ANALOG DEVICES AD9484 Service Manual

8-Bit, 500 MSPS,
V
A

FEATURES

SNR = 47 dBFS at fIN up to 250 MHz at 500 MSPS ENOB of 7.5 bits at f SFDR = 79 dBc at f Integrated input buffer Excellent linearity
DNL = ±0.1 LSB typical
INL = ±0.1 LSB typical LVDS at 500 MSPS (ANSI-644 levels) 1 GHz full power analog bandwidth On-chip reference, no external decoupling required Low power dissipation
670 mW at 500 MSPS—LVDS SDR output Programmable (nominal) input voltage range
1.18 V p-p to 1.6 V p-p, 1.5 V p-p nominal
1.8 V analog and digital supply operation Selectable output data format (offset binary, twos
complement, Gray code) Clock duty cycle stabilizer Integrated data capture clock
up to 250 MHz at 500 MSPS (−1.0 dBFS)
IN
up to 250 MHz at 500 MSPS (−1.0 dBFS)
IN
1.8 V Analog-to-Digital Converter
AD9484

FUNCTIONAL BLOCK DIAGRAM

AGNDPWDN
8 8
ADC
CORE
SERIAL PORT
SDIO CSB
Figure 1.
VDD
AD9484
OUTPUT
STAGING
LVDS
DRVDD DRGND
D7± TO D0±
OR+ OR–
DCO+ DCO–
CML
VIN+ VIN–
CLK+ CLK–
REF
REFERENCE
TRACK-AND-HOLD
CLOCK
MANAGEMENT
SCLK/DFS
09615-001

APPLICATIONS

Wireless and wired broadband communications Cable reverse path Communications test equipment Low cost digital oscilloscopes Satellite subsystems Power amplifier linearization

GENERAL DESCRIPTION

The AD9484 is an 8-bit, monolithic, sampling analog-to-digital converter (ADC) optimized for high performance, low power, and ease of use. The part operates at up to a 500 MSPS conver­sion rate and is optimized for outstanding dynamic performance in wideband carrier and broadband systems. All necessary functions, including a sample-and-hold and voltage reference, are included on the chip to provide a complete signal conversion solution. The VREF pin can be used to monitor the internal reference or provide an external voltage reference (external reference mode must be enabled through the SPI port).
The ADC requires a 1.8 V analog voltage supply and a differen­tial clock for full performance operation. The digital outputs are LVDS (ANSI-644) compatible and support twos complement, offset binary format, or Gray code. A data clock output is available for proper output data timing.
Rev. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
Fabricated on an advanced BiCMOS process, the AD9484 is availa­ble in a 56-lead LFCSP, and is specified over the industrial temperature range (−40°C to +85°C). This product is protected by a U.S. patent.

PRODUCT HIGHLIGHTS

1. High Performance.
Maintains 47 dBFS SNR at 500 MSPS with a 250 MHz input.
2. Ease of Use.
LVDS output data and output clock signal allow interface to current FPGA technology. The on-chip reference and sample-and-hold provide flexibility in system design. Use of a single 1.8 V supply simplifies system power supply design.
3. Serial Port Control.
Standard serial port interface supports various product functions, such as data formatting, power-down, gain adjust, and output test pattern generation.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2011 Analog Devices, Inc. All rights reserved.
AD9484

TABLE OF CONTENTS

Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
DC Specifications ......................................................................... 3
AC Specifications .......................................................................... 4
Digital Specifications ................................................................... 5
Switching Specifications .............................................................. 6
Absolute Maximum Ratings ............................................................ 7
Thermal Resistance ...................................................................... 7
ESD Caution .................................................................................. 7
Pin Configuration and Function Descriptions ............................. 8
Typical Performance Characteristics ........................................... 10
Equivalent Circuits ......................................................................... 13
Theory of Operation ...................................................................... 14
Analog Input and Voltage Reference ....................................... 14
Clock Input Considerations ...................................................... 15
Power Dissipation and Power-Down Mode ........................... 16
Digital Outputs ........................................................................... 16
Timing ......................................................................................... 17
VREF ............................................................................................ 17
AD9484 Configuration Using the SPI ..................................... 18
Hardware Interface ..................................................................... 18
Configuration Without the SPI ................................................ 18
Memory Map .................................................................................. 20
Reading the Memory Map Table .............................................. 20
Reserved Locations .................................................................... 20
Default Values ............................................................................. 20
Logic Levels ................................................................................. 20
Outline Dimensions ....................................................................... 23
Ordering Guide .......................................................................... 23

REVISION HISTORY

6/11—Rev. 0 to Rev. A
Change to General Description Section ........................................ 1
Change to Aperture Time Parameter in Table 4 ........................... 6
Change to Figure 34 ....................................................................... 16
Changes to Register 17 and Register 18 in Table 12 .................. 20
3/11—Revision 0: Initial Version
Rev. A | Page 2 of 24
AD9484

SPECIFICATIONS

DC SPECIFICATIONS

AVDD = 1.8 V, DRVDD = 1.8 V, T
Table 1.
Parameter1 Temp Min Typ Max Unit
RESOLUTION 8 Bits ACCURACY
No Missing Codes Full Guaranteed Offset Error 25°C 0 mV Full −3.0 +3.0 mV Gain Error 25°C 1.0 % FS Full −5.0 +7.0 % FS Differential Nonlinearity (DNL) 25°C ±0.13 LSB Full −0.25 +0.25 LSB Integral Nonlinearity (INL) 25°C ±0.1 LSB Full −0.15 +0.15 LSB
INTERNAL REFERENCE
VREF Full 0.71 0.75 0.78 V
TEMPERATURE DRIFT
Offset Error Full 18 μV/°C Gain Error Full 0.07 %/°C
ANALOG INPUTS (VIN+, VIN−)
Differential Input Voltage Range2 Full 1.18 1.5 1.6 V p-p Input Common-Mode Voltage Full 1.7 V Input Resistance (Differential) Full 1 kΩ Input Capacitance (Differential) Full 1.3 pF
POWER SUPPLY
AVDD Full 1.75 1.8 1.9 V DRVDD Full 1.75 1.8 1.9 V Supply Currents
3
I
Full 283 300 mA
AVDD
3
I
/SDR Mode4 Full 89 100 mA
DRVDD
Power Dissipation
SDR Mode4 Full 670 720 mW Standby Mode Full 40 50 mW Power-Down Mode Full 2.5 7 mW
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed.
2
The input range is programmable through the SPI, and the range specified reflects the nominal values of each setting. See the section. Memory Map
3
I
and I
AVDD
4
Single data rate mode; this is the default mode of the AD9484.
are measured with a −1 dBFS, 10.3 MHz sine input at a rated sample rate.
DRVDD
= −40°C, T
MIN
= +85°C, fIN = −1.0 dBFS, full scale = 1.5 V, unless otherwise noted.
MAX
Rev. A | Page 3 of 24
AD9484

AC SPECIFICATIONS

AVDD = 1.8 V, DRVDD = 1.8 V, T
= −40°C, T
MIN
= +85°C, fIN = −1.0 dBFS, full scale = 1.5 V, unless otherwise noted.
MAX
Table 2.
Parameter
1, 2
Temp Min Typ Max Unit
SNR
fIN = 30.3 MHz 25°C 47.0 dBFS fIN = 70.3 MHz 25°C 47.0 dBFS fIN = 100.3 MHz 25°C 47.0 dBFS Full 46.5 dBFS fIN = 250.3 MHz 25°C 47.0 dBFS fIN = 450.3 MHz 25°C 46.9 dBFS
SINAD
fIN = 30.3 MHz 25°C 47.0 dBFS fIN = 70.3 MHz 25°C 47.0 dBFS fIN = 100.3 MHz 25°C 47.0 dBFS Full 46.4 dBFS fIN = 250.3 MHz 25°C 47.0 dBFS fIN = 450.3 MHz 25°C 46.9 dBFS
EFFECTIVE NUMBER OF BITS (ENOB)
fIN = 30.3 MHz 25°C 7.5 Bits fIN = 70.3 MHz 25°C 7.5 Bits fIN = 100.3 MHz 25°C 7.5 Bits fIN = 250.3 MHz 25°C 7.5 Bits fIN = 450.3 MHz 25°C 7.5 Bits
WORST HARMONIC (SECOND or THIRD)
fIN = 30.3 MHz 25°C −87 dBc fIN = 70.3 MHz 25°C −86 dBc fIN = 100.3 MHz 25°C −87 dBc Full −75 dBc fIN = 250.3 MHz 25°C 83 dBc fIN = 450.3 MHz 25°C 70 dBc
SFDR
fIN = 30.3 MHz 25°C 82 dBc fIN = 70.3 MHz 25°C 81 dBc fIN = 100.3 MHz 25°C 82 dBc Full 75 dBc fIN = 250.3 MHz 25°C 79 dBc fIN = 450.3 MHz 25°C 70 dBc
WORST OTHER HARMONIC (SFDR EXCLUDING SECOND and THIRD)
fIN = 30.3 MHz 25°C −82 dBc fIN = 70.3 MHz 25°C −81 dBc fIN = 100.3 MHz 25°C −82 dBc Full −75 dBc fIN = 250.3 MHz 25°C 79 dBc fIN = 450.3 MHz 25°C 77 dBc
TWO-TONE IMD
f
= 119.5 MHz, f
IN1
= 122.5 MHz 25°C −77 dBc
IN2
ANALOG INPUT BANDWIDTH
Full Power 25°C 1 GHz
1
All ac specifications tested by driving CLK+ and CLK− differentially.
2
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed.
Rev. A | Page 4 of 24
AD9484

DIGITAL SPECIFICATIONS

AVDD = 1.8 V, DRVDD = 1.8 V, T
Table 3.
Parameter1 Temp Min Typ Max Unit
CLOCK INPUTS
Logic Compliance Full CMOS/LVDS/LVPECL Internal Common-Mode Bias Full 0.9 V Differential Input Voltage
High Level Input (VIH) Full 0.2 1.8 V p-p
Low Level Input (VIL) Full −1.8 −0.2 V p-p High Level Input Current (IIH) Full −10 +10 μA Low Level Input Current (IIL) Full −10 +10 μA Input Resistance (Differential) Full 8 10 12 kΩ Input Capacitance Full 4 pF
LOGIC INPUTS
Logic 1 Voltage Full 0.8 × DRVDD V Logic 0 Voltage Full 0.2 × DRVDD V Logic 1 Input Current (SDIO, CSB) Full 0 μA Logic 0 Input Current (SDIO, CSB) Full −60 μA Logic 1 Input Current (SCLK, PDWN) Full 50 μA Logic 0 Input Current (SCLK, PDWN) Full 0 μA Input Capacitance Full 4 pF
LOGIC OUTPUTS2
VOD Differential Output Voltage Full 247 454 mV VOS Output Offset Voltage Full 1.125 1.375 V Output Coding
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed.
2
LVDS R
TERMINATION
= 100 Ω.
= −40°C, T
MIN
= +85°C, fIN = −1.0 dBFS, full scale = 1.5 V, unless otherwise noted.
MAX
Rev. A | Page 5 of 24
AD9484

SWITCHING SPECIFICATIONS

AVDD = 1.8 V, DRVDD = 1.8 V, T
Table 4.
Parameter Temp Min Typ Max Unit
Maximum Conversion Rate Full 500 Minimum Conversion Rate Full
1
CLK+ Pulse Width High (tCH) CLK+ Pulse Width Low (tCL)1 Full 0.9 11 ns Output (LVDS—SDR)1
Data Propagation Delay (tPD) Full 0.85 ns Rise Time (tR) (20% to 80%) 25°C 0.15 ns Fall Time (tF) (20% to 80%) 25°C 0.15 ns DCO Propagation Delay (t Data to DCO Skew (t
CPD
) Full −0.07 +0.07 ns
SKEW
Latency Full 15 Clock cycles Aperture Time (tA) 25°C 0.85 ns Aperture Uncertainty (Jitter, tJ) 25°C 80 fs rms
1
See . Figure 2

Timing Diagram

N – 1
VIN+, VIN–
= −40°C, T
MIN
= +85°C, fIN = −1.0 dBFS, full scale = 1.5 V, unless otherwise noted.
MAX
50 MSPS
MSPS
Full 0.9 11 ns
) Full 0.6 ns
t
A
N
N + 3
N + 1
N + 2
N + 4
N + 5
CLK+
CLK–
DCO+
DCO–
Dx+
Dx–
t
CH
t
t
CPD
1/
CL
f
S
t
SKEW
t
PD
N – 15 N – 14 N – 13 N – 12 N – 11
09615-002
Figure 2. Timing Diagram
Rev. A | Page 6 of 24
AD9484

ABSOLUTE MAXIMUM RATINGS

Table 5.
Parameter Rating
Electrical
AVDD to AGND −0.3 V to +2.0 V DRVDD to DRGND −0.3 V to +2.0 V AGND to DRGND −0.3 V to +0.3 V AVDD to DRVDD −2.0 V to +2.0 V D0+/D0− through D7+/D7−
to DRGND DCO+, DCO− to DRGND −0.3 V to DRVDD + 0.2 V OR+, OR− to DRGND −0.3 V to DRVDD + 0.2 V CLK+ to AGND −0.3 V to AVDD + 0.2 V CLK− to AGND −0.3 V to AVDD + 0.2 V VIN+ to AGND −0.3 V to AVDD + 0.2 V VIN− to AGND −0.3 V to AVDD + 0.2 V SDIO/DCS to DRGND −0.3 V to DRVDD + 0.2 V PDWN to AGND −0.3 V to DRVDD + 0.2 V CSB to AGND −0.3 V to DRVDD + 0.2 V SCLK/DFS to AGND −0.3 V to DRVDD + 0.2 V CML to AGND −0.3 V to AVDD + 0.2 V VREF to AGND −0.3 V to AVDD + 0.2 V
Environmental
Storage Temperature Range −65°C to +125°C Operating Temperature Range −40°C to +85°C Lead Temperature
(Soldering, 10 sec)
Junction Temperature 150°C
−0.3 V to DRVDD + 0.2 V
300°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

THERMAL RESISTANCE

The exposed paddle must be soldered to the ground plane for the LFCSP package. Soldering the exposed paddle to the PCB increases the reliability of the solder joints, maximizing the thermal capability of the package.
Table 6.
Package Type θJA θ
56-Lead LFCSP_VQ (CP-56-5) 23.7 1.7 °C/W
Unit
JC
Typical θJA and θJC are specified for a 4-layer board in still air. Airflow increases heat dissipation, effectively reducing θ
JA
. In addition, metal in direct contact with the package leads from metal traces, through holes, ground, and power planes reduces the θ
.
JA

ESD CAUTION

Rev. A | Page 7 of 24
AD9484

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

DNC
DNC
DNC
55
56
54
1DNC 2DNC 3D0– 4D0+ 5D1– 6D1+ 7DRVDD 8DRGND
9D2– 10D2+ 11D3– 12D3+ 13D4– 14D4+
NOTES
1. DNC = DO NOT CONNECT. DO NOT CO NNECT TO THIS PI N.
2. AGND AND DRGND SHO ULD BE TI ED TO A CO MMON QUIET G ROUND PLANE.
3. THE EXPOSED PADDLE MUST BE SOLDERED T O A GROUND PLANE .
PIN 1 INDICATOR
PIN 0 (EXPOSED PADDLE ) = AGND
16
17
15
D5–
D6–
D5+
DCO+
DNC
DNC
DNC
52
53
50
51
AD9484
TOP VIEW
(Not to Scale)
21
19
20
18
D7–
D7+
D6+
OR–
CO–
CLK–
AVDD
DRVDD
D
48 DRGND
49
22
23
OR+
DRGND
CLK+
AVDD
44
43
45
46
47
42 AVDD 41 AVDD 40 CML 39 AVDD 38 AVDD 37 AVDD 36 VIN– 35 VIN+ 34 AVDD 33 AVDD 32 AVDD 31 VREF 30 AVDD 29 PWDN
24
25
26
27
28
CSB
DNC
SDIO
DRVDD
SCLK/DFS
09615-003
Figure 3. Pin Configuration
Table 7. Pin Function Descriptions
Pin No. Mnemonic Description
0 AGND1 Analog Ground. The exposed paddle must be soldered to a ground plane. 30, 32 to 34, 37 to 39,
AVDD 1.8 V Analog Supply.
41 to 43, 46 7, 24, 47 DRVDD 1.8 V Digital Output Supply. 8, 23, 48 DRGND1 Digital Output Ground. 35 VIN+ Analog Input—True. 36 VIN− Analog Input—Complement. 40 CML
Common-Mode Output. Enabled through the SPI, this pin provides a reference for the
optimized internal bias voltage for VIN+/VIN−. 44 CLK+ Clock Input—True. 45 CLK− Clock Input—Complement. 31 VREF Voltage Reference Internal/Input/Output. Nominally 0.75 V. 1, 2, 28, 51 to 56 DNC Do Not Connect. Do not connect to this pin. This pin should be left floating. 25 SDIO Serial Port Interface (SPI) Data Input/Output. 26 SCLK/DFS Serial Port Interface Clock (Serial Port Mode)/Data Format Select (External Pin Mode). 27 CSB Serial Port Chip Select (Active Low). 29 PWDN Chip Power-Down. 49 DCO− Data Clock Output—Complement. 50 DCO+ Data Clock Output—True. 3 D0− D0 Complement Output (LSB). 4 D0+ D0 True Output (LSB). 5 D1− D1 Complement Output. 6 D1+ D1 True Output. 9 D2− D2 Complement Output. 10 D2+ D2 True Output. 11 D3− D3 Complement Output. 12 D3+ D3 True Output. 13 D4− D4 Complement Output.
Rev. A | Page 8 of 24
AD9484
Pin No. Mnemonic Description
14 D4+ D4 True Output. 15 D5− D5 Complement Output. 16 D5+ D5 True Output. 17 D6− D6 Complement Output. 18 D6+ D6 True Output. 19 D7− D7 Complement Output (MSB). 20 D7+ D7 True Output (MSB). 21 OR− Overrange Complement Output. 22 OR+ Overrange True Output.
1
Tie AGND and DRGND to a common quiet ground plane.
Rev. A | Page 9 of 24
AD9484

TYPICAL PERFORMANCE CHARACTERISTICS

AVDD = 1.8 V, DRVDD = 1.8 V, rated sample rate, TA = 25°C, 1.5 V p-p differential input, AIN = −1 dBFS, unless otherwise noted.
0
–10
–20
–30
–40
–50
–60
AMPLITUDE (dBFS)
–70
–80
–90
–100
0 20 40 60 80 100 120 140 160 180
FREQUENC Y (MHz)
500MSPS
30.3M Hz AT –1.0dBFS SNR: 46.0dB ENOB: 7.5 BITS SFDR: 82dBc
Figure 4. 64k Point Single-Tone FFT; 500 MSPS, 30.3 MHz
200 220 240
09615-106
0
500MSPS
–10
270.3M Hz AT –1.0dBFS SNR: 46.0dB
–20
ENOB: 7.5 BITS SFDR: 79dBc
–30
–40
–50
–60
AMPLITUDE (dBFS)
–70
–80
–90
–100
0 20 40 60 80 100 120 140 160 180
FREQUENC Y (MHz)
200 220 240
Figure 7. 64k Point Single-Tone FFT; 500 MSPS, 270.3 MHz
09615-109
0
–10
–20
–30
–40
–50
–60
AMPLITUDE (dBFS)
–70
–80
–90
–100
0 20 40 60 80 100 120 140 160 180
FREQUENC Y (MHz)
500MSPS
100.3M Hz AT –1.0dBFS SNR: 46.0dB ENOB: 7.5 BITS SFDR: 83dBc
200 220 240
Figure 5. 64k Point Single-Tone FFT; 500 MSPS, 100.3 MHz
0
–10
–20
–30
–40
–50
–60
AMPLITUDE (dBFS)
–70
–80
–90
–100
0 20 40 60 80 100 120 140 160 180
FREQUENC Y (MHz)
500MSPS
140.3M Hz AT –1.0dBFS SNR: 46.0dB ENOB: 7.5 BITS SFDR: 82dBc
200 220 240
Figure 6. 64k Point Single-Tone FFT; 500 MSPS, 140.3 MHz
0
–10
–20
–30
–40
–50
–60
AMPLITUDE (dBFS)
–70
–80
–90
–100
0 20 40 60 80 100 120 140 160 180
09615-107
FREQUENC Y (MHz)
500MSPS
450.3M Hz AT –1.0dBFS SNR: 45.9dB ENOB: 7.5 BITS SFDR: 70dBc
200 220 240
09615-110
Figure 8. 64k Point Single-Tone FFT; 500 MSPS, 450.3 MHz
85
80
75
70
65
60
SNR/SFDR (d B)
55
50
45
40
09615-108
SFDR (dBc), T
SNR (dBFS), T SNR (dBFS), T SNR (dBFS), T
0 100 200 300 400 500
ANALOG INPU T FREQUECY (MHz )
A
A
= –40°C = +25°C
A
= +85°C
A
=+85°C
SFDR (d Bc), T
SFDR (dBc) , TA= –40°C
Figure 9. Single-Tone SNR/SFDR vs. Input Frequency (f
=+25°C
A
) and Temperature;
IN
09615-111
500 MSPS
Rev. A | Page 10 of 24
AD9484
85
SFDR (dBc) , 30.3MHz
80
75
70
65
60
SNR/SFDR (dB)
55
SNR (dBFS), 30.3MHz
50
SNR (dBFS), 100. 3M
45
40
50 100 150 200 250 300 350 400 450 500 550
SAMPLE RATE (MSPS)
SFDR (d Bc), 100. 3MHz
Hz
Figure 10. SNR/SFDR vs. Sample Rate; 30.3 MHz, 100.3 MHz
09615-112
0.10
0.08
0.06
0.04
0.02
0
DNL (LSB)
–0.02
–0.04
–0.06
–0.08
–0.10
0 64 128 192 256
OUTPUT CODE
Figure 13. DNL, 500 MSPS
09615-115
100
90
SFDR (dBFS)
80
70
60
50
40
SNR/SFDR (dB)
30
20
10
0 –50 –45 –40 –35 –30 –25 –20 –15 –10 –5 0
SNR (dB)
AMPLIT UDE (d B)
SFDR (dBc)
SNR (dBF S)
Figure 11. SNR/SFDR vs. Input Amplitude; 500 MSPS,140.3 MHz
0.10
0.08
0.06
0.04
0.02
0
INL (LSB)
–0.02
–0.04
–0.06
–0.08
–0.10
0 64 128 192 256
OUTPUT CODE
Figure 12. INL, 500 MSPS
4.0
0.29 LSB rms
3.5
3.0
2.5
2.0
1.5
NUMBER OF HITS (M)
1.0
0.5
0
N – 3 N – 2 N – 1 N N + 1 N + 2 N + 3
09615-211
BINS
09615-116
Figure 14. Grounded Input Histogram, 500 MSPS
0
–10
–20
–30
–40
–50
–60
AMPLIT UDE (dBFS)
–70
–80
–90
–100
0
09615-114
20 40 60 80 100 120 140 160 180
FREQUENC Y (MHz)
500MSPS
119.5MHz AT –7.0dBFS
122.5M Hz AT –7.0dBFS SFDR: 77dBc
200 220 240
09615-215
Figure 15. 64k Point, Two-Tone FFT; 500 MSPS,
119.2 MHz, 122.5 MHz
Rev. A | Page 11 of 24
AD9484
100
90
80
70
60
50
SFDR (dB)
40
30
20
10
0 –90 –80 –70 –60 –50 –40 –30 –20 –10 0
IMD3 (dBF S)
SFDR (dBFS)
SFDR (dBc)
AMPLIT UDE (dBFS)
Figure 16. Two-Tone SFDR vs. Input Amplitude; 500 MSPS,
119.5 MHz, 122.5 MHz
90
SFDR (dBc)
80
70
09615-118
80
75
70
SFDR (dBc)
65
60
55
50
SNR/SFDR (d B)
45
SNR (dBFS)
40
35
30
500 600 700 800 900 1000
FREQUENCY (MHz)
Figure 19. SNR/SFDR at 500 MSPS; AIN Sweep at −1.0 dBFS
09615-121
60
SNR/SFDR (d B)
50
40
30
1.5 1.6 1.7 1.8 1.9 2.0
SNR (dBFS)
VCM (V)
Figure 17. SNR/SFDR vs. Common-Mode Voltage; 500 MSPS,
AIN = 140.3 MHz
350
300
250
200
CURRENT (mA)
150
100
50
50
75
100
125
150
TOTAL POWER
175
200
225
250
275
SAMPLE RATE (MSPS)
300
I
AVDD
I
DRVDD
325
350
375
400
425
450
475
Figure 18. Current and Power vs. Sample Rate, AIN = 30.3 MHz
09615-119
800
700
600
500
400
POWER (mW)
300
200
100
0
500
525
550
09615-120
Rev. A | Page 12 of 24
AD9484
C
V
V
V
V
V
R
V
A
V

EQUIVALENT CIRCUITS

AVDD
CSB
DRVDD
350
DRVDD
30k
DRVDD
AVDD AVDD
LK+
0.9V
15k 15k
CLK–
Figure 20. Clock Inputs
AVDD
CML
AVDD
IN+
500
IN+
AVDD
SPI
CONTROLLED
500
Figure 21. Analog Input DC Equivalent Circuit (V
DRVDD
SCLK/DFS
350
30k
A
A
+
IN
IN
CML
DRVDD
BOOST
DC
= ~1.7 V)
09615-006
09615-009
Figure 24. Equivalent CSB Input Circuit
D
DD
V+
Dx–
V–
V–
Dx+
V+
9615-010
Figure 25. LVDS Outputs (Dx+, Dx−, OR+, OR−, DCO+, DCO−)
DD
20k
(00)
(01)
09615-007
VREF
(10)
NOT USED
(11)
SPI CTRL V 00 = INTERNAL V 01 = IMPORT V 10 = EXPORT V 11 = NOT USED
REF
SELECT
REF
REF
REF
09615-011
Figure 26. Equivalent VREF Input/Output Circuit
09615-008
Figure 22. Equivalent SCLK/DFS, PDWN Input Circuit
IN+
1.3pF 1k
IN–
09615-025
Figure 23. Analog Input AC EquivalentCircuit
DRVDD
SDIO
Figure 27. Equivalent SDIO Input Circuit
350
DRVDD
30k
CTRL
9615-012
Rev. A | Page 13 of 24
AD9484

THEORY OF OPERATION

The AD9484 architecture consists of a front-end sample-and­hold amplifier (SHA) followed by a pipelined switched capacitor ADC. The quantized outputs from each stage are combined into a final 8-bit result in the digital correction logic. The pipelined architecture permits the first stage to operate on a new input sample, whereas the remaining stages operate on preceding samples. Sampling occurs on the rising edge of the clock.
Each stage of the pipeline, excluding the last, consists of a low resolution flash ADC connected to a switched capacitor DAC and interstage residue amplifier (MDAC). The residue amplifier magnifies the difference between the reconstructed DAC output and the flash input for the next stage in the pipeline. One bit of redundancy is used in each stage to facilitate digital correction of flash errors. The last stage simply consists of a flash ADC.
The input stage contains a differential SHA that can be ac- or dc-coupled in differential or single-ended mode. The output staging block aligns the data, carries out the error correction, and passes the data to the output buffers. The output buffers are powered from a separate supply, allowing adjustment of the output voltage swing. During power-down, the output buffers enter a high impedance state.

ANALOG INPUT AND VOLTAGE REFERENCE

The analog input to the AD9484 is a differential buffer. For best dynamic performance, match the source impedances driving VIN+ and VIN− such that common-mode settling errors are symmetrical. The analog input is optimized to provide superior wideband performance and requires that the analog inputs be driven differentially. SNR and SINAD performance degrades significantly if the analog input is driven with a single-ended signal.
A wideband transformer, such as Mini-Circuits® ADT1-1WT, can provide the differential analog inputs for applications that require a single-ended-to-differential conversion. Both analog inputs are self-biased by an on-chip reference to a nominal 1.7 V.
An internal differential voltage reference creates positive and negative reference voltages that define the 1.5 V p-p fixed span of the ADC core. This internal voltage reference can be adjusted by means of SPI control. See the AD9484 Configuration Using the SPI section for more details.

Differential Input Configurations

Optimum performance is achieved while driving the AD9484 in a differential input configuration. For baseband applications, the AD8138 differential driver provides excellent performance and a flexible interface to the ADC. The output common-mode voltage of the AD8138 is easily set to AVDD/2 + 0.5 V, and the driver can be configured in a Sallen-Key filter topology to pro­vide band limiting of the input signal.
49.91V p-p
499
0.1µF
Figure 28. Differential Input Configuration Using the AD8138
523
499
AD8138
499
33
33
20pF
AVDD
VIN+
AD9484
VIN–
CML
09615-013
At input frequencies in the second Nyquist zone and above, the performance of most amplifiers may not be adequate to achieve the true performance of the AD9484. This is especially true in IF undersampling applications where frequencies in the 70 MHz to 100 MHz range are being sampled. For these applications, differential transformer coupling is the recommended input configuration. The signal characteristics must be considered when selecting a transformer. Most RF transformers saturate at frequencies below a few megahertz (MHz), and excessive signal power can cause core saturation, which leads to distortion.
In any configuration, the value of the shunt capacitor, C (see Figure 30), is dependent on the input frequency and may need to be reduced or removed.
15
501.5V p-p
Figure 29. Differential Transformer—Coupled Configuration
0.1µF
2pF
15
VIN+
AD9484
VIN–
09615-014
As an alternative to using a transformer-coupled input at frequen­cies in the second Nyquist zone, the AD8352 differential driver can be used (see Figure 30).
Rev. A | Page 14 of 24
AD9484
V
A
A
A
A
CC
NALOG INPUT
NALOG INPUT
0.1µF
C
DRDRG
0.1µF
0
16
1
2
3
4
5
0
8, 13
AD8352
14
0.1µF
0.1µF
11
10
0.1µF
0.1µF
200
200
R
C
R
0.1µF
VIN+
AD9484
VIN–
CML
09615-015
Figure 30. Differential Input Configuration Using the AD8352
D9510/AD9511/ AD9512/AD9513/ AD9514/AD9515
CLOCK
INPUT
CLOCK
INPUT
50
1
50Ω RESISTORS ARE OPTIONAL.
0.1µF
CLK
0.1µF
50
CLK
1
1
PECL DRIVER
0.1µF
CLK+
100
0.1µF
240240
ADC
AD9484
CLK–
09615-017
Figure 31. Differential PECL Sample Clock
D9510/AD9511/ AD9512/AD9513/ AD9514/AD9515
CLOCK
INPUT
CLOCK
INPUT
50
0.1µF
CLK
LVDS DRIVER
0.1µF
50
CLK
1
1
0.1µF
100
0.1µF
CLK+
ADC
AD9484
CLK–
1
50Ω RESISTORS ARE OPTIONAL.
Figure 32. Differential LVDS Sample Clock

CLOCK INPUT CONSIDERATIONS

For optimum performance, drive the AD9484 sample clock inputs (CLK+ and CLK−) with a differential signal. This signal is typically ac-coupled into the CLK+ and CLK− pins via a transformer or capacitors. These pins are biased at ~0.9 V internally and require no additional bias. If the clock signal is dc-coupled, then the common-mode voltage should remain within a range of 0.9 V.
Figure 33 shows one preferred method for clocking the AD9484. The low jitter clock source is converted from single-ended to differential using an RF transformer. The back-to-back Schottky diodes across the secondary transformer limit clock excursions into the AD9484 to approximately 0.8 V p-p differential. This helps prevent the large voltage swings of the clock from feeding through to other portions of the AD9484 and preserves the fast rise and fall times of the signal, which are critical to low jitter performance.
09615-018
MINI-CIRCUIT S
CLOCK
INPUT
50
ADT1–1WT, 1: 1Z
100
XFMR
0.1µF
0.1µF0.1µF
0.1µF
SCHOTTKY
DIODES:
HSM2812
CLK+
ADC
AD9484
CLK–
09615-016
Figure 33. Transformer-Coupled Differential Clock
If a low jitter clock is available, another option is to ac couple a differential PECL signal to the sample clock input pins, as shown in Figure 31. The AD9510/AD9511/AD9512/AD9513/
AD9514/AD9515 family of clock drivers offers excellent jitter
performance.
In some applications, it may be acceptable to drive the sample clock inputs with a single-ended 1.8 V CMOS signal. In such applications, drive the CLK+ pin directly from a CMOS gate, and bypass the CLK− pin to ground with a 0.1 F capacitor in parallel with a 39 k resistor (see Figure 34).
Rev. A | Page 15 of 24
AD9484
V
CC
0.1µF
1k
1k
AD951x CMOS DRIVER
CLOCK
INPUT
1
50 RESISTOR IS OPTIONAL.
Figure 34. Single-Ended 1.8 V CMOS Input Clock (Up to 200 MHz)
50
1
OPTIONAL
100
0.1µF
0.1µF CLK+
ADC
AD9484
CLK–

Clock Duty Cycle Considerations

Typical high speed ADCs use both clock edges to generate a variety of internal timing signals. As a result, these ADCs may be sensitive to clock duty cycle. A 5% tolerance is commonly required on the clock duty cycle to maintain dynamic performance characteristics. The AD9484 contains a duty cycle stabilizer (DCS) that retimes the nonsampling edge, providing an internal clock signal with a nominal 50% duty cycle. This allows a wide range of clock input duty cycles without affecting the performance of the AD9484. When the DCS is on, noise and distortion perfor­mance are nearly flat for a wide range of duty cycles.
The duty cycle stabilizer uses a delay-locked loop (DLL) to create the nonsampling edge. As a result, any changes to the sampling frequency require approximately 15 clock cycles to allow the DLL to acquire and lock to the new rate.

Clock Jitter Considerations

High speed, high resolution ADCs are sensitive to the quality of the clock input. The degradation in SNR at a given input frequency
) due only to aperture jitter (tJ) can be calculated by
(f
A
SNR Degradation = 20 × log
(1/2 × π × fA × tJ)
10
In this equation, the rms aperture jitter represents the root mean square of all jitter sources, including the clock input, analog input signal, and ADC aperture jitter specifications. IF undersampling applications are particularly sensitive to jitter (see Figure 35).
Treat the clock input as an analog signal in cases where aperture jitter may affect the dynamic range of the AD9484. Separate the power supplies for clock drivers from the ADC output driver supplies to avoid modulating the clock signal with digital noise. Low jitter, crystal-controlled oscillators make the best clock sources. If the clock is generated from another type of source (by gating, dividing, or other methods), it should be retimed by the original clock at the last step.
Refer to the AN-501 Application Note and the AN-756 Application Note for more in-depth information about jitter performance as it relates to ADCs (visit www.analog.com).
130
RMS CLOCK JI TTER REQUIREMENT
120
110
100
90
80
SNR (dB)
09615-024
70
10 BITS
60
8 BITS
50
40
30
1 10 100 1000
Figure 35. Ideal SNR vs. Input Frequency and Jitter
ANALOG INP UT FREQUENCY (MHz)
0.125ps
0.25ps
0.5ps
1.0ps
2.0ps
16 BITS
14 BITS
12 BITS
9615-019

POWER DISSIPATION AND POWER-DOWN MODE

As shown in Figure 18, the power dissipated by the AD9484 is proportional to its sample rate. The digital power dissipation does not vary much because it is determined primarily by the DRVDD supply and bias current of the LVDS output drivers.
By asserting PDWN (Pin 29) high, the AD9484 is placed in standby mode or full power-down mode, as determined by the contents of Serial Port Register 08. Reasserting the PDWN pin low returns the AD9484 to its normal operational mode.
An additional standby mode is supported by means of varying the clock input. When the clock rate falls below 50 MHz, the AD9484 assumes a standby state. In this case, the biasing network and internal reference remain on, but digital circuitry is powered down. Upon reactivating the clock, the AD9484 resumes normal operation after allowing for the pipeline latency.

DIGITAL OUTPUTS

Digital Outputs and Timing

The AD9484 differential outputs conform to the ANSI-644 LVDS standard on default power-up. This can be changed to a low power, reduced signal option similar to the IEEE 1596.3 standard using the SPI. This LVDS standard can further reduce the overall power dissipation of the device, which reduces the power by ~39 mW. See the Memory Map section for more infor­mation. The LVDS driver current is derived on chip and sets the output current at each output equal to a nominal 3.5 mA. A 100 Ω differential termination resistor placed at the LVDS receiver inputs results in a nominal 350 mV swing at the receiver.
The AD9484 LVDS outputs facilitate interfacing with LVDS receivers in custom ASICs and FPGAs that have LVDS capability for superior switching performance in noisy environments. Single point-to-point net topologies are recommended with a 100 Ω termination resistor placed as close to the receiver as possible. No far-end receiver termination or poor differential trace routing may result in timing errors. It is recommended that the trace length be no longer than 24 inches and that the
Rev. A | Page 16 of 24
AD9484
differential output traces be kept close together and at equal lengths.
An example of the LVDS output using the ANSI standard (default) data eye and a time interval error (TIE) jitter histogram with trace lengths less than 24 inches on regular FR-4 material is shown in Figure 36. Figure 37 shows an example of when the trace lengths exceed 24 inches on regular FR-4 material. Notice that the TIE jitter histogram reflects the decrease of the data eye opening as the edge deviates from the ideal position. It is up to the user to determine if the waveforms meet the timing budget of the design when the trace lengths exceed 24 inches.
14
500
400
300
200
100
0
–100
–200
–300
EYE DIAGRAM: VOLTAGE (mV)
–400
–500
–3 –2 –1 0 1 2 3
TIME (ns)
12
10
8
6
4
TIE JIT TER HIST OGRAM (Hi ts)
2
0
–40 –20 0 20 40
TIME (ps)
09615-020
Figure 36. Data Eye for LVDS Outputs in ANSI Mode with Trace Lengths Less
Than 24 Inches on Standard FR-4
600
400
200
0
–200
EYE DIAGRAM: VOLTAGE (mV)
–400
–600
3–2–10123
TIME (ns)
12
10
8
6
4
TIE JITTER HISTOGRAM (Hits)
2
0
–100 0 100
TIME (ps)
09615-021
Figure 37. Data Eye for LVDS Outputs in ANSI Mode with Trace Lengths
Greater Than 24 Inches on Standard FR-4
The format of the output data is offset binary by default. An example of the output coding format can be found in Tabl e 11. If it is desired to change the output data format to twos comple­ment, see the AD9484 Configuration Using the SPI section.
An output clock signal is provided to assist in capturing data from the AD9484. The DCO is used to clock the output data and is equal to the sampling clock (CLK) rate. In single data rate mode (SDR), data is clocked out of the AD9484 and must be captured on the rising edge of the DCO. See the timing diagram shown in Figure 2 for more information.

Output Data Rate and Pinout Configuration

The output data of the AD9484 can be configured to drive 12 pairs of LVDS outputs at the same rate as the input clock signal (SDR mode).

Out-of-Range (OR)

An out-of-range condition exists when the analog input voltage is beyond the input range of the ADC. OR+ and OR− (OR±) are digital outputs that are updated along with the data output corresponding to the particular sampled input voltage. Thus, OR± has the same pipeline latency as the digital data. OR± is low when the analog input voltage is within the analog input range and high when the analog input voltage exceeds the input range, as shown in Figure 38. OR± remains high until the analog input returns to within the input range and another conversion is completed. By logically AND’ing OR± with the MSB and its complement, overrange high or underrange low conditions can be detected.
OR± DATA OUTPUTS
1 0 0
0 0 1
1111 1111 1111
0000 0000 0000
1111 1111 1110
0001 0000 0000
OR±
–FS + 1/2 L SB
–FS – 1/2 L SB
Figure 38. OR± Relation to Input Voltage and Output Data
+FS – 1 LSB
+FS–FS
+FS – 1/2 LSB
09615-022

TIMING

The AD9484 provides latched data outputs with a pipeline delay of 15 clock cycles. Data outputs are available one propagation delay (t
) after the rising edge of the clock signal.
PD
Minimize the length of the output data lines and loads placed on them to reduce transients within the AD9484. These transi­ents can degrade the dynamic performance of the converter. The AD9484 also provides a data clock output (DCO) intended for capturing the data in an external register. The data outputs are valid on the rising edge of DCO.
The lowest conversion rate of the AD9484 is 50 MSPS. At clock rates below 1 MSPS, the AD9484 assumes the standby mode.

VREF

The AD9484 VREF pin (Pin 31) allows the user to monitor the on-board voltage reference, or provide an external reference (requires configuration through the SPI). The three optional settings are internal V export V
, and import V
REF
to this pin. VREF is internally compensated and additional loading may impact performance.
(pin is connected to 20 kΩ to ground),
REF
. Do not attach a bypass capacitor
REF
Rev. A | Page 17 of 24
AD9484

AD9484 CONFIGURATION USING THE SPI

The AD9484 SPI allows the user to configure the converter for specific functions or operations through a structured register space inside the ADC. This gives the user added flexibility to customize device operation depending on the application. Addresses are accessed (programmed or readback) serially in 1-byte words. Each byte can be further divided into fields, which are documented in the Memory Map section.
There are three pins that define the serial port interface (SPI) to this particular ADC. They are the SCLK/DFS, SDIO and CSB pins. The SCLK/DFS (serial clock) is used to synchronize the read and write data presented the ADC. The SDIO (serial data input/output) is a dual-purpose pin that allows data to be sent to and read from the internal ADC memory map registers. The CSB is an active low control that enables or disables the read and write cycles (see Tab l e 8 ).
Table 8. Serial Port Pins
Mnemonic Function
SCLK
SDIO
CSB
The falling edge of the CSB, in conjunction with the rising edge of the SCLK, determines the start of the framing. An example of the serial timing and its definitions can be found in Figure 39 and Tabl e 10 .
During an instruction phase, a 16-bit instruction is transmitted. Data then follows the instruction phase and is determined by the W0 and W1 bits, which is one or more bytes of data. All data is composed of 8-bit words. The first bit of each individual byte of serial data indicates whether this is a read or write
SCLK (serial clock) is the serial shift clock in. SCLK is used to synchronize serial interface reads and writes.
SDIO (serial data input/output) is a dual-purpose pin. The typical role for this pin is an input and output depending on the instruction being sent and the relative position in the timing frame.
CSB (chip select) is an active low control that gates the read and write cycles.
command. This allows the serial data input/output (SDIO) pin to change direction from an input to an output.
Data can be sent in MSB or in LSB first mode. MSB first is default on power-up and can be changed by changing the configuration register. For more information about this feature and others, see the AN-877 Application Note, Interfacing to High Speed ADCs via SPI at www.analog.com.

HARDWARE INTERFACE

The pins described in Ta b l e 8 comprise the physical interface between the programming device of the user and the serial port of the AD9484. The SCLK pin and the CSB pin function as inputs when using the SPI interface. The SDIO pin is bidirec­tional, functioning as an input during the write phase and as an output during readback.
This interface is flexible enough to be controlled by either PROMs or PIC® microcontrollers as well. This provides the user with an alternate method to program the ADC other than a SPI controller.
If the user chooses not to use the SPI interface, some pins serve a dual function and are associated with a specific function when strapped externally to AVDD or ground during device power­on. The Configuration Without the SPI section describes the strappable functions supported on the AD9484.

CONFIGURATION WITHOUT THE SPI

In applications that do not interface to the SPI control registers, the SCLK/DFS pin can alternately serve as a standalone CMOS­compatible control pin. Connect the CSB pin to AVDD, which disables the serial port interface.
Table 9. Mode Selection
External
Mnemonic
Voltage Configuration
AVDD Twos complement enabled SCLK/DFS AGND Offset binary enabled
CSB
SCLK DON’T CARE
SDIO DON’ T CARE
t
t
DS
S
W1 W0 A12 A11 A10 A9 A8 A7 D5 D4 D3 D2 D1 D0
R/W
t
HIGH
t
DH
Figure 39. Serial Port Interface Timing Diagram
t
CLK
t
LOW
Rev. A | Page 18 of 24
t
H
DON’T CARE
DON’T CARE
09615-023
AD9484
Table 10. Serial Timing Definitions
Parameter Minimum (ns) Description
tDS 5 Setup time between the data and the rising edge of SCLK tDH 2 Hold time between the data and the rising edge of SCLK t
40 Period of the clock
CLK
tS 5 Setup time between CSB and SCLK tH 2 Hold time between CSB and SCLK t
16 Minimum period that SCLK should be in a logic high state
HIGH
t
16 Minimum period that SCLK should be in a logic low state
LOW
t
1
EN_SDIO
t
5
DIS_SDIO
Table 11. Output Data Format
Input (V) Condition (V) Offset Binary Output Mode, D7± to D0± Twos Complement Mode, D7± to D0± OR±
VIN+ − VIN− < −0.75 − 0.5 LSB 0000 0000 1000 0000 1 VIN+ − VIN− = −0.75 0000 0000 1000 0000 0 VIN+ − VIN− = 0 1000 0000 0000 0000 0 VIN+ − VIN− = 0.75 1111 1111 0111 1111 0 VIN+ − VIN− > 0.75 + 0.5 LSB 1111 1111 0111 1111 1
Minimum time for the SDIO pin to switch from an input to an output relative to the SCLK falling edge (not shown in Figure 39)
Minimum time for the SDIO pin to switch from an output to an input relative to the SCLK rising edge (not shown in Figure 39)
Rev. A | Page 19 of 24
AD9484

MEMORY MAP

READING THE MEMORY MAP TABLE

Each row in the memory map table (see Ta b l e 1 2 ) has eight address locations. The memory map is roughly divided into three sections: chip configuration register map (Address 0x00 to Address 0x02), transfer register map (Address 0xFF), and ADC functions register map (Address 0x08 to Address 0x2A).
The Addr. (Hex) column of the memory map indicates the register address in hexadecimal, and the Default Value (Hex) column shows the default hexadecimal value that is already written into the register. The Bit 7 (MSB) column is the start of the default hexadecimal value given. For example, Hexadecimal Address 0x2A, OVR_CONFIG, has a hexadecimal default value of 0x01. This means Bit 7 = 0, Bit 6 = 0, Bit 5 = 0, Bit 4 = 0, Bit 3 = 0, Bit 2 = 0, Bit 1 = 0, and Bit 0 = 1, or 0000 0001 in binary. The default value enables the OR± output. Overwriting this default so that Bit 0 = 0 disables the OR± output. For more information on this and other functions, consult the AN-877 Application Note, Interfacing to High-Speed ADCs via SPI® user manual at
www.analog.com.

RESERVED LOCATIONS

Undefined memory locations should not be written to other than with the default values suggested in this data sheet. Addresses that have values marked as 0 should be considered reserved and have a 0 written into their registers during power-up.

DEFAULT VALUES

Coming out of reset, critical registers are preloaded with default values. These values are indicated in Tab le 1 2 . Other registers do not have default values and retain the previous value when exiting reset.

LOGIC LEVELS

An explanation of various registers follows: “Bit is set” is synonymous with “bit is set to Logic 1” or “writing Logic 1 for the bit.” Similarly, “clear a bit” is synonymous with “bit is set to Logic 0” or “writing Logic 0 for the bit.”
Table 12. Memory Map Register
Default Addr. (Hex) Register Name
Chip Configuration Registers 00 CHIP_PORT_CONFIG 0 LSB
01 CHIP_ID 8-bit chip ID, Bits[7:0] = 0x6C Read
02 CHIP_GRADE 0 0 0 Speed grade:
Transfer Register FF DEVICE_UPDATE 0 0 0 0 0 0 0 SW
ADC Functions Registers 08 Modes 0 0 PDWN:
Bit 7 (MSB) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1
first
Soft reset
0 = full (default) 1 = standby
1 1 Soft
reset
X1 XX1 X
00 = 500 MSPS
0 0 Internal power-down mode:
Note that external PDWN pin
LSB first
000 = normal (power-up,
default)
001 = full power-down
010 = standby
011 = normal (power-up)
overrides this setting
Bit 0 (LSB)
0 0x18 The nibbles
1
Read
transfer
Value
(Hex)
only
only
0x00 Synchronously
0x00 Determines
Default Notes/ Comments
should be mirrored by the user so that LSB or MSB first mode registers correctly, regardless of shift mode.
Default is a unique chip ID, different for each device. This is a read­only register.
Child ID used to differentiate graded devices.
transfers data from the master shift register to the slave.
various generic modes of chip operation.
Rev. A | Page 20 of 24
AD9484
Default Addr. (Hex)
10 Offset 8-bit device offset adjustment [7:0]
0D TEST_IO (For user-defined
0F AIN_CONFIG 0 0 0 0 0 Analog
14 OUTPUT_MODE 0 0 0 Output
15 OUTPUT_ADJUST 0 0 0 0 LVDS
16 OUTPUT_PHASE Output
17 FLEX_OUTPUT_DELAY 0 0 0 0 Output clock delay:
Register Name
Bit 7 (MSB)
mode only, set
Bits[3:0] = 1000)
00 = Pattern 1 only
01 = toggle P1/P2
11 = toggle P1/P2/
clock polarity 1 = inverted 0 = normal (default)
Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1
10 = toggle
P1/0000
0000
0 0 0 0 0 0 0 0x00
Reset PN23 gen: 1 = on 0 = off (default)
0111 111 = +127 codes
0000 0000 = 0 codes
1000 0000 = −128 codes
Reset PN9 gen: 1 = on 0 = off (default)
enable: 0 = enable (default)
1 = disable
0100 = checker board output
0111 = one/zero word toggle
(Format determined by OUTPUT_MODE)
0 Output
course adjust: 0 =
3.5 mA (default) 1 =
2.0 mA
Output test mode:
0000 = off (default)
0001 = midscale short
0010 = +FS short 0011 = −FS short
0101 = PN23 sequence
0110 = PN9
1000 = user defined
1001 = unused 1010 = unused 1011 = unused 1100 = unused
input disable:
1 = on 0 = off (default)
invert: 1 = on 0 = off (default)
0100 = reserved
0 0 0x00
Data format select:
00 = offset binary
(default)
01 = twos
complement
10 = Gray code
LVDS fine adjust:
001 = 3.50 mA 010 = 3.25 mA 011 = 3.00 mA 100 = 2.75 mA 101 = 2.50 mA 110 = 2.25 mA 111 = 2.00 mA
0000 = 0 0001 = −1/10 0010 = −2/10 0011 = −3/10
0101 = +5/10 0110 = +4/10 0111 = +3/10 1000 = +2/10 1001 = +1/10
Bit 0 (LSB)
Value (Hex)
0x00 Device offset
0x00 When set, the
0x00 0
0x00 0
0x00 Shown as
Default Notes/ Comments
trim: codes are relative to the output resolution.
test data is placed on the output pins in place of normal data. Set pattern values: P1 = Reg 0x19, Reg 0x1A
P2 = Reg 0x1B, Reg 0x1C
fractional value of sampling clock period that is subtracted or added to initial t
, see
SKEW
Figure 2.
Rev. A | Page 21 of 24
AD9484
Default Addr. (Hex)
Register Name
18 FLEX_VREF VREF select
Bit 7 (MSB)
Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1
00 = internal V
(20 kΩ pull-down)
01 = import V
REF
(0.59 V to 0.8 V on
VREF pin)
10 = export V
REF
(from internal
reference)
11 = not used
0 Input voltage range setting:
REF
11100 = 1.60 11101 = 1.58 11110 = 1.55 11111 = 1.52 00000 = 1.50 00001 = 1.47 00010 = 1.44 00011 = 1.42 00100 = 1.39 00101 = 1.36
Bit 0 (LSB)
00110 = 1.34 00111 = 1.31 01000 = 1.28 01001 = 1.26 01010 = 1.23
01011= 1.20 01011= 1.18
19 USER_PATT1_LSB
1A USER_PATT1_MSB
1B USER_PATT2_LSB
1C USER_PATT2_MSB
B7 B6 B5 B4 B3 B2 B1 B0
B7 B6 B5 B4 B3 B2 B1 B0
B7 B6 B5 B4 B3 B2 B1 B0
B7 B6 B5 B4 B3 B2 B1 B0
2A OVR_CONFIG 0 0 0 0 0 0 0 OR±
enable: 1 = on (default) 0 = off
2C Input coupling 0 0 0 0 0 DC
0 0 0x00 Default is coupling enable
1
X = don’t care.
Value (Hex)
Default Notes/ Comments
0x00
0x00 User-defined
pattern, 1 LSB.
0x00 User-defined
pattern, 1 MSB.
0x00 User-defined
pattern, 2 LSBs.
0x00 User-defined
pattern, 2 MSBs.
0x01
ac coupling.
Rev. A | Page 22 of 24
AD9484

OUTLINE DIMENSIONS

EXPOSED
PAD
0.30
0.23
0.18
N
I
1
P
R
O
D
C
I
A
T
N
56
I
1
5.25
5.10 SQ
4.95
PIN 1
INDICATOR
8.10
8.00 SQ
7.90
7.85
7.75 SQ
7.65
0.60
MAX
0.50
BSC
0.60 MAX
43
42
14
15
FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET.
0.25 MIN
081809-B
1.00
0.85
0.80
SEATING
PLANE
12° MAX
TOP VI EW
29
0.08
28
BOTTOM VIEW
6.50 REF
0.50
0.40
0.80 MAX
0.65 TYP
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-VLLD-2
0.30
0.05 MAX
0.02 NOM COPLANARITY
Figure 40. 56-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
8 mm × 8 mm Body, Very Thin Quad
(CP-56-5)
Dimensions shown in millimeters

ORDERING GUIDE

Model1 Temperature Range Package Description Package Option
AD9484BCPZ-500 −40°C to +85°C 56-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-56-5 AD9484BCPZRL7-500 −40°C to +85°C 56-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-56-5 AD9484-500EBZ Evaluation Board
1
Z = RoHS Compliant Part.
Rev. A | Page 23 of 24
AD9484
NOTES
©2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D09615-0-6/11(A)
Rev. A | Page 24 of 24
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