Analog Devices AD8392 Service Manual

Low Power, High Output Current, Quad Op Amp,

T

V

V

Dual-Channel ADSL/ADSL2+ Line Driver

FEATURES

Four current feedback, high current amplifiers
Ideal for use as ADSL/ADSL2+ dual-channel Central Office

(CO) line drivers

Low power operation

Power supply operation from ±5 V (+10 V) up to ±12 V (+24 V)
Less than 3 mA/Amp quiescent supply current for full

power ADSL/ADSL2+ CO applications (20.4 dBm line
power, 5.5 CF)

Three active power modes plus shutdown

High output voltage and current drive

400 mA peak output drive current
44 V p-p differential output voltage

Low distortion

−72 dBc @1 MHz second harmonic

−82 dBc @ 1 MHz third harmonic
High speed: 900 V/µs differential slew rate
Additional functionality of AD8392ACP

On-chip common-mode voltage generation

APPLICATIONS

ADSL/ADSL2+ CO line drivers
XDSL line drives
High output current, low distortion amplifiers
DAC output buffer

GENERAL DESCRIPTION

The AD8392 is comprised of four high output current, low
power consumption, operational amplifiers. It is particularly
well suited for the CO driver interface in digital subscriber line
systems, such as ADSL and ADSL2+. The driver is capable of
providing enough power to deliver 20.4 dBm to a line, while
compensating for losses due to hybrid insertion and back
termination resistors. In addition, the low distortion, fast slew
rate, and high output current capability make the AD8392 ideal
for many other applications, including medical instrumenta­tion, DAC output drivers, and other high peak current circuits.

The AD8392 is available in two thermally enhanced packages, a
28-lead TSSOP/EP (AD8392ARE) and a 5 mm × 5 mm 32-lead
LFCSP (AD8392ACP). Four bias modes are available via the use
of two digital bits (PD1, PD0).

AD8392

PIN CONFIGURATIONS

V

1

EE

+V
–V

V

V

–V
+V

IN
IN

OUT

V

CC

NC

OUT

IN
IN

NC
NC

GND

2
3

1

4

1

5

1

6
7
8

3

9

3

10

3

11
12
13
14

1

AD8392

3

NC = NO CONNECT

PD0 1, 2
PD1 1, 2

Figure 1. AD8392ARE, 28-Lead TSSOP/EP

1

IN

+V

32 31 30 29 28 27 2526

1

NC

2

–V

1

IN

3

1

OUT

4

V

CC

5

NC

6

3

OUT

7

3

–V

IN

8

NC

91011121314

3

IN

+V

NC = NO CONNEC

PD1 1, 2

1

3

NC

EE

V

PD0 1, 2

AD8392

3, 4

GND

COM

V

Figure 2. AD8392ACP, 32-Lead LFCSP 5 mm × 5 mm

Additionally, the AD8392ACP provides V
common mode voltage generation.

The low power consumption, high output current, high output
voltage swing, and robust thermal packaging enable the
AD8392 to be used as the CO line drivers in ADSL and other
xDSL systems, as well as other high current, single-ended or
differential amplifier applications.

GND

EE

V

2

4

1, 2

COM

V

2

4

PD0 3, 4

28

GND

27

NC

26

NC

2

+V

25

IN

–V

2

24

IN

2

V

23

OUT

22

NC

21

V

CC

20

V

4

OUT

19

–VIN4

18

4

+V

IN

17

PD1 3, 4

16

PD0 3, 4

15

V

EE

2

IN

NC

+V

24

NC
–V

23

V

22

OUT

21

NC
V

20

CC

V

19

OUT

–VIN4

18
17

NC

1615

4

IN

+V

PD1 3, 4

pins for on-chip

COM

04802-0-001

2

IN

2

4

04802-0-002

Rev. A

Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
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registered trademarks are the property of their respective owners.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: [phone]
Fax: [phone] ©2005 Analog Devices, Inc. All rights reserved.

www.analog.com

AD8392

TABLE OF CONTENTS

Specifications..................................................................................... 3

Power Management ................................................................... 12

Absolute Maximum Ratings............................................................ 5

Thermal Resistance ...................................................................... 5

ESD Caution.................................................................................. 5

Typical Performance Characteristics ............................................. 6

Theory of Operation ...................................................................... 11

Applications..................................................................................... 12

Supplies, Grounding, and Layout............................................. 12

Resistor Selection........................................................................ 12

REVISION HISTORY

3/05—Rev. 0 to Rev. A

Changes to Figure 1 and Figure 2................................................... 1

Changes to Ordering Guide.......................................................... 16

7/04—Revision 0: Initial Version

Driving Capacitive Loads.......................................................... 12

Thermal Considerations............................................................ 13

Typical ADSL/ADSL2+ Application........................................ 13

Multitone Power Ratio............................................................... 14

Lightning and AC Power Fault................................................. 15

Outline Dimensions ....................................................................... 16

Ordering Guide .......................................................................... 16

Rev. A | Page 2 of 16

AD8392

SPECIFICATIONS

VS = ±12 V or +24 V, RL = 100 Ω, G = +5, PD = (0, 0), T = 25°C, unless otherwise noted.

Table 1.

Parameter Min Typ Max Unit Test Conditions/Comments

DYNAMIC PERFORMANCE

−3 dB Small Signal Bandwidth 30 40 MHz V

−3 dB Large Signal Bandwidth 20 25 MHz V
Peaking 0.05 dB V
Slew Rate 850 900 V/µs V

NOISE/DISTORTION PERFORMANCE

Second Harmonic Distortion −72 dBc fC = 1 MHz, V
Third Harmonic Distortion −82 dBc fC = 1 MHz, V
Multitone Input Power Ratio −70 dBc 26 kHz to 2.2 MHz, Z
Voltage Noise (RTI) 4.3 nV/√Hz f = 10 kHz
+Input Current Noise 10 pA/√Hz f = 10 kHz

−Input Current Noise 13 pA/√Hz f = 10 kHz

INPUT CHARACTERISTICS

RTI Offset Voltage −5.0 ±3.0 +5.0 mV V
+Input Bias Current 5.0 10.0 µA

−Input Bias Current 10.0 15.0 µA
Input Resistance 400 kΩ
Input Capacitance 2.0 pF
Common-Mode Rejection Ratio 64 68 dB (∆V

OUTPUT CHARACTERISTICS

Differential Output Voltage Swing 42.0 44.0 46.0 V ∆V
Single-Ended Output Voltage Swing 21.0 22.0 23.0 V ∆V
Linear Output Current 400 mA RL = 10 Ω, fC = 100 kHz

POWER SUPPLY

Operating Range (Dual Supply) ±5 ±12 V
Operating Range (Single Supply) 10 24 V
Total Quiescent Current

PD1, PD0 = (0, 0) 6.0 7.0 mA/Amp
PD1, PD0 = (0, 1) 3.6 4.0 mA/Amp
PD1, PD0 = (1, 0) 2.8 3.3 mA/Amp

PD1, PD0 = (1, 1) (Shutdown State) 0.4 1.2 mA/Amp
PD = 0 Threshold 0.8 V
PD = 1 Threshold 1.8 V
+Power Supply Rejection Ratio 64 68 dB ∆V

−Power Supply Rejection Ratio 76 79 dB ∆V

= 0.1 V p-p, RF = 2 kΩ

OUT

= 4 V p-p, RF = 2 kΩ

OUT

= 0.1 V p-p, RF = 2 kΩ

OUT

= 20 V p-p, RF = 2 kΩ

OUT

= 2 V p-p

OUT

= 2 V p-p

OUT

− V

+IN

−IN

)/(∆V

OS, DM (RTI)

OUT

OUT

OS, DM (RTI)

OS, DM (RTI)

IN, CM

/∆VCC, ∆VCC = ±1 V
/∆VEE, ∆VEE = ±1 V

= 100 Ω Differential Load

LINE

)

Rev. A | Page 3 of 16

AD8392

VS = ±5 V or +10 V, RL = 100 Ω, G = +5, PD = (0, 0), T = 25°C, unless otherwise noted.

Table 2.

Parameter Min Typ Max Unit Test Conditions/Comments

DYNAMIC PERFORMANCE

−3 dB Small Signal Bandwidth 30 40 MHz V

−3 dB Large signal Bandwidth 20 25 MHz V
Peaking 0.05 dB V
Slew Rate (Rise) 300 350 V/µs V
Slew Rate (Fall) 400 450 V/µs V

NOISE/DISTORTION PERFORMANCE

Second Harmonic Distortion −72 dBc fC = 1 MHz, V
Third Harmonic Distortion −82 dBc fC = 1 MHz, V
Voltage Noise (RTI) 4.3 nV/√Hz f = 10 kHz
+Input Current Noise 10 pA/√Hz f = 10 kHz

−Input Current Noise 13 pA/√Hz f = 10 kHz

INPUT CHARACTERISTICS

RTI Offset Voltage −5.0 ±3.0 +5.0 mV V
+Input Bias Current 5.0 10.0 µA

−Input Bias Current 10.0 15.0 µA
Input Resistance 400 kΩ
Input Capacitance 2.0 pF
Common-Mode Rejection Ratio 62 66 dB (∆V

OUTPUT CHARACTERISTICS

Differential Output Voltage Swing 14.0 16.0 18.0 V ∆V
Single-Ended Output Voltage Swing 7.0 8.0 9.0 V ∆V
Linear Output Current 400 mA RL = 10 Ω, fC = 100 kHz

POWER SUPPLY

Operating Range (Dual Supply) ±5 ±12 V
Operating Range (Single Supply) +10 +24 V
Total Quiescent Current

PD1, PD0 = (0, 0) 5.4 6.0 mA/Amp
PD1, PD0 = (0, 1) 3.5 4.0 mA/Amp
PD1, PD0 = (1, 0) 2.6 3.0 mA/Amp

PD1, PD0 = (1, 1) (Shutdown State) 0.4 1.0 mA/Amp
PD = 0 Threshold 0.8 V
PD = 1 Threshold 1.8 V
+Power Supply Rejection Ratio 72 76 dB ∆V

−Power Supply Rejection Ratio 64 68 dB ∆V

= 0.1 V p-p, RF = 2 kΩ

OUT

= 4 V p-p, RF = 2 kΩ

OUT

= 0.1 V p-p, RF = 2 kΩ

OUT

= 7 V p-p, RF = 2 kΩ

OUT

= 7 V p-p, RF = 2 kΩ

OUT

= 2 V p-p

OUT

= 2 V p-p

OUT

− V

+IN

−IN

)/(∆V

OS, DM (RTI)

OUT

OUT

OS, DM (RTI)

OS, DM (RTI)

IN, CM

/∆VCC, ∆VCC = ±1 V
/∆VEE, ∆VEE = ±1 V

)

Rev. A | Page 4 of 16

AD8392

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter Rating

RMS output voltages should be considered. If R

as in single-supply operation, the total power is VS × I

to V

S−

Supply Voltage ±13 V (+26 V)

Power Dissipation See Figure 3

Storage Temperature −65°C to +150°C

Operating Temperature Range −40°C to +85°C

Lead Temperature Range (Soldering 10 sec) 300°C

Junction Temperature 150°C

In single supply with R

Airflow increases heat dissipation, effectively reducing θ
more metal directly in contact with the package leads from
metal traces, through holes, ground, and power planes reduces

.

the θ

JA

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

Figure 3 shows the maximum safe power dissipation in the
package versus the ambient temperature for the LFCSP-32 and
TSSOP-28/EP packages on a JEDEC standard 4-layer board. θ
values are approximations.

7

device reliability.

THERMAL RESISTANCE

6

θJA is specified for the worst-case conditions, i.e., θJA is specified

for device soldered in circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type θ

JA

Unit

LFCSP-32 (CP) 27.27 °C/W

TSSOP-28/EP (RE) 35.33 °C/W

Maximum Power Dissipation

The power dissipated in the package (PD) is the sum of the

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

power is the voltage between the supply pins (V

quiescent current (I

the total drive power is V

). Assuming that the load (RL) is midsupply,

S

/2 × I

S

, some of which is

OUT

dissipated in the package and some in the load (V

) times the

S

× I

OUT

OUT

).

5

4

3

2

1

MAXIMUM POWER DISSIPATION (W)

0

–40–30–20–100 102030405060708090

Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

See the Thermal Considerations section for additional thermal
design guidance.

to VS−, worst case is V

L

LFCSP-32

TSSOP-28/EP

TEMPERATURE (°C)

is referenced

L

= VS/2.

OUT

TJ = 150°C

. Also,

JA

OUT

JA

04802-0-003

.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the

human body and test equipment and can discharge without detection. Although this product features proprie-

tary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic

discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of

functionality.

Rev. A | Page 5 of 16