ANALOG DEVICES AD9517-1 Service Manual

12-Output Clock Generator with

FEATURES

Low phase noise, phase-locked loop
On-chip VCO tunes from 2.30 GHz to 2.65 GHz External VCO/VCXO to 2.4 GHz optional 1 differential or 2 single-ended reference inputs Reference monitoring capability Auto and manual reference switchover/holdover modes Autorecover from holdover Accepts references to 250 MHz Programmable delays in path to PFD Digital or analog lock detect, selectable
2 pairs of 1.6 GHz LVPECL outputs
Each pair shares 1 to 32 dividers with coarse phase delay Additive output jitter 225 f Channel-to-channel skew paired outputs <10 ps
2 pairs of 800 MHz LVDS clock outputs
Each pair shares two cascaded 1 to 32 dividers with coarse
phase delay Additive output jitter 275 f Fine delay adjust (ΔT) on each LVDS output
Eight 250 MHz CMOS outputs (two per LVDS output) Automatic synchronization of all outputs on power-up Manual synchronization of outputs as needed Serial control port 48-lead LFCSP

APPLICATIONS

Low jitter, low phase noise clock distribution Clocking high speed ADCs, DACs, DDSs, DDCs, DUCs, MxFEs High performance wireless transceivers High performance instrumentation Broadband infrastructure AT E

GENERAL DESCRIPTION

The AD9517-11 provides a multi-output clock distribution function with subpicosecond jitter performance, along with an on-chip PLL and VCO. The on-chip VCO tunes from 2.30 GHz to 2.65 GHz. Optionally, an external VCO/VCXO of up to
2.4 GHz may be used.
The AD9517-1 emphasizes low jitter and phase noise to maximize data converter performance and can benefit other applications with demanding phase noise and jitter requirements.
rms
S
rms
S
Integrated 2.5 GHz VCO
AD9517-1

FUNCTIONAL BLOCK DIAGRAM

PLL
ΔT
ΔT
ΔT
ΔT
LF
STATUS
MONITOR
VCO
LVPECL
LVPECL
LVDS/CMOS
LVDS/CMOS
AD9517-1
CP
REF1
REFIN
REF2
SWITCHOVER
AND MONITOR
CLK
DIV/Φ DIV/Φ
DIV/Φ DIV/Φ
SERIAL CONT ROL PORT
DIVIDER
AND MUXs
DIV/Φ
DIV/Φ
AND
DIGITAL LOGIC
Figure 1.
The AD9517-1 features four LVPECL outputs (in two pairs); four LVDS outputs (in two pairs); and eight CMOS outputs (two per LVDS output). The LVPECL outputs operate to
1.6 GHz, the LVDS outputs operate to 800 MHz, and the CMOS outputs operate to 250 MHz.
Each pair of outputs has dividers that allow both the divide ratio and coarse delay (or phase) to be set. The range of division for the LVPECL outputs is 1 to 32. The LVDS/CMOS outputs allow a range of divisions up to a maximum of 1024.
The AD9517-1 is available in a 48-lead LFCSP and can be operated from a single 3.3 V supply. An external VCO, which requires an extended voltage range, can be accommodated by connecting the charge pump supply (VCP) to 5.5 V. A separate LVPECL power supply can be from 2.375 V to 3.6 V.
The AD9517-1 is specified for operation over the industrial range of −40°C to +85°C.
1
AD9517 is used throughout to refer to all the members of the AD9517
family. However, when AD9517-1 is used, it is referring to that specific member of the AD9517 family.
OUT0 OUT1 OUT2 OUT3 OUT4 OUT5 OUT6 OUT7
06425-001
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2007 Analog Devices, Inc. All rights reserved.
AD9517-1

TABLE OF CONTENTS

Features .............................................................................................. 1
Applications....................................................................................... 1
General Description......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 3
Specifications..................................................................................... 4
Power Supply Requirements ....................................................... 4
PLL Characteristics ...................................................................... 4
Clock Inputs.................................................................................. 6
Clock Outputs............................................................................... 6
Timing Characteristics ................................................................ 7
Clock Output Additive Phase Noise (Distribution Only; VCO
Divider Not Used) ........................................................................ 8
Clock Output Absolute Phase Noise (Internal VCO Used).... 9
Clock Output Absolute Time Jitter (Clock Generation Using
Internal VCO) ............................................................................. 10
Clock Output Absolute Time Jitter (Clock Cleanup Using
Internal VCO) ............................................................................. 10
Clock Output Absolute Time Jitter (Clock Generation Using
External VCXO) ......................................................................... 10
Clock Output Additive Time Jitter (VCO Divider Not Used)
....................................................................................................... 11
Clock Output Additive Time Jitter (VCO Divider Used)..... 11
Delay Block Additive Time Jitter.............................................. 12
Serial Control Port .....................................................................12
SYNC
PD
,
LD, STATUS, REFMON Pins.................................................... 13
Power Dissipation....................................................................... 14
Timing Diagrams............................................................................ 15
Absolute Maximum Ratings.......................................................... 16
Thermal Resistance .................................................................... 16
ESD Caution................................................................................ 16
Pin Configuration and Function Descriptions........................... 17
Typical Performance Characteristics ........................................... 19
Te r mi n ol o g y .................................................................................... 25
Detailed Block Diagram ................................................................ 26
Theory of Operation ...................................................................... 27
Operational Configurations...................................................... 27
High Frequency Clock Distribution—CLK or External
VCO >1600 MHz ...................................................................27
Internal VCO and Clock Distribution.................................29
, and
RESET
Pins ..................................................... 13
Clock Distribution or External VCO <1600 MHz ............ 31
Phase-Locked Loop (PLL) .................................................... 33
Configuration of the PLL ...................................................... 33
Phase Frequency Detector (PFD) ........................................ 33
Charge Pump (CP)................................................................. 34
On-Chip VCO ........................................................................ 34
PLL External Loop Filter....................................................... 34
PLL Reference Inputs............................................................. 34
Reference Switchover............................................................. 35
Reference Divider R............................................................... 35
VCXO/VCO Feedback Divider N: P, A, B, R ..................... 35
Digital Lock Detect (DLD) ....................................................... 37
Analog Lock Detect (ALD)................................................... 37
Current Source Digital Lock Detect (DLD) ....................... 37
External VCXO/VCO Clock Input (CLK/
Holdover .................................................................................. 38
Manual Holdover Mode ........................................................ 38
Automatic/Internal Holdover Mode.................................... 38
Frequency Status Monitors................................................... 39
VCO Calibration .................................................................... 40
Clock Distribution ..................................................................... 41
Internal VCO or External CLK as Clock Source ............... 41
CLK or VCO Direct to LVPECL Outputs........................... 41
Clock Frequency Division..................................................... 42
VCO Divider ........................................................................... 42
Channel Dividers—LVPECL Outputs................................. 42
Channel Dividers—LVDS/CMOS Outputs........................ 44
Synchronizing the Outputs—SYNC Function ................... 47
Clock Outputs......................................................................... 49
LVPECL Outputs: OUT0 to OUT3 ..................................... 49
LVDS/CMOS Outputs: OUT4 to OUT7............................. 50
Reset Modes ................................................................................ 50
Power-On Reset—Start-Up Conditions When VS Is
Applied .................................................................................... 50
Asynchronous Reset via the
Soft Reset via 0x00<5> .......................................................... 50
Power-Down Modes .................................................................. 50
Chip Power-Down via
PLL Power-Down................................................................... 51
Distribution Power-Down .................................................... 51
RESET
PD
.................................................... 50
CLK
)................ 37
Pin ............................. 50
Rev. 0 | Page 2 of 80
AD9517-1
Individual Clock Output Power-Down................................51
Individual Circuit Block Power-Down ................................51
Serial Control Port ..........................................................................52
Serial Control Port Pin Descriptions........................................52
General Operation of Serial Control Port ...............................52
Communication Cycle—Instruction Plus Data..................52
Wr it e .........................................................................................52
Read ..........................................................................................53
The Instruction Word (16 Bits).................................................53
MSB/LSB First Transfers............................................................53

REVISION HISTORY

7/07—Revision 0: Initial Version
Register Map Overview ..................................................................56
Register Map Descriptions.............................................................60
Application Notes............................................................................78
Using the AD9517 Outputs for ADC Clock Applications ....78
LVPECL Clock D i s t ribut io n ......................................................78
LVDS Clock Distribution...........................................................78
CMOS Clock Distribution.........................................................79
Outline Dimensions........................................................................80
Ordering Guide...........................................................................80
Rev. 0 | Page 3 of 80
AD9517-1

SPECIFICATIONS

Typical (typ) is given for VS = V unless otherwise noted. Minimum (min) and maximum (max) values are given over full V

POWER SUPPLY REQUIREMENTS

Table 1.
Parameter Min Typ Max Unit Test Conditions/Comments
V
S
V
S_LVPECL
V
CP
3.135 3.3 3.465 V This is 3.3 V ± 5%
2.375 V V
S
RSET Pin Resistor 4.12 Sets internal biasing currents; connect to ground CPRSET Pin Resistor 5.1
BYPASS Pin Capacitor 220 nF Bypass for internal LDO regulator; necessary for LDO stability; connect to ground

PLL CHARACTERISTICS

Table 2.
Parameter Min Typ Max Unit Test Conditions/Comments
VCO (ON-CHIP)
Frequency Range 2300 2650 MHz See Figure 15 VCO Gain (K Tunin g Volt age (VT) 0.5 VCP − 0.5 V
Frequency Pushing (Open-Loop) 1 MHz/V Phase Noise @ 100 kHz Offset −105 dBc/Hz f = 2475 MHz Phase Noise @ 1 MHz Offset −124 dBc/Hz f = 2475 MHz
REFERENCE INPUTS
Differential Mode (REFIN, REFIN)
Input Frequency 0 250 MHz
Input Sensitivity 250 mV p-p
Self-Bias Voltage, REFIN 1.35 1.60 1.75 V Self-bias voltage of REFIN Self-Bias Voltage, REFIN Input Resistance, REFIN 4.0 4.8 5.9 Self-biased Input Resistance, REFIN
Dual Single-Ended Mode (REF1, REF2) Two single-ended CMOS-compatible inputs
Input Frequency (AC-Coupled) 20 250 MHz Slew rate > 50 V/μs Input Frequency (DC-Coupled) 0 250 MHz Slew rate > 50 V/μs; CMOS levels Input Sensitivity (AC-Coupled) 0.8 V p-p Should not exceed VS p-p Input Logic High 2.0 V Input Logic Low 0.8 V Input Current −100 +100 μA
Input Capacitance 2 pF
) 50 MHz/V See Figure 10
VCO
= 3.3 V ± 5%; VS ≤ VCP ≤ 5.25 V; TA = 25°C; R
S_LVPECL
V This is nominally 2.5 V to 3.3 V ± 5%
S
SET
5.25 V This is nominally 3.3 V to 5.0 V ± 5%
Sets internal CP current range, nominally 4.8 mA (CP_lsb = 600 μA); actual current can be calculated by: CP_lsb = 3.06/CPRSET; connect to ground
1.30 1.50 1.60 V
4.4 5.3 6.4 kΩ Self-biased
= 4.12 kΩ; CP and TA (−40°C to +85°C) variation.
S
≤ VS when using internal VCO; outside of this
V
CP
= 5.1 kΩ,
RSET
range, the CP spurs may increase due to CP up/ down mismatch
Differential mode (can accommodate single­ended input by ac grounding undriven input)
Frequencies below about 1 MHz should be dc-coupled; be careful to match V
(self-bias voltage)
CM
PLL figure of merit increases with increasing slew rate; see
Self-bias voltage of
Each pin, REFIN/
Figure 14
REFIN
1
1
REFIN (REF1/REF2)
1
1
Rev. 0 | Page 4 of 80
AD9517-1
Parameter Min Typ Max Unit Test Conditions/Comments
PHASE/FREQUENCY DETECTOR (PFD)
PFD Input Frequency 100 MHz Antibacklash pulse width = 1.3 ns, 2.9 ns 45 MHz Antibacklash pulse width = 6.0 ns Antibacklash Pulse Width 1.3 ns 0x17<1:0> = 01b
2.9 ns 0x17<1:0> = 00b; 0x17<1:0> = 11b
6.0 ns 0x17<1:0> = 10b
CHARGE PUMP (CP)
ICP Sink/Source Programmable
High Value 4.8 mA With CP
Low Value 0.60 mA
Absolute Accuracy 2.5 % CPV = VCP/2 V
CP
Range 2.7/10
RSET
ICP High Impedance Mode Leakage 1 nA Sink-and-Source Current Matching 2 % 0.5 < CPV < VCP − 0.5 V ICP vs. CP
V
1.5 % 0.5 < CPV < VCP − 0.5 V
ICP vs. Temperature 2 % CPV = VCP/2 V
PRESCALER (PART OF N DIVIDER)
Prescaler Input Frequency
P = 1 FD 300 MHz
P = 2 FD 600 MHz
P = 3 FD 900 MHz
P = 2 DM (2/3) 600 MHz
P = 4 DM (4/5) 1000 MHz
P = 8 DM (8/9) 2400 MHz
P = 16 DM (16/17) 3000 MHz
P = 32 DM (32/33) 3000 MHz Prescaler Output Frequency 300 MHz
A, B counter input frequency (prescaler input frequency divided by P)
PLL DIVIDER DELAYS Register 0x19: R <5:3>, N <2:0>; see Table 53
000 Off 001 330 ps 010 440 ps 011 550 ps 100 660 ps 101 770 ps 110 880 ps 111 990 ps
NOISE CHARACTERISTICS
In-Band Phase Noise of the Charge Pump/Phase Frequency Detector (In-Band Means Within the LBW of the PLL)
The PLL in-band phase noise floor is estimated by measuring the in-band phase noise at the output of the VCO and subtracting 20log(N)
(where N is the value of the N divider) @ 500 kHz PFD Frequency −165 dBc/Hz @ 1 MHz PFD Frequency −162 dBc/Hz @ 10 MHz PFD Frequency −151 dBc/Hz @ 50 MHz PFD Frequency −143 dBc/Hz
PLL Figure of Merit (FOM) −220 dBc/Hz
Reference slew rate > 0.25 V/ns. FOM + 10log (f
is an approximation of the PFD/CP in-band
phase noise (in the flat region) inside the PLL
loop bandwidth; when running closed loop,
the phase noise, as observed at the VCO output,
is increased by 20log(N)
= 5.1 kΩ
RSET
PFD
)
Rev. 0 | Page 5 of 80
AD9517-1
Parameter Min Typ Max Unit Test Conditions/Comments
PLL DIGITAL LOCK DETECT WINDOW
Required to Lock (Coincidence of Edges) Selected by 0x17<1:0> and 0x18<4>
Low Range (ABP 1.3 ns, 2.9 ns) 3.5 ns 0x17<1:0> = 00b, 01b,11b; 0x18<4> = 1b High Range (ABP 1.3 ns, 2.9 ns) 7.5 ns 0x17<1:0> = 00b, 01b, 11b; 0x18<4> = 0b High Range (ABP 6 ns) 3.5 ns 0x17<1:0> = 10b; 0x18<4> = 0b
To Unlock After Lock (Hysteresis)
Low Range (ABP 1.3 ns, 2.9 ns) 7 ns 0x17<1:0> = 00b, 01b, 11b; 0x18<4> = 1b High Range (ABP 1.3 ns, 2.9 ns) 15 ns 0x17<1:0> = 00b, 01b, 11b; 0x18<4> = 0b High Range (ABP 6 ns) 11 ns 0x17<1:0> = 10b; 0x18<4> = 0b
1
REFIN and
2
For reliable operation of the digital lock detect, the period of the PFD frequency must be greater than the unlock-after-lock time.
REFIN
self-bias points are offset slightly to avoid chatter on an open input condition.

CLOCK INPUTS

Table 3.
Parameter Min Typ Max Unit Test Conditions/Comments
CLOCK INPUTS (CLK, CLK)
Input Frequency 0 0 Input Sensitivity, Differential 150 mV p-p
Input Level, Differential 2 V p-p
Input Common-Mode Voltage, V Input Common-Mode Range, V Input Sensitivity, Single-Ended 150 mV p-p
Input Resistance 3.9 4.7 5.7 Self-biased Input Capacitance 2 pF
1
Below about 1 MHz, the input should be dc-coupled. Care should be taken to match VCM.
CMR
2
Signal available at LD, STATUS, and REFMON pins when selected by appropriate register settings
2
Differential input
1
2.4 GHz High frequency distribution (VCO divider)
1
1.6 GHz Distribution only (VCO divider bypassed) Measured at 2.4 GHz; jitter performance is improved
with slew rates > 1 V/ns Larger voltage swings may turn on the protection
diodes and can degrade jitter performance
CM
1.3 1.57 1.8 V Self-biased; enables ac coupling
1.3 1.8 V With 200 mV p-p signal applied; dc-coupled CLK ac-coupled;
CLK ac-bypassed to RF ground

CLOCK OUTPUTS

Table 4.
Parameter Min Typ Max Unit Test Conditions/Comments
LVPECL CLOCK OUTPUTS Termination = 50 Ω to VS − 2 V
OUT0, OUT1, OUT2, OUT3
Differential (OUT, Output Frequency, Maximum 2950 MHz Using direct to output; see Figure 25 Output High Voltage (VOH) VS − 1.12 VS − 0.98 VS − 0.84 V Output Low Voltage (VOL) VS − 2.03 VS − 1.77 VS − 1.49 V Output Differential Voltage (VOD) 550 790 980 mV
LVDS CLOCK OUTPUTS Differential termination 100 Ω @ 3.5 mA
OUT4, OUT5, OUT6, OUT7
Differential (OUT, Output Frequency 800 MHz See Figure 26 Differential Output Voltage (VOD) 247 360 454 mV Delta V
OD
25 mV Output Offset Voltage (VOS) 1.125 1.24 1.375 V Delta V
OS
25 mV Short-Circuit Current (ISA, ISB) 14 24 mA Output shorted to GND
Rev. 0 | Page 6 of 80
OUT)
OUT)
AD9517-1
Parameter Min Typ Max Unit Test Conditions/Comments
CMOS CLOCK OUTPUTS
OUT4A, OUT4B, OUT5A, OUT5B, OUT6A, OUT6B, OUT7A, OUT7B
Output Frequency 250 MHz See Figure 27 Output Voltage High (VOH) VS − 0.1 V @ 1 mA load Output Voltage Low (VOL) 0.1 V @ 1 mA load

TIMING CHARACTERISTICS

Table 5.
Parameter Min Typ Max Unit Test Conditions/Comments
LVPECL Termination = 50 Ω to VS − 2 V; level = 810 mV
Output Rise Time, t Output Fall Time, t
PROPAGATION DELAY, t
High Frequency Clock Distribution Configuration 835 995 1180 ps See Figure 42 Clock Distribution Configuration 773 933 1090 ps See Figure 44 Variation with Temperature 0.8 ps/°C
OUTPUT SKEW, LVPECL OUTPUTS
LVPECL Outputs That Share the Same Divider 5 15 ps LVPECL Outputs on Different Dividers 13 40 ps All LVPECL Outputs Across Multiple Parts 220 ps
LVDS Termination = 100 Ω differential; 3.5 mA
Output Rise Time, t Output Fall Time, t
PROPAGATION DELAY, t
For All Divide Values 1.4 1.8 2.1 ns Variation with Temperature 1.25 ps/°C
OUTPUT SKEW, LVDS OUTPUTS
LVDS Outputs That Share the Same Divider 6 62 ps LVDS Outputs on Different Dividers 25 150 ps All LVDS Outputs Across Multiple Parts 430 ps
CMOS Termination = open
Output Rise Time, t Output Fall Time, t
PROPAGATION DELAY, t
For All Divide Values 1.6 2.1 2.6 ns Variation with Temperature 2.6 ps/°C
OUTPUT SKEW, CMOS OUTPUTS
CMOS Outputs That Share the Same Divider 4 66 ps All CMOS Outputs on Different Dividers 28 180 ps All CMOS Outputs Across Multiple Parts 675 ps
DELAY ADJUST
Shortest Delay Range
Zero Scale 50 315 680 ps 0xA2 (0xA5) (0xA8) (0xAB) <5:0> 000000b Full Scale 540 880 1180 ps 0xA2 (0xA5) (0xA8) (0xAB) <5:0> 101111b
Longest Delay Range
Zero Scale 200 570 950 ps 0xA2 (0xA5) (0xA8) (0xAB) <5:0> 000000b
Quarter Scale 1.72 2.31 2.89 ns 0xA2 (0xA5) (0xA8) (0xAB) <5:0> 001100b
Full Scale 5.7 8.0 10.1 ns 0xA2 (0xA5) (0xA8) (0xAB) <5:0> 101111b
RP
FP
, CLK-TO-LVPECL OUTPUT
PECL
1
RL
FL
, CLK-TO-LVDS OUTPUT Delay off on all outputs
LVDS
1
RC
FC
, CLK-TO-CMOS OUTPUT Fine delay off
CMOS
1
3
4
4
Single-ended; termination = 10 pF
70 180 ps 20% to 80%, measured differentially 70 180 ps 80% to 20%, measured differentially
170 350 ps 20% to 80%, measured differentially 160 350 ps 20% to 80%, measured differentially
2
2
Delay off on all outputs
495 1000 ps 20% to 80%, C 475 985 ps 80% to 20%, C
LOAD
LOAD
= 10 pF = 10 pF
Fine delay off
LVDS and CMOS 0xA1 (0xA4) (0xA7) (0xAA) <5:0> 101111b
0xA1 (0xA4) (0xA7) (0xAA) <5:0> 000000b
Rev. 0 | Page 7 of 80
AD9517-1
Parameter Min Typ Max Unit Test Conditions/Comments
Delay Variation with Temperature
Short Delay Range
Zero Scale 0.23 ps/°C Full Scale −0.02 ps/°C
Long Delay Range
Zero Scale 0.3 ps/°C Full Scale 0.24 ps/°C
1
This is the difference between any two similar delay paths while operating at the same voltage and temperature.
2
Corresponding CMOS drivers set to A for noninverting, and B for inverting.
3
The maximum delay that can be used is a little less than one-half the period of the clock. A longer delay disables the output.
4
Incremental delay; does not include propagation delay.
5
All delays between zero scale and full scale can be estimated by linear interpolation.

CLOCK OUTPUT ADDITIVE PHASE NOISE (DISTRIBUTION ONLY; VCO DIVIDER NOT USED)

Table 6.
Parameter Min Typ Max Unit Test Conditions/Comments
CLK-TO-LVPECL ADDITIVE PHASE NOISE
CLK = 1 GHz, OUTPUT = 1 GHz Input slew rate > 1 V/ns Divider = 1
@ 10 Hz Offset −109 dBc/Hz @ 100 Hz Offset −118 dBc/Hz @ 1 kHz Offset −130 dBc/Hz @ 10 kHz Offset −139 dBc/Hz @ 100 kHz Offset −144 dBc/Hz @ 1 MHz Offset −146 dBc/Hz
@ 10 MHz Offset −147 dBc/Hz
@ 100 MHz Offset −149 dBc/Hz CLK = 1 GHz, OUTPUT = 200 MHz Input slew rate > 1 V/ns Divider = 5
@ 10 Hz Offset −120 dBc/Hz @ 100 Hz Offset −126 dBc/Hz @ 1 kHz Offset −139 dBc/Hz @ 10 kHz Offset −150 dBc/Hz @ 100 kHz Offset −155 dBc/Hz @ 1 MHz Offset −157 dBc/Hz
>10 MHz Offset −157 dBc/Hz
CLK-TO-LVDS ADDITIVE PHASE NOISE
CLK = 1.6 GHz, OUTPUT = 800 MHz Input slew rate > 1 V/ns Divider = 2
@ 10 Hz Offset −103 dBc/Hz @ 100 Hz Offset −110 dBc/Hz @ 1 kHz Offset −120 dBc/Hz @ 10 kHz Offset −127 dBc/Hz @ 100 kHz Offset −133 dBc/Hz @ 1 MHz Offset −138 dBc/Hz @ 10 MHz Offset −147 dBc/Hz @ 100 MHz Offset −149 dBc/Hz
5
5
Distribution section only; does not include PLL and VCO
Distribution section only; does not include PLL and VCO
Rev. 0 | Page 8 of 80
AD9517-1
Parameter Min Typ Max Unit Test Conditions/Comments
CLK = 1.6 GHz, OUTPUT = 400 MHz Input slew rate > 1 V/ns Divider = 4
@ 10 Hz Offset −114 dBc/Hz @ 100 Hz Offset −122 dBc/Hz @ 1 kHz Offset −132 dBc/Hz @ 10 kHz Offset −140 dBc/Hz @ 100 kHz Offset −146 dBc/Hz @ 1 MHz Offset −150 dBc/Hz >10 MHz Offset −155 dBc/Hz
CLK-TO-CMOS ADDITIVE PHASE NOISE
CLK = 1 GHz, OUTPUT = 250 MHz Input slew rate > 1 V/ns Divider = 4
@ 10 Hz Offset −110 dBc/Hz @ 100 Hz Offset −120 dBc/Hz @ 1 kHz Offset −127 dBc/Hz @ 10 kHz Offset −136 dBc/Hz @ 100 kHz Offset −144 dBc/Hz @ 1 MHz Offset −147 dBc/Hz
>10 MHz Offset −154 dBc/Hz CLK = 1 GHz, OUTPUT = 50 MHz Input slew rate > 1 V/ns Divider = 20
@ 10 Hz Offset −124 dBc/Hz
@ 100 Hz Offset −134 dBc/Hz
@ 1 kHz Offset −142 dBc/Hz
@ 10 kHz Offset −151 dBc/Hz
@ 100 kHz Offset −157 dBc/Hz
@ 1 MHz Offset −160 dBc/Hz
>10 MHz Offset −163 dBc/Hz
Distribution section only; does not include PLL and VCO

CLOCK OUTPUT ABSOLUTE PHASE NOISE (INTERNAL VCO USED)

Table 7.
Parameter Min Typ Max Unit Test Conditions/Comments
LVPECL ABSOLUTE PHASE NOISE Internal VCO; direct to LVPECL output
VCO = 2.65 GHz; OUTPUT = 2.65 GHz
@ 1 kHz Offset −46 dBc/Hz
@ 10 kHz Offset −76 dBc/Hz
@ 100 kHz Offset −104 dBc/Hz
@ 1 MHz Offset −123 dBc/Hz
@ 10 MHz Offset −140 dBc/Hz
@ 40 MHz Offset −146 dBc/Hz VCO = 2.475 GHz; OUTPUT = 2.475 GHz
@ 1 kHz Offset −47 dBc/Hz
@ 10 kHz Offset −77 dBc/Hz
@ 100 kHz Offset −105 dBc/Hz
@ 1 MHz Offset −124 dBc/Hz
@ 10 MHz Offset −141 dBc/Hz
@ 40 MHz Offset −146 dBc/Hz
Rev. 0 | Page 9 of 80
AD9517-1
Parameter Min Typ Max Unit Test Conditions/Comments
VCO = 2.3 GHz; OUTPUT = 2.3 GHz
@ 1 kHz Offset −54 dBc/Hz @ 10 kHz Offset −78 dBc/Hz @ 100 kHz Offset −106 dBc/Hz @ 1 MHz Offset −125 dBc/Hz @ 10 MHz Offset −141 dBc/Hz @ 40 MHz Offset −146 dBc/Hz

CLOCK OUTPUT ABSOLUTE TIME JITTER (CLOCK GENERATION USING INTERNAL VCO)

Table 8.
Parameter Min Typ Max Unit Test Conditions/Comments
LVPECL OUTPUT ABSOLUTE TIME JITTER
VCO = 2.46 GHz; LVPECL = 491.52 MHz; PLL LBW = 55 kHz 142 fS rms Integration BW = 200 kHz to 10 MHz 370 fS rms Integration BW = 12 kHz to 20 MHz VCO = 2.46 GHz; LVPECL = 122.88 MHz; PLL LBW = 55 kHz 145 fS rms Integration BW = 200 kHz to 10 MHz 356 fS rms Integration BW = 12 kHz to 20 MHz VCO = 2.46 GHz; LVPECL = 61.44 MHz; PLL LBW = 55 kHz 195 fS rms Integration BW = 200 kHz to 10 MHz 402 fS rms Integration BW = 12 kHz to 20 MHz
Application example based on a typical setup where the reference source is clean, so a wider PLL loop bandwidth is used; reference = 15.36 MHz; R = 1

CLOCK OUTPUT ABSOLUTE TIME JITTER (CLOCK CLEANUP USING INTERNAL VCO)

Table 9.
Parameter Min Typ Max Unit Test Conditions/Comments
LVPECL OUTPUT ABSOLUTE TIME JITTER
VCO = 2.49 GHz; LVPECL = 622.08 MHz; PLL LBW = 125 Hz 745 fS rms Integration BW = 12 kHz to 20 MHz VCO = 2.49 GHz; LVPECL = 155.52 MHz; PLL LBW = 125 Hz 712 fS rms Integration BW = 12 kHz to 20 MHz VCO = 2.46 GHz; LVPECL = 122.88 MHz; PLL LBW = 125 Hz 700 fS rms Integration BW = 12 kHz to 20 MHz
Application example based on a typical setup where the reference source is jittery, so a narrower PLL loop bandwidth is used; reference = 10.0 MHz; R = 20

CLOCK OUTPUT ABSOLUTE TIME JITTER (CLOCK GENERATION USING EXTERNAL VCXO)

Table 10.
Parameter Min Typ Max Unit Test Conditions/Comments
LVPECL OUTPUT ABSOLUTE TIME JITTER
LVPECL = 245.76 MHz; PLL LBW = 125 Hz 54 fS rms Integration BW = 200 kHz to 5 MHz 77 fS rms Integration BW = 200 kHz to 10 MHz 109 fS rms Integration BW = 12 kHz to 20 MHz LVPECL = 122.88 MHz; PLL LBW = 125 Hz 79 fS rms Integration BW = 200 kHz to 5 MHz 114 fS rms Integration BW = 200 kHz to 10 MHz 163 fS rms Integration BW = 12 kHz to 20 MHz LVPECL = 61.44 MHz; PLL LBW = 125 Hz 124 fS rms Integration BW = 200 kHz to 5 MHz 176 fS rms Integration BW = 200 kHz to 10 MHz 259 fS rms Integration BW = 12 kHz to 20 MHz
Application example based on a typical setup using an external 245.76 MHz VCXO (Toyocom TCO-2112); reference = 15.36 MHz; R = 1
Rev. 0 | Page 10 of 80
AD9517-1

CLOCK OUTPUT ADDITIVE TIME JITTER (VCO DIVIDER NOT USED)

Table 11.
Parameter Min Typ Max Unit Test Conditions/Comments
LVPECL OUTPUT ADDITIVE TIME JITTER
CLK = 622.08 MHz; LVPECL = 622.08 MHz; Divider = 1 40 fS rms BW = 12 kHz to 20 MHz CLK = 622.08 MHz; LVPECL = 155.52 MHz; Divider = 4 80 fS rms BW = 12 kHz to 20 MHz CLK = 1.6 GHz; LVPECL = 100 MHz; Divider = 16 215 fS rms
CLK = 500 MHz; LVPECL = 100 MHz; Divider = 5 245 fS rms
LVDS OUTPUT ADDITIVE TIME JITTER
CLK = 1.6 GHz; LVDS = 800 MHz; Divider = 2; VCO Divider Not Used 85 fS rms BW = 12 kHz to 20 MHz CLK = 1 GHz; LVDS = 200 MHz; Divider = 5 113 fS rms BW = 12 kHz to 20 MHz CLK = 1.6 GHz; LVDS = 100 MHz; Divider = 16 280 fS rms
CMOS OUTPUT ADDITIVE TIME JITTER
CLK = 1.6 GHz; CMOS = 100 MHz; Divider = 16 365 fS rms
Distribution section only; does not include PLL and VCO; uses rising edge of clock signal
Calculated from SNR of ADC method; DCC not used for even divides
Calculated from SNR of ADC method; DCC on
Distribution section only; does not include PLL and VCO; uses rising edge of clock signal
Calculated from SNR of ADC method; DCC not used for even divides
Distribution section only; does not include PLL and VCO; uses rising edge of clock signal
Calculated from SNR of ADC method; DCC not used for even divides

CLOCK OUTPUT ADDITIVE TIME JITTER (VCO DIVIDER USED)

Table 12.
Parameter Min Typ Max Unit Test Conditions/Comments
LVPECL OUTPUT ADDITIVE TIME JITTER
CLK = 2.4 GHz; VCO DIV = 2; LVPECL = 100 MHz; Divider = 12; Duty-Cycle Correction = Off
LVDS OUTPUT ADDITIVE TIME JITTER
CLK = 2.4 GHz; VCO DIV = 2; LVDS = 100 MHz; Divider = 12; Duty-Cycle Correction = Off
CMOS OUTPUT ADDITIVE TIME JITTER
CLK = 2.4 GHz; VCO DIV = 2; CMOS = 100 MHz; Divider = 12; Duty-Cycle Correction = Off
210 f
285 f
350 f
S
S
S
Distribution section only; does not include PLL and VCO; uses rising edge of clock signal
rms Calculated from SNR of ADC method
Distribution section only; does not include PLL and VCO; uses rising edge of clock signal
rms Calculated from SNR of ADC method
Distribution section only; does not include PLL and VCO; uses rising edge of clock signal
rms Calculated from SNR of ADC method
Rev. 0 | Page 11 of 80
AD9517-1

DELAY BLOCK ADDITIVE TIME JITTER

Table 13.
Parameter Min Typ Max Unit Test Conditions/Comments
DELAY BLOCK ADDITIVE TIME JITTER
100 MHz Output
Delay (1600 μA, 1C) Fine Adj. 000000 0.54 ps rms Delay (1600 μA, 1C) Fine Adj. 101111 0.60 ps rms Delay (800 μA, 1C) Fine Adj. 000000 0.65 ps rms Delay (800 μA, 1C) Fine Adj. 101111 0.85 ps rms Delay (800 μA, 4C) Fine Adj. 000000 0.79 ps rms Delay (800 μA, 4C) Fine Adj. 101111 1.2 ps rms Delay (400 μA, 4C) Fine Adj. 000000 1.2 ps rms Delay (400 μA, 4C) Fine Adj. 101111 2.0 ps rms Delay (200 μA, 1C) Fine Adj. 000000 1.3 ps rms Delay (200 μA, 1C) Fine Adj. 101111 2.5 ps rms Delay (200 μA, 4C) Fine Adj. 000000 1.9 ps rms Delay (200 μA, 4C) Fine Adj. 101111 3.8 ps rms
1
This value is incremental. That is, it is in addition to the jitter of the LVDS or CMOS output without the delay. To estimate the total jitter, the LVDS or CMOS output jitter
should be added to this value using the root sum of squares (RSS) method.
1
Incremental additive jitter

SERIAL CONTROL PORT

Table 14.
Parameter Min Typ Max Unit Test Conditions/Comments
CS (INPUT)
Input Logic 1 Voltage 2.0 V Input Logic 0 Voltage 0.8 V Input Logic 1 Current 3 μA Input Logic 0 Current 110 μA Input Capacitance 2 pF
SCLK (INPUT) SCLK has an internal 30 kΩ pull-down resistor
Input Logic 1 Voltage 2.0 V Input Logic 0 Voltage 0.8 V Input Logic 1 Current 110 μA Input Logic 0 Current 1 μA Input Capacitance 2 pF
SDIO (WHEN INPUT)
Input Logic 1 Voltage 2.0 V Input Logic 0 Voltage 0.8 V Input Logic 1 Current 10 nA Input Logic 0 Current 20 nA Input Capacitance 2 pF
SDIO, SDO (OUTPUTS)
Output Logic 1 Voltage 2.7 V Output Logic 0 Voltage 0.4 V
CS has an internal 30 kΩ pull-up resistor
Rev. 0 | Page 12 of 80
AD9517-1
Parameter Min Typ Max Unit Test Conditions/Comments
TIMING
Clock Rate (SCLK, 1/t Pulse Width High, t Pulse Width Low, t SDIO to SCLK Setup, t SCLK to SDIO Hold, t SCLK to Valid SDIO and SDO, t CS to SCLK Setup and Hold, tS, t CS Minimum Pulse Width High, t

PD, SYNC, AND RESET PINS

Table 15.
Parameter Min Typ Max Unit Test Conditions/Comments
INPUT CHARACTERISTICS These pins each have a 30 kΩ internal pull-up resistor
Logic 1 Voltage 2.0 V Logic 0 Voltage 0.8 V Logic 1 Current 110 μA Logic 0 Current 1 μA Capacitance 2 pF
RESET TIMING
Pulse Width Low 50 ns
SYNC TIMING
Pulse Width Low 1.5 High speed clock cycles High speed clock is CLK input signal

LD, STATUS, REFMON PINS

) 25 MHz
SCLK
HI
LO
DS
DH
DV
H
PWH
16 ns 16 ns 2 ns
1.1 ns 8 ns 2 ns 3 ns
Table 16.
Parameter Min Typ Max Unit Test Conditions/Comments
OUTPUT CHARACTERISTICS
When selected as a digital output (CMOS); there are other modes in which these pins are not CMOS digital outputs;
Tab le 53, 0x17, 0x1A, and 0x1B
see Output Voltage High (VOH) 2.7 V Output Voltage Low (VOL) 0.4 V
MAXIMUM TOGGLE RATE 100 MHz
Applies when mux is set to any divider or counter output
or PFD up/down pulse; also applies in analog lock detect
mode; usually a debug mode; beware that spurs may
couple to output when any of these pins are toggling
ANALOG LOCK DETECT
Capacitance 3 pF
On-chip capacitance; used to calculate RC time constant
for analog lock detect readback; use a pull-up resistor
REF1, REF2, AND VCO FREQUENCY STATUS MONITOR
Normal Range 1.02 MHz
Frequency above which the monitor indicates the
presence of the reference Extended Range (REF1 and REF2 Only) 8 kHz
Frequency above which the monitor indicates the
presence of the reference
LD PIN COMPARATOR
Trip Point 1.6 V Hysteresis 260 mV
Rev. 0 | Page 13 of 80
AD9517-1

POWER DISSIPATION

Table 17.
Parameter Min Typ Max Unit Test Conditions/Comments
POWER DISSIPATION, CHIP
Power-On Default 1.0 1.2 W
Full Operation; CMOS Outputs at 206 MHz 1.4 2.0 W
Full Operation; LVDS Outputs at 206 MHz 1.4 2.1 W
PD
Power-Down
PD
Power-Down, Maximum Sleep
VCP Supply 1.5 mW PLL operating; typical closed-loop configuration
POWER DELTAS, INDIVIDUAL FUNCTIONS Power delta when a function is enabled/disabled
VCO Divider 30 mW VCO divider not used REFIN (Differential) 20 mW All references off to differential reference enabled REF1, REF2 (Single-Ended) 4 mW
VCO 70 mW CLK input selected to VCO selected PLL 75 mW PLL off to PLL on, normal operation; no reference enabled Channel Divider 30 mW Divider bypassed to divide-by-2 to divide-by-32 LVPECL Channel (Divider Plus Output Driver) 160 mW No LVPECL output on to one LVPECL output on LVPECL Driver 90 mW Second LVPECL output turned on, same channel LVDS Channel (Divider Plus Output Driver) 120 mW No LVDS output on to one LVDS output on LVDS Driver 50 mW Second LVDS output turned on, same channel CMOS Channel (Divider Plus Output Driver) 100 mW Static; no CMOS output on to one CMOS output on CMOS Driver (Second in Pair) 0 mW Static; second CMOS output, same pair, turned on CMOS Driver (First in Second Pair) 30 mW Static; first output, second pair, turned on Fine Delay Block 50 mW
75 185 mW
31 mW
No clock; no programming; default register values; does not include power dissipated in external resistors
PLL on; internal VCO = 2476 MHz; VCO divider = 2; all channel dividers on; six LVPECL outputs @ 619 MHz; eight CMOS outputs (10 pF load) @ 206 MHz; all fine delay on, maximum current; does not include power dissipated in external resistors
PLL on; internal VCO = 2476 MHz, VCO divider = 2; all channel dividers on; six LVPECL outputs @ 619 MHz; four LVDS outputs @ 206 MHz; all fine delay on, maximum current; does not include power dissipated in external resistors
PD
pin pulled low; does not include power dissipated
in terminations PD
pin pulled low; PLL power-down 0x10<1:0> = 01b; SYNC power-down 0x230<2> = 1b; REF for distribution power-down 0x230<1> = 1b
All references off to REF1 or REF2 enabled; differential reference not enabled
Delay block off to delay block enabled; maximum current setting
Rev. 0 | Page 14 of 80
AD9517-1
K

TIMING DIAGRAMS

t
CLK
CL
DIFFERENTIAL
80%
20%
t
LVDS
t
PECL
LVDS
t
CMOS
Figure 2. CLK/
DIFFERENTIAL
80%
20%
Figure 3. LVPECL Timing, Differential
CLK
to Clock Output Timing, DIV = 1
LVPECL
t
RP
t
RL
06425-060
Figure 4. LVDS Timing, Differential
SINGL E-ENDE D
80%
CMOS
10pF LOAD
20%
t
FP
06425-061
t
RC
Figure 5. CMOS Timing, Single-Ended, 10 pF Load
t
FL
t
FC
06425-062
06425-063
Rev. 0 | Page 15 of 80
AD9517-1

ABSOLUTE MAXIMUM RATINGS

Table 18.
With
Parameter or Pin
Respect To
Rating
VS, VS_LVPECL GND −0.3 V to +3.6 V VCP GND −0.3 V to +5.8 V REFIN, REFIN REFIN
GND −0.3 V to VS + 0.3 V REFIN
−3.3 V to +3.3 V RSET GND −0.3 V to VS + 0.3 V CPRSET GND −0.3 V to VS + 0.3 V CLK, CLK CLK SCLK, SDIO, SDO, CS OUT0, OUT0, OUT1, OUT1,
OUT2, OUT3, OUT3,
OUT2,
GND −0.3 V to VS + 0.3 V CLK
−1.2 V to +1.2 V
GND −0.3 V to VS + 0.3 V GND −0.3 V to VS + 0.3 V
OUT4, OUT4, OUT5, OUT5, OUT6, OUT6, OUT7, OUT7
SYNC
GND −0.3 V to VS + 0.3 V REFMON, STATUS, LD GND −0.3 V to VS + 0.3 V Junction Temperature Storage Temperature
1
150°C
−65°C to +150°C
Range Lead Temperature (10 sec) 300°C
1
See Table 19 for θJA.
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

THERMAL RESISTANCE

Table 19.
Package Type
48-Lead LFCSP 28.5 °C/W
1
Thermal impedance measurements were taken on a 4-layer board in still air
in accordance with EIA/JESD51-7.
1
θ
JA
Unit

ESD CAUTION

Rev. 0 | Page 16 of 80
AD9517-1

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

REFIN (REF 1)
REFIN (REF 2)
CPRSETVSRSETVSOUT0
4847464544434241403938
OUT0
VS_LVPECL
OUT1
OUT1
VS
37
REFMON
LD
VCP
CP
STATUS
REF_SEL
SYNC
BYPASS
VS
CLK
CLK
1
2
3
4
5
6
7
8
LF
9
10
11
12
PIN 1 INDICAT OR
AD9517-1
TOP VIEW
(Not to Scale)
13141516171819
CS
SCLK
PD
SDO
SDIO
RESET
2021222324
OUT2
OUT2
S_LVPECL
OUT3
36
S
V
35
OUT4 (OUT4A)
34
OUT4 (OUT4B)
33
OUT5 (OUT5A)
32
OUT5 (OUT5B)
31
VS
30
VS
29
OUT7 (OUT7B)
28
OUT7 (OUT7A)
27
OUT6 (OUT6B)
26
OUT6 (OUT6A)
25
S
V
VS
OUT3
06425-003
Figure 6. Pin Configuration
Table 20. Pin Function Descriptions
Pin No. Mnemonic Description
1 REFMON Reference Monitor (Output). This pin has multiple selectable outputs; see Table 53 0x1B. 2 LD Lock Detect (Output). This pin has multiple selectable outputs; see Tabl e 53 0x1A. 3 VCP Power Supply for Charge Pump (CP); VS < VCP < 5.0 V. 4 CP Charge Pump (Output). Connects to external loop filter. 5 STATUS Status (Output). This pin has multiple selectable outputs; see Tab le 53 0x17. 6 REF_SEL Reference Select. Selects REF1 (low) or REF2 (high). This pin has an internal 30 kΩ pull-down resistor. 7
SYNC
Manual Synchronizations and Manual Holdover. This pin initiates a manual synchronization and is
also used for manual holdover. Active low. This pin has an internal 30 kΩ pull-up resistor. 8 LF Loop Filter (Input). Connects to VCO control voltage node internally. 9 BYPASS This pin is for bypassing the LDO to ground with a capacitor. 10, 24, 25, 30, 31,
VS 3.3 V Power Pins.
36, 37, 43, 45 11 CLK
12
CLK
Along with
Along with CLK, this is the differential input for the clock distribution section.
CLK, this is the differential input for the clock distribution section.
13 SCLK Serial Control Port Data Clock Signal. 14
CS
Serial Control Port Chip Select; Active Low. This pin has an internal 30 kΩ pull-up resistor. 15 SDO Serial Control Port Unidirectional Serial Data Out. 16 SDIO Serial Control Port Bidirectional Serial Data In/Out. 17 18
RESET PD
Chip Reset; Active Low. This pin has an internal 30 kΩ pull-up resistor.
Chip Power Down; Active Low. This pin has an internal 30 kΩ pull-up resistor. 21, 40 VS_LVPECL Extended Voltage 2.5 V to 3.3 V LVPECL Power Pins.
42 OUT0 LVPECL Output; One Side of a Differential LVPECL Output. 41
OUT0
LVPECL Output; One Side of a Differential LVPECL Output. 39 OUT1 LVPECL Output; One Side of a Differential LVPECL Output. 38
OUT1
LVPECL Output; One Side of a Differential LVPECL Output. 19 OUT2 LVPECL Output; One Side of a Differential LVPECL Output.
Rev. 0 | Page 17 of 80
AD9517-1
Pin No. Mnemonic Description
20 22 OUT3 LVPECL Output; One Side of a Differential LVPECL Output. 23 35 OUT4 (OUT4A) LVDS/CMOS Output; One Side of a Differential LVDS Output, or a Single-Ended CMOS Output. 34 33 OUT5 (OUT5A) LVDS/CMOS Output; One Side of a Differential LVDS Output, or a Single-Ended CMOS Output. 32 26 OUT6 (OUT6A) LVDS/CMOS Output; One Side of a Differential LVDS Output, or a Single-Ended CMOS Output. 27 28 OUT7 (OUT7A) LVDS/CMOS Output; One Side of a Differential LVDS Output, or a Single-Ended CMOS Output. 29 44 RSET Resistor connected here sets internal bias currents. Nominal value = 4.12 kΩ. 46 CPRSET Resistor connected here sets the CP current range. Nominal value = 5.1 kΩ. 47
48 REFIN (REF1)
EPAD GND Ground; External Paddle (EPAD). This is the only ground for the part.
OUT2
OUT3
OUT4 (OUT4B)
OUT5 (OUT5B)
OUT6 (OUT6B)
OUT7 (OUT7B)
REFIN (REF2) Along with REFIN, this is the differential input for the PLL reference. Alternatively, this pin is a
LVPECL Output; One Side of a Differential LVPECL Output.
LVPECL Output; One Side of a Differential LVPECL Output.
LVDS/CMOS Output; One Side of a Differential LVDS Output, or a Single-Ended CMOS Output.
LVDS/CMOS Output; One Side of a Differential LVDS Output, or a Single-Ended CMOS Output.
LVDS/CMOS Output; One Side of a Differential LVDS Output, or a Single-Ended CMOS Output.
LVDS/CMOS Output; One Side of a Differential LVDS Output, or a Single-Ended CMOS Output.
single-ended input for REF2. Along with
single-ended input for REF1.
REFIN, this is the differential input for the PLL reference. Alternatively, this pin is a
Rev. 0 | Page 18 of 80
AD9517-1

TYPICAL PERFORMANCE CHARACTERISTICS

240
220
2 CHANNELS—4 LVPE CL
65
60
200
180
160
CURRENT (mA)
140
120
100
0 500 1000 1500 2000 2500 3000
2 CHANNELS—2 LVPE CL
1 CHANNEL—1 LVPECL
FREQUENCY (MHz)
06425-007
55
50
(MHz/V)
VCO
K
45
40
35
2.3 2.72.62. 52.4
Figure 7. Current vs. Frequency, Direct to Output, LVPECL Outputs
180
2 CHANNELS—4 LVDS
160
140
120
CURRENT (mA)
100
80
0 200 400 600 800
2 CHANNELS—2 LVDS
1 CHANNEL—1 LVDS
FREQUENCY (MHz )
Figure 8. Current vs. Frequency—LVDS Outputs
06425-008
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
CURRENT FROM CP PIN (mA)
1.0
0.5
0
0 0.5 1.0 1.5 2.0 2.5 3.0
Figure 11. Charge Pump Characteristics @ V
240
220
200
180
160
140
CURRENT (mA)
120
100
2 CHANNELS—8 CMOS
2 CHANNELS—2 CMOS
1 CHANNEL—2 CMOS
80
02
FREQUENCY (MHz )
1 CHANNEL—1 CMOS
5020015010050
06425-009
Figure 9. Current vs. Frequency—CMOS Outputs
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
CURRENT FROM CP PIN (mA)
1.0
0.5
0
0 0.5 1.0 1.5 2.0 3.0 4.02.5 3.5 5.04.5
Figure 12. Charge Pump Characteristics @ V
VCO FREQUENCY (GHz)
Figure 10. VCO K
vs. Frequency
VCO
PUMP DOWN PUMP UP
VOLTAGE ON CP PIN (V)
= 3.3 V
CP
PUMP DOWN PUMP UP
VOLTAGE ON CP PIN (V)
= 5.0 V
CP
06425-010
06425-011
06425-012
Rev. 0 | Page 19 of 80
AD9517-1
140
–145
–150
–155
(dBc/Hz)
–160
–165
PFD PHASE NOI SE REFERRED T O PFD INP UT
–170
0.1 1 10010
PFD FREQUENCY (MHz)
Figure 13. PFD Phase Noise Referred to PFD Input vs. PFD Frequency
210
–212
–214
–216
–218
–220
PLL FIGURE OF MERI T (dBc/Hz)
–222
–224
02
SLEW RATE (V/n s)
Figure 14. PLL Figure of Merit (FOM) vs. Slew Rate at REFIN/
1.9
1.8
1.7
1.6
1.5
1.4
VCO TUNING VO LTAGE (V)
1.3
1.2
2.3 2. 4 2. 5 2.6 2.7
FREQUENCY (GHz)
Figure 15. VCO Tuning Voltage vs. Frequency
REFIN
10
0
–10
–20
–30
–40
–50
–60
–70
RELATIVE POWER (dB)
–80
–90
–100
–110
CENTER 122.88MHz SPAN 50MHz5MHz/DIV
06425-013
06425-137
Figure 16. PFD/CP Spurs; 122.88 MHz; PFD = 15.36 MHz;
LBW = 55 kHz; I
10
0
–10
–20
–30
–40
–50
–60
–70
RELATIVE POWER (dB)
–80
–90
–100
–110
.52.01.51.00.5
06425-136
CENTER 122. 88MHz SP AN 1MHz100kHz/DIV
Figure 17. Output Spectrum, LVPECL; 122.88 MHz; PFD = 15.36 MHz;
LBW = 55 kHz; I
10
0
–10
–20
–30
–40
–50
–60
–70
RELATIVE POWER (dB)
–80
–90
–100
–110
CENTER 122.88MHz SPAN 1MHz100kHz/DIV
06425-138
= 4.8 mA; F
CP
= 4.8 mA; F
CP
= 2.46 GHz
VCO
= 2.46 GHz
VCO
06425-135
06425-134
Figure 18. Output Spectrum, LVDS; 122.88 MHz; PFD = 15.36 MHz;
LBW = 55 kHz; I
= 4.8 mA; F
CP
= 2.46 GHz
VCO
Rev. 0 | Page 20 of 80
AD9517-1
1.0
0.4
0.6
0.2
–0.2
DIFFERENT IAL OUTPUT (V)
–0.6
–1.0
02
TIME (ns)
2015105
5
06425-014
Figure 19. LVPECL Output (Differential) @ 100 MHz
0.2
0
–0.2
DIFFERENT IAL OUTPUT (V)
–0.4
021
Figure 22. LVDS Output (Differential) @ 800 MHz
1.0
0.6
0.2
–0.2
DIFFERENT IAL OUTPUT (V)
–0.6
2.8
1.8
OUTPUT (V)
0.8
TIME (ns)
06425-017
–1.0
021
TIME (ns)
06425-015
–0.2
0860 1004020
Figure 20. LVPECL Output (Differential) @ 1600 MHz
0.4
2.8
0.2
1.8
0
OUTPUT (V)
–0.2
DIFFERENT IAL OUTPUT (V)
–0.4
02
TIME (ns)
2015105
5
06425-016
Figure 21. LVDS Output (Differential) @ 100 MHz
0.8
–0.2
086121042
Figure 24. CMOS Output @ 250 MHz
TIME (ns)
Figure 23.CMOS Output @ 25 MHz
TIME (ns)
0
06425-018
06425-019
Rev. 0 | Page 21 of 80
AD9517-1
1600
70
–80
1400
1200
1000
DIFFERENTIAL SWING (mV p-p)
800
0321
FREQUENCY (GHz)
Figure 25. LVPECL Differential Swing vs. Frequency
06425-020
–90
–100
–110
–120
PHASE NOISE (dBc/Hz)
–130
–140
–150
10k 100M10M1M100k
Figure 28. Internal VCO Phase Noise (Absolute) Direct to LVPECL @ 2650 MHz
70
700
600
DIFFERENT IAL SWING (mV p- p)
500
08
FREQUENCY (MHz )
00700600500400300200100
06425-021
Figure 26. LVDS Differential Swing vs. Frequency
–80
–90
–100
–110
–120
PHASE NOISE (dBc/Hz)
–130
–140
–150
10k 100M10M1M100k
Figure 29. Internal VCO Phase Noise (Absolute) Direct to LVPECL @ 2475 MHz
CL = 2pF
3
70
–80
FREQUENCY (Hz)
FREQUENCY (Hz)
06425-023
06425-024
= 10pF
C
L
2
C
= 20pF
OUTPUT SWING (V)
1
0
0 600500400300200100
OUTPUT FREQUENCY (MHz)
L
Figure 27. CMOS Output Swing vs. Frequency and Capacitive Load
06425-133
–90
–100
–110
–120
PHASE NOISE (dBc/Hz)
–130
–140
–150
10k 100M10M1M100k
FREQUENCY (Hz)
06425-025
Figure 30. Internal VCO Phase Noise (Absolute) Direct to LVPECL @ 2300 MHz
Rev. 0 | Page 22 of 80
AD9517-1
120
–125
–130
110
–120
–135
–140
–145
PHASE NOISE (dBc/Hz)
–150
–155
–160
10 100M10M1M100k10k1k100
FREQUENCY (Hz)
Figure 31. Phase Noise (Additive) LVPECL @ 245.76 MHz, Divide-by-1
110
–120
–130
–140
PHASE NOISE (dBc/Hz)
–150
–160
10 100M10M1M100k10k1k100
FREQUENCY (Hz)
Figure 32. Phase Noise (Additive) LVPECL @ 200 MHz, Divide-by-5
100
–130
–140
PHASE NOISE (dBc/Hz)
–150
–160
10 100M1k 10k 100k 1M 10M100
06425-026
FREQUENCY (Hz)
06425-142
Figure 34. Phase Noise (Additive) LVDS @ 200 MHz, Divide-by-1
100
–110
–120
–130
PHASE NOISE (dBc/Hz)
–140
–150
10 100M10M1M100k10k1k100
06425-027
FREQUENCY (Hz)
06425-130
Figure 35. Phase Noise (Additive) LVDS @ 800 MHz, Divide-by-2
120
–110
–120
–130
PHASE NOISE (dBc/Hz)
–140
–150
10 100M10M1M100k10k1k100
FREQUENCY (Hz)
Figure 33. Phase Noise (Additive) LVPECL @ 1600 MHz, Divide-by-1
06425-128
–130
–140
–150
PHASE NOISE (dBc/Hz)
–160
–170
10 100M10M1M100k10k1k100
FREQUENCY (Hz)
Figure 36. Phase Noise (Additive) CMOS @ 50 MHz, Divide-by-20
06425-131
Rev. 0 | Page 23 of 80
AD9517-1
100
–110
–120
–130
–140
PHASE NOISE (dBc/Hz)
–150
–160
10 100M10M1M100k10k1k100
FREQUENCY (Hz)
Figure 37. Phase Noise (Additive) CMOS @ 250 MHz, Divide-by-4
120
06425-132
70
–80
–90
–100
–110
–120
–130
PHASE NOISE (dBc/Hz)
–140
–150
–160
1k 100M10M1M100k10k
FREQUENCY (Hz)
06425-139
Figure 39. Phase Noise (Absolute) Clock Cleanup; Internal VCO @ 2.488 GHz;
PFD = 19.44 MHz; LBW = 12.8 kHz; LVPECL Output = 155.52 MHz
120
–130
–140
PHASE NOISE (dBc/Hz)
–150
–160
1k 100M10M1M100k10k
FREQUENCY (Hz)
06425-141
Figure 38. Phase Noise (Absolute) Clock Generation; Internal VCO @
2.4576 GHz; PFD = 15.36 MHz; LBW = 55 kHz; LVPECL Output = 122.88 MHz
–130
–140
PHASE NOISE (dBc/Hz)
–150
–160
1k 100M10M1M100k10k
FREQUENCY (Hz)
Figure 40. Phase Noise (Absolute), External VCXO (Toyocom TCO-2112)
@ 245.76 MHz; PFD = 15.36 MHz; LBW = 250 Hz; LVPECL Output = 245.76 MHz
06425-140
Rev. 0 | Page 24 of 80
AD9517-1

TERMINOLOGY

Phase Jitter and Phase Noise
An ideal sine wave can be thought of as having a continuous and even progression of phase with time from 0° to 360° for each cycle. Actual signals, however, display a certain amount of variation from ideal phase progression over time. This phenomenon is called phase jitter. Although many causes can contribute to phase jitter, one major cause is random noise, which is characterized statistically as being Gaussian (normal) in distribution.
This phase jitter leads to a spreading out of the energy of the sine wave in the frequency domain, producing a continuous power spectrum. This power spectrum is usually reported as a series of values whose units are dBc/Hz at a given offset in frequency from the sine wave (carrier). The value is a ratio (expressed in dB) of the power contained within a 1 Hz bandwidth with respect to the power at the carrier frequency. For each measurement, the offset from the carrier frequency is also given.
It is meaningful to integrate the total power contained within some interval of offset frequencies (for example, 10 kHz to 10 MHz). This is called the integrated phase noise over that frequency offset interval and can be readily related to the time jitter due to the phase noise within that offset frequency interval.
Phase noise has a detrimental effect on the performance of ADCs, DACs, and RF mixers. It lowers the achievable dynamic range of the converters and mixers, although they are affected in somewhat different ways.
Time Jitter
Phase noise is a frequency domain phenomenon. In the time domain, the same effect is exhibited as time jitter. When observing a sine wave, the time of successive zero crossings varies. In a square wave, the time jitter is a displacement of the edges from their ideal (regular) times of occurrence. In both cases, the variations in timing from the ideal are the time jitter. Because these variations are random in nature, the time jitter is specified in units of seconds root mean square (rms) or 1 sigma of the Gaussian distribution.
Time jitter that occurs on a sampling clock for a DAC or an ADC decreases the signal-to-noise ratio (SNR) and dynamic range of the converter. A sampling clock with the lowest possible jitter provides the highest performance from a given converter.
Additive Phase Noise
Additive phase noise is the amount of phase noise that is attributable to the device or subsystem being measured. The phase noise of any external oscillators or clock sources is subtracted. This makes it possible to predict the degree to which the device impacts the total system phase noise when used in conjunction with the various oscillators and clock sources, each of which contributes its own phase noise to the total. In many cases, the phase noise of one element dominates the system phase noise. When there are multiple contributors to phase noise, the total is the square root of the sum of squares of the individual contributors.
Additive Time Jitter
Additive time jitter is the amount of time jitter that is attributable to the device or subsystem being measured. The time jitter of any external oscillators or clock sources is subtracted. This makes it possible to predict the degree to which the device impacts the total system time jitter when used in conjunction with the various oscillators and clock sources, each of which contributes its own time jitter to the total. In many cases, the time jitter of the external oscillators and clock sources dominates the system time jitter.
Rev. 0 | Page 25 of 80
AD9517-1
V

DETAILED BLOCK DIAGRAM

REFIN ( REF1)
REFIN ( REF2)
BYPASS
CLK
CLK
PD
SYNC
RESET
SCLK
SDIO
SDO
CS
REF1
REF2
REGULATOR ( LDO)
LF
REF_ SEL CPRSETVCP
REFERENCE
SWITCHOVER
STATUS
STATUS
LOW DROPOUT
VCO
DIGITAL
LOGIC
SERIAL
CONTROL
PORT
S GND RSET
DISTRIBUTI ON
REFERENCE
R
DIVIDER
VCO STATUS
P, P + 1
PRESCALER
DIVIDE BY
2, 3, 4, 5, OR 6
01
N DIVIDE R
A/B
COUNTERS
DIVIDE BY
1 TO 32
REFMO N
PROGRAMMABLE
R DELAY
PROGRAMMABLE
N DELAY
DIVIDE BY
1 TO 32
DIVIDE BY
1 TO 32
DIVIDE BY
1 TO 32
LOCK
DETECT
PHASE
FREQUENCY
DETECTOR
PLL
REFERENCE
CHARGE
ΔT
ΔT
PUMP
LVDS/CMOS
HOLD
LVPECL
LVPECL
LD
CP
STATUS
OUT0
OUT0
OUT1
OUT1
OUT2
OUT2
OUT3
OUT3
OUT4 (OUT4A)
OUT4 (OUT4B)
OUT5 (OUT5A)
OUT5 (OUT5B)
AD9517-1
DIVIDE BY
1 TO 32
DIVIDE BY
1 TO 32
Figure 41. Detailed Block Diagram
Rev. 0 | Page 26 of 80
ΔT
ΔT
LVDS/CMOS
OUT6 (OUT6A)
OUT6 (OUT6B)
OUT7 (OUT7A)
OUT7 (OUT7B)
6425-002
AD9517-1

THEORY OF OPERATION

OPERATIONAL CONFIGURATIONS

The AD9517 can be configured in several ways. These configurations must be set up by loading the control registers (see
Tabl e 51 and Ta ble 52 through Tabl e 61 ). Each section or function must be individually programmed by setting the appropriate bits in the corresponding control register or registers.

High Frequency Clock Distribution—CLK or External VCO >1600 MHz

The AD9517 power-up default configuration has the PLL powered off and the routing of the input set so that the
CLK
CLK/ through the VCO divider (divide-by-2/divide-by-3/divide-by-4/ divide-by-5/divide-by-6). This is a distribution only mode that allows for an external input up to 2400 MHz (see maximum frequency that can be applied to the channel dividers is 1600 MHz; therefore, higher input frequencies must be divided down before reaching the channel dividers. This input routing can also be used for lower input frequencies, but the minimum divide is 2 before the channel dividers.
When the PLL is enabled, this routing also allows the use of the PLL with an external VCO or VCXO with a frequency less than 2400 MHz. In this configuration, the internal VCO is not used, and is powered off. The external VCO/VCXO feeds directly into the prescaler.
The register settings shown in these registers at power-up or after a reset operation. If the contents of the registers are altered by prior programming after power-up or reset, these registers may also be set intentionally to these values.
input is connected to the distribution section
Table 3 ). The
Table 2 1 are the default values of
Table 21. Default Settings of Some PLL Registers
Register Function
0x10<1:0> = 01b PLL asynchronous power-down (PLL off) 0x1E0<2:0> = 010b Set VCO divider = 4 0x1E1<0> = 0b Use the VCO divider 0x1E1<1> = 0b CLK selected as the source
When using the internal PLL with an external VCO, the PLL must be turned on.
Table 22. Settings When Using an External VCO
Register Function
0x10 to 0x1E PLL normal operation (PLL on) 0x1E1<1> = 0b
PLL settings. Select and enable a reference input; set R, N (P, A, B), PFD polarity, and I according to the intended loop configuration.
CP
An external VCO requires an external loop filter that must be connected between CP and the tuning pin of the VCO. This loop filter determines the loop bandwidth and stability of the PLL. Make sure to select the proper PFD polarity for the VCO being used.
Table 23. Setting the PFD Polarity
Register Function
0x10<7> = 0b
0x10<7> = 1b
PFD polarity positive (higher control voltage produces higher frequency)
PFD polarity negative (higher control voltage produces lower frequency)
Rev. 0 | Page 27 of 80
AD9517-1
V
T
R
)
VCO
REFIN (REF 1)
REFIN (REF 2)
BYPASS
CLK
CLK
PD
SYNC
RESET
SCLK
SDIO
SDO
CS
LF
REF_ SEL CPRSETVCP
REFERENCE
SWITCHOVER
REF1
REF2
STATUS
LOW DROPOU
EGULATOR (LDO
DIGITAL
LOGIC
SERIAL
CONTROL
PORT
STATUS
S GND RSET
DISTRI BUTION
REFERENCE
R
DIVIDE R
VCO STATUS
P, P + 1
PRESCALER
DIVIDE BY
2, 3, 4, 5, OR 6
01
N DIVIDER
A/B
COUNTERS
DIVIDE BY
1 TO 32
REFMON
PROGRAMMABLE
R DELAY
PROGRAMMABLE
N DELAY
DIVIDE BY
1 TO 32
DIVIDE BY
1 TO 32
DIVIDE BY
1 TO 32
LOCK
DETECT
PHASE
FREQUENCY
DETECTOR
PLL
REFERENCE
CHARGE
ΔT
ΔT
PUMP
LVDS/CMOS
HOLD
LVPECL
LVPECL
LD
CP
STATUS
OUT0
OUT0
OUT1
OUT1
OUT2
OUT2
OUT3
OUT3
OUT4 (OUT4A)
OUT4 (OUT4B)
OUT5 (OUT5A)
OUT5 (OUT5B)
AD9517-1
DIVIDE BY
1 TO 32
DIVIDE BY
1 TO 32
Figure 42. High Frequency Clock Distribution or External VCO >1600 MHz
Rev. 0 | Page 28 of 80
ΔT
ΔT
LVDS/CMOS
OUT6 (OUT6A)
OUT6 (OUT6B)
OUT7 (OUT7A)
OUT7 (OUT7B)
06425-029
AD9517-1

Internal VCO and Clock Distribution

When using the internal VCO and PLL, the VCO divider must be employed to ensure that the frequency presented to the channel dividers does not exceed its specified maximum frequency (1600 MHz, see
Tabl e 3). The internal PLL uses an external loop filter to set the loop bandwidth. The external loop filter is also crucial to the loop stability.
When using the internal VCO, it is necessary to calibrate the VCO (0x18<0>) to ensure optimal performance.
For internal VCO and clock distribution applications, the register settings shown in
Tabl e 2 4 should be used.
Table 24. Settings When Using Internal VCO
Register Function
0x10<1:0> = 00b PLL normal operation (PLL on). 0x10 to 0x1E
0x18<0> = 0, 0x232<0> = 1
0x18<0> = 1, 0x232<0> = 1
0x1E0<2:0>
0x1E1<0> = 0b
0x1E1<1> = 1b VCO selected as the source.
PLL settings. Select and enable a reference input; set R, N (P, A, B), PFD polarity, and I according to the intended loop configuration.
Reset VCO calibration (first time after power-up, this does not have to be done, but must be done subsequently).
Initiate VCO calibration.
VCO divider set to divide-by-2, divide-by-3, divide-by-4, divide-by-5, and divide-by-6.
Use the VCO divider as source for distribution section.
CP
Rev. 0 | Page 29 of 80
AD9517-1
V
REFIN ( REF1)
REFIN ( REF2)
BYPASS
CLK
CLK
PD
SYNC
RESET
SCLK
SDIO
SDO
CS
REF1
REF2
REGULATOR ( LDO)
LF
REF_ SEL CPRSETVCP
REFERENCE
SWITCHOVER
STATUS
STATUS
LOW DROPOUT
VCO
DIGITAL
LOGIC
SERIAL
CONTROL
PORT
S GND RSET
DISTRIBUTI ON
REFERENCE
R
DIVIDER
VCO STATUS
P, P + 1
PRESCALER
DIVIDE BY
2, 3, 4, 5, OR 6
01
N DIVIDE R
A/B
COUNTERS
DIVIDE BY
1 TO 32
REFMO N
PROGRAMMABLE
R DELAY
PROGRAMMABLE
N DELAY
DIVIDE BY
1 TO 32
DIVIDE BY
1 TO 32
DIVIDE BY
1 TO 32
LOCK
DETECT
PHASE
FREQUENCY
DETECTOR
PLL
REFERENCE
CHARGE
ΔT
ΔT
PUMP
LVDS/CMOS
HOLD
LVPECL
LVPECL
LD
CP
STATUS
OUT0
OUT0
OUT1
OUT1
OUT2
OUT2
OUT3
OUT3
OUT4 (OUT4A)
OUT4 (OUT4B)
OUT5 (OUT5A)
OUT5 (OUT5B)
OUT6 (OUT6A)
OUT6 (OUT6B)
OUT7 (OUT7A)
OUT7 (OUT7B)
06425-030
AD9517-1
DIVIDE BY
1 TO 32
DIVIDE BY
1 TO 32
ΔT
LVDS/CMOS
ΔT
Figure 43. Internal VCO and Clock Distribution
Rev. 0 | Page 30 of 80
AD9517-1

Clock Distribution or External VCO <1600 MHz

When the external clock source to be distributed or the external VCO/VCXO is <1600 MHz, a configuration that bypasses the VCO divider can be used. This only differs from the
High Frequency Clock Distribution—CLK or External VCO >1600 MHz section in that the VCO divider (divide-by-2, divide-by-3, divide-by-4, divide-by-5, and divide-by-6) is bypassed. This limits the frequency of the clock source to <1600 MHz (due to the maximum input frequency allowed at the channel dividers).
Configuration and Register Settings
For clock distribution applications where the external clock is <1600 MHz, the register settings shown in
Tabl e 25 should be used.
Table 26. Settings for Using Internal PLL with External VCO <1600 MHz
Register Function
0x1E1<0> = 1b
0x10<1:0> = 00b
Bypass the VCO divider as source for distribution section
PLL normal operation (PLL on) along with other appropriate PLL settings in 0x10 to 0x1E
An external VCO/VCXO requires an external loop filter that must be connected between CP and the tuning pin of the VCO/VCXO. This loop filter determines the loop bandwidth and stability of the PLL. Make sure to select the proper PFD polarity for the VCO/VCXO being used.
Table 25. Settings for Clock Distribution <1600 MHz
Register Function
0x10<1:0> = 01b PLL asynchronous power-down (PLL off) 0x1E1<0> = 1b
0x1E1<1> = 0b CLK selected as the source
Bypass the VCO divider as source for distribution section
When using the internal PLL with an external VCO <1600 MHz, the PLL must be turned on.
Table 27. Setting the PFD Polarity
Register Function
0x10<7> = 0
0x10<7> = 1
PFD polarity positive (higher control voltage produces higher frequency)
PFD polarity negative (higher control voltage produces lower frequency)
Rev. 0 | Page 31 of 80
AD9517-1
V
LO
OUT
R
)
VCO
DIVIDE BY
2, 3, 4
6
REFIN (REF1)
REFIN (REF2)
BYPASS
CLK
CLK
PD
SYNC
RESET
SCLK
SDIO
SDO
CS
LF
REF_ SEL CPRSETVCP
REFERENCE
SWITCHOVER
REF1
STATUS
REF2
W DROP
EGULATOR (LDO
DIGITAL
LOGIC
SERIAL
CONTROL
PORT
STATUS
S GND RSET
DISTRIBUTI ON
REFERENCE
R
DIVIDER
VCO STATUS
P, P + 1
PRESCALER
, 5, OR
01
N DIVIDER
A/B
COUNTERS
DIVIDE BY
1 TO 32
REFMON
PROGRAMMABLE
R DELAY
PROGRAMMABLE
N DELAY
DIVIDE BY
1 TO 32
DIVIDE BY
1 TO 32
DIVIDE BY
1 TO 32
LOCK
DETECT
PHASE
FREQUENCY
DETECTOR
PLL
REFERENCE
CHARGE
ΔT
ΔT
PUMP
LVDS/CMOS
HOLD
LVPECL
LVPECL
LD
CP
STATUS
OUT0
OUT0
OUT1
OUT1
OUT2
OUT2
OUT3
OUT3
OUT4 (OUT4A)
OUT4 (OUT4B)
OUT5 (OUT5A)
OUT5 (OUT5B)
OUT6 (OUT6A)
OUT6 (OUT6B)
OUT7 (OUT7A)
OUT7 (OUT7B)
06425-028
AD9517-1
DIVIDE BY
1 TO 32
DIVIDE BY
1 TO 32
ΔT
LVDS/CMOS
ΔT
Figure 44. Clock Distribution or External VCO <1600 MHz
Rev. 0 | Page 32 of 80
AD9517-1
VCPV

Phase-Locked Loop (PLL)

REF_SEL
SGND
RSET
REFMO N
CPRSET
N DIVIDER
DIST
REF
R DIVIDER
A/B
COUNTERS
0
1
REFIN ( REF1)
REFIN ( REF2)
BYPASS
LF
CLK
CLK
REFERENCE
SWITCHOVER
REF1
REF2
LOW DROPOUT
REGULATOR (LDO)
STATUS
VCO
STATUS
P, P + 1
PRESCALER
DIVIDE BY
2, 3, 4, 5, OR 6
01
Figure 45. PLL Functional Blocks
The AD9517 includes an on-chip PLL with an on-chip VCO. The PLL blocks can be used either with the on-chip VCO to create a complete phase-locked loop, or with an external VCO or VCXO. The PLL requires an external loop filter, which usually consists of a small number of capacitors and resistors. The configuration and components of the loop filter help to establish the loop bandwidth and stability of the operating PLL.
The AD9517 PLL is useful for generating clock frequencies from a supplied reference frequency. This includes conversion of reference frequencies to much higher frequencies for subsequent division and distribution. In addition, the PLL can be exploited to clean up jitter and phase noise on a noisy reference. The exact choices of PLL parameters and loop dynamics are application specific. The flexibility and depth of the AD9517 PLL allow the part to be tailored to function in many different applications and signal environments.
Configuration of the PLL
The AD9517 allows flexible configuration of the PLL, accommodating various reference frequencies, PFD comparison frequencies, VCO frequencies, internal or external VCO/VCXO, and loop dynamics. This is accomplished by the various settings that include the R divider, the N divider, the PFD polarity (only applicable to external VCO/VCXO), the antibacklash pulse width, the charge pump current, the selection of internal VCO or external VCO/VCXO, and the loop bandwidth. These are managed through programmable register settings (see and
Tabl e 53 ) and by the design of the external loop filter.
Tabl e 51
PROGRAMMABLE
R DELAY
PROGRAMMABLE
N DELAY
VCO STATUS
Successful PLL operation and satisfactory PLL loop performance are highly dependent upon proper configuration of the PLL settings. The design of the external loop filter is crucial to the proper operation of the PLL. A thorough knowledge of PLL theory and design is helpful.
ADIsimCLK (V1.2 or later) is a free program that can help with the design and exploration of the capabilities and features of the AD9517, including the design of the PLL loop filter. It is available at
Phase Frequency Detector (PFD)
The PFD takes inputs from the R counter and N counter and produces an output proportional to the phase and frequency difference between them. The PFD includes a programmable delay element that controls the width of the antibacklash pulse. This pulse ensures that there is no dead zone in the PFD transfer function and minimizes phase noise and reference spurs. The antibacklash pulse width is set by 0x17<1:0>.
An important limit to keep in mind is the maximum frequency allowed into the PFD. The maximum input frequency into the PFD is a function of the antibacklash pulse setting, as specified in the phase/frequency detector section of
LOCK
DETECT
PLL REF
PHASE
FREQUENCY
DETECTOR
CHARGE PUMP
www.analog.com/clocks.
HOLD
Tabl e 2.
LD
CP
STATUS
06425-064
Rev. 0 | Page 33 of 80
AD9517-1
Charge Pump (CP)
The charge pump is controlled by the PFD. The PFD monitors the phase and frequency relationship between its two inputs and tells the CP to pump up or pump down to charge or discharge the integrating node (part of the loop filter). The integrated and filtered CP current is transformed into a voltage that drives the tuning node of the internal VCO through the LF pin (or the tuning pin of an external VCO) to move the VCO frequency up or down. The CP can be set (0x10<6:4>) for high impedance (allows holdover operation), for normal operation (attempts to lock the PLL loop), for pump up, or for pump down (test modes). The CP current is programmable in eight steps from (nominally) 600 μA to 4.8 mA. The exact value of the CP current LSB is set by the CP_RSET resistor, which is nominally 5.1 kΩ.
On-Chip VCO
The AD9517 includes an on-chip VCO covering the frequency range shown in
Tabl e 2. Achieving low VCO phase noise was a
priority in the design of the VCO.
To tune over the wide range of frequencies covered by this VCO, ranges are used. This is largely transparent to the user but is the reason that the VCO must be calibrated when the PLL loop is first set up. The calibration procedure ensures that the VCO is operating within the correct band range for the frequency that it is asked to produce. See the
VCO Calibration section for
additional information.
The on-chip VCO is powered by an on-chip, low drop out (LDO), linear voltage regulator. The LDO provides some isolation of the VCO from variations in the power supply voltage level. The BYPASS pin should be connected to ground by a 220 nF capacitor to ensure stability. This LDO employs the same technology used in the anyCAP® line of regulators from Analog Devices, Inc., making it insensitive to the type of capacitor used. Driving an external load from the BYPASS pin is not supported.
PLL External Loop Filter
When using the internal VCO, the external loop filter should be referenced to the BYPASS pin for optimal noise and spurious performance. An example of an external loop filter for the PLL is shown in
Figure 46. A loop filter must be calculated for each desired PLL configuration. The values of the components depend upon the VCO frequency, the K
, the PFD frequency,
VCO
the CP current, the desired loop bandwidth, and the desired phase margin. The loop filter affects the phase noise, the loop settling time, and the loop stability. A knowledge of PLL theory is necessary for understanding the subject of loop filter design. There are tools available, such as ADIsimCLK, that can help with the calculation of a loop filter according to the application requirements.
PLL Reference Inputs
The AD9517 features a flexible PLL reference input circuit that allows either a fully differential input or two separate single­ended inputs. The input frequency range for the reference inputs is specified in the single-ended inputs are self-biased, allowing for easy ac coupling of input signals.
The differential input and the single-ended inputs share the two pins, REFIN (REF1)/ type is selected and controlled by 0x1C (see
When the differential reference input is selected, the self-bias level of the two sides is offset slightly (~100 mV, see prevent chattering of the input buffer when the reference is slow or missing. This increases the voltage swing required of the driver and overcomes the offset.
The single-ended inputs can be driven by either a dc-coupled CMOS level signal or an ac-coupled sine wave or square wave. Each single-ended input can be independently powered down when not needed to increase isolation and reduce power. Either a differential or a single-ended reference must be specifically enabled. All PLL reference inputs are off by default.
The differential reference input is powered down whenever the PLL is powered down or when the differential reference input is not selected. The single-ended buffers power down when the PLL is powered down and when their individual power-down registers are set. When the differential mode is selected, the single-ended inputs are powered down.
In differential mode, the reference input pins are internally self­biased so that they can be ac-coupled via capacitors. It is possible to dc couple to these inputs. If the differential REFIN is driven by a single-ended signal, the unused side (
decoupled via a suitable capacitor to a quiet ground. shows the equivalent circuit of REFIN.
AD9517-1
LF
VCO
CHARGE
PUMP
Figure 46. Example of External Loop Filter for PLL
CP
BYPASS
C
= 220nF
BP
R2
R1
C1 C2 C3
Tabl e 2. Both the differential and
REFIN
(REF2). The desired reference input
Tabl e 51 and Tabl e 5 3 ).
) should be
REFIN
06425-065
Tabl e 2) to
Figure 47
Rev. 0 | Page 34 of 80
AD9517-1
V
REF1
10k12k
REFIN
REFIN
10k10k
REF2
Figure 47. REFIN Equivalent Circuit
85k
85k
S
150
150
V
S
V
S
06425-066
Reference Switchover
The AD9517 supports dual single-ended CMOS inputs, as well as a single differential reference input. In the dual single-ended reference mode, the AD9517 supports automatic and manual PLL reference clock switching between REF1 (on Pin REFIN) and REF2 (on Pin
REFIN
). This feature supports networking and other applications that require redundant references. When using reference switchover, the single-ended reference inputs should be dc-coupled CMOS levels and never be allowed to go to high impedance. If these inputs are allowed to go to high impedance, noise may cause the buffer to chatter, causing a false detection of the presence of a reference.
There are several configurable modes of reference switchover. The switchover can be performed manually or automatically. The manual switchover is done either through a register setting (0x1D) or by using the REF_SEL pin. The automatic switchover occurs when REF1 disappears. There is also a switchover deglitch feature that ensures that the PLL does not receive rising edges that are far out of alignment with the newly selected reference.
There are two reference automatic switchover modes (0x1C):
Prefer REF1: Switch from REF1 to REF2 when REF1
disappears. Return to REF1 from REF2 when REF1 returns.
Stay on REF2: Automatically switch to REF2 if REF1 disappears,
but do not switch back to REF1 if it reappears. The reference can be set back to REF1 manually at an appropriate time.
In automatic mode, REF1 is monitored by REF2. If REF1 disappears (two consecutive falling edges of REF2 without an edge transition on REF1), REF1 is considered missing. Upon the next subsequent rising edge of REF2, REF2 is used as the reference clock to the PLL. If 0x1C<3> = 0b (default), when REF1 returns (four rising edges of REF1 without two falling edges of REF2 between the REF1 edges), the PLL reference switches back to REF1. If 0x1C<3> = 1b, the user can control when to switch back to REF1. This is done by programming the part to manual reference select mode (0x1C<4> = 0b) and by ensuring that the registers and/or REF_SEL pin are set to select the desired reference. Automatic mode can be re-enabled when REF1 is reselected.
Manual switchover requires the presence of a clock on the reference input that is being switched to or that the deglitching feature be disabled (0x1C<7>).
Reference Divider R
The reference inputs are routed to the reference divider, R. R (a 14-bit counter) can be set to any value from 0 to 16383 by writing to 0x11 and 0x12. (Both R = 0 and R = 1 give divide-by-1.) The output of the R divider goes to one of the PFD inputs to be compared with the VCO frequency divided by the N divider. The frequency applied to the PFD must not exceed the maximum allowable frequency, which depends on the antibacklash pulse setting (see
Tabl e 2).
The R counter has its own reset. The R counter can be reset using the shared reset bit of the R, A, and B counters. It can also be reset by a
SYNC
operation.
VCXO/VCO Feedback Divider N: P, A, B, R
The N divider is a combination of a prescaler (P) and two counters, A and B. The total divider value is
N = (P × B) + A
where P can be 2, 4, 8, 16, or 32.
Prescaler
The prescaler of the AD9517 allows for two modes of operation: a fixed divide (FD) mode of 1, 2, or 3, and dual modulus (DM) mode where the prescaler divides by P and (P + 1) {2 and 3, 4 and 5, 8 and 9, 16 and 17, or 32 and 33}. The prescaler modes of operation are given in available at all frequencies (see
Tabl e 53 , 0x16<2:0>. Not all modes are
Tabl e 2).
When operating the AD9517 in dual modulus mode (P//P + 1), the equation used to relate input reference frequency to VCO output frequency is
= (f
f
VCO
/R) × (P × B + A) = f
REF
× N/R
REF
However, when operating the prescaler in FD mode 1, 2, or 3, the A counter is not used (A = 0) and the equation simplifies to
f
= (f
VCO
/R) × (P × B) = f
REF
× N/R
REF
When A = 0, the divide is a fixed divide of P = 2, 4, 8, 16, or 32, in which case the previous equation also applies.
Rev. 0 | Page 35 of 80
AD9517-1
By using combinations of DM and FD modes, the AD9517 can achieve values of N all the way down to N = 1.
Tabl e 28 shows how a 10 MHz reference input may be locked to any integer multiple of N.
Note that the same value of N may be derived in different ways, as illustrated by the case of N = 12. The user may choose a fixed divide mode P = 2 with B = 6, or use the dual modulus mode 2/3 with A = 0, B = 6, or use the dual modulus mode 4/5 with A = 0, B = 3.
A and B Counters
The AD9517 B counter can be bypassed (B = 1). This B counter bypass mode is only valid when using the prescaler in FD mode. When A = 0, the divide is a fixed divide of P = 2, 4, 8, 16, or 32.
Unlike the R counter, an A = 0 is actually a zero. The B counter must be ≥3 or bypassed.
Table 28. How a 10 MHz Reference Input May Be Locked to Any Integer Multiple of N
FREF R P A B N FVCO Mode Notes
10 1 1 X 1 1 10 FD P = 1, B = 1 (bypassed) 10 1 2 X 1 2 20 FD P = 2, B = 1 (bypassed) 10 1 1 X 3 3 30 FD P = 1, B = 3 10 1 1 X 4 4 40 FD P = 1, B = 4 10 1 1 X 5 5 50 FD P = 1, B = 5 10 1 2 X 3 6 60 FD P = 2, B = 3 10 1 2 0 3 6 60 DM P and P + 1 = 2 and 3, A = 0, B = 3 10 1 2 1 3 7 70 DM P and P + 1 = 2 and 3, A = 1, B = 3 10 1 2 2 3 8 80 DM P and P + 1 = 2 and 3, A = 2, B = 3 10 1 2 1 4 9 90 DM P and P + 1 = 2 and 3, A = 1, B = 4 10 1 2 X 5 10 100 FD P = 2, B = 5 10 1 2 0 5 10 100 DM P and P + 1 = 2 and 3, A = 0, B = 5 10 1 2 1 5 11 110 DM P and P + 1 = 2 and 3, A = 1, B = 5 10 1 2 X 6 12 120 FD P = 2, B = 6 10 1 2 0 6 12 120 DM P and P + 1 = 2 and 3, A = 0, B = 6 10 1 4 0 3 12 120 DM P and P + 1 = 4 and 5, A = 0, B = 3 10 1 4 1 3 13 130 DM P and P + 1 = 4 and 5, A = 1, B = 3
The maximum input frequency to the A/B counter is reflected in the maximum prescaler output frequency specified in
Tabl e 2.
This is the prescaler input frequency (VCO or CLK) divided by P.
Although manual reset is not normally required, the A/B counters have their own reset bit. A and B counters can be reset using the shared reset bit of the R, A, and B counters. They may also be reset through a
R, A, and B Counters:
SYNC
operation.
SYNC
Pin Reset
The R, A and B counters may also be reset simultaneously through the (see
SYNC
Tabl e 53 ). The
pin. This function is controlled by 0x19<7:6>
SYNC
pin reset is disabled by default.
R and N Divider Delays
Both the R and N dividers feature a programmable delay cell. These delays may be enabled to allow adjustment of the phase relationship between the PLL reference clock and the VCO or CLK. Each delay is controlled by three bits. The total delay range is about 1 ns. See 0x19 in
Tabl e 53 .
Rev. 0 | Page 36 of 80
AD9517-1
V
V
CLKC

DIGITAL LOCK DETECT (DLD)

By selecting the proper output through the mux on each pin, the DLD function is available at the LD, STATUS, and REFMON pins. The DLD circuit indicates a lock when the time difference of the rising edges at the PFD inputs is less than a specified value (the lock threshold). The loss of a lock is indicated when the time difference exceeds a specified value (the unlock threshold). Note that the unlock threshold is wider than the lock threshold, which allows some phase error in excess of the lock window to occur without chattering on the lock indicator.
The lock detect window timing depends on three settings: the DLD window bit (0x18<4>), the antibacklash pulse width setting (0x17<1:0>, see (0x18<6:5>). A lock is not indicated until there is a programmable number of consecutive PFD cycles with a time difference less than the lock detect threshold. The lock detect circuit continues to indicate a lock until a time difference greater than the unlock threshold occurs on a single subsequent cycle. For the lock detect to work properly, the period of the PFD frequency must be greater than the unlock threshold. The number of consecutive PFD cycles required for lock is programmable (0x18<6:5>).

Analog Lock Detect (ALD)

The AD9517 provides an ALD function that may be selected for use at the LD pin. There are two versions of ALD:
N-channel open-drain lock detect. This signal requires a
pull-up resistor to the positive supply, VS. The output is normally high with short, low-going pulses. Lock is indicated by the minimum duty cycle of the low-going pulses.
P-channel open-drain lock detect. This signal requires a pull-
down resistor to GND. The output is normally low with short, high-going pulses. Lock is indicated by the minimum duty cycle of the high-going pulses.
The analog lock detect function requires an R-C filter to provide a logic level indicating lock/unlock.
Figure 48. Example of Analog Lock Detect Filter, Using

Current Source Digital Lock Detect (DLD)

During the PLL locking sequence, it is normal for the DLD signal to toggle a number of times before remaining steady when the PLL is completely locked and stable. There may be applications where it is desirable to have DLD asserted only after the PLL is solidly locked. This is possible by using the current source lock detect function. This function is set by selecting it as the output from the LD pin control (0x1A<5:0>).
Tabl e 2), and the lock detect counter
= 3.3
S
AD9517-1
LD
ALD
an N-Channel Open-Drain Driver
R2
R1
V
C
OUT
06425-067
The current source lock detect provides a current of 110 μA when DLD is true and shorts to ground when DLD is false. If a capacitor is connected to the LD pin, it charges at a rate determined by the current source during the DLD true time but is discharged nearly instantly when DLD is false. By monitoring the voltage at the LD pin (top of the capacitor), it is only possible to get a Logic High level after the DLD has been true for a sufficiently long time. Any momentary DLD false resets the charging. By selecting a properly sized capacitor, it is possible to delay a lock detect indication until the PLL is stably locked, and the lock detect does not chatter.
The voltage on the capacitor can be sensed by an external comparator connected to the LD pin. However, there is an internal LD pin comparator that can be read at the REFMON pin control (0x1B<4:0>) or the STATUS pin control (0x17<7:2>) as an active high signal. It is also available as an active low signal (REFMON, 0x1B<4:0> and STATUS, 0x17<7:2>). The internal LD pin comparator trip point and hysteresis are given in
AD9517-1
110µA
C
V
OUT
CLK
DLD
LD PIN
COMPARATOR
Figure 49. Current Source Lock Detect
LD
REFMON OR STATUS
External VCXO/VCO Clock Input (CLK/
)
Table 1 6.
06425-068
CLK is a differential input that can be used as an input to drive the AD9517 clock distribution section. This input can receive up to 2.4 GHz. The pins are internally self-biased, and the input signal should be ac-coupled via capacitors.
CLOCK INPUT
STAGE
06425-032
The CLK/
V
S
LK
2.5k 2.5k
5k
5k
Figure 50. CLK Equivalent Input Circuit
CLK
input can be used either as a distribution only input (with the PLL off ), or as a feedback input for an external VCO/VCXO using the internal PLL when the internal VCO is not used. The CLK/
CLK
input can be used for frequencies up
to 2.4 GHz.
Rev. 0 | Page 37 of 80
AD9517-1

Holdover

The AD9517 PLL has a holdover function. Holdover is implemented by putting the charge pump into a high impedance state. This is useful when the PLL reference clock is lost. Holdover mode allows the VCO to maintain a relatively constant frequency even though there is no reference clock. Without this function, the charge pump is placed into a constant pump-up or pump-down state resulting in a massive VCO frequency shift. Because the charge pump is placed in a high impedance state, any leakage that occurs at the charge pump output or the VCO tuning node causes a drift of the VCO frequency. This can be mitigated by using a loop filter that contains a large capacitive component because this drift is limited by the current leakage induced slew rate (I
LEAK
/C) of
the VCO control voltage.
SYNC
Both a manual holdover, using the
pin, and an automatic holdover mode are provided. To use either function, the holdover function must be enabled (0x1D<0> and 0x1D<2>).
[Note that the VCO cannot be calibrated with the holdover enabled because the holdover resets the N divider during calibration, which prevents proper calibration. Disable holdover before issuing a VCO calibration.]

Manual Holdover Mode

A manual holdover mode can be enabled that allows the user to place the charge pump into a high impedance state when the SYNC
pin is asserted low. This operation is edge sensitive, not level sensitive. The charge pump enters a high impedance state immediately. To take the charge pump out of a high impedance state take the
SYNC
pin high. The charge pump then leaves high impedance state synchronously with the next PFD rising edge from the reference clock. This prevents extraneous charge pump events from occurring during the time between
SYNC
going high and the next PFD event. This also means that the charge pump stays in a high impedance state as long as there is no reference clock present.
The B-counter (in the N divider) is reset synchronously with the charge pump leaving the high impedance state on the reference path PFD event. This helps align the edges out of the R and N dividers for faster settling of the PLL. Because the prescaler is not reset, this feature works best when the B and R numbers are close because this results in a smaller phase difference for the loop to settle out.
When using this mode, the channel dividers should be set to
SYNC
ignore the
pin (at least after an initial
dividers are not set to ignore the
SYNC
SYNC
event). If the
pin, any time
SYNC
is taken low to put the part into holdover the distribution outputs turn off.

Automatic/Internal Holdover Mode

When enabled, this function automatically puts the charge pump into a high impedance state when the loop loses lock. The assumption is that the only reason the loop loses lock is due to the PLL losing the reference clock; therefore, the holdover function puts the charge pump into a high impedance state to maintain the VCO frequency as close as possible to the original frequency before the reference clock disappears.
A flow chart of the automatic/internal holdover function
NO
NO
NO
NO
Figure 51.
LOOP OUT OF LOCK. DIGITAL LOCK DETECT SIGNAL GOES LOW WHEN THE LOOP LEA VES LOCK AS DET ERMINED BY THE PHASE DIFFERENCE AT THE INPUT OF THE PFD.
ANALOG LO CK DETECT PIN INDICATES LOCK WAS PREVIOUSLY ACHIEVED. (0x1D<3> = 1: USE L D PIN VOLT AGE WITH HOLDOVER. 0x1D<3> = 0: IGNO RE LD PIN VOLTAGE, TREAT LD PIN AS ALWAYS HIGH.)
CHARGE PUMP IS MADE HIGH IMPEDANCE . PLL COUNTERS CONTINUE OPERATING NORMALLY.
CHARGE PUMP REM AINS HIGH IMPEDANCE UNTIL THE REFERENCE HAS RETURNED.
YES
TAKE CHARGE PUMP OUT OF HIGH IMPEDANCE . PLL CAN NOW RESETTLE.
WAIT FOR DLD TO GO HIGH. THIS TAKES 5 TO 255 CYCLES ( PROGRAMMING OF THE DLD DELAY COUNTE R) WITH THE REFERENCE AND FEEDBACK CLOCKS INSIDE THE LOCK WINDOW AT THE PFD. THIS ENSURES THAT THE HOLDOVER FUNCTION WAITS FOR THE PLL TO SETTLE AND LOCK BEFORE THE HOLDOVER F UNCTION CAN BE RETRIGGE RED.
operation is shown in
PLL ENABLED
DLD == LOW
YES
WAS
LD PIN == HIGH
WHEN DLD WENT
LOW?
YES
HIGH IMPEDANCE
CHARGE PUMP
YES
REFERENCE
EDGE AT PFD?
YES
RELEASE
CHARGE PUMP
HIGH IMPEDANCE
YES
DLD == HIGH
Figure 51. Flow Chart of Automatic/Internal Holdover Mode
The holdover function senses the logic level of the LD pin as a condition to enter holdover. The signal at LD can be from the DLD, ALD, or current source LD mode. It is possible to disable the LD comparator (0x1D<3>), which causes the holdover function to always sense LD as high. If DLD is used, it is possible for the DLD signal to chatter some while the PLL is reacquiring lock. The holdover function may retrigger, thereby preventing the holdover mode from terminating. Use of the current source lock detect mode is recommended to avoid this situation (see the
Current Source Digital Lock Detect section).
6425-069
Rev. 0 | Page 38 of 80
AD9517-1
Once in holdover mode, the charge pump stays in a high impedance state as long as there is no reference clock present.
As in the external holdover mode, the B counter (in the N divider) is reset synchronously with the charge pump leaving high impedance state on the reference path PFD event. This helps to align the edges out of the R and N dividers for faster settling of the PLL and to reduce frequency errors during settling. Because the prescaler is not reset, this feature works best when the B and R numbers are close, resulting in a smaller phase difference for the loop to settle out.
After leaving holdover, the loop then reacquires lock and the LD pin must charge (if 0x1D<3> = 1) before it can re-enter holdover (CP high impedance).
The holdover function always responds to the state of the currently selected reference (0x1C). If the loop loses lock during a reference switchover (see the holdover is triggered briefly until the next reference clock edge at the PFD.
The following registers affect the automatic/internal holdover function:
0x18<6:5>—lock detect counter. This changes how many
consecutive PFD cycles with edges inside the lock detect window are required for the DLD indicator to indicate lock. This impacts the time required before the LD pin can begin to charge as well as the delay from the end of a holdover event until the holdover function can be re-engaged.
0x18<3>—disable digital lock detect. This bit must be set to a
0 to enable the DLD circuit. Automatic/internal holdover does not operate correctly without the DLD function enabled.
0x1A<5:0>—LD pin control. Set this to 000100b to put it in
the current source lock detect mode if using the LD pin comparator. Load the LD pin with a capacitor of an appropriate value.
Reference Switchover section),
For example, to use automatic holdover with:
Automatic reference switchover, prefer REF1.
Digital lock detect: five PFD cycles, high range window.
Automatic holdover using the LD pin comparator.
The following registers are set (in addition to the normal PLL registers):
0x18<6:5> = 00b; lock detect counter = five cycles.
0x18<4> = 0b; lock detect window = high range.
0x18<3> = 0b; DLD normal operation.
0x1A<5:0> = 000100b; current source lock detect mode.
0x1C<4> = 1b; automatic reference switchover enabled.
0x1C<3> = 0b; prefer REF1.
0x1C<2:1> = 11b; enable REF1 and REF2 input buffers.
0x1D<3> = 1b; enable LD pin comparator.
0x1D<2> = 1b; enable the holdover function.
0x1D<1> = 0b; use internal/automatic holdover mode.
0x1D<0> = 1b; enable the holdover function.

Frequency Status Monitors

The AD9517 contains three frequency status monitors that are used to indicate if the PLL reference (or references in the case of single-ended mode) and the VCO have fallen below a threshold frequency. A diagram showing their location in the PLL is shown in
The PLL reference monitors have two threshold frequencies: normal and extended (see monitor thresholds are selected in 0x1F.
Figure 52.
Tabl e 16 ). The reference frequency
0x1D<3>—enable LD pin comparator. 1 = enable; 0 = disable.
When disabled, the holdover function always senses the LD pin as high.
0x1D<1>—enable external holdover control.
0x1D<0> and 0x1D<2>—holdover enable. If holdover is
disabled, both external and automatic/internal holdover are disabled.
Rev. 0 | Page 39 of 80
AD9517-1
V
REFIN ( REF1)
REFIN ( REF2)
BYPASS
CLK
CLK
REF1
REF2
REGULATOR ( LDO)
LF
REF_SEL CPRSETVCP
REFERENCE
SWITCHOVER
STATUS
STATUS
LOW DROPOUT
VCO
S GND RSET
DISTRIBUTI ON
REFERENCE
R
DIVIDER
N DIVIDE R
P, P + 1
PRESCALER
DIVIDE BY
2, 3, 4, 5, OR 6
01
A/B
COUNTERS
Figure 52. Reference and VCO Status Monitors

VCO Calibration

The AD9517 on-chip VCO must be calibrated to ensure proper operation over process and temperature. The VCO calibration is controlled by a calibration controller running off a divided REFIN clock. The calibration requires that the PLL be set up properly to lock the PLL loop and that the REFIN clock be present. During the first initialization after a power-up or a reset of the AD9517, a VCO calibration sequence is initiated by setting 0x18<0> = 1b. This can be done as part of the initial setup before executing an update registers (0x232<0> = 1b). Subsequent to the initial setup, a VCO calibration sequence is initiated by resetting 0x18<0> = 0b, executing an update registers operation, setting 0x18<0> = 1b, and executing another update registers operation. A readback bit (0x1F<6>) indicates when a VCO calibration is finished by returning a logic true (that is, 1b).
The sequence of operations for the VCO calibration is:
Program the PLL registers to the proper values for the PLL loop.
For the initial setting of the registers after a power-up or
reset, initiate VCO calibration by setting 0x18<0> = 1b. Subsequently, whenever a calibration is desired, set 0x18<0> = 0b, update registers, and set 0x18<0> = 1b, update registers.
A SYNC operation is initiated internally, causing the outputs
to go to a static state determined by normal SYNC function operation.
VCO calibrates to the desired setting for the requested VCO
frequency.
Internally, the SYNC signal is released, allowing outputs to
continue clocking.
PLL loop is closed.
PLL locks.
PROGRAMMABLE
PROGRAMMABLE
VCO STATUS
0
1
REFMO N
LD
CP
STATUS
R DELAY
N DELAY
LOCK
DETECT
PHASE
FREQUENCY
DETECT OR
PLL
REFERENCE
CHARGE
PUMP
HOLD
A SYNC is executed during the VCO calibration; therefore, the outputs of the AD9517 are held static during the calibration, which prevents unwanted frequencies from being produced. However, at the end of a VCO calibration, the outputs may resume clocking before the PLL loop is completely settled.
The VCO calibration clock divider is set as shown in
Tabl e 53
(0x18<2:1>).
The calibration divider divides the PFD frequency (reference frequency divided by R) down to the calibration clock. The calibration occurs at the PFD frequency divided by the calibration divider setting. Lower VCO calibration clock frequencies result in longer times for a calibration to be completed.
The VCO calibration clock frequency is given by
= f
f
CAL_CLOCK
/(R × cal_div)
REFIN
where:
f
is the frequency of the REFIN signal.
REFIN
R is the value of the R divider. cal_div is the division set for the VCO calibration divider
(0x18<2:1>).
The VCO calibration takes 4400 calibration clock cycles. Therefore, the VCO calibration time in PLL reference clock cycles is given by
Time to Calibrate VCO =
4400 × R × cal_div PLL Reference Clock Cycles
Table 29. Example Time to Complete a VCO Calibration with Different f
f
(MHz) R Divider PFD Time to Calibrate VCO
REFIN
Frequencies
REFIN
100 1 100 MHz 88 μs 10 10 1 MHz 8.8 ms 10 100 100 kHz 88 ms
06425-070
Rev. 0 | Page 40 of 80
AD9517-1
VCO calibration must be manually initiated. This allows for flexibility in deciding what order to program registers and when to initiate a calibration, instead of having it happen every time certain PLL registers have their values change. For example, this allows for the VCO frequency to be changed by small amounts without having an automatic calibration occur each time; this should be done with caution and only when the user knows the VCO control voltage is not going to exceed the nominal best performance limits. For example, a few 100 kHz steps are fine, but a few MHz might not be. Additionally, because the calibration procedure results in rapid changes in the VCO frequency, the distribution section is automatically placed in SYNC until the calibration is finished. Therefore, this temporary loss of outputs must be expected.
A VCO calibration should be initiated under the following conditions:
After changing any of the PLL R, P, B, and A divider settings,
or after a change in the PLL reference clock frequency. This, in effect, means any time a PLL register or reference clock is changed such that a different VCO frequency results.
Whenever system calibration is desired. The VCO is designed
to operate properly over extremes of temperatures even when it is first calibrated at the opposite extreme. However, a VCO calibration can be initiated at any time, if desired.

CLOCK DISTRIBUTION

A clock channel consists of a pair (or double pair, in the case of CMOS) of outputs that share a common divider. A clock output consists of the drivers that connect to the output pins. The clock outputs have either LVPECL or LVDS/CMOS signal levels at the pins.
The AD9517 has four clock channels: two channels are LVPECL (four outputs); two channels are LVDS/CMOS (up to four LVDS outputs or up to eight CMOS outputs).
Each channel has its own programmable divider that divides the clock frequency applied to its input. The LVPECL channel dividers contain a divider that can divide by any integer from 1 to 32. Each LVDS/CMOS channel divider contains two cascaded dividers that can be set to divide by any integer from 1 to 32. The total division of the channel is the product of the divide value of the two cascaded dividers. This allows divide values of (1 to 32) × (1 to 32), or up to 1024 (notice that this is not all values from 1 to 1024 but only the set of numbers that are the product of the two dividers).
Because the internal VCO frequency is above the maximum channel divider input frequency (1600 MHz), the VCO divider must be used after the on-chip VCO. The VCO divider can be set to divide by 2, 3, 4, 5, or 6. External clock signals connected to the CLK input also require the VCO divider if the frequency of the signal is greater than 1600 MHz.
The channel dividers allow for a selection of various duty cycles, depending on the currently set division. That is, for any specific division, D, the output of the divider can be set to high for N + 1 input clock cycles and low for M + 1 input clock cycles (where D = N + M + 2). For example, a divide-by-5 can be high for one divider input cycle and low for four cycles, or a divide­by-5 can be high for three divider input cycles and low for two cycles. Other combinations are also possible.
The channel dividers include a duty-cycle correction function that can be disabled. In contrast to the selectable duty cycle just described, this function can correct a non-50% duty cycle caused by an odd division. However, this requires that the division be set by M = N + 1.
In addition, the channel dividers allow a coarse phase offset or delay to be set. Depending on the division selected, the output can be delayed by up to 31 input clock cycles. The divider outputs can also be set to start high or to start low.

Internal VCO or External CLK as Clock Source

The clock distribution of the AD9517 has two clock input sources: an internal VCO and an external clock connected to
0x1E1
CLK
pins. Either the internal VCO or CLK must be
Channel Divider Source VCO Divider
Tabl e 30
the CLK/ chosen as the source of the clock signal to distribute. When the internal VCO is selected as the source, the VCO divider must be used. When CLK is selected as the source, it is not necessary to use the VCO divider if the CLK frequency is less than the maximum channel divider input frequency (1600 MHz); otherwise, the VCO divider must be used to reduce the frequency to one acceptable by the channel dividers. shows how the VCO, CLK, and VCO divider are selected. 0x1E1<1:0> selects the channel divider source and determines whether the VCO divider is used. It is not possible to select the VCO without using the VCO divider.
Table 30. Selecting VCO or CLK as Source for Channel Divider and Whether VCO Divider Is Used
<1> <0>
0 0 CLK Used 0 1 CLK Not used 1 0 VCO Used 1 1 Not allowed Not allowed

CLK or VCO Direct to LVPECL Outputs

It is possible to connect either the internal VCO or the CLK (whichever is selected as the input to the VCO divider) directly to the LVPECL outputs, OUT0 to OUT3. This configuration can pass frequencies up to the maximum frequency of the VCO directly to the LVPECL outputs. The LVPECL outputs may not be able to provide a full voltage swing at the highest frequencies.
Rev. 0 | Page 41 of 80
AD9517-1
To connect the LVPECL outputs directly to the internal VCO or CLK, the VCO divider must be selected as the source to the distribution section, even if no channel uses it.
Either the internal VCO or the CLK can be selected as the source for the direct-to-output routing.
Table 31. Settings for Routing VCO Divider Input Directly to LVPECL Outputs
Register Setting Selection
0x1E1<1:0> = 00b CLK is the source; VCO divider selected 0x1E1<1:0> = 10b VCO is the source; VCO divider selected 0x192<1> = 1b Direct to output (OUT0, OUT1) 0x198<1> = 1b Direct to output (OUT2, OUT3)

Clock Frequency Division

The total frequency division is a combination of the VCO divider (when used) and the channel divider. When the VCO divider is used, the total division from the VCO or CLK to the output is the product of the VCO divider (2, 3, 4, 5, and 6) and the division of the channel divider.
Table 3 2 and Tab l e 3 3 indicate how the frequency division for a channel is set. For the LVPECL outputs, there is only one divider per channel. For the LVDS/CMOS outputs, there are two dividers (X.1, X.2) cascaded per channel.
Table 32. Frequency Division for Divider 0 and Divider 1
CLK or VCO Selected
CLK/VCO 2 to 6 1 (bypassed) Yes 1 CLK/VCO 2 to 6 1 (bypassed) No (2 to 6) × (1) CLK/VCO 2 to 6 2 to 32 No
CLK
CLK

VCO Divider

Not used
Not used
Channel Divider
1 (bypassed) No 1
2 to 32 No 2 to 32
Direct to Output
Frequency Division
(2 to 6) × (2 to 32)
Table 33. Frequency Division for Divider 2 and Divider 3
CLK or VCO Selected
CLK/VCO 2 to 6
CLK/VCO 2 to 6 2 to 32
CLK/VCO 2 to 6 2 to 32 2 to 32
CLK
CLK
CLK
VCO Divider
Not used
Not used
Not used
Channel Divider
X.1 X.2
1 (bypassed) 1 (bypassed)
1 (bypassed)
1 1 1
2 to 32 1 (2 to 32) × (1)
2 to 32 2 to 32
Frequency Division
(2 to 6) × (1) × (1)
(2 to 6) × (2 to 32) × (1)
(2 to 6) × (2 to 32) × (2 to 32)
2 to 32 × (2 to 32)
The channel dividers feeding the LVPECL output drivers contain one 2-to-32 frequency divider. This divider provides for division by 1 to 32. Division by 1 is accomplished by bypassing the divider. The dividers also provide for a programmable duty cycle, with optional duty-cycle correction when the divide ratio is odd. A phase offset or delay in increments of the input clock cycle is selectable. The channel dividers operate with a signal at their inputs up to 1600 MHz. The features and settings of the dividers are selected by programming the appropriate setup and control registers (see
Tabl e 51 through Tab le 6 1).
VCO Divider
The VCO divider provides frequency division between the internal VCO or the external CLK input and the clock distribution channel dividers. The VCO divider can be set to divide by 2, 3, 4, 5, or 6 (see
Table 5 9, 0x1E0<2:0>).

Channel Dividers—LVPECL Outputs

Each pair of LVPECL outputs is driven by a channel divider. There are two channel dividers (0, 1) driving four LVPECL outputs (OUT0 to OUT3).
Tabl e 3 4 gives the register locations used for setting the division and other functions of these dividers. The division is set by the values of M and N. The divider can be bypassed (equivalent to divide-by-1, divider circuit is powered down) by setting the bypass bit. The duty-cycle correction can be enabled or disabled according to the setting of the DCCOFF bits.
Table 34. Setting D
Low Cycles M High Cycles
Divider
0 0x190<7:4> 0x190<3:0> 0x191<7> 0x192<0> 1 0x196<7:4> 0x196<3:0> 0x197<7> 0x198<0>
for Divider 0 and Divider 1
X
N
Bypass DCCOFF
Channel Frequency Division (0, 1)
For each channel (where the channel number is x: 0, 1), the frequency division, D
, is set by the values of M and N
X
(four bits each, representing Decimal 0 to Decimal 15), where
Number of Low Cycles = M + 1
Number of High Cycles = N + 1
The cycles are cycles of the clock signal currently routed to the input of the channel dividers (VCO divider out or CLK).
When a divider is bypassed, D
Otherwise, D
= (N + 1) + (M + 1) = N + M + 2. This allows
X
= 1.
X
each channel divider to divide by any integer from 1 to 32.
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AD9517-1
Duty Cycle and Duty-Cycle Correction (0, 1)
The duty cycle of the clock signal at the output of a channel is a result of some or all of the following conditions:
What are the M and N values for the channel?
Is the DCC enabled?
Is the VCO divider used?
What is the CLK input duty cycle? (The internal VCO has a
50% duty cycle.)
The DCC function is enabled by default for each channel divider. However, the DCC function can be disabled individually for each channel divider by setting the DCCOFF bit for that channel.
Certain M and N values for a channel divider result in a non­50% duty cycle. A non-50% duty cycle can also result with an even division if M ≠ N. The duty-cycle correction function automatically corrects non-50% duty cycles at the channel divider output to 50% duty cycle. Duty-cycle correction requires the following channel divider conditions:
An even division must be set as M = N
An odd division must be set as M = N + 1
When not bypassed or corrected by the DCC function, the duty cycle of each channel divider output is the numerical value of (N + 1)/(N + M + 2) expressed as a %.
The duty cycle at the output of the channel divider for various configurations is shown in
Tabl e 3 5 to Ta bl e 37 .
Table 35. Duty Cycle with VCO Divider; Input Duty Cycle Is 50%
VCO Divider
Even
Odd = 3
Odd = 5
Even, Odd Even
Even, Odd Odd
N + M + 2 DCCOFF = 1 DCCOFF = 0
1 (divider bypassed)
1 (divider bypassed)
1 (divider bypassed)
D
X
50% 50%
33.3% 50%
40% 50%
(N + 1)/ (N + M + 2)
(N + 1)/ (N + M + 2)
Output Duty Cycle
50%; requires M = N
50%; requires M = N + 1
Table 36. Duty Cycle with VCO Divider; Input Duty Cycle Is X%
D
VCO Divider
Even
Odd = 3
Odd = 5
Even Even
Odd
Odd = 3 Even
Odd = 3 Odd
Odd = 5 Even
Odd = 5 Odd
X
N + M + 2 DCCOFF = 1 DCCOFF = 0
1 (divider bypassed)
1 (divider bypassed)
1 (divider bypassed)
50% 50%
33.3% (1 + X%)/3
40% (2 + X%)/5
(N + 1)/ (N + M + 2)
(N + 1)/ (N + M + 2)
(N + 1)/ (N + M + 2)
(N + 1)/ (N + M + 2)
(N + 1)/ (N + M + 2)
(N + 1)/ (N + M + 2)
Output Duty Cycle
50%, requires M = N
50%, requires M = N + 1
50%, requires M = N
(3N + 4 + X%)/(6N + 9), requires M = N + 1
50%, requires M = N
(5N + 7 + X%)/(10N + 15), requires M = N + 1
Table 37. Channel Divider Output Duty Cycle When the VCO Divider Is Not Used
D
Input Clock Duty Cycle
Any 1
Any Even
50% Odd
X% Odd
X
N + M + 2 DCCOFF = 1 DCCOFF = 0
1 (divider bypassed)
(N + 1)/ (M + N + 2)
(N + 1)/ (M + N + 2)
(N + 1)/ (M + N + 2)
Output Duty Cycle
Same as input duty cycle
50%, requires M = N
50%, requires M = N + 1
(N + 1 + X%)/(2 × N + 3), requires M = N + 1
The internal VCO has a duty cycle of 50%. Therefore, when the VCO is connected directly to the output, the duty cycle is 50%. If the CLK input is routed directly to the output, the duty cycle of the output is the same as the CLK input.
Rev. 0 | Page 43 of 80
AD9517-1
Phase Offset or Coarse Time Delay (0, 1)
Each channel divider allows for a phase offset, or a coarse time delay, to be programmed by setting register bits (see
Tabl e 38 ). These settings determine the number of cycles (successive rising edges) of the channel divider input frequency by which to offset, or delay, the rising edge of the output of the divider. This delay is with respect to a nondelayed output (that is, with a phase offset of zero). The amount of the delay is set by five bits loaded into the phase offset (PO) register plus the start high (SH) bit for each channel divider. When the start high bit is set, the delay is also affected by the number of low cycles (M) programmed for the divider.
It is necessary to use the SYNC function to make phase offsets effective (see the
Synchronizing the Outputs—SYNC Function
section).
Table 38. Setting Phase Offset and Division for Divider 0 and Divider 1
Divider
Start High (SH)
Phase Offset (PO)
Low Cycles M High Cycles
N
0 0x191<4> 0x191<3:0> 0x190<7:4> 0x190<3:0> 1 0x197<4> 0x197<3:0> 0x196<7:4> 0x196<3:0>
Let
= delay (in seconds).
Δ
t
Δ
= delay (in cycles of clock signal at input to DX).
c
T
= period of the clock signal at the input of the divider, DX
X
(in seconds). Φ = 16 × SH<4> + 8 × PO<3> + 4 × PO<2> + 2 × PO<1> + 1 × PO<0>.
The channel divide-by is set as N = high cycles and M = low cycles.
Case 1
For Φ ≤ 15: Δ
= Φ × TX
t
Δ
= Δt/TX = Φ
c
Case 2
For Φ ≥ 16: Δ
= (Φ − 16 + M + 1) × T
t
Δc = Δt/T
X
X
By giving each divider a different phase offset, output-to-output delays can be set in increments of the channel divider input clock cycle.
Figure 53 shows the results of setting such a coarse
offset between outputs.
CHANNEL
DIVIDER INPUT
DIVIDER 0
DIVIDER 1
DIVIDER 2
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
SH = 0 PO = 0
SH = 0 PO = 1
SH = 0 PO = 2
Tx
E
L
I
D
N
N
A
H
C
I
D
V
1 × Tx
2 × Tx
P
T
U
S
T
U
E
R
O
V
I
D
=
5
0
,
=
4
%
T
U
D
Y
Figure 53. Effect of Coarse Phase Offset (or Delay)
06425-071
Rev. 0 | Page 44 of 80

Channel Dividers—LVDS/CMOS Outputs

Channel Divider 2 and Channel Divider 3 each drive a pair of LVDS out p uts , g i v i n g f ou r LV D S o utputs (OUT4 to OUT7). Alternatively, each of these LVDS differential outputs can be configured individually as a pair (A and B) of CMOS single­ended outputs, providing for up to eight CMOS outputs. By default, the B output of each pair is off but can be turned on as desired.
Channel Divider 2 and Channel Divider 3 each consist of two cascaded, 1 to 32, frequency dividers. The channel frequency division is D
X.1
× D
or up to 1024. Both of the dividers also
X.2
have DCC enabled by default, but this function can be disabled, if desired, by setting the DCCOFF bit of the channel. A coarse phase offset or delay is also programmable (see the or Coarse Time Delay (Divider 2 and Divider 3)
Phase Offset
section). The channel dividers operate up to 1600 MHz. The features and settings of the dividers are selected by programming the appropriate setup and control registers (see through
Table 39. Setting Division (D
Tabl e 61 ).
) for Divider 2, Divider 3
X
Tabl e 51 and Tabl e 5 2
Divider M N Bypass DCCOFF
2 2.1 0x199<7:4> 0x199<3:0> 0x19C<4> 0x19D<0>
2.2 0x19B<7:4> 0x19B<3:0> 0x19C<5> 0x19D<0> 3 3.1 0x19E<7:4> 0x19E<3:0> 0x1A1<4> 0x1A2<0>
3.2 0x1A0<7:4> 0x1A0<3:0> 0x1A1<5> 0x1A2<0>
Channel Frequency Division (Divider 2 and Divider 3)
The division for each channel divider is set by the bits in the registers for the individual dividers (X.Y = 2.1, 2.2, 3.1, and 3.2)
Number of Low Cycles = M
Number of High Cycles = N
When both X.1 and X.2 are bypassed, D
When only X.2 is bypassed, D
When both X.1 and X.2 are not bypassed, D (N
+ M
X.2
+ 2).
X.2
X.Y
X.Y
= (N
X
+ 1
+ 1
X.1
= 1 × 1 = 1.
X
+ M
+ 2) × 1.
X.1
= (N
X
X.1
+ M
+ 2) ×
X.1
By cascading the dividers, channel division up to 1024 can be obtained. However, not all integer value divisions from 1 to 1024 are obtainable; only the values that are the product of the separate divisions of the two dividers (D
X.1
× D
X.2
) can be realized.
If only one divider is needed when using Divider 2 and Divider 3, use the first one (X.1) and bypass the second one (X.2). Do not bypass X.1 and use X.2.
AD9517-1
Duty Cycle and Duty-Cycle Correction (Divider 2 and Divider 3)
The same duty cycle and DCC considerations apply to Divider 2 and Divider 3 as to Divider 0 and Divider 1 (see Duty-Cycle Correction (0, 1)
); however, with these channel
Duty Cycle and
dividers, the number of possible configurations is even more complex.
Duty-cycle correction on Divider 2 and Divider 3 requires the following channel divider conditions:
An even D
must be set as M
X.Y
X.Y
= N
(low cycles = high
X.Y
cycles).
An odd D
must be set as M
X.Y
X.Y
= N
+ 1 (the number of
X.Y
low cycles must be one greater than the number of high cycles).
If only one divider is bypassed, it must be the second
divider, X.2.
If only one divider has an even divide-by, it must be the
second divider, X.2.
The possibilities for the duty cycle of the output clock from Divider 2 and Divider 3 are shown in
Tabl e 40 through Tab le 4 4.
Table 40. Divider 2 and Divider 3 Duty Cycle; VCO Divider Used; Duty Cycle Correction Off (DCCOFF = 1)
VCO Divider
D
X.1
N
+ M
X.1
+ 2 N
X.1
X.2
D
+ M
X.2
Output Duty Cycle
+ 2
X.2
Even 1 1 50% Odd = 3 1 1 33.3% Odd = 5 1 1 40% Even Even, Odd 1
Odd Even, Odd 1
Even Even, Odd Even, Odd
Odd Even, Odd Even, Odd
(N (N
(N (N
(N (N
(N (N
X.1
X.1
X.1
X.1
X.2
X.2
X.2
X.2
+ 1)/ + M
+ 1)/ + M
+ 1)/ + M
+ 1)/ + M
X.1
X.1
X.2
X.2
+ 2)
+ 2)
+ 2)
+ 2)
Table 41. Divider 2 and Divider 3 Duty Cycle; VCO Divider Not Used; Duty Cycle Correction Off (DCCOFF = 1)
Input Clock Duty Cycle
D
X.1
N
+ M
X.1
+ 2 N
X.1
X.2
D
+ M
X.2
X.2
+ 2
Output Duty Cycle
50% 1 1 50% X% 1 1 X% 50% Even, Odd 1
X% Even, Odd 1
50% Even, Odd Even, Odd
X% Even, Odd Even, Odd
(N (N
(N (N
(N (N
(N (N
+ 1)/
X.1
+ M
X.1
+ 1)/
X.1
+ M
X.1
+ 1)/
X.2
+ M
X.2
+ 1)/
X.2
+ M
X.2
X.1
X.1
X.2
X.2
+ 2)
+ 2)
+ 2)
+ 2)
Table 42. Divider 2 and Divider 3 Duty Cycle; VCO Divider Used; Duty Cycle Correction Is On (DCCOFF = 0); VCO Divider Input Duty Cycle = 50%
VCO Divider
D
X.1
N
+ M
X.1
+ 2 N
X.1
X.2
+ M
D
X.2
+ 2
X.2
Output Duty Cycle
Even 1 1 50% Odd 1 1 50% Even Even (N Odd Even (N Even Odd (M Odd Odd (M Even Even (N Odd Even (N Even Odd (M Odd Odd (M Even Odd (M Odd Odd (M
= M
X.1
X.1
X.1
X.1
X.1
X.1
X.1
X.1
X.1
X.1
) 1 50%
X.1
= M
) 1 50%
X.1
= N
+ 1) 1 50%
X.1
= N
+ 1) 1 50%
X.1
= M
X.1
= M
X.1
= N
+ 1) Even (N
X.1
= N
+ 1) Even (N
X.1
= N
+ 1) Odd (M
X.1
= N
+ 1) Odd (M
X.1
) Even (N ) Even (N
X.2
X.2
X.2
X.2
X.2
X.2
= M = M = M
= M = N = N
) 50%
X.2
) 50%
X.2
) 50%
X.2
) 50%
X.2
+ 1) 50%
X.2
+ 1) 50%
X.2
Rev. 0 | Page 45 of 80
AD9517-1
Table 43. Divider 2 and Divider 3 Duty Cycle; VCO Divider Used; Duty Cycle Correction On (DCCOFF = 0); VCO Divider Input Duty Cycle = X%
VCO Divider
D
X.1
N
+ M
X.1
+ 2 N
X.1
X.2
D
+ M
X.2
X.2
+ 2
Output Duty Cycle
Even 1 1 50% Odd = 3 1 1 (1 + X%)/3 Odd = 5 1 1 (2 + X%)/5 Even
Odd
Even
Odd = 3
Odd = 5
Even
Odd
Even
Odd
Even
Odd = 3
Odd = 5
Even (N
X.1
Even (N
X.1
Odd (M
X.1
Odd (M
X.1
Odd (M
X.1
Even (N
X.1
Even (N
X.1
Odd (M
X.1
Odd (M
X.1
Odd (M
X.1
Odd (M
X.1
Odd (M
X.1
= M
= M
= N
= N
= N
= M
= M
= N
= N
= N
= N
= N
X.1
X.1
X.1
X.1
X.1
X.1
X.1
X.1
X.1
X.1
X.1
X.1
1 50%
)
1 50%
)
1 50%
+ 1)
+ 1)
+ 1)
)
)
+ 1)
+ 1)
+ 1)
+ 1)
1
1
Even (N
X.2
Even (N
X.2
Even (N
X.2
Even (N
X.2
Odd (M
X.2
Odd (M
X.2
= M
= M
= M
= M
= N
= N
X.2
X.2
X.2
X.2
X.2
X.2
)
)
)
)
+ 1)
+ 1)
(3N (6N
(5N (10N
50%
50%
50%
50%
50%
(6N 9N
X.1
X.1
X.1
X.1NX.2
X.2
(3(2N (2N
X.2
+ 1)
Odd (M
X.2
= N
X.2
+ 1)
(10N 15N (5(2 N (2 N
+ 4 + X%)/ + 9)
+ 7 + X%)/
+ 15)
X.1
+ 9N
+ 13 + X%)/
+ 3)
X.1
+ 3))
+ 15N
X.1NX.2
+ 22 + X%)/
X.2
+ 3)
X.1
+ 3))
X.2
+
X.1
X.1
+
Table 44. Divider 2 and Divider 3 Duty Cycle; VCO Divider Not Used; Duty Cycle Correction On (DCCOFF = 0)
Input Clock Duty Cycle N
X.1
D
+ M
X.1
+ 2 N
X.1
X.2
D
+ M
X.2
Output Duty Cycle
+ 2
X.2
50% 1 1 50% 50%
Even (N
X.1
= M
X.1
1 50%
) X% 1 1 X% (High) X%
50%
X%
50%
X%
50%
X%
50%
X%
Even (N
X.1
Odd (M
X.1
Odd (M
X.1
Even (N
X.1
Even (N
X.1
Odd (M
X.1
Odd (M
X.1
Odd (M
X.1
Odd (M
X.1
= M
= N
= N
= M
= M
= N
= N
= N
= N
X.1
X.1
X.1
X.1
X.1
X.1
X.1
X.1
X.1
1 50%
)
1 50%
+ 1)
+ 1)
)
)
+ 1)
+ 1)
+ 1)
+ 1)
1
Even (N
X.2
Even (N
X.2
Even (N
X.2
Even (N
X.2
Odd (M
X.2
Odd (M
X.2
= M
= M
= M
= M
= N
= N
X.2
X.2
X.2
X.2
X.2
X.2
)
)
)
)
+ 1)
+ 1)
(N
X.1
(2N 50%
50%
50%
50%
50%
(2N 3N
X.2
((2N
+ 1 + X%)/
+ 3)
X.1
+ 3N
X.1NX.2
+ 4 + X%)/
+ 3)(2N
X.1
X.1
X.2
+
+ 3))
Phase Offset or Coarse Time Delay (Divider 2 and Divider 3)
Divider 2 and Divider 3 can be set to have a phase offset or delay. The phase offset is set by a combination of the bits in the phase offset and start high registers (see
Tabl e 45 ).
Table 45. Setting Phase Offset and Division for Divider 2 and Divider 3
Divider
Start High (SH)
Phase Offset (PO)
Low Cycles M
High Cycles N
2 2.1 0x19C<0> 0x19A<3:0> 0x199<7:4> 0x199<3:0>
2.2 0x19C<1> 0x19A<7:4> 0x19B<7:4> 0x19B<3:0> 3 3.1 0x1A1<0> 0x19F<3:0> 0x19E<7:4> 0x19E<3:0>
3.2 0x1A1<1> 0x19F<7:4> 0x1A0<7:4> 0x1A0<3:0>
Let:
= delay (in seconds).
Δ
t
Φ
= 16 × SH<0> + 8 × PO<3> + 4 × PO<2> + 2 × PO<1> +
x.y
1 × PO<0>. T
= period of the clock signal at the input to D
X.1
T
= period of the clock signal at the input to D
X.2
(in seconds).
X.1
(in seconds).
X.2
Rev. 0 | Page 46 of 80
AD9517-1
Case 1
When Φ
Δ
= Φ
t
≤ 15 and Φ
x.1
× T
x.1
X.1
+ Φ
X.2
x.2
× T
≤ 15:
x.2
Case 2
When Φ
Δ
= Φ
t
≤ 15 and Φ
x.1
× T
X.1
X.1
+ (Φ
≥ 16:
x.2
− 16 + M
X.2
+ 1) × T
X.2
X.2
Case 3
When Φ
Δ
= (Φ
t
≥ 16 and Φ
X.1
− 16 + M
X.1
X.2
+ 1) × T
X.1
≤ 15:
X.1
+ Φ
X.2
× T
X.2
Case 4
When Φ
Δ
=
t
− 16 + M
X.1
≥ 16 and Φ
X.1
X.1
X.2
+ 1) × T
≥ 16:
+ (Φ
X.1
− 16 + M
X.2
+ 1) × T
X.2
X.2
Fine Delay Adjust (Divider 2 and Divider 3)
Each AD9517 LVDS/CMOS output (OUT4 to OUT7) includes an analog delay element that can be programmed to give variable time delays (Δ
VCO
CLK
DIVIDER
DIVIDE R
X.1
) in the clock signal at that output.
t
BYPASS
ΔT
FINE DELAY
DIVIDER
X.2
Figure 54. Fine Delay (OUT4 to OUT7)
ADJUST
BYPASS
ΔT
FINE DELAY
ADJUST
CMOS
LVDS
CMOS
CMOS
LVDS
CMOS
OUTM
OUTM
OUTPUT DRIVERS
OUTN
OUTN
06425-072
The amount of delay applied to the clock signal is determined by programming four registers per output (see
Tabl e 46 ).
Table 46. Setting Analog Fine Delays
OUTPUT (LVDS/CMOS)
Ramp Capacitors
Ramp Current
Delay Fraction
Delay Bypass
OUT4 0xA1<5:3> 0xA1<2:0> 0xA2<5:0> 0xA0<0> OUT5 0xA4<5:3> 0xA4<2:0> 0xA5<5:0> 0xA3<0> OUT6 0xA7<5:3> 0xA7<2:0> 0xA8<5:0> 0xA6<0> OUT7 0xAA<5:3> 0xAA<2:0> 0xAB<5:0> 0xA9<0>
Calculating the Fine Delay
The following values and equations are used to calculate the delay of the delay block:
I
(μA) = 200 × (Ramp Current + 1)
RAMP
Number of Capacitors = Number of Bits = 0 in Ramp Capacitors + 1
Example: 101 = 1 + 1 = 2; 110 = 1 + 1 = 2; 100 = 2 + 1 = 3; 001 = 2 + 1 = 3; 111 = 0 + 1 = 1.
⎛ ⎜
+×+=
⎜ ⎝
)) × 1.3286
RAMP
I
CapsofNo.
RAMP
1
⎞ ⎟
6
×
⎟ ⎠
Delay Range (ns) = 200 × ((No. of Caps + 3)/(I
4
()
()
IOffset
RAMP
1016000.34ns
Delay Full Scale (ns) = Delay Range + Offset
Fine Delay (ns) = Delay Range × Delay Fraction × (1/63) + Offset
Note that only delay fraction values up to 47 decimals (101111b; 0x2F) are supported.
In no case can the fine delay exceed one-half of the output clock period. If a delay longer than half of the clock period is attempted, the output stops clocking.
The delay function adds some jitter greater than that specified for the nondelayed output. This means that the delay function should be used primarily for clocking digital chips, such as FPGA, ASIC, DUC, and DDC. An output with this delay enabled may not be suitable for clocking data converters. The jitter is higher for long full scales because the delay block uses a ramp and trip points to create the variable delay. A slower ramp time produces more time jitter.

Synchronizing the Outputs—SYNC Function

The AD9517 clock outputs can be synchronized to each other. Outputs can be individually excluded from synchronization. Synchronization consists of setting the nonexcluded outputs to a preset set of static conditions and subsequently releasing these outputs to continue clocking at the same instant with the preset conditions applied. This allows for the alignment of the edges of two or more outputs or for the spacing of edges according to the coarse phase offset settings for two or more outputs.
Rev. 0 | Page 47 of 80
AD9517-1
S
R
R
Synchronization of the outputs is executed in several ways:
SYNC
The
pin is forced low and then released (manual SYNC).
By setting and then resetting any one of the following three
bits: the soft SYNC bit (0x230<0>), the soft reset bit (0x00<5> [mirrored]), or the distribution power-down bit (0x230<1>).
Synchronization of the outputs can be executed as part of the
chip power-up sequence.
RESET
The
The
pin is forced low and then released (chip reset).
PD
pin is forced low and then released (chip power-down).
Whenever a VCO calibration is completed, an internal SYNC
signal is automatically asserted at the beginning and released upon the completion of a VCO calibration.
CHANNEL DIVIDE
OUTPUT CLOCKING
CHANNEL DIVIDER O UTPUT STAT IC
The most common way to execute the SYNC function is to use
SYNC
the This requires a low-going signal on the
pin to do a manual synchronization of the outputs.
SYNC
pin, which is held low and then released when synchronization is desired. The timing of the SYNC operation is shown in VCO divider) and
Figure 56 (VCO divider not used). There is
Figure 55 (using
an uncertainty of up to one cycle of the clock at the input to the channel divider due to the asynchronous nature of the SYNC signal with respect to the clock edges inside the AD9517. The delay from the
SYNC
rising edge to the beginning of synchronized output clocking is between 14 and 15 cycles of clock at the channel divider input, plus either one cycle of the VCO divider input (see (see
Figure 55), or one cycle of the channel divider input
Figure 56), depending on whether the VCO divider is used.
Cycles are counted from the rising edge of the signal.
Another common way to execute the SYNC function is by setting and resetting the soft SYNC bit at 0x230<0> (see through
Tabl e 61 for details). Both setting and resetting of the
Tabl e 52
soft SYNC bit require an update all registers (0x232<0> = 1) operation to take effect.
CHANNEL DIVIDE
OUTPUT CLOCKING
INPUT TO VCO DIVIDER
INPUT TO CHANNEL DIVIDER
YNC PIN
OUTPUT OF
CHANNEL DIVIDER
123 456 78910
14 TO 15 CYCLES AT CHANNEL DIVIDER INPUT + 1 CYCLE AT VCO DIVIDER I NPUT
Figure 55. SYNC Timing When VCO Divider Is Used—CLK or VCO Is Input
1
11
13 14
12
06425-073
Rev. 0 | Page 48 of 80
AD9517-1
R
V
CHANNEL DIVIDER
OUTPUT CLOCKING
CHANNEL DIVIDER O UTPUT ST ATIC
CHANNEL DIVIDE
OUTPUT CLOCKING
INPUT TO CLK
IINPUT TO CHANNEL DIVI DER
SYNC PIN
OUTPUT OF
CHANNEL DIVIDER
12345678910
14 TO 15 CYCLES AT CHANNEL DIVIDER INPUT + 1 CYCLE AT CLK INPUT
Figure 56. SYNC Timing When VCO Divider Is Not Used—CLK Input Only
A SYNC operation brings all outputs that have not been excluded (by the nosync bit) to a preset condition before allowing the outputs to begin clocking in synchronicity. The preset condition takes into account the settings in each of the channel’s start high bit and its phase offset. These settings govern both the static state of each output when the SYNC operation is happening and the state and relative phase of the outputs when they begin clocking again upon completion of the SYNC operation. Between outputs and after synchronization, this allows for the setting of phase offsets.
The AD9517 outputs are in pairs, sharing a channel divider per pair (two pairs of pairs, four outputs, in the case of CMOS). The synchronization conditions apply to both outputs of a pair.
Each channel (a divider and its outputs) can be excluded from any SYNC operation by setting the nosync bit of the channel. Channels that are set to ignore SYNC (excluded channels) do not set their outputs static during a SYNC operation, and their outputs are not synchronized with those of the nonexcluded channels.

Clock Outputs

The AD9517 offers three output level choices: LVPECL, LVDS, and CMOS. OUT0 to OUT3 are LVPECL differential outputs; and OUT4 to OUT7 are LVDS/CMOS outputs. These outputs can be configured as either LVDS differential or as pairs of single-ended CMOS outputs.
1
11
13 14
12
6425-074

LVPECL Outputs: OUT0 to OUT3

The LVPECL differential voltage (VOD) is selectable from ~400 mV to ~960 mV (see 0xF0:0xF5<3:2>). The LVPECL outputs have dedicated pins for power supply (VS_LVPECL), allowing a separate power supply to be used. V
S_LVPECL
can be
from 2.5 V to 3.3 V.
The LVPECL output polarity can be set as noninverting or inverting, which allows for the adjustment of the relative polarity of outputs within an application without requiring a board layout change. Each LVPECL output can be powered down or powered up as needed. Because of the architecture of the LVPECL output stages, there is the possibility of electrical overstress and breakdown under certain power-down conditions. For this reason, the LVPECL outputs have several power-down modes. This includes a safe power-down mode that continues to protect the output devices while powered down, although it consumes somewhat more power than a total power-down. If the LVPECL output pins are terminated, it is best to select the safe power-down mode. If the pins are not connected (unused), it is acceptable to use the total power-down mode.
3.3
OUT
OUT
GND
Figure 57. LVPECL Output Simplified Equivalent Circuit
Rev. 0 | Page 49 of 80
06425-033
AD9517-1
3
A
3
A
V

LVDS/CMOS Outputs: OUT4 to OUT7

OUT4 to OUT7 can be configured as either an LVDS differential output or as a pair of CMOS single-ended outputs. The LVDS outputs allow for selectable output current from ~1.75 mA to ~7 mA.
The LVDS output polarity can be set as noninverting or inverting, which allows for the adjustment of the relative polarity of outputs within an application without requiring a board layout change. Each LVDS output can be powered down if not needed to save power.
.5m
OUT
OUT
.5m
Figure 58. LVDS Output Simplified Equivalent Circuit with
3.5 mA Typical Current Source
06425-034
OUT4 to OUT7 can also be CMOS outputs. Each LVDS output can be configured to be two CMOS outputs. This provides for up to eight CMOS outputs: OUT4A, OUT4B, OUT5A, OUT5B, OUT6A, OUT6B, OUT7A, and OUT7B. When an output is configured as CMOS, the CMOS Output A is automatically turned on. The CMOS Output B can be turned on or off independently. The relative polarity of the CMOS outputs can also be selected for any combination of inverting and noninverting. See Tabl e 56 , 0x140<7:5>, 0x141<7:5>, 0x142<7:5>, and 0x143<7:5>.
Each LVDS/CMOS output can be powered-down as needed to save power. The CMOS output power-down is controlled by the same bit that controls the LVDS power-down for that output. This power-down control affects both the CMOS A and CMOS B outputs. However, when the CMOS A output is powered up, the CMOS B output can be powered on or off separately.
S
OUT
06425-035
Figure 59. CMOS Equivalent Output Circuit

RESET MODES

The AD9517 has several ways to force the chip into a reset condition that restores all registers to their default values and makes these settings active.

Power-On Reset—Start-Up Conditions When VS Is Applied

A power-on reset (POR) is issued when the VS power supply is turned on. This initializes the chip to the power-on conditions that are determined by the default register settings. These are indicated in the Default Value (Hex) column of
Tabl e 51 . At power-on, the AD9517 also executes a SYNC operation, which brings the outputs into phase alignment according to the default settings.
Asynchronous Reset via the
RESET
Pin
An asynchronous hard reset is executed by momentarily pulling RESET
low. A reset restores the chip registers to the default
settings.

Soft Reset via 0x00<5>

A soft reset is executed by writing 0x00<5> and 0x00<2> = 1b. This bit is not self-clearing; therefore, it must be cleared by writing 0x00<5> and 0x00<2> = 0b to reset it and complete the soft reset operation. A soft reset restores the default values to the internal registers. The soft reset bit does not require an update registers command (0x232) to be issued.

POWER-DOWN MODES

Chip Power-Down via PD
The AD9517 can be put into a power-down condition by pulling the functions and currents inside the AD9517. The chip remains in this power-down state until When woken up, the AD9517 returns to the settings programmed into its registers prior to the power-down, unless the registers are changed by new programming while the
The except the bias current necessary to maintain the LVPECL outputs in a safe shutdown mode. This is needed to protect the LVPECL output circuitry from damage that could be caused by certain termination and load configurations when tristated. Because this is not a complete power-down, it can be called sleep mode.
When the AD9517 is in a following state:
The PLL is off (asynchronous power-down).
The VCO is off.
The CLK input buffer is off.
All dividers are off.
All LVDS/CMOS outputs are off.
All LVPECL outputs are in safe off mode.
The serial control port is active, and the chip responds to
PD
pin low. Power-down turns off most of the
PD
is brought back to Logic High.
PD
pin is held low.
PD
power-down shuts down the currents on the chip,
PD
power-down, the chip is in the
commands.
Rev. 0 | Page 50 of 80
AD9517-1
If the AD9517 clock outputs must be synchronized to each other, a SYNC is required upon exiting power-down (see the Synchronizing the Outputs—SYNC Function section). A VCO calibration is not required when exiting power-down.

PLL Power-Down

The PLL section of the AD9517 can be selectively powered down. There are three PLL operating modes set by 0x10<1:0>, as shown in
In asynchronous power-down mode, the device powers down as soon as the registers are updated.
In synchronous power-down mode, the PLL power-down is gated by the charge pump to prevent unwanted frequency jumps. The device goes into power-down on the occurrence of the next charge pump event after the registers are updated.
Tab l e 5 3 .

Distribution Power-Down

The distribution section can be powered down by writing 0x230<1> = 1b. This turns off the bias to the distribution section. If the LVPECL power-down mode is normal operation (00b), it is possible for a low impedance load on that LVPECL output to draw significant current during this power-down. If the LVPECL power-down mode is set to 11b, the LVPECL output is not protected from reverse bias and can be damaged under certain termination conditions.

Individual Clock Output Power-Down

Any of the clock distribution outputs may be powered down individually by writing to the appropriate registers. The register map details the individual power-down settings for each output (see
Tabl e 51 ). The LVDS/CMOS outputs may be powered
down, regardless of their output load configuration.
The LVPECL outputs have multiple power-down modes (see
Tabl e 55 ), which give some flexibility in dealing with the various output termination conditions. When the mode is set to 10b, the LVPECL output is protected from reverse bias to 2 VBE + 1 V. If the mode is set to 11b, the LVPECL output is not protected from reverse bias and can be damaged under certain termination conditions. This setting also affects the operation when the distribution block is powered down with 0x230<1> = 1b (see the
Distribution Power-Down section).

Individual Circuit Block Power-Down

Other AD9517 circuit blocks (such as CLK, REF1, and REF2) can be powered down individually. This gives flexibility in configuring the part for power savings whenever certain chip functions are not needed.
Rev. 0 | Page 51 of 80
AD9517-1

SERIAL CONTROL PORT

The AD9517 serial control port is a flexible, synchronous, serial communications port that allows an easy interface with many industry-standard microcontrollers and microprocessors. The AD9517 serial control port is compatible with most synchronous transfer formats, including both the Motorola SPI® and Intel® SSR® protocols. The serial control port allows read/write access to all registers that configure the AD9517. Single- or multiple­byte transfers are supported, as well as MSB first or LSB first transfer formats. The AD9517 serial control port can be configured for a single bidirectional I/O pin (SDIO only) or for two unidirectional I/O pins (SDIO/SDO). By default, the AD9517 is in bidirectional mode, long instruction (long instruction is the only instruction mode supported).

SERIAL CONTROL PORT PIN DESCRIPTIONS

SCLK (serial clock) is the serial shift clock. This pin is an input. SCLK is used to synchronize serial control port reads and writes. Write data bits are registered on the rising edge of this clock, and read data bits are registered on the falling edge. This pin is internally pulled down by a 30 kΩ resistor to ground.
SDIO (serial data input/output) is a dual-purpose pin and acts as either an input only (unidirectional mode) or as both an input/output (bidirectional mode). The AD9517 defaults to the bidirectional I/O mode (0x00<7> = 0).
SDO
(serial data out) is used only in the unidirectional I/O
mode (0x00<7>) as a separate output pin for reading back data.
(chip select bar) is an active low control that gates the read
CS and write cycles. When
is high, SDO and SDIO are in a high
CS
impedance state. This pin is internally pulled up by a 30 kΩ resistor to VS.
13
SCLK
CS
SDO
SDIO
Figure 60. Serial Control Port
AD9517-1
14
SERIAL
15
CONTROL
16
PORT
06425-036

GENERAL OPERATION OF SERIAL CONTROL PORT

A write or a read operation to the AD9517 is initiated by pulling
CS bytes of data (plus instruction data) are transferred (see
In these modes,
boundary, allowing time for the system controller to process the next byte.
high during either part (instruction or data) of the transfer.
low.
CS
stalled high is supported in modes where three or fewer
Tabl e 47 ).
can temporarily return high on any byte
CS
can go high on byte boundaries only and can go
CS
During this period, the serial control port state machine enters a wait state until all data is sent. If the system controller decides to abort the transfer before all of the data is sent, the state machine must be reset by either completing the remaining transfers or by returning the
less than eight SCLK cycles). Raising the
low for at least one complete SCLK cycle (but
CS
on a nonbyte
CS
boundary terminates the serial transfer and flushes the buffer.
In the streaming mode (see Tab l e 47 ), any number of data bytes can be transferred in a continuous stream. The register address is automatically incremented or decremented (see the First Transfers
section). CS must be raised at the end of the last
MSB/LSB
byte to be transferred, thereby ending the stream mode.

Communication Cycle—Instruction Plus Data

There are two parts to a communication cycle with the AD9517. The first writes a 16-bit instruction word into the AD9517, coincident with the first 16 SCLK rising edges. The instruction word provides the AD9517 serial control port with information regarding the data transfer, which is the second part of the communication cycle. The instruction word defines whether the upcoming data transfer is a read or a write, the number of bytes in the data transfer, and the starting register address for the first byte of the data transfer.

Write

If the instruction word is for a write operation, the second part is the transfer of data into the serial control port buffer of the AD9517. Data bits are registered on the rising edge of SCLK.
The length of the transfer (1, 2, 3 bytes or streaming mode) is indicated by two bits (W1:W0) in the instruction byte. When the transfer is 1, 2, or 3 bytes, but not streaming,
CS
can be
raised after each sequence of eight bits to stall the bus (except after the last byte, where it ends the cycle). When the bus is stalled, the serial transfer resumes when
is lowered. Raising CS
CS
on a nonbyte boundary resets the serial control port. During a write, streaming mode does not skip over reserved or blank registers; therefore, the user must know what bit pattern to write to the reserved registers to preserve proper operation of the part. It does not matter what data is written to blank registers.
Because data is written into a serial control port buffer area, not directly into the actual control registers of the AD9517, an additional operation is needed to transfer the serial control port buffer contents to the actual control registers of the AD9517, thereby causing them to become active. The update registers operation consists of setting 0x232<0> = 1b (this bit is self­clearing). Any number of bytes of data can be changed before executing an update registers. The update registers simultaneously actuates all register changes that have been written to the buffer since any previous update.
Rev. 0 | Page 52 of 80
AD9517-1

Read

If the instruction word is for a read operation, the next N × 8 SCLK cycles clock out the data from the address specified in the instruction word, where N is 1 to 3 as determined by W1:W0. If N = 4, the read operation is in streaming mode, continuing until
is raised. Streaming mode does not skip over reserved
CS
or blank registers. The readback data is valid on the falling edge of SCLK.
The default mode of the AD9517 serial control port is the bidirectional mode. In bidirectional mode, both the sent data and the readback data appear on the SDIO pin. It is also possible to set the AD9517 to unidirectional mode (SDO enable register, 0x00<7>). In unidirectional mode, the readback data appears on the SDO pin.
A readback request reads the data that is in the serial control port buffer area, or the data in the active registers (see
Figure 61).
Readback of the buffer or active registers is controlled by 0x04<0>.
The AD9517 supports only the long instruction mode; therefore, 0x00<4:3> must be set to 11b (this register uses mirrored bits). Long instruction mode is the default at power-up or reset.
The AD9517 uses Register Address 0x00 to Register Address 0x232.
SCLK
SDIO
SDO
CS
SERIAL CONTROL PORT
WRITE RE GISTE R 0x232 = 0x01 TO UDATE REG ISTERS
Figure 61. Relationship Between Serial Control Port Buffer Registers and
Active Registers of the AD9517
UPDATE
REGISTERS
BUFFER REGISTERS
ACTIVE REGISTERS
06425-037

THE INSTRUCTION WORD (16 BITS)

The MSB of the instruction word is R/W, which indicates whether the instruction is a read or a write. The next two bits, W1:W0, indicate the length of the transfer in bytes. The final 13 bits are the address (A12:A0) at which to begin the read or write operation.
For a write, the instruction word is followed by the number of bytes of data indicated by Bits W1:W0 (see
Table 47. Byte Transfer Count
W1
0 0 1 0 1 2 1 1 1 Streaming mode
W0 Bytes to Transfer
0 3
Tabl e 47 ).
A12:A0: These 13 bits select the address within the register map that is written to or read from during the data transfer portion of the communications cycle. Only Bits<A9:A0> are needed to cover the range of the 0x232 registers used by the AD9517. Bits<A12:A10> must always be 0b. For multibyte transfers, this address is the starting byte address. In MSB first mode, subsequent bytes increment the address.

MSB/LSB FIRST TRANSFERS

The AD9517 instruction word and byte data can be MSB first or LSB first. Any data written to 0x00 must be mirrored; the upper four bits (7:4) must mirror the lower four bits (3:0). This makes it irrelevant whether LSB first or MSB first is in effect. As an example of this mirroring, see the default setting for this register: 0x18, which mirrors Bit 4 and Bit 3. This sets the long instruction mode (default, and is the only mode supported).
The default for the AD9517 is MSB first.
When LSB first is set by 0x00<2> and 0x00<6>, it takes effect immediately, because it only affects the operation of the serial control port and does not require that an update be executed.
When MSB first mode is active, the instruction and data bytes must be written from MSB to LSB. Multibyte data transfers in MSB first format start with an instruction byte that includes the register address of the most significant data byte. Subsequent data bytes must follow in order from the high address to the low address. In MSB first mode, the serial control port internal address generator decrements for each data byte of the multibyte transfer cycle.
When LSB first is active, the instruction and data bytes must be written from LSB to MSB. Multibyte data transfers in LSB first format start with an instruction byte that includes the register address of the least significant data byte followed by multiple data bytes. The internal byte address generator of the serial control port increments for each byte of the multibyte transfer cycle.
The AD9517 serial control port register address decrements from the register address just written toward 0x00 for multibyte I/O operations if the MSB first mode is active (default). If the LSB first mode is active, the register address of the serial control port increments from the address just written toward 0x232 for multibyte I/O operations.
Streaming mode always terminates when it hits Address 0x232. Note that unused addresses are not skipped during multibyte I/O operations.
Table 48. Streaming Mode (No Addresses Are Skipped)
Write Mode
LSB first MSB first Decrement 0x01, 0x00, 0x232, stop
Address Direction Stop Sequence
Increment 0x230, 0x231, 0x232, stop
Rev. 0 | Page 53 of 80
AD9517-1
K
K
Table 49. Serial Control Port, 16-Bit Instruction Word, MSB First
MSB LSB
I15 I14 I13 I12 I11 I10 I9 I8 I7 I6 I5 I4 I3 I2 I1 I0
R/W
CS
SCL
DON'T CARE
W1 W0 A12 = 0 A11 = 0 A10 = 0 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
DON'T CARE
DON'T CARE
SDIO A12W0W1R/W A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
16-BIT INST RUCTION HEADE R REGISTE R (N) DATA REG ISTER (N – 1) DATA
Figure 62. Serial Control Port Write—MSB First, 16-Bit Instruction, Two Bytes Data
CS
SCLK
DON'T CARE
SDIO
SDO
DON'T CARE
A12W0W1R/ W A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
REGISTE R (N) DATA16-BIT INST RUCTION HE ADER REG ISTER ( N – 1) DATA REG ISTER (N – 2 ) DATA REG ISTER (N – 3) DAT A
Figure 63. Serial Control Port Read—MSB First, 16-Bit Instruction, Four Bytes Data
t
CS
SCLK
SDIO
DON'T CARE
DON'T CARE
DS
t
S
R/W
t
DH
W1W0A12A11A10A9A8A7A6A5D4D3D2D1D0
t
HI
t
CLK
t
LO
t
C
DON'T CARE
DON'T CARE
Figure 64. Serial Control Port Write—MSB First, 16-Bit Instruction, Timing Measurements
CS
DON'T CARE
DON'T CARE
DON'T
CARE
6425-040
6425-038
06425-039
SCLK
t
DV
SDIO
SDO
DATA BIT N – 1DATA BIT N
06425-041
Figure 65. Timing Diagram for Serial Control Port Register Read
CS
DON'T CARE
SCL
SDIO
DON'T CARE
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 D1D0R/WW1W0 D2 D3 D4 D5 D6 D7 D0 D1 D2 D3 D4 D5 D6 D7
16-BIT INST RUCTION HEADE R REGIST ER (N) DATA RE GISTER ( N + 1) DATA
DON'T CARE
DON'T CARE
6425-042
Figure 66. Serial Control Port Write—LSB First, 16-Bit Instruction, Two Bytes Data
Rev. 0 | Page 54 of 80
AD9517-1
SCLK
CS
t
S
t
CLK
t
HI
t
DS
t
DH
t
LO
t
C
SDIO
BIT N BIT N + 1
Figure 67. Serial Control Port Timing—Write
Table 50. Serial Control Port Timing
Parameter Description
t
DS
t
DH
t
CLK
t
S
t
C
t
HI
t
LO
t
DV
Setup time between data and rising edge of SCLK Hold time between data and rising edge of SCLK Period of the clock Setup time between CS falling edge and SCLK rising edge (start of communication cycle) Setup time between SCLK rising edge and CS rising edge (end of communication cycle) Minimum period that SCLK should be in a Logic High state Minimum period that SCLK should be in a Logic Low state SCLK to valid SDIO and SDO (see Figure 65)
06425-043
Rev. 0 | Page 55 of 80
AD9517-1

REGISTER MAP OVERVIEW

Table 51. Register Map Overview
Default Addr (Hex)
Serial Port Configuration
00 Serial Port
01 Blank 02 to
03 04 Read Back
PLL
10 PFD and
11 R Counter 14-Bit R Divider Bits<7:0> (LSB) 01 12 Blank 14-Bit R Divider Bits<13:8> (MSB) 00 13 A Counter Blank 6-Bit A Counter 00 14 13-Bit B Counter Bits<7:0> (LSB) 03 15 16 PLL Control 1 Set CP Pin
17 PLL Control 2 STATUS Pin Control Antibacklash Pulse Width 00 18 PLL Control 3 Reserved Lock Detect Counter Digital Lock
19 PLL Control 4
1A PLL Control 5 Reserved Reference
1B PLL Control 6 VCO
1C PLL Control 7 Disable
1D PLL Control 8 Reserved PLL Status
1E PLL Control 9
1F PLL Readback Reserved VCO Cal
20 to 4F
Parameter
Configuration
Control
Charge Pump
B Counter
Bit 7 (MSB)
SDO Active
PFD Polarity
/2
to V
CP
R, A, B Counters
Pin Reset
Frequency Monitor
Switchover Deglitch
Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 (LSB)
LSB First Soft Reset Long
Charge Pump Current Charge Pump Mode PLL Power-Down 7D
Blank 13-Bit B Counter Bits<12:8> (MSB) 00
Reset R Counter
SYNC
Frequency Monitor Threshold
REF2
REFIN
( Frequency Monitor
Select REF2
Finished
)
Reset A and B Counters
REF1 (REFIN) Frequency Monitor
Use REF_SEL Pin
Holdover Active
Instruction
Reserved
Blank Read Back
Reset All Counters
Detect Window
R Path Delay N Path Delay 00
Automatic Reference Switchover
Register Disable
REF2 Selected
Blank
Long Instruction
B Counter Bypass
Disable Digital Lock Detect
Stay on REF2
LD Pin Comparator Enable
Reserved
VCO Frequency > Threshold
Soft Reset LSB First SDO Active 18
Active Registers
Prescaler P 06
VCO Calibration Divider VCO Cal
LD Pin Control 00
REFMON Pin Control 00
REF2 Power On
Holdover Enable
REF2 Frequency > Threshold
REF1 Power On
External Holdover Control
REF1 Frequency >Threshold
Now
Differential Reference
Holdover Enable
Digital Lock Detect
Value
(Hex)
00
06
00
00
00
--
Rev. 0 | Page 56 of 80
AD9517-1
Default Addr (Hex)
Fine Delay Adjust: OUT4 to OUT7
A0 OUT4 Delay
A1 OUT4 Delay
A2 OUT4 Delay
A3 OUT5 Delay
A4 OUT5 Delay
A5 OUT5 Delay
A6 OUT6 Delay
A7 OUT6 Delay
Parameter
Bypass
Full-Scale
Fraction
Bypass
Full-Scale
Fraction
Bypass
Full-Scale
Bit 7 (MSB)
Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 (LSB)
Blank OUT4 Delay
Bypass
Blank OUT4 Ramp Capacitors OUT4 Ramp Current 00
Blank OUT4 Delay Fraction 00
Blank OUT5 Delay
Bypass
Blank OUT5 Ramp Capacitors OUT5 Ramp Current 00
Blank OUT5 Delay Fraction 00
Blank OUT6 Delay
Bypass
Blank OUT6 Ramp Capacitors OUT6 Ramp Current 00
Value
(Hex)
01
01
01
A8 OUT6 Delay
Fraction
A9 OUT7 Delay
Bypass
AA OUT7 Delay
Full-Scale
AB OUT7 Delay
Fraction
AC to EF
LVPECL Outputs
F0 OUT0 Blank OUT0
F1 OUT1 Blank OUT1
F2 to F3
F4 OUT2 Blank OUT2
F5 OUT3 Blank OUT3
F6 to 13F
LVDS/CMOS Outputs
140 OUT4 OUT4 CMOS Output
Polarity
141 OUT5 OUT5 CMOS Output
Polarity
142 OUT6 OUT6 CMOS Output
Polarity
143 OUT7 OUT7 CMOS Output
Polarity
144 to 18F
Blank OUT6 Delay Fraction 00
Blank OUT7 Delay
Blank OUT7 Ramp Capacitors OUT7 Ramp Current 00
Blank OUT7 Delay Fraction 00
Blank
Invert
Invert
Reserved
Invert
Invert
Blank
OUT4 LVDS/ CMOS Output Polarity
OUT5 LVDS/ CMOS Output Polarity
OUT6 LVDS/ CMOS Output Polarity
OUT7 LVDS/ CMOS Output Polarity
OUT4 CMOS B
OUT5 CMOS B
OUT6 CMOS B
OUT7 CMOS B
Blank
OUT0 LVPECL
Differential Voltage
OUT1 LVPECL
Differential Voltage
OUT2 LVPECL
Differential Voltage
OUT3 LVPECL
Differential Voltage
OUT4 Select LVDS/CMOS
OUT5 Select LVDS/CMOS
OUT6 Select LVDS/CMOS
OUT7 Select LVDS/CMOS
OUT0 Power-Down 08
OUT1 Power-Down A
OUT2 Power-Down 08
OUT3 Power-Down 0A
OUT4 LVDS Output
Current
OUT5 LVDS Output
Current
OUT6 LVDS Output
Current
OUT7 LVDS Output
Current
Bypass
OUT4 Power-Down
OUT5 Power-Down
OUT6 Power-Down
OUT7 Power-Down
01
42
43
42
43
Rev. 0 | Page 57 of 80
AD9517-1
Default Addr (Hex)
LVPECL Channel Dividers
190 Divider 0
191 Divider 0
192 Blank Reserved Divider 0
193 to 195
196 Divider1
197 Divider 1
198 Blank Reserved Divider 1
LVDS/CMOS Channel Dividers
199 Divider 2
19A Phase Offset Divider 2.2 Phase Offset Divider 2.1 00 19B Low Cycles Divider 2.2 High Cycles Divider 2.2 11
19C Reserved Bypass
19D Blank Reserved Divider 2
19E Divider 3
19F Phase Offset Divider 3.2 Phase Offset Divider 3.1 00 1A0 Low Cycles Divider 3.2 High Cycles Divider 3.2 11 1A1 Reserved Bypass
1A2 Blank Reserved Divider 3
1A3 Reserved
1A4 to 1DF
VCO Divider and CLK Input
1E0 VCO Divider Blank Reserved VCO Divider 02
Parameter
(PECL)
(PECL)
(LVDS/CMOS)
(LVDS/CMOS)
Bit 7 (MSB)
Bypass
Bypass
Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1
Divider 0 Low Cycles Divider 0 High Cycles 00
Divider 0 Nosync
Divider 1 Low Cycles Divider 1 High Cycles 00
Divider 1 Nosync
Low Cycles Divider 2.1 High Cycles Divider 2.1 22
Low Cycles Divider 3.1 High Cycles Divider 3.1 22
Divider 0 Force High
Divider 1 Force High
Divider 2.2
Divider 3.2
Divider 0 Start High
Reserved
Divider 1 Start High
Bypass Divider 2.1
Bypass Divider 3.1
Blank
Divider 2 Nosync
Divider 3 Nosync
Divider 0 Phase Offset 80
Direct to Output
Divider 1 Phase Offset 00
Direct to Output
Divider 2 Force High
Divider 3 Force High
Start High Divider 2.2
Start High Divider 3.2
Bit 0 (LSB)
Divider 0 DCCOFF
Divider 1 DCCOFF
Start High Divider 2.1
DCCOFF
Start High Divider 3.1
DCCOFF
Value
(Hex)
00
00
00
00
00
00
1E1 Input CLKs Reserved Power-
1E2 to 22A
Down Clock Input Section
Blank
Rev. 0 | Page 58 of 80
Power-Down VCO Clock Interface
Power­Down VCO and CLK
Select VCO or CLK
Bypass VCO Divider
00
AD9517-1
Default Addr (Hex)
System
230 Power-Down
231 Blank Reserved 00
Update All Registers
232 Update All
Parameter
and Sync
Registers
Bit 7 (MSB)
Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1
Reserved Power-
Down Sync
Blank Update All
Power­Down Distribution Reference
Bit 0 (LSB)
Soft Sync 00
Registers (Self-Clearing Bit)
Value
(Hex)
00
Rev. 0 | Page 59 of 80
AD9517-1

REGISTER MAP DESCRIPTIONS

Tabl e 52 through Tab le 6 1 provide a detailed description of each of the control register functions. The registers are listed by hexadecimal address. Reference to a specific bit or range of bits within a register is indicated by angle brackets. For example, <3> refers to Bit 3, and <5:2> refers to the range of bits from Bit 5 through Bit 2.
Table 52. Serial Port Configuration
Reg. Addr (Hex) Bit(s) Name Description
00 <7> SDO Active Selects unidirectional or bidirectional data transfer mode. <7> = 0; SDIO pin used for write and read; SDO set high impedance; bidirectional mode. <7> = 1; SDO used for read; SDIO used for write; unidirectional mode. 00 <6> LSB First MSB or LSB data orientation. <6> = 0; data-oriented MSB first; addressing decrements. <6> = 1; data-oriented LSB first; addressing increments. 00 <5> Soft Reset Soft Reset.
00 <4> Long Instruction
<4> = 0; 8-bit instruction (short). <4> = 1; 16-bit instruction (long). 00 <3:0> Mirror<7:4>
<0> = <7>. <1> = <6>. <2> = <5>. <3> = <4>. 04 <0> Read Back Active Registers Select register bank used for a readback. <0> = 0; read back buffer registers. <0> = 1; read back active registers.
<5> = 1 (not self-clearing). Soft reset; restores default values to internal registers. Not self-clearing. Must be cleared to 0b to complete reset operation.
Short/long instruction mode (this part uses long instruction mode only, so this bit should always be = 1).
Bits<3:0> should always mirror Bits<7:4> so that it does not matter whether the part is in MSB or LSB first mode (see Register 0x00<6>). User should set bits as follows:
Rev. 0 | Page 60 of 80
AD9517-1
Table 53. PLL
Reg. Addr (Hex)
Bit(s) Name Description
10 <7> PFD Polarity
<7> = 0; positive (higher control voltage produces higher frequency). <7> = 1; negative (higher control voltage produces lower frequency). 10 <6:4> CP Current Charge pump current (with CPRSET = 5.1 kΩ).
0 0 0 0.6 0 0 1 1.2 0 1 0 1.8 0 1 1 2.4 1 0 0 3.0 1 0 1 3.6 1 1 0 4.2 1 1 1 4.8 10 <3:2> CP Mode Charge pump operating mode.
0 0 High impedance state. 0 1 Force source current (pump up). 1 0 Force sink current (pump down). 1 1 Normal operation. 10 <1:0> PLL Power- PLL operating mode. Down 0 0 Normal operation. 0 1 Asynchronous power-down. 1 0 Normal operation. 1 1 Synchronous power-down. 11 <7:0>
12 <5:0>
13 <5:0>
14 <7:0>
15 <4:0>
16 <7> Set CP Pin Set the CP pin to one-half of the VCP supply voltage. to VCP/2 <7> = 0; CP normal operation. <7> = 1; CP pin set to VCP/2. 16 <6> Reset R Reset R counter (R divider). Counter <6> = 0; normal. <6> = 1; reset R counter. 16 <5> Reset A and B Reset A and B counters (part of N divider). Counters <5> = 0; normal. <5> = 1; reset A and B counters.
14-Bit R Divider Bits<7:0> (LSB)
14-Bit R Divider Bits<13:8> (MSB)
6-Bit A Counter
13-Bit B Counter Bits<7:0> (LSB)
13-Bit B Counter Bits<12:8> (MSB)
Sets the PFD polarity. Negative polarity is for use (if needed) with external VCO/VCXO only. The on-chip VCO requires positive polarity <7> = 0.
<6> <5> <4> ICP (mA)
<3> <2> Charge Pump Mode
<1> <0> Mode
R divider LSBs—lower eight bits.
R divider MSBs—upper six bits.
A counter (part of N divider).
B counter (part of N divider)—lower eight bits.
B counter (part of N divider)—upper five bits.
Rev. 0 | Page 61 of 80
AD9517-1
Reg. Addr (Hex) Bit(s)
16 <4> Reset All Reset R, A, and B counters. Counters <4> = 0; normal. <4> = 1; reset R, A, and B counters. 16 <3> B Counter B counter bypass. This is valid only when operating the prescaler in FD mode. Bypass <3> = 0; normal.
16 <2:0> Prescaler P Prescaler: DM = dual modulus and FD = fixed divide.
0 0 0 FD Divide-by-1. 0 0 1 FD Divide-by-2. 0 1 0 DM Divide-by-2 and divide-by-3 when A ≠ 0; divide-by-2 when A = 0. 0 1 1 DM Divide-by-4 and divide-by-5 when A ≠ 0; divide-by-4 when A = 0. 1 0 0 DM Divide-by-8 and divide-by-9 when A ≠ 0; divide-by-8 when A = 0. 1 0 1 DM Divide-by-16 and divide-by-17 when A ≠ 0; divide-by-16 when A = 0. 1 1 0 DM Divide-by-32 and divide-by-33 when A ≠ 0; divide-by-32 when A = 0. 1 1 1 FD Divide-by-3. 17 <7:2> STATUS Select the signal that is connected to the STATUS pin Pin Control
0 0 0 0 0 0 LVL Ground (dc). 0 0 0 0 0 1 DYN N divider output (after the delay). 0 0 0 0 1 0 DYN R divider output (after the delay). 0 0 0 0 1 1 DYN A divider output. 0 0 0 1 0 0 DYN Prescaler output. 0 0 0 1 0 1 DYN PFD up pulse. 0 0 0 1 1 0 DYN PFD down pulse. 0 X X X X X LVL Ground (dc); for all other cases of 0XXXXX not specified. The selections that follow are the same as REFMON. 1 0 0 0 0 0 LVL Ground (dc). 1 0 0 0 0 1 DYN REF1 clock (differential reference when in differential mode). 1 0 0 0 1 0 DYN REF2 clock (N/A in differential mode). 1 0 0 0 1 1 DYN
1 0 0 1 0 0 DYN
1 0 0 1 0 1 LVL
1 0 0 1 1 0 LVL
1 0 0 1 1 1 LVL Status REF1 frequency (active high). 1 0 1 0 0 0 LVL Status REF2 frequency (active high). 1 0 1 0 0 1 LVL (Status REF1 frequency) AND (status REF2 frequency). 1 0 1 0 1 0 LVL (DLD) AND (status of selected reference) AND (status of VCO). 1 0 1 0 1 1 LVL Status of VCO frequency (active high). 1 0 1 1 0 0 LVL Selected reference (low = REF1, high = REF2). 1 0 1 1 0 1 LVL Digital lock detect (DLD); active high. 1 0 1 1 1 0 LVL Holdover active (active high). 1 0 1 1 1 1 LVL LD pin comparator output (active high). 1 1 0 0 0 0 LVL VS (PLL supply).
Name Description
<3> = 1; B counter is set to divide-by-1. This allows the prescaler setting to determine the divide for the N divider.
<2> <1> <0> Mode Prescaler
<7> <6> <5> <4> <3> <2>
Level or Dynamic Signal
Signal at STATUS Pin
Selected reference to PLL (differential reference when in differential mode).
Unselected reference to PLL (not available in differential mode).
Status of selected reference (status of differential reference); active high.
Status of unselected reference (not available in differential mode); active high.
Rev. 0 | Page 62 of 80
AD9517-1
Reg. Addr (Hex) Bit(s)
1 1 0 0 0 1 DYN 1 1 0 0 1 0 DYN 1 1 0 0 1 1 DYN
1 1 0 1 0 0 DYN
1 1 0 1 0 1 LVL
1 1 0 1 1 0 LVL
1 1 0 1 1 1 LVL Status of REF1 frequency (active low). 1 1 1 0 0 0 LVL Status of REF2 frequency (active low). 1 1 1 0 0 1 LVL
1 1 1 0 1 0 LVL 1 1 1 0 1 1 LVL Status of VCO Frequency (active low).
1 1 1 1 0 0 LVL Selected reference (low = REF2, high = REF1).
1 1 1 1 0 1 LVL Digital lock detect (DLD) (active low). 1 1 1 1 1 0 LVL Holdover active (active low). 1 1 1 1 1 1 LVL LD pin comparator output (active low). 17 <1:0> Antibacklash Pulse Width 0 0 2.9 0 1 1.3 1 0 6.0 1 1 2.9 18 <6:5>
0 0 5 0 1 16 1 0 64 1 1 255 18 <4>
Window <4> = 0; high range. <4> = 1; low range. 18 <3> Disable Digital lock detect operation. Digital <3> = 0; normal lock detect operation. Lock Detect <3> = 1; disable lock detect. 18 <2:1> VCO Cal VCO Calibration Divider. Divider used to generate the VCO calibration clock from the PLL reference clock. Divider 0 0 2 0 1 4 1 0 8 1 1 16 (default) 18 <0>
Name Description
<7> <6> <5> <4> <3> <2>
<1> <0> Antibacklash Pulse Width (ns)
Lock Detect Counter
Digital Lock Detect
VCO Cal Now
Required consecutive number of PFD cycles with edges inside lock detect window before the DLD indicates a locked condition.
<6> <5> PFD Cycles to Determine Lock
If the time difference of the rising edges at the inputs to the PFD are less than the lock detect window time, the digital lock detect flag is set. The flag remains set until the time difference is greater than the loss-of-lock threshold.
<2> <1> VCO Calibration Clock Divider
Bit used to initiate the VCO calibration. This bit must be toggled from 0 to 1 in the active registers. The sequence to initiate a calibration is: program to a 0, followed by an update bit (Register 0x232<0>); then programmed to 1, followed by another update bit (Register 0x232<0>). This sequence gives complete control over when the VCO calibration occurs relative to the programming of other registers that can impact the calibration.
Level or Dynamic Signal
Signal at STATUS Pin
REF1 clock REF2 clock Selected reference to PLL
differential mode). Unselected reference to PLL
differential mode). Status of selected reference (status of differential reference);
active low. Status of unselected reference (not available in differential
mode); active low.
(Status of REF1 frequency) AND (status of REF2 frequency) (DLD) AND (status of selected reference) AND (status of VCO)
(differential reference when in differential mode). (not available in differential mode).
(differential reference when in
(not available when in
.
.
Rev. 0 | Page 63 of 80
AD9517-1
Reg. Addr (Hex) Bit(s)
19 <7:6> R, A, B Counters 0 0
Reset 1 0 Synchronous reset. 1 1
19 <5:3> R Path Delay <5:3> R Path Delay (see Table 2). 19 <2:0> N Path Delay <2:0> N Path Delay (see Table 2 ). 1A <6>
Monitor <6> = 0; frequency valid if frequency is above the higher frequency threshold. Threshold <6> = 1; frequency valid if frequency is above the lower frequency threshold. 1A <5:0> LD Pin Select the signal that is connected to the LD pin. Control
0 0 0 0 0 0 LVL Digital lock detect (high = lock, low = unlock). 0 0 0 0 0 1 DYN P-channel, open-drain lock detect (analog lock detect). 0 0 0 0 1 0 DYN N-channel, open-drain lock detect (analog lock detect). 0 0 0 0 1 1 HIZ High-Z LD pin. 0 0 0 1 0 0 CUR Current source lock detect (110 μA when DLD is true). 0 X X X X X LVL Ground (dc); for all other cases of 0XXXXX not specified. The selections that follow are the same as REFMON. 1 0 0 0 0 0 LVL Ground (dc). 1 0 0 0 0 1 DYN REF1 clock (differential reference when in differential mode). 1 0 0 0 1 0 DYN REF2 clock (N/A in differential mode). 1 0 0 0 1 1 DYN
1 0 0 1 0 0 DYN Unselected reference to PLL (not available in differential mode). 1 0 0 1 0 1 LVL
1 0 0 1 1 0 LVL
1 0 0 1 1 1 LVL Status REF1 frequency (active high). 1 0 1 0 0 0 LVL Status REF2 frequency (active high). 1 0 1 0 0 1 LVL (Status REF1 frequency) AND (status REF2 frequency). 1 0 1 0 1 0 LVL (DLD) AND (status of selected reference) AND (status of VCO). 1 0 1 0 1 1 LVL Status of VCO frequency (active high). 1 0 1 1 0 0 LVL Selected reference (low = REF1, high = REF2). 1 0 1 1 0 1 LVL Digital lock detect (DLD); active high. 1 0 1 1 1 0 LVL Holdover active (active high). 1 0 1 1 1 1 LVL N/A—do not use. 1 1 0 0 0 0 LVL VS (PLL supply). 1 1 0 0 0 1 DYN
1 1 0 0 1 0 DYN 1 1 0 0 1 1 DYN
1 1 0 1 0 0 DYN
1 1 0 1 0 1 LVL
Name Description
<7> <6> Action
SYNC
Pin
Reference Frequency
0 1 Asynchronous reset.
Sets the reference (REF1/REF2) frequency monitor’s detection threshold frequency. This does not affect the VCO frequency monitor’s detection threshold (see Table 16 , REF1, REF2, and VCO Frequency Status Monitor).
<5> <4> <3> <2> <1> <0>
Do nothing on
Do nothing on
SYNC
SYNC
(default).
.
Level or Dynamic Signal
Signal at LD Pin
Selected reference to PLL (differential reference when in differential mode).
Status of selected reference (status of differential reference); active high.
Status of unselected reference (not available in differential mode); active high.
REF1 clock REF2 clock Selected reference to PLL
differential mode). Unselected reference to PLL
mode). Status of selected reference (status of differential reference);
active low.
(differential reference when in differential mode). (not available in differential mode).
(differential reference when in
(not available when in differential
Rev. 0 | Page 64 of 80
AD9517-1
Reg. Addr (Hex) Bit(s)
1 1 0 1 1 0 LVL
1 1 0 1 1 1 LVL Status of REF1 frequency (active low). 1 1 1 0 0 0 LVL Status of REF2 frequency (active low). 1 1 1 0 0 1 LVL
1 1 1 0 1 0 LVL 1 1 1 0 1 1 LVL Status of VCO frequency (active low).
1 1 1 1 0 0 LVL Selected reference (low = REF2, high = REF1). 1 1 1 1 0 1 LVL Digital lock detect (DLD); active low. 1 1 1 1 1 0 LVL Holdover active (active low). 1 1 1 1 1 1 LVL N/A—do not use. 1B <7> VCO Enable or disable VCO frequency monitor. Frequency <7> = 0; disable VCO frequency monitor. Monitor <7> = 1; enable VCO frequency monitor. 1B <6>
Frequency <6> = 0; disable REF2 frequency monitor. Monitor <6> = 1; enable REF2 frequency monitor. 1B <5>
Monitor <5> = 0; disable REF1 (REFIN) frequency monitor. <5> = 1; enable REF1 (REFIN) frequency monitor. 1B <4:0> REFMON Pin Select the signal that is connected to the REFMON pin. Control
0 0 0 0 0 LVL Ground (dc). 0 0 0 0 1 DYN REF1 clock (differential reference when in differential mode). 0 0 0 1 0 DYN REF2 clock (N/A in differential mode). 0 0 0 1 1 DYN
0 0 1 0 0 DYN Unselected reference to PLL (not available in differential mode). 0 0 1 0 1 LVL
0 0 1 1 0 LVL
0 0 1 1 1 LVL Status REF1 frequency (active high). 0 1 0 0 0 LVL Status REF2 frequency (active high). 0 1 0 0 1 LVL (Status REF1 frequency) AND (status REF2 frequency). 0 1 0 1 0 LVL (DLD) AND (status of selected reference) AND (status of VCO). 0 1 0 1 1 LVL Status of VCO frequency (active high). 0 1 1 0 0 LVL Selected reference (low = REF1, high = REF2). 0 1 1 0 1 LVL Digital lock detect (DLD); active low. 0 1 1 1 0 LVL Holdover active (active high). 0 1 1 1 1 LVL LD pin comparator output (active high). 1 0 0 0 0 LVL VS (PLL supply). 1 0 0 0 1 DYN
1 0 0 1 0 DYN 1 0 0 1 1 DYN
Name Description
<5> <4> <3> <2> <1> <0>
Enable or disable REF2 frequency monitor.
REFIN
REF2 (
REF1 (REFIN) Frequency
)
REF1 (REFIN) frequency monitor enable; this is for both REF1 (single-ended) and REFIN (differential) inputs (as selected by differential reference mode).
<4> <3> <2> <1> <0>
Level or Dynamic Signal
Level or Dynamic Signal
Signal at LD Pin
Status of unselected reference (not available in differential mode); active low.
(Status of REF1 frequency) AND (status of REF2 frequency) (DLD) AND (status of selected reference) AND (status of VCO)
Signal at REFMON Pin
Selected reference to PLL (differential reference when in differential mode).
Status of selected reference (status of differential reference); active high.
Status of unselected reference (not available in differential mode); active high.
REF1 clock REF2 clock Selected reference to PLL
differential mode).
(differential reference when in differential mode). (not available in differential mode).
(differential reference when in
.
.
Rev. 0 | Page 65 of 80
AD9517-1
Reg. Addr (Hex)
Bit(s) Name Description
<4> <3> <2> <1> <0>
1 0 1 0 0 DYN
1 0 1 0 1 LVL
1 0 1 1 0 LVL
1 0 1 1 1 LVL Status of REF1 frequency (active low). 1 1 0 0 0 LVL Status of REF2 frequency (active low). 1 1 0 0 1 LVL
1 1 0 1 0 LVL 1 1 0 1 1 LVL Status of VCO frequency (active low).
1 1 1 0 0 LVL Selected reference (low = REF2, high = REF1). 1 1 1 0 1 LVL Digital lock detect (DLD); active low. 1 1 1 1 0 LVL Holdover active (active low). 1 1 1 1 1 LVL LD pin comparator output (active low). 1C <7> Disable Disable or enable the switchover deglitch circuit. Switchover <7> = 0; enable switchover deglitch circuit. Deglitch <7> = 1; disable switchover deglitch circuit. 1C <6> Select REF2 If Register 0x1C<5> = 0, select reference for PLL. <6> = 0; select REF1. <6> = 1; select REF2. 1C <5> Use REF_SEL If Register 0x1C<4> = 0 (manual), set method of PLL reference selection. Pin <5> = 0; use Register 0x1C<6>. <5> = 1; use REF_SEL pin. 1C <4>
Switchover <4> = 0; manual reference switchover. <4> = 1; automatic reference switchover. 1C <3> Stay on REF2 Stay on REF2 after switchover. <3> = 0; return to REF1 automatically when REF1 status is good again. <3> = 1; stay on REF2 after switchover. Do not automatically return to REF1. 1C <2> REF2 When automatic reference switchover is disabled, this bit turns the REF2 power on. Power-On <2> = 0; REF2 power off. <2> = 1; REF2 power on. 1C <1> REF1 When automatic reference switchover is disabled, this bit turns the REF1 power on. Power-On <1> = 0; REF1 power-off. <1> = 1; REF1 power-on. 1C <0>
<0> = 0; single-ended reference mode. <0> = 1; differential reference mode. 1D <4> PLL Status Disables the PLL status register readback. Register <4> = 0; PLL status register enable. Disable <4> = 1; PLL status register disable.
Automatic Reference
Differential Reference
Automatic or manual reference switchover. Single-ended reference mode must be selected by Register 0x1C<0> = 0.
Selects the PLL reference mode, differential or single-ended. Single-ended must be selected for the automatic switchover for REF1 and REF2 to work.
Level or Dynamic Signal
Signal at REFMON Pin
Unselected reference to PLL differential mode).
Status of selected reference (status of differential reference); active low.
Status of unselected reference (not available in differential mode); active low.
(Status of REF1 frequency) AND (status of REF2 frequency) (DLD) AND (status of selected reference) AND (status of VCO)
(not available when in
.
.
Rev. 0 | Page 66 of 80
AD9517-1
Reg. Addr (Hex)
Bit(s) Name Description
1D <3>
<3> = 0; disable LD pin comparator; internal/automatic holdover controller treats this pin as true (high). <3> = 1; enable LD pin comparator. 1D <2> Holdover Along with <0> enables the holdover function. Enable <2> = 0; holdover disabled. <2> = 1; holdover enabled. 1D <1> External
Holdover <1> = 0; automatic holdover mode—holdover controlled by automatic holdover circuit. Control
1D <0> Holdover Along with <2> enables the holdover function. Enable <0> = 0; holdover disabled. <0> = 1; holdover enabled. 1F <6> VCO Cal Readback register: status of the VCO calibration. Finished <6> = 0; VCO calibration not finished. <6> = 1; VCO calibration finished. 1F <5>
<5> = 0; not in holdover. <5> = 1; holdover state active. 1F <4> REF2 Readback register: indicates which PLL reference is selected as the input to the PLL. Selected <4> = 0; REF1 selected (or differential reference if in differential mode). <4> = 1; REF2 selected. 1F <3>
Threshold <3> = 0; VCO frequency is less than the threshold. <3> = 1; VCO frequency is greater than the threshold. 1F <2>
Threshold <2> = 0; REF2 frequency is less than threshold frequency. <2> = 1; REF2 frequency is greater than threshold frequency. 1F <1>
Threshold <1> = 0; REF1 frequency is less than threshold frequency. <1> = 1; REF1 frequency is greater than threshold frequency. 1F <0> Digital Lock Readback register: digital lock detect. Detect <0> = 0; PLL is not locked. <0> = 1; PLL is locked.
LD Pin Comparator Enable
Holdover Active
VCO Frequency >
REF2 Frequency >
REF1 Frequency >
Enables the LD pin voltage comparator. This is used with the LD pin current source lock detect mode. When in the internal (automatic) holdover mode, this enables the use of the voltage on the LD pin to determine if the PLL was previously in a locked state (see the REFMON and STATUS pins to monitor the voltage on this pin.
Enables the external hold control through the
<1> = 1; external holdover mode—holdover controlled by
Readback register: indicates if the part is in the holdover state (see enabled.
Readback register: indicates if the VCO frequency is greater than the threshold (see Frequency Status Monitor).
Readback register: indicates if the frequency of the signal at REF2 is greater than the threshold frequency set by Register 0x1A<6>.
Readback register: indicates if the frequency of the signal at REF2 is greater than the threshold frequency set by Register 0x1A<6>.
SYNC pin. (This disables the internal holdover mode.)
Figure 51). Otherwise, this can be used with
SYNC pin.
Figure 51). This is not the same as holdover
Table 16, REF1, REF2, and VCO
Rev. 0 | Page 67 of 80
AD9517-1
Table 54. Fine Delay Adjust: OUT4 to OUT7
Reg. Addr (Hex)
Bit(s) Name Description
A0 <0> OUT4 Delay Bypass or use the delay function. Bypass <0> = 0; use delay function. <0> = 1; bypass delay function. A1 <5:3>
0 0 0 4 0 0 1 3 0 1 0 3 0 1 1 2 1 0 0 3 1 0 1 2 1 1 0 2 1 1 1 1 A1 <2:0>
0 0 0 200 0 0 1 400 0 1 0 600 0 1 1 800 1 0 0 1000 1 0 1 1200 1 1 0 1400 1 1 1 1600 A2 <5:0>
A3 <0> OUT5 Delay Bypass or use the delay function. Bypass <0> = 0; use delay function. <0> = 1; bypass delay function. A4 <5:3>
0 0 0 4 0 0 1 3 0 1 0 3 0 1 1 2 1 0 0 3 1 0 1 2 1 1 0 2 1 1 1 1
OUT4 Ramp Capacitors
OUT4 Ramp Current
OUT4 Delay Fraction
OUT5 Ramp Capacitors
Selects the number of ramp capacitors used by the delay function. The combination of the number of the capacitors and the ramp current sets the delay full scale.
<5> <4> <3> Number of Capacitors
Ramp current for the delay function. The combination of the number of capacitors and the ramp current sets the delay full scale.
<2> <1> <0> Current (μA)
Selects the fraction of the full-scale delay desired (6-bit binary). 000000 gives zero delay. Only delay values up to 47 decimals (101111b; 0x2F) are supported.
Selects the number of ramp capacitors used by the delay function. The combination of the number of the capacitors and the ramp current sets the delay full scale.
<5> <4> <3> Number of Capacitors
Rev. 0 | Page 68 of 80
AD9517-1
Reg. Addr (Hex) Bit(s)
A4 <2:0>
0 0 0 200 0 0 1 400 0 1 0 600 0 1 1 800 1 0 0 1000 1 0 1 1200 1 1 0 1400 1 1 1 1600 A5 <5:0>
A6 <0> OUT6 Delay Bypass or use the delay function. Bypass <0> = 0; use delay function. <0> = 1; bypass delay function. A7 <5:3>
0 0 0 4 0 0 1 3 0 1 0 3 0 1 1 2 1 0 0 3 1 0 1 2 1 1 0 2 1 1 1 1 A7 <2:0>
0 0 0 200 0 0 1 400 0 1 0 600 0 1 1 800 1 0 0 1000 1 0 1 1200 1 1 0 1400 1 1 1 1600 A8 <5:0>
A9 <0> OUT7 Delay Bypass or use the delay function. Bypass <0> = 0; use delay function. <0> = 1; bypass delay function.
Name Description
OUT5 Ramp Current
OUT5 Delay Fraction
OUT6 Ramp Capacitors
OUT6 Ramp Current
OUT6 Delay Fraction
Ramp current for the delay function. The combination of the number of capacitors and the ramp current sets the delay full scale.
<2> <1> <0> Current (μA)
Selects the fraction of the full-scale delay desired (6-bit binary). 000000 give zero delay. Only delay values up to 47 decimals (101111b; 0x2F) are supported.
Selects the number of ramp capacitors used by the delay function. The combination of the number of capacitors and the ramp current sets the delay full scale.
<5> <4> <3> Number of Capacitors
Ramp current for the delay function. The combination of the number of capacitors and the ramp current sets the delay full scale.
<2> <1> <0> Current (μA)
Selects the fraction of the full-scale delay desired (6-bit binary). 000000 gives zero delay. Only delay values up to 47 decimals (101111b; 0x2F) are supported.
Rev. 0 | Page 69 of 80
AD9517-1
Reg. Addr (Hex) Bit(s)
AA <5:3>
0 0 0 4 0 0 1 3 0 1 0 3 0 1 1 2 1 0 0 3 1 0 1 2 1 1 0 2 1 1 1 1 AA <2:0>
0 0 0 200 0 0 1 400 0 1 0 600 0 1 1 800 1 0 0 1000 1 0 1 1200 1 1 0 1400 1 1 1 1600 AB <5:0>
Name Description
OUT7 Ramp Capacitors
OUT7 Ramp Current
OUT7 Delay Fraction
Selects the number of ramp capacitors used by the delay function. The combination of the number of capacitors and the ramp current sets the delay full scale.
<5> <4> <3> Number of Capacitors
Ramp current for the delay function. The combination of the number of capacitors and the ramp current sets the delay full scale.
<2> <1> <0> Current Value (μA)
Selects the fraction of the full-scale delay desired (6-bit binary). 000000 gives zero delay. Only delay values up to 47 decimals (101111b; 0x2F) are supported.
Table 55. LVPECL Outputs
Reg. Addr (Hex)
Bit(s) Name Description
F0 <4> OUT0 Invert Sets the output polarity. <4> = 0; noninverting. <4> = 1; inverting. F0 <3:2> OUT0 LVPECL Sets the LVPECL output differential voltage (VOD). Differential Voltage 0 0 400 0 1 600 1 0 780 1 1 960 F0 <1:0> OUT0 LVPECL power-down modes. Power-Down 0 0 Normal operation. On 0 1 Partial power-down, reference on; use only if there are no external load resistors. Off 1 0 Partial power-down, reference on, safe LVPECL power-down. Off 1 1 Total power-down, reference off; use only if there are no external load resistors. Off F1 <4> OUT1 Invert Sets the output polarity. <4> = 0; noninverting. <4> = 1; inverting.
<3> <2> V
<1> <0> Mode Output
OD
(mV)
Rev. 0 | Page 70 of 80
AD9517-1
Reg. Addr (Hex) Bit(s)
F1 <3:2> OUT1 LVPECL Sets the LVPECL output differential voltage (VOD). Differential Voltage 0 0 400 0 1 600 1 0 780 1 1 960 F1 <1:0> OUT1 LVPECL power-down modes. Power-Down 0 0 Normal operation. On 0 1 Partial power-down, reference on; use only if there are no external load resistors. Off 1 0 Partial power-down, reference on, safe LVPECL power-down. Off 1 1 Total power-down, reference off; use only if there are no external load resistors. Off F4 <4> OUT2 Invert Sets the output polarity. <4> = 0; noninverting. <4> = 1; inverting. F4 <3:2> OUT2 LVPECL Sets the LVPECL output differential voltage (VOD). Differential Voltage 0 0 400 0 1 600 1 0 780 1 1 960 F4 <1:0> OUT2 LVPECL power-down modes. Power-Down 0 0 Normal operation. On 0 1 Partial power-down, reference on; use only if there are no external load resistors. Off 1 0 Partial power-down, reference on, safe LVPECL power-down. Off 1 1 Total power-down, reference off; use only if there are no external load resistors. Off F5 <4> OUT3 Invert Sets the output polarity. <4> = 0; noninverting. <4> = 1; inverting. F5 <3:2> OUT3 LVPECL Sets the LVPECL output differential voltage (VOD). Differential Voltage 0 0 400 0 1 600 1 0 780 1 1 960 F5 <1:0> OUT3 LVPECL power-down modes. Power-Down 0 0 Normal operation. On 0 1 Partial power-down, reference on; use only if there are no external load resistors. Off 1 0 Partial power-down, reference on, safe LVPECL power-down. Off 1 1 Total power-down, reference off; use only if there are no external load resistors. Off
Name Description
<3> <2> V
<1> <0> Mode Output
<3> <2> VOD (mV)
<1> <0> Mode Output
<3> <2> V
<1> <0> Mode Output
OD
OD
(mV)
(mV)
Rev. 0 | Page 71 of 80
AD9517-1
Table 56. LVDS/CMOS Outputs
Reg. Addr (Hex)
Bit(s) Name Description
140 <7:5>
0 0 0 Noninverting Inverting Noninverting 0 1 0 Noninverting Noninverting Noninverting 1 0 0 Inverting Inverting Noninverting 1 1 0 Inverting Noninverting Noninverting 0 0 1 Inverting Noninverting Inverting 0 1 1 Inverting Inverting Inverting 1 0 1 Noninverting Noninverting Inverting 1 1 1 Noninverting Inverting Inverting 140 <4> OUT4 CMOS B In CMOS mode, turn on/off the CMOS B output. There is no effect in LVDS mode. <4> = 0; turn off the CMOS B output. <4> = 1; turn on the CMOS B output. 140 <3> OUT4 Select LVDS/CMOS Select LVDS or CMOS logic levels. <3> = 0; LVDS. <3> = 1; CMOS. 140 <2:1> OUT4 LVDS Output Current Set output current level in LVDS mode. This has no effect in CMOS mode.
0 0 1.75 100 0 1 3.5 100 1 0 5.25 50 1 1 7 50 140 <0> OUT4 Power-Down Power-down output (LVDS/CMOS). <0> = 0; power on. <0> = 1; power off. 141 <7:5> OUT5 Output Polarity
0 0 0 Noninverting Inverting Noninverting 0 1 0 Noninverting Noninverting Noninverting 1 0 0 Inverting Inverting Noninverting 1 1 0 Inverting Noninverting Noninverting 0 0 1 Inverting Noninverting Inverting 0 1 1 Inverting Inverting Inverting 1 0 1 Noninverting Noninverting Inverting 1 1 1 Noninverting Inverting Inverting 141 <4> OUT5 CMOS B In CMOS mode, turn on/off the CMOS B output. There is no effect in LVDS mode. <4> = 0; turn off the CMOS B output. <4> = 1; turn on the CMOS B output. 141 <3> OUT5 Select LVDS/CMOS Select LVDS or CMOS logic levels. <3> = 0; LVDS. <3> = 1; CMOS. 141 <2:1> OUT5 LVDS Output Current Set output current level in LVDS mode. This has no effect in CMOS mode.
0 0 1.75 100 0 1 3.5 100 1 0 5.25 50 1 1 7 50
OUT4 Output Polarity
In CMOS mode, <7:5> select the output polarity of each CMOS output. In LVDS mode, only <5> determines LVDS polarity.
<7> <6> <5> OUT4A (CMOS) OUT4B (CMOS) OUT4 (LVDS)
<2> <1> Current (mA) Recommended Termination (Ω)
In CMOS mode, <7:5> select the output polarity of each CMOS output. In LVDS mode, only <5> determines LVDS polarity.
<7> <6> <5> OUT5A (CMOS) OUT5B (CMOS) OUT5 (LVDS)
<2> <1> Current (mA) Recommended Termination (Ω)
Rev. 0 | Page 72 of 80
AD9517-1
Reg. Addr (Hex) Bit(s)
141 <0> OUT5 Power-Down Power-down output (LVDS/CMOS). <0> = 0; power on. <0> = 1; power off. 142 <7:5> OUT6 Output Polarity
0 0 0 Noninverting Inverting Noninverting 0 1 0 Noninverting Noninverting Noninverting 1 0 0 Inverting Inverting Noninverting 1 1 0 Inverting Noninverting Noninverting 0 0 1 Inverting Noninverting Inverting 0 1 1 Inverting Inverting Inverting 1 0 1 Noninverting Noninverting Inverting 1 1 1 Noninverting Inverting Inverting 142 <4> OUT6 CMOS B In CMOS mode, turn on/off the CMOS B output. There is no effect in LVDS mode.
142 <3> OUT6 Select LVDS/CMOS Select LVDS or CMOS logic levels.
142 <2:1> OUT6 LVDS Output Current Set output current level in LVDS mode. This has no effect in CMOS mode.
142 <0> OUT6 Power-Down Power-down output (LVDS/CMOS). <0> = 0; power on. <0> = 1; power off. 143 <7:5> OUT7 Output Polarity
0 0 0 Noninverting Inverting Noninverting 0 1 0 Noninverting Noninverting Noninverting 1 0 0 Inverting Inverting Noninverting 1 1 0 Inverting Noninverting Noninverting 0 0 1 Inverting Noninverting Inverting 0 1 1 Inverting Inverting Inverting 1 0 1 Noninverting Noninverting Inverting 1 1 1 Noninverting Inverting Inverting 143 <4> OUT7 CMOS B In CMOS mode, turn on/off the CMOS B output. There is no effect in LVDS mode. <4> = 0; turn off the CMOS B output. <4> = 1; turn on the CMOS B output. 143 <3> OUT7 Select LVDS/CMOS Select LVDS or CMOS logic levels. <3> = 0; LVDS. <3> = 1; CMOS.
Name Description
In CMOS mode, <7:5> select the output polarity of each CMOS output. In LVDS mode, only <5> determines LVDS polarity.
<7> <6> <5> OUT6A (CMOS) OUT6B (CMOS) OUT6 (LVDS)
<4> = 0; turn off the CMOS B output. <4> = 1; turn on the CMOS B output.
<3> = 0; LVDS. <3> = 1; CMOS.
<2> <1> Current (mA) Recommended Termination (Ω)
0 0 1.75 100 0 1 3.5 100 1 0 5.25 50 1 1 7 50
In CMOS mode, <7:5> select the output polarity of each CMOS output. In LVDS mode, only <5> determines LVDS polarity.
<7> <6> <5> OUT7A (CMOS) OUT7B (CMOS) OUT7 (LVDS)
Rev. 0 | Page 73 of 80
AD9517-1
Reg. Addr (Hex) Bit(s)
143 <2:1> OUT7 LVDS Output Current Set output current level in LVDS mode. This has no effect in CMOS mode.
0 0 1.75 100 0 1 3.5 100 1 0 5.25 50 1 1 7 50 143 <0> OUT7 Power-Down Power-down output (LVDS/CMOS). <0> = 0; power on. <0> = 1; power off.
Table 57. LVPECL Channel Dividers
Reg. Addr (Hex)
190 <7:4> Divider 0 Low Cycles Number of clock cycles of the divider input during which divider output stays low.
190 <3:0> Divider 0 High Cycles Number of clock cycles of the divider input during which divider output stays high.
191 <7> Divider 0 Bypass Bypass and power-down the divider; route input to divider output. <7> = 0; use divider. <7> = 1; bypass divider. 191 <6> Divider 0 Nosync Nosync. <6> = 0; obey chip-level SYNC signal. <6> = 1; ignore chip-level SYNC signal. 191 <5> Divider 0 Force High Force divider output to high. This requires that nosync also be set. <5> = 0; divider output forced to low. <5> = 1; divider output forced to high. 191 <4> Divider 0 Start High Selects clock output to start high or start low. <4> = 0; start low. <4> = 1; start high. 191 <3:0> Divider 0 Phase Offset Phase offset.
192 <1> Divider 0 Direct to Output Connect OUT0 and OUT1 to Divider 0 or directly to VCO or CLK. <1> = 0: OUT0 and OUT1 are connected to Divider 0.
192 <0> Divider 0 DCCOFF Duty-cycle correction function. <0> = 0; enable duty-cycle correction. <0> = 1; disable duty-cycle correction. 196 <7:4> Divider 1 Low Cycles Number of clock cycles of the divider input during which divider output stays low.
196 <3:0> Divider 1 High Cycles Number of clock cycles of the divider input during which divider output stays high.
197 <7> Divider 1 Bypass Bypass and power-down the divider; route input to divider output. <7> = 0; use divider. <7> = 1; bypass divider. 197 <6> Divider 1 Nosync Nosync. <6> = 0; obey chip-level SYNC signal. <6> = 1; ignore chip-level SYNC signal. 197 <5> Divider 1 Force High Force divider output to high. This requires that nosync also be set. <5> = 0; divider output forced to low. <5> = 1; divider output forced to high.
Name Description
<2> <1> Current (mA) Recommended Termination (Ω)
Bit(s) Name Description
<1> = 1: If 0x1E1<1:0> = 10b, the VCO is routed directly to OUT0 and OUT1. If 0x1E1<1:0> = 00b, the CLK is routed directly to OUT0 and OUT1. If 0x1E1<1:0> = 01b, there is no effect.
Rev. 0 | Page 74 of 80
AD9517-1
Reg. Addr (Hex)
Bit(s) Name Description
197 <4> Divider 1 Start High Selects clock output to start high or start low. <4> = 0; start low. <4> = 1; start high. 197 <3:0> Divider 1 Phase Offset Phase offset.
198 <1> Divider 1 Direct to Output Connect OUT2 and OUT3 to Divider 2 or directly to VCO or CLK. <1> = 0; OUT2 and OUT3 are connected to Divider 1.
198 <0> Divider 1 DCCOFF Duty-cycle correction function. <0> = 0; enable duty-cycle correction. <0> = 1; disable duty-cycle correction.
Table 58. LVDS/CMOS Channel Dividers
Reg. Addr (Hex)
Bit(s) Name Description
199 <7:4> Low Cycles Divider 2.1 Number of clock cycles of 2.1 divider input during which 2.1 output stays low.
199 <3:0> High Cycles Divider 2.1 Number of clock cycles of 2.1 divider input during which 2.1 output stays high.
19A <7:4> Phase Offset Divider 2.2 Refer to LVDS/CMOS channel divider function description.
19A <3:0> Phase Offset Divider 2.1 Refer to LVDS/CMOS channel divider function description.
19B <7:4> Low Cycles Divider 2.2 Number of clock cycles of 2.2 divider input during which 2.2 output stays low.
19B <3:0> High Cycles Divider 2.2 Number of clock cycles of 2.2 divider input during which 2.2 output stays high.
19C <5> Bypass Divider 2.2 Bypass (and power-down) 2.2 divider logic, route clock to 2.2 output. <5> = 0; do not bypass. <5> = 1; bypass. 19C <4> Bypass Divider 2.1 Bypass (and power-down) 2.1 divider logic, route clock to 2.1 output. <4> = 0; do not bypass. <4> = 1; bypass. 19C <3> Divider 2 Nosync Nosync. <3> = 0; obey chip-level SYNC signal. <3> = 1; ignore chip-level SYNC signal. 19C <2> Divider 2 Force High Force Divider 2 output high. Requires that nosync also be set. <2> = 0; force low. <2> = 1; force high. 19C <1> Start High Divider 2.2 Divider 2.2 start high/low. <1> = 0; start low. <1> = 1; start high. 19C <0> Start High Divider 2.1 Divider 2.1 start high/low. <0> = 0; start low. <0> = 1; start high. 19D <0> Divider 2 DCCOFF Duty-cycle correction function. <0> = 0; enable duty-cycle correction. <0> = 1; disable duty-cycle correction. 19E <7:4> Low Cycles Divider 3.1 Number of clock cycles of divider 3.1 input during which 3.1 output stays low.
19E <3:0> High Cycles Divider 3.1 Number of clock cycles of 3.1 divider input during which 3.1 output stays high.
19F <7:4> Phase Offset Divider 3.2 Refer to LVDS/CMOS channel divider function description.
<1> = 1: If 0x1E1<1:0> = 10b, the VCO is routed directly to OUT2 and OUT3. If 0x1E1<1:0> = 00b, the CLK is routed directly to OUT2 and OUT3. If 0x1E1<1:0> = 01b, there is no effect.
Rev. 0 | Page 75 of 80
AD9517-1
Reg. Addr (Hex) Bit(s)
19F <3:0> Phase Offset Divider 3.1 Refer to LVDS/CMOS channel divider function description.
1A0 <7:4> Low Cycles Divider 3.2 Number of clock cycles of 3.2 divider input during which 3.2 output stays low.
1A0 <3:0> High Cycles Divider 3.2 Number of clock cycles of 3.2 divider input during which 3.2 output stays high.
1A1 <5> Bypass Divider 3.2 Bypass (and power-down) 3.2 divider logic, route clock to 3.2 output. <5> = 0; do not bypass. <5> = 1; bypass. 1A1 <4> Bypass Divider 3.1 Bypass (and power-down) 3.1 divider logic, route clock to 3.1 output. <4> = 0; do not bypass. <4> = 1; bypass. 1A1 <3> Divider 3 Nosync Nosync. <3> = 0; obey chip-level SYNC signal. <3> = 1; ignore chip-level SYNC signal. 1A1 <2> Divider 3 Force High Force Divider 3 output high. Requires that nosync also be set. <2> = 0; force low. <2> = 1; force high. 1A1 <1> Start High Divider 3.2 Divider 3.2 start high/low. <1> = 0; start low. <1> = 1; start high. 1A1 <0> Start High Divider 3.1 Divider 3.1 start high/low. <0> = 0; start low. <0> = 1; start high. 1A2 <0> Divider 3 DCCOFF Duty-cycle correction function. <0> = 0; enable duty-cycle correction. <0> = 1; disable duty-cycle correction.
Name Description
Table 59. VCO Divider and CLK Input
Reg. Addr (Hex)
Bit(s) Name Description
1E0 <2:0> VCO Divider
0 0 0 2 0 0 1 3 0 1 0 4 0 1 1 5 1 0 0 6 1 0 1 Output static 1 1 0 Output static 1 1 1 Output static 1E1 <4> Power-Down Clock Input Section Power down the clock input section (including CLK buffer, VCO divider, and CLK tree). <4> = 0; normal operation. <4> = 1; power-down. 1E1 <3> Power-Down VCO Clock Interface Power down the interface block between VCO and clock distribution. <3> = 0; normal operation. <3> = 1; power-down. 1E1 <2> Power-Down VCO and CLK Power down both VCO and CLK input. <2> = 0; normal operation. <2> = 1; power-down.
<2> <1> <0> Divide
Rev. 0 | Page 76 of 80
AD9517-1
Reg. Addr (Hex) Bit(s)
1E1 <1> Select VCO or CLK Select either the VCO or the CLK as the input to VCO divider. <1> = 0; select external CLK as input to VCO divider. <1> = 1; select VCO as input to VCO divider; cannot bypass VCO divider when this is selected. 1E1 <0> Bypass VCO Divider Bypass or use the VCO divider. <0> = 0; use VCO divider. <0> = 1; bypass VCO divider; cannot select VCO as input when this is selected.
Table 60. System
Reg. Addr (Hex) Bit(s)
230 <2> Power-Down SYNC Power down the SYNC function. <2> = 0; normal operation of the SYNC function. <2> = 1; power-down SYNC circuitry. 230 <1> Power-Down Distribution Reference Power down the reference for distribution section. <1> = 0; normal operation of the reference for the distribution section. <1> = 1; power down the reference for the distribution section. 230 <0> Soft SYNC
Name Description
Name Description
The soft SYNC bit works the same as the is reversed. That is, a high level forces selected channels into a predetermined static state, and a 1-to-0 transition triggers a SYNC.
<0> = 0; same as <0> = 1; same as
SYNC pin, except that the polarity of the bit
SYNC high. SYNC low.
Table 61. Update All Registers
Reg. Addr (Hex)
Bit(s) Name Description
232 <0>
<0> = 1 (self-clearing); update all active registers to the contents of the buffer registers.
Update All Registers
This bit must be set to 1 to transfer the contents of the buffer registers into the active registers. This happens on the next SCLK rising edge. This bit is self-clearing; that is, it does not have to be set back to 0.
Rev. 0 | Page 77 of 80
AD9517-1
V
V
V
V
V
V

APPLICATION NOTES

USING THE AD9517 OUTPUTS FOR ADC CLOCK APPLICATIONS

Any high speed ADC is extremely sensitive to the quality of its sampling clock. An ADC can be thought of as a sampling mixer, and any noise, distortion, or timing jitter on the clock is combined with the desired signal at the analog-to-digital output. Clock integrity requirements scale with the analog input frequency and resolution, with higher analog input frequency applications at ≥14-bit resolution being the most stringent. The theoretical SNR of an ADC is limited by the ADC resolution and the jitter on the sampling clock. Considering an ideal ADC of infinite resolution where the step size and quantization error can be ignored, the available SNR can be expressed approximately by

LVPECL CLOCK DISTRIBUTION

The LVPECL outputs of the AD9517 provide the lowest jitter clock signals available from the AD9517. The LVPECL outputs (because they are open emitter) require a dc termination to bias the output transistors. The simplified equivalent circuit in Figure 57 shows the LVPECL output stage.
In most applications, an LVPECL far-end Thevenin termination is recommended, as shown in designed to match the transmission line impedance (50 Ω) and the switching threshold (V
S_LVPECL
Figure 69. The resistor network is
− 1.3 V).
S
S_LVPECL
V
S
50
127127
SNR
⎛ ⎜
×=
log20(dB)
⎜ ⎝
1
⎟ ⎟
π
tf
2
J
A
where:
f
is the highest analog frequency being digitized.
A
is the rms jitter on the sampling clock.
t
J
Figure 68 shows the required sampling clock jitter as a function of the analog frequency and effective number of bits (ENOB).
110
f
A
(MHz)
SNR = 20log
t
J
=
1
0
2
0
0
f
S
4
0
0
f
S
1
p
s
2
p
s
1
0
p
s
0
100
90
80
70
SNR (dB)
60
50
40
30
10 1k100
Figure 68. SNR and ENOB vs. Analog Input Frequency
2πf
f
S
1
AtJ
18
16
14
12
ENOB
10
8
6
See the AN-756 application note and the AN-501 application note
www.analog.com.
at
Many high performance ADCs feature differential clock inputs to simplify the task of providing the required low jitter clock on a noisy PCB. (Distributing a single-ended clock on a noisy PCB can result in coupled noise on the sample clock. Differential distribution has inherent common-mode rejection that can provide superior clock performance in a noisy environment.) The AD9517 features both LVPECL and LVDS outputs that provide differential clock outputs, which enable clock solutions that maximize converter SNR performance. The input requirements of the ADC (differential or single-ended, logic level termination) should be considered when selecting the best clocking/converter solution.
LVPECL
SINGLE-E NDED
(NOT CO UPLED)
50
V
= VS – 1.3V
T
LVPECL
8383
6425-045
Figure 69. LVPECL Far-End Thevenin Termination
S_LVPECL
LVPECL
0.1nF
0.1nF
200 200
100 DIFFERENTIAL
(COUPLED)
TRANSMISSION LINE
100
S_LVPECL
LVPECL
06425-046
Figure 70. LVPECL with Parallel Transmission Line

LVDS CLOCK DISTRIBUTION

The AD9517 provides four clock outputs (OUT4 to OUT7) that are selectable as either CMOS or LVDS level outputs. LVDS is a differential output option that uses a current mode output stage. The nominal current is 3.5 mA, which yields 350 mV output swing across a 100 Ω resistor. The LVDS output meets or
06425-044
exceeds all ANSI/TIA/EIA-644 specifications.
A recommended termination circuit for the LVDS outputs is shown in
Figure 71.
S
LVDS
DIFFERENTIAL (COUPLED)
100
100
Figure 71. LVDS Output Termination
S
LVDS
06425-047
See the AN-586 application note at www.analog.com for more information on LVDS.
Rev. 0 | Page 78 of 80
AD9517-1
V

CMOS CLOCK DISTRIBUTION

The AD9517 provides four clock outputs (OUT4 to OUT7) that are selectable as either CMOS or LVDS level outputs. When selected as CMOS, each output becomes a pair of CMOS outputs, each of which can be individually turned on or off and set as noninverting or inverting. These outputs are 3.3 V CMOS compatible.
Whenever single-ended CMOS clocking is used, some of the following general guidelines should be used.
Point-to-point nets should be designed such that a driver has only one receiver on the net, if possible. This allows for simple termination schemes and minimizes ringing due to possible mismatched impedances on the net. Series termination at the source is generally required to provide transmission line matching and/or to reduce current transients at the driver. The value of the resistor is dependent on the board design and timing requirements (typically 10 Ω to 100 Ω is used). CMOS outputs are also limited in terms of the capacitive load or trace length that they can drive. Typically, trace lengths less than 3 inches are recommended to preserve signal rise/fall times and preserve signal integrity.
60.4
(1.0 INCH)
10
CMOS CMOS
Figure 72. Series Termination of CMOS Output
MICROSTRIP
06425-076
Termination at the far-end of the PCB trace is a second option. The CMOS outputs of the AD9517 do not supply enough current to provide a full voltage swing with a low impedance resistive, far-end termination, as shown in
Figure 73. The far­end termination network should match the PCB trace impedance and provide the desired switching point. The reduced signal swing may still meet receiver input requirements in some applications. This can be useful when driving long trace lengths on less critical nets.
S
10
CMOS CMOS
Figure 73. CMOS Output with Far-End Termination
50
100
100
6425-077
Because of the limitations of single-ended CMOS clocking, consider using differential outputs when driving high speed signals over long traces. The AD9517 offers both LVPECL and LVDS outputs that are better suited for driving long traces where the inherent noise immunity of differential signaling provides superior performance for clocking converters.
Rev. 0 | Page 79 of 80
AD9517-1

OUTLINE DIMENSIONS

0.30
0.23
0.18 PIN 1
48
INDICATOR
1
BSC SQ
PIN 1 INDICATOR
7.00
0.60 MAX
37
36
0.60 MAX
1.00
0.85
0.80
12° MAX
SEATING PLANE
TOP
VIEW
0.80 MAX
0.65 TYP
0.50 BSC
COMPLIANT TO JEDEC STANDARDS MO-220-VKKD-2
6.75
BSC SQ
0.20 REF
0.50
0.40
0.30
0.05 MAX
0.02 NOM COPLANARITY
0.08
25
24
EXPOSED
PAD
(BOTTOM VIEW)
5.50 REF
13
5.25
5.10 SQ
4.95
12
0.25 MIN
Figure 74. 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
7 mm × 7 mm Body, Very Thin Quad
CP-48-1
Dimensions shown in millimeters

ORDERING GUIDE

Model Temperature Range Package Description Package Option
AD9517-1BCPZ AD9517-1BCPZ-REEL7 AD9517-1/PCBZ
1
Z = RoHS Compliant Part.
1
1
1
−40°C to +85°C 48-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-48-1
−40°C to +85°C 48-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-48-1 Evaluation Board
©2007 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06425-0-7/07(0)
Rev. 0 | Page 80 of 80
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