78.3 dBFS SNR/92 dBFS SFDR with 30 MHz input (3.2 V p-p)
74.8 dBFS SNR/95 dBFS SFDR with 30 MHz input (2.0 V p-p)
77.0 dBFS SNR/87 dBFS SFDR with 170 MHz input (3.2 V p-p)
74.6 dBFS SNR/95 dBFS SFDR with 170 MHz input (2.0 V p-p)
73.0 dBFS SNR/88 dBFS SFDR with 300 MHz input (2.0 V p-p)
102 dBFS 2-tone SFDR with 30 MHz and 31 MHz
92 dBFS 2-tone SFDR with 170 MHz and 171 MHz
60 fsec rms jitter
Excellent linearity
DNL = ±0.25 LSB typical
INL = ±0.8 LSB typical
2.0 V p-p to 4.0 V p-p differential full-scale input
Buffered analog inputs
LVDS outputs (ANSI-644 compatible) or CMOS outputs
Data format select (offset binary or twos complement)
Output clock available
3.3 V and 5 V supply operation
APPLICATIONS
Multicarrier, multimode cellular receivers
Antenna array positioning
Power amplifier linearization
Broadband wireless
Radar
Infrared imaging
Medical imaging
Communications instrumentation
GENERAL DESCRIPTION
The AD9445 is a 14-bit, monolithic, sampling analog-to-digital
converter (ADC) with an on-chip IF sampling track-and-hold
circuit. It is optimized for performance, small size, and ease of
use. The product operates at up to a 125 MSPS conversion rate
and is designed for multicarrier, multimode receivers, such as
those found in cellular infrastructure equipment.
The ADC requires 3.3 V and 5.0 V power supplies and a low
voltage differential input clock for full performance operation.
No external reference or driver components are required for
many applications. Data outputs are CMOS or LVDS
compatible (ANSI-644 compatible) and include the means to
reduce the overall current needed for short trace distances.
AD9445
FUNCTIONAL BLOCK DIAGRAM
AGNDDRGND DRVDD
AVDD1 AVDD2
2
28
2
RF ENABLE
DFS
DCS MODE
OUTPUT MODE
OR
D13 TO D0
DCO
AD9445
VIN+
VIN–
CLK+
CLK–
BUFFER
CLOCK
AND TIMING
MANAGEMENT
T/H
PIPELINE
VREF
ADC
REF
Figure 1.
14
CMOS
OR
LVDS
OUTPUT
STAGING
REFBSENSE REFT
Optional features allow users to implement various selectable
operating conditions, including input range, data format select,
high IF sampling mode, and output data mode.
The AD9445 is available in a Pb-free, 100-lead, surface-mount,
plastic package (100-lead TQFP/EP) specified over the
industrial temperature range −40°C to +85°C.
PRODUCT HIGHLIGHTS
1. High performance: outstanding SFDR performance for IF
sampling applications such as multicarrier, multimode 3G,
and 4G cellular base station receivers.
2. Ease of use: on-chip reference and high input impedance
track-and-hold with adjustable analog input range and an
output clock simplifies data capture.
3. Packaged in a Pb-free, 100-lead TQFP/EP package.
performance over a wide range of clock pulse widths.
5. OR (out-of-range) outputs indicate when the signal is
beyond the selected input range.
6. RF enable pin allows users to configure the device for
optimum SFDR when sampling frequencies above 210 MHz
(AD9445-125) or 240 MHz (AD9445-105).
05489-001
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
AD9445BSVZ-105 AD9445BSVZ-125
Parameter Te mp Min Typ Max Min Typ Max Unit
RESOLUTION Full 14 14 Bits
ACCURACY
No Missing Codes Full Guaranteed Guaranteed
Offset Error Full −7 +7 −7 +7 mV
25°C ±3 ±3 mV
Gain Error Full −3 +3 −3 +3 % FSR
25°C −2 +2 −2 +2 % FSR
Differential Nonlinearity (DNL)
5 5
Integral Nonlinearity (INL)1 25°C ±0.65 ±0.8 LSB
Full −1.6 +1.6 −2 +2 LSB
VOLTAGE REFERENCE
Output Voltage VREF = 1.0 V Full 0.9 1.0 1.1 0.9 1.0 1.1 V
Load Regulation @ 1.0 mA Full ±2 ±2 mV
Reference Input Current (External VREF = 1.6 V) Full µA
INPUT REFERRED NOISE 25°C 1.0 1.0 LSB rms
ANALOG INPUT
Input Span
VREF = 1.6 V Full 3.2 3.2 V p-p
VREF = 1.0 V Full 2.0 2.0 V p-p
Internal Input Common-Mode Voltage Full 3.5 3.5 V
External Input Common-Mode Voltage Full 3.1
Input Resistance
Input Capacitance
2
2
POWER SUPPLIES
Supply Voltage
AVDD1 Full 3.14 3.3 3.46 3.14 3.3 3.46 V
AVDD2 Full 4.75 5.05.254.75 5.0 5.25 V
DRVDD—LVDS Outputs Full 3.0
DRVDD—CMOS Outputs Full 3.03.33.63.0 3.3 3.6 V
Supply Current
1
AVDD1 Full 335 364 384 424 mA
1, 3
AVDD2
1
I
—LVDS Outputs Full 6378 63 78 mA
DRVDD
1
I
—CMOS Outputs Full 14 14 mA
DRVDD
PSRR
Offset Full 1 1 mV/V
Gain Full 0.2 0.2 %/V
POWER CONSUMPTION
LVDS Outputs Full 2.22.4 2.3 2.6 W
CMOS Outputs (DC Input) Full 2.0 2.1 W
1
Measured at the maximum clock rate, fIN = 15 MHz, full-scale sine wave, with a 100 Ω differential termination on each pair of output bits for LVDS output mode and
approximately 5 pF loading on each output bit for CMOS output mode.
2
Input capacitance or resistance refers to the effective impedance between one differential input pin and AGND. Refer to Figure 6 for the equivalent analog input structure.
3
For RF ENABLE = AVDD1, I
AVDD2
1
Full −0.6 ±0.25 +0.65 −0.6 ±0.25 +0.65 LSB
Full 1 1 kΩ
Full 6 6 pF
Full 169196 172 199 mA
increases by ~30 mA, which increases power dissipation.
3.9 3.1 3.9 V
3.63.0 3.6 V
Rev. 0 | Page 3 of 40
AD9445
AC SPECIFICATIONS
AVDD1 = 3.3 V, AVDD2 = 5.0 V, DRVDD = 3.3 V, LVDS mode, specified minimum sample rate, 2.0 V p-p differential input, internal
trimmed reference (1.0 V mode), A
Table 2.
Parameter Temp
SIGNAL-TO-NOISE RATIO (SNR)
fIN = 10 MHz 25°C 74.3 74.1 dB
fIN = 30 MHz 25°C 73.3 74.3 72.9 73.8 dB
Full 73 72.5 dB
fIN = 170 MHz 25°C 72.9 73.6 72.3 73.2 dB
fIN = 225 MHz
1
Full 72.2 71.4 dB
fIN = 300 MHz
fIN = 400 MHz
fIN = 450 MHz
2
2
2
fIN = 10 MHz (3.2 V p-p Input) 25°C 77.6 77.3 dB
fIN = 30 MHz (3.2 V p-p Input) 25°C 77.5 77.3 dB
fIN = 170 MHz (3.2 V p-p Input) 25°C 76 76 dB
fIN = 225 MHz (3.2 V p-p Input)
fIN = 300 MHz (3.2 V p-p Input)
SIGNAL-TO-NOISE AND DISTORTION (SINAD)
fIN = 10 MHz 25°C 74.2 73.9 dB
fIN = 30 MHz 25°C 73.2 74.2 72.8 73.7 dB
Full 72.8 72.3 dB
fIN = 170 MHz 25°C 72.3 73.3 72.4 73.0 dB
fIN = 225 MHz
1
Full 71.3 70.7 dB
fIN = 300 MHz
fIN = 400 MHz
fIN = 450 MHz
2
2
2
fIN = 10 MHz (3.2 V p-p Input) 25°C 77.4 76.9 dB
fIN = 30 MHz (3.2 V p-p Input) 25°C 77.3 76.8 dB
fIN = 170 MHz (3.2 V p-p Input) 25°C 75.7 75.4 dB
fIN = 225 MHz (3.2 V p-p Input)
fIN = 300 MHz (3.2 V p-p Input)
EFFECTIVE NUMBER OF BITS (ENOB)
fIN = 10 MHz 25°C 12.2 12.2 Bits
fIN = 30 MHz 25°C 12.2 12.1 Bits
fIN = 170 MHz 25°C 12.1 12.0 Bits
fIN = 225 MHz
fIN = 300 MHz
fIN = 400 MHz
fIN = 450 MHz
(SFDR, Second or Third Harmonic)
fIN = 10 MHz 25°C 95 95 dBc
fIN = 30 MHz 25°C 84 92 85 94 dBc
Full 83 82 dBc
fIN = 170 MHz 25°C 82 94 80 91 dBc
fIN = 225 MHz
1
25°C 76 87 83 88
Full 75 75 dBc
fIN = 300 MHz
fIN = 400 MHz
fIN = 450 MHz
2
2
2
25°C 76 87 75 87 dBc
25°C 75 73 dBc
25°C 70 69 dBc
fIN = 10 MHz (3.2 V p-p Input) 25°C 92 92 dBc
fIN = 30 MHz (3.2 V p-p Input) 25°C 88 91 dBc
fIN = 170 MHz (3.2 V p-p Input) 25°C 86 86 dBc
fIN = 225 MHz (3.2 V p-p Input)
fIN = 300 MHz (3.2 V p-p Input)
WORST SPUR EXCLUDING SECOND OR
1
2
25°C 81 80 dBc
25°C 77 76 dBc
THIRD HARMONICS
fIN = 10 MHz 25°C −97 −97 dBc
fIN = 30 MHz 25°C −99 −90 −98 −89 dBc
Full −90 −88 dBc
fIN = 170 MHz 25°C −99 −92 −93 −85 dBc
fIN = 225 MHz
1
25°C −94 −88 −94 −84 dBc
Full −86 −80 dBc
fIN = 300 MHz
fIN = 400 MHz
fIN = 450 MHz
2
2
2
25°C −97 −90 −92 −82 dBc
25°C −93 −93 dBc
25°C −82 −87 dBc
fIN = 10 MHz (3.2 V p-p Input) 25°C −97 −95 dBc
fIN = 30 MHz (3.2 V p-p Input) 25°C −97 −95 dBc
fIN = 170 MHz (3.2 V p-p Input) 25°C −97 −95 dBc
fIN = 225 MHz (3.2 V p-p Input)
fIN = 300 MHz (3.2 V p-p Input)
1
2
25°C −95 −94 dBc
25°C −93 −91 dBc
TWO-TONE SFDR
fIN = 30.3 MHz @ −7 dBFS,
25°C 102 102 dBFS
31.3 MHz @ −7 dBFS
fIN = 170.3 MHz @ −7 dBFS,
25°C 92 91 dBFS
171.3 MHz @ −7 dBFS
ANALOG BANDWIDTH Full 615 615 MHz
1
RF ENABLE = low (AGND ) for AD9445-105; RF ENABLE = high (AVDD1) for AD9445-125.
2
RF ENABLE = high (AVDD1).
Min Typ Max Min Typ Max Unit
dBc
Rev. 0 | Page 5 of 40
AD9445
DIGITAL SPECIFICATIONS
AVDD1 = 3.3 V, AVDD2 = 5.0 V, DRVDD = 3.3 V, R
Table 3.
AD9445BSVZ-105 AD9445BSVZ-125
Parameter Te mp Min Typ Max Min Typ Max Unit
CMOS LOGIC INPUTS (DFS, DCS MODE, OUTPUT MODE)
High Level Input Voltage Full 2.0 2.0 V
Low Level Input Voltage Full 0.8 0.8 V
High Level Input Current Full
Low Level Input Current Full −10
Input Capacitance Full
DIGITAL OUTPUT BITS—CMOS MODE (D0 to D13, OTR)
DRVDD = 3.3 V
High Level Output Voltage Full 3.25
Low Level Output Voltage Full
DIGITAL OUTPUT BITS—LVDS MODE (D0 to D13, OTR)
VOD Differential Output Voltage
2
VOS Output Offset Voltage Full 1.125
CLOCK INPUTS (CLK+, CLK−)
Differential Input Voltage Full 0.2
Common-Mode Voltage Full 1.31.51.61.3 1.5 1.6 V
Differential Input Resistance Full 1.1 1.41.71.1 1.41.7kΩ
Differential Input Capacitance Full
1
Output voltage levels measured with 5 pF load on each output.
AD9445BSVZ-105 AD9445BSVZ-125
Parameter Te mp Min Typ Max Min Typ Max Unit
CLOCK INPUT PARAMETERS
Maximum Conversion Rate Full 105 125 MSPS
Minimum Conversion Rate Full 10 10 MSPS
CLK Period Full 9.5 8.0 ns
CLK Pulse Width High1 (t
CLK Pulse Width Low1 (t
DATA OUTPUT PARAMETERS
Output Propagation Delay—CMOS (tPD)2 (Dx, DCO+) Full 3.35 3.35 ns
Output Propagation Delay—LVDS (tPD)3 (Dx+), (t
Pipeline Delay (Latency) Full 13 13 Cycles
Aperture Delay (tA) Full
Aperture Uncertainty (Jitter, tJ) Full 60 60
1
With duty cycle stabilizer (DCS) enabled.
2
Output propagation delay is measured from clock 50% transition to data 50% transition with 5 pF load.
3
LVDS R
= 100 Ω. Measured from the 50% point of the rising edge of CLK+ to the 50% point of the data transition.
TERM
) Full 3.8 3.2 ns
CLKH
) Full 3.8
CLKL
)3 (DCO+) Full 2.1 3.6 4.8 2.3 3.6 4.8 ns
CPD
3.2 ns
ns
fsec
rms
Rev. 0 | Page 6 of 40
AD9445
TIMING DIAGRAMS
A
CLK+
CLK–
N–1
IN
t
CLKH
t
CLKL
N
N + 1
1/
f
S
t
PD
DATA OUT
DCO+
DCO–
VIN
CLK–
CLK+
DX
DCO+
DCO–
N–1
t
CLKH
N + 1
05489-002
t
CPD
N – 13
13 CLOCK CYCLES
N–12
N
Figure 2. LVDS Mode Timing Diagram
N
N + 1
t
CLKL
t
PD
N – 13N – 12N – 1N
N + 2
13 CLOCK CYCLES
05489-003
Figure 3. CMOS Timing Diagram
Rev. 0 | Page 7 of 40
AD9445
ABSOLUTE MAXIMUM RATINGS
Table 5.
With
Respect
Parameter
ELECTRICAL
AVDD1 AGND −0.3 V to +4 V
AVDD2 AGND −0.3 V to +6 V
DRVDD DGND −0.3 V to +4 V
AGND DGND −0.3 V to +0.3 V
AVDD1 DRVDD −4 V to +4 V
AVDD2 DRVDD −4 V to +6 V
AVDD2 AVDD1 −4 V to +6 V
D0± to D13± DGND –0.3 V to DRVDD + 0.3 V
CLK+/CLK− AGND –0.3 V to AVDD1 + 0.3 V
OUTPUT MODE, DCS
MODE, DFS, SFDR,
RF ENABLE
VIN+, VIN− AGND –0.3 V to AVDD2 + 0.3 V
VREF AGND –0.3 V to AVDD1 + 0.3 V
SENSE AGND –0.3 V to AVDD1 + 0.3 V
REFT, REFB AGND –0.3 V to AVDD1 + 0.3 V
ENVIRONMENTAL
Storage Temperature
Range
Operating Temperature
Range
Lead Temperature
(Soldering 10 sec)
Junction Temperature 150°C
To
AGND –0.3 V to AVDD1 + 0.3 V
–65°C to +125°C
–40°C to +85°C
300°C
Rating
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The heat sink of the AD9445 package must be soldered to ground.
Table 6.
Package Type θJA θ
100-lead TQFP/EP 19.8 8.3 2 °C/W
Typical θJA = 19.8°C/W (heat sink soldered) for multilayer
board in still air.
Typical θ
= 8.3°C/W (heat sink soldered) for multilayer board
JB
in still air.
Typical θ
= 2°C/W (junction to exposed heat sink) represents
JC
the thermal resistance through heat sink path.
Airflow increases heat dissipation, effectively reducing θ
more metal directly in contact with the package leads from
metal traces through holes, ground, and power planes reduces
the θ
. It is required that the exposed heat sink be soldered to
JA
the ground plane.
θJC Unit
JB
. Also,
JA
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. 0 | Page 8 of 40
AD9445
TERMINOLOGY
Analog Bandwidth (Full Power Bandwidth) Minimum Conversion Rate
The analog input frequency at which the spectral power of the
fundamental frequency (as determined by the FFT analysis) is
reduced by 3 dB.
The clock rate at which the SNR of the lowest analog signal
frequency drops by no more than 3 dB below the guaranteed
limit.
Aperture Delay (t
) Offset Error
A
The delay between the 50% point of the rising edge of the clock
and the instant at which the analog input is sampled.
Aperture Uncertainty (Jitter, t
)
J
The sample-to-sample variation in aperture delay.
Clock Pulse Width and Duty Cycle
Pulse width high is the minimum amount of time that the
clock pulse should be left in the Logic 1 state to achieve rated
performance. Pulse width low is the minimum time the clock
pulse should be left in the low state. At a given clock rate, these
specifications define an acceptable clock duty cycle.
Differential Nonlinearity (DNL, No Missing Codes)
An ideal ADC exhibits code transitions that are exactly 1 LSB
apart. DNL is the deviation from this ideal value. Guaranteed
no missing codes to 14-bit resolution indicates that all 16,384
codes must be present over all operating ranges.
Effective Number of Bits (ENOB)
The effective number of bits for a sine wave input at a given
input frequency can be calculated directly from its measured
SINAD using the following formula:
ENOB
()
SINAD
=
6.02
1.76−
Gain Error
The first code transition should occur at an analog value of
½ LSB above negative full scale. The last transition should occur
at an analog value of 1½ LSB below the positive full scale. Gain
error is the deviation of the actual difference between first and
last code transitions and the ideal difference between first and
last code transitions.
Integral Nonlinearity (INL)
The deviation of each individual code from a line drawn from
negative full scale through positive full scale. The point used as
negative full scale occurs ½ LSB before the first code transition.
Positive full scale is defined as a level 1½ LSB beyond the last
code transition. The deviation is measured from the middle of
each particular code to the true straight line.
Maximum Conversion Rate
The clock rate at which parametric testing is performed.
The major carry transition should occur for an analog value of
½ LSB below VIN+ = VIN−. Offset error is defined as the
deviation of the actual transition from that point.
Out-of-Range Recovery Time
The time it takes for the ADC to reacquire the analog input
after a transition from 10% above positive full scale to 10%
above negative full scale, or from 10% below negative full scale
to 10% below positive full scale.
Output Propagation Delay (tPD)
The delay between the clock rising edge and the time when all
bits are within valid logic levels.
Power-Supply Rejection Ratio
The change in full scale from the value with the supply at the
minimum limit to the value with the supply at the maximum
limit.
Signal-to-Noise and Distortion (SINAD)
The ratio of the rms input signal amplitude to the rms value of
the sum of all other spectral components below the Nyquist
frequency, including harmonics but excluding dc.
Signal-to-Noise Ratio (SNR)
The ratio of the rms input signal amplitude to the rms value of
the sum of all other spectral components below the Nyquist
frequency, excluding the first six harmonics and dc.
Spurious-Free Dynamic Range (SFDR)
The ratio of the rms signal amplitude to the rms value of the
peak spurious spectral component. The peak spurious component
may be a harmonic. SFDR can be reported in dBc (that is, degrades
as signal level is lowered) or dBFS (always related back to converter
full scale).
Tem p er at u re Dr i ft
The temperature drift for offset error and gain error specifies
the maximum change from the initial (25°C) value to the value
at T
MIN
or T
MAX
.
Total Harmonic Distortion (THD)
The ratio of the rms input signal amplitude to the rms value of
the sum of the first six harmonic components.
Two -Tone SFDR
The ratio of the rms value of either input tone to the rms value
of the peak spurious component. The peak spurious component
may or may not be an IMD product.
Clock Duty Cycle Stabilizer (DCS) Control Pin. CMOS compatible. DCS = low (AGND) to
enable DCS (recommended); DCS = high (AVDD1) to disable DCS.
CMOS-Compatible Output Logic Mode Control Pin. OUTPUT MODE = 0 for CMOS mode;
OUTPUT MODE = 1 (AVDD1) for LVDS outputs.
Data Format Select Pin. CMOS control pin that determines the format of the output data.
DFS = high (AVDD1) for twos complement; DFS = low (ground) for offset binary format.
Reference Mode Selection. Connect to AGND for internal 1 V reference; connect to
AVDD1 for external reference.
1.0 V Reference I/O. Function dependent on SENSE and external programming resistors.
Decouple to ground with 0.1 µF and 10 µF capacitors.
Analog Ground. The exposed heat sink on the bottom of the package must be
connected to AGND.
Differential Reference Output. Decoupled to ground with 0.1 µF capacitor and to REFB
(Pin 14) with 0.1 µF and 10 µF capacitors.
Differential Reference Output. Decoupled to ground with a 0.1 µF capacitor and to REFT
(Pin 13) with 0.1 µF and 10 µF capacitors.
RF ENABLE Control Pin. CMOS-compatible control pin to optimize the configuration of
the AD9445 analog front end. Connecting RF ENABLE to AGND optimizes SFDR
performance for applications with analog input frequencies <210 MHz for 125 MSPS
speed grade and <230 MHz for the 105 MSPS speed grade. For applications with analog
inputs >225 MHz for the 125 MSPS speed grade and >230 MHz for the 105 MSPS speed
grade, this pin should be connected to AVDD1 for optimum SFDR performance. Power
dissipation from AVDD2 increases by 150 mW to 200 mW.
Clock Duty Cycle Stabilizer (DCS) Control Pin. CMOS compatible. DCS = low (AGND) to enable
DCS (recommended); DCS = high (AVDD1) to disable DCS.
CMOS-Compatible Output Logic Mode Control Pin. OUTPUT MODE = 0 for CMOS mode;
OUTPUT MODE = 1 (AVDD1) for LVDS outputs.
Data Format Select Pin. CMOS control pin that determines the format of the output data.
DFS = high (AVDD1) for twos complement; DFS = low (ground) for offset binary format.
Reference Mode Selection. Connect to AGND for internal 1 V reference; connect to AVDD1 for
external reference.
1.0 V Reference I/O. Function dependent on SENSE and external programming resistors.
Decouple to ground with 0.1 µF and 10 µF capacitors.
Analog Ground. The exposed heat sink on the bottom of the package must be connected to
AGND.
Differential Reference Output. Decoupled to ground with 0.1 µF capacitor and to REFB
(Pin 14) with 0.1 µF and 10 µF capacitors.
Differential Reference Output. Decoupled to ground with a 0.1 µF capacitor and to REFT
(Pin 13) with 0.1 µF and 10 µF capacitors.
RF ENABLE CMOS-compatible Control Pin. Optimizes the configuration of the analog front end.
Connecting RF ENABLE to AGND optimizes SFDR performance for applications with analog input
frequencies <210 MHz for 125 MSPS speed grade and <230 MHz for the 105 MSPS speed grade.
For applications with analog inputs >225 MHz for the 125 MSPS speed grade and >230 MHz
for the 105 MSPS speed grade, this pin should be connected to AVDD1 for optimum SFDR.
Power dissipation from AVDD2 increases by 150 mW to 200 mW.
Figure 52. AD9445-105 Power Supply Current vs. Sample Rate
10.3 MHz @ −1 dBFS
78
(dB)
77
76
75
74
73
72
71
2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0
1.8
ANALOG INPUT RANGE (V p-p)
170.3MHz SNR dB
225.3MHz SNR dB
300.3MHz SNR dB
4.2
05489-067
Figure 53. AD9445-125 SNR vs. Analog Input Range, 125 MSPS/170.3 MHz,
225.3 MHz, 300.3 MHz
Rev. 0 | Page 22 of 40
AD9445
78
95
(dB)
77
76
75
74
73
72
71
1.8
ANALOG INPUT RANGE (V p-p)
170.3MHz SFDR dBc
225.3MHz SFDR dBc
300.3MHz SFDR dBc
Figure 54. AD9445-105 SNR vs. Analog Input Range,
105 MSPS/170.3 MHz, 225.3 MHz, 300.3 MHz
400
350
(mA)
SUPPLY
I
300
250
200
150
100
AVDD1
AVDD2
DRVDD
50
0
20406080100120140
0
SAMPLE RATE (MSPS)
Figure 55. AD9445-125 Power Supply Current vs. Sample Rate
10.3 MHz @ −1 dBFS
90
170.3MHz SFDR dBc
85
(dB)
80
75
05489-068
4.22.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0
70
1.8
ANALOG INPUT RANGE (V p-p)
225.3MHz SFDR dBc
300.3MHz SFDR dBc
Figure 57. AD9445-105 SFDR vs. Analog Input Range,
105 MSPS/170.3 MHz, 225.3 MHz, 300.3 MHz
81
80
79
78
(dB)
77
76
75
160
05489-069
74
105M SNR dBFS
125M SNR dBFS
2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0
1.84.2
ANALOG INPUT RANGE (V p-p)
Figure 58. SNR vs. Analog Input Range, 2.3 MHz @ −30 dBFS
05489-071
4.22.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0
05489-039
95
(dB)
90
85
80
75
70
1.8
ANALOG INPUT RANGE (V p-p)
170.3MHz SFDR dBc
225.3MHz SFDR dBc
300.3MHz SFDR dBc
05489-070
4.22.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0
Figure 56. AD9445-125 SFDR vs. Analog Input Range, 125 MSPS/170.3 MHz,
225.3 MHz, 300.3 MHz
Rev. 0 | Page 23 of 40
AD9445
THEORY OF OPERATION
The AD9445 architecture is optimized for high speed and ease
of use. The analog inputs drive an integrated, high bandwidth
track-and-hold circuit that samples the signal prior to quantization
by the 14-bit pipeline ADC core. The device includes an on-board
reference and input logic that accepts TTL, CMOS, or LVPECL
levels. The digital output logic levels are user selectable as standard
3 V CMOS or LVDS (ANSI-644 compatible) via the OUTPUT
MODE pin.
ANALOG INPUT AND REFERENCE OVERVIEW
A stable and accurate 0.5 V band gap voltage reference is built
into the AD9445. The input range can be adjusted by varying
the reference voltage applied to the AD9445, using either the
internal reference or an externally applied reference voltage.
The input span of the ADC tracks reference voltage changes
linearly.
Internal Reference Connection
A comparator within the AD9445 detects the potential at the
SENSE pin and configures the reference into three possible states,
which are summarized in
reference amplifier switch is connected to the internal resistor
divider (see
Figure 59), setting VREFto ~1.0 V. Connecting the
SENSE pin to VREF switches the reference amplifier output to
the SENSE pin, completing the loop and providing a ~1.0 V
reference output. If a resistor divider is connected as shown in
Figure 60, the switch again sets to the SENSE pin. This puts the
reference amplifier in a noninverting mode with the VREF
output defined as
VVREF15.0
In all reference configurations, REFT and REFB drive the
analog-to-digital conversion core and establish its input span.
The input range of the ADC always equals twice the voltage at
the reference pin for either an internal or an external reference.
Internal Reference Trim
The internal reference voltage is trimmed during the production
test to adjust the gain (analog input voltage range) of the AD9445.
Therefore, there is little advantage to the user supplying an external
voltage reference to the AD9445. The gain trim is performed
with the AD9445 input range set to 2.0 V p-p nominal (SENSE
Table 9. Reference Configuration Summary
Selected Mode SENSE Voltage Resulting VREF (V) Resulting Differential Span (V p-p)
External Reference AVDD1 N/A 2 × external reference
Programmable Reference 0.2 V to VREF
Internal Fixed Reference AGND to 0.2 V 1.0 2.0
Tabl e 9 . If SENSE is grounded, the
R2
⎞
⎛
+×=
⎟
⎜
R1
⎠
⎝
R2
⎛
+×
10.5
⎜
R1
⎝
connected to AGND). Because of this trim and the maximum ac
performance provided by the 2.0 V p-p analog input range, there
is little benefit to using analog input ranges <2 V p-p. Users are
cautioned that the differential nonlinearity of the ADC varies
with the reference voltage. Configurations that use <2.0 V p-p
may exhibit missing codes and, therefore, degraded noise and
distortion performance.
VIN+
10μF+0.1μF
10μF+0.1μF
⎞
(See Figure 60)
⎟
⎠
VIN–
ADC
CORE
VREF
SELECT
LOGIC
SENSE
0.5V
AD9445
Figure 59. Internal Reference Configuration
VIN+
VIN–
VREF
R2
SENSE
R1
Figure 60. Programmable Reference Configuration
SELECT
LOGIC
0.5V
AD9445
2 × VREF
ADC
CORE
REFT
0.1μF
0.1μF10μF
REFB
0.1μF
REFT
0.1μF
0.1μF10μF
REFB
0.1μF
+
05489-054
+
05489-055
Rev. 0 | Page 24 of 40
AD9445
External Reference Operation
The AD9445’s internal reference is trimmed to enhance the gain
accuracy of the ADC. An external reference may be more stable
over temperature, but the gain of the ADC is not likely to improve.
Figure 49 shows the typical drift characteristics of the internal
reference in both 1 V and 0.5 V modes.
1V p-p
VIN+
3.5V
When the SENSE pin is tied to AVDD, the internal reference is
disabled, allowing the use of an external reference. An internal
reference buffer loads the external reference with an equivalent
7 kΩ load. The internal buffer still generates the positive and
negative full-scale references, REFT and REFB, for the ADC
core. The input span is always twice the value of the reference
voltage; therefore, the external reference must be limited to a
maximum of 1.6 V.
Analog Inputs
As with most new high speed, high dynamic range ADCs, the
analog input to the AD9445 is differential. Differential inputs
improve on-chip performance because signals are processed
through attenuation and gain stages. Most of the improvement
is a result of differential analog stages having high rejection of
even-order harmonics. There are also benefits at the PCB level.
First, differential inputs have high common-mode rejection of
stray signals, such as ground and power noise. Second, they
provide good rejection of common-mode signals, such as local
oscillator feedthrough. The specified noise and distortion of the
AD9445 cannot be realized with a single-ended analog input, so
such configurations are discouraged. Contact sales for
recommendations of other 14-bit ADCs that support singleended analog input configurations.
With the 1 V reference, which is the nominal value (see the
Internal Reference Trim section), the differential input range of
the AD9445 analog input is nominally 2.0 V p-p or 1.0 V p-p on
each input (VIN+ or VIN−).
The AD9445 analog input voltage range is offset from ground
by 3.5 V. Each analog input connects through a 1 kΩ resistor to
the 3.5 V bias voltage and to the input of a differential buffer.
The internal bias network on the input properly biases the
buffer for maximum linearity and range (see the
Circuits
section).
Equivalent
VIN–
DIGITAL OUT = ALL 1sDIGITAL OUT = ALL 0s
Figure 61. Differential Analog Input Range for VREF = 1.0 V
Therefore, the analog source driving the AD9445 should be accoupled to the input pins. The recommended method for driving
the analog input of the AD9445 is to use an RF transformer to
convert single-ended signals to differential (see
Figure 62).
Series resistors between the output of the transformer and the
AD9445 analog inputs help isolate the analog input source from
switching transients caused by the internal sample-and-hold
circuit. The series resistors, along with the 1 kΩ resisters connected
to the internal 3.5 V bias, must be considered in impedance
matching the transformer input. For example, if R
51 Ω, R
is set to 33 Ω, and there is a 1:1 impedance ratio trans-
S
is set to
T
former, the input will match a 50 Ω source with a full-scale drive
of 10.0 dBm. The 50 Ω impedance matching can also be incorporated on the secondary side of the transformer, as shown in
0.1
μF
Figure 67).
R
S
VIN+
AD9445
R
S
VIN–
05489-057
the evaluation board schematic (see
R
T
ADT1–1WT
ANALOG
INPUT
SIGNAL
Figure 62. Transformer-Coupled Analog Input Circuit
High IF Applications
In applications where the analog input frequency range is
>100 MHz, the phase and amplitude matching at the analog
inputs becomes critical to optimize performance of the ADC.
The circuit in
Figure 63 can be used to optimize the matching of
these parameters. This configuration uses a double balun configuration that has low parasitics, high bandwidth, and parasitic
cancellation.
ETC1–1–13ETC1–1–13
33
Ω
VIN+
AD9445
33
Ω
μF
VIN–
50
SOURCE
25
Ω
CT
Ω
Figure 63. Double Balun-Coupled Analog Input Circuit
0.1μF
25
0.1
Ω
05489-056
05489-058
Rev. 0 | Page 25 of 40
AD9445
CLOCK INPUT CONSIDERATIONS
Any high speed ADC is extremely sensitive to the quality of the
sampling clock provided by the user. A track-and-hold circuit is
essentially a mixer, and any noise, distortion, or timing jitter on
the clock is combined with the desired signal at the analog-todigital output. For that reason, considerable care was taken in
the design of the clock inputs of the AD9445, and the user is
advised to give careful thought to the clock source.
Typical high speed ADCs use both clock edges to generate a
variety of internal timing signals and, as a result, may be
sensitive to the clock duty cycle. Commonly a 5% tolerance is
required on the clock duty cycle to maintain dynamic
performance characteristics. The AD9445 contains a clock duty
cycle stabilizer (DCS) that retimes the nonsampling edge,
providing an internal clock signal with a nominal 50% duty
cycle. Noise and distortion performance are nearly flat for a
30% to 70% duty cycle with the DCS enabled. The DCS circuit
locks to the rising edge of CLK+ and optimizes timing
internally. This allows for a wide range of input duty cycles at
the input without degrading performance. Jitter in the rising
edge of the input is still of paramount concern and is not
reduced by the internal stabilization circuit. The duty cycle
control loop does not function for clock rates of less than
30 MHz nominally. The loop is associated with a time constant
that should be considered in applications where the clock rate
can change dynamically, requiring a wait time of 1.5 μs to 5 μs
after a dynamic clock frequency increase or decrease before the
DCS loop is relocked to the input signal. During the time that
the loop is not locked, the DCS loop is bypassed, and the internal
device timing is dependent on the duty cycle of the input clock
signal. In such an application, it may be appropriate to disable
the duty cycle stabilizer. In all other applications, enabling the
DCS circuit is recommended to maximize ac performance.
The DCS circuit is controlled by the DCS MODE pin; a CMOS
logic low (AGND) on DCS MODE enables the duty cycle
stabilizer, and logic high (AVDD1 = 3.3 V) disables the
controller.
The AD9445 input sample clock signal must be a high quality,
extremely low phase noise source to prevent degradation of
performance. Maintaining 14-bit accuracy places a premium on
the encode clock phase noise. SNR performance can easily
degrade by 3 dB to 4 dB with 70 MHz analog input signals
when using a high jitter clock source. (See the
Application Note
Performance
, Aperture Uncertainty and ADC System
.) For optimum performance, the AD9445 must be
clocked differentially. The sample clock inputs are internally
biased to ~2.2 V, and the input signal is usually ac-coupled into
the CLK+ and CLK− pins via a transformer or capacitors.
Figure 64 shows one preferred method for clocking the
AD9445. The clock source (low jitter) is converted from singleended to differential using an RF transformer. The back-to-back
AN-501
Schottky diodes across the secondary of the transformer limit
clock excursions into the AD9445 to approximately 0.8 V p-p
differential. This helps prevent the large voltage swings of the
clock from feeding through to other portions of the AD9445
and limits the noise presented to the sample clock inputs.
If a low jitter clock is available, it may help to band-pass filter
the clock reference before driving the ADC clock inputs.
Another option is to ac couple a differential ECL/PECL signal
to the encode input pins, as shown in Figure 65.
High speed, high resolution ADCs are sensitive to the quality
of the clock input. The degradation in SNR at a given input
f
frequency (
t
) can be calculated using the following equation:
(
J
SNR = 20 log[2πf
) and rms amplitude due only to aperture jitter
INPUT
× tJ]
INPUT
In the equation, the rms aperture jitter represents the rootmean-square of all jitter sources, which includes the clock
input, analog input signal, and ADC aperture jitter
specification. IF undersampling applications are particularly
sensitive to jitter, see
Figure 66.
The clock input should be treated as an analog signal in cases
where aperture jitter may affect the dynamic range of the
AD9445. Power supplies for clock drivers should be separated
from the ADC output driver supplies to avoid modulating the
clock signal with digital noise. Low jitter crystal-controlled
oscillators make the best clock sources. If the clock is generated
from another type of source (by gating, dividing, or another
method), it should be synchronized by the original clock during
the last step.
Rev. 0 | Page 26 of 40
AD9445
75
70
65
60
55
SNR (dBc)
50
45
40
1
Figure 66. SNR vs. Input Frequency and Jitter
INPUT FREQUENCY (MHz)
0.2ps
0.5ps
1.0ps
1.5ps
2.0ps
2.5ps
3.0ps
100010010
05489-061
POWER CONSIDERATIONS
Care should be taken when selecting a power source. The use of
linear dc supplies is highly recommended. Switching supplies
tend to have radiated components that may be received by the
AD9445. Each of the power supply pins should be decoupled as
closely to the package as possible using 0.1 μF chip capacitors.
The AD9445 has separate digital and analog power supply pins.
The analog supplies are denoted AVDD1 (3.3 V) and AVDD2
(5 V), and the digital supply pins are denoted DRVDD. Although
the AVDD1 and DRVDD supplies can be tied together, best
performance is achieved when the supplies are separate. This is
because the fast digital output swings can couple switching
current back into the analog supplies. Note that both AVDD1
and AVDD2 must be held within 5% of the specified voltage.
The DRVDD supply of the AD9445 is a dedicated supply for the
digital outputs in either LVDS or CMOS output mode. When in
LVDS mode, the DRVDD should be set to 3.3 V. In CMOS
mode, the DRVDD supply can be connected from 2.5 V to
3.6 V for compatibility with the receiving logic.
DIGITAL OUTPUTS
LVDS Mode
The off-chip drivers on the chip can be configured to provide
LVDS-compatible output levels via Pin 3 (OUTPUT MODE).
LVDS outputs are available when OUTPUT MODE is CMOS
logic high (or AVDD1 for convenience) and a 3.74 kΩ R
SET
resistor is placed at Pin 5 (LVDS_BIAS) to ground. Dynamic
performance, including both SFDR and SNR, is maximized
when the AD9445 is used in LVDS mode; designers are
encouraged to take advantage of this mode. The AD9445
outputs include complimentary LVDS outputs for each data bit
(Dx+/Dx−), the overrange output (OR+/OR−), and the output
data clock output (DCO+/DCO−). The R
resistor current is
SET
multiplied on-chip, setting the output current at each output
equal to a nominal 3.5 mA (11 × I
). A 100 Ω differential
R
SET
termination resistor placed at the LVDS receiver inputs results
in a nominal 350 mV swing at the receiver. LVDS mode
facilitates interfacing with LVDS receivers in custom ASICs and
FPGAs that have LVDS capability for superior switching
performance in noisy environments. Single point-to-point net
topologies are recommended, with a 100 Ω termination resistor
placed as close to the receiver as possible. It is recommended to
keep the trace length less than 2 inches and to keep differential
output trace lengths as equal as possible.
CMOS Mode
In applications that can tolerate a slight degradation in dynamic
performance, the AD9445 output drivers can be configured to
interface with 2.5 V or 3.3 V logic families by matching
DRVDD to the digital supply of the interfaced logic. CMOS
outputs are available when OUTPUT MODE is CMOS logic
low (or AGND for convenience). In this mode, the output data
bits, Dx, are single-ended CMOS, as is the overrange output,
OR. The output clock is provided as a differential CMOS signal,
DCO+/DCO−. Lower supply voltages are recommended to
avoid coupling switching transients back to the sensitive analog
sections of the ADC. The capacitive load to the CMOS outputs
should be minimized, and each output should be connected to a
single gate through a series resistor (220 Ω) to minimize
switching transients caused by the capacitive loading.
TIMING
The AD9445 provides latched data outputs with a pipeline delay
of 13 clock cycles. Data outputs are available one propagation
delay (t
) after the rising edge of CLK+. Refer to
PD
Figure 3 for detailed timing diagrams.
Figure 2 and
Rev. 0 | Page 27 of 40
AD9445
OPERATIONAL MODE SELECTION
Data Format Select
The data format select (DFS) pin of the AD9445 determines
the coding format of the output data. This pin is 3.3 V CMOScompatible, with logic high (or AVDD1, 3.3 V) selecting twos
complement and DFS logic low (AGND) selecting offset binary
Tabl e 1 0 summarizes the output coding.
format.
Output Mode Select
The OUPUT MODE pin controls the logic compatibility, as well
as the pinout of the digital outputs. This pin is a CMOS-compatible
input. With OUTPUT MODE = 0 (AGND), the AD9445 outputs
are CMOS compatible, and the pin assignment for the device is
as defined in
V), the AD9445 outputs are LVDS compatible, and the pin
assignment for the device is as defined in
Duty Cycle Stabilizer
The DCS circuit is controlled by the DCS MODE pin; a CMOS
logic low (AGND) on DCS MODE enables the DCS, and logic
high (AVDD1, 3.3 V) disables the controller.
The RF ENABLE pin is a CMOS-compatible control pin that
optimizes the configuration of the AD9445 analog front end.
The crossover analog input frequency for determining the
RF ENABLE connection differs for the 105 MSPS and 125 MSPS
speed grades. For the 125 MSPS speed grade, connecting the
RF ENABLE to AGND optimizes SFDR performance for applications with analog input frequencies <210 MHz. For applications
with analog inputs >210 MHz, this pin should be connected to
AVDD1 for optimum SFDR performance. Connecting this pin to
AVDD1 reconfigures the ADC, thereby improving high IF and RF
spurious performance. Operating in this mode increases power dissipation from AVDD2 by 150 mW to 200 mW. For the 105 MSPS
speed grade, connecting RF ENABLE to AGND optimizes SFDR
performance for applications with analog input frequencies
<230 MHz. For applications with analog inputs >230 MHz, this
pin should be connected to AVDD1 to optimize performance.
Digital Output
Offset Binary (D13••••••D0)
Digital Output
Twos Complement (D13••••••D0)
Rev. 0 | Page 28 of 40
AD9445
EVALUATION BOARD
Evaluation boards are offered to configure the AD9445 in
either CMOS or LVDS mode only. This design represents a
recommended configuration for using the device over a wide
range of sampling rates and analog input frequencies. These
evaluation boards provide all the support circuitry required to
operate the ADC in its various modes and configurations.
Complete schematics are shown in
Gerber files are available from engineering applications demonstrating the proper routing and grounding techniques that should
be applied at the system level.
Figure 67 through Figure 70.
The LVDS mode evaluation boards include an LVDS-to-CMOS
translator, making them compatible with the high speed ADC
FIFO evaluation kit (HSC-ADC-EVALA-SC). The kit includes a
high speed data capture board that provides a hardware solution
for capturing up to 32 kB samples of high speed ADC output
data in a FIFO memory chip (user upgradeable to 256 kB
samples). Software is provided to enable the user to download
the captured data to a PC via the USB port. This software also
includes a behavioral model of the AD9445 and many other
high speed ADCs.
It is critical that signal sources with very low phase noise
(<60 fsec rms jitter) be used to realize the ultimate performance
of the converter. Proper filtering of the input signal to remove
harmonics and lower the integrated noise at the input is also
necessary to achieve the specified noise performance.
The evaluation boards are shipped with a 115 V ac to 6 V dc
power supply. The evaluation boards include low dropout
regulators to generate the various dc supplies required by the
AD9445 and its support circuitry. Separate power supplies are
provided to isolate the DUT from the support circuitry. Each
input configuration can be selected by proper connection of
various jumpers (see
Figure 67).
Behavioral modeling of the AD9445 is also available at
www.analog.com/ADIsimADC. The ADIsimADC™ software
supports virtual ADC evaluation using ADI proprietary behavioral
modeling technology. This allows rapid comparison between
the AD9445 and other high speed ADCs with or without
hardware evaluation boards.
The user can choose to remove the translator and terminations
to access the LVDS outputs directly.
Capacitor 805 10 F Digi-Key Corporation 409-1717-1-ND
Header EHOLE Mouser Electronics 517-6111TG
SMA SMA Digi-Key Corporation ARFX1231-ND
Header C40MS Samtec, Inc. TSW-120-08-L-D-RA
BRES402 402 XX
BRES402 402 XX
ECLOSC DIP4(14)
MTHOLE6 MTHOLE6
Resistor 402 36 Digi-Key Corporation P36JCT-ND
Transformer ADT1-1WT Mini-Circuits ADT1-1WT
Term strip PTMICRO4 Newark Electronics
Rev. 0 | Page 36 of 40
AD9445
OUTLINE DIMENSIONS
0.75
0.60
0.45
1.20
MAX
16.00 BSC SQ
1
PIN 1
14.00 BSC SQ
76100
76100
75
75
1
1.05
1.00
0.95
0.15
SEATING
0.05
PLANE
VIEW A
ROTATED 90° CCW
BOTTO M V IEW
0.50 BSC
LEAD PITCH
EXPOSED
PAD
(PINS UP)
0.27
0.22
0.17
TOP VIEW
(PINS DOWN)
0° MIN
0.20
0.09
7°
3.5°
0°
0.08 MAX
COPLANARITY
NOTES
1. CENTER FIGURES ARE TY P ICAL UNLESS O THERWISE NOTED.
2. THE PACKAGE HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEATAND ENSURE RELIABLE OPE RATION OF
THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EX P OSED ON THE BO TTOM OF
THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT I S RE COMMENDED THAT NO PCB SIGNAL
TRACES OR VI AS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE
SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE
DEVICE WHI CH MAY BE BENEFICIAL IN HIGH TEMPE RATURE ENVIRONM E NTS.
25
2649
VIEW A
COMPLIANT TO JEDEC STANDARDS MS-026-AE D- HD
50
51
9.50 SQ
25
2650
Figure 71. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
(SV-100-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model Temperature Range Package Description Package Option
AD9445BSVZ-125–40°C to +85°C 100-Lead TQFP_EP SV-100-3
AD9445BSVZ-105–40°C to +85°C 100-Lead TQFP_EP SV-100-3
AD9445-IF-LVDS/PCB AD9445-125 IF (>100 MHz) LVDS Mode Evaluation Board
AD9445-BB-LVDS/PCB AD9445-125 Baseband (<100 MHz) LVDS Mode Evaluation Board