SNR = 64.9 dBFS @ fIN up to 70 MHz @ 250 MSPS
ENOB of 10.4 @ f
SFDR = −79 dBc @ f
Excellent linearity
DNL = ±0.3 LSB typical
INL = ±0.5 LSB typical
LVDS at 250 MSPS (ANSI-644 levels)
700 MHz full power analog bandwidth
On-chip reference, no external decoupling required
Integrated input buffer and track-and-hold
Low power dissipation
434 mW @ 250 MSPS—LVDS SDR mode
400 mW @ 250 MSPS—LVDS DDR mode
Programmable input voltage range
1.0 V to 1.5 V, 1.25 V nominal
1.8 V analog and digital supply operation
Selectable output data format (offset binary, twos
Wireless and wired broadband communications
Cable reverse path
Communications test equipment
Radar and satellite subsystems
Power amplifier linearization
GENERAL DESCRIPTION
The AD9230 is a 12-bit monolithic sampling analog-to-digital
converter optimized for high performance, low power, and ease
of use. The product operates at up to a 250 MSPS conversion
rate and is optimized for outstanding dynamic performance in
wideband carrier and broadband systems. All necessary
functions, including a track-and-hold (T/H) and voltage
reference, are included on the chip to provide a complete signal
conversion solution.
The ADC requires a 1.8 V analog voltage supply and a
differential clock for full performance operation. The digital
outputs are LVDS (ANSI-644) compatible and support either
twos complement, offset binary format, or Gray code. A data
clock output is available for proper output data timing.
Fabricated on an advanced CMOS process, the AD9230 is
available in a 56-lead LFCSP, specified over the industrial
temperature range (−40°C to +85°C).
PRODUCT HIGHLIGHTS
1. High Performance—Maintains 64.9 dBFS SNR @ 250 MSPS
with a 70 MHz input.
2. Low Power—Consumes only 434 mW @ 250 MSPS.
3. Ease of Use—LVDS output data and output clock signal
allow interface to current FPGA technology. The on-chip
reference and sample and hold provide flexibility in system
design. Use of a single 1.8 V supply simplifies system
power supply design.
4. Serial Port Control—Standard serial port interface supports
various product functions, such as data formatting, disabling
the clock duty cycle stabilizer, power-down, gain adjust,
and output test pattern generation.
5. Pin-Compatible Family—10-bit pin-compatible family
offered as AD9211.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
No Missing Codes Full Guaranteed Guaranteed Guaranteed
Offset Error 25°C 4.2 4.3 4.5 mV
Full −12 12 −12 12 −12 12 mV
Gain Error 25°C 0.89 1.0 1.1 mV
Full −1.5 3.5 −1.5 3.5 −1.5 3.5 % FS
Differential Nonlinearity 25°C ±0.3 ±0.3 ±0.3 LSB
(DNL) Full −0.5 0.5 −0.5 0.5 −0.6 0.6 LSB
Integral Nonlinearity (INL) 25°C ±0.5 ±0.4 ±0.5 LSB
Full −0.75 0.75 −0.75 0.75 −1.0 +1.0 LSB
TEMPERATURE DRIFT
Offset Error Full
Gain Error Full 0.019 0.021 0.018 %/°C
ANALOG INPUTS (VIN+, VIN−)
Differential Input Voltage Range2Full 0.98 1.25 1.5 0.98 1.25 1.5 0.98 1.25 1.5 V p-p
Input Common-Mode Voltage Full 1.4 1.4 1.4 V
Input Resistance (Differential) Full 4.3 4.3 4.3 kΩ
Input Capacitance 25°C 2 2 2 pF
POWER SUPPLY
AVDD Full 1.7 1.8 1.9 1.7 1.8 1.9 V
DRVDD Full 1.7 1.8 1.9 1.7 1.8 1.9 V
Supply Currents
3
I
AVDD
3
I
/SDR Mode
DRVDD
3
I
/DDR Mode
DRVDD
Power Dissipation
SDR Mode
DDR Mode
1
See the AN-835 Application Note, “Understanding High Speed ADC Testing and Evaluation,” for a complete set of definitions and how these tests were completed.
2
The input range is programmable through the SPI, and the range specified reflects the nominal values of each setting. See the Memory Map section.
3
I
and I
AVDD
4
Single data rate mode; this is the default mode of the AD9230.
5
Double data rate mode; user-programmable feature. See the Memory Map section.
are measured with a −1 dBFS, 10.3 MHz sine input at rated sample rate.
DRVDD
4
5
3
4
5
= −40°C, T
MIN
= +85°C, fIN = −1.0 dBFS, full scale = 1.25 V, DCS enabled, unless otherwise noted.
MAX
AD9230-170 AD9230-210 AD9230-250
Temp Min Typ Max Min Typ Max Min Typ Max Unit
±9
±8
±7
μV/°C
Full 136 145 154 164 181 194 mA
Full 58 61 59 62 60 63 mA
Full 39 40 41 mA
Full mW
Full 349 371 383 407 434 463 mW
Full 315 349 400 mW
Rev. 0 | Page 3 of 32
AD9230
AC SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, T
1
= −40°C, T
MIN
= +85°C, fIN = −1.0 dBFS, full scale = 1.25 V, DCS enabled, unless otherwise noted.
MAX
Table 2.
AD9230-170 AD9230-210 AD9230-250
Parameter2 Temp Min Typ Max Min Typ Max Min Typ Max Unit
SNR
fIN = 10 MHz 25°C 63.8 64.6 63.7 64.5 63.3 64.1 dB
Full 63.5 63.4 62.5 dB
fIN = 70 MHz 25°C 63.5 64.3 63.3 64.2 63.0 63.9 dB
Full 63.3 63.1 62.3 dB
fIN = 170 MHz
3
25°C 63.5 63.4 63.3 dB
fIN = 225 MHz 25°C 63.0 61.5 63.3 dB
SINAD
fIN = 10 MHz 25°C 63.7 64.5 63.6 64.4 63.3 64.0 dB
Full 63.4 63.4 62.4 dB
fIN = 70 MHz 25°C 63.3 64.1 63.2 64.0 62.9 63.7 dB
Full 63.1 63.0 62.2 dB
fIN = 170 MHz
3
25°C 63.3 63.1 63.0 dB
fIN = 225 MHz 25°C 61.8 61.1 62.8 dB
EFFECTIVE NUMBER OF BITS (ENOB)
fIN = 10 MHz 25°C 10.6 10.6 10.5 Bits
fIN = 70 MHz 25°C 10.5 10.5 10.4 Bits
fIN = 170 MHz
3
25°C 10.4 10.4 10.3 Bits
fIN = 225 MHz 25°C 10.1 10.0 10.3 Bits
WORST HARMONIC (Second or Third)
fIN = 10 MHz 25°C −82 −78 −86 −80 −84 −79 dBc
Full −78 −78 −76 dBc
fIN = 70 MHz 25°C −78 −76 −80 −77 −79 −76 dBc
Full −75 −75 −75 dBc
fIN = 170 MHz
3
25°C −78 −79 −78 dBc
fIN = 225 MHz 25°C −68 −70 −75 dBc
WORST OTHER
(SFDR Excluding Second and Third)
fIN = 10 MHz 25°C −89 −84 −89 −84 −84 −79 dBc
Full −83 −83 −76 dBc
fIN = 70 MHz 25°C −89 −83 −86 −81 −83 −79 dBc
Full −83 −81 −75 dBc
fIN = 170 MHz
3
25°C −89 −79 −83 dBc
fIN = 225 MHz 25°C −80 −79 −80 dBc
TWO-TONE IMD
140.2 MHz/141.3 MHz @ −7 dBFS 25°C 73 75 78 dBc
170.2 MHz/171.3 MHz @ −7 dBFS 25°C 67 73 dBc
ANALOG INPUT BANDWIDTH 25°C 700 700 700 MHz
1
All ac specifications tested by driving CLK+ and CLK− differentially.
2
See the AN-835 Application Note, “Understanding High Speed ADC Testing and Evaluation,” for a complete set of definitions and how these tests were completed.
3
140 MHz for the AD9230-170 speed grade, 170 MHz for the AD9230-210 and AD9230-250 speed grades.
Rev. 0 | Page 4 of 32
AD9230
DIGITAL SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, T
Table 3.
AD9230-170 AD9230-210 AD9230-250
Parameter1 Temp Min Typ Max Min Typ Max Min Typ Max Unit
CLOCK INPUTS
Logic Compliance Full CMOS/LVDS/LVPECL CMOS/LVDS/LVPECL CMOS/LVDS/LVPECL
Internal Common-Mode Bias Full 1.2 1.2 1.2 V
Differential Input Voltage Full 0.2 6 0.2 6 0.2 6 V p-p
Input Voltage Range Full
Input Common-Mode Range Full 1.1 AVDD 1.1 AVDD 1.1 AVDD V
High Level Input Voltage (VIH) Full 1.2 3.6 1.2 3.6 1.2 3.6 V
Low Level Input Voltage (VIL) Full 0 0.8 0 0.8 0 0.8 V
High Level Input Current (IIH) Full −10 +10 −10 +10 −10 +10 μA
Low Level Input Current (IIL) Full −10 +10 −10 +10 −10 +10 μA
Input Resistance
(Differential)
Input Capacitance Full 4 4 4 pF
LOGIC INPUTS
Logic 1 Voltage Full
Logic 0 Voltage Full
Logic 1 Input Current (SDIO) Full 0 0 0 μA
Logic 0 Input Current (SDIO) Full −60 −60 −60 μA
Logic 1 Input Current
VOD Differential Output Voltage Full 247 454 247 454 247 454 mV
VOS Output Offset Voltage Full 1.125 1.375 1.125 1.375 1.125 1.375 V
Output Coding Twos complement, Gray code, or offset binary (default)
1
See the AN-835 Application Note, “Understanding High Speed ADC Testing and Evaluation,” for a complete set of definitions and how these tests were completed.
2
LVDS R
TERMINATION
= 100 Ω.
= −40°C, T
MIN
AVDD −
0.3
= +85°C, fIN = −1.0 dBFS, full scale = 1.25 V, DCS enabled, unless otherwise noted.
MAX
AVDD +
1.6
AVDD −
0.3
AVDD +
1.6
AVDD −
0.3
AVDD +
1.6
V
Full 16 20 24 16 20 24 16 20 24 kΩ
0.8 ×
VDD
0.2 ×
AVDD
0.8 ×
VDD
0.2 ×
AVDD
0.8 ×
V
VDD
0.2 ×
AVDD
V
Full 55 55 50 μA
Full 0 0 0 μA
Rev. 0 | Page 5 of 32
AD9230
SWITCHING SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, T
Table 4.
AD9230-170 AD9230-210 AD9230-250
Parameter (Conditions) Temp Min Typ Max Min Typ Max Unit
Maximum Conversion Rate Full 170
Minimum Conversion RateFull
CLK+ Pulse Width High (tCH)Full 2.65 2.9 2.15 2.4 1.8 2.0 ns
CLK+ Pulse Width Low (tCL) Full 2.65 2.9 2.15 2.4 1.8 2.0 ns
Output (LVDS − SDR Mode)
to DRGND
DCO to DRGND −0.3 V to DRVDD + 0.3 V
OR to DGND −0.3 V to DRVDD + 0.3 V
CLK+ to AGND −0.3 V to +3.9 V
CLK− to AGND −0.3 V to +3.9 V
VIN+ to AGND −0.3 V to AVDD + 0.2 V
VIN− to AGND −0.3 V to AVDD + 0.2 V
SDIO/DCS to DGND −0.3 V to DRVDD + 0.3 V
PDWN to AGND −0.3 V to +3.9 V
CSB to AGND −0.3 V to +3.9 V
SCLK/DFS to AGND −0.3 V to +3.9 V
ENVIRONMENTAL
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +85°C
Lead Temperature
(Soldering 10 sec)
Junction Temperature 150°C
−0.3 V to DRVDD + 0.3 V
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the
customer board increases the reliability of the solder joints,
maximizing the thermal capability of the package.
Table 6.
Package Type θJA θ
56-Lead LFCSP (CP-48-3) 30.4 2.9 °C/W
Unit
JC
Typical θJA and θJC are specified for a 4-layer board in still air.
Airflow increases heat dissipation, effectively reducing θ
JA
. In
addition, metal in direct contact with the package leads from
metal traces, and through holes, ground, and power planes
reduces the θ
.
JA
ESD CAUTION
Rev. 0 | Page 8 of 32
AD9230
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
)
D2–
D2+
55
56
1D3–
2D3+
3D4–
4D4+
5D5–
6D5+
7DRVDD
8DRG ND
9D6–
10D6+
11D7–
12D7+
13D8–
14D8+
PIN 1
INDICATO R
PIN 0 (EXPOSED PADDLE) = AGND
16
15
D9–
D9+
Figure 4. Single Data Rate Mode
D0+ (LSB
D1–
D1+
52
53
54
AD9230
TOP VIEW
(Not to Scale)
17
19
18
D10–
D10+
(MSB) D11–
DCO+
D0– (LSB)
50
51
21
20
OR–
(MSB) D11+
Table 7. Single Data Rate Mode Pin Function Descriptions
Pin No. Mnemonic Description
30, 32 to 34, 37 to 39,
AVDD 1.8 V Analog Supply.
41 to 43, 46
7, 24, 47 DRVDD 1.8 V Digital Output Supply.
0 AGND
8, 23, 48 DRGND
1
1
Analog Ground.
Digital Output Ground.
35 VIN+ Analog Input—True.
36 VIN− Analog Input—Complement.
40 CML
Common-Mode Output Pin. Enabled through the SPI, this pin provides a reference for the
optimized internal bias voltage for VIN+/VIN−.
44 CLK+ Clock Input—True.
45 CLK− Clock Input—Complement.
31 RBIAS Set Pin for Chip Bias Current. (Place 1% 10 kΩ resistor terminated to ground.) Nominally 0.5 V.
28 RESET CMOS-Compatible Chip Reset (Active Low).
25 SDIO/DCS
Serial Port Interface (SPI®) Data Input/Output (Serial Port Mode); Duty Cycle Stabilizer Select
(External Pin Mode).
26 SCLK/DFS Serial Port Interface Clock (Serial Port Mode); Data Format Select Pin (External Pin Mode).
27 CSB Serial Port Chip Select (Active Low).
29 PWDN Chip Power-Down.
49 DCO− Data Clock Output—Complement.
50 DCO+ Data Clock Output—True.
51 D0− D0 Complement Output Bit (LSB).
52 D0+ D0 True Output Bit (LSB).
53 D1− D1 Complement Output Bit.
54 D1+ D1 True Output Bit.
55 D2− D2 Complement Output Bit.
56 D2+ D2 True Output Bit.
1 D3− D3 Complement Output Bit.
2 D3+ D3 True Output Bit.
3 D4− D4 Complement Output Bit.
4 D4+ D4 True Output Bit.
Table 8. Double Data Rate Mode Pin Function Descriptions
Pin No. Mnemonic Description
30, 32 to 34, 37 to 39,
AVDD 1.8 V Analog Supply.
41 to 43, 46
7, 24, 47 DRVDD 1.8 V Digital Output Supply.
0 AGND
8, 23, 48 DRGND
1
Analog Ground.
1
Digital Output Ground.
35 VIN+ Analog Input—True.
36 VIN− Analog Input—Complement.
40 CML
Common-Mode Output Pin. Enabled through the SPI, this pin provides a reference for the
optimized internal bias voltage for VIN+/VIN−.
44 CLK+ Clock Input—True.
45 CLK− Clock Input—Complement.
31 RBIAS Set Pin for Chip Bias Current. (Place 1% 10 kΩ resistor terminated to ground.) Nominally 0.5 V.
28 RESET CMOS-Compatible Chip Reset (Active Low).
25 SDIO/DCS
Serial Port Interface (SPI) Data Input/Output (Serial Port Mode); Duty Cycle Stabilizer Select
(External Pin Mode).
26 SCLK/DFS Serial Port Interface Clock (Serial Port Mode); Data Format Select Pin (External Pin Mode).
27 CSB Serial Port Chip Select (Active Low).
29 PWDN Chip Power-Down.
49 DCO− Data Clock Output—Complement.
50 DCO+ Data Clock Output—True.
51 D0/D6− D0/D6 Complement Output Bit (LSB).
52 D0/D6+ D0/D6 True Output Bit (LSB).
53 D1/D7− D1/D7 Complement Output Bit.
54 D1/D7+ D1/D7 True Output Bit.
55 D2/D8− D2/D8 Complement Output Bit.
56 D2/D8+ D2/D8 True Output Bit.
1 D3/D9− D3/D9 Complement Output Bit.
2 D3/D9+ D3/D9 True Output Bit.
3 D4/D10− D4/D10 Complement Output Bit.
4 D4/D10+ D4/D10 True Output Bit.
5 D5/D11− D5/D11 Complement Output Bit (MSB).
6 D5/D11+ D5/D11 True Output Bit (MSB).
Rev. 0 | Page 11 of 32
AD9230
Pin No. Mnemonic Description
9 OR− D6 Complement Output Bit. (This pin is disabled if Pin 21 is reconfigured through the SPI to be OR−.)
10 OR+ D6 True Output Bit. (This pin is disabled if Pin 22 is reconfigured through the SPI to be OR+.)
11 to 20 DNC Do Not Connect.
21 DNC/(OR−)
22 DNC/(OR+)
1
AGND and DRGND should be tied to a common quiet ground plane.
Do Not Connect. (This pin can be reconfigured as the Overrange Complement Output Bit through
the serial port register.)
Do Not Connect. (This pin can be reconfigured as the Overrange True Output Bit through the serial
port register.)
Figure 41. AD9230-250 64k Point, Two-Tone FFT; 250 MSPS,
170.1 MHz, 171.1 MHz
210
190
170
150
130
110
CURRENT (mA)
90
70
50
TOTAL POWER
IDRVDD
50300250200150100
SAMPLE RATE (MSPS)
IAVDD
Figure 42. AD9230 Power Supply Current vs. Sample Rate
120
100
80
60
SFDR (dB)
40
20
070605040302010
06002-121
0
–900–10–20–30–40–50–60–70–80
IMD3 (dBFS)
SFDR (dBFS)
AMPLITUDE ( –dBFS)
SFDR (dBc)
06002-120
Figure 44. AD9230-250 Two-Tone SFDR vs. Input Amplitude; 250 MSPS,
170.1 MHz, 171.1 MHz
480
460
440
420
400
380
360
340
320
300
POWER (mW)
06002-127
0
–20
–40
–60
–80
AMPLITUDE (dBFS)
–100
–120
030.7261.4492.16122.88
FREQUENCY (MHz)
06002-101
Figure 45. AD9230-250 64k Point FFT; Four W-CDMA Carriers, IF = 184 MHz,
245.6 MSPS
Rev. 0 | Page 19 of 32
AD9230
85
80
75
SFDR (dBc)
90
SFDR (dBFS ) w/ DCS ON
80
70
SFDR (dBFS) w/ DCS OFF
70
65
SNR/SFDR (dB)
60
55
50
1.01.11.21.31.41.51.61.71.8
SNR (dB)
VCM (V)
Figure 46. SNR/SFDR vs. Common-Mode Voltage;
250 MSPS, 70.3 MHz @ −1 dBFS
80
75
70
65
60
55
SNR/SFDR (dB)
50
45
40
50300250200150100
SAMPLE RATE (MSPS)
SFDR (dBc)
SNR (dB)
Figure 47. SNR/SFDR vs. Sample Rate;
250 MSPS, 170.3 MHz @ −1 dBFS
60
50
SNR/SFDR (dB)
40
30
20
0 102030405060708090100
06002-130
SNR (dBFS) w / DCS OFF
INPUT CLOCK DUTY CYCLE (% CL K+ HIGH)
SNR (dBFS) w / DCS ON
06002-100
Figure 49. SNR/SFDR vs. Sample Clock Duty Cycle;
250 MSPS, 170.3 MHz @ −1 dBFS
2.5
2.0
1.5
AD9230-210
1.0
GAIN (%FS)
0.5
0
–0.5
–60120100806040200–20–40
06002-122
TEMPERATURE ( °C)
AD9230-250
AD9230-170
06002-102
Figure 50. Gain vs. Temperature
6.0
5.5
5.0
4.5
4.0
OFFSET (mV)
3.5
3.0
2.5
2.0
AD9230-210
–40 –30 –20 –10 0908070605040302010
Figure 51. Offset vs. Temperature
AD9230-250
AD9230-170
TEMPERATURE ( °C)
06002-103
SNR/SFDR (dB)
85
80
75
70
65
60
0.91.61. 51.41.31.21.11.0
ANALOG INPUT RANGE (MHz)
SFDR (dBFS)
SNR (dBF S)
Figure 48. SNR/SFDR vs. Analog Input Range;
06002-131
250 MSPS, 170.3 MHz @ −1 dBFS
Rev. 0 | Page 20 of 32
AD9230
V
A
A
THEORY OF OPERATION
The AD9230 architecture consists of a front-end sample and
hold amplifier (SHA) followed by a pipelined switched capacitor
ADC. The quantized outputs from each stage are combined into
a final 12-bit result in the digital correction logic. The pipelined
architecture permits the first stage to operate on a new input
sample, while the remaining stages operate on preceding
samples. Sampling occurs on the rising edge of the clock.
Each stage of the pipeline, excluding the last, consists of a low
resolution flash ADC connected to a switched capacitor DAC
and interstage residue amplifier (MDAC). The residue amplifier
magnifies the difference between the reconstructed DAC output
and the flash input for the next stage in the pipeline. One bit of
redundancy is used in each stage to facilitate digital correction
of flash errors. The last stage simply consists of a flash ADC.
The input stage contains a differential SHA that can be ac- or
dc-coupled in differential or single-ended mode. The outputstaging block aligns the data, carries out the error correction,
and passes the data to the output buffers. The output buffers are
powered from a separate supply, allowing adjustment of the
output voltage swing. During power-down, the output buffers
go into a high impedance state.
ANALOG INPUT AND VOLTAGE REFERENCE
The analog input to the AD9230 is a differential buffer. For best
dynamic performance, the source impedances driving VIN+
and VIN− should be matched such that common-mode settling
errors are symmetrical. The analog input is optimized to
provide superior wideband performance and requires that the
analog inputs be driven differentially. SNR and SINAD
performance degrades significantly if the analog input is driven
with a single-ended signal.
A wideband transformer, such as Mini-Circuits® ADT1-1WT,
can provide the differential analog inputs for applications that
require a single-ended-to-differential conversion. Both analog
inputs are self-biased by an on-chip resistor divider to a
nominal 1.3 V.
An internal differential voltage reference creates positive and
negative reference voltages that define the 1.25 V p-p fixed span
of the ADC core. This internal voltage reference can be adjusted
by means of SPI control. See the
the SPI
section for more details.
Differential Input Configurations
Optimum performance is achieved while driving the AD9230
in a differential input configuration. For baseband applications,
the
and a flexible interface to the ADC. The output common-mode
voltage of the
AD8138 is easily set to AVDD/2 + 0.5 V, and the
driver can be configured in a Sallen-Key filter topology to
provide band limiting of the input signal.
AD9230 Configuration Using
At input frequencies in the second Nyquist zone and above, the
performance of most amplifiers may not be adequate to achieve
the true performance of the AD9230. This is especially true in
IF undersampling applications where frequencies in the 70 MHz
to 100 MHz range are being sampled. For these applications,
differential transformer coupling is the recommended input
configuration. The signal characteristics must be considered
when selecting a transformer. Most RF transformers saturate at
frequencies below a few MHz, and excessive signal power can
also cause core saturation, which leads to distortion.
In any configuration, the value of the shunt capacitor, C, is
dependent on the input frequency and may need to be reduced
or removed.
As an alternative to using a transformer-coupled input at
frequencies in the second Nyquist zone, the
driver can be used (see
NALOG I NPUT
NALOG I NPUT
49.9Ω1V p-p
499Ω
0.1µF
523Ω
Figure 52. Differential Input Configuration Using the
Figure 54. Differential Input Configuration Using the AD8352
8, 13
AD8352
14
0.1µF
0.1µF
11
10
0.1µF
0.1µF
200Ω
200Ω
R
C
R
0.1µF
VIN+
AD9230
VIN–
6002-055
CML
06002-059
Rev. 0 | Page 21 of 32
AD9230
A
A
CLOCK INPUT CONSIDERATIONS
For optimum performance, the AD9230 sample clock inputs
(CLK+ and CLK−) should be clocked with a differential signal.
This signal is typically ac-coupled into the CLK+ pin and CLK−
pin via a transformer or capacitors. These pins are biased
internally and require no additional bias.
Figure 55 shows one preferred method for clocking the AD9230.
The low jitter clock source is converted from single-ended to
differential using an RF transformer. The back-to-back Schottky
diodes across the secondary transformer limit clock excursions
into the AD9230 to approximately 0.8 V p-p differential. This
helps prevent the large voltage swings of the clock from feeding
through to other portions of the AD9230 and preserves the fast
rise and fall times of the signal, which are critical to low jitter
performance.
In some applications, it is acceptable to drive the sample clock
inputs with a single-ended CMOS signal. In such applications,
CLK+ should be directly driven from a CMOS gate, and the
CLK− pin should be bypassed to ground with a 0.1 F capacitor
in parallel with a 39 kΩ resistor (see
Figure 58). Although the
CLK+ input circuit supply is AVDD (1.8 V), this input is
designed to withstand input voltages up to 3.3 V, making the
selection of the drive logic voltage very flexible.
D9510/AD9511/
AD9512/AD9513/
CLOCK
INPUT
50Ω
0.1µF
0.1µF
1
AD9514/AD9515
CLK
CMOS DRIVER
CLK
0.1µF
OPTIONAL
100Ω
39kΩ
0.1µF
CLK+
ADC
AD9230
CLK–
MINI-CIRCUITS
CLOCK
INPUT
50Ω
ADT1–1WT, 1:1Z
100Ω
XFMR
0.1µF
0.1µF0.1µF
0.1µF
SCHOTTKY
DIODES:
HSM2812
CLK+
ADC
AD9230
CLK–
06002-060
Figure 55. Transformer-Coupled Differential Clock
If a low jitter clock is available, another option is to ac couple a
differential PECL signal to the sample clock input pins, as
shown in
Figure 56. The AD9510/AD9511/AD9512/AD9513/
AD9514/AD9515 family of clock drivers offers excellent jitter
performance.
AD9510/AD9511/
AD9512/AD9513/
AD9514/AD9515
CLOCK
INPUT
CLOCK
INPUT
50Ω
1
50Ω RESISTORS ARE OPTI ONAL.
0.1µF
CLK
0.1µF
50Ω
CLK
1
1
PECL DRIVER
0.1µF
CLK+
100Ω
0.1µF
240Ω240Ω
ADC
AD9230
CLK–
Figure 56. Differential PECL Sample Clock
AD9510/AD9511/
AD9512/AD9513/
AD9514/AD9515
CLOCK
INPUT
CLOCK
INPUT
50Ω
1
50Ω RESISTORS ARE O PTIONAL.
0.1µF
CLK
LVDS DRIVER
0.1µF
50Ω
CLK
1
1
Figure 57. Differential LVDS Sample Clock
0.1µF
100Ω
0.1µF
CLK+
ADC
AD9230
CLK–
1
50Ω RESISTOR IS OPTIONAL.
06002-071
Figure 58. Single-Ended 1.8 V CMOS Sample Clock
D9510/AD9511/
AD9512/AD9513/
AD9514/AD9515
CLK
CMOS DRIVER
CLK
OPTIONAL
100Ω
0.1µF
0.1µF
CLK+
ADC
AD9230
CLK–
06002-072
50Ω
0.1µF
0.1µF
1
CLOCK
INPUT
1
50Ω RESISTOR IS OPTIONAL.
Figure 59. Single-Ended 3.3 V CMOS Sample Clock
Clock Duty Cycle Considerations
Typical high speed ADCs use both clock edges to generate a
variety of internal timing signals. As a result, these ADCs may
be sensitive to clock duty cycle. Commonly, a 5% tolerance is
required on the clock duty cycle to maintain dynamic performance
characteristics. The AD9230 contains a duty cycle stabilizer (DCS)
06002-061
that retimes the nonsampling edge, providing an internal clock
signal with a nominal 50% duty cycle. This allows a wide range
of clock input duty cycles without affecting the performance of
the AD9230. When the DCS is on, noise and distortion performance are nearly flat for a wide range of duty cycles. However,
some applications may require the DCS function to be off. If so,
keep in mind that the dynamic range performance can be affected
when operated in this mode. See the
Using the SPI
section for more details on using this feature.
AD9230 Configuration
The duty cycle stabilizer uses a delay-locked loop (DLL) to
create the nonsampling edge. As a result, any changes to the
06002-070
sampling frequency require approximately eight clock cycles
to allow the DLL to acquire and lock to the new rate.
Rev. 0 | Page 22 of 32
AD9230
Clock Jitter Considerations
High speed, high resolution ADCs are sensitive to the quality of the
clock input. The degradation in SNR at a given input frequency
(f
) due only to aperture jitter (tJ) can be calculated by
A
SNR Degradation = 20 × log
[1/2 × π × fA × tJ]
10
In this equation, the rms aperture jitter represents the root mean
square of all jitter sources, including the clock input, analog input
signal, and ADC aperture jitter specifications. IF undersampling
applications are particularly sensitive to jitter (see
Figure 60).
The clock input should be treated as an analog signal in cases
where aperture jitter may affect the dynamic range of the AD9230.
Power supplies for clock drivers should be separated from the
ADC output driver supplies to avoid modulating the clock signal
with digital noise. Low jitter, crystal-controlled oscillators make
the best clock sources. If the clock is generated from another
type of source (by gating, dividing, or other methods), it should
be retimed by the original clock at the last step.
Refer to the
AN-501 Application Noteand the AN-756
Application Note for more in-depth information about jitter
performance as it relates to ADCs (visit
130
RMS CLOCK JITTER REQUIREMENT
120
110
100
90
80
SNR (dB)
70
10 BITS
60
8 BITS
50
40
30
1101001000
Figure 60. Ideal SNR vs. Input Frequency and Jitter
ANALOG INP UT FREQUENCY (MHz)
0.125ps
0.25ps
www.analog.com).
0.5ps
1.0ps
2.0ps
16 BITS
14 BITS
12 BITS
06002-065
POWER DISSIPATION AND POWER-DOWN MODE
As shown in Figure 42, the power dissipated by the AD9230 is
proportional to its sample rate. The digital power dissipation
does not vary much because it is determined primarily by the
DRVDD supply and bias current of the LVDS output drivers.
By asserting PDWN (Pin 29) high, the AD9230 is placed in
standby mode or full power-down mode, as determined by the
contents of Serial Port Register 08. Reasserting the PDWN pin
low returns the AD9230 into its normal operational mode.
An additional standby mode is supported by means of varying
the clock input. When the clock rate falls below 20 MHz, the
AD9230 assumes a standby state. In this case, the biasing network
and internal reference remain on, but digital circuitry is powered
down. Upon reactivating the clock, the AD9230 resumes normal
operation after allowing for the pipeline latency.
DIGITAL OUTPUTS
Digital Outputs and Timing
The AD9230 differential outputs conform to the ANSI-644
LVDS standard on default power-up. This can be changed to a
low power, reduced signal option similar to the IEEE 1596.3
standard using the SPI. This LVDS standard can further reduce
the overall power dissipation of the device, which reduces the
power by ~39 mW. See the
information. The LVDS driver current is derived on-chip and
sets the output current at each output equal to a nominal
3.5 mA. A 100 Ω differential termination resistor placed at the
LVDS receiver inputs results in a nominal 350 mV swing at the
receiver.
The AD9230 LVDS outputs facilitate interfacing with LVDS
receivers in custom ASICs and FPGAs that have LVDS capability
for superior switching performance in noisy environments.
Single point-to-point net topologies are recommended with a
100 Ω termination resistor placed as close to the receiver as
possible. No far-end receiver termination and poor differential
trace routing may result in timing errors. It is recommended
that the trace length is no longer than 24 inches and that the
differential output traces are kept close together and at equal
lengths.
An example of the LVDS output using the ANSI standard (default)
data eye and a time interval error (TIE) jitter histogram with
trace lengths less than 24 inches on regular FR-4 material is
shown in
Figure 61. Figure 62 shows an example of when the
trace lengths exceed 24 inches on regular FR-4 material. Notice
that the TIE jitter histogram reflects the decrease of the data eye
opening as the edge deviates from the ideal position. It is up to
the user to determine if the waveforms meet the timing budget
of the design when the trace lengths exceed 24 inches.
500
400
300
200
100
0
–100
–200
–300
EYE DIAG RAM: V OLTAGE (mV )
–400
–500
–3 –2 –1 01 2 3
Figure 61. Data Eye for LVDS Outputs in ANSI Mode with Trace Lengths Less
TIME (ns)
than 24 Inches on Standard FR-4, AD9230-250
Memory Map section for more
14
12
10
8
6
4
TIE JIT TER HIST OGRAM (Hi ts)
2
0
–40–2002040
TIME (ps)
Rev. 0 | Page 23 of 32
AD9230
O
600
400
200
0
–200
EYE DIAGRAM: VOLTAGE (mV)
–400
–600
–3 –2 –1 01 23
Figure 62. Data Eye for LVDS Outputs in ANSI Mode with Trace Lengths
TIME (ns)
Greater than 24 Inches on Standard FR-4, AD9230-250
12
10
8
6
4
TIE JIT TER HIST OGRAM (Hi ts)
2
0
–1000100
TIME (ps)
The format of the output data is offset binary by default. An
example of the output coding format can be found in
Tabl e 12 .
If it is desired to change the output data format to twos complement, see the
AD9230 Configuration Using the SPI section.
An output clock signal is provided to assist in capturing data
from the AD9230. The DCO is used to clock the output data
and is equal to the sampling clock (CLK) rate. In single data rate
mode (SDR), data is clocked out of the AD9230 and must be
captured on the rising edge of the DCO. In double data rate
mode (DDR), data is clocked out of the AD9230 and must be
captured on the rising and falling edges of the DCO See the
timing diagrams shown in
Figure 2 and Figure 3 for more
information.
Output Data Rate and Pinout Configuration
The output data of the AD9230 can be configured to drive 12
pairs of LVDS outputs at the same rate as the input clock signal
(single data rate, or SDR, mode), or six pairs of LVDS outputs at
2× the rate of the input clock signal (double data rate, or DDR,
mode). SDR is the default mode; the device may be reconfigured
for DDR by setting Bit 3 in Register 14 (see
Tabl e 1 3 ).
Out-of-Range (OR)
An out-of-range condition exists when the analog input voltage
is beyond the input range of the ADC. OR is a digital output
that is updated along with the data output corresponding to the
particular sampled input voltage. Thus, OR has the same
pipeline latency as the digital data. OR is low when the analog
input voltage is within the analog input range and high when
the analog input voltage exceeds the input range, as shown in
Figure 63. OR remains high until the analog input returns to
within the input range and another conversion is completed. By
logically AND-ing OR with the MSB and its complement, overrange high or underrange low conditions can be detected.
R DATA OUT PUTS
1111
1
1111
1111
1111
0000
0000
0000
1111
1111
1110
0001
0000
0000
0
1111
1111
0
0
0000
0
0000
1
0000
Figure 63. OR Relation to Input Voltage and Output Data
OR
–FS + 1/2 L SB
–FS – 1/2 LSB
+FS – 1 LSB
+FS–FS
+FS – 1/2 L SB
06002-062
TIMING
The AD9230 provides latched data outputs with a pipeline delay
of seven clock cycles. Data outputs are available one
propagation delay (t
) after the rising edge of the clock signal.
PD
The length of the output data lines and loads placed on them
should be minimized to reduce transients within the AD9230.
These transients can degrade the converter’s dynamic performance.
The AD9230 also provides data clock output (DCO) intended for
capturing the data in an external register. The data outputs are valid
on the rising edge of DCO.
The lowest typical conversion rate of the AD9230 is 40 MSPS.
At clock rates below 1 MSPS, the AD9230 assumes the standby
mode.
RBIAS
The AD9230 requires the user to place a 10 k resistor between
the RBIAS pin and ground. This resister should have a 1%
tolerance and is used to set the master current reference of the
ADC core.
AD9230 CONFIGURATION USING THE SPI
The AD9230 SPI allows the user to configure the converter for
specific functions or operations through a structured register
space inside the ADC. This gives the user added flexibility to
customize device operation depending on the application.
Addresses are accessed (programmed or readback) serially in
one-byte words. Each byte may be further divided down into
fields, which are documented in the
There are three pins that define the serial port interface or SPI
to this particular ADC. They are the SPI SCLK/DFS, SPI
SDIO/DCS, and CSB pins. The SCLK/DFS (serial clock) is used
to synchronize the read and write data presented the ADC. The
SDIO/DCS (serial data input/output) is a dual-purpose pin that
allows data to be sent and read from the internal ADC memory
map registers. The CSB is an active low control that enables or
disables the read and write cycles (see
Memory Map section.
Tabl e 9).
Rev. 0 | Page 24 of 32
AD9230
Table 9. Serial Port Pins
Mnemonic Function
SCLK
SCLK (Serial Clock) is the serial shift clock in.
SCLK is used to synchronize serial interface
reads and writes.
SDIO
SDIO (Serial Data Input/Output) is a dual-purpose
pin. The typical role for this pin is an input and
output depending on the instruction being sent
and the relative position in the timing frame.
CSB
CSB (Chip Select Bar) is active low controls that
gates the read and write cycles.
RESET
Master Device Reset. When asserted, device
assumes default settings. Active low.
The falling edge of the CSB, in conjunction with the rising edge
of the SCLK, determines the start of the framing. An example of
the serial timing and its definitions can be found in
and
Tabl e 11 .
Figure 64
During an instruction phase, a 16-bit instruction is transmitted.
Data then follows the instruction phase and is determined by
the W0 and W1 bits, which is 1 or more bytes of data. All data is
composed of 8-bit words. The first bit of each individual byte of
serial data indicates whether this is a read or write command.
This allows the serial data input/output (SDIO) pin to change
direction from an input to an output.
Data may be sent in MSB or in LSB first mode. MSB first is
default on power-up and can be changed by changing the
configuration register. For more information about this feature
and others, see Interfacing to High Speed ADCs via SPI at
www.analog.com.
HARDWARE INTERFACE
The pins described in Ta b l e 9 comprise the physical interface
between the user’s programming device and the serial port of
the AD9230. All serial pins are inputs, which is an open-drain
output and should be tied to an external pull-up or pull-down
resistor (suggested value of 10 kΩ).
This interface is flexible enough to be controlled by either
PROMS or PIC mirocontrollers as well. This provides the user
with an alternate method to program the ADC other than a SPI
controller.
If the user chooses not to use the SPI interface, some pins serve
a dual function and are associated with a specific function when
strapped externally to AVDD or ground during device power
on. The
Configuration Without the SPI section describes the
strappable functions supported on the AD9230.
CONFIGURATION WITHOUT THE SPI
In applications that do not interface to the SPI control registers,
the SPI SDIO/DCS and SPI SCLK/DFS pins can alternately
serve as standalone CMOS-compatible control pins. When the
device is powered up, it is assumed that the user intends to use
the pins as static control lines for the duty cycle stabilizer. In
this mode, the SPI CSB chip select should be connected to
ground, which disables the serial port interface.
tDS 5 Setup time between the data and the rising edge of SCLK
tDH 2 Hold time between the data and the rising edge of SCLK
t
40 Period of the clock
CLK
tS 5 Setup time between CSB and SCLK
tH 2 Hold time between CSB and SCLK
tHI 16 Minimum period that SCLK should be in a logic high state
tLO 16 Minimum period that SCLK should be in a logic low state
t
Minimum time for the SDIO pin to switch from an input to an output relative to the SCLK
falling edge (not shown in
Figure 64)
Minimum time for the SDIO pin to switch from an output to an input relative to the SCLK
rising edge (not shown in
Offset Binary
Output Mode
D11 to D0
Figure 64)
Twos Complement Mode
D11 to D0
Gray Code Mode
(SPI Accessible)
D11 to D0
OR
Rev. 0 | Page 26 of 32
AD9230
MEMORY MAP
READING THE MEMORY MAP TABLE
Each row in the memory map table has eight address locations.
The memory map is roughly divided into three sections: chip
configuration register map (Address 0x00 to Address 0x02),
transfer register map (Address 0xFF), and program register map
(Address 0x08 to Address 0x2A).
The Addr. (Hex) column of the memory map indicates the
register address in hexadecimal, and the Default Value (Hex)
column shows the default hexadecimal value that is already
written into the register The Bit 7 (MSB) column is the start of
the default hexadecimal value given. For example, Hexadecimal
Address 0x09, clock, has a hexadecimal default value of 0x01.
This means Bit 7 = 0, Bit 6 = 0, Bit 5 = 0, Bit 4 = 0, Bit 3 = 0,
Bit 2 = 0, Bit 1 = 0, and Bit 0 = 1, or 0000 0001 in binary. The
default value enables the duty cycle stabilizer. Overwriting this
default so that Bit 0 = 0 disables the duty cycle stabilizer. For more
information on this and other functions, consult the Inter facing to High-Speed ADCs via SPI® user manual at www.analog.com.
Table 13. Memory Map Register
Addr.
(Hex)
Chip Configuration Registers
00 chip_port_config 0 LSB
01 chip_id 8-bit chip ID, Bits[7:0]
02 chip_grade 0 0 0 Speed grade:
Transfer Register
FF device_update 0 0 0 0 0 0 0 SW
Parameter Name
Bit 7
(MSB)
Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1
first
Soft
reset
1 1 Soft
AD9230 = 0x0C
00 = 250 MSPS
01 = 210 MSPS
10 = 170 MSPS
RESERVED LOCATIONS
Undefined memory locations should not be written to other
than their default values suggested in this data sheet. Addresses
that have values marked as 0 should be considered reserved and
have a 0 written into their registers during power-up.
DEFAULT VALUES
Coming out of reset, critical registers are preloaded with default
values. These values are indicated in Table 13. Other registers
do not have default values and retain the previous value when
exiting reset.
LOGIC LEVELS
An explanation of various registers follows: “Bit is set” is
synonymous with “bit is set to Logic 1” or “writing Logic 1 for
the bit.” Similarly, “clear a bit” is synonymous with “bit is set to
Logic 0” or “writing Logic 0 for the bit.”
Default
Bit 0
(LSB)
LSB first 0 0x18 The nibbles
reset
X X X Read-
transfer
Value
(Hex)
Read-
only
only
0x00 Synchronously
Default Notes/
Comments
should be
mirrored by the
user so that LSB
or MSB first
mode registers
correctly,
regardless of
shift mode.
Default is unique
chip ID, different
for each device.
This is a readonly register.
Child ID used to
differentiate
graded devices.
transfers data
from the master
shift register to
the slave.