The AD9461 is a 16-bit, monolithic, sampling, analog-to-digital
converter (ADC) with an on-chip track-and-hold circuit. It is
optimized for performance, small size, and ease of use. The
AD9461 operates up to 130 MSPS, providing a superior signalto-noise ratio (SNR) for instrumentation, medical imaging, and
radar receivers using baseband (<100 MHz) and IF frequencies.
The ADC requires 3.3 V and 5.0 V power supplies and a low
voltage differential input clock for full performance operation.
No external reference or driver components are required for
many applications. Data outputs are CMOS or LVDS compatible
(ANSI-644 compatible) and include the means to reduce the
overall current needed for short trace distances.
AD9461
FUNCTIONAL BLOCK DIAGRAM
GNDDRGND DRVDD
VDD1AVDD2
2
32
2
DFS
DCS MODE
OUTPUT MODE
OR
D15 TO D0
DCO
AD9461
VIN+
VIN–
CLK+
CLK–
BUFFER
CLOCK
AND TIMI NG
MANAGEMENT
T/H
VREF
PIPELINE
ADC
REF
Figure 1.
16
CMOS
OR
LVDS
OUTPUT
STAGING
REFBSENSE REFT
Optional features allow users to implement various selectable
operating conditions, including input range, data format select,
and output data mode.
The AD9461 is available in a Pb-free, 100-lead, surface-mount,
plastic package (100-lead TQFP_EP) specified over the industrial
temperature range −40°C to +85°C.
PRODUCT HIGHLIGHTS
1. True 16-bit linearity.
2. High performance: outstanding SNR performance for
baseband IFs in data acquisition, instrumentation,
magnetic resonance imaging, and radar receivers.
3. Ease of use: on-chip reference and high input impedance
track-and-hold with adjustable analog input range and an
output clock simplifies data capture.
performance over a wide range of clock pulse widths.
6. Out-of-range (OR) outputs indicate when the signal is
beyond the selected input range.
06011-001
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
AVDD1 = 3.3 V, AVDD2 = 5.0 V, DRVDD = 3.3 V, LVDS mode, specified minimum sampling rate, 3.4 V p-p differential input, internal
trimmed reference (1.0 V mode), A
Table 1.
AD9461BSVZ
Parameter Te mp Min Typ Max Unit
RESOLUTION Full 16 Bits
ACCURACY
No Missing Codes Full Guaranteed
Offset Error Full −4.2 ±0.1 +4.2 mV
Gain Error 25°C −3 ±0.5 +3 % FSR
Full −3.4 +3.4 % FSR
Differential Nonlinearity (DNL)
Full −1.0 +1.3 LSB
Integral Nonlinearity (INL)1 25°C −7 ±5.0 +7 LSB
VOLTAGE REFERENCE
Output Voltage VREF = 1.7 V Full +1.7 V
Load Regulation @ 1.0 mA Full ±2 mV
Reference Input Current (External VREF = 1.7 V) Full 350 µA
INPUT REFERRED NOISE 25°C 2.6 LSB rms
ANALOG INPUT
Input Span
VREF = 1.7 V Full 3.4 V p-p
VREF = 1.0 V Full 2.0 V p-p
Internal Input Common-Mode Voltage Full 3.5 V
External Input Common-Mode Voltage Full 3.2 3.9 V
Input Resistance
Input Capacitance
2
2
POWER SUPPLIES
Supply Voltage
AVDD1 Full 3.14 3.3 3.46 V
AVDD2 Full 4.75 5.05.25V
DRVDD—LVDS Outputs Full 3.0
DRVDD—CMOS Outputs Full 3.03.33.6V
Supply Current
1
AVDD1 Full 405426mA
1, 3
AVDD2
1
I
—LVDS Outputs Full 7281mA
DRVDD
1
I
—CMOS Outputs Full 14 mA
DRVDD
PSRR
Offset Full 1 mV/V
Gain Full 0.2 %/V
POWER CONSUMPTION
LVDS Outputs Full 2.2 2.4 W
CMOS Outputs (DC Input) Full 2.0 W
1
Measured at the maximum clock rate, fIN = 15 MHz, full-scale sine wave, with a 100 Ω differential termination on each pair of output bits for LVDS output mode and
approximately 5 pF loading on each output bit for CMOS output mode.
2
Input capacitance or resistance refers to the effective impedance between one differential input pin and AGND. Refer to Figure 6 for the equivalent analog input structure.
High Level Input Voltage Full 2.0 V
Low Level Input Voltage Full 0.8 V
High Level Input Current Full 200 µA
Low Level Input Current Full −10 +10 µA
Input Capacitance Full 2 pF
DIGITAL OUTPUT BITS—CMOS MODE (D0 to D15, OTR)
High Level Output Voltage Full 3.25 V
Low Level Output Voltage Full 0.2 V
DIGITAL OUTPUT BITS—LVDS MODE (D0 to D15, OTR)
VOD Differential Output Voltage
2
VOS Output Offset Voltage Full 1.125 1.375 V
CLOCK INPUTS (CLK+, CLK−)
Differential Input Voltage Full 0.2 V
Common-Mode Voltage Full 1.3 1.5 1.6 V
Input Resistance Full 1.1 1.4 1.7 kΩ
Input Capacitance Full 2 pF
1
Output voltage levels measured with 5 pF load on each output.
Maximum Conversion Rate Full 130 MSPS
Minimum Conversion Rate Full 1 MSPS
CLK Period Full 7.7 ns
CLK Pulse Width High1 (t
CLK Pulse Width Low1 (t
DATA OUTPUT PARAMETERS
Output Propagation Delay—CMOS (tPD)2 (Dx, DCO+) Full 3.35 ns
Output Propagation Delay—LVDS (tPD)3 (Dx+), (t
Pipeline Delay (Latency) Full 13 Cycles
Aperture Uncertainty (Jitter, tJ) Full 60 fsec rms
1
With duty cycle stabilizer (DCS) enabled.
2
Output propagation delay is measured from clock 50% transition to data 50% transition with 5 pF load.
3
LVDS R
= 100 Ω. Measured from the 50% point of the rising edge of CLK+ to the 50% point of the data transition.
TERM
) Full 3.1 ns
CLKH
) Full 3.1 ns
CLKL
)3 (DCO+) Full 2.3 3.6 4.8 ns
CPD
Rev. 0 | Page 5 of 28
AD9461
TIMING DIAGRAMS
A
IN
CLK+
CLK–
N – 1
t
CLKH
t
CLKL
N
N + 1
f
1/
S
t
PD
N + 13
N + 14
N + 15
DATA OUT
DCO+
DCO–
VIN
CLK–
CLK+
DX
DCO+
DCO–
N – 1
t
CLKH
N – 13
t
CPD
N – 12
13 CLOCK CYCLES
N
N + 1
06011-002
Figure 2. LVDS Mode Timing Diagram
N
N + 1
t
CLKL
t
PD
N – 13N – 12N – 1N
N + 2
13 CLOCK CYCLES
06011-003
Figure 3. CMOS Timing Diagram
Rev. 0 | Page 6 of 28
AD9461
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
ELECTRICAL
AVDD1 to AGND −0.3 V to +4 V
AVDD2 to AGND −0.3 V to +6 V
DRVDD to DGND −0.3 V to +4 V
AGND to DGND −0.3 V to +0.3 V
AVDD1 to DRVDD −4 V to +4 V
AVDD2 to DRVDD −4 V to +6 V
AVDD2 to AVDD −4 V to +6 V
D0± through D15± to DGND −0.3 V to DRVDD + 0.3 V
CLK+/CLK− to AGND –0.3 V to AVDD1 + 0.3 V
OUTPUT MODE, DCS MODE, and
–0.3 V to AVDD1 + 0.3 V
DFS to AGND
VIN+, VIN− to AGND −0.3 V to AVDD2 + 0.3 V
VREF to AGND −0.3 V to AVDD1 + 0.3 V
SENSE to AGND −0.3 V to AVDD1 + 0.3 V
REFT, REFB to AGND −0.3 V to AVDD1 + 0.3 V
ENVIRONMENTAL
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +85°C
Lead Temperature (Soldering 10 sec) 300°C
Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The heat sink of the AD9461 package must be soldered to
ground.
Airflow increases heat dissipation, effectively reducing θ
more metal directly in contact with the package leads from
metal traces through holes, ground, and power planes reduces
the θ
. It is required that the exposed heat sink be soldered to
JA
the ground plane.
Table 6.
Package Type θ
1
JA
2
θ
JB
3
θ
JC
100-Lead TQFP_EP 19.8 8.3 2 °C/W
1
Typical θJA = 19.8°C/W (heat sink soldered) for multilayer board in still air.
2
Typical θJB = 8.3°C/W (heat sink soldered) for multilayer board in still air.
3
Typical θJC = 2°C/W (junction to exposed heat sink) represents the thermal
resistance through heat sink path.
. Also,
JA
Unit
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Figure 4. 100-Lead TQFP_EP Pin Configuration in LVDS Mode
Table 7. Pin Function Descriptions—100-Lead TQFP_EP in LVDS Mode
Pin No. Mnemonic Description
1 DCS MODE Clock Duty Cycle Stabilizer (DCS) Control Pin. CMOS compatible.
DCS = low (AGND) to enable DCS (recommended).
DCS = high (AVDD1) to disable DCS.
2 DNC Do Not Connect. This pin should float.
3 OUTPUT MODE CMOS-Compatible Output Logic Mode Control Pin.
OUTPUT MODE = 0 for CMOS mode.
OUTPUT MODE = 1 (AVDD1) for LVDS outputs.
4 DFS Data Format Select Pin. CMOS control pin that determines the format of the output data.
DFS = high (AVDD1) for twos complement.
DFS = low (ground) for offset binary format.
5 LVDS_BIAS Set Pin for LVDS Output Current. Place 3.7 kΩ resistor terminated to DRGND.
6, 18 to 20, 32 to 34, 36,
AVDD1 3.3 V (±5%) Analog Supply.
38, 43 to 45, 92 to 97
7 SENSE
Reference Mode Selection. Connect to AGND for internal 1.7 V reference (3.4 V p-p analog
input range); connect to AVDD1 for external reference.
8 VREF
1.7 V Reference I/O. The function is dependent on the SENSE pin and external programming
resistors. Decouple to ground with 0.1 µF and 10 µF capacitors.
Differential Reference Output. Decoupled to ground with 0.1 µF capacitor and to REFB
(Pin 11) with 0.1 µF and 10 µF capacitors.
Differential Reference Output. Decoupled to ground with a 0.1 µF capacitor and to REFT
(Pin 10) with 0.1 µF and 10 µF capacitors.
SFDR Control Pin. CMOS-compatible control pin for optimizing the configuration of the
AD9461 analog front end. Connecting SFDR to AGND optimizes SFDR performance for
applications with analog input frequencies <40 MHz or >215 MHz. For applications with
analog inputs from 40 MHz to 215 MHz, connect this pin to AVDD1 for optimum SFDR
performance; power dissipation from AVDD2 decreases by ~40 mW.
Rev. 0 | Page 9 of 28
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