Analog Devices AD9511 Service Manual

T
T
VSV
1.2 GHz Clock Distribution IC, PLL Core,

FEATURES

Low phase noise phase-locked loop core
Reference input frequencies to 250 MHz Programmable dual-modulus prescaler Programmable charge pump (CP) current
Separate CP supply (VCP Two 1.6 GHz, differential clock inputs 5 programmable dividers, 1 to 32, all integers Phase select for output-to-output coarse delay adjust 3 independent 1.2 GHz LVPECL outputs
Additive output jitter 225 fs rms 2 independent 800 MHz/250 MHz LVDS/CMOS clock outputs
Additive output jitter 275 fs rms
Fine delay adjust on 1 LVDS/CMOS output Serial control port Space-saving 48-lead LFCSP

APPLICATIONS

Low jitter, low phase noise clock distribution Clocking high speed ADCs, DACs, DDSs, DDCs, DUCs, MxFEs High performance wireless transceivers High performance instrumentation Broadband infrastructure

GENERAL DESCRIPTION

The AD9511 provides a multi-output clock distribution function along with an on-chip PLL core. The design emphasizes low jitter and phase noise to maximize data converter performance. Other applications with demanding phase noise and jitter requirements also benefit from this part.
The PLL section consists of a programmable reference divider (R); a low noise phase frequency detector (PFD); a precision charge pump (CP); and a programmable feedback divider (N). By connecting an external VCXO or VCO to the CLK2/CLK2B pins, frequencies up to 1.6 GHz may be synchronized to the input reference.
There are five independent clock outputs. Three outputs are LVPECL (1.2 GHz), and two are selectable as either LVDS (800 MHz) or CMOS (250 MHz) levels.
) extends tuning range
S
Dividers, Delay Adjust, Five Outputs
AD9511

FUNCTIONAL BLOCK DIAGRAM

RSE
GND
REFIN
REFINB
FUNCTION
CLK1
CLK1B
SCLK
SDIO
SDO CSB
SYNCB, RESETB
PDB
SERIAL
CONTROL
PORT
DISTRIBUTION
REF
R DIVIDER
N DIVIDER
PROGRAMMABLE
PHASE ADJUST /1, /2, /3... /31, /32
/1, /2, /3... /31, /32
/1, /2, /3... /31, /32
/1, /2, /3... /31, /32
/1, /2, /3... /31, /32
AD9511
FREQUENCY
DIVIDERS AND
PHASE
DETECTOR
Figure 1.
Each output has a programmable divider that may be bypassed or set to divide by any integer up to 32. The phase of one clock output relative to another clock output may be varied by means of a divider phase select function that serves as a coarse timing adjustment. One of the LVDS/CMOS outputs features a programmable delay element with full-scale ranges up to 10 ns of delay. This fine tuning delay block has 5-bit resolution, giving 32 possible delays from which to choose for each full-scale setting.
The AD9511 is ideally suited for data converter clocking applications where maximum converter performance is achieved by encode signals with subpicosecond jitter.
The AD9511 is available in a 48-lead LFCSP and can be operated from a single 3.3 V supply. An external VCO, which requires an extended voltage range, can be accommodated by connecting the charge pump supply (VCP) to 5.5 V. The temperature range is −40°C to +85°C.
Δ
T
DELAY
ADJUST
CPRSE
PLL REF
CHARGE
PUMP
PLL
SETTINGS
LVPECL
LVPECL
LVPECL
LVDS/CMOS
LVDS/CMOS
CP
CP
STATUS
CLK2 CLK2B
OUT0 OUT0B
OUT1 OUT1B
OUT2 OUT2B
OUT3 OUT3B
OUT4 OUT4B
05286-001
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2005 Analog Devices, Inc. All rights reserved.
AD9511

TABLE OF CONTENTS

Specifications..................................................................................... 4
A and B Counters................................................................... 30
PLL Characteristics ...................................................................... 4
Clock Inputs.................................................................................. 5
Clock Outputs ............................................................................... 6
Timing Characteristics ................................................................ 7
Clock Output Phase Noise .......................................................... 9
Clock Output Additive Time Jitter........................................... 12
PLL and Distribution Phase Noise and Spurious................... 14
Serial Control Port ..................................................................... 15
FUNCTION Pin ......................................................................... 15
STATUS Pin ................................................................................16
Power ............................................................................................16
Timing Diagrams............................................................................ 17
Absolute Maximum Ratings.......................................................... 18
Thermal Characteristics ............................................................ 18
ESD Caution................................................................................ 18
Determining Values for P, A, B, and R ................................ 30
Phase Frequency Detector (PFD) and Charge Pump ....... 31
Antibacklash Pulse................................................................. 31
STATUS Pin............................................................................ 31
PLL Digital Lock Detect ........................................................ 31
PLL Analog Lock Detect ....................................................... 32
Loss of Reference.................................................................... 32
FUNCTION Pin......................................................................... 32
RESETB: 58h<6:5> = 00b (Default)..................................... 32
SYNCB: 58h<6:5> = 01b ....................................................... 32
PDB: 58h<6:5> = 11b ............................................................ 33
Distribution Section................................................................... 33
CLK1 and CLK2 Clock Inputs.................................................. 33
Dividers........................................................................................ 33
Setting the Divide Ratio ........................................................ 33
Pin Configuration and Function Descriptions........................... 19
Te r mi n ol o g y .................................................................................... 21
Typical Performance Characteristics ........................................... 22
Typical Mode s o f Operation .......................................................... 26
PLL with External VCXO/VCO Followed by Clock
Distribution................................................................................. 26
Clock Distribution Only............................................................ 26
PLL with External VCO and Band-Pass Filter Followed by
Clock Distribution......................................................................27
Functional Description .................................................................. 29
Overall.......................................................................................... 29
PLL Section ................................................................................. 29
PLL Reference Input—REFIN.............................................. 29
VCO/VCXO Clock Input—CLK2........................................ 29
PLL Reference Divider—R.................................................... 29
VCO/VCXO Feedback Divider—N (P, A, B) ..................... 29
Setting the Duty Cycle........................................................... 33
Divider Phase Offset.............................................................. 37
Delay Block ................................................................................. 38
Calculating the Delay ............................................................ 38
Outputs ........................................................................................ 38
Power-Down Modes .................................................................. 39
Chip Power-Down or Sleep Mode—PDB........................... 39
PLL Power-Down................................................................... 39
Distribution Power-Down .................................................... 39
Individual Clock Output Power-Down............................... 39
Individual Circuit Block Power-Down................................ 39
Reset Modes ................................................................................ 40
Power-On Reset—Start-Up Conditions when VS
is Applied................................................................................. 40
Asynchronous Reset via the FUNCTION Pin ................... 40
Soft Reset via the Serial Port................................................. 40
Rev. A | Page 2 of 60
AD9511
Single-Chip Synchronization.....................................................40
Summary Table............................................................................45
SYNCB—Hardware SYNC ....................................................40
Soft SYNC—Register 58h<2> ...............................................40
Multichip Synchronization........................................................40
Serial Control Port ..........................................................................41
Serial Control Port Pin Descriptions........................................41
General Operation of Serial Control Port ...............................41
Framing a Communication Cycle with CSB .......................41
Communication Cycle—Instruction Plus Data..................41
Wr it e .........................................................................................41
Read ..........................................................................................42
The Instruction Word (16 Bits).................................................42
MSB/LSB First Transfers ............................................................42
Register Map and Description.......................................................45

REVISION HISTORY

6/05—Rev. 0 to Rev. A
Changes to Features..........................................................................1
Changes to General Description .....................................................1
Changes to Table 1 and Table 2 .......................................................5
Changes to Table 4 ............................................................................7
Changes to Table 5 ............................................................................9
Changes to Table 6 ..........................................................................14
Changes to Table 8 and Table 9 .....................................................15
Changes to Table 11 ........................................................................16
Changes to Table 13 ........................................................................20
Changes to Figure 19 to Figure 23 ................................................24
Changes to Figure 30 and Figure 31 .............................................26
Changes to Figure 32 ......................................................................27
Changes to Figure 33 ......................................................................28
Changes to VCO/VCXO Clock Input—CLK2 Section ..............29
Changes to PLL Reference Divider—P Section...........................29
Changes to A and B Counters Section .........................................30
Changes to PLL Digital Lock Detect Section ..............................31
Changes to PLL Analog Lock Detect Section..............................32
Changes to Loss of Reference Section ..........................................32
Changes to FUNCTION Pin Section ...........................................32
Changes to RESETB: 58h<6:5> = 00b (Default) Section...........32
Changes to SYNCB: 58h<6:5> = 01b Section..............................32
Changes to CLK1 and CLK2 Clock Inputs Section....................33
Register Map Description..........................................................47
Power Supply ...................................................................................54
Power Management ....................................................................54
Applications.....................................................................................55
Using the AD9511 Outputs for ADC Clock Applications ....55
CMOS Clock Distribution.........................................................55
LVPECL Clock D i s t r ibu t i o n ......................................................56
LVDS Clock Distribution...........................................................56
Power and Grounding Considerations and Power Supply
Rejection.......................................................................................56
Outline Dimensions........................................................................57
Ordering Guide...........................................................................57
Changes to Divider Phase Offset Section ....................................37
Changes to Individual Clock Output Power-Down Section.....39
Changes to Individual Circuit Block Power-Down Section......39
Changes to Soft Reset via the Serial Port Section .......................40
Changes to Multichip Synchronization Section..........................40
Changes to Serial Control Port Section .......................................41
Changes to Serial Control Port Pin Descriptions Section.........41
Changes to General Operation of Serial
Control Port Section.......................................................................41
Added Framing a Communication Cycle with CSB Section ....41
Added Communication Cycle—Instruction Plus
Data Section.....................................................................................41
Changes to Write Section ............................................................... 41
Changes to Read Section................................................................42
Changes to Instruction Word (16 Bits) Section ..........................42
Changes to Table 20 ........................................................................42
Changes to MSB/LSB First Transfers Section..............................42
Added Figure 52; Renumbered Sequentially...............................44
Changes to Table 23 ........................................................................45
Changes to Table 24 ........................................................................47
Changes to Power Supply...............................................................54
4/05—Revision 0: Initial Version
Rev. A | Page 3 of 60
AD9511

SPECIFICATIONS

Typical (typ) is given for VS = 3.3 V ± 5%; VS ≤ VCPS ≤ 5.5 V, TA = 25°C, R Minimum (min) and maximum (max) values are given over full V
and TA (−40°C to +85°C) variation.
S

PLL CHARACTERISTICS

Table 1.
Parameter Min Typ Max Unit Test Conditions/Comments
REFERENCE INPUTS (REFIN)
Input Frequency 0 250 MHz Input Sensitivity 150 mV p-p Self-Bias Voltage, REFIN 1.45 1.60 1.75 V Self-bias voltage of REFIN1. Self-Bias Voltage, REFINB 1.40 1.50 1.60 V Self-bias voltage of REFINB1. Input Resistance, REFIN 4.0 4.9 5.8 kΩ Self-biased1. Input Resistance, REFINB 4.5 5.4 6.3 kΩ Self-biased1. Input Capacitance 2 pF
PHASE/FREQUENCY DETECTOR (PFD)
PFD Input Frequency 100 MHz Antibacklash pulse width 0Dh<1:0> = 00b. PFD Input Frequency 100 MHz Antibacklash pulse width 0Dh<1:0> = 01b. PFD Input Frequency 45 MHz Antibacklash pulse width 0Dh<1:0> = 10b. Antibacklash Pulse Width 1.3 ns 0Dh<1:0> = 00b. (This is the default setting.) Antibacklash Pulse Width 2.9 ns 0Dh<1:0> = 01b. Antibacklash Pulse Width 6.0 ns 0Dh<1:0> = 10b.
CHARGE PUMP (CP)
ICP Sink/Source Programmable.
High Value 4.8 mA Low Value 0.60 mA Absolute Accuracy 2.5 % VCP = VCPS/2. CPR
Range 2.7/10 kΩ
SET
ICP Three-State Leakage 1 nA Sink-and-Source Current Matching 2 % 0.5 < VCP < VCPS − 0.5 V. ICP vs. V
CP
ICP vs. Temperature 2 % VCP = VCPS/2 V.
RF CHARACTERISTICS (CLK2)
2
Input Frequency 1.6 GHz
Input Sensitivity 150 mV p-p Input Common-Mode Voltage, V Input Common-Mode Range, V
CM
CMR
Input Sensitivity, Single-Ended 150 mV p-p
Input Resistance 4.0 4.8 5.6 kΩ Self-biased.
Input Capacitance 2 pF CLK2 VS. REFIN DELAY 500 ps Difference at PFD. PRESCALER (PART OF N DIVIDER)
Prescaler Input Frequency
P = 2 DM (2/3) 600 MHz P = 4 DM (4/5) 1000 MHz P = 8 DM (8/9) 1600 MHz P = 16 DM (16/17) 1600 MHz P = 32 DM (32/33) 1600 MHz
CLK2 Input Frequency for PLL 300 MHz A, B counter input frequency.
1.5 % 0.5 < VCP < VCPS − 0.5 V.
1.5 1.6 1.7 V Self-biased; enables ac coupling.
1.3 1.8 V With 200 mV p-p signal applied.
= 4.12 kΩ, CPR
SET
= 5.1 kΩ, unless otherwise noted.
SET
With CPR
= 5.1 kΩ.
SET
Frequencies > 1200 MHz (LVPECL) or 800 MHz (LVDS) require a minimum divide-by-2 (see the
Distribution Section).
CLK2 ac-coupled; CLK2B capacitively bypassed to RF ground.
VCO/VCXO Feedback Divider—N (P, A, B)
See the section.
Rev. A | Page 4 of 60
AD9511
Parameter Min Typ Max Unit Test Conditions/Comments
NOISE CHARACTERISTICS
In-Band Noise of the Charge Pump/ Phase Frequency Detector (In-Band Means Within the LBW of the PLL)
@ 50 kHz PFD Frequency −172 dBc/Hz @ 2 MHz PFD Frequency −156 dBc/Hz @ 10 MHz PFD Frequency −149 dBc/Hz @ 50 MHz PFD Frequency −142 dBc/Hz
PLL Figure of Merit
PLL DIGITAL LOCK DETECT WINDOW
Required to Lock
(Coincidence of Edges) Low Range (ABP 1.3 ns, 2.9 ns Only) 3.5 ns <5> = 1b. High Range (ABP 1.3 ns, 2.9 ns) 7.5 ns <5> = 0b. High Range (ABP 6 ns) 3.5 ns <5> = 0b.
To Unlock After Lock (Hysteresis)
4
Low Range (ABP 1.3 ns, 2.9 ns Only) 7 ns <5> = 1b. High Range (ABP 1.3 ns, 2.9 ns) 15 ns <5> = 0b. High Range (ABP 6 ns) 11 ns <5> = 0b.
1
REFIN and REFINB self-bias points are offset slightly to avoid chatter on an open input condition.
2
CLK2 is electrically identical to CLK1; the distribution only input can be used as differential or single-ended input (see the Clock Inputs section).
3
Example: −218 + 10 × log(f
4
For reliable operation of the digital lock detect, the period of the PFD frequency must be greater than the unlock-after-lock time.
) + 20 × log(N) should give the values for the in-band noise at the VCO output.
PFD
The synthesizer phase noise floor is estimated by measuring the in-band phase noise at the output of the VCO and subtracting 20logN (where N is the N divider value).
−218 + 10 × log (f
dBc/Hz
)
PFD
Approximation of the PFD/CP phase noise floor (in the flat region) inside the PLL loop bandwidth. When running closed loop this phase noise is gained up by 20 × log(N)
4
Signal available at STATUS pin when selected by 08h<5:2>.
Selected by Register ODh.
Selected by Register 0Dh.
3
.

CLOCK INPUTS

Table 2.
Parameter Min Typ Max Unit Test Conditions/Comments
CLOCK INPUTS (CLK1, CLK2)
Input Frequency 0 1.6 GHz Input Sensitivity 1502 mV p-p
Input Level 2
Input Common-Mode Voltage, V Input Common-Mode Range, V Input Sensitivity, Single-Ended 150 mV p-p CLK2 ac-coupled; CLK2B ac bypassed to RF ground. Input Resistance 4.0 4.8 5.6 kΩ Self-biased. Input Capacitance 2 pF
1
CLK1 and CLK2 are electrically identical; each can be used as either differential or single-ended input.
2
With a 50 Ω termination, this is −12.5 dBm.
3
With a 50 Ω termination, this is +10 dBm.
1
Jitter performance can be improved with higher slew rates (greater swing).
3
V p-p
Larger swings turn on the protection diodes and can degrade jitter performance.
CM
CMR
1.5 1.6 1.7 V Self-biased; enables ac coupling.
1.3 1.8 V With 200 mV p-p signal applied; dc-coupled.
Rev. A | Page 5 of 60
AD9511

CLOCK OUTPUTS

Table 3.
Parameter Min Typ Max Unit Test Conditions/Comments
LVPECL CLOCK OUTPUTS Termination = 50 Ω to VS − 2 V
OUT0, OUT1, OUT2; Differential Output level 3Dh (3Eh) (3Fh)<3:2> = 10b
Output Frequency 1200 MHz See Figure 21
Output High Voltage (VOH) VS − 1.22 VS − 0.98 VS − 0.93 V
Output Low Voltage (VOL) VS − 2.10 VS − 1.80 VS − 1.67 V
Output Differential Voltage (VOD) 660 810 965 mV LVDS CLOCK OUTPUTS Termination = 100 Ω differential; default
OUT3, OUT4; Differential
Output Frequency 800 MHz See Figure 22
Differential Output Voltage (VOD) 250 360 450 mV
Delta V
OD
Output Offset Voltage (VOS) 1.125 1.23 1.375 V
Delta V
OS
Short-Circuit Current (ISA, ISB) 14 24 mA Output shorted to GND CMOS CLOCK OUTPUTS
OUT3, OUT4
Output Frequency 250 MHz With 5 pF load each output; see Figure 23
Output Voltage High (VOH) VS-0.1 V @ 1 mA load
Output Voltage Low (VOL) 0.1 V @ 1 mA load
25 mV
25 mV
Output level 40h (41h)<2:1> = 01b
3.5 mA termination current
Single-ended measurements; B outputs: inverted, termination open
Rev. A | Page 6 of 60
AD9511

TIMING CHARACTERISTICS

Table 4.
Parameter Min Typ Max Unit Test Conditions/Comments
LVPECL
Termination = 50 Ω to V
Output level 3Dh (3Eh) (3Fh)<3:2> = 10b Output Rise Time, t Output Fall Time, t
RP
FP
PROPAGATION DELAY, t
, CLK-TO-LVPECL OUT
PECL
1
130 180 ps 20% to 80%, measured differentially 130 180 ps 80% to 20%, measured differentially
Divide = Bypass 335 490 635 ps Divide = 2 − 32 375 545 695 ps Variation with Temperature 0.5 ps/°C
OUTPUT SKEW, LVPECL OUTPUTS
OUT1 to OUT0 on Same Part, t OUT1 to OUT2 on Same Part, t OUT0 to OUT2 on Same Part, t All LVPECL OUT Across Multiple Parts, t Same LVPECL OUT Across Multiple Parts, t
LVDS
SKP
SKP
SKP
2
2
2
3
SKP_AB
3
SKP_AB
70 100 140 ps 15 45 80 ps 45 65 90 Ps 275 ps 130 ps
Termination = 100 Ω differential
Output level 40h (41h) <2:1> = 01b
3.5 mA termination current Output Rise Time, t Output Fall Time, t
RL
FL
PROPAGATION DELAY, t
, CLK-TO-LVDS OUT
LVDS
1
200 350 ps 20% to 80%, measured differentially 210 350 ps 80% to 20%, measured differentially Delay off on OUT4
OUT3 to OUT4
Divide = Bypass 0.99 1.33 1.59 ns Divide = 2 − 32 1.04 1.38 1.64 ns Variation with Temperature 0.9 ps/°C
OUTPUT SKEW, LVDS OUTPUTS Delay off on OUT4
OUT3 to OUT4 on Same Part, t All LVDS OUTs Across Multiple Parts, t Same LVDS OUT Across Multiple Parts, t
SKV
2
3
SKV_AB
3
SKV_AB
−85 +270 ps 450 ps 325 ps
CMOS B outputs are inverted; termination = open
Output Rise Time, t Output Fall Time, t
RC
FC
PROPAGATION DELAY, t
, CLK-TO-CMOS OUT
CMOS
1
681 865 ps 20% to 80%; C 646 992 ps 80% to 20%; C
LOAD
LOAD
Delay off on OUT4 Divide = Bypass 1.02 1.39 1.71 ns Divide = 2 − 32 1.07 1.44 1.76 ns Variation with Temperature 1 ps/°C
OUTPUT SKEW, CMOS OUTPUTS Delay off on OUT4
OUT3 to OUT4 on Same Part, t All CMOS OUT Across Multiple Parts, t Same CMOS OUT Across Multiple Parts, t
SKC
2
3
SKC_AB
3
SKC_AB
−140 +145 +300
650 ps
500 ps
LVPECL-TO-LVDS OUT Everything the same; different logic type
Output Skew, t
SKP_V
0.74 0.92 1.14 ns LVPECL to LVDS on same part
LVPECL-TO-CMOS OUT Everything the same; different logic type
Output Skew, t
SKP_C
0.88 1.14 1.43 ns LVPECL to CMOS on same part
LVDS-TO-CMOS OUT Everything the same; different logic type
Output Skew, t
SKV_C
158 353 506 ps LVDS to CMOS on same part
= 3 pF = 3 pF
− 2 V
S
Rev. A | Page 7 of 60
AD9511
Parameter Min Typ Max Unit Test Conditions/Comments
DELAY ADJUST OUT4; LVDS and CMOS
Shortest Delay Range
Zero Scale 0.05 0.36 0.68 ns 36h <5:1> 00000b Full Scale 0.72 1.12 1.51 ns 36h <5:1> 11111b Linearity, DNL 0.5 LSB Linearity, INL 0.8 LSB
Longest Delay Range
Zero Scale 0.20 0.57 0.95 ns 36h <5:1> 00000b Full Scale 9.0 10.2 11.6 ns 36h <5:1> 11111b Linearity, DNL 0.3 LSB Linearity, INL 0.6 LSB
Delay Variation with Temperature
Long Delay Range, 10 ns
Zero Scale 0.35 ps/°C Full Scale −0.14 ps/°C
Short Delay Range, 1 ns
Zero Scale 0.51 ps/°C Full Scale 0.67 ps/°C
1
The measurements are for CLK1. For CLK2, add approximately 25 ps.
2
This is the difference between any two similar delay paths within a single device operating at the same voltage and temperature.
3
This is the difference between any two similar delay paths across multiple devices operating at the same voltage and temperature.
4
Incremental delay; does not include propagation delay.
5
All delays between zero scale and full scale can be estimated by linear interpolation.
4
4
5
5
35h <5:1> 11111b
35h <5:1> 00000b
Rev. A | Page 8 of 60
AD9511

CLOCK OUTPUT PHASE NOISE

Table 5.
Parameter Min Typ Max Unit Test Conditions/Comments
CLK1-TO-LVPECL ADDITIVE PHASE NOISE
CLK1 = 622.08 MHz, OUT = 622.08 MHz Input slew rate > 1 V/ns
Divide Ratio = 1
@ 10 Hz Offset −125 dBc/Hz @ 100 Hz Offset −132 dBc/Hz @ 1 kHz Offset −140 dBc/Hz @ 10 kHz Offset −148 dBc/Hz @ 100 kHz Offset −153 dBc/Hz >1 MHz Offset −154 dBc/Hz
CLK1 = 622.08 MHz, OUT = 155.52 MHz
Divide Ratio = 4
@ 10 Hz Offset −128 dBc/Hz @ 100 Hz Offset −140 dBc/Hz @ 1 kHz Offset −148 dBc/Hz @ 10 kHz Offset −155 dBc/Hz @ 100 kHz Offset −161 dBc/Hz >1 MHz Offset −161 dBc/Hz
CLK1 = 622.08 MHz, OUT = 38.88 MHz
Divide Ratio = 16
@ 10 Hz Offset −135 dBc/Hz @ 100 Hz Offset −145 dBc/Hz @ 1 kHz Offset −158 dBc/Hz @ 10 kHz Offset −165 dBc/Hz @ 100 kHz Offset −165 dBc/Hz >1 MHz Offset −166 dBc/Hz
CLK1 = 491.52 MHz, OUT = 61.44 MHz
Divide Ratio = 8
@ 10 Hz Offset −131 dBc/Hz @ 100 Hz Offset −142 dBc/Hz @ 1 kHz Offset −153 dBc/Hz @ 10 kHz Offset −160 dBc/Hz @ 100 kHz Offset −165 dBc/Hz >1 MHz Offset −165 dBc/Hz
CLK1 = 491.52 MHz, OUT = 245.76 MHz
Divide Ratio = 2
@ 10 Hz Offset −125 dBc/Hz @ 100 Hz Offset −132 dBc/Hz @ 1 kHz Offset −140 dBc/Hz @ 10 kHz Offset −151 dBc/Hz @ 100 kHz Offset −157 dBc/Hz >1 MHz Offset −158 dBc/Hz
CLK1 = 245.76 MHz, OUT = 61.44 MHz
Divide Ratio = 4
@ 10 Hz Offset −138 dBc/Hz @ 100 Hz Offset −144 dBc/Hz @ 1 kHz Offset −154 dBc/Hz @ 10 kHz Offset −163 dBc/Hz @ 100 kHz Offset −164 dBc/Hz >1 MHz Offset −165 dBc/Hz
Distribution Section only; does not include PLL or external VCO/VCXO
Rev. A | Page 9 of 60
AD9511
Parameter Min Typ Max Unit Test Conditions/Comments
CLK1-TO-LVDS ADDITIVE PHASE NOISE
CLK1 = 622.08 MHz, OUT= 622.08 MHz
Divide Ratio = 1
@ 10 Hz Offset −100 dBc/Hz @ 100 Hz Offset −110 dBc/Hz @ 1 kHz Offset −118 dBc/Hz @ 10 kHz Offset −129 dBc/Hz @ 100 kHz Offset −135 dBc/Hz @ 1 MHz Offset −140 dBc/Hz >10 MHz Offset −148 dBc/Hz
CLK1 = 622.08 MHz, OUT = 155.52 MHz
Divide Ratio = 4
@ 10 Hz Offset −112 dBc/Hz @ 100 Hz Offset −122 dBc/Hz @ 1 kHz Offset −132 dBc/Hz @ 10 kHz Offset −142 dBc/Hz @ 100 kHz Offset −148 dBc/Hz @ 1 MHz Offset −152 dBc/Hz >10 MHz Offset −155 dBc/Hz
CLK1 = 491.52 MHz, OUT = 245.76 MHz
Divide Ratio = 2
@ 10 Hz Offset −108 dBc/Hz @ 100 Hz Offset −118 dBc/Hz @ 1 kHz Offset −128 dBc/Hz @ 10 kHz Offset −138 dBc/Hz @ 100 kHz Offset −145 dBc/Hz @ 1 MHz Offset −148 dBc/Hz >10 MHz Offset −154 dBc/Hz
CLK1 = 491.52 MHz, OUT = 122.88 MHz
Divide Ratio = 4
@ 10 Hz Offset −118 dBc/Hz @ 100 Hz Offset −129 dBc/Hz @ 1 kHz Offset −136 dBc/Hz @ 10 kHz Offset −147 dBc/Hz @ 100 kHz Offset −153 dBc/Hz @ 1 MHz Offset −156 dBc/Hz >10 MHz Offset −158 dBc/Hz
CLK1 = 245.76 MHz, OUT = 245.76 MHz
Divide Ratio = 1
@ 10 Hz Offset −108 dBc/Hz @ 100 Hz Offset −118 dBc/Hz @ 1 kHz Offset −128 dBc/Hz @ 10 kHz Offset −138 dBc/Hz @ 100 kHz Offset −145 dBc/Hz @ 1 MHz Offset −148 dBc/Hz >10 MHz Offset −155 dBc/Hz
CLK1 = 245.76 MHz, OUT = 122.88 MHz
Divide Ratio = 2
@ 10 Hz Offset −118 dBc/Hz @ 100 Hz Offset −127 dBc/Hz @ 1 kHz Offset −137 dBc/Hz @ 10 kHz Offset −147 dBc/Hz
Distribution Section only; does not include PLL or external VCO/VCXO
Rev. A | Page 10 of 60
AD9511
Parameter Min Typ Max Unit Test Conditions/Comments
@ 100 kHz Offset −154 dBc/Hz @ 1 MHz Offset −156 dBc/Hz >10 MHz Offset −158 dBc/Hz
CLK1-TO-CMOS ADDITIVE PHASE NOISE
CLK1 = 245.76 MHz, OUT = 245.76 MHz
Divide Ratio = 1
@ 10 Hz Offset −110 dBc/Hz @ 100 Hz Offset −121 dBc/Hz @ 1 kHz Offset −130 dBc/Hz @ 10 kHz Offset −140 dBc/Hz @ 100 kHz Offset −145 dBc/Hz @ 1 MHz Offset −149 dBc/Hz > 10 MHz Offset −156 dBc/Hz
CLK1 = 245.76 MHz, OUT = 61.44 MHz
Divide Ratio = 4
@ 10 Hz Offset −122 dBc/Hz @ 100 Hz Offset −132 dBc/Hz @ 1 kHz Offset −143 dBc/Hz @ 10 kHz Offset −152 dBc/Hz @ 100 kHz Offset −158 dBc/Hz @ 1 MHz Offset −160 dBc/Hz >10 MHz Offset −162 dBc/Hz
CLK1 = 78.6432 MHz, OUT = 78.6432 MHz
Divide Ratio = 1
@ 10 Hz Offset −122 dBc/Hz @ 100 Hz Offset −132 dBc/Hz @ 1 kHz Offset −140 dBc/Hz @ 10 kHz Offset −150 dBc/Hz @ 100 kHz Offset −155 dBc/Hz @ 1 MHz Offset −158 dBc/Hz >10 MHz Offset −160 dBc/Hz
CLK1 = 78.6432 MHz, OUT = 39.3216 MHz
Divide Ratio = 2
@ 10 Hz Offset −128 dBc/Hz @ 100 Hz Offset −136 dBc/Hz @ 1 kHz Offset −146 dBc/Hz @ 10 kHz Offset −155 dBc/Hz @ 100 kHz Offset −161 dBc/Hz >1 MHz Offset −162 dBc/Hz
Distribution Section only; does not include PLL or external VCO/VCXO
Rev. A | Page 11 of 60
AD9511

CLOCK OUTPUT ADDITIVE TIME JITTER

Table 6.
Parameter Min Typ Max Unit Test Conditions/Comments
LVPECL OUTPUT ADDITIVE TIME JITTER
CLK1 = 622.08 MHz 40 fs rms BW = 12 kHz − 20 MHz (OC-12)
Any LVPECL (OUT0 to OUT2) = 622.08 MHz Divide Ratio = 1
CLK1 = 622.08 MHz 55 fs rms BW = 12 kHz − 20 MHz (OC-3)
Any LVPECL (OUT0 to OUT2) = 155.52 MHz Divide Ratio = 4
CLK1 = 400 MHz 215 fs rms
Any LVPECL (OUT0 to OUT2) = 100 MHz Divide Ratio = 4
CLK1 = 400 MHz 215 fs rms
Any LVPECL (OUT0 to OUT2) = 100 MHz Divide Ratio = 4 Other LVPECL = 100 MHz Interferer(s) Both LVDS (OUT3, OUT4) = 100 MHz Interferer(s)
CLK1 = 400 MHz 222 fs rms
Any LVPECL (OUT0 to OUT2) = 100 MHz Divide Ratio = 4 Other LVPECL = 50 MHz Interferer(s) Both LVDS (OUT3, OUT4) = 50 MHz Interferer(s)
CLK1 = 400 MHz 225 fs rms
Any LVPECL (OUT0 to OUT2) = 100 MHz Divide Ratio = 4 Other LVPECL = 50 MHz Interferer(s) Both CMOS (OUT3, OUT4) = 50 MHz (B Outputs Off) Interferer(s)
CLK1 = 400 MHz 225 fs rms
Any LVPECL (OUT0 to OUT2) = 100 MHz Divide Ratio = 4 Other LVPECL = 50 MHz Interferer(s) Both CMOS (OUT3, OUT4) = 50 MHz (B Outputs On) Interferer(s)
LVDS OUTPUT ADDITIVE TIME JITTER
CLK1 = 400 MHz 264 fs rms
LVDS (OUT3) = 100 MHz Divide Ratio = 4
CLK1 = 400 MHz 319 fs rms
LVDS (OUT4) = 100 MHz Divide Ratio = 4
Distribution Section only; does not include PLL or external VCO/VCXO
Calculated from SNR of ADC method;
= 100 MHz with AIN = 170 MHz
F
C
Calculated from SNR of ADC method; F
= 100 MHz with AIN = 170 MHz
C
Calculated from SNR of ADC method; F
= 100 MHz with AIN = 170 MHz
C
Calculated from SNR of ADC method; F
= 100 MHz with AIN = 170 MHz
C
Calculated from SNR of ADC method;
= 100 MHz with AIN = 170 MHz
F
C
Distribution Section only; does not include PLL or external VCO/VCXO
Calculated from SNR of ADC method;
= 100 MHz with AIN = 170 MHz
F
C
Calculated from SNR of ADC method;
= 100 MHz with AIN = 170 MHz
F
C
Rev. A | Page 12 of 60
AD9511
Parameter Min Typ Max Unit Test Conditions/Comments
CLK1 = 400 MHz 395 fs rms
LVDS (OUT3) = 100 MHz Divide Ratio = 4 LVDS (OUT4) = 50 MHz Interferer(s) All LVPECL = 50 MHz Interferer(s)
CLK1 = 400 MHz 395 fs rms
LVDS (OUT4) = 100 MHz Divide Ratio = 4 LVDS (OUT3) = 50 MHz Interferer(s) All LVPECL = 50 MHz Interferer(s)
CLK1 = 400 MHz 367 fs rms
LVDS (OUT3) = 100 MHz Divide Ratio = 4 CMOS (OUT4) = 50 MHz (B Outputs Off) Interferer(s) All LVPECL = 50 MHz Interferer(s)
CLK1 = 400 MHz 367 fs rms
LVDS (OUT4) = 100 MHz Divide Ratio = 4 CMOS (OUT3) = 50 MHz (B Outputs Off) Interferer(s) All LVPECL = 50 MHz Interferer(s)
CLK1 = 400 MHz 548 fs rms
LVDS (OUT3) = 100 MHz Divide Ratio = 4 CMOS (OUT4) = 50 MHz (B Outputs On) Interferer(s) All LVPECL = 50 MHz Interferer(s)
CLK1 = 400 MHz 548 fs rms
LVDS (OUT4) = 100 MHz Divide Ratio = 4 CMOS (OUT3) = 50 MHz (B Outputs On) Interferer(s) All LVPECL = 50 MHz Interferer(s)
CMOS OUTPUT ADDITIVE TIME JITTER
CLK1 = 400 MHz 275 fs rms
Both CMOS (OUT3, OUT4) = 100 MHz (B Output On) Divide Ratio = 4
CLK1 = 400 MHz 400 fs rms
CMOS (OUT3) = 100 MHz (B Output On) Divide Ratio = 4 All LVPECL = 50 MHz Interferer(s) LVDS (OUT4) = 50 MHz Interferer(s)
CLK1 = 400 MHz 374 fs rms
CMOS (OUT3) = 100 MHz (B Output On) Divide Ratio = 4 All LVPECL = 50 MHz Interferer(s) CMOS (OUT4) = 50 MHz (B Output Off) Interferer(s)
Calculated from SNR of ADC method;
= 100 MHz with AIN = 170 MHz
F
C
Calculated from SNR of ADC method; F
= 100 MHz with AIN = 170 MHz
C
Calculated from SNR of ADC method; F
= 100 MHz with AIN = 170 MHz
C
Calculated from SNR of ADC method; F
= 100 MHz with AIN = 170 MHz
C
Calculated from SNR of ADC method;
= 100 MHz with AIN = 170 MHz
F
C
Calculated from SNR of ADC method;
= 100 MHz with AIN = 170 MHz
F
C
Distribution Section only; does not include PLL or external VCO/VCXO
Calculated from SNR of ADC method;
= 100 MHz with AIN = 170 MHz
F
C
Calculated from SNR of ADC method;
= 100 MHz with AIN = 170 MHz
F
C
Calculated from SNR of ADC method;
= 100 MHz with AIN = 170 MHz
F
C
Rev. A | Page 13 of 60
AD9511
Parameter Min Typ Max Unit Test Conditions/Comments
CLK1 = 400 MHz 555 fs rms
CMOS (OUT3) = 100 MHz (B Output On) Divide Ratio = 4 All LVPECL = 50 MHz Interferer(s) CMOS (OUT4) = 50 MHz (B Output On) Interferer(s)
DELAY BLOCK ADDITIVE TIME JITTER
1
Incremental additive jitter
100 MHz Output
Delay FS = 1 ns (1600 A, 1C) Fine Adj. 00000 0.61 ps Delay FS = 1 ns (1600 A, 1C) Fine Adj. 11111 0.73 ps Delay FS = 2 ns (800 A, 1C) Fine Adj. 00000 0.71 ps Delay FS = 2 ns (800 A, 1C) Fine Adj. 11111 1.2 ps Delay FS = 3 ns (800 A, 4C) Fine Adj. 00000 0.86 ps Delay FS = 3 ns (800 A, 4C) Fine Adj. 11111 1.8 ps Delay FS = 4 ns (400 A, 4C) Fine Adj. 00000 1.2 ps Delay FS = 4 ns (400 A, 4C) Fine Adj. 11111 2.1 ps Delay FS = 5 ns (200 A, 1C) Fine Adj. 00000 1.3 ps Delay FS = 5 ns (200 A, 1C) Fine Adj. 11111 2.7 ps Delay FS = 11 ns (200 A, 4C) Fine Adj. 00000 2.0 ps Delay FS = 11 ns (200 A, 4C) Fine Adj. 00100 2.8 ps
1
This value is incremental. That is, it is in addition to the jitter of the LVDS or CMOS output without the delay. To estimate the total jitter, the LVDS or CMOS output jitter
should be added to this value using the root sum of the squares (RSS) method.
Calculated from SNR of ADC method;
= 100 MHz with AIN = 170 MHz
F
C

PLL AND DISTRIBUTION PHASE NOISE AND SPURIOUS

Table 7.
Parameter Min Typ Max Unit Test Conditions/Comments
PHASE NOISE AND SPURIOUS
VCXO = 245.76 MHz,
F
= 1.2288 MHz; R = 25, N = 200
PFD
VCXO is Toyocom TCO-2112 245.76.
245.76 MHz Output Divide by 1. Phase Noise @100 kHz Offset <−145 dBc/Hz Dominated by VCXO phase noise. Spurious <−97 dBc
61.44 MHz Output Divide by 4. Phase Noise @100 kHz Offset <−155 dBc/Hz Dominated by VCXO phase noise. Spurious <−97 dBc
Depends on VCO/VCXO selection. Measured at LVPECL clock outputs; ABP = 6 ns; I
First and second harmonics of F
= 5 mA; Ref = 30.72 MHz.
CP
.
PFD
Below measurement floor.
First and second harmonics of F
PFD
.
Below measurement floor.
Rev. A | Page 14 of 60
AD9511

SERIAL CONTROL PORT

Table 8.
Parameter Min Typ Max Unit Test Conditions/Comments
CSB, SCLK (INPUTS)
Input Logic 1 Voltage 2.0 V Input Logic 0 Voltage 0.8 V Input Logic 1 Current 110 µA Input Logic 0 Current 1 µA Input Capacitance 2 pF
SDIO (WHEN INPUT)
Input Logic 1 Voltage 2.0 V Input Logic 0 Voltage 0.8 V Input Logic 1 Current 10 nA Input Logic 0 Current 10 nA Input Capacitance 2 pF
SDIO, SDO (OUTPUTS)
Output Logic 1 Voltage 2.7 V Output Logic 0 Voltage 0.4 V
TIMING
Clock Rate (SCLK, 1/t Pulse Width High, t Pulse Width Low, t SDIO to SCLK Setup, t SCLK to SDIO Hold, t SCLK to Valid SDIO and SDO, t CSB to SCLK Setup and Hold, tS, t CSB Minimum Pulse Width High, t
) 25 MHz
SCLK
PWH
PWL
DS
DH
DV
H
PWH
16 ns 16 ns 2 ns 1 ns 6 ns 2 ns 3 ns
CSB and SCLK have 30 kΩ internal pull-down resistors

FUNCTION PIN

Table 9.
Parameter Min Typ Max Unit Test Conditions/Comments
INPUT CHARACTERISTICS
Logic 1 Voltage 2.0 V Logic 0 Voltage 0.8 V Logic 1 Current 110 µA Logic 0 Current 1 µA Capacitance 2 pF
RESET TIMING
Pulse Width Low 50 ns
SYNC TIMING
Pulse Width Low 1.5 High speed clock cycles
The FUNCTION pin has a 30 kΩ internal pull-down resistor. This pin should normally be held high. Do not leave NC.
High speed clock is CLK1 or CLK2, whichever is used for distribution.
Rev. A | Page 15 of 60
AD9511

STATUS PIN

Table 10.
Parameter Min Typ Max Unit Test Conditions/Comments
OUTPUT CHARACTERISTICS
Output Voltage High (VOH) 2.7 V Output Voltage Low (VOL) 0.4 V
MAXIMUM TOGGLE RATE 100 MHz
ANALOG LOCK DETECT
Capacitance 3 pF

POWER

Table 11.
Parameter Min Typ Max Unit Test Conditions/Comments
POWER-UP DEFAULT MODE POWER DISSIPATION 550 600 mW
POWER DISSIPATION 800 mW
850 mW
Full Sleep Power-Down 35 60 mW
Power-Down (PDB) 60 80 mW
POWER DELTA
CLK1, CLK2 Power-Down 10 15 25 mW Divider, DIV 2 − 32 to Bypass 23 27 33 mW For each divider. LVPECL Output Power-Down (PD2, PD3) 50 65 75 mW
LVDS Output Power-Down 80 92 110 mW For each output. CMOS Output Power-Down (Static) 56 70 85 mW For each output. Static (no clock). CMOS Output Power-Down (Dynamic) 115 150 190 mW
CMOS Output Power-Down (Dynamic) 125 165 210 mW
Delay Block Bypass 20 24 60 mW
PLL Section Power-Down 5 15 40 mW
When selected as a digital output (CMOS); there are other modes in which the STATUS pin is not CMOS digital output. See
Applies when PLL mux is set to any divider or counter output, or PFD up/down pulse. Also applies in analog lock detect mode.
Usually debug mode only. Beware that spurs may couple to output when this pin is toggling.
On-chip capacitance; used to calculate RC time constant for analog lock detect readback. Use a pull-up resistor.
Power-up default state; does not include power dissipated in output load resistors. No clock.
All outputs on. Three LVPECL outputs @ 800 MHz, two CMOS out @ 62 MHz (5 pF load). Does not include power dissipated in external resistors.
All outputs on. Three LVPECL outputs @ 800 MHz, two CMOS out @ 125 MHz (5 pF load). Does not include power dissipated in external resistors.
Maximum sleep is entered by setting 0Ah<1:0> = 01b and 58h<4> = 1b. This powers off the PLL BG and the distribution BG references. Does not include power dissipated in terminations.
Set FUNCTION pin for PDB operation by setting 58h<6:5> = 11b. Pull PDB low. Does not include power dissipated in terminations.
For each output. Does not include dissipation in termination (PD2 only).
For each CMOS output, single-ended. Clocking at 62 MHz with 5 pF load.
For each CMOS output, single-ended. Clocking at 125 MHz with 5 pF load.
Vs. delay block operation at 1 ns fs with maximum delay; output clocking at 25 MHz.
Figure 37.
Rev. A | Page 16 of 60
AD9511
C

TIMING DIAGRAMS

LK1
t
CLK1
DIFFERENTIAL
t
PECL
t
LVDS
t
CMOS
Figure 2. CLK1/CLK1B to Clock Output Timing, DIV = 1 Mode
DIFFERENTIAL
80%
LVPECL
20%
t
RP
Figure 3. LVPECL Timing, Differential
80%
LVDS
20%
t
05286-002
RL
t
FL
05286-065
Figure 4. LVDS Timing, Differential
SINGLE-ENDED
80%
CMOS
3pF LOAD
20%
t
FP
05286-064
t
RC
t
FC
05286-066
Figure 5. CMOS Timing, Single-Ended, 3 pF Load
Rev. A | Page 17 of 60
AD9511

ABSOLUTE MAXIMUM RATINGS

Table 12.
With Respect
Parameter or Pin
VS GND −0.3 +3.6 V VCP GND −0.3 +5.8 V VCP V REFIN, REFINB GND −0.3 VS + 0.3 V RSET GND −0.3 VS + 0.3 V CPRSET GND −0.3 VS + 0.3 V CLK1, CLK1B, CLK2, CLK2B GND −0.3 VS + 0.3 V CLK1 CLK1B −1.2 +1.2 V CLK2 CLK2B −1.2 +1.2 V SCLK, SDIO, SDO, CSB GND −0.3 VS + 0.3 V OUT0, OUT1, OUT2, OUT3,
OUT4 FUNCTION GND −0.3 VS + 0.3 V STATUS GND −0.3 VS + 0.3 V Junction Temperature 150 °C Storage Temperature −65 +150 °C Lead Temperature (10 sec) 300 °C
to
S
Min Max Unit
−0.3 +5.8 V
GND −0.3 V
+ 0.3 V
S
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum ratings for extended periods may affect device reliability.

THERMAL CHARACTERISTICS

Thermal Resistance
48-Lead LFCSP
θ
= 28.5°C/W
JA
1
Thermal impedance measurements were taken on a 4-layer board in still air,
in accordance with EIA/JESD51-7.
1

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. A | Page 18 of 60
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