79.4 dBFS SNR/91 dBc SFDR with 10 MHz input
(3.4 V p-p input, 80 MSPS)
78.3 dBFS SNR/ with 170 MHz input
(4.0 V p-p input, 80 MSPS)
77.8 dBFS SNR/87 dBc SFDR with 170 MHz input
(3.4 V p-p input, 80 MSPS)
77.2 dBFS SNR/84 dBc SFDR with 170 MHz input
(3.4 V p-p input, 105 MSPS)
90 dBFS two-tone SFDR with 139 MHz/140 MHz input
(3.4 V p-p input, 105 MSPS)
60 fsec rms jitter
Excellent linearity
DNL = ±0.5 LSB typical
INL = ±3.0 LSB typical
2.0 V p-p to 4.0 V p-p differential full-scale input
Buffered analog inputs
LVDS outputs (ANSI-644 compatible) or CMOS outputs
Data format select (offset binary or twos complement)
Output data capture clock available
Optional features allow users to implement various selectable
operating conditions, including input range, data format select,
and output data mode.
The AD9460 is available in a Pb-free, 100-lead, surface-mount,
plastic package (TQFP_EP) specified over the industrial temperature range of −40°C to +85°C.
PRODUCT HIGHLIGHTS
1.True 16-bit linearity.
06006-001
GENERAL DESCRIPTION
The AD9460 is a 16-bit, monolithic, sampling, analog-to-digital
converter (ADC) with an on-chip track-and-hold circuit. It is
optimized for performance, small size, and ease of use. The
AD9460 operates up to 105 MSPS, providing a superior signalto-noise ratio (SNR) for instrumentation, medical imaging, and
2. High performance: outstanding SNR performance for
baseband IFs in data acquisition, instrumentation,
magnetic resonance imaging, and radar receivers.
3. Ease of use: on-chip reference and high input impedance,
track-and-hold with adjustable analog input range, and an
output clock simplifies data capture.
radar receivers using baseband (<100 MHz) and IF frequencies.
The ADC requires 3.3 V and 5.0 V power supplies and a low
voltage differential input clock for full performance operation.
No external reference or driver components are required for
performance over a wide range of clock pulse widths.
many applications. Data outputs are CMOS or LVDS compatible
(ANSI-644 compatible) and include the means to reduce the
overall current needed for short trace distances.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
6. Out-of-range (OR) outputs indicate when the signal is
AD9460BSVZ-80 AD9460BSVZ-105
Parameter Te mp Min Typ Max Min Typ Max Unit
RESOLUTION Full 16 16 Bits
ACCURACY
No Missing Codes Full Guaranteed Guaranteed
Offset Error Full −5.0 ±0.1 +5.0 −5.0 ±0.1 +5.0 mV
Gain Error 25°C −3 ±0.5 +3 −3 ±0.5 +3 % FSR
Full −3.4 +3.4 −3.4 +3.4 % FSR
Differential Nonlinearity (DNL)
Full −0.9 +0.9 −1 +1.2
Integral Nonlinearity (INL)1 25°C −6 ±3 +6 −6 ±3 +6 LSB
VOLTAGE REFERENCE
Output Voltage VREF = 1.7 V Full 1.7 1.7 V
Load Regulation @ 1.0 mA Full ±2 ±2 mV
Reference Input Current (External VREF = 1.7 V) Full 350 350 µA
INPUT REFERRED NOISE 25°C 2.4 2.5 LSB rms
ANALOG INPUT
Input Span
VREF = 1.7 V Full 3.4 3.4 V p-p
VREF = 1.0 V Full 2.0 2.0 V p-p
Internal Input Common-Mode Voltage Full 3.5 3.5 V
External Input Common-Mode Voltage Full 3.2
Input Resistance
Input Capacitance
2
2
POWER SUPPLIES
Supply Voltages
AVDD1 Full 3.14 3.3 3.46 3.14 3.3 3.46 V
AVDD2 Full 4.75 5.05.254.75 5.05.25V
DRVDD—LVDS Outputs Full 3.03.3 3.63.03.3 3.6V
DRVDD—CMOS Outputs Full 3.03.33.63.03.33.6V
Supply Currents
1
AVDD1 Full 290310 337373mA
1, 3
AVDD2
1
I
—LVDS Outputs Full 7078.5 7181mA
DRVDD
1
I
—CMOS Outputs Full 14 14 mA
DRVDD
PSRR
Offset Full 1 1 mV/V
Gain Full 0.2 0.2 %/V
POWER CONSUMPTION
3
LVDS Outputs Full 1.71.8
CMOS Outputs (DC Input) Full 1.5
1
Measured at the maximum clock rate, fIN = 15 MHz, full-scale sine wave, with a 100 Ω differential termination on each pair of output bits for LVDS output mode and
approximately 5 pF loading on each output bit for CMOS output mode.
2
Input capacitance or resistance refers to the effective impedance between one differential input pin and AGND. Refer to Figure 6 for the equivalent analog input structure.
3
For SFDR = AVDD1, I
power increases by ~70 mW for the AD9460BSVZ-80 and ~20 mW for the AD9460BSVZ-105.
AVDD2
1
25°C −0.8±0.5 +0.8−0.85±0.5 +0.85LSB
3.9 3.2
3.9 V
Full 1 1 kΩ
Full 6 6 pF
Full 101110 116133mA
1.9
1.7
2.2 W
W
Rev. 0 | Page 3 of 32
Page 4
AD9460
AC SPECIFICATIONS
AVDD1 = 3.3 V, AVDD2 = 5.0 V, DRVDD = 3.3 V, LVDS mode, specified minimum sample rate, 3.4 V p-p differential input, internal
trimmed reference (1.7 V mode), A
Table 2.
Parameter Temp
SIGNAL-TO-NOISE RATIO (SNR)
fIN = 10 MHz 25°C 77.6 78.4 77.2 78.1 dB
Full 77.4 76.9
fIN = 170 MHz 25°C 76.1 76.8 75.0 76.2 dB
Full 75.0 74.5
fIN = 225 MHz 25°C 75.7 75.2 dB
SIGNAL-TO-NOISE AND DISTORTION (SINAD)
fIN = 10 MHz 25°C 76.1 78.0 75.2 77.4 dB
Full 74.4 74.5
fIN = 170 MHz 25°C 74.0 76.1 72.0 75.1 dB
Full 72.1 71.2
fIN = 225 MHz 25°C 74.6 73.6 dB
EFFECTIVE NUMBER OF BITS (ENOB)
fIN = 10 MHz 25°C 12.8 12.7 bits
fIN = 170 MHz 25°C 12.5 12.4 bits
fIN = 225 MHz 25°C 12.3 12.1 bits
SPURIOUS-FREE DYNAMIC RANGE (SFDR, SECOND
OR THIRD HARMONIC)
fIN = 10 MHz 25°C 80 91 80 88 dBc
Full 78 76
fIN = 170 MHz 25°C 80 87 78 84 dBc
Full 78 74
fIN = 225 MHz 25°C 82 81 dBc
WORST SPUR EXCLUDING SECOND OR
THIRD HARMONICS
fIN = 10 MHz 25°C 94 100 92 98 dBc
Full 91 91
fIN = 170 MHz 25°C 90 98 89 98 dBc
Full 88 85
fIN = 225 MHz 25°C 97 92 dBc
AD9460BSVZ-80/105
Parameter Te mp Min Typ Max Unit
CMOS LOGIC INPUTS (DFS, DCS MODE, OUTPUT MODE)
High Level Input Voltage Full 2.0 V
Low Level Input Voltage Full 0.8 V
High Level Input Current Full 200 µA
Low Level Input Current Full −10
Input Capacitance Full
DIGITAL OUTPUT BITS—CMOS MODE (D0 to D15, OTR)
DRVDD = 3.3 V
High Level Output Voltage Full 3.25
Low Level Output Voltage Full
DIGITAL OUTPUT BITS—LVDS MODE (D0 to D15, OTR)
VOD Differential Output Voltage
2
VOS Output Offset Voltage Full 1.125
CLOCK INPUTS (CLK+, CLK−)
Differential Input Voltage Full 0.2
Common-Mode Voltage Full 1.31.51.6V
Input Resistance Full 1.1 1.41.7kΩ
Input Capacitance Full
1
Output voltage levels measured with 5 pF load on each output.
AD9460BSVZ-80 AD9460BSVZ-105
Parameter Te mp Min Typ Max Min Typ Max Unit
CLOCK INPUT PARAMETERS
Maximum Conversion Rate Full 80 105 MSPS
Minimum Conversion Rate Full 1 1 MSPS
CLK Period Full 12.5 9.5 ns
CLK Pulse Width High1 (t
CLK Pulse Width Low1 (t
DATA OUTPUT PARAMETERS
Output Propagation Delay—CMOS (tPD)2 (Dx, DCO+) Full 3.35 3.35 ns
Output Propagation Delay—LVDS (tPD)3 (Dx+), (t
Pipeline Delay (Latency) Full 13 13 cycles
Aperture Delay (tA) Full ns
Aperture Uncertainty (Jitter, tJ) Full 60 60 fs, rms
1
With duty cycle stabilizer (DCS) enabled.
2
Output propagation delay is measured from clock 50% transition to data 50% transition with 5 pF load.
3
LVDS R
= 100 Ω. Measured from the 50% point of the rising edge of CLK+ to the 50% point of the data transition.
TERM
) Full 5.0 3.8 ns
CLKH
) Full 5.0 3.8 ns
CLKL
)3 (DCO+) Full 2.3 3.6 4.8 2.3 3.6 4.8 ns
CPD
Rev. 0 | Page 5 of 32
Page 6
AD9460
TIMING DIAGRAMS
VIN
CLK+
CLK–
N – 1
t
CLKH
t
CLKL
N
N + 1
f
1/
S
t
PD
N + 13
N + 14
N + 15
DCO+
DCO–
VIN
CLK–
CLK+
DCO+
DCO–
N – 12
13 CLOCK CYCLES
t
N – 13
CPD
Dx
N
N + 1
06006-002
Figure 2. LVDS Mode Timing Diagram
N – 1
t
CLKH
Dx
N
N + 1
t
CLKL
t
PD
N – 13N – 12N – 1N
N + 2
13 CLOCK CYCLES
06006-003
Figure 3. CMOS Timing Diagram
Rev. 0 | Page 6 of 32
Page 7
AD9460
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
ELECTRICAL
AVDD1 to AGND −0.3 V to +4 V
AVDD2 to AGND −0.3 V to +6 V
DRVDD to DGND −0.3 V to +4 V
AGND to DGND −0.3 V to +0.3 V
AVDD1 to DRVDD −4 V to +4 V
AVDD2 to DRVDD −4 V to +6 V
AVDD2 to AVDD1 −4 V to +6 V
D0± Through D15± to DGND −0.3 V to DRVDD + 0.3 V
CLK+/CLK− to AGND −0.3 V to AVDD1 + 0.3 V
OUTPUT MODE, DCS MODE, and
−0.3 V to AVDD1 + 0.3 V
DFS to AGND
VIN+, VIN− to AGND −0.3 V to AVDD2 + 0.3 V
VREF to AGND −0.3 V to AVDD1 + 0.3 V
SENSE to AGND −0.3 V to AVDD1 + 0.3 V
REFT, REFB to AGND −0.3 V to AVDD1 + 0.3 V
ENVIRONMENTAL
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +85°C
Lead Temperature (Soldering 10 sec) 300°C
Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The heat sink of the AD9460 package must be soldered to
ground.
Airflow increases heat dissipation, effectively reducing θ
more metal directly in contact with the package leads from
metal traces through holes, ground, and power planes reduces
the θ
. It is required that the exposed heat sink be soldered to
JA
the ground plane.
Table 6.
Package Type θ
1
JA
2
θ
JB
3
θ
JC
100-Lead TQFP_EP 19.8 8.3 2 °C/W
1
Typical θJA = 19.8°C/W (heat sink soldered) for a multilayer board in still air.
2
Typical θJB = 8.3°C/W (heat sink soldered) for a multilayer board in still air.
3
Typical θJC = 2°C/W (junction to exposed heat sink) represents the thermal
resistance through heat sink path
. Also,
JA
Unit
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Figure 4. 100-Lead TQFP_EP Pin Configuration in LVDS Mode
Table 7. Pin Function Descriptions—100-Lead TQFP_EP in LVDS Mode
Pin No. Mnemonic Description
1 DCS MODE Clock Duty Cycle Stabilizer (DCS) Control Pin. CMOS compatible.
DCS = low (AGND) to enable DCS (recommended).
DCS = high (AVDD1) to disable DCS.
2 DNC Do Not Connect. This pin should float.
3 OUTPUT MODE CMOS-Compatible Output Logic Mode Control Pin.
OUTPUT MODE = 0 for CMOS mode.
OUTPUT MODE = 1 (AVDD1) for LVDS outputs.
4 DFS Data Format Select Pin. CMOS control pin that determines the format of the output data.
DFS = high (AVDD1) for twos complement
DFS = low (ground) for offset binary format.
5 LVDS_BIAS Set Pin for LVDS Output Current. Place a 3.7 kΩ resistor terminated to DRGND.
6, 18 to 20, 32 to 34, 36, 38,
AVDD1 3.3 V (±5%) Analog Supply.
43 to 45, 92 to 97
7 SENSE
Reference Mode Selection. Connect to AGND for internal 1.7 V reference (3.4 V p-p analog
input range); connect to AVDD1 for external reference.
8 VREF
1.7 V Reference I/O. The function is dependent on the SENSE pin and external
programming resistors. Decouple to ground with 0.1 µF and 10 µF capacitors.
Differential Reference Output. Decoupled to ground with 0.1 µF capacitor and to REFB
(Pin 11) with 0.1 µF and 10 µF capacitors.
Differential Reference Output. Decoupled to ground with a 0.1 µF capacitor and to REFT
(Pin 10) with 0.1 µF and 10 µF capacitors.
SFDR Control Pin. CMOS-compatible control pin for optimizing the configuration of the
AD9460 analog front end. Connecting SFDR to AGND optimizes SFDR performance for
applications with analog input frequencies <200 MHz for 80 MSPS and 105 MSPS speed
grades. For applications with analog inputs >200 MHz, connect this pin to AVDD1 for
optimum SFDR performance; power dissipation from AVDD2 increases by ~70 mW for the
AD9460BSVZ-80 and ~20 mW for the AD9460BSVZ-105.
Figure 5. 100-Lead TQFP_EP Pin Configuration in CMOS Mode
Table 8. Pin Function Descriptions—100-Lead TQFP_EP in CMOS Mode
Pin No. Mnemonic Description
1 DCS MODE Clock Duty Cycle Stabilizer (DCS) Control Pin. CMOS compatible.
DCS = low (AGND) to enable DCS (recommended).
DCS = high (AVDD1) to disable DCS.
2, 49 to 62, 65 to 66, 69 DNC Do Not Connect. These pins should float.
3 OUTPUT MODE CMOS-Compatible Output Logic Mode Control Pin.
OUTPUT MODE = 0 for CMOS mode.
OUTPUT MODE = 1 (AVDD1) for LVDS outputs.
4 DFS Data Format Select Pin. CMOS control pin that determines the format of the output data.
DFS = high (AVDD1) for twos complement.
DFS = low (ground) for offset binary format.
5 LVDS_BIAS Set Pin for LVDS Output Current. Place a 3.7 kΩ resistor terminated to DRGND.
6, 18 to 20, 32 to 34, 36,
AVDD1 3.3 V (±5%) Analog Supply.
38, 43 to 45, 92 to 97
7 SENSE
Reference Mode Selection. Connect to AGND for internal 1.7 V reference (3.4 V p-p analog
input range); connect to AVDD1 for external reference.
8 VREF
1.7 V Reference I/O. The function is dependent on the SENSE pin and external programming
resistors. Decouple to ground with 0.1 µF and 10 µF capacitors.
Differential Reference Output. Decoupled to ground with a 0.1 µF capacitor and to REFT (Pin
10) with 0.1 µF and 10 µF capacitors.
SFDR Control Pin. CMOS-compatible control pin for optimizing the configuration of the
AD9460 analog front end. Connecting SFDR to AGND optimizes SFDR performance for
applications with analog input frequencies <200 MHz for 80 MSPS and 105 MSPS speed
grades. For applications with analog inputs >200 MHz, connect this pin to AVDD1 for
optimum SFDR performance; power dissipation from AVDD2 increases by ~70 mW for the
AD9460BSVZ-80 and ~20 mW for the AD9460BSVZ-105.
Figure 43. Single-Tone SNR/SFDR vs. Sample Rate, 170.3 MHz
145
06006-053
Rev. 0 | Page 18 of 32
Page 19
AD9460
(
TERMINOLOGY
Analog Bandwidth (Full Power Bandwidth)
The analog input frequency at which the spectral power of the
fundamental frequency (as determined by the FFT analysis) is
reduced by 3 dB.
Two -Tone SFDR
The ratio of the rms value of either input tone to the rms value
of the peak spurious component. The peak spurious component
may or may not be an IMD product.
Aperture Delay (t
)
A
The delay between the 50% point of the rising edge of the clock
and the instant at which the analog input is sampled.
Aperture Uncertainty (Jitter, t
)
J
The sample-to-sample variation in aperture delay.
Clock Pulse Width and Duty Cycle
Pulse width high is the minimum amount of time that the
clock pulse should be left in the Logic 1 state to achieve rated
performance. Pulse width low is the minimum time the clock
pulse should be left in the low state. At a given clock rate, these
specifications define an acceptable clock duty cycle.
Differential Nonlinearity (DNL, No Missing Codes)
An ideal ADC exhibits code transitions that are exactly 1 LSB
apart. DNL is the deviation from this ideal value. Guaranteed
no missing codes to 16-bit resolution indicates that all 65,536
codes must be present over all operating ranges.
Integral Nonlinearity (INL)
INL is the deviation of each individual code from a line drawn
from negative full scale through positive full scale. The point
used as negative full scale occurs ½ LSB before the first code
transition. Positive full scale is defined as a level 1½ LSB beyond
the last code transition. The deviation is measured from the
middle of each particular code to the true straight line.
Signal-to-Noise and Distortion (SINAD)
SINAD is the ratio of the rms input signal amplitude to the rms
value of the sum of all other spectral components below the
Nyquist frequency, including harmonics but excluding dc.
Signal-to-Noise Ratio (SNR)
SNR is the ratio of the rms input signal amplitude to the rms
value of the sum of all other spectral components below the
Nyquist frequency, excluding the first six harmonics and dc.
Spurious-Free Dynamic Range (SFDR)
SFDR is the ratio of the rms signal amplitude to the rms value
of the peak spurious spectral component. The peak spurious
component may be a harmonic. SFDR can be reported in dBc (that
is, degrades as signal level is lowered) or dBFS (always related back
to converter full scale).
Total Harmonic Distortion (THD)
The ratio of the rms input signal amplitude to the rms value of
the sum of the first six harmonic components.
Effective Number of Bits (ENOB)
The effective number of bits for a sine wave input at a given
input frequency can be calculated directly from its measured
SINAD using the following formula:
)
SINAD
=
ENOB
1.76−
6.02
Gain Error
The first code transition should occur at an analog value of
½ LSB above negative full scale. The last transition should occur
at an analog value of 1½ LSB below the positive full scale. Gain
error is the deviation of the actual difference between first and
last code transitions and the ideal difference between first and
last code transitions.
Maximum Conversion Rate
The clock rate at which parametric testing is performed.
Minimum Conversion Rate
The clock rate at which the SNR of the lowest analog signal
frequency drops by no more than 3 dB below the guaranteed limit.
Offset Error
The major carry transition should occur for an analog value of
½ LSB below VIN+ = VIN−. Offset error is defined as the
deviation of the actual transition from that point.
Out-of-Range Recovery Time
The time it takes for the ADC to reacquire the analog input
after a transition from 10% above positive full scale to 10%
above negative full scale, or from 10% below negative full scale
to 10% below positive full scale.
Output Propagation Delay (tPD)
The delay between the clock rising edge and the time when all
bits are within valid logic levels.
Power-Supply Rejection Ratio
The change in full scale from the value with the supply
at the minimum limit to the value with the supply at the
maximum limit.
Tem p er at u re Dr i ft
The temperature drift for offset error and gain error specifies
the maximum change from the initial (25°C) value to the value
at T
MIN
or T
MAX
.
Rev. 0 | Page 19 of 32
Page 20
AD9460
F
F
THEORY OF OPERATION
The AD9460 architecture is optimized for high speed and ease
of use. The analog inputs drive an integrated, high bandwidth
track-and-hold circuit that samples the signal prior to quantization
by the 16-bit pipeline ADC core. The device includes an on-board
reference and input logic that accepts TTL, CMOS, or LVPECL
levels. The digital output logic levels are user selectable as standard
3 V CMOS or LVDS (ANSI-644 compatible) via the OUTPUT
MODE pin.
ANALOG INPUT AND REFERENCE OVERVIEW
A stable and accurate 0.5 V band gap voltage reference is built
into the AD9460. The input range can be adjusted by varying
the reference voltage applied to the AD9460, using either the
internal reference or an externally applied reference voltage.
The input span of the ADC tracks reference voltage changes
linearly.
Internal Reference Connection
A comparator within the AD9460 detects the potential at the
SENSE pin and configures the reference into three possible states,
summarized in
amplifier switch is connected to the internal resistor divider (see
Figure 44), setting VREF to ~1.7 V. If a resistor divider is
connected as shown in
SENSE pin. This puts the reference amplifier in a noninverting
mode with the VREF output defined as
VREF = 0.5 V ×
In all reference configurations, REFT and REFB drive the
analog-to-digital conversion core and establish its input span.
The input range of the ADC always equals twice the voltage at
the reference pin for either an internal or an external reference.
Internal Reference Trim
The internal reference voltage is trimmed during the production
test; therefore, there is little advantage to the user supplying an
external voltage reference to the AD9460. The gain trim is
performed with the AD9460 input range set to 3.4 V p-p
nominal (SENSE connected to AGND). Because of this trim,
and the maximum ac performance provided by the 3.4 V p-p
analog input range, there is little benefit to using analog input
Tabl e 9 . If SENSE is grounded, the reference
Figure 45, the switch again sets to the
R2
⎞
⎛
+
1
⎟
⎜
R1
⎠
⎝
ranges <2 V p-p. However, reducing the range can improve SFDR
performance in some applications. Likewise, increasing the
range up to 3.4 V p-p can improve SNR. Users are cautioned
that the differential nonlinearity of the ADC varies with the
reference voltage. Configurations that use <2.0 V p-p can
exhibit missing codes and, therefore, degraded noise and
distortion performance.
VIN+
10µ
10µ
VIN–
CORE
VREF
+
0.1µF
SENSE
Figure 44. Internal Reference Configuration
+
0.1µF
R2
SENSE
R1
Figure 45. Programmable Reference Configuration
VIN+
VIN–
VREF
SELECT
LOGIC
AD9460
SELECT
LOGIC
0.5V
0.5V
AD9460
ADC
ADC
CORE
REFT
0.1µF
0.1µF10µF
REFB
0.1µF
REFT
0.1µF
0.1µF10µF
REFB
0.1µF
+
+
06006-054
06006-055
Rev. 0 | Page 20 of 32
Page 21
AD9460
A
Table 9. Reference Configuration Summary
Selected Mode SENSE Voltage Resulting VREF (V) Resulting Differential Span (V p-p)
External Reference AVDD N/A 2 × external reference
Programmable Reference 0.2 V to VREF
Programmable Reference
0.2 V to VREF
(Set for 2 V p-p)
Internal Fixed Reference AGND to 0.2 V 1.7 3.4
R2
(See Figure 45)
+1×0.5
R1
R2
⎞
⎛
10.5
⎜
⎝
+×
⎟
R1
⎠
, R1 = R2 = 1 kΩ
2 × VREF
2.0
External Reference Operation
When the SENSE pin is tied to AVDD, the internal reference is
disabled, allowing the use of an external reference. An internal
reference buffer loads the external reference with an equivalent
7 kΩ load. The internal buffer continues to generate the positive
and negative full-scale references, REFT and REFB, for the ADC
core. The input span is always twice the value of the reference
voltage; therefore, the external reference must be limited to a
maximum of 2.0 V. See
Figure 40 for gain variation vs. temperature.
Analog Inputs
As with most new high speed, high dynamic range ADCs, the
analog input to the AD9460 is differential. Differential inputs
improve on-chip performance because signals are processed
through attenuation and gain stages. Most of the improvement
is a result of differential analog stages having high rejection of
even-order harmonics. There are also benefits at the PCB level.
First, differential inputs have high common-mode rejection of
stray signals, such as ground and power noise. Second, they
provide good rejection of common-mode signals, such as local
oscillator feedthrough. The specified noise and distortion of the
AD9460 cannot be realized with a single-ended analog input;
therefore, such configurations are discouraged. Contact sales for
recommendations of other 16-bit ADCs that support single-ended
analog input configurations.
With the 1.7 V reference, which is the nominal value (see the
Internal Reference Trim section), the differential input range of
the AD9460 analog input is nominally 3.4 V p-p or 1.7 V p-p on
each input (VIN+ or VIN−).
VIN+
1.7V p-p
3.5V
The AD9460 analog input voltage range is offset from ground
by 3.5 V. Each analog input connects through a 1 kΩ resistor
to the 3.5 V bias voltage and to the input of a differential buffer.
The internal bias network on the input properly biases the
buffer for maximum linearity and range (see the
section). Therefore, the analog source driving the
Circuits
Equivalent
AD9460 should be ac-coupled to the input pins. The recommended method for driving the analog input of the AD9460 is
to use an RF transformer to convert single-ended signals to
R
T
Figure 47).
DT1–1WT
0.1µF
R
S
VIN+
AD9460
R
S
VIN–
06006-057
differential signals (see
ANALOG
INPUT
SIGNAL
Figure 47. Transformer-Coupled Analog Input Circuit
Series resistors between the output of the transformer and the
AD9460 analog inputs help isolate the analog input source from
switching transients caused by the internal sample-and-hold
circuit. The series resistors, along with the 1 kΩ resisters
connected to the internal 3.5 V bias, must be considered in
impedance matching the transformer input. For example, if R
is set to 51 Ω, R
is set to 33 Ω, and there is a 1:1 impedance ratio
S
T
transformer, then the input matches a 50 Ω source with a fullscale drive of 16.0 dBm. The 50 Ω impedance matching can also
be incorporated on the secondary side of the transformer, as
shown in the evaluation board schematic (see
Figure 50).
CLOCK INPUT CONSIDERATIONS
Any high speed ADC is extremely sensitive to the quality of the
sampling clock provided by the user. A track-and-hold circuit is
essentially a mixer, and any noise, distortion, or timing jitter on
the clock combines with the desired signal at the analog-todigital output. For that reason, considerable care was taken in
the design of the clock inputs of the AD9460, and the user is
advised to give careful thought to the clock source.
VIN–
Typical high speed ADCs use both clock edges to generate a
variety of internal timing signals and, as a result, can be sensitive
DIGITAL OUT = ALL 1sDIGITAL OUT = ALL 0s
to the clock duty cycle. Commonly a 5% tolerance is required on
the clock duty cycle to maintain dynamic performance charac-
06006-056
Figure 46. Differential Analog Input Range for VREF = 1.7 V
Rev. 0 | Page 21 of 32
teristics. The AD9460 contains a clock duty cycle stabilizer (DCS)
that retimes the nonsampling edge, providing an internal clock
Page 22
AD9460
V
signal with a nominal ~50% duty cycle. Noise and distortion performance are nearly flat for a 30% to 70% duty cycle with the DCS
enabled. The DCS circuit locks to the rising edge of CLK+ and
optimizes timing internally. This allows for a wide range of input
duty cycles at the input without degrading performance. Jitter in
the rising edge of the input is still of paramount concern and is
not reduced by the internal stabilization circuit. The duty cycle
control loop does not function for clock rates of less than 30 MHz
nominally. The loop is associated with a time constant that
should be considered in applications where the clock rate can
change dynamically, requiring a wait time of 1.5 μs to 5 μs after a
dynamic clock frequency increase or decrease before the DCS
loop is relocked to the input signal. During the time that the
loop is not locked, the DCS loop is bypassed, and the internal
device timing is dependent on the duty cycle of the input clock
signal. In such an application, it can be appropriate to disable the
duty cycle stabilizer. In all other applications, enabling the DCS
circuit is recommended to maximize ac performance.
The DCS circuit is controlled by the DCS MODE pin; a CMOS
logic low (AGND) on DCS MODE enables the duty cycle stabilizer,
and logic high (AVDD1 = 3.3 V) disables the controller.
The AD9460 input sample clock signal must be a high quality,
extremely low phase noise source to prevent degradation of performance. Maintaining 16-bit accuracy places a premium on the
encode clock phase noise. SNR performance can easily degrade
by 3 dB to 4 dB with 70 MHz analog input signals when using a
high jitter clock source. See the
AN-501 Application Note,
Aperture Uncertainty and ADC System Performance, for more
information. For optimum performance, the AD9460 must be
clocked differentially. The sample clock inputs are internally
biased to ~1.5 V, and the input signal is usually ac-coupled into
the CLK+ and CLK− pins via a transformer or capacitors.
Figure 48 shows one preferred method for clocking the AD9460.
The clock source (low jitter) is converted from single-ended to
differential using an RF transformer. The back-to-back Schottky
diodes across the secondary of the transformer limit clock
excursions into the AD9460 to approximately 0.8 V p-p
differential. This helps prevent the large voltage swings of the
clock from feeding through to other portions of the AD9460 and
limits the noise presented to the sample clock inputs.
If a low jitter clock is available, it helps to band-pass filter the
clock reference before driving the ADC clock inputs. Another
option is to ac couple a differential ECL/PECL signal to the encode
input pins, as shown in
Figure 49.
T
0.1µF
ECL/
PECL
VT
Figure 49. Differential ECL for Encode
0.1µF
ENCODE
AD9460
ENCODE
06006-059
Jitter Considerations
High speed, high resolution ADCs are sensitive to the quality
of the clock input. The degradation in SNR at a given input
frequency (f
(t
) can be calculated using the following equation:
J
SNR = 20 log[2
) and rms amplitude due only to aperture jitter
INPUT
πf
× tJ]
INPUT
In the equation, the rms aperture jitter represents the root-meansquare of all jitter sources, including the clock input, analog input
signal, and ADC aperture jitter specification. IF undersampling
applications are particularly sensitive to jitter.
The clock input should be treated as an analog signal in cases
where aperture jitter can affect the dynamic range of the AD9460.
Power supplies for clock drivers should be separated from the
ADC output driver supplies to avoid modulating the clock signal
with digital noise. Low jitter crystal-controlled oscillators make
the best clock sources. If the clock is generated from another type
of source (by gating, dividing, or another method), it should be
synchronized by the original clock during the last step.
POWER CONSIDERATIONS
Care should be taken when selecting a power source. The use of
linear dc supplies is highly recommended. Switching supplies
tend to have radiated components that can be received by the
AD9460. Each of the power supply pins should be decoupled as
closely to the package as possible using 0.1 μF chip capacitors.
The AD9460 has separate digital and analog power supply pins.
The analog supplies are denoted AVDD1 (3.3 V) and AVDD2
(5 V), and the digital supply pins are denoted DRVDD. Although
the AVDD1 and DRVDD supplies can be tied together, best performance is achieved when the supplies are separate. This is
because the fast digital output swings can couple switching
current back into the analog supplies. Note that both AVDD1
and AVDD2 must be held within 5% of the specified voltage.
The DRVDD supply of the AD9460 is a dedicated supply for the
digital outputs in either LVDS or CMOS output modes. When
in LVDS mode, the DRVDD should be set to 3.3 V. In CMOS
mode, the DRVDD supply can be connected from 2.5 V to 3.6 V
for compatibility with the receiving logic.
Rev. 0 | Page 22 of 32
Page 23
AD9460
DIGITAL OUTPUTS
LVDS Mode
The off-chip drivers on the chip can be configured to provide
LVDS-compatible output levels via Pin 3 (OUTPUT MODE).
LVDS outputs are available when OUTPUT MODE is CMOS
logic high (or AVDD1 for convenience) and a 3.74 kΩ R
resistor is placed at Pin 5 (LVDS_BIAS) to ground. Dynamic
performance, including both SFDR and SNR, maximizes when
using the AD9460 in LVDS mode; designers are encouraged to
take advantage of this mode. The AD9460 outputs include complementary LVDS outputs for each data bit (Dx+/Dx−), the
overrange output (OR+/OR−), and the output data clock output
(DCO+/DCO−). The R
resistor current is multiplied on-chip,
SET
setting the output current at each output equal to a nominal
3.5 mA (11 × I
). A 100 Ω differential termination resistor
RSET
placed at the LVDS receiver inputs results in a nominal 350 mV
swing at the receiver. LVDS mode facilitates interfacing with
LVDS receivers in custom ASICs and FPGAs that have LVDS
capability for superior switching performance in noisy environments. Single point-to-point net topologies are recommended,
with a 100 Ω termination resistor located as close to the receiver
as possible. It is recommended to keep the trace length less than
two inches and to keep differential output trace lengths as equal
as possible.
CMOS Mode
In applications that can tolerate a slight degradation in dynamic
performance, the AD9460 output drivers can be configured to
interface with 2.5 V or 3.3 V logic families by matching
DRVDD to the digital supply of the interfaced logic. CMOS
outputs are available when OUTPUT MODE is CMOS logic
low (or AGND for convenience). In this mode, the output data
bits, Dx, are single-ended CMOS, as is the overrange output,
OR+. The output clock serves as a differential CMOS signal,
DCO+/DCO−. Lower supply voltages are recommended to
avoid coupling switching transients back to the sensitive analog
sections of the ADC. Minimize the capacitive load to the CMOS
outputs and connect each output to a single gate through a
series resistor (220 Ω) to minimize switching transients caused
by the capacitive loading.
SET
TIMING
The AD9460 provides latched data outputs with a pipeline delay
of 13 clock cycles. Data outputs are available one propagation
delay (t
) after the rising edge of CLK+. Refer to Figure 2 and
PD
Figure 3 for detailed timing diagrams.
OPERATIONAL MODE SELECTION
Data Format Select
The data format select (DFS) pin of the AD9460 determines
the coding format of the output data. This pin is 3.3 V CMOS
compatible, with logic high (or AVDD1, 3.3 V) selecting twos
complement and DFS logic low (AGND) selecting offset binary
Tabl e 1 0 summarizes the output coding.
format.
Output Mode Select
The OUPUT MODE pin controls the logic compatibility,
as well as the pinout of the digital outputs. This pin is a CMOScompatible input. With OUTPUT MODE = 0 (AGND), the
AD9460 outputs are CMOS compatible, and the pin assignment
for the device is as defined in
(AVDD1, 3.3 V), the AD9460 outputs are LVDS compatible, and
the pin assignment for the device is as defined in
Duty Cycle Stabilizer
The DCS circuit is controlled by the DCS MODE pin; a CMOS
logic low (AGND) on DCS MODE enables the DCS, and logic
high (AVDD1, 3.3 V) disables the controller.
SFDR Enhancement
Under certain conditions, the SFDR performance of the AD9460
improves by adding some additional power to the core of the
ADC. The SFDR control pin (Pin 100) is a CMOS-compatible
control pin to optimize the configuration of the AD9460 analog
front end. Connecting SFDR to AGND optimizes SFDR
performance for applications with analog input frequencies
<200 MHz for 80 MSPS and 105 MSPS speed grades. For
applications with analog inputs >200 MHz, this pin should be
connected to AVDD1 for optimum SFDR performance; power
dissipation from AVDD2 increases by ~70 mW for the
AD9460BSVZ-80 and ~20 mW for the AD9460BSVZ-105.
Evaluation boards are offered to configure the AD9460 in either
CMOS mode or LVDS mode only. This design represents a
recommended configuration for using the device over a wide
range of sampling rates and analog input frequencies. These
evaluation boards provide all the support circuitry required to
operate the ADC in its various modes and configurations. Complete schematics are shown in
files are available from engineering applications demonstrating
the proper routing and grounding techniques that should be
applied at the system level.
Figure 50 through Figure 53. Gerber
The LVDS mode evaluation boards include an LVDS-toCMOS translator, making them compatible with the high
speed ADC FIFO evaluation kit (HSC-ADC-EVALA-SC,
www.analog.com/FIFO). The kit includes a high speed data
capture board that provides a hardware solution for capturing
up to 32 kB samples of high speed ADC output data in a FIFO
memory chip (user upgradeable to 256 kB samples). Software
is provided to enable the user to download the captured data to
a PC via the USB port. This software also includes a behavioral
model of the AD9460 and many other high speed ADCs.
It is critical that signal sources with very low phase noise
(<60 fsec rms jitter) are used to realize the ultimate
performance of the converter. Proper filtering of the input
signal to remove harmonics and lower the integrated noise at
the input is also necessary to achieve the specified noise
performance.
The evaluation boards are shipped with a 115 V ac to 6 V dc
power supply. The evaluation boards include low dropout
regulators to generate the various dc supplies required by the
AD9460 and its support circuitry. Separate power supplies are
provided to isolate the DUT from the support circuitry. Each
input configuration can be selected by proper connection of
various jumpers (see
Figure 50).
Behavioral modeling of the AD9460 using ADIsimADC™
software is also available at
ADIsimADC software supports virtual ADC evaluation using ADI
proprietary behavioral modeling technology. This allows rapid
comparison between the AD9460 and other high speed ADCs
with or without hardware evaluation boards.
The user can choose to remove the translator and terminations
to access the LVDS outputs directly.
www.analog.com/ADIsimADC. The
Rev. 0 | Page 24 of 32
Page 25
AD9460
P1
1
P2
2
P3
3
P21
P4
4
PTMICRO4
P1
1
P2
2
P3
3
P22
P4
4
PTMICRO4
GND
DRGND
XTALPWR
EXTREF
DRGND
DRVDD
GND
VCC
GND
5V
DRVDD
76
MTHOLE6
H4
MTHOLE6
H3
MTHOLE6
H1
MTHOLE6
H2
D11_C/D6_Y
77
D11_T/D7_Y
78
D12_C/D8_Y
79
D12_T/D9_Y
80
D13_C/D10_Y
81
D13_T/D11_Y
82
D14_C/D12_Y
83
D14_T/D13_Y
84
D15_C/D14_Y
85
(MSB) D15_T/D15_Y
86
DRGND
87
DRVDD
88
DOR_C
89
DOR_T/DOR_Y
90
GND
91
VCC
92
VCC
93
VCC
94
VCC
95
VCC
96
VCC
97
GND
98
99
100
101
DRVDD
D11_C
D11_T
D12_C
D12_T
D13_C
D13_T
D14_C
D14_T
D15_C
D15_T
DRGND
DRVDD
OR_C
OR_T
AGND
AVDD1
AVDD1
AVDD1
AVDD1
AVDD1
AVDD1
AGND
AGND
SFDR
EPAD
DRGND
D10_T/D5_Y
73
74
75
D10_T
DRGND
D8_C/D0_Y
D8_T/D1_Y
D9_C/D2_Y
D9_T/D3_Y
D10_C/D4_Y
72
69
70
71
D9_T
D8_T
D9_C
D8_C
D10_C
D7_C
D7_T
DR
DRB
68
67
DCO
DCOB
DRGND
DRVDD
65
66
64
63
D7_T
D7_C
DRVDD
DRGND
U1
AD9460
D5_C
D5_T
D6_T
D6_C
59
60
61
62
D6_T
D5_T
D6_C
D5_C
D3_C
D3_T
D4_C
D4_T
55
56
57
58
D4_T
D3_T
D4_C
D3_C
D1_C
D1_T
D2_T
D2_C
51
52
53
54
D2_T
D1_T
D2_C
D1_C
D0_T
50
D0_C
49
DRVDD
48
DRGND
47
AGND
46
AVDD1
45
AVDD1
44
AVDD1
43
AGND
42
ENCB
41
ENC
40
AGND
39
AVDD1
38
AVDD2
37
AVDD1
36
AVDD2
35
AVDD1
34
AVDD1
33
AVDD1
32
AVDD2
31
AVDD2
30
AVDD2
29
AVDD2
28
AVDD2
27
AVDD2
26
D0_T
D0_C (LSB)
DRVDD
DRGND
GND
VCC
VCC
VCC
GND
ENCB
ENC
GND
VCC
5V
VCC
5V
VCC
VCC
VCC
5V
DCS MODE
DNC
OUTPUT MODE
DFS
LVDSBIAS
AVDD1
SENSE
VREF
AGND
REFT
REFB
AVDD2
AVDD2
AVDD2
AVDD2
AVDD2
AVDD2
AVDD1
AVDD1
AVDD1
AGND
VIN+
VIN–
AGND
6
234
5
1
GND
E19
VCC
E4
E18
E36
VCC
GND
E10
E5
E6
E1
VCC
GND
SCLK
GND
R11
1kΩ
VCC
E3
E9
GND
E2
E14
VCC
GND
9
8
7
VCC
GND
GND
11
10
GND
C86
0.1µF
GND
E25
E27
E24
E26
E41
VCC
EXTREF
R1
DNP
R3
3.74kΩ
15
12
14
13
5V
5V
5V
5V
C2
0.1µF
C51
10µF
C9
C3
0.1µF
0.1µF
C40
0.1µF
+
C39
10µF
GND
GND
R2
DNP
GND
20
16
17
5V
GND
C98
21
19
18
5V
GND
VCC
VCC
VCC
GND
DNP
T1
ETC1-1-13
R5
DNP
GND
23
22
24
25
GND
R28
33Ω
C7
0.1µF
R4
GND
GND
TOUT
C12
0.1µF
CT
2
15
34
TINB
GND
C5
L1
10nH
J4
SMBMST
AVDD2
5V
25Ω
125
T2
3
PRISEC
TOUTB
PRI SEC
0.1µF
ANALOG
C13
R9
DNP
DNP
4
OPTIONAL
R35
33Ω
0.1µF
C91
C8
GND
GND
TOUT
624
153
GND
0.1µF
CT
PRI SEC
NC
TINBTOUTB
06006-060
DNP = DO NOT POPULATE
R6
25Ω
ETC1-1-13
E15
T5
ADT1-1WT
Figure 50. Evaluation Board Schematic
Rev. 0 | Page 25 of 32
Page 26
AD9460
VIN
DRVDDX
DRGND
1
C41
0.1µF
DNP
C1
10µF
DNP
+
VXTAL
OPTIONAL ENCODE CIRCUITS
GND
5V
XTALPWR
C44
10µF
DNP
+
E30
E31
E20
VXTAL
ENC
CR1
2
1
XTALINPUT
8
1
OUTVCC
U2
ECLOSC
VEE~OUT
7
14
GND
GND
VXTAL
ENCB
3
DRGNDGND
L2
0Ω
GND
OUT1
U3
3.3V
ADP3338-3.3
U7
ADP3338-3.3
OUT
DRVDDX
VCCX
GND
1
GND
OUT1
3.3V
OUT
VCCX
C4
10µF
+
342
IN
VIN
C6
10µF
+
342
IN
C88
+
C87
+
DRGND
10µF
DRGND
GND
10µF
GND
VIN
5VX
GND
GND
OUT1
OUT
5VX
GND
3
3
2
C34
10µF
+
342
IN
VIN
C33
10µF
+
1
1
C89
+
GND
10µF
GND
GND
DNP = DO NOT PO PULATE
06006-061
ENCODE
GND
GND
CR2
6
123
DNP
DNP
J1
5
NC
1
2
GND
C42
0.1µF
4
SEC
PRI
C26
R8
SMBMST
L5
0.1µF
GND
50Ω
VCCXVCC
DRVDDXDRVDD
L4
FERRITE
5VX5V
1
L3
FERRITE
FERRITE
U14
5V
ADP3338-5
XTALINPUT
POWER OPTIONS
2
P4
PJ-002A
3
LOADING SYMMETRICAL
CR2 TO MAKE LAYOUT AND PARASIT IC
T3
ADT1-1WT
0Ω
R39
C36
R7
DNP
J5
SMBMST
Figure 51. Evaluation Board Schematic, Encode, Optional Encode and Power Options
DNP = do not populate. All items listed in this category are not populated.
1
1
1
1
1
1
1
1
1
1
1
1
Capacitor 805 DNP
Header EHOLE DNP
SMA SMA DNP
Header C40MS DNP Samtec, Inc. TSW-120-08-L-D-RA
BRES402 402 DNP
BRES402 402 DNP
ECLOSC DIP4(14) DNP
MTHOLE6 MTHOLE6 DNP
Balun transformer SM-22 DNP M/A-COM ETC1-1-13
Transformer ADT1-1WT DNP Mini-Circuits ADT1-WT
Term strip PTMICRO4 DNP
1
Manufacturer Mfg. Part No.
Digi-Key
478-1699-2
Corporation
Digi-Key
490-1717-1-ND
Corporation
Mouser
517-6111TG
Electronics
Digi-Key
ARFX1231-ND
Corporation
Newark
Electronics
Rev. 0 | Page 30 of 32
Page 31
AD9460
OUTLINE DIMENSIONS
0.75
0.60
0.45
1.20
MAX
16.00 BSC SQ
1
PIN 1
14.00 BSC SQ
76100
76100
75
75
1
1.05
1.00
0.95
0.15
SEATING
0.05
PLANE
VIEW A
ROTATED 90° CCW
TOP VIEW
(PINS DOWN)
0° MIN
0.20
0.09
7°
3.5°
0°
0.08 MAX
COPLANARIT Y
NOTES
1. CENTER FI GURES ARE TYPICAL UNL ESS OTHERWI SE NOTED.
2. THE PACKAGE HAS A CONDUCTIVE HE AT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELI ABLE OPER ATION OF
THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF
THE PACKAGE AND ELECTRICALLY CONNECTED TO CHI P GROUND. IT IS RECOMM ENDED THAT NO PCB SIGNAL
TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE
SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTI ON TEMPERATURE OF THE
DEVICE WHI CH MAY BE BENEFICIAL I N HIGH TEMP ERATURE ENVIRONMENTS.
25
2650
VIEW A
COMPLIANT TO JEDEC STANDARDS MS-026-AED-HD
51
51
EXPOSED
BOTTO M VIEW
0.50 BSC
LEAD PITCH
PAD
(PINS UP)
0.27
0.22
0.17
9.50 SQ
25
2650
040506-A
Figure 54. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
(SV-100-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option