1. PIN 4 AND THE E X P OSED PAD
MUST BE CONNECTED TO V–.
TOP VIEW
(Not to S cale)
AD8617
05622-035
1
2
3
4
5
6
7
AD8619
–IN A
+IN A
V+
OUT B
–IN B
+IN B
OUT A
14
13
1
2
11
10
9
8
–IN D
+IN D
V
–
OUT C
–IN C
+IN C
OUT D
TOP VIEW
(Not to Scale)
Data Sheet
FEATURES
Offset voltage: 2.2 mV maximum
Low input bias current: 1 pA maximum
Single-supply operation: 1.8 V to 5.5 V
Low noise: 22 nV/√Hz
Micropower: 50 µA/amplifier maximum over temperature
No phase reversal
Unity gain stable
Qualified for automotive applications
APPLICATIONS
Battery-powered instrumentation
Multipole filters
Current shunt sense
Sensors
ADC predrivers
DAC drivers/level shifters
Low power ASIC input or output amplifiers
Low Cost Micropower, Low Noise CMOS
PIN CONFIGURATIONS
Figure 1. 5-Lead SC70 and 5-Lead TSOT-23
Figure 2. 8-Lead MSOP and 8-Lead SOIC_N
GENERAL DESCRIPTION
The AD8613/AD8617/AD8619 are single, dual, and quad micropower, ra il-to-rail input and output amplifiers that feature low
supply current, as well as low input voltage and current noise.
The parts are fully specified to operate from 1.8 V to 5 V single
supply, or ±0.9 V and ±2.5 V dual supply. The combination of low
noise, very low input bias currents, and low power consumption
make the AD8613/AD8617/AD8619 especially useful in portable
and loop-powered instrumentation.
The ability to swing rail-to-rail at both the input and output
enables designers to buffer CMOS ADCs, DACs, ASICs, and
other wide output swing devices in low power, single-supply
systems.
The AD8613 is available in a 5-lead SC70 package and a 5-lead
TSOT-23 package. The AD8617 is available in 8-lead MSOP,
8-lead SOIC, and 8-lead LFCSP packages. The AD8619 is
available in 14-lead TSSOP and 14-lead SOIC packages. The
AD8617W is qualified for automotive applications and is
available in 8-lead MSOP and 8-lead SOIC packages. The
AD8619W is qualified for automotive applications and is
available in 14-lead SOIC and 14-lead TSSOP packages.
Figure 3. 8-Lead LFCSP_VD
Figure 4. 14-Lead TSSOP and 14-Lead SOIC
Rev. G Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
Changes to Features Section, Figure 2 Caption, General
Description Section, and Figure 3 .................................................. 1
Changed V
Changes to Input Characteristics, Input Voltage Range
Parameter; Dynamic Performance, Settling Time to 0.1% and
Phase Margin Parameters; and Noise Performance, Peak-to-
Changes to Input Characteristics, Input Voltage Range
Parameter; Dynamic Performance, Settling Time to 0.1% and
Phase Margin Parameters; and Noise Performance, Peak-to-
Voltage Noise Density en f = 1 kHz 25 nV/√Hz
f = 10 kHz 22 nV/√Hz
Current Noise Density in f = 1 kHz 0.05 pA/√Hz
Rev. G | Page 4 of 16
Data Sheet AD8613/AD8617/AD8619
Operating Temperature Range
−40°C to +125°C
5-Lead SC70 (KS-5)
376
126
°C/W
8-Lead MSOP (RM-8)
210
45
°C/W
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter Rating
Supply Voltage 6 V
Input Voltage VSS − 0.3 V to VDD + 0.3 V
Input Current ±10 mA
Differential Input Voltage ±6 V
Output Short-Circuit Duration to GND Indefinite
Storage Temperature Range −65°C to +150°C
Junction Temperature Range −65°C to +150°C
Lead Temperature (Soldering, 60 sec) 300°C
ESD AD8613
HBM ±4000 V
FICDM ±1000 V
ESD AD8617
HBM ±3000 V
FICDM ±1000 V
MM ±100 V
ESD AD8619
HBM ±4000 V
FICDM ±1250 V
MM ±200 V
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.