Analog Devices AD9430-PCB-CMOS, AD9430BSV-170 Datasheet

PRELIMINARY TECHNICAL DATA
range
REV. PrG 4/01/2002
Information furnished by Analog Devices is believed to be accurate and reliable.However,no responsibility is assumed by Analog Devices for its use,nor for any infringements of patents or other rights of third parties that may result from its use.No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
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a
12-Bit, 170 MSPS
3.3V A/D Converter
Preliminary Technical Data AD9430
FEATURES SNR = 65dB @ Fin up to 65MHz at 170Msps ENOB of 10.3 @ Fin up to 65MHz at 170 Msps SFDR = -80dBc @ Fin up to 65MHz at 170Msps
(-1dBFs)
(-1dBFs)
Excellent Linearity:
- DNL = +/- 1 lsb (typ)
- INL = +/- 1.5 lsb (typ) Two Output Data options
- Demultiplexed 3.3V CMOS outputs each at 85 Msps
- LVDS at 170Msps 700 MHz Full Power Analog Bandwidth On–chip reference and track/hold Power dissipation = 1.25W typical at 170Msps
1.5V Input voltage range +3.3V Supply Operation Output data format option Data Sync input and Data Clock output provided Interleaved or parallel data output option (CMOS) Clock Duty Cycle Stabilizer.
APPLICATIONS Wireless and Wired Broadband Communications
- Wideband carrier frequency systems
- Cable Reverse Path Communications Test Equipment Radar and Satellite sub-systems Power Amplifier Linearization

PRODUCT DESCRIPTION

The AD9430 is a 12-bit monolithic sampling analog–to– digital converter with an on–chip track–and–hold circuit and is optimized for low cost, low power, small size and ease of use. The product operates up to 170 Msps conversion rate and is optimized for outstanding dynamic performance in wideband carrier systems.
The ADC requires a +3.3V power supply and a differential encode clock for full performance operation. No external reference or driver components are required for many applications. The digital outputs are TTL/CMOS or LVDS compatible. Separate output power supply pins support interfacing with 3.3V CMOS logic.
An output data format select option of two’s complement or offset binary is supported. In CMOS mode two output buses support demultiplexed data up to 85 Msps rates. A data sync input is supported for proper output data port alignment and a data clock output is available for proper output data timing.
Fabricated on an advanced BiCMOS process, the AD9430 is available in a 100 pin surface mount plastic package (100 TQFP ePAD) specified over the industrial temperature (–40°C to +85°C).
AD9430
DS+
ENC+
ENC-
AIN+
AIN-
DS-
Management
Track &
Clock
S1 S5

AD9430 FUNCTIONAL BLOCK DIAGRAM

Hold
S2
SENSE
Scaleable Reference
VREF
ADC
12-bit
Pipeline
Core
AGND
S4
DrGND
Outputs
12
Outputs
Select CMOS or LVDS
DrVDDAV
LVDS
CMOS
DD
A port
B port
Data(24), OR(2)
Data(12), OR(1)
Data(12), OR(1)
DCO+
DCO-
PRELIMINARY TECHNICAL DATA
AD9430
AIN
AIN
ENC
DC SPECIFICATIONS (AV
reference, LVDS Output Mode)
Parameter
= DrVDD = 3.3V; T
DD
Temp
Test
Level
= -40°C, T
MIN
= +85°C, Fin = -0.5dBFS, 1.235V External
MAX
AD9430BSV-170
Min Typ Max Units
RESOLUTION 12 Bits
ACCURACY
No Missing Codes
Offset Error
Gain Error
Differential Nonlinearity (DNL)
Integral Nonlinearity (INL)
TEMPERATURE DRIFT
Offset Error
Gain Error
Full
25°C 25°C 25°C 25°C
Full Full
POWER SUPPLY REJECTION Full V
REFERENCE OUT (V
ANALOG INPUTS (AIN,
Input Voltage Range (AIN–
Input Common Mode Voltage
Input Resistance
Input Capacitance
POWER SUPPLY
Supply Voltages
AV
DD
DrVDD
Supply Current
I
I
DIGITAL
(AVDD= 3.3V)
ANALOG
(DrVDD = 3.3V)2
) Full V 1.235 V
REF
)
)1
Full Full Full Full
Full Full
2
Full Full
V V
V V V V
V V
V V
I I I I I
3.0 3.3 3.6
3.0 3.3 3.6
Guaranteed
tbd tbd
+/- .3
+/- .5
tbd tbd
± tbd
± .768
2.8 3 5
335
55
POWER CONSUMPTION3 Full V 1.29 W
NOTES
1
Nominal Differential Full Scale = .766 V * 2 = 1.53 V
2 I
and I
AVDD
Characteristics and Applications section for I
are measured with an analog input of 10.3MHz, -0.5dBFs, sine wave, rated Encode rate and in LVDS output mode. See Typical Performance
DrVDD
DrVDD
p-p differential
. 3 Power Consumption is measured with a DC input at rated Encode rate in LVDS output mode
DIGITAL SPECIFICATIONS (AV
Parameter (Conditions)
ENCODE AND DATA SYNC INPUTS (ENC,
Differential Input Voltage
, DS, DS/ )
1
Encode Common Mode Voltage
Input Resistance Input Capacitance LOGIC INPUTS ( S1,S2,S4,S5 ) Logic ‘1’ Voltage Logic ‘0’ Voltage Input Resistance Input Capacitance LOGIC OUTPUTS (Demux Mode) Logic “1” Voltage Logic “0” Voltage
2 2
LOGIC OUTPUTS (LVDS Mode) V
Differential Output Voltage
OD
V
Output Offset Voltage
OS
Output Coding
NOTES
2
1
All AC specifications tested by driving ENCODE and ENCODE differentially | ENCODE - ENCODE | > 200mV
Digital Output Logic Levels: DrV
2,3
Temp
= 3.3V, C
DD
Full Full
Full Full
Full Full Full Full
Full Full
Full Full Full
for S5 = 0; Nominal Differential Full Scale = .766 V
= 3.3V, DrVDD = 3.3V; T
DD
Test
Level
IV IV
IV IV
IV
AD9430BSV-170
Min Typ Max Units
0.2
1.5
5.5
2.0
MIN
4
IV
DD
30
4
-0.05
0.05
IV IV
IV IV
DrV
IV
247 454
IV
1.125 1.375
IV
LOAD
Two’s Comp or Binary
= 5pF.
3
LVDS Rl=100 ohms, LVDS Output Swing Set Resistor = 3.7K
mV
% FS
LSB LSB
ppm/°C ppm/°C
mV/V
k
pF
mA mA
= -40°°C, T
V V
k
pF
V
.8
V
k
pF
V V
mV
V
V V
V V
MAX
p-p differential
for S5 = 1 (see Fig. X)
= +85°°C)
-2- 4/01/2002 REV. PrG
PRELIMINARY TECHNICAL DATA
AC SPECIFICATIONS
= +85°C, Internal voltage reference, LVDS Output Mode )
Parameter (Conditions)
SNR Analog Input 10 MHz @ -0.5dBFS 65 MHz 100 MHz 240 MHz
SINAD Analog Input 10 MHz @ -0.5dBFS 65 MHz 100 MHz 240 MHz
Worst Harmonic (2nd or 3rd) Analog Input 10 MHz @ -0.5dBFS 65 MHz 100 MHz 240 MHz
Worst Harmonic (4th or higher) Analog Input 10 MHz @ -0.5dBFS 65 MHz 100 MHz 240 MHz
Two-tone IMD2 F1, F2 @ -7 dBFS
Analog Input Bandwidth
NOTES
1
All AC specifications tested by driving ENCODE and ENCODE differentially.
2 F1 = 31.5 MHz, F2 = 32.5 MHz

SWITCHING SPECIFICATIONS (AVDD= 3.3 V, DrVDD = 3.3V; ENCODE = Maximum Conversion Rate ;

Parameter (Conditions)
Maximum Conversion Rate1 Minimum Conversion Rate Encode Pulse Width High (t Encode Pulse Width Low (t DS Input Setup Time (t DS Input Hold Time (t
NOTES
1
All AC specifications tested by driving ENCODE and ENCODE differentially, LVDS Mode.
2 DS inputs used in CMOS Mode only.
SDS
HDS
1
) 2
) 2
1
(AVDD= 3.3 V, DrVDD = 3.3V; ENCODE = Maximum Conversion Rate ; T
Test
Temp
25°C 25°C 25°C 25°C
25°C 25°C 25°C 25°C
25°C 25°C 25°C 25°C
25°C 25°C 25°C 25°C
Full
25°C
Temp
Full
)1
EH
1
)
EL
Full Full Full Full Full
Level
I
I V V
I
I V V
I
I V V
I
I V V
V V 700 MHz
= -40°C, T
T
MIN
Test
Level
I V V V
IV IV
AD9430BSV-170
Min Typ Max Units
65 65 65 64
65 65
64.5 60
-85
-80
-77
-63
-87
-87
-77
-63
-75
= +85°C )
MAX
dB dB dB dB
dB dB dB dB
dBc dBc dBc dBc
dBc dBc dBc dBc
dBc
AD9430BSV-170
Min Typ Max Units
170 40
2 2
.5
1.5
MSPS MSPS
nS nS nS nS
AD9430
= -40°C, T
MIN
MAX
REV. PrG 4/01/2002 -3-
PRELIMINARY TECHNICAL DATA
AD9430
SWITCHING SPECIFICATIONS (cont’d)
Parameter
OUTPUT Parameters in Demux Mode Valid Time (t Propagation Delay (t Rise Time (t Fall Time (t DCO Propagation Delay (t Data to DCO Skew (t
)
V
) (20% to 80%)
R
) (20% to 80%)
F
PD
PD
– t
)
CPD
CPD
)
) Interleaved Mode (A, B Latency) Parallel Mode (A, B Latency)
OUTPUT Parameters in LVDS Mode Valid Time (t Propagation Delay (t Rise Time (t Fall Time (t DCO Propagation Delay (t Data to DCO Skew (t
)
V
) (20% to 80%)
R
) (20% to 80%)
F
PD
PD
– t
)
CPD
CPD
)
) Pipeline Latency
Aperture Delay (tA) Aperture Uncertainty (Jitter, t
)
J
Temp
Full Full
25°C 25°C
Full Full Full Full
Full Full
25°C 25°C
Full Full Full
25°C 25°C
Test
Level
IV IV
V
V VI IV VI VI
IV
I V V
VI IV VI
V V
Min Typ Max Units
2.0
1.8 2.7 3.8
Measured Preliminary Performance : FFT 65MHz Ain at 170MSPS
AD9430BSV-170
tbd
3.8 1 1
3.8 0
14/14 14/15
3.2 4.3
.5 .5
.5
14
1.2
0.25
ns ns ns ns ns
ns Cycles Cycles
ns
ns
ns
ns
ns
ns Cycles
ps ps rms
-4- 4/01/2002 REV. PrG
PRELIMINARY TECHNICAL DATA

AD9430 Timing Diagram

AD9430
REV. PrG 4/01/2002 -5-
PRELIMINARY TECHNICAL DATA
AD9430

ABSOLUTE MAXIMUM RATINGS

AVDD, DRVDD.. .. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 V
Analog Inputs . . . . . . . . . . .. . .. . . –0.5 V to AVDD + 0.5 V
Digital Inputs . . .. . . . . . . . .. . . .. –0.5 V to DRVDD + 0.5 V
REFIN Inputs . . . . . . . . . . . . . . . . –0.5 V to AVDD + 0.5 V
Digital Output Current . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
Operating Temperature . . . . . . . . . . ... . . . . . –55C to +125C
Storage Temperature . . . . . . . . . . . . . ... . . . . –65C to +150C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . 150C
Maximum Case Temperature . . . . . . . . . . . . . . . . . . . ..150C
2
θ
. . . . . . .. . . . . . . . . . . . . . . . . . . . . . . . . 25C/W, 32C/W
JA
NOTES
EXPLANATION OF TEST LEVELS Test Level
I 100% production tested. II 100% production tested at 25C and sample tested at specified temperatures. III Sample tested only. IV Parameter is guaranteed by design and characterization testing. V Parameter is a typical value only. VI 100% production tested at 25C; guaranteed by design and characterization testing for industrial temperature range; 100% production tested at temperature extremes for military devices.
1 Stresses above those listed under Absolute Maximum Ratings may
cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions outside of those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum ratings for extended periods may affect device reliability.
2 Typical 25C/W (heat slug soldered), for multilayer board in still air.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD9430 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality
θJA = 32C/W (heat slug not soldered), Typical θ
=
JA
.
ORDERING GUIDE
Model Temperature Range Package Option
AD9430BSV-170 –40°C to +85°C TQFP–100
AD9430/PCB-CMOS +25°C Evaluation Board
(CMOS Mode)
Table 1. AD9430 Output Select Coding
S1
(Data Format Select)
S2
(LVDS/CMOS Output Mode Select )
1
S4
(Select Interleaved or Parallel Mode)
(Full Scale Adjust)
2
S5
1 X X X 2’s Complement
0 X X X Offset Binary X 0 1 X Dual Mode CMOS Interleaved X 0 0 X Dual Mode CMOS Parallel X 1 X X LVDS Mode X X X 1 Full Scale -> .766 V
1.533 V
X X X 0 Full Scale -> 1.533 V
Notes:
1
X = Don’t Care
S1-S5 all have 30K resistive pulldowns on chip
2
In interleaved mode output data on port A is offset from output data changes on port B by ½ output clock cycle.
Interleaved mode
Parallel Mode
Mode
pp differential
Single- Ended
pp
pp differential
-6- 4/01/2002 REV. PrG
PRELIMINARY TECHNICAL DATA
(MSB)
AGND
AVDD
AGND
AGND
AVDD
AVDD
AGND
323733
AGND
AVDD
AGND
90
91
92
LVDS PINOUT
TOP VIEW
(Not to Scale)
36
34
AVDD
AVDD
888786
89
AD9430
38
AGND
OR_T
OR_C
AGND
DRVDD
858084
83
424344454647484950
393540
41
DRGND
D11_T 81
D11_C
D10_T
79
D9_T
D10_C
788277
D9_C
76
75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 D1_T 51
DNC
AGND
LVDSBIAS
AVDD
AGND
SENSE
VREF AGND AGND
AVDD
AVDD AGND AGND
AVDD
AVDD
AGND
AGND
AVDD AGND
AIN AIN
AVDD
9796959493
99
98
100
1
S5
2 3
S4
4 5
S2
6
S1
7 8
9 10 11 12 13 14 15 16
17 18 19 20 21 22 23 24 25
293031
27
28
26
DRVDD
DRGND
D8_T D8_C D7_T D7_C D6_T D6_C DRGND D5_T D5_C DCO DCO DRVDD DRGND
D4_T
D4_C D3_T D3_C D2_T
D2_C DRVDD DRGND
D1_C
AD9430
ENC
AGND
AVDD
AVDD
AVDD
AGND
AGND
GND
AVDD
AVDD
AGND
ENC
AVDD
AGND
AVDD
AGND
DNC
DNC
DNC
DNC
DNC
DRVDD
DRGND
D0_C
D0_T
AD9430 LVDS Mode Pinout
AGND
AVDD
AVDD
AGND
AGND
DA11 (MSB)
DRVDD
DRGND
DA10
DA9
DA8
DA7
DB2
79
788277
DRVDD
DRGND
DA6
DB3
DA5
76
DB4
75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60
59 58 57 56 55 54 53 52 51
DRVDD
DRGND
DA4 DA3 DA2 DA1 DA0 DNC DRGND DNC DNC DCO DCO DRVDD DRGND
OR_B
DB11 DB10 DB9 DB8
DB7 DRVDD DRGND DB6 DB5
(MSB)
DNC
AGND
DNC
AVDD
AGND
SENSE
VREF AGND AGND
AVDD
AVDD AGND AGND
AVDD
AVDD
AGND
AIN AIN
AGND
AVDD AGND
AGND
AVDD
AGND
AGND
AVDD
AVDD
99
98
100
1
S5
2 3
S4
4 5
S2
6
S1
7 8
9 10 11 12 13 14 15 16
17 18 19 20 21 22 23 24 25
27
28
26
AVDD
AVDD
AGND
AVDD
9796959493
293031
323733
DS
AVDD
AGND
AGND
AGND
AGND
92
34
DS
AVDD
91
AVDD
90
89
AD9430
CMOS PINOUT
TOP VIEW
(Not to Scale)
36
ENC
ENC
AGND
888786
38
393540
AVDD
AGND
OR_A
858084
41
AVDD
AGND
81
83
424344454647484950
DB0
DB1
DNC
DNC
AD9430 CMOS Dual Mode Pinout
REV. PrG 4/01/2002 -7-
PRELIMINARY TECHNICAL DATA
AD9430
PIN FUNCTION DESCRIPTIONS (CMOS mode) CMOS Mode
Name
Function in CMOS Mode
Pin Number
2,7,42,43,65,66,68 DNC Do not connect 1 S5
3 S4 Interlaced or parallel output mode. (only in Dual Port mode
5 S2 Output Mode select. Low = Dual Port, CMOS; High = LVDS 6 S1 Data format select. Low = Binary, High = Two’s compliment 8,14,15,18,19,24,27,28,29,34, 39,40,88,89,90,94,95,98,99 4,9,12,13,16,17,20,23,25,26,3 0,31,35,38,41,86,87,91,92,93, 96,97,100 10 SENSE Control Pin for Reference , Full Scale 11 VREF 1.235 Reference I/O - function dependent on REFSENSE 21 VIN+ Analog input – true. 22 VIN- Analog input – compliment. 32 DS+ Data sync (input) – true. Aligns output channels so that data from
33 DS- Data sync (input) – compliment. Tie HIGH if not used. 36 ENC+ Clock input – true. 37 ENC- Clock input – compliment. 44 DB0 B Port Output Data Bit (LSB) 45 DB1 B Port Output Data Bit 46 DB2 B Port Output Data Bit 49 DB3 B Port Output Data Bit 50 DB4 B Port Output Data Bit 51 DB5 B Port Output Data Bit 52 DB6 B Port Output Data Bit 55 DB7 B Port Output Data Bit 56 DB8 B Port Output Data Bit 57 DB9 B Port Output Data Bit 58 DB10 B Port Output Data Bit 59 DB11 B Port Output Data Bit (MSB) 60 OR_B B Port Overrange 48,53,61,67,74,82 DrGND Digital ground. 47,54,62,75,83 DrVDD 3.3V digital output supply. (3.0V to 3.6V) 63 DCO- Data Clock output – compliment. 64 DCO+ Data Clock output – true. 69 DA0 A port Output Data Bit (LSB) 70 DA1 A port Output Data Bit 71 DA2 A port Output Data Bit 72 DA3 A port Output Data Bit 73 DA4 A port Output Data Bit 76 DA5 A port Output Data Bit 77 DA6 A port Output Data Bit 78 DA7 A port Output Data Bit 79 DA8 A port Output Data Bit 80 DA9 A port Output Data Bit 81 DA10 A port Output Data Bit 84 DA11 A port Output Data Bit (MSB) 85 OR_A A port Overrange
AVDD 3.3V analog supply. (3.0V to 3.6V)
AGND Analog Ground
Full Scale Adjust pin : ‘1’ sets FS =
‘0’ sets FS =
operation) HIGH = data arrives in channel A at falling edge of clock and data arrives in channel A at rising edge of clock. LOW = data arrives in channels A and B at rising edge of clock.
channel A represents a sample that is prior from data in channel B, taking into account the pipeline delay. (See timing diagram). Tie LOW if not used.
1.533 V
pp differential
.766 V
pp differential,
-8- 4/01/2002 REV. PrG
PRELIMINARY TECHNICAL DATA
PIN FUNCTION DESCRIPTIONS (LVDS mode ) LVDS Mode
Name
Pin Number
2,42,43,44,45,46 DNC Do not connect 1 S5
3 S4 Interlaced or parallel output mode. (only in Dual Port mode
5 S2 Output Mode select. Low = Dual Port, CMOS; High = LVDS 6 S1 Data format select. Low = Binary, High = Two’s compliment 7 LVDSBIAS Sets LVDS Output Current = 3.5mA
8,14,15,18,19,24,27,28,29,34, 39,40,88,89,90,94,95,98,99 4,9,12,13,16,17,20,23,25,26,3 0,31,35,38,41,86,87,91,92,93, 96,97,100 10 SENSE Control Pin for Reference , Full Scale 11 VREF 1.235 Reference I/O - function dependent on REFSENSE 21 VIN+ Analog input – true. 22 VIN- Analog input – compliment. 32 DS+ Data sync (input) – Not used in LVDS mode.Tie LOW . 33 DS- Data sync (input) – compliment. Not used in LVDS mode.Tie HIGH. 36 ENC+ Clock input – true. (LVPECL levels) 37 ENC- Clock input – compliment. (LVPECL levels) 47,54,62,75,83 DrVDD 3.3V digital output supply.
AVDD 3.3V analog supply. (3.0V to 3.6V)
AGND Analog Ground
Function in LVDS Mode
Full Scale Adjust pin : ‘1’ sets FS =
‘0’ sets FS =
operation) HIGH = data arrives in channel A at falling edge of clock and data arrives in channel A at rising edge of clock. LOW = data arrives in channels A and B at rising edge of clock.
(Place 3.7K RSET resistor from LVDSBIAS to ground)
1.533 V
pp differential
.766 V
pp differential,
AD9430
48,53,61,67,74,82 DrGND Digital ground. 49 D0_C D0 complement output bit (LSB) (LVDS Levels) 50 D0_T D0 true output bit (LSB) (LVDS Levels) 51 D1_C D1 complement output bit (LVDS Levels) 52 D1_T D1 true output bit (LVDS Levels) 55 D2_C D2 complement output bit (LVDS Levels) 56 D2_T D2 true output bit (LVDS Levels) 57 D3_C D3 complement output bit (LVDS Levels) 58 D3_T D3 true output bit (LVDS Levels) 59 D4_C D4 complement output bit (LVDS Levels) 60 D4_T D4 true output bit (LVDS Levels) 63 DCO- Data Clock output – compliment. (LVDS Levels) 64 DCO+ Data Clock output – true. (LVDS Levels) 65 D5_C D5 complement output bit (LVDS Levels) 66 D5_T D5 true output bit (LVDS Levels) 68 D6_C D6 complement output bit (LVDS Levels) 69 D6_T D6 true output bit (LVDS Levels) 70 D7_C D7 complement output bit (LVDS Levels) 71 D7_T D7 true output bit (LVDS Levels) 72 D8_C D8 complement output bit (LVDS Levels) 73 D8_T D8 true output bit (LVDS Levels) 76 D9_C D9 complement output bit (LVDS Levels) 77 D9_T D9 true output bit (LVDS Levels) 78 D10_C D10 complement output bit (LVDS Levels) 79 D10_T D10 true output bit (LVDS Levels) 80 D11_C D11 complement output bit (LVDS Levels) MSB 81 D11_T D11 true output bit (LVDS Levels) MSB 84 OR_C Overrange complement output bit (LVDS Levels) 85 OR_T Overrange true output bit (LVDS Levels)
REV. PrG 4/01/2002 -9-
PRELIMINARY TECHNICAL DATA
AD9430
02.6
TERMINOLOGY Analog Bandwidth
The analog input frequency at which the spectral power of the fundamental frequency (as determined by the FFT analysis) is reduced by 3 dB.
Aperture Delay
The delay between the 50% point of the rising edge of the ENCODE command and the instant at which the analog input is sampled.
Aperture Uncertainty (Jitter)
The sample-to-sample variation in aperture delay.
Crosstalk
Coupling onto one channel being driven by a low level (–40 dBFS) signal when the adjacent interfering channel is driven by a full-scale signal.
Differential Analog Input Resistance, Differential Analog Input Capacitance and Differential Analog Input Impedance
The real and complex impedances measured at each analog input port. The resistance is measured statically and the capacitance and differential input impedances are measured with a network analyzer.
Differential Analog Input Voltage Range
The peak-to-peak differential voltage that must be applied to the converter to generate a full-scale response. Peak differential voltage is computed by observing the voltage on a single pin and subtracting the voltage from the other pin, which is 180 degrees out of phase. Peak-to-peak differential is computed by rotating the inputs phase 180 degrees and again taking the peak measurement. The difference is then computed between both peak measurements.
Differential Nonlinearity
The deviation of any code width from an ideal 1 LSB step.
Effective Number of Bits
The effective number of bits (ENOB) is calculated from the measured SNR based on the equation:
ENOB
ENCODE Pulsewidth / Duty Cycle
Pulsewidth high is the minimum amount of time that the ENCODE pulse should be left in Logic 1 state to achieve rated performance; pulsewidth low is the minimum time ENCODE pulse should be left in low state. See timing implications of changing t these specifica-tions define an acceptable ENCODE duty cycle.
76.1 dBSNR
=
MEASURED
in text. At a given clock rate,
ENCH
Full-Scale Input Power
Expressed in dBm. Computed using the following equation:
2
V
Fullscale
 
Power
Fullscale
=
log10
Z
001.
 
Gain Error
Gain error is the difference between the measured and ideal full scale input voltage range of the ADC.
Harmonic Distortion, Second
The ratio of the rms signal amplitude to the rms value of the second harmonic component, reported in dBc.
Harmonic Distortion, Third
The ratio of the rms signal amplitude to the rms value of the third harmonic component, reported in dBc.
Integral Nonlinearity
The deviation of the transfer function from a reference line measured in fractions of 1 LSB using a “best straight line” determined by a least square curve fit.
Minimum Conversion Rate
The encode rate at which the SNR of the lowest analog signal frequency drops by no more than 3 dB below the guaranteed limit.
Maximum Conversion Rate
The encode rate at which parametric testing is performed.
Output Propagation Delay
The delay between a differential crossing of ENCODE and ENCODE and the time when all output data bits are within valid logic levels.
Noise (for Any Range within the ADC)
 
=
noise
Where Z is the input impedance, FS is the full scale of the device for the frequency in question, SNR is the value for the particular input level, and Signal is the signal level within the ADC reported in dB below full scale. This value includes both thermal and quantization noise.
Power Supply Rejection Ratio
The ratio of a change in input offset voltage to a change in power supply voltage.
Signal-to-Noise-and-Distortion (SINAD)
The ratio of the rms signal amplitude (set 1 dB below full scale) to the rms value of the sum of all other spectral components, including harmonics but excluding dc.
-10- 4/01/2002 REV. PrG
ZV
10*001.*
Input
rms
    
SignalSNRFS
10
dBFSdBcdBm
 
PRELIMINARY TECHNICAL DATA
Signal-to-Noise Ratio (without Harmonics)
The ratio of the rms signal amplitude (set at 1 dB below full scale) to the rms value of the sum of all other spectral components, excluding the first five harmonics and dc.
Spurious-Free Dynamic Range (SFDR)
The ratio of the rms signal amplitude to the rms value of the peak spurious spectral component. The peak spurious component may or may not be a harmonic. May be reported in dBc (i.e., degrades as signal level is lowered), or dBFS (always related back to converter full scale).
Two-Tone Intermodulation Distortion Rejection
The ratio of the rms value of either input tone to the rms value of the worst third order intermodulation product; reported in dBc.
Two-Tone SFDR
The ratio of the rms value of either input tone to the rms value of the peak spurious component. The peak spurious component may or may not be an IMD product. May be reported in dBc (i.e., degrades as signal level is lowered), or in dBFS (always related back to converter full scale).
Worst Other Spur
The ratio of the rms signal amplitude to the rms value of the worst spurious component (excluding the second and third harmonic) reported in dBc.
Transient Response Time
Transient response is defined as the time it takes for the ADC to reacquire the analog input after a transient from 10% above negative full scale to 10% below positive full scale.
Out-of-Range Recovery Time
Out of range recovery time is the time it takes for the ADC to reacquire the analog input after a transient from 10% above positive full scale to 10% above negative full scale, or from 10% below negative full scale to 10% below positive full scale.

EQUIVALENT CIRCUITS

AD9430
Figure X Analog Inputs
Figure X S1-S5 Inputs
Figure X VREF, SENSE I/O

Figure X Data Outputs (CMOS Mode)

Figure X Encode and DS Inputs

REV. PrG 4/01/2002 -11-

Figure X Data Outputs (LVDS Mode)

PRELIMINARY TECHNICAL DATA
AD9430
APPLICATION NOTES

THEORY OF OPERATION

The AD9430 architecture is optimized for high speed and ease of use. The analog inputs drive an integrated high bandwidth track-and-hold circuit that samples the signal prior to quantization by the 12-bit core. For ease of use the part includes an onboard reference and input logic that accepts TTL, CMOS, or LVPECL levels. The digital outputs logic levels are user selectable as standard 3V CMOS or LVDS (ANSI-644 compatible) via pin S2.
USING THE AD9430 ENCODE Input
Any high speed A/D converter is extremely sensitive to the quality of the sampling clock provided by the user. A track/hold circuit is essentially a mixer, and any noise, distortion, or timing jitter on the clock will be combined with the desired signal at the A/D output. For that reason, considerable care has been taken in the design of the ENCODE input of the AD9430, and the user is advised to give commensurate thought to the clock source.
The AD9430 has an internal clock duty cycle stabilization circuit that locks to the rising edge of ENCODE (falling edge of ENCODE if driven differentially), and optimizes timing internally. This allows for a wide range of input duty cycles at the input without degrading performance. Jitter in the rising edge of the input is still of paramount concern, and is not reduced by the internal stabilization circuit. This circuit is always on, and cannot be disabled by the user. The ENCODE and ENCODE inputs are internally biased to
1.5V (nominal), and support either differential or single – ended signals. For best dynamic performance, a differential signal is recommended. Good performance is obtained using an MC10EL16 in the circuit to drive the encode inputs , as illustrated in figure below.
differential analog inputs for applications that require a single-ended-to-differential conversion. Both analog inputs are self-biased by an on-chip resistor divider to a nominal
2.8 V. (See Equivalent Circuits section TBD.) Special care was taken in the design of the Analog Input section of the AD9430 to prevent damage and corruption of data when the input is overdriven. The nominal input range is 1.5 V diff p-p. The nominal differential input range is 768 mV p-p × 2.
Differential Analog Input Range

Driving Encode with EL16

Analog Input
The analog input to the AD9430 is a differential buffer. For
____
best dynamic performance, impedances at should match. The analog input has been optimized to provide superior wideband performance and requires that the analog inputs be driven differentially. SNR and SINAD performance will degrade significantly (~6dB) if the analog input is driven with a single-ended signal. A wideband transformer such as Minicircuits ADT1-1WT can be used to provide the
AIN and
AIN
-12- 4/01/2002 REV. PrG
Single Ended Analog Input Range
PRELIMINARY TECHNICAL DATA
Digital Outputs
The off chip drivers on the chip can be configured by the user to provide CMOS or LVDS compatible output levels via pin S2.
The CMOS digital outputs (S2=0) are TTL/CMOS­compatible for lower power consumption. The outputs are biased from a separate supply (VDD), allowing easy interface to external logic. The outputs are CMOS devices which will swing from ground to VDD (with no dc load). It is recommended to minimize the capacitive load the ADC drives by keeping the output traces short (<1 inch, for a total C
< 5 pF). When operating in cmos mode it is also
LOAD
recommended to place low value (220 ohm) series damping resistors on the data lines to reduce switching transient effects on performance.
LVDS outputs are available when S2=VDD and a 3.7K RSET resistor is placed at pin 7 ( LVDSBIAS) to ground . This resistor sets the output current at each output equal to a nominal 3.5mA ( 10* I termination resistor placed at the lvds receiver inputs results in a nominal 350mV voltage swing at the receiver. Note that when operating in LVDS mode the output supply must be at a dc potential greater than or equal to the analog supply level (AVDD). This can be accomplished simply by biasing the two supplies from the same power plane or by tying the two supplies on the pcb through an inductor. When operating in CMOS mode this is not required and separate supplies are recommended.
Clock Outputs (DCO+, DCO-)
The input ENCODE is divided by two (in CMOS mode) and available off-chip at DCO+ and DCO-. These clocks can facilitate latching off-chip, providing a low skew clocking solution (see timing diagram). The on-chip clock buffers should not drive more than 5 pF of capacitance to limit switching transient effects on performance. Note that the Outputs clocks are CMOS levels when CMOS mode is selected(S2=0) and are LVDS levels when in LVDS mode(S2=VDD). (Requiring a 100ohm differential termination at receiver in LVDS mode). The output clock in LVDS mode switches at the encode rate.
) . A 100 ohm differential
RSET
AD9430
Voltage Reference
A stable and accurate 1.25 V voltage reference is built into the AD9430 (VREF). The analog input Full Scale Range is linearly proportional to the voltage at VREF. VREF (and in turn input full scale ) can be varied by adding an external resistor network at VREF, SENSE and GROUND. (See figure X ) . No appreciable degradation in performance occurs when VREF is adjusted ±5%. Note that an external reference can be used by connecting the SENSE pin to VDD (disabling internal reference) and driving VREF with the external reference source. A .1uF capacitor to ground is recommended at VREF pin in internal and external reference applications.

Simplified Voltage Reference Equivalent Circuit

REV. PrG 4/01/2002 -13-
AD9430
PRELIMINARY TECHNICAL DATA

AD9430 EVALUATION BOARD

The AD9430 evaluation board offers an easy way to test the AD9430. It requires a clock source, an analog input signal, and a 3.3 V power supply. The clock source is buffered on the board to provide the clocks for the ADC, an on-board DAC, latches, and a data ready signal. The digital outputs and output clocks are available at two 40-pin connectors, P3 and P4. The board has several different modes of operation, and is shipped in the following configuration:
Offset Binary
Internal Voltage Reference
CMOS Parallel Timing
Full-Scale Adjust = Low
Power Connector
Power is supplied to the board via a detachable 12-lead power strip (three 4-pin blocks).
> 0.5 V p-p. Power to the EL16 is set at jumper E47. E47–E45 powers the buffer from AVDD, E47–E46 powers the buffer from VCLK/V_XTAL.
Voltage Reference
The AD9430 has an internal 1.23 V voltage reference. The ADC uses the internal reference as the default when jumpers E24–E27 and E25–E26 are left open. The full scale can be increased by placing optional resistor R3. The required value would vary with process and needs to be tuned for the specific application. Full scale can similarly be reduced by placing R4; tuning would be required here as well. An external reference can be used by shorting the SENSE pin to 3.3 V (place jumper E26–E25). E27–E24 jumper connects the ADC VREF pin to EXT_VREF pin at the power connector.
Data Format Select
Data Format Select sets the output data format of the ADC. Set­ting DFS (E1–E2) low sets the output format to be offset binary; setting DFS high (E1–E3) sets the output to two’s complement.
Table II. Power Connector
AVDD 3.3 V Analog Supply for ADC (~ 350 mA) DRVDD 3.3 V Output Supply for ADC (~ 28 mA) VDL 3.3 V
Supply for Support Logic and DAC (~350 mA)
EXT_VREF* Optional External Reference Input VCLK/V_XTAL Supply for Clock Buffer/Optional XTAL VAMP Supply for Optional Amp
*LVEL16 clock buffer can be powered from AVDD or VCLK at E47 jumper
(AVDD, DrVDD,VDL are the minimum required power connections).
Analog Inputs
The evaluation board accepts a 1.3 V p-p analog input signal centered at ground at SMB connector J4. This signal is terminated to ground through 50 by R16. The input can be alternatively terminated at T1 transformer secondary by R13, R14. T1 is a wideband RF transformer providing the single-ended to differential conversion allowing the ADC to be driven differentially, minimizing
I/P
Output timing is set at E11–E13. E12–E11 sets S4 low for parallel output timing mode. E11–E13 sets S4 high for interleaved timing mode.
Timing Controls
Flexibility in latch clocking and output timing is accomplished by allowing for clock inversion at the timing controls section of the PCB. Each buffered clock is buffered by an XOR and can be inverted by moving the appropriate jumper for that clock.
Data Outputs
The ADC digital outputs are latched on the board by four LVT574s; the latch outputs are available at the two 40-pin connectors at pins 11–33 on P23 (channel A) and pins 11–33 on P3 (channel B). The latch output clocks (data ready) are available at Pin 37 on P23 (channel A) and Pin 37 on P3 (channel B). The data ready clocks can be inverted at the timing controls section if needed.
even order harmonics. An optional second transformer T2 can be placed following T1 if desired. This would provide some
perfor­mance advantage (~1–2 dB) for high analog input frequencies (>100 MHz). If T2 is placed, two shorting traces at the pads would need to be cut. The analog signal is low pass filtered by R41, C12
, and R42, C13 at the ADC input.
Gain
Full scale is set at E17–E19, E17–E18 sets S5 low, full scale =
1.5 V differential; E17–E19 sets S5 high, full scale = 0.75 V differential.
Encode
The encode clock is terminated to ground through 50 at SMB connector J5. The input is ac-coupled to a high-speed differential receiver (LVEL16) which provides the required low-jitter, fast edge rates needed for optimum performance. J5 input should be
: 4.6nS C1 FREQ
84.65608MHz
1
2
2.00V 2.00V
CH1 CH2CH2 M 5.00nS
Figure 13. Data Output and Clock @ 80-Pin Connector
-14- 4/01/2002 REV. PrG
PRELIMINARY TECHNICAL DATA
AD9430
DAC Outputs
Each channel is reconstructed by an on-board dual-channel DAC, an AD9753. This DAC is intended to assist in debug—it should not be used to measure the performance of the ADC. It is a current output DAC with on-board 50 termination resistors. figure
below is representative of the DAC output with a full-scale input. The scope setting is low bandwidth.
analog
The
Optional Amplifier
The footprint for transformer T2 can be modified to accept a wideband differential amplifier (AD8350) for low frequency applications where gain is required. Note that Pin 2 would need to be lifted and left floating for operation. Input transformer T1 would need to be modified to a 4:1 for impedance matching and ADC input filtering would enhance performance (see AD8350 data sheet). SNR/SINAD Performance of 61 dB/60 dB is pos­sible
1
2.00mV
CH1 CH1M 25.0nS
C1 FREQ
10.33592MHz
C1 PK-PK 448mV
248mV
Figure 14. DAC Output
Encode Xtal
An optional xtal oscillator can be placed on the board to serve as a clock source for the PCB. Power to the xtal is through the VCLK/VXTAL pin at the power connector. If an oscillator is used, ensure proper termination for best results. The board has been tested with a Valpey Fisher VF561 and a Vectron JN00158-163.84. Test results for the VF561 are shown below.
and would start to degrade at about 30 MHz.
CUT TRACE
AD9430
1
CUT TRACE
Figure 16. Using the AD8350 on the AD9430 PCB
0
ENCODE 163.84MHz
–10
ANALOG 65.02MHz SNR 63.93dB SINAD 63.87dB
–20
FUND –0.45dBFS 2ND –85.62dBc
–30
3RD –91.31dBc 4TH –90.54dBc
–40
5TH –90.56dBc 6TH –91.12dBc
–50
THD –82.21dBc
dB
SFDR 83.93dBc
–60
SAMPLES 8k NOISEFLR –100.44dBFS WORSTSP –83.93dBc
70
80
90
100
08020
40 60
MHz
Figure 15. FFT—Using VF561 XTAL as Clock Source
REV. PrG 4/01/2002 -15-
PRELIMINARY TECHNICAL DATA
AD9430
Table III. Evaluation Board Bill of Materials
No. Qty. Reference Designator Device Package Value Comments
1 45 C1, C3–C11, C15–C17, Capacitor 0603 0.1 µF C43, C47
C19–C29, C31–C48, Not Placed
C58–C62 2 0 C2 Capacitor 0603 10 pF Not Placed 3 0 C12, C13 Capacitor 0603 20 pF Not Placed 4 1 C14 Capacitor 0603 0.01 µF 5 0 C18 Capacitor 0603 1 µF 6 7 C30, C49, C63–C67 Capacitor CAPL 10 µF C30 Not Placed 7 9 E3–E1–E2 3-Pin Header/Jumper
E19–E17–E18 3-Pin Header/Jumper
E13–E11–E12 3-Pin Header/Jumper
E26–E25–E27–E24 4-Pin Header
E46–E47–E45 3-Pin Header/Jumper
E35–E33–E34 3-Pin Header/Jumper
E32–E30–E31 3-Pin Header/Jumper
E29–E23–E28 3-Pin Header/Jumper
E22–E16–E21 3-Pin Header/Jumper 8 5 J1, J2, J3, J4, J5, J6 SMB SMB J1 Not Placed 9 2 P3, P23 40-Pin Header 10 3 P4, P21, P22 4-Pin Power Connector Post 25.531.3425.0 Wieland
Detachable Connector 25.602.5453.0 Wieland
11 8 R1, R5, R13, R14, R16, Resistor 0603 50 R1, R13, R14
Not Placed
R25, R27, R28, R41, R42 12 1 R2, R3, R4 Resistor 0603 3.9 k R3, R4 Not Placed
13 8 R6–R8, R10, R15, Resistor 0603 100 R15, R21–R24, R38
Not Placed
R21–R24, R33–R36, R38 14 5 R12, R30, R37 Resistor 0603 0 15 4 R17, R18, R19, R20 Resistor 0603 510 16 1 R26 Resistor 0603 2 k 17 1 R29 Resistor 0603 390 18 7 R31, R32, R39, R40, R43, Resistor 0603 1 k
R44, R45 19 4 RZ1, RZ2, RZ3, RZ4 Resistor Pack 220 SO16RES 742C163221JTR CTS 20 8 RZ5, RZ6, RZ7, RZ8, RZ9, Resistor Pack 22 SO16RES 742C163220JTR CTS
RZ10, RZ11, RZ12 21 1 T1, T2 Transformer CD542 Minicircuits T2 Not Placed
ADT1–1WT 22 1 U1 AD9430BSV TQFP100 ADC 23 1 U2 MC100LVEL16D SO8NB Clock Buffer 24 1 U3 74LCX86 SO14NB Xor/Buffer 25 4 U4, U5, U6, U7 74LVT574 SO20 Latch 26 1 U9 AD9753AST LQFP48 DAC
-16- 4/01/2002 REV. PrG
GND
DRA
GND
DX11
DX10
PRELIMINARY TECHNICAL DATA
AD9430
GND
DRB
GND
DY1 1
DY1 0
DY9
DY8
DY7
DY6
DY5
DY4
DY3
DY2
DY1
DY0
DYA
DYB
DRY
DX9
DX8
DX7
DX6
DX5
DX4
DX3
DX2
DX1
DX0
DXA
DXB
DRX
GND
GND
P39
P37
P35
P33
P31
P40
P38
P36
P34
P32
GND
DRX
DX11
DX10
16151413121110
R1R2R3R4R5R6R7
RZ8 22
1234567
VDL
201918171615141312
Q0Q1Q2Q3Q4Q5Q6
VCC
U4
OUT_END0D1D2D3D4D5D6D7
123456789
GND
16151413121110
R1R2R3R4R5R6R7
RZ1 220
1234567
CLKLATA
R33
100
3
U3
74LCX86
74LCX86
1
2
4
R10
100
COUTA
E35
E34
E33
VCC
GND
E7
E20VDL
DRVDD
GND
VAM P
GND
VCLK/V_XTAL
4
P4
123
P4
P1P2P3
PTMICA04
EXT_VREF
4
P21
123
P1P2P3
P29
P27
P25
P23
P30
P28
P26
P24
DX9
DX8
DM8
DM7
DRA
R34
100
6
U3
5
R8
100
COUTA
E32
E31
E30
VCC
GND
COUTA
R9
COUT
H4
MTHOLESH3MTHOLESH2MTHOLESH2MTHOLES
VDL
GND
DRVDD
123
P4
P1P2P3
PTMICA04
P21
P19
P17
P22
P20
P18
DX7
DX6
DM6
74LCX86
9
GND
AVDD (VCC)
4
P4
PTMICA04
P22
P15
P16
DX5
9
R8
8
DM5
Q7
9
R8
8
CLKLATB
8
U3
10
COUTAB
E29
VCC
COUTAB
R11
COUTB
P13
P14
R35
E23
P9P7P5P3P1
P11
P12
P10P8P6P4P2
RZ7 22
VDL
CLKLATA
11
201918171615141312
VCC
CLOCK
U5
LVT574
GND
OUT_END0D1D2D3D4D5D6D7
123456789
10
GND
GND
RZ2 220
DRB
R36
100
11
U3
74LCX86
12
13
R7
100
COUTAB
E28
E22
E16
VCC
GND
GND
P23
C4OMS
DX4
DX3
DX2
DX1
DX0
16151413121110
R1R2R3R4R5R6R7
1234567
Q0Q1Q2Q3Q4Q5Q6
16151413121110
R1R2R3R4R5R6R7
1234567
100
PLB GND
GROUND PAD UNDER PART
R6
100
E21
GND
DXA
DXB
9
R8
8
CLKLATA
11
Q7
CLOCK
LVT574
GND
10
GND
9
R8
8
DRVDD
GND
75747372717069686766656463626160595857565554535251
76 77 78 79 80 81
GND
82
DRVDD
83 84 85
GND
86
GND
87
VCC
88
VCC
89
VCC
90
GND
91
GND
92
GND
93
VCC
94
VCC
95
GND
96
GND
97
VCC
98
VCC
99
GND
100
123456789
GND
GND
GND
E13VCC
E18GND
E14
E12GNDE8E10VCC
E11
E19VCC
E17
Figure 17a. Evaluation Board Schematic
REV. PrG 4/01/2002 -17-
P39
P37
P35
P33
P31
P29
P40
P38
P36
P34
P32
P30
GND
DRY
DY1 1
DY1 0
16151413121110
R1R2R3R4R5R6R7
RZ6 22
1234567
VDL
201918171615141312
Q0Q1Q2Q3Q4Q5Q6
VCC
U6
OUT_END0D1D2D3D4D5D6D7
123456789
GND
16151413121110
R1R2R3R4R5R6R7
RZ3 220
1234567
GND
COUT
COUTB
DRVDD
GND
U1
AD9430
101112131415161718192021222324
VCC
VCC
VCC
GND
25
E26VCC
1k
E29
R3
E9GND
GND
GND
C1
E24EXT_VREF
E27
R4
R39
1k
GND
E6VCC
0.1F
VCC
E4
E5GND
GND
GND
GND
R3, R4
OPTIONAL
E3VCC
E1
E2GND
VCC
R41
R39
C12
P27
P28
DY9
GND
20pF
P25
P23
P21
P26
P24
P22
DY8
DY7
DRVDD
GND
GND
GND
C43
0.1F
T2
T2
OPTIONAL
P19
P17
P20
P18
DY6
R8
R8
25
VCC
GND
R41
25
426
153
ADT1-1WT
C3
0.1F
R14
29
426
T1
153
ADT1-1WT
P15
P16
9
8
9
8
DY5
Q7
50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26
P13
P14
11
10
C11 0.1␮F
GND
GND
P9P7P5P3P1
P11
P12
P10P8P6P4P2
RZ5 22
VDL
CLKLATA
201918171615141312
VCC
CLOCK
U7
LVT574
OUT_END0D1D2D3D4D5D6D7
GND
123456789
GND
GND
RZ4 220
GND
DRVDD
GND
VCC
GND
GND
VCC
GND GND
VCC
R5
50
VCC VCC
GND
GND
C13
20pF
GND
R42
25
C47
PRI SEC
C2
10pF
R13
25
C6
0.1F
PRI SEC
C6
R16
50
0.1F
J4
P3
C4OMS
DY4
DY3
DY2
DY1
16151413121110
R1R2R3R4R5R6R7
1234567
Q0Q1Q2Q3Q4Q5Q6
16151413121110
R1R2R3R4R5R6R7
1234567
CLK–
CLK+
R1
50
J2
GND
GND
J1
GND
C36
0.1F
DATA SYNC
U2
E45
E46
0.1F
E47
VCC
VCLK
R13, R14 OPTIONAL
E19
ANALOG
DY0
DYA
9
R8
8
9
R8
8
R1 NOT PLACED
7
8
VCC
DQ
234
MC100LVEL 16
C5
0.15F
J5
DYB
CLKLATB
11
Q7
CLOCK
GND
10
GND
E36
6
DNQNVBB
R27
50
ENCODE
LVT574
00
R19
510
R20
510
R10
R17
VEE
510
510
GND
R12
C30
10F
+
GND
GND
C4
0.1F
VCC
GND
5
GND
C8
0.1F
AD9430
V
CC
+
C64 10F
C16
0.1F
C17
0.1F
PRELIMINARY TECHNICAL DATA
C24
C27
C26
C19
0.1F
C21
0.1F
C20
0.1F
C23
0.1F
C22
0.1F
C25
0.1F
0.1F
0.1F
0.1F
C29
0.1F
C28
0.1F
C31
0.1F
C32
0.1F
C35
0.1F
GND
VDL
GND
DRV
DD
GND
+
C67 10F
+
C65 10F
R38 FOR VF561 CRYSTAL
C40
0.1U
C61
0.1F
100
VOL
GND
R38
R31 1k
R32 1k
C62
0.1F
R15
100
GND
GND
GND
C45
0.1U
DX11
DX10
DX9
DX8
DX7
DX6
DX5
DX4
DX3
DX2
DX1
DX0
DXA
DXB
C60
0.1F
C59
C58
0.1F
0.1F
1
E/D
2
NC
3
GND
OUTPUT B
U8
OPTIONAL XTAL
R43
1k
GND
VOL
GND
DRA
C48
0.1U
RZ9
R1
16
1
R2
15
2
R3
14
3
R4
13
4
R5
12
5
R6
11
6
R7
10
7
R8
9
8
220
RZ11
R1
16
1
R2
15
2
R3
14
3
R4
13
4
R5
12
5
R6
11
6
R7
10
7
R8
9
8
220
V
OUTPUT
GND
CC
VCLK
GND
R37
GND
0
6 5
4
C38 .1U
VOL
1
2
3
4
5
6
7
8
9
10
11
12
VCLK
C66 10F
VCLK
R30
0
GND
J6
48
13
R21 100
R22 100
GND
C18
0.1U
47
E40
E37
C42
0.1F
C41
0.1F
VAM P
GND
OPIN B
GND
IN–
87 65
12 34
IN+
GND
OPIN
VOL
GND
GND
VOL
GND
GND
GND
ENBL
GND
GND
CC
V
VAM P
10
11
12
13
14
15
16
10
11
12
13
14
15
16
+
OPIN B
OUT–
OUT+
OPIN
RZ12
R8
9
R7
R6
R5
R4
R3
R2
R1
220
RZ10
R8
9
R7
R6
R5
R4
R3
R2
R1
220
U10
C49 10F
OPTIONAL AMPAD9430
8
7
6
5
4
3
2
1
8
7
6
5
4
3
2
1
C15
0.1F
C48
0.1F
DYB
DYA
DY0
DY1
DY2
DY3
DY4
DY5
DY6
DY7
DY8
DY9
DY1 0
DY1 1
C37
0.1F
C44
0.1F
C14
0.01F
P1
VCLK
R23 100
R24 100
GND
R25 50
GND
J3
R28 50
GND
GND R29 392
44
45
46
VREF
GND
P2
C34
VOL
0.1U
GND
R26
2k
41
42
43
+
C63 10F
GND
C33
0.1U
39
40
E4Z
E41
R44
1k
E39
E38
R45 1k
37
38
36
35
34
33
32
31
AD9430
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
GND
C35
0.1U
VOL
GND
Figure 17b. Evaluation Board Schematic
-18- 4/01/2002 REV. PrG
PRELIMINARY TECHNICAL DATA
AD9430
Figure 18. PCB Top Side Silkscreen
Figure 19. PCB Top Side Copper
Figure 21. PCB Split Power Plane
Figure 22. PCB Bottom Side Copper
Figure 20. PCB Ground Layer
REV. PrG 4/01/2002 -19-
Figure 23. PCB Bottom Side Silkscreen
AD9430
PRELIMINARY TECHNICAL DATA
Troubleshooting
If the board does not seem to be working correctly, try the following:
Verify power at IC pins.
Check that all jumpers are in the correct position for the desired mode of operation.
Verify VREF is at 1.23 V.
Try running Encode Clock and Analog Inputs at low speeds (10 MSPS/1 MHz) and monitor 574, DAC, and ADC outputs for toggling.
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
100-Lead TQFP (with Exposed Heat Sink)
(TQFP-100)
0.030 (0.75)
0.024 (0.60)
0.018 (0.45)
SEATING
PLANE
0.047 (1.20) MAX
1
0.630 (16.00) SQ
0.551 (14.00) SQ
76100
75
The AD9430 Evaluation Board is provided as a design example for customers of Analog Devices, Inc. ADI makes no warranties, express, statutory, or implied, regarding merchantability or fitness for a particular purpose.
76 100
75
BOTTOM VIEW
1
TOP VIEW
(PINS DOWN)
CONDUCTIVE
25
26 49
0.006 (0.15)
0.002 (0.05)
0.0197 (0.50) BSC
NOTE: THE AD9430 HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT IS RECOMMENDED THAT NO PCB SIGNAL TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE DEVICE WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.
0.011 (0.27)
0.009 (0.22)
0.007 (0.17)
50
0.041 (1.05)
0.039 (1.00)
0.037 (0.95)
7 0
50
CONTROLLING DIMENSIONS ARE IN MILLIMETERS. CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED.
HEAT SINK
0.260 (6.00) NOM
25
2649
-20- 4/01/2002 REV. PrG
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