SNR = 47 dBFS at fIN up to 250 MHz at 500 MSPS
ENOB of 7.5 bits at f
SFDR = 79 dBc at f
Integrated input buffer
Excellent linearity
DNL = ±0.1 LSB typical
INL = ±0.1 LSB typical
LVDS at 500 MSPS (ANSI-644 levels)
1 GHz full power analog bandwidth
On-chip reference, no external decoupling required
Low power dissipation
670 mW at 500 MSPS—LVDS SDR output
Programmable (nominal) input voltage range
1.18 V p-p to 1.6 V p-p, 1.5 V p-p nominal
1.8 V analog and digital supply operation
Selectable output data format (offset binary, twos
Wireless and wired broadband communications
Cable reverse path
Communications test equipment
Low cost digital oscilloscopes
Satellite subsystems
Power amplifier linearization
GENERAL DESCRIPTION
The AD9484 is an 8-bit, monolithic, sampling analog-to-digital
converter (ADC) optimized for high performance, low power,
and ease of use. The part operates at up to a 500 MSPS conversion rate and is optimized for outstanding dynamic performance
in wideband carrier and broadband systems. All necessary
functions, including a sample-and-hold and voltage reference,
are included on the chip to provide a complete signal conversion
solution. The VREF pin can be used to monitor the internal
reference or provide an external voltage reference (external
reference mode must be enabled through the SPI port).
The ADC requires a 1.8 V analog voltage supply and a differential clock for full performance operation. The digital outputs are
LVDS (ANSI-644) compatible and support twos complement,
offset binary format, or Gray code. A data clock output is available
for proper output data timing.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Fabricated on an advanced BiCMOS process, the AD9484 is available in a 56-lead LFCSP, and is specified over the industrial
temperature range (−40°C to +85°C). This product is protected
by a U.S. patent.
PRODUCT HIGHLIGHTS
1. High Performance.
Maintains 47 dBFS SNR at 500 MSPS with a 250 MHz input.
2. Ease of Use.
LVDS output data and output clock signal allow interface
to current FPGA technology. The on-chip reference and
sample-and-hold provide flexibility in system design. Use
of a single 1.8 V supply simplifies system power supply design.
3. Serial Port Control.
Standard serial port interface supports various product
functions, such as data formatting, power-down, gain
adjust, and output test pattern generation.
Change to General Description Section ........................................ 1
Change to Aperture Time Parameter in Table 4 ........................... 6
Change to Figure 34 ....................................................................... 16
Changes to Register 17 and Register 18 in Table 12 .................. 20
3/11—Revision 0: Initial Version
Rev. A | Page 2 of 24
AD9484
SPECIFICATIONS
DC SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, T
Table 1.
Parameter1 Temp Min Typ Max Unit
RESOLUTION 8 Bits
ACCURACY
No Missing Codes Full Guaranteed
Offset Error 25°C 0 mV
Full −3.0 +3.0 mV
Gain Error 25°C 1.0 % FS
Full −5.0 +7.0 % FS
Differential Nonlinearity (DNL) 25°C ±0.13 LSB
Full −0.25 +0.25 LSB
Integral Nonlinearity (INL) 25°C ±0.1 LSB
Full −0.15 +0.15 LSB
INTERNAL REFERENCE
VREF Full 0.71 0.75 0.78 V
TEMPERATURE DRIFT
Offset Error Full 18 μV/°C
Gain Error Full 0.07 %/°C
ANALOG INPUTS (VIN+, VIN−)
Differential Input Voltage Range2 Full 1.18 1.5 1.6 V p-p
Input Common-Mode Voltage Full 1.7 V
Input Resistance (Differential) Full 1 kΩ
Input Capacitance (Differential) Full 1.3 pF
POWER SUPPLY
AVDD Full 1.75 1.8 1.9 V
DRVDD Full 1.75 1.8 1.9 V
Supply Currents
3
I
Full 283 300 mA
AVDD
3
I
/SDR Mode4 Full 89 100 mA
DRVDD
Power Dissipation
SDR Mode4 Full 670 720 mW
Standby Mode Full 40 50 mW
Power-Down Mode Full 2.5 7 mW
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed.
2
The input range is programmable through the SPI, and the range specified reflects the nominal values of each setting. See the section. Memory Map
3
I
and I
AVDD
4
Single data rate mode; this is the default mode of the AD9484.
are measured with a −1 dBFS, 10.3 MHz sine input at a rated sample rate.
DRVDD
= −40°C, T
MIN
= +85°C, fIN = −1.0 dBFS, full scale = 1.5 V, unless otherwise noted.
MAX
Rev. A | Page 3 of 24
AD9484
AC SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, T
= −40°C, T
MIN
= +85°C, fIN = −1.0 dBFS, full scale = 1.5 V, unless otherwise noted.
MAX
Table 2.
Parameter
1, 2
Temp Min Typ Max Unit
SNR
fIN = 30.3 MHz 25°C 47.0 dBFS
fIN = 70.3 MHz 25°C 47.0 dBFS
fIN = 100.3 MHz 25°C 47.0 dBFS
Full 46.5 dBFS
fIN = 250.3 MHz 25°C 47.0 dBFS
fIN = 450.3 MHz 25°C 46.9 dBFS
SINAD
fIN = 30.3 MHz 25°C 47.0 dBFS
fIN = 70.3 MHz 25°C 47.0 dBFS
fIN = 100.3 MHz 25°C 47.0 dBFS
Full 46.4 dBFS
fIN = 250.3 MHz 25°C 47.0 dBFS
fIN = 450.3 MHz 25°C 46.9 dBFS
EFFECTIVE NUMBER OF BITS (ENOB)
fIN = 30.3 MHz 25°C 7.5 Bits
fIN = 70.3 MHz 25°C 7.5 Bits
fIN = 100.3 MHz 25°C 7.5 Bits
fIN = 250.3 MHz 25°C 7.5 Bits
fIN = 450.3 MHz 25°C 7.5 Bits
WORST HARMONIC (SECOND or THIRD)
fIN = 30.3 MHz 25°C −87 dBc
fIN = 70.3 MHz 25°C −86 dBc
fIN = 100.3 MHz 25°C −87 dBc
Full −75 dBc
fIN = 250.3 MHz 25°C 83 dBc
fIN = 450.3 MHz 25°C 70 dBc
SFDR
fIN = 30.3 MHz 25°C 82 dBc
fIN = 70.3 MHz 25°C 81 dBc
fIN = 100.3 MHz 25°C 82 dBc
Full 75 dBc
fIN = 250.3 MHz 25°C 79 dBc
fIN = 450.3 MHz 25°C 70 dBc
WORST OTHER HARMONIC (SFDR EXCLUDING SECOND and THIRD)
fIN = 30.3 MHz 25°C −82 dBc
fIN = 70.3 MHz 25°C −81 dBc
fIN = 100.3 MHz 25°C −82 dBc
Full −75 dBc
fIN = 250.3 MHz 25°C 79 dBc
fIN = 450.3 MHz 25°C 77 dBc
TWO-TONE IMD
f
= 119.5 MHz, f
IN1
= 122.5 MHz 25°C −77 dBc
IN2
ANALOG INPUT BANDWIDTH
Full Power 25°C 1 GHz
1
All ac specifications tested by driving CLK+ and CLK− differentially.
2
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed.
Rev. A | Page 4 of 24
AD9484
DIGITAL SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, T
Table 3.
Parameter1 Temp Min Typ Max Unit
CLOCK INPUTS
Logic Compliance Full CMOS/LVDS/LVPECL
Internal Common-Mode Bias Full 0.9 V
Differential Input Voltage
High Level Input (VIH) Full 0.2 1.8 V p-p
Low Level Input (VIL) Full −1.8 −0.2 V p-p
High Level Input Current (IIH) Full −10 +10 μA
Low Level Input Current (IIL) Full −10 +10 μA
Input Resistance (Differential) Full 8 10 12 kΩ
Input Capacitance Full 4 pF
LOGIC INPUTS
Logic 1 Voltage Full 0.8 × DRVDD V
Logic 0 Voltage Full 0.2 × DRVDD V
Logic 1 Input Current (SDIO, CSB) Full 0 μA
Logic 0 Input Current (SDIO, CSB) Full −60 μA
Logic 1 Input Current (SCLK, PDWN) Full 50 μA
Logic 0 Input Current (SCLK, PDWN) Full 0 μA
Input Capacitance Full 4 pF
LOGIC OUTPUTS2
VOD Differential Output Voltage Full 247 454 mV
VOS Output Offset Voltage Full 1.125 1.375 V
Output Coding
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed.
2
LVDS R
TERMINATION
= 100 Ω.
= −40°C, T
MIN
= +85°C, fIN = −1.0 dBFS, full scale = 1.5 V, unless otherwise noted.
MAX
Rev. A | Page 5 of 24
AD9484
SWITCHING SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, T
Table 4.
Parameter Temp Min Typ Max Unit
Maximum Conversion Rate Full 500
Minimum Conversion RateFull
1
CLK+ Pulse Width High (tCH)
CLK+ Pulse Width Low (tCL)1 Full 0.9 11 ns
Output (LVDS—SDR)1
Data Propagation Delay (tPD) Full 0.85 ns
Rise Time (tR) (20% to 80%) 25°C 0.15 ns
Fall Time (tF) (20% to 80%) 25°C 0.15 ns
DCO Propagation Delay (t
Data to DCO Skew (t
CPD
) Full −0.07 +0.07 ns
SKEW
Latency Full 15 Clock cycles
Aperture Time (tA) 25°C 0.85 ns
Aperture Uncertainty (Jitter, tJ) 25°C 80 fs rms
1
See . Figure 2
Timing Diagram
N – 1
VIN+, VIN–
= −40°C, T
MIN
= +85°C, fIN = −1.0 dBFS, full scale = 1.5 V, unless otherwise noted.
MAX
50 MSPS
MSPS
Full 0.9 11 ns
) Full 0.6 ns
t
A
N
N + 3
N + 1
N + 2
N + 4
N + 5
CLK+
CLK–
DCO+
DCO–
Dx+
Dx–
t
CH
t
t
CPD
1/
CL
f
S
t
SKEW
t
PD
N – 15N – 14N – 13N – 12N – 11
09615-002
Figure 2. Timing Diagram
Rev. A | Page 6 of 24
AD9484
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
Electrical
AVDD to AGND −0.3 V to +2.0 V
DRVDD to DRGND −0.3 V to +2.0 V
AGND to DRGND −0.3 V to +0.3 V
AVDD to DRVDD −2.0 V to +2.0 V
D0+/D0− through D7+/D7−
to DRGND
DCO+, DCO− to DRGND −0.3 V to DRVDD + 0.2 V
OR+, OR− to DRGND −0.3 V to DRVDD + 0.2 V
CLK+ to AGND −0.3 V to AVDD + 0.2 V
CLK− to AGND −0.3 V to AVDD + 0.2 V
VIN+ to AGND −0.3 V to AVDD + 0.2 V
VIN− to AGND −0.3 V to AVDD + 0.2 V
SDIO/DCS to DRGND −0.3 V to DRVDD + 0.2 V
PDWN to AGND −0.3 V to DRVDD + 0.2 V
CSB to AGND −0.3 V to DRVDD + 0.2 V
SCLK/DFS to AGND −0.3 V to DRVDD + 0.2 V
CML to AGND −0.3 V to AVDD + 0.2 V
VREF to AGND −0.3 V to AVDD + 0.2 V
Environmental
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +85°C
Lead Temperature
(Soldering, 10 sec)
Junction Temperature 150°C
−0.3 V to DRVDD + 0.2 V
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the PCB
increases the reliability of the solder joints, maximizing the
thermal capability of the package.
Table 6.
Package Type θJA θ
56-Lead LFCSP_VQ (CP-56-5) 23.7 1.7 °C/W
Unit
JC
Typical θJA and θJC are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θ
JA
. In
addition, metal in direct contact with the package leads from
metal traces, through holes, ground, and power planes reduces
the θ
.
JA
ESD CAUTION
Rev. A | Page 7 of 24
AD9484
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
DNC
DNC
DNC
55
56
54
1DNC
2DNC
3D0–
4D0+
5D1–
6D1+
7DRVDD
8DRGND
9D2–
10D2+
11D3–
12D3+
13D4–
14D4+
NOTES
1. DNC = DO NOT CONNECT. DO NOT CO NNECT TO THIS PI N.
2. AGND AND DRGND SHO ULD BE TI ED TO A CO MMON
QUIET G ROUND PLANE.
3. THE EXPOSED PADDLE MUST BE SOLDERED T O
A GROUND PLANE .
0 AGND1 Analog Ground. The exposed paddle must be soldered to a ground plane.
30, 32 to 34, 37 to 39,
AVDD 1.8 V Analog Supply.
41 to 43, 46
7, 24, 47 DRVDD 1.8 V Digital Output Supply.
8, 23, 48 DRGND1 Digital Output Ground.
35 VIN+ Analog Input—True.
36 VIN− Analog Input—Complement.
40 CML
Common-Mode Output. Enabled through the SPI, this pin provides a reference for the
optimized internal bias voltage for VIN+/VIN−.
44 CLK+ Clock Input—True.
45 CLK− Clock Input—Complement.
31 VREF Voltage Reference Internal/Input/Output. Nominally 0.75 V.
1, 2, 28, 51 to 56 DNC Do Not Connect. Do not connect to this pin. This pin should be left floating.
25 SDIO Serial Port Interface (SPI) Data Input/Output.
26 SCLK/DFS Serial Port Interface Clock (Serial Port Mode)/Data Format Select (External Pin Mode).
27 CSB Serial Port Chip Select (Active Low).
29 PWDN Chip Power-Down.
49 DCO− Data Clock Output—Complement.
50 DCO+ Data Clock Output—True.
3 D0− D0 Complement Output (LSB).
4 D0+ D0 True Output (LSB).
5 D1− D1 Complement Output.
6 D1+ D1 True Output.
9 D2− D2 Complement Output.
10 D2+ D2 True Output.
11 D3− D3 Complement Output.
12 D3+ D3 True Output.
13 D4− D4 Complement Output.
Rev. A | Page 8 of 24
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