Unity-gain bandwidth: 5.5 MHz
Low voltage offset: 1.0 mV
Slew rate: 7.5 V/μs
Single-supply operation: 5 V to 18 V
High output current: 70 mA
Low supply current: 800 μA/amplifier
Stable with large capacitive loads
Rail-to-rail inputs and outputs
APPLICATIONS
LCD gamma and V
Modems
Portable instrumentation
Direct access arrangement
GENERAL DESCRIPTION
The AD8614 (single) and AD8644 (quad) are single-supply,
5.5 MHz bandwidth, rail-to-rail amplifiers optimized for LCD
monitor applications.
They are processed using the Analog Devices, Inc. high voltage,
extra fas
proprietary process includes trench-isolated transistors that
lower internal parasitic capacitance, which improves gain
bandwidth, phase margin, and capacitive load drive. The low
supply current of 800 μA (typical) per amplifier is critical for
portable or densely packed designs. In addition, the rail-to-rail
output swing provides greater dynamic range and control than
standard video amplifiers provide.
These products operate from supplies of 5 V to as high as 18 V.
T
slew rates, and high capacitive drive capability makes the
AD8614/AD8644 an ideal choice for LCD applications.
The AD8614 and AD8644 are specified over the temperature
ra
14-lead TSSOP, and 14-lead SOIC surface-mount packages in
tape and reel.
t complementary bipolar (HV XFCB) process. This
he unique combination of an output drive of 70 mA, high
nge of –20°C to +85°C. They are available in 5-lead SOT-23,
COM
drivers
Operational Amplifiers
AD8614/AD8644
PIN CONFIGURATIONS
1
OUT A
V–
+IN
AD8614
2
TOP VIEW
(Not to Scale)
3
Figure 1. 5-Lead SOT-23
(RJ-5)
1
OUT A
2
–IN A
3
V+
AD8644
TOP VIEW
4
(Not to Scale)
5
6
7
+IN A
+IN B
–IN B
OUT B
Figure 2. 14-Lead TSSOP
(R
U-14)
OUT A
1
–IN A
2
+IN A
3
AD8644
TOP VIEW
4
V+
(Not to Scale)
5
+IN B
–IN B
6
OUT B
7
Figure 3. 14-Lead Narrow Body SOIC
(R
-14)
14
13
12
11
10
14
13
12
11
10
9
8
9
8
V+
5
4
–IN
OUT D
–IN D
+IN D
V–
+IN C
–IN C
OUT C
OUT D
–IN D
+IN D
V–
+IN C
–IN C
OUT C
06485-001
6485-002
06485-003
Rev. B
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
5 V ≤ VS ≤ 18 V, VCM = VS/2, TA = 25°C, unless otherwise noted.
Table 1.
Parameter Symbol Conditions Min Typ Max Unit
INPUT CHARACTERISTICS
Offset Voltage VOS 1.0 2.5 mV
−20°C ≤ TA ≤ +85°C 3 mV
Input Bias Current IB 80 400 nA
−20°C ≤ TA ≤ +85°C 500 nA
Input Offset Current IOS 5 100 nA
−20°C ≤ TA ≤ +85°C 200 nA
Input Voltage Range 0 VS V
Common-Mode Rejection Ratio CMRR VCM = 0 V to VS 60 75 dB
Voltage Gain AVO V
OUTPUT CHARACTERISTICS
Output Voltage High VOH I
Output Voltage Low VOL I
Output Short-Circuit Current ISC 35 70 mA
−20°C ≤ TA ≤ +85°C 30 mA
POWER SUPPLY
Power Supply Rejection Ratio PSRR VS = ±2.25 V to ±9.25 V 80 110 dB
Supply Current/Amplifier ISY 0.8 1.1 mA
−20°C ≤ TA ≤ +85°C 1.5 mA
DYNAMIC PERFORMANCE
Slew Rate SR CL = 200 pF 7.5 V/μs
Gain Bandwidth Product GBP 5.5 MHz
Phase Margin Φo 65 Degrees
Settling Time tS 0.01%, 10 V step 3 μs
NOISE PERFORMANCE
Voltage Noise Density en f = 1 kHz 12 nV/√Hz
e
Current Noise Density in f = 10 kHz 1 pA/√Hz
1
All typical values are for VS = 18 V.
f = 10 kHz 11 nV/√Hz
n
OUT
LOAD
LOAD
1
= 0.5 V to VS – 0.5 V, RL = 10 kΩ 10 150 V/mV
= 10 mA VS − 0.15 V
= 10 mA 65 150 mV
Rev. B | Page 3 of 16
AD8614/AD8644
www.BDTIC.com/ADI
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Supply Voltage 20 V
Input Voltage GND to VS
Storage Temperature Range −65°C to +150°C
Operating Temperature Range −20°C to +85°C
Junction Temperature Range −65°C to +150°C
Lead Temperature Range (Soldering, 60 sec) 300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.