Single- or dual-power supply operation from 10 V (±5 V)
up to 24 V (±12 V)
4 mA total quiescent supply current for full power ADSL
and ADSL2+ CO applications
Adjustable supply current to minimize power
consumption
High output voltage and current drive
400 mA peak output drive current
44.2 V p-p differential output voltage
Low distortion
–82 dBc @ 1 MHz second harmonic
–91 dBc @ 1 MHz third harmonic
High speed: 300 V/µs differential slew rate
APPLICATIONS
ADSL/ADSL2+ CO and CPE line drivers
xDSL line driver
High current differential amplifiers
GENERAL DESCRIPTION
The AD8390 is a high output current, low power consumption
differential amplifier. It is particularly well suited for the central
office (CO) driver interface in digital subscriber line systems
such as ADSL and ADSL2+. While in full bias operation, the
driver is capable of providing 24.4 dBm output power into low
resistance loads. This is enough to power a 20.4 dBm line while
compensating for losses due to hybrid insertion, transformer
insertion, and back termination resistors.
The AD8390 fully differential amplifier is available in a thermally enhanced lead frame chip scale package (LFCSP-16) and
a 16-lead QSOP/EP. Significant control and flexibility in bias
current have been designed into the AD8390. The four power
modes are controlled by two digital bits,
provide three levels of driver bias and one powered-down state.
In addition, the I
pin can be used for fine quiescent current
ADJ
trimming to tailor the performance of
the AD8390.
PWDN (1,0) which
Differential Amplifier
AD8390
PIN CONFIGURATIONS
V
NCNCNC
OCM
1
+IN
PWDN1
PWDN0
4
–IN
DGND
NCNC
NC = NO CONNECT
Figure 1. 4 mm × 4 mm 16-Lead LFCSP
V
OCM
NC
+IN
PWDN1
PWDN0
–IN
NC
DGND
NC = NO CONNECT
Figure 2. 16-Lead QSOP/EP
The low power consumption, high output current, high output
voltage swing, and robust thermal packaging enable the AD8390
to be used as the central office line driver in ADSL, ADSL2+,
and proprietary xDSL systems, as well as in other high current
applications requiring a differential amplifier.
I
ADJ
1316
12
–OUT
V
EE
V
CC
+OUT
9
85
03600-0-001
161
NC
–OUT
NC
V
EE
V
CC
NC
+OUT
98
I
ADJ
03600-0-002
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
VS = ±12 V or +24 V, RL = 100 Ω, G = 10, PWDN = (1,1), I
= NC, V
ADJ
= float, TA = 25°C, unless otherwise noted.
OCM
Table 1.
Parameter Conditions Min Typ Max Unit
DYNAMIC PERFORMANCE
–3 dB Small Signal Bandwidth V
Large Signal Bandwidth V
Peaking V
Slew Rate V
= 0.2 V p-p, RF = 10 kΩ 40 60 MHz
OUT
= 4 V p-p 25 40 MHz
OUT
= 0.2 V p-p 0.1 dB
OUT
= 4 V p-p 300 V/µs
OUT
NOISE/DISTORTION PERFORMANCE
Second Harmonic Distortion
Third Harmonic Distortion
Multitone Power Ratio (26 kHz to 1.1 MHz)Z = 100 Ω, P = 19.8 dBm,
= 1 MHz, V
f
C
= 1 MHz, V
f
C
LINELINE
= 2 V p-p
OUT
= 2 V p-p
OUT
–82 dBc
–91 dBc
–70 dBc
crest factor (CF) = 5.4
Multitone Power Ratio (26 kHz to 2.2 MHz)Z = 100 Ω, P = 19.8 dBm,
LINELINE
–65 dBc
crest factor (CF) = 5.4
Voltage Noise (RTI) f = 10 kHz 8 nV/√Hz
Input Current Noise f = 10 kHz 1 pA/√Hz
INPUT CHARACTERISTICS
RTI Offset Voltage (V
RTI Offset Voltage (V
) V
OS,DM(RTI)
) V
OS,DM(RTI)
– V
, V
+IN
– V
+IN
= midsupply –3.0 ±1.0 +3.0 mV
–IN
OCM
, V
= float –3.0 ±1.0 +3.0 mV
–IN
OCM
±Input Bias Current –4.0 –7.0 µA
Input Offset Current –0.35 ±0.05 +0.35 µA
Input Resistance 400 kΩ
Input Capacitance 2 pF
Common-Mode Rejection Ratio (∆V
OS,DM(RTI)
)/(∆V
) 58 64 dB
IN,CM
OUTPUT CHARACTERISTICS
Differential Output Voltage Swing ∆V
Output Balance Error (∆V
OUT
OS,CM
)/∆V
OUT
43.8 44.2 44.6 V
60 dB
Linear Output Current RL = 10 Ω, fC = 100 kHz 400 mA
Worst harmonic = –60 dBc
Output Common-Mode Offset (V
Output Common-Mode Offset (V
+OUT
+OUT
+ V
+ V
–OUT
–OUT
)/2, V
= midsupply –75 ±35 +75 mV
OCM
)/2, V
= float –75 ±35 +75 mV
OCM
POWER SUPPLY
Operating Range (Dual Supply) ±5 ±12 V
Operating Range (Single Supply) +10 +24 V
Total Quiescent Current PWDN1, PWDN0 = (1,1); I
(1,0); I (0,1); I
(0,0); I
Total Quiescent Current PWDN1, PWDN0 = (1,1); I
(1,0); I
(0,1); I
(0,0); I
Power Supply Rejection Ratio (PSRR) ∆V
/∆VS, ∆VS = ±1 V, V
OS,DM
= V
ADJ
EE
= V
ADJ
EE
= V
ADJ
EE
= V
ADJ
EE
= NC 10.0 11.0 mA
ADJ
= NC 6.7 8.0 mA
ADJ
= NC 3.8 5.0 mA
ADJ
= NC 0.67 1.0 mA
ADJ
= midsupply 70 76 dB
OCM
5.2 6.5 mA
3.8 5.0 mA
2.5 3.5 mA
0.57 1.0 mA
PWDN = 0 (Low Logic State) 1.0 V
PWDN = 1 (High Logic State) 1.6 V
V
OCM
TO ±V
SPECIFICATIONS
OUT
Input Voltage Range –11.0 to +10.0 V
Input Resistance 28 kΩ
V
Accuracy ∆V
OCM
1
V
bypassed with 0.1 µF capacitor.
OCM
2
See . Figure 3
OUT,CM
/∆V
OCM
0.996 1.0 1.004 V/V
1, 2
Rev. C | Page 3 of 16
AD8390
VS = ±5 V or +10 V, RL = 100 Ω, G = 10, PWDN = (1,1), I
= NC, V
ADJ
= float, TA = 25°C, unless otherwise noted.
OCM
1, 2
Table 2.
Parameter Conditions Min Typ Max Unit
DYNAMIC PERFORMANCE
–3 dB Small Signal Bandwidth V
Large Signal Bandwidth V
Peaking V
Slew Rate V
= 0.2 V p-p, RF = 10 kΩ, G = 10 40 60 MHz
OUT
= 4 V p-p 25 40 MHz
OUT
= 0.2 V p-p 0.1 dB
OUT
= 4 V p-p 300 V/µs
OUT
NOISE/DISTORTION PERFORMANCE
Second Harmonic Distortion fC = 1 MHz, V
Third Harmonic Distortion fC = 1 MHz, V
= 2 V p-p –82 dBc
OUT
= 2 V p-p –91 dBc
OUT
Voltage Noise (RTI) f = 10 kHz 8 nV/√Hz
Input Current Noise f = 10 kHz 1 pA/√Hz
INPUT CHARACTERISTICS
RTI Offset Voltage (V
RTI Offset Voltage (V
OS,DM(RTI)
OS,DM(RTI)
) V
) V
+IN
+IN
– V
– V
, V
= midsupply –3.0 ±1.0 +3.0 mV
–IN
OCM
, V
= float –3.0 ±1.0 +3.0 mV
–IN
OCM
±Input Bias Current –4.0 –7.0 µA
Input Offset Current –0.35 ±0.05 +0.35 µA
Input Resistance 400 kΩ
Input Capacitance 2 pF
Common-Mode Rejection Ratio (∆V
OS,DM(RTI)
)/(∆V
) 58 64 dB
IN,CM
OUTPUT CHARACTERISTICS
Differential Output Voltage Swing ∆V
Output Balance Error (∆V
OUT
OS,CM
)/∆V
OUT
16.0 16.4 16.8 V
60 dB
Linear Output Current RL = 10 Ω, fC = 100 kHz 400 mA
Worst harmonic = –60 dBc
Output Common-Mode Offset (V
Output Common-Mode Offset (V
+OUT
+OUT
+ V
+ V
–OUT
–OUT
)/2, V
)/2, V
= midsupply
OCM
= float
OCM
–75
–75
±35 +75 mV
±35 +75 mV
POWER SUPPLY
Operating Range (Dual Supply) ±5 ±12 V
Operating Range (Single Supply) +10 +24 V
Total Quiescent Current PWDN1, PWDN0 = (1,1); I
(1,0); I
(0,1); I
(0,0); I
Total Quiescent Current PWDN1, PWDN0 = (1,1); I
(1,0); I
(0,1); I
(0,0); I
Power Supply Rejection Ratio ∆V
/∆VS, ∆VS = ±1 V, V
OS,DM
= V
ADJ
EE
= V
ADJ
EE
= V
ADJ
EE
= V
ADJ
EE
= NC 8.7 10.0 mA
ADJ
= NC 5.8 7.0 mA
ADJ
= NC 3.3 4.0 mA
ADJ
= NC 0.55 1.0 mA
ADJ
= midsupply 70 76 dB
OCM
4.5 5.5 mA
3.3 4.0 mA
2.1 3.0 mA
0.43 1.0 mA
PWDN = 0 (Low Logic State) 1.0 V
PWDN = 1 (High Logic State) 1.6 V
V
OCM
TO ±V
SPECIFICATIONS
OUT
Input Voltage Range –4.0 to +3.0 V
Input Resistance 28 kΩ
V
Accuracy ∆V
OCM
1
V
bypassed with 0.1 µF capacitor.
OCM
2
See . Figure 3
OUT,CM
/∆V
OCM
0.996 1.0 1.004 V/V
Rev. C | Page 4 of 16
AD8390
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
Supply Voltage ±13.2 V (26.4 V)
V
OCM
Package Power Dissipation (TJ
Maximum Junction Temperature (TJ
MAX
Operating Temperature Range (TA) –40°C to +85°C
Storage Temperature Range –65°C to +150°C
Lead Temperature (Soldering 10 s) 300°C
Stresses above those listed under Absolute Maximum Ratings
JEDEC 2S2P – 0 airflow
Paddle soldered to board
Nine thermal vias in pad
16-lead QSOP/EP (RC-16)
JEDEC 1S2P – 0 airflow
Paddle soldered to board
Nine thermal vias in pad
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
= 1kΩ
= 1kΩ
RF = 10kΩ
AD8390
RF = 10kΩ
Figure 3. Basic Test Circuit
R
L,DM
= 100Ω
V
49.9Ω
R
G
V
IN
R
G
49.9Ω
OUT,DM
03600-0-003
30.4°C/W
44.3°C/W
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. C | Page 5 of 16
AD8390
TYPICAL PERFORMANCE CHARACTERISTICS
Default Conditions: VS = ±12 V or +24 V, RL = 100 Ω, G = 10, PWDN = (1,1), I
= 25°C, unless otherwise noted. See Figure 3.
T
A
25
20
15
10
5
GAIN (dB)
0
–5
PWDN(0,1); I
PWDN(0,1); I
PWDN(1,0); I
= V
ADJ
ADJ
PWDN(1,1); I
ADJ
EE
= NC
= NC
ADJ
= NC
PWDN(1,0); I
PWDN(1,1); I
ADJ
ADJ
= V
= V
EE
EE
GAIN (dB)
= NC, V
ADJ
30
25
PWDN(0,1); I
20
15
10
5
0
–5
OCM
ADJ
PWDN(0,1); I
= float (bypassed with 0.1 μF capacitor),
= V
ADJ
EE
= NC
PWDN(1,0); I
PWDN(1,1); I
PWDN(1,0); I
PWDN(1,1); I
ADJ
ADJ
ADJ
ADJ
= V
= V
= NC
= NC
EE
EE
–10
1101001000
FREQUENCY (MHz)
Figure 4. Small Signal Frequency Response;
V
= ±12 V, Gain = 10, V
S
25
20
15
PWDN(0,1); I
10
PWDN(0,1); I
5
GAIN (dB)
0
–5
–10
1101001000
= V
ADJ
ADJ
PWDN(1,0); I
PWDN(1,1); I
EE
= NC
= NC
ADJ
= NC
ADJ
FREQUENCY (MHz)
OUT
= 200 mV p-p
PWDN(1,0); I
PWDN(1,1); I
ADJ
ADJ
Figure 5. Large Signal Frequency Response;
V
= ±12 V, Gain = 10, V
S
–10
–15
–20
–25
–30
–35
–40
–45
–50
–55
FEEDTHROUGH (dB)
–60
–65
–70
–75
110100
FREQUENCY (MHz)
= 4 V p-p
OUT
Figure 6. Signal Feedthrough; PWDN = (0,0)
= V
= V
–10
03600-0-004
1101001000
FREQUENCY (MHz)
03600-0-026
Figure 7. Small Signal Frequency Response;
V
= ±5 V, Gain = 5, V
S
25
PWDN(0,1); I
20
EE
EE
03600-0-006
15
10
5
GAIN (dB)
0
–5
–10
1101001000
ADJ
PWDN(0,1); I
PWDN(1,0); I
= V
EE
= NC
ADJ
FREQUENCY (MHz)
= 200 mV p-p
OUT
ADJ
= V
EE
PWDN(1,1); I
PWDN(1,0); I
PWDN(1,1); I
ADJ
ADJ
ADJ
= V
= NC
= NC
EE
03600-0-027
Figure 8. Large Signal Frequency Response;
03600-0-008
= ±5 V, Gain = 5, V
V
S
100
10
1
0.1
OUTPUT IMPEDANCE (Ω)
0.01
0.001
0.010.1110100
FREQUENCY (MHz)
Figure 9. Output Impedance vs. Frequency; PWDN = (1,1)
= 2 V p-p
OUT
03600-0-020
Rev. C | Page 6 of 16
AD8390
–50
–55
PWDN(0,1); I
ADJ
= V
EE
CREST FACTOR = 5.4
–45
–50
PWDN(0,1); I
CREST FACTOR = 5.4
= V
ADJ
EE
–60
PWDN(0,1); I
ADJ
= NC
PWDN(1,0); I
–65
PWDN(1,1); I
–70
MULTITONE POWER RATIO (dBc)
–75
121420181622
PWDN(1,0); I
OUTPUT POWER (dBm)
= NC
ADJ
PWDN(1,1); I
ADJ
ADJ
= NC
Figure 10. MTPR vs. Output Power;
970 kHz Empty Bin (26 kHz to 1.1 MHz)
900
CREST FACTOR = 5.4
800
700
600
PWDN(1,0); I
PWDN(1,1); I
PWDN(1,1); I
= V
ADJ
ADJ
EE
ADJ
= NC
= NC
PWDN(0,1); I
500
POWER CONSUMPTION (mW)
400
300
121614182022
OUTPUT POWER (dBm)
PWDN(1,0); I
PWDN(0,1); I
ADJ
ADJ
= V
= V
EE
Figure 11. Power Consumption vs. Output Power
(Includes Output Power Delivered to Load)
ADJ
= V
ADJ
EE
= V
EE
EE
= NC
03600-0-010
03600-0-028
–55
–60
–65
MULTITONE POWER RATIO (dBc)
–70
122220181614
PWDN(1,0); I
PWDN(0,1); I
ADJ
= V
ADJ
EE
PWDN(1,1); I
PWDN(1,1); I
PWDN(1,0); I
ADJ
OUTPUT POWER (dBm)
= NC
= NC
Figure 13. MTPR vs. Output Power;
1.75 MHz Empty Bin (26 kHz to 2.2 MHz)
50
45
40
VS = ±12V
35
30
25
20
15
10
DIFFERENTIAL OUTPUT SWING (V)
V
= ±5V
S
5
0
102030405060708090100
Figure 14. Differential Output Swing vs. R
R
LOAD
(Ω)
LOAD
ADJ
ADJ
= V
= NC
EE
03600-0-030
03600-0-031
–50
–55
PWDN(0,1); I
ADJ
= V
EE
–60
PWDN(0,1); I
–65
–70
–75
–80
TOTAL HARMONIC DISTORTION (dBc)
–85
–90
0.1110
= NC
ADJ
FREQUENCY (MHz)
PWDN(1,1); I
PWDN(1,0); I
PWDN(1,1); I
PWDN(1,0); I
ADJ
ADJ
= V
ADJ
= V
Figure 12. Total Harmonic Distortion vs. Frequency;
= ±12 V, V
V
S
= 2 V p-p
OUT
ADJ
EE
= NC
= NC
EE
03600-0-029
Rev. C | Page 7 of 16
–50
ADJ
ADJ
= NC
= V
EE
–55
PWDN(0,1); I
–60
PWDN(0,1); I
–65
–70
–75
–80
TOTAL HARMONIC DISTORTION (dBc)
–85
–90
0.1110
FREQUENCY (MHz)
PWDN(1,1); I
PWDN(1,0); I
PWDN(1,1); I
PWDN(1,0); I
ADJ
ADJ
= V
ADJ
= V
Figure 15. Total Harmonic Distortion vs. Frequency;
V
= ±5 V, V
S
= 2 V p-p
OUT
ADJ
EE
= NC
= NC
EE
03600-0-032
AD8390
11
10
9
8
7
6
5
SUPPLY CURRENT (mA)
4
3
2
1101001k10k100k1M
Figure 16. Quiescent Current vs. I
PWDN(1,1)
PWDN(1,0)
PWDN(0,1)
I
SERIES RESISTOR (Ω)
ADJ
Resistor; VS = ±12 V
ADJ
03600-0-016
9
8
7
6
5
4
SUPPLY CURRENT (mA)
3
2
1
1101001k10k100k1M
I
ADJ
Figure 19. Quiescent Current vs. I
PWDN(1,1)
SERIES RESISTOR (Ω)
Resistor; VS = ±5 V
ADJ
PWDN(1,0)
PWDN(0,1)
03600-0-017
3
2
1
0
–1
DIFFERENTIAL OUTPUT (V)
–2
–3
–0.2 –0.100.1 0.20.3 0.4 0.50.6 0.70.8
PWDN PINS
OUTPUT
TIME (µs)
Figure 17. Power-Up Time;
PWDN = (0,0) to PWDN = (1,1)
100
Hz)
10
5.5
4.5
3.5
2.5
1.5
0.5
–0.5
PWDN PIN VALUES (V)
03600-0-018
3
2
1
0
–1
DIFFERENTIAL OUTPUT (V)
–2
–3
–20246810
TIME (µs)
OUTPUT
PWDN PINS
Figure 20. Power-Down Time;
PWDN = (1,1) to PWDN = (0,0)
100
10
5.5
4.5
3.5
2.5
1.5
0.5
–0.5
PWDN PIN VALUES (V)
03600-0-019
VOLTAGE NOISE (nV/
1
10100100k1M10k1k10M
FREQUENCY (Hz)
Figure 18. Voltage Noise (RTI)
03600-0-014
Rev. C | Page 8 of 16
1.0
CURRENT NOISE (pA/ Hz)
0.1
101001k10k100k1M10M
FREQUENCY (Hz)
Figure 21. Current Noise (RTI)
03600-0-015
AD8390
(
−
=
(
)
×
=
THEORY OF OPERATION
R
F
V
R
G
+IN
I
ADJ
R
ADJ
PWDN0
PWDN1
V
EE
DGND
–IN
R
G
A
50kΩ
C
B
50kΩ
AD8390
R
Figure 22. Functional Block Diagram
The AD8390 is a true differential operational amplifier with
common-mode feedback. The AD8390 is functionally equivalent
to three op amps, as shown in Figure 22. Amplifiers A and B act
like a standard dual op amp in an inverting configuration that
requires four resistors to set the desired gain.
The third amplifier (C) maintains the common-mode voltage
) at the output of the AD8390. V
(V
OCM
generated, as shown in Figure 22. The common-mode feedback
amplifier (C) drives the noninverting terminals of A and B such
that the difference between the output common-mode voltage
and V
is always zero. This functionality forces the outputs to
OCM
sit at midsupply, which results in differential outputs of identical
amplitude and 180 degrees out of phase. The user also has the
option to externally drive the V
output common-mode voltage. For details, see the Setting the
Output Common-Mode Voltage section.
CC
–OUT
56kΩ
V
OCM
56kΩ
V
EE
F
OCM
pin as an input to set the dc
OCM
BYP
+OUT
is internally
03600-0-035
APPLICATIONS
CIRCUIT DEFINITIONS
Differential voltage refers to the difference between two node
voltages. For example, the output differential voltage (or output
differential-mode voltage) is defined as
)
VVV
(1)
OUTOUTDMOUT
+IN
–IN
−+
VV
+
OUTOUT
−+
2
(2)
R
F
–OUT
R
+OUT
–
L,DMVOUT,DM
+
can also
OCM
,
V
+OUT
and V
refer to the voltages at the +OUT and –OUT
–OUT
terminals with respect to a common reference.
Common-mode voltage refers to the average of the two node
voltages. The output common-mode voltage is defined as
V
=
,
CMOUT
ANALYZING A BASIC APPLICATION CIRCUIT
The AD8390 uses high open-loop gain and negative feedback to
force its differential and common-mode output voltages in such
a way as to minimize the differential and common-mode error
voltages. The differential error voltage is defined as the voltage
between the differential inputs +IN and –IN, as shown in
Figure 23. For most purposes, this voltage can be assumed to be
zero. Similarly, the difference between the actual output
common-mode voltage and the voltage applied to V
be assumed to be zero. Starting from these two assumptions, any
application circuit can be analyzed.
R
G
+
V
IN,DM
V
OCM
R
G
–
SETTING THE CLOSED-LOOP GAIN
The differential-mode gain of the circuit in Figure 23 can be
described by
CALCULATING INPUT IMPEDANCE
The input impedance of the circuit in Figure 23 between the
inputs (V
Rev. C | Page 9 of 16
R
F
(I
ADJ
V
V
,
+IN
,
Figure 23. Basic Applications Circuit
Pin Not Connected, and PWDN0 and PWDN1 Held High)
R
DMOUT
,
DMIN
=
and V
2
F
(3)
R
G
) is simply
−IN
RR
(4)
GDMIN
03600-0-022
AD8390
SETTING THE OUTPUT COMMON-MODE VOLTAGE
By design, the AD8390’s V
voltage equal to the midsupply point (average value of the
voltages on V
and VEE), eliminating the need for external
CC
resistors. The high impedance nature of the V
allows the designer to force it to a desired level with an external
low impedance source. It should be noted that the V
not intended for use as an ac signal input.
The three configurations for the V
single supply, floating with dual supplies, and forcing the pin
with an external source. If not externally forcing the V
the designer must decouple it to ground with a 0.1 µF capacitor
in close proximity to the AD8390.
With dual equal supplies (for example, ±12 V) such that the
midpoint of the supplies is nominally 0 V, the user may opt to
connect the V
pin directly to ground, thus eliminating the
OCM
need for an external decoupling capacitor.
POWER-DOWN FEATURES AND THE I
The AD8390 offers significant versatility in setting quiescent
bias levels for a particular application from full ON to full OFF.
This versatility gives the circuit designer the flexibility to maximize efficiency while maintaining optimal levels of performance.
pin is internally biased at a
OCM
OCM
pin are floating with a
OCM
ADJ
pin, however,
pin is
OCM
pin,
OCM
PIN
When I
is not connected, the bias current in the various
ADJ
power modes is set to approximately 10 mA, 6.7 mA, and
3.8 mA for power modes PWDN1,0 = (1,1), (1,0), and (0,1),
respectively, as seen in Table 5. Setting I
operation (or grounding the I
pin for single-supply opera-
ADJ
= VEE for dual-supply
ADJ
tion) cuts the bias setting approximately in half for each mode.
A resistor (R
operation, or I
) between I
ADJ
and VEE for dual-supply operation, allows fine
ADJ
and ground for single-supply
ADJ
bias adjustment between the bias levels preset by the PWDN
pins. Figure 16 and Figure 19 depict the effect of different R
ADJ
values on setting the bias levels.
Table 5. PWDN Code Selection Guide
PWDN1 PWDN0 R
1 1
1 0
0 1
0 0
(Ω) I
ADJ
∞
∞
∞
∞
(mA)
Q
10.0
6.7
3.8
0.67
1 1 0 5.2
1 0 0 3.8
0 1 0 2.5
0 0 0 0.57
ADSL and ADSL2+ Applications
Optimizing driver efficiency while delivering the required signal
level is accomplished with the AD8390 through the use of two
on-chip power management features: two PWDN pins used to
select one of four bias modes, and an I
pin used for additional
ADJ
power management including fine bias adjustments.
PWDN Pins
Two digitally programmable logic pins, PWDN1 and PWDN0,
may be used to select four different bias levels (see Table 5).
These levels start with full power if the I
The top bias level can also start at approximately half of full bias,
if the I
configuration, R
pin is connected to VEE or to ground in a single-supply
ADJ
= 0. The bias level can be controlled with
ADJ
CMOS logic levels (high = 1) applied to the PWDN1 and PWDN0
pins alone or in combination with the I
digital ground pin (DGND) is the logic ground reference for the
PWDN1 and PWDN0 pins. PWDN = (0,0) is the power-down
mode of the amplifier.
The AD8390 exhibits a low output impedance for PWDN1,0 =
(1,1), (1,0), and (0,1). At PWDN1,0 = (0,0), however, the output
impedance is undefined. The lowest power mode (0,0) of the
AD8390 alone may not be suitable for systems that rely on a
high impedance OFF state, such as multiplexing.
I
Pin
ADJ
The I
feature offers users significant flexibility in setting the
ADJ
bias level of the AD8390 by allowing for fine tuning of the bias
setting. Use of the I
feature is not required for operation of
ADJ
the AD8390.
pin is not connected.
ADJ
control pin. The
ADJ
The AD8390 line driver amplifier is an efficient class AB amplifier
that is ideal for driving xDSL signals. The AD8390 may be used
for driving ADSL or ADSL2+ modulated signals in either direction: upstream from CPE to the CO or downstream from the
CO to CPE.
ADSL and ADSL2+ Applications Circuit
Increased CO port density has made driver power efficiency an
important requirement in ADSL and ADSL2+ systems. The largest impact on efficiency is due to the need for back termination of the driver. In the simplest case, this is accomplished with
a pair of resistors, each equal to half the reflected line impedance,
in series with the outputs of the differential driver. In this scenario, half the transmitted power is consumed by the back termination resistors. This results in the need for higher turns ratio
transformers, which attenuate the receive signal and tend to be
more lossy. They also increase current requirements of the driver, effectively reducing headroom because the output devices
can no longer swing as close to the rail.
To solve this problem, it is common practice to use a combination
of negative and positive feedback to synthesize the output impedance, thus decreasing the required ohmic value of the back
termination. Overall efficiency is improved because less power
is wasted in the back termination and a lower turns ratio transformer can be used without the need for increased supply rails.
The application circuit in Figure 24 depicts such an approach,
where the positive feedback, negative feedback, and back termination are provided by R2, R3, and R
, respe ctively.
M
Rev. C | Page 10 of 16
AD8390
V
N
V
+IN
OCM
–IN
V
CC
EE
0.1µF
10µF0.1µF
0.1µF
R1
0.1µF
R1
R
ADJ
10µF
Figure 24. ADSL/ADSL2+ Application Circuit
PWDN1
I
PWDN0
ADJ
R2
R3
–OUT
+OUT
R3
R2
R
M
1:N
R
M
RLV
+
OUT,DM
–
Referring to Figure 24, the following describes how to calculate
the resistor values necessary to obtain the desired input impedance, gain, and output impedance.
The differential input impedance to the circuit is simply 2R1.
As such, R1 is chosen by the designer to yield the desired input
impedance.
When synthesizing the output impedance, a factor k is
introduced, which is used to express the ratio of the negative
feedback resistor to the positive feedback resistor by
R3
=−1(5)
k
R2
Along with the turns ratio N, k is also used to define the value of
the back termination resistors R
. Commonly used values for k
M
are 0.1 to 0.25. A k value of 0.1 would result in back termination
resistors that are only 1/10 as large as those in the simplest case
described above. Lower values of k result in greater amounts of
positive feedback. Therefore, values much lower than 0.1 can
lead to instability and are generally not recommended.
R
L
×=
kR
M
This factor (k), along with R1, R
(6)
2
2
×
, and the desired gain (AV), is
M
then used to calculate the necessary values for R3 and R2.
()
2
RkRkR1AR1AkR1AR3×−+××××+××=
MMVVV
(7)
Table 6 shows a comparison of the results using the exact values,
the simplified approximation, and the closest 1% resistor values.
R1, A
In this example,
, and k were chosen to be 1.0 kΩ, 10 kΩ,
V
and 0.1 kΩ, respectively.
It should be noted that decreasing the value of the back termination resistors attenuates the receive signal by approximately
1/k. However, advances in low noise receive amplifiers permit
k values as small as 0.1 to be commonly used.
The line impedance, turns ratio, and k factor specify the output
voltage and current requirements from the AD8390. To accom-
03600-0-036
modate higher crest factors or lower supply rails, the turns ratio,
N, may have to be increased. Since higher turns ratios and smaller
k factors both attenuate the receive signal, a large increase in N
may require an increase in k to maintain the desired noise
performance. Any particular design process requires that these
trade-offs be visited.
Multitone power ratio is a commonly used figure of merit that
xDSL designers use to help describe system performance.
MTPR is the measured delta between the peak of a filled
frequency bin and the harmonic products that appear in an
intentionally empty frequency bin. Figure 25 illustrates this
principle. The plots in Figure 10 and Figure 13 show MTPR
performance in various power modes. All data were taken with
a circuit with a k factor of 0.1, a 1:1 turns ratio transformer, and
a waveform with a 5.4 peak-to-average ratio, also known as the
crest factor (CF).
10dB/DIV
The usually small value for R
allows a simplified approximation
M
for R3.
–70dBc
R2−=
Once R
AkR1R3×××≅2(8)
V
R3
(9)
k
1
, R3, and R2 are computed, the closest 1% resistors can
M
be chosen and the gain rechecked with the following equation:
R3R2
A
=
V
()
M
×
(10)
R1R3R2R2kR
×−+×+
Rev. C | Page 11 of 16
CENTER 431.25kHzSPAN 10kHz1kHz/DIV
Figure 25. MTPR Measurement
03600-0-033
AD8390
LAYOUT, GROUNDING, AND BYPASSING
The first layout requirement is for a good solid ground plane
that covers as much of the board area around the AD8390 as
possible. The only exception to this is that the two input pins
should be kept a few millimeters from the ground plane, and
ground should be removed from inner layers and the opposite
side of the board under the input traces. This minimizes the
stray capacitance on these nodes and helps preserve the gain
flatness versus frequency.
The power supply pins should be bypassed as close as possible
to the device on a ground plane common with signal ground.
Good high frequency, ceramic chip capacitors should be used.
This bypassing should be done with a capacitance value of
0.01 μF to 0.1 μF for each supply. Low frequency bypassing
should be provided with 10 μF tantalum capacitors from each
supply to signal ground. The signal routing should be short and
direct to avoid parasitic effects, particularly on traces connected
to the amplifier inputs. Wherever there are complementary
signals, a symmetrical layout should be provided to the extent
possible to maximize the balance performance. When running
differential signals over a long distance, the traces on the PCB
should be close together.
POWER DISSIPATION AND THERMAL
MANAGEMENT
The AD8390 was designed to be the most efficient class AB
ADSL/ADSL2+ line driver available. Figure 11 shows the total
power consumption (delivered line power and power consumed)
of the AD8390 driving ADSL signals at varying output powers
and power modes. To accurately determine the amount of
power dissipated by the AD8390, it is necessary to subtract the
power delivered to the load, matching losses, and transformer
losses as follows:
PPPP
AD8390
where:
P
is the total supply power in mW drawn by the AD8390.
supply,mW
P
is the power delivered into a 100 Ω twisted-pair line in mW.
load,mW
P
is the power dissipated by the matching resistors and
losses,mW
the transformer in mW.
While this discussion focuses mainly on ADSL applications, the
same premise can be applied to determining the power dissipation of the AD8390 in any application.
−−= (11)
mWlossesmWloadsupply,mW
,,
To obtain optimum thermal performance from the AD8390 in
either package, it is essential that the thermal pad be soldered to
a ground plane with minimal thermal resistance. This is particularly true for dense circuit designs with multiple integrated
circuits. Furthermore, the PCB should be designed in such a
manner as to draw the heat away from the ICs. Figure 26
illustrates the relationship between thermal resistance (°C/W)
and the copper area (mm
2
) for the AD8390ACP soldered down
to a 4-layer board with a given copper area.
Figure 26 can be used to help determine the copper board area
required for proper thermal management of the AD8390. The
power dissipation of the AD8390 can be computed using
Equation 11. This number can then be inserted into the
following equation to yield the required θ
θ
where T
T
RISE
JA
P
AD8390
is the delta from the maximum expected ambient
RISE
°
C
==
(12)
W
:
JA
temperature to the highest allowable die temperature. It is
generally recommended that the maximum die temperature be
limited to 125°C, and in no case should it be allowed to exceed
150°C.
Using the θ
computed in Equation 12, Figure 26 can be used to
JA
determine the minimum copper area required for proper thermal
dissipation of the AD8390.
90
80
70
60
50
(°C/W)
40
JA
θ
30
20
10
0
110010001010000
Figure 26. Thermal Resistance vs. Copper Area
Cu AREA (mm
2)
03600-0-034
Rev. C | Page 12 of 16
AD8390
OUTLINE DIMENSIONS
PIN 1
INDICATOR
1.00
0.85
0.80
4.0
12° MAX
SEATING
PLANE
BSC SQ
TOP
VIEW
0.80 MAX
0.65 TYP
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
0.35
0.28
0.25
3.75
BSC SQ
0.20 REF
0.60 MAX
0.65 BSC
0.05 MAX
0.02 NOM
COPLANARITY
0.75
0.60
0.50
0.08
Figure 27. 4 × 4 mm 16-Lead Lead Frame Chip Scale Package [LFCSP]
(CP-16)
Dimensions shown in millimeters
0.197
0.189
13
12
9
8
0.60 MAX
BOTTOM
VIEW
16
1
4
5
1.95 BSC
0.096
PIN 1
INDICATOR
2.25
2.10 SQ
1.95
0.25MIN
0.012
0.008
9
8
0.236
BSC
0.069
0.053
SEATING
PLANE
0.077
0.010
0.006
BOTTOM VIEW
8°
0°
0.090
0.050
0.016
0.154
BSC
0.065
0.049
0.010
0.004
COPLANARITY
0.004
16
TOP VIEW
1
PIN 1
0.025
BSC
COMPLIANT TO JEDEC STANDARDS MO-137
Figure 28. 16-Lead Shrink Small Outline Package, Exposed Pad [QSOP/EP]
(RC-16)
Dimensions shown in inches
ORDERING GUIDE
Model Temperature Range Package Description Package Option
AD8390ACP-R2 –40°C to +85°C 16-Lead LFCSP CP-16, 250 Piece Reel
AD8390ACP-REEL –40°C to +85°C 16-Lead LFCSP CP-16, 13” Tape and Reel
AD8390ACP-REEL7 –40°C to +85°C 16-Lead LFCSP CP-16, 7” Tape and Reel
AD8390ACP-EVAL Evaluation Board LFCSP
AD8390ARC –40°C to +85°C 16-Lead QSOP/EP RC-16
AD8390ARC-REEL –40°C to +85°C 16-Lead QSOP/EP RC-16, 13” Tape and Reel
AD8390ARC-REEL7 –40°C to +85°C 16-Lead QSOP/EP RC-16, 7” Tape and Reel
AD8390ARC-EVAL Evaluation Board QSOP/EP