVPECL 42 OUT0 41
OUT0 39 OUT1 38
OUT1
Serial Control Port Bidirectional Serial Data In/Out. Chip Reset; Active Low. This pin has an internal 30 kΩ pull-up resistor.
Chip Power Down; Active Low. This pin has an internal 30 kΩ pull-up resistor. Extended Voltage 2.5 V to 3.3 V LVPECL Power Pins.
LVPECL Output; One Side of a Differential LVPECL Output. LVPECL Output; One Side of a Differential LVPECL Output. LVPECL Output; One Side of a Differential LVPECL Output. LVPECL Output; One Side of a Differential LVPECL Output.
19 OUT2 LVPECL Output; One Side of a Differential LVPECL Output.
Rev. 0 | Page 17 of 80
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Pin No. Mnemonic Description
20 22 OUT3 LVPECL Output; One Side of a Differential LVPECL Output. 23 35 OUT4 (OUT4A) LVDS/CMOS Output; One Side of a Differential LVDS Output, or a Single-Ended CMOS Output. 34 33 OUT5 (OUT5A) LVDS/CMOS Output; One Side of a Differential LVDS Output, or a Single-Ended CMOS Output. 32 26 OUT6 (OUT6A) LVDS/CMOS Output; One Side of a Differential LVDS Output, or a Single-Ended CMOS Output. 27 28 OUT7 (OUT7A) LVDS/CMOS Output; One Side of a Differential LVDS Output, or a Single-Ended CMOS Output. 29 44 RSET Resistor connected here sets internal bias currents. Nominal value = 4.12 kΩ. 46 CPRSET Resistor connected here sets the CP current range. Nominal value = 5.1 kΩ. 47
48 REFIN (REF1)
EPAD GND Ground; External Paddle (EPAD). This is the only ground for the part.
OUT2
OUT3
(OUT4B)
OUT4
(OUT5B)
OUT5
(OUT6B)
OUT6
(OUT7B)
OUT7
(REF2) Along with REFIN, this is the differential input for the PLL reference. Alternatively, this pin is a
REFIN
LVPECL Output; One Side of a Differential LVPECL Output.
LVPECL Output; One Side of a Differential LVPECL Output.
LVDS/CMOS Output; One Side of a Differential LVDS Output, or a Single-Ended CMOS Output.
LVDS/CMOS Output; One Side of a Differential LVDS Output, or a Single-Ended CMOS Output.
LVDS/CMOS Output; One Side of a Differential LVDS Output, or a Single-Ended CMOS Output.
LVDS/CMOS Output; One Side of a Differential LVDS Output, or a Single-Ended CMOS Output.
single-ended input for REF2. Along with REFIN
single-ended input for REF1.
, this is the differential input for the PLL reference. Alternatively, this pin is a
Rev. 0 | Page 18 of 80
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TYPICAL PERFORMANCE CHARACTERISTICS

240
220
200
180
160
CURRENT (mA)
140
120
100
0 500 1000 1500 2000 2500 3000
Figure 7. Current vs. Frequency, Direct
2 CHANNELS—4 LVPE CL
2 CHANNELS—2 LVPE CL
1 CHANNEL—1 LVPECL
FREQUENCY (MHz)
to Output, LVPECL Outputs
06426-007
180
2 CHANNELS—4 LVDS
160
140
120
CURRENT (mA)
100
80
0 200 400 600 800
2 CHANNELS—2 LVDS
1 CHANNEL—1 LVDS
FREQUENCY (MHz )
06426-008
Figure 8. Current vs. Frequency—LVDS Outputs
240
220
200
180
160
140
CURRENT (mA)
120
100
2 CHANNELS—8 CMOS
2 CHANNELS—2 CMOS
1 CHANNEL—2 CMOS
80
02
FREQUENCY (MHz )
1 CHANNEL—1 CMOS
010050
5020015
06426-009
Figure 9. Current vs. Frequency—CMOS Outputs
48
46
44
42
40
(MHz/V)
38
VCO
K
36
34
32
30
2.00 2.05 2.10 2.15 2.20 2. 25 2. 30 2. 35
VCO FREQUENCY (GHz)
Figure 10. VCO K
vs. Frequency
VCO
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
CURRENT FROM CP PIN (mA)
1.0
0.5
PUMP DOWN PUMP UP
0
0 0.5 1.0 1.5 2.0 2.5 3.0
VOLTAGE ON CP PIN (V)
Figure 11. Charge Pump Characteristics @ VCP = 3.3 V
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
CURRENT FROM CP PIN (mA)
1.0
0.5
0
PUMP DOWN PUMP UP
0 0.5 1.0 1.5 2.0 3.0 4.02.5 3.5 5. 04.5
VOLTAGE ON CP PIN (V)
Figure 12. Charge Pump Characteristics @ VCP = 5.0 V
06426-010
06426-011
06426-012
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140
–145
–150
–155
(dBc/Hz)
–160
–165
PFD PHASE NOI SE REFERRED T O PFD INP UT
–170
0.1 1 10010
PFD FREQUENCY (MHz)
Figure 13. PFD Phase Noise Referred to PFD Input vs. PFD Frequency
210
–212
–214
–216
–218
–220
PLL FIGURE OF MERI T (dBc/Hz)
–222
–224
02
Figure 14. PLL Figure
SLEW RATE (V/n s)
of Merit (FOM) vs. Slew Rate at REFIN/
1.9
1.8
1.7
1.6
1.5
1.4
VCO TUNING VO LTAGE (V)
1.3
1.2
2.0 2.42.32.22.1
FREQUENCY (GHz)
Figure 15. VCO Tuning Voltage vs. Frequency
REFIN
10
0
–10
–20
–30
–40
–50
–60
–70
RELATIVE POWER (dB)
–80
–90
–100
–110
CENTER 122.88MHz SPAN 50MHz5MHz/DIV
06426-013
06426-137
Figure 16. PFD/CP Spurs; 122.88 MHz; PFD = 15.36 MHz;
LBW
= 138 kHz; I
10
0
–10
–20
–30
–40
–50
–60
–70
RELATIVE POWER (dB)
–80
–90
–100
–110
.52.01.51.00. 5
06426-136
06426-138
CENTER 122. 88MHz SP AN 1MHz100kHz/DIV
Figure 17. Output Spectrum, LVPECL; 122.88 MHz; PFD = 15.36 MHz;
= 138 kHz; I
LBW
10
0
–10
–20
–30
–40
–50
–60
–70
RELATIVE POWER (dB)
–80
–90
–100
–110
CENTER 122.88MHz SPAN 1MHz100kHz/DIV
= 3.0 mA; F
CP
= 3.0 mA; F
CP
= 2.21 GHz
VCO
= 2.21 GHz
VCO
06426-135
06426-134
Figure 18. Output Spectrum, LVDS; 122.88 MHz; PFD = 15.36 MHz;
LBW
= 138 kHz; I
= 3.0 mA; F
CP
= 2.21 GHz
VCO
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0.4
0.2
0
–0.2
1.0
0.
0.2
6
DIFFERENT IAL OUTPUT (V)
–0.6
–1.0
025
TIME (ns)
2015105
06426-014
Figure 19. LVPECL Output (Differential) @ 100 MHz
–0.2
DIFFERENT IAL OUTPUT (V)
–0.4
021
Figure 22. LVDS Output (Differential) @ 800 MHz
1.0
0.6
0.2
–0.2
DIFFERENT IAL OUTPUT (V)
–0.6
–1.0
021
TIME (ns)
Figure 20. LVPECL Output (Differential) @ 1600 MHz
06426-015
2.8
1.8
OUTPUT (V)
0.8
–0.2
0860 1004020
Figure 23. CMOS Output @ 25 MHz
0.4
TIME (ns)
TIME (ns)
06426-017
0
06426-018
0.2
0
–0.2
DIFFERENT IAL OUTPUT (V)
–0.4
02
TIME (ns)
2015105
5
06426-016
Figure 21. LVDS Output (Differential) @ 100 MHz
Rev. 0 | Page 21 of 80
OUTPUT (V)
2.8
1.8
0.8
–0.2
086121042
Figure 24. CMOS Output @ 250 MHz
TIME (ns)
06426-019
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1600
70
–80
1400
1200
1000
DIFFERENTIAL SWING (mV p-p)
800
0321
FREQUENCY (GHz)
Figure 25. LVPECL Differential Swing vs. Frequency
700
600
DIFFERENT IAL SWING (mV p- p)
500
080070060050040
0300200100
FREQUENCY (MHz )
Figure 26. LVDS Differential Swing vs. Frequency
3
CL = 2pF
–90
–100
–110
–120
PHASE NOISE (dBc/Hz)
–130
–140
–150
10k 100M10M1M100k
06426-020
FREQUENCY (Hz)
06426-023
Figure 28. Internal VCO Phase Noise (Absolute) Direct to LVPECL @ 2335 MHz
80
–90
–100
–110
–120
–130
PHASE NOISE (dBc/Hz)
–140
–150
06426-021
10k 100M10M1M100k
FREQUENCY (Hz)
06426-024
Figure 29. Internal VCO Phase Noise (Absolute) Direct to LVPECL @ 2175 MHz
80
–90
= 10pF
C
L
2
C
= 20pF
OUTPUT SWING (V)
1
0
0 600500400300200100
OUTPUT FREQUENCY (MHz)
Figure 27. CMOS Output Swing vs. Frequency
L
and Capacitive Load
06426-133
Rev. 0 | Page 22 of 80
–100
–110
–120
–130
PHASE NOISE (dBc/Hz)
–140
–150
10k 100M10M1M100k
FREQUENCY (Hz)
06426-025
Figure 30. Internal VCO Phase Noise (Absolute) Direct to LVPECL @ 2050 MHz
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120
–125
–130
110
–120
–135
–140
–145
PHASE NOISE (dBc/Hz)
–150
–155
–160
10 100M10M1M100k10k1k100
Figure 31. Phase Noise (Additive) LV
FREQUENCY (Hz)
PECL @ 245.76 MHz, Divide-by-1
110
–120
–130
–140
PHASE NOISE (dBc/Hz)
–150
–160
10 100M10M1M100k10k1k100
FREQUENCY (Hz)
Figure 32. Phase Noise (Additive) LVPECL @ 200 M
100
Hz, Divide-by-5
–130
–140
PHASE NOISE (dBc/Hz)
–150
–160
10 100M1k 10k 100k 1M 10M100
06426-026
Figure 34. Phase Noise (Additive) LVD
FREQUENCY (Hz)
S @ 200 MHz, Divide-by-1
06426-142
100
–110
–120
–130
PHASE NOISE (dBc/Hz)
–140
–150
10 100M10M1M100k10k1k100
06426-027
Figure 35. Phase Noise (Additive) LVD
FREQUENCY (Hz)
S @ 800 MHz, Divide-by-2
06426-130
120
–110
–120
–130
PHASE NOISE (dBc/Hz)
–140
–150
10 100M10M1M100k10k1k100
Figure 33. Phase Noise (Additive) LVPECL @ 1600 MHz, D
FREQUENCY (Hz)
ivide-by-1
06426-128
Rev. 0 | Page 23 of 80
–130
–140
–150
PHASE NOISE (dBc/Hz)
–160
–170
10 100M10M1M100k10k1k100
FREQUENCY (Hz)
Figure 36. Phase Noise (Additive) CM
OS @ 50 MHz, Divide-by-20
06426-131
AD9517-2
www.BDTIC.com/ADI
100
80
–110
–120
–130
–140
PHASE NOISE (dBc/Hz)
–150
–160
10 100M10M1M100k10k1k100
FREQUENCY (Hz)
Figure 37. Phase Noise (Additive) CM
110
–120
–130
–140
PHASE NOISE (dBc/Hz)
–150
OS @ 250 MHz, Divide-by-4
–90
–100
–110
–120
–130
PHASE NOISE (dBc/Hz)
–140
–150
–160
1k 100M10M1M100k10k
06426-132
FREQUENCY (Hz)
06426-139
Figure 39. Phase Noise (Absolute) Clock Cleanup; Internal VCO @ 2.18 GHz;
P
FD = 19.44 MHz; LBW = 12.8 kHz; LVPECL Output = 155.52 MHz
120
–130
–140
PHASE NOISE (dBc/Hz)
–150
–160
1k 100M10M1M100k10k
FREQUENCY (Hz)
Figure 38. Phase Noise (Absolute) Clock Generation; Internal VCO @
2.2
1 GHz; PFD = 15.36 MHz; LBW = 138 kHz; LVPECL Output = 122.88 MHz
–160
1k 100M10M1M100k10k
06426-141
FREQUENCY (Hz)
06426-140
Figure 40. Phase Noise (Absolute), External VCXO (Toyocom TCO-2112) @
245.76 M
Hz; PFD = 15.36 MHz; LBW = 250 Hz; LVPECL Output = 245.76 MHz
Rev. 0 | Page 24 of 80
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