FEATURES
Single-Supply Operation: 4.5 V to 16 V
Input Capability beyond the Rails
Rail-to-Rail Output Swing
Continuous Output Current: 35 mA
Peak Output Current: 250 mA
Offset Voltage: 10 mV
Slew Rate: 6 V/s
Unity Gain Stable with Large Capacitive Loads
Supply Current: 700 A per Amplifier
The AD8565, AD8566, and AD8567 are low cost, single-supply
rail-to-rail input and output operational amplifiers optimized for
LCD monitor applications. They are built on an advanced high
voltage CBCMOS process. The AD8565 contains a single
amplifier, the AD8566 has two amplifiers, and the AD8567 has
four amplifiers.
These LCD op amps have high slew rates, 35 mA continuous
output drive, 250 mA peak output drive, and high capacitive load
drive capability. They have a wide supply range and offset voltages below 10 mV. The AD8565, AD8566, and AD8567 are
ideal for LCD grayscale reference buffer and V
The AD8565, AD8566, and AD8567 are specified over the –40°C
to +85°C temperature range. The AD8565 single is available in a
5-lead SC70 package. The AD8566 dual is available in an 8-lead
MSOP package. The AD8567 quad is available in 14-lead TSSOP
and 16-lead LFCSP packages.
applications.
COM
AD8565/AD8566/AD8567
5-Lead SC70
(KS Suffix)
Operational Amplifiers
PIN CONFIGURATIONS
8-Lead MSOP
(RM Suffix)
AD8566
1
OUT A
–IN A
2
+IN A
36
V–
45
14-Lead TSSOP
(RU Suffix)
1
OUT A
213
–IN A
3
+IN A
4
V+
+IN B
–IN B
OUT B
AD8567
510
69
78
14
12
11
16-Lead LFCSP
(CP Suffix)
OUT D
–IN D
+IN D
V–
+IN C
–IN C
OUT C
8
7
V+
OUT B
–IN B
+IN B
REV. C
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Operating Temperature Range . . . . . . . . . . . –40°C to +85°C
Junction Temperature Range . . . . . . . . . . . . –65°C to +150°C
Lead Temperature Range (Soldering, 60 sec) . . . . . . . . 300°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
θJA is specified for worst-case conditions, i.e., θ
onto a circuit board for surface-mount packages.
2
DAP is soldered down to PCB.
1
JA
2
JC
2
30
is specified for a device soldered
JA
Unit
°C/W
ORDERING GUIDE
TemperaturePackage
ModelRangePackage DescriptionOptionBranding
AD8565AKS-R2–40°C to +85°C5-Lead Thin Shrink Small Outline Transistor PackageKS-5ASA
AD8565AKS-REEL7–40°C to +85°C5-Lead Thin Shrink Small Outline Transistor PackageKS-5ASA
AD8565AKSZ-REEL7*–40°C to +85°C5-Lead Thin Shrink Small Outline Transistor PackageKS-5ASA
AD8566ARM-R2–40°C to +85°C8-Lead Micro Small Outline PackageRM-8ATA
AD8566ARM-REEL–40°C to +85°C8-Lead Micro Small Outline PackageRM-8ATA
AD8566ARMZ-REEL*–40°C to +85°C8-Lead Micro Small Outline PackageRM-8ATA
AD8567ARU–40°C to +85°C14-Lead Thin Shrink Small Outline PackageRU-14
AD8567ARU-REEL–40°C to +85°C14-Lead Thin Shrink Small Outline PackageRU-14
AD8567ARUZ*–40°C to +85°C14-Lead Thin Shrink Small Outline PackageRU-14
AD8567ARUZ-REEL*–40°C to +85°C14-Lead Thin Shrink Small Outline PackageRU-14
AD8567ACP-R2–40°C to +85°C16-Lead Lead Frame Chip Scale PackageCP-16
AD8567ACP-REEL–40°C to +85°C16-Lead Lead Frame Chip Scale PackageCP-16
AD8567ACP-REEL7–40°C to +85°C16-Lead Lead Frame Chip Scale PackageCP-16
AD8567ACPZ-REEL*–40°C to +85°C16-Lead Lead Frame Chip Scale PackageCP-16
AD8567ACPZ-REEL7*–40°C to +85°C16-Lead Lead Frame Chip Scale PackageCP-16
*Z = Pb-free part.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD8565/AD8566/AD8567 features proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
REV. C
–3–
WARNING!
ESD SENSITIVE DEVICE
AD8565/AD8566/AD8567
–Typical Performance Characteristics
0
VCM = VS/2
0.25
0.50
0.75
VS = 4.5V
1.00
INPUT OFFSET VOLTAGE (mV)
1.25
1.50
40
VS = 16V
2585
TEMPERATURE (C)
TPC 1. Input Offset Voltage vs. Temperature
10
4.5V VS 16V
T
= 25C
A
1
CURRENT NOISE DENSITY (pA Hz)
1000
4.5V VS 16V
= 25C
T
A
100
10
VOLTAGE NOISE DENSITY (nV Hz)
1
1010k1001k
FREQUENCY (Hz)
TPC 4. Voltage Noise Density vs. Frequency
1.0
VO = VS/2
= +1
A
V
T
= 25C
A
0.8
0.6
0.4
0.2
SUPPLY CURRENT/AMPLIFIER (mA)
0.1
1010k1001k
FREQUENCY (Hz)
TPC 2. Current Noise Density vs. Frequency
VS = 16V
= 10k
R
L
= 100pF
C
L
= +1
A
V
= 25C
T
A
TIME (50mV/DIV)
FREQUENCY (1s/DIV)
TPC 3. Small Signal Transient Response
0
0182
46810121416
SUPPLY VOLTAGE (V)
TPC 5. Supply Current/Amplifier vs. Supply Voltage
0.80
VCM = VS/2
0.75
VS = 16V
0.70
0.65
0.60
0.55
SUPPLY CURRENT/AMPLIFIER (mA)
0.50
40
TEMPERATURE (C)
VS = 4.5V
2585
TPC 6. Supply Current/Amplifier vs. Temperature
–4–
REV. C
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