High speed
Up to 85 MHz clock rate
Triple (R, G, B) output
Matched delay lines
Low power dissipation: 40 mW
Reference to rising or falling edge of MONITI input
Selectable loop delay
Available in 48-lead 7 mm × 7 mm LFCSP
APPLICATIONS
LCD microdisplay horizontal timing
FUNCTIONAL BLOCK DIAGRAM
Delay-Locked Loop
AD8389
PRODUCT DESCRIPTION
The AD8389 is a triple 6-channel LCD microdisplay delaylocked timing loop. As part of a closed-loop system, the AD8389
maintains a constant delay between the common input, DXI,
and each independent feedback reference, MONITxI.
The AD8389 consists of a selectable fixed delay element, a phase
detector, a charge pump, and six matched variable delay lines
per color. The phase detector, charge pump, and master delay
line form a closed loop when connected to a compatible LCD
microdisplay. Five additional delay lines track the master for a
complete set of matched timing signals.
The AD8389 dissipates 40 mW nominal power. The AD8389 is
offered in a 48-lead 7 mm × 7 mm LFCSP package and operates
over the commercial temperature range of 0°C to 85°C.
AVDD(4) AVSS(4)DRVDD(2) DRVSS(2)
COMPEDGE
SLOW
DXI
ENBX1I
ENBX2I
ENBX3I
ENBX4I
CLXI
CLK
DXI
INTERNAL
TIMING
SELECTABLE
DELAY
6
/
PHASE
DETECTOR
MATCHED VARIABLE
DELAY LINES (6-CHANNEL)
PHASE
DETECTOR
MATCHED VARIABLE
DELAY LINES (6-CHANNEL)
PHASE
DETECTOR
MATCHED VARIABLE
DELAY LINES (6-CHANNEL)
CHARGE
PUMP
CHARGE
PUMP
CHARGE
PUMP
Figure 1.
AD8389
6
/
6
/
6
/
VCONTR
MONITRI
DXRO
ENBX1RO
ENBX2RO
ENBX3RO
ENBX4RO
CLXRO
VCONTG
MONITGI
DXGO
ENBX1GO
ENBX2GO
ENBX3GO
ENBX4GO
CLXGO
VCONTB
MONITBI
DXBO
ENBX1BO
ENBX2BO
ENBX3BO
ENBX4BO
CLXBO
04515-0-001
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
Maximum Digital Input Voltage AVDD + 0.3 V
Minimum Digital Input Voltage AVSS – 0.3 V
Internal Power Dissipation
LFCSP Package @ TA = 25°C 4.8 W
Operating Temperature Range 0°C to 85°C
Storage Temperature Range –65°C to +125°C
Lead Temperature Range (Soldering 10 sec) 300°C
1
Stresses above those listed under the Absolute Maximum Ratings may cause
permanent damage to the device. This is a stress rating only; functional
operation of the device at these or any other conditions above those
indicated in the operational section of this specification is not implied.
Exposure to the absolute maximum ratings for extended periods may
reduce device reliability.
2
48-Lead LFCSP Package:
= 26°C/W (JEDEC Standard 4-layer PCB in still air)
θ
JA
= 20°C/W
θ
JC
1
EXPOSED PADDLE
To ensure high reliability, the exposed paddle must be soldered
to GND.
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8389 is limited by its junction temperature. The maximum
2
safe junction temperature for plastic encapsulated devices as
determined by the glass transition temperature of the plastic is
approximately 150°C. Exceeding this limit temporarily may
cause a shift in the parametric performance due to a change in
the stresses exerted on the die by the package. Exceeding a
junction temperature of 175°C for an extended period can
result in device failure.
To ensure operation within the specified operating temperature
range, it is necessary to limit the maximum power dissipation as
follows:
5.0
P
DMAX
= (T
JMAX
– TA)/θ
JA
4.5
4.0
3.5
3.0
POWER DISSIPATION (W)
2.5
2.0
2535455565758595
AMBIENT TEMPERATURE (°C)
Figure 2. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
this product features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
04515-0-002
Rev. 0 | Page 4 of 12
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