ANALOG DEVICES AD9446 Service Manual

www.BDTIC.com/ADI
16-Bit, 80/100 MSPS ADC

FEATURES

100 MSPS guaranteed sampling rate (AD9446-100)
83.6 dBFS SNR with 30 MHz input (3.8 V p-p input, 80 MSPS)
82.6 dBFS SNR with 30 MHz input (3.2 V p-p input, 80 MSPS) 89 dBc SFDR with 30 MHz input (3.2 V p-p input, 80 MSPS) 95 dBFS 2-tone SFDR with 9.8 MHz and 10.8 MHz (100 MSPS) 60 fsec rms jitter Excellent linearity
DNL = ±0.4 LSB typical INL = ±3.0 LSB typical
2.0 V p-p to 4.0 V p-p differential full-scale input Buffered analog inputs LVDS outputs (ANSI-644 compatible) or CMOS outputs Data format select (offset binary or twos complement) Output clock available
3.3 V and 5 V supply operation

APPLICATIONS

MRI receivers Multicarrier, multimode cellular receivers Antenna array positioning Power amplifier linearization Broadband wireless Radar Infrared imaging Communications instrumentation

GENERAL DESCRIPTION

The AD9446 is a 16-bit, monolithic, sampling analog-to-digital converter (ADC) with an on-chip track-and-hold circuit. It is optimized for performance, small size, and ease of use. The product operates up to a 100 MSPS, providing superior SNR for instrumentation, medical imaging, and radar receivers employing baseband (<100 MHz) IF frequencies.
The ADC requires 3.3 V and 5.0 V power supplies and a low v
oltage differential input clock for full performance operation. No external reference or driver components are required for many applications. Data outputs are CMOS or LVDS compatible (ANSI-644 compatible) and include the means to reduce the overall current needed for short trace distances.
AD9446

FUNCTIONAL BLOCK DIAGRAM

AGND DRGND DRVDD
AVDD1 AVDD2
2
32
2
DFS DCS MODE OUTPUT MODE OR
D15 TO D0
DCO
AD9446
VIN+ VIN–
CLK+ CLK–
BUFFER
CLOCK
AND TIMING
MANAGEMENT
T/H
PIPELINE
VREF
ADC
REF
Figure 1.
16
CMOS
OR
LVDS
OUTPUT
STAGING
REFBSENSE REFT
Optional features allow users to implement various selectable op
erating conditions, including input range, data format select,
and output data mode.
The AD9446 is available in a Pb-free, 100-lead, surface-mount,
lastic package (100-lead TQFP/EP) specified over the
p industrial temperature range −40°C to +85°C.

PRODUCT HIGHLIGHTS

1. True 16-bit linearity.
2. H
igh performance: outstanding SNR performance for baseband IFs in data acquisition, instrumentation, magnetic resonance imaging, and radar receivers.
ase of use: on-chip reference and high input impedance
3. E
track-and-hold with adjustable analog input range and an output clock simplifies data capture.
ackaged in a Pb-free, 100-lead TQFP/EP package.
4. P
5. C
lock duty cycle stabilizer (DCS) maintains overall ADC
performance over a wide range of clock pulse widths.
6. O
R (out-of-range) outputs indicate when the signal is
beyond the selected input range.
05490-001
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 © 2005 Analog Devices, Inc. All rights reserved.
AD9446
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TABLE OF CONTENTS

Features .............................................................................................. 1
Te r mi n ol o g y .......................................................................................9
Applications....................................................................................... 1
General Description......................................................................... 1
Functional Block Diagram .............................................................. 1
Product Highlights........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
DC Specifications ......................................................................... 3
AC Specifications.......................................................................... 4
Digital Specifications ................................................................... 6
Switching Specifications .............................................................. 6
Timing Diagrams.......................................................................... 7
Absolute Maximum Ratings............................................................ 8
Thermal Resistance ...................................................................... 8
ESD Caution.................................................................................. 8
Pin Configurations and Function Descriptions ......................... 10
Equivalent Circuits......................................................................... 15
Typical Perf or m an c e Chara c t e ristic s ........................................... 16
Theory of Operation ...................................................................... 24
Analog Input and Reference Overview ................................... 24
Clock Input Considerations...................................................... 26
Power Considerations ................................................................ 27
Digital Outputs........................................................................... 27
Timing ......................................................................................... 27
Operational Mode Selection ..................................................... 28
Evaluation Board ............................................................................ 29
Outline Dimensions ....................................................................... 36
Ordering Guide .......................................................................... 36

REVISION HISTORY

10/05—Revision 0: Initial Version
Rev. 0 | Page 2 of 36
AD9446
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SPECIFICATIONS

DC SPECIFICATIONS

AVDD1 = 3.3 V, AVDD2 = 5.0 V, DRVDD = 3.3 V, LVDS mode, specified minimum sampling rate, 3.2 V p-p differential input, internal trimmed reference (1.6 V mode), A
Table 1.
AD9446BSVZ-80 AD9446BSVZ-100 Parameter Te mp Min Typ Max Min Typ Max Unit
RESOLUTION Full 16 16 Bits ACCURACY
No Missing Codes Full Guaranteed Guaranteed Offset Error Full −5 ±0.1 +5 −5 ±0.1 +5 mV Gain Error Full −3 ±0.6 +3 −3 ±0.5 +3 % FSR 25°C −2 ±0.3 +2 −2 ±0.3 +2 % FSR Differential Nonlinearity (DNL) Integral Nonlinearity (INL)1 25°C −5 ±3.0 +5 −6 ±3.0 +6 LSB
VOLTAGE REFERENCE
Output Voltage
1
VREF = 1.6 V (3.2 V p-p Analog Input Range) Full 1.6 1.6 V Load Regulation @ 1.0 mA Full ±2 ±2 mV Reference Input Current (External 1.6 V Reference) Full µA
INPUT REFERRED NOISE 25°C 1.5 1.9 LSB rms ANALOG INPUT
Input Span
VREF = 1.6 V Full 3.2 3.2 V p-p
VREF = 1.0 V (External) Full 2.0 2.0 V p-p Internal Input Common-Mode Voltage Full 3.5 3.5 V External Input Common-Mode Voltage Full 3.2 3.8 3.2 3.8 V Input Resistance Input Capacitance
2
2
POWER SUPPLIES
Supply Voltage
AVDD1 Full 3.14 3.3 3.46 3.14 3.3 3.46 V
AVDD2 Full 4.75 5.0 5.25 4.75 5.0 5.25 V
DRVDD—LVDS Outputs Full 3.0 3.3 3.6 3.0 3.3 3.6 V
DRVDD—CMOS Outputs Full 3.0 3.3 3.6 3.0 3.3 3.6 V Supply Current
1
I
AVDD
1
I
AVDD2
1
I
—LVDS Outputs Full 68 75 69 75 mA
DRVDD
1
I
—CMOS Outputs Full 14 14 mA
DRVDD
PSRR
Offset Full 1 1 mV/V
Gain Full 0.2 0.2 %/V
POWER CONSUMPTION
LVDS Outputs Full 2.4 2.6 2.6 2.8 W CMOS Outputs (DC Input) Full 2.2 2.3 W
1
Measured at the maximum clock rate, fIN = 15 MHz, full-scale sine wave, with a 100 Ω differential termination on each pair of output bits for LVDS output mode and
approximately 5 pF loading on each output bit for CMOS output mode.
2
Input capacitance or resistance refers to the effective impedance between one differential input pin and AGND. Refer to Figure 6 for the equivalent analog input structure.
= −1.0 dBFS, DCS on, unless otherwise noted.
IN
1
Full −0.75 ±0.4 +0.75 −0.85 ±0.4 +0.85 LSB
Full 1 1 kΩ Full 6 6 pF
Full 335 365 368 401 mA Full 204 234 223 255 mA
Rev. 0 | Page 3 of 36
AD9446
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AC SPECIFICATIONS

AVDD1 = 3.3 V, AVDD2 = 5.0 V, DRVDD = 3.3 V, LVDS mode, specified minimum sample rate, 3.2 V p-p differential input, internal trimmed reference (1.6 V mode), A
Table 2.
AD9446BSVZ-80 AD9446BSVZ-100 Parameter Te m p Min Typ Max Min Typ Max Unit
SIGNAL-TO-NOISE RATIO (SNR)
fIN = 10 MHz 25°C 79.6 81.8 78.4 79.7 dB fIN = 30 MHz 25°C 80.5 81.6 78.3 79.5 dB Full 79.2 77.9 dB fIN = 70 MHz 25°C 79.0 80.6 77.7 79.0 dB Full 78.2 77.6 dB fIN = 92 MHz 25°C 80.1 78.9 dB fIN = 125 MHz 25°C 78.8 78.2 dB fIN = 170 MHz 25°C 77.1 77.0 dB
fIN = 10 MHz (2 V p-p Input) 25°C 78.3 76.6 dB fIN = 30 MHz (2 V p-p Input) 25°C 78.3 76.6 dB fIN = 70 MHz (2 V p-p Input) 25°C 77.6 76.2 dB fIN = 92 MHz (2 V p-p Input) 25°C 77.5 76 dB fIN = 125 MHz (2 V p-p Input) 25°C 76.7 75.6 dB fIN = 170 MHz (2 V p-p Input) 25°C 75.5 75.1 dB
SIGNAL-TO-NOISE AND DISTORTION (SINAD)
fIN = 10 MHz 25°C 77.1 80.5 76.9 78.9 dB fIN = 30 MHz 25°C 75.9 80.4 75.5 78.6 dB Full 74.9 71.7 dB fIN = 70 MHz 25°C 75.5 78.6 73.8 77.7 dB Full 74.4 69.1 dB fIN = 92 MHz 25°C 79.2 77.1 dB fIN = 125 MHz 25°C 74.9 76.9 dB fIN = 170 MHz 25°C 66.0 70.5 dB
fIN = 10 MHz (2 V p-p Input) 25°C 77.9 76.2 dB fIN = 30 MHz (2 V p-p Input) 25°C 77.8 76.1 dB fIN = 70 MHz (2 V p-p Input) 25°C 77.1 75.9 dB fIN = 92 MHz (2 V p-p Input) 25°C 77.1 75.7 dB fIN = 125 MHz (2 V p-p Input) 25°C 75.7 75.3 dB fIN = 170 MHz (2 V p-p Input) 25°C 72.5 73.6 dB
EFFECTIVE NUMBER OF BITS (ENOB)
fIN = 10 MHz 25°C 13.2 13.0 Bits fIN = 30 MHz 25°C 13.2 12.9 Bits fIN = 70 MHz 25°C 12.9 12.8 Bits fIN = 92 MHz 25°C 13.0 12.7 Bits fIN = 125 MHz 25°C 12.3 12.6 Bits fIN = 170 MHz 25°C 10.8 11.6 Bits
= −1 dBFS, DCS on, unless otherwise noted.
IN
Rev. 0 | Page 4 of 36
AD9446
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AD9446BSVZ-80 AD9446BSVZ-100 Parameter Te m p Min Typ Max Min Typ Max Unit
SPURIOUS-FREE DYNAMIC RANGE
(SFDR, Second or Third Harmonic) fIN = 10 MHz 25°C 82 90 82 92 dBc fIN = 30 MHz 25°C 82 89 82 89 dBc Full 80 79 dBc fIN = 70 MHz 25°C 80 87 81 89 dBc Full 79 77 dBc fIN = 92 MHz 25°C 84 84 dBc fIN = 125 MHz 25°C 80 83 dBc fIN = 170 MHz 25°C 66 74 dBc
fIN = 10 MHz (2 V p-p Input) 25°C 92 94 dBc fIN = 30 MHz (2 V p-p Input) 25°C 93 92 dBc fIN = 70 MHz (2 V p-p Input) 25°C 92 92 dBc fIN = 92 MHz (2 V p-p Input) 25°C 90 89 dBc fIN = 125 MHz (2 V p-p Input) 25°C 85 87 dBc fIN = 170 MHz (2 V p-p Input) 25°C 77 82 dBc
WORST SPUR EXCLUDING SECOND OR
THIRD HARMONICS fIN = 10 MHz 25°C −98 −89 −96 −91 dBc fIN = 30 MHz 25°C −97 −89 −97 −89 dBc Full −89 −87 dBc fIN = 70 MHz 25°C −98 −90 −96 −90 dBc Full −89 −88 dBc fIN = 92 MHz 25°C −98 −95 dBc fIN = 125 MHz 25°C −96 −96 dBc fIN = 170 MHz 25°C −95 −92 dBc
fIN = 10 MHz (2 V p-p Input) 25°C −97 −93 dBc fIN = 30 MHz (2 V p-p Input) 25°C −97 −96 dBc fIN = 70 MHz (2 V p-p Input) 25°C −94 −94 dBc fIN = 92 MHz (2 V p-p Input) 25°C −97 −99 dBc fIN = 125 MHz (2 V p-p Input) 25°C −97 −95 dBc fIN = 170 MHz (2 V p-p Input) 25°C −93 −95 dBc
TWO-TONE SFDR
fIN = 10.8 MHz @ −7 dBFS,
9.8 MHz @ −7 dBFS
fIN = 70.3 MHz @ −7 dBFS,
69.3 MHz @ −7 dBFS
ANALOG BANDWIDTH Full 325 540 MHz
25°C 96 95 dBFS
25°C 92 92 dBFS
Rev. 0 | Page 5 of 36
AD9446
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DIGITAL SPECIFICATIONS

AVDD1 = 3.3 V, AVDD2 = 5.0 V, DRVDD = 3.3 V, R
Table 3.
AD9446BSVZ-80 AD9446BSVZ-100 Parameter Te mp Min Typ Max Min Typ Max Unit
CMOS LOGIC INPUTS (DFS, DCS MODE, OUTPUT MODE)
High Level Input Voltage Full 2.0 2.0 V Low Level Input Voltage Full 0.8 0.8 V High Level Input Current Full 200 200 µA Low Level Input Current Full −10 Input Capacitance Full
DIGITAL OUTPUT BITS—CMOS MODE (D0 to D15, OTR)
DRVDD = 3.3 V
High Level Output Voltage Full 3.25 Low Level Output Voltage Full
DIGITAL OUTPUT BITS—LVDS MODE (D0 to D15, OTR)
VOD Differential Output Voltage
2
VOS Output Offset Voltage Full 1.125
CLOCK INPUTS (CLK+, CLK−)
Differential Input Voltage Full 0.2 Common-Mode Voltage Full 1.3 1.5 1.6 1.3 1.5 1.6 V Input Resistance Full 1.1 1.4 1.7 1.1 1.4 1.7 kΩ Input Capacitance Full
1
Output voltage levels measured with 5 pF load on each output.
2
LVDS R
TERM
= 100 Ω.
= 3.74 kΩ, unless otherwise noted.
LVD S_ BI AS
1
Full 247
2
+10 −10 +10 µA
0.2 0.2 V
2
545 247 545 mV
1.375 1.125 1.375 V
2 pF
3.25 V
0.2 V
2 pF

SWITCHING SPECIFICATIONS

AVDD1 = 3.3 V, AVDD2 = 5.0 V, DRVDD = 3.3 V, unless otherwise noted.
Table 4.
AD9446BSVZ-80 AD9446BSVZ-100 Parameter Te mp Min Typ Max Min Typ Max Unit
CLOCK INPUT PARAMETERS
Maximum Conversion Rate Full 80 100 MSPS Minimum Conversion Rate Full 1 1 MSPS CLK Period Full 12.5 10 ns CLK Pulse Width High1 (t CLK Pulse Width Low1 (t
DATA OUTPUT PARAMETERS
Output Propagation Delay—CMOS (tPD)2 (Dx, DCO+) Full 3.35 3.35 ns Output Propagation Delay—LVDS (tPD)3 (Dx+), (t Pipeline Delay (Latency) Full 13 13 Cycles Aperture Delay (tA) Full ns Aperture Uncertainty (Jitter, tJ) Full 60 60
1
With duty cycle stabilizer (DCS) enabled.
2
Output propagation delay is measured from clock 50% transition to data 50% transition with 5 pF load.
3
LVDS R
= 100 Ω. Measured from the 50% point of the rising edge of CLK+ to the 50% point of the data transition.
TERM
) Full 5.0 4.0 ns
CLKH
) Full 5.0 4.0 ns
CLKL
)3 (DCO+) Full 2.1 3.6 4.8 2.3 3.6 4.8 ns
CPD
fsec
s
rm
Rev. 0 | Page 6 of 36
AD9446
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TIMING DIAGRAMS

A
CLK+
CLK–
N–1
IN
t
CLKH
t
CLKL
N
N + 1
1/
f
S
t
PD
DATA OUT
DCO+
DCO–
VIN
CLK–
CLK+
DX
DCO+
DCO–
N–1
t
CLKH
N + 1
05490-002
t
CPD
N – 13
13 CLOCK CYCLES
N–12
N
Figure 2. LVDS Mode Timing Diagram
N
N + 1
t
CLKL
t
PD
N – 13 N – 12 N – 1 N
N + 2
13 CLOCK CYCLES
05490-003
Figure 3. CMOS T
iming Diagram
Rev. 0 | Page 7 of 36
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ABSOLUTE MAXIMUM RATINGS

Table 5.
With
t
Respec
Parameter
ELECTRICAL
AVDD1 AGND −0.3 V to +4 V AVDD2 AGND −0.3 V to +6 V DRVDD DGND −0.3 V to +4 V AGND DGND −0.3 V to +0.3 V AVDD1 DRVDD −4 V to +4 V AVDD2 DRVDD −4 V to +6 V AVDD2 AVDD1 −4 V to +6 V D0± to D15± DGND –0.3 V to DRVDD + 0.3 V CLK+/CLK− AGND –0.3 V to AVDD1 + 0.3 V OUTPUT MODE,
DCS MODE, DFS VIN+, VIN− AGND –0.3 V to AVDD2 + 0.3 V VREF AGND –0.3 V to AVDD1 + 0.3 V SENSE AGND –0.3 V to AVDD1 + 0.3 V REFT, REFB AGND –0.3 V to AVDD1 + 0.3 V
ENVIRONMENTAL
Storage Temperature
Range Operating Temperature
Range Lead Temperature
(Soldering 10 sec) Junction Temperature 150°C
to
AGND –0.3 V to AVDD1 + 0.3 V
–65°C to +125°C
–40°C to +85°C
300°C
Rating
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

THERMAL RESISTANCE

The heat sink of the AD9446 package must be soldered to ground.
Table 6.
Package Type θ
100-lead TQFP/EP 19.8 8.3 2 °C/W
JA
Typical θJA = 19.8°C/W (heat sink soldered) for multilayer board in still air.
Typical θ
= 8.3°C/W (heat sink soldered) for multilayer board
JB
in still air.
Typical θ
= 2°C/W (junction to exposed heat sink) represents
JC
the thermal resistance through heat sink path.
Airflow increases heat dissipation, effectively reducing θ more metal directly in contact with the package leads from metal traces through holes, ground, and power planes reduces the θ
. It is required that the exposed heat sink be soldered to
JA
the ground plane.
θ
JB
θ
JC
Unit
. Also,
JA

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. 0 | Page 8 of 36
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TERMINOLOGY

Analog Bandwidth (Full Power Bandwidth)
The analog input frequency at which the spectral power of the
undamental frequency (as determined by the FFT analysis) is
f reduced by 3 dB.
Minimum Conversion Rate
The clock rate at which the SNR of the lowest analog signal frequency drops by no more than 3 dB below the guaranteed limit.
Aperture Delay (t
The delay between the 50% point of the rising edge of the clock
nd the instant at which the analog input is sampled.
a
Aperture Uncertainty (Jitter, t
The sample-to-sample variation in aperture delay.
Clock Pulse Width and Duty Cycle
Pulse width high is the minimum amount of time that the
lock pulse should be left in the Logic 1 state to achieve rated
c performance. Pulse width low is the minimum time the clock pulse should be left in the low state. At a given clock rate, these specifications define an acceptable clock duty cycle.
Differential Nonlinearity (DNL, No Missing Codes)
An ideal ADC exhibits code transitions that are exactly 1 LSB
part. DNL is the deviation from this ideal value. Guaranteed
a no missing codes to 16-bit resolution indicates that all 65,536 codes must be present over all operating ranges.
Effective Number of Bits (ENOB)
The effective number of bits for a sine wave input at a given
put frequency can be calculated directly from its measured
in SINAD using the following formula:
ENOB
Gain Error
The first code transition should occur at an analog value of ½ LSB above negative full scale. The last transition should occur at an analog value of 1½ LSB below the positive full scale. Gain error is the deviation of the actual difference between first and last code transitions and the ideal difference between first and last code transitions.
Integral Nonlinearity (INL)
The deviation of each individual code from a line drawn from negative full scale through positive full scale. The point used as negative full scale occurs ½ LSB before the first code transition. Positive full scale is defined as a level 1½ LSB beyond the last code transition. The deviation is measured from the middle of each particular code to the true straight line.
Maximum Conversion Rate
The clock rate at which parametric testing is performed.
)
A
)
J
()
SINAD
=
1.76
6.02
Offset Error
The major carry transition should occur for an analog value of ½ LSB below VIN+ = VIN−. Offset error is defined as the deviation of the actual transition from that point.
Out-of-Range Recovery Time
The time it takes for the ADC to reacquire the analog input after a transition from 10% above positive full scale to 10% above negative full scale, or from 10% below negative full scale to 10% below positive full scale.
Output Propagation Delay (tPD)
The delay between the clock rising edge and the time when all bits are within valid logic levels.
Power-Supply Rejection Ratio
The change in full scale from the value with the supply at the minimum limit to the value with the supply at the maximum limit.
Signal-to-Noise and Distortion (SINAD)
The ratio of the rms input signal amplitude to the rms value of the sum of all other spectral components below the Nyquist frequency, including harmonics but excluding dc.
Signal-to-Noise Ratio (SNR)
The ratio of the rms input signal amplitude to the rms value of the sum of all other spectral components below the Nyquist frequency, excluding the first six harmonics and dc.
Spurious-Free Dynamic Range (SFDR)
The ratio of the rms signal amplitude to the rms value of the peak spurious spectral component. The peak spurious component may be a harmonic. SFDR can be reported in dBc (that is, degrades as signal level is lowered) or dBFS (always related back to converter full scale).
Tem p er at u re Dr i ft
The temperature drift for offset error and gain error specifies the maximum change from the initial (25°C) value to the value at T
or T
MIN
Total Harmonic Distortion (THD)
The ratio of the rms input signal amplitude to the rms value of the sum of the first six harmonic components.
Two -Tone SFDR
The ratio of the rms value of either input tone to the rms value of the peak spurious component. The peak spurious component may or may not be an IMD product.
MAX
.
Rev. 0 | Page 9 of 36
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PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

AGND99AGND98AGND97AVDD196AVDD195AVDD194AVDD193AVDD192AVDD191AGND90OR+89OR–88DRVDD87DRGND86D15+ (MSB)85D15–84D14+83D14–82D13+81D13–80D12+79D12–78D11+77D11–76DRVDD
100
DNC
DFS
AVDD1 SENSE
VREF
AGND
REFT
REFB AVDD2 AVDD2 AVDD2 AVDD2 AVDD2 AVDD2 AVDD1 AVDD1 AVDD1
AGND
VIN+ VIN–
AGND
AVDD2
1 2 3 4 5 6 7 8 9
10
11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
DCS MODE
OUTPUT MODE
LVDS_BIAS
DNC = DO NOT CONNECT
PIN 1
AD9446
LVDS MODE
TOP VIEW
(Not to Scale)
26
AVDD227AVDD228AVDD229AVDD230AVDD231AVDD232AVDD133AVDD134AVDD135AVDD236AVDD137AVDD238AVDD1
39
40
AGND
41
CLK+
42
CLK–
AGND
Figure 4. 100-Lead TQFP/EP Pin Configuration in LVDS Mode
43
AVDD144AVDD145AVDD1
46
47
AGND
48
DRVDD
DRGND
75
DRGND
74
D10+
73
D10–
72
D9+
71
D9–
70
D8+
69
D8–
68
DCO+
67
DCO–
66
D7+
65
D7–
64
DRVDD
63
DRGND
62
D6+
61
D6–
60
D5+
59
D5–
58
D4+
57
D4–
56
D3+
55
D3–
54
D2+
53
D2–
52
D1+
51
D1–
49
50
D0+
D0– (LSB)
05490-004
Rev. 0 | Page 10 of 36
AD9446
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Table 7. Pin Function Descriptions—100-Lead TQFP/EP in LVDS Mode
Pin No. Mnemonic Description
1 DCS MODE
2 DNC Do Not Connect. These pins should float. 3
4 DFS
5 LVDS_BIAS Set Pin for LVDS Output Current. Place 3.7 kΩ resistor terminated to DRGND. 6, 18 to 20, 32 to 34, 36, 38,
43 to 45, 92 to 97 7 SENSE
8 VREF
9, 21, 24, 39, 42, 46, 91, 98, 99, 100, Exposed Heat Sink
10 REFT
11 REFB
12 to 17, 25 to 31, 35, 37 AVDD2 5.0 V Analog Supply (±5%). 22 VIN+ Analog Input—True. 23 VIN− Analog Input—Complement. 40 CLK+ Clock Input—True. 41 CLK− Clock Input—Complement. 47, 63, 75, 87, DRGND Digital Output Ground. 48, 64, 76, 88 DRVDD 3.3 V Digital Output Supply (3.0 V to 3.6 V). 49 D0− (LSB) D0 Complement Output Bit (LVDS Levels). 50 D0+ D0 True Output Bit. 51 D1− D1 Complement Output Bit. 52 D1+ D1 True Output Bit. 53 D2− D2 Complement Output Bit. 54 D2+ D2 True Output Bit. 55 D3− D3 Complement Output Bit. 56 D3+ D3 True Output Bit. 57 D4− D4 Complement Output Bit. 58 D4+ D4 True Output Bit. 59 D5− D5 Complement Output Bit. 60 D5+ D5 True Output Bit. 61 D6− D6 Complement Output Bit. 62 D6+ D6 True Output Bit. 65 D7− D7 Complement Output Bit. 66 D7+ D7 True Output Bit. 67 DCO− Data Clock Output—Complement. 68 DCO+ Data Clock Output—True. 69 D8− D8 Complement Output Bit. 70 D8+ D8 True Output Bit. 71 D9− D9 Complement Output Bit. 72 D9+ D9 True Output Bit. 73 D10− D10 Complement Output Bit. 74 D10+ D10 True Output Bit. 77 D11− D11 Complement Output Bit. 78 D11+ D11 True Output Bit.
OUTPUT MODE
AVDD1 3.3 V (±5%) Analog Supply.
AGND
Clock Duty Cycle Stabilizer (DCS) Control Pin. CMOS compatible. DCS = low (AGND) to enable
ecommended); DCS = high (AVDD1) to disable DCS.
DCS (r
CMOS-Compatible Output Logic Mode Control Pin. OUTPUT MODE = 0 for CMOS mode; OUTPUT MODE
Data Format Select Pin. CMOS control pin that det high (AVDD1) for twos complement; DFS = low (ground) for offset binary format.
Reference Mode Selection. Connect to AGND for internal 1.6 V reference (3.2 V p-p analog
ange); connect to AVDD1 for external reference.
input r
1.6 V Reference I/O. Function dependent on SENSE and ex Decouple to ground with 0.1 µF and 10 µF capacitors.
Analog Ground. The exposed heat sink on the bottom of the package must be connected to AG
ND.
Differential Reference Output. Decoupled to ground with 0.1 µF with 0.1 µF and 10 µF capacitors.
Differential Reference Output. Decoupled to ground with a 0.1 µ (Pin 10) with 0.1 µF and 10 µF capacitors.
= 1 (AVDD1) for LVDS outputs.
ermines the format of the output data. DFS =
ternal programming resistors.
capacitor and to REFB (Pin 11)
F capacitor and to REFT
Rev. 0 | Page 11 of 36
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