Analog Devices AD9430 c Datasheet

12-Bit, 170/210 MSPS

FEATURES

SNR = 65 dB @ fIN = 70 MHz @ 210 MSPS ENOB of 10.6 @ f SFDR = 80 dBc @ f Excellent linearity:
DNL = ±0.3 LSB (typical) INL = ±0.5 LSB (typical)
2 output data options:
Demultiplexed 3.3 V CMOS outputs each @ 105 MSPS
Interleaved or parallel data output option LVDS at 210 MSPS 700 MHz full-power analog bandwidth On-chip reference and track-and-hold Power dissipation = 1.3 W typical @ 210 MSPS
1.5 V input voltage range
3.3 V supply operation Output data format option Data sync input and data clock output provided Clock duty cycle stabilizer

APPLICATIONS

Wireless and wired broadband communications Cable reverse path Communications test equipment Radar and satellite subsystems Power amplifier linearization

GENERAL DESCRIPTION

The AD9430 is a 12-bit monolithic sampling analog-to-digital converter optimized for high performance, low power, and ease of use. The product operates up to a 210 MSPS conversion rate and is optimized for outstanding dynamic performance in wideband carrier and broadband systems. All necessary functions, including a track-and-hold (T/H) and reference, are included on the chip to provide a complete conversion solution.
The ADC requires a 3.3 V power supply and a differential ENCODE clock for full performance operation. The digital outputs are TTL/CMOS or LVDS compatible and support either twos complement or offset binary format. Separate output power supply pins support interfacing with 3.3 V or 2.5 V CMOS logic.
= 70 MHz @ 210 MSPS (–0.5 dBFS)
IN
= 70 MHz @ 210 MSPS (–0.5 dBFS)
IN
3.3 V A/D Converter AD9430

FUNCTIONAL BLOCK DIAGRAM

DRGND
12
OR LVDS
S5S4S2S1
DRVDD
LVDS
OUTPUTS
CMOS
OUTPUTS
AVDD
DATA, OVERRANGE IN LVDS OR 2-PORT CMOS
DCO+
DCO–
VIN+
VIN–
DS+
DS– CLK+ CLK–
AD9430
TRACK-
AND-HOLD
CLOCK
MANAGEMENT
SENSE VREF
SCALABLE
REFERENCE
Figure 1. Functional Block Diagram
ADC
12-BIT
PIPELINE
CORE
AGND
SELECT CMOS
Two output buses support demultiplexed data up to 105 MSPS rates in CMOS mode. A data sync input is supported for proper output data port alignment in CMOS mode, and a data clock output is available for proper output data timing. In LVDS mode, the chip provides data at the ENCODE clock rate.
Fabricated on an advanced BiCMOS process, the AD9430 is available in a 100-lead, surface-mount plastic package (100 e-PAD TQFP) specified over the industrial temperature range (–40°C to +85°C).

PRODUCT HIGHLIGHTS

1. High performance.
Maintains 65 dB SNR @ 210 MSPS with a 65 MHz input.
2. Low power.
Consumes only 1.3 W @ 210 MSPS.
3. Ease of use.
LVDS output data and output clock signal allow interface to current FPGA technology. The on-chip reference and sample/hold provide flexibility in system design. Use of a single 3.3 V supply simplifies system power supply design.
4. Out of range (OR).
The OR output bit indicates when the input signal is beyond the selected input range.
5. Pin compatible with 10-bit AD9411 (LVDS only).
02607-001
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 Fax: 781.326.8703 © 2004 Analog Devices, Inc. All rights reserved.
www.analog.com
AD9430

TABLE OF CONTENTS

DC Specifications ............................................................................. 4
AC Specifications.............................................................................. 5
Digital Specifications........................................................................ 6
Switching Specifications .................................................................. 7
Absolute Maximum Ratings............................................................ 9
Explanation of Test Levels........................................................... 9
ESD Caution.................................................................................. 9
Pin Configurations and Function Descriptions .........................10
Te r mi n ol o g y .................................................................................... 14
Equivalent Circuits......................................................................... 16
Typical Performance Characteristics ........................................... 17
Application Notes ........................................................................... 24
Theory of Operation ..................................................................24
Encode Input............................................................................... 24
Analog Input ............................................................................... 25
Analog Inputs ............................................................................. 27
Gain.............................................................................................. 27
ENCODE..................................................................................... 27
Volt a ge R e fe r e nc e ....................................................................... 27
Data Format Select..................................................................... 27
I/P Timing Select........................................................................ 27
Timing Controls ......................................................................... 27
CMOS Data Outputs.................................................................. 27
DAC Outputs .............................................................................. 28
Crystal Oscillator........................................................................ 28
Optional Amplifier..................................................................... 28
Troubleshooting.......................................................................... 28
Evaluation Board, LVDS Mode
Power Connector ........................................................................ 34
Analog Inputs ............................................................................. 34
...................................................... 34
DS Inputs (DS+, DS–)................................................................ 25
CMOS Outputs........................................................................... 25
LVDS Output s ............................................................................. 25
Clock Outputs (DCO+, DCO–)............................................... 26
Volt a ge R e fe r e nc e ....................................................................... 26
Noise Power Ratio Testing (NPR)............................................ 26
Evaluation Board, CMOS Mode ...................................................27
Power Connector ........................................................................27
Gain.............................................................................................. 34
Clock ............................................................................................ 34
Volt a ge R e fe r e nc e ....................................................................... 34
Data Format Select..................................................................... 34
Data Outputs............................................................................... 34
Crystal Oscillator........................................................................ 34
Outline Dimensions ....................................................................... 40
Ordering Guide .......................................................................... 40
Rev. C | Page 2 of 40
AD9430
REVISION HISTORY
11/04—Rev. B to Rev. C
Changes to Specifications ............................................................. 4
Changes to Figure 60 ................................................................. 31
Changes to LVDS PCB BOM .................................................... 35
Changes to Figure 68 (Evaluation Board—LVDS Mode)...... 36
Updated Outline Dimensions ................................................... 40
7/03—Rev. A to Rev. B
Changed order of Figure 1 and Figure 2 ................................... 5
Updated TPC 13 .......................................................................... 14
Changes to LVDS OUTPUTS section....................................... 20
Add New AD9430 EVALUATION BOARD, LVDS MODE
Section ...................................................................................... 27
Updated OUTLINE DIMENSIONS ........................................ 32
3/03—Rev. 0 to Rev. A
Changes to FEATURES ............................................................... 1
Changes to PRODUCT HIGHLIGHTS .................................... 1
Changes to SPECIFICATIONS ................................................... 2
Changes to Figure 2 ...................................................................... 5
Changes to ORDERING GUIDE ................................................ 6
Change to PIN FUNCTION DESCRIPTIONS ........................ 7
Edits to Output Propagation Delay section. ........................... 10
Added TPCs 5–8, 10–12, 14, 16, 18, 20, 22, 27, 31–32, 34 ... 12
Changes to TPCs........................................... 17, 19, 26, 35–36, 38
Added text to ENCODE INPUT section ................................ 18
Added DS INPUTS section ....................................................... 19
Change to Table I ....................................................................... 19
Changes to LVDS Outputs section........................................... 20
Changes to Voltage Reference section ...................................... 20
Replaced Figure 12...................................................................... 20
Change to Troubleshooting section .......................................... 22
Updated OUTLINE DIMENSIONS.......................................... 27
Upgraded for AD9430-210 ............................................Universal
5/02—Revision 0: Initial Version
Rev. C | Page 3 of 40
AD9430

DC SPECIFICATIONS

AVDD = 3.3 V, DRVDD = 3.3 V, T unless otherwise noted.
Table 1.
AD9430-170 AD9430-210 Parameter Temp Test Level Min Typ Max Min Typ Max Unit
RESOLUTION 12 Bits ACCURACY No Missing Codes Full VI Guaranteed Guaranteed Offset Error 25°C I –3 +3 –3 +3 mV Gain Error 25°C I –5 +5 –5 +5 % FS Differential Nonlinearity (DNL) 25°C I –1 ± 0.3 +1 –1 ± 0.3 +1 LSB Full VI –1 ± 0.3 +1.5 –1 ± 0.3 +1.5 LSB Integral Nonlinearity (INL) 25°C I –1.5 ± 0.5 +1.5 Full VI –2.25 ± 0.5 +2.25 –2.5 ± 0.3 +2.5 LSB TEMPERATURE DRIFT Offset Error Full V 58 58 µV/°C Gain Error Full V 0.02 0.02 %/°C Reference Out (VREF) Full V +0.12/–0.24 +0.12/–0.24 mV/°C REFERENCE Reference Out (VREF) 25°C I 1.15 1.235 1.3 1.15 1.235 1.3 V Output Current I
Input Current2 25°C I 20 20 mA
VREF
I
Input Current2 25°C I 1.6 5.0 1.6 5.0 mA
SENSE
1
ANALOG INPUTS (VIN+, VIN–)3
Differential Input Voltage Range (S5 = GND)
Differential Input Voltage Range (S5 = AVDD) Input Common-Mode Voltage Full VI 2.65 2.8 2.9 2.65 2.8 2.9 V Input Resistance Full VI 2.2 3 3.8 2.2 3 3.8 kΩ Input Capacitance 25°C V 5 5 pF POWER SUPPLY (LVDS Mode) AVDD Full IV 3.1 3.3 3.6 3.2 3.3 3.6 V DRVDD Full IV 3.0 3.3 3.6 3.0 3.3 3.6 V Supply Currents: I I
(AVDD = 3.3 V)
ANALOG
(DRVDD = 3.3 V)4 Full VI 55 62 55 62 mA
DIGITAL
4
Power Dissipation4 Full VI 1.29 1.43 1.5 1.7 W Power Supply Rejection 25°C V –7.5 –7.5 mV/V POWER SUPPLY (CMOS Mode) AVDD Full IV 3.1 3.3 3.6 3.2 3.3 3.6 V DRVDD Full IV 3.0 3.3 3.6 3.0 3.3 3.6 V Supply Currents: I
(AVDD = 3.3 V)5 Full IV 335 372 390 450 mA
AVDD
I
(DRVDD = 3.3 V)5 Full IV 24 30 30 30 mA
DRVDD
Power Dissipation5 Full IV 1.1 1.3 W Power Supply Rejection 25°C V –7.5 –7.5 mV/V
1
Internal reference mode; SENSE = Floats.
2
External reference mode; SENSE = DRVDD, VREF driven by external 1.23 V reference.
3
S5 (Pin 1) = GND. See Analog Input section. S5 = GND in all dc, ac tests unless otherwise specified.
4
I
and I
AVDD
Characteristics and Application Notes sections for I
5
I
AVDD
Characteristics and Application Notes sections for I
are measured with an analog input of 10.3 MHz, –0.5 dBFS, sine wave, rated ENCODE rate, and in LVDS output mode. See Typical Performance
DRVDD
and I
are measured with an analog input of 10.3 MHz, –0.5 dBFS, sine wave, rated ENCODE rate, and in CMOS output mode. See Typical Performance
DRVDD
= –40°C, T
MIN
= +85°C, fIN = –0.5 dBFS, internal reference, full scale = 1.536 V, LVDS output mode,
MAX
–1.75
± 0.3 +1.75 LSB
25°C IV 3.0 3.0 mA
Full V 1.536 1.536 V Full V 0.766 0.766 V
Full VI 335 372 390 450 mA
. Power consumption is measured with a dc input at rated ENCODE rate in LVDS output mode.
DRVDD
. Power consumption is measured with a dc input at rated ENCODE rate in CMOS output mode.
DRVDD
Rev. C | Page 4 of 40
AD9430

AC SPECIFICATIONS

AVDD = 3.3 V, DRVDD = 3.3 V, T unless otherwise noted.
1
Table 2
.
Parameter Temp Test Level Min Typ Max Min Typ Max Unit
SNR Analog Input @ –0.5 dBFS 10 MHz 25°C I 63.5 65 62.5 64.5 dB 70 MHz 25°C I 63 65 62.5 64.5 dB 100 MHz 25°C V 65 64.5 dB 240 MHz 25°C V 61 61 dB SINAD Analog Input @ –0.5 dBFS 10 MHz 25°C I 63.5 65 62.5 64.5 dB 70 MHz 25°C I 63 65 62.5 64.5 dB 100 MHz 25°C V 65 64.5 dB 240 MHz 25°C V 60 60 dB EFFECTIVE NUMBER OF BITS (ENOB) 10 MHz 25°C I 10.2 10.6 10.2 10.5 Bits 70 MHz 25°C I 10.2 10.6 10.2 10.5 Bits 100 MHz 25°C V 10.6 10.5 Bits 240 MHz 25°C V 9.8 9.8 Bits WORST HARMONIC (2nd or 3rd) Analog Input @ –0.5 dBFS 10 MHz 10 MHz 25°C I –85 –75 –84 –74 dBc 70 MHz 25°C I –85 –75 –84 –74 dBc 100 MHz 25°C V –77 –77 dBc 240 MHz 25°C V –63 –63 dBc WORST HARMONIC (4th or Higher) Analog Input @ –0.5 dBFS 10 MHz 10 MHz 25°C I –87 –78 –87 –77 dBc 70 MHz 25°C I –87 –78 –87 –77 dBc 100 MHz 25°C V –77 –77 dBc 240 MHz 25°C V –63 –63 dBc TWO-TONE IMD2 F1, F2 @ –7 dBFS 25°C V –75 –75 dBc ANALOG INPUT BANDWIDTH 25°C V 700 700 MHz
1
All ac specifications tested by driving CLK+ and CLK– differentially.
2
F1 = 28.3 MHz, F2 = 29.3 MHz.
= –40°C, T
MIN
= +85°C, fIN = –0.5 dBFS, internal reference, full scale = 1.536 V, LVDS output mode,
MAX
AD9430-170 AD9430-210
Rev. C | Page 5 of 40
AD9430

DIGITAL SPECIFICATIONS

AVDD = 3.3 V, DRVDD = 3.3 V, T
Table 3.
Test AD9430-170 AD9430-210 Parameter Temp Level Min Typ Max Min Typ Max Unit
ENCODE AND DS INPUTS (CLK+, CLK–, DS+, DS–)1 Differential Input Voltage2 Full IV 0.2 0.2 V Common-Mode Voltage3 Full VI 1.375 1.5 1.575 1.375 1.5 1.575 V Input Resistance Full VI 3.2 5.5 6.5 3.2 5.5 6.5 kΩ Input Capacitance 25°C V 4 4 pF LOGIC INPUTS (S1, S2, S4, S5) Logic 1 Voltage Full IV 2.0 2.0 V Logic 0 Voltage Full IV 0.8 0.8 V Logic 1 Input Current Full VI 190 190 µA Logic 0 Input Current Full VI 10 10 µA Input Resistance 25°C V 30 30 kΩ Input Capacitance 25°C V 4 4 pF LOGIC OUTPUTS (CMOS Mode) Logic 1 Voltage4 Full IV DRVDD DRVDD V –0.05 –0.05 Logic 0 Voltage4 Full IV 0.05 0.05 V LOGIC OUTPUTS (LVDS Mode)4, 5 VOD Differential Output Voltage Full VI 247 454 247 454 mV VOS Output Offset Voltage Full VI 1.125 1.375 1.125 1.375 V Output Coding Twos complement or binary Twos complement or binary
1
ENCODE and DS inputs identical on-chip. See Equivalent Circuits section.
2
All ac specifications tested by driving CLK+ and CLK– differentially, |(CLK+) – (CLK–)| > 200 mV.
3
ENCODE inputs’ common mode can be externally set, such that 0.9 V < ENC± < 2.6 V.
4
Digital output logic levels: DRVDD = 3.3 V, C
5
LVDS R
= 100 , LVDS output current set resistor (R
TERM
= –40°C, T
MIN
= 5 pF.
LOAD
= +85°C, unless otherwise noted.
MAX
) = 3.74 k(1% tolerance).
SET
Rev. C | Page 6 of 40
AD9430

SWITCHING SPECIFICATIONS

AVDD = 3.3 V, DRVDD = 3.3 V, T
Table 4.
Test AD9430-170 AD9430-210 Parameter (Conditions) Temp Level Min Typ Max Min Typ Max Unit
Maximum Conversion Rate1 Full VI 170 Minimum Conversion Rate
1
Full V
CLK+ Pulse Width High (tEH)1 Full IV 2 CLK+ Pulse Width Low (tEL)1 Full IV 2 DS Input Setup Time (t DS Input Hold Time (t
)2 Full IV –0.5 –0.5 ns
SDS
)2 Full IV 1.75 1.75 ns
HDS
OUTPUT (CMOS Mode) Valid Time (tV) Full IV 2 2 ns Propagation Delay (tPD) Full IV 3.8 5 3.8 5 ns Rise Time (tR) (20% to 80%) 25°C V 1 1 ns Fall Time (tF) (20% to 80%) 25°C V 1 1 ns DCO Propagation Delay (tCPD) Full IV 3.8 5 3.8 5 ns Data to DCO Skew (tPD – t
) Full IV –0.5 0 +0.5 –0.5 0 +0.5 ns
CPD
Interleaved Mode (A, B Latency) Full IV 14, 14 14, 14 Cycles Parallel Mode (A, B Latency) Full IV 15, 14 15, 14 Cycles OUTPUT (LVDS Mode) Valid Time (tV) Full VI 2.0 2.0 ns Propagation Delay (tPD) Full VI 3.2 4.3 3.2 4.3 ns Rise Time (tR) (20% to 80%) 25°C V 0.5 0.5 ns Fall Time (tF) (20% to 80%) 25°C V 0.5 0.5 ns DCO Propagation Delay (t Data to DCO Skew (tPD – t
CPD
) Full IV 0.2 0.5 0.8 0.2 0.5 0.8 ns
CPD
Latency Full IV 14 14 Cycles Aperture Delay (tA) 25°C V 1.2 1.2 ns Aperture Uncertainty (Jitter, tJ) 25°C V 0.25 0.25 ps rms Out of Range Recovery Time (CMOS and LVDS) 25°C V 1 1 Cycles
1
All ac specifications tested by driving CLK+ and CLK– differentially.
2
DS inputs used in CMOS mode only.
= –40°C, T
MIN
= +85°C, unless otherwise noted.)
MAX
40
12.5 2
12.5 2
210
MSPS 40 MSPS
12.5 ns
12.5 ns
) Full VI 1.8 2.7 3.8 1.8 2.7 3.8 ns
Rev. C | Page 7 of 40
AD9430
CLK+
CLK–
DS+
DS–
PORT A
DA11–DA0
PORT B
DB11–DB0
PORT A
DA11–DA0
PORT B
DB11–DB0
DCO–
DCO+
t
HDS
INTERLEAVED DATA OUT
STATIC
STATIC
PARALLEL DATA OUT
STATIC
STATIC
STATIC
t
SDS
14 CYCLES
INVALID
INVALID
INVALID
INVALID
INVALID
INVALID
INVALID
t
PD
N N+2
N+1
N N+2
N+1 N+3
t
CPD
N+3
t
V
02607-002
Figure 2. CMOS Timing Diagram
N
1
A
IN
N
N+1
t
EL
t
EH
CLK+
CLK–
DATA OUT
DCO+
DCO–
t
CPD
1/f
S
t
PD
N–14
N–13
14 CYCLES
N
N+1
02607-003
Figure 3. LVDS Timing Diagram
Rev. C | Page 8 of 40
AD9430

ABSOLUTE MAXIMUM RATINGS

Table 5.
Parameter Rating AVDD, DRVDD 4 V Analog Inputs –0.5 V to AVDD + 0.5 V Digital Inputs –0.5 V to DRVDD + 0.5 V REFIN Inputs –0.5 V to AVDD + 0.5 V Digital Output Current 20 mA Operating Temperature –55ºC to +125°C Storage Temperature –65ºC to +150°C Maximum Junction Temperature 150°C Maximum Case Temperature 150°C
1
θ
JA
25°C/W, 32°C/W
1
Typical θJA = 32°C/W (heat slug not soldered); typical θJA = 25°C/W (heat slug
soldered) for multilayer board in still air with solid ground plane.
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
EXPLANATION OF TEST LEVELS
Test L ev el
I. 100% production tested.
II. 100% production tested at 25°C and sample tested at
specified temperatures.
III. Sample tested only. IV. Parameter is guaranteed by design and characterization
testing.
V. Parameter is a typical value only.
VI. 100% production tested at 25°C; guaranteed by design and
characterization testing for industrial temperature range; 100% production tested at temperature extremes for military devices.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. C | Page 9 of 40
AD9430
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
DNC
AGND
DNC
AVDD AGND
SENSE
VREF AGND AGND AVDD AVDD AGND AGND AVDD AVDD AGND
VIN+
VIN– AGND AVDD AGND
AGND
AVDD
AVDD
AGND
AGND
AVDD
AVDD
AGND
AGND
AGND
AVDD
AVDD
AVDD
AGND
AGND
OR_A
DA11
99989796959493
100
S5
1 2
S4
3 4
S2
5
S1
6 7 8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
2627282930
AVDD
AVDD
AVDD
AGND
AGND
31
DS+
AGND
929190
89
88
8786858483
AD9430
CMOS PI NOUT
TOP VIEW
(Not to S cale)
33
32
343536
DS–
AVDD
AGND
CLK+
37
CLK–
38
AVDD
AGND
39
40
414243
DNC
AVDD
AGND
DRVDD
DRGND
DA10 81
82
4445464748
DB1
DB0
DNC
DA979DA878DA777DA676DA5 80
50
49
DB3
DB2
DRVDD
DB4
DRGND
75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
DRVDD DRGND DA4 DA3 DA2 DA1 DA0 DNC DRGND DNC DNC DCO+ DCO– DRVDD DRGND OR_B DB11 DB10 DB9 DB8 DB7 DRVDD DRGND DB6 DB5
02607-004
Figure 4. CMOS Dual-Mode Pinout
Rev. C | Page 10 of 40
AD9430
Table 6. Pin Function Descriptions (CMOS Mode)
Pin Number Mnemonic Function
1 S5
Full-Scale Adjust Pin. AVDD sets f
= 1.536 V p-p differential.
sets f
S
2, 7, 42, 43, 65, 66, 68 DNC Do Not Connect. 3 S4 Interleaved, Parallel Select Pin. High = interleaved. 4, 9, 12, 13, 16, 17, 20, 23, 25, 26, 30, 31, 35, 38, 41, 86,
87, 91, 92, 93, 96, 97, 100
AGND1 Analog Ground.
5 S2 Output Mode Select. Low = dual-port CMOS, high = LVDS.
6 S1
8, 14, 15, 18, 19, 24, 27, 28, 29, 34, 39, 40, 88, 89, 90, 94, 95, 98, 99
AVDD 3.3 V Analog Supply.
Data Format Select. Low = binary, CMOS and LVDS mode.
10 SENSE Reference Mode Select Pin. Float for internal reference operation. 11 VREF 1.235 V Reference I/O—Function Dependent on SENSE. 21 VIN+ Analog Input—True. 22 VIN– Analog Input—Complement. 32 DS+ Data Sync (Input)—True. Tie low if not used. 33 DS– Data Sync (Input)—Complement. Tie high if not used. 36 CLK+ Clock Input—True. 37 CLK– Clock Input—Complement. 44 DB0 B Port Output Data Bit (LSB). 45 DB1 B Port Output Data Bit. 46 DB2 B Port Output Data Bit. 47, 54, 62, 75, 83 DRVDD 3.3 V Digital Output Supply (3.0 V to 3.6 V). 48, 53, 61, 67, 74, 82 DRGND1 Digital Output Ground. 49 DB3 B Port Output Data Bit. 50 DB4 B Port Output Data Bit. 51 DB5 B Port Output Data Bit. 52 DB6 B Port Output Data Bit. 55 DB7 B Port Output Data Bit. 56 DB8 B Port Output Data Bit. 57 DB9 B Port Output Data Bit. 58 DB10 B Port Output Data Bit. 59 DB11 B Port Output Data Bit (MSB). 60 OR_B B Port Overrange. 63 DCO– Data Clock Output—Complement. 64 DCO+ Data Clock Output—True. 69 DA0 A Port Output Data Bit (LSB). 70 DA1 A Port Output Data Bit. 71 DA2 A Port Output Data Bit. 72 DA3 A Port Output Data Bit. 73 DA4 A Port Output Data Bit. 76 DA5 A Port Output Data Bit. 77 DA6 A Port Output Data Bit. 78 DA7 A Port Output Data Bit. 79 DA8 A Port Output Data Bit. 80 DA9 A Port Output Data Bit. 81 DA10 A Port Output Data Bit. 84 DA11 A Port Output Data Bit (MSB). 85 OR_A A Port Overrange.
1
AGND and DRGND should be tied together to a common ground plane.
= 0.768 V p-p differential, GND
S
high = twos
complement for both
Rev. C | Page 11 of 40
AD9430
DNC
AGND
LVDSBIAS
AVDD
AGND
SENSE
VREF AGND AGND
AVDD
AVDD AGND AGND
AVDD
AVDD AGND
VIN+ VIN–
AGND
AVDD AGND
AGND
AVDD
AVDD
AGND
AGND
AVDD
AVDD
AGND
AGND
AGND
AVDD
AVDD
AVDD
AGND
AGND
OR+
OR–
DRVDD
DRGND
D11+
D11–79D10+78D10–77D9+76D9–
DNC
DNC
81
82
80
4445464748
DNC
DNC
DNC
DRVDD
49
D0–
DRGND
75
DRVDD
74
DRGND
73
D8+
72
D8–
71
D7+
70
D7–
69
D6+
68
D6–
67
DRGND
66
D5+
65
D5–
64
DCO+
63
DCO–
62
DRVDD
61
DRGND
60
D4+
59
D4–
58
D3+
57
D3–
56
D2+ D2–
55 54
DRVDD
53
DRGND
52
D1+
51
D1–
50
D0+
02607-005
99989796959493
100
S5
1 2 3
S4
4 5
S2
6
S1
7 8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
2627282930
AVDD
AVDD
AVDD
AGND
AGND
31
32
GND
AGND
33
AVDD
929190
343536
AVDD
AGND
8786858483
89
88
AD9430
LVDS PINOUT
TOP VIEW
(Not to Scale)
37
39
38
CLK–
CLK+
AVDD
AGND
40
AVDD
414243
AGND
Figure 5. LVDS Mode Pinout
Rev. C | Page 12 of 40
AD9430
Table 7. Pin Function Descriptions (LVDS Mode)
Pin Number Mnemonic Function
1 S5 Full-Scale Adjust Pin. AVDD sets fS = 0.768 V p-p differential, GND sets fS = 1.536 V p-p differential. 2, 42 to 46 DNC Do Not Connect.
3 S4
4, 9, 12, 13, 16, 17, 20, 23, 25, 26, 30, 31, 35, 38, 41, 86, 87, 91, 92, 93, 96, 97, 100
5 S2 Output Mode Select. GND = dual-port CMOS; AVDD = LVDS. 6 S1
7 LVDSBIAS
8, 14, 15, 18, 19, 24, 27, 28, 29, 33, 34, 39, 40, 88, 89, 90, 94, 95, 98, 99 10 SENSE 11 VREF 1.235 V Reference I/O—Function Dependent on SENSE. 21 VIN+ Analog Input—True. 22 VIN– Analog Input—Complement. 32 GND Data Sync (Input)—Not Used in LVDS Mode. Tie to GND. 36 CLK+ Clock Input—True (LVPECL Levels). 37 CLK– Clock Input—Complement (LVPECL Levels). 47, 54, 62, 75, 83 DRVDD 3.3 V Digital Output Supply (3.0 V to 3.6 V). 48, 53, 61, 67, 74, 82 DRGND1 Digital Output Ground. 49 D0– D0 Complement Output Bit (LSB). 50 D0+ D0 True Output Bit (LSB). 51 D1– D1 Complement Output Bit. 52 D1+ D1 True Output Bit. 55 D2– D2 Complement Output Bit. 56 D2+ D2 True Output Bit. 57 D3– D3 Complement Output Bit. 58 D3+ D3 True Output Bit. 59 D4– D4 Complement Output Bit. 60 D4+ D4 True Output Bit. 63 DCO– Data Clock Output—Complement. 64 DCO+ Data Clock Output—True. 65 D5– D5 Complement Output Bit. 66 D5+ D5 True Output Bit. 68 D6– D6 Complement Output Bit. 69 D6+ D6 True Output Bit. 70 D7– D7 Complement Output Bit. 71 D7+ D7 True Output Bit. 72 D8– D8 Complement Output Bit. 73 D8+ D8 True Output Bit. 76 D9– D9 Complement Output Bit. 77 D9+ D9 True Output Bit. 78 D10– D10 Complement Output Bit. 79 D10+ D10 True Output Bit. 80 D11– D11 Complement Output Bit. 81 D11+ D11 True Output Bit. 84 OR– Overrange Complement Output Bit. 85 OR+ Overrange True Output Bit.
AGND1 Analog Ground.
AVDD 3.3 V Analog Supply.
1
AGND and DRGND should be tied together to a common ground plane.
Control Pin for CMOS Mode. Tie low when operating in LVDS mode.
Data Format Select. GND = binary, AVDD = twos complement. Set Pin for LVDS Output Current. Place 3.74 kW resistor
terminated to ground.
Reference Mode Select Pin. Float for internal reference operation.
Rev. C | Page 13 of 40
AD9430

TERMINOLOGY

Analog Bandwidth
The analog input frequency at which the spectral power of the fundamental frequency (as determined by the FFT analysis) is reduced by 3 dB.
Aperture Delay
The delay between the 50% point of the rising edge of the ENCODE command and the instant at which the analog input is sampled.
Aperture Uncertainty (Jitter) The sample-to-sample variation in aperture delay.
Crosstalk
Coupling onto one channel being driven by a low level (–40 dBFS) signal when the adjacent interfering channel is driven by a full-scale signal.
Differential Analog Input Resistance, Differential Analog Input Capacitance, and Differential Analog Input Impedance
The real and complex impedances measured at each analog input port. The resistance is measured statically and the capacitance and differential input impedances are measured with a network analyzer.
Full-Scale Input Power Expressed in dBm. Computed using the following equation:
Power
FULLSCALE
⎛ ⎜
2
V
FULLSCALE
=
log10
Z
INPUT
⎜ ⎝
001.0
RMS
⎞ ⎟
⎟ ⎟
⎟ ⎠
Gain Error
The difference between the measured and ideal full-scale input voltage range of the ADC.
Harmonic Distortion, Second
The ratio of the rms signal amplitude to the rms value of the second harmonic component, reported in dBc.
Harmonic Distortion, Third
The ratio of the rms signal amplitude to the rms value of the third harmonic component, reported in dBc.
Integral Nonlinearity
The deviation of the transfer function from a reference line measured in fractions of 1 LSB using a “best straight line” determined by a least square curve fit.
Differential Analog Input Voltage Range
The peak-to-peak differential voltage that must be applied to the converter to generate a full-scale response. Peak differential voltage is computed by observing the voltage on a single pin and subtracting the voltage from the other pin, which is 180° out of phase. Peak-to-peak differential is computed by rotating the input’s phase 180° and again taking the peak measurement. The difference is then computed between both peak measurements.
Differential Nonlinearity The deviation of any code width from an ideal 1 LSB step.
Effective Number of Bits (ENOB) Calculated from the measured SNR based on the equation
ENOB
MEASURED
=
76.1 dBSNR
02.6
ENCODE Pulse Width/Duty Cycle
Pulse width high is the minimum amount of time the ENCODE pulse (clock pulse) should be left in Logic 1 state to achieve rated performance; pulse width low is the minimum time the ENCODE pulse should be left in low state. See timing implications of changing t
in the Application Notes, Encode
EH
Input section. At a given clock rate, these specifications define an acceptable ENCODE duty cycle.
Minimum Conversion Rate
The ENCODE rate at which the SNR of the lowest analog
frequency drops by no more than 3 dB below the
signal guaranteed limit.
Maximum Conversion Rate The ENCODE rate at which parametric testing is performed.
Output Propagation Delay
The delay between a differential crossing of CLK+ and CLK– and the time when all output data bits are within valid logic levels.
Noise (for Any Range within the ADC) Calculated as follows:
NOISE
ZV
××=
10001.0
⎜ ⎝
10
dBFSdBcdBM
⎟ ⎠
SignalSNRFS
where Z is the input impedance, FS is the full scale of the device for the frequency in question, SNR is the value of the particular input level, and Signal is the signal level within the ADC, reported in dB below full scale. This value includes input levels both thermal and quantization noise.
Power Supply Rejection Ratio
The ratio of a change in input offset voltage to a change in power supply voltage.
Rev. C | Page 14 of 40
AD9430
Signal-to-Noise-and-Distortion (SINAD)
The ratio of the rms signal amplitude (set 1 dB below full scale) to the rms value of the sum of all other spectral components, including harmonics but excluding dc.
Worst Other Spur
The ratio of the rms signal amplitude to the rms value of the worst spurious component (excluding the second and third harmonic) reported in dBc.
Signal-to-Noise Ratio (without Harmonics)
The ratio of the rms signal amplitude (set at 1 dB below full scale) to the rms value of the sum of all other spectral components, excluding the first five harmonics and dc.
Spurious-Free Dynamic Range (SFDR)
The ratio of the rms signal amplitude to the rms value of the peak spurious spectral component. The peak spurious component may or may not be a harmonic. May be reported in dBc (i.e., degrades as signal level is lowered) or dBFS (always related back to converter full scale).
Two-Tone Intermodulation Distortion Rejection
The ratio of the rms value of either input tone to the rms value of the worst third-order intermodulation product reported in dBc.
Two -Tone SFDR
The ratio of the rms value of either input tone to the rms value of the peak spurious component. The peak spurious component may or may not be an IMD product. May be reported in dBc (i.e., degrades as signal level is lowered) or in dBFS (always related back to converter full scale).
;
Transi ent Res p onse T i m e
The time it takes for the ADC to reacquire the analog input after a transient from 10% above negative full scale to 10% below positive full scale.
Out-of-Range Recovery Time
The time it takes for the ADC to reacquire the analog input after a transient from 10% above positive full scale to 10% above negative full scale, or from 10% below negative full scale to 10% below positive full scale.
Rev. C | Page 15 of 40
AD9430
V

EQUIVALENT CIRCUITS

AVDD
12k
CLK+
OR
DS+
10k
150
12k
150
FULL
K
SCALE
S5 = 0 —> K = 1.24
CLK– OR
10k
DS–
+
1V
S5 = 1 —> K = 0.62
A1
200
0.1µF
VREF
VIN+
Figure 6. ENCODE and DS Inputs
3.5k
20k
Figure 7. Analog Inp uts
S1, S2,
S4, S5
30k
1k
VDD
02607-006
DISABLE
A1
Figure 9. VREF, SENSE I/O
DR
DX
3.5k
20k
AVDD
VIN–
02607-007
SENSE
02607-009
DD
02607-010
VDD
Figure 10. Data Outputs (CMOS Mode)
02607-008
V
DX–
V
DRVDD
V
DX+
V
Figure 8. S1-S5 Inputs
02607-011
Figure 11. Data Outputs (LVDS Mode)
Rev. C | Page 16 of 40
AD9430

TYPICAL PERFORMANCE CHARACTERISTICS

Charts at 170 MSPS, 210 MSPS for –170, –210 grades, respectively. AVDD, DRVDD = 3.3 V, T = 25C, AIN differential drive, Full scale = 1.536 V, internal reference unless otherwise noted.
0
–10
–20
–30
–40
–50
dB
–60
–70
–80
–90
–100
Figure 12. FFT: f
0
–10
–20
–30
–40
–50
dB
–60
–70
–80
–90
–100
04010 20 30 50 60 70 80
Figure 13. FFT: f
0
–10
–20
–30
–40
–50
dB
–60
–70
–80
–90
–100
Figure 14. FFT: f
SNR = 65.2dB SINAD = 65.1dB H2 = –88.8dBc H3 = –88.1dBc SFDR = 87dBc
04010 20 30 50 60 70 80
= 170 MSPS, AIN = 10.3 MHz @ −0.5 dBFS, LVDS Mode
s
SNR = 65.1dB SINAD = 64.9dB FUND = –0.50dBFS H2 = –88.6dBc H3 = –94.6dBc SFDR = 85.9dBc
= 170 MSPS, AIN = 65 MHz @ –0.5 dBFS, LVDS Mode
s
SNR = 64.93dB SINAD = 64.85dB FUND = –0.44dBFS H2 = –92.1dBc H3 = –90.1dBc SFDR = 75.6dBc
04010 20 30 50 60 70 80
= 170 MSPS, AIN = 65 MHz @ –0.5 dBFS, CMOS Mode
s
MHz
MHz
MHz
85
02607-012
85
02607-013
85
02607-015
0
–10
–20 –30 –40
dB
–50
–60
–70
–80 –90
–100
04010 20 30 50 60 70 80
Figure 15. FFT: f
SNR = 62.99dBFS SINAD = 61.45dBFS H2 = –66.8dBc H3 = –82.5dBc SFDR = 66.1dBc
MHz
= 170 MSPS, AIN = 10.3, MHz @ –0.5 dBFS, Single-Ended
s
Input, Full Scale = 0.76 V, LVDS Mode
0
–10
–20
–30
–40
–50
dB
–60
–70
–80
–90
–100
0 153045607590105
Figure 16. FFT: f
0
–10
–20 –30
–40
–50
dB
–60
–70 –80
–90
–100
0 15 30 45 60 75 90 105
Figure 17. FFT: f
= 210 MSPS, AIN = 10.3 MHZ @ –0.5 dBFS, LVDS Mode
s
= 210 MSPS, AIN = 65 MHz @ –0.5 dBFS, CMOS Mode
s
MHz
MHz
SNR = 63.6dB SINAD = 62.9dB H2 = –82.5dBc H3 = –78.6dBc SFDR = 77.7dBc
SNR = 63.1dB SINAD = 62.8dB H2 = –81.1dBc H3 = –76dBc SFDR = –76dBc
85
02607-015
02607-016
02607-017
Rev. C | Page 17 of 40
AD9430
0 –10
–20
–30
–40
–50
dB
–60
–70
–80
–90
–100
0 15 30 45 60 75 90 105
Figure 18. FFT: f
85
80
75
70
65
dB
60
55
50
45
40
0 100 150 250 35050 200 300 400
= 210 MSPS, AIN = 65 MHz @ –0.5 dBFS, LVDS Mode
s
FULL SCALE = 1.5
Figure 19. SNR, SINAD, and SFDR vs. A
A
@ –0.5 dBFS, LVDS Mode
IN
SFDR
AIN (MHz)
SNR = 63.5dB SINAD = 62.6dB H2 = –79dBc H3 = –76.1dBc SFDR = 75.2dBc
MHz
SNR
Frequency, fS = 210 MSPS,
IN
SINAD
02607-018
02607-019
0
SNR = 63.3dB
–10
SINAD = 63.1dB H2 = –80.38dBc
–20
H3 = –81.8dBc SFDR = 80.8dBc
–30
–40
–50
dB
–60 –70
–80
–90
–100
0 153045607590105
Figure 21. FFT: f
85
80
75
70
65
dB
60
55
50
45
40
0 100 150 250 35050 200 300 400
= 213 MSP, AIN = 100 MHz @ –0.5 dBFS, LVDS Mode
s
FULL SCALE = 0.75
Figure 22. SNR, and SINAD vs. A
A
@ –0.5 dBFS, LVDS Mode, Full Scale = 0.76 V
IN
MHz
SNR
SINAD
AIN (MHz)
Frequency ; fs = 210 MSPS,
IN
02607-021
02607-022
100
THIRD
90
80
SFDR
70
dB
60
50
40
0 200 40050 100 150 250 300 350
AIN(MHz)
Figure 20. Harmonic Distortion (Second and Third)
and SFDR vs. A
Frequenc y
IN
SECOND
02607-020
Rev. C | Page 18 of 40
100
90
THIRD
80
SFDR
70
dB
60
50
40
0 200 40050 100 150 250 300 350
SECOND
AIN(MHz)
Figure 23. Harmonic Distortion (Second and Third) and
SFDR vs. A
Frequency, fs = 170 MSPS, CMOS Mode
IN
02607-023
AD9430
70
68
66
64 62
60
dB
58
56
54
52 50
0 100 15050 200 250 300 350 400
Figure 24. SNR, and SINAD vs. A
A
@ –0.5 dBFS, LVDS Mode
IN
–170 SNR
–170 SINAD
AIN (MHz)
Frequency ; fs = 170, 210 MSPS,
IN
–210 SNR
–210 SINAD
02607-024
0
–30
–60
dB
–90
–120
0 102030405060 809010070
SFDR = 63dBc
MHz
Figure 27. Two-Tone Intermodulation Distortion (59 MHz and 60 MHz),
LVD S Mod e, f
= 210 MSPS
s
02607-027
85
80
75
70
65
dB
60
55
50
45
40
0 100 150 250 35050 200 300 400
Figure 25. SNR, and SINAD, SFDR vs. A
f
= 210 MSPS, AIN @ –0.5 dBFS, CMOS Mode
s
0
SFDR = 75dBc
–10
–20
–30
–40
dB
–50
–60
–70
–80
–90
–100
04010 20 30 50 60 70 80
SNR
AIN (MHz)
MHz
SFDR
SINAD
Frequency;
IN
Figure 26. Two-Tone Intermodulation Distortion
(28.3 MHz and 29.3 MHz; LVDS Mode, f
= 170 MSPS)
s
02607-025
85
02607-026
95
90
85
80
75
dB
70
65
60
55
50
0 25050 100 150 200
SFDR
SINAD
MHz
Figure 28. SINAD and SFDR vs. Clock Rate
(A
= 10.3 MHz @ –0.5 dBFS, LVDS Mode), –170 Grade
IN
85
80
75
70
65
dB
60
55
50
45
40
0 100 150 25050 200
SINAD
SFDR
SNR
MHz
Figure 29. SNR, and SINAD, SFDR vs. Clock Rate
= 10.3 MHz, @ –0.5 dBFS), LVDS Mode, –210 Grade
(A
IN
02607-028
02607-029
Rev. C | Page 19 of 40
AD9430
400
ANALOG SUPPLY CURRENT CMOS
350
MODE
300
250
OUTPUT SUPPLY CURRENT LVDS
200
MODE
150
100
(ANALOG SUPPLY CURRENT) (mA)
50
AVDD
I
0
100 220140 160 180 200120
Figure 30. I
AVDD
and I
ENCODE (MSPS)
vs. Clock Rate (AIN = 10.3 MHz @ –0.5 dBFS)
DRVDD
170 MSPS Grade, C
450
ANALOG SUPPLY
400
CURRENT LVDS MODE
350
300
250
200
150
100
(ANALOG SUPPLY CURRENT) (mA)
50
AVDD
I
0
100 140 160 200
(A
OUTPUT SUPPLY CURRENT LVDS MODE
120 180
Figure 31. I
= 10.3 MHz @ –0.5 dBFS) 210 MSPS Grade, C
IN
ENCODE (MSPS)
AVDD
ANALOG SUPPLY CURRENT LVDS MODE
OUTPUT SUPPLY CURRENT CMOS MODE
= 5pF
LOAD
ANALOG SUPPLY CURRENT CMOS MODE
OUTPUT SUPPLY CURRENT CMOS MODE
and I
vs. Clock Rate
DRVDD
220
LOAD
240
= 5 pF
80
60
40
20
0
90
80
70
60
50
40
30
20
10
0
(OUTPUT SUPPLY CURRENT) (mA)
DRVDD
I
02607-030
(OUTPUT SUPPLY CURRENT) (mA)
DRVDD
I
02607-031
80
75
70
65
dB
60
55
50
20 40 50 7030 60 80
ENCODE POSITIVE DUTY CYCLE (%)
SFDR
SNR
SINAD
Figure 33. SNR, SINAD, and SFDR vs. ENCODE Pulse Width High,
= 10.3 MHz @ –0.5 dBFS, 210 MSPS, LVDS)
(A
IN
1.4
1.2
1.0
0.8
(V)
0.6
REFOUT
V
0.4
0.2
0
081472
RO = 13Ω TYP
Figure 34. V
I
LOAD
536
(mA)
vs. I
REFOUT
LOAD
02607-033
02607-034
85
80
75
70
dB
65
60
55
50
10 60 9020 40 50 70 8030
SFDR
SNR
SINAD
ENCODE POSITIVE DUTY CYCLE (%)
Figure 32. SINAD and SFDR vs. Clock Pulse Width High
(A
= 10.3 MHz @ –0.5 dBFS, 170 MSPS, LVDS)
IN
02607-032
Rev. C | Page 20 of 40
2.0
1.5
1.0
0.5
0
–0.5
GAIN ERROR (%)
–1.0
–1.5
–2.0
–50 10 95–30 –10 30 50 70 90
TEMPERATURE (°C)
% GAIN ERROR USING EXT REF
Figure 35. Full-Scale Gain Error vs. Temperature
= 10.3 MHz @ –0.5 dBFS, 170 MSPS/210 MSPS, LVDS)
(A
IN
02607-035
AD9430
1.250
1.245
1.00
0.75
0.50
1.240
(V)
REF
V
1.235
1.230
1.225
2.5 3.12.7 2.9 3.3 3.5 3.7 3.9
Figure 36. V
95
90
85
80
dB
75
70
65
60
–50 10–30 –10 30 50 70 90
SFDR
AVDD (V)
Output Voltage vs. AVDD
REF
THIRD
SECOND
TEMPERATURE (°C)
Figure 37. SNR, SINAD, SFDR vs. Temperature
= 10.3 MHz @ –0.5 dBFS, 170 MSPS)
(A
IN
SNR
SINAD
02607-036
02607-037
0.25
0
LSB
–0.25
–0.50
–0.75
–1.00
0 4000500 1500 2500 30001000 2000 3500
Figure 39. Typical INL Plot (A
1.00
0.75
0.50
0.25
0
LSB
–0.25
–0.50
–0.75
–1.00
0 4000500 1500 2500 30001000 2000 3500
Figure 40. Typical DNL Plot (A
CODE
= 10.3 MHz @ –0.5 dBFS, 170 MSPS, LVDS)
IN
CODE
= 10.3 MHz @ –0.5 dBFS)
IN
02607-039
02607-040
65
64
63
62
61
60
dB
59
58
57
56
55
–45 –5 15 55–25 35 75
TEMPERATURE (°C)
AVDD = 3.135
AVDD = 3.3
AVDD = 3.0
Figure 38. SINAD vs. Temperature, AVDD
= 70 MHz @ –0.5 dB, 210 MSPS, LVDS Mode)
(A
IN
AVDD = 3.6
02607-038
Rev. C | Page 21 of 40
100
90
80
70
60
50
dB
40
30
20
10
0
–100 0–70 –50 –30 –20–60 –40 –10–80–90
SFDR –dBFS
SFDR –dBc
80dB REFERENCE LINE
ANALOG INPUT LEVEL (dBFS)
Figure 41. SFDR vs. A
A
@ 10.3MHz,170 MSPS, LVDS Mode
IN
Input Level,
IN
02607-041
AD9430
90
80
70
60
50
dB
40
30
20
10
0
–90 –70 –60 –40 –20–80 –50 –30 –10
Figure 42. SFDR vs. A
90
80
70
60
50
dB
40
30
20
10
0
–90 –70 –60 –40 –20–80 –50 –30 –10
Figure 43. SFDR vs. A
SFDR dBc LVDS MODE FULL SCALE = 1.5
SFDR dBc CMOS MODE FULL SCALE = 1.5
80dB REFERENCE LINE
0
Input Level, AIN @ 10.3 MHz, 210 MSPS,
IN
LVD S/C MO S Mo des
SFDR dBc LVDS MODE FULL SCALE = 1.5
SFDR dBc LVDS MODE FULL SCALE = 0.75
80dB REFERENCE LINE
0
Input Level, AIN @ 10.3 MHz, 210 MSPS, LVDS Mode,
IN
Full Scale = 0.76 V/1.536 V
02607-042
02607-043
0
–20
–40
dB
–60
–80
–100
19.2 38.4
19.2
MHz
Figure 45. W-CDMA Four Channels Centered at 38.4 MHz,
= 153.6 MHz, LVDS Mode
f
s
90
80
70
60
50
dB
40
30
20
10
0
0 2.52.01.0 1.50.5
FULL-SCALE RANGE (V)
SFDR
SNR
SINAD
Figure 46. SNR, and SINAD. SFDR vs. Full-Scale Range, S5 = 0,
Full-Scale Range Varied by Adjusting VREF, 170 MSPS
47.6
02607-045
02607-046
0
NPR = 56.95dB ENCODE = 170MSPS
–20
NOTCH @ 19MHz
–40
–60
–80
–100
NOISE INPUT LEVEL (dB)
–120
–140
2.65 42.521.25
Figure 44. Noise Power Ratio Plot
4.5
4.0
3.5
ns
TPD
3.0 TCPD
2.5
MHz
02607-044
–40 1006020 40–20 0 80
TEMPERATURE (°C)
02607-047
Figure 47. Propagation Delay vs. Temperature, LVDS Mode,
170 MSPS/210 MSPS
Rev. C | Page 22 of 40
AD9430
4.5
4.0
3.5
ns
3.0
2.5 –40 1006020 40–20 0 80
TCPD (CLOCKOUT RISING)
TPDR (DATA RISING)
TEMPERATURE (°C)
Figure 48. Propagation Delay vs. Temperature,
CMOS Mode, 170 MSPS/210 MSPS
TPDF (DATA FALLING)
02607-048
900
800
700
600
500
(mV)
DIF
400
V
300
200
100
0
014106212
V
V
OS
OD
84
RSET (k)
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
(V)
OS
V
02607-049
Figure 49. LVDS Output Swing, Common-Mode Voltage vs. RSET,
Placed at LVDSBIAS, 170 MSPS/210 MSPS
Rev. C | Page 23 of 40
AD9430

APPLICATION NOTES

THEORY OF OPERATION
The AD9430 architecture is optimized for high speed and ease of use. The analog inputs drive an integrated high bandwidth track-and-hold circuit that samples the signal prior to quantization by the 12-bit core. For ease of use, the part includes an on-board reference and input logic that accepts TTL, CMOS, or LVPECL levels. The digital output’s logic levels are user selectable as standard 3 V CMOS or LVDS (ANSI-644 compatible) via Pin S2.
ENCODE INPUT
Any high speed A/D converter is extremely sensitive to the quality of the sampling clock provided by the user. A track-and­hold circuit is essentially a mixer, and any noise, distortion, or timing jitter on the clock is combined with the desired signal at the A/D output. For that reason, considerable care has been taken in the design of the clock inputs of the AD9430, and the user is advised to give careful thought to the clock source.
The AD9430 has an internal clock duty cycle stabilization circuit that locks to the rising edge of CLK+ and optimizes timing internally. This allows for a wide range of input duty cycles at the input without degrading performance. Jitter in
rising edge of the input is still of paramount concern and
the
not reduced by the internal stabilization circuit. The duty
is cycle control loop does not function for clock rates less than 30 MHz nominally. The loop has a time constant associated
Table 8. Output Select Coding
1
S1 (Data Format Select) (LVDS/CMOS Mode Select)2 (I/P Select) (Full-Scale Select)3 Mode
1 X X X Twos complement 0 X X X Offset binary X 0 1 X Dual-mode CMOS interleaved X 0 0 X Dual-mode CMOS parallel X 1 X X LVDS mode X X X 1 Full scale = 0.768 V X X X 0 Full scale = 1.536 V
1
X = Don’t care.
2
S4 used in CMOS mode only (S2 = 0). S1 to S5 all have 30 kΩ-resistive pull-downs on-chip.
3
S5 full-scale adjust (see Analog Inputs section).
In interleaved mode, output data on Port A is offset from output data changes on Port B by one-half output clock cycle:
S21 S41 S51
with it that needs to be considered in applications where the clock rate can change dynamically, requiring a wait time of
1.5 µs to 5 µs after a dynamic clock frequency increase before valid data is available. This circuit is always on and cannot be disabled by the user.
The clock inputs are internally biased to 1.5 V (nominal) and support either differential or single-ended signals. For best dynamic performance, a differential signal is recommended. An MC100LVEL16 performs well in the circuit to drive the clock inputs, as illustrated in Figure 50. (For trace lengths > 2 inches, a standard LVPECL termination is recommended rather than the simple pull-down as shown.) Note that for this low voltage PECL device, the ac coupling is optional.
0.1µF
PECL GATE
0.1µF
510
Figure 50. Driving Clock Inputs with LVEL16
510
AD9430
CLK+
CLK–
02607-050
INTERLEAVED MODE PARALLEL MODE
Figure 51.
Rev. C | Page 24 of 40
02607-051
AD9430
ANALOG INPUT
The analog input to the AD9430 is a differential buffer. For best dynamic performance, impedances at VIN+ and VIN should match. The analog input is optimized to provide superior
wideband performance and requires that the analog inputs be driven differentially. SNR and SINAD performance degrades significantly if the analog input is driven with a single­ended signal.
A wideband transformer, such as Mini-Circuits’ ADT1-1WT, can provide the differential analog inputs for applications that require a single-ended-to-differential conversion. Both analog inputs are self-biased by an on-chip resistor divider to a nominal 2.8 V. (See the Equivalent Circuits section.)
Special care was taken in the design of the analog input section of the AD9430 to prevent damage and corruption of data when the input is overdriven. The nominal differential input range is approximately 1.5 V p-p ~ (768 mV × 2). Note that the best performance is achieved with S5 = 0 (full-scale = 1.5). See Figure 43.
S5 = GND
VIN+
768mV
2.8V
VIN–
2.8V
DS INPUTS (DS+, DS–)
In CMOS output mode, the data sync inputs (DS+, DS–) can be used in applications that require a given sample to appear at a specific output port (A or B) relative to a given external timing signal. The DS inputs can also be used to synchronize two or more ADCs in a system to maintain phasing between Ports A and B on separate ADCs (in effect, synchronizing multiple DCO outputs). When DS+ is held high (DS– low), the ADC data outputs and clock do not switch and are held static. Synchronization is accomplished by the assertion (falling edge) of DS+ within the timing constraints t
SDS
and t clock rising edge. (On initial synchronization, t relevant.) If DS+ falls within the required setup time (t before a given clock rising edge N, the analog value at that point in time will be digitized and available at Port A, 14 cycles later in interleaved mode.
The very next sample, N + 1, is sampled by the next rising clock edge and available at Port B, 14 cycles after that clock edge. In dual parallel mode, Port A has a 15-cycle latency and Port B has a 14-cycle latency, but data is available at the same time. Driving each ADC’s DS inputs by the same sync signals accomplishes this. An easy way to accomplish synchronization is by a one­time sync at power-on reset. Note that when running the AD9430 in LVDS mode, set DS+ to ground and DS– to 3.3 V, as the DS inputs are relevant only in CMOS output mode, simplifying the design for some applications as well as affording superior SNR/SINAD performance at higher encode/analog frequencies.
, relative to a
HDS
is not
HDS
SDS
)
768mV
DIGITALOUT = ALL 1s DIGITALOUT = ALL 0s
Figure 52. Differential Analog Input Range
S5 = AVDD
VIN+
2.8V VIN– =2.8V
Figure 53. Single-Ended Analog Input Range
2.8V
CMOS OUTPUTS
The off-chip drivers on the chip can be configured to provide
02607-052
CMOS compatible output levels via Pin S2. The CMOS digital outputs (S2 = 0) are TTL/CMOS compatible for lower power consumption. The outputs are biased from a separate supply (DRVDD), allowing easy interface to external logic. The outputs are CMOS devices that swing from ground to DRVDD (with no dc load). It is recommended to minimize the capacitive load the ADC drives by keeping the output traces short (< 1 inch, for a total C
< 5 pF). When operating in CMOS mode, it is also
LOAD
recommended to place low value (20 Ω) series damping resistors on the data lines to reduce switching transient effects on performance.
LVDS OUTPUTS
The off-chip drivers on the chip can be configured to provide LVDS compatible output levels via Pin S2. LVDS outputs are
02607-053
at Pin 7 (LVDSBIAS) to ground. The RSET resistor current is ratioed on-chip, setting the output current at each output equal to a nominal 3.5 mA (11 × IRSET). A 100 Ω termination resistor placed at the LVDS receiver inputs results
available when S2 = V
and a 3.74 kΩ RSET resistor is placed
DD
differential
Rev. C | Page 25 of 40
AD9430
in a nominal 350 mV swing at the receiver. LVDS mode facilitates interfacing with LVDS receivers in custom ASICs and FPGAs that have LVDS capability for superior switching performance in noisy environments. Single point-to-point net topologies are recommended with a 100 Ω termination resistor as close to the receiver as possible. It is recommended to keep the trace length two inches maximum and to keep differential output trace lengths as equal as possible.
FULL
K
SCALE
S5 = 0—> K = 1.24 S5 = 1—> K = 0.62
+
1V
A1
200
0.1µF
VREF
EXTERNAL 1.23V REFERENCE
+
CLOCK OUTPUTS (DCO+, DCO–)
The input ENCODE is divided by two (in CMOS mode) and available off-chip at DCO+ and DCO–. These clocks can facilitate latching off-chip, providing a low skew clocking solution (see Figure 2). The on-chip clock buffers should not drive more than 5 pF of capacitance to limit switching transient effects on performance. Note that the output clocks are CMOS levels when CMOS mode is selected (S2 = 0) and are LVDS levels when in LVDS mode (S2 = V
), (requiring a 100 Ω
DD
differential termination at receiver in LVDS mode). The output clock in LVDS mode switches at the ENCODE rate.
VOLTAGE REFERENCE
A stable and accurate 1.23 V voltage reference is built into the AD9430 (VREF). The analog input full-scale range is linearly proportional to the voltage at VREF. Note that an external reference can be used by connecting the SENSE pin to VDD (disabling internal reference) and driving VREF with the external reference source. No appreciable degradation in performance occurs when VREF is adjusted ±5%. A 0.1 µF capacitor to ground is recommended at the VREF pin in internal and external reference applications. Float the SENSE pin for internal reference operation.
DISABLE
1k
A1
Figure 54. Using an External Reference
V
DD
SENSE
3.3V
+
02607-054
NOISE POWER RATIO TESTING (NPR)
NPR is a test that is commonly used to characterize the return path of cable systems where the signals are typically QAM signals with a “noise-like” frequency spectrum. NPR performance of the AD9430 was characterized in the lab yielding an effective NPR = 56.9 dB at an analog input of 19 MHz. This agrees with a theoretical maximum NPR of
57.1 dB for an 11-bit ADC at 13.6 dB backoff. The rms noise power of the signal inside the notch is compared with the rms noise level outside the notch using an FFT. Sufficiently long record lengths to guarantee a sufficient number of samples inside the notch are a requirement, as well as a high order band­stop filter that provides the required notch depth for testing.
Rev. C | Page 26 of 40
AD9430

EVALUATION BOARD, CMOS MODE

The AD9430 evaluation board offers an easy way to test the AD9430 in CMOS mode. It requires a clock source, an analog input signal, and a 3.3 V power supply. The clock source is buffered on the board to provide the clocks for the ADC, an on­board DAC, latches, and a data ready signal. The digital outputs and output clocks are available at two 40-pin connectors, P3 and P4. (See Figure 60.) The board has several different modes of operation and is shipped in the following configurations:
Offset Binary
Internal Voltage Reference
CMOS Parallel Timing
Full-Scale Adjust = Low
POWER CONNECTOR
Power is supplied to the board via a detachable 12-lead power strip (three 4-pin blocks). (AVDD, DRVDD, and VDL are the minimum required power connections).
Table 9. Power Connector, CMOS Mode
AVDD 3.3 V Analog supply for ADC (350 mA) DRVDD 3.3 V Output supply for ADC (28 mA) VDL 3.3 V Supply for support logic and DAC (350 mA) EXT_VREF Optional external reference input VCLK/V_XTAL Supply for clock buffer/optional CRYSTAL VAMP Supply for optional amp
ANALOG INPUTS
The evaluation board accepts a 1.3 V p-p analog input signal centered at ground at SMB connector J4. This signal is terminated to ground through 50 Ω alternatively terminated at transformer T1 secondary by R13 and R14. T1 is a wideband RF transformer providing the single­ended-to-differential conversion, allowing the ADC to be driven differentially, minimizing even order harmonics. An optional second transformer, T2, can be placed following T1 if desired. This would provide some performance advantage (~1 dB to 2 dB) for high analog input frequencies (>100 MHz). If T2 is placed, two shorting traces at the pads would need to be cut. The analog signal is low-pass filtered by R41, C12 and R42, C13 at the ADC input.
by R16. The input can be
GAIN
Full scale is set at E17, E18, and E19. Connecting E17 to E18 sets S5 low, full scale = 1.5 V differential; connecting E17 to E19 sets S5 high, full scale = 0.75 V differential.
ENCODE
The ENCODE clock is terminated to ground through 50 Ω at SMB connector J5. The input is ac-coupled to a high speed differential receiver (LVEL16) that provides the required low jitter, fast edge rates needed for optimum performance. J5 input should be > 0.5 V p-p. Power to the EL16 is set at jumper E47. Connecting E47 to E45 powers the buffer from AVDD; connecting E47 to E46 powers the buffer from VCLK/V_XTAL.
VOLTAGE REFERENCE
The AD9430 has an internal 1.23 V voltage reference. The ADC uses the internal reference as the default and E25–E26 are left open. The full scale can be increased by placing optional resistor R3. The required value would vary with the process and needs to be tuned for the specific application. Full scale can similarly be reduced by placing R4; tuning is required here as well. An external reference can be used by shorting the SENSE pin to 3.3 V (place jumper E26–E25). E27–E24 jumper connects the ADC VREF pin to the EXT_VREF pin at the power connector.
when jumpers
E24–E27
DATA FORMAT SELECT
Data format select sets the output data format of the ADC. Setting DFS (E1 to E2) low sets the output format to be offset binary; setting DFS high (E1 to E3) sets the output to twos complement.
I/P TIMING SELECT
Output timing is set at E11, E12 and E13. E12 to E11 sets S4 low for parallel output timing mode. E11 to E13 sets S4 high for interleaved timing mode.
TIMING CONTROLS
Flexibility in latch clocking and output timing is accomplished by allowing for clock inversion at the timing controls section of the PCB. Each buffered clock is buffered by an XOR and can be inverted by moving the appropriate jumper for that clock.
CMOS DATA OUTPUTS
The ADC CMOS digital outputs are latched on the board by four LVT574s; the latch outputs are available at the two 40-pin connectors at Pins 11–33 on P23 (Channel A) and Pins 11–33 on P3 (Channel B). The latch output clocks (data ready) are available at Pin 37 on P23 (Channel A) and Pin 37 on P3 (Channel B). The data-ready clocks can be inverted at the timing controls section if needed
Rev. C | Page 27 of 40
AD9430
4.6ns
C1 FREQ
84.65608MHz
1
2
2.00V 2.00V
CH1 CH2CH2 M 5.00ns
02607-055
Figure 55. Data Output and Clock @ 80-Pin Connector
DAC OUTPUTS
Each channel is reconstructed by an on-board, dual-channel DAC, an AD9753. This DAC is intended to assist in debug—it should not be used to measure the performance of the ADC. It is a current output DAC with on-board 50 Ω resistors. Figure 56 is representative of the DAC output with a full-scale analog input. The scope setting is low bandwidth.
termination
C1 FREQ
10.33592MHz C1 p-p
448mV
0
ENCODE 163.84MHz
–10
ANALOG 65.02MHz SNR 63.93dB SINAD 63.87dB
–20
FUND –0.45dBFS 2ND –85.62dBc
–30
3RD –91.31dBc 4TH –90.54dBc
–40
5TH –90.56dBc 6TH –91.12dBc
–50
THD –82.21dBc
dB
SFDR 83.93dBc
–60
SAMPLES 8k NOISEFLR –100.44dBFS WORSTSP –83.93dBc
–70
–80
–90
–100
0820
40 60
MHz
0
02607-057
Figure 57. FFT—Using VF561 CRYSTAL as Clock Source
ADC input filtering would enhance performance. See the AD8350 data sheet. SNR/SINAD performance of 61 dB/60 dB is possible and would start to degrade at about 30 MHz.
CUT TRACE
AD8350
1
CH1 CH1M 25.0ns
2.00m
248mV
02607-056
Figure 56. DAC Output
CRYSTAL OSCILLATOR
An optional crystal oscillator can be placed on the board to serve as a clock source for the PCB. Power to the oscillator is through the VCLK/VXTAL pin at the power connector. If an oscillator is used, ensure proper termination for best results. The board has been tested with a Valpey Fisher VF561 and a Vectron JN00158-163.84. Test results for the VF561 are shown in Figure 57.
OPTIONAL AMPLIFIER
The footprint for transformer T2 can be modified to accept a wideband differential amplifier (AD8350) for low frequency applications where gain is required. Note that Pin 2 would need to be lifted and left floating for operation. Input transformer T1 would need to be modified to a 4:1 for impedance matching and
1
CUT TRACE
02607-058
Figure 58. Using the AD8350 on the AD9430 PCB
TROUBLESHOOTING
If the board does not seem to be working correctly, try the following:
Verify power at IC pins.
Check that all jumpers are in the correct position for the
desired mode of operation.
Verify that VREF is at 1.23 V.
Try running clock and analog inputs at low speeds
(10 MSPS/1 MHz) and monitor latch, DAC, and ADC for toggling.
The AD9430 evaluation board is provided as a design example for customers of Analog Devices, Inc. ADI makes no warranties, express, statutory, or implied, regarding merchantability or fitness for a particular purpose.
Rev. C | Page 28 of 40
AD9430
SIGNAL
GENERATOR
REFIN
10MHz REFOUT
SIGNAL
GENERATOR
BAND-PASS
FILTER
3.3V
+
AVDD GND DRVDD GND VDL GND
ANALOG J4
AD9430 EVALUATION BOARD
CLOCK J5
3.3V
+
+
Figure 59. Evaluation Board Connections
3.3V –
DATA
CAPTURE
AND
PROCESSING
02607-059
Rev. C | Page 29 of 40
AD9430
Table 10. Evaluation Board Bill of Materials—CMOS
No. Quantity Reference Designator Device Package Value Comments
1 47 C1, C3–C11, C15–C17, Capacitor 0603 0.1 µF C43, C47 C19–C29, C31–C48, C58–C62 Not placed 2 1 C2 Capacitor 0603 10 pF Not placed 3 2 C12, C13 Capacitor 0603 20 pF Not placed 4 1 C14 Capacitor 0603 0.01 µF 5 1 C18 Capacitor 0603 1 µF 6 7 C30, C49, C63–C67 Capacitor CAPL 10 µF C30 Not placed 7 9 E3, E1, E2 3-pin header/jumper E19, E17, E18 3-pin header/jumper E13, E11, E12 3-pin header/jumper E26, E25, E27, E24 4-pin header E46, E47, E45 3-pin header/jumper E35, E33, E34 3-pin header/jumper E32, E30, E31 3-pin header/jumper E29, E23–E28 3-pin header/jumper E22, E16–E21 3-pin header/jumper 8 6 J1, J2, J3, J4, J5, J6 SMB SMB J2 Not placed 9 2 P3, P231 10 3 P4, P21, P22 4-pin power connector Post Z5.531.3425.0 Wieland Detachable Connector 25.602.5453.0 Wieland 11 8 R1, R5, R16, R25, R27, R28, Resistor 0603
R41, R42 Not placed 12 3 R2, R3, R4 Resistor 0603 3.74 kΩ R3, R4 Not placed 13 14 R6–R8, R10, R15, R21–R24, Resistor 0603
R33–R36, R38 Not placed 14 5 R9, R11, R12, R30, R37 Resistor 0603
15 4 R17, R18, R19, R20 Resistor 0603 16 1 R26 Resistor 0603
17 1 R29 Resistor 0603
18 7 R31, R32, R39, R40, R43, Resistor 0603
R44, R45 19 4 RZ1, RZ2, RZ3, RZ4 Resistor pack 220 W SO16RES 742C163221JTR CTS 20 8 RZ5, RZ6, RZ7, RZ8, RZ9, Resistor pack 22 W SO16RES 742C163220JTR CTS RZ10, RZ11, RZ12 21 2 T1, T2 Transformer CD542 Mini-Circuits T2 Not placed ADT1–1WT 22 1 U1 AD9430BSV TQFP100 ADC 23 1 U2 MC100LVEL16D SO8NB Clock buffer 24 1 U3 74LVC86 SO14NB XOR 25 4 U4, U5, U6, U7 74LVT574 SO20 Latch 26 1 U9 AD9753AST LQFP48 DAC 27 2 R13, R14 Resistors 0603 25 W R13, R14 Not placed
50
100
0
510 2 k
390
1 k
1
P3, P23 are implemented as one physical 80-pin connector SAMTEC TSW-140-08-L-D-RA.
R1, R13, R14
R15, R21 to R24
Rev. C | Page 30 of 40
AD9430
GND
DRB
GND
DY11
DY10DY9
DY8
DY7
DY6
DY5
DY4
DY3
DY2
DY1
DY0
DYA
DYB
DRY
GND
DRA
GND
DX11
DX10DX9
DX8
DX7
DX6
DX5
DX4
DX3
DX2
DX1
DX0
DXA
DXB
DRX
GND
GND
P39
P37
P35
P33
P31
P40
P38
P36
P34
P32
GND
DRX
DX11
DX10
16151413121110
R1R2R3R4R5R6R7
RZ8 22
1234567
VDL
201918171615141312
Q0Q1Q2Q3Q4Q5Q6
VCC
U4
OUT_END0D1D2D3D4D5D6D7
123456789
GND
16151413121110
R1R2R3R4R5R6R7
RZ1 220
1234567
CLKLATA
R33
100
3
U3
74L VC86
74L VC86
1
2
4
R10
100
COUTA
COUTA
E35
E34
E32
E33
VCC
VCC
GND
E20VDL
E7
DRVDD
GND
VAMP
GND
VCLK/V_XTAL
P1P2P3
EXT_VREF
4
123
4
P4
P1P2P3
PTMICA04
P4
P21
123
P29
P27
P25
P23
P21
P19
P30
P28
P26
P24
P22
P20
DX9
DX8
DX7
DM8
DM7
DM6
DRA
R34
100
6
U3
74L VC86
5
9
R8
100
E31
E30
GND
COUTA
R9
COUT
H4
MTHOLESH3MTHOLESH2MTHOLESH1MTHOLES
VDL
GND
AVDD (VCC)
GND
DRVDD
123
4
P4
P1P2P3
P4
PTMICA04
P22
P17
P18
DX6
R8
R8
8
COUTAB
E29
VCC
COUTAB
COUTB
PTMICA04
P15
P13
P16
P14
DX5
9
8
DM5
11
Q7
10
9
8
CLKLATB
R35
U3
10
R7
E23
R11
P9P7P5P3P1
P11
C4OMS
P12
P10P8P6P4P2
R1R2R3R4R5R6R7
RZ7 22
VDL
CLKLATA
201918171615141312
VCC
CLOCK
U5
LVT574
GND
OUT_END0D1D2D3D4D5D6D7
123456789
GND
GND
R1R2R3R4R5R6R7
RZ2 220
DRB
R36
100
100
11
U3
74L VC86
12
13
R6
100
COUTAB
E28
E22
E16
VCC
GND
GND
P23
DX4
DX3
DX2
DX1
DX0
DXA
16151413121110
1234567
Q0Q1Q2Q3Q4Q5Q6
16151413121110
1234567
GND DR VDD
GND GND VCC VCC VCC GND GND GND VCC VCC GND GND VCC VCC GND
PLB GND
GROUND PAD UNDER PART
100
E21
GND
Figure 60. Evaluation Board Schematic—CMOS
P39
P37
P35
P33
P31
P40
P38
P36
P34
P32
GND
DRY
DXB
9
R8
8
CLKLATA
11
Q7
CLOCK
LVT574
GND
10
GND
9
R8
8
DR VDD
GND
75747372717069686766656463626160595857565554535251
76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100
123456789
E19VCC
E18GND
E14
E17
GND
AD9430
101112131415161718192021222324
VCC
GND
R2
3.74k
GND
E26VCC
E27
E29
GND
R3
R40
1k
GND
GND
E13VCC
E12GNDE8E10VCC
E9GND
E11
DY11
16151413121110
R1R2R3R4R5R6R7
RZ6 22
1234567
VDL
201918171615141312
Q0Q1Q2Q3Q4Q5Q6
VCC
U6
OUT_END0D1D2D3D4D5D6D7
123456789
GND
16151413121110
R1R2R3R4R5R6R7
RZ3 220
1234567
COUT
COUTB
DR VDD
GND
U1
VCC
VCC
VCC
GND
GND
GND
GND
GND
C1
0.1µF
E24EXT_VREF
R4
R3, R4
OPTIONAL
R39
1k
E3VCC
E2GND
E6VCC
E5GND
E1
E4
P29
P27
P25
P23
P30
P28
P26
P24
DY10
DY9
DY8
DR VDD
VCC
GND
C12
20pF
C43
T2
OPTIONAL
P9P7P5P3P1
P21
P19
P17
P15
P13
P11
P22
P20
P18
P16
P14
P12
P10P8P6P4P2
DY7
DY6
DY5
9
R8
8
CLKLATB
11
Q7
CLOCK
GN
10
GND
9
R8
8
GND
50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26
25
VCC
C13
GND
GND
GND
R41
25
GND
C11 0.1µF
0.1µF
426
T2
153
ADT1-1WT
GND
C3
0.1µF
R14
29
GND
C7
426
T1
153
ADT1-1WT
R16
50
P3
C4OMS
DY4
DY3
16151413121110
R1R2R3R4R5R6R7
RZ5 22
1234567
VDL
201918171615141312
Q0Q1Q2Q3Q4Q5Q6
VCC
U7
LVT574
D
OUT_END0D1D2D3D4D5D6D7
123456789
GND
16151413121110
R1R2R3R4R5R6R7
RZ4 220
1234567
GND
DR VDD
GND
VCC
GND
GND
VCC
GND
GND VCC VCC VCC
GND
20pF
R42
PRI SEC
C2
R13
0.1µF
PRI SEC
CLKÐ
CLK+
R1
R5
50
GND
J1
GND
DATA SYNC
25
C47
0.1µF
10pF
25
R13, R14 OPTIONAL
E15
C6
0.1µF
ANALOG
J4
DY2
DY1
DY0
DYA
DYB
9
R8
8
CLKLATB
11
Q7
CLOCK
LVT574
D
GN
10
GND
9
R8
8
C30
10µF
+
GND
0
R12
50
J2
GND
GND
C36
0.1µF
E45
E46
E47
VCC
VCLK
E36
C9
0.1µF
R19
510
R1 NOT PLACED
C10
0.1µF R20
510
6
7
8
VCC
U2
234
MC100L VEL 16
C5
0.1µF
5
VEE
DQ
DNQNVBB
R10
510
R17
510
R27
50
GND
J5
ENCODE
GND
F
µ
C4
1
. 0
VCC
GND
GND
C8
0.1µF
02607-060
Rev. C | Page 31 of 40
AD9430
V
u
CC
+
GND
VDL
+
GND
DRVDD
+
GND
C64 10µF
C67 10µF
C65 10µF
C16
0.1µF
C61
0.1µF
C17
0.1µF
C62
0.1µF
C19
0.1µF
C60
0.1µF
C59
0.1µF
C21
0.1µF
C58
0.1µF
C20
0.1µF
VCLK
GND
C23
0.1µF
C66 10µF
C22
0.1µF
C25
0.1µF
C14
0.1µF
C24
0.1µF
C27
0.1µF
C44
0.1µF
VREF
GND
C26
0.1µF
C29
0.1µF
+
C63 10µF
C28
0.1µF
C42
0.1µF
C31
0.1µF
VAMP
GND
C41
0.1µF
C35
C32
0.1µF
0.1µF
C15
C37
0.1µF
0.1µF
+
C49
C48
10µF
0.1µF
R38 FOR VF561 CRYSTAL
C40
0.1µF
100
VOL
GND
R38
R31 1k
R32 1k
100
GND
R15
GND
GND
C45
0.1µF
DX11 DX10
DX9 DX8 DX7 DX6 DX5
DX4
DXA
1 2 3
OPTIONAL XTAL
VOL
DX3 DX2 DX1 DX0
DXB
E/D NC
GND
GND
GND
VCLK
GND
VCLK
1 2 3
4 5
6
R30
0
GND
J6
R21
100
R22 100
GND
J3
C18 1µF
47
48
14
13
P1
VCLK
R23
100
P2
R24
100
GND
VOL
R25 50
GND
R28
50
46
GND
R29 392
15
GND
45
17
16
43
44
AD9753
18
GND
GND R26
2k
41
42
20
19
C39
0.1µF
6
V
CC
OUTPUT
DRA
GND
GND
R37
5 4
VOL
C38
0.1µF
0
7 8
9 10 11 12
OUTPUT B
U8
R43
1k
C46
0.1µF
RZ9
R1
1
16
R2
2
15
R3
3
14
R4
4
13
R5
5
12
R6
6
11
R7
7
10
R8
8
9
22
RZ11
R1
1
16
R2
2
15
R3
3
14
R4
4
13
R5
5
12
R6
6
11
R7
7
10
R8
8
9
22
Figure 61. Evaluation Board Schematic—CMOS (continued)
C34
0.1µF
21
40
VOL
GND
C33
0.1µF
22
GND
OPIN B
OPIN B
GND
GND
IN–
OUT–
GND
GND
7
865
ENBL
CC
V
VAMP
9 10 11 12 13 14 15 16
9 10 11 12 13 14 15 16
OPIN
OUT+
RZ12
RZ10
R8 R7 R6 R5 R4 R3 R2 R1
22
R8 R7 R6 R5 R4 R3 R2 R1
22
OPTIONAL AMP
U10
8 7 6 5 4 3 2 1
8 7 6 5 4 3 2 1
DYB DYA DY0 DY1 DY2 DY3
DY4 DY5 DY6 DY7 DY8 DY9 DY10 DY11
02607-061
AD8350
12 3 4
IN+
GND
OPIN
E4Z
VOL
E40
GND
E41
R44
GND
1k
E39
VOL
E37
GND
E38
GND R45 1k
37
38
39
36 35 34 33 32 31
30 29 28 27 26 25
24
23
Rev. C | Page 32 of 40
AD9430
Figure 62. PCB Top Side Silkscreen
Figure 63. PCB Top Side Copper
02607-062
02607-063
Figure 65. PCB Split Power Plane
Figure 66. PCB Bottom Side Copper
02607-065
02607-066
Figure 64. PCB Ground Layer
02607-064
Rev. C | Page 33 of 40
Figure 67. PCB Bottom Side Silkscreen
02607-067
AD9430

EVALUATION BOARD, LVDS MODE

The AD9430 evaluation board offers an easy way to test the AD9430 in LVDS mode. (The board is also compatible with the AD9411.) It requires a clock source, an analog input signal, and a 3.3 V power supply. The clock source is buffered on the board to provide the clocks for the ADC, latches, and a data-ready signal. The digital outputs and output clocks are available at a 40-pin connector, P23. The board has several different modes of operation and is shipped in the following configurations:
Offset Binary
Internal Voltage Reference
GAIN
Full scale differential; E17–E19 sets S5 high, full scale = 0.75 V differential. Best performance is obtained at 1.5 V full scale.
is set at E17–E19, E17–E18 sets S5 low, full scale = 1.5 V
CLOCK
The CLOCK input is terminated to ground through a 50 Ω resistor at SMB connector J5. The input is ac-coupled to a high speed differential receiver (LVEL16) that provides the required low jitter, fast edge rates needed for optimum performance. J5 input should be > 0.5 V p-p. Power to the LVEL16 is set at Jumper E47. E47–E45 powers the buffer from AVDD; E47–E46 powers the buffer from VCLK/V_XTAL.
Full-Scale Adjust = Low
POWER CONNECTOR
Power is supplied to the board via a detachable 8-lead power strip (two 4-pin blocks). Note for the following table that VCC, DRVDD, and VDL are the minimum required power connections, and LVEL16 clock buffer can be powered from VCC or VDL at E47 jumper.
Table 11. Power Connector, LVDS Mode
VCC 3.3 V Analog supply for ADC (350 mA) DRVDD 3.3 V Output supply for ADC (50 mA) VDL 3.3 V Supply for support logic
EXT_VREF Optional external reference input
ANALOG INPUTS
The evaluation board accepts a 1.3 V p-p analog input signal centered at ground at SMB connector J4. This signal is terminated to ground through 50 Ω alternatively terminated at T1 transformer secondary by R13 and R14. single­be driven differentially, minimizing even-order harmonics.
ptional second transformer, T2, can be placed following
o if desired. This provides some performance advantage (~1 – 2dB) for high analog input frequencies (>100 MHz). If T2 is placed, two shorting traces at the pads need to be cut. The analog signal can be low-pass filtered by R41, C12 and R42, C13 at the ADC input. A wideband differential amplifier (AD8351) can be configured on the PCB for DC-coupled applications. Remove C6, C15, C30 to prevent transformer loading of the amp. See the PCB schematic for more information.
T1 is a wideband RF transformer providing the
ended-to-differential conversion, allowing the ADC to
by R16. The input can be
An
T1
VOLTAGE REFERENCE
The AD9430 has an internal 1.23 V voltage reference. The ADC uses the internal reference as the default when jumpers E24–E27 and E25–E26 are left open. The full scale can be increased by placing optional resistor R3. The required value varies with the process and needs to be tuned for the specific application. Full scale can similarly be reduced by placing R4; tuning is required here as well. An external reference can be used by shorting the SENSE pin to 3.3 V (place jumper E26–E25). Jumper E27–E24 connects the ADC VREF pin to the EXT_VREF pin at the power connector.
DATA FORMAT SELECT
Data format select (DFS) sets the output data format of the ADC. Setting DFS low (E1–E2) sets the output format to be offset binary; setting DFS high (E1–E3) sets the output to twos complement.
DATA OUTPUTS
The ADC LVDS digital outputs are routed directly to the connector at the card edge. Resistor pads have been placed at the output connector to allow for termination if the connector receiving logic does not have the required differential termination for the data bits and DCO. Each output trace pair should be terminated differentially at the far end of the line with a single 100 ohm resistor.
CRYSTAL OSCILLATOR
An optional crystal oscillator can be placed on the board to serve as a clock source for the PCB. Power to the oscillator is through the VCLK/VXTAL pin at the power connector. If an oscillator is used, ensure proper termination for best results. The board has been tested with a Valpey Fisher VF561 and a Vectron JN00158-163.84.
Rev. C | Page 34 of 40
AD9430
Table 12. Evaluation Board Bill of Material—LVDS PCB
No. Quantity Reference Designator Device Package Value Comment
1 33
2 4 C33, C34, C37, C38 Capacitor 0402 0.1 µF
3 4 C63–C66 Capacitor TAJD CAPL 10 uF 4 1 C2 Capacitor 0603 10 pF
5 2 C12, C13 Capacitor 0603 20 pF
6 2 J4, J5 Jacks SMB 7 2 P21, P22 Power connectors
8 2 P21, P22 Power connectors
9 1 P23
10 16 R1, R6–R12, R15, R31–R37 Resistor 0402 100 Ω
11 1 R2 Resistor 0603 3.8 kΩ 12 3 R5, R16, R27 Resistor 0603 50 Ω 13 2 R17, R18 Resistor 0603 510 Ω 14 2 R19, R20 Resistor 0603 150 Ω 15 2 R29, R30 Resistor 0603 1 kΩ 16 2 R41, R42 Resistor 0603 25 Ω 17 2 R3, R4 Resistor 0603 3.8 kΩ 18 2 R13, R14 Resistor 0603 25 Ω
19 6 R22, R23, R24, R25, R26, R28 Resistor 0603 100 Ω
20 5 R38, R39, R40, R45, R47 Resistor 0402 25 Ω
21 2 R43, R44 Resistor 0402 10 kΩ
22 1 R46 Resistor 0402 1.2 kΩ
23 2 R48, R49 Resistor 0402 0 Ω
24 2 R50, R51 Resistor 0402 1 kΩ
25 1
26 1 U2 RF amp AD8351 27 1 U9 Optional crystal oscillator
28 1 U1 AD9430 TQFP-100 29 1 U3 MC100LVEL16 SO8NB
C1, C4–C11, C15–C17, C19–C32, C35, C36, C58–C62 C3, C18, C39, C40
T1 T2
Capacitors 0603 0.1 µF
25.602.5453.0
Top
Posts 40-pin right-angle
connector
RF transformer Mini circuits
Wieland Z5.531.3425.0 Wieland Digi-Key S2131-20-ND
ADT1-1WT
JN00158 or VF561
C3, C18, C39, C40 Not placed
C33, C34, C37, C38 Not placed
C2 Not placed
C12, C13 Not placed
R1, R6–R12, R15, R31–37 Not placed
R13, R14 Not placed
R22, R23, R24, R25, R26, R28 Not placed
R38, R39, R40, R45, R47 Not placed
R43, R44 Not placed
R46 Not placed
R48, R49 Not placed
R50, R51 Not placed
T2 Not placed
Rev. C | Page 35 of 40
AD9430
DOR
R1
D9
R8
D10
D10B
R7
100
D11
D11B
R6
100
DORB
100
GND DRVDD
GND GND VCC VCC VCC GND GND GND VCC VCC GND GND VCC VCC GND
H4
MTHOLE6H3MTHOLE6H2MTHOLE6H1MTHOLE6
GND
GND
VREF
GND
1
2
3
P1
P2
P3
GROUND PAD UNDER PART
P16
GNDDRGND
D11
D10
D2B
GND
GND
R41
C15
T2
T1
P35
P36
GND 36
D1
VCC
25
0.1µF
ADT1-1WT
ADT1-1WT
P33
P34
D11B 34
GND
P31
P32
D10B 32
R15
100
25
GND
C3
R14
GND
2
4
1
5
GND
426
153
R16
0.1µF
25
NC NC
50
D9D8D7D6D5
2927252321 P29
P27
P30
P28
D9B 30
D8B 28
D1B
C13
20pF
C2
C11
0.1µF
6
3
C7
0.1µF
SEC PRI SEC
PRI
J4
D4
GND
VCC
0.1µF
GND
R33
GND
GND
D4B
3937353331
P39
100
D3
R32
P37
P40
P38
D3B
40
100
DRB 38
GND
D2
R31
100
DRVDD
GND
VCC
VCC
AMPINB
C12
20pF
GND
T2 OPTIONAL
D8
D8B
R12
100
D7
D7B
D5
D5B
R11
100
D6
DRVDD
GND
D9B
100
75747372717069686766656463626160595857565554535251
76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99
100
123456789
E19
E18
R30
1k
E17
VCC
GND
GND
R29
1k
GND
VCC
E3
E2
E1
VDL
GND
DRVDD
GND
4
P4
PTM1CRO4
P21
VCC
1
2
3
4
P1
P2
P3
P4
PTM1CRO4
P22
VCC
GND
R9
100
D6B
DR
R10
100
GND
R37
DRB
100
DRVDD
U1
101112131415161718192021222324
VCC
GND
GND
GND
VCC
E27
E24
VREF
C1
GND
R2
E26
VCC
3.8k
E25
R3
3.8kR43.8k
GND
ANALOG
P25
P23
P26
P24
D7B26D6B24D5B
50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26
GND
GND
R42
10pF
R13
25
C6
0.1µF
D4D3D2D1D0
1917151311
P21
P19
P22
P20
22
D4B 20
D0
R36
100
E46
VCC
25
C30
AMPIN
AMP
GND
P17
P18
D3B 18
D0B
GND
GND
VCC GND
GND VCC
GND GND VCC VCC VCC GND
0.1µF
P15
P16
D2B16D1B14D0B
D1F
R35
DRVDD
~ENC
R5
50
GND
C36
0.1µF
E45
E47
VDL
P13
P14
100
C10
GND
8
U3
10EL16
C5
0.1µF
J5
P11
P12 12
D1FB
0.1µF
ELOUT
7
VCC
234
D1F
D2F
DORGND
97531 P9P7P5P3P1
P10P8P6P4P2
4
D1FB 10
D2FB 8
DORB 6
CONNECTOR
D2F
D2FB
R34
100
GND
C4
0.1µF
C9
0.1µF
R19
ELOUTB
R20
6
Q
QN
VEE
5
C8
VBB
D
DN
R18
R17
R27
50
GND
ENCODE
GND 2
VCC
510
GND
510
0.1µF GND
510
510
GND
02607-068
Figure 68. Evaluation Board Schematic—LVDS
Rev. C | Page 36 of 40
AD9430
A
VCC
GND
C64
10µF
+
C16
C17
0.1µF
0.1µF
C19
0.1µF
C21
0.1µF
C20
0.1µF
C23
0.1µF
C22
0.1µF
C25
0.1µF
C24
0.1µF
C27
0.1µF
C26
0.1µF
C29
0.1µF
C28
0.1µF
C31
0.1µF
C32
0.1µF
C35
0.1µF
TO USE VF561 CRYSTAL
R22
100
R28
100
GND
GND
DRVDD
JN00158
1
E/D
2
NC
3
GND
VCC
OUTPUTB
OUTPUT
U9
VDL
6 5 4
GND
VDL
GND
C65
10µF
R23 100
R25 100
+
GND
VDL
C61
0.1µF
P4
R24 100
R26 100
C62
0.1µF
P5
C60
0.1µF
C59
0.1µF
C58
0.1µF
VDL
GND
C66
10µF
+
C18
0.1µF
VREF
GND
C63
10µF
+
02607-069
Figure 69. Evaluation Board Schematic—LVDS (continued)
R38
25k
MP IN
AMP
GND
C33
0.1µF
C34
0.1µF
R43
10k
VDL
R51 1k
VDL GND
POWER DOWN
USE R43 OR R44
GND
R44
10k
R39
25k
R40
25k
R45
25k
1 2 3 4 5
PWUP RGP1
INHI INLO
RPG2
U2
AD8351
R46
1.2k
0.1µF
VOCM
VPOS
OPHI
OPLO
COMM
C38
Figure 70. Evaluation Board Schematic—LVDS (continued)
R50 1k
VDL
C37
0.1µF GNDGND
R47 25k
10
9 8 7
GND
6
R49
R48
C39
0.1µF
0
C40
0.1µF
0
AMPINB
AMPIN
02607-070
Rev. C | Page 37 of 40
AD9430
F
Figure 71. PCB Top Side Silkscreen—LVDS
02607-071
Figure 73. PCB Ground Layer—LVDS
02607-073
Figure 72. PCB Top Side Copper—LVDS
02607-072
Rev. C | Page 38 of 40
Figure 74. PCB Split Power Plane—LVDS
02607-074
AD9430
Figure 75. PCB Bottom Side Copper—LVDS
02607-075
02607-076
Figure 76. PCB Bottom Side Silkscreen—LVD
S
Rev. C | Page 39 of 40
AD9430

OUTLINE DIMENSIONS

1.20
0.75 MAX
0.60
0.45
SEATING
PLANE
0.20
0.09
NOTES
1. CENTER FIGURES ARE TYPICAL UNLESS OTHERWISE NOTED.
2. THE AD9411 HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT IS RECOMMENDED THAT NO PCB SIGNAL TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE
SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE
DEVICE WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.
1
25
26 50
3.5° 0°
16.00 SQ
14.00 SQ
76100
75
TOP VIEW
(PINS DOWN)
51
0.50 BSC
COMPLIANT TO JEDEC STANDARDS MS-026AED-HD
0.27
0.22
0.17
0.15
0.05
75
51
1.05
1.00
0.95
COPLANARITY
0.08
76 100
CONDUCTIVE
HEAT SINK
2650
6.50 NOM
1
25
Figure 77.100-Lead Thin Quad Flat Package, Exposed Pad [TQFP/EP]
(SV-100-1)
Dimensions shown in millimeters

ORDERING GUIDE

Model Temperature Range Package Description Package Option
AD9430BSV-170 –40°C to +85°C 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP/EP] SV-100-1 AD9430BSVZ-1701 –40°C to +85°C 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP/EP] SV-100-1 AD9430BSV-210 –40°C to +85°C 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP/EP] SV-100-1 AD9430BSVZ-2101 –40°C to +85°C 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP/EP] SV-100-1 AD9430-CMOS/PCB Evaluation Board (CMOS Mode) Shipped with –210 Grade AD9430-LVDS/PCB Evaluation Board (LVDS Mode) Shipped with –210 Grade
1
Z = PB-free part.
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners.
C02607-0-11/04(C)
Rev. C | Page 40 of 40
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