Fine delay adjust on 1 LVDS/CMOS output
Serial control port
Space-saving 48-lead LFCSP
APPLICATIONS
Low jitter, low phase noise clock distribution
Clocking high speed ADCs, DACs, DDSs, DDCs, DUCs, MxFEs
High performance wireless transceivers
High performance instrumentation
Broadband infrastructure
GENERAL DESCRIPTION
The AD9511 provides a multi-output clock distribution
function along with an on-chip PLL core. The design
emphasizes low jitter and phase noise to maximize data
converter performance. Other applications with demanding
phase noise and jitter requirements also benefit from this part.
The PLL section consists of a programmable reference divider
(R); a low noise phase frequency detector (PFD); a precision
charge pump (CP); and a programmable feedback divider (N).
By connecting an external VCXO or VCO to the CLK2/CLK2B
pins, frequencies up to 1.6 GHz may be synchronized to the
input reference.
There are five independent clock outputs. Three outputs are
LVPECL (1.2 GHz), and two are selectable as either LVDS
(800 MHz) or CMOS (250 MHz) levels.
) extends tuning range
S
Dividers, Delay Adjust, Five Outputs
AD9511
FUNCTIONAL BLOCK DIAGRAM
RSE
GND
REFIN
REFINB
FUNCTION
CLK1
CLK1B
SCLK
SDIO
SDO
CSB
SYNCB,
RESETB
PDB
SERIAL
CONTROL
PORT
DISTRIBUTION
REF
R DIVIDER
N DIVIDER
PROGRAMMABLE
PHASE ADJUST
/1, /2, /3... /31, /32
/1, /2, /3... /31, /32
/1, /2, /3... /31, /32
/1, /2, /3... /31, /32
/1, /2, /3... /31, /32
AD9511
FREQUENCY
DIVIDERS AND
PHASE
DETECTOR
Figure 1.
Each output has a programmable divider that may be bypassed
or set to divide by any integer up to 32. The phase of one clock
output relative to another clock output may be varied by means
of a divider phase select function that serves as a coarse timing
adjustment. One of the LVDS/CMOS outputs features a
programmable delay element with full-scale ranges up to 10 ns
of delay. This fine tuning delay block has 5-bit resolution, giving
32 possible delays from which to choose for each full-scale
setting.
The AD9511 is ideally suited for data converter clocking
applications where maximum converter performance is
achieved by encode signals with subpicosecond jitter.
The AD9511 is available in a 48-lead LFCSP and can be
operated from a single 3.3 V supply. An external VCO, which
requires an extended voltage range, can be accommodated by
connecting the charge pump supply (VCP) to 5.5 V. The
temperature range is −40°C to +85°C.
Δ
T
DELAY
ADJUST
CPRSE
PLL
REF
CHARGE
PUMP
PLL
SETTINGS
LVPECL
LVPECL
LVPECL
LVDS/CMOS
LVDS/CMOS
CP
CP
STATUS
CLK2
CLK2B
OUT0
OUT0B
OUT1
OUT1B
OUT2
OUT2B
OUT3
OUT3B
OUT4
OUT4B
05286-001
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
High Value 4.8 mA
Low Value 0.60 mA
Absolute Accuracy 2.5 % VCP = VCPS/2.
CPR
Range 2.7/10 kΩ
SET
ICP Three-State Leakage 1 nA
Sink-and-Source Current Matching 2 % 0.5 < VCP < VCPS − 0.5 V.
ICP vs. V
CP
ICP vs. Temperature 2 % VCP = VCPS/2 V.
RF CHARACTERISTICS (CLK2)
2
Input Frequency 1.6 GHz
Input Sensitivity 150 mV p-p
Input Common-Mode Voltage, V
Input Common-Mode Range, V
CM
CMR
Input Sensitivity, Single-Ended 150 mV p-p
Input Resistance 4.0 4.8 5.6 kΩ Self-biased.
Input Capacitance 2 pF
CLK2 VS. REFIN DELAY 500 ps Difference at PFD.
PRESCALER (PART OF N DIVIDER)
Prescaler Input Frequency
P = 2 DM (2/3) 600 MHz
P = 4 DM (4/5) 1000 MHz
P = 8 DM (8/9) 1600 MHz
P = 16 DM (16/17) 1600 MHz
P = 32 DM (32/33) 1600 MHz
CLK2 Input Frequency for PLL 300 MHz A, B counter input frequency.
1.5 % 0.5 < VCP < VCPS − 0.5 V.
1.5 1.6 1.7 V Self-biased; enables ac coupling.
1.3 1.8 V With 200 mV p-p signal applied.
= 4.12 kΩ, CPR
SET
= 5.1 kΩ, unless otherwise noted.
SET
With CPR
= 5.1 kΩ.
SET
Frequencies > 1200 MHz (LVPECL) or
800 MHz (LVDS) require a minimum
divide-by-2 (see the
Distribution Section).
CLK2 ac-coupled; CLK2B capacitively
bypassed to RF ground.
VCO/VCXO Feedback Divider—N (P, A, B)
See the
section.
Rev. A | Page 4 of 60
AD9511
Parameter Min Typ Max Unit Test Conditions/Comments
NOISE CHARACTERISTICS
In-Band Noise of the Charge Pump/
Phase Frequency Detector (In-Band
Means Within the LBW of the PLL)
@ 50 kHz PFD Frequency −172 dBc/Hz
@ 2 MHz PFD Frequency −156 dBc/Hz
@ 10 MHz PFD Frequency −149 dBc/Hz
@ 50 MHz PFD Frequency −142 dBc/Hz
PLL Figure of Merit
PLL DIGITAL LOCK DETECT WINDOW
Required to Lock
(Coincidence of Edges)
Low Range (ABP 1.3 ns, 2.9 ns Only) 3.5 ns <5> = 1b.
High Range (ABP 1.3 ns, 2.9 ns) 7.5 ns <5> = 0b.
High Range (ABP 6 ns) 3.5 ns <5> = 0b.
To Unlock After Lock (Hysteresis)
4
Low Range (ABP 1.3 ns, 2.9 ns Only) 7 ns <5> = 1b.
High Range (ABP 1.3 ns, 2.9 ns) 15 ns <5> = 0b.
High Range (ABP 6 ns) 11 ns <5> = 0b.
1
REFIN and REFINB self-bias points are offset slightly to avoid chatter on an open input condition.
2
CLK2 is electrically identical to CLK1; the distribution only input can be used as differential or single-ended input (see the Clock Inputs section).
3
Example: −218 + 10 × log(f
4
For reliable operation of the digital lock detect, the period of the PFD frequency must be greater than the unlock-after-lock time.
) + 20 × log(N) should give the values for the in-band noise at the VCO output.
PFD
The synthesizer phase noise floor is
estimated by measuring the in-band
phase noise at the output of the VCO and
subtracting 20logN (where N is the
N divider value).
−218 +
10 × log (f
dBc/Hz
)
PFD
Approximation of the PFD/CP phase noise
floor (in the flat region) inside the PLL loop
bandwidth. When running closed loop this
phase noise is gained up by 20 × log(N)
4
Signal available at STATUS pin
when selected by 08h<5:2>.
Selected by Register ODh.
Selected by Register 0Dh.
3
.
CLOCK INPUTS
Table 2.
Parameter Min Typ Max Unit Test Conditions/Comments
CLOCK INPUTS (CLK1, CLK2)
Input Frequency 0 1.6 GHz
Input Sensitivity 1502 mV p-p
Input Level 2
Input Common-Mode Voltage, V
Input Common-Mode Range, V
Input Sensitivity, Single-Ended 150 mV p-p CLK2 ac-coupled; CLK2B ac bypassed to RF ground.
Input Resistance 4.0 4.8 5.6 kΩ Self-biased.
Input Capacitance 2 pF
1
CLK1 and CLK2 are electrically identical; each can be used as either differential or single-ended input.
2
With a 50 Ω termination, this is −12.5 dBm.
3
With a 50 Ω termination, this is +10 dBm.
1
Jitter performance can be improved with higher slew
rates (greater swing).
3
V p-p
Larger swings turn on the protection diodes and can
degrade jitter performance.
CM
CMR
1.5 1.6 1.7 V Self-biased; enables ac coupling.
1.3 1.8 V With 200 mV p-p signal applied; dc-coupled.
Rev. A | Page 5 of 60
AD9511
CLOCK OUTPUTS
Table 3.
Parameter Min Typ Max Unit Test Conditions/Comments
LVPECL CLOCK OUTPUTS Termination = 50 Ω to VS − 2 V
OUT1 to OUT0 on Same Part, t
OUT1 to OUT2 on Same Part, t
OUT0 to OUT2 on Same Part, t
All LVPECL OUT Across Multiple Parts, t
Same LVPECL OUT Across Multiple Parts, t
This value is incremental. That is, it is in addition to the jitter of the LVDS or CMOS output without the delay. To estimate the total jitter, the LVDS or CMOS output jitter
should be added to this value using the root sum of the squares (RSS) method.
Calculated from SNR of ADC method;
= 100 MHz with AIN = 170 MHz
F
C
PLL AND DISTRIBUTION PHASE NOISE AND SPURIOUS
Table 7.
Parameter Min Typ Max Unit Test Conditions/Comments
Depends on VCO/VCXO selection. Measured at LVPECL
clock outputs; ABP = 6 ns; I
First and second harmonics of F
= 5 mA; Ref = 30.72 MHz.
CP
.
PFD
Below measurement floor.
First and second harmonics of F
PFD
.
Below measurement floor.
Rev. A | Page 14 of 60
AD9511
SERIAL CONTROL PORT
Table 8.
Parameter Min Typ Max Unit Test Conditions/Comments
CSB, SCLK (INPUTS)
Input Logic 1 Voltage 2.0 V
Input Logic 0 Voltage 0.8 V
Input Logic 1 Current 110 µA
Input Logic 0 Current 1 µA
Input Capacitance 2 pF
SDIO (WHEN INPUT)
Input Logic 1 Voltage 2.0 V
Input Logic 0 Voltage 0.8 V
Input Logic 1 Current 10 nA
Input Logic 0 Current 10 nA
Input Capacitance 2 pF
SDIO, SDO (OUTPUTS)
Output Logic 1 Voltage 2.7 V
Output Logic 0 Voltage 0.4 V
TIMING
Clock Rate (SCLK, 1/t
Pulse Width High, t
Pulse Width Low, t
SDIO to SCLK Setup, t
SCLK to SDIO Hold, t
SCLK to Valid SDIO and SDO, t
CSB to SCLK Setup and Hold, tS, t
CSB Minimum Pulse Width High, t
) 25 MHz
SCLK
PWH
PWL
DS
DH
DV
H
PWH
16 ns
16 ns
2 ns
1 ns
6 ns
2 ns
3 ns
CSB and SCLK have 30 kΩ
internal pull-down resistors
FUNCTION PIN
Table 9.
Parameter Min Typ Max Unit Test Conditions/Comments
INPUT CHARACTERISTICS
Logic 1 Voltage 2.0 V
Logic 0 Voltage 0.8 V
Logic 1 Current 110 µA
Logic 0 Current 1 µA
Capacitance 2 pF
RESET TIMING
Pulse Width Low 50 ns
SYNC TIMING
Pulse Width Low 1.5 High speed clock cycles
The FUNCTION pin has a 30 kΩ internal pull-down resistor.
This pin should normally be held high. Do not leave NC.
High speed clock is CLK1 or CLK2, whichever is
used for distribution.
Rev. A | Page 15 of 60
AD9511
STATUS PIN
Table 10.
Parameter Min Typ Max Unit Test Conditions/Comments
OUTPUT CHARACTERISTICS
Output Voltage High (VOH) 2.7 V
Output Voltage Low (VOL) 0.4 V
MAXIMUM TOGGLE RATE 100 MHz
ANALOG LOCK DETECT
Capacitance 3 pF
POWER
Table 11.
Parameter Min Typ Max Unit Test Conditions/Comments
POWER-UP DEFAULT MODE POWER DISSIPATION 550 600 mW
POWER DISSIPATION 800 mW
850 mW
Full Sleep Power-Down 35 60 mW
Power-Down (PDB) 60 80 mW
POWER DELTA
CLK1, CLK2 Power-Down 10 15 25 mW
Divider, DIV 2 − 32 to Bypass 23 27 33 mW For each divider.
LVPECL Output Power-Down (PD2, PD3) 50 65 75 mW
LVDS Output Power-Down 80 92 110 mW For each output.
CMOS Output Power-Down (Static) 56 70 85 mW For each output. Static (no clock).
CMOS Output Power-Down (Dynamic) 115 150 190 mW
CMOS Output Power-Down (Dynamic) 125 165 210 mW
Delay Block Bypass 20 24 60 mW
PLL Section Power-Down 5 15 40 mW
When selected as a digital output (CMOS); there are other modes
in which the STATUS pin is not CMOS digital output. See
Applies when PLL mux is set to any divider or counter output,
or PFD up/down pulse. Also applies in analog lock detect mode.
Usually debug mode only. Beware that spurs may couple
to output when this pin is toggling.
On-chip capacitance; used to calculate RC time
constant for analog lock detect readback. Use a pull-up resistor.
Power-up default state; does not include power
dissipated in output load resistors. No clock.
All outputs on. Three LVPECL outputs @ 800 MHz,
two CMOS out @ 62 MHz (5 pF load). Does not include
power dissipated in external resistors.
All outputs on. Three LVPECL outputs @ 800 MHz,
two CMOS out @ 125 MHz (5 pF load). Does not include
power dissipated in external resistors.
Maximum sleep is entered by setting 0Ah<1:0> = 01b
and 58h<4> = 1b. This powers off the PLL BG and the
distribution BG references. Does not include power
dissipated in terminations.
Set FUNCTION pin for PDB operation by setting
58h<6:5> = 11b. Pull PDB low. Does not include
power dissipated in terminations.
For each output. Does not include dissipation
in termination (PD2 only).
For each CMOS output, single-ended. Clocking at
62 MHz with 5 pF load.
For each CMOS output, single-ended. Clocking at
125 MHz with 5 pF load.
Vs. delay block operation at 1 ns fs with maximum
delay; output clocking at 25 MHz.
Figure 37.
Rev. A | Page 16 of 60
AD9511
C
TIMING DIAGRAMS
LK1
t
CLK1
DIFFERENTIAL
t
PECL
t
LVDS
t
CMOS
Figure 2. CLK1/CLK1B to Clock Output Timing, DIV = 1 Mode
DIFFERENTIAL
80%
LVPECL
20%
t
RP
Figure 3. LVPECL Timing, Differential
80%
LVDS
20%
t
05286-002
RL
t
FL
05286-065
Figure 4. LVDS Timing, Differential
SINGLE-ENDED
80%
CMOS
3pF LOAD
20%
t
FP
05286-064
t
RC
t
FC
05286-066
Figure 5. CMOS Timing, Single-Ended, 3 pF Load
Rev. A | Page 17 of 60
AD9511
ABSOLUTE MAXIMUM RATINGS
Table 12.
With
Respect
Parameter or Pin
VS GND −0.3 +3.6 V
VCP GND −0.3 +5.8 V
VCP V
REFIN, REFINB GND −0.3 VS + 0.3 V
RSET GND −0.3 VS + 0.3 V
CPRSET GND −0.3 VS + 0.3 V
CLK1, CLK1B, CLK2, CLK2B GND −0.3 VS + 0.3 V
CLK1 CLK1B −1.2 +1.2 V
CLK2 CLK2B −1.2 +1.2 V
SCLK, SDIO, SDO, CSB GND −0.3 VS + 0.3 V
OUT0, OUT1, OUT2, OUT3,
OUT4
FUNCTION GND −0.3 VS + 0.3 V
STATUS GND −0.3 VS + 0.3 V
Junction Temperature 150 °C
Storage Temperature −65 +150 °C
Lead Temperature (10 sec) 300 °C
to
S
Min Max Unit
−0.3 +5.8 V
GND −0.3 V
+ 0.3 V
S
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to
absolute maximum ratings for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
Thermal Resistance
48-Lead LFCSP
θ
= 28.5°C/W
JA
1
Thermal impedance measurements were taken on a 4-layer board in still air,
in accordance with EIA/JESD51-7.
1
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. A | Page 18 of 60
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