Analog Devices AD9254 Service Manual

14-Bit, 150 MSPS, 1.8 V
A

FEATURES

1.8 V analog supply operation
1.8 V to 3.3 V output supply SNR = 71.8 dBc (72.8 dBFS) to 70 MHz input SFDR = 84 dBc to 70 MHz input Low power: 430 mW @ 150 MSPS Differential input with 650 MHz bandwidth On-chip voltage reference and sample-and-hold amplifier DNL = ±0.4 LSB Flexible analog input: 1 V p-p to 2 V p-p range Offset binary, Gray code, or twos complement data format Clock duty cycle stabilizer Data output clock Serial port control
Built-in selectable digital test pattern generation Programmable clock and data alignment

APPLICATIONS

Ultrasound equipment IF sampling in communications receivers
CDMA2000, WCDMA, TD-SCDMA, and WiMax Battery-powered instruments Hand-held scopemeters Low cost digital oscilloscopes
Macro, micro, and pico cell infrastructure

GENERAL DESCRIPTION

The AD9254 is a monolithic, single 1.8 V supply, 14-bit, 150 MSPS analog-to-digital converter (ADC), featuring a high performance sample-and-hold amplifier (SHA) and on-chip voltage reference. The product uses a multistage differential pipeline architecture with output error correction logic to provide 14-bit accuracy at 150 MSPS data rates and guarantees no missing codes over the full operating temperature range.
The wide bandwidth, truly differential SHA allows a variety of user-selectable input ranges and offsets, including single-ended applications. It is suitable for multiplexed systems that switch full-scale voltage levels in successive channels and for sampling single-channel inputs at frequencies well beyond the Nyquist rate. Combined with power and cost savings over previously available ADCs, the AD9254 is suitable for applications in communications, imaging, and medical ultrasound.
A differential clock input controls all internal conversion cycles. A duty cycle stabilizer (DCS) compensates for wide variations in the clock duty cycle while maintaining excellent overall ADC performance.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
Analog-to-Digital Converter
AD9254

FUNCTIONAL BLOCK DIAGRAM

MODE
SELECT
DRVDD
A/D
3
VDD
AD9254
VIN+
VIN–
REFT
REFB
VREF
SENSE
SHA
REF
SELECT
MDAC1
A/D
0.5V
AGND
8-STAGE
1 1/2-BIT PIPELINE
4
CORRECTION LOGIC
OUTPUT BUFF ERS
CLOCK
DUTY CYCLE
STABILIZER
CLK+
Figure 1.
8
15
CLK– PDWN DRGND
The digital output data is presented in offset binary, Gray code, or twos complement formats. A data output clock (DCO) is provided to ensure proper latch timing with receiving logic.
The AD9254 is available in a 48-lead LFCSP_VQ and is specified over the industrial temperature range (−40°C to +85°C).

PRODUCT HIGHLIGHTS

1. The AD9254 operates from a single 1.8 V power supply
and features a separate digital output driver supply to accommodate 1.8 V to 3.3 V logic families.
2. The patented SHA input maintains excellent performance
for input frequencies up to 225 MHz.
3. The clock DCS maintains overall ADC performance over a
wide range of clock pulse widths.
4. A standard serial port interface supports various product
features and functions, such as data formatting (offset binary, twos complement, or Gray coding), enabling the clock DCS, power-down, and voltage reference mode.
5. The AD9254 is pin-compatible with the AD9233, allowing
a simple migration from 12 bits to 14 bits.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2006 Analog Devices, Inc. All rights reserved.
OR
DCO
D13 (MSB)
D0 (LSB)
SCLK/DFS
SDIO/DCS
CSB
06216-001
AD9254
TABLE OF CONTENTS
Features.............................................................................................. 1
Timing ......................................................................................... 20
Applications....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
DC Specifications ......................................................................... 3
AC Specifications.......................................................................... 4
Digital Specifications ................................................................... 5
Switching Specifications.............................................................. 6
Timing Diagram........................................................................... 6
Absolute Maximum Ratings............................................................ 7
Thermal Resistance ...................................................................... 7
ESD Caution.................................................................................. 7
Pin Configuration and Function Descriptions............................. 8
Serial Port Interface (SPI).............................................................. 21
Configuration Using the SPI..................................................... 21
Hardware Interface..................................................................... 21
Configuration Without the SPI................................................ 21
Memory Map .................................................................................. 22
Reading the Memory Map Register Table............................... 22
Memory Map Register Table..................................................... 23
Layout Considerations................................................................... 25
Power and Ground Recommendations................................... 25
CML ............................................................................................. 25
RBIAS........................................................................................... 25
Reference Decoupling................................................................ 25
Evaluation Board............................................................................ 26
Power Supplies............................................................................ 26
Input Signals................................................................................ 26
Equivalent Circuits........................................................................... 9
Typical Performance Characteristics ........................................... 10
Theory of Operation ...................................................................... 14
Analog Input Considerations.................................................... 14
Differential Input Configurations............................................ 15
Voltage Reference....................................................................... 16
Clock Input Considerations...................................................... 17
Jitter Considerations .................................................................. 19
Power Dissipation and Standby Mode..................................... 19
Digital Outputs ........................................................................... 20

REVISION HISTORY

10/06—Revision 0: Initial Version
Output Signals ............................................................................ 26
Default Operation and Jumper Selection Settings................. 27
Alternative Clock Configurations............................................ 27
Alternative Analog Input Drive Configuration...................... 27
Schematics................................................................................... 29
Evaluation Board Layout........................................................... 34
Bill of Materials........................................................................... 37
Outline Dimensions....................................................................... 40
Ordering Guide .......................................................................... 40
Rev. 0 | Page 2 of 40
AD9254

SPECIFICATIONS

DC SPECIFICATIONS

AVDD = 1.8 V; DRVDD = 2.5 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, DCS enabled, unless otherwise noted.
Table 1.
AD9254BCPZ-150
Parameter Temperature
Min Typ Max
RESOLUTION Full 14 Bits ACCURACY
No Missing Codes Full Guaranteed Offset Error Full ±0.3 ±0.8 % FSR Gain Error Full ±0.6 ±4.5 % FSR Differential Nonlinearity (DNL)
1
25°C ±0.4 LSB
Full ±1.0 LSB
Integral Nonlinearity (INL)
1
25°C ±1.5 LSB Full ±5.0 LSB TEMPERATURE DRIFT
Offset Error Full ±15 ppm/°C Gain Error Full ±95 ppm/°C
INTERNAL VOLTAGE REFERENCE
Output Voltage Error (1 V Mode) Full ±5 ±35 mV Load Regulation @ 1.0 mA Full 7 mV
INPUT REFERRED NOISE
VREF = 1.0 V 25°C 1.3 LSB rms
ANALOG INPUT
Input Span, VREF = 1.0 V Full 2 V p-p Input Capacitance
2
Full 8 pF REFERENCE INPUT RESISTANCE Full 6 kΩ POWER SUPPLIES
Supply Voltage
AVDD Full 1.7 1.8 1.9 V DRVDD Full 1.7 2.5 3.6 V
Supply Current
1
IAVDD
Full 240 260 mA
IDRVDD1(DRVDD = 1.8 V) Full 11 mA IDRVDD1 (DRVDD = 3.3 V) Full 23 mA
POWER CONSUMPTION
DC Input Full 430 470 mW Sine Wave Input1 (DRVDD = 1.8 V) Full 450 mW Sine Wave Input1 (DRVDD = 3.3 V) Full 506 mW Standby Power Power-Down Power Full 1.8 mW
1
Measured with a low input frequency, full-scale sine wave, with approximately 5 pF loading on each output bit.
2
Input capacitance refers to the effective capacitance between one differential input pin and AGND. Refer to Figure 4 for the equivalent analog input structure.
3
Standby power is measured with a dc input, the CLK pin inactive (set to AVDD or AGND).
3
Full 40 mW
Unit
Rev. 0 | Page 3 of 40
AD9254

AC SPECIFICATIONS

AVDD = 1.8 V; DRVDD = 2.5 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, DCS enabled, unless otherwise noted.
Table 2.
Parameter
1
Temperature
SIGNAL-TO-NOISE-RATIO (SNR)
fIN = 2.4 MHz 25°C 72.0 dBc fIN = 70 MHz 25°C 71.8 dBc Full 70.0 dBc fIN = 100 MHz 25°C 71.6 dBc fIN = 170 MHz 25°C 70.8 dBc
SIGNAL-TO-NOISE AND DISTORTION (SINAD)
fIN = 2.4 MHz 25°C 71.7 dBc fIN = 70 MHz 25°C 71.0 dBc Full 69.0 dBc fIN = 100 MHz 25°C 70.6 dBc fIN = 170 MHz 25°C
EFFECTIVE NUMBER OF BITS (ENOB)
fIN = 2.4 MHz fIN = 70 MHz fIN = 100 MHz fIN = 170 MHz
25°C 25°C 25°C 25°C
WORST SECOND OR THIRD HARMONIC
fIN = 2.4 MHz fIN = 70 MHz
fIN = 100 MHz fIN = 170 MHz
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
fIN = 2.4 MHz fIN = 70 MHz
fIN = 100 MHz fIN = 170 MHz
25°C 25°C Full 25°C 25°C
25°C 25°C Full 25°C 25°C
WORST OTHER (HARMONIC OR SPUR)
fIN = 2.4 MHz fIN = 70 MHz
fIN = 100 MHz fIN = 170 MHz
TWO-TONE SFDR
fIN = 29 MHz (−7 dBFS ), 32 MHz (−7 dBFS ) fIN = 169 MHz (−7 dBFS ), 172 MHz (−7 dBFS )
ANALOG INPUT BANDWIDTH
1
See Application Note AN-835, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions.
25°C 25°C Full 25°C 25°C
25°C 25°C 25°C
AD9254BCPZ-150
Min Typ Max
69.8
11.7
11.7
11.6
11.5
dBc
−90
−84
−74
−83
−80
90 84 74 83 80
−93
−93
−85
−90
−90
90 90 650
Unit
Bits Bits Bits Bits
dBc dBc dBc dBc dBc
dBc dBc dBc dBc dBc
dBc dBc dBc dBc dBc
dBFS dBFS MHz
Rev. 0 | Page 4 of 40
AD9254

DIGITAL SPECIFICATIONS

AVDD = 1.8 V; DRVDD = 2.5 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, DCS enabled, unless otherwise noted.
Table 3.
AD9254BCPZ-150
Parameter Temperature
DIFFERENTIAL CLOCK INPUTS (CLK+, CLK−)
Logic Compliance Internal Common-Mode Bias Differential Input Voltage Full 0.2 6 Input Voltage Range Full AVDD − 0.3 AVDD + 1.6 Input Common-Mode Range Full 1.1 AVDD High Level Input Voltage (VIH) Full 1.2 3.6 V Low Level Input Voltage (VIL) Full High Level Input Current (IIH) Full −10 +10 µA Low Level Input Current (IIL) Full −10 +10 µA Input Resistance Full 8 10 12 Input Capacitance Full 4
LOGIC INPUTS (SCLK/DFS, OEB, PWDN)
High Level Input Voltage (VIH) Full 1.2 3.6 V Low Level Input Voltage (VIL) Full 0 0.8 V High Level Input Current (IIH) Full Low Level Input Current (IIL) Full Input Resistance Full 30 kΩ Input Capacitance Full 2 pF
LOGIC INPUTS (CSB)
High Level Input Voltage (VIH) Full 1.2 3.6 V Low Level Input Voltage (VIL) Full 0 0.8 V High Level Input Current (IIH) Full −10 +10 µA Low Level Input Current (IIL) Full Input Resistance Full 26 kΩ Input Capacitance Full 2 pF
LOGIC INPUTS (SDIO/DCS)
High Level Input Voltage (VIH) Full 1.2 DRVDD + 0.3 V Low Level Input Voltage (VIL) Full 0 0.8 V High Level Input Current (IIH) Full −10 +10 µA Low Level Input Current (IIL) Full Input Resistance Full 26 kΩ Input Capacitance Full 5 pF
DIGITAL OUTPUTS
DRVDD = 3.3 V
High Level Output Voltage (VOH, IOH = 50 µA) Full 3.29 V High Level Output Voltage (VOH, IOH = 0.5 mA) Full 3.25 V Low Level Output Voltage (VOL, IOL = 1.6 mA) Full 0.2 V Low Level Output Voltage (VOL, IOL = 50 µA) Full 0.05 V
DRVDD = 1.8 V
High Level Output Voltage (VOH, IOH = 50 µA) Full 1.79 V High Level Output Voltage (VOH, IOH = 0.5 mA) Full 1.75 V Low Level Output Voltage (VOL, IOL = 1.6 mA) Full 0.2 V Low Level Output Voltage (VOL, IOL = 50 µA) Full 0.05 V
CMOS/LVDS/LVPECL Full 1.2 V
Min Typ Max
0 0.8
−50 −75
−10 +10
+40 +135
+40 +130
Unit
V p-p V V
V
kΩ pF
µA µA
µA
µA
Rev. 0 | Page 5 of 40
AD9254

SWITCHING SPECIFICATIONS

AVDD = 1.8 V, DRVDD = 2.5 V, unless otherwise noted.
Table 4.
Parameter
1
Temperature
Min Typ Max
CLOCK INPUT PARAMETERS
Conversion Rate, DCS Enabled Full 20 150 MSPS Conversion Rate, DCS Disabled Full 10 150 MSPS CLK Period Full 6.7 ns CLK Pulse Width High, DCS Enabled Full 2.0 3.3 4.7 ns CLK Pulse Width High, DCS Disabled Full 3.0 3.3 3.7 ns
DATA OUTPUT PARAMETERS
Data Propagation Delay (tPD) DCO Propagation Delay (t
2
) Full 4.4 ns
DCO
Full 3.1 3.9 4.8 ns
Setup Time (tS) Full 1.9 2.9 ns Hold Time (tH) Full 3.0 3.8 ns Pipeline Delay (Latency) Full 12 Cycles Aperture Delay (tA) Full 0.8 ns Aperture Uncertainty (Jitter, tJ) Full 0.1 ps rms Wake-Up Time
3
Full 350 µs OUT-OF-RANGE RECOVERY TIME Full 3 Cycles SERIAL PORT INTERFACE
SCLK Period (t
4
) Full 40 ns
CLK
SCLK Pulse Width High Time (tHI) Full 16 ns SCLK Pulse Width Low Time (tLO) Full 16 ns SDIO to SCLK Setup Time (tDS) Full 5 ns SDIO to SCLK Hold Time (tDH) Full 2 ns CSB to SCLK Setup Time (tS) Full 5 ns CSB to SCLK Hold Time (tH) Full 2 ns
1
See Application Note AN-835, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions.
2
Output propagation delay is measured from CLK 50% transition to DATA 50% transition, with 5 pF load.
3
Wake-up time is dependent on the value of the decoupling capacitors, values shown with 0.1 µF capacitor across REFT and REFB.
4
See Figure 50 and the Serial Port Interface (SPI) section.
AD9254BCPZ-150
Unit

TIMING DIAGRAM

CLK+
CLK–
DATA
DCO
N – 13
N+ 2
N+ 1
N
t
A
t
CLK
t
PD
N – 12 N – 11 N – 10 N – 9 N – 8 N – 7 N – 6 N – 5 N – 4
t
S
t
H
N+ 3
t
DCO
N+ 4
N+ 5
N+ 6
t
CLK
N+ 7
Figure 2. Timing Diagram
Rev. 0 | Page 6 of 40
N+ 8
06216-002
AD9254

ABSOLUTE MAXIMUM RATINGS

Table 5.
Parameter Rating
ELECTRICAL
AVDD to AGND −0.3 V to +2.0 V DRVDD to DGND −0.3 V to +3.9 V AGND to DGND −0.3 V to +0.3 V AVDD to DRVDD −3.9 V to +2.0 V D0 through D13 to DGND −0.3 V to DRVDD + 0.3 V DCO to DGND −0.3 V to DRVDD + 0.3 V OR to DGND −0.3 V to DRVDD + 0.3 V CLK+ to AGND −0.3 V to +3.9 V CLK− to AGND −0.3 V to +3.9 V VIN+ to AGND −0.3 V to AVDD + 0.2 V VIN− to AGND −0.3 V to AVDD + 0.2 V VREF to AGND −0.3 V to AVDD + 0.2 V SENSE to AGND −0.3 V to AVDD + 0.2 V REFT to AGND −0.3 V to AVDD + 0.2 V REFB to AGND −0.3 V to AVDD + 0.2 V SDIO/DCS to DGND −0.3 V to DRVDD + 0.3 V PDWN to AGND −0.3 V to +3.9 V CSB to AGND −0.3 V to +3.9 V SCLK/DFS to AGND −0.3 V to +3.9 V OEB to AGND −0.3 V to +3.9 V
ENVIRONMENTAL
Storage Temperature Range –65°C to +125°C Operating Temperature Range –40°C to +85°C Lead Temperature
(Soldering 10 Sec) Junction Temperature 150°C
300°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

THERMAL RESISTANCE

The exposed paddle must be soldered to the ground plane for the LFCSP_VQ package. Soldering the exposed paddle to the customer board increases the reliability of the solder joints, maximizing the thermal capability of the package.
Table 6. Thermal Resistance
Package Type θJA θ
48-lead LFCSP_VQ (CP-48-3) 26.4 2.4 °C/W
Unit
JC
Typical θJA and θJC are specified for a 4-layer board in still air. Airflow increases heat dissipation, effectively reducing θ
JA
. In addition, metal in direct contact with the package leads from metal traces and through holes, ground, and power planes, reduces the θ
.
JA

ESD CAUTION

Rev. 0 | Page 7 of 40
AD9254

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

DRVDD
DRGNDD1D0 (LSB)
DCO
OEB
AVDD
AGND
AVDD
CLK–
CLK+
4847464544434241403938
AGND
37
AVDD
35 34 33
32 31 30 29
28 27
26 25
PDWN36
RBIAS CML AVDD
AGND VIN– VIN+ AGND
REFT REFB
VREF SENSE
06216-003
DRGND
DRVDD
D10
D11
D2
1
D3
2
D4
3
D5
4
D6
5
D7
6
7
8
D8
9
D9
10 11
12
PIN 1 INDICATO R
AD9254
TOP VIEW
(Not to Scale)
13141516171819
OR
D12
DRVDD
DRGND
D13 (MSB)
SDIO/DCS
2021222324
CSB
AGND
SCLK/DFS
AVDD
AGND
Figure 3. Pin Configuration
Table 7. Pin Function Description
Pin No. Mnemonic Description
0, 21, 23, 29, 32,
AGND Analog Ground. (Pin 0 is the exposed thermal pad on the bottom of the package.)
37, 41 45, 46, 1 to 6,
D0 (LSB) to D13 (MSB) Data Output Bits.
9 to 14 7, 16, 47 DRGND Digital Output Ground. 8, 17, 48 DRVDD Digital Output Driver Supply (1.8 V to 3.3 V). 15 OR Out-of-Range Indicator. 18 SDIO/DCS
Serial Port Interface (SPI) Data Input/Output (Serial Port Mode); Duty Cycle Stabilizer Select (External Pin Mode). See
Table 10. 19 SCLK/DFS Serial Port Interface Clock (Serial Port Mode); Data Format Select Pin (External Pin Mode). 20 CSB Serial Port Interface Chip Select (Active Low). See Tab le 10. 22, 24, 33, 40, 42 AVDD Analog Power Supply.
25 SENSE Reference Mode Selection. See Table 9. 26 VREF Voltage Reference Input/Output. 27 REFB Differential Reference (−). 28 REFT Differential Reference (+). 30 VIN+ Analog Input Pin (+). 31 VIN– Analog Input Pin (−). 34 CML Common-Mode Level Bias Output. 35 RBIAS
External Bias Resistor Connection. A 10 kΩ resistor must be connected between this pin and
analog ground (AGND). 36 PDWN Power-Down Function Select. 38 CLK+ Clock Input (+). 39 CLK– Clock Input (−). 43 OEB Output Enable (Active Low). 44 DCO Data Clock Output.
Rev. 0 | Page 8 of 40
AD9254
V
C
S
S
V
A
V

EQUIVALENT CIRCUITS

LK+
IN
06216-004
Figure 4. Equivalent Analog Input Circuit
AVDD
1.2V
10k 10k
Figure 5. Equivalent Clock Input Circuit
DRVDD
DIO/DCS
1k
CLK–
CLK/DFS
OEB
PDWN
30k
1k
06216-008
Figure 8. Equivalent SCLK/DFS, OEB, PDWN Input Circuit
AVDD
26k
CSB
06216-005
1k
06216-009
Figure 9. Equivalent CSB Input Circuit
SENSE
1k
06216-010
06216-011
Figure 6. Equivalent SDIO/DCS Input Circuit
DRVDD
DRGND
Figure 7. Equivalent Digital Output Circuit
06216-006
06216-007
Figure 10. Equivalent Sense Circuit
DD
REF
6k
Figure 11. Equivalent VREF Circuit
Rev. 0 | Page 9 of 40
AD9254

TYPICAL PERFORMANCE CHARACTERISTICS

AVDD = 1.8 V; DRVDD = 2.5 V; maximum sample rate, DCS enabled, 1 V internal reference; 2 V p-p differential input; AIN = −1.0 dBFS; 64k sample; T
–20
–40
= 25°C, unless otherwise noted.
A
0
150MSPS
2.3MHz @ –1dBFS SNR = 72.0dBc (73. 0dBFS) ENOB = 11.7 BITS SFDR = 90.0dBc
0
150MSPS
100.3MHz @ –1dBF S SNR = 71.6dBc (72.6dBFS)
–20
ENOB = 11.6 BI TS SFDR = 83dBc
–40
–60
–80
AMPLI TUDE (d BFS)
–100
–120
0 18.75 37.50 56.25 75.00
Figure 12. AD9254 Single-Tone FFT with f
0
–20
–40
–60
–80
AMPLI TUDE (d BFS)
–100
–120
0 18.75 37.50 56.25 75.00
Figure 13. AD9254 Single-Tone FFT with f
FREQUENCY (MHz )
150MSPS
30.3MHz @ –1dBFS SNR = 71.9dBc (72. 9dBFS) ENOB = 11.7 BITS SFDR = 88d Bc
FREQUENCY (MHz )
= 2.3 MHz
IN
= 30.3 MHz
IN
–60
–80
AMPLI TUDE (d BFS)
–100
–120
0 18.75 37.50 56.25 75.00
06216-012
Figure 15. AD9254 Single-Tone FFT with f
0
–20
–40
–60
–80
AMPLI TUDE (d BFS)
–100
–120
0 18.75 37.50 56.25 75.00
06216-013
Figure 16. AD9254 Single-Tone FFT with f
FREQUENCY (MHz )
150MSPS
140.3MHz @ –1dBF S SNR = 71.5dBc (72. 5dBFS) ENOB = 11.5 BI TS SFDR = 81dBc
FREQUENCY (MHz )
= 100.3 MHz
IN
= 140.3 MHz
IN
06216-015
06216-016
0
150MSPS
70.3MHz @ –1dBF S SNR = 71.8dBc (72.8dBFS)
–20
ENOB = 11.7 BI TS SFDR = 84dBc
–40
–60
–80
AMPLI TUDE (d BFS)
–100
–120
0 18.75 37.50 56.25 75.00
Figure 14. AD9254 Single-Tone FFT with f
FREQUENCY (MHz )
= 70.3 MHz
IN
06216-014
Rev. 0 | Page 10 of 40
0
–20
–40
–60
–80
AMPLI TUDE (d BFS)
–100
–120
0 18.75 37.50 56.25 75.00
FREQUENCY (MHz )
Figure 17. AD9254 Single-Tone FFT with f
150MSPS
170.3MHz @ –1dBF S SNR = 70.8dBc (71. 8dBFS) ENOB = 11.5 BI TS SFDR = 80dBc
= 170.3 MHz
IN
06216-017
AD9254
0
150MSPS
250.3MHz @ –1dBF S SNR = 69.3dBc (70. 3dBFS)
–20
ENOB = 11.3 BITS SFDR = 79dBc
–40
120
100
80
SFDR (dBFS)
SNR (dBFS)
–60
–80
AMPLI TUDE (d BFS)
–100
–120
0 18.75 37.50 56.25 75.00
Figure 18. AD9254 Single-Tone FFT with f
0
–20
–40
–60
–80
AMPLI TUDE (d BFS)
–100
–120
0 18.75 37.50 56.25 75.00
Figure 19. AD9254 Two-Tone FFT with f
90
85
80
FREQUENCY (MHz )
IN
150MSPS
f
= 29.1MHz @ –7d BFS
IN1
f
= 32.1MHz @ –7d BFS
IN2
SFDR = 83.2dBc (90.2dBFS ) WoIMD3 = –83.9dBc (–90. 9dBFS)
FREQUENCY (MHz )
= 29.1 MHz, f
IN1
SFDR –40°C
= 250.3 MHz
SFDR +25°C
= 32.1 MHz
IN2
60
40
SFDR (dBc)
SNR/SFDR (dBc an d dBFS )
20
SNR (dBc)
0
–90 0–20 –10–30–40–50–60–70–80
06216-018
INPUT AMPLI TUDE (dBFS)
85dBc REFERENCE LINE
06216-021
Figure 21. AD9254 Single-Tone SNR/SFDR vs. Input Amplitude (AIN)
= 2.4 MHz
with f
IN
0
–20
–40
WORST I MD3 (dBc)
–60
–80
–100
SFDR/WORST IMD3 (d Bc and dBFS)
–120
–90 –78 –66 –54 –42 –30 –18 –6
06216-019
SFDR (–dBc)
SFDR (–dBFS)
WORST I MD3 (dBFS)
INPUT AMPLITUDE (dBFS)
06216-022
Figure 22. AD9254 Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN)
= 29.1 MHz, f
with f
IN1
90
85
80
= 32.1 MHz
IN2
SFDR +25°C
SFDR –40°C
SNR/SFDR (dBc)
75
70
65
60
0435030025020015010050
INPUT FREQUENCY (MHz)
SNR –40°C
SNR +25°C
Figure 20. AD9254 Single-Tone SNR/SFDR vs. Input Frequency (f
Temperature with 2 V p-p Full Scale
75
SFDR +85°C
SNR +85°C
00
06216-020
) and
IN
SNR/SFDR (dBc)
70
65
60
Figure 23. AD9254 Single-Tone SNR/SFDR vs. Input Frequency (f
Rev. 0 | Page 11 of 40
SNR +25°C
0435030025020015010050
INPUT FREQ UENCY (MHz)
Temperature with 1 V p-p Full Scale
SFDR +85°C
SNR –40°C
SNR +85°C
00
06216-023
) and
IN
AD9254
0
–20
–40
–60
–80
AMPLI TUDE (d BFS)
–100
–120
0 18.75 37.50 56.25 75.00
FREQUENCY (MHz )
Figure 24. AD9254 Two-Tone FFT with f
95
90
85
80
150MSPS
f
= 169.1MHz @ –7dBF S
IN1
f
= 172.1MHz @ –7dBF S
IN2
SFDR = 83dBc (90d BFS) WoIMD3 = –83d Bc (90dBFS)
= 169.1 MHz, f
IN1
SFDR
= 172.1 MHz
IN2
2.0
1.5
1.0
0.5
0
–0.5
INL ERROR (LSB)
–1.0
–1.5
–2.0
0 163841433612288102408192614440962048
06216-024
Figure 27. AD9254 INL with f
12000
10000
8000
6000
OUTPUT CODE
= 10.3 MHz
IN
32768 SAMPLES
1.25 LSB rms
06216-031
SNR/SFDR (dBc)
75
70
65
10 1501401301201101009080706050403020
CLOCK FREQUE NCY (MSPS)
Figure 25. AD9254 Single-Tone SNR/SFDR vs. Clock Frequency (f
0
–20
–40
WORST I MD3 (dBc)
–60
–80
–100
SFDR/WORST IMD3 (d Bc and dBFS)
–120
–90 –78 –66 –54 –42 –30 –18 –6
SFDR (–dBc)
SFDR (–dBFS)
INPUT AMPLITUDE (dBFS)
= 2.4 MHz
with f
IN
WORST I MD3 (dBFS)
SNR
CLK
Figure 26. AD9254 Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN)
with f
= 169.1 MHz, f
IN1
= 172.11 MHz
IN2
NUMBER OF HIT S
4000
2000
0
N – 5 N – 4 N – 3 N – 2 N – 1 N N + 1 N + 2 N + 3 N + 4 N + 5
06216-025
)
ERROR (%FS)
06216-027
Figure 28. AD9254 Grounded Input Histogram
0
–0.5
–1.0
–1.5
–2.0
–2.5
40–200 20406080
CODE
OFFSET ERROR
GAIN ERROR
TEMPERATURE (° C)
06216-032
06216-033
Figure 29. AD9254 Gain and Offset vs. Temperature
Rev. 0 | Page 12 of 40
AD9254
0.5
0.4
0.3
0.2
0.1
0
–0.1
DNL ERROR (LSB)
–0.2
–0.3
–0.4
–0.5
0 163841433612288102408192614440962048
Figure 30. AD9254 DNL with f
OTUPUT CODE
= 10.3 MHz
IN
06216-034
Rev. 0 | Page 13 of 40
AD9254

THEORY OF OPERATION

The AD9254 architecture consists of a front-end sample-and­hold amplifier (SHA) followed by a pipelined switched capacitor ADC. The quantized outputs from each stage are combined into a final 14-bit result in the digital correction logic. The pipeline architecture permits the first stage to operate on a new input sample, while the remaining stages operate on preceding samples. Sampling occurs on the rising edge of the clock.
Each stage of the pipeline, excluding the last, consists of a low resolution flash ADC connected to a switched capacitor DAC and interstage residue amplifier (MDAC). The residue amplifier magnifies the difference between the reconstructed DAC output and the flash input for the next stage in the pipeline. One bit of redundancy is used in each stage to facilitate digital correction of flash errors. The last stage consists only of a flash ADC.
The input stage contains a differential SHA that can be ac- or dc-coupled in differential or single-ended modes. The output staging block aligns the data, carries out the error correction, and passes the data to the output buffers. The output buffers are powered from a separate supply, allowing adjustment of the output voltage swing. During power-down, the output buffers go into a high impedance state.

ANALOG INPUT CONSIDERATIONS

The analog input to the AD9254 is a differential switched capacitor SHA that has been designed for optimum performance while processing a differential input signal.
The clock signal alternately switches the SHA between sample mode and hold mode (see into sample mode, the signal source must be capable of charging the sample capacitors and settling within one-half of a clock cycle. A small resistor in series with each input can help reduce the peak transient current required from the output stage of the driving source.
A shunt capacitor can be placed across the inputs to provide dynamic charging currents. This passive network creates a low­pass filter at the ADC input; therefore, the precise values are dependent upon the application.
Figure 31). When the SHA is switched
VIN+
VIN–
S
C
PIN, PAR
C
PIN, PAR
S
Figure 31. Switched-Capacitor SHA Input
C
S
H
C
S
For best dynamic performance, the source impedances driving VIN+ and VIN− should match such that common-mode settling errors are symmetrical. These errors are reduced by the common-mode rejection of the ADC.
An internal differential reference buffer creates two reference voltages used to define the input span of the ADC core. The span of the ADC core is set by the buffer to be 2 × VREF. The reference voltages are not available to the user. Two bypass points, REFT and REFB, are brought out for decoupling to reduce the noise contributed by the internal reference buffer. It is recom­mended that REFT be decoupled to REFB by a 0.1 μF capacitor, as described in the
Layout Considerations section.
Input Common Mode
The analog inputs of the AD9254 are not internally dc-biased. In ac-coupled applications, the user must provide this bias externally. Setting the device such that V recommended for optimum performance; however, the device functions over a wider range with reasonable performance (see Figure 30). An on-board common-mode voltage reference is included in the design and is available from the CML pin. Optimum performance is achieved when the common-mode voltage of the analog input is set by the CML pin voltage (typically 0.55 × AVDD). The CML pin must be decoupled to ground by a 0.1 μF capacitor, as described in the Considerations
section.
S
C
H
C
H
S
= 0.55 × AVDD is
CM
Layout
06216-035
In IF undersampling applications, any shunt capacitors should be reduced. In combination with the driving source impedance, these capacitors would limit the input bandwidth. For more information, see Application Note Response of Switched-Capacitor ADCs; Application Note
AN-742, Frequency Domain
AN-827,
A Resonant Approach to Interfacing Amplifiers to Switched­Capacitor ADCs; and the Analog Dialogue article,
“Transformer-
Coupled Front-End for Wideband A/D Converters.”
Rev. 0 | Page 14 of 40
AD9254
A
V

DIFFERENTIAL INPUT CONFIGURATIONS

Optimum performance is achieved by driving the AD9254 in a differential input configuration. For baseband applications, the
AD8138 differential driver provides excellent performance and a
flexible interface to the ADC. The output common-mode voltage of the
AD8138 is easily set with the CML pin of the AD9254 (see Figure 32), and the driver can be configured in a Sallen-Key filter topology to provide band limiting of the input signal.
1V p-p
For baseband applications where SNR is a key parameter, differential transformer coupling is the recommended input configuration (see connected to the center tap of the secondary winding of the transformer to bias the analog input.
The signal characteristics must be considered when selecting a transformer. Most RF transformers saturate at frequencies below a few megahertz, and excessive signal power can cause core saturation, which leads to distortion.
2V p-p
At input frequencies in the second Nyquist zone and above, the noise performance of most amplifiers is not adequate to achieve the true SNR performance of the AD9254. For applications where SNR is a key parameter, transformer coupling is the recommended input. For applications where SFDR is a key parameter, differential double balun coupling is the recom­mended input configuration (see
49.9
0.1µF
499
523
499
AD8138
499
R
C
R
VIN+
AD9254
VIN–
AVDD
Figure 32. Differential Input Configuration Using the AD8138
Figure 33). The CML voltage can be
R
49.9
0.1µF
C
R
Figure 33. Differential Transformer-Coupled Configuration
VIN+
AD9254
VIN–
CML
Figure 35).
CML
06216-036
06216-037
As an alternative to using a transformer-coupled input at frequencies in the second Nyquist zone, the driver can be used (see
Figure 36).
AD8352 differential
In any configuration, the value of the shunt capacitor, C, is dependent on the input frequency and source impedance and may need to be reduced or removed.
Tabl e 8 displays recom­mended values to set the RC network. However, these values are dependent on the input signal and should only be used as a starting guide.
Table 8. RC Network Recommended Values
Frequency Range (MHz) R Series (Ω) C Differential (pF)
0 to 70 33 15 70 to 200 33 5 200 to 300 15 5 >300 15 Open
Single-Ended Input Configuration
Although not recommended, it is possible to operate the AD9254 in a single-ended input configuration, as long as the input voltage swing is within the AVDD supply. Single-ended operation can provide adequate performance in cost-sensitive applications.
In this configuration, SFDR and distortion performance degrade due to the large input common-mode swing. If the source impedances on each input are matched, there should be little effect on SNR performance.
Figure 34 details a typical
single-ended input configuration.
1V p-p
10µF
49.9
10µF
0.1µF
0.1µF
Figure 34. Single-Ended Input Configuration
AVD D
1k
1k
1k
1k
DD
R
C
R
VIN+
AD9254
VIN–
06216-038
Rev. 0 | Page 15 of 40
AD9254
V
2V p-p
0.1µF
S
SP
A
0.1µF
25
P
0.1µF
25
0.1µF
R
C
R
VIN+
AD9254
VIN–
CML
06216-039
Figure 35. Differential Double Balun Input Configuration
CC
0.1µF
C
D
0.1µF
0
16
1
2
R
R
D
G
3
4
5
0
8, 13
AD8352
14
0.1µF
0.1µF
11
10
0.1µF
0.1µF
200
200
R
R
0.1µF
VIN+
C
AD9254
VIN–
CML
06216-040
Figure 36. Differential Input Configuration Using the AD8352
Table 9. Reference Configuration Summary
Resulting Differential
Selected Mode SENSE Voltage Resulting VREF (V)
Span (V p-p)
External Reference AVDD N/A 2 × external reference Internal Fixed Reference VREF 0.5 1.0 Programmable Reference 0.2 V to VREF
R
2
15.0
+×
(see Figure 38)
R
1
2 × VREF
Internal Fixed Reference AGND to 0.2 V 1.0 2.0

VOLTAGE REFERENCE

A stable and accurate voltage reference is built into the AD9254. The input range is adjustable by varying the reference voltage applied to the AD9254, using either the internal reference or an externally applied reference voltage. The input span of the ADC tracks reference voltage changes linearly. The various reference modes are summarized in the following sections. The Decoupling
section describes the best practices and require-
ments for PCB layout of the reference.
Internal Reference Connection
A comparator within the AD9254 detects the potential at the
Reference
Connecting the SENSE pin to VREF switches the reference amplifier input to the SENSE pin, completing the loop and providing a 0.5 V reference output. If a resistor divider is connected external to the chip, as shown in
Figure 38, the switch sets to the SENSE pin. This puts the reference amplifier in a noninverting mode with the VREF output defined as
VREF 15.0
⎛ ⎜ ⎝
+=
R1
R2
If the SENSE pin is connected to AVDD, the reference amplifier is disabled, and an external reference voltage can be applied to the VREF pin (see the
External Reference Operation section).
SENSE pin and configures the reference into four possible states, as summarized in
Tabl e 9. If SENSE is grounded, the reference amplifier switch is connected to the internal resistor divider (see
Figure 37), setting VREF to 1 V.
The input range of the ADC always equals twice the voltage at the reference pin for either an internal or an external reference.
Rev. 0 | Page 16 of 40
AD9254
External Reference Operation
The use of an external reference may be necessary to enhance the gain accuracy of the ADC or improve thermal drift characteristics. Figure 40 shows the typical drift characteristics of the internal reference in both 1 V and 0.5 V modes.
10
8
6
VREF = 0.5V
VREF = 1V
0.1µF0.1µF
SENSE
VIN+ VIN–
VREF
SELECT
LOGIC
ADC
CORE
REFT
0.1µF
REFB
0.5V
AD9254
06216-041
Figure 37. Internal Reference Configuration
VIN+ VIN–
VREF
0.1µF0.1µF
R2
SENSE
R1
SELECT
LOGIC
ADC
CORE
REFT
0.1µF
REFB
0.5V
AD9254
06216-042
Figure 38. Programmable Reference Configuration
If the internal reference of the AD9254 is used to drive multiple converters to improve gain matching, the loading of the reference by the other converters must be considered. Figure 39 depicts how the internal reference voltage is affected by loading.
0
VREF = 0.5V
–0.25
VREF = 1V
–0.50
4
2
REFERENCE VOLTAGE ERROR ( mV )
0
–40
–20
0 204060
TEMPERATURE ( °C)
80
06216-044
Figure 40. Typical VREF Drift
When the SENSE pin is tied to AVDD, the internal reference is disabled, allowing the use of an external reference. An internal resistor divider loads the external reference with an equivalent 6 kΩ load (see Figure 11). In addition, an internal buffer generates the positive and negative full-scale references for the ADC core. Therefore, the external reference must be limited to a maximum of 1 V.

CLOCK INPUT CONSIDERATIONS

For optimum performance, the AD9254 sample clock inputs (CLK+ and CLK−) should be clocked with a differential signal. The signal is typically ac-coupled into the CLK+ pin and the CLK− pin via a transformer or capacitors. These pins are biased internally (see Figure 5) and require no external bias.
Clock Input Options
The AD9254 has a very flexible clock input structure. The clock input can be a CMOS, LVDS, LVPECL, or sine wave signal. Regardless of the type of signal used, the jitter of the clock source is of the most concern, as described in the Jitter Considerations section.
–0.75
Figure 41 shows one preferred method for clocking the AD9254. A low jitter clock source is converted from single­ended to a differential signal using an RF transformer. The
REFERENCE VOLTAGE ERROR (%)
–1.00
back-to-back Schottky diodes across the transformer secondary limit clock excursions into the AD9254 to approximately 0.8 V p-p
–1.25
02.0
0.5 1.0 1.5 LOAD CURRENT (mA)
06216-043
Figure 39. VREF Accuracy vs. Load
Rev. 0 | Page 17 of 40
differential. This helps prevent the large voltage swings of the clock from feeding through to other portions of the AD9254, while preserving the fast rise and fall times of the signal, which are critical to a low jitter performance.
AD9254
K
MINI-CIRCUITS
CLOC
INPUT
50
ADT1–1WT, 1:1Z
100
XFMR
0.1µF
0.1µF0.1µF
0.1µF
SCHOTTKY
DIODES: HMS2812
CLK+
ADC
AD9254
CLK–
Figure 41. Transformer Coupled Differential Clock
If a low jitter clock source is not available, another option is to ac-couple a differential PECL signal to the sample clock input pins as shown in
Figure 42. The AD9510/AD9511/AD9512/
AD9513/AD9514/AD9515 family of clock drivers offers
excellent jitter performance.
CLOCK
INPUT
CLOCK
INPUT
1
50
1
50Ω RESIST ORS ARE OPTIONAL .
Figure 42. Differential PECL Sample Clock
0.1µF
0.1µF
50
CLK
AD951x
PECL DRIV ER
CLK
1
0.1µF
CLK+
100
0.1µF
240240
ADC
AD9254
CLK–
A third option is to ac-couple a differential LVDS signal to the sample clock input pins, as shown in
Figure 43. The AD9510/
AD9511/AD9512/AD9513/AD9514/AD9515 family of clock
drivers offers excellent jitter performance.
CLOCK
INPUT
CLOCK
INPUT
50
1
50 RESISTO RS ARE OPTIONAL .
0.1µF
0.1µF
1
50
Figure 43. Differential LVDS Sample Clock
CLK
AD951x
LVDS DRIV ER
CLK
1
0.1µF
100
0.1µF
CLK+
ADC
AD9254
CLK–
In some applications, it is acceptable to drive the sample clock inputs with a single-ended CMOS signal. In such applications, directly drive CLK+ from a CMOS gate, while bypassing the CLK− pin to ground using a 0.1 μF capacitor in parallel with a 39 kΩ resistor (see
Figure 44). CLK+ can be directly driven from a CMOS gate. This input is designed to withstand input voltages up to 3.6 V, making the selection of the drive logic voltage very flexible. When driving CLK+ with a 1.8 V CMOS signal, biasing the CLK− pin with a 0.1 μF capacitor in parallel with a 39 kΩ resistor (see
Figure 44) is required. The 39 kΩ resistor is not required when driving CLK+ with a 3.3 V CMOS signal (see
Figure 45).
CLOCK
INPUT
06216-045
CLOCK
INPUT
1
Clock Duty Cycle
Typical high speed ADCs use both clock edges to generate a variety of internal timing signals. As a result, these ADCs may
06216-046
be sensitive to clock duty cycle. Commonly, a ±5% tolerance is required on the clock duty cycle to maintain dynamic performance characteristics.
The AD9254 contains a duty cycle stabilizer (DCS) that retimes the nonsampling, or falling edge, providing an internal clock signal with a nominal 50% duty cycle. This allows a wide range of clock input duty cycles without affecting the performance of the AD9254. Noise and distortion performance are nearly flat for a wide range of duty cycles when the DCS is on, as shown in Figure 28.
Jitter in the rising edge of the input is still of paramount concern and is not reduced by the internal stabilization circuit. The duty cycle control loop does not function for clock rates less than
06216-047
20 MHz nominally. The loop has a time constant associated with it that needs to be considered in applications where the clock rate can change dynamically. This requires a wait time of 1.5 μs to 5 μs after a dynamic clock frequency increase (or decrease) before the DCS loop is relocked to the input signal. During the time period the loop is not locked, the DCS loop is bypassed, and the internal device timing is dependent on the duty cycle of the input clock signal. In such an application, it may be appropriate to disable the duty cycle stabilizer. In all other applications, enabling the DCS circuit is recommended to maximize ac performance.
VCC
0.1µF
1k
AD951x
1k
CMOS DRIVER
1
50
1
50Ω RESISTOR IS OPTIONAL.
0.1µF
OPTIONAL
100
39k
Figure 44. Single-Ended 1.8 V CMOS Sample Clock
VCC
0.1µF
1k
AD951x
1k
CMOS DRIVER
1
50
50Ω RESISTOR I S OPTI ONAL.
OPTIONAL
100
Figure 45. Single-Ended 3.3 V CMOS Sample Clock
0.1µF
0.1µF
0.1µF
CLK+
ADC
AD9254
CLK–
CLK+
ADC
AD9254
CLK–
06216-048
06216-049
Rev. 0 | Page 18 of 40
AD9254
The DCS can be enabled or disabled by setting the SDIO/DCS pin when operating in the external pin mode (see Table 10), or via the SPI, as described in Table 13.
Table 10. Mode Selection (External Pin Mode)
Voltage at Pin SCLK/DFS SDIO/DCS
AGND Binary (default) DCS disabled AVDD Twos complement
DCS enabled (default)

JITTER CONSIDERATIONS

High speed, high resolution ADCs are sensitive to the quality of the clock input. The degradation in SNR at a given input frequency (f
SNR = −20 log (2π × f
In the equation, the rms aperture jitter represents the root mean square of all jitter sources, which include the clock input, analog input signal, and ADC aperture jitter specification. IF under­sampling applications are particularly sensitive to jitter, as shown in Figure 46.
SNR (dBc)
Treat the clock input as an analog signal in cases where aperture jitter can affect the dynamic range of the AD9254. Power supplies for clock drivers should be separated from the ADC output driver supplies to avoid modulating the clock signal with digital noise. The power supplies should also not be shared with analog input circuits, such as buffers, to avoid the clock modulating onto the input signal or vice versa. Low jitter, crystal-controlled oscil­lators make the best clock sources. If the clock is generated from another type of source (by gating, dividing, or other methods), it should be retimed by the original clock at the last step.
Refer to Application Notes AN-501, Aperture Uncertainty and
ADC System Performance; and AN-756, Sampled Systems and the Effects of Clock Phase Noise and Jitter, for more in-depth
information about jitter performance as it relates to ADCs.
) due to jitter (tJ) is calculated as follows:
IN
× tJ)
IN
75
70
MEASURED
PERFORMANCE
65
60
55
50
45
40
1 10 100 1000
Figure 46. SNR vs. Input Frequency and Jitter
INPUT FREQ UE NCY ( MHz )
0.05ps
0.20ps
0.5ps
1.0ps
1.50ps
2.00ps
2.50ps
3.00ps
06216-050

POWER DISSIPATION AND STANDBY MODE

The power dissipated by the AD9254 is proportional to its sample rate (see Figure 47). The digital power dissipation is determined primarily by the strength of the digital drivers and the load on each output bit. Maximum DRVDD current (I
f
LOAD
CLK
2
CVI
DRVDDDRVDD
where N is the number of output bits, 14 in the AD9254.
This maximum current occurs when every output bit switches on every clock cycle, that is, a full-scale square wave at the Nyquist frequency, f
/2. In practice, the DRVDD current is
CLK
established by the average number of output bits switching, which is determined by the sample rate and the characteristics of the analog input signal. Reducing the capacitive load presented to the output drivers can minimize digital power consumption. The data in Figure 47 was taken under the same operating conditions as the data for the Typical Performance Characteristics section, with a 5 pF load on each output driver.
500
480
460
440
420
400
380
POWER (mW)
360
340
320
300
0 102030405060708090100110120130140150
Figure 47. AD9254 Power and Current vs. Clock Frequency f
I (AVDD)
POWER
I (DRVDD)
CLOCK FREQUE NCY (MHz)
Power-Down Mode
By asserting the PDWN pin high, the AD9254 is placed in power­down mode. In this state, the ADC typically dissipates 1.8 mW. During power-down, the output drivers are placed in a high impedance state. Reasserting the PDWN pin low returns the AD9254 to its normal operational mode. This pin is both 1.8 V and 3.3 V tolerant.
Low power dissipation in power-down mode is achieved by shutting down the reference, reference buffer, biasing networks, and clock. The decoupling capacitors on REFT and REFB are discharged when entering power-down mode and then must be recharged when returning to normal operation. As a result, the wake-up time is related to the time spent in power-down mode; and shorter power-down cycles result in proportionally shorter wake-up times. With the recommended 0.1 μF decoupling capaci­tors on REFT and REFB, it takes approximately 0.25 ms to fully discharge the reference buffer decoupling capacitors and 0.35 ms to restore full operation.
) can be calculated as
DRVDD
N
×××=
300
250
200
150
100
50
0
= 30 MHz
IN
CURRENT (mA)
06216-051
Rev. 0 | Page 19 of 40
AD9254
Standby Mode
When using the SPI port interface, the user can place the ADC in power-down or standby modes. Standby mode allows the user to keep the internal reference circuitry powered when faster wake-up times are required (see the Memory Map section).

DIGITAL OUTPUTS

The AD9254 output drivers can be configured to interface with
1.8 V to 3.3 V logic families by matching DRVDD to the digital supply of the interfaced logic. The output drivers are sized to provide sufficient output current to drive a wide variety of logic families. However, large drive currents tend to cause current glitches on the supplies that may affect converter performance. Applications requiring the ADC to drive large capacitive loads or large fan-outs may require external buffers or latches.
The output data format can be selected for either offset binary or twos complement by setting the SCLK/DFS pin when operat­ing in the external pin mode (see Table 10). As detailed in the
Interfacing to High Speed ADCs via SPI user manual, the data
format can be selected for either offset binary, twos complement, or Gray code when using the SPI control.
Out-of-Range (OR) Condition
An out-of-range condition exists when the analog input voltage is beyond the input range of the ADC. OR is a digital output that is updated along with the data output corresponding to the particular sampled input voltage. Thus, OR has the same pipeline latency as the digital data.
OR DATA OUTPUTS
1
11
1111
1111
0
11
1111
1111
0
11
1111
1111
0 0 1
0000
00
0000
0000
00
0000
0000
00
0000
Figure 48. OR Relation to Input Voltage and Output Data
1111 1111 1110
0001 0000 0000
OR
–FS + 1/2 LSB
–FS – 1/2 L SB
OR is low when the analog input voltage is within the analog input range and high when the analog input voltage exceeds the input range, as shown in Figure 48. OR remains high until the analog input returns to within the input range and another conversion is completed.
+FS – 1 LSB
+FS–FS
+FS – 1/2 LS B
06216-052
By logically AND’ing the OR bit with the MSB and its complement, overrange high or underrange low conditions can be detected. Table 11 is a truth table for the overrange/underrange circuit in Figure 49, which uses NAND gates.
MSB
OR
MSB
Figure 49. Overrange/Underrange Logic
OVER = 1
UNDER = 1
06216-053
Table 11. Overrange/Underrange Truth Table
OR MSB Analog Input Is:
0 0 Within range 0 1 Within range 1 0 Underrange 1 1 Overrange
Digital Output Enable Function (OEB)
The AD9254 has three-state ability. If the OEB pin is low, the output data drivers are enabled. If the OEB pin is high, the output data drivers are placed in a high impedance state. This is not intended for rapid access to the data bus. Note that OEB is referenced to the digital supplies (DRVDD) and should not exceed that supply voltage.

TIMING

The lowest typical conversion rate of the AD9254 is 10 MSPS. At clock rates below 10 MSPS, dynamic performance can degrade.
The AD9254 provides latched data outputs with a pipeline delay of twelve clock cycles. Data outputs are available one propaga­tion delay (t
The length of the output data lines and the loads placed on them should be minimized to reduce transients within the AD9254. These transients can degrade the dynamic performance of the converter.
Data Clock Output (DCO)
The AD9254 also provides data clock output (DCO) intended for capturing the data in an external register. The data outputs are valid on the rising edge of DCO, unless the DCO clock polarity has been changed via the SPI. See Figure 2 for a graphical timing description.
) after the rising edge of the clock signal.
PD
Table 12. Output Data Format
Gray Code Mode
Input (V) Condition (V) Binary Output Mode Twos Complement Mode
(SPI Accessible)
OR
VIN+ – VIN– < –VREF – 0.5 LSB 00 0000 0000 0000 10 0000 0000 0000 11 0000 0000 0000 1 VIN+ – VIN– = –VREF 00 0000 0000 0000 10 0000 0000 0000 11 0000 0000 0000 0 VIN+ – VIN– = 0 10 0000 0000 0000 00 0000 0000 0000 00 0000 0000 0000 0 VIN+ – VIN– = +VREF – 1.0 LSB 11 1111 1111 1111 01 1111 1111 1111 10 0000 0000 0000 0 VIN+ – VIN– > +VREF – 0.5 LSB 11 1111 1111 1111 01 1111 1111 1111 10 0000 0000 0000 1
Rev. 0 | Page 20 of 40
AD9254

SERIAL PORT INTERFACE (SPI)

The AD9254 serial port interface (SPI) allows the user to configure the converter for specific functions or operations through a structured register space provided inside the ADC. This provides the user added flexibility and customization depending on the application. Addresses are accessed via the serial port and may be written to or read from via the port. Memory is organized into bytes that are further divided into fields, as documented in the Memory Map section. For detailed operational information, see the Interfacing to High Speed ADCs
via SPI user manual.
CONFIGURATION USING THE SPI
As summarized in Table 13, three pins define the SPI of this ADC. The SCLK/DFS pin synchronizes the read and write data presented to the ADC. The SDIO/DCS dual-purpose pin allows data to be sent to and read from the internal ADC memory map registers. The CSB pin is an active low control that enables or disables the read and write cycles.
Table 13. Serial Port Interface Pins
Pin Name Function
SCLK/DFS
SDIO/DCS
CSB
The falling edge of the CSB in conjunction with the rising edge of the SCLK determines the start of the framing. Figure 50 and Table 14 provide examples of the serial timing and its definitions.
Other modes involving the CSB are available. The CSB can be held low indefinitely to permanently enable the device (this is called streaming). The CSB can stall high between bytes to allow for additional external timing. When CSB is tied high, SPI functions are placed in a high impedance mode. This mode turns on any SPI pin secondary functions.
During an instruction phase, a 16-bit instruction is transmitted. Data follows the instruction phase and the length is determined by the W0 bit and the W1 bit. All data is composed of 8-bit words. The first bit of each individual byte of serial data indicates whether a read or write command is issued. This allows the serial data input/output (SDIO) pin to change direction from an input to an output.
SCLK (serial clock) is the serial shift clock in. SCLK synchronizes serial interface reads and writes. SDIO (serial data input/output) is a dual-purpose pin. The typical role for this pin is an input and output, depending on the instruction being sent and the relative position in the timing frame. CSB (chip select bar) is an active-low control that gates the read and write cycles.
In addition to word length, the instruction phase determines if the serial frame is a read or write operation, allowing the serial port to be used to both program the chip as well as read the contents of the on-chip memory. If the instruction is a readback operation, performing a readback causes the serial data input/output (SDIO) pin to change direction from an input to an output at the appropriate point in the serial frame.
Data can be sent in MSB- or in LSB-first mode. MSB first is the default on power-up and can be changed via the configuration register. For more information, see the Interfacing to High Speed
ADCs via SPI user manual.
Table 14. SPI Timing Diagram Specifications
Name Description
tDS Setup time between data and rising edge of SCLK tDH Hold time between data and rising edge of SCLK t
Period of the clock
CLK
tS Setup time between CSB and SCLK tH Hold time between CSB and SCLK tHI
tLO
Minimum period that SCLK should be in a logic high state
Minimum period that SCLK should be in a logic low state
HARDWARE INTERFACE
The pins described in Table 13 comprise the physical interface between the user’s programming device and the serial port of the AD9254. The SCLK and CSB pins function as inputs when using the SPI interface. The SDIO pin is bidirectional, functioning as an input during write phases and as an output during readback.
The SPI interface is flexible enough to be controlled by either PROM or PIC microcontrollers. This provides the user with the ability to use an alternate method to program the ADC. One method is described in detail in Application Note AN-812, Microcontroller-Based Serial Port Interface Boot Circuit.
When the SPI interface is not used, some pins serve a dual function. When strapped to AVDD or ground during device power on, the pins are associated with a specific function.
CONFIGURATION WITHOUT THE SPI
In applications that do not interface to the SPI control registers, the SDIO/DCS and SCLK/DFS pins serve as stand-alone CMOS-compatible control pins. When the device is powered up, it is assumed that the user intends to use the pins as static control lines for the output data format and duty cycle stabilizer (see Table 10). In this mode, the CSB chip select should be connected to AVDD, which disables the serial port interface. For more information, see the Interfacing to High Speed ADCs
via SPI user manual.
Rev. 0 | Page 21 of 40
AD9254

MEMORY MAP

READING THE MEMORY MAP REGISTER TABLE

Each row in the memory map register table has eight address locations. The memory map is roughly divided into three sections: the chip configuration registers map (Address 0x00 to Address 0x02), the device index and transfer registers map (Address 0xFF), and the ADC functions map (Address 0x08 to Address 0x18).
Table 15 displays the register address number in hexadecimal in the first column. The last column displays the default value for each hexadecimal address. The Bit 7 (MSB) column is the start of the default hexadecimal value given. For example, Hexadecimal Address 0x14, output_phase, has a hexadecimal default value of 0x00. This means Bit 3 = 0, Bit 2 = 0, Bit 1 = 1, and Bit 0 = 1 or 0011 in binary. This setting is the default output clock or DCO phase adjust option. The default value adjusts the DCO phase 90° relative to the nominal DCO edge and 180° relative to the data edge. For more information on this function, consult the Interfacing to High Speed ADCs via SPI user manual.
Open Locations
Locations marked as open are currently not supported for this device. When required, these locations should be written with 0s. Writing to these locations is required only when part of an address location is open (for example, Address 0x14). If the entire address location is open (Address 0x13), then the address location does not need to be written.
Default Values
Coming out of reset, critical registers are loaded with default values. The default values for the registers are shown in Table 15.
Logic Levels
An explanation of two registers follows:
“Bit is set” is synonymous with “Bit is set to Logic 1” or
“Writing Logic 1 for the bit.”
“Clear a bit” is synonymous with “Bit is set to Logic 0” or
“Writing Logic 0 for the bit.”
SPI-Accessible Features
A list of features accessible via the SPI and a brief description of what the user can do with these features follows. These features are described in detail in the Interfacing to High Speed ADCs via
SPI user manual.
Modes: Set either power-down or standby mode.
Clock: Access the DCS via the SPI.
Offset: Digitally adjust the converter offset.
Te st I /O : Set test modes to have known data on output bits.
Output Mode: Setup outputs, vary the strength of the
output drivers.
Output Phase: Set the output clock polarity.
CSB
SCLK
SDIO
DON’T CARE
t
DS
t
S
R/W W1 W0 A12 A11 A10 A9 A8 A7
t
DH
t
HI
Figure 50. Serial Port Interface Timing Diagram
t
CLK
t
LO
VREF: Set the reference voltage.
D5 D4 D3 D2 D1 D0
t
H
DON’T CARE
DON’T CAREDON’T CARE
06216-054
Rev. 0 | Page 22 of 40
AD9254

MEMORY MAP REGISTER TABLE

Table 15. Memory Map Register
Default Addr. (Hex)
Chip Configuration Registers
00 chip_port_config 0 LSB first
01 chip_id 8-bit Chip ID Bits 7:0
02 chip_grade Open Open Open Open Child ID
Device Index and Transfer Registers
FF device_update Open Open Open Open Open Open Open SW
Global ADC Functions
08 modes Open Open PDWN
09 clock Open Open Open Open Open Open Open Duty
Parameter Name
Bit 7 (MSB)
Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1
0 = Off (Default)
1 = On
Soft reset
0 = Off (Default)
1 = On
0—Full 1—
Standby
1 1 Soft
reset 0 = Off
(Default) 1 = On
(AD9254 = 0x00), (default)
Open Open Open Read 0 = 150 MSPS
Open Open Internal power-down mode
000—normal (power-up)
001—full power-down
010—standby
011—normal (power-up)
Note: External PDWN pin
overrides this setting.
LSB first 0 = Off
(Default) 1 = On
Bit 0 (LSB)
0 0x18 The nibbles
transfer
cycle stabilizer 0— disabled 1— enabled
Value (Hex)
Read only
only
0x00 Synchronously
0x00 Determines
Default Notes/ Comments
should be mirrored. See the
Interfacing to High Speed ADCs via SPI
user
manual. Default is unique
chip ID, different for each device.
Child ID used to differentiate speed grades.
transfers data from the master shift register to the slave.
various generic modes of chip operation. See the
Power Dissipation and Standby Mode
SPI-
and the
Accessible
0x01
Features
sections.
See the
Duty Cycle
section and the
Clock
SPI-Accessible Features
section.
Rev. 0 | Page 23 of 40
AD9254
Addr. (Hex)
Flexible ADC Functions
10 offset
0D test_io PN23
14 output_mode Output Driver
16 output_phase Output Clock
18 VREF Internal Reference
1
Parameter Name
External output enable (OEB) pin must be high.
Bit 7 (MSB)
Configuration 00 for DRVDD = 2.5 V to
3.3 V 10 for DRVDD = 1.8 V
Polarity 1 = inverted 0 = normal (Default)
Resistor Divider 00—VREF = 1.25 V
01—VREF = 1.5 V 10—VREF = 1.75 V 11—VREF = 2.00 V (Default)
Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1
Open Open Open Open Open Open Open 0x00
Digital Offset Adjust<5:0> 011111 011110 011101 … 000010 000001 000000 111111 111110 111101 ... 100001 100000
0 = normal (Default) 1 = reset
Open Output
Open Open Open Open Open Open 0xC0
PN9 0 = normal (Default) 1 = reset
Disable 1— disabled 0—
1
enabled
Bit 0 (LSB)
Offset in LSBs
+31 +30 +29
+2 +1 0 (Default) 1
−2
−3
−31
−32
Global Output Test Options
Open Output
000—off 001—midscale short
010—+FS short 011—−FS short
100—checker board output 101—PN 23 sequence 110—PN 9 111—one/zero word toggle
Data Format Select Data Invert 1 = invert
00—offset binary
(default)
01—twos
complement
10—Gray Code
0x00 Adjustable for
Default Value (Hex)
0x00 See the
0x00 Configures the
Default Notes/ Comments
offset inherent in the converter. See
SPI­Accessible Features
section.
Interfacing to High Speed ADCs via SPI
user manual.
outputs and the format of the data.
See the
SPI­Accessible Features
section.
See the
SPI­Accessible Features
section.
Rev. 0 | Page 24 of 40
AD9254

LAYOUT CONSIDERATIONS

POWER AND GROUND RECOMMENDATIONS

When connecting power to the AD9254, it is recommended that two separate supplies be used: one for analog (AVDD, 1.8 V nominal) and one for digital (DRVDD, 1.8 V to 3.3 V nominal). If only a single 1.8 V supply is available, it is routed to AVDD first, then tapped off and isolated with a ferrite bead or filter choke with decoupling capacitors proceeding connection to DRVDD. The user can employ several different decoupling capacitors to cover both high and low frequencies. These should be located close to the point of entry at the PC board level and close to the parts with minimal trace length.
A single PC board ground plane is sufficient when using the AD9254. With proper decoupling and smart partitioning of analog, digital, and clock sections of the PC board, optimum performance is easily achieved.
Exposed Paddle Thermal Heat Slug Recommendations
It is required that the exposed paddle on the underside of the ADC be connected to analog ground (AGND) to achieve the best electrical and thermal performance of the AD9254. An exposed, continuous copper plane on the PCB should mate to the AD9254 exposed paddle, Pin 0. The copper plane should have several vias to achieve the lowest possible resistive thermal path for heat dissipation to flow through the bottom of the PCB. These vias should be solder-filled or plugged.
To maximize the coverage and adhesion between the ADC and PCB, partition the continuous plane by overlaying a silkscreen on the PCB into several uniform sections. This provides several tie points between the two during the reflow process. Using one continuous plane with no partitions guarantees only one tie point between the ADC and PCB. See example. For detailed information on packaging and the PCB layout of chip scale packages, see
A Design and Manufacturing Guide for the Lead Frame Chip Scale Package.
Figure 51 for a PCB layout
Application Note AN-772,
CML
The CML pin should be decoupled to ground with a 0.1 μF capacitor, as shown in

RBIAS

The AD9254 requires the user to place a 10 k resistor between the RBIAS pin and ground. This resister sets the master current reference of the ADC core and should have at least a 1% tolerance.

REFERENCE DECOUPLING

The VREF pin should be externally decoupled to ground with a low ESR 1.0 μF capacitor in parallel with a 0.1 μF ceramic low ESR capacitor. In all reference configurations, REFT and REFB are bypass points provided for reducing the noise contributed by the internal reference buffer. It is recommended that an external 0.1 μF ceramic capacitor be placed across REFT/REFB. While placement of this 0.1 μF capacitor is not required, the SNR performance degrades by approximately 0.1 dB without it. All reference decoupling capacitors should be placed as close to the ADC as possible with minimal trace lengths.
SILKSCREEN PARTITION
PIN 1 INDICATOR
Figure 51. Typical PCB Layout
Figure 33.
06216-055
Rev. 0 | Page 25 of 40
AD9254

EVALUATION BOARD

The AD9254 evaluation board provides all of the support circuitry required to operate the ADC in its various modes and configu­rations. The converter can be driven differentially through a double balun configuration (default) or through the
AD8352 differential
driver. The ADC can also be driven in a single-ended fashion. Separate power pins are provided to isolate the DUT from the AD8352 drive circuitry. Each input configuration can be selected by proper connection of various components (see
Figure 53 to Figure 63). Figure 52 shows the typical bench characterization setup used to evaluate the ac performance of the AD9254.
It is critical that the signal sources used for the analog input and clock have very low phase noise (<1 ps rms jitter) to realize the optimum performance of the converter. Proper filtering of the analog input signal to remove harmonics and lower the integrated or broadband noise at the input is also necessary to achieve the specified noise performance.
Figure 53 to Figure 57 for the complete schematics and
See layout diagrams that demonstrate the routing and grounding techniques that should be applied at the system level.

POWER SUPPLIES

This evaluation board comes with a wall-mountable switching power supply that provides a 6 V, 2 A maximum output. Connect the supply to the rated 100 V ac to 240 V ac wall outlet at 47 Hz to 63 Hz. The other end is a 2.1 mm inner diameter jack that connects to the PCB at P500. Once on the PC board, the 6 V supply is fused and conditioned before connecting to five low dropout linear regulators that supply the proper bias to each of the various sections on the board.
When operating the evaluation board in a nondefault condition, L501, L503, L504, L508, and L509 can be removed to disconnect the switching power supply. This enables the user to individually bias each section of the board. Use P501 to connect a different supply for each section. At least one 1.8 V supply is needed with a 1 A current capability for AVDD_DUT and DRVDD_DUT; however, it is recommended that separate supplies be used for analog and digital. To operate the evaluation board using the AD8352 option, a separate 5.0 V supply (AMP_VDD) with a 1 A current capability is needed. To operate the evaluation board using the alternate SPI options, a separate 3.3 V analog supply is needed, in addition to the other supplies. The 3.3 V supply (AVDD_3.3V) should have a 1 A current capability as well. Solder Jumpers J501, J502, and J505 allow the user to combine these supplies (see
Figure 57 for more details).

INPUT SIGNALS

When connecting the clock and analog source, use clean signal generators with low phase noise, such as Rohde & Schwarz SMHU or Agilent HP8644 signal generators or the equivalent. Use one meter long, shielded, RG-58, 50 Ω coaxial cable for making connections to the evaluation board. Enter the desired frequency and amplitude for the ADC. Typically, most evaluation boards from Analog Devices, Inc. can accept a ~2.8 V p-p or 13 dBm sine wave input for the clock. When connecting the analog input source, it is recommended to use a multipole, narrow­band, band-pass filter with 50 Ω terminations. Analog Devices uses TTE®, Allen Avionics, and K&L® types of band-pass filters. Connect the filter directly to the evaluation board, if possible.

OUTPUT SIGNALS

The parallel CMOS outputs interface directly with the Analog Devices standard single-channel FIFO data capture board (HSC-ADC-EVALB-SC). For more information on the FIFO boards and their optional settings, visit
www.analog.com/FIFO.
WALL OUTLET 100V TO 240V AC 47Hz TO 63Hz
6V DC
SWITCHING
ROHDE & SCHWARZ,
SMHU, 2V p-p SIGNAL SYNTHESIZ ER
ROHDE & SCHWARZ,
SMHU, 2V p-p SIGNAL SYNTHESIZER
POWER SUPPLY
2A MAX
BAND-PASS
FILTER
AIN
CLK
5.0V
–+
GND
AMP_VDD
1.8V
GND
2.5V
–+–+
GND
AVDD_DUT
AD9254
EVALUATION BOARD
–+
DRVDD_DUT
3.3V
GND
–+
VDL
PARALLEL
3.3V
GND
AVD D_3. 3V
14-BIT
CMOS
SPI SPISPI
3.3V
–+
VCC
GND
HSC-ADC-EVALB-SC
FIFO DATA
CAPTURE
BOARD
USB
CONNECTION
PC
RUNNING
ADC
ANALYZER
AND SPI
USER
SOFTWARE
06216-056
Figure 52. Evaluation Board Connection
Rev. 0 | Page 26 of 40
AD9254

DEFAULT OPERATION AND JUMPER SELECTION SETTINGS

The following is a list of the default and optional settings or modes allowed on the AD9254 Rev. A evaluation board.
POWER
Connect the switching power supply that is supplied in the evaluation kit between a rated 100 V ac to 240 V ac wall outlet at 47 Hz to 63 Hz and P500.
VIN
The evaluation board is set up for a double balun configuration analog input with optimum 50 Ω impedance matching out to 70 MHz. For more bandwidth response, the differential capacitor across the analog inputs can be changed or removed (see Table 8). The common mode of the analog inputs is developed from the center tap of the transformer via the CML pin of the ADC (see the Analog Input Considerations section).
VREF
VREF is set to 1.0 V by tying the SENSE pin to ground via JP507 (Pin 1 and Pin 2). This causes the ADC to operate in
2.0 V p-p full-scale range. A separate external reference option is also included on the evaluation board. Connect JP507 between Pin 2 and Pin 3, connect JP501, and provide an external reference at E500. Proper use of the VREF options is detailed in the Voltage Reference section.
RBIAS
RBIAS requires a 10 kΩ resistor (R503) to ground and is used to set the ADC core bias current.
CLOCK
The default clock input circuitry is derived from a simple transformer-coupled circuit using a high bandwidth 1:1 impedance ratio transformer (T503) that adds a very low amount of jitter to the clock path. The clock input is 50 Ω terminated and ac-coupled to handle single-ended sine wave inputs. The transformer converts the single-ended input to a differential signal that is clipped before entering the ADC clock inputs.
SCLK/DFS
If the SPI port is in external pin mode, the SCLK/DFS pin sets the data format of the outputs. If the pin is left floating, the pin is internally pulled down, setting the default condition to binary. Connecting JP2 Pin 2 and Pin 3 sets the format to twos comple­ment. If the SPI port is in serial pin mode, connecting JP2 Pin 1 and Pin 2 connects the SCLK pin to the on-board SPI circuitry (see the Serial Port Interface (SPI) section).
SDIO/DCS
If the SPI port is in external pin mode, the SDIO/DCS pin acts to set the duty cycle stabilizer. If the pin is left floating, the pin is internally pulled up, setting the default condition to DCS enabled. To disable the DCS, connect JP3 Pin 2 and Pin 3. If the SPI port is in serial pin mode, connecting JP3 Pin 1 and Pin 2 connects the SDIO pin to the on-board SPI circuitry (see the Serial Port Interface (SPI) section).

ALTERNATIVE CLOCK CONFIGURATIONS

A differential LVPECL clock can also be used to clock the ADC input using the AD9515 (U500). When using this drive option, the components listed in Table 16 need to be populated. Consult the AD9515 data sheet for further information.
To configure the analog input to drive the AD9515 instead of the default transformer option, the following components need to be added, removed, and/or changed.
1. Remove R507, R508, C532, and C533 in the default clock
path.
2. Populate R505 with a 0 Ω resistor and C531 in the default
clock path.
3. Populate R511, R512, R513, R515 to R524, U500, R580,
R582, R583, R584, C536, C537, and R586.
If using an oscillator, two oscillator footprint options are also available (OSC500) to check the performance of the ADC. JP508 provides the user flexibility in using the enable pin, which is common on most oscillators. Populate OSC500, R575, R587, and R588 to use this option.
PDWN
To enable the power-down feature, connect JP506, shorting the PDWN pin to AVDD.
CSB
The CSB pin is internally pulled-up, setting the chip into external pin mode, to ignore the SDIO and SCLK information. To connect the control of the CSB pin to the SPI circuitry on the evaluation board, connect JP1 Pin 1 and Pin 2. To set the chip into serial pin mode, and enable the SPI information on the SDIO and SCLK pins, tie JP1 low (connect Pin 2 and Pin 3) in the always enabled mode.
Rev. 0 | Page 27 of 40

ALTERNATIVE ANALOG INPUT DRIVE CONFIGURATION

This section provides a brief description of the alternative analog input drive configuration using the AD8352. When using this particular drive option, some components need to be populated, as listed in Table 16. For more details on the AD8352 differential driver, including how it works and its optional pin settings, consult the AD8352 data sheet.
AD9254
To configure the analog input to drive the AD8352 instead of the default transformer option, the following components need to be added, removed, and/or changed:
1. Remove C1 and C2 in the default analog input path.
2. Populate R3 and R4 with 200 Ω resistors in the analog
input path.
3. Populate the optional amplifier input path with all
components except R594, R595, and C502.
Note that to terminate the input path, only one of the following components should be populated: R9, R592, or the combination of R590 and R591).
4. Populate C529 with a 5 pF capacitor in the analog input
path.
Currently, R561 and R562 are populated with 0 Ω resistors to allow signal connection. This area allows the user to design a filter if additional requirements are necessary.
Rev. 0 | Page 28 of 40
AD9254

SCHEMATICS

2
DUTAVDD
D501
DNI
1
3
HSMS2812
2
DUTAVDD
D500
DNI
1
3
HSMS2812
DNI
.1UF
C502
DNI
R595
10K
AMPVDD
31
disable
R594
10K
DNI
J500
OPTIONAL AMP INPUT
AMPVDD
AMPOUT+
.1UF
C504
DNI
DNI
RC0402
0R535
11
12
GND
VOP
VCC
13
VCM
15
ENB
2
16 14
VIP
enable
0
R593
C500
.1UF
DNI
RDP
2
DNI
AMPOUT-
C505
DNI
.1UF
DNI
RC0402
R536 0
9
10
GND
VON
8
VCC
GND
67
5
VIN
AMPVDD
0
DNI
R596
.1UF
DNI
C503
AD8352
DNI
U511
SIGNAL=GND;17
RGN
RDN
RGP
413
R598
100
0.3PF
C501
DNI DNI DNI
4.3K
R597
R592
DNI
CC0402
C529
DNI
DNI
CML
RC0402
DNI
20PF
RC0402RC0402
213
VIN-
VIN-
RC0402
33
R567
RC0402
0
R562
.1UF
C510
25
R4
VIN+
AMPOUT-
C2
.1UF
4
When using R1, remove R3, R4,R6.
Replace C1, C2 w ith 0 oh m resistors.
ETC1-1-13
Replace R5 wi th 0.1UF cap
0
R5
RC0402
VIN+
R563
RC0402
RC0402
R566
33
R574
RC0402
RC0402
R561
0
0
R571
25
R3
AMPOUT+
RC0402
R565
C1
.1UF
5
T501
SP
DOUBLE BALUN / XFMR INPUT
1234
SP
T500
5
0
R2
CC0402
0.1UF
C528
RC0603
R560
0
12
GND;3,4,5
SMAEDGE
S500
Ain
DNI
R1
RC0402
CML
6
DNI
T502
ETC1-1-13
RC0402
DNI
50
R502
1
34
25
C509
.1UF
R6
DNI
RC0402
CML
CC0402
DNI
C3
RC0603
R7
DNI
12
RC0603
GND;3,4 ,5
SMAEDGE
S503
Ain/
Remove R3, R4. Pl ace R6, R502,.
When usi ng T502, remove T 500, T501.
Repalce C1, C2 w ith 0 oh m resistors.
R8
DNI
RC0603
C4
R10
S504
DNI
CC0402
0
21
RC0603
DNI
0
SMA200UP
Ampin
Figure 53. Evaluation Board Schematic, DUT Analog Inputs
R590
25
25
R591
DNI
DNI
2
1
SP
T1
DNI
5
43
0
C5
R12
DNI
CC0402
RC0603
DNI
0
R590/R591,R9,R592 On ly one should be installed at a time.
Install all optional Amp input components.
Remove C1, C2.
Set R3=R4=200 OHM.
For ampli fier (AD8352):
12
DNI
R11
DNI
R9
RC0603
GND;3,4 ,5
DNI
SMA200UP
S505
0
RC060 3
GND;3,4 ,5
DNI
Ampin/
06216-057
Rev. 0 | Page 29 of 40
AD9254
C1C2C3C4C5C6C7C8C9
C10
C11
C12
C13
C14
C15
C16
C17
C18
C19
C20
J503
JP3
2
13
SDIO_ODM
DUTAVDD
JP2
2
13
SCLK_DTP
JP1
2
13
CSB_DUT
SDI_CHAFIFOCLK
B1B2B3B4B5B6B7B8B9
A1A2A3A4A5A6A7A8A9
FD13
FD13
FDOR
22
23
24
O14
O15
OE4
74VCX16224
I14
I15
OE3
25
27
26
VDL
611
710
22RP502
22RP502
D13
DOR
FD12
21
GND4
U509
GND5
28
SDO_CHA
CSB1_CHA
FD11
FD12
O13
I13
22RP502
D12
SCLK_CHA
B10
B11
B12
B13
B14
B15
B16
B17
B18
B19
B20
J503
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
J503
OUTPUT CONNECTOR
FD8
FD9
FD10
FD10
FD11
18
19
20
O11
O12
VCC2
I11
VCC3
I12
31
30
29
314
413
512
22RP502
22RP502
D11
D10
FD4
FD5
FD6
FD7
FD7
FD8
FD9
14
15
16
17
O8
O9
O10
GND3
I8
I9
GND6
I10
35
34
33
32
116
215
22RP501
22RP502
22RP502
D8D7D6D5D4D3D2
D9
FD0
FD1
FD2
FD3
FD6
13
O7
36
512
611
22RP501
FDOR
FIFOCLK
FD0
FD1
FD2
FD3
FD4
FD5
VCC1
VCC4I4I5
42
22RP501
O2
O3
I2
I3
44
43
45
116
RP5002236RP5002227RP50022
D1
45678
GND1
GND8
123
O0
O1
OE1
I0
I1
OE2
OUTPUT BUFFER
48
47
46
45
D0
DCO
9
10
11
12
O4
O5
O6
GND2
GND7I6I7
41
40
39
38
37
215
314
413
22RP501
22RP501
22RP501
DUTAVDD
2425
AVDDSENSE
SENSE
DUT
710
22RP501
TP502
D2
D3
1
2
D2
D3
DRGND
DRVDD
DUTDRVDD
RP50122
98
AD9246LFCSP
ESNESFERV_TXE
13
2
JP507
JP500
DUTAVDD
JP501
E500
RP50222
98
TP501
TP503
DUTDRVDD
17
18
19
20
21
23
22
CSB
AVDD
AGND
AGND
SCLK/DFS
DRVDD
SDIO/DCS
DOR
16
15
OR
DRGND
D12
D13
13
14
D12
D13 (MSB)
chip corn ers
VIN-
CML
AGND
AVDD
AGND
VREF
REFB
VIN+
REFT
26
27
VREF
31
29
30
28
0.1UF
C554
VIN-
VIN+
CC0402
RBIAS
PDWN
34
32
33
35
36
JP506
DNI
R503
10K
CC0603
CML
0.1UF
C556
D11
12
D11
AGND
37
RC0603
D10
11
D10
CLK+
38
CLK
D8
D9
9
10
D9
D8
EPAD
CLK-
AVDD
394041
CLK
DUTAVDD
8
DRVDD
AGND
42
JP502
DRGND
AVDD
DNI
D4
D5
D6
D7
3
4
567
D4
D5
D6
D7
U510
D0 (LSB)
DCO
D1
OEB
45
44
464748
43
D0
DCO
D1
TP500
TP504
22RP500
81
VREF
R0402
R0402
DNI
R500
DNI
DNI
DNI
R501
1.0UF
C553
CC0805
C555
0.1UF
CC0402
06216-058
Figure 54. Evaluation Board Schematic, DUT, VREF, and Digital Output Interface
Rev. 0 | Page 30 of 40
AD9254
DNI
DNI
RC0603
R513 0
R515 0
RC0603
R525 0
R514 0
DNI
DNI
RC0603
RC0603
R516 0
R517 0
RC0603
RC0603
R527 0
DNI
R526 0
DNI
RC0603
RC0603
R520 0
R521 0
RC0603
RC0603
R531 0
DNI
R530 0
DNI
RC0603
RC0603
R519 0
R518 0
RC0603
RC0603
R529 0
R528 0
DNI
DNI
RC0603
RC0603
R524 0
RC0603
RC0603
R534 0
DNI
R533 0
DNI
DNI
DNI
DNI
DNI
DNI
DNI
DNI
AD9515 LOGIC SETUP
AVDD_3P3V
S1
S0
S2
S4
S3
S6
S5
S8
S7
DNI
RC0603
RC0603
R522 0
R523 0
RC0603
RC0603
DNI
R532 0
DNI
S9
S10
DNI
10K
R588
RC0402
DISABLE
2
JP508
ENABLE
DNI
153
31
DNI
10KR587
RC0402
78
OE
OE
DNI
GND
OSC50 0
VCC
VCC
OUT
10
14
12
AVDD_3P3V
0
R575
DNI
CLK
CC0402CC0402CC0402
0.1UF
C536
DNI
CLK
0.1UF
C533
RC0603
0
R506
6
T503
1
GNDOUT
CB3LV-3C
RC0603
0
R508
RC0402
OPT_CLK
0.1UF
C530
CLK
CC0402CC0402
0.1UF
C532
1
3
2
RC0603
D502
HSMS2812
0
R509
5
2
34
C511
.1UF
RC0603
RC0603
0
R512
0
R507
DNI
OPT_CLK
CC0402
CC0402
0.1UF
C531
DNI
49.9
R504
RC0603
49.9
R505
DNI
RC0603
Place C531,R505=0.
To use AD9515 (OPT _CLK), remove R507, R508, C533, C532.
AVDD_3P3V
DNI
4.12K
R586
RC0402
DNI
R580
10K
RC0402
DNI
R581
RC0402
R576
DNI
CLK
CC0402
0.1UF
C537
DNI
RC0402
DNI
100
R582
33
RC0402
31
32
DNI
21
RC0603
DNI
R510
OPT_CLK
23
OUT0
GND_PA D
GND
RSET
U500
RC0402
22
OUT0B
CLK
CLKB
235
R577
240
R583
RC0402
240
R584
RC0402
19
AD9515
AVDD_3P3V;1,4,17,20,21,24,26,29,30
SYNCB
DNI
21
RC0603
DNI
R511
OPT_CLK
E502
DNI
E503
0.1UF
C535
0.1UF
C534
DNI
RC0402
DNI
100
R585
DNI
DNI
18
OUT1
OUT1B
S10
25
S0
S9
16
S1
S8
15
S2
S7
14
S3
S6
13
S4
S5
12
S5
S4
11
S6
S3
10
S7
NC=27,28
S2
9
S8
S1
8
S9
S0
7
S10
VREF
6
E501
RC0402
R578
DNI
RC0402
R579
DNI
XFMR/AD9515
Clock Circuitry
SMAEDGE
SMAEDGE
S501
S502
GND;3,4,5
CLK
GND;3,4,5
CLK/
06216-059
Figure 55. Evaluation Board Schematic, DUT Clock Input
Rev. 0 | Page 31 of 40
AD9254
SDO_CHA
CSB1_CHA
SDI_CHA
SCLK_CHA
SDIO_ODM
R553
1K
RC0603
AVDD_3P3V
R551
1K
RC0603
DUTAVDD
6
Y1
VCC
A1
GND
U508
1K
R552
RC0603
4
Y2
NC7WZ07
A2
1325
RC0603
R550
10K
RC0603
0
R554
RC0603
0
R556
RC0603
0
R557
RC0603
0
R555
RC0603
RC0603
AVDD_3P3V
R549
10K
CSB_DUT
SCLK_DTP
6
4
Y1
Y2
VCC
U507
A1
NC7WZ16
GND
A2
1325
RC0603
R548
10K
R546
4.7K DN I
RC0603
DNI
4.7K
R545
RC0603
R547
4.7K DNI
765
GP0
GP2
GP1
VSSVDD
DNI
REMOVE WHEN USING OR PROGRAMMING PIC (U506)
DDVPMAV3P3_DDVA
U506
GP5
GP4
3
2814
SOIC8
MCLR
DNI
2
JP509
13
+5V=PROGR AMMING ONLY=A MPVDD
+3.3V=NORMAL OPERATION=AVDD_3P3V
CC0603
0.1UF
C557
DNI
R558
4.7K
RC0603
3
DNI
D505
21
PIC12F629
RC0603
Optional
R559
261
12
DNI
4
E504
PICVCC
GP1
GP0
MCLR -GP3
DNI
DNI
J504
1
34
56
78
9
2
PICVCC
GP1
GP0
MCLR -GP3
10
HEADER UP MALE
PIC-HEADER
For FIFO controlled port, populate R555, R556, R557.
When u sing P ICSPI co ntrol led po rt, p opul ate R545, R546, R547.
When u sing P ICSPI co ntrol led po rt, remo ve R555, R556, R55 7.
DNI
S1
1
SPI CIRCUITRY
2
6216-060
Figure 56. Evaluation Board Schematic, SPI Circuitry
Rev. 0 | Page 32 of 40
AD9254
AMPVDDIN
TP507
L501
10UH
LC1210
C522
1UF
4
23
1TUPTUOTUPNI
OUTPU T4
GND
1
AVDD_3.3V=3.3V
DUTDRVDD=2. 5V
DUTAVDD=1. 8V
VDL=3.3V
AMPVDD=5V
ADP3339AKC-5
U501
C523
1UF
PWR_IN
DUTAVDDIN
TP506
L504
10UH
LC1210
C518
4
23
1TUPTUOTUPNI
OUTPU T4
ADP3339AKC-1.8
U502
C519
PWR_IN
TP505
L503
1UF
GND
1
U503
1UF
AVDD_3P3V
TP513
L509
10UH
LC1210
C525
1UF
4
23
1TUPTUOTUPNI
0.1UF
C543
OUTPU T4
GND
1
ADP3339AKC-3.3
U505
C513
1UF
PWR_IN
DUTDRVDDIN
10UH
LC1210
C520
1UF
4
23
1TUPTUOTUPNI
OUTPU T4
GND
1
ADP3339AKC-2.5
C521
1UF
PWR_IN
VDLINPWR_IN
TP508
L508
10UH
LC1210
C526
1UF
4
23
1TUPTUOTUPNI
OUTPU T4
GND
1
ADP3339AKC-3.3
U504
C524
1UF
CC0402CC0402CC0402 CC0402
0.1UF
C546
0.1UF
C544
0.1UF
C545
AVDD_3P3V
0.1UF
C568
CC0603
0.1UF
C538
CC0402CC0402CC0402 CC0402
0.1UF
C542
0.1UF
C539
0.1UF
C540
AVDD_3P3V
C559
0.1UF0.1U F
C558
CC0603 CC0603
0.1UF
C565
H503
H502
H500
H501
GROUND
TEST POINTS
Connecte d to Ground
Mounting Holes
TP509
TP512
TP511
TP510
0.1UF
C574
CC0603CC0603
0.1UF
C570
CC0603
0.1UF
C566
CC0603
0.1UF
C575
0.1UF
C599C572
0.1UF
CC0603 CC0603
D503
SHOT_RECT3ADO-214AB
FER500
Power Supply Input
CHOKE_COIL
F500
6V, 2A max
0.1UF
PWR_IN
CR50 0
R589
261
21
34
D504
DO-214AA2AS2A_RECT
SMDC110F
C527
10UF
OPTIONAL POWER CONNECTION
2
3
1
CON005
7.5V POWER
P500
2.5MM JAC K
0.1UF
C514
AMPVDD
6.3V
C549
1OUF
ACASE
L507
L505
10UH
LC1210
AMPVDDIN
123456789
P1P2P3P4P5P6P7P8P9
P501
10UH
J505
GND
GND
GND
DUTDRVDDIN
DUTAVDDIN
VDL
LC1210
VDLIN
C567
CC0603
AMPVDD
DUTAVDD
0.1UF
C515
6.3V
C550
1OUF
ACASE
GND
C551
L502
10UH
LC1210
GND
AVDD_3P3VIN
10
P10
0.1UF
C564
CC0603 CC0603
VDL
DUTDRVDD
0.1UF
C516
6.3V
1OUF
ACASE
J502
C517
C552
1OUF
ACASE
L506
10UH
LC1210
0.1UF
C569
CC0603
DUTAVDD
AVDD_3P3V
0.1UF
6.3V
J501
0.1UF
C512
6.3V
C548
1OUF
ACASE
L500
10UH
LC1210
0.1UF
C573
CC0603
DUTDRVDD
Remove L501, L503,L 504,L508, L509.
To use optional power connection
06216-061
Figure 57. Evaluation Board Schematic, Power Supply Inputs
Rev. 0 | Page 33 of 40
AD9254

EVALUATION BOARD LAYOUT

Figure 58. Evaluation Board Layout, Primary Side
6216-062
Figure 59. Evaluation Board Layout, Secondary Side (Mirrored Image)
Rev. 0 | Page 34 of 40
6216-063
AD9254
Figure 60. Evaluation Board Layout, Ground Plane
6216-064
Figure 61. Evaluation Board Layout, Power Plane
Rev. 0 | Page 35 of 40
6216-065
AD9254
06216-066
Figure 62. Evaluation Board Layout, Silkscreen Primary Side
Figure 63. Evaluation Board Layout, Silkscreen Secondary Side (Mirrored Image)
Rev. 0 | Page 36 of 40
06216-067
AD9254

BILL OF MATERIALS

Table 16. Evaluation Board Bill of Materials (BOM)
Omit
Item Qty.
1 1 AD9246CE_REVA PCB PCB ADI 2
3 1 C501 Capacitor 0402 0.3 pF 4 2 C4, C5 Resistor 0402 0 Ω 5 10
6 1 C527 Capacitor 1206 10 F 7 1 C529 Capacitor 0402 20 pF 8 5 C548, C549, C550, C551, C552 Capacitor ACASE 10 F 9 1 C553 Capacitor 0805 1.0 F 10 15
24
12
(DNP)
Reference Designator Device Package Description Supplier/Part Number
C1, C2, C509, C510, C511, C512, C514, C515, C516, C517, C528, C530, C532, C533, C538, C539, C540, C542, C543, C544, C545, C546, C554, C555
C3, C500, C502, C503, C504, C505, C531, C534, C535, C536, C537, C557
C513, C518, C519, C520, C521, C522, C523, C524, C525, C526
C556, C558, C559, C564, C565, C566, C567, C568, C569, C570, C572, C573, C574, C575, C599
Capacitor 0402 0.1 F
Capacitor 0402 1.0 F
Capacitor 0603 0.1 F
11 1 CR500 LED 0603 green
1 D502 12
13 1 D503 Diode DO-214AB 3 A, 30 V, SMC
14 1 D504 Diode DO-214AA 2 A, 50 V, SMC
15 1 D505 LED LN1461C AMB Amber LED 16 1 F500 Fuse 1210
17 1 FER500 Choke 2020
18 1 J500 Jumper Solder jumper 19 3 J501, J502, J505 Jumper Solder jumper 20 1 J503 Connector 120 pin Male header 21 1 J504 Connector 10 pin Male, 2 × 5 Samtec 22 3 JP1, JP2, JP3 Jumper 3 pin Male, straight Samtec TSW-103-07-G-S 23 4 JP500, JP501, JP502, JP506 Jumper 2 pin Male, straight Samtec TSW-102-07-G-S
25 10
26 1 OSC500 Oscillator SMT
27 1 P500 Connector PJ-102A DC power jack Digikey CP-102A-ND
2 D500, D501
1 JP507 24 2 JP508, JP509
L500, L501, L502, L503, L504, L505, L506, L507, L508, L509
Diode SOT-23
Jumper
Ferrite Bead
3-pin jumper
3.2 mm ×
2.5 mm ×
1.6 mm
30 V, 20 mA, dual Schottky
6.0 V, 2.2 A trip current resettable fuse
Male, straight Samtec TSW-103-07-G-S
Digikey P9811CT-ND
125 MHz or 105 MHz
Panasonic LNJ314G8TRA
HSMS2812
Micro Commercial Components SK33­TPMSCT-ND
Micro Commercial Components S2A­TPMSTR-ND
Tyco, Raychem NANOSMDC110F-2
Murata DLW5BSN191SQ2
Samtec TSW-140-08-G-T-RA
CTS Reeves CB3LV-3C
Rev. 0 | Page 37 of 40
AD9254
Omit
Item Qty.
28 1 P501 Connector 10 pin Male, straight PTMICRO10 29 6 R1, R6, R563, R565, R574, R577 Resistor 0402 DNI
5 R2, R5, R561, R562, R571 30
6 R10, R11, R12, R535, R536, R575 31 2 R3, R4 Resistor 0402 25 Ω 32 6 R7, R8, R9, R502, R510, R511 Resistor 0603 DNI 33 6
34 4 R503, R548, R549, R550 Resistor 0603 10 kΩ
1 R504 35
1 R505 36
37 4 R545, R546, R547, R558 Resistor 0603 4.7 kΩ 38 3 R551, R552, R553 Resistor 0603 1 kΩ 39 1 R559 Resistor 0603 261 40 2 R566, R567 Resistor 0402 33 Ω 41 3 R582, R585, R598 Resistor 0402 100 Ω 42 2 R583, R584 Resistor 0402 240 Ω 43 1 R586 Resistor 0402 4.12 kΩ 44 3 R580, R587, R588 Resistor 0402 10 kΩ 45 1 R589 Resistor 0603 261 46 2 R590, R591 Resistor 0402 25 Ω 47 1 R592 Resistor 0402 DNI 48 2 R593, R596 Resistor 0402 0 Ω 49 2 R594, R595 Resistor 0402 10 kΩ 50 1 R597 Resistor 0402 4.3 kΩ 51 1 RP500 Resistor RCA74204 22 52 2 RP501, RP502 Resistor RCA74208 22 Ω 53 1 S1 Switch
55 2 S504, S505 Connector SMA200UP
58 1 U500 IC
59 1 U501 IC SOT-223
9
23
2 S500, S501 54
2 S502, S503
2 T500, T501 56
1 T1
1 T503 57
1 T502
(DNP) Reference Designator Device Package Description Supplier/Part Number
Resistor 0402 0
R500, R501, R576, R578, R579, R581
R506, R508, R509, R512, R554, R555, R556, R557, R560
R507, R513, R514, R515, R516, R517, R518, R519, R520, R521, R522, R523, R524, R525, R526, R527, R528, R529, R530, R531, R532, R533, R534,
Resistor 0402 DNI
Resistor 0603 49.9
Resistor 0603 0
Momentary (normally open)
Connector SMAEDGE
Transformer SM-22 M/A-Com ETC1-1-13
Transformer CD542 Mini-Circuits ADT1-1WT
32-pin LFCSP _VQ
SMA edge right angle
SMA RF 5-pin upright
Clock distribution
Voltage regulator
Panasonic EVQ-PLDA15
ADI AD9515BCPZ
ADI ADP3339AKCZ-5
Rev. 0 | Page 38 of 40
AD9254
Omit
Item Qty.
60 1 U502 IC SOT-223
61 1 U503 IC SOT-223
62 2 U504, U505 IC SOT-223
63 1 U506 IC 8-pin SOIC
64 1 U507 IC SC70 Dual buffer Fairchild NC7WZ16 65 1 U508 IC SC70 Dual buffer Fairchild NC7WZ07 66 1 U509 IC
67 1 U510
68 1 U511 (or Z500) IC
Total 128 107
(DNP) Reference Designator Device Package Description Supplier/Part Number
ADI ADP3339AKCZ-1.8
ADI ADP3339AKCZ-2.5
ADI ADP3339AKCZ-3.3
Microchip PIC12F629
Fairchild 74VCX162244
ADI AD8352ACPZ
DUT (AD9254)
48-pin TSSOP
48-pin LFCSP_VQ
16-pin LFCSP_VQ
Voltage regulator
Voltage regulator
Voltage regulator
8-bit microcontroller
Buffer/line driver
ADC ADI AD9254BCPZ
Differential amplifier
Rev. 0 | Page 39 of 40
AD9254
R

OUTLINE DIMENSIONS

0.30
0.23
0.18 PIN 1
48
INDICATO
1
BSC SQ
PIN 1 INDICATOR
7.00
0.60 MAX
37
36
0.60 MAX
1.00
0.85
0.80
12° MAX
SEATING PLANE
TOP
VIEW
0.80 MAX
0.65 TYP
0.50 BSC
COMPLIANT TO JEDEC STANDARDS MO-220-VKKD-2
6.75
BSC SQ
0.20 REF
0.50
0.40
0.30
0.05 MAX
0.02 NOM COPLANARITY
0.08
25
24
EXPOSED
PA D
(BOTTOM VIEW)
5.50 REF
13
4.25
4.10 SQ
3.95
12
0.25 MIN
Figure 64. 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
7 mm × 7 mm Body, Very Thin Quad (CP-48-3)
Dimensions shown in millimeters

ORDERING GUIDE

Model Temperature Range Package Description Package Option
AD9254BCPZ-150 AD9254BCPZRL7–150 AD9254-150EBZ
1
Z = Pb-free part.
2
It is required that the exposed paddle be soldered to the AGND plane to achieve the best electrical and thermal performance.
1, 2
1, 2
1
–40°C to +85°C 48-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-48-3 –40°C to +85°C 48-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-48-3 Evaluation Board
©2006 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D06216-0-10/06(0)
Rev. 0 | Page 40 of 40
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