To within 1.3 V of supply rails
Output short-circuit protection
High update rates
Fast, 100 Ms/s 10-bit input data update rate
Static power dissipation: 1.4 W
Voltage-controlled video reference (brightness), offset,
and full-scale (contrast) output levels
INV bit reverses polarity of video signal
3.3 V logic, 9 V to 18 V analog supplies
High accuracy voltage outputs
Laser trimming eliminates the need for adjustments or
calibration
Flexible logic
XFR allows parallel AD8386 operation
Fast settling into capacitive loads
35 ns settling time to 0.25% into 150 pF load
Slew rate 400 V/μs
Available in 64-lead 9 mm × 9 mm LFCSP_VQ
GENERAL DESCRIPTION
The AD8386 provides a fast, 10-bit, latched, decimating digital
input that drives 12 high voltage outputs. Input words with
10 bits are loaded sequentially into 12 separate high speed,
bipolar DACs. Flexible digital input format allows several
AD8386s to be used in parallel in high resolution displays.
The output signal can be adjusted for dc reference, signal
inversion, and contrast for maximum flexibility.
BYP
VRH
VRH
VRL
DB(0:9)
R/L
CLK
XFR
INV
GCTL
GSW
TSW
SDI
SCL
SEN
SVRH
SVRL
SVRL
Decimating LCD Driver
AD8386
FUNCTIONAL BLOCK DIAGRAM
BIAS
2
10
3
3
3
2
SCALING
CONTROL
TWO-STAGE
LATCH
SEQUENCE
CONTROL
12-BIT
SHIFT
REGISTER
Figure 1.
10-BIT
DACs
INV
CONTROL
8-BIT
DAC
AD8386
VID0
VID1
VID2
VID3
VID4
12
VID5
VID6
VID7
VID8
VID9
VID10
VID11
VAO
05687-001
The AD8386 is fabricated on ADI’s fast bipolar, 26 V XFHV
process, which provides fast input logic, bipolar DACs with
trimmed accuracy and fast settling, high voltage, precision
drive amplifiers on the same chip.
The AD8386 dissipates 1.4 W nominal static power.
The AD8386 is offered in a 64-lead 9 mm × 9 mm LFCSP_VQ
package and operates over the commercial temperature range of
0°C to 85°C.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
VDE DAC Code 450 to 800 −7.5 +7.5 mV
VCME DAC Code 450 to 800 −3.5 +3.5 mV
VIDEO OUTPUT DYNAMIC PERFORMANCE T
Data Switching Slew Rate 20% to 80%, VO = 5 V step 400 V/μs
Invert Switching Slew Rate 20% to 80%, VO = 10 V step 560 V/μs
Data Switching Settling Time to 1% 24 35 ns
Data Switching Settling Time to 0.25% 35 50 ns
Invert Switching Settling Time to 1% 80 130 ns
Invert Switching Settling Time to 0.25% 250 500 ns
Invert Switching Overshoot 10 V Step 100 200 mV
CLK and Data Feedthrough
All-Hostile Crosstalk
2
3
Amplitude 50 mV p-p
Glitch Duration 30 ns
DAC Transition Glitch Energy DAC code 511 to 512 0.6 nV-s
VIDEO OUTPUT CHARACTERISTICS
Output Voltage Swing AVCC − VOH, VOL − AGND 1.1 1.3 V
Output Voltage—Grounded Mode 200 mV
Data Switching Delay: t
INV Switching Delay: t
4
9
5
10
Output Current 100 mA
Output Resistance 29 Ω
REFERENCE INPUTS
VRL Range VRH ≥ VRL 5.25 AVCC − 4 V
VRH Range VRH ≥ VRL VRL AVCC V
VRH – VRL Range VFS = 2 × (VRH − VRL) 0 2.75 V
VRH Input Resistance To VRL 20 kΩ
VRL Input Current −45 μA
VRH Input Current 125 μA
RESOLUTION
Coding Binary 10 Bits
DIGITAL INPUT CHARACTERISTICS
CIN 3 pF
IIH 0.05 μA
IIL −2 μA
VIH 2 V
VIL 0.8 V
VTH 1.65 V
IIH TSW 330 μA
IIL TSW −2 μA
TSW R
VAO Maximum SVRH − 1 LSB V
VAO Minimum SVRL V
VAO − Grounded Mode 150 mV
VAO Output Resistance All supplies OFF 75 kΩ
I
±30 mA
OUT
C
Low Range
LOAD
C
High Range
LOAD
REFERENCE INPUTS
SVRH Range SVRL < SVRH SVRL + 1 AVCC − 3.5 V
SVRL Range SVRL < SVRH AGND + 1.5 SVRH − 1 V
SVFS Range 1 8 V
SVRH Input Current SVRS = 5 V 0.1 μA
SVRL Input Current SVRS = 5 V −1.6 −1.3 mA
DIGITAL INPUT CHARACTERISTICS
CIN 3 pF
IIH 0.05 μA
IIL −1 μA
VIH 2.0 DVCC V
VIL DGND 0.8 V
VTH 1.65 V
DIGITAL TIMING CHARACTERISTICS T
SEN to SCL Setup Time, t20 10 ns
SCL, High Level Pulse Width, t21 10 ns
SCL, Low Level Pulse Width, t22 10 ns
SCL to SEN Hold Time, t23 10 ns
SDI Setup Time, t24 10 ns
SDI Hold Time, t25 10 ns
POWER SUPPLIES
DVCC, Operating Range 3 3.3 3.6 V
DVCC, Quiescent Current 54 75 mA
AVCC Operating Range 9 18 V
Total AVCC Quiescent Current 80 100 mA
OPERATING TEMPERATURES
Ambient Temperature Range, T
Ambient Temperature Range, T
1
Output VAO is designed to drive capacitive loads less than 0.002 μF or more than 0.047 μF. Load capacitances in the range 0.002 μF − 0.047 μF cause the output
overshoot to exceed 100 mV.
2
Operation at high ambient temperature requires a thermally optimized PCB layout (see the Applications section). In systems with limited or no airflow, the maximum
ambient operating temperature is limited to 70°C with the thermal protection enabled, VFS = 4 V, data update rate = 85 Ms/s. Operation at 85°C ambient temperature
requires the thermal protection circuit turned disabled (TSW = LOW).
Still air, TSW = HIGH 0 70 °C
Still air, TSW = LOW 0 85 °C
Rev. 0 | Page 5 of 20
AD8386
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
Supply Voltage
AVCCx − AGNDx 18 V
DVCC − DGND 4.5 V
Input Voltage
Maximum Digital Input Voltage DVCC + 0.5 V
Minimum Digital Input Voltage DGND − 0.5 V
Maximum Analog Input Voltage AVCC + 0.5 V
Minimum Analog Input Voltage AGND − 0.5 V
Internal Power Dissipation
LFCSP @ TA = 25°C 3.7 W
Operating Temperature Range 0°C to 85°C
Storage Temperature Range –65°C to +125°C
Lead Temperature Range
(Soldering 10 sec)
1
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
1
64-lead VQ_LFCSP:
θJA = 27°C/W in still air (JEDEC STD, 4-layer PCB with 16 vias on Epad)
θJA = 25°C/W @ 200 lfm airflow (JEDEC STD, 4-layer PCB with 16 vias on Epad)
θJA = 24°C/W @ 400 lfm airflow (JEDEC STD, 4-layer PCB with 16 vias on Epad)
ΨJT = 0.2°C/W in still air (JEDEC STD, 4-layer PCB with 16 vias on Epad)
ΨJB = 13.8°C/W in still air (JEDEC STD, 4-layer PCB with 16 vias on Epad)
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8386 is limited by its junction temperature. The maximum
safe junction temperature for plastic encapsulated devices, as
determined by the glass transition temperature of the plastic, is
approximately 150°C. Exceeding this limit temporarily may
cause a shift in the parametric performance due to a change in
the stresses exerted on the die by the package. Exceeding a
junction temperature of 175°C for an extended period can
result in device failure.
OVERLOAD PROTECTION
The AD8386 overload protection circuit consists of an output
current limiter and a thermal protection circuit.
When TSW is LOW, the thermal protection circuit is disabled,
and the output current limiter is turned on. The maximum
current at any one output of the AD8386 is internally limited to
100 mA average. In the event of a momentary short circuit
between a video output and a power supply rail (AVCC or
AGND), the output current limit is sufficiently low to provide
temporary protection.
When TSW is HIGH, the output current limiter, as well as the
thermal protection circuit, is turned on. The thermal protection
circuit debiases the output amplifier when the junction
temperature reaches the internally set trip point. In the event of
an extended short circuit between a video output and a power
supply rail, the output amplifier current continues to switch
between 0 mA and 100 mA typical with a period determined by
the thermal time constant and the hysteresis of the thermal trip
point. The thermal protection circuit limits the average junction
temperature to a safe level, which provides long-term
protection.
EXPOSED PADDLE
To ensure optimal thermal performance, the exposed paddle
must be electrically connected to an external plane, such as
AVCC or GND, as described in the
Applications section.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate
on the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. 0 | Page 6 of 20
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