1. PIN 4 AND THE E X P OSED PAD
MUST BE CONNECTED TO V–.
TOP VIEW
(Not to S cale)
AD8617
05622-035
1
2
3
4
5
6
7
AD8619
–IN A
+IN A
V+
OUT B
–IN B
+IN B
OUT A
14
13
1
2
11
10
9
8
–IN D
+IN D
V
–
OUT C
–IN C
+IN C
OUT D
TOP VIEW
(Not to Scale)
Data Sheet
FEATURES
Offset voltage: 2.2 mV maximum
Low input bias current: 1 pA maximum
Single-supply operation: 1.8 V to 5.5 V
Low noise: 22 nV/√Hz
Micropower: 50 µA/amplifier maximum over temperature
No phase reversal
Unity gain stable
Qualified for automotive applications
APPLICATIONS
Battery-powered instrumentation
Multipole filters
Current shunt sense
Sensors
ADC predrivers
DAC drivers/level shifters
Low power ASIC input or output amplifiers
Low Cost Micropower, Low Noise CMOS
PIN CONFIGURATIONS
Figure 1. 5-Lead SC70 and 5-Lead TSOT-23
Figure 2. 8-Lead MSOP and 8-Lead SOIC_N
GENERAL DESCRIPTION
The AD8613/AD8617/AD8619 are single, dual, and quad micropower, ra il-to-rail input and output amplifiers that feature low
supply current, as well as low input voltage and current noise.
The parts are fully specified to operate from 1.8 V to 5 V single
supply, or ±0.9 V and ±2.5 V dual supply. The combination of low
noise, very low input bias currents, and low power consumption
make the AD8613/AD8617/AD8619 especially useful in portable
and loop-powered instrumentation.
The ability to swing rail-to-rail at both the input and output
enables designers to buffer CMOS ADCs, DACs, ASICs, and
other wide output swing devices in low power, single-supply
systems.
The AD8613 is available in a 5-lead SC70 package and a 5-lead
TSOT-23 package. The AD8617 is available in 8-lead MSOP,
8-lead SOIC, and 8-lead LFCSP packages. The AD8619 is
available in 14-lead TSSOP and 14-lead SOIC packages. The
AD8617W is qualified for automotive applications and is
available in 8-lead MSOP and 8-lead SOIC packages. The
AD8619W is qualified for automotive applications and is
available in 14-lead SOIC and 14-lead TSSOP packages.
Figure 3. 8-Lead LFCSP_VD
Figure 4. 14-Lead TSSOP and 14-Lead SOIC
Rev. G Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Changes to Features Section, Figure 2 Caption, General
Description Section, and Figure 3 .................................................. 1
Changed V
Changes to Input Characteristics, Input Voltage Range
Parameter; Dynamic Performance, Settling Time to 0.1% and
Phase Margin Parameters; and Noise Performance, Peak-to-
Changes to Input Characteristics, Input Voltage Range
Parameter; Dynamic Performance, Settling Time to 0.1% and
Phase Margin Parameters; and Noise Performance, Peak-to-
Voltage Noise Density en f = 1 kHz 25 nV/√Hz
f = 10 kHz 22 nV/√Hz
Current Noise Density in f = 1 kHz 0.05 pA/√Hz
Rev. G | Page 4 of 16
Page 5
Data Sheet AD8613/AD8617/AD8619
Operating Temperature Range
−40°C to +125°C
5-Lead SC70 (KS-5)
376
126
°C/W
8-Lead MSOP (RM-8)
210
45
°C/W
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter Rating
Supply Voltage 6 V
Input Voltage VSS − 0.3 V to VDD + 0.3 V
Input Current ±10 mA
Differential Input Voltage ±6 V
Output Short-Circuit Duration to GND Indefinite
Storage Temperature Range −65°C to +150°C
Junction Temperature Range −65°C to +150°C
Lead Temperature (Soldering, 60 sec) 300°C
ESD AD8613
HBM ±4000 V
FICDM ±1000 V
ESD AD8617
HBM ±3000 V
FICDM ±1000 V
MM ±100 V
ESD AD8619
HBM ±4000 V
FICDM ±1250 V
MM ±200 V
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Figure 7. Input Offset Voltage vs. Input Common-Mode Voltage
Figure 10. Supply Current vs. Temperature
Rev. G | Page 6 of 16
Page 7
Data Sheet AD8613/AD8617/AD8619
1k
0.01
0.00110
05622-009
LOAD CURRENT (mA)
OUTPUT VOLTAGE TO SUPPLY RAIL
(mV)
0.01
0.1
1
0.1
1
10
100
V
SY
= 5V
TA = 25ºC
SOURCE
VSY – V
OH
SINK
V
OL
40
0
–40125
05622-010
TEMPERATURE (°C)
OUTPUT VOLTAGE TO SUPPL
Y RAIL (mV)
30
20
10
–25 –10 520 35 50
65 80 95 110
VSY = 5V
VSY – V
OH
@ 1mA
VOL @ 1m
A
350
0
–40
125
05622-0
11
TEMPERATURE (°C)
OUTPUT VOLTAGE TO SUPPLY RAIL (mV)
–25 –10 520 35 50 6580 95 110
V
SY
= 5V
VOL @ 10mA
300
250
200
150
100
50
V
SY
– VOH @ 10m
A
60
–20
1k1M
05622-012
FREQUENCY
(Hz)
OPEN-LOOP
GAIN (dB)
–45
0
45
90
135
PHASE (Degrees)
10k100k
50
40
30
20
10
0
–10
V
SY
= ±2.5V
AND ±0.9V
R
L
= 100kΩ
C
L
= 20pF
ΦM
120
0
1001M
05622-013
FREQUENCY (Hz)
CMRR (dB)
1k10k
100
80
60
40
20
100k
VSY = 5V AND 2.7V
T
A
= 25°C
120
0
1001M
05622-014
FREQUENCY (Hz)
PSRR (dB)
1k10k100k
100
80
60
40
20
VSY = ±2.5V AND ±1.35V
T
A
= 25°C
Figure 11. Output Voltage to Supply Rail vs. Load Current
Figure 12. Output Voltage to Supply Rail vs. Temperature
(I
= 1 mA)
L
Figure 14. Open-Loop Gain and Phase vs. Frequency
Figure 15. CMRR vs. Frequency
Figure 13. Output Voltage to Supply Rail vs. Temperature
(I
L
= 10 mA)
Figure 16. PSRR vs. Frequency
Rev. G | Page 7 of 16
Page 8
AD8613/AD8617/AD8619 Data Sheet
1k
AV = 100
100
VSY = 5V
= 1
A
V
= 10kΩ
R
L
= 200pF
C
L
AV = 10
10
OUTPUT IMPE DANCE (Ω)
1
0
1001M
1k10k100k
FREQUENCY (Hz)
AV = 1
VSY = 5V AND 1.8V
Figure 17. Output Impedance vs. Frequency
50
VSY = 5V
T
= 25°C
A
45
40
35
30
25
20
15
10
SMALL SIGNAL OVERSHOOT (%)
5
0
101000
LOAD CAPACITANCE (pF)
–OS
+OS
100
Figure 18. Small Signal Overshoot vs. Load Capacitance
05622-015
05622-016
(V)V
OUT
V
–2.5
(mV)
IN
VOLTAGE (1V/DIV)
TIME (20µ s/DIV)
Figure 20. Large Signal Transient Response
0
100
0
TIME (20µ s/DIV)
Figure 21. Positive Overload Recovery
VSY = ±2.5V
= –50
A
V
05622-018
05622-019
VSY = 5V, 2.7V, 1.8V
A
= 1
V
R
= 10kΩ
L
C
= 200pF
L
VOLTAGE (50mV/DIV)
TIME (4µs/DIV)
Figure 19. Small Signal Transient Response
05622-017
Rev. G | Page 8 of 16
2.5
(V)V
OUT
V
(mV)
IN
–100
0
0
TIME (20µ s/DIV)
Figure 22. Negative Overload Recovery
VSY = ±2.5V
A
= –50
V
05622-020
Page 9
Data Sheet AD8613/AD8617/AD8619
1000
100
VSY = 5V
T
= 25ºC
A
V
IN
V
OUT
VOLTAGE (1V/DIV)
VSY = ±2.5V
= 1
A
V
= 10kΩ
R
L
= 6V p-p
V
IN
TIME (20ms/DIV)
Figure 23. No Phase Reversal
VSY = 5V AND 2.7V
VOLTAGE NOISE (1µV/DIV)
TIME (1s/ DIV)
Figure 24. 0.1 Hz to 10 Hz Input Voltage Noise
10
INPUT VOLTAGE NOISE (nV/ Hz)
05622-021
1
110000
1/F CORNER @ 100Hz
101001000
FREQUENCY (Hz)
05622-023
Figure 25. Voltage Noise Density
140
120
100
80
60
40
CHANNEL SEPARATION (dB)
20
05622-022
0
1001M
1k10k100k
FREQUENCY (Hz)
VSY = 5V
05622-024
Figure 26. Channel Separation
Rev. G | Page 9 of 16
Page 10
AD8613/AD8617/AD8619 Data Sheet
450
0
–2000
1900
05622-025
INPUT OFFSET VOLTAGE (µV)
NUMBER OF AMPLIFIERS
400
350
300
250
200
150
100
50
–1700
–1400
–1100
–800
–500
–200
100
400
700
1000
1300
1600
VSY = 1.8V
0V < VCM < 1.8V
TA = 25°C
2000
–2000
–0.5
INPUT COMMON-MODE VO
LTAGE (V)
INPUT OFFSET VOLTAGE (µV)
2.2
1500
–1500
–1000
–500
0
500
1000
–0.2 0.10.4
0.7
1.01.3
1.6
1.9
V
SY
= 1.8V
T
A
= 25°C
05622-026
1000
0.01
0.00110
05622-027
LOAD CURRENT (mA)
OUTPUT VOLTAGE TO SUPPLY RAIL (mV)
0.010.11
0.1
1
10
100
VSY–V
OH
SOURCE
VSY = 1.8V
T
A
= 25°C
SINK
V
OL
80
0
–40125
05622-028
TEMPERA
TURE (°C)
OUTPUT VOLTAGE
TO SUPP
LY
RAIL
(mV)
60
40
20
–25 –10
520 35 50 6580 95
110
VSY = 1.8V
VSY–V
OH
@ 1mA
V
OH
@ 1mA
100
0
1001M
05622-029
FREQUENCY (Hz)
CMRR (dB)
20
40
60
80
1k10k100k
V
SY
= 1.8V
T
A
= 25°C
120
0
1001M
05622-030
FREQUENCY (Hz)
PSRR (dB)
20
40
60
80
100
1k
10k
V
SY
= 1.8V
T
A
= 25°C
VSY = 1.8 V or ±0.9 V, unless otherwise noted.
Figure 27. Input Offset Voltage Distribution
Figure 28. Input Offset Voltage vs. Input Common-Mode Voltage
Figure 30. Output Voltage to Supply Rail vs. Temperature
(I
= 1 mA)
L
Figure 31. CMRR vs. Frequency
Figure 29. Output Voltage to Supply Rail vs. Load Current
Rev. G | Page 10 of 16
Figure 32. PSRR vs. Frequency
Page 11
Data Sheet AD8613/AD8617/AD8619
40
30
VSY = 1.8V
= 25°C
T
A
VSY = 1.8V
20
10
SMALL SIGNAL OVERSHOOT (%)
0
101k
LOAD CAPACITANCE (pF)
100
–OS
+OS
Figure 33. Small Signal Overshoot vs. Load Capacitance
VSY = 1.8V
= 1
A
V
= 10kΩ
R
L
= 200pF
C
L
VOLTAGE (500mV/DIV)
TIME (20µ s/DIV)
Figure 34. Large Signal Transient Response
05622-032
05622-031
VOLTAGE (1µV/DIV)
TIME (1s/ DIV)
05622-033
Figure 35. 0.1 Hz to 10 Hz Input Voltage Noise
1k
VSY = 1.8V
T
= 25°C
A
100
10
INPUT VOLTAGE NOISE (nV/ Hz)
1
110k
1/F CORNER @ 100Hz
101001k
FREQUENCY (Hz)
05622-034
Figure 36. Voltage Noise Density
Rev. G | Page 11 of 16
Page 12
AD8613/AD8617/AD8619 Data Sheet
COMPLI ANT TO JEDEC ST ANDARDS M O-187-AA
6°
0°
0.80
0.55
0.40
4
8
1
5
0.65 BSC
0.40
0.25
1.10 MAX
3.20
3.00
2.80
COPLANARITY
0.10
0.23
0.09
3.20
3.00
2.80
5.15
4.90
4.65
PIN 1
IDENTIFIER
15° MAX
0.95
0.85
0.75
0.15
0.05
10-07-2009-B
CONTROLLING DIMENSIONS ARE IN
MIL
LIME
TER
S; I
NCH DIMENSIONS
(IN
PAR
ENT
HESE
S) ARE ROUNDED-OFF MILLIMETER EQUI
VAL
ENT
S FOR
REFERENCE ONLY
AND
ARE
NOT
APPR
OPRIATE FOR USE IN DESIGN.
COM
PLIA
NT T
O JE
DEC STANDARDSMS-012-AA
012407-A
0.
25 (
0.0
098)
0.17 (0.0067)
1.2
7 (0
.050
0)
0.40 (0.0157)
0.5
0 (0.0196)
0.25
(0.0
099
)
45°
8
°
0°
1
.75
(0.
0688
)
1.35 (0.0532
)
S
EAT
ING
PLANE
0
.25 (0.0098)
0.10
(0.
004
0)
4
1
85
5.00
(0.
1968)
4.
80(0
.18
90)
4.
00 (0.1574)
3.
80 (
0.1
497
)
1.27 (0.050
0)
BSC
6.
20 (
0.2
441)
5.80 (0.2284)
0.51 (0.0201)
0
.31 (0.0122)
COPLANARITY
0.
10
OUTLINE DIMENSIONS
Figure 37. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
Figure 38. 8-Lead Standard Small Outline Package [SOIC_N]
Narrow Body (R-8)
Dimensions shown in millimeters and (inches)
Rev. G | Page 12 of 16
Page 13
Data Sheet AD8613/AD8617/AD8619
CONTROLLING DIMENSIONSARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE O NLYAND ARE NOT APPROPRIATE FOR USE IN DESIGN.
COMPLIANT TO JEDEC STANDARDS MS-012-AB
060606-A
14
8
7
1
6.20 (0.2441)
5.80 (0.2283)
4.00 (0.1575)
3.80 (0.1496)
8.75 (0.3445)
8.55 (0.3366)
1.27 (0.0500)
BSC
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
1.75 (0.0689)
1.35 (0.0531)
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
0.25 (0.0098)
0.17 (0.0067)
COPLANARITY
0.10
8°
0°
45°
COMPLI ANT TO JEDEC ST ANDARDS M O-153-AB-1
061908-A
8°
0°
4.50
4.40
4.30
14
8
7
1
6.40
BSC
PIN 1
5.10
5.00
4.90
0.65 BSC
0.15
0.05
0.30
0.19
1.20
MAX
1.05
1.00
0.80
0.20
0.09
0.75
0.60
0.45
COPLANARITY
0.10
SEATING
PLANE
Figure 39. 14-Lead Standard Small Outline Package [SOIC_N]
Narrow Body (R-14)
Dimensions shown in millimeters and (inches)
Figure 40. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters
Rev. G | Page 13 of 16
Page 14
AD8613/AD8617/AD8619 Data Sheet
COMP
L
IA
NT
T
O J
E
DE
C S
TANDARDS MO-203-AA
1.00
0.90
0.
70
0.46
0
.
36
0.26
2
.2
0
2.00
1
.8
0
2.40
2.10
1.
8
0
1.35
1.
25
1.15
072809-A
0.10 MA
X
1
.
10
0.80
0.40
0.10
0.22
0.
08
3
12
45
0
.
65
BS
C
CO
P
LA
NA
R
IT
Y
0.10
SEATING
PLANE
0.30
0.15
100708-A
*
COMPLI ANT TO JEDEC ST ANDARDS M O-193-AB WITH
THE EXCEPT ION OF PACKAGE HEIGHT AND THICKNESS.
1.60 BSC
2.80 BSC
1.90
BSC
0.95 BSC
0.20
0.08
0.60
0.45
0.30
8°
4°
0°
0.50
0.30
0.10 MAX
*
1.00 MAX
0.90 MAX
0.70 MIN
2.90 BSC
5
4
123
SEATING
PLANE
Figure 41. 5-Lead Thin Shrink Small Outline Transistor Package [SC70]
(KS-5)
Dimensions shown in millimeters
Figure 42. 5-Lead Thin Small Outline Transistor Package [TSOT-23]
(UJ-5)
Dimensions shown in millimeters
Rev. G | Page 14 of 16
Page 15
Data Sheet AD8613/AD8617/AD8619
AD8613AKSZ-REEL7
−40°C to +125°C
5-Lead SC70
KS-5
A0Y
AD8617WARZ-R7
−40°C to +125°C
8-Lead SOIC_N
R-8
AD8619ARUZ-REEL
−40°C to +125°C
14-Lead TSSOP
RU-14
1
EXPOSED
PAD
BOTTOM VIEW
0.50
BSC
PIN 1
INDICATOR
0.50
0.40
0.30
TOP VIEW
12° MAX
0.70 MAX
0.65TYP
0.90 MAX
0.85 NOM
0.05 MAX
0.01 NOM
0.20 REF
2.23
2.13
2.03
4
1.60
1.50
1.40
3.25
3.00 SQ
2.75
2.95
2.75 SQ
2.55
5
8
PIN 1
INDICATOR
SEATING
PLANE
0.30
0.23
0.18
0.60 MAX
0.60 MAX
FOR PROPE R CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATI ON AND
FUNCTIO N DE SCRIPTIONS
SECTION OF THIS DATA SHEET.
04-06-2012-A
Figure 43. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
3 mm × 3 mm Body, Very Thin, Dual Lead
(CP-8-9)
Dimensions shown in millimeters
ORDERING GUIDE
1, 2
Model
AD8613AKSZ-R2 −40°C to +125°C 5-Lead SC70 KS-5 A0Y
AD8613AKSZ-REEL −40°C to +125°C 5-Lead SC70 KS-5 A0Y
AD8613AUJZ-R2 −40°C to +125°C 5-Lead TSOT-23 UJ-5 A0Y
AD8613AUJZ-REEL −40°C to +125°C 5-Lead TSOT-23 UJ-5 A0Y
AD8613AUJZ-REEL7 −40°C to +125°C 5-Lead TSOT-23 UJ-5 A0Y
AD8617ACPZ-R2 −40°C to +125°C 8-Lead LFCSP_VD CP-8-9 A0T
AD8617ACPZ-R7 −40°C to +125°C 8-Lead LFCSP_VD CP-8-9 A0T
AD8617ACPZ-RL −40°C to +125°C 8-Lead LFCSP_VD CP-8-9 A0T
AD8617ARMZ −40°C to +125°C 8-Lead MSOP RM-8 A0T
AD8617ARMZ-REEL −40°C to +125°C 8-Lead MSOP RM-8 A0T
AD8617ARZ −40°C to +125°C 8-Lead SOIC_N R-8
AD8617ARZ-REEL −40°C to +125°C 8-Lead SOIC_N R-8
AD8617ARZ-REEL7 −40°C to +125°C 8-Lead SOIC_N R-8
AD8617WARMZ-REEL −40°C to +125°C 8-Lead MSOP RM-8 A23
AD8617WARZ-RL −40°C to +125°C 8-Lead SOIC_N R-8
AD8619ARUZ −40°C to +125°C 14-Lead TSSOP RU-14
Temperature Range Package Description Package Option Branding
AD8619ARZ −40°C to +125°C 14-Lead SOIC_N R-14
AD8619ARZ-REEL7 −40°C to +125°C 14-Lead SOIC_N R-14
AD8619WARZ-RL −40°C to +125°C 14-Lead SOIC_N R-14
AD8619WARZ-R7 −40°C to +125°C 14-Lead SOIC_N R-14
AD8619WARUZ -R7 −40°C to +125°C 14-Lead TSSOP RU-14
AD8619WARUZ -RL −40°C to +125°C 14-Lead TSSOP RU-14
1
Z = RoHS Compliant Part.
2
Qualified for automotive applications.
AUTOMOTIVE PRODUCTS
The AD8617W and AD8619W models are available with controlled manufacturing to support the quality and reliability requirements of
automotive applications. Note that these automotive models may have specifications that differ from the commercial models; therefore,
designers should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for
use in automotive applications. Contact your local Analog Devices account representative for specific product ordering information and
to obtain the specific Automotive Reliability reports for these models.