Analog Devices AD9237 Service Manual

Page 1
12-Bit, 20 MSPS/40 MSPS/65 MSPS

FEATURES

Ultralow power
85 mW at 20 MSPS 135 mW at 40 MSPS
190 mW at 65 MSPS SNR = 66 dBc to Nyquist at 65 MSPS SFDR = 80 dBc to Nyquist at 65 MSPS DNL = ±0.7 LSB Differential input with 500 MHz bandwidth Flexible analog input: 1 V p-p to 4 V p-p range Offset binary, twos complement, or gray code data formats Output enable pin 2-step power-down Full power-down and sleep mode Clock duty cycle stabilizer

APPLICATIONS

Ultrasound and medical imaging Battery-powered instruments Hand-held scope meters Low cost digital oscilloscopes Low power digital still cameras and copiers Low power communications

GENERAL DESCRIPTION

The AD9237 is a family of monolithic, single 3 V supply, 12-bit, 20 MSPS/40 MSPS/65 MSPS analog-to-digital converters (ADC). This family features a high performance sample-and­hold amplifier (SHA) and voltage reference. The AD9237 uses a multistage differential pipelined architecture with output error correction logic to provide 12-bit accuracy at 20 MSPS/ 40 MSPS/65 MSPS data rates and guarantees no missing codes over the full operating temperature range.
With significant power savings over previously available ADCs, the AD9237 is suitable for applications in imaging and medical ultrasound.
Fabricated on an advanced CMOS process, the AD9237 is available in a 32-lead LFCSP and is specified over the industrial temperature range (−40°C to +85°C).
3 V Low Power A/D Converter
AD9237

FUNCTIONAL BLOCK DIAGRAM

AVDD
VIN+
VIN–
REFT
REFB
MODE2
VREF
SENSE
SHA
REF
SELECT
A/D
AGND
MDAC1
4 15
CORRECTION LOGIC
OUTPUT BUFFERS
AD9237
CLOCK
DUTY CYCLE
STABILIZER
0.5V
CLK PDWN MODE
Figure 1.

PRODUCT HIGHLIGHTS

1. Evaluation boards available for all speed grades.
2. Operating at 65 MSPS, the AD9237 consumes a low 190 mW
at 65 MSPS, 135 mW at 40 MSPS, and 85 mW at 20 MSPS.
3. Power scaling reduces the operating power further when
running at lower speeds.
4. The AD9237 operates from a single 3 V power supply and
features a separate digital output driver supply to accommodate 2.5 V and 3.3 V logic families.
5. The patented SHA input maintains excellent performance
for input frequencies beyond Nyquist and can be configured for single-ended or differential operation.
6. The AD9237 is optimized for selectable and flexible input
ranges from 1 V p-p to 4 V p-p.
7. An output enable pin allows for multiplexing of the outputs.
8. Two-step power-down supports a standby mode in addition
to a power-down mode.
9. The OTR output bit indicates when the signal is beyond the
selected input range.
10. The clock duty cycle stabilizer (DCS) maintains converter
performance over a wide range of clock pulse widths.
DRVDD
10-STAGE
1 1/2-BIT
PIPELINE
12
MODE
SELECT
A/D
3
OE OTR
D11
D0
DGND
05455-001
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 © 2005 Analog Devices, Inc. All rights reserved.
Page 2
AD9237

TABLE OF CONTENTS

Features .............................................................................................. 1
Te r mi n ol o g y .......................................................................................9
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Product Highlights........................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
DC Specifications ......................................................................... 3
Digital Specifications ................................................................... 4
AC Specifications.......................................................................... 4
Switching Specifications .............................................................. 5
Timing Diagram ............................................................................... 6
Absolute Maximum Ratings............................................................ 7
ESD Caution.................................................................................. 7
Pin Configuration and Function Descriptions............................. 8
Equivalent Circuits......................................................................... 10
Typical Perf or m an c e Charac t e r istics ........................................... 11
Applying the AD9237 .................................................................... 16
Theory of Operation .................................................................. 16
Analog Input and Reference Overview ................................... 16
Volt a ge R e fer e nce ....................................................................... 18
Clock Input Considerations...................................................... 19
Power Dissipation, Power Scaling, and Standby Mode......... 19
Digital Outputs........................................................................... 21
LFCSP Evaluation Board........................................................... 22
Outline Dimensions ....................................................................... 28
Ordering Guide .......................................................................... 28

REVISION HISTORY

10/05—Revision 0: Initial Version
Rev. 0 | Page 2 of 28
Page 3
AD9237

SPECIFICATIONS

DC SPECIFICATIONS

AVDD = 3 V, DRVDD = 2.5 V, maximum sample rate, 2 V p-p differential input, −0.5 dBFS input, 1.0 V internal reference, T unless otherwise noted.
Table 1.
AD9237BCP-20 AD9237BCP-40 AD9237BCP-65 Parameter Min Typ Max Min Typ Max Min Typ Max Unit
RESOLUTION 12 12 12 Bits ACCURACY
No Missing Codes Guaranteed 12 12 12 Bits Offset Error ±1.30 ±1.95 ±1.30 ±1.95 ±1.30 ±1.95 % FSR Gain Error Differential Nonlinearity (DNL) Integral Nonlinearity (INL)
1
2
2
±0.70 ±2.10 ±0.75 ±2.10 ±1.05 ±2.25 % FSR ±0.70 ±0.95 ±0.70 ±0.95 −1.00 ±0.70 +1.25 LSB ±0.90 ±1.35 ±0.90 ±1.35 ±0.90 ±2.00 LSB
TEMPERATURE DRIFT
Offset Error ±2 ±2 ±2 ppm/°C Gain Error
1
±12 ±12 ±12 ppm/°C
INTERNAL VOLTAGE REFERENCE
Output Voltage Error (1 V Mode) ±5 ±25 ±5 ±25 ±5 ±25 mV Load Regulation @ 1.0 mA 0.8 0.8 0.8 mV Output Voltage Error (0.5 V Mode) ±2.5 ±2.5 ±2.5 mV Load Regulation @ 0.5 mA 0.1 0.1 0.1 mV Reference Input Resistance 7 7 7 kΩ
INPUT REFERRED NOISE
VREF = 0.5 V 1.35 1.35 1.35 LSB rms VREF = 1.0 V 0.70 0.70 0.70 LSB rms
ANALOG INPUT
Input Span
VREF = 0.5 V; MODE2 = 0 V 1 1 1 V p-p VREF = 1.0 V; MODE2 = 0 V 2 2 2 V p-p VREF = 0.5 V; MODE2 = AVDD 2 2 2 V p-p VREF = 1.0 V; MODE2 = AVDD 4 4 4 V p-p
Input Capacitance
3
7 7 7 pF
POWER SUPPLIES
Supply Voltages
AVDD 2.7 3.0 3.6 2.7 3.0 3.6 2.7 3.0 3.6 V DRVDD 2.25 2.5 3.6 2.25 2.5 3.6 2.25 2.5 3.6 V
Supply Current
2
IAVDD IDRVDD
2
30.5 45.5 64.5 mA
3.0 4.5 5.5 mA
PSRR ±0.01 ±0.01 ±0.01 % FSR
POWER CONSUMPTION
DC Input Sine Wave Input
4
2
85 135 190 mW
100 120 150 180 210 270 mW Power-Down Mode 1 1 1 mW Standby Power 20 20 20 mW
1
Gain error and gain temperature coefficient are based on the ADC only (with a fixed 1.0 V external reference).
2
Measured at maximum clock rate, fIN = 2.4 MHz, full-scale sine wave, with approximately 5 pF loading on each output bit.
3
Input capacitance refers to the effective capacitance between one differential input pin and AGND. Refer to Figure 4 for the equivalent analog input structure.
4
Measured with dc input at maximum clock rate.
MIN
to T
MAX
,
Rev. 0 | Page 3 of 28
Page 4
AD9237

DIGITAL SPECIFICATIONS

Table 2.
AD9237BCP-20 AD9237BCP-40 AD9237BCP-65 Parameter Min Typ Max Min Typ Max Min Typ Max Unit
LOGIC INPUTS
High Level Input Voltage 2.0 2.0 2.0 V Low Level Input Voltage 0.8 0.8 0.8 V High Level Input Current –10 +10 –10 +10 –10 +10 μA Low Level Input Current –10 +10 –10 +10 –10 +10 μA
Input Capacitance 2 2 2 pF LOGIC OUTPUTS DRVDD = 3.3 V
High-Level Output Voltage (IOH = 50 μA) 3.29 3.29 3.29 V
High-Level Output Voltage (IOH = 0.5 mA) 3.25 3.25 3.25 V
Low-Level Output Voltage (IOL = 1.6 mA) 0.2 0.2 0.2 V
Low-Level Output Voltage (IOL = 50 μA) 0.05 0.05 0.05 V DRVDD = 2.5 V
High-Level Output Voltage (IOH = 50 μA) 2.49 2.49 2.49 V
High-Level Output Voltage (IOH = 0.5 mA) 2.45 2.45 2.45 V
Low-Level Output Voltage (IOL = 1.6 mA) 0.2 0.2 0.2 V
Low-Level Output Voltage (IOL = 50 μA) 0.05 0.05 0.05 V
1
Output voltage levels measured with 5 pF load on each output.
1

AC SPECIFICATIONS

AVDD = 3 V, DRVDD = 2.5 V, maximum sample rate, 2 V p-p differential input, AIN = –0.5 dBFS, 1.0 V internal reference, T unless otherwise noted.
Table 3.
AD9237BCP-20 AD9237BCP-40 AD9237BCP-65 Parameter Min Typ Max Min Typ Max Min Typ Max Unit
SIGNAL-TO-NOISE RATIO (SNR)
f
= 2.4 MHz 66.8 66.5 66.5 dBc
INPUT
f
= 9.7 MHz 65.6 66.6 dBc
INPUT
f
= 19.6 MHz 65.3 66.6 dBc
INPUT
f
= 34.2 MHz 64.0 66.1 dBc
INPUT
f
= 70 MHz 66.0 66.3 65.9 dBc
INPUT
SIGNAL-TO-NOISE RATIO AND DISTORTION (SINAD)
f
= 2.4 MHz 66.7 66.4 66.3 dBc
INPUT
f
= 9.7 MHz 65.1 66.5 dBc
INPUT
f
= 19.6 MHz 64.4 66.4 dBc
INPUT
f
= 34.2 MHz 63.5 65.8 dBc
INPUT
f
= 70 MHz 65.6 65.8 65.2 dBc
INPUT
EFFECTIVE NUMBER OF BITS (ENOB)
f
= 9.7 MHz 10.8 Bits
INPUT
f
= 19.6 MHz 10.7 Bits
INPUT
f
= 34.2 MHz 10.6 Bits
INPUT
MIN
to T
MAX
,
Rev. 0 | Page 4 of 28
Page 5
AD9237
AD9237BCP-20 AD9237BCP-40 AD9237BCP-65 Parameter Min Typ Max Min Typ Max Min Typ Max Unit
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
f
= 2.4 MHz 88.0 83.5 85.5 dBc
INPUT
f
= 9.7 MHz 72.4 87.5 dBc
INPUT
f
= 19.6 MHz 72.2 82.4 dBc
INPUT
f
= 34.2 MHz 69.4 80.1 dBc
INPUT
f
= 70 MHz 80.5 77.9 74.9 dBc
INPUT
WORST HARMONIC (SECOND OR THIRD)
f
= 2.4 MHz −88.0 −83.5 −85.5 dBc
INPUT
f
= 9.7 MHz −72.4 −87.5 dBc
INPUT
f
= 19.6 MHz −72.2 −82.4 dBc
INPUT
f
= 34.2 MHz −69.4 −80.1 dBc
INPUT
f
= 70 MHz −80.5 −77.9 −74.9 dBc
INPUT
WORST OTHER SPUR
f
= 2.4 MHz −90 −90 −90 dBc
INPUT
f
= 9.7 MHz −73.4 −90 dBc
INPUT
f
= 19.6 MHz −73.1 −90 dBc
INPUT
f
= 34.2 MHz −72.0 −90 dBc
INPUT
f
= 70 MHz −90 −90 −90 dBc
INPUT

SWITCHING SPECIFICATIONS

Table 4.
AD9237BCP-20 AD9237BCP-40 AD9237BCP-65 Parameter Min Typ Max Min Typ Max Min Typ Max Unit
CLK INPUT PARAMETERS
Maximum Conversion Rate 20 40 65 MSPS Minimum Conversion Rate 1 1 1 MSPS CLK Period 50.0 25.0 15.4 ns CLK Pulse Width High CLK Pulse Width Low
DATA OUTPUT PARAMETERS
Output Delay (tPD) Pipeline Delay (Latency) 8 8 8 Cycles Output Enable Time 6 6 6 ns Output Disable Time 3 3 3 ns Aperture Delay (tA) 1.0 1.0 1.0 ns Aperture Uncertainty (Jitter, tJ) 0.5 0.5 0.5 ps rms Wake-Up Time (Sleep Mode) Wake-Up Time (Standby Mode)3 3.0 3.0 3.0 μs
OUT-OF-RANGE RECOVERY TIME 1 1 2 Cycles
1
With duty cycle stabilizer enabled.
2
Output delay is measured from CLK 50% transition to DATA 50% transition, with 5 pF load on each output.
3
Wake-up time is dependent on value of decoupling capacitors; typical values shown with 0.1 μF and 10 μF capacitors on REFT and REFB.
1
1
2
3
15.0 8.8 6.2 ns
15.0 8.8 6.2 ns
3.5 3.5 3.5 ns
3.0 3.0 3.0 ms
Rev. 0 | Page 5 of 28
Page 6
AD9237

TIMING DIAGRAM

N+1
ANALOG
INPUT
CLK
N
N–1
N+2
t
A
N+3
N+4
N+7
N+5 N+6
N+8
DATA
OUT
N–9 N–8 N–7 N–6 N–5 N–4 N–3 N–2 N–1 N
N–10
t
PD
05455-002
Figure 2. Timing Diagram
Rev. 0 | Page 6 of 28
Page 7
AD9237

ABSOLUTE MAXIMUM RATINGS

Table 5.
With
Pin Name
ELECTRICAL
AVDD AGND –0.3 +3.9 V DRVDD DGND –0.3 +3.9 V AGND DGND –0.3 +0.3 V AVDD DRVDD –3.9 +3.9 V Digital
Outputs, OE
CLK, MODE,
MODE2 VIN+, VIN– AGND –0.3 AVDD + 0.3 V VREF AGND –0.3 AVDD + 0.3 V SENSE AGND –0.3 AVDD + 0.3 V REFB, REFT AGND –0.3 AVDD + 0.3 V PDWN AGND –0.3 AVDD + 0.3 V
ENVIRONMENTAL
Operating Temperature –40 +85 °C Junction Temperature 150 °C Lead Temperature (10 sec) 300 °C Storage Temperature –65 +150 °C
1
Typical thermal impedances (32-lead LFCSP), θJA = 32.5°C/W, θJC = 32.71°C/W.
These measurements were taken on a 4-layer board in still air, in accordance with EIA/JESD51-1.
Respect to
DGND –0.3 DRVDD + 0.3 V
AGND −0.3 AVDD + 0.3 V
1
Min Max Unit
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Absolute maximum ratings are limiting values to be applied individually and beyond which the serviceability of the circuit may be impaired. Functional operability is not necessarily implied. Exposure to absolute maximum rating conditions for an extended period may affect device reliability.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Rev. 0 | Page 7 of 28
Page 8
AD9237

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

AGND
AVDD
REFT
AVDD
AGND
VIN–
31
30
32
REFB
VIN+
28
27
26
25
29
14 D7
15
16
DGND
DRVDD
24 VREF 23 SENSE 22 MODE 21 OTR 20 D11 (MSB) 19 D10 18 D9 17 D8
05455-003
1MODE2
PIN 1
2CLK
INDICATOR
3OE
AD9237
4PDWN 5GC
TOP VIEW
(Not to Scale)
6DNC 7D0 (LSB) 8D1
9
11
10
D2
D3
D4
DNC = DO NOT CONNECT
12
13
D5
D6
Figure 3. Pin Configuration
Table 6. Pin Function Descriptions
Pin Number Mnemonic Description
1 MODE2 SHA Gain Select and Power Scaling Control (see Table 8). 2 CLK Clock Input Pin. 3 OE Output Enable Pin (Active Low). 4 PDWN Power-Down Function Selection (see Table 9 ). 5 GC Gray Code Control (Active High). 6 DNC Do Not Connect. 7 to 14, 17 to 20 D0 (LSB) to D11 (MSB) Data Output Bits. 15 DGND Digital Output Ground. 16 DRVDD
Digital Output Driver Supply. Must be decoupled to DGND with a minimum 0.1 μF capacitor.
Recommended decoupling is 0.1 μF in parallel with 10 μF. 21 OTR Out-of-Range Indicator. 22 MODE Data Format and Clock Duty Cycle Stabilizer (DCS) Mode Selection (see Table 10 ). 23 SENSE Reference Mode Selection (see Table 7 ). 24 VREF Voltage Reference Input/Output (see Table 7). 25 REFB Differential Reference (−). Must be decoupled to REFT with a minimum 10 μF capacitor. 26 REFT Differential Reference (+). 27, 32 AVDD
Analog Power Supply. Must be decoupled to AGND with a minimum 0.1 μF capacitor.
Recommended decoupling is 0.1 μF in parallel with 10 μF. 28, 31 AGND Analog Ground. 29 VIN+ Analog Input Pin (+). 30 VIN− Analog Input Pin (−).
Rev. 0 | Page 8 of 28
Page 9
AD9237

TERMINOLOGY

Analog Bandwidth (Full Power Bandwidth)
The analog input frequency at which the spectral power of the fundamental frequency (as determined by the FFT analysis) is reduced by 3 dB.
Signal-To-Noise and Distortion (SINAD)
The ratio of the rms signal amplitude to the rms value of the sum of all other spectral components below the Nyquist frequency, including harmonics but excluding dc.
1
Aperture Delay (t
)
A
The delay between the 50% point of the rising edge of the clock and the instant at which the analog input is sampled.
Aperture Jitter (t
)
J
The sample-to-sample variation in aperture delay.
Integral Nonlinearity (INL)
The deviation of each individual code from a line drawn from negative full scale through positive full scale. The point used as negative full scale occurs ½ LSB before the first code transition. Positive full scale is defined as a level 1½ LSBs beyond the last code transition. The deviation is measured from the middle of each particular code to the true straight line.
Differential Nonlinearity (DNL, No Missing Codes)
An ideal ADC exhibits code transitions that are exactly 1 LSB apart. DNL is the deviation from this ideal value. Guaranteed no missing codes to 12-bit resolution indicates that all 4096 codes must be present over all operating ranges.
Offset Error
The major carry transition should occur for an analog value ½ LSB below VIN+ = VIN–. Offset error is defined as the deviation of the actual transition from that point.
Gain Error
The first code transition should occur at an analog value ½ LSB above negative full scale. The last transition should occur at an analog value 1½ LSB below the positive full scale. Gain error is the deviation of the actual difference between first and last code transitions and the ideal difference between first and last code transitions.
Tem p er at u re Dr i ft
The temperature drift for offset error and gain error specifies the maximum change from the initial (25°C) value to the value at T
MIN
or T
MAX
.
Power Supply Rejection Ratio
The change in full scale from the value with the supply at the minimum limit to the value with the supply at its maximum limit.
Total Harmonic Distortion (THD)
1
The ratio of the rms sum of the first six harmonic components to the rms value of the measured input signal.
Effective Number of Bits (ENOB)
The effective number of bits for a device for sine wave inputs at a given input frequency can be calculated directly from its measured SINAD using the following formula:
ENOB = (SINAD
Signal-to-Noise Ratio (SNR)
− 1.76)/6.02
dBFS
1
The ratio of the rms signal to the rms value of the sum of all other spectral components below the Nyquist frequency, excluding the first six harmonics and dc.
Spurious-Free Dynamic Range (SFDR)
1
SFDR is the difference in dB between the rms amplitude of the input signal and the rms value of the peak spurious signal. The peak spurious signal may not be an harmonic.
Two -Tone SFDR
1
The ratio of the rms value of either input tone to the rms value of the peak spurious component. The peak spurious component may or may not be an IMD product.
Clock Pulse Width and Duty Cycle
Pulse width high is the minimum amount of time that the clock pulse should be left in the Logic 1 state to achieve rated performance. Pulse width low is the minimum time the clock pulse should be left in the low state. At a given clock rate, these specifications define an acceptable clock duty cycle.
Minimum Conversion Rate
The clock rate at which the SNR of the lowest analog signal frequency drops by no more than 3 dB below the guaranteed limit.
Maximum Conversion Rate
The clock rate at which parametric testing is performed.
Output Propagation Delay (t
)
PD
The delay between the clock logic threshold and the time when all bits are within valid logic levels.
Out-of-Range Recovery Time
The time it takes the ADC to reacquire the analog input after a transition from 10% above positive full scale to 10% above negative full scale, or from 10% below negative full scale to 10% below positive full scale.
1
AC specifications may be reported in dBc (degrades as signal levels are
lowered) or in dBFS (always related back to converter full scale).
Rev. 0 | Page 9 of 28
Page 10
AD9237
V

EQUIVALENT CIRCUITS

AVDD
IN+, VIN–
05455-004
Figure 4. Equivalent Analog Input Circuit
MODE,
MODE2,
GC, OE
375Ω
70kΩ
05455-005
Figure 5. Equivalent MODE, MODE2, GC, OE Input Circuit
DRVDD
D11–D0, OTR
Figure 6. Equivalent Digital Output Circuit
CLK,
PDWN
375Ω
Figure 7. Equivalent CLK, PDWN Input Circuit
05455-006
05455-007
Rev. 0 | Page 10 of 28
Page 11
AD9237

TYPICAL PERFORMANCE CHARACTERISTICS

AVDD = 3.0 V, DRVDD = 2.5 V, maximum sample rate with DCS disabled, TA = 25°C, 2 V p-p differential input, AIN = –0.5 dBFS, VREF = 1.0 V internal, FFT length 16 K, unless otherwise noted.
0
–20
SNR = 66.9dBc SFDR = 87.0dBc
90
85
SFDR
–40
–60
–80
AMPLITUDE (dBFS)
–100
–120
01
FREQUENCY (MHz)
6842
05455-008
0
Figure 8. AD9237-20 10 MHz FFT
0
SNR = 66.8dBc SFDR = 83.1dBc
–20
–40
–60
–80
AMPLITUDE (dBFS)
–100
–120
02
FREQUENCY (MHz)
12 16841810 1462
05455-009
0
Figure 9. AD9237-40 20 MHz FFT
0
–20
–40
SNR = 66.0dBc SFDR = 78.6dBc
80
75
SNR/SFDR (dBc)
70
65
60
10.0 20.017.515.012.5
Figure 11. AD9237-20 SNR/SFDR vs. Clock Frequency with f
90
85
80
75
SNR/SFDR (dBc)
70
65
20 40353025
Figure 12. AD9237-40 SNR/SFDR vs. Clock Frequency with f
90
85
80
SNR
CLOCK FREQUENCY (MSPS)
SFDR
SNR
CLOCK FREQUENCY (MSPS)
SFDR
= 10 MHz
IN
= 20 MHz
IN
05455-011
05455-012
AMPLITUDE (dBFS)
–60
–80
–100
–120
0 30 32.5252015105
FREQUENCY (MHz)
Figure 10. AD9237-65 70 MHz FFT
05455-010
Rev. 0 | Page 11 of 28
75
SNR/SFDR (dBc)
70
SNR
65
60
40 6555 605045
CLOCK FREQUENCY (MSPS)
Figure 13. AD9237-65 SNR/SFDR vs. Clock Frequency with f
= 35 MHz
IN
05455-013
Page 12
AD9237
0
–20
–40
SNR = 65.6dBc SFDR = 67.1dBc
90
85
80
75
SFDR DCS ENABLED
SFDR DCS DISABLED
–60
–80
AMPLITUDE (dBc)
–100
–120
0 30 32.5252015105
FREQUENCY (MHz)
Figure 14. AD9237-65 100 MHz FFT
90
80
70
60
50
SNR/SFDR (dBc and dBFS)
40
30
–30 0–5–10–15–20–25
SFDR dBFS 2V p-p
SNR dBFS 2V p-p SNR dBFS 4V p-p
SFDR dBc 2V p-p
SFDR dBFS 4V p-p
SFDR dBc 4V p-p
SNR dBc 2V p-p SNR dBc 4V p-p
INPUT AMPLITUDE (dBFS)
Figure 15. AD9237-65 SNR/SFDR vs. Input Amplitude with f
100
SFDR dBFS 2V p-p
90
= 35 MHz
IN
05455-014
05455-017
SNR/SFDR (dBc)
70
65
60
55
50
30 7065605550454035
DUTY CYCLE (%)
SNR DCS ENABLED
SNR DCS DISABLED
Figure 17. SNR/SFDR vs. Clock Duty Cycle
90
80
70
60
50
SNR/SFDR (dBc and dBFS)
40
30
–30 0–5–10–15–20–25
SFDR dBFS 2V p-p
SFDR dBFS 1V p-p SNR dBFS 2V p-p
SNR dBFS 1V p-p
SNR dBc 2V p-p
SFDR dBc 2V p-p
SFDR dBc 1V p-p
SNR dBc 1V p-p
INPUT AMPLITUDE (dBFS)
Figure 18. AD9237-65 SNR/SFDR vs. Input Amplitude with f
100
SFDR dBFS 2V p-p
90
= 35 MHz
IN
05455-030
05455-018
80
SFDR dBFS 1V p-p
70
60
50
SNR/SFDR (dBc and dBFS)
40
30
–30 0–5–10–15–20–25
SNR dBFS 1V p-p
SFDR dBc 2V p-p
SFDR dBc 1V p-p
SNR dBFS 2V p-p
SNR dBc 2V p-p
SNR dBc 1V p-p
INPUT AMPLITUDE (dBFS)
Figure 16. AD9237-40 SNR/SFDR vs. Input Amplitude with f
= 20 MHz
IN
Rev. 0 | Page 12 of 28
05455-019
80
SFDR dBFS 1V p-p
70
60
50
SNR/SFDR (dBc and dBFS)
40
30
–30 0–5–10–15–20–25
SFDR dBc 2V p-p
SNR dBFS 1V p-p
SNR dBFS 2V p-p
SNR dBc 2V p-p
SNR dBc 1V p-p
INPUT AMPLITUDE (dBFS)
SFDR dBc 1V p-p
Figure 19. AD9237-20 SNR/SFDR vs. Input Amplitude with f
= 10 MHz
IN
05455-020
Page 13
AD9237
0
SNR = 67.0dBFS SFDR = 87.8dBFS
–20
–40
–60
–80
AMPLITUDE (dBc)
–100
–120
0 30 32.5252015105
FREQUENCY (MHz)
Figure 20. AD9237-65 Two-Tone FFT, f
= 45 MHz, f
IN1
= 46 MHz
IN2
05455-095
0
–20
–40
–60
–80
AMPLITUDE (dBc)
–100
–120
02
FREQUENCY (MHz)
SNR = 67.2dBFS SFDR = 88.3dBFS
015105
05455-021
Figure 21. AD9237-40 Two-Tone FFT
= 45 MHz, f
f
IN1
0
–20
–40
–60
–80
AMPLITUDE (dBFS)
–100
–120
03
Figure 22. AD9237-65 Two-Tone FFT, f
= 46 MHz
IN2
FREQUENCY (MHz)
= 69 MHz, f
IN1
SNR = 66.9dBFS SFDR = 84.1dBFS
252015105
0
= 70 MHz
IN2
05455-094
100
90
SFDR dBFS
80
SNR dBFS
70
60
SFDR dBc
50
SNR/SFDR (dBc and dBFS)
40
SNR dBc
30
–30 –10 –6.5–15–20–25
INPUT AMPLITUDE (AIN)
Figure 23. AD9237-65 Two-Tone SNR/SFDR , vs. Analog Input with
100
90
80
70
60
50
SNR/SFDR (dBc and dBFS)
40
30
–30 –10 –6.5–15–20–25
SFDR dBFS
SNR dBFS
SFDR dBc
SNR dBc
= 45 MHz, f
f
IN1
INPUT AMPLITUDE (AIN)
= 46 MHz
IN2
Figure 24. AD9237-40 Two-Tone SNR/SFDR , vs. Analog Input with
= 45 MHz, f
f
IN1
100
90
SFDR dBFS
80
SNR dBFS
70
60
SFDR dBc
50
SNR/SFDR (dBc and dBFS)
40
SNR dBc
30
–30 –10 –6.5–15–20–25
INPUT AMPLITUDE (AIN)
= 46 MHz
IN2
Figure 25. AD9237-65 Two-Tone SNR/SFDR vs. Analog Input with
= 69 MHz, f
f
IN1
= 70 MHz
IN2
05455-024
05455-025
05455-098
Rev. 0 | Page 13 of 28
Page 14
AD9237
0
–20
–40
–60
–80
AMPLITUDE (dBc)
–100
–120
02
FREQUENCY (MHz)
SNR = 67.1dBFS SFDR = 87.3dBFS
15105
05455-026
0
Figure 26. AD9237-40 Two-Tone FFT
= 69 MHz, f
f
IN1
90
= 70 MHz
IN2
100
90
SFDR dBFS
80
SNR dBFS
70
60
SFDR dBc
50
SNR/SFDR (dBc and dBFS)
40
SNR dBc
30
–30 –10 –6.5–15–20–25
INPUT AMPLITUDE (AIN)
Figure 29. AD9237-40 Two-Tone SNR/SFDR vs. Analog Input with
= 69 MHz, f
f
IN1
90
= 70 MHz
IN2
05455-097
85
SFDR
80
75
70
SNR/SFDR (dBc)
SNR
65
60
55
0 125100755025
INPUT FREQUENCY (MHz)
Figure 27. AD9237-65 SNR/SFDR vs. Input Frequency
1.00
0.75
0.50
0.25
0
INL (LSB)
–0.25
–0.50
05455-015
SNR/SFDR (dBc)
85
80
75
70
65
60
55
0 125100755025
SFDR
SNR
INPUT FREQUENCY (MHz)
Figure 30. AD9237-40 SNR/SFDR vs. Input Frequency
1.00
0.75
0.50
0.25
0
DNL (LSB)
–0.25
–0.50
05455-016
–0.75
–1.00
0 4096358430722560204815361024512
CODE
Figure 28. Typical INL
05455-032
Rev. 0 | Page 14 of 28
–0.75
–1.00
0 4096358430722560204815361024512
CODE
Figure 31. Typical DNL
05455-035
Page 15
AD9237
67.5
90
67.0
AD9237-20
AD9237-40
66.5
66.0
SINAD (dBc)
65.5
65.0 10 20 7060504030
CLOCK FREQUENCY (MSPS)
AD9237-65
Figure 32. AD9237 SINAD/ENOB vs. Clock Frequency with f
10.83
10.75
10.67
10.59
10.50
= Nyquist
IN
ENOB (Bits)
05455-062
85
80
75
SNR/SFDR (dBc)
70
65
60
–40 –20 85806040200
SNR
SFDR
TEMPERATURE (°C)
Figure 33. AD9237-65 SNR/SFDR vs. Temperature with f
= 32.5MHz
IN
05455-063
Rev. 0 | Page 15 of 28
Page 16
AD9237
V
V

APPLYING THE AD9237

THEORY OF OPERATION

The AD9237 uses a calibrated, 11-stage pipeline architecture with a patented input SHA implemented. Each stage of the pipeline, excluding the last, consists of a low resolution flash ADC connected to a switched capacitor digital-to-analog converter (DAC) and an interstage residue amplifier (MDAC). The MDAC magnifies the difference between the reconstructed DAC output and the flash input for the next stage in the pipeline. One bit of redundancy is used in each stage to facilitate digital correction of flash errors. The last stage consists of a flash ADC.
The pipelined architecture permits the first stage to operate on a new input sample, while the remaining stages operate on preceding samples. While the converter captures a new input sample every clock cycle, it takes eight clock cycles for the conversion to be fully processed and to appear at the output, as shown in
The input stage contains a differential SHA that can be ac- or dc-coupled in differential or single-ended modes. The output­staging block aligns the data, carries out the error correction, and passes the data to the output buffers. The output buffers are powered from a separate supply, allowing adjustment of the output voltage swing. During power-down and stand-by operation, the output buffers go into a high impedance state.
Figure 2.
In addition, a small shunt capacitor placed across the inputs provides dynamic charging currents. This passive network creates a low-pass filter at the ADC’s input; therefore, the precise values are dependant on the application. In IF under­sampling applications, the shunt capacitor(s) should be reduced or removed depending on the input frequency. In combination with the driving source impedance, the capacitors limit the input bandwidth.
90
80
70
60
SNR/SFDR (dBc)
50
40
30
0 3.02.52.01.51.00.5
Figure 34. AD9237-65 SNR/SFDR vs. Input Common-Mode Level
2.5MHz SFDR
34.2MHz SFDR
2.5MHz SNR
34.2MHz SNR
INPUT COMMON-MODE LEVEL (V)
H
05455-038
The ADC samples the analog input on the rising edge of the clock. System disturbances just prior to, or immediately following, the rising edge of the clock and/or excessive clock jitter can cause the SHA to acquire the wrong input value and should be minimized.

ANALOG INPUT AND REFERENCE OVERVIEW

The analog input to the AD9237 is a differential switched capacitor SHA that has been designed for optimum performance while processing a differential input signal. The SHA input can support a wide common-mode range and maintain excellent performance, as shown in An input common-mode voltage of midsupply minimizes signal-dependant errors and provides optimum performance.
Figure 35 shows the clock signal alternately switching the SHA between sample mode and hold mode. When the SHA is switched into sample mode, the signal source must be capable of charging the sample capacitors and settling within one-half of a clock cycle. A small resistor in series with each input can help reduce the peak transient current required from the output stage of the driving source.
Figure 34.
IN+
IN–
T
5pF
C
PAR
T
5pF
C
PAR
Figure 35. Switched-Capacitor SHA Input
T
T
H
05455-039
For best dynamic performance, the source impedances driving VIN+ and VIN– should be matched so that common-mode settling errors are symmetrical. These errors are reduced by the common-mode rejection of the ADC.
An internal differential reference buffer creates positive and negative reference voltages, REFT and REFB, that define the span of the ADC core.
Rev. 0 | Page 16 of 28
Page 17
AD9237
2
2
The output common mode of the reference buffer is set to mid­supply, and the REFT and REFB voltages and input span are defined as:
REFT = ½(AVDD + VREF)
REFB = ½(AVDDVREF)
Span
()
4 ×
=
REFBREFT
×
FactorSpan
_
=
4
VREF
FactorSpan
_
25Ω
+
AD8351
V p-p
25Ω
0.1μF
49.9Ω
0.1μF
Figure 36. Differential Input Configuration Using the AD8351
1.2kΩ
1kΩ
1kΩ
0.1μF
0.1μF
33Ω
33Ω
15pF
AVDD
VIN+
AD9237
VIN–
AGND
05455-041
The previous equations show that the REFT and REFB voltages are symmetrical about the midsupply voltage, and the input span is proportional to the value of the VREF voltage, see
Table 7
for more details.
The internal voltage reference can be pin strapped to fixed values of 0.5 V or 1.0 V, or adjusted within this range as discussed in the
Internal Reference Connection section. Maximum SNR performance is achieved with the AD9237 set to an input span of 2 V p-p or greater. The relative SNR degradation is 3 dB when changing from 2 V p-p mode to 1 V p-p mode.
The SHA must be driven from a source that keeps the signal peaks within the allowable range for the selected reference voltage. The minimum and maximum common-mode input levels are defined as:
VCM
VCM
= VREF/2
MIN
= (AVDD + VREF)/2
MAX
The minimum common-mode input level allows the AD9237 to accommodate ground-referenced inputs.
Although optimum performance is achieved with a differential input, a single-ended source can be driven into VIN+ or VIN–. In this configuration, one input accepts the signal while the opposite input should be set to midscale by connecting it to an appropriate reference. For example, a 2 V p-p signal can be applied to VIN+ while a 1 V reference is applied to VIN–. The AD9237 then accepts an input signal varying between 2 V and 0 V. In the single-ended configuration, distortion performance may degrade significantly as compared to the differential case. However, the effect is less noticeable at lower input frequencies and in the lower speed grade models (AD9237-40 and AD9237-20).

Differential Input Configurations

As previously detailed, optimum performance is achieved while driving the AD9237 in a differential input configuration. For baseband applications, the AD8351 differential driver provides excellent performance and a flexible interface to the ADC. The output common-mode voltage of the AD8351 is easily set to AVDD/2, and the driver can be configured in a Sallen-Key filter topology to provide band limiting of the input signal.
Figure 36
details a typical configuration using the AD8351.
At input frequencies in the second Nyquist zone and above, the performance of most amplifiers is not adequate to achieve the true performance of the AD9237. This is especially true in IF undersampling applications where frequencies in the 70 MHz to 100 MHz range are being sampled. For these applications, differential transformer coupling is the recommended input configuration, as shown in
2V p-p
Figure 37. Differential Transformer-Coupled Configuration
49.9Ω
Figure 37.
0.1μF
1kΩ
1kΩ
33Ω
33Ω
15pF
AVDD
VIN+
AD9237
VIN–
AGND
05455-042
The signal characteristics must be considered when selecting a transformer. Most RF transformers saturate at frequencies below a few MHz, and excessive signal power can cause core saturation, which leads to distortion.

Single-Ended Input Configuration

A single-ended input can provide adequate performance in cost-sensitive applications. In this configuration, there is degradation in SFDR and distortion performance due to the large input common-mode swing. However, if the source impedances on each input are matched, there should be little effect on SNR performance.
Figure 38 details a typical single-
ended input configuration.
1k
Ω
33
1k
Ω
1k
Ω
33
1k
Ω
Ω
V p-p
49.9
0.1μF
Ω
0.1μF 25
Figure 38. Single-Ended Input Configuration
Ω
15pF
Ω
AVDD
VIN+
AD9237
VIN–
AGND
05455-099
Rev. 0 | Page 17 of 28
Page 18
AD9237
×
×
Table 7. Reference Configuration Summary
Selected Mode SENSE Voltage Resulting VREF (V) Span Factor Resulting Differential Span (V p-p)
External Reference AVDD N/A 2
4
1 Internal Fixed Reference VREF 0.5 2 1.0 V 1 4.0 V Programmable Reference 0.2 V to VREF
0.5 × (1 + R2/R1) Figure 40)
(See
2
4
1 Internal Fixed Reference AGND to 0.2 V 1.0 2 2.0 V 1 1.0 V
VREF
FactorSpan
_
ReferenceExternal
FactorSpan
_

VOLTAGE REFERENCE

A stable and accurate 0.5 V voltage reference is built into the AD9237. The input range can be adjusted by varying the reference voltage applied to the AD9237, using either the internal reference or an externally applied reference voltage. The input span of the ADC tracks reference voltage changes linearly.
In all reference configurations, REFT and REFB drive the A/D conversion core and, in conjunction with the span factor, establish its input span. The input range of the ADC always equals four times the voltage at the reference pin divided by the span factor for either an internal or an external reference. It is required to decouple REFT to REFB with 0.1 μF and 10 μF decoupling capacitors, as shown in

Internal Reference Connection

A comparator within the AD9237 detects the potential at the SENSE pin and configures the reference into one of four possible states, which are summarized in grounded, the reference amplifier switch is connected to the internal resistor divider, setting VREF to 1 V (see Connecting the SENSE pin to VREF switches the reference amplifier output to the SENSE pin, completing the loop and providing a 0.5 V reference output. If a resistor divider is connected, as shown in
Figure 40, then the switch is again set to the SENSE pin. This puts the reference amplifier in a non­inverting mode with the VREF output defined as
2
R
+×=
150
.VREF
1
R
Figure 39.
Tabl e 7. If SENSE is
Figure 39).
10μF
10μF
VIN+
VIN–
ADC
CORE
VREF
+
0.1μF
SENSE
Figure 39. Internal Reference Configuration
VIN+ VIN–
VREF
+
0.1μF R2
SENSE
R1
Figure 40. Programmable Reference Configuration
SELECT
LOGIC
SELECT
LOGIC
AD9237
AD9237
0.5V
ADC
CORE
0.5V
REFT
REFB
REFT
REFB
0.1μF
0.1μF
0.1μF
0.1μF
0.1μF
0.1μF
+
10μF
+
10μF
05455-043
05455-044
Rev. 0 | Page 18 of 28
Page 19
AD9237
×
=

External Reference Operation

The use of an external reference may be necessary to enhance the gain accuracy of the ADC or to improve thermal drift characteristics.
Figure 41 shows the typical drift characteristics of the internal reference in both 1 V and 0.5 V modes. When multiple ADCs track one another, a single reference (internal or external) reduces gain matching errors.
When the SENSE pin is connected to AVDD, the internal reference is disabled, allowing the use of an external reference. An internal reference buffer loads the external reference with an equivalent 7 kΩ load. The internal buffer still generates the positive and negative full-scale references, REFT and REFB, for the ADC core. The input span is always four times the value of the reference voltage divided by the span factor; therefore, the external reference must be limited to a maximum of 1 V.
0.7
0.6
0.5
0.4
0.3
VREF ERROR (%)
0.2
0.1
0
–40 –20 85806040200
1V REFERENCE
0.5V REFERENCE
TEMPERATURE (°C)
Figure 41. Typical VREF Drift
05455-046
If the internal reference of the AD9237 is used to drive multiple converters to improve gain matching, the loading of the refer­ence by the other converters must be considered.
Figure 42 shows how the internal reference voltage is affected by loading. A 2 mA load is the maximum recommended load.
0.05

CLOCK INPUT CONSIDERATIONS

Typical high speed ADCs use both clock edges to generate a variety of internal timing signals and, as a result, can be sensitive to clock duty cycle. Commonly a 5% tolerance is required on the clock duty cycle to maintain dynamic performance characteristics. The AD9237 contains a clock duty cycle stabilizer (DCS) that retimes the nonsampling, or falling edge, providing an internal clock signal with a nominal 50% duty cycle. This allows a wide range of clock input duty cycles without affecting the performance of the AD9237. As shown in nearly flat over a 30% range of duty cycle with the DCS enabled.
The duty cycle stabilizer uses a delay-locked loop (DLL) to create the nonsampling edge. As a result, any changes to the sampling frequency require approximately 100 clock cycles to allow the DLL to acquire and lock to the new rate.
High speed, high resolution ADCs are sensitive to the quality of the clock input. The degradation in SNR at a given full-scale input frequency (f be calculated by
In this equation, the rms aperture jitter represents the root­sum-square of all jitter sources, which include the clock input, analog input signal, and ADC aperture jitter specification. Undersampling applications are particularly sensitive to jitter.
The clock input should be treated as an analog signal in cases where aperture jitter can affect the dynamic range of the AD9237. Power supplies for clock drivers should be separated from the ADC output driver supplies to avoid modulating the clock signal with digital noise. Low jitter, crystal-controlled oscillators make the best clock sources. If the clock is generated from another type of source (such as gating, dividing, or other methods), then it should be retimed by the original clock at the last step.
Figure 17, noise and distortion performance are
) due only to rms aperture jitter (tJ) can
INPUT
20
lognDegradatioSNR
10
π
2
=
1
INPUT
⎤ ⎥
tf
J
0
The lowest typical conversion rate of the AD9237 is 1 MSPS. At clock rates below 1 MSPS, dynamic performance may degrade.
–0.05
–0.10
ERROR (%)
–0.15
1V ERROR (%)
0.5V ERROR (%)

POWER DISSIPATION, POWER SCALING, AND STANDBY MODE

As shown in Figure 43, the power dissipated by the AD9237 is proportional to its sample rate. The digital power dissipation does not vary substantially between the three speed grades
–0.20
because it is determined primarily by the strength of the digital drivers and the load on each output bit. The maximum DRVDD
–0.25
0 3.02.52.01.51.00.5
Figure 42. VREF Accuracy vs. Load
LOAD (mA)
05455-093
current can be calculated as
DRVDDDRVDD
NfCVI
××
CLKLOAD
where N is 12, the number of output bits.
Rev. 0 | Page 19 of 28
Page 20
AD9237
This maximum current occurs when every output bit switches on every clock cycle, that is, a full-scale square wave at the Nyquist frequency, f
/2. In practice, the DRVDD current is
CLK
established by the average number of output bits switching, which is determined by the encode rate and the characteristics of the analog input signal.
190
170
150
130
AD9237-65
POWER (mW)
110
AD9237-40
90
AD9237-20
70
10 60 6550403020
Figure 43. Total Power vs. Sample Rate with f
SAMPLE RATE (MSPS)
= 10 MHz
IN
05455-047
For the AD9237-20 speed grade, the digital power consumption can represent as much as 10% of the total dissipation. Digital power consumption can be minimized by reducing the capacitive load presented to the output drivers. The data in Figure 43 was taken with a 5 pF load on each output driver.
The AD9237 is designed to provide excellent performance with minimum power. The analog circuitry is optimally biased so that each speed grade provides excellent performance while affording reduced power consumption. Each speed grade dissipates a baseline power at low sample rates that increases linearly with the clock frequency, as shown in
Figure 43.
The power scaling feature provides an additional power savings when enabled, as shown in
Figure 44. The power scaling mode cannot be enabled if the clock is varied during operation. This is because the internal circuitry cannot quickly track a changing clock, and the part does not have enough power to operate properly.
190
170
150
130
POWER (mW)
110
90
70
10 60 6550403020
Figure 44. Total Power vs. Sample Rate with Power Scaling Enabled
AD9237-40
AD9237-20
SAMPLE RATE (MSPS)
AD9237-65
05455-096
The MODE2 pin is a multilevel input that controls the span factor and power scaling modes. The MODE2 pin is internally pulled down to AGND by a 70 kΩ resistor. The input threshold and corresponding mode selections are outlined in
Tabl e 8.
Table 8. MODE2 Selection
MODE2 Voltage Span Factor Power Scaling
AVDD 1 Disabled 2/3 AVDD 1 Enabled 1/3 AVDD 2 Enabled AGND (Default) 2 Disabled
The PDWN pin is a multilevel input that controls the power states. The input threshold values and corresponding power states are outlined in
Tabl e 9.
Table 9. PDWN Selection
PDWN Voltage Power State Power (mW)
AVDD Power-Down Mode 1 1/3 AVDD Standby Mode 20 AGND (Default) Normal Operation Based on speed grade
By asserting the PDWN pin high, the AD9237 is placed in power-down mode. In this state, the ADC typically dissipates 1 mW. During power-down, the output drivers are placed in a high impedance state. Low power dissipation in power-down mode is achieved by shutting down the reference, reference buffer, biasing networks, clock, and duty cycle stabilizer circuitry. The decoupling capacitors on REFT and REFB are discharged when entering power-down mode and then must be recharged when returning to normal operation.
As a result, the wake-up time is related to the time spent in power-down mode and shorter standby cycles result in proportionally shorter wake-up times. With the recommended
0.1 μF and 10 μF decoupling capacitors on REFT and REFB, it takes approximately 1 sec to fully discharge the reference buffer decoupling capacitors and 3 ms to restore full operation.
Rev. 0 | Page 20 of 28
Page 21
AD9237
S
By asserting the PDWN pin to AVDD/3, the AD9237 is placed in standby mode. In this state, the ADC typically dissipates 20 mW. The output drivers are placed in a high impedance state. The reference circuitry is enabled, allowing for a quick start upon bringing the ADC into normal operating mode.

DIGITAL OUTPUTS

The AD9237 output drivers can be configured to interface with
2.5 V or 3.3 V logic families by matching DRVDD to the digital supply of the interfaced logic. The output drivers are sized to provide sufficient output current to drive a wide variety of logic families. However, large drive currents tend to cause current glitches on the supplies that can affect converter performance. Applications requiring the ADC to drive large capacitive loads or large fanouts may require external buffers or latches.
The length of the output data lines and loads placed on them should be minimized to reduce transients within the AD9237; these transients can detract from the converter’s dynamic performance.
As detailed in either offset binary, twos complement, or gray code.

Operational Mode Selection

The AD9237 can output data in either offset binary, twos complement, or gray code format. There is also a provision for enabling or disabling the duty cycle stabilizer (DCS). The MODE pin is a multilevel input that controls the data format (except for gray code) and DCS state. The MODE pin is internally pulled down to AGND by a 70 kΩ resistor. The input threshold values and corresponding mode selections are outlined in
The gray code output format is obtained by connecting GC to AVDD. When the part is in gray code mode, the MODE pin controls the DCS function only. The GC pin is internally pulled down to AGND by a 70 kΩ resistor.
Table 10. MODE Selection
MODE Voltage Data Format Duty Cycle Stabilizer
AVDD Twos Complement Disabled 2/3 AVDD Twos Complement Enabled 1/3 AVDD Offset Binary Enabled AGND (Default) Offset Binary Disabled

Out of Range (OTR)

An out-of-range condition exists when the analog input voltage is beyond the input range of the ADC. The OTR pin is a digital output that is updated along with the data output corresponding to the particular sampled input voltage. Therefore, the OTR pin has the same pipeline latency as the digital data. OTR is low when the analog input voltage is within the analog input range, and high when the analog input voltage exceeds the input range, as shown in returns to within the input range and another conversion is
Table 1 0, the data format can be selected for
Tabl e 10 .
Figure 45. OTR remains high until the analog input
completed. By logically AND-ing OTR with the MSB and its complement, overrange high or underrange low conditions can be detected. range circuit in
Tabl e 11 is a truth table for the overrange/ under-
Figure 46, which uses NAND gates. Systems requiring programmable gain condition of the AD9237 can, after eight clock cycles, detect an out-of-range condition; therefore, eliminating gain selection iterations. In addition, OTR can be used for digital offset and gain calculation.
OTR DATA OUTPUT
1 1111 1111 1111 0 1111 1111 1111 0 1111 1111 1110
0 0000 0000 0001 0 0000 0000 0000 0 0000 0000 0000
Figure 45. OTR Relation to Input Voltage and Output Data
OTR
–FS + 1/2 LSB
–FS – 1/2 LSB
+FS – 1 LSB
+FS
–FS
–FS – 1/2 LSB
Table 11. Output Data Format
OTR MSB Analog Input Is
0 0 Within range 0 1 Within range 1 0 Underrange 1 1 Overrange
MSB
OTR
MSB
Figure 46. Overrange/Underrange Logic
OVER = 1
UNDER = 1
05455-050

Digital Output Enable Function (OE)

The AD9237 has three-state ability. The OE pin is internally pulled down to AGND by a 70 kΩ resistor. If the OE pin is low, the output data drivers are enabled. If the OE pin is high, the output data drivers are placed in a high impedance state. It is not intended for rapid access to the data bus. Note that the OE pin is referenced to the digital supplies (DRVDD) and should not exceed that voltage.

Timing

The AD9237 provides latched data outputs with a pipeline delay of eight clock cycles. Data outputs are available one propagation delay (t
) after the rising edge of the clock signal. Refer to
PD
Figure 2 for a detailed timing diagram.
05455-049
Rev. 0 | Page 21 of 28
Page 22
AD9237

LFCSP EVALUATION BOARD

The typical bench setup used to evaluate the ac performance of the AD9237 is shown in single-ended or differentially through a transformer. Separate power pins are provided to isolate the DUT from the support circuitry. Each input configuration can be selected by proper connection of various jumpers (refer to the schematics).
Figure 47. The AD9237 can be driven
An alternative differential analog input path using an
AD8351 op amp is included in the layout but is not populated
in production. Designers interested in evaluating the op amp with the ADC should remove C15, R12, and R3 and populate the op amp circuit. The passive network between the
AD8351 outputs and the AD9237 allows the user to optimize the frequency response of the op amp for the application.
REFIN
10MHz REFOUT
HP8644, 2V p-p
SIGNAL SYNTHESIZER
HP8644, 2V p-p
CLOCK SYNTHESIZER
3V
AVDD DRVDDGND GND VDL VAMP
BAND-PASS
FILTER
CLOCK
DIVIDER
Figure 47. LFCSP Evaluation Board Connections
J1 ANALOG IN
J2 ENCODE
2.5V
+
EVALUATION BOARD
+
AD9237
2.5V
5V
+
+
DATA
P12
CAPTURE
AND
PROCESSING
05455-051
Rev. 0 | Page 22 of 28
Page 23
AD9237
D0X
D1X
D2X
D3X
D4X
D5X
D6X
11
9
10
12
13
14
152
RP1
220Ω
PWDN
E. POWER DOWN
F. STANDBY
R46
R47
1kΩ
E15
E13
F
E
E12
E14
CLK
C42
0.1μF
GND
C23
10pF
R3
0Ω
R11
36Ω
XOUTB
ANALOG INPUT
G. POWER UP
1kΩ
G
E17
R15
OPTIONAL XFR
GND
33Ω
T2
GND
AVDD
E10
E11
R8
E4
8
E3
7
E2
6
E5
5
MODE2
GND
R25
R13
AVDD
AMPINB
R3, R18, C27
XOUTXFRIN
2
15
ETC1-1-13
1kΩ
E9
1kΩ R45
E8
1kΩ R44
E7
1kΩ R43
E6
1kΩ
1kΩ
C18
0.1μF
R18
25Ω
ONLY ONE SHOULD BE
ON BOARD AT A TIME
CT
XOUTBGND
34
R SINGLE
GND
ENDED
PRI SEC
GND
GND
AVDD
MODE 2
5: SHA GAIN 1/AUTO POWER CONTROL OFF
6: SHA GAIN 1/AUTO POWER CONTROL ON
7: SHA GAIN 2/AUTO POWER CONTROL ON
8: SHA GAIN 2/AUTO POWER CONTROL OFF
05455-080
34567
116
GND
10
131211
141615
D3
D4
D5
D6
D7
DGND
AD9237
U4
AGND
VIN+
VIN–
282930
AIN
AIN
R4
0Ω
XOUT
AVDD
31
GND
AVDD
C21
10pF
33Ω
R10
REFT
AGND
AVDD
27
25
26
GND
AVDD
GNDAVDD
R26
1kΩ
R36
1kΩ
R12
AMPIN
9
D2
32
C19
C26
36Ω
T1
16
ADT1-1WT
XFRIN
L1
10nH
C15
0.1μF
GND
15pF
10pF
E45
J1
OR L1
GND
2
5
NC
8
AVDD
E36
TP1(GRAYCODE)
(LSB)
D1 D0 DNC GC PDWN
45678
OE CLK
2
MODE2
13
FOR
FILTER
R2
XX
GND
C5
0.1μF
C16
0.1μF
34
PRI SEC
GND
AMP
GND
E16
GND
H1
MTHOLE6H2MTHOLE6H3MTHOLE6H4MTHOLE6
GND
MODE SELECT
1: 2 COMP/DUTY CYCLE OFF
2: 2 COMP/DUTY CYCLE ON
E18
1
E22
R5
1kΩ
AVDD
C22 +
C13
AVDD
E1
GND
1V MAX
EXTREF
REFERENCE
A: EXTERNAL VOLTAGE DIVIDER
B: INTERNAL 1V REFERENCE
C: EXTERNAL REFERENCE
D: INTERNAL 0.5V REFERENCE
D7X
D8X
D9X
D10X
D11X
D12X
D13X
ORX
11
9
10
12
13
14
152
RP2
P2
VAMP
6
5
4
3
2
1
3: OFFET BINARY/DUTY CYCLE ON
4: OFFET BINARY/DUTY CYCLE OFF
MODE
2
10μF
0.1μF
E26 E27 E28
ABC D
E29
R1
10kΩ
5.0V
2.5V
VDL
GND
DRVDD
3.0V
GND
AVDD
3.0V
C8
0.1μF
E21
E23
R7
GND GND
E20
3
E24
1kΩ
E34 E33 E32
E30
C12
0.1μF
R9
10kΩ
220Ω
OVER RANGE BIT
GND
E19
4
E25
R6
1kΩ
GND
C11
0.1μF
C29
10μF
+
C9
0.1μF
GND
GND
34567
116
(MSB)
1718192022
21
2324
C7
0.1μF
GND
R12, R42, C17
ONLY ONE SHOULD
BE ON BOARD AT A TIME
FOR SINGLE ENDED INPUT
PLACE R19 (50Ω ON BOTTOM)
R42 (0Ω), C6, C18 (0.1μF)
AND R18 (25Ω)
REMOVE R12, R3, C27, C17
8
DRVDD
D8 D9
DRVDD
D10 D11
OTR
MODE
SENSE
VREF
REFB
GND
0Ω
R42
C6
0.1μF
SINGLE ENDED
INPUT
Figure 48. LFCSP Evaluation Board Schematic, Analog Inputs, and DUT
Rev. 0 | Page 23 of 28
Page 24
AD9237
T
R
CLKLAT/DAC
MSB
ORX
D13X
GND D12X D11X
DRVDD
D10X
D9X
GND
D8X D7X D6X D5X
GND
D4X D3X
DRVDD
D2X D1X
GNDLSB
D0X
CLKLAT/DAC
O USE AMPLIFIE
PLACE ALL COMPONENTS SHOWN HERE (RIGHT) EXCEPT R40 OR R41 REMOVE R12, R3, R18, R42, C6, C18
AMP IN
74LVTH162374
2CLK 2D8 2D7 GND7 2D6 2D5 VCC2 2D4 2D3 GND4 2D2 2D1 1D8 1D7 GND5 1D6 1D5 VCC3 1D4 1D3 GND6 1D2 1D1 1CLK
AMP
R19 50Ω
U1
GND
2OE
2Q8 2Q7
GND3
2Q6 2Q5
VCC1
2Q4 2Q3
GND2
2Q2 2Q1 1Q8 1Q7
GND1
1Q6 1Q5
VCC
1Q4 1Q3
GND
1Q2 1Q1
1OE
R35 25Ω
VAMP
GND
GND
2425
ORY
2326 2227
GND
2128 2029 1930
DRVDD
1831 1732 1633
GND
1534 1435 1336 1237 1138
GND
1039 940 841
DRVDD
742 643 544
GND
445 346 247
GND
148
POWER DOWN
USE R40 OR R41
GND
R41
R40
10kΩ
10kΩ
C28
0.1μF
C35
0.1μF
R33
100Ω
GND
MSB
DR
GND
ORY
R38
GND
1kΩ
C44
0.1μF
VAMP
1PWDN 10 VOCM
U3
AD8351
2RGP1 9 VPOS
3INHI 8 OPHI
4INLO 7 OPLO
5RPG2 6 COMM
R34
1.2kΩ
2 4 6
8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40
R39 1kΩ
VAMP
GND
HEADER 40
2 4 6 8 10 12 14 16 18
P12
20 22 24 26 28 30 32 34 36 38 40
C24
10μF
+
C45
0.1μF
R14 25Ω
R16
0Ω
R17
0Ω
GND
GND
GND
C27
0.1μF
C17
0.1μF
1
1
3
3
5
5
7
7
9
9
11
11
13
13
15
15
17
17
19
19
21
21
23
23
25
25
27
27
29
29
31
31
33
33
35
35
37
37
39
39
GNDGND
AMPINB
AMPIN
05455-081
Figure 49. LFCSP Evaluation Board Schematic, Digital Path
Rev. 0 | Page 24 of 28
Page 25
AD9237
05455-082
C40
VDL
C37
C20
+
0.001μF
0.1μF
C46
10μF
GND
VAMP
+
GND
DR
Rx
R37 0Ω
R22 0Ω
10μF
C49
C48
C47
C1
C39
C38
C36
C34
0.001μF
0.001μF
0.1μF
0.1μF
0.001μF
0.001μF
0.1μF
0.1μF
LATCH
BYPASSING
DRVDD
AVDD
AVDD
VDL DRVDD
C31
C30
C2
+
C41
C14
C33
C32
C25
+
C3 +
C4 +
C10 +
0.1μF
0.001μF
10μF
0.1μF
0.001μF
0.1μF
0.001μF
10μF
10μF
10μF
10μF
SCHEMATIC SHOWS 2 GATE DELAY SETUP
FOR ONE DELAY, REMOVE BOTH RESISTORS AND
ATTACH ONE FROM 2Y TO DR (Rx)
CLKLAT/DAC
VDL
147PWR
4Y
3B3Y4A
101213
E53E52
4B
R20
VDL
GND
1kΩ
ENCODE
GND
R31
C43
GNDVDL
1kΩ
0.1μF
J2
DIGITAL
GND
ANALOG
GND
DUT
BYPASSING
U5
74VCX86
ENC
BYPASSING
ENCX
6811
1Y 3
1A
1B
2A
2B2Y3A
12459
R32
1kΩ
E51E50
CLK
R280ΩR27
ENC
ENCX
R23 0Ω
GNDVDL
0Ω
BYPASSING
FOR A BUFFERED ENCODE USE R28
FOR A DIRECT ENCODE USE R27
CLOCK TIMING ADJUSTMENTS
Figure 50. LFCSP Evaluation Board Schematic, Clock Input
R30
R29
1kΩ
50Ω
E35E31
GND
GND
GND
R21
1kΩ
GNDVDL
E44E43
R24
1kΩ
GNDVDL
Rev. 0 | Page 25 of 28
Page 26
AD9237
Figure 51. LFCSP Evaluation Board Layout, Primary Side
Figure 52. LFCSP Evaluation Board Layout, Secondary Side
05455-056
05455-057
Figure 54. LFCSP Evaluation Board Layout, Power Plane
Figure 55. LFCSP Evaluation Board Layout, Primary Silkscreen
05455-059
05455-060
05455-058
Figure 53. LFCSP Evaluation Board Layout, Ground Plane
Figure 56. LFCSP Evaluation Board Layout, Secondary Silkscreen
05455-061
Rev. 0 | Page 26 of 28
Page 27
AD9237
Table 12. LFCSP Evaluation Board Bill of Materials
Recommended Vendor/
Item Qty. Omit1Reference Designator Device Package Value
18
1
C1, C5, C7, C8, C9, C11, C12,
Chip Capacitors 0603 0.1 μF
Part Number
C13, C15, C16, C31, C33, C34, C36, C37, C41, C43, C47
9
C6, C17, C18, C27, C28, C35, C42, C44, C45
8
2
C2, C3, C4, C10, C20,
Tantalum Capacitors TAJD 10 μF
C22, C25, C29
2 C24, C46
3 8
C14, C30, C32,
Chip Capacitors 0603 0.001 μF
C38, C39, C40, C48, C49
4 1 C19 Chip Capacitor 0603 15 pF
1 C26 5
Chip Capacitors 0603 10 pF 2 C21, C23 41 E2 to E36, E43, E44, E50 to E53
6
2 E1, E45 4 H1, H2, H3, H4
Headers
EHOLE
MTHOLE
Jumper Blocks S1031-02-ND
7 2 J1, J2 SMA Connectors/50 Ω SMA 8 1 L1 Inductor 0603 10 nH Coilcraft/0603CS-10NXGBU 9 1 P2 Terminal Block TB6
Wieland/25.602.2653.0, z5-530-0625-0
10 1 P12
Header, Dual
HEADER40 Digi-Key S2131-20-ND
20-Pin RT Angle 5 R3, R12, R23, R28, Rx 11
Chip Resistors 0603 0 Ω 6 R16, R17, R22, R27, R37, R42
12 2 R4, R15 Chip Resistors 0603 33 Ω
19
13
R5 to R8, R13, R20, R21,
Chip Resistors 0603 1 kΩ
R24 to R26, R30 to R32, R36, R43 to R47
2 R38, R39
14 2 R10, R11 Chip Resistors 0603 36 Ω
1 R29 15
Chip Resistors 0603 50 Ω 1 R19
16 2 RP1, RP2 Resistor Pack R_742 220 Ω
Digi-Key
CTS/742C163220JTR 17 1 T1 ADT1-1WT AWT1-1T Mini-Circuits 18 1 U1
74LVTH162374
TSSOP-48
CMOS Register 19 1 U4 AD9237BCP ADC (DUT) LFCSP-32 Analog Devices, Inc. X 20 1 U5 74VCX86M SOIC-14 Fairchild 21 1 PCB AD92XXBCP/PCB PCB Analog Devices, Inc. X 22 1 U3 AD8351 Op Amp MSOP-8 Analog Devices, Inc. X 23 1 T2
M/A-COM
ETC1-1-13 1-1 TX M/A-COM/ETC1-1-13
Transform er 24 1 R2 Chip Resistor 0603 SELECT 25 3 R14, R18, R35 Chip Resistors 0603 25 Ω 26 4 R1, R9, R40, R41 Chip Resistors 0603 10 kΩ 27 1 R34 Chip Resistor 1.2 kΩ 28 1 R33 Chip Resistor 100 Ω Total 118 40
1
These items are included in the PCB design but are omitted at assembly.
Supplied by ADI
Rev. 0 | Page 27 of 28
Page 28
AD9237

OUTLINE DIMENSIONS

0.08
0.60 MAX
25
24
EXPOSED
PAD
(BOTTOM VIEW)
17
16
32
1
8
9
3.50 REF
PIN 1 INDICATOR
3.25
3.10 SQ
2.95
0.25 MIN
PIN 1
INDICATOR
1.00
0.85
0.80
12° MAX
SEATING PLANE
5.00
BSC SQ
TOP
VIEW
0.80 MAX
0.65 TYP
0.30
0.23
0.18
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
4.75
BSC SQ
0.20 REF
0.05 MAX
0.02 NOM
0.60 MAX
0.50
BSC
0.50
0.40
0.30
COPLANARITY
Figure 57. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-2)
Dimensions shown in millimeters

ORDERING GUIDE

Model Temperature Range Package Description Package Option
AD9237BCPZ-20 AD9237BCPZRL7-20 AD9237BCPZ-40 AD9237BCPZRL7-40 AD9237BCPZ-65 AD9237BCPZRL7-65 AD9237BCP-20EB AD9237BCP-40EB AD9237BCP-65EB
1
Z = Pb-free part.
2
It is recommended that the exposed paddle be soldered to the ground plane. There is an increased reliability of the solder joints and maximum thermal capability of
the package is achieved with exposed paddle soldered to the customer board.
1, 2
1, 2
1, 2
–40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2
1, 2
–40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2 –40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2
1, 2
–40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2 –40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2
1, 2
–40°C to +85°C 32-Lead Lead Frame Chip Scale Package (LFCSP_VQ) CP-32-2
Evaluation Board Evaluation Board Evaluation Board
© 2005 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D05455–0–10/05(0)
T
Rev. 0 | Page 28 of 28
TTT
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