Flexible CMOS interface allows dual-word, word, or byte load
Single-carrier W-CDMA ACLR = 80 dBc at 122.88 MHz IF
Analog output: adjustable 8.7 mA to 31.7 mA, R
Novel 2×/4×/8× interpolator/complex modulator allows
carrier placement anywhere in the DAC bandwidth
Gain and phase adjustment for sideband suppression
Multichip synchronization interface
High performance, low noise PLL clock multiplier
Digital inverse sinc filter
Low power: 900 mW at 500 MSPS, full operating conditions
72-lead, exposed paddle LFCSP
APPLICATIONS
Wireless infrastructure
W-CDMA, CDMA2000, TD-SCDMA, WiMAX, GSM, LTE
Digital high or low IF synthesis
Transmit diversity
Wideband communications: LMDS/MMDS, point-to-point
Cable modem termination systems
= 25 Ω to 50 Ω
L
AD9125
GENERAL DESCRIPTION
The AD9125 is a dual, 16-bit, high dynamic range TxDAC+®
digital-to-analog converter (DAC) that provides a sample rate of
1000 MSPS, permitting a multicarrier generation up to the Nyquist
frequency. It includes features optimized for direct conversion
transmit applications, including complex digital modulation,
and gain and offset compensation. The DAC outputs are optimized
to interface seamlessly with analog quadrature modulators, such
as the ADL537x F-MOD series from Analog Devices, Inc. A 4-wire
serial port interface allows programming/readback of many internal parameters. Full-scale output current can be programmed
over a range of 8.7 mA to 31.7 mA. The AD9125 comes in a
72-lead LFCSP.
PRODUCT HIGHLIGHTS
1. Ultralow noise and intermodulation distortion (IMD)
enable high quality synthesis of wideband signals from
baseband to high intermediate frequencies.
2. A proprietary DAC output switching technique enhances
dynamic performance.
3. The current outputs are easily configured for various
single-ended or differential circuit topologies.
4. The flexible CMOS digital interface allows the standard
32-wire bus to be reduced to a 16-wire bus.
TYPICAL SIGNAL CHAIN
COMPLEX BAS EBAND
DC
2
DIGITAL
BASEBAND
PROCESSOR
NOTES
1. AQM = ANALOG QUADRATURE MODULATOR.
SIN
COS
2
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Differential Nonlinearity (DNL) ±2.1 LSB
Integral Nonlinearity (INL) ±3.7 LSB
MAIN DAC OUTPUTS
Offset Error −0.001 0 +0.001 % FSR
Gain Error (with Internal Reference) −3.6 ±2 +3.6 % FSR
Full-Scale Output Current1 8.66 19.6 31.66 mA
Output Compliance Range −1.0 +1.0 V
Output Resistance 10 MΩ
Gain DAC Monotonicity Guaranteed
Settling Time to Within ±0.5 LSB 20 ns
MAIN DAC TEMPERATURE DRIFT
Offset 0.04 ppm/°C
Gain 100 ppm/°C
Reference Voltage 30 ppm/°C
REFERENCE
Internal Reference Voltage 1.2 V
Output Resistance 5 kΩ
ANALOG SUPPLY VOLTAGES
AVDD33 3.13 3.3 3.47 V
CVDD18 1.71 1.8 1.89 V
DIGITAL SUPPLY VOLTAGES
DVDD18 1.71 1.8 1.89 V
IOVDD 1.71 1.8/3.3 3.47 V
POWER CONSUMPTION
2× Mode, f
2× Mode, f
8× Mode, f
AVDD33 55 58 mA
CVDD18 78 85 mA
DVDD18 440 490 mA
Power-Down Mode 1.5 2.7 mW
Power Supply Rejection Ratio, AVDD33 −0.3 +0.3 % FSR/V
D[31:0], FRAME, DCI EPAD, DVSS −0.3 V to DVDD18 + 0.3 V
DACCLKP/DACCLKN,
REFCLKP/REFCLKN
RESET, IRQ, CS, SCLK,
SDIO, SDO
Junction Temperature 125°C
Storage Temperature
Range
Respect To Rating
AVSS, EPAD,
CVSS, DVSS
AVSS, EPAD,
CVSS, DVSS
AVSS, EPAD,
CVSS, DVSS
EPAD, CVSS,
DVSS
AVSS, CVSS,
DVSS
AVSS, EPAD,
DVSS
AVSS, EPAD,
CVSS
AVSS −0.3 V to AVDD33 + 0.3 V
DVSS −0.3 V to CVDD18 + 0.3 V
EPAD, DVSS −0.3 V to IOVDD + 0.3 V
−65°C to +150°C
−0.3 V to +3.6 V
−0.3 V to +3.6 V
−0.3 V to +2.1 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
−0.3 V to +0.3 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle (EPAD) must be soldered to the ground
plane for the 72-lead LFCSP. The EPAD performs as an
electrical and thermal connection to the board.
Typical θ
, θJB, and θJC values are specified for a 4-layer board in
JA
still air. Airflow increases heat dissipation, effectively reducing
θ
Interrupt Request. Open Drain, Active Low Output. Connect external pull-up to IOVDD.
8 D31 Data Bit 31.
9 D30 Data Bit 30.
10 NC No Connect.
11 IOVDD
Supply for Serial Port Pin, RESET
Pin, and IRQ Pin. 1.8 V to 3.3 V can be applied to this pin.
12 DVDD18 1.8 V Digital Supply. Supplies power to digital core and digital data ports.
13 D29 Data Bit 29.
14 D28 Data Bit 28.
15 D27 Data Bit 27.
16 D26 Data Bit 26.
17 D25 Data Bit 25.
18 D24 Data Bit 24.
19 D23 Data Bit 23.
20 D22 Data Bit 22.
21 D21 Data Bit 21.
22 D20 Data Bit 20.
23 D19 Data Bit 19.
24 D18 Data Bit 18.
25 D17 Data Bit 17.
26 D16 Data Bit 16.
27 DCI Data Clock Input.
Rev. 0 | Page 8 of 56
AD9125
Pin No. Mnemonic Description
28 NC No Connect.
29 DVDD18 1.8 V Digital Supply.
30 DVSS Digital Common.
31 D15 Data Bit 15.
32 D14 Data Bit 14.
33 D13 Data Bit 13.
34 D12 Data Bit 12.
35 D11 Data Bit 11.
36 D10 Data Bit 10.
37 D9 Data Bit 9.
38 D8 Data Bit 8.
39 D7 Data Bit 7.
40 D6 Data Bit 6.
41 D5 Data Bit 5.
42 D4 Data Bit 4.
43 DVDD18 1.8 V Digital Supply.
44 DVSS Digital Supply Common.
45 D3 Data Bit 3.
46 D2 Data Bit 2.
47 D1 Data Bit 1.
48 D0 Data Bit 0.
49 DVDD18 1.8 V Digital Supply.
50 SDO Serial Port Data Output (CMOS levels with respect to IOVDD).
51 SDIO Serial Port Data Input/Output (CMOS levels with respect to IOVDD).
52 SCLK Serial Port Clock Input (CMOS levels with respect to IOVDD).
53
54
55 NC No Connect.
56 AVSS Analog Supply Common.
57 AVDD33 3.3 V Analog Supply.
58 IOUT2P Q DAC Positive Current Output.
59 IOUT2N Q DAC Negative Current Output.
60 AVDD33 3.3 V Analog Supply.
61 AVSS Analog Supply Common.
62 REFIO Voltage Reference. Nominally 1.2 V output. Should be decoupled to analog common.
63 FSADJ Full-Scale Current Output Adjust. Place a 10 kΩ resistor on the analog common.
64 AVSS Analog Common.
65 AVDD33 3.3 V Analog Supply.
66 IOUT1N I DAC Negative Current Output.
67 IOUT1P I DAC Positive Current Output.
68 AVDD33 3.3 V Analog Supply.
69 REFCLKN PLL Reference Clock Input, Negative. This pin has a secondary function as the SYNC input.
70 REFCLKP PLL Reference Clock Input, Positive. This pin has a secondary function as the SYNC input.
71 CVDD18 1.8 V Clock Supply. Supplies clock receivers, clock distribution, and PLL circuitry.
72 CVDD18 1.8 V Clock Supply. Supplies clock receivers, clock distribution, and PLL circuitry.
EPAD
CS
RESET
Serial Port Chip Select. Active Low (CMOS levels with respect to IOVDD).
Reset. Active Low (CMOS levels with respect to IOVDD).
Exposed pad must be connected to AVSS. This provides an electrical, thermal, and mechanical connection
to the PCB.
Rev. 0 | Page 9 of 56
AD9125
TYPICAL PERFORMANCE CHARACTERISTICS
0
f
= 125MSPS, S E COND HARMONIC
DATA
f
–10
–20
–30
–40
–50
–60
HARMONICS (dBc)
–70
–80
–90
–100
050100150200250300
Figure 4. Harmonics vs. f
= 125MSPS, THIRD HARMONIC
DATA
f
= 250MSPS, S E COND HARMONIC
DATA
f
= 250MSPS, THIRD HARMONIC
DATA
f
(MHz)
OUT
over f
OUT
Digital Scale = 0 dBFS, f
, 2× Interpolation,
DATA
= 20 mA
SC
09016-101
–50
–55
–60
–65
–70
–75
HARMONICS (dBc)
–80
–85
–90
Figure 7. Second Harmonic vs. f
0dBFS
–6dBFS
–12dBFS
–18dBFS
0 50 100150200250300
f
(MHz)
OUT
over Digital Scale, 2× Interpolation,
OUT
= 250 MSPS, fSC = 20 mA
f
DATA
09016-104
0
f
= 125MSPS, S E COND HARMONIC
DATA
f
–10
–20
–30
–40
–50
–60
HARMONICS (d Bc)
–70
–80
–90
–100
0100200300400500600
Figure 5. Harmonics vs. f
0
–10
–20
–30
–40
–50
–60
HARMONICS (dBc)
–70
–80
–90
–100
0100200300400500600
Figure 6. Harmonics vs. f
= 125MSPS, THIRD HARMONIC
DATA
f
= 250MSPS, S E COND HARMONIC
DATA
f
= 250MSPS, THIRD HARMONIC
DATA
f
(MHz)
OUT
over f
OUT
Digital Scale = 0 dBFS, f
f
= 125MSPS, S E COND HARMONIC
DATA
f
= 125MSPS, THIRD HARMONIC
DATA
f
(MHz)
OUT
over f
OUT
Digital Scale = 0 dBFS, f
, 4× Interpolation,
DATA
= 20 mA
SC
, 8× Interpolation,
DATA
= 20 mA
SC
–50
–55
–60
–65
–70
–75
–80
HARMONICS (d Bc)
–85
–90
–95
–100
09016-102
Figure 8. Third Harmonic vs. f
–50
–55
–60
–65
–70
–75
–80
HARMONICS (dBc)
–85
–90
–95
09016-103
0dBFS
–6dBFS
–12dBFS
–18dBFS
0 50 100150200250300
f
(MHz)
OUT
over Digital Scale, 2× Interpolation,
OUT
= 250 MSPS, fSC = 20 mA
f
DATA
10mA, SECOND HARMONI C
20mA, SECOND HARMONI C
30mA, SECOND HARMONI C
10mA, THIRD HARMONIC
20mA, THIRD HARMONIC
30mA, THIRD HARMONIC
Figure 35. One-Carrier W-CDMA ACLR Performance, IF ≈150 MHz
Rev. 0 | Page 15 of 56
AD9125
TERMINOLOGY
Integral Nonlinearity (INL)
INL is defined as the maximum deviation of the actual analog
output from the ideal output, determined by a straight line drawn
from zero scale to full scale.
Differential Nonlinearity (DNL)
DNL is the measure of the variation in analog value, normalized
to full scale, associated with a 1 LSB change in digital input code.
Offset Error
The deviation of the output current from the ideal of zero is
called offset error. For IOUT1P, 0 mA output is expected when
the inputs are all 0s. For IOUT1N, 0 mA output is expected
when all inputs are set to 1.
Gain Error
The difference between the actual and ideal output span. The
actual span is determined by the difference between the outputs
when all inputs are set to 1 vs. when all inputs are set to 0.
Output Compliance Range
The range of allowable voltage at the output of a current output
DAC. Operation beyond the maximum compliance limits can
cause either output stage saturation or breakdown, resulting in
nonlinear performance.
Temp er at u re D ri ft
Temperature drift is specified as the maximum change from
the ambient (25°C) value to the value at either T
MIN
or T
MAX
.
For offset and gain drift, the drift is reported in ppm of fullscale range (FSR) per degree Celsius. For reference drift, the
drift is reported in ppm per degree Celsius.
Power Supply Rejection (PSR)
The maximum change in the full-scale output as the supplies
are varied from minimum to maximum specified voltages.
Settling Time
The time required for the output to reach and remain within a
specified error band around its final value, measured from
the start of the output transition.
Spurious-Free Dynamic Range (SFDR)
The difference in decibels between the peak amplitude of the
output signal and the peak spurious signal within the dc to the
Nyquist frequency of the DAC. Typically, energy in this band is
rejected by the interpolation filters. This specification, therefore,
defines how well the interpolation filters work and the effect of
other parasitic coupling paths to the DAC output.
Signal-to-Noise Ratio (SNR)
SNR is the ratio of the rms value of the measured output signal
to the rms sum of all other spectral components below the Nyquist
frequency, excluding the first six harmonics and dc. The value
for SNR is expressed in decibels.
Interpolation Filter
If the digital inputs to the DAC are sampled at a multiple rate of
f
(interpolation rate), a digital filter can be constructed that
DATA
has a sharp transition band near f
appear around f
(output data rate) can be greatly suppressed.
DAC
/2. Images that typically
DATA
Adjacent Channel Leakage Ratio (ACLR)
The ratio in decibels relative to the carrier (dBc) between the
measured power within a channel and that of its adjacent channel.
Complex Image Rejection
In a traditional two-part upconversion, two images are created
around the second IF frequency. These images have the effect
of wasting transmitter power and system bandwidth. By placing
the real part of a second complex modulator in series with the
first complex modulator, either the upper or lower frequency
image near the second IF can be rejected.
DATA
DCI
LATCH
INPUT
f
INTERFACE
DATA
FORMAT
32
WRITE
POINTER
16
2
FIFO
16
2
READ
POINTER
f
/
f
DATA
HB1
Figure 36. Defining Data Rates
Rev. 0 | Page 16 of 56
f
SIN
NCO
COS
CLOCK GENERATOR
AND DISTRIBUTOR
/
f
NCO
HB2
16
22
22
f
HB3
I DAC
16
Q DAC
DACCLK
f
DAC
09016-136
AD9125
THEORY OF OPERATION
The AD9125 combines many features that make it a very attractive
DAC for wired and wireless communications systems. The dual
digital signal path and dual DAC structure allow an easy interface
to common quadrature modulators when designing single
sideband transmitters. The speed and performance of the AD9125
allows wider bandwidths and more carriers to be synthesized than
in previously available DACs. In addition, these devices include an
innovative low power, 32-bit, complex NCO that greatly increases
the ease of frequency placement.
The AD9125 offers features that allow simplified synchronization
with incoming data and between multiple devices. Auxiliary
DACs are also provided on chip for output dc offset compensation
(for local oscillator [LO] compensation in single sideband [SSB]
transmitters) and for gain matching (for image rejection
optimization in SSB transmitters).
SERIAL PORT OPERATION
The serial port is a flexible, synchronous serial communication
port, allowing easy interface to many industry-standard microcontrollers and microprocessors. The serial I/O is compatible
with most synchronous transfer formats, including both the
Motorola SPI® and Intel® SSR protocols. The interface allows
read/write access to all registers that configure the AD9125.
Single- or multiple-byte transfers are supported, as well as MSBfirst or LSB-first transfer formats. The serial interface ports can
be configured as a single-pin I/O (SDIO) or two unidirectional
pins for input/output (SDIO/SDO).
50
SDO
51
SDIO
SCLK
Figure 37. Serial Port Interface Pins
There are two phases of a communication cycle with the
AD9125. Phase 1 is the instruction cycle (the writing of an
instruction byte into the device), which is coincident with the
first eight SCLK rising edges. The instruction byte provides the
serial port controller with information regarding the data
transfer cycle, which is Phase 2 of the communication cycle.
The Phase 1 instruction byte defines whether the upcoming
data transfer is a read or write and the starting register address
for the first byte of the data transfer. The first eight SCLK rising
edges of each communication cycle are used to write the
instruction byte into the device.
A logic high on the
CS
pin followed by a logic low resets the
serial port timing to the initial state of the instruction cycle.
From this state, the next eight rising SCLK edges represent the
instruction bits of the current I/O operation.
CS
SPI
PORT
52
53
09016-010
The remaining SCLK edges are for Phase 2 of the communication
cycle. Phase 2 is the actual data transfer between the device and
the system controller. Phase 2 of the communication cycle is a
transfer of one or more data bytes. Registers change immediately
upon writing to the last bit of each transfer byte, except for the
frequency tuning word and NCO phase offsets, which only change
when the frequency update bit (Register 0x36, Bit 0) is set.
DATA FORMAT
The instruction byte contains the information shown in Tab l e 9 .
Table 9. Serial Port Instruction Byte
I7 (MSB) I6 I5 I4 I3 I2 I1 I0 (LSB)
R/W
A6 A5 A4 A3 A2 A1 A0
R/W, Bit 7 of the instruction byte, determines whether a read or
write data transfer occurs after the instruction byte write. Logic 1
indicates a read operation, and Logic 0 indicates a write
operation.
A6 to A0, Bit 6 to Bit 0 of the instruction byte, determine the
register that is accessed during the data transfer portion of the
communication cycle. For multibyte transfers, A6 is the starting
byte address. The remaining register addresses are generated by
the device based on the LSB_FIRST bit (Register 0x00, Bit 6).
SERIAL PORT PIN DESCRIPTIONS
Serial Clock (SCLK)
The serial clock pin synchronizes data to and from the device
and runs the internal state machines. The maximum frequency
of SCLK is 40 MHz. All data input is registered on the rising
edge of SCLK. All data is driven out on the falling edge of SCLK.
Chip Select (
An active low input starts and gates a communication cycle.
It allows more than one device to be used on the same serial
communication lines. The SDO and SDIO pins go to a high
impedance state when this input is high. During the
communication cycle, the
Serial Data I/O (SDIO)
Data is always written into the device on this pin. However, this
pin can be used as a bidirectional data line. The configuration
of this pin is controlled by Register 0x00, Bit 7. The default is
Logic 0, configuring the SDIO pin as unidirectional.
Serial Data Out (SDO)
Data is read from this pin for protocols that use separate lines
for transmitting and receiving data. In the case where the device
operates in a single bidirectional I/O mode, this pin does not
output data and is set to a high impedance state.
CS
)
CS
pin should stay low.
Rev. 0 | Page 17 of 56
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